AU2003241758A1 - Electroless plating apparatus and electroless plating method - Google Patents
Electroless plating apparatus and electroless plating methodInfo
- Publication number
- AU2003241758A1 AU2003241758A1 AU2003241758A AU2003241758A AU2003241758A1 AU 2003241758 A1 AU2003241758 A1 AU 2003241758A1 AU 2003241758 A AU2003241758 A AU 2003241758A AU 2003241758 A AU2003241758 A AU 2003241758A AU 2003241758 A1 AU2003241758 A1 AU 2003241758A1
- Authority
- AU
- Australia
- Prior art keywords
- electroless plating
- plating method
- plating apparatus
- electroless
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007772 electroless plating Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1669—Agitation, e.g. air introduction
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1678—Heating of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-273668 | 2002-09-19 | ||
JP2002273668A JP3495033B1 (en) | 2002-09-19 | 2002-09-19 | Electroless plating apparatus and electroless plating method |
PCT/JP2003/006498 WO2004027114A1 (en) | 2002-09-19 | 2003-05-23 | Electroless plating apparatus and electroless plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003241758A1 true AU2003241758A1 (en) | 2004-04-08 |
Family
ID=31712367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003241758A Abandoned AU2003241758A1 (en) | 2002-09-19 | 2003-05-23 | Electroless plating apparatus and electroless plating method |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060037858A1 (en) |
JP (1) | JP3495033B1 (en) |
KR (1) | KR20050057334A (en) |
CN (1) | CN1681965A (en) |
AU (1) | AU2003241758A1 (en) |
WO (1) | WO2004027114A1 (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8485120B2 (en) | 2007-04-16 | 2013-07-16 | Lam Research Corporation | Method and apparatus for wafer electroless plating |
US8069813B2 (en) * | 2007-04-16 | 2011-12-06 | Lam Research Corporation | Wafer electroless plating system and associated methods |
US8844461B2 (en) * | 2007-04-16 | 2014-09-30 | Lam Research Corporation | Fluid handling system for wafer electroless plating and associated methods |
US7874260B2 (en) * | 2006-10-25 | 2011-01-25 | Lam Research Corporation | Apparatus and method for substrate electroless plating |
JP2006057171A (en) * | 2004-08-23 | 2006-03-02 | Tokyo Electron Ltd | Electroless plating apparatus |
JP2006111938A (en) * | 2004-10-15 | 2006-04-27 | Tokyo Electron Ltd | Electroless plating apparatus |
US20060219566A1 (en) * | 2005-03-29 | 2006-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for fabricating metal layer |
JP5105833B2 (en) * | 2005-12-02 | 2012-12-26 | 東京エレクトロン株式会社 | Electroless plating apparatus, electroless plating method, and computer-readable storage medium |
KR100723664B1 (en) * | 2006-02-09 | 2007-05-30 | 김원영 | A basket device for electrless of printed circuit board |
JP2009016782A (en) | 2007-06-04 | 2009-01-22 | Tokyo Electron Ltd | Film forming method, and film forming apparatus |
JP2009076881A (en) * | 2007-08-30 | 2009-04-09 | Tokyo Electron Ltd | Treatment gas supply system and processing device |
JP5417754B2 (en) | 2008-07-11 | 2014-02-19 | 東京エレクトロン株式会社 | Film forming method and processing system |
JP5522979B2 (en) | 2009-06-16 | 2014-06-18 | 国立大学法人東北大学 | Film forming method and processing system |
JP5487748B2 (en) | 2009-06-16 | 2014-05-07 | 東京エレクトロン株式会社 | Barrier layer, film forming method and processing system |
JP5359642B2 (en) | 2009-07-22 | 2013-12-04 | 東京エレクトロン株式会社 | Deposition method |
JP5429078B2 (en) | 2010-06-28 | 2014-02-26 | 東京エレクトロン株式会社 | Film forming method and processing system |
JP2013052361A (en) * | 2011-09-05 | 2013-03-21 | Fujifilm Corp | Chemical bath deposition apparatus |
JP6736386B2 (en) | 2016-07-01 | 2020-08-05 | 東京エレクトロン株式会社 | Substrate liquid processing apparatus, substrate liquid processing method and recording medium |
WO2019107331A1 (en) | 2017-12-01 | 2019-06-06 | 東京エレクトロン株式会社 | Substrate liquid processing device |
JP7026801B2 (en) * | 2018-08-06 | 2022-02-28 | 東京エレクトロン株式会社 | Board processing equipment and board processing method |
CN110055521B (en) * | 2019-06-11 | 2024-01-26 | 绵阳皓华光电科技有限公司 | CdS film chemical water bath deposition device and preparation method thereof |
US20220406605A1 (en) * | 2019-10-30 | 2022-12-22 | Tokyo Electron Limited | Substrate liquid processing method and substrate liquid processing apparatus |
CN110983304A (en) * | 2019-12-31 | 2020-04-10 | 广州兴森快捷电路科技有限公司 | Chemical plating equipment and surface treatment system |
CN115595566B (en) * | 2022-11-17 | 2024-05-28 | 西华大学 | Environment-friendly, energy-saving, efficient and flexible chemical plating device and method |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6017585A (en) * | 1998-02-24 | 2000-01-25 | National Semiconductor Corporation | High efficiency semiconductor wafer coating apparatus and method |
US7033463B1 (en) * | 1998-08-11 | 2006-04-25 | Ebara Corporation | Substrate plating method and apparatus |
JP2000064087A (en) * | 1998-08-17 | 2000-02-29 | Dainippon Screen Mfg Co Ltd | Substrate plating and substrate plating device |
WO2001048800A1 (en) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Semiconductor wafer processing apparatus and processing method |
US6843852B2 (en) * | 2002-01-16 | 2005-01-18 | Intel Corporation | Apparatus and method for electroless spray deposition |
-
2002
- 2002-09-19 JP JP2002273668A patent/JP3495033B1/en not_active Expired - Fee Related
-
2003
- 2003-05-23 AU AU2003241758A patent/AU2003241758A1/en not_active Abandoned
- 2003-05-23 KR KR1020057004404A patent/KR20050057334A/en not_active Application Discontinuation
- 2003-05-23 CN CNA038223112A patent/CN1681965A/en active Pending
- 2003-05-23 US US10/528,117 patent/US20060037858A1/en not_active Abandoned
- 2003-05-23 WO PCT/JP2003/006498 patent/WO2004027114A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN1681965A (en) | 2005-10-12 |
JP2004107747A (en) | 2004-04-08 |
JP3495033B1 (en) | 2004-02-09 |
WO2004027114A1 (en) | 2004-04-01 |
KR20050057334A (en) | 2005-06-16 |
US20060037858A1 (en) | 2006-02-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |