WO2023139735A1

WO2023139735A1 - Component mounting device

Info

Publication number: WO2023139735A1
Application number: PCT/JP2022/002070
Authority: WO
Inventors: 大介春日
Original assignee: ヤマハ発動機株式会社
Priority date: 2022-01-20
Filing date: 2022-01-20
Publication date: 2023-07-27

Abstract

This component mounting device (100) comprises a first imaging unit (6), a raising unit (8), a first movement mechanism (7), a second movement mechanism (9), and a control unit (10). The control unit uses the first imaging unit to perform imaging of the raising unit, acquires a first thermal elongation correction amount (D1) that incorporates the thermal elongation of the first movement mechanism and the thermal elongation of the second movement mechanism on the basis of the results of the imaging of the raising unit by the first imaging unit, and performs thermal elongation correction on the basis of the acquired first thermal elongation correction amount.

Description

Component mounter

The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus that picks up components from a diced wafer and mounts them on a board.

Conventionally, there has been known a component mounting apparatus that picks up components from a diced wafer and mounts them on a board. Such a device is disclosed, for example, in Japanese Unexamined Patent Publication No. 2005-277273.

The above Japanese Patent Application Laid-Open No. 2005-277273 discloses an electronic component mounting apparatus (component mounting apparatus) that picks up semiconductor chips from a diced wafer and mounts them on a substrate. This electronic component mounting apparatus includes a supply section imaging camera that captures an image of a semiconductor chip on a wafer from above, a supply section imaging camera moving mechanism that moves the supply section imaging camera, an ejector that pushes up the semiconductor chip on the wafer from below, and an ejector XY table that moves the ejector. In this electronic component mounting apparatus, the movement of the supply section imaging camera increases the temperature of the supply section imaging camera moving mechanism, and thermal expansion occurs in the supply section imaging camera movement mechanism. For this reason, this electronic component mounting apparatus is provided with a recognition mark that is used for correcting the thermal expansion of the feeding section imaging camera moving mechanism. In this electronic component mounting apparatus, the thermal expansion of the supply section imaging camera moving mechanism is corrected by imaging the recognition mark with the supply section imaging camera.

Japanese Patent Application Laid-Open No. 2005-277273

However, in the electronic component mounting apparatus described in Japanese Patent Application Laid-Open No. 2005-277273, the thermal expansion of the feeding section imaging camera moving mechanism is corrected, but the thermal expansion of the ejector XY table is not corrected. Since thermal expansion also occurs in the ejector XY table, unless the thermal expansion of the ejector XY table is corrected, the ejector cannot move to an appropriate thrust-up position due to the thermal expansion of the ejector XY table. For this reason, there is a problem that it is impossible to ensure the accuracy of stably pushing up the semiconductor chip (component).

The present invention was made to solve the above-mentioned problems, and one object of the present invention is to provide a component mounting apparatus capable of ensuring stable component push-up accuracy.

A component mounting apparatus according to one aspect of the present invention is a component mounting apparatus that picks up components from a diced wafer and mounts them on a substrate, comprising: a first imaging unit that captures an image of the components on the wafer from above; a push-up unit that pushes up the components on the wafer from below; a first movement mechanism that moves the first imaging unit; a second movement mechanism that moves the push-up unit; , a control unit that acquires a first thermal expansion correction amount including the thermal expansion of the second moving mechanism, and performs thermal expansion correction based on the acquired first thermal expansion correction amount.

In the component mounting apparatus according to one aspect of the present invention, as described above, the first imaging unit images the pushing-up portion, based on the imaging result of the pushing-up portion by the first imaging unit, the first thermal expansion correction amount including the thermal elongation of the first moving mechanism that moves the first imaging unit and the thermal elongation of the second moving mechanism that moves the pushing-up portion is acquired, and a control unit is provided that performs thermal expansion correction based on the acquired first thermal expansion correction amount. As a result, it is possible to correct the thermal expansion of the second moving mechanism that moves the push-up part, so that it is possible to suppress the failure of the push-up part to move to an appropriate push-up position due to the thermal expansion of the second moving mechanism. In other words, the pushing-up portion can be moved to an appropriate pushing-up position by the second moving mechanism, so that the component can be properly pushed up by the pushing-up portion. As a result, it is possible to ensure the accuracy of stable pushing-up of the component. In addition, since it is possible to ensure the accuracy of stably pushing up the component, it is possible to ensure the accuracy of stable extraction of the component.

In addition, in order to correct the thermal elongation of the first moving mechanism and the thermal elongation of the second moving mechanism, it is conceivable to configure the component mounting apparatus as follows. That is, it is conceivable to provide a component mounting apparatus with a recognition mark used for thermal expansion correction, to correct the thermal expansion of the first moving mechanism by imaging the recognition mark with the first imaging unit, and to correct the thermal expansion of the second moving mechanism by imaging the push-up portion with the first imaging unit in a state in which the thermal expansion of the first moving mechanism is corrected. However, in this case, it is necessary to separately perform the imaging of the recognition mark and the imaging of the push-up portion, which increases the time required for correcting the thermal expansion. On the other hand, as described above, the thrust-up portion is imaged by the first imaging unit, based on the imaging result of the thrust-up portion by the first imaging unit, the first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism is acquired, and thermal expansion correction is performed based on the acquired first thermal expansion correction amount. As a result, the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism can be corrected at the same time only by imaging the push-up portion, so that an increase in the time required for correcting the thermal expansion can be suppressed.

In the component mounting apparatus according to the above aspect, preferably, the control unit acquires the image pickup position of the component by the first image pickup unit based on the first thermal expansion correction amount, picks up an image of the component while the component is moved to the acquired image pickup position by the first image pickup unit, acquires the amount of deviation from the position of the push-up unit including the thermal expansion of the second moving mechanism to the position of the component based on the image pickup result of the component by the first image pickup unit, and acquires the push-up position of the component by the push-up unit based on the amount of deviation. Configured. With this configuration, the position of the part pushed up by the pushing part can be accurately corrected based on the first thermal expansion correction amount, so that stable accuracy of pushing up the part can be easily ensured.

The component mounting apparatus according to the above one aspect preferably further includes a head unit that takes out components on the wafer from above, a second imaging section provided in the head unit, and a third moving mechanism that moves the head unit. 2, thermal expansion correction is performed based on the amount of thermal expansion correction. With this configuration, the thermal extension of the third moving mechanism can be corrected so as to correspond to the thermal extension of the first moving mechanism and the second moving mechanism, so that the third moving mechanism can move the head to an appropriate take-out position. As a result, it is possible to properly pick up the component by the head, so that it is possible to secure more stable component picking accuracy.

In this case, preferably, the control unit acquires the imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, images the component in a state of being moved to the acquired imaging position by the first imaging unit, acquires the deviation amount from the position of the push-up unit including the thermal expansion of the second moving mechanism to the position of the component based on the imaging result of the component by the first imaging unit, acquires the push-up position of the component by the push-up unit based on the deviation amount, and corrects the deviation amount and the second thermal expansion. and the position of picking up the part by the head. According to this configuration, it is possible to accurately correct the position where the part is pushed up by the pushing part and the position where the part is picked up by the head based on the first correction amount of thermal expansion and the second correction amount of thermal expansion.

In the configuration in which the component mounting apparatus includes the third moving mechanism, preferably the first moving mechanism is configured to move the first imaging section in a first direction and a second direction that are substantially orthogonal to each other in a horizontal plane, the second moving mechanism is configured to move the push-up section in the first direction and the second direction, and the third moving mechanism is configured to move the head unit in the first direction and the second direction. With this configuration, the first imaging section, the push-up section, and the head unit can be easily moved in the first direction and the second direction by the first moving mechanism, the second moving mechanism, and the third moving mechanism, respectively. In addition, in the case where the effects of thermal elongation for moving the first imaging section, thrust-up section, and head unit in the first direction and the second direction are complicated, the thermal elongation of the first moving mechanism, the second moving mechanism, and the third moving mechanism can be corrected.

In the configuration in which the component mounting apparatus includes the second imaging section, the control section is preferably configured so that the first imaging section images the push-up section with the first imaging section and the thrust-up section moved to the same first target position, and the second imaging section images the thrust-up section with the second imaging section and the thrust-up section moved to the same second target position as the first target position. With this configuration, the thermal elongation of the second moving mechanism included in the first thermal elongation correction amount can be matched with the thermal elongation of the second moving mechanism included in the second thermal elongation correction amount, so that the thermal elongation correction based on the first thermal elongation correction amount and the second thermal elongation correction amount can be accurately performed.

In the component mounting apparatus according to the above one aspect, preferably, the control unit is configured to update the thermal expansion correction at predetermined time intervals, and the control unit is configured to acquire an area for picking up the component from the wafer within the predetermined time interval, capture an image of the push-up section with the first imaging unit at a position corresponding to the acquired area, and update the thermal expansion correction. According to this configuration, by updating the thermal elongation correction at predetermined time intervals, the thermal elongation that changes with time can be properly reflected in the thermal elongation correction. In addition, an area for extracting the component from the wafer is acquired within a predetermined time interval, and the thrust-up portion is imaged by the first imaging unit at a position corresponding to the acquired area to update the thermal expansion correction. As a result, the thrust-up portion can be imaged by the first imaging unit at an effective position close to the component, and the thermal expansion correction can be updated, so the accuracy of the thermal expansion correction can be effectively improved.

In addition, since thermal elongation is not linear in many cases, it is preferable from the viewpoint of improving the accuracy of thermal elongation correction to perform thermal elongation correction by imaging the push-up portion with the first imaging unit at a plurality of positions. However, when the thrust-up portion is imaged by the first imaging unit at a plurality of positions, the time required for thermal expansion correction increases. On the other hand, in the above configuration, the accuracy of thermal expansion correction can be effectively improved, so even if the number of positions where the thrust-up portion is imaged by the first imaging unit is reduced, thermal expansion can be corrected with high accuracy. As a result, it is possible to accurately perform the thermal elongation correction while suppressing an increase in the time required for the thermal elongation correction.

In this case, preferably, the control unit is configured to obtain the number of components to be taken out from the wafer within a predetermined time interval based on the substrate cycle time, and to obtain the area based on the obtained number of components. According to this configuration, it is possible to easily acquire the area from which the components are to be removed from the wafer within the predetermined time interval based on the number of components to be removed from the wafer within the predetermined time interval.

In the component mounting apparatus according to the above one aspect, preferably, the push-up section is configured not to have an imaging section. With this configuration, the push-up section does not have an imaging section, so an increase in the number of parts and complication of the structure can be suppressed compared to the case where the push-up section has an imaging section. Further, even if the push-up section does not have an imaging section, it is possible to effectively use the first imaging section to correct the thermal expansion of the second moving mechanism. As a result, the thermal expansion of the second moving mechanism can be corrected while suppressing an increase in the number of parts and complication of the structure.

According to the present invention, as described above, it is possible to provide a component mounting apparatus capable of ensuring stable component push-up accuracy.

1 is a schematic plan view showing a component mounting apparatus according to a first embodiment; FIG. FIG. 2 is a schematic perspective view showing a wafer imaging section, a push-up section, and a head according to the first embodiment; It is a figure for demonstrating the pushing-up of components by the pushing-up part by 1st Embodiment. It is a figure (1) for demonstrating thermal elongation correction|amendment by 1st Embodiment. It is a figure (2) for demonstrating thermal expansion correction|amendment by 1st Embodiment. It is a figure (3) for demonstrating thermal expansion correction|amendment by 1st Embodiment. It is a figure for demonstrating the imaging position of thermal expansion correction|amendment by 1st Embodiment. It is a flowchart (1) for demonstrating the control process regarding thermal expansion correction|amendment by 1st Embodiment. It is a flowchart (2) for demonstrating the control process regarding thermal expansion correction|amendment by 1st Embodiment. It is a figure for demonstrating the imaging position of thermal expansion correction|amendment by 2nd Embodiment. It is a flow chart for explaining control processing about heat expansion amendment by a 2nd embodiment. FIG. 12 is a flowchart continued from FIG. 11; FIG.

An embodiment embodying the present invention will be described below based on the drawings.

[First embodiment]
(Configuration of component mounting device)
A configuration of a component mounting apparatus 100 according to an embodiment of the present invention will be described with reference to FIG.

The component mounting apparatus 100 is a device that takes out components C as semiconductor chips from a diced wafer W and mounts them on a substrate B.

As shown in FIGS. 1 and 2, the component mounting apparatus 100 includes a base 1, a conveyor 2, a head unit 3, a head unit moving mechanism 4, a component supply section 5, a wafer imaging section 6, a wafer imaging section moving mechanism 7, a push-up section 8, a push-up section movement mechanism 9, and a control section 10. The head unit moving mechanism 4 is an example of the "third moving mechanism" in the claims. Also, the wafer imaging section 6 is an example of the "first imaging section" in the claims. Also, the wafer imaging unit moving mechanism 7 is an example of the "first moving mechanism" in the claims. Also, the push-up portion moving mechanism 9 is an example of the "second moving mechanism" in the claims.

The conveyor 2 is configured to carry in the board B to the mounting work position and carry out the board B from the mounting work position. The conveyor 2 also includes a pair of conveyor rails extending in the X direction and a positioning mechanism (not shown) that positions the board B at the mounting position. As a result, the conveyor 2 conveys the board B in the X direction and positions and fixes the board B at the mounting work position.

The head unit 3 is a head unit for component mounting. The head unit 3 is supported by a head unit moving mechanism 4 so as to be movable in horizontal directions (XY directions) above the wafer W and the conveyor 2 (substrate B). The head unit 3 includes a plurality of heads 31 arranged along the X direction. The head 31 is a mounting head that picks up the component C from the wafer W from above and mounts the picked component C on the substrate B. As shown in FIG. The head 31 has a suction nozzle 31a for sucking the component C at its tip. The head 31 is configured to pick up the component C from the wafer W by suction with a suction nozzle 31a. The head 31 is configured to mount the component C on the board B, which is picked up by the suction nozzle 31a.

The head unit moving mechanism 4 is configured to move the head unit 3. Specifically, the head unit moving mechanism 4 is configured to move the head unit 3 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane. The head unit moving mechanism 4 includes an X-axis head unit moving mechanism 41 for moving the head unit 3 in the X direction and a Y-axis head unit moving mechanism 42 for moving the X-axis head unit moving mechanism 41 in the Y direction. The X direction and the Y direction are examples of the "first direction" and the "second direction" in the claims, respectively.

The X-axis head unit moving mechanism 41 is a linear motion mechanism having a ball screw shaft 41a and a drive motor 41b that drives the ball screw shaft 41a. The X-axis head unit moving mechanism 41 rotates the ball screw shaft 41a by the drive motor 41b, thereby moving the head unit 3 attached to the ball screw shaft 41a via the ball nut in the X direction.

The Y-axis head unit moving mechanism 42 is a linear motion mechanism having a ball screw shaft 42a and a drive motor 42b that drives the ball screw shaft 42a. The Y-axis head unit moving mechanism 42 rotates the ball screw shaft 42a by the drive motor 42b, thereby moving the X-axis head unit moving mechanism 41 attached to the ball screw shaft 42a via the ball nut in the Y direction. The X-axis head unit moving mechanism 41 and the Y-axis head unit moving mechanism 42 move the head unit 3 horizontally (XY directions) above the wafer W and the conveyor 2 (substrate B).

Also, the head unit 3 is provided with a board imaging section 32 and a component imaging section 33 . The board imaging unit 32 is a board camera that takes an image of a position recognition mark (fiducial mark) provided on the board B from above before the component C is mounted on the board B by the head 31 . The control unit 10 is configured to correct the mounting position of the component C by the head 31 based on the imaging result of the position recognition mark by the board imaging unit 32 . In addition, the board|substrate imaging part 32 is an example of the "2nd imaging part" of a claim.

The component imaging unit 33 is a component camera that takes an image of the component C sucked by the suction nozzle 31a of the head 31 from the side before the component C is mounted on the board B by the head 31. The control unit 10 is configured to recognize the state of the component C sucked by the suction nozzle 31 a of the head 31 based on the imaging result of the component C by the component imaging unit 33 . In addition, in FIG. 2, illustration of the component imaging part 33 is abbreviate|omitted.

Also, the board imaging section 32 and the component imaging section 33 are provided in a common frame with the head unit 3 . Therefore, the board imaging section 32 and the component imaging section 33 can be moved horizontally (XY directions) above the wafer W and the conveyor 2 (board B) by the head unit moving mechanism 4 together with the head unit 3 .

The component supply unit 5 is configured to move the wafer W stored in the wafer storage unit 11 to the supply position PF and supply the components C of the wafer W. A plurality of diced wafers W are stored in the wafer storage unit 11 . Specifically, in the wafer storage unit 11, a plurality of diced wafers W are stored while being adhered to an adhesive wafer sheet WS (see FIG. 3) attached to a ring frame. The component supply unit 5 includes a wafer holding table 51 movable in the Y direction between the wafer storage unit 11 and the supply position PF. The wafer holding table 51 is movable in the Y direction between the wafer housing portion 11 and the supply position PF while holding the wafer W via the ring frame.

The wafer image capturing unit 6 is a wafer camera that captures an image of the component C on the wafer W held by the wafer holding table 51 at the supply position PF from above before the component C is taken out from the wafer W by the head 31 . The control unit 10 is configured to correct the pick-up position (suction position) of the component C by the head 31 based on the imaging result of the component C by the wafer imaging unit 6 . The wafer imaging section 6 is supported by a wafer imaging section moving mechanism 7 so as to be movable above the wafer W in horizontal directions (XY directions).

The wafer imaging section moving mechanism 7 is configured to move the wafer imaging section 6 . Specifically, the wafer imaging section moving mechanism 7 is configured to move the wafer imaging section 6 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane. The wafer imaging section moving mechanism 7 includes an X-axis wafer imaging section moving mechanism 71 for moving the wafer imaging section 6 in the X direction, and a Y-axis wafer imaging section moving mechanism 72 for moving the X-axis wafer imaging section moving mechanism 71 in the Y direction.

The X-axis wafer imaging unit moving mechanism 71 is a linear motion mechanism having a ball screw shaft 71a and a drive motor 71b that drives the ball screw shaft 71a. The X-axis wafer imaging section moving mechanism 71 rotates the ball screw shaft 71a by the drive motor 71b, thereby moving the wafer imaging section 6 attached to the ball screw shaft 71a via the ball nut in the X direction.

The Y-axis wafer imaging unit moving mechanism 72 is a linear motion mechanism having a ball screw shaft 72a and a drive motor 72b that drives the ball screw shaft 72a. The Y-axis wafer imaging section moving mechanism 72 rotates the ball screw shaft 72a by the drive motor 72b, thereby moving the X-axis wafer imaging section moving mechanism 71 attached to the ball screw shaft 72a via the ball nut in the Y direction. The wafer imaging section 6 is moved above the wafer W in the horizontal direction (XY directions) by the X-axis wafer imaging section moving mechanism 71 and the Y-axis wafer imaging section moving mechanism 72 .

As shown in FIGS. 2 and 3, the push-up unit 8 is a push-up head that pushes up the component C of the wafer W held on the wafer holding table 51 at the supply position PF from below when the component C is taken out from the wafer W. The head 31 is held by the wafer holding table 51 at the supply position PF, and is configured to pick up the component C from the wafer W while it is pushed up by the push-up portion 8 . The push-up portion 8 includes a push-up pin 81 that is raised and lowered by a lifting mechanism (not shown). The push-up pins 81 are configured to push up the component C from below and separate the component C from the wafer sheet WS by being lifted by an elevating mechanism. It should be noted that the push-up section 8 does not have an imaging section.

The push-up portion moving mechanism 9 is configured to move the push-up portion 8 . Specifically, the push-up portion moving mechanism 9 is configured to move the push-up portion 8 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane. The pushing-up portion moving mechanism 9 includes an X-axis pushing-up portion moving mechanism 91 for moving the head unit 3 in the X direction, and a Y-axis pushing-up portion moving mechanism 92 for moving the X-axis pushing-up portion moving mechanism 91 in the Y direction.

The X-axis push-up portion moving mechanism 91 is a linear motion mechanism having a ball screw shaft 91a and a drive motor 91b that drives the ball screw shaft 91a. The X-axis push-up portion moving mechanism 91 rotates the ball screw shaft 91a with a drive motor 91b, thereby moving the push-up portion 8 attached to the ball screw shaft 91a via a ball nut in the X direction.

The Y-axis push-up portion moving mechanism 92 is a linear motion mechanism having a ball screw shaft 92a and a drive motor 92b that drives the ball screw shaft 92a. The Y-axis push-up portion moving mechanism 92 rotates the ball screw shaft 92a by the drive motor 92b, thereby moving the X-axis push-up portion moving mechanism 91 attached to the ball screw shaft 92a via the ball nut in the Y direction. The push-up portion 8 is moved below the wafer W in the horizontal direction (XY direction) by the X-axis push-up portion movement mechanism 91 and the Y-axis push-up portion movement mechanism 92 .

As shown in FIG. 1, the control section 10 is configured to control the operation of each section of the component mounting apparatus 100 . Specifically, the control unit 10 is configured to control the operations of the conveyor 2, the head unit 3, the head unit moving mechanism 4, the board imaging unit 32, the component imaging unit 33, the component supply unit 5, the wafer imaging unit 6, the wafer imaging unit moving mechanism 7, the pushing unit 8, and the pushing unit moving mechanism 9. The control unit 10 controls the operation of each unit based on output signals from position detection means such as encoders built in the drive motors of the above units. Further, the control unit 10 has a function of performing imaging control and image recognition of various imaging units (the substrate imaging unit 32, the component imaging unit 33, and the wafer imaging unit 6). The control unit 10 includes a processor such as a CPU (Central Processing Unit) and a memory.

(thermal elongation correction)
Here, in each movement mechanism of the head unit movement mechanism 4, the wafer imaging section movement mechanism 7, and the push-up section movement mechanism 9, the temperature rise occurs with the movement of each movement target of the head unit 3 (head 31), the wafer imaging section 6, and the push-up section 8. In each moving mechanism, thermal elongation (thermal expansion) occurs due to temperature rise. In this case, due to the thermal expansion of each moving mechanism, a shift occurs between the theoretical moving position and the actual moving position, so the positioning accuracy of each moving object is lowered. Therefore, the component mounting apparatus 100 performs thermal expansion correction.

Here, in the first embodiment, as shown in FIG. 4 to 6, the control unit 10 is an imaging portion 8 by the wafer imaging section 6, and based on the image result of the thrust part 8 by the wafer imaging section 6, the thermal growth of the Waeha imaging unit movement mechanism 7 and the thermal growth of the push -up part of the tracking part 9. The first thermal growth correction amount D1 (see FIG. 4) is obtained, and it is configured to perform a thermal growth correction based on the obtained first thermal growth amount D1. 4 to 6, for convenience, the head 31, the substrate imaging section 32, the wafer imaging section 6, and the push-up section 8 are schematically illustrated as marks representing each configuration.

In addition, in the first embodiment, the control unit 10 captures an image of the push-up portion 8 by the substrate imaging unit 32, acquires the second thermal expansion correction amount D2 (see FIG. 5) including the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the push-up portion moving mechanism 9 based on the imaging result of the push-up portion 8 by the substrate imaging unit 32, and performs thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2.

Specifically, the control unit 10 acquires the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, images the component C with the wafer imaging unit 6 while being moved to the acquired imaging position, acquires the deviation amount D3 (see FIG. 6) from the position of the thrusting unit 8 including the thermal elongation of the thrusting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and based on the deviation amount D3, determines the thrusting unit. 8 is configured to acquire the position of the component C pushed up. Further, the control unit 10 is configured to acquire the pickup position of the component C by the head 31 based on the deviation amount D3 and the second thermal expansion correction amount D2.

In the first embodiment, the control unit 10 is configured such that the wafer imaging unit 6 images the push-up unit 8 while the wafer imaging unit 6 and the thrust-up unit 8 are moved to the same first target position (theoretical position P1), and the substrate imaging unit 32 images the push-up unit 8 while the substrate imaging unit 32 and the thrust-up unit 8 are moved to the same second target position (theoretical position P1) as the first target position. When the wafer imaging section 6 and the substrate imaging section 32 pick up an image of the push-up section 8, the wafer W is moved by the wafer holding table 51 so as to retreat from the supply position PF. Therefore, the push-up portion 8 is exposed upward at the supply position PF, and the wafer imaging portion 6 and the board imaging portion 32 can image the push-up portion 8 from above at the supply position PF.

An example of thermal elongation correction will be described with reference to FIGS.

Acquisition of the first thermal expansion correction amount D1 will be described with reference to FIG. As shown in FIG. 4, in a state in which the wafer W is not placed at the supply position PF, the wafer imaging section moving mechanism 7 moves the wafer imaging section 6 with the theoretical position P1 as the target position, and the thrusting section moving mechanism 9 moves the thrusting section 8 with the theoretical position P1 as the target position. In the moved state, due to the thermal expansion of the wafer imaging section moving mechanism 7, the wafer imaging section 6 is located at a position displaced from the theoretical position P1 by the amount of thermal expansion deviation D11. Also, due to the thermal expansion of the push-up portion moving mechanism 9, the push-up portion 8 is positioned at a position displaced from the theoretical position P1 by a thermal expansion displacement amount D12.

Then, the wafer imaging section 6 images the thrusting-up section 8 from above in a state where the wafer imaging section 6 and the pushing-up section 8 are positioned at a position displaced from the theoretical position P1 by the thermal expansion deviation amount. This imaging result includes information on the amount of thermal expansion deviation D11 of the wafer imaging unit 6 and the amount of thermal expansion deviation D12 of the push-up unit 8 . Then, a first thermal expansion correction amount D1 including the thermal expansion displacement amount D11 of the wafer imaging unit 6 and the thermal expansion displacement amount D12 of the pushing-up unit 8 is obtained based on the imaging result of the pushing-up unit 8 by the wafer imaging unit 6. The first thermal expansion correction amount D1 represents the displacement amount of the pushing-up portion 8 with respect to the wafer imaging portion 6 in a state of thermal expansion. That is, the first thermal expansion correction amount D1 represents the relative amount of thermal expansion deviation of the wafer imaging section 6 including the thermal expansion deviation amount D12 of the push-up section 8 .

Then, by correcting the target position of the wafer imaging unit 6 so as to add the first thermal expansion correction amount D1 to the target position of the wafer imaging unit 6, it is possible to move the wafer imaging unit 6 so that the center of the wafer imaging unit 6 and the center of the push-up unit 8 substantially coincide. That is, it is possible to move the wafer imaging section 6 to the position of the pushing-up section 8 including the thermal expansion of the pushing-up section moving mechanism 9 .

Acquisition of the second thermal expansion correction amount D2 will be described with reference to FIG. As shown in FIG. 5, while the wafer W is not placed at the supply position PF, the head unit moving mechanism 4 moves the substrate imaging section 32 with the theoretical position P1 as the target position, and the thrusting section moving mechanism 9 moves the thrusting section 8 with the theoretical position P1 as the target position. Note that if the wafer imaging unit 6 has already imaged the push-up unit 8, the push-up unit 8 has already been moved. In the moved state, due to the thermal expansion of the head unit moving mechanism 4, the board imaging section 32 is positioned at a position shifted from the theoretical position P1 by the amount of thermal expansion deviation D21. Also, due to the thermal expansion of the push-up portion moving mechanism 9, the push-up portion 8 is positioned at a position displaced from the theoretical position P1 by a thermal expansion displacement amount D12.

Then, the board imaging section 32 captures an image of the thrusting section 8 from above in a state where the board imaging section 32 and the thrusting section 8 are positioned at positions displaced from the theoretical position P1 by the amount of thermal expansion deviation. This imaging result includes information on the amount of thermal expansion deviation D21 of the board imaging portion 32 and the amount of thermal expansion deviation D12 of the push-up portion 8 . Then, a second thermal expansion correction amount D2 including the thermal expansion displacement amount D21 of the substrate imaging unit 32 and the thermal expansion displacement amount D12 of the pushing-up portion 8 is acquired based on the imaging result of the thrust-up portion 8 by the substrate imaging unit 32. Further, since the amount of thermal expansion deviation of the board imaging section 32 and the amount of thermal expansion deviation of the head 31 can be regarded as substantially the same, the amount of thermal expansion deviation D21 can also be said to be the amount of thermal expansion deviation of the head 31 . Therefore, it can be said that the second thermal expansion correction amount D2 includes the thermal expansion deviation amount D21 of the head 31 and the thermal expansion deviation amount D12 of the push-up portion 8 . The second thermal expansion correction amount D2 represents the displacement amount of the push-up portion 8 with respect to the head 31 (board imaging portion 32) in a thermally expanded state. That is, the second thermal expansion correction amount D2 represents a relative amount of thermal expansion deviation of the head 31 (board imaging section 32) including the thermal expansion deviation amount D12 of the push-up portion 8. FIG.

By correcting the target position of the head 31 so as to add the second thermal expansion correction amount D2 to the target position of the head 31, it is possible to move the head 31 so that the center of the head 31 and the center of the push-up portion 8 substantially coincide. That is, it is possible to move the head 31 to the position of the push-up portion 8 including the thermal expansion of the push-up portion moving mechanism 9 .

Acquisition of the push-up position and acquisition of the take-out position based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described with reference to FIG. As shown in FIG. 6, while the wafer W is placed at the supply position PF, the component C of the wafer W is shifted from the theoretical position P2 where it should be originally placed due to the positioning error of the wafer holding table 51 or the like. In FIG. 6, the center of the part C is displaced from the theoretical position P2 by the displacement amount Dx in the X direction and by the displacement amount Dy in the Y direction. Therefore, it is necessary to image the component C by the wafer imaging unit 6 and correct the position where the component C is pushed up by the push-up unit 8 and the pickup position (suction position) of the component C by the head 31 by the positional deviation of the component C from the theoretical position P2. In addition to correcting the positional deviation of the component C from the theoretical position P2, it is also necessary to correct the positional deviation caused by the thermal expansion of each moving mechanism.

First, by correcting the target position (theoretical position P2) of the wafer imaging unit 6 so as to add the first thermal expansion correction amount D1 to the target position (theoretical position P2) of the wafer imaging unit 6, the imaging position of the component C by the wafer imaging unit 6 is acquired as the target position after correction. Since the imaging position is acquired including the thermal elongation of the push-up part moving mechanism 9, when the wafer imaging part moving mechanism 7 moves the wafer imaging part 6 to the imaging position, the wafer imaging part 6 is moved to the position of the push-up part 8 including the thermal elongation of the push-up part moving mechanism 9. That is, the wafer imaging unit 6 is moved to a position shifted from the theoretical position P2 by the amount of thermal expansion deviation D12.

Then, the component C is imaged from above by the wafer imaging unit 6 in a state of being shifted from the theoretical position P2 by the amount of thermal expansion deviation D12. This imaging result includes information on the amount of deviation D3 from the position of the push-up portion 8 including the thermal elongation of the push-up portion moving mechanism 9 to the center position of the component C. FIG. Then, based on the imaging result of the component C by the wafer imaging unit 6, the shift amount D3 from the position of the push-up portion 8 including the thermal expansion of the push-up portion moving mechanism 9 to the center position of the component C is obtained.

Then, by correcting the target position (theoretical position P2) of the push-up part 8 so as to add the deviation amount D3 to the target position (theoretical position P2) of the push-up part 8, the position of the part C pushed up by the push-up part 8 is obtained as the corrected target position. Then, by moving the push-up part 8 to the acquired push-up position by the push-up part moving mechanism 9, the push-up part 8 can be moved so that the center of the part C and the center of the push-up part 8 substantially coincide.

Further, by correcting the target position (theoretical position P2) of the head 31 so as to add the deviation amount D3 and the second thermal expansion correction amount D2 to the target position (theoretical position P2) of the head 31, the pickup position of the component C by the head 31 is obtained as the corrected target position. The head unit moving mechanism 4 moves the head 31 to the acquired take-out position, thereby moving the head 31 so that the center of the component C and the center of the head 31 substantially coincide.

Incidentally, as shown in FIG. 7, the imaging of the push-up portion 8 by each of the wafer imaging portion 6 and the substrate imaging portion 32 may be performed at only one point, or may be performed at a plurality of points such as two points and four points.

For example, in the area of the supply position PF, in the wafer suction area WA where the wafer W is arranged and the component C is suctioned, if the amount of thermal expansion of each movement target of each moving mechanism can be considered to be substantially constant regardless of the position of the component C, it is possible for each imaging section to image the push-up section 8 at only one point within the wafer suction area WA. In this case, each imaging unit captures an image of the push-up portion 8 at a point P11 at the center position of the wafer adsorption area WA. Then, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 at the point P11 are acquired based on the imaging result at the point P11 of the push-up portion 8 . Then, the acquired first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used as they are when correcting the push-up position and the take-out position, as described with reference to FIGS. That is, the same first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used when picking up the component C at any position on the wafer W. FIG.

Further, for example, if the amount of thermal expansion of each movement target of each moving mechanism differs depending on the position of the component C within the wafer adsorption area WA, it is possible for each imaging section to image the push-up section 8 at a plurality of points, such as arbitrary two points and arbitrary four points within the wafer adsorption area WA.

For example, when the pushing-up portion 8 is imaged at two arbitrary points, the pushing-up portion 8 is imaged by each imaging portion at predetermined points P21 and P22 in the wafer adsorption area WA. Then, based on the imaging results of the push-up portion 8 at each of the points P21 and P22, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C on the wafer W are obtained using a coordinate transformation method such as affine transformation. Then, the obtained first thermal expansion correction amount D1 and second thermal expansion correction amount D2 for each position of the component C on the wafer W are used when correcting the push-up position and the pick-up position. That is, depending on the position of the component C on the wafer W, different first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used.

Further, for example, when the push-up portion 8 is imaged at four arbitrary points, the push-up portion 8 is imaged by each imaging portion at predetermined points P31 to P34 within the wafer adsorption area WA. Then, based on the imaging results of the push-up portion 8 at each of the points P31 to P34, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C on the wafer W are obtained using a coordinate transformation method such as projective transformation. Then, the obtained first thermal expansion correction amount D1 and second thermal expansion correction amount D2 for each position of the component C on the wafer W are used when correcting the push-up position and the pick-up position. That is, depending on the position of the component C on the wafer W, different first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used.

(Control processing related to thermal elongation correction)
8 and 9, control processing for thermal expansion correction by the component mounting apparatus 100 of the first embodiment will be described based on a flowchart. Note that each process in the flowchart is executed by the control unit 10 .

With reference to FIG. 8, control processing regarding acquisition of the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. As shown in FIG. 8, first, in step S101, it is determined whether or not the wafer W is present at the supply position PF. If it is determined that the wafer W does not exist at the supply position PF, the process proceeds to step S103. Further, when it is determined that the wafer W is present at the supply position PF, the process proceeds to step S102.

Then, in step S102, the wafer W is returned to the wafer storage unit 11 by the wafer holding table 51.

Then, in step S103, the wafer imaging section moving mechanism 7 moves to the imaging position (theoretical position P1), and the thrusting section moving mechanism 9 moves the thrusting section 8 to the imaging position (theoretical position P1).

Then, in step S104, the thrust-up portion 8 is imaged by the wafer imaging portion 6.

Then, in step S105, it is determined whether or not imaging of the push-up portion 8 by the wafer imaging unit 6 at all imaging points has been completed. If it is determined that the wafer imaging unit 6 has not completed imaging the thrust-up portion 8 at all imaging points, the process proceeds to step S103, and the wafer imaging unit 6 images the thrust-up portion 8 at the next imaging point. If it is determined that the imaging of the push-up portion 8 by the wafer imaging section 6 at all imaging points has been completed, the process proceeds to step S106. Note that when there is only one imaging point, the process of step S105 is not performed.

Then, in step S106, the first thermal expansion correction amount D1 is obtained based on the imaging result of the pushing-up portion 8 by the wafer imaging portion 6.

Then, in step S107, the board imaging section 32 is moved to the imaging position (theoretical position P1) by the head unit moving mechanism 4, and the thrusting section 8 is moved to the imaging position (theoretical position P1) by the thrusting section moving mechanism 9. It should be noted that the push-up portion 8 maintains the position moved in the process of step S103.

Then, in step S108, the board imaging section 32 captures an image of the push-up section 8.

Then, in step S109, it is determined whether or not imaging of the push-up portion 8 by the substrate imaging section 32 at all imaging points has been completed. If it is determined that the substrate imaging unit 32 has not completed imaging the push-up portion 8 at all imaging points, the process proceeds to step S107, and the substrate imaging unit 32 images the push-up portion 8 at the next imaging point. If it is determined that imaging of the push-up portion 8 by the substrate imaging section 32 at all imaging points has been completed, the process proceeds to step S110. Note that when there is only one imaging point, the process of step S109 is not performed.

Then, in step S<b>110 , the second thermal expansion correction amount D<b>2 is acquired based on the imaging result of the push-up portion 8 by the substrate imaging section 32 . The control process is then terminated. Note that the amount of thermal expansion of each moving mechanism changes with time, so the control process shown in FIG. 8 is performed at predetermined time intervals (such as 3-minute intervals). Therefore, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are updated at predetermined time intervals, and the latest thermal expansion state is reflected in the thermal expansion correction.

With reference to FIG. 9, control processing regarding acquisition of the push-up position and the take-out position based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. Note that the wafer W is placed at the supply position PF. As shown in FIG. 9, first, in step S111, the imaging position of the component C by the wafer imaging unit 6 is obtained based on the first thermal expansion correction amount D1.

Then, in step S112, the wafer imaging section moving mechanism 7 moves the wafer imaging section 6 to the imaging position.

Then, in step S113, the image of the component C is captured by the wafer imaging unit 6.

Then, in step S114, the amount of deviation D3 is acquired based on the imaging result of the component C by the wafer imaging unit 6.

Then, in step S115, the push-up position of the part C by the push-up unit 8 is acquired based on the deviation amount D3.

Then, in step S116, the push-up portion moving mechanism 9 moves the push-up portion 8 to the push-up position.

Also, in step S117, the pickup position of the component C by the head 31 is acquired based on the deviation amount D3 and the second thermal expansion correction amount D2.

Then, in step S118, the head unit moving mechanism 4 moves the head 31 to the removal position.

Then, in step S119, the pushing-up portion 8 pushes up the component C and the head 31 picks up the component C. The control process is then terminated. Further, the control processing shown in FIG. 9 is repeatedly performed until the production of the substrate B is completed.

(Effect of the first embodiment)
The following effects can be obtained in the first embodiment.

In the first embodiment, as described above, the wafer imaging unit 6 captures an image of the push-up unit 8, acquires the first thermal expansion correction amount D1 including the thermal elongation of the wafer imaging unit moving mechanism 7 that moves the wafer imaging unit 6 and the thermal elongation of the push-up unit moving mechanism 9 that moves the push-up unit 8, based on the imaging result of the push-up unit 8 by the wafer imaging unit 6, and provides the control unit 10 that performs thermal elongation correction based on the acquired first thermal expansion correction amount D1. As a result, it is possible to correct the thermal elongation of the push-up part moving mechanism 9 for moving the push-up part 8, so that the failure of the push-up part 8 to move to an appropriate push-up position due to the thermal expansion of the push-up part moving mechanism 9 can be suppressed. In other words, the pushing-up portion moving mechanism 9 can move the pushing-up portion 8 to an appropriate pushing-up position, so that the pushing-up portion 8 can push up the component C appropriately. As a result, it is possible to ensure the accuracy of stable push-up of the component C. In addition, since it is possible to ensure the accuracy of stable push-up of the component C, it is possible to ensure the accuracy of stable removal of the component C.

In order to correct the thermal expansion of the wafer imaging section moving mechanism 7 and the thermal expansion of the push-up section moving mechanism 9, it is possible to configure the component mounting apparatus 100 as follows. That is, it is conceivable to provide the component mounting apparatus 100 with a recognition mark used for thermal expansion correction, to correct the thermal expansion of the wafer imaging section moving mechanism 7 by imaging the recognition mark with the wafer imaging section 6, and to correct the thermal expansion of the thrusting section moving mechanism 9 by imaging the push-up section 8 with the wafer imaging section 6 in a state in which the thermal expansion of the wafer imaging section movement mechanism 7 has been corrected. However, in this case, it is necessary to separately perform imaging of the recognition mark and imaging of the push-up portion 8, so the time required for thermal expansion correction increases. On the other hand, as described above, the wafer imaging unit 6 captures an image of the push-up unit 8, and based on the imaging result of the push-up unit 8 by the wafer imaging unit 6, the first thermal expansion correction amount D1 including the thermal expansion of the wafer imaging unit moving mechanism 7 and the thermal expansion of the push-up unit moving mechanism 9 is acquired, and thermal expansion correction is performed based on the acquired first thermal expansion correction amount D1. As a result, the thermal expansion of the wafer imaging part moving mechanism 7 and the thermal expansion of the pushing part moving mechanism 9 can be corrected simultaneously only by imaging the push-up part 8, so that it is possible to suppress an increase in the time required for correcting the thermal expansion.

In addition, in the first embodiment, as described above, the control unit 10 acquires the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, images the component C with the wafer imaging unit 6 while being moved to the acquired imaging position, acquires the deviation amount D3 from the position of the thrusting unit 8 including the thermal expansion of the thrusting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and acquires the deviation amount D3 based on the deviation amount D3. , to obtain the position of the component C pushed up by the pushing-up portion 8 . As a result, it is possible to accurately correct the thrust-up position of the component C by the thrust-up part 8 based on the first thermal expansion correction amount D1, so that stable precision of thrust-up of the component C can be easily ensured.

Further, in the first embodiment, as described above, the component mounting apparatus 100 includes the head unit 3 that picks up the component C on the wafer from above, the board imaging section 32 provided in the head unit 3, and the head unit moving mechanism 4 that moves the head unit 3. The control unit 10 is configured to capture an image of the push-up portion 8 by the substrate imaging unit 32, acquire a second thermal expansion correction amount D2 including the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the push-up portion moving mechanism 9 based on the imaging result of the push-up portion 8 by the substrate imaging unit 32, and perform thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2. As a result, the thermal expansion of the head unit moving mechanism 4 can be corrected so as to correspond to the correction of the thermal expansion of the wafer imaging unit moving mechanism 7 and the push-up portion moving mechanism 9, so that the head unit moving mechanism 4 can move the head 31 to an appropriate take-out position. As a result, the component C can be properly picked up by the head 31, so that a more stable picking accuracy of the component C can be ensured.

In addition, in the first embodiment, as described above, the control unit 10 acquires the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, images the component C with the wafer imaging unit 6 while being moved to the acquired imaging position, acquires the deviation amount D3 from the position of the thrusting unit 8 including the thermal expansion of the thrusting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and acquires the deviation amount D3 based on the deviation amount D3. , the position of the component C pushed up by the pushing-up portion 8 is obtained, and the pickup position of the component C by the head 31 is obtained based on the deviation amount D3 and the second thermal expansion correction amount D2. As a result, based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2, the pushing-up position of the component C by the pushing-up part 8 and the picking-up position of the component C by the head 31 can be corrected with high accuracy, so that it is possible to easily secure more stable pushing-up accuracy of the component C and more stable picking-up accuracy of the component C.

Further, in the first embodiment, as described above, the wafer imaging section moving mechanism 7 is configured to move the wafer imaging section 6 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane. The push-up portion moving mechanism 9 is configured to move the push-up portion 8 in the X direction and the Y direction. The head unit moving mechanism 4 is configured to move the head unit 3 in the X direction and the Y direction. As a result, the wafer imaging section moving mechanism 7, the thrusting section moving mechanism 9, and the head unit moving mechanism 4 can easily move the wafer imaging section 6, the thrusting section 8, and the head unit 3 in the X direction and the Y direction, respectively. Further, in the case where the effects of thermal expansion caused by moving the wafer imaging section 6, the pushing section 8, and the head unit 3 in the X and Y directions are complicated, the thermal expansion of the wafer imaging section moving mechanism 7, the pushing section moving mechanism 9, and the head unit moving mechanism 4 can be corrected.

Further, in the first embodiment, as described above, the control unit 10 is configured such that the wafer imaging unit 6 images the push-up unit 8 while the wafer imaging unit 6 and the push-up unit 8 are moved to the same first target position, and the substrate imaging unit 32 images the push-up unit 8 while the substrate imaging unit 32 and the push-up unit 8 are moved to the same second target position as the first target position. As a result, the thermal elongation of the push-up portion moving mechanism 9 included in the first thermal elongation correction amount D1 and the thermal elongation of the push-up portion moving mechanism 9 included in the second thermal elongation correction amount D2 can be matched, so the thermal elongation correction based on the first thermal elongation correction amount D1 and the second thermal elongation correction amount D2 can be accurately performed.

In addition, in the first embodiment, as described above, the push-up section 8 is configured so as not to have an imaging section. Accordingly, since the push-up section 8 does not have an imaging section, it is possible to suppress an increase in the number of parts and complication of the structure as compared with the case where the push-up section 8 has an imaging section. Further, even if the push-up unit 8 does not have an imaging unit, the wafer imaging unit 6 can be effectively used to correct thermal expansion of the push-up unit moving mechanism 9 . As a result, it is possible to correct the thermal elongation of the push-up portion moving mechanism 9 while suppressing an increase in the number of parts and complication of the structure.

[Second embodiment]
Next, a second embodiment will be described with reference to FIGS. 10 to 12. FIG. In this second embodiment, unlike the above-described first embodiment, an example will be described in which an area for picking up a component from a wafer is acquired within a predetermined time interval, and the thrust-up portion is imaged by the wafer imaging unit at a position corresponding to the acquired area. In the drawings, the same components as in the first embodiment are indicated by the same reference numerals, and descriptions thereof are omitted.

(Configuration of component mounting device)
A component mounting apparatus 200 according to the second embodiment of the present invention differs from the component mounting apparatus 100 according to the first embodiment in that it includes a control unit 110 as shown in FIG. The control unit 110 is configured to update the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for thermal expansion correction at predetermined time intervals (such as 3-minute intervals).

Here, in the second embodiment, the control unit 110 acquires the area 111 from which the component C is to be taken out from the wafer W within a predetermined time interval, and at the position P101 corresponding to the acquired area 111, the wafer imaging unit 6 images the push-up unit 8, and updates the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2. In the second embodiment, the control unit 110 is configured to obtain the number of components C to be taken out from the wafer W within a predetermined time interval based on the cycle time of the substrate B, and to obtain the area 111 based on the obtained number of components C. Note that FIG. 10 shows an example in which there are two imaging points, but the number of imaging points may be one, or a plurality of points other than two.

(Control processing related to thermal elongation correction)
11 and 12, control processing for thermal expansion correction by the component mounting apparatus 200 of the second embodiment will be described based on a flowchart. Note that each process in the flowchart is executed by the control unit 110 .

As shown in FIG. 11, first, in step S201, the cycle time is initialized. In step S201, the previous cycle time is set from the previous production history.

Then, in step S202, the substrate B is replaced by the conveyor 2. In step S202, the conveyor 2 unloads the board B on which the component C has been mounted, and carries in the board B on which the component C is to be mounted.

Then, in step S203, it is determined whether or not the timing is the update timing of the thermal expansion correction. If it is determined that the timing is not the update timing of the thermal expansion correction, the process proceeds to step S207. Moreover, when it is determined that the timing is the update timing of the thermal expansion correction, the process proceeds to step S204.

Then, in step S204, based on the cycle time of the substrate B, the number of components C to be removed from the wafer W is obtained by the next thermal expansion correction update timing, and based on the obtained number of components C, the area 111 for removing the components C from the wafer W by the next thermal expansion correction update timing is obtained.

Then, in step S205, the pushing-up portion 8 is imaged by the wafer imaging portion 6 and the board imaging portion 32.

Then, in step S206, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are obtained based on the imaging result of the push-up portion 8. Note that in steps S205 and S206, in detail, the processes of steps S103 to S110 shown in FIG. 8 are performed.

Then, in step S207, the image of the component C is captured by the wafer imaging unit 6.

Then, in step S208, the pushing-up portion 8 pushes up the component C and the head 31 picks up the component C. Note that in steps S207 and S208, in detail, the processes of steps S111 to S119 shown in FIG. 8 are performed.

Then, in step S<b>209 , an image of the component C sucked by the suction nozzle 31 a of the head 31 is captured by the component imaging unit 33 .

Then, in step S<b>210 , the component C is mounted on the board B by the head 31 based on the imaging result of the component C by the component imaging unit 33 .

Then, as shown in FIG. 12, the cycle time is updated in step S211. Note that the cycle time may be updated for each suction group of the head 31 or may be updated for each production of one substrate B. FIG.

Then, in step S212, it is determined whether or not the component C has been mounted at all mounting positions on the board B. If it is determined that component C is not mounted on all mounting positions on board B, the process proceeds to step S203, and component C is mounted on the remaining mounting positions. If it is determined that component C has been mounted at all mounting positions on board B, the process proceeds to step S213.

Then, in step S213, it is determined whether or not the production of the board B is finished. If it is determined that the production of the board B will not be finished, the process proceeds to step S202, and the component C is mounted on the next board B. On the other hand, if it is determined that the production of the board B is finished, the process proceeds to step S214.

Then, in step S214, the substrate B is carried out by the conveyor 2.

Then, in step S215, the cycle time is saved. After that, the control process is terminated.

Other configurations of the second embodiment are the same as those of the first embodiment.

(Effect of Second Embodiment)
The following effects can be obtained in the second embodiment.

In the second embodiment, as described above, the control unit 110 is configured to update the thermal expansion correction at predetermined time intervals. The control unit 110 acquires the area 111 from which the component C is to be removed from the wafer W within a predetermined time interval, captures an image of the push-up unit 8 with the wafer imaging unit 6 at a position P101 corresponding to the acquired area 111, and updates the thermal expansion correction. Accordingly, by updating the thermal elongation correction at predetermined time intervals, the thermal elongation that changes with time can be properly reflected in the thermal elongation correction. In addition, the area 111 from which the component C is to be taken out from the wafer W is acquired within a predetermined time interval, and the thrust-up portion 8 is imaged by the wafer imaging section 6 at the position P101 corresponding to the acquired area 111 to update the thermal expansion correction. As a result, the thrust-up portion 8 can be imaged by the wafer imaging portion 6 at an effective position near the component C and the thermal expansion correction can be updated, so that the accuracy of the thermal expansion correction can be effectively improved.

In addition, since thermal elongation is not linear in many cases, it is preferable from the viewpoint of improving the accuracy of thermal elongation correction to perform thermal elongation correction by imaging the push-up portion 8 with the wafer imaging unit 6 at a plurality of positions. However, when the wafer imaging unit 6 images the push-up portion 8 at a plurality of positions, the time required for thermal expansion correction increases. On the other hand, in the above configuration, the accuracy of thermal expansion correction can be effectively improved, so even if the number of positions where the thrust-up portion 8 is imaged by the wafer imaging unit 6 is reduced, the thermal expansion can be corrected with high accuracy. As a result, it is possible to accurately perform the thermal elongation correction while suppressing an increase in the time required for the thermal elongation correction.

Also, in the second embodiment, as described above, the control unit 110 is configured to acquire the number of components C to be taken out from the wafer W within a predetermined time interval based on the cycle time of the substrate B, and to acquire the area 111 based on the acquired number of components C. Accordingly, based on the number of components C to be removed from the wafer W within a predetermined time interval, it is possible to easily obtain the area 111 from which the components C are to be removed from the wafer W within the predetermined time interval.

Other effects of the second embodiment are the same as those of the first embodiment.

(Modification)
It should be noted that the embodiments disclosed this time should be considered as examples and not restrictive in all respects. The scope of the present invention is indicated by the scope of the claims rather than the above description of the embodiments, and includes all modifications (modifications) within the scope and meaning equivalent to the scope of the claims.

For example, in the above-described first and second embodiments, the head is a mounting head, but the present invention is not limited to this. In the present invention, the head may be a take-out head that picks up components from a wafer and transfers the picked-up components to a mounting head.

Also, in the above-described first and second embodiments, an example in which the board imaging section is provided as the second imaging section has been shown, but the present invention is not limited to this. In the present invention, an imaging section other than the substrate imaging section may be provided as the second imaging section.

Also, in the first and second embodiments, an example in which the push-up portion moving mechanism (second moving mechanism) moves the push-up portion in the X direction (first direction) and the Y direction (second direction) is shown, but the present invention is not limited to this. In the present invention, the second moving mechanism may move the push-up portion in only one of the first direction and the second direction.

Also, in the first and second embodiments, an example in which the control unit acquires the first thermal expansion correction amount and the second thermal expansion correction amount is shown, but the present invention is not limited to this. In the present invention, the control unit may acquire only the first thermal expansion correction amount.

Also, in the above embodiment, for convenience of explanation, a flow-driven flow in which the control processing is performed in order along the processing flow has been described, but the present invention is not limited to this. In the present invention, control processing may be performed by event-driven processing in which processing is executed on an event-by-event basis. In this case, it may be completely event-driven, or a combination of event-driven and flow-driven.

3 head unit 4 head unit moving mechanism (third moving mechanism)
6 Wafer imaging unit (first imaging unit)
7 Wafer imaging unit moving mechanism (first moving mechanism)
8 push-up portion 9 push-up portion moving mechanism (second moving mechanism)
10, 110 control section 31 head 32 board imaging section (second imaging section)
100, 200 Component mounting apparatus 111 Area B Board C Component D1 First thermal expansion correction amount D2 Second thermal expansion correction amount D3 Deviation amount P101 Position corresponding to area X direction (first direction)
Y direction (second direction)
W Wafer

Claims

A component mounting apparatus for taking out components from a diced wafer and mounting them on a substrate,
a first imaging unit that images the component of the wafer from above;
a push-up portion pushing up the component of the wafer from below;
a first moving mechanism for moving the first imaging unit;
a second moving mechanism for moving the push-up portion;
a control unit that captures an image of the pushing-up portion by the first imaging unit, acquires a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism based on the imaging result of the pushing-up portion by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount.
The control unit acquires the imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, captures the component by the first imaging unit while the component is moved to the acquired imaging position, acquires the displacement amount from the position of the push-up unit including the thermal expansion of the second moving mechanism to the position of the component based on the imaging result of the component by the first imaging unit, and obtains the push-up position of the component by the push-up unit based on the displacement amount. 2. The component mounting apparatus according to claim 1, configured as follows.
a head unit including a head for taking out the components of the wafer from above;
a second imaging section provided in the head unit;
a third moving mechanism for moving the head unit,
3. The component mounting apparatus according to claim 1 or 2, wherein the control unit is configured to capture an image of the push-up portion by the second imaging unit, acquire a second thermal expansion correction amount including the thermal expansion of the third moving mechanism and the thermal expansion of the second moving mechanism based on the imaging result of the push-up portion by the second imaging unit, and perform thermal expansion correction based on the first thermal expansion correction amount and the second thermal expansion correction amount.
The control unit acquires the imaging position of the component by the first imaging unit based on the first correction amount of thermal expansion, captures the component by the first imaging unit while being moved to the acquired imaging position, acquires the amount of deviation from the position of the push-up unit including the thermal elongation of the second moving mechanism to the position of the component based on the imaging result of the component by the first imaging unit, and acquires the position of the component pushed up by the thrust-up unit based on the amount of deviation. 4. The component mounting apparatus according to claim 3, wherein the picking position of the component by the head is obtained based on the deviation amount and the second thermal expansion correction amount.
The first moving mechanism is configured to move the first imaging unit in a first direction and a second direction that are substantially perpendicular to each other in a horizontal plane,
The second moving mechanism is configured to move the push-up portion in the first direction and the second direction,
5. The component mounting apparatus according to claim 3, wherein said third moving mechanism is configured to move said head unit in said first direction and said second direction.
The component mounting apparatus according to any one of claims 3 to 5, wherein the control section is configured to image the push-up section with the first imaging section in a state in which the first imaging section and the push-up section are moved to the same first target position, and to image the push-up section with the second imaging section in a state in which the second imaging section and the thrust-up section are moved to the same second target position as the first target position.
The control unit is configured to update the thermal elongation correction at predetermined time intervals,
The component mounting apparatus according to any one of claims 1 to 6, wherein the control unit acquires an area from which the component is to be removed from the wafer within the predetermined time interval, captures an image of the push-up unit with the first imaging unit at a position corresponding to the acquired area, and updates thermal expansion correction.
The component mounting apparatus according to claim 7, wherein the control unit acquires the number of the components to be taken out from the wafer within the predetermined time interval based on the cycle time of the substrate, and acquires the area based on the acquired number of the components.
The component mounting apparatus according to any one of claims 1 to 8, wherein the push-up section is configured so as not to have an imaging section.