SG11201601923VA - Method for applying a bonding layer - Google Patents

Method for applying a bonding layer

Info

Publication number
SG11201601923VA
SG11201601923VA SG11201601923VA SG11201601923VA SG11201601923VA SG 11201601923V A SG11201601923V A SG 11201601923VA SG 11201601923V A SG11201601923V A SG 11201601923VA SG 11201601923V A SG11201601923V A SG 11201601923VA SG 11201601923V A SG11201601923V A SG 11201601923VA
Authority
SG
Singapore
Prior art keywords
applying
bonding layer
bonding
layer
Prior art date
Application number
SG11201601923VA
Inventor
Markus Wimplinger
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201601923VA publication Critical patent/SG11201601923VA/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • H—ELECTRICITY
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0104—Chemical-mechanical polishing [CMP]
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    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
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    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Contacts (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
SG11201601923VA 2013-09-13 2013-09-13 Method for applying a bonding layer SG11201601923VA (en)

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EP1223757B1 (en) * 2001-01-09 2006-03-22 Metabyte Networks, Inc. System, method, and software application for targeted advertising via behavioral model clustering, and preference programming based on behavioral model clusters
JP4136844B2 (en) * 2002-08-30 2008-08-20 富士電機ホールディングス株式会社 Electronic component mounting method
EP1734570A4 (en) 2004-03-02 2008-03-05 Fuji Electric Holdings Method for packaging electronic component
JP4325571B2 (en) * 2005-02-28 2009-09-02 株式会社日立製作所 Manufacturing method of electronic device
US8736081B2 (en) * 2005-08-26 2014-05-27 Innovative Micro Technology Wafer level hermetic bond using metal alloy with keeper layer
US7569926B2 (en) * 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
JP4552968B2 (en) * 2007-05-29 2010-09-29 住友電気工業株式会社 Compound semiconductor substrate polishing method, compound semiconductor substrate, compound semiconductor epi substrate manufacturing method, and compound semiconductor epi substrate
DE102008040775A1 (en) * 2008-07-28 2010-02-04 Robert Bosch Gmbh Encapsulation, MEMS and selective encapsulation
EP2363373A1 (en) * 2010-03-02 2011-09-07 SensoNor Technologies AS Bonding process for sensitive micro-and nano-systems
JP5734951B2 (en) * 2010-03-03 2015-06-17 シャープ株式会社 Display device, driving method thereof, and liquid crystal display device
JP2012079935A (en) * 2010-10-01 2012-04-19 Fujikura Ltd Method for manufacturing composite substrate, and composite substrate
US8377798B2 (en) 2010-11-10 2013-02-19 Taiwan Semiconductor Manufacturing Co., Ltd Method and structure for wafer to wafer bonding in semiconductor packaging
US20120145308A1 (en) * 2010-12-08 2012-06-14 Jiangwei Feng Methods for anodic bonding material layers to one another and resultant apparatus
JP5919641B2 (en) 2011-04-27 2016-05-18 富士通株式会社 Semiconductor device, method for manufacturing the same, and electronic device
US9054121B2 (en) * 2011-10-24 2015-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS structures and methods for forming the same
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US20180145048A1 (en) 2018-05-24
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