WO2021242015A1

WO2021242015A1 - Substrate processing system and method for inspecting substrate processing system

Info

Publication number: WO2021242015A1
Application number: PCT/KR2021/006567
Authority: WO
Inventors: 정진안; 김종철; 변영섭; 정구현; 황철주
Original assignee: 주성엔지니어링(주)
Priority date: 2020-05-29
Filing date: 2021-05-26
Publication date: 2021-12-02
Also published as: TW202205510A; KR20210147677A

Abstract

A substrate processing system according to an embodiment of the present invention comprises: a transfer chamber having an inner space; a transfer device having a support unit provided in the transfer chamber so that the substrate can be supported and moved; and a first inspection device which has a first detection unit provided in the transfer chamber and/or the transfer device, and which uses data acquired by the first detection unit to determine whether the support unit has moved to a preset first position, and thus determines the operating state of the transfer device. Therefore, the problem in which a substrate is loaded on a loading stand in a wrong or abnormal state during substrate processing can be reduced so that the substrate can be loaded at the right position of the loading stand during actual processing. Thus, a defect caused by the loading position of a substrate can be reduced and substrate processing quality can be improved.

Description

Substrate processing system and inspection method of substrate processing system

The present invention relates to a substrate processing system and an inspection method of the substrate processing system, and more particularly, to a substrate processing system capable of confirming the state of the substrate processing system prior to a substrate processing process and a substrate processing system inspection method.

A semiconductor manufacturing apparatus transfers a substrate loaded into a transfer chamber to a process chamber that performs different substrate processing processes, and the process chamber performs processes such as depositing or etching a thin film on the substrate. In this case, a transfer device including a robot arm for supporting the substrate is provided in the transfer chamber, and the transfer device transfers the substrate into the process chamber.

In processing a substrate in a process chamber, it is necessary to place the substrate in place on a susceptor positioned within the process chamber. The position of the substrate on the susceptor may be determined by at least one of an operation of the transfer apparatus and a state in which the process chamber is coupled to the transfer chamber. That is, the substrate may or may not be seated in the correct position on the susceptor by at least one of an operation of the transfer apparatus and a state in which the process chamber is coupled to the transfer chamber. In addition, when the substrate is not seated in a proper position on the susceptor, a problem may occur in a substrate processing process in the process chamber, and a defective semiconductor device may be produced.

Therefore, before performing the actual substrate processing process, it is necessary to check the operation of the transfer apparatus and the connection state of the process chamber in advance. And, when the operation of the transport device and the connection state of the process chamber are found to be abnormal or defective, it is necessary to repair or adjust them.

(Prior art literature)

(Patent Document 1) Korean Patent Application Laid-Open No. 10-2008-0004118

The present invention provides a substrate processing system capable of inspecting whether an operation of a transfer apparatus for transferring a substrate is abnormal and a method of inspecting the substrate processing system.

The present invention provides a substrate processing system capable of inspecting the state of a process chamber for processing a substrate, and a load lock chamber that provides a substrate to a transfer chamber, and a method for inspecting the substrate processing system.

A substrate processing system according to an embodiment of the present invention includes a transfer chamber having an internal space; a transfer device having a support installed in the transfer chamber to support and move the substrate; A first detection unit installed in at least one of the transfer chamber and the transfer device is provided, and it is determined whether the support unit has moved to a preset first position using the data obtained from the first detection unit, and a first inspection device for determining an operating state.

The first detection unit monitors the position of the support, and the first inspection device compares the position of the support monitored by the first detection unit with the first position to determine the operation state of the transfer device. includes a judging unit.

The first detection unit is installed in at least one of the support unit and the transfer chamber to detect a separation distance between the support unit and the inner wall of the transfer chamber, and the first inspection device includes a distance detected by the first detection unit and a preset distance. Comparing the distance, it includes a first determination unit for determining the operating state of the transfer device.

a load lock chamber connectable to the transfer chamber; and a second inspection device configured to monitor the support moved into the load lock chamber to determine a state in which the load lock chamber is installed in the transfer chamber.

The second inspection device may include: a second detection unit configured to monitor a position of the support unit moved into the load lock chamber; and a second determination unit configured to determine a connection state between the load lock chamber and the transfer chamber by comparing the position of the support unit monitored by the second detection unit with a preset second position.

a process chamber connectable to the transfer chamber; a mount installed in the process chamber; and a third inspection device configured to monitor at least one of the support part and the mounting table moved into the process chamber to determine at least one of a state in which the process chamber is connected to the transfer chamber and an installation state of the mounting table.

The third inspection apparatus may include: a third detection unit configured to monitor a position of the support part moved into the process chamber and a position of the seating base; and comparing the position of the support part monitored by the third detector with a preset third position to determine a state in which the process chamber is connected to the transfer chamber, or to use the data monitored by the third detector to determine the position of the seat and a third determination unit for determining the installation state of the seating table by determining whether the seat is horizontal.

A method of inspecting a substrate processing system according to an embodiment of the present invention includes the steps of: moving the support part of a transfer apparatus according to a driving command value for moving the support part to a preset first position in a transfer chamber; detecting a position of the support part by a first detection part; and determining the operating state of the transfer device by comparing the preset value to which the first position is reflected and the value detected by the first detection unit.

moving the support part according to a driving command value for moving the support part to a preset second position in a load lock chamber connected to the transfer chamber; A process of detecting the position of the support part moved into the load lock chamber by a second detector; comparing the preset value reflecting the second position with the value detected by the second detector to determine the connection state of the load lock chamber the process of judging;

moving the support part in response to a driving command value for moving the support part to a preset third position in a process chamber connected to the transfer chamber; detecting a position of the support part moved into the process chamber by a third detector; and determining the connection state of the process chamber by comparing the preset value to which the third position is reflected with the value detected by the third detector.

supporting a substrate on the support; moving the support part to a preset fourth position in a process chamber connected to the transfer chamber; placing the substrate supported on the support unit on a mounting table installed inside the process chamber; detecting the position of the substrate on the mounting table by a third detection unit; determining a connection state of the process chamber by comparing a preset position with the position of the substrate detected by the third detector; includes

According to the embodiments of the present invention, before performing the substrate processing process, it is possible to check whether the operation of the transfer device for transferring the substrate is abnormal. In addition, it is possible to automatically check whether there is an abnormality in a state in which the process chamber for processing the substrate is connected to the transfer chamber, a state in which a seat is installed in the process chamber, and a state in which the load lock chamber is connected to the transfer chamber. Accordingly, when it is confirmed that there is an abnormality in these devices, inspection, repair or adjustment of the device in which the abnormality is confirmed may be performed.

Therefore, it is possible to reduce the problem of seating the substrate on the mounting table in an abnormal or abnormal state, thereby allowing the substrate to be seated at the correct position of the mounting table during the actual process. Accordingly, it is possible to reduce the occurrence of defects according to the seating position of the substrate, and improve the substrate processing quality.

1 and 2 are top views of a substrate processing system according to an embodiment of the present invention.

3 and 4 are views exemplarily illustrating a state in which a substrate is seated on a mounting base.

5 is a top view illustrating a state in which the support part is moved forward according to an embodiment of the present invention in order to inspect the operation of the transport device.

6 is a front view illustrating a standby state before the support part is moved forward according to an embodiment of the present invention.

7 and 8 are front views illustrating a state in which a support part according to an embodiment of the present invention is moved forward from the transfer chamber toward the process chamber in order to inspect the operation of the transfer apparatus.

9 is a conceptual diagram exemplarily illustrating positions of a reference region and a mark on an image image acquired through a first detection unit according to an embodiment of the present invention.

10 to 12 are front views illustrating a state in which the support part is moved forward in the transfer chamber in order to inspect the operation of the transfer apparatus using the first inspection apparatus according to a modified example of the embodiment.

13 is a conceptual diagram illustrating a horizontal position in which a process chamber is coupled to a transfer chamber.

14 is a conceptual diagram for explaining a case in which the support is installed horizontally (solid line) and inclined (dotted line) when the support is installed in the process chamber.

15 is a diagram conceptually illustrating a state in which light is irradiated into the process chamber by using the third detector to determine the connection state of the process chamber using the third inspection apparatus according to an embodiment of the present invention.

16 is a top view illustrating a state in which a substrate is seated on a mounting table to determine a connection state of a process chamber using the third inspection apparatus according to an embodiment of the present invention.

17 is a flowchart illustrating a process of inspecting a substrate processing system according to an embodiment of the present invention before a substrate processing process.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and the scope of the invention to those of ordinary skill in the art will be completely It is provided to inform you. The drawings may be exaggerated to explain the embodiments of the present invention, and like reference numerals in the drawings refer to like elements.

1 and 2 are top views of a substrate processing system according to an embodiment of the present invention. 3 and 4 are views exemplarily illustrating a state in which a substrate is seated on a mounting base. Here, FIG. 3 shows a state in which the center of the width direction of the substrate and the center in the width direction of the mounting base coincide with each other, and FIG. 4 shows a state in which they do not coincide.

1 to 4 , a substrate processing system according to an embodiment of the present invention includes a transfer chamber 1000 having an internal space in which a substrate 10 can be accommodated, and is fastened to the transfer chamber 1000 , and moves into the A support part for transferring the substrate 10 into the process chamber 6000 performing a predetermined process on the transferred substrate 10 , the transfer chamber 1000 , or transferring the substrate 10 to the outside of the transfer chamber 1000 . It includes a transport device 2000 having a 2100 , and an inspection device (hereinafter, referred to as a first inspection device 3000 ) that inspects the operating state of the transport device 2000 .

In addition, the substrate processing system includes a load lock chamber 4000 and a load lock chamber that are connectable to the transfer chamber 1000 and temporarily accommodate or store the substrate 10 to be transferred to the transfer chamber 1000 . An inspection device (hereinafter, referred to as a second inspection device 5000 ) that inspects a state connected to the transfer chamber 1000 , a state in which the process chamber 6000 is connected to the transfer chamber 1000 , and a seat installed inside the process chamber 6000 . and an inspection device (hereinafter, referred to as a third inspection device 7000 ) that inspects at least one of the installation states of the 6110 .

In addition, the substrate processing system includes a transfer driver 2000a that provides a transfer driving force to the transfer apparatus 2000 , a controller 2000b that controls the operation of the transfer driver 2000a , a process chamber 6000 and a transfer chamber 1000 . It may include a gate valve 8000 installed between and between the load lock chamber 4000 and the transfer chamber 1000 .

The substrate 10 to be processed in the substrate processing system according to the embodiment may be a circular wafer. Of course, the substrate 10 is not limited to the above-described wafer, and various means such as glass, polymer film, plastic, etc. may be applied. Also, the shape of the substrate 10 is not limited to a circular shape, and various polygonal shapes other than a circular shape may be applied.

The transfer chamber 1000 has a cylindrical shape having an internal space, and may be disposed to connect the process chamber 6000 and the load lock chamber 4000 . The transfer chamber 1000 may be provided in various shapes having an internal space in which the transfer apparatus 2000 can be installed and the transfer apparatus 2000 can be operated.

The load lock chamber 4000 has an internal space, and can be connected to the transfer chamber 1000 , that is, fastened and separated. In addition, the substrate 10 is temporarily seated or loaded in the load lock chamber 4000 , and an elevating cassette 4100 may be installed. In addition, a viewport 4200 through which the inside of the load lock chamber 4000 can be visually confirmed may be provided at an upper portion of the load lock chamber 4000 .

A plurality of process chambers 6000 may be provided, and the plurality of process chambers 6000 are connected to the transfer chamber 1000 , ie, coupled to and separated from each other. When the plurality of process chambers 6000 and the load lock chamber 4000 are coupled to the transfer chamber 1000 , for example, as shown in FIGS. 1 and 2 , the plurality of process chambers 6000 and the load lock chamber 4000 . ) may be fastened to be radially disposed around the transfer chamber 1000 . Of course, the shape in which the plurality of process chambers 6000 and the load lock chamber 4000 are coupled to the transfer chamber 1000 is not limited to the aforementioned radial shape and may be variously changed.

The plurality of process chambers 6000 may be provided to perform different substrate processing processes therein.

Inside the process chamber 6000, the substrate receiving unit 6100 having a mounting unit 6110 on which the substrate 10 is mounted, and the mounting unit 6110 are disposed to face the substrate, and source gas for substrate processing is sprayed. A gas injection unit (not shown) may be installed.

The raw material injected from the gas injection unit may be a raw material for depositing a thin film on the substrate 10 or a raw material for etching the substrate 10 or the thin film.

The process chamber 6000 may be provided with a viewport 6200 through which the inside of the process chamber 6000 can be visually confirmed, and the viewport 6200 is preferably provided at a position facing the mounting table 6110 . . In addition, the substrate receiving unit 6100 and the gas injection unit are disposed to face each other inside the process chamber 6000 . For example, the substrate receiving unit 6100 is located in the lower part of the process chamber 6000 , and the substrate receiving unit 6100 is disposed. ) may be disposed so that the gas injection unit is located on the upper side.

As shown in FIGS. 3 and 4, the substrate receiving unit 6100 has a mounting base 6110 on which the substrate 10 is mounted and one end protruding upward of the mounting base 6110, or the mounting base ( It includes a lift pin 6120 capable of elevating so as to be located on the inside of the 6110.

The mount 6110 is a means on which the substrate 10 for processing is seated or supported. The mounting base 6110 may have a plate shape having a larger area than that of the substrate 10 . In addition, a groove (hereinafter, a seating groove) or a pocket for stably supporting the substrate 10 may be provided in the seating table 6110 . That is, the seating table 6110 is provided with a groove in the shape of a depression in the opposite side to the gas injection part from the surface (hereinafter, referred to as one surface 62) facing the gas injection part, and this groove is a seating in which the substrate is accommodated or seated. it is home

When the substrate 10 is seated in the seating groove, the seating position of the substrate 10 on the seating groove or the seating surface 62b is an operation of the transfer device 2000 for transferring the substrate 10 to the process chamber 6000 . It may vary depending on a state, a state in which the process chamber 6000 is connected to the transfer chamber 1000 , and a state in which the mounting base 6110 is installed in the process chamber 6000 . More specifically, it may vary depending on whether the operation of the transfer device 2000 is abnormal, a position where the process chamber 6000 is coupled to the transfer chamber 1000 , and whether the seat 6110 is horizontal.

For example, when the substrate 10 is seated in the seating groove, the width direction center 12 of the substrate 10 is positioned at the width direction center _{CH of the seating surface 62b as shown in FIG. 3 (a).} can be seated In this case, the separation distance (or gap) between the side surface 11 of the substrate 10 and the inner surface 62c of the seat 6110 in the circumferential direction of the substrate 10 may be uniform as in (b) of 3 . As another example, when the width direction center 12 of the substrate 10 is seated _{so as to deviate from the width direction center (CH} ) of the seating surface 62b as shown in FIG. 4 (a), FIG. 4 (b) and Similarly, the separation distance (or gap) between the side surface 11 of the substrate 10 and the inner surface 62c of the seat 6110 in the circumferential direction of the substrate 10 may be non-uniform.

As described above, the different positions of the substrate 10 on the mounting table 6110 include whether the operation of the transfer device 2000 is abnormal, the position at which the process chamber 6000 is coupled to the transfer chamber 1000 and the seating position. It varies depending on whether the stand 6110 is horizontal or not, and a description of the substrate seating position will be described later.

The transfer device 2000 is a device that supports the substrate 10 and moves it to a desired position. For example, the transfer apparatus 2000 transfers the substrate 10 inside the load lock chamber 4000 to the transfer chamber 1000 , and transfers the substrate 10 transferred to the transfer chamber 1000 into the process chamber 6000 . transport

The transfer device 2000 is installed to connect the support 2100 on which the substrate 10 is supported and the support 2100 and the transfer driver 2000a, and horizontally move and rotate according to the operation of the transfer driver 2000a. and an arm 2200 that is movable.

The arm 2200 is connected between the support part 2100 and the transfer driving part 2000a. That is, the arm 2200 has one end connected to the transport driving unit 2000a and the other end connected to the support unit 2100 . The arm 2200 is horizontally moved and rotated according to the operation of the transport driver 2000a. In addition, the arm 2200 may be raised and lowered according to the operation of the transfer driving unit 2000a.

Hereinafter, a horizontal movement operation in which the support 2100 connected to the arm 2200 moves closer to the process chamber 6000 or the load lock chamber 4000 , or moves toward the process chamber 6000 or the load lock chamber 4000 . is defined as a forward movement. In addition, on the contrary, the support 2100 connected to the arm 2200 moves away from the process chamber 6000 or the load lock chamber 4000 , or horizontally moves in the opposite direction to the process chamber 6000 or the load lock chamber 4000 . A movement motion is defined as a backward movement.

The transfer driving unit 2000a is a means for driving or operating the arm 2200 so that the support unit 2100 moves forward and backward and rotationally. The transport driving unit 2000a may include a horizontal driving unit for moving the transport device 2000 forward and backward and a rotation driving unit for rotating the transport device 2000 . In addition, the transport driving unit may include an elevating driving unit for adjusting the height of the transport device 2000 .

The controller 2000b may operate the transport driving unit 2000a according to a driving command value so that the transport device 2000 is horizontally moved, rotated, or moved up and down. That is, the control unit 2000b sets or stores a driving command value for horizontally moving, rotationally moving, or elevating and lowering the transfer device 2000 so that the support unit 2100 is positioned at a desired position. The driving command value may be a value set in advance in the installation stage of the transfer device 2000, and may be a value in which design dimensions, design tolerance, and the like are reflected. And the transfer device can be operated by these drive command values.

Meanwhile, when the substrate 10 transferred into the process chamber 6000 through the transfer device 2000 is seated on the mounting table 6110 , it is necessary to ensure that the position of the substrate 10 becomes the correct position. Here, the position of the substrate 10 may be a position based on the mounting base 6110 or the mounting surface 62b. In addition, the position of the substrate 10 is a position of the substrate 10 at which defects do not occur during processing of the substrate 10 or can be manufactured with a desired quality, and is a position determined or set during manufacturing of the substrate processing system. can be

The original position of the substrate 10 is, for example, the width direction center 12 of the substrate 10 as shown in FIGS. 3 (a) and (b) is the width direction center of the seating surface 62b ( _CH ) It may be a position that coincides with or overlaps with. That is, the original position of the substrate 10 is not biased to either side on the seating surface 62b of the substrate 10 as shown in FIGS. 4 (a) and (b), and in FIGS. ), the distance between the side surface 11 of the substrate 10 and the inner surface 62c of the mounting base 6110 in the circumferential direction of the substrate 10 may be uniformly disposed.

Of course, the position of the substrate 10 is not limited to the example in which _{the width direction center of the substrate 10 coincides with the width direction center CH of the seating surface 62b, as described above, and defects occur during substrate processing.} It may not occur or may be altered to various locations intended to produce the desired quality.

The position of the substrate 10 on the seat 6110 or the seat surface 62b is determined whether the operation of the transfer device 2000 for transferring the substrate 10 is abnormal, and the process chamber 6000 is connected to the transfer chamber 1000 . It may vary depending on the fastened position and whether the seat is horizontal.

Whether the operation of the transfer device 2000 is abnormal may mean a state in which the support unit 2100 is actually moved according to the operation of the transfer driver 2000a. Here, the state in which the support part 2100 is actually moved may be whether the support part 2100 in which the horizontal movement has been completed is located at a preset target position (hereinafter, referred to as a first position). And, in determining whether the operation of the transfer device 2000 is abnormal, if the support part 2100, where the horizontal movement is finished, is located in the first position, the operation of the transfer apparatus 2000 is normal, otherwise it is determined as abnormal.

In determining whether the support part 2100 is located at the first position, it may be determined using a distance actually horizontally moved (hereinafter, referred to as an actual movement distance) of the support part 2100 . More specifically, when the transfer driving unit 2000a is operated by a preset driving command value (hereinafter, referred to as the first driving command value) according to the first position or the desired horizontal movement distance (hereinafter, the first movement distance), Accordingly, the arm 2200 is operated to horizontally move the support part 2100 . Here, the first movement distance may be determined according to the first location. In addition, the operation of the transfer device 2000 may be determined to be normal or abnormal depending on whether the support unit 2100 is moved to the first movement distance. This is because if the actual movement distance of the support part 2100 is the first movement distance, the support part 2100 has reached the first position, otherwise it is not located in the first position.

The first moving distance may be set as a range. That is, the first movement distance may be a range value greater than or equal to the lower limit and less than or equal to the upper limit. Reflecting this and explaining again, when the actual horizontal movement distance of the support unit 2100 , that is, the actual movement distance is included in the first movement distance, the operation of the transfer device 2000 may be considered normal. However, when the actual movement distance of the support unit 2100 is not included in the first movement distance, the operation of the transfer device 2000 may be regarded as abnormal. Here, the fact that the actual movement distance of the support unit 2100 is not included in the first movement distance may be less than the lowest limit of the first movement distance or exceeding the upper limit of the first movement distance.

And, when the substrate 10 loaded into the transfer chamber 1000 is transferred into the process chamber 6000 through the transfer device 2000 and seated on the mount 6110, the operation of the transfer device 2000 is normal and , when the connection state of the process chamber 6000 is normal, the substrate 10 may be seated in the proper position of the mounting base 6110 . That is, for example, as shown in FIG. 3 , the center 12 in the width direction of the substrate 10 may be seated to coincide with the _{center C H in the width direction of the seating surface 62b.} However, when the operation of the transfer device 2000 is abnormal, the substrate 10 may not be seated in the proper position of the mounting base 6110 . That is, for example, as shown in FIG. 4 , the center 12 in the width direction of the substrate 10 _{does not coincide with the center in the width direction of the mounting base 6110 (CH} ), and may be seated so as to deviate.

The normal or abnormal operation of the transfer device 2000 is an assembly state between the support part 2100 and the arm 2200 and an assembly state between the plurality of

link members

2210a and 2210b constituting the arm 2200. It may be by at least one. That is, according to at least one of the assembly state between the support part 2100 and the arm 2200 and the assembly state between the plurality of

link members

2210a and 2210b constituting the arm 2200, by the operation of the transfer driving unit 2000a The actual horizontal movement distance of the support unit 2100, that is, the forward or backward movement distance varies. In other words, according to at least one of the assembly state between the support part 2100 and the arm 2200 and the assembly state between the plurality of

link members

2210a and 2210b constituting the arm 2200, the transfer driving unit 2000a By the operation, the support 2100 may be horizontally moved by the first movement distance, moved less than the first movement distance, or moved to exceed the first movement distance.

Hereinafter, for convenience of explanation, the assembly state between the support part 2100 and the arm 2200 and the assembly state between the plurality of

link members

2210a and 2210b constituting the arm 2200 are referred to as 'assembly state of the transfer device'. It will be described collectively.

The position of the substrate 10 on the seating table 6110 or the seating surface 62b may vary depending on the assembly state of the transfer device 2000 as well as the connection state of the process chamber 6000 . In other words. During fabrication or setting of the substrate processing system, the process chamber 6000 is fastened or coupled to the transfer chamber 1000 . In this case, the position of the substrate 10 on the mounting base 6110 may vary according to a position where the process chamber 6000 is coupled to the transfer chamber 1000 . That is, even if the operation of the transfer device 2000 is normal, the substrate 10 may not be positioned on the mounting base 6110 according to the connection state of the process chamber 6000 . This is because the position of the seating base 6110 with respect to the transfer chamber 1000 or the transfer device 2000 is changed according to the coupling state of the process chamber 6000 .

Accordingly, in the embodiment of the present invention, the first inspection apparatus 3000 that monitors the operation state of the transfer apparatus 2000 before the actual substrate processing process, that is, can check or inspect whether there is an abnormal operation in advance, is provided.

Hereinafter, the first inspection apparatus will be described with reference to FIGS. 1, 2, and 5 to 9 .

In this case, when the transfer apparatus 2000 is moved forward to check whether the operation of the transfer apparatus 2000 is abnormal, moving the transfer apparatus 2000 forward in the direction of one of the process chambers 6000 will be described as an example.

5 is a top view illustrating a state in which the support part is moved forward according to an embodiment of the present invention in order to inspect the operation of the transport device. 6 is a front view illustrating a standby state before the support part is moved forward according to an embodiment of the present invention. 7 and 8 are front views illustrating a state in which a support part according to an embodiment of the present invention is moved forward from the transfer chamber toward the process chamber in order to inspect the operation of the transfer apparatus. 9 is a conceptual diagram exemplarily illustrating positions of a reference region and a mark on an image image acquired through a first detection unit according to an embodiment of the present invention.

Here, Figure 7 is a physical movement of the support distance (D _R) of the first movement distance (D _ET) to satisfy the figure, and the actual moving distance of Fig. 8 is the support shown a case in which (D _R) of the first movement distance ( D _ET ) is not satisfied.

1, 2, and 5 to 8 , in the first inspection apparatus 3000 , a mark M formed on the support 2100 and the support 2100 move to the position of the process chamber 6000 . A determination unit (hereinafter, referred to as first and a determination unit 3200). In addition, the first inspection device 3000 includes an alarm unit (hereinafter, the first alarm unit 3300) that generates an alarm when the first determination unit 3200 determines that the operation of the transfer device 2000 is abnormal. can do.

The mark M may be formed, for example, on the back surface of the support 2100 as shown in FIG. 6 . Of course, the formation position of the mark M is not limited to the rear surface of the support part 2100 , and may be formed at any position of the support part 2100 if it can be detected by the first detection part 3100 . In addition, the mark M according to the embodiment has a shape such as a cross (see FIG. 9 ), but is not limited thereto and may be deformed into various shapes such as a circle and a polygon.

The first detection unit 3100 may be a means for imaging the mark M provided on the support unit 2100 . That is, the first detection unit 3100 may be a means including an imaging unit capable of acquiring an image or a video image, and the imaging unit may be a line scanner, a vision camera, or the like.

The first detection unit 3100 may be installed in the transfer chamber 1000 to be located below the support unit 2100 . In addition, the first detection unit 3100 is installed in the transfer chamber 1000 so that the support unit 2100 is located at a position on the path on which the support unit 2100 is moved forward to the position of the process chamber 6000 . That is, the first detector 3100 is installed in the transfer chamber 1000 to be positioned between the process chamber 6000 and the transfer driver 2000a. The first detection unit 3100 may be provided in plurality, and may be located between each process chamber 6000 and the transfer driver 2000a.

In the above description, it has been described that the first detection unit 3100 is installed inside the transfer chamber 1000 , but the present invention is not limited thereto. may be installed in

An installation position of the first detection unit 3100 is determined based on a state in which the support unit 2100 does not move forward in the process chamber 6000 direction (hereinafter, referred to as a standby state) as shown in FIGS. 1 and 6 . More specifically, the installation of the first detector 3100 so that even the center of the mark (M) provided on the support portion 2100 in the stand-by state as shown in 6 (C _M) a predetermined distance from the processing chamber (6000) direction from. Accordingly, when the support part 2100 in the standby state moves forward in the direction of the process chamber 6000 by the predetermined distance, the mark M is located on the upper side of the first detection part 3100 , that is, to face the first detection part 3100 . can be located.

In the embodiment, in order to inspect the operation of the transport device 2000 , the transport device 2000 , that is, the support part 2100 is moved forward in the direction of the first detection part 3100 . Accordingly, the first position may be the position of the first detection unit 3100 , and the target horizontal movement distance to which the support unit 2100 is moved, that is, the first movement distance D _ET , is to the support unit 2100 in the standby state. It may be a separation distance between the provided mark M and the first detection unit 3100 . More specifically, the first movement distance D _ET may be a separation distance between the center _{C M} of the mark M provided on the support unit 2100 in the standby state and the center of the first detection unit 3100 .

When the transfer driving unit 2000a is operated according to the first driving command value, the support unit 2100 moves forward in the process chamber 6000 direction by the operation of the arm 2200 . At this time, when the support part 2100 is moved by the first movement distance D _ET , the mark M may be positioned above the first detection part 3100 , that is, to face the first detection part 3100 . And, the mark M may be located in the first position. As another example, when the support part 2100 _{is moved to be less than or more than the first movement distance D ET} , the mark M may not face the first detection part 3100 . Further, the mark (M) is the center in the width direction of the center (C _M) is the first detection unit 3100 of the first detection unit skater faced with 3100, according to which the support portion 2100, the actual distance traveled, the mark (M) may or may not match or overlap with . In this case, the mark M is not located at the first position.

As described above, according to the actual forward movement distance D _R _{of the support 2100 , the position of the mark M changes, so the mark M F} on the image image F captured by the first detection unit 3100 . location changes. For example, the mark (M _F) on the video image (F) as shown in (a) of Fig. 9 the center (C _MF) is a picture image (F) the center (C _F) with or match or overlap of the, in FIG. 9 ( b) may not be the case. Also, the mark M _F may not exist on the video image F .

The first determination unit 3200 determines whether the operation of the transfer device 2000 is normal or abnormal using the data obtained by the first detection unit 3100 . For example, the first determination unit 3200 determines the operation of the transfer device 2000 as normal or abnormal according to the position of _{the mark M F} on the image image F obtained from the first detection unit 3100 . To this end, the first determination unit 3200 sets the reference area A _S on the image image F transmitted from the first detection unit 3100 . Here, the reference area A _S may be a predetermined area including _{the center C F} on the image F. That is, the reference area _(S A) can be set to have a predetermined area, so that this center coincides with the center (C _F) of the picture image (F). Further, the reference area (A _S) are, when positioned so as to coincide with the center (C _F) of the mark (M _F) the center (C _MF) the reference area (A _S) of I of a predetermined area as described above, , the mark M _F does not deviate out of the reference area A _S , and has an area that can be located inside.

In the embodiment, the reference area ( _AS ) is set or provided in a circular shape, but is not limited thereto, and any shape can be changed as long as the area in which the marks ( _MF _{) can all be accommodated in the reference area (AS).} .

A first determining unit 3200 is the operation of analyzing the picture image (F), the mark (M _F), the reference area (A _S) deviated out depending on whether or not, the transfer device (2000), that is, the support portion 2100 judged to be normal or abnormal. That is, when the first determination unit 3200 without departing out mark (M _F), the reference area (A _S) as shown in (a) of Figure 9, the mark (M _F), the entire analysis to be located in a reference region , it is determined that the operation of the transfer device 2000 is normal. But, on the contrary, it determines the behavior of the mark (M _F), when the whole or part of the analysis to be out of the reference area _(S A), the transfer device (2000) as shown in (b) of Fig. 9 as abnormal.

More preferably, the first determination unit 3200 _{coordinates analysis of the center position of the mark M F} on the image image F, and the center C _MF _{of the mark M F} as shown in FIG. 9 (a). ) When the position coincides with or overlaps the center C _F _{of the reference area A S} , it is determined that the operation of the transfer device 2000 is normal. However, also the center of the mark (M _F) on the video image (F) as shown in 9 (b) (C _MF) the center of the location where the reference area (A _S) (C _F) position and a spaced not match or overlap If it is, it is determined that the operation of the transfer device 2000 is abnormal.

Here, as shown in (a) of Figure 9, the mark (M _F) on the video image (F) are without departing out of the reference area (A _S), the mark (M _F) or the entire position in the reference area (A _S), mark (M _F), the center (C _MF) is positioned that the center (C _F) of the reference area (a _S) and the matching or overlapping, support member 2100 is in the standby state (see FIG. 6) as shown in Figure 7 the This is because it has actually moved forward as much as 1 movement distance (D _{ET ).} That is, this is because the actual forward movement distance D _R of the support 2100 satisfies the first movement distance D _{ET .} In other words, this is because the support 2100 provided with the mark M has been moved to the first position. Therefore, when the center (C _MF) position of the mark (M _F), the reference area (A _S), the center (C _F) and a matching or overlapping of, the support 2100, the actual movement of a first travel distance (D _ET) Thus, it can be explained that the support 2100 or the mark M has reached the first position.

However, when the support 2100 is in a standby state (see FIG. 6 ), the actual forward moving distance D _R does not reach the first moving distance D _ET as shown in FIG. 8 , or the first moving distance D _ET ) is the center (C _MF) position of the case greater than (not shown), the mark (M _F as shown in (b) of FIG. 9) in whole or in part out of the reference area (a _S) or mark (M _F) the center of the reference area (a _S) (C _F) position and does not match or overlap. In other words, when the support 2100 provided with the mark M does not reach the first position or is moved to exceed the first position, the center (C _MF _{) position of the mark M F} is the reference area ( the center of a _S) (C _F) position and does not match or overlap. Accordingly, the center (C _MF) if the location is based on the area center (C _F) position and does not match or overlap of (A _S), the actual moving distance (D _R) of the support portion 2100 of the mark (M _F) the It may be explained that the support 2100 or the mark M does not reach the first position because the 1 movement distance D _{ET is not satisfied.}

In this way, the first determination unit 3200 _{compares and analyzes the position between the reference area A S} and the mark M _F on the image image F, and sets the operation state of the transfer device 2000 as normal or abnormal. judge

The first alarm unit 3300 generates an alarm when the first determination unit 3200 determines that the operation of the transfer device 2000 is abnormal. When an alarm is generated in the first alarm unit 3300 , the operator repairs or repairs the transfer device 200 . That is, the assembly state between the plurality of

link members

2210a and 2210b constituting the arm 2110 or the assembly state between the support part 2100 and the arm 2110 is checked, and repair or repair is performed.

As shown in FIG. 5 , a plurality of first detection units 3100 of the first inspection apparatus 3000 may be provided. That is, the plurality of process chambers 6000 and the load lock chamber 4000 may be installed to face each other.

The first inspection apparatus 3000 according to the above-described embodiment provides a mark M on the support part 2100 , and images the support part 2100 with the first detection part 3100 including an image pickup part, and the transfer apparatus 2000 ) was judged to be normal or abnormal. However, the first inspection apparatus 3000 is not limited to the above-described example, and may determine the operation of the transfer apparatus 2000 as normal or abnormal by various means and methods.

Hereinafter, a first inspection apparatus according to a modified example of the embodiment will be described with reference to FIGS. 10 to 12 .

10 to 12 are front views illustrating a state in which the support part is moved forward in the transfer chamber in order to inspect the operation of the transfer apparatus using the first inspection apparatus according to a modified example of the embodiment. Here, Figure 10 shows a standby state before the support is moved forward. And, FIG. 11 is a view showing a case where the separation distance between the front end of the forward-moved support part and the inner wall of the transfer chamber satisfies a preset distance, and FIG. 12 is a view showing a case that does not.

10 to 12 , the first inspection apparatus 3000 includes a first detection unit 3400 including an optical sensor mounted in the transfer chamber 1000 to emit light and receive the reflected light; The distance detected or measured by the distance detection unit 3500 and the distance detection unit 3500 for measuring or detecting the separation distance between the support 2100 and the inner wall of the transfer chamber 1000 using the signal or data transmitted from the detection unit 3400 and a first determination unit 3200 that compares the distance D _M with a preset separation distance (hereinafter, a preset distance D _S ) to determine whether the operation of the transfer device 2000 is normal or abnormal. In addition, it may include a first alarm unit 3300 that generates an alarm when it is determined that the first determination unit 3200 is abnormal.

The first detection unit 3400 may be a means including a light sensor having a light emitting unit that generates and emits light and a receiving unit that receives the reflected light. The first detection unit 3400 may be mounted on the inner wall of the transfer chamber 2000 .

The distance detection unit 3500 may be, for example, a means for detecting or measuring the separation distance between the support unit 2100 and the inner wall of the transfer chamber 1000 using a time when the light emitted from the first detection unit 3400 is reflected and received again. have.

_{The first determination unit 3200 compares the separation distance (hereinafter, the detection distance (DM} )) between the support unit 2100 and the inner wall of the transfer chamber 1000 detected by the distance detection unit 3500 and a preset distance ( _DS ) Thus, it is determined that the operation of the transfer device 2000 is normal or abnormal.

Here, the preset distance D _S is determined according to the target position to which the support unit 2100 is to be moved, that is, the first position. More specifically, a preset distance Ds may be determined according to a first position that is a target position with respect to the tip of the support 2100 . And, the preset distance D _S may be a range value. That is, the preset distance D _S may be a range value equal to or greater than the lower limit and less than or equal to the upper limit.

_{The preset distance D S} set in the first determination unit 3200 is the support 2100 and the transfer chamber 1000 when the support 2100 is moved to the first movement distance D _{ET for inspection.} It is set as the actual separation distance between the inner walls. That is, it may be set as an actual separation distance between the front end of the first detection unit 3400 and the support unit 2100 .

When the detection distance D _M is included in the preset distance D _S , the first determination unit 3200 determines that the operation of the transfer device 2000 is normal. In this case, it may be determined that the support part 2100 is moved to the first position. Conversely, when the detection distance D _M is not included in the preset distance D _S , the first determination unit 3200 determines that the operation of the transfer device 2000 is abnormal. In this case, it may be determined that the support 2100 has not moved to the first position.

Here, the detected distance (D _M) the group is not included in the predetermined distance (D _S), the detected distance (D _M) the group or the lowermost less than limits of the predetermined distance (D _S), may be to best exceed the limit values .

Hereinafter, a method of determining the operation of the transport device 2000 using the first inspection device 3000 according to a modified example will be described.

First, the transfer driving unit 2000a operates according to the first driving command value. Here, the first driving command value is a value set according to the first position or the first movement distance D _{ET for inspection.} When the transfer driving unit 2000a operates according to the first driving command value, the support unit 2100 moves forward in the process chamber 6000 direction.

When the forward movement of the support unit 2100 is finished, light is emitted through the first detection unit 3400 . Then, the distance detector 3500 receives the optical signal or data from the first detector 3400 , and detects the distance D _M between the support 2100 and the inner wall of the transfer chamber 1000 . The detected separation distance D _M is transmitted to the first determination unit 3200 .

The first determination unit 3200 compares the detection distance D _M with a preset distance D _S , and determines that the operation of the transfer device 2000 is normal or abnormal. In this case, when the detection distance D _M is included in the preset distance D _S , the first determination unit 3200 determines that the operation of the transfer device 2000 is normal. _{This is because the support part 2100 is actually moved forward by the first preset distance D ET} as shown in FIG. 11 in the standby state of FIG. 10 , and the front end of the support part 2100 has reached the first position. Conversely, when the detection distance D _M is not included in the preset distance D _S , the first determination unit 3200 determines that the operation of the transfer device 2000 is abnormal. _{This is because the support 2100 is moved less than or exceeding the first movement distance D ET} as shown in FIG. 12 in the standby state of FIG. 10 (not shown), so that the front end of the support part 2100 is located in the first position because it doesn't

Then, when the first determination unit 3200 determines that the operation of the transfer device 2000 is abnormal, the first alarm unit 3300 generates an alarm. When an alarm is generated, the operator checks the assembly state of the transfer device 2000 and performs repair or repair work.

In the above-described modified example, it has been described that the first detection unit 3400 is installed on the inner wall of the transfer chamber 2000 . However, the present invention is not limited thereto, and the first detection unit 3400 may be installed at the front end of the support unit 2100 .

In the above-described embodiments and modified examples, it has been described that the support part 2100 is moved forward in the direction of the process chamber 6000 to examine the operation of the transfer device 2000 . However, the present invention is not limited thereto, and the operation of the transfer device 2000 may be examined by moving forward in the direction of the load lock chamber 4000 .

When it is determined that the operating state of the transport device 2000 is normal, the load lock chamber 4000 is connected to the transport device 2000 by using the second inspection device 5000 and then inspects the third inspection device 7000 . ) to check the state in which the process chamber 6000 is connected to the transfer device.

First, the second inspection device 5000 will be described.

The second inspection device 5000 determines the connection state of the load lock chamber 4000 .

1 and 2 , the second inspection device 5000 is mounted on an upper portion of the load lock chamber 4000 , and a detection unit capable of detecting the position of the support unit 2100 transferred into the load lock chamber 4000 . (hereinafter, a second detection unit 5100 ) and a second determination unit 5200 that determines the connection state of the load lock chamber 4000 as normal or abnormal using data provided from the second detection unit 5100 . Also, the second test apparatus 5000 may include a second alarm unit 5300 that generates an alarm when the second determination unit 5200 determines that the connection state of the load lock chamber 4000 is abnormal.

The second detection unit 5100 may be installed to be located outside the upper side of the viewport 4200 provided at the upper portion of the load lock chamber 4000 . In addition, the second detection unit 5100 may be horizontally moved in an X-axis direction that is an arrangement direction of the transfer chamber 1000 and the load lock chamber 4000 and a Y-axis direction intersecting the X-axis direction, respectively.

A reference position (hereinafter, referred to as a second position) for determining whether the connection state of the load lock chamber 4000 is normal is set in the second determination unit 5200 . In addition, the control unit 2000b sets or stores a driving command value (hereinafter, referred to as a second driving command value) according to the second position, which is the target position of the support unit 2100 in the load lock chamber 4000 . Further, the transfer driving unit 2000a operates according to the second driving command value, and accordingly, the support unit 2100 moves forward into the load lock chamber 4000 .

In the second position (X _s Y _S , Z _S ), when the operation of the transfer device 2000 is normal and the load lock chamber 4000 is connected to the transfer chamber 1000 in a fixed position, the support unit 2100 is When moved into the load lock chamber 4000 , it may be the X, Y, and Z coordinate values of the tip of the support part 2100 in the load lock chamber 4000 .

The method of inspecting or monitoring the connection state of the load lock chamber 4000 in the second inspection device 5000 is the same as the method of inspecting the connection state of the process chamber 6000 in the third inspection device 7000, which will be described later. do.

Accordingly, a description of a method of inspecting the connection state of the load lock chamber 4000 using the second inspection device 70000 will be omitted herein.

Hereinafter, with reference to FIGS. 13 and 14 , the third inspection apparatus according to the embodiment and a method of inspecting the installation state of the process chamber and the mounting table using the third inspection apparatus will be described.

13 is a conceptual diagram illustrating a horizontal position in which a process chamber is coupled to a transfer chamber. 14 is a conceptual diagram for explaining a case in which the support is installed horizontally (solid line) and inclined (dotted line) when the support is installed in the process chamber.

As described above, the position of the substrate 10 on the mounting table 6110 may vary depending on the position at which the process chamber 6000 is coupled to the transfer chamber 1000 . That is, when the process chamber 6000 is fastened to the transfer chamber 1000 , it may be fastened to the original position (solid line in FIG. 13 ) or deviated from the original position (dashed line in FIG. 13 ).

In addition, when the operation of the transfer device 2000 is normal and the process chamber 6000 is fastened to the original position of the transfer chamber 1000 (solid line in FIG. 13 ), as shown in FIGS. 3 (a) and (b) The substrate 10 may be seated in a fixed position on the seating surface 62b. However, even if the operation of the transfer device 2000 is normal, when the process chamber 6000 is not fastened to the correct position of the transfer chamber 1000 (dashed line in FIG. 13 ), FIGS. 4 (a) and (b) and Similarly, the substrate 10 cannot be seated in the correct position of the seating surface 62b.

In addition, the seat 6110 needs to be disposed in the process chamber 6000 to be horizontal (solid line in FIG. 14 ) with the bottom surface of the process chamber 6000 . When the mounting base 6110 is not arranged horizontally and is inclined (a dotted line in FIG. 14 ), a defect may occur in the substrate processing process.

Accordingly, in the embodiment of the present invention, a connection state inspection apparatus (hereinafter, referred to as a third inspection apparatus) capable of inspecting the connection state of the process chamber 6000 and the installation state of the mounting base 6110 is provided before the actual substrate processing process. .

The third inspection apparatus 7000 according to the embodiment may inspect whether the connection state of the process chamber 6000 is normal, and may inspect whether the mounting base 6110 is installed horizontally.

1, 2, 13 and 14 , the third inspection device 7000 is mounted on the upper portion of the process chamber 6000 , and the support 2100 and the seating table transferred into the process chamber 6000 . The connection state of the process chamber 6000 and the installation state of the mounting base 6110 using the data obtained from the detection unit capable of detecting the position of the 6110 (hereinafter, the third detection unit 7100) and the third detection unit 7100 and a third determination unit 7200 that determines that is normal or abnormal. In addition, the third inspection device 7000 includes a third alarm unit 7300 that generates an alarm when the third determination unit 7200 determines that the installation state of the process chamber 6000 or the seat 6110 is abnormal. may include

The third detector 7100 is installed above the process chamber 6000 , for example, it may be installed above the viewport 6200 . In addition, it is preferable to be installed at a position facing the mounting base 6110 of the third detection unit 7100 .

The third detection unit 7100 may be a means including a light sensor having a light emitting unit that generates and emits light and a receiving unit that receives the reflected light. In addition, the third detection unit 7100 moves horizontally in the X-axis direction, which is the forward/backward movement direction of the support unit 2100, in the arranging direction between the process chamber 6000 and the transfer chamber 1000, and the Y-axis direction intersecting the light ( L) may be provided to emit and receive light. In this case, the movement of the third detection unit 7100 in each of the X-axis direction and the Y-axis direction may be performed in a preset section in the X-axis direction and the Y-axis direction.

A reference position (hereinafter, a third position) for determining whether the connection position of the process chamber 6000 is normal may be set in the third determination unit 7200 . In addition, the third determination unit 7200 may determine whether the mounting table 6110 is horizontal.

Here, the third position is a coordinate in the X-axis direction, which is the direction in which the process chamber 6000 and the transfer chamber 1000 are arranged or the support part 2100 moves forward toward the process chamber 6000, which intersects the X-axis direction. It may have coordinates in the Y-axis direction and coordinate values (X, Y, Z) in the Z-axis direction, which is the vertical direction (or height direction).

Hereinafter, coordinates of the third position, which are a reference for determining the connection state of the process chamber 6000, will be described by specifying _{X S} , Y _S , and Z _{S .}

In the third position (X _S , Y _S , Z _S ), in a state in which the operation of the transfer device 2000 is normal and the process chamber 6000 is connected to the transfer chamber 1000 in a fixed position, the support unit 2100 is When moved into the process chamber 6000, it may be the X, Y, Z coordinate values of the tip of the support part 2100 in the process chamber 6000.

Hereinafter, a method of determining the connection state of the process chamber using the third inspection apparatus of the present invention will be described with reference to FIG. 15 .

The method of determining the connection state of the process chamber 6000 to be described below is a method of determining the connection state of the process chamber 6000 by detecting the position of the support part 2100 moved into the process chamber 6000 . This will be described in detail below.

First, the support 2100 on which the substrate 10 is supported is moved into the process chamber 6000 . To this end, the control unit 2000b sets or stores a driving command value (hereinafter, referred to as a third driving command value) according to a third position that is a target position of the support unit 2100 in the process chamber 6000 . Then, the transfer driving unit 2000a operates according to the third driving command value, and accordingly, the support unit 2100 moves forward into the process chamber 6000 .

When the forward movement of the support part 2100 is finished, the position of the support part 2100 is detected through the third detection part 7100 . To this end, light is emitted and received while the third detector 7100 is moved in the X-axis and Y-axis directions. At this time, when the light reaches the support 2100 and is reflected from the support 2100, it is reflected and returned faster than in other cases, so this time difference can be converted or converted into a height value that is a Z-axis value. . Accordingly, it is possible to know a change in the height value in the X-axis direction, and through this, it is possible to know the position of the tip of the support part 2100 . In addition, the change in the height value in the Y-axis direction (Z-axis) can be seen. Accordingly, the position of the tip of the support unit 2100 detected by the third detection unit 7100 may be in the form of coordinates such as _{'X M} , Y _M , Z _{M '.}

_{The third determination unit 7200 compares the position (X M} , Y _M , Z _M ) of the tip of the support unit 2100 detected by the third detection unit 7100 and the third position (X _S , Y _S , Z _S ) do. At this time, when the detected position (X _M , Y _M , Z _M ) is the third position (X _S , Y _S , Z _S ) (see (a) of FIG. 15 ), the connection position of the process chamber 6000 is judged to be normal However, when at least one of the detected positions (X _M , Y _M , Z _M ) is different from the third position (X _S , Y _S , Z _S ), it is determined that the connection position of the process chamber 6000 is abnormal. .

For example, as shown in (b) of FIG. 15 , among the detected positions (X _M , Y _M , Z _M ), when the position (X _M ) in the X-axis direction is different from the third position (X _s ) in the X-axis direction , it is determined that the connection position of the process chamber 6000 is abnormal. As another example, as shown in (c) of FIG. 15 , among the detected positions (X _M , Y _M , Z _M ), the position in the Y-axis direction (Y _M ) is different from the third position (Y _s ) in the Y-axis direction. In this case, it is determined that the connection position of the process chamber 6000 is abnormal. In addition, although not shown, among the detected positions (X _M , Y _M , Z _M ), when the position (Z _M ) in the Z-axis direction is different from the third position (Z _s ) in the Z-axis direction, the process chamber ( 6000) is determined to be abnormal.

And, when the third determination unit 7200 determines that the connection position of the process chamber 6000 is abnormal, the third alarm unit 7300 generates an alarm, and the operator adjusts the connection position of the process chamber 6000 There is a need.

Next, a method for determining the installation state of the seating table using the third inspection device of the present invention will be described with reference to FIG. 14 .

First, light is emitted through the third detector 7100 and the reflected light is received. In this case, light is emitted and received while the third detector 7100 is moved in at least one of the X-axis and Y-axis directions.

At this time, in moving the third detection unit 7100 in the X-axis direction, for example, from the outside of the mounting table 6110 through the upper surface 62a of the mounting table 6110, the seating surface 62b of the mounting table 6110 ) to a predetermined position. Accordingly, it can be seen a change in the height value of the mounting table 6110 in the X-axis direction. That is, since the light reflected from the relatively high surface is received by the third detection unit 7100 for a short time, the shorter the time, the higher the surface height is derived, so that the height change of the surface of the seating table 6110 can be known. . More specifically, the height change of the upper surface 62a of the seating table 6110 and the height change of the seating surface 62b can be seen.

At this time, when the mounting table 6110 is disposed horizontally with the bottom surface of the process chamber 6000, the time that light is received in the X-axis direction is constant on the upper surface 62a of the mounting table 6110, and the seating surface In (62b), the time the light is received in the X-axis direction will be constant. From this, in the upper surface 62a of the seating table 6110, the height in the X-axis direction is constant, and in the seating surface 62b, it can be detected that the height in the X-axis direction is constant, thereby, the seating It may be determined that the stand 6110 is horizontally disposed.

However, when the mounting table 6110 is not arranged horizontally with the bottom surface of the process chamber 6000, the time at which light is received in the X-axis direction is different on the upper surface 62a of the mounting table 6110, and the seating surface In (62b), the time at which the light is received in the X-axis direction will be different. From this, it can be detected that the height in the X-axis direction changes on the upper surface 62a of the seat 6110, and the height in the X-axis direction changes on the seat surface 62b. It can be determined that 6110 is not horizontally arranged.

The third determination unit 7200 determines whether the mounting table 6110 is horizontal by using the optical data obtained from the third detection unit 7100 . That is, when there is no height change in each of the upper surface 62a and the seating surface 62b of the seating table 6110 in the height change in the X-axis direction, it is determined that the height is horizontal in the X-axis direction. However, in the height change in the X-axis direction, when a height change is detected on the upper surface 62a and the seating surface 62b of the seating table 6110, it is determined that the height is not horizontal in the X-axis direction.

In the above description, it has been described that the third detection unit 7100 moves in the X-axis direction to determine the horizontal state of the seating unit 4210 . However, the present invention is not limited thereto, and the third detection unit 7100 may move in the Y-axis direction to determine the horizontal state of the seating unit 4210 .

Through this method, the third determination unit 7200 may determine whether the mounting base 6110 is horizontal. And, when the third determination unit 7200 determines that the horizontal state of the seat 6110 is abnormal, the third alarm unit 7300 generates an alarm, and the operator adjusts the installation state of the seat 6110. There is a need.

In the above, a method of determining the connection state of the process chamber 6000 by detecting the position of the support part 2100 moved to the inside of the process chamber 6000 has been described. However, the present invention is not limited thereto, and the connection state of the process chamber 6000 may be determined in another method.

Hereinafter, another method of determining the connection state of the process chamber 6000 will be described with reference to FIG. 16 .

In the method to be described below, the substrate 10 is seated on the mounting base 6110 and the connection state of the process chamber 6000 depends on whether the substrate 10 is positioned on the mounting base 6110 in a fixed position. It is a method of determining whether a normal or abnormal This will be described in detail below.

First, the support 2100 on which the substrate 10 is supported is moved into the process chamber 6000 . To this end, a driving command value (hereinafter, a fourth driving command value) according to a target position (hereinafter, referred to as a fourth position) of the support unit 2100 is set or stored in the control unit 2000b in the process chamber 6000 . Here, the fourth position is, when the substrate 10 of the support unit 2100 moved into the process chamber 6000 is seated on the mounting table 6110, the substrate 10 is at the original position of the mounting table 6110. This may be a position of the support part 2100 on which it is seated. More specifically, it may be a position of the tip of the support 6100 .

The transfer driving unit 2000a is operated according to the fourth driving command value, and accordingly, the support unit 2100 moves into the process chamber 6000 . When the support part 2100 is moved to the process chamber 6000 , the substrate 10 supported on the support part 2100 is seated on the mount 6100 .

Then, it is determined whether or not the substrate 10 is seated at the correct position on the mounting table 6100 . To this end, light is emitted through the third detector 7100 and the reflected light is received. In this case, light is emitted and received while the third detector 7100 is moved horizontally, for example, in the X-axis direction. At this time, in moving the third detection unit 7100 in the X-axis direction, it is preferable to move from the upper surface 62a of the mounting table 6110 to a predetermined position of the substrate 10 through the mounting surface 62b. Accordingly, it can be seen that the height value change in the X-axis direction. At this time, the seating table 6110 has a step (height difference) between its upper surface 62a and the seating surface 62b, and when the substrate 10 is seated on the seating surface 62b, the upper surface of the seating table 6110 There is a step between the seating surface 62a and the seating surface 62b, and the seating surface 62b and the surface of the substrate 10 . Accordingly, the separation distance between the inner surface 62c of the mounting table 6110 and the side surface of the substrate 10 , that is, the gap G _M may be detected through a change in the height value in the X-axis direction.

_{The gap G M} detected by the third detector 7100 may vary depending on a state in which the process chamber 6000 is coupled to the transfer chamber 1000 . For example, when the process chamber 6000 is fastened to the original position of the transfer chamber 1000 , as shown in (a) of FIG. 16 , the gap G _{M in} the circumferential direction of the mounting base 6110 is constant. In this case, the gap G _M detected by the third detector 7100 may be included in the preset reference gap G _{s .} However, when the process chamber 6000 is not fastened to the original position of the transfer chamber 1000 , the gap G _M is non-uniform in the circumferential direction of the seat 6110 as shown in FIG. 16 ( b ). In this case, the gap G _M detected by the third detector 7100 may not be included in the preset reference gap G _{s .}

The third determination unit 7200 compares the detected gap G _M with a preset reference gap G _S . Here, the reference gap G _S may be a range value. That is, it may be a value in the range of the lowest limit to the highest limit.

A third determination unit (7200) if the detected gap (G _M) that contains the reference gap (G _S), and determines the connection status of the process chamber 6000 by the normal, on the contrary outside of the standard gap (G _S), In this case, it is determined that the connection state of the process chamber 6000 is abnormal. Here, the measured gap (G _M) is outside the reference gap (G _S) are not, the measured gap (G _M) or the lowest less than an inch of the reference gap (G _M), may be to best exceed the limit values.

The third determination unit 7200 determines that the connection state of the process chamber 6000 is normal, as described above, between the side surface 11 of the substrate 10 and the inner surface 62c of the seat 6110 . It means that the gap is uniform in the circumferential direction of the substrate 10 . However, when the third determination unit 7200 determines that the connection state of the process chamber 6000 is abnormal, the gap between the side surface 11 of the substrate 10 and the inner surface 62c of the seat 6110 is It means that it is not uniform in the circumferential direction of the substrate.

In the above description, it has been described that the third detection unit 7100 is moved in the X-axis direction to detect the gap in the X-axis direction. However, the gap in the Y-axis direction may be detected by moving the third detector 7100 in the Y-axis direction.

In addition, in the above, the gap between the side surface 11 of the substrate 10 and the inner surface 62c of the mounting base 6110 is measured, and the substrate 10 is positioned on the mounting table 6110 through the measured gap. The connection state of the process chamber 6000 was determined by determining whether it was seated.

However, other than the method of measuring the gap, it is determined whether the substrate 10 is seated in the proper position of the mounting base 6110 by another method, and the connection state of the process chamber 6000 can be determined using this.

In the embodiment, it has been described that the transport device 2000 includes one support part 2100 . However, the present invention is not limited thereto, and a plurality of support parts 2100 arranged in a width direction of the transfer chamber 1000 may be installed, and a plurality of support parts 2100 may be installed in a vertical direction. In addition, all of the plurality of support units 2100 may be configured to be individually operable.

Hereinafter, a process of inspecting the substrate processing system will be described with reference to FIGS. 1 and 2 , FIGS. 5 to 9 , and FIGS. 13 to 15 and 17 . In this case, the content overlapping with the previously described content will be omitted or briefly described.

First, it is determined whether the operation of the transfer device 2000 is normal (S110). To this end, as shown in FIG. 5 , the support part 2100 is moved forward in the direction in which the first detection part 3100 is located. When the movement of the support unit 2100 is finished, the image image F is acquired through the first detection unit 3100 .

_{The first determination unit 3200 compares the position between the mark M F} and the reference area A _S on the image image F captured by the first detection unit 3100 (see FIG. 9 ), and the transfer device ( 2000) is judged to be normal or abnormal.

At this time, if it is determined that the operation of the transfer device 2000 is abnormal (No), the first alarm unit 3300 sounds an alarm (S120). Then, the operator recognizes that there is a problem in the transport device 2000 and repairs the transport device 2000 . For example, the assembly state of the transport device 2000 is checked and adjusted.

Then, when it is determined that the operation of the transfer device 2000 is normal (Yes), the following inspection process is performed.

For example, it is first determined whether the connection state of the load lock chamber 4000 is normal ( S210 ). To this end, for example, the support part 2100 is moved forward to the load lock chamber 4000 , and the tip position of the support part 2100 is detected using the second detection part 5100 of the second inspection apparatus 5000 .

The second determination unit 5200 is the detected support portion 2100, the tip position (X _M , Y _M ,Z _M ) and the second position (X _S , Y _S ,Z _S ), it is determined that the connection state of the load lock chamber 4000 is normal or abnormal.

At this time, if it is determined that the connection state of the load lock chamber 4000 is abnormal (No), the second alarm unit 5300 sounds an alarm (S220). Then, the operator recognizes that there is a problem in the load lock chamber 4000 and adjusts the connection position of the load lock chamber 4000 .

Then, when it is determined that the connection state of the load lock chamber 4000 is normal (Yes), the following inspection process is performed.

For example, it is determined whether the connection state of the process chamber 6000 is normal ( S310 ). To this end, as shown in FIGS. 13 and 15 , the support part 2100 is moved forward to the process chamber 6000 , and the tip position of the support part 2100 is detected using the third detection part 7100 of the third inspection apparatus 7000 . do.

The third determination unit 7200 is the detected support unit 2100 tip position (X _M , Y _M ,Z _M ) and the third position (X _S , Y _S ,Z _S ), it is determined that the connection state of the process chamber 6000 is normal or abnormal.

At this time, when it is determined that the connection state of the process chamber 6000 is abnormal (No), the third alarm unit 7300 sounds an alarm (S320). Then, the operator recognizes that there is a problem in the process chamber 6000 and adjusts the connection position of the process chamber 6000 .

When it is determined that the connection state of the process chamber 6000 is normal (Yes), the following inspection process is performed.

In the above description, after checking whether the connection state of the load lock chamber 4000 is normal (S210), the connection state of the process chamber 6000 is checked (S310), but the order is not limited thereto and may be changed. have.

When it is confirmed that the connection state of the load lock chamber 4000 and the process chamber 6000 is normal, it is checked whether the installation state of the mounting base 6110 installed inside the process chamber 6000 is normal (S410). That is, it is determined whether the mounting base 6110 is horizontal.

To this end, the third detection unit 7100 is used to irradiate light to the mounting table 6110, and the reflected light is received. Light is irradiated and received while moving.

Then, the third detection unit 7100 detects the height of the surface of the seating table 6110 in the X-axis direction by using the obtained optical data. Then, the third determination unit 7200 determines whether the mounting table 6110 is horizontal by checking the height change of the surface of the mounting table 6110 in the X-axis direction detected by the third detection unit 7100 .

When the third determination unit 7200 determines that the horizontal state of the seat 6110 is abnormal (No), the third alarm unit 7300 sounds an alarm (S420). Then, the operator recognizes that there is a problem with the mounting base 6110, and adjusts the inclination of the mounting base 6110.

And, when it is determined that the mounting base 6110 is horizontally disposed (Yes), it is determined that all of the substrate processing systems are normal. Accordingly, a substrate processing step is performed.

As such, according to embodiments of the present invention, it is possible to check whether the operation of the transfer device 2000 for transferring the substrate 10 is abnormal before performing the substrate processing process. In addition, the process chamber 6000 for processing the substrate 10 is connected to the transfer chamber 1000 , the seat 6110 is installed inside the process chamber 6000 , and the load lock chamber 4000 is the transfer chamber ( 1000), you can automatically check whether there is an abnormality in the connected state. Accordingly, when it is confirmed that there is an abnormality in these devices, inspection, repair or adjustment of the device in which the abnormality is confirmed may be performed.

Therefore, it is possible to reduce the problem of seating the substrate on the mounting table 6110 in an abnormal or abnormal state, thereby allowing the substrate 10 to be seated at the correct position of the mounting table 6110 during the actual process. have. Accordingly, it is possible to reduce the occurrence of defects according to the seating position of the substrate 10 and improve the substrate processing quality.

It is possible to reduce the problem of seating the substrate on the mounting table in an abnormal or abnormal state during the substrate processing process, thereby allowing the substrate to be seated at the correct position of the mounting table during the actual process. Accordingly, it is possible to reduce the occurrence of defects according to the seating position of the substrate, and improve the substrate processing quality.

Claims

a transfer chamber having an interior space;

a transfer device having a support installed in the transfer chamber to support and move the substrate;

A first detection unit installed in at least one of the transfer chamber and the transfer device is provided, and it is determined whether the support unit has moved to a preset first position using the data obtained from the first detection unit, a first inspection device for determining an operating state;

A substrate processing system comprising a.
The method according to claim 1,

The first detection unit monitors the position of the support,

The first inspection apparatus may include a first determination unit configured to determine an operation state of the transfer apparatus by comparing the first position with the position of the support part monitored by the first detection unit.
The method according to claim 1,

The first detection part is installed in at least one of the support part and the transfer chamber to detect the separation distance between the support part and the inner wall of the transfer chamber,

The first inspection apparatus may include a first determination unit configured to determine an operation state of the transfer apparatus by comparing the distance detected by the first detection unit with a preset distance.
The method according to claim 1,

a load lock chamber connectable to the transfer chamber; and

a second inspection device for monitoring a support moved into the load lock chamber and determining a state in which the load lock chamber is installed in the transfer chamber;

A substrate processing system comprising a.
5. The method according to claim 4,

The second inspection device,

a second detection unit for monitoring a position of the support unit moved into the load lock chamber; and

a second determination unit for determining a connection state between the load lock chamber and the transfer chamber by comparing the position of the support unit monitored by the second detection unit with a preset second position;

A substrate processing system comprising a.
The method according to claim 1,

a process chamber connectable to the transfer chamber;

a mount installed in the process chamber; and

a third inspection device configured to monitor at least one of the support part and the mounting table moved into the process chamber to determine at least one of a state in which the process chamber is connected to the transfer chamber and an installation state of the mounting table;

A substrate processing system comprising a.
7. The method of claim 6,

The third inspection device,

a third detector for monitoring the position of the support part moved into the process chamber and the position of the seating base; and

A state in which the process chamber is connected to the transfer chamber is determined by comparing the position of the support part monitored by the third detection unit with a preset third position, or the horizontal position of the seating table is determined using the data monitored by the third detection unit. By determining whether or not, a third determination unit for determining the installation state of the seat;

A substrate processing system comprising a.
moving the support part according to a driving command value for moving the support part of the transport device to a preset first position in the transport chamber;

detecting a position of the support part by a first detection part; and

determining an operating state of the transfer device by comparing a preset value to which the first position is reflected with a value detected by the first detection unit;

Inspection method of a substrate processing system comprising a.
9. The method of claim 8,

moving the support part according to a driving command value for moving the support part to a preset second position in a load lock chamber connected to the transfer chamber;

detecting a position of the support part moved into the load lock chamber by a second detector;

determining a connection state of the load lock chamber by comparing a preset value to which the second position is reflected with a value detected by the second detection unit;

Inspection method of a substrate processing system comprising a.
9. The method of claim 8,

moving the support part in response to a driving command value for moving the support part to a preset third position in a process chamber connected to the transfer chamber;

detecting a position of the support part moved into the process chamber by a third detector;

determining a connection state of the process chamber by comparing a preset value to which the third position is reflected with a value detected by the third detector;

Inspection method of a substrate processing system comprising a.
9. The method of claim 8,

supporting a substrate on the support;

moving the support part to a preset fourth position in a process chamber connected to the transfer chamber;

placing the substrate supported on the support unit on a mounting table installed inside the process chamber;

detecting the position of the substrate on the mounting table by a third detection unit;

determining a connection state of the process chamber by comparing a preset position with the position of the substrate detected by the third detector;

Inspection method of a substrate processing system comprising a.