WO2023243927A1

WO2023243927A1 - Brush detection device and pressure control method for semiconductor wafer cleaning equipment

Info

Publication number: WO2023243927A1
Application number: PCT/KR2023/007801
Authority: WO
Inventors: 김태경
Original assignee: 엔씨케이티 주식회사
Priority date: 2022-06-15
Filing date: 2023-06-08
Publication date: 2023-12-21
Also published as: KR102489796B1

Abstract

The present invention relates to a brush detection device and a pressure control method for semiconductor wafer cleaning equipment, whereby a brush cleaning process is controlled while monitoring the position and initial load of a brush when cleaning a wafer substrate. The present invention provides a novel brush detection device and pressure control method for semiconductor wafer cleaning equipment, wherein a combination of a load cell and a moving coil are used to control the overall operation of a brush by, for example, controlling brush pressure and position, during a cleaning process for removing impurities from the surface of a wafer substrate, and brush soft landing technology minimizing the impact of contact with the wafer substrate is employed. The brush detection device and the pressure control method make it possible to smoothly perform a cleaning process on the wafer substrate and improve the efficiency of the cleaning process by shortening the process time, and can protect the wafer substrate against the risk of damage and ensure the quality of the cleaning of the wafer substrate.

Description

Brush detection device and pressure control method for semiconductor wafer cleaning equipment

The present invention relates to a brush sensing device and pressure control method for semiconductor wafer cleaning equipment. More specifically, a brush sensing device for semiconductor wafer cleaning equipment that controls the brush cleaning process while monitoring the position and initial load of the brush when cleaning a wafer substrate. and pressure control methods.

In general, semiconductor devices include an impurity ion implantation process to inject impurity ions into the semiconductor, a thin film deposition process to form a material film on a semiconductor substrate, an etching process to form a material film in a predetermined pattern, and an interlayer insulating film to be deposited on the top of the wafer. It is manufactured through several steps, such as a flattening process that removes steps by collectively polishing the wafer surface.

In order to manufacture a semiconductor device in this way, several processes are performed selectively and repeatedly, and during these various processes, many contaminants are generated on the semiconductor device.

Therefore, a wafer substrate cleaning process is performed to remove contaminants before and after each process.

Usually, in the wafer substrate cleaning process, a combination of alkaline and acidic cleaning fluids or other chemicals are used, and in the rinsing process to remove the residue, a large amount of pure water is used and the brush is touched to the wafer substrate. In this state, the wafer substrate is cleaned by rotating the wafer substrate and the brush while supplying cleaning liquid to the brush from the outside of the brush.

In most wafer substrate cleaning processes, a method of spraying a cleaning liquid onto the surface of the wafer substrate through a cleaning liquid spray nozzle and simultaneously wiping the surface of the wafer substrate using a brush can be used.

However, in the wafer substrate cleaning process using a brush, there is a disadvantage in that it is not easy to control the brush due to various reasons such as natural deterioration due to use of the equipment for a long period of time, errors in the equipment itself, or engineer's mistakes. In this way, the brush cannot be controlled accurately. If the cleaning process for the wafer substrate is performed in an untreated state, not only may foreign substances attached to the surface of the wafer substrate not be properly removed, but it may also cause defects such as scratches on the surface of the wafer substrate.

Currently, there is no system in place to detect the exact state of the brush (e.g., brush position or pressure) before proceeding with the cleaning process, so it relies on the engineer's visual confirmation process and uncertain confirmation work by the engineer. There are limits to carrying out an efficient cleaning process alone.

Therefore, the present invention was developed with this in mind. During the cleaning process to remove impurities from the surface of the wafer substrate, the overall brush operation, such as brush pressure and position, is controlled using a combination of a load cell and a moving coil, and the wafer substrate is cleaned. By implementing a new type of brush sensing device and pressure control method that applies the brush's soft landing technology that minimizes contact shock with the substrate, it is possible to perform a smooth cleaning process for the wafer substrate and improve the efficiency of the cleaning process. The purpose is to provide a brush detection device and pressure control method for semiconductor wafer cleaning equipment that can protect the substrate from the risk of damage and ensure cleaning quality for the wafer substrate.

In order to achieve the above object, the brush detection device of the semiconductor wafer cleaning equipment provided by the present invention has the following features.

The brush detection device of the semiconductor wafer cleaning equipment includes a base plate, a spin up-down cup and a spin rotation chuck that are installed on the upper surface of the base plate to fix the wafer substrate and simultaneously lift and rotate the wafer substrate, and the base plate. A brush motor module and brush arm installed on the upper surface to clean the wafer substrate using a brush, at least one DI water rinse nozzle installed on the upper surface of the base plate to supply cleaning water to the wafer substrate, and the base It is characterized by including a brush clean port installed on the upper surface of the plate to clean the brush.

The brush detection device of this semiconductor wafer cleaning equipment may further include a two-fluid cleaning nozzle and a nozzle arm that are installed on the upper surface of the base plate and spray cleaning water uniformly and finely to additionally clean the wafer substrate.

In addition, the brush detection device of the semiconductor wafer cleaning equipment may further include a wafer tilt detector sensor and a wafer detector sensor installed on the upper surface of the base plate to detect poor seating of the wafer substrate and the presence or absence of the wafer substrate.

In particular, the brush motor module is a means for cleaning a wafer substrate using a brush that rotates and moves up and down, and is installed in a module housing and on one side of the inside of the module housing to control the brush by applying pressure or releasing the pressure. A voice coil motor that does not move, a moving block that moves up and down in connection with the coil side of the voice coil motor, a brush rotation motor that is installed in a structure supported on the moving block side and provides power for rotating the brush, and the brush It may include a brush mounted on the lower part of the axis of the rotation motor and located below the bottom of the module housing, and a load cell that detects the brush load while contacting a sensor dog installed on one side of the inside of the module housing and raised and lowered with a moving block. there is.

In a preferred embodiment, the brush detection device of the semiconductor wafer cleaning equipment may further include a controller as a means to control the position and pressure of the brush, and this controller controls the brush pressing pressure to control the current of the voice coil motor. In addition to controlling, the pressure control current of the voice coil motor can be corrected based on the load provided by the load cell.

Meanwhile, in order to achieve the above object, the brush pressure control method of the semiconductor wafer cleaning equipment provided by the present invention has the following characteristics.

The brush pressure control method of the semiconductor wafer cleaning equipment includes a preparation step of waiting the brush at the origin position outside the wafer, a first step of positioning the brush at the center of the wafer, and starting the brush rotation and brush preset pressing pressure. After first lowering to the center of the wafer, a second step of contacting the brush with the wafer surface by continuously soft landing at a relatively slow speed compared to the first lowering speed, and moving the brush from the center of the wafer to the tip while the brush is in contact with the wafer. A third step of cleaning the wafer while moving it at a set speed, a fourth step of raising the brush and positioning it at the starting point of the end of the wafer, and after repeating the first to fourth steps several times, releasing the pressing pressure and rotating it. It includes a completion step of allowing the brush to stand still at the origin position outside the wafer.

Here, the second step may include a process of soft landing the brush if the preset pressing pressure is normal through feedback using the pressure measurement of the load cell after the first lowering of the brush.

Also, in the second step, the preset pressing pressure of the brush can be controlled using current control of the voice coil motor.

As a preferred embodiment, in the second step, the control current of the voice coil motor is converted into weight (g) units, and then the brush pressing pressure is set and controlled using reference data, and set and controlled to about 10 to 80 g in 1 g units. You can.

In a preferred embodiment, in the pressure setup step, the basic spin rotation chuck is removed and the pressure measuring jig is replaced in a process of setting up the pressing pressure base by attaching a weight and using a scale to set up the brush pressing pressure, and then setting the equipment. It may further include a process of comparing the brush pressing pressure to be used during the process using a scale, inputting the value, correcting the fine value, and storing it.

The brush sensing device and pressure control method of the semiconductor wafer cleaning equipment provided by the present invention have the following effects.

When cleaning the surface of a semiconductor substrate, the overall brush operation such as brush pressure and position is controlled using a combination of VCM motor, load cell, and moving coil. In addition to automatically correcting the brush pressing pressure, the brush soft lands at a specific distance and speed. By providing a brush detection device and pressure control method equipped with control technology such as contact with the wafer substrate, a smooth cleaning process for the wafer substrate can be performed, and the efficiency of the cleaning process is increased to protect the wafer substrate as well as protect the wafer substrate. It has the effect of securing cleaning quality and at the same time increasing the reliability of the product.

1 is a perspective view showing a spin chamber unit in the brush detection device of semiconductor wafer cleaning equipment according to an embodiment of the present invention.

Figure 2 is a perspective view showing the brush arm module in the brush detection device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention.

3 and 4 are a perspective view and a cross-sectional view showing a brush motor module in the brush detection device of semiconductor wafer cleaning equipment according to an embodiment of the present invention.

Figure 5 is a schematic diagram showing the brush force control configuration in the brush detection device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention.

Figure 6 is a schematic diagram showing the brush cleaning process in the brush pressure control method of semiconductor wafer cleaning equipment according to an embodiment of the present invention.

The brush detection device of the semiconductor wafer cleaning equipment includes a base plate, a spin up-down cup and spin rotation chuck that are installed on the upper surface of the base plate to fix the wafer substrate and simultaneously lift and rotate the wafer substrate, and the upper surface of the base plate. A brush motor module and brush arm installed on the upper surface of the base plate to clean the wafer substrate using a brush, at least one DI water rinse nozzle installed on the upper surface of the base plate to supply cleaning water to the wafer substrate, and the base plate It is characterized by including a brush clean port installed on the upper surface of the brush to clean the brush.

Hereinafter, the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a perspective view showing a spin chamber unit in the brush detection device of semiconductor wafer cleaning equipment according to an embodiment of the present invention.

As shown in FIG. 1, the brush sensing device of the semiconductor wafer cleaning equipment includes a base plate 10 as a means of supporting each component of the device.

On the upper surface of the base plate 10, a spin up-down cup 11 and a spin rotation chuck 12 for loading the wafer substrate are installed in the center area, and at the same time, in the outer area, that is, the spin up-down cup 11 and the spin rotation chuck 12 are installed in the center area. A brush motor module 14, a brush arm 15, a brush clean port 17, an air cleaning nozzle 18, and a nozzle arm 19 are installed in the peripheral area of the chuck 12.

In addition, a driving unit (not shown) for operating the spin up-down cup 11 and the spin rotation chuck 12, and a brush arm driving unit 30 for operating the brush arm 15 are provided on the bottom of the base plate 10. , a nozzle arm driving unit 31 for operating the nozzle arm 19 is installed, respectively.

Accordingly, when the brush arm driver 30 operates, the brush 13 can be positioned in a predetermined waiting area and a work area on the wafer substrate by rotating the brush arm 15, and the nozzle arm driver 31 When operating, the two-fluid cleaning nozzle 18 can be positioned in a predetermined work area by rotating the nozzle arm 19.

Additionally, the brush detection device of the semiconductor wafer cleaning equipment includes a spin up-down cup 11 and a spin rotation chuck 12 as means for loading the wafer substrate.

The spin up-down cup 11 and the spin rotation chuck 12 are installed in the center area of the upper surface of the base plate 10 and serve to fix the wafer substrate and simultaneously lift and rotate the wafer substrate.

The spin up-down cup 11 and the spin rotation chuck 12 are arranged in a coaxial structure from the inside and outside, and the inside spin rotation chuck 12 is positioned to protrude more upward compared to the spin up-down cup 11, like this. A wafer substrate can be placed and seated on the upper surface of the protruding spin rotation chuck 12.

Accordingly, when the spin up-down cup 11 and the spin rotation chuck 12 operate, the wafer substrate can be raised and lowered for loading and unloading as well as rotated for cleaning.

Additionally, the brush sensing device of the semiconductor wafer cleaning equipment includes a brush motor module 14 and a brush arm 15 as means for substantially cleaning the wafer substrate.

The brush arm 15 is installed on one side of the upper surface of the base plate 10, for example, on one side around the spin rotation chuck 12 on which the wafer substrate is placed, and a brush ( A brush motor module 14 having 13) is installed.

Accordingly, when the brush arm driving unit 30 operates, the brush arm 15 rotates in the horizontal direction, and as a result, the brush of the brush motor module 14 installed in a structure supported on the brush arm 15 ( 13) can perform cleaning operations by freely moving between the area where the wafer substrate is located for cleaning as well as the area outside the wafer substrate, such as the waiting area outside the wafer substrate and the area where the brush clean port 17 is located. There will be.

Additionally, the brush detection device of the semiconductor wafer cleaning equipment includes a DI water rinse nozzle 16 as a means of supplying cleaning water when cleaning the wafer substrate.

The DI water rinse nozzle 16 is installed on one side of the upper surface of the base plate 10, for example, on one side around the spin rotation chuck 12 where the wafer substrate is placed, and is used to clean the wafer substrate by the brush 13. It serves to spray cleaning water on the substrate.

It is desirable to have two such DI water rinse nozzles 16, each of which is disposed at a position facing each other.

Additionally, the brush detection device of the semiconductor wafer cleaning equipment includes a brush clean port 17 as a means for cleaning the contaminated brush 13.

The brush clean port 17 is installed on one side of the upper surface of the base plate 10, and serves to clean the brush bristles using pure water spray and ultrasonic cleaning methods.

For example, the brush clean port 17 can clean the brush 13 by applying ultrasonic vibration while the brush 13 is immersed in the cleaning liquid in the port, and at the same time, pure water is applied to the brush 13 through a nozzle. The brush 13 can be cleaned by spraying.

In addition, the brush detection device of the semiconductor wafer cleaning equipment includes a double-fluid cleaning nozzle 18 and a nozzle arm 19 as means for additional final cleaning of the wafer substrate after the main cleaning of the wafer substrate.

The nozzle arm 19 is installed on one side of the upper surface of the base plate 10, for example, on one side around the spin rotation chuck 12 on which the wafer substrate is placed, and a two-fluid substance is placed on the nozzle arm 19 installed in this way. A cleaning nozzle 18 is installed.

Accordingly, when the nozzle arm driving unit 31 operates, the nozzle arm 19 rotates in the horizontal direction, and as a result, the air cleaning nozzle 18 installed in a structure supported on the nozzle arm 19 is cleaned. For this purpose, it is possible to perform cleaning work, etc. by freely moving between the area where the wafer substrate is located as well as the area outside the wafer substrate.

For example, the double-fluid cleaning nozzle 18 can move to the area where the wafer substrate is placed and spray cleaning water uniformly and finely on the surface of the wafer substrate to further clean the wafer substrate.

In addition, the brush detection device of the semiconductor wafer cleaning equipment includes a wafer tilt detector sensor 20 and a wafer detector sensor 21 as means for detecting the loading state of the wafer substrate.

The wafer tilt detector sensor 20 and the wafer detector sensor 21 are each installed on one side of the upper surface of the base plate 10, for example, on one side around the spin rotation chuck 12 on which the wafer substrate is placed.

Here, the wafer tilt detector sensor 20 serves to detect poor seating of the wafer substrate on the spin rotation chuck 12, and the wafer detector sensor 21 detects the presence or absence of the wafer substrate on the spin rotation chuck 12. It plays a role in detection.

Figure 2 is a perspective view showing the brush arm module in the brush sensing device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention, and Figures 3 and 4 are the brush sensing device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention. This is a perspective view and cross-sectional view showing the brush motor module.

As shown in Figures 2 to 4. The brush motor module 14 is a combination of a linear motor and a rotary motor, and implements brush pressure control with a moving coil motion to clean the wafer substrate with the brush 13 that rotates and moves up and down.

To this end, the brush motor module 14 is supported by the brush arm 15 and rotates in the horizontal direction by the movement of the brush arm 15 to move the position to the area where the wafer substrate is located. The surface of the wafer substrate can be cleaned using the brush 13 while moving on the substrate.

This brush motor module 14 includes a module housing 22 in the form of a square case, and at this time, a voice coil motor 23, a moving block 24, a brush rotation motor 25, and a load cell are included in the module housing 22. (28) may be installed, and the brush 13 may be located outside the bottom portion of the module housing 22.

The voice coil motor 23 is a motor that is installed on one side of the inside of the module housing 22 and is controlled by applying pressure to the brush 13, or is not controlled by releasing the pressure, and controls the brush pressing pressure through motor current control. You can do it.

That is, it is possible to control the pressing pressure of the brush 13 through movement by the voice coil motor 23.

The moving block 24 is connected to the coil side of the voice coil motor 23 in a structure that can be operated in conjunction with it, enabling upward and downward operations when the voice coil motor 23 operates. The moving block 24 By the movement, not only the brush rotation motor 25 but also the brush 13 can be raised and lowered.

In addition, a sensor dog 27 extending horizontally to one side is installed on one side of the moving block 24. At this time, the sensor dog 27 contacts the load cell 28 when the moving block 24 is lowered ( pressurizing), the pressure of the voice coil motor 23, that is, the current pressing pressure of the brush 13, can be provided to the load cell 28.

The brush rotation motor 25 is installed in a structure that passes vertically through the moving block 24 and is supported on the upper end of the hollow rod 32 coupled to the moving block 24 side.

The axis 26 of the brush rotation motor 25 installed in this way extends vertically downward along the inside of the rod 32 and is located below the bottom of the module housing 22. At this time, the axis 26 is equipped with a brush ( 13) can be combined.

Accordingly, when the brush rotation motor 25 operates, the brush 13 can be rotated along with the rotation of the shaft 26.

The brush 13 is installed on the lower end of the shaft 26 of the brush rotation motor 25 and positioned below the bottom of the module housing 22.

This brush 13 is made of a material such as water-soluble polyvinyl alcohol (PVA), and can clean the wafer substrate surface by contacting the surface of the wafer substrate with a preset pressing pressure provided by the voice coil motor 23. do.

The load cell 28 is installed on one side of the inside of the module housing 13 and exerts a stopper function. The load cell 28 installed in this way extends horizontally from the moving block 24 side and is raised and lowered together with the sensor dog 27. The brush load can be detected when it comes into contact with .

For example, the pressing pressure of the brush 13 is controlled by the movement by the voice coil motor 23, and the brush 13, which descends in a pressure-controlled state, is moved by the load cell 28 through the sensor dog 27. ), the final down position is determined and feedback control is performed.

That is, the position where the brush 13 touches the wafer substrate is implemented by the voice coil motor 23, and the force pressing the wafer substrate is controlled by the voice coil motor 23 by receiving feedback from the load cell 28.

Here, the load cell 28 is fixed by withstanding the pressure of the voice coil motor 23 due to the characteristics of the metal material, so it serves as a stopper to determine the final process position and converts the change in physical force into a current value when pressure is applied. Feedback is provided to the voice coil motor 23 through the available characteristics.

Additionally, the brush detection device of the semiconductor wafer cleaning equipment includes a controller 29 as a means of controlling the position and pressure of the brush 13.

The controller 29 controls the brush pressing pressure by controlling the current of the voice coil motor 23, and also controls the pressure control current of the voice coil motor 23 based on the load provided by the load cell 28. After correcting, it is possible to control the brush pressing pressure based on this.

Figure 5 is a schematic diagram showing the brush force control configuration in the brush sensing device of the semiconductor wafer cleaning equipment according to an embodiment of the present invention.

As shown in Figure 5, herein is shown a hardware and program system for automatically adjusting the pressing pressure with which the PVA brush contacts the wafer substrate when cleaning the wafer substrate.

That is, it shows a brush force control configuration that controls the pressing pressure of the brush 13 and corrects the pressing pressure of the brush 13 based on the cleaning process recipe data.

The hardware and program include a higher-level control device and control program as driving elements, a voice coil motor 23 and a voice coil motor driver 33 for motion for pressing pressure control, and a brush rotation motor (BLDC servo motor; 25) and a brush rotation motor driver 34, and a load cell for feedback control (Max 200g; 28).

In addition, the pressing pressure range is 10~80g (set in 1g increments), the self-rotation speed is 100~300rpm, the pressing pressure repeatability is ±3g, the pressing pressure control distance is 3mm (soft landing 2mm), and the pressing pressure control method is Current output control by process recipe (standard value and correction value designation setting), automatic current output control and compensation program control by load cell feedback method (control range designation setting), and alarm are set to monitor the output status for the set pressure.

Therefore, the signal from the rotation motor driver 34, which controls the operation of the brush rotation motor 25, is input to the controller 29, and the voice coil motor driver 33, which controls the operation of the voice coil motor 23, is input to the controller 29. The signal is also input to the controller 29, and the brush pressing pressure (load) detected by the load cell 28 is input to the voice coil driver 33 through the load cell converter 35 and then the voice coil motor driver ( The signal of 33) is also input to the controller 29.

The controller 29 that receives these signals controls the operation of the brush rotation motor 25 and the voice coil motor 23, while operating the voice coil motor 23 based on preset pressing pressure data. Through control, the brush pressure is controlled and the brush pressure is corrected.

Here, basic data for brush pressing pressure is set in the controller 29, for example, standard pressing pressure data (converting current value to grams) is set, and pressing pressure correction (difference between set value and actual value) is set. Calibration) data is set, basic constant data is set when the device is started, and cleaning process recipe data is set.

This controller 29 provides the optimal brush pressing pressure (e.g., the optimal brush pressing pressure combining the preset brush pressing pressure and the corrected brush pressing pressure obtained from the load cell) when cleaning the wafer substrate, while using the voice coil motor 23. Control for an efficient cleaning process is performed.

For example, the controller 29 may perform brush pressing pressure control through motor current control of the voice coil motor 23, and convert the control current of the voice coil motor 23 into units of weight (g). Control using reference data can be performed using this method.

In addition, the controller 29 can perform control to automatically correct the pressure control current of the voice coil motor 23 through the load cell 28 with a stopper function, and the brush 13 with the pressure controlled. Control can be performed to soft land the brush at a specific distance and speed so that it contacts the wafer substrate, while control can be performed to measure and correct the pressure at a specified specific location, and the brush command pressure can be set to 10 to 80 g in 1 g increments. You can control settings up to .

Figure 6 is a schematic diagram showing a brush cleaning process in the brush pressure control method of semiconductor wafer cleaning equipment according to an embodiment of the present invention.

As shown in Figure 6, here, the first position (Initial) represents the origin standby position of the brush 13, the second position (Near edge) represents the end position of the wafer substrate, and the third position (Center) represents the origin standby position of the brush 13. It indicates the position of the center point of the wafer substrate, and position 4 (Measurement) indicates the position where the pressure of the brush 13 is corrected for the difference between the set value and the actual measured value using a jig and electronic scale in the calibration program mode.

First, as a preparation step, the brush 13 is made to stand at the origin position outside the wafer.

In this standby position, the brush 13 can be controlled to a preset pressing pressure value.

That is, the brush 13 is raised by a process from the standby position, and when the raising operation is completed, the brush 13 can be controlled to a preset pressure value.

At this time, the brush 13 can stand by in a rotating state.

Next, as a first step, positioning the brush 13 at the center of the wafer substrate 100 is performed.

That is, the brush 13 is moved to a raised point at the center of the wafer substrate 100 in a rotation-stop state.

At this time, the brush 13 can be moved to the center position of the wafer substrate by driving the rotation motor of the brush arm module.

Next, as a second step, the brush 13 is first lowered to the center of the wafer with the start of the brush rotation and brush preset pressing pressure, and continues to be soft-landed at a relatively slow speed compared to the first lowering speed to brush the brush on the wafer surface. Carry out the step of contacting.

That is, the brush 13 is first vertically moved down to the soft landing starting point at a speed of about 27.26 m/s and a distance (height) of about 3 mm through the voice coil motor, and continues at about 1.75 m/s. Soft landing at a speed of 1.5 inches and a distance (height) of approximately 2 mm.

At this time, during the downward movement, brush rotation and pressing pressure output operations are initiated.

Subsequently, the brush 13 is brought into soft landing contact with the wafer substrate 100 through the voice coil motor (program set position and set speed).

At this time, the brush 13 first lowers with the pressure controlled and then performs a second soft landing so that the wafer and the brush come into contact.

In other words, once the brush 13 completes its rise to proceed with the process in the standby state, it is then controlled through feedback using the constant pressure measurement of the load cell, and the preset pressing pressure of the brush 13 at this time is determined by the process recipe. It can be controlled using current control of the voice coil motor to match the pressure specified in .

At this time, after converting the control current of the voice coil motor into units of weight (g), the brush pressing pressure can be set and controlled (for example, set to 10 to 80 g in 1 g units) using reference data.

The reason for soft landing of the brush 13 after the first downward movement is to lower the brush 13 at a high speed to minimize the process time, and then lower the speed just before it touches the wafer substrate 100 so that the wafer substrate 100 This is to minimize the impact of contact with the brush bristles.

At this time, the soft landing height starts about 2 mm in front of the wafer substrate 100.

Next, as a third step, a step of cleaning the wafer substrate 100 while moving the brush 13 from the center of the wafer substrate to the end at a preset speed while the brush 13 is in contact with the wafer substrate 100. Conduct.

At this time, the brush 13 can move at a preset speed according to the program recipe.

At this time, the brush 13 can be moved to the end position of the wafer substrate by driving the rotation motor of the brush arm module.

Next, as a fourth step, the step of raising the brush 13 using a voice coil motor from the end position of the wafer substrate and positioning it at a starting point set right above the end of the wafer substrate is performed.

Next, as a completion step, steps 1 to 4 are repeated several times according to the number of program recipe settings, and then upon completion of the cleaning operation, the brush 13 is held at the origin outside the wafer with the pressing pressure released and the rotation stopped. Carry out the steps as instructed.

In a preferred embodiment, this brush cleaning process may include setting up brush pressure.

For example, the setup step is a process of setting up the pressing pressure base by attaching a weight and using a scale to set up the brush pressing pressure. After removing the basic spin rotation chuck and replacing the pressure measuring jig, the equipment This process consists of comparing the brush pressure to be used during the process using a scale, entering the value, correcting the fine value, and storing it.

In this cleaning process, the brush spin process recipe steps are as follows.

Step 1: As the brush 13 rotates at about 1,000 rpm, DI water rinse is discharged from the two water rinse nozzles 16, and the brush 13 is moved to the center position of the wafer substrate.

From this point on, if the pressure set on the brush exceeds the feedback control range before the brush comes to the standby position, an alarm is issued and all operations in the chamber are brought to an emergency stop.

Step 2: The brush (13) discharges DI water rinse from only one water rinse nozzle (16) at about 1,000 rpm, and the brush (13) is lowered to the soft landing 3 mm position by starting and pressing pressure control operation.

Continuously, it descends to a 2mm soft landing and touches the wafer substrate, then moves to scan at a set speed to the end position of the wafer substrate, and then the same operation is repeated as many times as the number of scans (time) set in the program recipe.

Step 3: As soon as the brush 13 rotates at about 1,000 rpm, DI water rinse is discharged from the two water rinse nozzles 16, and the brush 13 is moved to the standby position.

Step 4: The wafer substrate is rotated at about 2,500 rpm and the DI water rinse is dried.

Step 5: Rotation of the wafer substrate ends and the process is completed.

As such, the present invention uses a combination of a load cell and a moving coil during the wafer substrate cleaning process to control the overall brush operation, such as the pressing pressure of the brush, the position of the brush, and the correction of the pressing pressure of the brush, and the technology to control the impact of contact with the wafer substrate. By providing a new brush detection device and pressure control method that applies soft landing technology to minimize It can protect against the risk of damage and ensure excellent cleaning quality for the wafer substrate.

The present invention relates to a brush sensing device and pressure control method for semiconductor wafer cleaning equipment. Since it is used in the semiconductor process, which is a core process in the electronics industry, it can be used in the semiconductor manufacturing industry, electronic device manufacturing industry, AI industry, etc.

Claims

A preparation step of waiting the brush at the origin position outside the wafer;

A first step of positioning the brush at the center of the wafer;

A second step of first lowering the brush to the center of the wafer with the start of the brush rotation and brush preset pressing pressure, and then continuing to soft land at a relatively slow speed compared to the first lowering speed to bring the brush into contact with the wafer surface;

A third step of cleaning the wafer while moving the brush from the center of the wafer to the end at a preset speed while the brush is in contact with the wafer;

A fourth step of raising the brush and positioning it at the starting point of the end of the wafer;

After repeating the first to fourth steps several times, a completion step of releasing the pressing pressure and stopping the rotation of the brush and leaving the brush at the origin position outside the wafer;

A brush pressure control method for semiconductor wafer cleaning equipment, comprising:
In claim 1,

A brush pressure control method for semiconductor wafer cleaning equipment, characterized in that from the first step, all processes of the brush are driven when the preset pressing pressure is normal through feedback using the load cell pressure measurement of the brush.
In claim 1,

A brush pressure control method for semiconductor wafer cleaning equipment, characterized in that in the second step, the preset pressing pressure of the brush is controlled using current control of the voice coil motor.
In claim 3,

In the second step, the control current of the voice coil motor is converted into weight (g) units, and then the brush pressing pressure is set and controlled using reference data, and can be set and controlled from 10 to 80 g in 1 g units. Brush pressure control method for semiconductor wafer cleaning equipment.
In claim 1,

As a pressure setup step, it is a process of setting up the basis of the pressing pressure by attaching a weight and using a scale to set up the brush pressing pressure. After removing the basic spin rotation chuck and replacing the pressure measuring jig, the process is carried out in the equipment. A brush pressure control method for semiconductor wafer cleaning equipment, further comprising a process of comparing the brush pressure to be used using a scale, inputting the value, correcting the fine value, and storing it.
A base plate 10, a spin up-down cup 11 and a spin rotation chuck 12 installed on the upper surface of the base plate 10 to fix the wafer substrate and simultaneously lift and rotate the wafer substrate, A brush motor module 14 and a brush arm 15 installed on the upper surface of the base plate 10 to clean the wafer substrate using a brush 13; In the brush detection device of semiconductor wafer cleaning equipment,

The brush motor module 14 is,

A means for cleaning a wafer substrate using a brush 13 that rotates and moves up and down, including a module housing 22 and a voice installed on one side of the inside of the module housing 22 to control the pressing pressure of the brush 13. coil motor (23);

A moving block 24 that moves up and down in connection with the coil side of the voice coil motor 23, and a brush rotation motor 25 that is installed in a structure supported on the moving block 24 and provides power for rotating the brush. );

A brush (13) mounted on the lower end of the shaft (26) of the brush rotation motor (25) and located below the bottom of the module housing (22);

A load cell (28) installed on one inner side of the module housing (13) to detect the brush load while contacting a sensor dog (27) that is raised and lowered together with the moving block (24). Semiconductor wafer cleaning equipment comprising a. Brush detection device.
In claim 6,

At least one DI water rinse nozzle (16) installed on the upper surface of the base plate (10) to supply cleaning water to the wafer substrate; and

A brush detection device for semiconductor wafer cleaning equipment, further comprising a brush clean port (17) installed on the upper surface of the base plate (10) to clean the brush.
In claim 7,

A semiconductor device further comprising a double-fluid cleaning nozzle 18 and a nozzle arm 19 installed on the upper surface of the base plate 10 to uniformly and finely spray cleaning water to additionally clean the wafer substrate. Brush detection device for wafer cleaning equipment.
In claim 6,

A semiconductor wafer cleaning method further comprising a wafer tilt detector sensor 20 and a wafer detector sensor 21 installed on the upper surface of the base plate 10 to detect poor seating of the wafer substrate and the presence or absence of the wafer substrate. Brush detection device of the equipment.
In claim 6 or claim 9,

It further includes a controller 29 as a means for controlling the position and pressure of the brush 13, and the controller 29 controls the brush pressing pressure by controlling the current of the voice coil motor 23. A brush detection device for semiconductor wafer cleaning equipment, characterized in that it corrects the pressure control current of the voice coil motor (23) based on the load provided from the load cell (28).