AT502005B1 - Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement - Google Patents

Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement Download PDF

Info

Publication number
AT502005B1
AT502005B1 AT0094005A AT9402005A AT502005B1 AT 502005 B1 AT502005 B1 AT 502005B1 AT 0094005 A AT0094005 A AT 0094005A AT 9402005 A AT9402005 A AT 9402005A AT 502005 B1 AT502005 B1 AT 502005B1
Authority
AT
Austria
Prior art keywords
electrical conductor
connection element
electrical
electrical connection
coating
Prior art date
Application number
AT0094005A
Other languages
German (de)
English (en)
Other versions
AT502005A1 (de
Inventor
Peter Dipl Ing Berghofer
Josef Dipl Ing Sugetich
Mathias Pedevilla
Original Assignee
Outokumpu Copper Neumayer Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Copper Neumayer Gmbh filed Critical Outokumpu Copper Neumayer Gmbh
Priority to AT0094005A priority Critical patent/AT502005B1/de
Priority to KR1020077030996A priority patent/KR20080026568A/ko
Priority to JP2008513862A priority patent/JP2008543003A/ja
Priority to PCT/AT2006/000217 priority patent/WO2006128203A1/de
Priority to CNA2006800194299A priority patent/CN101199085A/zh
Priority to EP06741016A priority patent/EP1897174A1/de
Priority to US11/420,954 priority patent/US7476800B2/en
Publication of AT502005A1 publication Critical patent/AT502005A1/de
Application granted granted Critical
Publication of AT502005B1 publication Critical patent/AT502005B1/de
Priority to US12/327,212 priority patent/US20090077797A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/904—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the shapes of the structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Photovoltaic Devices (AREA)
  • Non-Insulated Conductors (AREA)
AT0094005A 2005-06-01 2005-06-01 Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement AT502005B1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
AT0094005A AT502005B1 (de) 2005-06-01 2005-06-01 Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement
KR1020077030996A KR20080026568A (ko) 2005-06-01 2006-05-29 전기적 연결 소자
JP2008513862A JP2008543003A (ja) 2005-06-01 2006-05-29 電気的接続要素
PCT/AT2006/000217 WO2006128203A1 (de) 2005-06-01 2006-05-29 Elektrisches verbindungselement
CNA2006800194299A CN101199085A (zh) 2005-06-01 2006-05-29 电连接元件
EP06741016A EP1897174A1 (de) 2005-06-01 2006-05-29 Elektrisches verbindungselement
US11/420,954 US7476800B2 (en) 2005-06-01 2006-05-30 Electric connection element
US12/327,212 US20090077797A1 (en) 2005-06-01 2008-12-03 Electric connection element, and method of contacting electric components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0094005A AT502005B1 (de) 2005-06-01 2005-06-01 Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement

Publications (2)

Publication Number Publication Date
AT502005A1 AT502005A1 (de) 2006-12-15
AT502005B1 true AT502005B1 (de) 2007-03-15

Family

ID=37028955

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0094005A AT502005B1 (de) 2005-06-01 2005-06-01 Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement

Country Status (6)

Country Link
EP (1) EP1897174A1 (enExample)
JP (1) JP2008543003A (enExample)
KR (1) KR20080026568A (enExample)
CN (1) CN101199085A (enExample)
AT (1) AT502005B1 (enExample)
WO (1) WO2006128203A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5221231B2 (ja) 2008-07-18 2013-06-26 日立電線株式会社 太陽電池用リード線の製造方法
DE102008002954A1 (de) * 2008-07-18 2010-01-21 Schott Solar Gmbh Löt-Stützstelle für Solarmodule und Dünnschichtsolarmodule
WO2010070393A1 (en) * 2008-12-17 2010-06-24 Fci Method of manufacture of ic contact-less communication devices
JP2010205792A (ja) 2009-02-27 2010-09-16 Hitachi Cable Ltd 太陽電池用リード線およびその製造方法並びにそれを用いた太陽電池
DE102010024331B4 (de) 2010-06-18 2023-06-01 Polytec Pt Gmbh Verfahren zur Verklebung eines bandförmigen Leiters mit einer Solarzelle, Anordnung mit der Verklebung und Verwendung eines Piezo-Jet-Dispensers dafür
DE202010015934U1 (de) * 2010-11-26 2012-02-27 Schlenk Metallfolien Gmbh & Co. Kg Verbinder für PV-Zellen und Metallfolie zur Herstellung solcher Verbinder
DE102011009006A1 (de) * 2011-01-20 2012-07-26 Schlenk Metallfolien Gmbh & Co. Kg Verfahren zum Herstellen von vorverzinnten Verbindern für PV-Zellen
US8829360B2 (en) 2010-11-26 2014-09-09 Schlenk Metallfolien Gmbh & Co. Kg Connector for PV cells and method for its production
JP2012129359A (ja) * 2010-12-15 2012-07-05 Mitsubishi Electric Corp 太陽電池モジュール及び太陽電池セル
KR101503462B1 (ko) * 2012-09-05 2015-03-18 엠케이전자 주식회사 반도체 장치용 본딩 와이어 및 그의 제조 방법
KR101971292B1 (ko) * 2012-12-20 2019-04-22 엘에스전선 주식회사 전극와이어 및 이를 구비한 태양전지모듈
KR102107209B1 (ko) * 2013-03-18 2020-05-06 엘지전자 주식회사 인터커넥터 및 이를 구비한 태양전지 모듈
DE102013208242A1 (de) * 2013-05-06 2014-11-06 Robert Bosch Gmbh Elektrisches Verbindungselement und Batterie mit elektrischem Verbindungselement
US9272371B2 (en) 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections
CN111201683A (zh) * 2017-10-13 2020-05-26 库利克和索夫工业公司 导电端子、汇流条及其制造方法、以及组装相关的功率模块的方法
JP7031377B2 (ja) 2018-03-05 2022-03-08 三菱マテリアル株式会社 コイル
KR102192443B1 (ko) * 2018-03-22 2020-12-17 엘지전자 주식회사 태양 전지 패널용 배선재 및 이를 포함하는 태양 전지 패널
CN110311002B (zh) 2018-03-22 2022-12-23 上饶市晶科绿能科技发展有限公司 太阳能电池板的互连构件和包括该构件的太阳能电池板
DE102019200659A1 (de) * 2019-01-18 2020-07-23 Te Connectivity Germany Gmbh Elektrische Verbindungsanordnung mit zwei verschweißten Leitern und einer Schicht Cyanacrylat-Klebstoff zwischen den Leitern sowie Verfahren hierzu
CN114597686B (zh) * 2022-03-16 2024-10-25 卧龙电气驱动集团股份有限公司 接线端子、电机以及接线方法
CN115732580A (zh) * 2022-12-12 2023-03-03 浙江晶科能源有限公司 光伏组件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4562637A (en) * 1983-06-22 1986-01-07 Hitachi, Ltd. Method of manufacturing solar battery
JPH09293754A (ja) * 1996-04-24 1997-11-11 Canon Inc 電気回路部品及び電気回路部品の製造方法及び導電ボール及び導電接続部材及び導電接続部材の製造方法
JP2005116486A (ja) * 2003-10-10 2005-04-28 Hitachi Cable Ltd 電子部品用銅合金線材

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522577A (en) * 1968-05-31 1970-08-04 Alfred M Zak Electrical connector and method and apparatus for making same
US4076356A (en) * 1976-10-18 1978-02-28 Bell Telephone Laboratories, Incorporated Interconnection pin for multilayer printed circuit boards
FR2387529A1 (fr) * 1977-04-15 1978-11-10 Ibm Contacts et connexions electriques a dendrites
US5172473A (en) * 1990-05-07 1992-12-22 International Business Machines Corporation Method of making cone electrical contact
JP2669413B2 (ja) * 1995-09-28 1997-10-27 日本電気株式会社 電子部品の実装構造
DE10348542A1 (de) * 2002-11-28 2004-06-17 Brose, Ursula Kontaktierungs- und Befestigungsverfahren von Zellen sowie Photovoltaikmodul
JP4565650B2 (ja) * 2003-05-22 2010-10-20 株式会社Ｎｅｏｍａｘマテリアル 電極線材およびその製造方法並びに前記電極線材によって形成された接続用リード線を備えた太陽電池

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4562637A (en) * 1983-06-22 1986-01-07 Hitachi, Ltd. Method of manufacturing solar battery
JPH09293754A (ja) * 1996-04-24 1997-11-11 Canon Inc 電気回路部品及び電気回路部品の製造方法及び導電ボール及び導電接続部材及び導電接続部材の製造方法
JP2005116486A (ja) * 2003-10-10 2005-04-28 Hitachi Cable Ltd 電子部品用銅合金線材

Also Published As

Publication number Publication date
WO2006128203A1 (de) 2006-12-07
AT502005A1 (de) 2006-12-15
CN101199085A (zh) 2008-06-11
JP2008543003A (ja) 2008-11-27
EP1897174A1 (de) 2008-03-12
KR20080026568A (ko) 2008-03-25

Similar Documents

Publication Publication Date Title
AT502005B1 (de) Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement
DE2813968C2 (de) Halbleiteranordnung
DE2365831A1 (de) Schichtfoermiges sicherheitsglas
DE19747116A1 (de) Verbindungsanordnung zum Verbinden eines Flachkabels mit Anschlüssen
WO2012016644A1 (de) Elektrische verbindungsanordnung und elektrisches verbindungselement sowie akkumulatoranordnung dafür
AT502004B1 (de) Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle und modul mit verbindungselement
EP3123502A1 (de) Träger und/oder clip für halbleiterelemente, halbleiterbauelement und verfahren zur herstellung
EP3425665A1 (de) Verfahren zur herstellung eines bonddrahtes
EP1927419B1 (de) Netzelektrode mit einem verlötbaren Netz aus miteinander über einer Netzfläche verwebten, eine Dickschichtverzinnung aufweisenden Drähten ; Verfahren zur Herstellung einer solchen Netzelektrode
DE60128537T2 (de) Zusammenbau zur verbindung von mindestens zwei gedruckten schaltungen
DE19835443C2 (de) Chip-Thermistor und Verfahren zum Einstellen eines Chip-Thermistors
DE102011010317B4 (de) Bauelement mit Lotstoppvertiefung
EP2408279B1 (de) Verbiegbare Metallkernleiterplatte
WO2015043951A1 (de) Verfahren zur herstellung von bändern und streifen aus zwei metallischen materialien
DE69400980T2 (de) Elektrische Anschlussvorrichtung und zugehöriges Herstellungsverfahren
DE102023003381A1 (de) Kontaktierungsvorrichtung
DE4425943A1 (de) Mehrschicht-Anschlußrahmen aus Metall und Verfahren zu seiner Herstellung
DE102011015219A1 (de) Verlötbare Elektrode und Verfahren zur Herstellung einer verlötbaren Elektrode
DE10339022A1 (de) Halbleitervorrichtung
DE102005027681A1 (de) Schmelzsicherung und Verfahren zu deren Herstellung
WO2003100854A2 (de) Elektronisches bauelement-modul und verfahren zu dessen herstellung
DE3211540A1 (de) Miniaturisierte stromschiene hoher kapazitanz und verfahren zur herstellung derselben
EP3189242B1 (de) Wälzlager mit einer elektrischen schaltung sowie herstellungsverfahren einer elektrischen schaltung für ein wälzlager
DE1277446B (de) Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement
DE10338041B3 (de) Elektrischer Widerstand und Verfahren zum Herstellen von Widerständen

Legal Events

Date Code Title Description
PTA Maintained in amend form after opposition

Free format text: MIT DEN PATENTANSPRUECHEN 1 BIS 20 AUFRECHTERHALTEN

Effective date: 20080804

ELJ Ceased due to non-payment of the annual fee