AT518702A5 - Verfahren zum Aufbringen einer Bondschicht - Google Patents
Verfahren zum Aufbringen einer BondschichtInfo
- Publication number
- AT518702A5 AT518702A5 ATA9472/2013A AT94722013A AT518702A5 AT 518702 A5 AT518702 A5 AT 518702A5 AT 94722013 A AT94722013 A AT 94722013A AT 518702 A5 AT518702 A5 AT 518702A5
- Authority
- AT
- Austria
- Prior art keywords
- applying
- layer
- bonding layer
- substrate
- base
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0102—Surface micromachining
- B81C2201/0104—Chemical-mechanical polishing [CMP]
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- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
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- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
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- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/036—Fusion bonding
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Wire Bonding (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
- Contacts (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zum Aufbringen einer aus einer Grundschicht und einer Schutzschicht bestehenden Bondschicht auf ein Substrat mit folgenden Verfahrensschritten: Aufbringen eines oxidierbaren Grundmaterials als Grundschicht auf eine Bondseite des Substrats, zumindest teilweises Bedecken der Grundschicht mit einem in dem Grundmaterial zumindest teilweise lösbaren Schutzmaterial als Schutzschicht. Weiterhin betrifft die Erfindung ein korrespondierendes Substrat.
Priority Applications (1)
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ATA232/2022A AT525410A1 (de) | 2013-09-13 | 2013-09-13 | Verfahren zum Aufbringen einer Bondschicht |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/EP2013/069003 WO2015036032A1 (de) | 2013-09-13 | 2013-09-13 | Verfahren zum aufbringen einer bondschicht |
Publications (1)
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AT518702A5 true AT518702A5 (de) | 2017-12-15 |
Family
ID=49170702
Family Applications (2)
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ATA232/2022A AT525410A1 (de) | 2013-09-13 | 2013-09-13 | Verfahren zum Aufbringen einer Bondschicht |
ATA9472/2013A AT518702A5 (de) | 2013-09-13 | 2013-09-13 | Verfahren zum Aufbringen einer Bondschicht |
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ATA232/2022A AT525410A1 (de) | 2013-09-13 | 2013-09-13 | Verfahren zum Aufbringen einer Bondschicht |
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US (3) | US9627349B2 (de) |
JP (1) | JP6336600B2 (de) |
KR (3) | KR102306976B1 (de) |
CN (3) | CN105517947B (de) |
AT (2) | AT525410A1 (de) |
DE (1) | DE112013007187B4 (de) |
SG (1) | SG11201601923VA (de) |
TW (4) | TWI630254B (de) |
WO (1) | WO2015036032A1 (de) |
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KR102306976B1 (ko) * | 2013-09-13 | 2021-09-30 | 에베 그룹 에. 탈너 게엠베하 | 접합 레이어 도포 방법 |
CH717141B1 (fr) * | 2019-01-16 | 2023-12-15 | Patek Philippe Sa Geneve | Procédé d'assemblage de composants horlogers. |
Citations (2)
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EP2363373A1 (de) * | 2010-03-02 | 2011-09-07 | SensoNor Technologies AS | Procédé de collage pour systèmes micro et nano sensibles |
US20130099355A1 (en) * | 2011-10-24 | 2013-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS Structures and Methods for Forming the Same |
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DE60209947T2 (de) * | 2001-01-09 | 2007-02-22 | Metabyte Networks, Inc., Fremont | System, Verfahren und Software für die Bereitstellung einer gezielten Werbung durch Benutzerprofildatenstruktur basierend auf Benutzerpräferenzen |
JP4136844B2 (ja) * | 2002-08-30 | 2008-08-20 | 富士電機ホールディングス株式会社 | 電子部品の実装方法 |
US20070152025A1 (en) | 2004-03-02 | 2007-07-05 | Fuji Electric Holdings Co., Ltd. | Electronic part mounting method |
JP4325571B2 (ja) * | 2005-02-28 | 2009-09-02 | 株式会社日立製作所 | 電子装置の製造方法 |
US8736081B2 (en) * | 2005-08-26 | 2014-05-27 | Innovative Micro Technology | Wafer level hermetic bond using metal alloy with keeper layer |
US7569926B2 (en) * | 2005-08-26 | 2009-08-04 | Innovative Micro Technology | Wafer level hermetic bond using metal alloy with raised feature |
JP4552968B2 (ja) * | 2007-05-29 | 2010-09-29 | 住友電気工業株式会社 | 化合物半導体基板の研磨方法、化合物半導体基板、化合物半導体エピ基板の製造方法および化合物半導体エピ基板 |
DE102008040775A1 (de) * | 2008-07-28 | 2010-02-04 | Robert Bosch Gmbh | Verkapselung, MEMS sowie Verfahren zum selektiven Verkapseln |
WO2011108166A1 (ja) * | 2010-03-03 | 2011-09-09 | シャープ株式会社 | 表示装置およびその駆動方法、ならびに液晶表示装置 |
JP2012079935A (ja) | 2010-10-01 | 2012-04-19 | Fujikura Ltd | 複合基板の製造方法、及び複合基板 |
US8377798B2 (en) | 2010-11-10 | 2013-02-19 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and structure for wafer to wafer bonding in semiconductor packaging |
US20120145308A1 (en) | 2010-12-08 | 2012-06-14 | Jiangwei Feng | Methods for anodic bonding material layers to one another and resultant apparatus |
JP5919641B2 (ja) | 2011-04-27 | 2016-05-18 | 富士通株式会社 | 半導体装置およびその製造方法並びに電子装置 |
EP2600389B1 (de) | 2011-11-29 | 2020-01-15 | IMEC vzw | Verfahren zum Bonden von Halbleitersubstraten |
KR102306976B1 (ko) * | 2013-09-13 | 2021-09-30 | 에베 그룹 에. 탈너 게엠베하 | 접합 레이어 도포 방법 |
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2013
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- 2013-09-13 US US14/909,157 patent/US9627349B2/en active Active
- 2013-09-13 AT ATA232/2022A patent/AT525410A1/de unknown
- 2013-09-13 CN CN201380079527.1A patent/CN105517947B/zh active Active
- 2013-09-13 KR KR1020207005479A patent/KR102184239B1/ko active IP Right Grant
- 2013-09-13 JP JP2016541823A patent/JP6336600B2/ja active Active
- 2013-09-13 CN CN201910183876.7A patent/CN110071049B/zh active Active
- 2013-09-13 WO PCT/EP2013/069003 patent/WO2015036032A1/de active Application Filing
- 2013-09-13 AT ATA9472/2013A patent/AT518702A5/de unknown
- 2013-09-13 DE DE112013007187.8T patent/DE112013007187B4/de active Active
- 2013-09-13 CN CN201910183859.3A patent/CN110085526B/zh active Active
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- 2014-08-05 TW TW108110542A patent/TWI677552B/zh active
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2017
- 2017-02-24 US US15/441,741 patent/US9911713B2/en active Active
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EP2363373A1 (de) * | 2010-03-02 | 2011-09-07 | SensoNor Technologies AS | Procédé de collage pour systèmes micro et nano sensibles |
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