WO2023236564A1 - 一种高比表面积高介电性烧结箔的制备方法 - Google Patents

一种高比表面积高介电性烧结箔的制备方法 Download PDF

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WO2023236564A1
WO2023236564A1 PCT/CN2023/074766 CN2023074766W WO2023236564A1 WO 2023236564 A1 WO2023236564 A1 WO 2023236564A1 CN 2023074766 W CN2023074766 W CN 2023074766W WO 2023236564 A1 WO2023236564 A1 WO 2023236564A1
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aluminum
foil
sintered
mixed slurry
powder
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PCT/CN2023/074766
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English (en)
French (fr)
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王建中
濮钰
冒慧敏
程恒洋
李姜红
朱伟晨
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南通海星电子股份有限公司
南通海一电子有限公司
四川中雅科技有限公司
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Priority to KR1020237033722A priority Critical patent/KR20230169955A/ko
Publication of WO2023236564A1 publication Critical patent/WO2023236564A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029—Processes of manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/052—Sintered electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/045—Electrodes or formation of dielectric layers thereon characterised by the material based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/052—Sintered electrodes
    • H01G9/0525—Powder therefor

Definitions

  • the invention relates to the technical field of electrode foil manufacturing, in particular to a method for preparing a high specific surface area and high dielectric sintered foil.
  • Aluminum electrolytic capacitors are widely used in industrial frequency conversion, inverters, 5G base stations, new energy charging piles and other fields. They are an important electronic device. As a key component, the anode foil plays a decisive role in the quality control of aluminum electrolytic capacitors.
  • China's authorized invention patent CN112053849B discloses a preparation method of electrode foil, which specifically includes the following steps: 1) Spread the mixed powder on On the first surface of the base aluminum foil, the mixed powder and the base aluminum foil are hot-rolled together; then the mixed powder is spread on the second surface of the base aluminum foil, and the mixed powder is hot-rolled on the first surface of the base aluminum foil.
  • the mixed powder and the base material aluminum foil are hot-rolled together to obtain a hot-rolled aluminum foil;
  • the mixed powder is composed of high-purity aluminum powder and a solid binder of the powder;
  • the hot-rolled aluminum foil Let it stand for 1 to 5 hours at 300 to 500°C; 3) Sinter the aluminum foil treated in step 3) in a vacuum or inert gas of not less than 500°C and less than 660°C for 2 to 20 hours to obtain a sintered sample; 4)
  • the sintered sample piece is subjected to chemical conversion treatment to obtain the electrode foil.
  • the above preparation process uses aluminum powder or aluminum alloy powder to accumulate and hot-roll to sinter and shape on both sides of the aluminum foil.
  • the present invention relates to a preparation method of a high specific surface area and high dielectric sintered foil, which includes the following steps:
  • step S3 Coat the mixed slurry prepared in step S2 on the surface of the electronic aluminum foil, and then perform a drying process on the electronic aluminum foil to form a mixed slurry pre-sintered body;
  • step S4 Preparation of sintered foil; perform segmented temperature-controlled sintering of the mixed slurry pre-sintered body obtained in step S3 according to the following sintering process to form a sintered layer on the surface of the electronic aluminum foil: at a constant temperature rise rate within a period of 10 to 20 minutes. Raise the temperature to 100 ⁇ 110°C, keep it for 10 ⁇ 20min, then heat it to 400 ⁇ 450°C at a constant heating rate within 3 ⁇ 4h, then keep it for 1 ⁇ 2h, and then heat it up to 500°C at a constant heating rate within 1h. ⁇ 520°C, keep warm for 3 ⁇ 4 hours;
  • step S5. Perform a conversion treatment on the sintered foil obtained in step S4.
  • the aluminum-based powder is preferably pure aluminum powder or aluminum alloy powder with a purity greater than 99.99%;
  • the nitrogen-containing organic matter is preferably thiourea, trisulfide Any one or a mixture of polycyanamine and dicyandiamine.
  • step S1 the equivalent particle size of the ground powder is not greater than 0.1 mm.
  • the organic solvent is preferably any one or a mixture of N-methylpyrrolidone (NMP) and N,N-dimethylformamide (DMF).
  • step S2 before completing the mixing slurry preparation operation by stirring, maleic anhydride-grafted PS and 5-10 maleic anhydride-grafted PS with a weight ratio of 15 to 18 are also mixed into the mixer. weight ratio of antioxidants.
  • step S3 the molding thickness of the mixed slurry pre-sintered body is controlled at 10 to 30 ⁇ m.
  • step S4 during the entire sintering process, the sintering chamber is maintained in a low-oxygen atmosphere, and the oxygen content is less than 0.01%.
  • the sintering chamber is filled with inert gas, or the sintering chamber is evacuated.
  • step S3 before formally executing the coating operation of the mixed slurry prepared in step S2, a surface treatment agent is brushed on the pre-coated surface of the electronic aluminum foil;
  • the surface treatment agent is a silane coupling agent A mixture of linking agents, surfactants, antistatic agents and film-forming agents.
  • silane coupling agents account for 17%; surfactants account for 5%; antistatic agents account for 2%; film-forming agents account for 75%, and the rest are impurities.
  • step S2 also includes step S21.
  • the specific content of step S21 is: perform an electromagnetic stirring operation on the uniformly mixed mixed slurry, lasting 3 to 5 minutes, the stirring frequency is controlled at 90 to 110Hz, the power range is 55 to 60KW, and the magnetic induction intensity at the center of the coil is controlled during the no-load period At 1000 ⁇ 1500A/m.
  • step S3 after the mixed slurry coating operation is completed and before formal solidification, the entire electronic aluminum foil is placed in a high-frequency alternating magnetic field environment, and the frequency is controlled at 15 to 20 Hz. , the magnetic field intensity is not less than 4500A/m.
  • the technical solution disclosed in the present invention has at least achieved the following beneficial effects in specific implementations, specifically:
  • the prepared mixed slurry is coated on the surface of the electronic aluminum foil, and the adhesive mixed therein is used to achieve reliable adhesion with the electrode foil. Subsequently, the mixed slurry pre-sintered body is formed by waiting for a period of time to solidify naturally. In this way, on the one hand, the molding thickness and appearance of the mixed slurry pre-sintered body can be changed by controlling the range, frequency and technique of brushing; on the other hand, the mixed slurry pre-sintered body after curing and molding has very standardized properties. shape, which is conducive to the regularity of sintered foil molding;
  • the generated g-C3N4 can also effectively wrap the aluminum-based powder particles in all directions, which can effectively block the heat conduction path.
  • its high-speed movement avoids the local aggregation of aluminum-based powder particles caused by the deposition effect. (aluminum-based powder agglomerates into large particles), which not only effectively avoids the occurrence of "over-burning" during the sintering process, but also ensures the homogeneity of the aluminum-based powder sintered layer, that is, the content contained in different areas of the sintered layer.
  • the distribution density of aluminum-based powders tends to be consistent.
  • Figure 1 is a metallographic photo of a sintered foil prepared using the existing conventional hot rolling sintering method.
  • Figure 2 is a metallographic photograph of a high specific surface area and high dielectric sintered foil prepared by the method in Example 1.
  • Figure 3 is a metallographic photograph of a high specific surface area and high dielectric sintered foil prepared by the method in Example 2.
  • Figure 4 is a metallographic photograph of a high specific surface area and high dielectric sintered foil prepared by the method in Example 3.
  • Figure 5 is a metallographic photograph of a high specific surface area and high dielectric sintered foil prepared by the method in Example 4.
  • Figure 6 is a metallographic photograph of a high specific surface area and high dielectric sintered foil prepared by the method in Example 5.
  • the preparation method of high specific surface area and high dielectric sintered foil includes the following steps:
  • step S3 Coat the mixed slurry prepared in step S2 on the surface of the electronic aluminum foil, and then perform a drying process on the electronic aluminum foil to form a mixed slurry pre-sintered body; and adjust the molded thickness of the mixed slurry pre-sintered body Control at 10 ⁇ 30 ⁇ m;
  • step S4 Preparation of sintered foil; perform segmented temperature-controlled sintering of the mixed slurry pre-sintered body obtained in step S3 according to the following sintering process to form a sintered layer on the surface of the electronic aluminum foil: 10 ⁇ Heating to 100 ⁇ 110°C at a constant heating rate within a 20min period, holding for 10 ⁇ 20min, then heating to 400 ⁇ 450°C at a constant heating rate within a 3 ⁇ 4h period, then maintaining for 1 ⁇ 2h, and then for a 1h period The temperature is raised to 500 ⁇ 520°C at a constant heating rate and maintained for 3 ⁇ 4 hours;
  • step S5. Perform a conversion treatment on the sintered foil obtained in step S4.
  • the voltage resistance performance of the sintered foil can reach 537.3V
  • the specific volume can reach 1.060 ⁇ F ⁇ cm -2
  • the CV performance can reach 569.5 ⁇ F ⁇ V ⁇ cm -2
  • the average particle size is controlled below 2.91 ⁇ m.
  • the porosity reaches 22.5%.
  • the generated g-C3N4 can also form an all-round package for the aluminum-based powder particles to block the heat conduction path between the aluminum-based powder particles, and the aluminum-based powder particles are blown by the overflow gas.
  • step S4 a segmented temperature control method is adopted to complete the preparation of the sintered foil.
  • the 100-110°C stage can fully evaporate the water contained in the mixed slurry, which is conducive to ensuring that the mixed slurry is pre-prepared.
  • the preparation method of high specific surface area and high dielectric sintered foil includes the following steps:
  • step S3 Coat the mixed slurry prepared in step S2 on the surface of the electronic aluminum foil, and then perform a drying process on the electronic aluminum foil to form a mixed slurry pre-sintered body; and adjust the molded thickness of the mixed slurry pre-sintered body Control at 10 ⁇ 30 ⁇ m;
  • step S4 Preparation of sintered foil; perform segmented temperature-controlled sintering of the mixed slurry pre-sintered body obtained in step S3 according to the following sintering process to form a sintered layer on the surface of the electronic aluminum foil: at a constant temperature rise rate within a period of 10 to 20 minutes. Raise the temperature to 100 ⁇ 110°C, keep it for 10 ⁇ 20min, then heat it to 400 ⁇ 450°C at a constant heating rate within 3 ⁇ 4h, then keep it for 1 ⁇ 2h, and then heat it up to 500°C at a constant heating rate within 1h. ⁇ 520°C, keep warm for 3 ⁇ 4 hours;
  • step S5. Perform a conversion treatment on the sintered foil obtained in step S4.
  • the voltage resistance performance of the sintered foil can reach 538.2V
  • the specific volume can reach 1.15 ⁇ F ⁇ cm -2
  • the CV performance can reach 572 ⁇ F ⁇ V ⁇ cm -2
  • the average particle size is controlled below 2.87 ⁇ m
  • the porosity reaches 24.7%.
  • the CV performance and porosity of the sintered foil are greatly improved.
  • the reason is that a certain amount of maleic anhydride-grafted PS and antioxidant are mixed in the mixing and preparation of the mixed slurry. .
  • the presence of antioxidants can effectively prevent the oxidation of the mixed slurry when it comes into contact with air, and the presence of maleic anhydride-grafted PS can effectively improve the compatibility and cross-linking coupling between pure aluminum powder and the adhesive. This not only effectively ensures that the mixed slurry always maintains good high fluidity and homogeneity before being painted, but also facilitates the distribution density of the mixed slurry relative to the pure aluminum powder in each area after electronic aluminum foil coating. is consistent, and can also improve the aluminum The bonding strength between the base powder sintered layer and the electronic aluminum foil.
  • the preparation method of high specific surface area and high dielectric sintered foil includes the following steps:
  • step S3 Coat the mixed slurry prepared in step S2 on the surface of the electronic aluminum foil, and then perform a drying process on the electronic aluminum foil to form a mixed slurry pre-sintered body; and adjust the molded thickness of the mixed slurry pre-sintered body Control at 10 ⁇ 30 ⁇ m;
  • the mixed slurry pre-sintered body obtained in step S3 is sintered at a controlled temperature in stages according to the following sintering process to form a sintered layer on the surface of the electronic aluminum foil.
  • the sintering chamber is filled with inert gas (nitrogen or helium) to ensure that the oxygen content during the period is less than 0.01%.
  • temperature-raising sintering is carried out according to the following temperature curve: heating to 100-110°C at a constant heating rate within a period of 10-20 minutes, holding for 10-20 minutes, and then heating to 400-450°C at a constant heating rate within a period of 3-4 hours. Subsequently, the temperature is maintained for 1 to 2 hours, and then the temperature is raised to 500 to 520°C at a constant heating rate within a period of 1 hour, and the heat preservation is maintained for 3 to 4 hours;
  • step S5. Perform a conversion treatment on the sintered foil obtained in step S4.
  • the voltage resistance performance of the sintered foil can reach 536.8V
  • the specific volume can reach 1.17 ⁇ F ⁇ cm -2
  • the CV performance can reach 571 ⁇ F ⁇ V ⁇ cm -2
  • the average particle size is controlled below 2.85 ⁇ m
  • the porosity reaches 25.6%.
  • the specific volume performance and porosity of the sintered foil are greatly improved, while the CV performance, pressure resistance performance and average particle size are not significantly different.
  • the preparation method of high specific surface area and high dielectric sintered foil includes the following steps:
  • the surface treatment agent is a mixture of silane coupling agent, surfactant, antistatic agent and film-forming agent. According to the weight ratio, silane coupling agents account for 17%; surfactants account for 5%; antistatic agents account for 2%; film-forming agents account for 75%, and the rest are impurities.
  • the mixed slurry prepared in step S2 is coated on the surface of the electronic aluminum foil, and then the electronic aluminum foil is dried to form a mixed slurry pre-sintered body; and the thickness of the mixed slurry pre-sintered body is controlled to 10 ⁇ 30 ⁇ m;
  • the mixed slurry pre-sintered body obtained in step S3 is sintered at a controlled temperature in stages according to the following sintering process to form a sintered layer on the surface of the electronic aluminum foil.
  • the sintering chamber is filled with inert gas (nitrogen or helium) to ensure that the oxygen content during the period is less than 0.01%.
  • temperature-raising sintering is carried out according to the following temperature curve: heating to 100-110°C at a constant heating rate within a period of 10-20 minutes, holding for 10-20 minutes, and then heating to 400-450°C at a constant heating rate within a period of 3-4 hours. Subsequently, the temperature is maintained for 1 to 2 hours, and then the temperature is raised to 500 to 520°C at a constant heating rate within a period of 1 hour, and the heat preservation is maintained for 3 to 4 hours;
  • step S5. Perform a conversion treatment on the sintered foil obtained in step S4.
  • the voltage resistance performance of the sintered foil can reach 545.2V, the specific volume can reach 1.16 ⁇ F ⁇ cm -2 , the CV performance can reach 571.2 ⁇ F ⁇ V ⁇ cm -2 , and the average particle size is controlled below 2.84 ⁇ m. And the porosity reaches 25.8%.
  • the voltage resistance performance of the sintered foil has been greatly improved, while the other performance parameters remain basically unchanged.
  • the surface treatment agent is applied in advance to generate multiple chemically active groups on the surface of the electronic aluminum foil, which facilitates the adhesion of the mixed slurry on the surface of the electronic aluminum foil and subsequent molding.
  • it can Effectively improve the bonding strength between the sintered layer and the outer surface of the electronic aluminum foil, which can prevent the pure aluminum powder from slipping when it is subjected to pressure; on the other hand, it effectively eliminates the "sag" phenomenon caused by insufficient bonding force. occurs to ensure that the sintered layer has good molding regularity.
  • the preparation method of high specific surface area and high dielectric sintered foil includes the following steps:
  • the stirring frequency is controlled at 90 to 110Hz
  • the power range is 55 to 60KW
  • the magnetic induction intensity at the center of the coil during the no-load period is controlled at 1000 to 1500A/m. .
  • the surface treatment agent is a mixture of silane coupling agent, surfactant, antistatic agent and film-forming agent. According to the weight ratio, silane coupling agents account for 17%; surfactants account for 5%; antistatic agents account for 2%; film-forming agents account for 75%, and the rest are impurities.
  • the mixed slurry prepared in step S2 is coated on the surface of the electronic aluminum foil, and then the electronic aluminum foil is dried to form a mixed slurry pre-sintered body; and the thickness of the mixed slurry pre-sintered body is controlled to 10 ⁇ 30 ⁇ m;
  • the electronic aluminum foil is placed in a high-frequency alternating magnetic field environment, and the frequency is controlled at 15-20Hz, and the magnetic field strength is not less than 4500A/m.
  • step S4 Preparation of sintered foil; sinter the mixed slurry presintered body obtained in step S3 as follows:
  • the sintering process carries out segmented temperature-controlled sintering to form a sintered layer on the surface of the electronic aluminum foil.
  • the sintering chamber is filled with inert gas (nitrogen or helium) to ensure that the oxygen content during the period is less than 0.01%.
  • temperature-raising sintering is carried out according to the following temperature curve: heating to 100-110°C at a constant heating rate within a period of 10-20 minutes, holding for 10-20 minutes, and then heating to 400-450°C at a constant heating rate within a period of 3-4 hours. Subsequently, the temperature is maintained for 1 to 2 hours, and then the temperature is raised to 500 to 520°C at a constant heating rate within a period of 1 hour, and the heat preservation is maintained for 3 to 4 hours;
  • step S5. Perform a conversion treatment on the sintered foil obtained in step S4.
  • the voltage resistance performance of the sintered foil can reach 545.1V
  • the specific volume can reach 1.23 ⁇ F ⁇ cm -2
  • the CV performance can reach 574.1 ⁇ F ⁇ V ⁇ cm -2
  • the average particle size is controlled below 2.45 ⁇ m.
  • the porosity reaches 27.2%.
  • the specific volume performance, CV performance, average particle size and porosity of the sintered foil are greatly improved.
  • step S2 an additional electromagnetic stirring operation is added to the mixed slurry after preparation, which can not only effectively improve the mixing uniformity of the mixed slurry, but also continuously stir between pure aluminum powder particles during the high-speed magnetic disturbance process. Contact, separation, and friction cause charges to accumulate on their outer surfaces. And in the subsequent pre-coating process, under the high-frequency alternating magnetic field environment, the charged pure aluminum powder particles are always acted upon by the Lorentz force, and the direction of the force is switched in real time, so that they are not in direct contact with the mixed slurry.
  • the prepared mixed slurry coating It is coated on the surface of the electronic aluminum foil, and the adhesive mixed in it is used to achieve reliable adhesion with the electrode foil. Then, the mixed slurry pre-sintered body is formed by waiting for a period of time to solidify naturally. In this way, on the one hand, the molded thickness and appearance of the mixed slurry pre-sintered body can be changed by controlling the range, frequency and technique of brushing; on the other hand, the mixed slurry after curing and molding The pre-sintered body has a very standardized shape, which is conducive to the regularity of sintered foil molding.
  • pure aluminum powder is used as the component of the sintered layer on the sintered foil.
  • aluminum is selected according to the specific needs of the customer, the performance parameters of the sintered foil, and the application fields.
  • the preparation process route of alloy powder is basically the same, and only the grinding parameters, stirring parameters, sintering parameters, etc. need to be fine-tuned appropriately.
  • Table 1 is a summary of the performance test results of the sintered foils obtained in Examples 1 to 5.

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Abstract

本发明涉及高比表面积高介电性烧结箔的制备方法，步骤如下：对铝基粉末和含氮有机物执行混合研磨操作；将研磨粉末、有机溶剂以及粘合剂按比例投喂至搅拌器中；将混合浆料涂覆于电子铝箔上，而后执行烘干处理；对混合浆料预烧结体执行分段控温烧结操作。在制备进程中，含氮有机物因受到高温作用而分解出g-C3N4，且伴着大量气体。g-C3N4可对铝基粉末进行全包裹，以阻断热量传导路径，从而避免了铝基粉末因局部聚集而引发"过烧"问题的出现；而气体的持续外溢行为可使得铝基粉末在烧结工艺正式实施前始终维持于高速运动状态，从而增加铝基粉末之间所形成空隙的大小和空隙数量，最终确保烧结箔具有较高的孔隙率、介电性能以及电容量。

Description

一种高比表面积高介电性烧结箔的制备方法 技术领域
本发明涉及电极箔制造技术领域，尤其是一种高比表面积高介电性烧结箔的制备方法。
背景技术
铝电解电容器被广泛应用在工业变频、逆变器、5G基站、新能源充电桩等领域，是一种重要的电子器件。阳极箔作为其中的关键组成部分，对铝电解电容器的质量控制具有决定性作用。
目前国内的高压阳极箔制造大多采用腐蚀工艺，需要用到硫酸-盐酸体系对铝箔进行化学腐蚀或者电化学腐蚀，在铝箔表面生成一定密度的隧道孔，以增大其比表面积。该种方法已被众多学者广为研究，其比表面积提升已接近理论极限，同时在利用硫酸-盐酸体系生产的同时会产生大量废酸，极易引发环境污染现象。
近些年来，出于保护环境方面考虑，部分厂家研发出了新型工艺，例如：中国发明授权专利CN112053849B公开了一种电极箔的制备方法，具体包括以下步骤：1)将混合粉料铺覆在基材铝箔的第一表面上，通过热轧将所述的混合粉料与基材铝箔热轧在一起后；再将混合粉料铺覆在基材铝箔的第二表面上，通过热轧将所述的混合粉料与基材铝箔热轧在一起，得热轧后的铝箔；所述的混合粉料由高纯铝粉和粉末的固体粘结剂组成；2)将热轧后的铝箔在300～500℃下，静置1～5h；3)将步骤3)处理后的铝箔在不小于500℃、小于660℃的真空或者惰性气体中，烧结2～20h，得烧结样片；4)将所述的烧结样片进行化成处理，即得到所述的电极箔。上述制备工艺利用铝粉或者铝合金粉末堆积、热轧以在铝箔的两侧烧结成型，具有极高的工业应用价值，且整个制备过程中无废酸、废液生成，对环境友好，然而亦存在有以下问题：1)在烧结的过程中极易发生过烧现象，且各区域烧结颗粒度极为不均，究其原因在于，铝粉或者铝合金粉末被完全压实，外部加热时温度传导进程以及升温速 率不可控，从而导致部分铝粉或者铝合金粉末局部过热，附带地引发局部区域内铝粉或者铝合金粉末因超前熔融而团聚在一起现象；2)相较于传统的腐蚀电极箔，所制备的烧结电极箔其孔隙率提升相对有限，严重地限制了其介电性能的进一步提升。因而，亟待技术人员解决上述问题。
发明内容
故，本发明设计人员鉴于上述现有的问题以及缺陷，乃搜集相关资料，经由多方的评估及考量，并经过从事于此行业的多年研发经验技术人员的不断实验以及修改，最终导致该高比表面积高介电性烧结箔的制备方法的出现。
为了解决上述技术问题，本发明涉及了一种高比表面积高介电性烧结箔的制备方法，其包括以下步骤：
S1、研磨粉末的制备；对铝基粉末和含氮有机物执行混合研磨操作，且铝基粉末与含氮有机物的质量比控制在2:1～2.5:1；
S2、混合浆料的制备；将步骤S1中所制备的100重量比的研磨粉末、30～50重量比的有机溶剂以及10～15重量比的粘合剂投喂至搅拌器中，直至混合均匀；
S3、将步骤S2中所制备的混合浆料涂覆于电子铝箔的表面上，而后对电子铝箔执行烘干处理以成型出混合浆料预烧结体；
S4、烧结箔的制备；将步骤S3中所得混合浆料预烧结体按照如下烧结工艺进行分段控温烧结，以在电子铝箔的表面成型出烧结层：10～20min时间段内以恒定升温速率升温至100～110℃，保温10～20min，而后3～4h时间段内以恒定升温速率升温至400～450℃，随后，保温1～2h，再然后1h时间段内以恒定升温速率升温至500～520℃，维持保温3～4h；
S5、将步骤S4中所得烧结箔执行化成处理。
作为本发明技术方案的进一步改进，在步骤S1中，铝基粉末优选为纯度大于99.99％的纯铝粉或者铝合金粉末；含氮有机物优选为硫脲、三 聚氰胺、二氰二胺中任一种或几种的混合。
作为本发明技术方案的进一步改进，在步骤S1中，研磨粉末的等效粒径不大于0.1mm。
作为本发明技术方案的进一步改进，在步骤S2中，有机溶剂优选为N-甲基吡咯烷酮(NMP)、N,N-二甲基甲酰胺(DMF)中任一种或几种的混合。
作为本发明技术方案的更进一步改进，在步骤S2中，预通过搅拌方式以完成混合浆料制备操作前，搅拌器内还混入有15～18重量比的马来酸酐接枝PS和5～10重量比的抗氧剂。
作为本发明技术方案的进一步改进，在步骤S3中，混合浆料预烧结体的成型厚度控制在10～30μm。
作为本发明技术方案的进一步改进，在步骤S4中，在整个烧结进程中，烧结室内保持于低氧氛围，氧气含量低于0.01％。
作为本发明技术方案的更进一步改进，正式烧结前，向着烧结室充满惰性气体，或对烧结室执行抽真空处理。
作为本发明技术方案的进一步改进，在步骤S3中，正式执行涂覆步骤S2中所制备的混合浆料操作前，在电子铝箔的预涂覆面刷涂表面处理剂；表面处理剂为硅烷类偶联剂、表面活性剂、抗静电剂以及成膜剂的混合物。
作为本发明技术方案的更进一步改进，按照重量比，硅烷类偶联剂占17％；表面活性剂占5％；抗静电剂占2％；成膜剂占75％，其余为杂质。
作为本发明技术方案的更进一步改进，步骤S2还包括有步骤S21。步骤S21具体内容为：将混合均匀后的混合浆料执行电磁搅拌操作，持续时长3～5min，搅拌频率控制在90～110Hz，功率范围为55～60KW，且空载时段线圈中心的磁感应强度控制在1000～1500A/m。
作为本发明技术方案的更进一步改进，在步骤S3中，待混合浆料涂覆操作完成后，正式固化前，将电子铝箔整体置于高频交变磁场环境中，且频率控制在15～20Hz,磁场强度不小于4500A/m。
相较于常规的铝基粉末热轧成型、且高温烧结电极箔的制备工艺，在本发明所公开的技术方案在具体实施中至少取得了以下几方面的有益效果，具体为：
1)所制备的混合浆料涂覆于电子铝箔的表面上，借以其中混合的粘合剂以实现与电极箔的可靠黏附，后续通过等待一段时间自然地固化成型出混合浆料预烧结体。如此，一方面，通过控制所刷涂范围、次数以及手法的不同即可改变混合浆料预烧结体的成型厚度、外观；另一方面，固化成型后的混合浆料预烧结体具有十分规范的外形，进而利于实现烧结箔成型的规整性；
2)在烧结进程中，含氮有机物在高温作用下而原位分解出g-C3N4,且伴随着的大量气体的生成，且这些大量气体在烧结过程中持续地、缓慢地释放、溢出，使得铝基粉末颗粒在烧结工艺正式实施前始终维持于高速运动状态，进而而使得铝基粉末之间空隙的大小和空隙数量均得到提升，利于确保烧结箔孔隙率、介电性能以及电容量的进一步提升；
3)生成的g-C3N4还可对铝基粉末颗粒形成有效地全方位包裹，可有效地阻断热量传导路径，加之其自身高速运动避免了铝基粉末颗粒因沉积效应而引起的局部聚集现象的发生(铝基粉末团聚为大颗粒体)，不但有效地避免烧结进程中“过烧”现象的发生，而且还确保了铝基粉末烧结层的匀质性，即烧结层中不同区域所含有铝基粉末的分布密度趋于一致。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是采用现有常规热轧烧结方法所制备烧结箔的金相照片。
图2是采用实施例1中方法所制备高比表面积高介电性烧结箔的金相照片。
图3是采用实施例2中方法所制备高比表面积高介电性烧结箔的金相照片。
图4是采用实施例3中方法所制备高比表面积高介电性烧结箔的金相照片。
图5是采用实施例4中方法所制备高比表面积高介电性烧结箔的金相照片。
图6是采用实施例5中方法所制备高比表面积高介电性烧结箔的金相照片。
具体实施方式
为了加深对本发明的理解，下面将结合实施例对本发明作进一步详述，该实施例仅用于解释本发明，并不构成对本发明保护范围的限定。所述方法无特别说明的均为常规方法。
实施例1
高比表面积高介电性烧结箔的制备方法包括以下步骤：
S1、研磨粉末的制备；对纯度大于99.99％的纯铝粉和硫脲执行混合研磨操作，且纯铝粉与硫脲的质量比控制在2:1；对研磨粉末执行过筛处理，确保研磨粉末经筛选后其等效粒径不大于0.1mm。
S2、混合浆料的制备；将步骤S1中所制备的100重量比的研磨粉末、30～50重量比的N-甲基吡咯烷酮(NMP)以及10～15重量比的粘合剂投喂至搅拌器中，直至混合均匀；
S3、将步骤S2中所制备的混合浆料涂覆于电子铝箔的表面上，而后对电子铝箔执行烘干处理以成型出混合浆料预烧结体；且将混合浆料预烧结体的成型厚度控制在10～30μm；
S4、烧结箔的制备；将步骤S3中所得混合浆料预烧结体按照如下烧结工艺进行分段控温烧结，以在电子铝箔的表面成型出烧结层：10～ 20min时间段内以恒定升温速率升温至100～110℃，保温10～20min，而后3～4h时间段内以恒定升温速率升温至400～450℃，随后，保温1～2h，再然后1h时间段内以恒定升温速率升温至500～520℃，维持保温3～4h；
S5、将步骤S4中所得烧结箔执行化成处理。
经过具体实验结果论证，烧结箔的耐压性能可以达到537.3V，比容可达1.060μF·cm-2，CV性能可达569.5μF·V·cm-2，平均粒径控制于2.91μm以下，且孔隙率达到22.5％。
究其原因在于：在烧结进程中，含氮有机物在高温作用下原位分解出g-C3N4,且伴随着大量气体的生成。且这些气体在烧结过程中持续地、缓慢地溢出，从而使得铝基粉末之间空隙的大小和空隙数量均得到提升，利于确保烧结箔孔隙率、介电性能以及电容量等参数的进一步提升。
在烧结箔实际制备进程中，所生成的g-C3N4还可对铝基粉末颗粒形成全方位包裹，以阻断铝基粉末颗粒间的热传导路径，且铝基粉末颗粒受到外溢气体吹拂力作用而在烧结工艺正式实施前始终维持于高速运动状态，避免了铝基粉末颗粒因沉积效应而引起的局部聚集现象的发生(铝基粉末团聚为大颗粒体)，不但有效地避免烧结进程中“过烧”现象的发生，而且还确保了铝基粉末烧结层的匀质性，即烧结层中不同区域所含有铝基粉末的分布密度趋于一致。
另外，还需着重说明一点，在步骤S4中，采取分段控温方式以完成烧结箔的制备，其中，100～110℃阶段可以使得混合浆料所含水分充分蒸发，利于确保混合浆料预烧结体被热量输入后热量传递的均匀性；400～450℃阶段不但可对电子铝箔进行提前预热，以避免后期因受热不均而引起的纯铝粉烧结层附着力低下或烧结裂纹问题的出现，而且还有利于混合浆料预烧结体因高温而充分地分解出有机气体，且持续至500～520℃烧结阶段。
实施例2
高比表面积高介电性烧结箔的制备方法包括以下步骤：
S1、研磨粉末的制备；对纯度大于99.99％的纯铝粉和硫脲执行混合研磨操作，且纯铝粉与硫脲的质量比控制在2:1；对研磨粉末执行过筛处理，确保研磨粉末经筛选后其等效粒径不大于0.1mm。
S2、混合浆料的制备；将步骤S1中所制备的100重量比的研磨粉末、30～50重量比的N-甲基吡咯烷酮(NMP)、10～15重量比的粘合剂、15～18重量比的马来酸酐接枝PS以及5～10重量比的抗氧剂投喂至搅拌器中，直至混合均匀；
S3、将步骤S2中所制备的混合浆料涂覆于电子铝箔的表面上，而后对电子铝箔执行烘干处理以成型出混合浆料预烧结体；且将混合浆料预烧结体的成型厚度控制在10～30μm；
S4、烧结箔的制备；将步骤S3中所得混合浆料预烧结体按照如下烧结工艺进行分段控温烧结，以在电子铝箔的表面成型出烧结层：10～20min时间段内以恒定升温速率升温至100～110℃，保温10～20min，而后3～4h时间段内以恒定升温速率升温至400～450℃，随后，保温1～2h，再然后1h时间段内以恒定升温速率升温至500～520℃，维持保温3～4h；
S5、将步骤S4中所得烧结箔执行化成处理。
经过具体实验结果论证，烧结箔的耐压性能可以达到538.2V，比容可达1.15μF·cm-2，CV性能可达572μF·V·cm-2，平均粒径控制于2.87μm以下，且孔隙率达到24.7％。
相较于第一种实施例，烧结箔的CV性能和孔隙率均有大幅度提升，究其原因在于：在混合浆料搅拌制备中混入了一定量的马来酸酐接枝PS和抗氧剂。抗氧剂的存在可有效地防止混合浆料在与空气发生接触时发生氧化现象，且马来酸酐接枝PS的存在可以有效地提高纯铝粉与粘合剂的相容性、交联耦合性，如此，不但有效地确保了混合浆料在被刷涂前始终保持有良好的高流动性和均质性，利于混合浆料相对于电子铝箔涂覆后各区域内纯铝粉分布密度趋于一致，而且还可在一定程度上提升铝 基粉末烧结层与电子铝箔的结合强度。
实施例3
高比表面积高介电性烧结箔的制备方法包括以下步骤：
S1、研磨粉末的制备；对纯度大于99.99％的纯铝粉和硫脲执行混合研磨操作，且纯铝粉与硫脲的质量比控制在2:1；对研磨粉末执行过筛处理，确保研磨粉末经筛选后其等效粒径不大于0.1mm。
S2、混合浆料的制备；将步骤S1中所制备的100重量比的研磨粉末、30～50重量比的N-甲基吡咯烷酮(NMP)以及10～15重量比的粘合剂投喂至搅拌器中，直至混合均匀；
S3、将步骤S2中所制备的混合浆料涂覆于电子铝箔的表面上，而后对电子铝箔执行烘干处理以成型出混合浆料预烧结体；且将混合浆料预烧结体的成型厚度控制在10～30μm；
S4、烧结箔的制备；将步骤S3中所得混合浆料预烧结体按照如下烧结工艺进行分段控温烧结，以在电子铝箔的表面成型出烧结层。在正式烧结前，向着烧结室内充满惰性气体(氮气或氦气)，确保期内氧气含量低于0.01％。而后依照下述温度曲线进行升温烧结：10～20min时间段内以恒定升温速率升温至100～110℃，保温10～20min，而后3～4h时间段内以恒定升温速率升温至400～450℃，随后，保温1～2h，再然后1h时间段内以恒定升温速率升温至500～520℃，维持保温3～4h；
S5、将步骤S4中所得烧结箔执行化成处理。
经过具体实验结果论证，烧结箔的耐压性能可以达到536.8V，比容可达1.17μF·cm-2，CV性能可达571μF·V·cm-2，平均粒径控制于2.85μm以下，且孔隙率达到25.6％。相较于第二种实施例，烧结箔的比容性能和孔隙率均有大幅度提升，而CV性能、耐压性能以及平均粒径差别不大，
究其原因在于：氮气或氦气等惰性气体的存在可以有效地预防氧气直接与纯铝粉粉末相接触，进而避免了烧结进程中纯铝粉粉末而被氧化为氧化铝现象的发生，确保了烧结箔的高纯性，最终为烧结箔的比容性能和孔隙率的大幅度提升作了良好的铺垫。
在此需要说明的是，除了可以向着烧结室中充入惰性气体的方式以降低氧气含量，亦可以采取抽真空方式实现，且真空度宜控制在-0.2Mpa以下。
实施例4
高比表面积高介电性烧结箔的制备方法包括以下步骤：
S1、研磨粉末的制备；对纯度大于99.99％的纯铝粉和硫脲执行混合研磨操作，且纯铝粉与硫脲的质量比控制在2:1；对研磨粉末执行过筛处理，确保研磨粉末经筛选后其等效粒径不大于0.1mm。
S2、混合浆料的制备；将步骤S1中所制备的100重量比的研磨粉末、30～50重量比的N-甲基吡咯烷酮(NMP)以及10～15重量比的粘合剂投喂至搅拌器中，直至混合均匀；
S3、在电子铝箔的预涂覆面刷涂表面处理剂；表面处理剂为硅烷类偶联剂、表面活性剂、抗静电剂以及成膜剂的混合物。且按照重量比，硅烷类偶联剂占17％；表面活性剂占5％；抗静电剂占2％；成膜剂占75％，其余为杂质。将步骤S2中所制备的混合浆料涂覆于电子铝箔的表面上，而后对电子铝箔执行烘干处理以成型出混合浆料预烧结体；且将混合浆料预烧结体的成型厚度控制在10～30μm；
S4、烧结箔的制备；将步骤S3中所得混合浆料预烧结体按照如下烧结工艺进行分段控温烧结，以在电子铝箔的表面成型出烧结层。在正式烧结前，向着烧结室内充满惰性气体(氮气或氦气)，确保期内氧气含量低于0.01％。而后依照下述温度曲线进行升温烧结：10～20min时间段内以恒定升温速率升温至100～110℃，保温10～20min，而后3～4h时间段内以恒定升温速率升温至400～450℃，随后，保温1～2h，再然后1h时间段内以恒定升温速率升温至500～520℃，维持保温3～4h；
S5、将步骤S4中所得烧结箔执行化成处理。
经过具体实验结果论证，烧结箔的耐压性能可以达到545.2V，比容可达1.16μF·cm-2，CV性能可达571.2μF·V·cm-2，平均粒径控制于2.84μm以下，且孔隙率达到25.8％。相较于第三种实施例，烧结箔的耐压性能 得到大幅度地提升，而其余性能参数基本不变。
究其原因在于：预先刷涂表面处理剂方式，以在电子铝箔的表面上生成有多个化学活性基团，利于混合浆料在电子铝箔表面上粘附以及后续成型，如此，一方面，可有效地提升烧结层与电子铝箔外表面的结合强度，可提升纯铝粉末受到压力作用时而侧滑现象的发生；另一方面，有效地杜绝了因结合力不足因引发的“流挂”现象的发生，确保烧结层具有良好的成型规整性。
实施例5
高比表面积高介电性烧结箔的制备方法包括以下步骤：
S1、研磨粉末的制备；对纯度大于99.99％的纯铝粉和硫脲执行混合研磨操作，且纯铝粉与硫脲的质量比控制在2:1；对研磨粉末执行过筛处理，确保研磨粉末经筛选后其等效粒径不大于0.1mm。
S2、混合浆料的制备；将步骤S1中所制备的100重量比的研磨粉末、30～50重量比的N-甲基吡咯烷酮(NMP)以及10～15重量比的粘合剂投喂至搅拌器中，直至混合均匀；
将混合均匀后的混合浆料执行电磁搅拌操作，持续时长3～5min，搅拌频率控制在90～110Hz，功率范围为55～60KW，且空载时段线圈中心的磁感应强度控制在1000～1500A/m。
S3、在电子铝箔的预涂覆面刷涂表面处理剂；表面处理剂为硅烷类偶联剂、表面活性剂、抗静电剂以及成膜剂的混合物。且按照重量比，硅烷类偶联剂占17％；表面活性剂占5％；抗静电剂占2％；成膜剂占75％，其余为杂质。将步骤S2中所制备的混合浆料涂覆于电子铝箔的表面上，而后对电子铝箔执行烘干处理以成型出混合浆料预烧结体；且将混合浆料预烧结体的成型厚度控制在10～30μm；
需要注意的是，待混合浆料涂覆操作完成后，正式固化前，将电子铝箔整体置于高频交变磁场环境中，且频率控制在15～20Hz,磁场强度不小于4500A/m。
S4、烧结箔的制备；将步骤S3中所得混合浆料预烧结体按照如下烧 结工艺进行分段控温烧结，以在电子铝箔的表面成型出烧结层。在正式烧结前，向着烧结室内充满惰性气体(氮气或氦气)，确保期内氧气含量低于0.01％。而后依照下述温度曲线进行升温烧结：10～20min时间段内以恒定升温速率升温至100～110℃，保温10～20min，而后3～4h时间段内以恒定升温速率升温至400～450℃，随后，保温1～2h，再然后1h时间段内以恒定升温速率升温至500～520℃，维持保温3～4h；
S5、将步骤S4中所得烧结箔执行化成处理。
经过具体实验结果论证，烧结箔的耐压性能可以达到545.1V，比容可达1.23μF·cm-2，CV性能可达574.1μF·V·cm-2，平均粒径控制于2.45μm以下，且孔隙率达到27.2％。相较于第四种实施例，烧结箔的比容性能、CV性能、平均粒径以及孔隙率均得到大幅度地提升。
究其原因在于：在步骤S2中，针对制备完成后混合浆料额外附加电磁搅拌操作，不但可有效地提升混合浆料的混合均匀性，而且在高速磁性扰动进程中纯铝粉颗粒间不断的接触、分离、相互摩擦以使得电荷在其外表面聚集。且在随后的预涂进程中，高频交变磁场环境下，带电的纯铝粉颗粒始终受到洛伦兹力作用，且受力方向实时转换，从而在非与混合浆料直接接触的前提下可有效地避免因其受到自身重力影响而底部沉积现象的发生，且纯铝粉颗粒在洛伦兹力作用下持续地高频激振，确保成型后混合浆料预烧结体其各区域内纯铝粉分布密度及均匀性趋于一致，从而有效地杜绝了因局部聚集而引发的过烧现象，确保烧结箔具有优良的应用性能(且具体体现在比容性能、CV性能、平均粒径以及孔隙率等方面)。
在此还需要说明的是，无论是针对第一种实施例、第二种实施例、第三种实施例、第四中实施例，抑或是第五种实施例，所制备的混合浆料涂覆于电子铝箔的表面上，借以其中混合的粘合剂以实现与电极箔的可靠黏附，后续通过等待一段时间自然地固化成型出混合浆料预烧结体。如此，一方面，通过控制所刷涂范围、次数以及手法的不同即可改变混合浆料预烧结体的成型厚度、外观；另一方面，固化成型后的混合浆料 预烧结体具有十分规范的外形，进而利于实现烧结箔成型的规整性。另外，在实施上述五种实施例进程中，均以纯铝粉作为烧结箔上烧结层组分，当然，在实际生产制造中，根据客户具体需求、对烧结箔性能参数以及应用领域的不同选择铝合金粉末，制备工艺路线基本一致，仅需对研磨参数、搅拌参数、烧结参数等适当微调即可。
表1是实施例1～5得到的烧结箔的性能测试结果汇总
表1
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (12)

  1. 一种高比表面积高介电性烧结箔的制备方法，其特征在于，包括以下步骤：
    S1、研磨粉末的制备；对铝基粉末和含氮有机物执行混合研磨操作，且铝基粉末与含氮有机物的质量比控制在2:1～2.5:1；
    S2、混合浆料的制备；将步骤S1中所制备的100重量比的研磨粉末、30～50重量比的有机溶剂以及10～15重量比的粘合剂投喂至搅拌器中，直至混合均匀；
    S3、将步骤S2中所制备的混合浆料涂覆于电子铝箔的表面上，而后对电子铝箔执行烘干处理以成型出混合浆料预烧结体；
    S4、烧结箔的制备；将步骤S3中所得混合浆料预烧结体按照如下烧结工艺进行分段控温烧结，以在电子铝箔的表面成型出烧结层：10～20min时间段内以恒定升温速率升温至100～110℃，保温10～20min，而后3～4h时间段内以恒定升温速率升温至400～450℃，随后，保温1～2h，再然后1h时间段内以恒定升温速率升温至500～520℃，维持保温3～4h；
    S5、将步骤S4中所得烧结箔执行化成处理。
  2. 根据权利要求1所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S1中，铝基粉末为纯度大于99.99％的纯铝粉或者铝合金粉末；含氮有机物为硫脲、三聚氰胺、二氰二胺中任一种或几种的混合。
  3. 根据权利要求1所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S1中，研磨粉末的等效粒径不大于0.1mm。
  4. 根据权利要求1所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S2中，有机溶剂为N-甲基吡咯烷酮(NMP)、N,N-二甲基甲酰胺(DMF)中任一种或几种的混合。
  5. 根据权利要求4所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S2中，预通过搅拌方式以完成混合浆料制备操作前，搅拌器内还混入有15～18重量比的马来酸酐接枝PS和5～10重量比的 抗氧剂。
  6. 根据权利要求1所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S3中，混合浆料预烧结体的成型厚度控制在10～30μm。
  7. 根据权利要求1所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S4中，在整个烧结进程中，烧结室内保持于低氧氛围，氧气含量低于0.01％。
  8. 根据权利要求7所述高比表面积高介电性烧结箔的制备方法，其特征在于，正式烧结前，向着烧结室充满惰性气体，或对烧结室执行抽真空处理。
  9. 根据权利要求1所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S3中，正式执行涂覆步骤S2中所制备的混合浆料操作前，在电子铝箔的预涂覆面刷涂表面处理剂；表面处理剂为硅烷类偶联剂、表面活性剂、抗静电剂以及成膜剂的混合物。
  10. 根据权利要求9所述高比表面积高介电性烧结箔的制备方法，其特征在于，按照重量比，硅烷类偶联剂占17％；表面活性剂占5％；抗静电剂占2％；成膜剂占75％，其余为杂质。
  11. 根据权利要求1-10中任一项所述高比表面积高介电性烧结箔的制备方法，其特征在于，步骤S2还包括有步骤S21；步骤S21具体内容为：将混合均匀后的混合浆料执行电磁搅拌操作，持续时长3～5min，搅拌频率控制在90～110Hz，功率范围为55～60KW，且空载时段线圈中心的磁感应强度控制在1000～1500A/m。
  12. 根据权利要求11所述高比表面积高介电性烧结箔的制备方法，其特征在于，在步骤S3中，待混合浆料涂覆操作完成后，正式固化前，将电子铝箔整体置于高频交变磁场环境中，且频率控制在15～20Hz,磁场强度不小于4500A/m。
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