AR041072A1 - Dispositivo y procedimiento para la regeneracion de un bano para depositar un metal sin energia electrica - Google Patents
Dispositivo y procedimiento para la regeneracion de un bano para depositar un metal sin energia electricaInfo
- Publication number
- AR041072A1 AR041072A1 ARP030103107A ARP030103107A AR041072A1 AR 041072 A1 AR041072 A1 AR 041072A1 AR P030103107 A ARP030103107 A AR P030103107A AR P030103107 A ARP030103107 A AR P030103107A AR 041072 A1 AR041072 A1 AR 041072A1
- Authority
- AR
- Argentina
- Prior art keywords
- metal
- regeneration
- spaces
- bath
- electrodialysis
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
- B01D61/44—Ion-selective electrodialysis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
- B01D61/44—Ion-selective electrodialysis
- B01D61/52—Accessories; Auxiliary operation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/469—Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
- C02F2001/425—Treatment of water, waste water, or sewage by ion-exchange using cation exchangers
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/16—Nature of the water, waste water, sewage or sludge to be treated from metallurgical processes, i.e. from the production, refining or treatment of metals, e.g. galvanic wastes
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/46115—Electrolytic cell with membranes or diaphragms
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Water Supply & Treatment (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Urology & Nephrology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Analytical Chemistry (AREA)
- Molecular Biology (AREA)
- Electrochemistry (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Chemically Coating (AREA)
Abstract
Se ha comprobado durante la regeneración de un bano de deposición metálica que funciona sin corriente eléctrica, que el metal del bano de deposición metálica se separa y deposita en forma de placas en la instalación de electrodiálisis. A efectos de resolver este problema se propone una mejora en las instalaciones de electrodiálisis conocidas, consistente en proveer intercambiadores catiónicos principales para la remoción de los iones de dicho metal a partir de un líquido concentrado. La intercambiadores catiónicos principales están conectados a los espacios para el material concentrado, de la instalación de electrodiálisis, de manera tal que el líquido concentrado que recorre los espacios del material concentrado es conducido a través de los intercambiadores catiónicos principales y puede ser reconocido nuevamente hacia los espacios del material concentrado.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10240350A DE10240350B4 (de) | 2002-08-28 | 2002-08-28 | Vorrichtung und Verfahren zum Regenerieren eines stromlosen Metallabscheidebades |
Publications (1)
Publication Number | Publication Date |
---|---|
AR041072A1 true AR041072A1 (es) | 2005-04-27 |
Family
ID=31502242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP030103107A AR041072A1 (es) | 2002-08-28 | 2003-08-27 | Dispositivo y procedimiento para la regeneracion de un bano para depositar un metal sin energia electrica |
Country Status (18)
Country | Link |
---|---|
US (1) | US7662266B2 (es) |
EP (1) | EP1532295B1 (es) |
JP (1) | JP2005536644A (es) |
KR (1) | KR100982919B1 (es) |
CN (1) | CN100485087C (es) |
AR (1) | AR041072A1 (es) |
AT (1) | ATE316587T1 (es) |
AU (1) | AU2003253413B8 (es) |
BR (1) | BR0311644B1 (es) |
CA (1) | CA2484799C (es) |
DE (2) | DE10240350B4 (es) |
DK (1) | DK1532295T3 (es) |
ES (1) | ES2256792T3 (es) |
HK (1) | HK1072446A1 (es) |
MX (1) | MXPA04012038A (es) |
MY (1) | MY135541A (es) |
TW (1) | TWI310790B (es) |
WO (1) | WO2004020698A1 (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8177956B2 (en) * | 2008-03-12 | 2012-05-15 | Micyus Nicole J | Method of electrolytically dissolving nickel into electroless nickel plating solutions |
JP5434188B2 (ja) * | 2009-03-26 | 2014-03-05 | 上村工業株式会社 | 無電解めっき液の再生方法 |
DE102010015361A1 (de) | 2010-04-16 | 2011-10-20 | Atotech Deutschland Gmbh | Membranelektrolysestapel, diesen enthaltende Elektrodialyseeinrichtung sowie Verfahren zum Regenerieren eines außenstromlos arbeitenden Bades zur Metallabscheidung |
TWI398554B (zh) * | 2010-07-29 | 2013-06-11 | Zhen Ding Technology Co Ltd | 電鍍裝置 |
ES2795810T3 (es) * | 2011-06-06 | 2020-11-24 | Atotech Deutschland Gmbh | Dispositivo y método para recuperar níquel a partir del fluido de un baño de niquelado |
US8961770B2 (en) | 2011-10-27 | 2015-02-24 | Pentair Residential Filtration, Llc | Controller and method of operation of a capacitive deionization system |
US9695070B2 (en) | 2011-10-27 | 2017-07-04 | Pentair Residential Filtration, Llc | Regeneration of a capacitive deionization system |
US9010361B2 (en) | 2011-10-27 | 2015-04-21 | Pentair Residential Filtration, Llc | Control valve assembly |
US8671985B2 (en) | 2011-10-27 | 2014-03-18 | Pentair Residential Filtration, Llc | Control valve assembly |
US9637397B2 (en) | 2011-10-27 | 2017-05-02 | Pentair Residential Filtration, Llc | Ion removal using a capacitive deionization system |
FR3066505B1 (fr) * | 2017-05-16 | 2021-04-09 | Safran Aircraft Engines | Procede et dispositif ameliores de filtration de bain de platine par electrodialyse |
DE102018008312A1 (de) * | 2018-10-22 | 2020-04-23 | RIAG Oberflächentechnik AG | Verfahren zur Beschichtung von Substratoberflächen, Vorrichtung mit Beschichtungsbad, Dichtemesseinrichtung, Entnahmeeinrichtung, Zugabeeinrichtungen und Steuerung |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3764503A (en) * | 1972-01-19 | 1973-10-09 | Dart Ind Inc | Electrodialysis regeneration of metal containing acid solutions |
DE2230243B1 (de) | 1972-06-21 | 1973-10-04 | Hager & Elsaesser, 7000 Stuttgartvaihingen | Verfahren zur Ruckgewinnung von Wertstoffen aus industriellen Spul hadern |
US5221328A (en) | 1991-11-27 | 1993-06-22 | Mcgean-Rohco, Inc. | Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths |
US5328616A (en) * | 1992-11-20 | 1994-07-12 | Monsanto Company | Methods and apparatus for treating electroless plating baths |
DE4310366C1 (de) * | 1993-03-30 | 1994-10-13 | Fraunhofer Ges Forschung | Verfahren zum Regenerieren von wässrigen, außenstromlos arbeitenden Beschichtungsbädern |
US5419821A (en) * | 1993-06-04 | 1995-05-30 | Vaughan; Daniel J. | Process and equipment for reforming and maintaining electroless metal baths |
FR2744463B1 (fr) * | 1996-02-02 | 1998-04-03 | Tredi | Procede pour la regeneration d'un bain de nickel use pour le revetement de pieces metalliques |
GB2319531B (en) * | 1996-11-21 | 2001-03-07 | Organo Corp | Process for rejuvenation treatment of photoresist development waste |
WO2004074544A1 (ja) | 1996-12-27 | 2004-09-02 | Ken Horikawa | 無電解ニッケルめっき液循環システム |
US6294066B1 (en) * | 1997-01-23 | 2001-09-25 | Archer Daniels Midland Company | Apparatus and process for electrodialysis of salts |
DE19849278C1 (de) * | 1998-10-15 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum elektrodialytischen Regenerieren eines stromlosen Metallabscheidebades |
DE19851180C1 (de) | 1998-11-06 | 2000-04-20 | Guv Ges Fuer Umweltvertraeglic | Verfahren zum Regenerieren einer Prozeßlösung |
-
2002
- 2002-08-28 DE DE10240350A patent/DE10240350B4/de not_active Expired - Fee Related
-
2003
- 2003-08-14 EP EP03790901A patent/EP1532295B1/en not_active Expired - Lifetime
- 2003-08-14 US US10/524,737 patent/US7662266B2/en not_active Expired - Fee Related
- 2003-08-14 DK DK03790901T patent/DK1532295T3/da active
- 2003-08-14 CA CA2484799A patent/CA2484799C/en not_active Expired - Lifetime
- 2003-08-14 WO PCT/EP2003/009030 patent/WO2004020698A1/en active IP Right Grant
- 2003-08-14 MX MXPA04012038A patent/MXPA04012038A/es active IP Right Grant
- 2003-08-14 JP JP2004532087A patent/JP2005536644A/ja active Pending
- 2003-08-14 DE DE60303393T patent/DE60303393T2/de not_active Expired - Lifetime
- 2003-08-14 CN CNB038185512A patent/CN100485087C/zh not_active Expired - Fee Related
- 2003-08-14 ES ES03790901T patent/ES2256792T3/es not_active Expired - Lifetime
- 2003-08-14 AT AT03790901T patent/ATE316587T1/de active
- 2003-08-14 AU AU2003253413A patent/AU2003253413B8/en not_active Ceased
- 2003-08-14 KR KR1020057002918A patent/KR100982919B1/ko not_active IP Right Cessation
- 2003-08-14 BR BRPI0311644-1A patent/BR0311644B1/pt not_active IP Right Cessation
- 2003-08-21 MY MYPI20033187A patent/MY135541A/en unknown
- 2003-08-26 TW TW092123430A patent/TWI310790B/zh not_active IP Right Cessation
- 2003-08-27 AR ARP030103107A patent/AR041072A1/es not_active Application Discontinuation
-
2005
- 2005-06-17 HK HK05105070A patent/HK1072446A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60303393D1 (de) | 2006-04-13 |
AU2003253413B2 (en) | 2006-07-20 |
MXPA04012038A (es) | 2005-03-07 |
CA2484799C (en) | 2012-10-16 |
TW200404913A (en) | 2004-04-01 |
BR0311644B1 (pt) | 2012-05-29 |
DE10240350A1 (de) | 2004-03-11 |
JP2005536644A (ja) | 2005-12-02 |
CN1675408A (zh) | 2005-09-28 |
EP1532295B1 (en) | 2006-01-25 |
BR0311644A (pt) | 2005-02-22 |
DE60303393T2 (de) | 2006-09-28 |
MY135541A (en) | 2008-05-30 |
ES2256792T3 (es) | 2006-07-16 |
HK1072446A1 (en) | 2005-08-26 |
WO2004020698A1 (en) | 2004-03-11 |
EP1532295A1 (en) | 2005-05-25 |
AU2003253413B8 (en) | 2007-01-25 |
ATE316587T1 (de) | 2006-02-15 |
AU2003253413A1 (en) | 2004-03-19 |
US7662266B2 (en) | 2010-02-16 |
TWI310790B (en) | 2009-06-11 |
DK1532295T3 (da) | 2006-05-15 |
CA2484799A1 (en) | 2004-03-11 |
CN100485087C (zh) | 2009-05-06 |
US20050241942A1 (en) | 2005-11-03 |
DE10240350B4 (de) | 2005-05-12 |
KR20050058409A (ko) | 2005-06-16 |
KR100982919B1 (ko) | 2010-09-20 |
AU2003253413A2 (en) | 2004-03-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant, registration | ||
FD | Application declared void or lapsed, e.g., due to non-payment of fee |