Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23B—TURNING; BORING
  • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
  • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
  • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool

Definitions

• This disclosure relates to sensor modules and systems.
• Patent Document 1 discloses a cutting tool that includes a holder with a sensor mounted therein and a cutting insert.
• the sensor module comprises a sensor and a housing.
• the housing houses the sensor.
• the housing has a mounting surface and an opposing surface.
• the mounting surface is attached to an object.
• the opposing surface is located opposite the mounting surface.
• the sensor is provided on the opposing surface.
• FIG. 1 is a perspective view of a sensor module according to the first embodiment.
• FIG. 2 is an exploded perspective view showing the internal structure of the sensor module according to the first embodiment.
• FIG. 3 is a plan view of the sensor module according to the first embodiment.
• FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
• FIG. 5 is an exploded perspective view of the housing according to the first embodiment.
• FIG. 6 is a plan view of the substrate according to the first embodiment.
• FIG. 7 is a plan view of the sensor according to the first embodiment.
• FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG.
• FIG. 9 is a perspective view of a sensor module according to the second embodiment.
• FIG. 10 is an exploded perspective view showing the internal structure of the sensor module according to the second embodiment.
• FIG. 11 is a plan view of the sensor module according to the second embodiment.
• FIG. 12 is a cross-sectional view taken along line XII-XII in FIG.
• FIG. 13 is an exploded perspective view of a housing according to the second embodiment.
• FIG. 14 is an exploded perspective view showing the internal structure of the sensor module according to the third embodiment.
• FIG. 15 is an exploded perspective view of a housing according to the third embodiment.
• FIG. 16 is an exploded perspective view showing the internal structure of the sensor module according to the fourth embodiment.
• FIG. 17 is a plan view of the sensor module according to the fourth embodiment.
• FIG. 18 is a cross-sectional view taken along line XVIII-XVIII in FIG.
• FIG. 19 is an exploded perspective view of a housing according to the fifth embodiment.
• FIG. 20 is a partially enlarged plan view showing the internal structure of the sensor module according to the fifth embodiment.
• FIG. 21 is an exploded perspective view of a housing according to a first modified example of the fifth embodiment.
• FIG. 22 is a partially enlarged plan view showing the internal structure of a sensor module according to a first modification of the fifth embodiment.
• FIG. 23 is an exploded perspective view of a housing according to a second modification of the fifth embodiment.
• FIG. 24 is a partially enlarged plan view showing the internal structure of a sensor module according to a second modification of the fifth embodiment.
• FIG. 25 is an exploded perspective view of a housing according to a third modified example of the fifth embodiment.
• FIG. 20 is a partially enlarged plan view showing the internal structure of the sensor module according to the fifth embodiment.
• FIG. 21 is an exploded perspective view of a housing according to a first modified example of the fifth embodiment.
• FIG. 22 is a
• FIG. 26 is a partially enlarged plan view showing the internal structure of a sensor module according to a third modification of the fifth embodiment.
• FIG. 27 is a perspective view of a system according to the sixth embodiment.
• FIG. 28 is a side view of the system according to the sixth embodiment.
• FIG. 29 is a perspective view of a system according to the seventh embodiment.
• FIG. 30 is an exploded perspective view of the system according to the eighth embodiment.
• FIG. 31 is an exploded perspective view of the system according to the ninth embodiment.
• FIG. 32 is a perspective view of a system according to the ninth embodiment.
• the purpose of this disclosure is to provide a sensor module that allows sensors to be easily attached to an object.
• the sensor module according to the present disclosure comprises a sensor and a housing.
• the housing houses the sensor.
• the housing has a mounting surface and an opposing surface.
• the mounting surface is attached to an object.
• the opposing surface is located opposite the mounting surface.
• the sensor is provided on the opposing surface.
• the sensor module disclosed herein allows the sensor module to be easily attached to an object. Furthermore, the sensor can be attached to an object, such as a cutting tool, without reducing the rigidity of the object.
• the senor may include a strain sensor. This makes it possible to measure the strain of an object.
• the sensor module according to (1) or (2) above may include a substrate electrically connected to the sensor. This allows the sensor to be supplied with power via the substrate. Also, information detected by the sensor can be transmitted to the wireless communication unit via the substrate.
• the sensor module according to (3) above may include a terminal provided on the substrate for supplying power to the sensor. This allows power to be supplied to the sensor from a power source such as a power supply module via the terminal.
• the sensor module according to (4) above may include a power supply module electrically connected to the terminals. This allows power to be supplied from the power supply module to the sensor via the terminals.
• the power supply module may be housed in a housing. This eliminates the need for cables extending outside the housing. Furthermore, even when the space available for mounting the sensor module is severely limited, the sensor module can be easily mounted to an object. Furthermore, if the object to which the sensor module is mounted is a cutting tool such as a cutting tool, there is no interference between the cable and the insert or between the cable and the workpiece.
• the sensor module according to (5) or (6) above may include a cable connecting the terminal and the power supply module.
• the cable may be located on the board or at a position farther from the board when viewed from the sensor. This allows the sensor to be located near the insert if the object to be attached to the sensor module is, for example, a cutting tool such as a turning tool. Furthermore, because the cable is located away from the insert, it is possible to avoid interference between the cable and the insert or the workpiece.
• a sensor may be disposed between the opposing surface and the substrate. This allows the sensor module to be made smaller.
• the sensor module according to any of (1) to (7) above may include a protective member that covers the sensor. This protects the sensor.
• the protective member can also be used to bond and fix the housing's receptacle and lid together.
• the protective member may be made of resin. This allows information detected by the sensor to be transmitted wirelessly to the outside of the housing.
• the senor may be positioned on the opposing surface at a position where the distance from the mounting surface is shortest. This allows the sensor to accurately detect distortion of the object if the sensor is a strain sensor, since the distance from the sensor to the object is shortest. Furthermore, if the sensor is a temperature sensor, the distance from the sensor to the object is shortest, so the sensor can accurately detect temperature changes of the object.
• a recess may be provided on the opposing surface.
• a sensor may be disposed in the recess.
• the sensor is a strain sensor, the distance from the sensor to the object is shortened, allowing the sensor to accurately detect strain in the object.
• the sensor is a temperature sensor, the distance from the sensor to the object is shortened, allowing the sensor to accurately detect temperature changes in the object.
• the recess serves as a marker for where to attach the sensor.
• a groove may be provided on the opposing surface.
• the sensor may be disposed above the groove. This causes stress concentration in the groove, increasing the strain detected by the sensor. As a result, the sensor can detect the strain of the object with high accuracy.
• a system according to the present disclosure includes a sensor module according to any one of (1) to (13) above, and an object.
• the object is an element involved in machining or plastic processing. This makes it possible to measure the physical quantities of the element involved in machining or plastic processing. As a result, the state of the element involved in machining or plastic processing, which is the object, can be ascertained from the measured physical quantities.
• FIG. 1 is a perspective view of the sensor module 1 according to the first embodiment.
• FIG. 2 is an exploded perspective view showing the internal structure of the sensor module 1 according to the first embodiment.
• FIG. 3 is a plan view of the sensor module 1 according to the first embodiment.
• FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3.
• the sensor module 1 according to the first embodiment has a housing 3, a substrate 4, a sensor 5, a wireless communication unit 6, a terminal 7, a cable 8, and a protective member 9. Note that the protective member 9 is not shown in FIGS. 1 to 3.
• the sensor module 1 shown in Figures 1 to 4 is a module having a sensor for measuring the physical quantity of an object.
• the object may be, for example, an element involved in machining.
• the element involved in machining may be, for example, a component of a machine tool such as a cutting tool, turret, spindle, tool post, table, or chuck, or may be a workpiece or anything else that affects the machining.
• the object may be, for example, an element involved in plastic processing.
• Elements involved in plastic processing may be, for example, molds, punches, dies, the base and frame of a forging machine, or any other element that affects plastic processing.
• the internal space of the housing 3 contains a circuit board 4, a sensor 5, a wireless communication unit 6, a terminal 7, a portion of the cable 8, and a protective member 9 (see Figure 4).
• the housing 3 has a lid 31 and a storage unit 32.
• the lid 31 is attached to the storage unit 32 so as to partially cover the opening of the storage unit 32.
• the shape of the housing 3 may be changed to match the shape of the object to which it is attached.
• the shape of the housing 3 may be elliptical or rectangular (see Figure 9).
• both ends of the housing 3 may be semicircular.
• the housing 3 may have a curved shape, such as an L-shape.
• the mounting surface 33a of the housing 3 may be a flat surface or a smoothly curved surface.
• the housing 3 may have a shape that allows it to be embedded in the object, such as a male thread shape.
• the housing 3 may be made of a metal material with high rigidity.
• the housing 3 may also be made of a resin material.
• the housing 3 may also be made of a hard material other than a metal or resin material.
• FIG. 5 is an exploded perspective view of the housing 3 according to the first embodiment.
• the storage section 32 is concave and has an attachment surface 33a, an outer wall surface 33b, an opposing surface 34, and an inner wall surface 35.
• the lid section 31 is flat and has an upper surface 33c and a lower surface 36.
• the opposing surface 34 is located opposite the attachment surface 33a.
• the opposing surface 34 is the bottom surface of the storage section 32.
• the inner wall surface 35 is continuous with the lower surface 36. In this way, the opposing surface 34, inner wall surface 35, and lower surface 36 form the internal space of the housing 3.
• Mounting surface 33a is the surface that is attached to an object such as a cutting tool.
• Outer wall surface 33b is located opposite inner wall surface 35.
• Upper surface 33c is located opposite lower surface 36.
• Outer wall surface 33b is continuous with mounting surface 33a.
• the direction in which the housing 3 extends is the x direction.
• the direction perpendicular to the x direction is the y direction.
• the direction perpendicular to the x and y directions is the z direction.
• the opposing surface 34 and the mounting surface 33a are surfaces that extend in the x and y directions and are surfaces that are perpendicular to the z direction.
• the opposing surface 34 and the lower surface 36 are spaced apart in the z direction so as to sandwich the internal space of the housing 3 therebetween.
• the lid portion 31 may be provided with a first notch n1 and a through hole h. Each of the first notch n1 and the through hole h is formed to extend from the upper surface 33c to the lower surface 36.
• the first notch n1 may be located, for example, at one end of the cover portion 31 in the x direction.
• the first notch n1 may be located, for example, at the center of the cover portion 31 in the y direction.
• the cable 8 is inserted through the first notch n1.
• the through-hole h may be located at a position overlapping the wireless communication unit 6, as shown in Figure 3.
• the protective member 9 fills the internal space of the housing 3.
• the protective member 9 covers the circuit board 4, the sensor 5, the wireless communication unit 6, and part of the cable 8. In this way, the protective member 9 protects the circuit board 4, the sensor 5, and the wireless communication unit 6.
• the protective member 9 may also bond the storage section 32 and the lid section 31 together. As a result, the lid section 31 can be attached to the storage section 32.
• the protective member 9 may be formed, for example, from an insulating resin.
• the protective member 9 is made of resin, so information such as strain detected by the sensor 5 can be transmitted wirelessly to the outside of the housing 3 without blocking radio waves.
• the opposing surface 34 has a first opposing surface portion 34a and a second opposing surface portion 34b. Specifically, a recess H1 is provided on the opposing surface 34. As shown in FIG. 4, the recess H1 is located on the opposite side of the substrate 4 from the cable 8 in the x direction.
• the recess H1 is formed by the second opposing surface portion 34b and the side surface portion 34c.
• the side surface portion 34c is connected to the first opposing surface portion 34a and the second opposing surface portion 34b.
• the side surface portion 34c may extend in a direction along the z direction. In a plan view of the opposing surface 34, the side surface portion 34c may be formed so as to surround the sensor 5.
• the side surface portion 34c may be inclined with respect to the z direction.
• the second opposing surface portion 34b is the surface located in the recess H1 at the furthest position from the first opposing surface portion 34a in the z direction.
• the second opposing surface portion 34b is the surface of the opposing surface 34 that is closest to the mounting surface 33a in the z direction. From a different perspective, as shown in Figure 4, the distance t2 between the second opposing surface portion 34b and the mounting surface 33a in the z direction is smaller than the distance t1 between the first opposing surface portion 34a and the mounting surface 33a.
• the substrate 4 is disposed on the first opposing surface portion 34a.
• the sensor 5 is disposed on the second opposing surface portion 34b. In this way, the sensor 5 is disposed at a position on the opposing surface 34 where the distance to the mounting surface 33a is shortest. This results in the shortest distance from the sensor 5 to the object. In other words, if the sensor 5 is a strain sensor, the sensor 5 can accurately detect strain on the object. If the sensor 5 is a temperature sensor, the sensor 5 can accurately detect temperature changes in the object.
• the recess H1 serves as a marker for where to attach the sensor 5.
• the sensor 5 may also be disposed on the first opposing surface portion 34a.
• the substrate 4 extends in the x direction in the internal space of the housing 3.
• the substrate 4 includes an insulating layer made of resin or the like, and a circuit pattern (not shown) made of copper or the like formed on the surface of the insulating layer.
• FIG. 6 is a plan view of the substrate 4 according to the first embodiment.
• a connector 41, a wireless communication unit 6, and a terminal 7 are provided on the surface of the substrate 4.
• the substrate 4 is electrically connected to the sensor 5.
• the sensor 5 is electrically connected to the connector 41 provided on the substrate 4 via wiring 42.
• the terminal 7 is connected to the cable 8.
• the cable 8 is inserted into the first cutout n1. In this manner, the cable 8 extends from the internal space of the housing 3 to the outside.
• a portion of the cable 8 extending outside the housing 3 may be electrically connected to a power source (not shown) located outside the housing 3.
• the terminal 7 supplies power to the sensor 5 and the wireless communication unit 6 via the cable 8 connected to the power source.
• the terminal 7 may be located at the farthest position in the x direction on the surface of the substrate 4 when viewed from the sensor 5.
• the cable 8 may be located on the substrate 4 or at a position farther away than the substrate 4. This allows the sensor 5 to be located near the insert if the object to be attached to the sensor module 1 is a cutting tool such as a cutting tool. Furthermore, because the cable 8 is located at a position away from the insert, it is possible to avoid interference between the cable 8 and the insert or the workpiece.
• the wireless communication unit 6 When viewed from the sensor 5, the wireless communication unit 6 may be positioned on the surface of the substrate 4 closer in the x direction than the terminal 7. As mentioned above, when viewed in a plan view in the z direction, the wireless communication unit 6 may be positioned so that it overlaps with the through-hole h (see Figure 3). In this way, even if the housing 3 is made of a metal material, the provision of the through-hole h in the lid portion 31 makes it possible to wirelessly transmit information such as strain detected by the sensor 5 to the outside.
• An AD converter (not shown) may be placed on the surface of the substrate 4.
• Information such as distortion detected by the sensor 5 is an analog signal. Therefore, by placing an AD converter on the surface of the substrate 4, the analog signal can be converted into a digital signal and transmitted to the wireless communication unit 6.
• the sensor 5 may include, for example, a strain sensor.
• the sensor 5 may include, for example, a sensor capable of measuring a desired physical quantity.
• the sensor 5 may include, for example, any of a strain sensor, a temperature sensor, and an acceleration sensor.
• the strain sensor may be a strain gauge with a metal circuit, a semiconductor sensor with a semiconductor element, or one equipped with other strain measurement methods.
• Figure 7 is a plan view of the sensor 5 according to the first embodiment.
• Figure 8 is a cross-sectional view taken along line VIII-VIII in Figure 7. Note that in Figure 7, the metal thin film pattern 52 is indicated by a dotted line.
• the sensor 5 includes, for example, a base plate 51, a metal thin film pattern (metal thin film resistor) 52, leads 54, and a protective layer 53.
• a metal thin film pattern 52 and a protective layer 53 are formed on the surface of the base plate 51.
• the back surface of the base plate 51 can be attached to the opposing surface 34 using an adhesive.
• the base plate 51 may be made of, for example, an insulating ceramic material.
• the base plate 51 may also be made of a stainless steel material.
• the metal thin film pattern 52 may include an electrode portion 52a.
• a lead 54 may be electrically connected to the electrode portion 52a.
• the surface of the electrode portion 52a may be coated with a metal material such as copper, silver, or gold, and the lead 54 may be soldered to the surface of the electrode portion 52a.
• the lead 54 is electrically connected to the wiring 42.
• the metal thin film pattern 52 may be made of, for example, a nickel-chromium (NiCr) or chromium (Cr)-based material.
• the protective layer 53 is disposed on the base plate 51 so as to cover the thin metal film pattern 52 and the leads 54. In this way, the protective layer 53 protects the thin metal film pattern 52.
• the protective layer 53 may be an insulating material such as a thin film of alumina ( Al2O3 ) or silicon dioxide ( SiO2 ).
• the metal thin film pattern 52 When strain occurs in the object, the metal thin film pattern 52 expands and contracts via the opposing surface 34 of the housing 3 and the base plate 51. When the metal thin film pattern 52 expands and contracts, the resistance value of the metal thin film pattern 52 changes, and the amount of strain in the object corresponding to the change in resistance value can be calculated.
• the resistance value may be converted into a voltage using a bridge circuit. In this way, even if the change in resistance value is small, the amount of strain can be measured from the voltage value.
• the sensor module 1 according to the second embodiment differs from the sensor module 1 according to the first embodiment mainly in that the substrate 4 overlaps the sensor 5 in a plan view seen from the z direction, but is otherwise similar to the sensor module 1 according to the first embodiment.
• the following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.
• FIG. 9 is a perspective view of the sensor module 1 according to the second embodiment.
• FIG. 10 is an exploded perspective view showing the internal structure of the sensor module 1 according to the second embodiment.
• FIG. 11 is a plan view of the sensor module 1 according to the second embodiment.
• FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 11.
• FIG. 13 is an exploded perspective view of the housing 3 according to the second embodiment. Note that in FIG. 12, the step portion 37 is indicated by a dotted line.
• the lid portion 31 may be provided with a second notch n2 and a third notch n3.
• Each of the second notch n2 and the third notch n3 is formed to extend from the upper surface 33c to the lower surface 36.
• the position of the second notch n2 may be changed to match the position of the cable 8.
• the terminal 7 is disposed at one end of the substrate 4 in the y direction. Therefore, in a plan view seen from the z direction, the cable 8 extends from one end of the internal space of the housing 3 in the y direction to the outside. Therefore, as shown in FIG. 11, the second notch n2 may be disposed, for example, at one end of the lid portion 31 in the y direction.
• the third notch n3 is, for example, located opposite the second notch n2 in the y direction. As shown in FIG. 11, the third notch n3 may be positioned so that it overlaps with the wireless communication unit 6. In this way, the position of the third notch n3 may be changed to match the position of the wireless communication unit 6 in a plan view seen from the z direction.
• a step portion 37 is provided at the boundary between the inner wall surface 35 of the housing 3 and the first opposing surface portion 34a.
• the step portion 37 protrudes from the first opposing surface portion 34a toward the lid portion 31.
• the step portion 37 has a mounting surface 37a and a side wall surface 37b.
• the mounting surface 37a is the surface on which the substrate 4 is placed.
• the mounting surface 37a extends along both the x direction and the y direction.
• the mounting surface 37a is continuous with the inner wall surface 35.
• the side wall surface 37b is continuous with both the mounting surface 37a and the first opposing surface portion 34a.
• the side wall surface 37b extends along the x direction and the z direction.
• the mounting surface 37a is positioned above the sensor 5.
• the sensor 5 can be positioned between the opposing surface 34 (second opposing surface portion 34b) on which the sensor 5 is positioned and the substrate 4.
• the sensor 5 in a plan view seen from the z direction, can be positioned so that it overlaps the substrate 4 in the x direction, allowing the housing 3 to be made smaller in size in the x direction.
• the sensor module 1 according to the third embodiment differs from the sensor module 1 according to the first embodiment mainly in that the housing portion 32 is flat and the lid portion 31 is concave, but is otherwise similar to the sensor module 1 according to the first embodiment.
• the following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.
• Figure 14 is an exploded perspective view showing the internal structure of the sensor module 1 according to the third embodiment.
• Figure 15 is an exploded perspective view of the housing 3 according to the third embodiment.
• the accommodating portion 32 is flat and has a mounting surface 33a and an opposing surface 34.
• the opposing surface 34 is located opposite the mounting surface 33a.
• the sensor 5 and the substrate 4 are mounted in the flat accommodating portion 32.
• the lid portion 31 is concave and has an upper surface 33c, an outer wall surface 33b, an inner wall surface 35, and a lower surface 36.
• the inner wall surface 35 is continuous with the lower surface 36.
• the outer wall surface 33b is located opposite the inner wall surface 35.
• the upper surface 33c is located opposite the lower surface 36.
• the outer wall surface 33b is continuous with the upper surface 33c.
• the storage section 32 is flat and does not have an inner wall surface 35 or an outer wall surface 33b, which reduces the rigidity of the storage section 32. As a result, if the sensor 5 is a strain sensor, the sensor 5 mounted in the storage section 32 can detect small strains.
• the housing 3 has a concave lid portion 31 and a flat storage portion 32, but the shapes of the storage portion 32 and the lid portion 31 may be modified as appropriate; for example, the lid portion 31 and the storage portion 32 may each be concave.
• the sensor module 1 according to the fourth embodiment differs from the sensor module 1 according to the first embodiment mainly in that a power supply is housed in the internal space of the housing 3, but is otherwise similar to the sensor module 1 according to the first embodiment.
• the following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.
• FIG. 16 is an exploded perspective view showing the internal structure of the sensor module 1 according to the fourth embodiment.
• FIG. 17 is a plan view of the sensor module 1 according to the fourth embodiment.
• FIG. 18 is a cross-sectional view taken along line XVIII-XVIII in FIG. 17.
• the sensor module 1 has a power supply module 11 as a power source.
• the power supply module 11 includes a battery.
• the power supply module 11 is housed in the internal space of the housing 3.
• the power supply module 11 is electrically connected to the terminals 7 via wiring.
• the lid 31 does not necessarily have to be provided with the first notch n1 through which the cable 8 is inserted. In this way, the sensor module 1 has a structure in which no cable 8 extends from the internal space of the housing 3 to the outside.
• the location where the sensor module 1 can be installed is limited by the location of the power source or the length of the cable 8 connecting the power source to the sensor module 1.
• the power supply module 11 that supplies power to the sensor 5 is mounted in the internal space of the housing 3, so the sensor module 1 can be installed on an object without being subject to the above limitations. Therefore, even if there are severe limitations on the space available for installing the sensor module 1, the sensor module 1 can be easily installed on an object.
• the object to which the sensor module 1 is attached is a cutting tool such as a cutting tool
• the sensor module 1 can be attached to the object even if the object is moving or rotating.
• the battery included in the power supply module 11 may be, for example, a disposable battery or a replaceable battery.
• a partition may be provided near the power supply module 11 to prevent the protective member 9 from entering the power supply module 11 and covering it, thereby hindering battery replacement.
• the lid 31 may also be structured so that it is divided into a portion that covers the power supply module 11 and the other portion. In this way, when replacing the battery, the battery can be replaced by opening and closing only the portion of the lid 31 that covers the power supply module 11.
• the battery included in the power supply module 11 may be compatible with either wired or wireless power supply. If the battery is compatible with wired power supply, the housing 3 may be provided with a first notch n1 through which the cable 8 is inserted. If the battery is compatible with wireless power supply, the housing 3 may not be provided with a first notch n1 through which the cable 8 is inserted. This makes it easy to charge the battery.
• the power supply module 11 may be placed as long as it is within the internal space of the housing 3, and it may be placed near the terminal 7 as shown in FIG. 18. As shown in FIG. 18, the power supply module 11 may be placed farther from the sensor 5 than the board 4. The power supply module 11 may also be placed closer to the sensor 5 than the board 4.
• the sensor module 1 according to the fifth embodiment differs from the sensor module 1 according to the first embodiment mainly in that a groove 38 is provided in the opposing surface 34, but is otherwise similar to the sensor module 1 according to the first embodiment.
• the following description will focus on the configuration that differs from the sensor module 1 according to the first embodiment.
• Figure 19 is an exploded perspective view of the housing 3 according to the fifth embodiment.
• Figure 20 is an enlarged partial plan view showing the internal structure of the sensor module 1 according to the fifth embodiment. As shown in Figures 19 and 20, a groove 38 is provided on the opposing surface 34.
• the groove 38 is positioned so that it overlaps the sensor 5.
• the sensor 5 is positioned above the groove 38.
• the groove 38 may also be positioned so that it overlaps the recess H1.
• the groove portion 38 is formed by a third opposing surface portion 38a and a side surface portion 38b.
• the side surface portion 38b may be continuous with the first opposing surface portion 34a, the second opposing surface portion 34b, and the third opposing surface portion 38a.
• the side surface portion 38b may extend in a direction along the z direction.
• the side surface portion 38b may be inclined with respect to the z direction.
• the third opposing surface portion 38a may be the surface of the groove portion 38 that is located at the furthest position from the first opposing surface portion 34a in the z direction.
• the third opposing surface portion 38a may be the surface of the opposing surface 34 that is closest to the mounting surface 33a in the z direction.
• the sensor 5 is disposed on the second opposing surface portion 34b.
• the side surface portion 34c of the recess H1 is formed to surround the sensor 5.
• the width w1 of the recess H1 in the x direction is greater than the width w3 of the sensor 5 in the x direction
• the width k1 of the recess H1 in the y direction is greater than the width k3 of the sensor 5 in the y direction.
• the groove 38 extends narrowly in a certain direction.
• the width w2 of the groove 38 in the x direction is shorter than the width k2 of the groove 38 in the y direction.
• the groove 38 in a plan view of the facing surface 34, may be positioned at the center of the width w1 of the recess H1 in the x direction. In a plan view of the facing surface 34, the groove 38 may be positioned at the center of the width w3 of the sensor 5 in the x direction.
• the width k2 of the groove 38 in the y direction may be greater than the width k3 of the sensor 5 in the y direction, and may also be greater than the width k2 of the recess H1 in the y direction.
• the distance between the third opposing surface portion 38a and the mounting surface 33a in the z direction may be the same as the distance t2 between the second opposing surface portion 34b and the mounting surface 33a.
• a pair of fourth cutout portions n4 may be provided on the side surface portion 34c of the recess H1.
• the pair of fourth cutout portions n4 may be arranged to sandwich the sensor 5 in the y direction.
• the groove 38 may be surrounded by the side surface 34c of the recess H1. Therefore, the width k2 of the groove 38 in the y direction may be smaller than the width k1 of the recess H1 in the y direction.
• Fig. 25 is an exploded perspective view of the housing 3 according to a third modified example of the fifth embodiment.
• Fig. 26 is a partially enlarged plan view showing the internal structure of the sensor module 1 according to the third modified example of the fifth embodiment.
• the recess H1 may not be formed in the opposing surface 34, but a groove 38 may be formed instead.
• the sensor 5 may be provided on the groove 38.
• the shank portion 21 is attached to the turret of the machine tool. Specifically, the first side surface 21a and the third side surface 21c are gripped by the turret from the Y direction, thereby fixing the cutting tool 2 in place.
• the insert portion 22 and base plate 24 are arranged in the holding portion 25.
• the insert portion 22 is arranged stacked on the base plate 24.
• the insert portion 22 has a first flank surface 22a, a second flank surface 22b, a corner flank surface 22c, and a rake surface 22d.
• the first flank surface 22a extends in the direction in which the second side surface 21b extends.
• the second flank surface 22b extends in the direction in which the second end surface 21f extends.
• the rake surface 22d extends in the direction in which the first side surface 21a extends.
• the corner flank surface 22c is located between the first flank surface 22a and the second flank surface 22b.
• the first flank surface 22a is the main flank surface.
• the second flank surface 22b is the secondary flank surface.
• the surface roughness is measured using the "SURFCOM 2800E” manufactured by Tokyo Seimitsu Co., Ltd.
• the measurement length and cutoff value follow the JIS (Japanese Industrial Standards) B0601:2001 standard.
• the measurement length is set to an adjustable value, and the cutoff value is set to 1/5 of the set measurement length, and the surface roughness is measured.
• the sensor 5 is located at one end of the internal space of the housing 3 extending in the x direction. Therefore, if the insert portion 22 is located at one end of the cutting tool 2 extending in the X direction, the sensor 5 can be located near the insert portion 22. Specifically, the sensor module 1 may be attached to the shank portion 21 so that the cable 8 is located near the first end face 21e in the X direction and the sensor 5 is located near the insert portion 22. From a different perspective, the sensor 5 may be located closer to the insert portion 22 in the X direction than the cable 8. In this way, physical quantities of the cutting tool 2 as the target object can be measured with high accuracy. The measured physical quantity may be, for example, strain, temperature, or acceleration occurring in the shank portion 21. Furthermore, because the cable 8 is located away from the insert portion 22, interference between the cable 8 and the insert portion 22 and the workpiece can be avoided.
• the cutting tool 2 machines a rotating workpiece (material to be cut) by, for example, bringing the insert portion 22 into contact with the workpiece.
• the sensor 5 detects distortion occurring in the shank portion 21 via the housing 3.
• a signal containing information such as the distortion detected by the sensor 5 is transmitted to the wireless communication unit 6, and then transmitted from the wireless communication unit 6 to the outside of the housing 3.
• the signal is received and analyzed outside the housing 3, thereby determining the state of the cutting tool 2, which is the target object.
• the rigidity of the accommodating portion 32 of the housing 3 may be less than the rigidity of the object, or may be the same as the rigidity of the object. In this way, the sensor 5 can accurately detect strain occurring in the shank portion 21.
• the material of the housing 3 may be changed depending on the material of the object.
• the material of the housing 3 may be the same as the material of the object.
• Fig. 30 is a perspective view of the system 100 according to the eighth embodiment.
• the system 100 according to the eighth embodiment differs from the system 100 according to the sixth embodiment in that a recess H2 in which the sensor module 1 is embedded is formed in the second side surface 21b, but in other respects is substantially the same as the system 100 according to the sixth embodiment.
• the recess H2 is formed so as to open to the first region 21b1 of the second side surface 21b.
• the recess H2 is recessed (along the Z direction) from the second side surface 21b toward the fourth side surface 21d. In a plan view of the second side surface 21b, the recess H2 extends along the X direction.
• the volume of the sensor module 1 that protrudes from the side of the shank portion 21 can be reduced. In this way, the sensor module 1 can avoid interference with the workpiece, the processing machine, and chips that fly off during processing.
• the shape and position of the recess H2 may be changed to suit the shape of the sensor module 1, the shape of the object, and the physical quantity to be measured.
• the recess H2 may be formed on any of the first side surface 21a, third side surface 21c, fourth side surface 21d, and first end surface 21e.
• Power may be supplied to the sensor module 1 from an external power source, a battery may be built into the recess H2, or a power supply module 11 may be housed within the internal space of the sensor module 1.
• the recess H2 After embedding the sensor module 1 in the recess H2, the recess H2 can be covered with a lid member. In this way, even if chips and coolant generated during heavy cutting or other operations are scattered, the sensor module 1 can be protected from strong impacts caused by the chips and coolant.
• the recess H2 After embedding the sensor module 1 in the recess H2, the recess H2 does not need to be covered with a lid member. This eliminates the need to perform additional work on the shank portion 21 to install the lid member, and allows the sensor module 1 to be easily attached to the shank portion 21.
• Fig. 31 is an exploded perspective view of the system 100 according to the ninth embodiment.
• Fig. 32 is a perspective view of the system 100 according to the ninth embodiment.
• the system 100 according to the ninth embodiment differs from the system 100 according to the eighth embodiment in that a fifth notch n5 into which the sensor module 1 is embedded is formed in the second side surface 21b and the third side surface 21c, but is substantially the same as the system 100 according to the eighth embodiment in other respects.
• the fifth notch n5 is formed so as to open to the first region 21b1 of the second side surface 21b and the third side surface 21c.
• the fifth notch n5 is recessed (along the Y direction) from the third side surface 21c toward the first side surface 21a. In a plan view of the third side surface 21c, the fifth notch n5 extends along the X direction.
• the fifth notch n5 basically has the same effect as the recess H2 in the system 100 according to the eighth embodiment, and by embedding the sensor module 1 in the fifth notch n5, the volume of the sensor module 1 that protrudes from the side of the shank portion 21 can be reduced. In this way, the sensor module 1 can avoid interference with the workpiece, the processing machine, and chips that fly off during processing.
• the shape of the fifth notch n5 may be the same as the shape of the sensor module 1, or may be larger than the sensor module 1, or may be smaller than the sensor module 1 so that a portion of the sensor module 1 protrudes from the fifth notch n5.
• the depth of the fifth notch n5 in the Y direction may be smaller than, the same as, or larger than the thickness of the sensor module 1 in the z direction.
• the shape and position of the fifth notch n5 may be changed to suit the shape of the sensor module 1, the shape of the object, and the physical quantity to be measured.
• the fifth notch n5 may be formed across multiple surfaces, including the first side surface 21a, the fourth side surface 21d, and the first end surface 21e, in addition to the second side surface 21b and the third side surface 21c of the shank portion 21.
• the fifth notch n5 opens to the second side surface 21b. Therefore, when the sensor module 1 is embedded in the fifth notch n5, a portion of the outer wall surface 33b is exposed from the fifth notch n5.
• a sixth notch n6 may be provided in the area of the outer wall surface 33b that is exposed from the fifth notch n5.
• the sixth notch n6 is formed so as to extend from the outer wall surface 33b to the inner wall surface 35.
• the cable 8 may be inserted into the sixth notch n6.
• the cable 8 can be connected to a power source located outside the housing 3 without interfering with the turret.
• a power source such as a power supply module 11 including a battery may be housed in the internal space of the housing 3.
• a sixth notch n6 is provided in the area of the outer wall surface 33b exposed from the fifth notch n5. This means that even if the first side surface 21a and the third side surface 21c are gripped by the turret from the Y direction, information such as distortion detected by the sensor 5 can be wirelessly transmitted to the outside from the sixth notch n6 of the housing 3.
• the sixth notch n6 may be closed with a lid member. In this way, even if chips and coolant generated during heavy cutting or other operations are scattered, the sensor module 1 can be protected from strong impacts from the chips and coolant.
• the sixth notch n6 After embedding the sensor module 1 in the sixth notch n6, the sixth notch n6 does not need to be covered with a cover member. This eliminates the need to perform additional work on the shank portion 21 to install the cover member, and allows the sensor module 1 to be easily attached to the shank portion 21.
• the effects of the sensor module 1 according to the present disclosure will be described.
• a sensor 5 In order to grasp the state of an object such as a cutting tool, it is necessary to install a sensor 5 in the object. For example, if a cavity is provided inside the shank portion 21 and the sensor 5 is embedded therein, the rigidity of the cutting tool 2 may decrease. In particular, if a cavity is provided near the insert portion 22, the rigidity of the cutting tool 2 may decrease significantly. For this reason, it has been difficult to attach the sensor 5 to an object such as the cutting tool 2 in order to measure the physical quantity of the cutting tool 2 using the sensor 5 near the insert portion 22.
• the sensor module 1 comprises a sensor 5 and a housing 3.
• the housing 3 houses the sensor 5.
• the housing 3 has a mounting surface 33a and an opposing surface 34.
• the mounting surface 33a is attached to an object.
• the opposing surface 34 is located opposite the mounting surface 33a.
• the sensor 5 is provided on the opposing surface 34. This allows the sensor module to be easily attached to an object. Furthermore, the sensor 5 can be attached to an object, such as a cutting tool 2, without reducing the rigidity of the object.
• the senor 5 may include a strain sensor. This makes it possible to measure the strain of an object.
• the sensor module 1 may include a substrate 4 electrically connected to the sensor 5. This allows power to be supplied to the sensor 5 via the substrate 4. Furthermore, information detected by the sensor 5 can be transmitted to the wireless communication unit 6 via the substrate 4.
• the sensor module 1 may include a terminal 7 provided on the substrate 4 for supplying power to the sensor 5. This allows power to be supplied to the sensor 5 via the terminal 7 from a power source such as a power supply module 11 located outside the housing 3.
• a power source such as a power supply module 11 located outside the housing 3.
• the sensor module 1 may include a power supply module 11 electrically connected to the terminal 7. This allows power to be supplied from the power supply module 11 to the sensor 5 via the terminal 7.
• the power supply module 11 may be housed in the housing 3. This eliminates the need for a cable 8 that extends outside the housing 3. Furthermore, even when the space available for mounting the sensor module 1 is severely limited, the sensor module 1 can be easily mounted to an object. Furthermore, if the object to which the sensor module 1 is mounted is a cutting tool such as a cutting tool, there is no interference between the cable 8 and the insert portion 22, or between the cable 8 and the workpiece.
• the sensor module 1 may include a cable 8 connecting the terminal 7 and the power supply module 11.
• the cable 8 may be located on the substrate 4 or at a position farther from the substrate 4 than the sensor 5. This allows the sensor 5 to be located near the insert portion 22 if the object to be attached to the sensor module 1 is a cutting tool 2 such as a cutting tool. Furthermore, because the cable 8 is located away from the insert portion 22, it is possible to avoid interference between the cable 8 and the insert portion 22 or the workpiece.
• the senor 5 may be disposed between the opposing surface 34 and the substrate 4. This allows the sensor module 1 to be made smaller.
• the sensor module 1 may include a protective member 9 that covers the sensor 5. This protects the sensor 5.
• the protective member 9 also allows the storage portion 32 and the lid portion 31 of the housing 3 to be bonded and fixed together.
• the protective member 9 may be formed from resin. This allows information detected by the sensor 5 to be wirelessly transmitted to the outside of the housing 3.
• the sensor 5 may be positioned on the opposing surface 34 at a position where the distance from the mounting surface 33a is shortest. This allows the sensor 5 to accurately detect distortion of the object if the sensor 5 is a strain sensor, as this will result in the sensor 5 being closest to the object. Furthermore, if the sensor 5 is a temperature sensor, this will result in the sensor 5 being closest to the object, as this will result in the sensor 5 being able to accurately detect temperature changes in the object.
• a recess H1 may be provided on the facing surface 34.
• a sensor 5 may be disposed in the recess H1. If the sensor 5 is a strain sensor, this shortens the distance from the sensor 5 to the object, allowing the sensor 5 to accurately detect distortion of the object. If the sensor 5 is a temperature sensor, this shortens the distance from the sensor 5 to the object, allowing the sensor 5 to accurately detect temperature changes in the object.
• the recess H1 also serves as a marker for where to attach the sensor 5.
• the sensor module 1 of the present disclosure may be a sensor unit having a sensor 5, or may be a sensor device.
• a groove H2 may be provided on the facing surface 34.
• the sensor 5 may be disposed above the groove H2. This causes stress to concentrate in the groove H2, increasing the strain detected by the sensor 5. As a result, the sensor 5 can detect the strain of the object with high accuracy.
• the system 100 includes the sensor module 1 according to the above embodiment and an object.
• the object is an element involved in machining or plastic processing. This makes it possible to measure the physical quantities of the element involved in machining or plastic processing. As a result, the state of the element involved in machining or plastic processing, which is the object, can be determined from the measured physical quantities.
• the object is not limited to the cutting tool 2.
• the object may be, for example, an element involved in machining, which may be, for example, a component of a machine tool such as a cutting tool, turret, spindle, tool post, table, or chuck, or may be a workpiece or anything else that affects machining.
• the object may also be, for example, an element involved in plastic processing, which may be, for example, a mold, punch, die, base, or frame of a forging machine, or anything else that affects plastic processing.
• the system 100 according to the present disclosure may include the sensor module 1 according to the above embodiment and, for example, a turret.

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• 2024
  • 2024-03-01 JP JP2025561246A patent/JPWO2025182084A1/ja active Pending
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