WO2023243927A1 - Dispositif de détection de brosse et procédé de régulation de pression pour équipement de nettoyage de tranche de semi-conducteur - Google Patents

Dispositif de détection de brosse et procédé de régulation de pression pour équipement de nettoyage de tranche de semi-conducteur Download PDF

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Publication number
WO2023243927A1
WO2023243927A1 PCT/KR2023/007801 KR2023007801W WO2023243927A1 WO 2023243927 A1 WO2023243927 A1 WO 2023243927A1 KR 2023007801 W KR2023007801 W KR 2023007801W WO 2023243927 A1 WO2023243927 A1 WO 2023243927A1
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WO
WIPO (PCT)
Prior art keywords
brush
wafer
wafer substrate
pressure
cleaning
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Application number
PCT/KR2023/007801
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English (en)
Korean (ko)
Inventor
김태경
Original Assignee
엔씨케이티 주식회사
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Application filed by 엔씨케이티 주식회사 filed Critical 엔씨케이티 주식회사
Publication of WO2023243927A1 publication Critical patent/WO2023243927A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • semiconductor devices include an impurity ion implantation process to inject impurity ions into the semiconductor, a thin film deposition process to form a material film on a semiconductor substrate, an etching process to form a material film in a predetermined pattern, and an interlayer insulating film to be deposited on the top of the wafer. It is manufactured through several steps, such as a flattening process that removes steps by collectively polishing the wafer surface.
  • a wafer substrate cleaning process is performed to remove contaminants before and after each process.
  • a method of spraying a cleaning liquid onto the surface of the wafer substrate through a cleaning liquid spray nozzle and simultaneously wiping the surface of the wafer substrate using a brush can be used.
  • the present invention was developed with this in mind.
  • the overall brush operation such as brush pressure and position
  • the overall brush operation is controlled using a combination of a load cell and a moving coil, and the wafer substrate is cleaned.
  • the purpose is to provide a brush detection device and pressure control method for semiconductor wafer cleaning equipment that can protect the substrate from the risk of damage and ensure cleaning quality for the wafer substrate.
  • the brush pressure control method of the semiconductor wafer cleaning equipment provided by the present invention has the following characteristics.
  • the brush pressure control method of the semiconductor wafer cleaning equipment includes a preparation step of waiting the brush at the origin position outside the wafer, a first step of positioning the brush at the center of the wafer, and starting the brush rotation and brush preset pressing pressure. After first lowering to the center of the wafer, a second step of contacting the brush with the wafer surface by continuously soft landing at a relatively slow speed compared to the first lowering speed, and moving the brush from the center of the wafer to the tip while the brush is in contact with the wafer. A third step of cleaning the wafer while moving it at a set speed, a fourth step of raising the brush and positioning it at the starting point of the end of the wafer, and after repeating the first to fourth steps several times, releasing the pressing pressure and rotating it. It includes a completion step of allowing the brush to stand still at the origin position outside the wafer.
  • the preset pressing pressure of the brush can be controlled using current control of the voice coil motor.
  • the basic spin rotation chuck is removed and the pressure measuring jig is replaced in a process of setting up the pressing pressure base by attaching a weight and using a scale to set up the brush pressing pressure, and then setting the equipment. It may further include a process of comparing the brush pressing pressure to be used during the process using a scale, inputting the value, correcting the fine value, and storing it.
  • Figure 2 is a perspective view showing the brush arm module in the brush detection device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention.
  • 3 and 4 are a perspective view and a cross-sectional view showing a brush motor module in the brush detection device of semiconductor wafer cleaning equipment according to an embodiment of the present invention.
  • a spin up-down cup 11 and a spin rotation chuck 12 for loading the wafer substrate are installed in the center area, and at the same time, in the outer area, that is, the spin up-down cup 11 and the spin rotation chuck 12 are installed in the center area.
  • a brush motor module 14, a brush arm 15, a brush clean port 17, an air cleaning nozzle 18, and a nozzle arm 19 are installed in the peripheral area of the chuck 12.
  • the brush 13 when the brush arm driver 30 operates, the brush 13 can be positioned in a predetermined waiting area and a work area on the wafer substrate by rotating the brush arm 15, and the nozzle arm driver 31 When operating, the two-fluid cleaning nozzle 18 can be positioned in a predetermined work area by rotating the nozzle arm 19.
  • the brush detection device of the semiconductor wafer cleaning equipment includes a spin up-down cup 11 and a spin rotation chuck 12 as means for loading the wafer substrate.
  • the wafer substrate can be raised and lowered for loading and unloading as well as rotated for cleaning.
  • the brush sensing device of the semiconductor wafer cleaning equipment includes a brush motor module 14 and a brush arm 15 as means for substantially cleaning the wafer substrate.
  • the brush detection device of the semiconductor wafer cleaning equipment includes a DI water rinse nozzle 16 as a means of supplying cleaning water when cleaning the wafer substrate.
  • the DI water rinse nozzle 16 is installed on one side of the upper surface of the base plate 10, for example, on one side around the spin rotation chuck 12 where the wafer substrate is placed, and is used to clean the wafer substrate by the brush 13. It serves to spray cleaning water on the substrate.
  • the brush clean port 17 is installed on one side of the upper surface of the base plate 10, and serves to clean the brush bristles using pure water spray and ultrasonic cleaning methods.
  • the brush clean port 17 can clean the brush 13 by applying ultrasonic vibration while the brush 13 is immersed in the cleaning liquid in the port, and at the same time, pure water is applied to the brush 13 through a nozzle.
  • the brush 13 can be cleaned by spraying.
  • the brush detection device of the semiconductor wafer cleaning equipment includes a double-fluid cleaning nozzle 18 and a nozzle arm 19 as means for additional final cleaning of the wafer substrate after the main cleaning of the wafer substrate.
  • the nozzle arm 19 is installed on one side of the upper surface of the base plate 10, for example, on one side around the spin rotation chuck 12 on which the wafer substrate is placed, and a two-fluid substance is placed on the nozzle arm 19 installed in this way.
  • a cleaning nozzle 18 is installed.
  • the nozzle arm driving unit 31 operates, the nozzle arm 19 rotates in the horizontal direction, and as a result, the air cleaning nozzle 18 installed in a structure supported on the nozzle arm 19 is cleaned.
  • the double-fluid cleaning nozzle 18 can move to the area where the wafer substrate is placed and spray cleaning water uniformly and finely on the surface of the wafer substrate to further clean the wafer substrate.
  • the brush detection device of the semiconductor wafer cleaning equipment includes a wafer tilt detector sensor 20 and a wafer detector sensor 21 as means for detecting the loading state of the wafer substrate.
  • the wafer tilt detector sensor 20 and the wafer detector sensor 21 are each installed on one side of the upper surface of the base plate 10, for example, on one side around the spin rotation chuck 12 on which the wafer substrate is placed.
  • the wafer tilt detector sensor 20 serves to detect poor seating of the wafer substrate on the spin rotation chuck 12, and the wafer detector sensor 21 detects the presence or absence of the wafer substrate on the spin rotation chuck 12. It plays a role in detection.
  • Figure 2 is a perspective view showing the brush arm module in the brush sensing device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention
  • Figures 3 and 4 are the brush sensing device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention.
  • This is a perspective view and cross-sectional view showing the brush motor module.
  • the brush motor module 14 is a combination of a linear motor and a rotary motor, and implements brush pressure control with a moving coil motion to clean the wafer substrate with the brush 13 that rotates and moves up and down.
  • the brush motor module 14 is supported by the brush arm 15 and rotates in the horizontal direction by the movement of the brush arm 15 to move the position to the area where the wafer substrate is located.
  • the surface of the wafer substrate can be cleaned using the brush 13 while moving on the substrate.
  • This brush motor module 14 includes a module housing 22 in the form of a square case, and at this time, a voice coil motor 23, a moving block 24, a brush rotation motor 25, and a load cell are included in the module housing 22. (28) may be installed, and the brush 13 may be located outside the bottom portion of the module housing 22.
  • the voice coil motor 23 is a motor that is installed on one side of the inside of the module housing 22 and is controlled by applying pressure to the brush 13, or is not controlled by releasing the pressure, and controls the brush pressing pressure through motor current control. You can do it.
  • the moving block 24 is connected to the coil side of the voice coil motor 23 in a structure that can be operated in conjunction with it, enabling upward and downward operations when the voice coil motor 23 operates.
  • the moving block 24 By the movement, not only the brush rotation motor 25 but also the brush 13 can be raised and lowered.
  • the brush rotation motor 25 is installed in a structure that passes vertically through the moving block 24 and is supported on the upper end of the hollow rod 32 coupled to the moving block 24 side.
  • the axis 26 of the brush rotation motor 25 installed in this way extends vertically downward along the inside of the rod 32 and is located below the bottom of the module housing 22. At this time, the axis 26 is equipped with a brush ( 13) can be combined.
  • the brush rotation motor 25 when the brush rotation motor 25 operates, the brush 13 can be rotated along with the rotation of the shaft 26.
  • the brush 13 is installed on the lower end of the shaft 26 of the brush rotation motor 25 and positioned below the bottom of the module housing 22.
  • This brush 13 is made of a material such as water-soluble polyvinyl alcohol (PVA), and can clean the wafer substrate surface by contacting the surface of the wafer substrate with a preset pressing pressure provided by the voice coil motor 23. do.
  • PVA water-soluble polyvinyl alcohol
  • the load cell 28 is installed on one side of the inside of the module housing 13 and exerts a stopper function.
  • the load cell 28 installed in this way extends horizontally from the moving block 24 side and is raised and lowered together with the sensor dog 27.
  • the brush load can be detected when it comes into contact with .
  • the pressing pressure of the brush 13 is controlled by the movement by the voice coil motor 23, and the brush 13, which descends in a pressure-controlled state, is moved by the load cell 28 through the sensor dog 27. ), the final down position is determined and feedback control is performed.
  • the position where the brush 13 touches the wafer substrate is implemented by the voice coil motor 23, and the force pressing the wafer substrate is controlled by the voice coil motor 23 by receiving feedback from the load cell 28.
  • the controller 29 controls the brush pressing pressure by controlling the current of the voice coil motor 23, and also controls the pressure control current of the voice coil motor 23 based on the load provided by the load cell 28. After correcting, it is possible to control the brush pressing pressure based on this.
  • Figure 5 is a schematic diagram showing the brush force control configuration in the brush sensing device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention.
  • the pressing pressure range is 10 ⁇ 80g (set in 1g increments)
  • the self-rotation speed is 100 ⁇ 300rpm
  • the pressing pressure repeatability is ⁇ 3g
  • the pressing pressure control distance is 3mm (soft landing 2mm)
  • the pressing pressure control method is Current output control by process recipe (standard value and correction value designation setting), automatic current output control and compensation program control by load cell feedback method (control range designation setting), and alarm are set to monitor the output status for the set pressure.
  • the signal from the rotation motor driver 34, which controls the operation of the brush rotation motor 25, is input to the controller 29, and the voice coil motor driver 33, which controls the operation of the voice coil motor 23, is input to the controller 29.
  • the signal is also input to the controller 29, and the brush pressing pressure (load) detected by the load cell 28 is input to the voice coil driver 33 through the load cell converter 35 and then the voice coil motor driver ( The signal of 33) is also input to the controller 29.
  • the controller 29 that receives these signals controls the operation of the brush rotation motor 25 and the voice coil motor 23, while operating the voice coil motor 23 based on preset pressing pressure data. Through control, the brush pressure is controlled and the brush pressure is corrected.
  • the controller 29 may perform brush pressing pressure control through motor current control of the voice coil motor 23, and convert the control current of the voice coil motor 23 into units of weight (g). Control using reference data can be performed using this method.
  • controller 29 can perform control to automatically correct the pressure control current of the voice coil motor 23 through the load cell 28 with a stopper function, and the brush 13 with the pressure controlled. Control can be performed to soft land the brush at a specific distance and speed so that it contacts the wafer substrate, while control can be performed to measure and correct the pressure at a specified specific location, and the brush command pressure can be set to 10 to 80 g in 1 g increments. You can control settings up to .
  • Figure 6 is a schematic diagram showing a brush cleaning process in the brush pressure control method of semiconductor wafer cleaning equipment according to an embodiment of the present invention.
  • the first position represents the origin standby position of the brush 13
  • the second position Near edge
  • the third position represents the origin standby position of the brush 13. It indicates the position of the center point of the wafer substrate
  • position 4 indicates the position where the pressure of the brush 13 is corrected for the difference between the set value and the actual measured value using a jig and electronic scale in the calibration program mode.
  • the brush 13 is made to stand at the origin position outside the wafer.
  • the brush 13 can be controlled to a preset pressing pressure value.
  • the brush 13 can stand by in a rotating state.
  • the brush 13 is moved to a raised point at the center of the wafer substrate 100 in a rotation-stop state.
  • the brush 13 can be moved to the center position of the wafer substrate by driving the rotation motor of the brush arm module.
  • the brush 13 is first lowered to the center of the wafer with the start of the brush rotation and brush preset pressing pressure, and continues to be soft-landed at a relatively slow speed compared to the first lowering speed to brush the brush on the wafer surface. Carry out the step of contacting.
  • the brush 13 is first vertically moved down to the soft landing starting point at a speed of about 27.26 m/s and a distance (height) of about 3 mm through the voice coil motor, and continues at about 1.75 m/s.
  • Soft landing at a speed of 1.5 inches and a distance (height) of approximately 2 mm.
  • the brush 13 is brought into soft landing contact with the wafer substrate 100 through the voice coil motor (program set position and set speed).
  • the brush 13 first lowers with the pressure controlled and then performs a second soft landing so that the wafer and the brush come into contact.
  • the brush 13 completes its rise to proceed with the process in the standby state, it is then controlled through feedback using the constant pressure measurement of the load cell, and the preset pressing pressure of the brush 13 at this time is determined by the process recipe. It can be controlled using current control of the voice coil motor to match the pressure specified in .
  • the brush pressing pressure can be set and controlled (for example, set to 10 to 80 g in 1 g units) using reference data.
  • the reason for soft landing of the brush 13 after the first downward movement is to lower the brush 13 at a high speed to minimize the process time, and then lower the speed just before it touches the wafer substrate 100 so that the wafer substrate 100 This is to minimize the impact of contact with the brush bristles.
  • the brush 13 can move at a preset speed according to the program recipe.
  • the brush 13 can be moved to the end position of the wafer substrate by driving the rotation motor of the brush arm module.
  • a fourth step the step of raising the brush 13 using a voice coil motor from the end position of the wafer substrate and positioning it at a starting point set right above the end of the wafer substrate is performed.
  • steps 1 to 4 are repeated several times according to the number of program recipe settings, and then upon completion of the cleaning operation, the brush 13 is held at the origin outside the wafer with the pressing pressure released and the rotation stopped. Carry out the steps as instructed.
  • this brush cleaning process may include setting up brush pressure.
  • the setup step is a process of setting up the pressing pressure base by attaching a weight and using a scale to set up the brush pressing pressure.
  • the equipment This process consists of comparing the brush pressure to be used during the process using a scale, entering the value, correcting the fine value, and storing it.
  • the brush spin process recipe steps are as follows.
  • Step 1 As the brush 13 rotates at about 1,000 rpm, DI water rinse is discharged from the two water rinse nozzles 16, and the brush 13 is moved to the center position of the wafer substrate.
  • Step 2 The brush (13) discharges DI water rinse from only one water rinse nozzle (16) at about 1,000 rpm, and the brush (13) is lowered to the soft landing 3 mm position by starting and pressing pressure control operation.
  • Step 3 As soon as the brush 13 rotates at about 1,000 rpm, DI water rinse is discharged from the two water rinse nozzles 16, and the brush 13 is moved to the standby position.
  • Step 4 The wafer substrate is rotated at about 2,500 rpm and the DI water rinse is dried.
  • Step 5 Rotation of the wafer substrate ends and the process is completed.
  • the present invention uses a combination of a load cell and a moving coil during the wafer substrate cleaning process to control the overall brush operation, such as the pressing pressure of the brush, the position of the brush, and the correction of the pressing pressure of the brush, and the technology to control the impact of contact with the wafer substrate.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention concerne un dispositif de détection de brosse et un procédé de régulation de pression pour un équipement de nettoyage de tranche de semi-conducteur, un processus de nettoyage de brosse étant commandé tout en surveillant la position et la charge initiale d'une brosse lors du nettoyage d'un substrat de tranche. La présente invention concerne un nouveau dispositif de détection de brosse et un nouveau procédé de régulation de pression pour un équipement de nettoyage de tranche de semi-conducteur, une combinaison d'une cellule de charge et d'une bobine mobile étant utilisée pour commander le fonctionnement global d'une brosse par, par exemple, la régulation de la pression et de la position de la brosse, pendant un processus de nettoyage pour éliminer les impuretés de la surface d'un substrat de tranche et une technologie de réception en douceur de brosse réduisant au minimum l'impact du contact avec le substrat de tranche est utilisée. Le dispositif de détection de brosse et le procédé de régulation de pression permettent d'effectuer sans à-coups un processus de nettoyage sur le substrat de tranche et d'améliorer l'efficacité du processus de nettoyage en raccourcissant le temps de traitement et peuvent protéger le substrat de tranche contre le risque d'endommagement et garantir la qualité du nettoyage du substrat de tranche.
PCT/KR2023/007801 2022-06-15 2023-06-08 Dispositif de détection de brosse et procédé de régulation de pression pour équipement de nettoyage de tranche de semi-conducteur WO2023243927A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020220072843A KR102489796B1 (ko) 2022-06-15 2022-06-15 반도체 웨이퍼 세정장비의 브러시 감지장치 및 압력제어방법
KR10-2022-0072843 2022-06-15

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WO2023243927A1 true WO2023243927A1 (fr) 2023-12-21

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KR102489796B1 (ko) * 2022-06-15 2023-01-18 엔씨케이티 주식회사 반도체 웨이퍼 세정장비의 브러시 감지장치 및 압력제어방법

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KR20060037649A (ko) * 2004-10-28 2006-05-03 삼성전자주식회사 스핀 스크러버
JP4555843B2 (ja) * 2007-07-30 2010-10-06 Ｏｋｉセミコンダクタ株式会社 基板洗浄方法
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KR102489796B1 (ko) * 2022-06-15 2023-01-18 엔씨케이티 주식회사 반도체 웨이퍼 세정장비의 브러시 감지장치 및 압력제어방법

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