AT517014A3 - Verfahren und Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat - Google Patents
Verfahren und Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat Download PDFInfo
- Publication number
- AT517014A3 AT517014A3 AT502912016A AT502912016A AT517014A3 AT 517014 A3 AT517014 A3 AT 517014A3 AT 502912016 A AT502912016 A AT 502912016A AT 502912016 A AT502912016 A AT 502912016A AT 517014 A3 AT517014 A3 AT 517014A3
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- coating
- metering device
- applying
- solvent
- Prior art date
Links
- 239000011248 coating agent Substances 0.000 title abstract 7
- 238000000576 coating method Methods 0.000 title abstract 7
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- 239000012530 fluid Substances 0.000 abstract 4
- 239000002904 solvent Substances 0.000 abstract 4
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/34—Applying different liquids or other fluent materials simultaneously
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/033—Manufacturing methods by local deposition of the material of the bonding area
- H01L2224/0331—Manufacturing methods by local deposition of the material of the bonding area in liquid form
- H01L2224/03312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/033—Manufacturing methods by local deposition of the material of the bonding area
- H01L2224/0331—Manufacturing methods by local deposition of the material of the bonding area in liquid form
- H01L2224/03318—Manufacturing methods by local deposition of the material of the bonding area in liquid form by dispensing droplets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Die Erfindung betrifft eine Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat (3), mit einer Dosiereinrichtung (5), mit der ein Beschichtungsfluid (2) als Strahl auf das Substrat (3) aufgebracht werden kann, und mit einem Lösungsmitteldispenser (10), der exzentrisch und seitlich des vorderen Endes der Dosiereinrichtung (5) angeordnet ist, so dass dem vorderen Ende der Dosiereinrichtung (5) eine vorbestimmte Menge Lösungsmittel (14) verabreicht werden kann. Die Erfindung betrifft auch ein Verfahren zum Aufbringen einer Beschichtung auf ein Substrat (3) mittels einer Vorrichtung nach einem der vorhergehenden Ansprüche, wobei vor dem Aufbringen des Beschichtungsfluids (2) eine vorbestimmte Menge Lösungsmittel (14) auf das vordere Ende der Dosiereinrichtung (5) gebracht wird, so dass das Lösungsmittel (14) mit dem sich dort befindenden Beschichtungsfluid (2) in Kontakt gelangt, und nach einer Wartezeit das Beschichtungsfluid (2) mittels der Dosiereinrichtung (5) auf das Substrat (3) aufgebracht wird.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2014597A NL2014597B1 (en) | 2015-04-08 | 2015-04-08 | Method and device for applying a coating to a substrate. |
Publications (3)
Publication Number | Publication Date |
---|---|
AT517014A2 AT517014A2 (de) | 2016-10-15 |
AT517014A3 true AT517014A3 (de) | 2019-11-15 |
AT517014B1 AT517014B1 (de) | 2019-11-15 |
Family
ID=53836151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT502912016A AT517014B1 (de) | 2015-04-08 | 2016-04-08 | Verfahren und Vorrichtung zum Aufbringen einer Beschichtung auf ein Substrat |
Country Status (8)
Country | Link |
---|---|
US (1) | US20160296968A1 (de) |
JP (1) | JP6715658B2 (de) |
KR (1) | KR20160120679A (de) |
CN (1) | CN106054535B (de) |
AT (1) | AT517014B1 (de) |
DE (1) | DE102016106399A1 (de) |
NL (1) | NL2014597B1 (de) |
TW (1) | TWI754612B (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116618241B (zh) * | 2023-07-24 | 2023-09-12 | 江苏泽润新能科技股份有限公司 | 一种汽车电池包灌胶装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0540447A1 (de) * | 1991-10-29 | 1993-05-05 | International Business Machines Corporation | Materialsparende Schleuder für Fotolack und Verfahren |
US6001417A (en) * | 1996-09-18 | 1999-12-14 | Kabushiki Kaisha Toshiba | Resist coating method and resist coating apparatus |
US20010033895A1 (en) * | 2000-04-25 | 2001-10-25 | Tokyo Electron Limited | Film forming method and film forming apparatus |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56155444U (de) * | 1980-04-21 | 1981-11-20 | ||
JPS62185322A (ja) * | 1986-02-10 | 1987-08-13 | Nec Corp | フオトレジスト塗布装置 |
JPH021862A (ja) * | 1988-06-13 | 1990-01-08 | Tokyo Electron Ltd | 塗布方法 |
JPH02220428A (ja) * | 1989-02-22 | 1990-09-03 | Hitachi Ltd | ホトレジストの塗布方法及び装置 |
JPH0494526A (ja) * | 1990-08-11 | 1992-03-26 | Sony Corp | レジストディスペンスノズルのレジスト残り除去方法 |
JPH0620936A (ja) * | 1992-06-30 | 1994-01-28 | Hoya Corp | 処理液滴下用ノズルの洗浄方法及び洗浄装置 |
US5403617A (en) * | 1993-09-15 | 1995-04-04 | Mobium Enterprises Corporation | Hybrid pulsed valve for thin film coating and method |
JP3429849B2 (ja) * | 1994-05-20 | 2003-07-28 | ワイエイシイ株式会社 | レジスト塗布装置 |
JP3160832B2 (ja) * | 1994-08-08 | 2001-04-25 | 東京エレクトロン株式会社 | 塗布膜形成方法及びその装置 |
JPH0929158A (ja) * | 1995-07-18 | 1997-02-04 | Dainippon Screen Mfg Co Ltd | 回転式塗布装置 |
JP3452795B2 (ja) * | 1997-05-07 | 2003-09-29 | 東京エレクトロン株式会社 | 塗布膜形成方法および塗布装置 |
JPH1133471A (ja) * | 1997-07-23 | 1999-02-09 | Tokyo Electron Ltd | 塗布装置 |
TW442336B (en) * | 1997-08-19 | 2001-06-23 | Tokyo Electron Ltd | Film forming method |
JP4053690B2 (ja) * | 1998-06-19 | 2008-02-27 | 東京エレクトロン株式会社 | 成膜装置 |
JP3800282B2 (ja) * | 1998-11-30 | 2006-07-26 | 大日本スクリーン製造株式会社 | 塗布液塗布方法 |
JP3587723B2 (ja) * | 1999-04-30 | 2004-11-10 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
JP2002175966A (ja) * | 2000-12-06 | 2002-06-21 | Matsushita Electric Ind Co Ltd | レジストパターン形成方法 |
JP3754316B2 (ja) * | 2001-04-16 | 2006-03-08 | 東京エレクトロン株式会社 | 塗布膜形成方法及び塗布膜形成装置 |
JP4461647B2 (ja) * | 2001-07-03 | 2010-05-12 | 凸版印刷株式会社 | スリットノズルの洗浄方法及び洗浄機構 |
JP3993496B2 (ja) * | 2001-09-27 | 2007-10-17 | 東京エレクトロン株式会社 | 基板の処理方法および塗布処理装置 |
JP3760131B2 (ja) * | 2002-01-22 | 2006-03-29 | 東京エレクトロン株式会社 | 処理方法 |
JP3697419B2 (ja) * | 2002-01-30 | 2005-09-21 | 株式会社東芝 | 液膜形成方法及び固形膜形成方法 |
KR20040053533A (ko) * | 2002-12-16 | 2004-06-24 | 삼성전자주식회사 | 화학 물질 분사 노즐용 세정 장치 및 그 방법 |
JP2006007163A (ja) * | 2004-06-29 | 2006-01-12 | Alps Electric Co Ltd | スプレーコート装置及びこれを用いたスプレーコート方法 |
US8076446B2 (en) * | 2006-03-31 | 2011-12-13 | Dai Nippon Printing Co., Ltd. | Optical layered body and method for producing optical layered body |
US20070251450A1 (en) * | 2006-04-28 | 2007-11-01 | Applied Materials, Inc. | Systems and Methods for Monitoring and Controlling Dispense Using a Digital Optical Sensor |
KR100941075B1 (ko) * | 2007-12-27 | 2010-02-09 | 세메스 주식회사 | 처리액 공급 유닛과, 이를 이용한 기판 처리 장치 및 방법 |
JP2009194020A (ja) * | 2008-02-12 | 2009-08-27 | Panasonic Corp | 半導体装置の製造方法および製造装置 |
JP5309907B2 (ja) * | 2008-11-07 | 2013-10-09 | ミツミ電機株式会社 | レジスト塗布方法 |
JP5935323B2 (ja) * | 2010-07-09 | 2016-06-15 | 東レ株式会社 | 感光性接着剤組成物、感光性接着剤フィルムおよびこれらを用いた半導体装置 |
JP5948097B2 (ja) * | 2012-03-08 | 2016-07-06 | 旭サナック株式会社 | 基板の成膜装置 |
US9097972B2 (en) * | 2013-01-29 | 2015-08-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of applying photoresist to a semiconductor substrate |
CN105446081B (zh) * | 2014-09-22 | 2019-11-08 | 中芯国际集成电路制造(上海)有限公司 | 防止光刻胶结晶的方法 |
-
2015
- 2015-04-08 NL NL2014597A patent/NL2014597B1/en not_active IP Right Cessation
-
2016
- 2016-04-07 TW TW105110913A patent/TWI754612B/zh active
- 2016-04-07 DE DE102016106399.1A patent/DE102016106399A1/de not_active Withdrawn
- 2016-04-07 KR KR1020160042830A patent/KR20160120679A/ko active Search and Examination
- 2016-04-08 AT AT502912016A patent/AT517014B1/de not_active IP Right Cessation
- 2016-04-08 JP JP2016077944A patent/JP6715658B2/ja not_active Expired - Fee Related
- 2016-04-08 CN CN201610217781.9A patent/CN106054535B/zh not_active Expired - Fee Related
- 2016-04-08 US US15/093,828 patent/US20160296968A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0540447A1 (de) * | 1991-10-29 | 1993-05-05 | International Business Machines Corporation | Materialsparende Schleuder für Fotolack und Verfahren |
US6001417A (en) * | 1996-09-18 | 1999-12-14 | Kabushiki Kaisha Toshiba | Resist coating method and resist coating apparatus |
US20010033895A1 (en) * | 2000-04-25 | 2001-10-25 | Tokyo Electron Limited | Film forming method and film forming apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20160296968A1 (en) | 2016-10-13 |
CN106054535B (zh) | 2021-04-27 |
AT517014B1 (de) | 2019-11-15 |
AT517014A2 (de) | 2016-10-15 |
JP6715658B2 (ja) | 2020-07-01 |
CN106054535A (zh) | 2016-10-26 |
JP2016219791A (ja) | 2016-12-22 |
DE102016106399A1 (de) | 2016-10-13 |
TW201709985A (zh) | 2017-03-16 |
KR20160120679A (ko) | 2016-10-18 |
NL2014597A (en) | 2016-10-12 |
TWI754612B (zh) | 2022-02-11 |
NL2014597B1 (en) | 2017-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM01 | Lapse because of not paying annual fees |
Effective date: 20220408 |