WO2023155267A1 - 印锡钢网及印刷锡膏的方法 - Google Patents

印锡钢网及印刷锡膏的方法 Download PDF

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Publication number
WO2023155267A1
WO2023155267A1 PCT/CN2022/082181 CN2022082181W WO2023155267A1 WO 2023155267 A1 WO2023155267 A1 WO 2023155267A1 CN 2022082181 W CN2022082181 W CN 2022082181W WO 2023155267 A1 WO2023155267 A1 WO 2023155267A1
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WO
WIPO (PCT)
Prior art keywords
stencil
substrate
area
printing stencil
tin
Prior art date
Application number
PCT/CN2022/082181
Other languages
English (en)
French (fr)
Inventor
李柱辉
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US17/754,896 priority Critical patent/US20240306307A1/en
Publication of WO2023155267A1 publication Critical patent/WO2023155267A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes

Definitions

  • the present application relates to the field of display technology, in particular to a tin printing stencil and a method for printing solder paste.
  • Mini ⁇ LED products With the rapid development of the display industry, Mini ⁇ LED products have attracted more and more attention. Among them, the most critical technology of Mini-LED products lies in the bonding of LEDs and substrates.
  • the bonding of the LED and the substrate needs to be completed through a solder paste process, and the solder paste process is usually through tin stencil printing.
  • the tin printing stencil printing method needs to use a scraper to apply the solder paste on the tin printing stencil on the substrate. The scraper will apply a lot of force to the substrate during the scraping process, which will easily damage the electricity on the substrate.
  • the present application provides a tin printing stencil and a method for printing solder paste, which can prevent the scraper from damaging the circuit on the substrate during the scraping process.
  • the present application provides a tin printing stencil, which is used to cooperate with a scraper to print solder paste on a substrate, and the tin printing stencil includes:
  • the stencil body includes a first area, a second area and a third area, the third area is arranged between the first area and the second area, and the third area is provided with a plurality of mesh holes arranged at intervals along the scraping direction of the scraper;
  • the protruding part is arranged on the side of the stencil body facing the substrate, the protruding part is provided on the first area and the second area, and the protruding part is elongated .
  • the tin-printing stencil has a first end portion and a second end portion disposed opposite to each other, and the protrusion extends from the first end portion to the second end portion .
  • the surface of the protruding portion facing the substrate is flat.
  • a first trace is arranged on the substrate; and the protrusion is arranged to avoid the first trace.
  • the substrate is provided with a second trace; and the protrusion is arranged to intersect with the second trace.
  • the surface of the protruding part facing the substrate is provided with a sub-depression; the intersection of the protruding part and the second trace corresponds to the sub-depression set up.
  • the concave sub-section penetrates the protrusion along the extending direction of the second trace.
  • the stencil body is any one of a planar stencil and a stepped stencil.
  • the height of the protrusions is between 2 microns and 5 microns.
  • the present application provides a tin printing stencil, which is used to cooperate with a scraper to print solder paste on a substrate, and the tin printing stencil includes:
  • the stencil body includes a first area, a second area and a third area, the third area is arranged between the first area and the second area, and the third area is provided with a plurality of mesh holes arranged at intervals along the scraping direction of the scraper;
  • a protruding part, the protruding part is arranged on the side of the stencil body facing the substrate, and the protruding part is provided on the first area and the second area.
  • the tin-printing stencil has a first end portion and a second end portion disposed opposite to each other, and the protrusion extends from the first end portion to the second end portion .
  • the surface of the protruding portion facing the substrate is flat.
  • a first trace is arranged on the substrate; and the protrusion is arranged to avoid the first trace.
  • the substrate is provided with a second trace; and the protrusion is arranged to intersect with the second trace.
  • the surface of the protruding part facing the substrate is provided with a sub-depression; the intersection of the protruding part and the second trace corresponds to the sub-depression set up.
  • the concave sub-section penetrates the protrusion along the extending direction of the second trace.
  • the stencil body is any one of a planar stencil and a stepped stencil.
  • the height of the protrusions is between 2 microns and 5 microns.
  • the present application also provides a method for printing solder paste, which includes:
  • the height of the protrusion is between 2 microns and 5 microns.
  • the tin printing stencil and the method of printing solder paste provided by this application by setting a protrusion on the side of the stencil body facing the substrate, when printing solder paste on the substrate, the pressure of the scraper can only be applied on the protrusion, and the pressure on the substrate will Due to the existence of the protrusion, the circuit is not under the pressure of the scraper, so the circuit will not be crushed or short-circuited; in addition, the conventional process of spraying black oil and other protective layers before printing solder paste can be omitted.
  • Fig. 1 is the schematic structural representation of the printed tin steel mesh that the embodiment of the present application provides;
  • Figure 2 is a schematic diagram of the matching between the tin printing stencil and the substrate provided in the embodiment of the present application;
  • Fig. 3 is another schematic structural view of the tin printing stencil provided by the embodiment of the present application.
  • Figure 4 is another schematic diagram of matching the tin printing stencil and the substrate provided in the embodiment of the present application.
  • Fig. 5 is an enlarged schematic view of the protrusion shown in Fig. 3 and Fig. 4;
  • FIG. 6 is a schematic flowchart of a method for printing solder paste provided in an embodiment of the present application.
  • the tin printing stencil provided in the embodiment of the present application is used to print solder paste on a substrate in cooperation with a scraper. Wherein, the tin printing stencil provided in the embodiment of the present application matches the substrate. It should be noted that when printing solder paste on the substrate, it is necessary to cover the tin printing stencil on the substrate, and at the same time place the solder paste on the tin printing stencil, and apply the solder paste to the tin printing stencil with a scraper to Solder paste is coated on the pads of the substrate.
  • FIG. 1 is a schematic structural diagram of a tin printing stencil provided in an embodiment of the present application.
  • the tin printing stencil 100 provided by the embodiment of the present application includes a stencil body 10 and a protrusion 20 .
  • the protruding portion 20 is disposed on a side of the stencil body 10 facing the substrate.
  • the tin printing stencil 100 when using the tin printing stencil 100 provided in the embodiment of the present application to print solder paste on the substrate, the tin printing stencil 100 will cover the substrate; at this time, the protrusion 20 is placed between the stencil body 10 and the substrate In between, the protrusion 20 can support the scraper while supporting the stencil body 10, so that the pressure of the scraper can only be applied to the protrusion 20, and the circuit on the substrate is not subjected to the pressure of the scraper because of the existence of the protrusion 20, so the circuit Will not be crushed or shorted.
  • the stencil body 10 includes a first area 101 , a second area 102 and a third area 103 .
  • the third area 103 is disposed between the first area 101 and the second area 102 .
  • the third area 103 is provided with a plurality of mesh holes 30 arranged at intervals along the scraping direction of the scraper.
  • the plurality of mesh holes 30 arranged at intervals along the scraping direction of the scraper corresponds to the plurality of pads on the substrate arranged at intervals along the scraping direction of the scraper.
  • the protruding portion 20 is disposed on a side of the stencil body 10 facing the substrate. Both the first area 101 and the second area 102 are provided with protrusions 20 . It can be understood that when using the tin printing stencil 100 provided by the embodiment of the present application to print solder paste on the substrate, the scraper can be erected on the stencil body 10 for scraping, and the two adjacent protrusions 20 can support the scraper .
  • the height of the protruding portion 20 is between 2 microns and 5 microns.
  • the height of the protrusion 20 may be 2 microns.
  • the height of the protrusion 20 may be 5 microns.
  • the height of the protrusion 20 may be 3 microns.
  • the height of the protrusion 20 may be 4 microns. That is to say, in the embodiment of the present application, by setting the height of the protrusion, the highest part of the circuit on the substrate is not pressed by the scraper due to the existence of the protrusion, so the circuit will not be crushed or short-circuited.
  • the tin printing stencil 100 provided in the embodiment of the present application by setting the protrusions 20 on the first area 101 and the second area 102, when using the tin printing stencil 100 provided in the embodiment of the application to print solder paste on the substrate, the scraper The pressure is applied on the protrusions 20 on the first area 101 and the second area 102, and the circuit on the substrate is not subjected to the pressure of the scraper due to the presence of the protrusions 20 on the first area 101 and the second area 102, so the circuit Will not be crushed or shorted. That is to say, the tin printing stencil 100 provided in the embodiment of the present application can bear the pressure of the scraper by providing the protrusion 20 .
  • the protruding portion 20 may be configured as a strip.
  • the tin printing stencil 100 has a first end A and a second end B oppositely arranged.
  • the protruding portion 20 extends from the first end portion A to the second end portion B, and the direction from the first end portion A to the second end portion B is the direction of scraping with a scraper. That is, the length of the protrusion 20 can be set according to the distance from the first end A to the second end B of the substrate.
  • the width of the protruding portion 20 can be set according to the actual situation of the circuit on the substrate. That is, the setting of the width of the protruding portion 20 should avoid consideration of the circuit on the substrate as much as possible.
  • the surface of the protruding portion 20 facing the substrate is flat.
  • the tin printing stencil 100 provided in the embodiment of the present application to print solder paste on a substrate
  • the tin printing stencil 100 needs to be placed on the substrate.
  • the surface of the protruding portion 20 facing the substrate will be in contact with the substrate.
  • by setting the surface of the protruding portion 20 facing the substrate to be flat it is possible to avoid shaking of the tin printing stencil 100 during scraping by the scraper.
  • the stencil body 10 is any one of a planar stencil and a stepped stencil.
  • the stepped stencil is made of two or more thicknesses on the same stencil, in order to cope with all large and small electronic components appearing on the same circuit board at the same time, and improve the welding quality.
  • the stepped stencil can be partially thickened to increase the thickness of the stencil to increase the amount of solder paste printed, or locally thinned to reduce the thickness of the stencil to reduce the amount of solder paste printed. Therefore, the mesh 30 can be set in a stepped shape, so as to increase the thickness of the lower tin in some areas and decrease the thickness of the lower tin in some areas. Such setting can further make the solder paste corresponding to the mesh hole 30 separate quickly and gather on the soldering pad of the substrate, reducing the risk of solder connection.
  • FIG. 2 is a schematic diagram of the matching between the tin printing stencil and the substrate provided in the embodiment of the present application.
  • the substrate 200 includes a first substrate region 201 , a second substrate region 202 and a third substrate region 203 , and the third substrate region 203 is disposed between the first substrate region 201 and the second substrate region 202 .
  • the first substrate region 201 corresponds to the first region 101
  • the second substrate region 202 corresponds to the second region 102
  • the third substrate region 203 corresponds to the third area 103 .
  • Circuits are disposed on the third substrate region 203 .
  • a plurality of pads and two first wires 204 are disposed on the third substrate region 203 .
  • the two second traces 205 cross the first substrate region 201 , the second substrate region 202 and the third substrate region 203 .
  • a plurality of welding pads are arranged at intervals along the scraping direction of the scraper. That is, a plurality of pads are arranged in a row to form a row of pads.
  • the row of pads has a first side, a second side, a third side and a fourth side, the first side is opposite to the second side, and the third side is opposite to the fourth side.
  • the first wiring 204 extends along the scraping direction of the scraper.
  • the first first trace 204 is disposed close to the first side, and the second first trace 204 is disposed close to the second side.
  • the second wiring 205 extends along a direction intersecting with the squeegee coating direction of the squeegee.
  • the first second wiring 205 is arranged close to the third side, and the second second wiring 205 is arranged close to the fourth side.
  • the two second traces 205 both extend to the first substrate region 201 and the second substrate region 202 .
  • the plurality of welding pads may include a plurality of positive electrode welding pads and a plurality of negative electrode welding pads.
  • positive electrode pads and negative electrode pads are arranged alternately.
  • the first first wiring 204 can be a VDD wiring
  • the second first wiring 204 can be a data line
  • the first second wiring 205 can be a VSS line
  • the second second wiring 205 can be a scan line.
  • the tin printing stencil provided in the embodiment of the present application uses the printing stencil provided in the embodiment of the present application by providing the protrusions 20 on the first region 101 corresponding to the first substrate region 201 and the second region 102 corresponding to the second substrate region 202 .
  • the pressure of the scraper can only be applied to the protrusions 20 on the first region 101 corresponding to the first substrate region 201 and the second region 102 corresponding to the second substrate region 202.
  • the circuit on the protrusion 20 and the third substrate area 203 is not under the pressure of the scraper due to the existence of the protrusion 20 on the first area 101 and the second area 102 , so the circuit will not be crushed or short-circuited.
  • FIG. 3 is another structural schematic diagram of the tin printing stencil provided in the embodiment of the present application.
  • the difference between the tin printing stencil 300 shown in FIG. 3 and the tin printing stencil 100 shown in the figure is that: the surface of the protrusion 20 in the tin printing stencil 300 shown in FIG.
  • the subsection 40 is recessed.
  • the tin printing stencil 300 provided by the embodiment of the present application includes a stencil body 10 and a protrusion 20 .
  • the protruding portion 20 is disposed on a side of the stencil body 10 facing the substrate.
  • a concave sub-portion 40 is provided on the surface of the protruding portion 20 facing the substrate.
  • the tin printing stencil 300 when using the tin printing stencil 300 provided in the embodiment of the present application to print solder paste on the substrate, the tin printing stencil 300 will cover the substrate; at this time, the protrusion 20 is placed between the stencil body 10 and the substrate In between, the protrusion 20 can support the scraper while supporting the stencil body 10, so that the pressure of the scraper can only be applied to the protrusion 20, and the circuit on the substrate is not subjected to the pressure of the scraper because of the existence of the protrusion 20, so the circuit Will not be crushed or shorted.
  • the stencil body 10 includes a first area 101 , a second area 102 and a third area 103 .
  • the third area 103 is disposed between the first area 101 and the second area 102 .
  • the third area 103 is provided with a plurality of mesh holes 30 arranged at intervals along the scraping direction of the scraper.
  • the plurality of mesh holes 30 arranged at intervals along the scraping direction of the scraper corresponds to the plurality of pads on the substrate arranged at intervals along the scraping direction of the scraper.
  • the protruding portion 20 is disposed on a side of the stencil body 10 facing the substrate. Both the first area 101 and the second area 102 are provided with protrusions 20 . It can be understood that when using the tin printing stencil 300 provided in the embodiment of the present application to print solder paste on the substrate, the scraper can be erected on the stencil body 10 for scraping, and the two adjacent protrusions 20 can support the scraper .
  • the height of the protruding portion 20 is between 2 microns and 5 microns.
  • the height of the protrusion 20 may be 2 microns.
  • the height of the protrusion 20 may be 5 microns.
  • the height of the protrusion 20 may be 3 microns.
  • the height of the protrusion 20 may be 4 microns. That is to say, in the embodiment of the present application, by setting the height of the protrusion, the highest part of the circuit on the substrate is not pressed by the scraper due to the existence of the protrusion, so the circuit will not be crushed or short-circuited.
  • FIG. 4 is another schematic diagram of matching the tin printing stencil and the substrate provided by the embodiment of the present application.
  • the substrate 200 includes a first substrate region 201 , a second substrate region 202 and a third substrate region 203 , and the third substrate region 203 is disposed between the first substrate region 201 and the second substrate region 202 .
  • the first substrate region 201 corresponds to the first region 101
  • the second substrate region 202 corresponds to the second region 102
  • the third substrate region 203 corresponds to the third area 103 .
  • Circuits are disposed on the third substrate region 203 .
  • a plurality of pads and two first wires 204 are disposed on the third substrate region 203 .
  • the two second traces 205 cross the first substrate region 21 , the second substrate region 202 and the third substrate region 203 .
  • a plurality of welding pads are arranged at intervals along the scraping direction of the scraper. That is, a plurality of pads are arranged in a row to form a row of pads.
  • the row of pads has a first side, a second side, a third side and a fourth side, the first side is opposite to the second side, and the third side is opposite to the fourth side.
  • the first wiring 204 extends along the scraping direction of the scraper.
  • the first first trace 204 is disposed close to the first side, and the second first trace 204 is disposed close to the second side.
  • the second wiring 205 extends along a direction intersecting with the squeegee coating direction of the squeegee.
  • the first second wiring 205 is arranged close to the third side, and the second second wiring 205 is arranged close to the fourth side.
  • the two second traces 205 both extend to the first substrate region 201 and the second substrate region 202 .
  • the plurality of welding pads may include a plurality of positive electrode welding pads and a plurality of negative electrode welding pads.
  • positive electrode pads and negative electrode pads are arranged alternately.
  • the first first wiring 204 can be a VDD wiring
  • the second first wiring 204 can be a data line
  • the first second wiring 205 can be a VSS line
  • the second second wiring 205 can be a scan line.
  • FIG. 5 is an enlarged schematic view of the protrusion shown in FIG. 3 and FIG. 4 .
  • the surface of the protruding portion 20 facing the substrate 200 is provided with a concave sub-portion 40 .
  • the intersection of the protruding portion 20 and the second trace 205 is arranged corresponding to the recessed sub-portion 40 .
  • the concave sub-portion 40 penetrates the protruding portion 20 along the extending direction of the second line 205 .
  • the pressure of the scraper can only be applied on the protrusion 20, and the circuit on the substrate 200 Because of the existence of the protrusion, there is no pressure from the scraper.
  • the scraper by setting the protrusions 20 on the first region 101 and the second region 102, when using the tin printing stencil 300 provided in the embodiment of the present application to print solder paste on the substrate, the scraper The pressure can only be applied on the protrusions 20 on the first area 101 and the second area 102, and the circuit on the substrate is not subjected to the pressure of the scraper due to the presence of the protrusions 20 on the first area 101 and the second area 102, So the circuit will not be crushed or shorted. That is to say, the tin printing stencil 300 provided in the embodiment of the present application can bear the pressure of the scraper by providing the protrusion 20 .
  • the protruding portion 20 may be configured as a strip.
  • the tin printing stencil 300 has a first end A and a second end B oppositely arranged.
  • the protruding portion 20 extends from the first end portion A to the second end portion B, and the direction from the first end portion A to the second end portion B is the direction of scraping with a scraper. That is, the length of the protrusion 20 can be set according to the distance from the first end A to the second end B of the substrate.
  • the width of the protruding portion 20 can be set according to the actual situation of the circuit on the substrate. That is, the setting of the width of the protruding portion 20 should avoid consideration of the circuit on the substrate as much as possible.
  • the surface of the protruding portion 20 facing the substrate is flat.
  • the tin printing stencil 300 provided in the embodiment of the present application to print solder paste on the substrate
  • the tin printing stencil 300 needs to be placed on the substrate.
  • the surface of the protruding portion 20 facing the substrate will be in contact with the substrate.
  • by setting the surface of the protruding portion 20 facing the substrate to be flat it is possible to prevent the tin printing stencil 300 from shaking during the scraping process of the scraper.
  • the stencil body 10 is any one of a planar stencil and a stepped stencil.
  • the stepped stencil is made of two or more thicknesses on the same stencil, in order to cope with all large and small electronic components appearing on the same circuit board at the same time, and improve the welding quality.
  • the stepped stencil can increase the printing amount of solder paste by increasing the thickness of the stencil by partially thickening it, or by reducing the thickness of the stencil by partially thinning it to reduce the printing amount of solder paste. Therefore, the mesh 30 can be set in a stepped shape, so as to increase the thickness of the lower tin in some areas and decrease the thickness of the lower tin in some areas. Such setting can further make the solder paste corresponding to the mesh hole 30 separate quickly and gather on the soldering pad of the substrate, reducing the risk of solder connection.
  • the tin printing stencil 300 provided in the embodiment of the present application is provided with the protrusions 20 on the first region 101 corresponding to the first substrate region 201 and the second region 102 corresponding to the second substrate region 202.
  • the pressure of the scraper can only be applied to the protrusions 20 on the first region 101 corresponding to the first substrate region 201 and the second region 102 corresponding to the second substrate region 202 , the circuit on the third substrate area 203 is not under the pressure of the scraper due to the existence of the protrusions 20 on the first area 101 and the second area 102, so the circuit will not be crushed or short-circuited; at the same time, the embodiment of the present application
  • the concave sub-section 40 when printing solder paste on the substrate 200, the second trace 205 is placed in the concave sub-section 40, and the pressure of the scraper can only be applied on the protrusion 20, and the circuit on the substrate 200 is due to the protrusion.
  • FIG. 6 is a schematic flowchart of a method for printing solder paste according to an embodiment of the present application. As shown in Figure 6, the method for printing solder paste provided by the embodiment of the present application includes the following steps:
  • Step S1 providing a printed tin stencil
  • Step S2 covering the substrate with a tin printing stencil, wherein the mesh holes correspond to the positions of the pads on the substrate, and the stencil body and the substrate have a preset distance.
  • Step S3 placing the solder paste on the tin printing stencil, and coating the solder paste on the tin printing stencil with a scraper.
  • Step S4 removing the tin printing stencil.
  • the tin-printing stencil can refer to the tin-printing stencil described in the above embodiments, and details are not described here.
  • the preset distance can be set as required.
  • the predetermined distance is between 2 microns and 5 microns.
  • the preset pitch may be 2 microns.
  • the preset distance may be 5 microns.
  • the preset distance may be 3 microns.
  • the preset distance may be 4 microns. That is to say, the embodiment of the present application restricts the distance between the stencil body and the substrate by setting the protrusion, so that the highest part of the circuit on the substrate is not under the pressure of the scraper due to the existence of the protrusion, so the circuit will not be crushed or a short circuit occurs.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)

Abstract

一种印锡钢网及印刷锡膏的方法，印锡钢网用于与刮刀配合在基板上印刷锡膏，印锡钢网包括：钢网本体，钢网本体包括第一区域、第二区域以及第三区域，第三区域设置在第一区域以及第二区域之间，第三区域设有多个沿着刮刀的刮涂方向间隔设置的网孔；以及突起部，设置在钢网本体朝向基板的一侧，第一区域以及第二区域上均设置有突起部。

Description

印锡钢网及印刷锡膏的方法 技术领域
本申请涉及显示技术领域，具体涉及一种印锡钢网及印刷锡膏的方法。
 背景技术
随着显示行业的快速发展，Mini‑LED产品越来越受到人们的关注。其中，Mini‑LED产品最关键的技术在于LED与基板的键合。
现有技术中，LED与基板的键合需要通过锡膏工艺完成，锡膏工艺通常是通过印锡钢网印刷方式。然而，印锡钢网印刷方式需要采用刮刀在印锡钢网上将锡膏涂覆于基板上，刮刀在刮涂过程中会有很大的力施加到基板上，容易破坏基板上的电。
 技术问题
本申请提供一种印锡钢网及印刷锡膏的方法，可以避免刮刀在刮涂过程中破坏基板上的电路。
 技术解决方案
第一方面，本申请提供一种印锡钢网，所述印锡钢网用于与刮刀配合在基板上印刷锡膏，所述印锡钢网包括：
钢网本体，所述钢网本体包括第一区域、第二区域以及第三区域，所述第三区域设置在所述第一区域以及所述第二区域之间，所述第三区域设有多个沿着所述刮刀的刮涂方向间隔设置的网孔；以及
突起部，所述突起部设置在所述钢网本体朝向所述基板的一侧，所述第一区域以及所述第二区域上均设置有所述突起部，所述突起部为长条状。
在本申请提供的印锡钢网中，所述印锡钢网具有相对设置的第一端部以及第二端部，所述突起部自所述第一端部延伸至所述第二端部。
在本申请提供的印锡钢网中，所述突起部朝向所述基板的一侧的表面平整。
在本申请提供的印锡钢网中，所述基板上设置有第一走线；所述突起部避开所述第一走线设置。
在本申请提供的印锡钢网中，所述基板上设置有第二走线；所述突起部与所述第二走线交叉设置。
在本申请提供的印锡钢网中，所述突起部朝向所述基板的一侧的表面设置有凹陷子部；所述突起部与所述第二走线交叉处与所述凹陷子部对应设置。
在本申请提供的印锡钢网中，所述凹陷子部沿着所述第二走线的延伸方向贯穿所述突起部。
在本申请提供的印锡钢网中，所述钢网本体为平面钢网、阶梯钢网中的任一种。
在本申请提供的印锡钢网中，所述突起部的高度介于2微米至5微米之间。
第二方面，本申请提供一种印锡钢网，所述印锡钢网用于与刮刀配合在基板上印刷锡膏，所述印锡钢网包括：
钢网本体，所述钢网本体包括第一区域、第二区域以及第三区域，所述第三区域设置在所述第一区域以及所述第二区域之间，所述第三区域设有多个沿着所述刮刀的刮涂方向间隔设置的网孔；以及
突起部，所述突起部设置在所述钢网本体朝向所述基板的一侧，所述第一区域以及所述第二区域上均设置有所述突起部。
在本申请提供的印锡钢网中，所述印锡钢网具有相对设置的第一端部以及第二端部，所述突起部自所述第一端部延伸至所述第二端部。
在本申请提供的印锡钢网中，所述突起部朝向所述基板的一侧的表面平整。
在本申请提供的印锡钢网中，所述基板上设置有第一走线；所述突起部避开所述第一走线设置。
在本申请提供的印锡钢网中，所述基板上设置有第二走线；所述突起部与所述第二走线交叉设置。
在本申请提供的印锡钢网中，所述突起部朝向所述基板的一侧的表面设置有凹陷子部；所述突起部与所述第二走线交叉处与所述凹陷子部对应设置。
在本申请提供的印锡钢网中，所述凹陷子部沿着所述第二走线的延伸方向贯穿所述突起部。
在本申请提供的印锡钢网中，所述钢网本体为平面钢网、阶梯钢网中的任一种。
在本申请提供的印锡钢网中，所述突起部的高度介于2微米至5微米之间。
第三方面，本申请还提供一种印刷锡膏的方法，其包括：
提供以上所述的印锡钢网；
将所述印锡钢网覆盖于所述基板上，其中，所述网孔与所述基板上的焊盘位置对应，且所述钢网本体与所述基板具有预设间距；
将锡膏置于所述印锡钢网上，并以刮刀将所述锡膏涂覆于所述印锡钢网上；
移开所述印锡钢网。
在本申请提供的印刷锡膏的方法中，所述突起部的高度介于2微米至5微米之间。
 有益效果
本申请提供的印锡钢网及印刷锡膏的方法，通过在钢网本体朝向基板的一侧设置突起部，在基板上印刷锡膏时，刮刀的压力仅能施加在突起部上，基板上的电路因为突起部的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路；此外，可以省去了印刷锡膏前常规的喷涂黑油等保护层的工序。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的印锡钢网的结构示意图；
图2为本申请实施例提供的印锡钢网与基板的匹配示意图；
图3为本申请实施例提供的印锡钢网的另一结构示意图；
图4为本申请实施例提供的印锡钢网与基板的另一匹配示意图；
图5为本图3、图4中所示的突起部的放大示意图；
图6为本申请实施例提供的印刷锡膏的方法的流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
此外，本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别不同对象，而不是用于描述特定顺序。术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。
本申请实施例提供的印锡钢网用于与刮刀配合在基板上印刷锡膏。其中，本申请实施例提供的印锡钢网与基板相匹配。需要说明的是，在基板上印刷锡膏时，需将印锡钢网覆盖于基板上，同时将锡膏置于印锡钢网上，并以刮刀将锡膏涂覆印锡钢网上，以在基板的焊盘上涂覆锡膏。
现有技术使用印锡钢网在基板上印刷锡膏时，刮刀在刮涂过程中会有很大的力施加到基板，从而容易破坏基板上的电路。相较于现有技术，使用本申请实施例提供的印锡钢网在基板上印刷锡膏时，可以使得刮刀的压力不会施加到基板上，从而避免破坏基板上的电路。
请参阅图1，图1为本申请实施例提供的印锡钢网的结构示意图。如图1所示，本申请实施例提供的印锡钢网100包括钢网本体10以及突起部20。突起部20设置在钢网本体10朝向基板的一侧。可以理解的，使用本申请实施例提供的印锡钢网100在基板上印刷锡膏时，印锡钢网100会覆盖于基板上；此时，突起部20置于钢网本体10与基板之间，突起部20在支撑钢网本体10的同时，可以支撑刮刀，使得刮刀的压力仅能施加在突起部20上，基板上的电路因为突起部20的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。
其中，钢网本体10包括第一区域101、第二区域102以及第三区域103。第三区域103设置在第一区域101以及第二区域102之间。第三区域103设有多个沿着刮刀的刮涂方向间隔设置的网孔30。多个沿着刮刀的刮涂方向间隔设置的网孔30与基板上的多个沿着刮刀的刮涂方向间隔设置的焊盘对应。
其中，突起部20设置在钢网本体10朝向基板的一侧。第一区域101以及第二区域102上均设置有突起部20。可以理解，使用本申请实施例提供的印锡钢网100在基板上印刷锡膏时，刮刀可以架设钢网本体10上进行刮涂，且相邻两个突起部20可以对刮刀起到支撑作用。
其中，突起部20的高度介于2微米至5微米之间。比如：突起部20的高度可以为2微米。突起部20的高度可以为5微米。突起部20的高度可以为3微米。突起部20的高度可以为4微米。也即，本申请实施例通过设置突起部的高度，可以使得基板上的电路的最高处因为突起部的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。
本申请实施例提供的印锡钢网100，通过在第一区域101以及第二区域102上设置突起部20，使用本申请实施例提供的印锡钢网100在基板上印刷锡膏时，刮刀的压力施加在第一区域101以及第二区域102上的突起部20上，基板上的电路因为第一区域101以及第二区域102上的突起部20的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。也即，本申请实施例提供的印锡钢网100，通过设置突起部20可以承载刮刀的压力。
在本申请实施例中，突起部20可以设置为长条状。具体的，印锡钢网100具有相对设置的第一端部A以及第二端部B。突起部20自第一端部A延伸至第二端部B，第一端部A至第二端部B的方向为刮刀刮涂的方向。也即，突起部20的长度可以根据基板第一端部A至第二端部B的距离设置。突起部20的宽度可以根据基板上的电路的实际情况设置。也即，突起部20的宽度的设置应该尽量避开基板上的电路考虑。
在本申请实施例中，突起部20朝向基板一侧的表面平整。在使用本申请实施例提供的印锡钢网100在基板上印刷锡膏时，需将印锡钢网100放置在基板上。其中，突起部20朝向基板的一侧的表面会与基板接触。本申请实施例通过将突起部20朝向基板的一侧的表面设置成平整，可以避免刮刀在刮涂过程中印锡钢网100晃动。
在本申请实施例中，钢网本体10为平面钢网、阶梯钢网中的任一种。阶梯钢网就是在同一个网板上做成两种或多种厚度，为了应付所有大大小小的电子零件同时出现在同一面的电路板上，提升焊接品质。阶梯钢网可以由局部加厚增加钢网厚度来增加锡膏的印刷量，或是局部减薄来降低钢网厚度来减少锡膏印刷量。因此，可以将网孔30设置成阶梯状，以增加一些区域的下锡厚度，减少一些区域的下锡厚度。这样设置能够进一步使对应网孔30的锡膏快速分离并聚集至基板的焊盘上，降低连锡的风险。
进一步的，请参阅图2，图2为本申请实施例提供的印锡钢网与基板的匹配示意图。结合图1、图2所示，基板200包括第一基板区域201、第二基板区域202以及第三基板区域203，第三基板区域203设置在第一基板区域201与第二基板区域202之间。在使用本申请实施例提供的印锡钢网100在基板200上印刷锡膏时，第一基板区域201与第一区域101对应，第二基板区域202与第二区域102对应，第三基板区域203与第三区域103对应。
第三基板区域203上设置有电路。具体的，第三基板区域203上设置有多个焊盘、两条第一走线204。两条第二走线205横跨第一基板区域201、第二基板区域202及第三基板区域203。多个焊盘沿着刮刀的刮涂方向间隔设置。也即，多个焊盘排列设置成一列焊盘。该列焊盘具有第一侧、第二侧、第三侧以及第四侧，第一侧与第二侧相对，第三侧与第四侧相对。第一走线204沿着刮刀的刮涂方向延伸。第一条第一走线204靠近第一侧设置，第二条第一走线204靠近第二侧设置。第二走线205沿着与刮刀的刮涂方向交叉的方向延伸。第一条第二走线205靠近第三侧设置，第二条第二走线205靠近第四侧设置。两条第二走线205均延伸至第一基板区域201以及第二基板区域202。
其中，多个焊盘可以包括多个正极焊盘以及多个负极焊盘。在沿着刮刀刮涂的方向上，正极焊盘与负极焊盘交替设置。第一条第一走线204可以为VDD走线，第二条第一走线204可以为数据线，第一条第二走线205可以为VSS线，第二条第二走线205可以为扫描线。
本申请实施例提供的印锡钢网，通过在对应第一基板区域201的第一区域101以及对应第二基板区域202的第二区域102上设置突起部20，使用本申请实施例提供的印锡钢网100在基板200上印刷锡膏时，刮刀的压力仅能施加在对应第一基板区域201的第一区域101上的突起部20以及对应第二基板区域202的第二区域102上的突起部20上，第三基板区域203上的电路因为第一区域101以及第二区域102上的突起部20的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。
请参阅图3，图3为本申请实施例提供的印锡钢网的另一结构示意图。其中，图3所示的印锡钢网300与图所示的印锡钢网100的区别在于：图3所示的印锡钢网300中的突起部20朝向基板的一侧的表面设置有凹陷子部40。
如图3所示，本申请实施例提供的印锡钢网300包括钢网本体10以及突起部20。突起部20设置在钢网本体10朝向基板的一侧。突起部20朝向基板的一侧的表面设置有凹陷子部40。可以理解的，使用本申请实施例提供的印锡钢网300在基板上印刷锡膏时，印锡钢网300会覆盖于基板上；此时，突起部20置于钢网本体10与基板之间，突起部20在支撑钢网本体10的同时，可以支撑刮刀，使得刮刀的压力仅能施加在突起部20上，基板上的电路因为突起部20的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。
其中，钢网本体10包括第一区域101、第二区域102以及第三区域103。第三区域103设置在第一区域101以及第二区域102之间。第三区域103设有多个沿着刮刀的刮涂方向间隔设置的网孔30。多个沿着刮刀的刮涂方向间隔设置的网孔30与基板上的多个沿着刮刀的刮涂方向间隔设置的焊盘对应。
其中，突起部20设置在钢网本体10朝向基板的一侧。第一区域101以及第二区域102上均设置有突起部20。可以理解，使用本申请实施例提供的印锡钢网300在基板上印刷锡膏时，刮刀可以架设钢网本体10上进行刮涂，且相邻两个突起部20可以对刮刀起到支撑作用。
其中，突起部20的高度介于2微米至5微米之间。比如：突起部20的高度可以为2微米。突起部20的高度可以为5微米。突起部20的高度可以为3微米。突起部20的高度可以为4微米。也即，本申请实施例通过设置突起部的高度，可以使得基板上的电路的最高处因为突起部的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。
进一步的，请参阅图4，图4为本申请实施例提供的印锡钢网与基板的另一匹配示意图。结合图3、图4所示，基板200包括第一基板区域201、第二基板区域202以及第三基板区域203，第三基板区域203设置在第一基板区域201与第二基板区域202之间。在使用本申请实施例提供的印锡钢网100在基板200上印刷锡膏时，第一基板区域201与第一区域101对应，第二基板区域202与第二区域102对应，第三基板区域203与第三区域103对应。
第三基板区域203上设置有电路。具体的，第三基板区域203上设置有多个焊盘、两条第一走线204。两条第二走线205横跨第一基板区域21、第二基板区域202及第三基板区域203。多个焊盘沿着刮刀的刮涂方向间隔设置。也即，多个焊盘排列设置成一列焊盘。该列焊盘具有第一侧、第二侧、第三侧以及第四侧，第一侧与第二侧相对，第三侧与第四侧相对。第一走线204沿着刮刀的刮涂方向延伸。第一条第一走线204靠近第一侧设置，第二条第一走线204靠近第二侧设置。第二走线205沿着与刮刀的刮涂方向交叉的方向延伸。第一条第二走线205靠近第三侧设置，第二条第二走线205靠近第四侧设置。两条第二走线205均延伸至第一基板区域201以及第二基板区域202。
其中，多个焊盘可以包括多个正极焊盘以及多个负极焊盘。在沿着刮刀刮涂的方向上，正极焊盘与负极焊盘交替设置。第一条第一走线204可以为VDD走线，第二条第一走线204可以为数据线，第一条第二走线205可以为VSS线，第二条第二走线205可以为扫描线。
进一步的，请参阅图5，图5为本图3、图4中所示的突起部的放大示意图。如图5所示，突起部20朝向基板200的一侧的表面设置有凹陷子部40。
其中，突起部20与第二走线205交叉处与凹陷子部40对应设置。凹陷子部40沿着第二走205线的延伸方向贯穿突起部20。本申请实施例通过设置凹陷子部40，在基板200上印刷锡膏时，第二走线205置于凹陷子部40内，刮刀的压力仅能施加在突起部20上，基板200上的电路因为突起部的存在，没有受到刮刀的压力。
本申请实施例提供的印锡钢网300，通过在第一区域101以及第二区域102上设置突起部20，使用本申请实施例提供的印锡钢网300在基板上印刷锡膏时，刮刀的压力仅能施加在第一区域101以及第二区域102上的突起部20上，基板上的电路因为第一区域101以及第二区域102上的突起部20的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。也即，本申请实施例提供的印锡钢网300，通过设置突起部20可以承载刮刀的压力。
在本申请实施例中，突起部20可以设置为长条状。具体的，印锡钢网300具有相对设置的第一端部A以及第二端部B。突起部20自第一端部A延伸至第二端部B，第一端部A至第二端部B的方向为刮刀刮涂的方向。也即，突起部20的长度可以根据基板第一端部A至第二端部B的距离设置。突起部20的宽度可以根据基板上的电路的实际情况设置。也即，突起部20的宽度的设置应该尽量避开基板上的电路考虑。
在本申请实施例中，突起部20朝向基板一侧的表面平整。在使用本申请实施例提供的印锡钢网300在基板上印刷锡膏时，需将印锡钢网300放置在基板上。其中，突起部20朝向基板的一侧的表面会与基板接触。本申请实施例通过将突起部20朝向基板的一侧的表面设置成平整，可以避免刮刀在刮涂过程中印锡钢网300晃动。
在本申请实施例中，钢网本体10为平面钢网、阶梯钢网中的任一种。阶梯钢网就是在同一个网板上做成两种或多种厚度，为了应付所有大大小小的电子零件同时出现在同一面的电路板上，提升焊接品质。阶梯钢网可以及由局部加厚增加钢网厚度来增加锡膏的印刷量，或是局部减薄来降低钢网厚度来减少锡膏印刷量。因此，可以将网孔30设置成阶梯状，以增加一些区域的下锡厚度，减少一些区域的下锡厚度。这样设置能够进一步使对应网孔30的锡膏快速分离并聚集至基板的焊盘上，降低连锡的风险。
本申请实施例提供的印锡钢网300，通过在对应第一基板区域201的第一区域101以及对应第二基板区域202的第二区域102上设置突起部20，使用本申请实施例提供的印锡钢网300在基板200上印刷锡膏时，刮刀的压力仅能施加在对应第一基板区域201的第一区域101以及对应第二基板区域202的第二区域上102的突起部20上，第三基板区域203上的电路因为第一区域101以及第二区域102上的突起部20的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路；同时，本申请实施例通过设置凹陷子部40，在基板200上印刷锡膏时，第二走线205置于凹陷子部40内，刮刀的压力仅能施加在突起部20上，基板200上的电路因为突起部的存在，没有受到刮刀的压力。
请参阅图6，图6为本申请实施例提供的印刷锡膏的方法的流程示意图。如图6所示，本申请实施例提供的印刷锡膏的方法，包括以下步骤：
步骤S1、提供一印锡钢网；
步骤S2、将印锡钢网覆盖于基板上，其中，网孔与基板上的焊盘位置对应，且钢网本体与基板具有预设间距。
步骤S3、将锡膏置于印锡钢网上，并以刮刀将锡膏涂覆于印锡钢网上。
步骤S4、移开印锡钢网。
其中，印锡钢网可参照以上实施例所述的印锡钢网，在此不做赘述。
需要说明的是，该预设间距可以根据需要设置。在本申请实施例中，该预设间距介于2微米-5微米之间。比如：该预设间距可以为2微米。该预设间距可以为5微米。该预设间距可以为3微米。该预设间距可以为4微米。也即，本申请实施例通过设置突起部限制钢网本体与基板之间的间距，可以使得基板上的电路的最高处因为突起部的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路。
本申请提供的印刷锡膏的方法，由于突起部的作用，使得基板上的电路因为突起部的存在，没有受到刮刀的压力，所以电路不会被压坏或发生短路，可以省去了印刷锡膏前常规的喷涂黑油等保护层的工序。
以上对本申请提供的印锡钢网及印刷锡膏的方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种印锡钢网，所述印锡钢网用于与刮刀配合在基板上印刷锡膏，其中，所述印锡钢网包括：
    钢网本体，所述钢网本体包括第一区域、第二区域以及第三区域，所述第三区域设置在所述第一区域以及所述第二区域之间，所述第三区域设有多个沿着所述刮刀的刮涂方向间隔设置的网孔；以及
    突起部，所述突起部设置在所述钢网本体朝向所述基板的一侧，所述第一区域以及所述第二区域上均设置有所述突起部，所述突起部为长条状。
  2. 根据权利要求1所述的印锡钢网，其中，所述印锡钢网具有相对设置的第一端部以及第二端部，所述突起部自所述第一端部延伸至所述第二端部。
  3. 根据权利要求2所述的印锡钢网，其特征在于，所述突起部朝向所述基板的一侧的表面平整。
  4. 根据权利要求1所述的印锡钢网，其中，所述基板上设置有第一走线；所述突起部避开所述第一走线设置。
  5. 根据权利要求1或4所述的印锡钢网，其中，所述基板上设置有第二走线；所述突起部与所述第二走线交叉设置。
  6. 根据权利要求5所述的印锡钢网，其中，所述突起部朝向所述基板的一侧的表面设置有凹陷子部；所述突起部与所述第二走线交叉处与所述凹陷子部对应设置。
  7. 根据权利要求6所述的印锡钢网，其中，所述凹陷子部沿着所述第二走线的延伸方向贯穿所述突起部。
  8. 根据权利要求1所述的印锡钢网，其中，所述钢网本体为平面钢网、阶梯钢网中的任一种。
  9. 根据权利要求1所述的印锡钢网，其中，所述突起部的高度介于2微米至5微米之间。
  10. 一种印锡钢网，所述印锡钢网用于与刮刀配合在基板上印刷锡膏，其中，所述印锡钢网包括：
    钢网本体，所述钢网本体包括第一区域、第二区域以及第三区域，所述第三区域设置在所述第一区域以及所述第二区域之间，所述第三区域设有多个沿着所述刮刀的刮涂方向间隔设置的网孔；以及
    突起部，所述突起部设置在所述钢网本体朝向所述基板的一侧，所述第一区域以及所述第二区域上均设置有所述突起部。
  11. 根据权利要求10所述的印锡钢网，其中，所述印锡钢网具有相对设置的第一端部以及第二端部，所述突起部自所述第一端部延伸至所述第二端部。
  12. 根据权利要求11所述的印锡钢网，其特征在于，所述突起部朝向所述基板的一侧的表面平整。
  13. 根据权利要求10所述的印锡钢网，其中，所述基板上设置有第一走线；所述突起部避开所述第一走线设置。
  14. 根据权利要求10或13所述的印锡钢网，其中，所述基板上设置有第二走线；所述突起部与所述第二走线交叉设置。
  15. 根据权利要求14所述的印锡钢网，其中，所述突起部朝向所述基板的一侧的表面设置有凹陷子部；所述突起部与所述第二走线交叉处与所述凹陷子部对应设置。
  16. 根据权利要求15所述的印锡钢网，其中，所述凹陷子部沿着所述第二走线的延伸方向贯穿所述突起部。
  17. 根据权利要求10所述的印锡钢网，其中，所述钢网本体为平面钢网、阶梯钢网中的任一种。
  18. 根据权利要求10所述的印锡钢网，其中，所述突起部的高度介于2微米至5微米之间。
  19. 一种印刷锡膏的方法，其包括：
    提供如权利要求10-18任一项所述的印锡钢网；
    将所述印锡钢网覆盖于所述基板上，其中，所述网孔与所述基板上的焊盘位置对应，且所述钢网本体与所述基板具有预设间距；
    将锡膏置于所述印锡钢网上，并以刮刀将所述锡膏涂覆于所述印锡钢网上；
    移开所述印锡钢网。
  20. 根据权利要求19所述的印刷锡膏的方法，其中，所述突起部的高度介于2微米至5微米之间。
PCT/CN2022/082181 2022-02-21 2022-03-22 印锡钢网及印刷锡膏的方法 WO2023155267A1 (zh)

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