WO2020184859A1 - Dispositif de transfert et procédé de transfert de puce à semi-conducteur - Google Patents

Dispositif de transfert et procédé de transfert de puce à semi-conducteur Download PDF

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Publication number
WO2020184859A1
WO2020184859A1 PCT/KR2020/002375 KR2020002375W WO2020184859A1 WO 2020184859 A1 WO2020184859 A1 WO 2020184859A1 KR 2020002375 W KR2020002375 W KR 2020002375W WO 2020184859 A1 WO2020184859 A1 WO 2020184859A1
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Prior art keywords
substrate
semiconductor chip
push pin
axis
stage
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PCT/KR2020/002375
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English (en)
Korean (ko)
Inventor
유병소
김정식
박종인
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㈜큐엠씨
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention relates to an apparatus for transferring a semiconductor chip, and more particularly, to an apparatus for transferring a light emitting diode chip.
  • a light emitting diode (LED) chip proceeds by forming a circuit of each chip on a wafer and then separating it into a plurality of individual chips. Such a light emitting diode chip undergoes several transfer processes in package and module processes.
  • this transfer process is for the purpose of classifying chips according to defects in quality, or transferring to a transfer tape or a substrate to adjust the chip spacing or direction of the chip, or for the purpose of mounting circuits. Transfer to the substrate.
  • a conventional transfer device ie, a pick up & place device
  • Korean Laid-Open Patent Publication No. 10-2016-0008187 discloses a chip transfer device and a transfer method.
  • micro LED chip eg, micro LED
  • chip size 5 ⁇ m to 300 ⁇ m
  • ultra-miniature LED chips can be applied to optical applications that require low power consumption, miniaturization, and weight reduction, and thus research and development are being actively conducted.
  • a vacuum when adsorbing a light emitting diode chip in a pick up step and a vacuum in the center to place a light emitting diode chip adsorbed in a place step are provided.
  • the diameter of the collet hole is several micrometers, it is not possible to secure sufficient vacuum pressure to hold the LED chip and air pressure to destroy the vacuum due to the pipe resistance of the collet hole.
  • the present invention has been devised to solve this problem, and one surface of a first substrate (including a substrate such as a mounting tape and a wafer) on which a semiconductor chip is mounted and a second substrate to which the semiconductor chip is transferred (transfer tape, substrate, circuit board)
  • a first substrate including a substrate such as a mounting tape and a wafer
  • a second substrate to which the semiconductor chip is transferred
  • transfer tape, substrate, circuit board To provide a transfer device and a transfer method for transferring a semiconductor chip to a transfer tape by pushing the other surface of a first substrate in a state in which) are disposed facing each other.
  • an embodiment of the present invention is a transfer device for transferring a semiconductor chip, a stage on which a first substrate on which the semiconductor chip is mounted is mounted, and the semiconductor chip is transferred.
  • a portion corresponding to the semiconductor chip is pushed from the other surface of the first substrate to remove the semiconductor chip. 2
  • It includes a push pin module transferred to the substrate.
  • the push pin module includes a push pin unit including a push pin for pushing the other surface of the first substrate and a load control unit for adjusting a load applied to the push pin when the semiconductor chip is transferred to the second substrate.
  • the load control unit may include at least one of a voice coil motor (VCM) and a spring.
  • VCM voice coil motor
  • the load control unit includes a VCM stator and a VCM mover, and when the semiconductor chip is transferred to the second substrate, a predetermined load or more on the push pin When this is applied, the VCM mover may move in a direction opposite to the moving direction of the push pin.
  • the load control unit may adjust the load applied to the push pin to be maintained as the preset load.
  • a flat portion parallel to one surface of the first substrate may be formed at the tip portion of the push pin.
  • the stage includes: a first substrate seating portion on which the first substrate is seated; A stage X-axis moving unit connected to the first substrate seating portion and controlling movement of the first substrate seating portion in the X-axis direction; And a stage Y-axis moving part connected to the stage X-axis moving part and controlling movement of the stage X-axis moving part in a Y-axis direction orthogonal to the X-axis.
  • stage X-axis moving part the first X-axis actuator connected to the first base material mounting portion, the first X-axis actuator for controlling the movement of the first base material mounting portion in the X-axis direction;
  • a second X-axis actuator that is disposed to be spaced apart from the first X-axis actuator, is connected to the first substrate seating portion, and controls the movement of the first substrate seating portion in the X-axis direction.
  • the stage Y-axis moving part may include a first Y-axis actuator connected to the stage X-axis moving part and controlling movement of the stage X-axis moving part in the Y-axis direction; And a second Y-axis actuator that is disposed to be spaced apart from the first Y-axis actuator, is connected to the stage X-axis moving part, and controls the movement of the stage X-axis moving part in the Y-axis direction.
  • the first X-axis actuator and the second X-axis actuator are controlled to be synchronously driven, and the first Y-axis actuator and the second Y-axis actuator are synchronized. It can be controlled to be driven.
  • the stage may further include a first substrate rotating means for controlling rotation of the first substrate on a surface parallel to one surface of the first substrate. have.
  • the first substrate rotation means may include a servo motor and a link section connected to the servo motor.
  • the work table includes: a second substrate seating portion on which the second substrate is seated; And a work table Z-axis moving part that controls the movement of the second base material mounting part in the vertical direction, wherein the work table Z-axis moving part is installed below the second base material mounting part, and the second base material is mounted
  • a horizontal guide rail disposed parallel to one side of the unit;
  • An inclined guide rail installed below the second substrate seating portion to be spaced apart from the horizontal guide rail in a vertical direction and disposed to be inclined with one surface of the second substrate seating portion;
  • a separation distance control means disposed between the horizontal guide rail and the inclined guide rail, and controlling a separation distance between the horizontal guide rail and the inclined guide rail.
  • the separation distance control means comprises: a horizontal guide coupled to the horizontal guide rail and moving along the horizontal guide rail; An inclined guide coupled to the inclined guide rail and moving along the inclined guide rail; And a screw coupled to the horizontal guide and the inclined guide to move the horizontal guide and the inclined guide together.
  • the worktable Z-axis moving part is installed under the second base material seating part, and is formed in a column shape extending in a vertical direction, so that the horizontal guide rail and the It may further include a plurality of Z-axis guides whose length increases or decreases according to the spacing of the inclined guide rail.
  • At least one of a separation distance between the push pin module and the work table, a separation distance between the push pin and the work table, and a separation distance between the stage and the work table may further include a sensor for setting (setting).
  • the senor may be a touch sensor.
  • a device comprising: a first substrate scanning unit for scanning the first substrate; And a second substrate scanning unit for scanning the second substrate.
  • the semiconductor chip may be a light emitting diode (LED) chip.
  • LED light emitting diode
  • Another embodiment of the present invention provides a method for transferring a semiconductor chip, comprising: preparing a first substrate on which the semiconductor chip is mounted; Preparing a second substrate to which the semiconductor chip is to be transferred; Transferring the semiconductor chip to the second substrate by pushing a portion corresponding to the semiconductor chip on the other surface of the first substrate with a push pin in a state in which one surface of the first substrate and the second substrate are disposed to face each other; Including, the step of transferring the semiconductor chip to the second substrate includes the step of maintaining a load applied to the push pin as a preset load.
  • the preparing of the first substrate on which the semiconductor chip is mounted on the one surface includes: preparing a preliminary substrate on which the semiconductor chip is mounted on one surface; Preparing the first substrate; And transferring the semiconductor chip to the first substrate by pushing a portion corresponding to the semiconductor chip on the other surface of the preliminary substrate with the push pin in a state in which one surface of the preliminary substrate and the first substrate are disposed to face each other.
  • transferring the semiconductor chip to the first substrate may include maintaining a load applied to the push pin as a preset load.
  • semiconductor chips can be transferred without damage, and a constant load can be applied to all semiconductor chips, so that the transferred semiconductor chips can be transferred to a uniform height.
  • FIG. 1 is a schematic diagram of a transfer device according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a stage provided in a transfer device according to an embodiment of the present invention.
  • FIG 3 is a schematic diagram of a work table provided in a transfer device according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a Z-axis moving part of a work table provided in a transfer device according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a Z-axis guide provided in a transfer device according to an embodiment of the present invention.
  • 6A and 6B are views for explaining driving of a Z-axis moving part of a work table provided in a transfer apparatus according to an exemplary embodiment of the present invention.
  • FIG. 7 is a schematic diagram of a push pin module provided in a transfer device according to an embodiment of the present invention.
  • FIG. 8 is a view for explaining a load control unit according to an embodiment of the present invention.
  • FIG. 9 is a view for explaining the characteristics of a spring according to an embodiment of the present invention.
  • FIG. 10 is a view for explaining a method of setting a sensor and a work table provided in the transfer device according to an embodiment of the present invention.
  • 11A to 11C are views for explaining a method of setting to the same process conditions using a sensor provided in a transfer device according to an embodiment of the present invention.
  • FIG. 12 is a flowchart illustrating a method of transferring a semiconductor chip mounted on a first substrate to a second substrate according to an embodiment of the present invention.
  • FIG. 13 is a view for explaining a method of transferring a semiconductor chip using a transfer device according to an embodiment of the present invention.
  • FIG. 14 is a flowchart illustrating a method of transferring a semiconductor chip to a second substrate according to another embodiment of the present invention.
  • unit includes a unit realized by hardware, a unit realized by software, and a unit realized using both. Further, one unit may be realized using two or more hardware, or two or more units may be realized using one hardware.
  • the Z-axis direction refers to the vertical direction
  • the X-axis direction refers to one direction on a horizontal plane orthogonal to the Z-axis direction
  • the Y-axis direction is orthogonal to the X-axis direction on the horizontal plane orthogonal to the Z-axis direction.
  • the X-axis direction does not mean a fixed direction, but an arbitrary direction on a horizontal plane orthogonal to the Z-axis direction.
  • the meaning of orthogonal or vertical is not limited to precisely forming an angle of 90 degrees, and includes a concept that is substantially orthogonal or perpendicular.
  • FIG. 1 is a schematic diagram of a transfer device according to an embodiment of the present invention.
  • a transfer apparatus 100 includes a stage 110, a work table 120, and a push pin module 130.
  • the transfer apparatus 100 may further include a control unit (not shown) having a memory.
  • the control unit controls each configuration of the transfer device 100 so that the transfer device 100 operates.
  • each component of the transfer apparatus 100 is described to directly perform an operation, but such description includes the control unit controlling each component so that each component performs a corresponding operation.
  • a first substrate on which a plurality of semiconductor chips are mounted is mounted on the stage 110.
  • the first substrate is a substrate on which a semiconductor chip is mounted, and may include a tape, a wafer, a substrate, and the like.
  • the semiconductor chip is a chip formed by using a deposition process, an etching process, etc. on a substrate or a wafer, and may be, for example, a light emitting diode (LED) chip.
  • the semiconductor chip may be a micro light emitting diode chip having a size of 5 ⁇ m to 300 ⁇ m, and may mean a product before packaging and a product that has been packaged. Further, in the present invention, the semiconductor chip may mean a micro LED.
  • FIG. 2 is a schematic diagram of a stage provided in a transfer device according to an embodiment of the present invention.
  • the stage 110 includes a first substrate seating portion 112, a stage X-axis moving portion 113, a stage Y-axis moving portion 116, and a first substrate rotating means 119.
  • a first substrate is seated on the first substrate seating portion 112, and the first substrate seating portion 112 supports the periphery of the first substrate to hold the first substrate.
  • the central portion of the first substrate mounting portion 112 is open, and through this, the semiconductor chip mounted on the first substrate may be transferred to the second substrate positioned below the stage 110.
  • the first substrate mounting portion 112 may be moved in the X-axis direction and/or the Y-axis direction for mounting the first substrate.
  • the first substrate mounting portion 112 can be moved between the preparation position (position in FIG.
  • the module 130 may be moved in the X-axis and/or Y-axis directions to transfer each semiconductor chip to the second substrate at the same fixed position.
  • the stage X-axis moving part 113 is connected to the first base material mounting part 112 to move the first base material mounting part 112 in the X-axis direction.
  • the stage X-axis moving unit 113 includes a first X-axis actuator 114 and a second X-axis actuator 115.
  • the first X-axis actuator 114 is installed on one side of the first substrate seating portion 112 and is connected to the first substrate seating portion 112 to allow movement of the first substrate seating portion 112 in the X-axis direction. Control.
  • the second X-axis actuator 115 is installed on the other side of the first substrate seating portion 112 and is connected to the first substrate seating portion 112 to allow the movement of the second substrate seating portion 112 in the X-axis direction. Control.
  • the first X-axis actuator 114 and the second X-axis actuator 115 are formed in a shape elongated in the X-axis direction, and are spaced apart from each other to allow the movement of the first substrate seating portion 112 in the X-axis direction. Control.
  • the first X-axis actuator 114 and the second X-axis actuator 115 are controlled to be synchronously driven in order to more accurately and quickly control the movement of the first substrate seating portion 112 in the X-axis direction.
  • the first base material mounting part 112 can be quickly and without delay. You can control the movement in the X-axis direction.
  • the first X-axis actuator 114 and the second X-axis actuator 115 may include a linear motor or the like.
  • the stage Y-axis moving part 116 is connected to the stage X-axis moving part 113 to move the stage X-axis moving part 113 in the Y-axis direction.
  • the stage Y-axis moving unit 116 includes a first Y-axis actuator 117 and a second Y-axis actuator 118.
  • the first Y-axis actuator 117 is installed on one side of the stage X-axis moving part 113, and is connected to the stage X-axis moving part 113 to allow the stage X-axis moving part 113 to move in the Y-axis direction. Control.
  • the second Y-axis actuator 118 is installed on the other side of the stage X-axis moving part 113, and is connected to the stage X-axis moving part 113 to control the movement of the stage X-axis moving part 113 in the Y-axis direction.
  • the first Y-axis actuator 117 and the second Y-axis actuator 118 are formed in a shape elongated in the Y-axis direction, and are spaced apart from each other to allow movement of the stage X-axis moving part 113 in the Y-axis direction. Control.
  • the first Y-axis actuator 117 and the second Y-axis actuator 118 control the first X-axis actuator 114 and the second X-axis actuator 115 to move together in the Y-axis direction, respectively.
  • the stage Y-axis moving part 116 can control the movement of the stage X-axis moving part 113 in the Y-axis direction, through which the first base material connected to the stage X-axis moving part 113 is mounted.
  • the movement of the unit 112 in the Y-axis direction can be controlled.
  • first Y-axis actuator 117 and the second Y-axis actuator 118 are controlled to be synchronously driven in order to more accurately and quickly control the movement in the Y-axis direction.
  • the Y-axis direction of the X-axis stage moving part 113 is quickly and without delay. It is possible to control the movement of, and accordingly, the movement of the first base material seating unit 112 connected to the X-axis stage moving unit 113 in the Y-axis direction can be quickly controlled without delay.
  • the first Y-axis actuator 117 and the second Y-axis actuator 118 may include a linear motor or the like.
  • the first Y-axis actuator 117 and the second Y-axis actuator 118 are shown to be disposed in the lower side of the stage X-axis moving unit 113, but are not limited thereto, and depending on the configuration, the stage X It may be disposed on the same plane as the shaft moving part 113 or may be disposed above the side.
  • the first substrate rotating means 119 controls rotation on a surface parallel to one surface of the first substrate of the first substrate seated on the first substrate seating portion 112. Before transferring the semiconductor chip mounted on the first substrate to the second substrate, it is necessary to quickly and precisely align the angle of the semiconductor chip mounted on the first substrate.
  • the first substrate rotating means 119 is a servo motor. (servo motor) and a link clause connected to the servo motor. The rotation by the link section allows the first substrate to rotate at a high speed, while stably controlling the rotation.
  • the transfer device 100 includes a work table 120.
  • the work table 120 is positioned below the stage 110, and a second substrate to which a plurality of semiconductor chips mounted on the first substrate is to be transferred is mounted.
  • the second substrate is a substrate to which the semiconductor chip is to be transferred, and includes a tape, a substrate, and a circuit board.
  • FIG 3 is a schematic diagram of a work table provided in a transfer device according to an embodiment of the present invention.
  • the work table 120 includes a second base material seating part 122, a work table Z-axis moving part 124, a work table Y-axis moving part 126, and a work table X-axis moving part 128. And a second substrate rotation means (129).
  • a second substrate is seated on the second substrate seating portion 122, and the second substrate seating portion 122 supports the entire second substrate to hold the second substrate.
  • the second substrate mounting portion 122 may be moved in an X-axis direction, a Y-axis direction, and/or a Z-axis direction for mounting the second substrate.
  • the second substrate mounting portion 122 may be moved in the Z-axis direction to adjust the spacing between the stage 110 and each semiconductor chip at the same fixed position during the transfer process. It may be moved in the X-axis and/or Y-axis direction so that it can be transferred to the second substrate.
  • the work table Z-axis moving part 124 is provided below the second base material mounting part 122 and controls the movement of the second base material mounting part 122 in the Z-axis direction (up-down direction).
  • FIG. 4 is a schematic diagram of a Z-axis moving part of a work table provided in a transfer device according to an embodiment of the present invention.
  • the work table Z-axis moving part 124 includes a first horizontal plate 211, a second horizontal plate 213, a Z-axis guide 215, a horizontal guide rail 217, and a horizontal guide 219 ), an inclined guide rail 221, an inclined guide 223, and a separation distance control means 225.
  • the first horizontal plate 211 is formed in a rectangular or square plate shape with one side parallel to one side of the second substrate, and is coupled to the second substrate mounting portion 122 under the second substrate mounting portion 122.
  • the second horizontal plate 213 is formed in a rectangular or square plate shape with one side parallel to one side of the second substrate, and is spaced apart from the first horizontal plate 211 by a predetermined distance under the first horizontal plate 211. Installed.
  • the shape of the two horizontal plates 211 and 213 is illustrated and described as having a rectangular or square plate shape, but is not limited thereto.
  • the second horizontal plate 213 is fixed and the first horizontal plate 211 is installed to be movable in the Z-axis direction. As the first horizontal plate 211 moves in the Z-axis direction, the first horizontal plate 211 ) And the second substrate mounting portion 122 is also moved in the Z-axis direction.
  • the Z-axis guide 215 is installed between the first horizontal plate 211 and the second horizontal plate 213 in the shape of a column extending in the vertical direction. One end of the Z-axis guide 215 is coupled to the first horizontal plate 211, and the other end is coupled to the second horizontal plate 213.
  • the Z-axis guide 215 may increase or decrease in length in the vertical direction.
  • a plurality of Z-axis guides 215 may be installed. In this embodiment, four are installed near the vertices of two horizontal plates 211 and 213 having a rectangular or square shape facing each other to connect the two horizontal plates 211 and 213.
  • the second substrate mounting portion 122 coupled with the first horizontal plate 2111 can be stably raised and lowered while maintaining parallelism.
  • An example of a Z-axis guide 215 provided in the work table Z-axis moving part 124 is shown in FIG. 5.
  • the Z-axis guide 215 includes a first outsleeve 310, a second outsleeve 320, a retainer 330, and a needle ( 340) and a post (post) 350
  • the first out sleeve 310 is coupled to the first horizontal plate 211
  • the second out sleeve 320 is coupled to the second horizontal plate 213 do.
  • the first out sleeve 310 and the second out sleeve 320 are connected by a post 350
  • a retainer 330 is installed outside the post 350.
  • the retainer 330 is disposed inside at least one of the two out sleeves 310, and a needle 340 is disposed on the outer side of the retainer 330.
  • the first out sleeve 310 coupled with the first horizontal plate 211 and the post 350 fixedly coupled with the first out sleeve 310 rise together.
  • the spacing between the first out sleeve 310 and the second out sleeve 320 increases, so that the lengths of the plurality of Z-axis guides 215 are increased.
  • the first out sleeve 310 coupled with the first horizontal plate 211 and the post 350 fixedly coupled with the first out sleeve 310 descend together. Is done. Accordingly, the distance between the first out sleeve 310 and the second out sleeve 320 is reduced, so that the lengths of the plurality of Z-axis guides 215 are constantly decreased.
  • the Z-axis guide 215 has a first out sleeve 310, a second out sleeve 320, a retainer 330, a needle 340, and a post 350 as described above.
  • a guide such as a linear motion guide or a cross roller guide may be used as the Z-axis guide 215.
  • the horizontal guide rail 217 is disposed parallel to one surface of the second horizontal plate 213 on the upper surface of the second horizontal plate 213 and is coupled to the second horizontal plate 213.
  • the horizontal guide rail 217 provides a moving path of the horizontal guide 219 so that the horizontal guide 219 coupled with the horizontal guide rail 217 moves along the horizontal guide rail 217. Accordingly, the horizontal guide 219 is coupled with the horizontal guide rail 217 so that it can be moved in a horizontal direction along a moving path provided by the horizontal guide rail 217 as shown in the arrow shown in FIG. 4.
  • the inclined guide rail 221 is installed so as to be inclined with one surface of the first horizontal plate 211 on the lower surface of the first horizontal plate 211 and is coupled to the first horizontal plate 211.
  • the inclined guide rail 221 provides a moving path of the inclined guide 223 so that the inclined guide 223 coupled with the inclined guide rail 221 moves along the inclined guide rail 221. Accordingly, the inclined guide 223 is coupled with the inclined guide rail 221 so that it can be moved in an inclined direction along a moving path provided by the inclined guide rail 221 like the arrow shown in FIG. 4.
  • the horizontal guide rail 217 and the inclined guide rail 221 are installed to be spaced apart in the vertical direction. At this time, since the inclined guide rail 221 is installed inclined and the horizontal guide rail is installed horizontally, the distance between the horizontal guide rail 217 at one end of the inclined guide rail 221 is relatively It is narrow (the right part in FIG. 4) and the spacing between the horizontal guide rail 217 at the other end of the inclined guide rail 221 is relatively large (left part in FIG. 4).
  • the vertical separation distance between the horizontal guide rail 217 and the inclined guide rail 221 is controlled by the separation distance control means 225.
  • the separation distance control means 225 is composed of a horizontal guide 219, an inclined guide 223, a screw 227, and a servo motor 229.
  • the screw 227 connected to the servo motor 229 is formed in a rod shape elongated in the horizontal direction, and rotates by driving the servo motor 229.
  • the horizontal guide 219 and the inclined guide 223 are coupled with the screw 227, and the horizontal guide 219 and the inclined guide 223 are linearly moved together by the rotational motion of the screw 227.
  • the horizontal guide 219 and the inclined guide 223 are moved along the horizontal guide rail 217 and the inclined guide rail 221 in the direction of the arrow shown in FIG. 6A by the rotational motion of the screw 227.
  • the movement the distance between the horizontal guide rail 217 and the inclined guide rail 221 is relatively narrow
  • the overall distance between the horizontal guide rail 217 and the inclined guide rail 221 increases.
  • the first horizontal plate 211 rises, and the post 350 of the Z-axis guide 215 moves in the direction of the arrow shown in FIG. 6A to increase the length of the Z-axis guide 215.
  • the horizontal guide 219 and the inclined guide 223 are moved along the horizontal guide rail 217 and the inclined guide rail 221 by the rotational motion of the screw 227.
  • the overall distance between the horizontal guide rail 217 and the inclined guide rail 221 is reduced.
  • the first horizontal plate 211 descends, and the post 350 of the Z-axis guide 215 moves in the direction of the arrow shown in FIG. 6B, so that the length of the Z-axis guide 215 decreases.
  • the work table Z-axis moving part 124 moves along the horizontal guide rail 217 and the inclined guide rail 221 by the rotational motion of the screw 227, the horizontal guide 219 and the inclined guide 223
  • the spacing between the horizontal guide rail 217 and the inclined guide rail 221 is changed, and accordingly, the first horizontal plate 211 coupled with the inclined guide rail 221 rises and falls, and the Z-axis guide 215 ) Will increase or decrease.
  • the work table Z-axis moving part 124 may move the second substrate seating part 122 coupled with the first horizontal plate 211 in the Z-axis direction (up-down direction).
  • the second base material seating part 122 coupled with the work table Z-axis moving part 124 is moved more stably and precisely while maintaining the horizontal level. It becomes possible to do.
  • the work table Y-axis moving part 126 is installed under the work table Z-axis moving part 124, and by moving the work table Z-axis moving part 124 in the Y-axis direction, Controls the movement of the second substrate seating portion 122 connected to the table Z-axis moving portion 124 in the Y-axis direction.
  • the work table Y-axis moving unit 126 may include a linear motor.
  • the work table X-axis moving part 128 is installed under the work table Y-axis moving part 126, and by moving the work table Y-axis moving part 126 in the X-axis direction, the work table Y-axis moving part 126 ) To control the movement in the X-axis direction of the work table Z-axis moving part 124 and the second base material seating part 122 connected to it.
  • the work table X-axis moving unit 128 may include a linear motor.
  • the second substrate rotating means 129 controls the rotation of the second substrate seated on the second substrate seating portion 122 on a surface parallel to one surface of the second substrate.
  • the first base rotation means 129 includes a servo motor.
  • the transfer device 100 includes a push pin module 130.
  • the push pin module 130 transfers the semiconductor chip mounted on the first substrate to the second substrate at the transfer process position.
  • transfer may refer to transfer of a semiconductor chip from a first substrate to a second substrate and adhesion (bonding) of the semiconductor chip to the second substrate.
  • the push pin module 130 transfers the semiconductor chip to the second substrate by pushing the other surface of the first substrate using a push pin in a state in which one surface of the first substrate and the second substrate are disposed to face each other.
  • FIG. 7 is a schematic diagram of a push pin module provided in a transfer device according to an embodiment of the present invention.
  • the push pin module 130 includes a push pin unit 410, a connection guide 420, and a load control unit 430.
  • the push pin unit 410 is for pushing the other surface of the first base material, and includes a push pin 412 and a push pin housing 414.
  • the push pin housing 414 protects the push pin 412 and contacts the first substrate.
  • the push pin 412 moves in the vertical direction to push the other surface of the first substrate to transfer the semiconductor chip corresponding to the corresponding portion to the second substrate.
  • the push pin unit 410 further includes a vacuum unit 416 that allows the first substrate to be separated from the corresponding semiconductor chip after the semiconductor chip is transferred to the second substrate by the push pin 412.
  • the load control unit 430 controls a load applied to the push pin 412 when the semiconductor chip is transferred to the second substrate, and the load control unit 430 and the push pin unit 410 are connected to the connection guide 420. Connected by When the semiconductor chip is transferred to the second substrate, the semiconductor chip and the second substrate come into contact with each other. At this time, a load is applied to the push pin 412 pushing the other surface of the first substrate on which the semiconductor chip is mounted.
  • the load control unit 430 controls the load applied to the push pin 412, and the load applied to the push pin 412 is transmitted to the load control unit 430 through the connection guide 420, and the load
  • the adjustment unit 430 adjusts the load applied to the push pin 412 to be maintained as a preset load. In addition, the load control unit 430 adjusts the load applied to the push pin 412 to be the same when each semiconductor chip is transferred to the second substrate.
  • the load control unit 430 may include a voice coil motor (VCM).
  • VCM voice coil motor
  • the voice coil motor is a linear motor including a permanent magnet and a coil, and can control a linear motion by controlling a current (or voltage) flowing through the voice coil, and includes a VCM stator 432 and a VCM mover 434.
  • the VCM stator 432 is installed so as to be fixed
  • the VCM mover 434 is disposed between the connection guide 420 and the VCM stator 432, and the moving direction of the push pin 412 or the direction opposite to the moving direction It is installed to be able to move.
  • the VCM mover 434 moves the connection guide 420 connected to the VCM mover 434 in the moving direction of the push pin 412 or in the opposite direction to the push pin unit 410 connected to the connection guide. Move.
  • a load is applied to the push pin 412. If more than a preset load is applied to the push pin 412, the load is adjusted.
  • the unit 430 adjusts the current (or voltage) of the voice coil motor to move the VCM mover 434 in the direction opposite to the direction of the push pin 412, so that the load applied to the push pin 412 is Adjust to maintain the set load.
  • FIG. 8 A diagram for explaining the load applied to the push pin 412 and the action and effect of the load control unit 430 in the transfer process using the push pin 412 is shown in FIG. 8.
  • the load applied to the push pin 412 Will increase.
  • the load control unit 430 is not provided, the load applied to the push pin 412 continues to increase (see 810), so that a load above the semiconductor chip damage limit load is applied to the semiconductor chip and the semiconductor chip is damaged. .
  • the load control unit 430 is provided as in the present invention, and the preset load is set to be less than the semiconductor chip damage limit load, the load applied to the push pin 412 is preset by the load control unit 430 Since it is maintained under the load (see 820), the semiconductor chip is not damaged.
  • the gap between the semiconductor chip and the second substrate may be different due to a variation in the thickness of the semiconductor chip.
  • the gap between the semiconductor chip and the second substrate may be different due to the difference in parallelism between the first substrate and the second substrate, and the thickness deviation of the second substrate or the height deviation of the circuit traces formed on the second substrate
  • the spacing between the semiconductor chip and the second substrate may be different. This problem caused by the deviation of the gap between the semiconductor chip and the second substrate can be solved by adjusting the moving distance of the push pin 412 according to the gap between the semiconductor chip and the second substrate, but the semiconductor chip is transferred very quickly.
  • the transfer device 100 may allow the same load to be applied to the push pin 412 even if a gap between the semiconductor chip and the second substrate occurs due to the load control unit 430. Even if the moving distance of the push pin 412 is not adjusted, it is possible to prevent damage to the semiconductor chip.
  • the load adjustment unit 430 may include a spring.
  • the spring (not shown) has a characteristic that the load increases linearly up to a specific displacement amount (a), and maintains a constant load (b) even if the displacement amount increases after the displacement amount (a).
  • the characteristics of the spring are similar to the picture shown in Fig. 8, so when the spring is installed to be connected to the push pin 412, the load applied to the push pin 412 is adjusted to maintain a constant load. I can.
  • the spring is fixed with a constant load (b) according to the characteristics of the spring, there is an inconvenience of replacing the spring itself in order to adjust this.
  • VCM voltage-driven load control unit 430
  • the load value to which the semiconductor chip is damaged may vary depending on the material, characteristics, and thickness of the semiconductor chip.
  • VCM it is possible to change the preset load value by adjusting the applied current (or voltage), so if the VCM is used as the load control unit 430, it is not necessary to replace the VCM depending on the semiconductor chip, and more precisely The load applied to the push pin 412 can be adjusted.
  • each semiconductor chip can be transferred to the second substrate at a uniform height.
  • the push pin 412 is formed in a shape with a sharp tip as the cross section becomes narrower as it goes down to the lower end, but a flat portion having a predetermined width is formed at the tip of the push pin 412.
  • a plane parallel to one surface of the first substrate is formed on the flat portion of the push pin 412. Therefore, since the flat portion of the tip portion of the push pin 412 comes into contact with the semiconductor chip, the pressure density between the push pin 412 and the semiconductor chip is reduced compared to the case where the tip portion of the push pin 412 is sharp. It can prevent breakage.
  • the flat portion of the push pin 412 is parallel to one surface of the first substrate, it is possible to prevent the semiconductor chip from being obliquely transferred when the semiconductor chip is transferred to the second substrate.
  • the transfer apparatus 100 further includes a first substrate scanning unit 140, a second substrate scanning unit 150, and a push pin scanning unit 160. I can.
  • the first substrate scanning unit 140 scans the position of the semiconductor chip mounted on the first substrate when the stage 110 is in standby at the ready position.
  • the first substrate scanning unit 140 may scan an arrangement form and an arrangement interval of a plurality of semiconductor chips mounted on the first substrate.
  • the second substrate scanning unit 150 is positioned on the work table 120 and scans the position of the circuit traces disposed on the second substrate.
  • the push pin scan unit 160 periodically scans whether or not the push pin 412 is positioned at the correct position (the center of the push pin housing 414). For example, the push pin scanning unit 160 may scan whether the push pin 412 is positioned at a correct position after the push pin 412 is replaced.
  • the push pin scanning unit 160 scans whether or not the push pin 412 is positioned at a correct position, but is not limited thereto.
  • the push pin scanning unit does not need to be included in the transfer device 100. That is, if the first substrate scan unit 140 can perform all the functions of the push pin scan unit, the push pin scan unit may not be included in the transfer apparatus 100.
  • the transfer device 100 may include a reticle (not shown).
  • the reticle may be used when synchronizing the alignment of the first substrate scan unit 140 and the second substrate scan unit 150. Further, the reticle may be used to synchronize the alignment of the push pin 412 and the first substrate scanning unit 140. And the reticle can be used for automatic calculation of the rotation center of the first and/or second substrate.
  • the push pin 412 provided in the transfer device 100 may be replaced, and when the push pin 412 is replaced, the same process conditions are secured after the push pin 412 is replaced. You need a setting to do it. That is, in order to secure the same process conditions as before even after the push pin 412 is replaced, the separation distance between the push pin housing 414 and the work table 120, which is the lowermost part of the push pin module 130, and the push pin 412 ) And the separation distance between the work table 120 should always be kept the same. In addition, the separation distance between the stage 110 and the work table 120 must also be set according to process conditions.
  • the transfer device 100 includes a separation distance between the push pin housing 414 and the work table 120, a separation distance between the push pin 412 and the work table 120, and the stage 110.
  • the work table 120 may be provided with a sensor 450 for setting the separation distance.
  • the sensor 450 provided in the transfer device 100 may be in the form of a touch sensor, and is installed around the work table 120.
  • the separation distance between the push pin housing 414 and the work table 120 using the sensor 450, the separation distance between the push pin 412 and the work table 120, and the separation between the stage 110 and the work table 120 A method of setting the distance is shown in FIGS. 10 and 11A to 11C.
  • FIG. 10 is a view for explaining a method of setting a sensor and a work table provided in the transfer device according to an embodiment of the present invention.
  • 11A to 11C are views for explaining a method of setting to the same process conditions using a sensor provided in a transfer device according to an embodiment of the present invention.
  • the sensor 450 and the work table 120 are set.
  • the setting jig 460 is disposed on the upper surface of the work table 120, and the height of the sensor 450 is adjusted so that the sensor 450 is touched on the lower surface of the setting jig 460. do.
  • the height of the sensor 450 at this time corresponds to the position of '0'.
  • the setting jig 460 is formed in a flat plate shape, and the setting jig 460 is arranged to be in close contact with the upper surface of the work table 120.
  • the push pin The push pin housing 414 is lowered so that the lower surface of the housing 414 touches the sensor 450.
  • the position of the push pin housing 414 becomes a position of '0' equal to the height of the sensor 450, and the position of '0' can be manually or automatically input to the control unit.
  • the height of the push pin housing 414 may be adjusted based on the position at this time to set the same process conditions.
  • the push pin 412 is The push pin 412 is protruded from the push pin housing 414 so as to touch the sensor 450. At this time, the position of the push pin 412 becomes a position of “0” equal to the height of the sensor 450, and the position of “0” may be manually or automatically input to the control unit. In addition, the height of the push pin 412 may be adjusted based on the position at this time to set the same process conditions.
  • the separation distance between the stage 110 and the work table 120 after moving the stage 110 to the top of the sensor 450 as shown in FIG. 11C, the lower surface of the stage 110 is The work table 120 and the sensor 450 are raised together to touch the sensor 450. At this time, the position of the stage 110 becomes a position of “0” equal to the height of the sensor 450, and the position of “0” may be manually or automatically input to the control unit.
  • the separation distance between the stage 110 and the work table 120 may be set according to the process conditions based on the position at this time.
  • FIG. 12 is a flowchart illustrating a method of transferring a semiconductor chip mounted on a first substrate to a second substrate using a transfer device according to an embodiment of the present invention.
  • a first substrate on which a semiconductor chip is mounted is mounted on the first substrate mounting portion 112 of the stage 110, and the second substrate is mounted on the second substrate mounting portion of the work table 120 ( 122) (S910). Then, the first substrate and the second substrate are aligned.
  • control unit identifies the first substrate containing the semiconductor chips and the second substrate. An input regarding identification is received (S920).
  • the control unit extracts the first substrate-related data and the second substrate-related data from the memory based on the input regarding the identification of the first substrate and the identification of the second substrate (S930).
  • the data related to the second substrate includes the pattern (including position) of the circuit traces on the second substrate, the number of semiconductor chips to be transferred to the circuit traces, and the relative positions of the semiconductor chips and the quality requirements of the semiconductor chips.
  • the data related to the first substrate includes a relative position of the semiconductor chip and a map thereof.
  • control unit determines the initial orientation of the first substrate and the second substrate for transfer of the semiconductor chip (S940).
  • the control unit controls the stage 110 and the work table 120 to move the first substrate and the second substrate to the transfer process position, and the first substrate The first and second substrates are rotated so that the and second substrates have a determined initial orientation (S950).
  • the control unit includes a stage X-axis moving part 113, a stage Y-axis moving part 116, and a first base material rotating means so that the first base material mounting part 112 on which the first base material is mounted is moved and/or rotated. Control (119).
  • control unit includes a work table Z-axis moving part 124, a work table Y-axis moving part 126, and a work table X-axis so that the second base material mounting part 122 on which the second base material is mounted is moved and/or rotated. It controls the moving part 128 and the second base rotation means 129. At this time, the control unit determines the position of the circuit trace to which the semiconductor chip is to be transferred and the semiconductor chip to be transferred from the first substrate.
  • control unit controls the push pin module 130 so that the semiconductor chip mounted on the first substrate is transferred to the second substrate (S960).
  • the process of performing the transfer process by controlling the push pin module 130 is shown in detail in FIG. 13.
  • the first substrate 520 may be, for example, a tape
  • the second substrate 540 may be, for example, a substrate or a circuit board.
  • the push pin module 130 descends to contact a position corresponding to the target semiconductor chip 510 on the other surface of the first substrate 520.
  • the push pin 412 protrudes from the push pin housing 414 toward the other surface of the first substrate 520, so that the target semiconductor chip 510 is transferred to the second substrate 540 Is transferred onto the circuit trace 530.
  • the first substrate 520 is entirely bent downward by the push pin 412, and in some cases, a part of the first substrate 520 may be pierced by the push pin 412.
  • a load is applied to the push pin 412.
  • the load applied to the push pin 412 by the load control unit 430 provided in the push pin module 130 is controlled and maintained by a preset load, and accordingly, the height of the transferred target semiconductor chip 510 is constant. Can be maintained.
  • the first substrate 520 is separated from the target semiconductor chip 510
  • the first substrate 520 is adsorbed to the push pin module 130 using the vacuum unit 416 so that it can be performed.
  • the entire transfer process is not completed by transferring one semiconductor chip, but the transfer of all the semiconductor chips mounted on the first substrate is completed or the semiconductor chip mounted on the first substrate Is completed when there is no more place to transfer to the second substrate. Accordingly, after the transfer of one semiconductor chip is completed, if the entire transfer process is not completed, transfer of the next semiconductor chip is performed.
  • the first substrate seating portion 112 of the stage 110 and the worktable 120 are disposed to transfer the next semiconductor chip. 2
  • the base material seating portion 122 is moved.
  • the first base material receiving part 112 is moved using the stage X-axis moving part 113 and the stage Y-axis moving part 116, and the second base material receiving part 122 is the worktable Y-axis moving part 126
  • the work table is moved using the X-axis moving unit 128.
  • the first substrate mounting portion 112 is positioned on the stage X-axis for transfer of the next semiconductor chip.
  • the moving part 113 is used to move in the X-axis direction, and the second substrate seating part 122 is moved in the Y-axis direction using the worktable Y-axis moving part 126.
  • both the first substrate seating portion 112 and the second substrate seating portion 122 are moved in the same direction (both in the X-axis direction or both in the Y-axis direction), the first substrate seating portion 112 and the second substrate seating portion Since the precision may be degraded due to the impact of the movement of 122, the first substrate seating portion 112 is moved in the X-axis direction, and the second substrate seating portion 122 is moved in the Y-axis direction.
  • the first base material mounting part 112 After performing the transfer process while moving the first base material mounting part 112 in the X-axis direction using the stage X-axis moving part 113 to transfer all the semiconductor chips arranged in the same row, the first base material mounting part After moving 112 by a predetermined distance in the Y-axis direction using the stage Y-axis moving part 116, a transfer process is performed. Then, a transfer process is performed while moving the first substrate seating portion 112 in the X-axis direction using the stage X-axis moving portion 113.
  • the second substrate seating portion 122 also performs a transfer process while moving similarly to the first substrate seating portion 112. After performing the transfer process while moving the second substrate mounting portion 122 in the Y-axis direction using the worktable Y-axis moving portion 126, and after all the semiconductor chips are transferred to the circuit traces arranged in the same row, the second The substrate seating portion 122 is moved by a predetermined distance in the X-axis direction using the work table X-axis moving portion 128 and then a transfer process is performed. Then, a transfer process is performed while moving the second base material seating portion 122 in the Y-axis direction using the work table Y-axis moving portion 126.
  • the first base material is rotated using the first base material rotation means 119. Since the orientation of the semiconductor chip mounted on the first substrate may be slightly different for each semiconductor chip, the first substrate is rotated using the first substrate rotation means 119 according to the orientation of the target semiconductor chip before transferring the semiconductor chip. And rotate precisely.
  • the first base rotation means 119 includes a servo motor and a link section connected to the servo motor.
  • step S960 which is a transfer process, is performed again.
  • the transfer process is terminated, and the push pin module 130 rises away from the first substrate.
  • the semiconductor chip may be a light emitting diode chip.
  • the light emitting diode chip may be classified into a red light emitting diode (red LED) chip, a green light emitting diode (green LED) chip, and a blue light emitting diode (blue LED) chip.
  • red LED red light emitting diode
  • green LED green light emitting diode
  • blue LED blue light emitting diode
  • a red light emitting diode chip, a green light emitting diode chip, and a blue light emitting diode chip must be alternately transferred to a second substrate having a circuit trace.
  • the first substrate on which the red LED chip is mounted is mounted on the stage 110 to perform the transfer process, and the first substrate on which the green LED chip is mounted is placed on the stage 110 to perform the transfer process.
  • the first substrate on which the blue LED chip is mounted may be mounted on the stage 110 to perform a transfer process.
  • the transfer process is performed in the order of a red LED chip, a green LED chip, and a blue LED chip is described, but is not limited thereto, and the order of the LED chips in which the transfer process is performed in the present invention is not limited. .
  • the red LED chip transfer process performed first is that there is no LED chip transferred first to the second substrate, so the transfer process is performed by making the separation distance between the stage 110 and the work table 120 relatively close. can do.
  • the green LED chip transfer process performed next is the transfer process in the state that the red LED chip is present on the second substrate, so that the stage 110 and the worktable 120 are compared with the red LED chip transfer process. The transfer process can be performed by increasing the separation distance a little.
  • the blue light-emitting diode chip transfer process performed last is the transfer process in the state that the red light-emitting diode chip and the green light-emitting diode chip are present on the second substrate, so that the separation distance between the stage 110 and the work table 120 is maximized.
  • FIG. 14 is a flowchart illustrating a method of transferring a semiconductor chip to a second substrate according to another embodiment of the present invention.
  • a preliminary substrate on which a semiconductor chip is mounted on one surface is mounted on a stage 110 waiting at a ready position (S1000).
  • the arrangement interval or position between the semiconductor chips mounted on the preliminary substrate is uneven. Rather than performing the process of directly transferring the semiconductor chips mounted on the preliminary substrate to the second substrate, it is preferable to rearrange the arrangement intervals or positions between the semiconductor chips to be suitable for performing the transfer process and then transfer them to the second substrate. There are cases.
  • step S1000 the first substrate to which the semiconductor chip is to be transferred is mounted on the work table 120.
  • the first substrate scanning unit 140 scans the semiconductor chip mounted on the preliminary substrate. At this time, the first substrate scanning unit 140 scans the position of the semiconductor chip mounted on the preliminary substrate.
  • stage 110 moves to the transfer process position, and the transfer process is performed (S1010).
  • the semiconductor chip is transferred to the first substrate so that the semiconductor chip is synchronized with the arrangement spacing between circuit traces disposed on the second substrate to be finally transferred. That is, through the rearrangement process, an arrangement interval between semiconductor chips mounted on one surface of the first substrate and an arrangement interval between circuit traces arranged on the second substrate are synchronized in advance.
  • the transfer process (S1010) in the rearrangement process is performed in the same manner as described in FIG. 11. That is, the semiconductor chip mounted on the preliminary substrate is pushed by the push pin 412 and transferred to the first substrate, and the load applied to the push pin 412 is a load control unit 430 provided in the push pin module 130 ) Is controlled and maintained by a preset load, and accordingly, the height of the transferred semiconductor chip can be kept constant.
  • step S980 of FIG. 12 the preliminary substrate seated on the stage 110 and the first substrate seated on the work table 120 must be moved to transfer the next semiconductor chip.
  • the stage 110 The movement of the and work table 120 corresponds to step S980 of FIG. 12, and a detailed description refers to step S980 of FIG. 12 and is omitted here.
  • the first substrate on which the semiconductor chip is mounted on one surface is mounted on the stage 110 waiting at the ready position.
  • the second substrate to which the semiconductor chip is to be transferred is seated on the work table 120 (S1020), and the stage 110 and the work table 120 are moved to the transfer process position, and the transfer process is performed (S1030). Since steps S1020 and S1030 correspond to the transfer process described in FIG. 12, a detailed description is referred to FIG. 12 and is omitted herein.
  • the transfer device according to the present invention when a semiconductor chip is transferred using the transfer device according to the present invention, it becomes possible to transfer the semiconductor chip in a short time and with high positional accuracy. In particular, compared to the transfer by the conventional pickup and place method, the time required for the transfer process is significantly reduced.
  • the transfer device according to the present invention is provided with a load control unit, and if it is used, semiconductor chips can be transferred without damage, and a constant load can be applied to all semiconductor chips, so that the transferred semiconductor chips have a uniform height. Can be transferred to.
  • transfer device 110 stage
  • first substrate seating portion 113 stage X-axis moving portion
  • first X-axis actuator 115 second X-axis actuator
  • stage Y-axis moving part 117 first Y-axis actuator
  • first horizontal plate 213 second horizontal plate
  • first out sleeve 320 second out sleeve
  • load adjustment unit 432 VCM stator
  • VCM mover 450 sensor

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Abstract

L'invention concerne un dispositif de transfert pour transférer une puce à semi-conducteur comprenant : un étage ayant une surface sur laquelle est placé un premier substrat sur lequel est montée une puce à semi-conducteur ; une table de travail sur laquelle est placé un second substrat auquel la puce à semi-conducteur doit être transférée ; et un module de broche de pression, qui pousse une partie correspondant à la puce à semi-conducteur sur l'autre surface du premier substrat tandis qu'une surface du premier substrat et du second substrat étant disposées l'une en face de l'autre, ce qui permet de transférer la puce à semi-conducteur au second substrat. Le module de broche de pression comprend : une unité de broche de pression comprenant une broche de pression pour pousser l'autre surface du premier substrat ; et une unité d'ajustement de charge pour ajuster une charge appliquée à la broche de pression lorsque la puce à semi-conducteur est transférée au second substrat.
PCT/KR2020/002375 2019-03-13 2020-02-19 Dispositif de transfert et procédé de transfert de puce à semi-conducteur WO2020184859A1 (fr)

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WO2022154135A1 (fr) * 2021-01-12 2022-07-21 ㈜토니텍 Système de saisie et de placement ayant une efficacité de traitement améliorée

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