WO2023203955A1 - キャリアテープ - Google Patents

キャリアテープ Download PDF

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Publication number
WO2023203955A1
WO2023203955A1 PCT/JP2023/011237 JP2023011237W WO2023203955A1 WO 2023203955 A1 WO2023203955 A1 WO 2023203955A1 JP 2023011237 W JP2023011237 W JP 2023011237W WO 2023203955 A1 WO2023203955 A1 WO 2023203955A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier tape
partition wall
height
height direction
accommodating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/011237
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
保弘 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to KR1020247033607A priority Critical patent/KR20240161154A/ko
Priority to CN202380020770.XA priority patent/CN118742496B/zh
Priority to JP2024516140A priority patent/JPWO2023203955A1/ja
Publication of WO2023203955A1 publication Critical patent/WO2023203955A1/ja
Priority to US18/618,150 priority patent/US20240239581A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Definitions

  • the present invention relates to a carrier tape suitable for accommodating a large number of components such as chip-shaped electronic components and using the tape for transportation or storage.
  • Patent Document 1 discloses a carrier tape that uses paper as a base material and has a large number of accommodating portions formed on the surface of the base material using a molding die.
  • the storage portions are separated by a partition wall. It is advantageous to efficiently accommodate a large number of electronic components by reducing the thickness of the partition wall portion that forms the interval between the accommodating sections and reducing the pitch of the accommodating sections.
  • the thickness of the partition wall is reduced to, for example, about 0.3 mm, in the case of a layered paper carrier tape, delamination tends to occur in the partition wall when press molding is performed using a molding die.
  • this interlayer peeling occurs, fine dust and paper powder are generated as foreign matter from the peeled portion, and the foreign matter may have a negative effect on the electronic component.
  • the carrier tape according to the present invention is formed into a band shape by laminated materials layered in the lamination direction, has a front surface and a back surface facing each other in a height direction corresponding to the lamination direction, and stores components on the side of the front surface.
  • a carrier tape is provided in which a plurality of accommodating portions are arranged along the length direction across a partition wall, and in the height direction, the height position of the top of the partition wall is equal to the height of the surface. position.
  • FIG. 2 is a sectional view taken along line II-II in FIG. 1.
  • FIG. 2 is a sectional view taken along line III-III in FIG. 1; 3 is an enlarged view of section IV in FIG. 2.
  • FIG. 5 is a sectional view showing another form of the partition wall portion according to the embodiment, and corresponds to FIG. 4.
  • FIG. 4 is a sectional view showing another form of the partition wall portion according to the embodiment, and corresponds to FIG. 4.
  • FIG. 1 is a plan view of a carrier tape 1 according to an embodiment.
  • FIG. 2 is a sectional view taken along line II-II in FIG.
  • FIG. 3 is a cross-sectional view taken along line III--III in FIG.
  • FIG. 4 is an enlarged view of section IV in FIG. 2.
  • the carrier tape 1 is formed into a band shape from paper, which is a laminated material, and has layers in the thickness direction.
  • the paper forming the carrier tape 1 is so-called laminated paper, and is formed by laminating a plurality of sheets of paper in the lamination direction and bonding them together.
  • the length direction of the carrier tape 1 is indicated by L
  • the width direction perpendicular to the length direction L is indicated by W
  • the height direction perpendicular to the length direction L and the width direction W is indicated by T.
  • the lamination direction corresponds to the height direction of the carrier tape 1.
  • the length direction, width direction, and height direction in the following description refer to the directions indicated by L, W, and T, respectively.
  • the height direction T is the same as the thickness direction of the carrier tape 1. Below, the height direction may be referred to as the thickness direction.
  • the carrier tape 1 has a front surface 1a and a back surface 1b that face each other in the height direction.
  • the front surface 1a and the back surface 1b are both flat surfaces and parallel to each other.
  • the distance between the front surface 1a and the back surface 1b is the maximum distance in the height direction of the carrier tape 1, that is, the distance between the front surface 1a and the back surface 1b is the thickness of the carrier tape 1.
  • a plurality of accommodating portions 10 are formed on the surface 1a side of the carrier tape 1.
  • the plurality of accommodating portions 10 are arranged at equal pitches along the length direction at positions biased towards one end side in the width direction of the carrier tape 1.
  • a plurality of feed holes 30 are formed at equal pitches along the length direction at the other end, which is the opposite side to one end in the width direction where the plurality of accommodating portions 10 are arranged.
  • the feed hole 30 is a circular through hole that penetrates from the front surface 1a to the back surface 1b.
  • the parts M shown in FIG. 4 are accommodated one by one in the plurality of accommodating parts 10.
  • the component M is, for example, a chip-shaped electronic component having a rectangular parallelepiped shape, such as a semiconductor chip or a multilayer ceramic capacitor, but is not limited thereto.
  • a partition wall portion 20 that separates the storage portions 10 is formed between the storage portions 10 that are adjacent to each other in the length direction.
  • the plurality of accommodating parts 10 are arranged in a line along the length direction with the partition wall part 20 in between.
  • the accommodating portion 10 is a recess that opens toward the surface 1a of the carrier tape 1.
  • the accommodating portion 10 has a rectangular internal space corresponding to the component M to be accommodated.
  • the housing portion 10 is surrounded by a bottom portion 11, a pair of side walls 12 on both sides in the width direction, and a pair of partition walls 20 on both sides in the length direction.
  • the pair of side walls 12 face each other in the width direction, and the pair of partition walls 20 face each other in the length direction.
  • a pair of side wall portions 12 forming the housing portion 10 are flat surfaces along the length direction and the height direction, and rise approximately perpendicularly from the edges on both sides in the width direction of the bottom portion 11 and directly continue to the surface 1a. It is formed like this. That is, when the carrier tape 1 is viewed in plan as shown in FIG. 1, there are surfaces 1a on both sides of the recess 1a in the width direction, and there is no part separating the accommodating portion 10 and the surface 1a.
  • the partition wall portion 20 has a rectangular shape when viewed from the front in the length direction.
  • the partition wall portion 20 has a top portion 21 that extends straight in the width direction.
  • the top portion 21 is the end portion of the partition wall portion 20 on the surface 1a side.
  • the height position 21h of this top portion 21 is lower than the height position 1ah of the surface 1a. That is, the top portion 21 of the partition wall portion 20 does not exist in the same plane as the surface 1a, but is recessed toward the bottom portion 11 side from the surface 1a.
  • the height position 21h of the top portion 21 refers to the highest position of the top portion 21 that is closest to the surface 1a in the height direction.
  • the amount of recess H1 that is, the distance H1 in the height direction from the top portion 21 to the surface 1a, is preferably 5% or more and 30% or less of the depth H2 of the accommodating portion 10.
  • the depth H2 of the accommodating portion 10 is a dimension in the height direction from the bottom portion 11 to the surface 1a, and is the height of the side wall portion 12.
  • the thickness G which is the lengthwise dimension of the partition wall 20, is not limited, but is, for example, 0.2 mm or more and 0.45 mm or less. It is preferable that the thickness G of the partition wall portion 20 is as small as this because the pitch between the plurality of accommodating portions 10 becomes small, the number of accommodating portions 10 can be increased, and a large number of parts M can be efficiently accommodated.
  • the top portion 21 has a cross-sectional shape along the length direction and the height direction that is rounded and convex toward the surface 1a. That is, the side cross-sectional shape of the upper surface 21a of the partition wall portion including the top portion 21 is a semicircular arc shape.
  • the radius r of this upper surface R is, for example, 0.1 mm or more and 1.5 mm or less.
  • the cross-sectional shape of the top portion 21 of the partition wall portion 20 does not have to be rounded.
  • the top part 21 of the partition wall part 20 has a rectangular cross-sectional shape along the length direction and the height direction
  • the top surface 21a of the top part 21 has a rectangular cross-sectional shape along the length direction and the width direction. It may be formed on a flat surface.
  • the housing portion 10 and the partition wall portion 20 are simultaneously formed by press-molding a molding die against the surface 1a of a material made of a strip-shaped laminated paper.
  • the partition wall portion 20 is formed by being compressed from the raw material state in the height direction and thickness direction. Therefore, the partition wall portion 20 has a higher degree of compression than other portions, and has a higher density than other portions other than the partition wall portion 20. Furthermore, due to the high density, the hardness of the partition wall portion 20 is higher than other portions.
  • the carrier tape 1 of the embodiment accommodates the components M one by one in each of the plurality of accommodation sections 10, and a cover tape (not shown) that seals the plurality of accommodation sections 10 is pasted on the surface 1a. Thereby, the component M is enclosed in the housing portion 10 without falling off.
  • the carrier tape 1 in which one component M is accommodated in each of the plurality of accommodating portions 10 is wound around a reel (not shown), and is transported or stored. Then, the cover tape is peeled off from the carrier tape 1 while being unwound from the reel at a destination where the parts M are supplied, and the parts M are picked up from the storage section 10 and used.
  • the teeth of the rotating conveyance sprocket are sequentially engaged with the feed holes 30. Thereby, the carrier tape 1 is unwound from the reel, and a plurality of parts M are conveyed in the unwinding direction.
  • the carrier tape 1 is formed into a band shape by laminated materials layered in the lamination direction, and has a front surface 1a and a back surface 1b facing each other in the height direction corresponding to the lamination direction, and has parts on the surface 1a side.
  • a plurality of accommodating portions 10 accommodating M are arranged along the length direction across the partition wall portion 20, and in the height direction, the height position of the top portion 21 of the partition wall portion 20 is equal to the height of the surface 1a. lower than the position.
  • the height of the partition wall portion 20 is smaller than the height, that is, the thickness, of the carrier tape 1, so that the degree of delamination that occurs can be reduced compared to a case where the height is the same as the thickness of the carrier tape 1. can. That is, delamination is less likely to occur in the partition wall portion 20.
  • the distance H1 in the height direction from the top portion 21 to the surface 1a is preferably 5% or more and 30% or less of the depth H2 of the accommodating portion 10.
  • the height of the partition wall 20 can be secured to such an extent that the component M stored in the storage section 10 does not come out beyond the partition wall 20, while also preventing delamination due to the low height. A suppressive effect can be obtained.
  • the thickness of the partition wall portion 20 is preferably 0.2 mm or more and 0.45 mm or less.
  • the pitch between the plurality of accommodating parts 10 becomes smaller, the number of accommodating parts 10 increases, and a large number of parts M can be efficiently accommodated.
  • the cross-sectional shape of the top portion 21 along the length direction and the height direction is formed in an R shape convex toward the surface 1a.
  • the side cross-sectional shape of the top portion 21 is rectangular and there are corners, the corners are likely to curl up, resulting in delamination and burrs.
  • the top portion 21 in an R shape such problems can be avoided. Hard to occur. That is, by forming the top portion 21 in an R shape, it is possible to suppress the occurrence of delamination and burrs on the top portion 21.
  • the density of the partition wall portion 20 is preferably higher than that of other portions other than the partition wall portion 20.
  • the layers of the partition wall portion 20 become denser, so that the occurrence of delamination can be further suppressed.
  • the present invention is not limited to the configuration of the above-described embodiments, and can be modified and applied as appropriate without changing the gist of the present invention.
  • Carrier tape 1a Surface of the carrier tape 1ah Height position of the surface of the carrier tape 1b Back side of the carrier tape 10

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
PCT/JP2023/011237 2022-04-20 2023-03-22 キャリアテープ Ceased WO2023203955A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020247033607A KR20240161154A (ko) 2022-04-20 2023-03-22 캐리어 테이프
CN202380020770.XA CN118742496B (zh) 2022-04-20 2023-03-22 载带
JP2024516140A JPWO2023203955A1 (https=) 2022-04-20 2023-03-22
US18/618,150 US20240239581A1 (en) 2022-04-20 2024-03-27 Carrier tape

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-069287 2022-04-20
JP2022069287 2022-04-20

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/618,150 Continuation US20240239581A1 (en) 2022-04-20 2024-03-27 Carrier tape

Publications (1)

Publication Number Publication Date
WO2023203955A1 true WO2023203955A1 (ja) 2023-10-26

Family

ID=88419594

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/011237 Ceased WO2023203955A1 (ja) 2022-04-20 2023-03-22 キャリアテープ

Country Status (5)

Country Link
US (1) US20240239581A1 (https=)
JP (1) JPWO2023203955A1 (https=)
KR (1) KR20240161154A (https=)
CN (1) CN118742496B (https=)
WO (1) WO2023203955A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487971A (ja) * 1990-07-13 1992-03-19 Mishima Seishi Kk 帯電防止および又は静電気シールド用包装容器
JP2006160370A (ja) * 2004-11-15 2006-06-22 Shin Etsu Polymer Co Ltd エンボスキャリアテープおよびその製造方法
JP2006272952A (ja) * 2005-03-03 2006-10-12 Shin Etsu Polymer Co Ltd エンボスキャリアテープおよびその製造方法
JP2013227065A (ja) * 2012-03-27 2013-11-07 Sumitomo Bakelite Co Ltd 電子部品収納用キャリアテープ、電子部品収納用キャリアテープの製造方法、および包装体
JP2021130292A (ja) * 2020-02-21 2021-09-09 信越ポリマー株式会社 エンボスキャリアテープの製造方法、及びエンボスキャリアテープ

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4736841A (en) * 1985-02-20 1988-04-12 Murata Manufacturing Co., Ltd. Electronic component series
US4781953A (en) * 1987-03-27 1988-11-01 Motorola Inc. Plastic carrier tape having lowered cross rails
US5115911A (en) * 1991-02-04 1992-05-26 Illinois Tool Works Inc. Carrier tape system
US5234104A (en) * 1991-02-04 1993-08-10 Illinois Tool Works Inc. Carrier tape system
MXPA03004771A (es) * 1997-09-10 2003-09-10 Yayoi Corp Paquete de piezas en forma de cinta, cinta para almacenamiento de piezas, cubierta en forma de cinta y aparato de empaquetado de piezas.
US6003676A (en) * 1997-12-05 1999-12-21 Tek Pak, Inc. Product carrier and method of making same
JP2001180784A (ja) * 1999-10-28 2001-07-03 Texas Instr Inc <Ti> 可撓性担体テープ装置
US7044304B2 (en) * 2002-08-28 2006-05-16 Texas Instruments Incorporated Anti-corrosion overcoat cover tape
JP4755410B2 (ja) * 2003-11-18 2011-08-24 ルネサスエレクトロニクス株式会社 テープ状部品包装体
JP4926436B2 (ja) * 2004-11-15 2012-05-09 信越ポリマー株式会社 エンボスキャリアテープ
JP4517856B2 (ja) * 2004-12-27 2010-08-04 Ｔｄｋ株式会社 電子部品連
EP1963198A1 (en) * 2005-12-20 2008-09-03 3M Innovative Properties Company Component carrier tape
DE112007002445T5 (de) * 2006-10-17 2009-09-10 3M Innovative Properties Co., St. Paul Bauteileträger und Verfahren zu dessen Herstellung
US7611016B2 (en) * 2007-07-31 2009-11-03 3M Innovative Properties Company Non-nesting component carrier tape
JP5299378B2 (ja) * 2010-08-11 2013-09-25 株式会社村田製作所 キャリアテープ、キャリアテープ製造装置、キャリアテープの製造方法
JP6257933B2 (ja) 2012-08-31 2018-01-10 信越ポリマー株式会社 電子部品収納用キャリアテープの製造方法およびキャリアテープ作製用シートの製造方法
JP6258306B2 (ja) * 2013-05-14 2018-01-10 信越ポリマー株式会社 キャリアテープ作製用シート、キャリアテープ作製用シートの製造方法および包装体
JP3193581U (ja) * 2014-07-30 2014-10-09 株式会社村田製作所 キャリアテープ及びテーピング部品連
US10315821B2 (en) * 2016-11-15 2019-06-11 Nxp B.V. Component carrier
JPWO2022044921A1 (https=) * 2020-08-24 2022-03-03

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0487971A (ja) * 1990-07-13 1992-03-19 Mishima Seishi Kk 帯電防止および又は静電気シールド用包装容器
JP2006160370A (ja) * 2004-11-15 2006-06-22 Shin Etsu Polymer Co Ltd エンボスキャリアテープおよびその製造方法
JP2006272952A (ja) * 2005-03-03 2006-10-12 Shin Etsu Polymer Co Ltd エンボスキャリアテープおよびその製造方法
JP2013227065A (ja) * 2012-03-27 2013-11-07 Sumitomo Bakelite Co Ltd 電子部品収納用キャリアテープ、電子部品収納用キャリアテープの製造方法、および包装体
JP2021130292A (ja) * 2020-02-21 2021-09-09 信越ポリマー株式会社 エンボスキャリアテープの製造方法、及びエンボスキャリアテープ

Also Published As

Publication number Publication date
US20240239581A1 (en) 2024-07-18
KR20240161154A (ko) 2024-11-12
CN118742496A (zh) 2024-10-01
JPWO2023203955A1 (https=) 2023-10-26
CN118742496B (zh) 2026-04-03

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