HK1072446A1 - Device and method for regenerating an electroless metal plating bath - Google Patents

Device and method for regenerating an electroless metal plating bath

Info

Publication number
HK1072446A1
HK1072446A1 HK05105070A HK05105070A HK1072446A1 HK 1072446 A1 HK1072446 A1 HK 1072446A1 HK 05105070 A HK05105070 A HK 05105070A HK 05105070 A HK05105070 A HK 05105070A HK 1072446 A1 HK1072446 A1 HK 1072446A1
Authority
HK
Hong Kong
Prior art keywords
regenerating
plating bath
metal plating
electroless metal
electroless
Prior art date
Application number
HK05105070A
Other languages
English (en)
Inventor
Jens Heydecke
Masanori Muranushi
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1072446A1 publication Critical patent/HK1072446A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
    • B01D61/44—Ion-selective electrodialysis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
    • B01D61/44—Ion-selective electrodialysis
    • B01D61/52—Accessories; Auxiliary operation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/469—Treatment of water, waste water, or sewage by electrochemical methods by electrochemical separation, e.g. by electro-osmosis, electrodialysis, electrophoresis
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
    • C02F2001/425—Treatment of water, waste water, or sewage by ion-exchange using cation exchangers
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/16—Nature of the water, waste water, sewage or sludge to be treated from metallurgical processes, i.e. from the production, refining or treatment of metals, e.g. galvanic wastes
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/46115—Electrolytic cell with membranes or diaphragms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Water Supply & Treatment (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Urology & Nephrology (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Hydrology & Water Resources (AREA)
  • Analytical Chemistry (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Chemically Coating (AREA)
HK05105070A 2002-08-28 2005-06-17 Device and method for regenerating an electroless metal plating bath HK1072446A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10240350A DE10240350B4 (de) 2002-08-28 2002-08-28 Vorrichtung und Verfahren zum Regenerieren eines stromlosen Metallabscheidebades
PCT/EP2003/009030 WO2004020698A1 (en) 2002-08-28 2003-08-14 Device and method for regenerating an electroless metal plating bath

Publications (1)

Publication Number Publication Date
HK1072446A1 true HK1072446A1 (en) 2005-08-26

Family

ID=31502242

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05105070A HK1072446A1 (en) 2002-08-28 2005-06-17 Device and method for regenerating an electroless metal plating bath

Country Status (18)

Country Link
US (1) US7662266B2 (es)
EP (1) EP1532295B1 (es)
JP (1) JP2005536644A (es)
KR (1) KR100982919B1 (es)
CN (1) CN100485087C (es)
AR (1) AR041072A1 (es)
AT (1) ATE316587T1 (es)
AU (1) AU2003253413B8 (es)
BR (1) BR0311644B1 (es)
CA (1) CA2484799C (es)
DE (2) DE10240350B4 (es)
DK (1) DK1532295T3 (es)
ES (1) ES2256792T3 (es)
HK (1) HK1072446A1 (es)
MX (1) MXPA04012038A (es)
MY (1) MY135541A (es)
TW (1) TWI310790B (es)
WO (1) WO2004020698A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8177956B2 (en) * 2008-03-12 2012-05-15 Micyus Nicole J Method of electrolytically dissolving nickel into electroless nickel plating solutions
JP5434188B2 (ja) * 2009-03-26 2014-03-05 上村工業株式会社 無電解めっき液の再生方法
DE102010015361A1 (de) 2010-04-16 2011-10-20 Atotech Deutschland Gmbh Membranelektrolysestapel, diesen enthaltende Elektrodialyseeinrichtung sowie Verfahren zum Regenerieren eines außenstromlos arbeitenden Bades zur Metallabscheidung
TWI398554B (zh) * 2010-07-29 2013-06-11 Zhen Ding Technology Co Ltd 電鍍裝置
PT2532760T (pt) * 2011-06-06 2020-06-25 Atotech Deutschland Gmbh Dispositivo e método para recuperação de níquel a partir de um fluido de banho de niquelagem
US8961770B2 (en) 2011-10-27 2015-02-24 Pentair Residential Filtration, Llc Controller and method of operation of a capacitive deionization system
US9695070B2 (en) 2011-10-27 2017-07-04 Pentair Residential Filtration, Llc Regeneration of a capacitive deionization system
US8671985B2 (en) 2011-10-27 2014-03-18 Pentair Residential Filtration, Llc Control valve assembly
US9637397B2 (en) 2011-10-27 2017-05-02 Pentair Residential Filtration, Llc Ion removal using a capacitive deionization system
US9010361B2 (en) 2011-10-27 2015-04-21 Pentair Residential Filtration, Llc Control valve assembly
FR3066505B1 (fr) * 2017-05-16 2021-04-09 Safran Aircraft Engines Procede et dispositif ameliores de filtration de bain de platine par electrodialyse
DE102018008312A1 (de) * 2018-10-22 2020-04-23 RIAG Oberflächentechnik AG Verfahren zur Beschichtung von Substratoberflächen, Vorrichtung mit Beschichtungsbad, Dichtemesseinrichtung, Entnahmeeinrichtung, Zugabeeinrichtungen und Steuerung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764503A (en) * 1972-01-19 1973-10-09 Dart Ind Inc Electrodialysis regeneration of metal containing acid solutions
DE2230243B1 (de) * 1972-06-21 1973-10-04 Hager & Elsaesser, 7000 Stuttgartvaihingen Verfahren zur Ruckgewinnung von Wertstoffen aus industriellen Spul hadern
US5221328A (en) 1991-11-27 1993-06-22 Mcgean-Rohco, Inc. Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths
US5328616A (en) * 1992-11-20 1994-07-12 Monsanto Company Methods and apparatus for treating electroless plating baths
DE4310366C1 (de) * 1993-03-30 1994-10-13 Fraunhofer Ges Forschung Verfahren zum Regenerieren von wässrigen, außenstromlos arbeitenden Beschichtungsbädern
US5419821A (en) * 1993-06-04 1995-05-30 Vaughan; Daniel J. Process and equipment for reforming and maintaining electroless metal baths
FR2744463B1 (fr) * 1996-02-02 1998-04-03 Tredi Procede pour la regeneration d'un bain de nickel use pour le revetement de pieces metalliques
GB2319531B (en) * 1996-11-21 2001-03-07 Organo Corp Process for rejuvenation treatment of photoresist development waste
US6245389B1 (en) 1996-12-27 2001-06-12 Nippon Chemical Industrial Co., Ltd. Method for circulating electroless nickel plating solution
US6294066B1 (en) * 1997-01-23 2001-09-25 Archer Daniels Midland Company Apparatus and process for electrodialysis of salts
DE19849278C1 (de) * 1998-10-15 2000-07-06 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrodialytischen Regenerieren eines stromlosen Metallabscheidebades
DE19851180C1 (de) * 1998-11-06 2000-04-20 Guv Ges Fuer Umweltvertraeglic Verfahren zum Regenerieren einer Prozeßlösung

Also Published As

Publication number Publication date
DE10240350A1 (de) 2004-03-11
AU2003253413B2 (en) 2006-07-20
TW200404913A (en) 2004-04-01
DK1532295T3 (da) 2006-05-15
KR100982919B1 (ko) 2010-09-20
MY135541A (en) 2008-05-30
TWI310790B (en) 2009-06-11
DE10240350B4 (de) 2005-05-12
AU2003253413A1 (en) 2004-03-19
DE60303393T2 (de) 2006-09-28
ATE316587T1 (de) 2006-02-15
CA2484799A1 (en) 2004-03-11
CN100485087C (zh) 2009-05-06
ES2256792T3 (es) 2006-07-16
CN1675408A (zh) 2005-09-28
BR0311644B1 (pt) 2012-05-29
EP1532295A1 (en) 2005-05-25
CA2484799C (en) 2012-10-16
JP2005536644A (ja) 2005-12-02
US7662266B2 (en) 2010-02-16
WO2004020698A1 (en) 2004-03-11
KR20050058409A (ko) 2005-06-16
EP1532295B1 (en) 2006-01-25
AU2003253413B8 (en) 2007-01-25
DE60303393D1 (de) 2006-04-13
AU2003253413A2 (en) 2004-03-19
MXPA04012038A (es) 2005-03-07
US20050241942A1 (en) 2005-11-03
BR0311644A (pt) 2005-02-22
AR041072A1 (es) 2005-04-27

Similar Documents

Publication Publication Date Title
HK1072446A1 (en) Device and method for regenerating an electroless metal plating bath
EP1681372A4 (en) AUTOCATALYTIC DEPOSITION SOLUTION AND AUTOCATALYTIC DEPOSITION PROCESSING METHOD
EP1335038A4 (en) DEVICE AND METHOD FOR ELECTRO-PLATING
EP1564314A4 (en) METAL TRANSFER STRUCTURE AND MANUFACTURING METHOD THEREFOR
AU2003223115A8 (en) Electronic component mounting apparatus and electronic component mounting method
AU2003243015A1 (en) Electroless plating apparatus and post-electroless plating cleaning method
EP1930472A4 (en) BATHING FOR THE ELASTIC DECOMPOSITION OF PALLADIUM AND METHOD FOR ELECTRICALLY DEPOSITING PALLADIUM
TWI316097B (en) Substrate holder and plating apparatus
EP1179617A4 (en) DEVICE AND METHOD FOR PLATING SUBSTRATES, ELECTROLYTIC PROCESSING METHOD AND DEVICE
AU2003241758A1 (en) Electroless plating apparatus and electroless plating method
EP1226426A4 (en) METHOD AND DEVICE FOR DETERMINING ADDITIVES IN METAL PLATING BATHS
IL146345A0 (en) Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating
EP1476006A4 (en) DEVICE AND METHOD FOR MOUNTING ELECTRONIC PART
SG111989A1 (en) Plating method
EP1542524A4 (en) METHOD AND EQUIPMENT FOR MOUNTING PARTS
EP1558794A4 (en) MEASURING THE CONCENTRATION OF A REDUCTION IN A BATHROOM FOR ELECTRICITY METAL SEPARATION
EP1583412A4 (en) DEVICE AND METHOD FOR PARTS ASSEMBLY
IL139063A0 (en) Method and device for regenerating an electroless metal deposition bath by electrodialysis
EP1338675A4 (en) SOLUTION FOR AUTOCATALYTIC GOLD AND CORRESPONDING PROCESS
AU2003225152A8 (en) Method and apparatus for reducing call setup time
GB2409423B (en) Metal casting apparatus and method
EP1227173A4 (en) AUTOCATALYTIC DEPOSIT PROCESS
AU2003219869A8 (en) Methods and apparatuses for analyzing solder plating solutions
TWI317766B (en) Method of electroless plating for copper leads
EP1483430A4 (en) CYANIDE-FREE COPING FOR ZINC AND ZINC ALLOY

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180821