WO2024069783A1 - Dispositif de commande, dispositif de montage, dispositif de gestion et procédé de traitement d'informations - Google Patents

Dispositif de commande, dispositif de montage, dispositif de gestion et procédé de traitement d'informations Download PDF

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Publication number
WO2024069783A1
WO2024069783A1 PCT/JP2022/036092 JP2022036092W WO2024069783A1 WO 2024069783 A1 WO2024069783 A1 WO 2024069783A1 JP 2022036092 W JP2022036092 W JP 2022036092W WO 2024069783 A1 WO2024069783 A1 WO 2024069783A1
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WIPO (PCT)
Prior art keywords
image
component
mounting
components
processing object
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PCT/JP2022/036092
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English (en)
Japanese (ja)
Inventor
智也 藤本
一也 小谷
雄哉 稲浦
賢志郎 西田
雅史 天野
博史 大池
健二 杉山
壮太 横山
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株式会社Fuji
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Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/036092 priority Critical patent/WO2024069783A1/fr
Publication of WO2024069783A1 publication Critical patent/WO2024069783A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • This specification discloses a control device, an implementation device, a management device, and an information processing method.
  • a mounting device that mounts components on a processing object such as a circuit board
  • uses a data creation device to create mounting data based on an image of the underside of the component, and creates inspection data based on an image of the topside of the component (see, for example, Patent Document 1).
  • a data creation device to create mounting data based on an image of the underside of the component, and creates inspection data based on an image of the topside of the component.
  • inspection data can be created using captured images of parts, but because the data creation device uses the parts to create images, there is still waste of parts and the efficiency of data generation is still not sufficient, so further improvements are required.
  • This disclosure has been made in consideration of these problems, and its primary objective is to provide a control device, implementation device, management device, and information processing method that can execute processing with improved efficiency.
  • control device implementation device, management device, and information processing method disclosed in this specification employ the following means to achieve the above-mentioned primary objective.
  • the control device of the present disclosure includes: A control device used in a mounting system including a printing device that prints a viscous fluid on a processing object, and a mounting device that picks up components from a component supply unit that has a holding member holding components and supplies the components, and mounts the components on the processing object that has been printed, a control unit that acquires a component image obtained by capturing an image of a component held by a holding member of the component supply unit and a base image that includes a portion of the processing object that has been printed on, on which the component is to be placed, or that includes a portion of the processing object that has not been printed on, on which the component is to be placed, and generates a reference image in which the component image is placed at a mounting position of the base image; It is equipped with the following:
  • the parts held in the parts supply unit are photographed to obtain a part image, which is then combined with the base image to generate a reference image. This means that no special parts are required for image generation, allowing for more efficient processing.
  • FIG. 1 is a schematic explanatory diagram showing an example of a mounting system 10.
  • FIG. 2 is a schematic explanatory diagram showing an example of a mounting device 13.
  • 13 is an explanatory diagram of an example in which a holding member 71 is imaged by a mark camera 34.
  • FIG. 4 is an explanatory diagram of an example of a substrate S during mounting processing.
  • FIG. 6 is a flowchart showing an example of a print inspection processing routine.
  • 11 is a flowchart showing an example of a reference image generation processing routine.
  • FIG. 4 is an explanatory diagram showing an example of a generation process of a part image 91.
  • FIG. 4 is an explanatory diagram showing an example of a generation process of a base image 92 and a reference image 93.
  • 11 is a flowchart showing an example of a mounting-inspection processing routine.
  • FIG. 1 is a schematic diagram showing an example of a mounting system 10.
  • FIG. 2 is a schematic diagram showing an example of a mounting device 13.
  • FIG. 3 is an explanatory diagram of an example of imaging a holding member 71 with a mark camera 34.
  • FIG. 4 is an explanatory diagram of an example of a board S during mounting processing, with FIG. 4A being before printing processing, FIG. 4B being after printing processing, and FIG. 4C being after component P has been placed.
  • the mounting system 10 is a system that executes mounting processing related to processing for mounting component P on board S, for example.
  • the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in FIG. 1.
  • the mounting system 10 is configured as a production line in which mounting devices 13 that mount components P on a substrate S as an object to be processed are arranged in the transport direction of the substrate S.
  • the substrate S is described as the object to be processed, but the object is not particularly limited as long as the components P are mounted on the substrate S, and may be a three-dimensional base material.
  • the mounting system 10 includes a printing device 11, a print inspection device 12, a mounting device 13, a mounting inspection device 14, and a management PC 18.
  • the printing device 11 is a device that prints a viscous fluid such as solder paste on the substrate S.
  • the printing device 11 may be a device that prints an adhesive or conductive paste as the viscous fluid.
  • the print inspection device 12 is a device that inspects the state of the printed solder.
  • the mounting device 13 is a device that mounts components P on the substrate S.
  • the mounting inspection device 14 is a device that inspects the state of the components P mounted by the mounting device 13.
  • the mounting device 13 may be a mounting-inspection device that has the functions of the mounting inspection device 14.
  • the mounting device 13 has a holding member 71 that holds components P, and picks up components P from a component supply unit 22 that supplies the components P, and mounts the components P on a board S before or after printing.
  • the mounting device 13 includes a board processing unit 21, a component supply unit 22, a parts camera 24, a control device 25, and a mounting unit 30.
  • the mounting device 13 also has a function to perform an inspection process to inspect the components P and the board S.
  • the board processing unit 21 is a unit that carries in, transports, fixes the board S at the mounting position, and carries it out.
  • the board processing unit 21 has a pair of conveyor belts that are spaced apart from each other and span the left and right directions in FIG. 1. The board S is transported by this conveyor belt.
  • the component supply section 22 has multiple feeders 23 with reels and a tray unit, and is removably attached to the front side of the mounting device 13.
  • Each reel is wound with tape as a holding member, and multiple components P are held on the surface of the tape along the longitudinal direction of the tape. This tape is unwound rearward from the reel, and with the components P exposed, it is sent by the feeder 23 to a collection position where they are collected by the collection member 33.
  • the tray unit has a tray on which multiple components P are arranged and placed, and this tray is moved in and out of the specified collection position.
  • the part camera 24 is a unit that captures images of one or more components P picked up and held by the mounting head 32. This part camera 24 is disposed between the component supply section 22 and the board processing section 21. The imaging range of this part camera 24 is above the part camera 24. When the mounting head 32 holding the component P passes above the part camera 24, the part camera 24 captures an image of the component P, and outputs the captured image data to the control device 25.
  • the mounting section 30 is a unit that picks up components P from the component supply section 22 and places them on the board S fixed to the board processing section 21.
  • the mounting section 30 includes a head moving section 31, a mounting head 32, a picking member 33, and a mark camera 34.
  • the head moving section 31 includes a slider that moves in the XY directions along a guide rail, and a motor that drives the slider.
  • the mounting head 32 is removably attached to the slider and moves in the XY directions by the head moving section 31.
  • the mounting head 32 has one or more picking members 33 (e.g., 16, 8, 4, etc.) removably attached to its underside, and can pick up multiple components P at once.
  • the picking member 33 may be a suction nozzle that uses negative pressure to pick up components, or a mechanical chuck that grips the components P.
  • the mark camera 34 is disposed on the underside of the mounting head 32, and is an imaging unit capable of imaging the board S, components P, etc. from above.
  • the mark camera 34 may be disposed, for example, on the underside of the mounting head 32, or on the underside of the slider of the head moving unit 31.
  • the mark camera 34 moves in the XY directions as the mounting head 32 moves.
  • the lower part of the mark camera 34 is an imaging area, and it images reference marks attached to the board S used to grasp the position of the board S, electrodes E formed on the board S, components P arranged on the board S, and holding members 71 of the feeder 23 of the component supply unit 22, and outputs the images to the control device 25.
  • the board S on which the mounting head 32 places the components P.
  • the mounting head 32 places the components P on multiple electrodes E of the board S on which solder is printed.
  • the board S has at least electrodes Ea1 to Ea6 on which the components Pa1 to Pa6 are placed, and electrodes Eb1 to Eb3 on which the components Pb1 to Pb3 are placed.
  • the electrodes Ea1 to Ea6 are collectively referred to as electrodes Ea
  • the electrodes Eb1 to Eb3 are collectively referred to as electrodes E
  • the components Pa1 to Pa6 are collectively referred to as components Pa
  • the components Pb1 to Pb3 are collectively referred to as components Pb
  • the components Pa to Pb are collectively referred to as components P.
  • the control device 25 is configured as a microprocessor centered on the CPU 26, and includes a memory unit 27 for storing various data.
  • the control device 25 has a function for controlling the entire mounting device 13, as well as a function for performing abnormality inspections such as whether components P and electrodes E are present and whether their shapes are within the allowable range, and a printing inspection such as whether the solder is properly printed on the electrodes E.
  • the control device 25 outputs control signals to the board processing unit 21, the component supply unit 22, the part camera 24, and the mounting unit 30, and inputs signals from the mounting unit 30, the component supply unit 22, the part camera 24, and the mounting unit 30.
  • the memory unit 27 stores mounting condition information including the mounting order for mounting the components P on the board S, the arrangement positions of the components P, and the type of collection member 33 from which the components P can be collected, as well as a reference image used during the mounting inspection.
  • the print inspection device 12 includes a board processing unit 41, a control device 42, and an inspection unit 45.
  • the board processing unit 41 is a unit similar to the board processing unit 21 of the mounting device 13.
  • the control device 42 has a configuration similar to the control device 25, and includes a CPU 43 and a memory unit 44.
  • the inspection unit 45 is a unit that inspects the board S itself and the state of the solder paste printed on the board S, and includes a head moving unit 46, an inspection head 47, and an imaging unit 48.
  • the head moving unit 46 is a unit that moves the inspection head 47 in the XY direction, similar to the head moving unit 31.
  • the inspection head 47 is provided with an imaging unit 48 that images the board S from above, and moves in the XY direction by the head moving unit 46.
  • the print inspection device 12 uses reference information including information such as the reference position where the solder paste is printed and the shape of the printed solder paste to inspect whether there are any abnormalities in the shape of the printed solder paste and whether the solder paste is printed
  • the mounting inspection device 14 includes a board processing unit 51, a control device 52, and an inspection unit 55.
  • the board processing unit 51 is a unit similar to the board processing unit 21 of the mounting device 13.
  • the control device 52 has the same configuration as the control device 25, and includes a CPU 53 and a memory unit 54.
  • the inspection unit 55 is a unit that inspects the state of the components P arranged on the board S, and includes a head moving unit 56, an inspection head 57, and an imaging unit 58.
  • the head moving unit 56 is a unit that moves the inspection head 57 in the XY direction, similar to the head moving unit 31.
  • the inspection head 57 is provided with an imaging unit 58 that images the board S from above, and moves in the XY direction by the head moving unit 56.
  • the mounting inspection device 14 uses reference information including information such as the reference position where the components P are arranged to inspect for missing components P or abnormalities in the arrangement position.
  • the mounting inspection device 14 is arranged downstream of the mounting device 13, which does not have
  • the management PC 18 is a computer that manages information about each device in the mounting system 10.
  • the management PC 18 is equipped with a control device 62, a communication unit 65, a display, and an input device.
  • the control device 62 is configured as a microprocessor centered on a CPU 63, and is equipped with a memory unit 64.
  • the memory unit 64 stores information for managing the production of the mounting system 10, as well as mounting condition information corresponding to each mounting device 13, including the mounting order for mounting components P on the board S, the placement positions of components P, and the type of collection material from which components P can be collected.
  • the communication unit 65 is an interface for exchanging information with external devices.
  • the printing process routine for executing the printing process is stored in the memory of the printing control unit 21, and is executed by the control unit of the printing device 11 after the mounting system 10 is started.
  • the control unit first carries out a process of carrying and fixing the board S by the board processing unit 30, and raising it to the printing height to bring the board S into contact with the screen mask.
  • the control unit ejects solder onto the screen mask M, moves the print head, and lowers the squeegee to bring the squeegee into contact with the upper surface of the screen mask M.
  • control unit moves the squeegee in the front-rear direction to print the solder on the board S.
  • the control unit ejects the printed board S outside the device, and when there is a next board S, carries out a transport and fixing process on the board S.
  • the control unit of the printing device 11 repeatedly executes this process until the production of the current board S is completed.
  • FIG. 5 is a flow chart showing an example of a print inspection process routine executed by the control device 42 of the print inspection device 12.
  • This routine is stored in the memory unit 44 of the print inspection device 12, and is executed by the CPU 43 of the control device 42 after the mounting system 10 is started.
  • the CPU 43 causes the substrate processing unit 41 to transport the printed substrate S to the inspection position and fix it (S100).
  • the CPU 43 causes the imaging unit 48 of the inspection head 47 to image the substrate S (S110).
  • the CPU 43 sets any of the printed electrodes E on the substrate S as the inspection target (S120).
  • the CPU 43 may set the inspection target in order, for example, starting from the electrode Ea1.
  • the CPU 43 acquires a reference image corresponding to this inspection target (S130) and determines whether the imaged inspection target is within an acceptable range for the reference image (S140).
  • the reference image may be, for example, an image of solder ideally printed on the electrode E.
  • the specified tolerance range may be empirically determined, for example, by empirically determining the relationship between the printed state of the solder and the state of the component P after reflow, within a range in which no defects occur in the component P after reflow.
  • the CPU 43 stores the inspection object as having good printing (S150).
  • the CPU 43 stores the inspection object as having a printing defect (S160).
  • the CPU 43 judges whether or not all the inspection objects of the current board S have been inspected (S170), and if not all have been inspected, executes the processing from S120 onwards. That is, the CPU 43 sets the next inspection object in S120 and judges whether or not the image of the inspection object is within the tolerance range for the reference image.
  • the CPU 43 executes a transport process according to the inspection result (S180). For example, the CPU 43 executes a process of transporting the board S with all inspection results being good to the mounting device 13, and executes a transport to remove the board S with even one printing defect from the production line. The CPU 43 then determines whether the print inspection is complete (S190), and if the print inspection is not complete, executes the processes from S100 onward. On the other hand, if the print inspection is complete in S190, the CPU 43 ends this routine. In this way, the print inspection device 12 supplies the boards S with all good print results to the mounting device 13.
  • FIG. 6 is a flow chart showing an example of a reference image generation process routine executed by the control device 25 of the mounting device 13.
  • This routine is stored in the storage unit 27, and is executed by the CPU 26 of the control device 25 after the mounting system 10 is started.
  • the CPU 26 judges whether it is the reference image generation timing (S200).
  • the reference image generation timing include when a new component P is used, such as when the feeder 23 is attached to the attachment portion of the component supply unit 22, or when the reference image is determined to be of low suitability and the reference image is updated.
  • the timing when the feeder 23 is attached to the attachment portion of the component supply unit 22 will be mainly described.
  • the CPU 26 executes the component image generation process of S200 to S280 (S10). Specifically, the CPU 26 first moves the mark camera 34 onto the corresponding feeder 23 of the component supply unit 22 (S210), captures an image to obtain its feature amount (S220), and stores it as a component-free image (S230).
  • the "feature amount” may be, for example, a brightness value or its variance.
  • FIG. 7 is an explanatory diagram showing an example of the generation process of the component image 91, where FIG. 7A is a supply unit captured image 80, FIG. 7B is a supply unit captured image 85, and FIG. 7C is an explanatory diagram showing the generation process of the component image 91.
  • the supply unit captured images 80 and 85 include the holding member 81, the storage unit 82, the feed hole 83, and the feeder 84 as images.
  • the CPU 26 obtains an image of only the holding member 71 at the leading portion of the holding member 71 (FIG. 7A).
  • the CPU 26 executes a process of sending out the holding member 71 (S240), captures an image to obtain its characteristic amount (S250), and judges whether or not there is a change in the characteristic amount (S260).
  • the CPU 26 executes the process from S240 onwards, and if there is a change in the characteristic amount in S260, the CPU 26 stores the supply unit captured image 85 as an image with a component in the storage unit 27 (S270).
  • the supply unit captured image 85 including the component P is captured (FIG. 7B).
  • the brightness value, which is the characteristic amount, changes, so that the presence of the component P can be confirmed.
  • the CPU 26 creates a difference image between a component-free image 86 obtained by capturing an image of the holding member 71 not holding a component P and a component-containing image 87 obtained by capturing an image of the holding member 71 holding a component P, performs blob processing on the difference image, cuts it out using a minimum bounding rectangle, generates a component image 91 that is an image of the component P, and stores it in the storage unit 27 (S280).
  • the CPU 26 rotates and corrects the position of the component P as necessary (FIG. 7C). In this way, the CPU 26 captures an image of the component P held by the holding member 71 of the component supply unit 22 to obtain the component image 91.
  • the CPU 26 executes the substrate image generation process (S20) of S290 to S310 and the reference image generation process (S30) of S320. Specifically, the CPU 26 moves the mark camera 34 onto the substrate S on which printing has been completed and before the placement of the components P (S290), captures an image of the substrate S, and stores it as a substrate image 90 (S300). Next, the CPU 26 extracts the area of the portion where each component P is to be placed, and stores each as a substrate image (S310). Next, the CPU 26 generates a reference image in which the component image is placed at the mounting position of the substrate image (S320). FIG.
  • FIG. 8 is an explanatory diagram showing an example of the generation process of the substrate image 92 and the reference image 93, where FIG. 8A is the substrate image 90, and FIG. 8B is an explanatory diagram of the generation process of the substrate image 92 and the reference image 93.
  • the substrate image 90 includes a plurality of areas A in which the components P are placed, including the electrodes E on which the solder is printed.
  • the CPU 26 captures an image of the board S (FIG. 8A).
  • the CPU 26 extracts each area A and stores it in the memory unit 27 as a base image 92. In this way, the CPU 26 obtains a base image including the area on the printed board S where components P will be placed.
  • the CPU 26 then generates a reference image 93 in which the component image 91 is placed at the mounting position of the base image 92.
  • the CPU 26 determines whether or not the reference images have been generated for all feeders 23 (S330), and if reference images have not been generated for all feeders 23, executes the processes from S200 onwards. On the other hand, when reference images 93 have been generated for all feeders 23 in S330, this routine ends. In this way, the reference image 93 can be obtained using the captured image of the component P on the component supply unit 22 and the captured image of the printed board S.
  • FIG. 9 is a flowchart showing an example of a mounting-inspection process routine executed by the control device 25 of the mounting device 13.
  • This routine is stored in the memory unit 27 of the mounting device 13, and is executed by the CPU 26 of the control device 25 after the mounting system 10 is started.
  • the CPU 26 first executes the mounting process of S400 to S450 (S40). Specifically, the CPU 26 reads and acquires the mounting condition information of the board S to be produced this time (S400), and causes the board processing unit 21 to transport the board S to the mounting position and perform the fixing process (S410).
  • the CPU 26 causes the mounting head 32 to pick up the components P to be picked up, which are set based on the mounting condition information (S420).
  • the CPU 26 causes the parts camera 24 to capture an image of the picked up components P, acquire the picking state of the components P (S430), correct the position of the components P based on the obtained picking state, and place them at the mounting position on the board S (S440).
  • the CPU 26 determines whether there is a next part P to be collected and placed (S450), and if there is a next part P to be collected and placed, executes the process from S420 onwards.
  • the CPU 26 executes a component inspection process in S460 to S540 to inspect the state of the component P on the board S (S50). Specifically, the CPU 26 uses the mark camera 34 to capture an image of the component P placed on the board S (S460) and sets the inspection target (S470). For example, the CPU 26 may set the inspection targets in order starting from component Pa1 in the board S of FIG. 4C. When the inspection target component P is set, the CPU 26 acquires the corresponding reference image 93 by reading it from the storage unit 27 (S480) and determines whether the placement state of the component P is within a predetermined tolerance range (S490).
  • the predetermined tolerance range may be empirically determined, for example, by empirically determining the relationship between the mounting state of the component P and the state of the component P after reflow, within a range in which no defects occur in the component P after reflow.
  • the mounting state may include the amount of deviation in the XY directions and the rotation angle.
  • the CPU 26 stores the inspection result in the storage unit 27 and outputs it to the management PC 18 (S530), and determines whether the production of the board S is completed (S540).
  • the CPU 26 executes the processing from S410 onwards.
  • this routine ends. In this way, the CPU 26 executes the inspection processing of the mounting state of the component P using the reference image 93 generated from the captured image.
  • the control device 25 of this embodiment is an example of a control device of this disclosure
  • the CPU 26 is an example of a control unit
  • the part image 91 is an example of a part image
  • the base image 92 is an example of a base image
  • the reference image 93 is an example of a reference image.
  • the part supply unit 22 is an example of a part supply unit
  • the holding member 71 is an example of a holding member
  • the mounting unit 30 is an example of a mounting unit
  • the mark camera 34 is an example of a part imaging unit and a base imaging unit. Note that in this embodiment, an example of an information processing method of this disclosure is also clarified by explaining the operation of the control device 25.
  • the control device 25 of the present embodiment described above is used in a mounting system 10 including a printing device 11 that prints solder as a viscous fluid on a substrate S as a processing object, and a mounting device 13 that picks up components P from a component supply unit 22 that has a holding member 71 holding the components P and supplies the components P, and mounts the components P on the printed substrate S.
  • the control device 25 includes a CPU 26 that serves as a control unit that acquires a component image 91 obtained by capturing an image of the components P held on the holding member 71 of the component supply unit 22, and a base image 92 that is a portion on the printed substrate S where the components P are to be placed, and generates a reference image 93 in which the component image 91 is placed at the mounting position of the base image 92.
  • the control device 25 does not consume any components P for image generation, and therefore can execute more efficient processing without wasting the components P.
  • the CPU 26 obtains the component image 91 by the difference between the captured images of the holding member 71 holding the component P and the holding member 71 not holding the component P, so the control device 25 can obtain the component image 91 more reliably depending on the presence or absence of the component P on the holding member 71.
  • the CPU 26 obtains the base image 92 obtained by capturing the substrate S after inspecting the printing state of the viscous fluid for the substrate S printed by the printing device 11, so the control device 25 can obtain the base image 92 that reflects a more appropriate printing state.
  • the CPU 26 captures the printed substrate S using the mark camera 34, which is an imaging device that can reproduce the same imaging conditions as those for executing the component inspection process that inspects the state of the component P on the substrate S, so the control device 25 can further reduce the influence of differences in image quality when using the reference image 93. Furthermore, the CPU 26 uses the reference image 93 in the component inspection process that inspects the state of the component P on the substrate S, so the reference image to be used in the component inspection process can be obtained more efficiently.
  • the mounting device 13 also includes a component supplying section 22 having a holding member 71 holding a component P and supplying the component P, a mounting section 30 that picks up the component P from the holding member 71 and mounts it on the board S, a component imaging section that images the component P on the holding member 71 of the component supplying section 22 and a mark camera 34 as a base imaging section that images the board S, and the control device 25 described above.
  • the CPU 26 of the control device 25 acquires a component image 91 from the image captured by the mark camera 34, and acquires a base image 92 from the image captured by the mark camera 34.
  • the function of the control device 25 described above can be realized in the mounting device 13.
  • the CPU 26 inspects the printing state of the viscous fluid on the board S printed by the printing device 11, and acquires a base image 92 obtained by imaging the board S after inspecting the printing state, so that a reference image 93 that reflects a more appropriate printing state can be acquired.
  • control device 25 since the control device 25 generates the reference image 93 from the component image 91 and the base image 92, it is possible to perform performance evaluation of the component inspection process using the reference image with a misaligned mounting position, for example, without having to prepare a board S on which the component P is mounted misaligned. Furthermore, since the control device 25 obtains the base image 92 from the printed board S, it is possible to perform inspection preparations that include the effects of viscous fluids.
  • control device disclosed in this specification is in no way limited to the above-mentioned embodiment, and can be implemented in various forms as long as it falls within the technical scope of the present invention.
  • the base image 92 is obtained from a substrate S on which a viscous fluid has been printed, but this is not particularly limited, and a base image may be obtained that includes a portion of the substrate S as a processing target on which components P are to be placed that has not been printed.
  • This control device 25 does not take into account the effects of the viscous fluid, but since no particular components P are consumed for image generation, it is possible to execute processing with higher efficiency without wasting components P.
  • the printed board S is imaged to obtain the base image 92 using the mark camera 34, which is an imaging device capable of reproducing the same imaging conditions as those for performing the component inspection process to inspect the state of the component P on the board S, but this is not particularly limited, and the base image 92 may be obtained using another imaging device different from the component inspection process.
  • the imaging of the base image 92 for the reference image 93 and the imaging of the component inspection process are performed using the mark camera 34 with the same imaging conditions, but for example, the base image 92 may be obtained using an image captured by the print inspection device 12, and the imaging of the component inspection process may be performed by the mark camera 34.
  • the reference image 93 is generated by the control device 25 of the mounting device 13, but the present invention is not limited to this.
  • the control device 62 of the management PC 18 may acquire the component image 91 and the base image 92 to generate the reference image 93.
  • the management PC 18 is used in the mounting system 10 including the printing device 11 that prints a viscous fluid on the substrate S as the processing object, and the mounting device 13 that has a holding member 71 that holds the components P and supplies the components P, picks up the components P from the component supply unit 22 that supplies the components P, and mounts them on the printing object, and is a management device that manages information about the mounting system 10.
  • the function of the above-mentioned control device can be realized by the management device.
  • the function of the control device 25 included in the mounting device 13 may be provided by one or more of the control device 52 of the mounting inspection device 14 and the control device 42 of the print inspection device 12. This control device can also perform processing with higher efficiency without wasting the components P.
  • the reference image 93 is described as being used for the part inspection process, but is not limited to this and may be used for other processes.
  • the control device 25 may use the reference image 93 for one or more of the learning process of part inspection on the processing object and the performance evaluation process of part inspection on the processing object.
  • the control device 25 may generate multiple reference images 93 with the mounting position of the part P shifted, and use these reference images 93 for the learning process.
  • the control device 25 may also generate multiple reference images 93 with the mounting position of the part P shifted, and use these reference images 93 for the performance evaluation process of part inspection. With this control device, the reference images used for the learning process and the performance evaluation process can be acquired more efficiently.
  • the mounting device 13 has been described as having the functions of a mounting device and a mounting inspection device, but this is not particularly limited, and the mounting device 13 may have only the mounting processing function, and the mounting inspection device 14 may have only the component inspection processing function. Specifically, the mounting device 13 executes the process of S40, and the mounting inspection device 14 executes the process of S50.
  • This mounting system 10 also does not consume the components P specifically for image generation, so it is possible to execute processing with higher efficiency without wasting the components P.
  • the component image 91 is captured by the mark camera 34 of the mounting device 13
  • the substrate image 92 is captured by the imaging unit 48 of the print inspection device 12
  • the component inspection process is captured by the imaging unit 58 of the mounting inspection device 14, so it is preferable that these imaging conditions are within a predetermined tolerance range.
  • image quality may differ depending on the imaging resolution and the lighting device, so it is preferable to image the printed board S by a device that executes the component inspection process. If the print inspection device 12, mounting device 13, and mounting inspection device 14 can obtain highly compatible images, the substrate image 92 may be obtained by the print inspection device 12.
  • control device 25 and mounting device 13 has been described as a control device 25 and mounting device 13, but is not limited to this and may be an information processing method.
  • the information processing method of the present disclosure may be configured as follows.
  • the information processing method of the present disclosure includes: 1. An information processing method executed by a computer used in a mounting system including a printing device that prints a viscous fluid on a processing object, and a mounting device that picks up components from a component supply unit that has a holding member holding components and supplies the components, and mounts the components on the processing object that has been printed, comprising: (a) acquiring a part image obtained by imaging a part held by a holding member of the part supply unit, and a base image including a portion of the processing object that has been printed on and on which the part is to be placed, or including a portion of the processing object that has not been printed on and on which the part is to be placed; (b) generating a reference image by arranging the acquired component image at a mounting position of the base image; It includes.
  • control device described above like the control device described above, it is possible to execute processing with improved efficiency.
  • various aspects of any of the control devices, implementation devices, and management devices described above may be adopted, and a step may be added that realizes the functions of any of the control devices, implementation devices, and management devices described above.
  • the inspection device and inspection method disclosed herein can be used in the technical field of devices that perform processes such as picking and placing parts.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif de commande qui est utilisé dans un système de montage qui comprend un dispositif d'impression pour imprimer un fluide visqueux sur une cible de traitement, et un dispositif de montage pour extraire un composant d'une unité d'alimentation en composants, qui fournit des composants et a un élément de maintien pour maintenir des composants, et monter ceux-ci sur la cible de traitement qui a été imprimée. Le dispositif de commande est équipé d'une unité de commande pour obtenir une image de composant obtenue par imagerie d'un composant maintenu par l'élément de maintien de l'unité d'alimentation en composants et d'une image de substrat qui comprend un emplacement sur une cible de traitement imprimée où un composant doit être positionné ou un emplacement sur une cible de traitement non imprimée où un composant doit être positionné, et générer une image de référence par positionnement de l'image de composant dans l'emplacement de montage dans l'image de substrat.
PCT/JP2022/036092 2022-09-28 2022-09-28 Dispositif de commande, dispositif de montage, dispositif de gestion et procédé de traitement d'informations WO2024069783A1 (fr)

Priority Applications (1)

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PCT/JP2022/036092 WO2024069783A1 (fr) 2022-09-28 2022-09-28 Dispositif de commande, dispositif de montage, dispositif de gestion et procédé de traitement d'informations

Applications Claiming Priority (1)

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PCT/JP2022/036092 WO2024069783A1 (fr) 2022-09-28 2022-09-28 Dispositif de commande, dispositif de montage, dispositif de gestion et procédé de traitement d'informations

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11271234A (ja) * 1998-03-23 1999-10-05 Omron Corp 検査装置および方法ならびに検査用基準データ作成装置
JP2009094283A (ja) * 2007-10-09 2009-04-30 Yamaha Motor Co Ltd 実装基板の生産方法、表面実装機及び実装基板生産管理装置
JP4836100B2 (ja) * 2008-06-10 2011-12-14 パイオニア株式会社 電子部品実装データの作成方法及び装置
WO2022149264A1 (fr) * 2021-01-08 2022-07-14 株式会社Fuji Dispositif de détection de présence/d'absence de composant, procédé d'apprentissage pour dispositif de détection de présence/d'absence de composant et machine de montage de composant

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11271234A (ja) * 1998-03-23 1999-10-05 Omron Corp 検査装置および方法ならびに検査用基準データ作成装置
JP2009094283A (ja) * 2007-10-09 2009-04-30 Yamaha Motor Co Ltd 実装基板の生産方法、表面実装機及び実装基板生産管理装置
JP4836100B2 (ja) * 2008-06-10 2011-12-14 パイオニア株式会社 電子部品実装データの作成方法及び装置
WO2022149264A1 (fr) * 2021-01-08 2022-07-14 株式会社Fuji Dispositif de détection de présence/d'absence de composant, procédé d'apprentissage pour dispositif de détection de présence/d'absence de composant et machine de montage de composant

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