KR101960693B1 - Component loading method and component mounting apparatus - Google Patents

Abstract

A component mounting method for mounting components on a substrate by a movable head unit having first and second image pickup units. In this component mounting method, the first and second marks of the first and second marks provided on the apparatus body at the same pitch as the first and second image pickup sections are held by the first image pickup section and the second image pickup section simultaneously A first data acquiring step of recognizing the position of each mark before the mounting operation is started by sensing the position of each mark; a second data acquiring step of re-recognizing the position of each mark after the first data acquiring step; Calculating a parameter relating to a change in a coordinate system due to a thermal influence of a drive mechanism of the head unit based on the positions of the first and second marks; And a target position correcting step of converting the head unit into coordinates based on the coordinate system, and moves the head unit based on the target coordinates after the conversion.

Description

TECHNICAL FIELD [0001] The present invention relates to a component mounting method and a component mounting apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus, and more particularly, to a component mounting method capable of suppressing displacement of a component mounting position due to thermal deformation of a drive shaft or the like and a component mounting apparatus capable of implementing the method.

In a component mounting apparatus that mounts (mounts) a component on a substrate such as a printed wiring board by moving the component mounting head unit in the XY axis direction by the XY robot, thermal expansion (thermal deformation) occurs in the drive shaft by continuous operation, The actual mounting position of the component may deviate from the predetermined mounting position due to this. In order to solve this problem, a reference mark provided on the apparatus main body is periodically photographed by one camera mounted on the head unit, and a head (not shown) So that the target coordinates of the unit are corrected (for example, Japanese Unexamined Patent Application Publication No. 2014-120724).

In addition to the thermal expansion of the drive shaft described above, due to machining errors and assembly errors of the components constituting the component mounting apparatus, due to inherent distortion inherent in the apparatus itself, In some cases. In order to solve such a problem, two cameras are installed in the head unit, and a jig board having a plurality of reference marks attached thereto before the start of operation is placed at a working position, each reference mark is picked up by each camera, The inclination of the head unit is calculated in advance based on the position of the image, and the target coordinate of the head unit at the time of mounting the component is corrected using the result (see, for example, JP-A-2013-239517 ).

However, when thermal expansion occurs in the drive shaft due to continuous operation, a slight change also occurs in the posture of the head unit due to the thermal expansion. Therefore, in order to correct the coordinates of the head unit at the time of component mounting more accurately, it is also necessary to take into consideration a movement error caused by a change in the posture of the head unit due to the thermal expansion of the drive shaft. However, as in Patent Document 1, a method for obtaining a thermal expansion change amount by capturing a reference mark by a single camera is to correct the positional deviation of the mark image in the X- and Y-axis directions by the thermal expansion of the drive shaft, Therefore, it can not be said that the above-described attitude change of the head unit is sufficiently reflected. Patent Document 2 discloses that the inclination of the head unit is calculated before starting the work and the target coordinate of the head is corrected based on the inclination as described above so that the change in attitude of the head unit due to the thermal expansion of the drive shaft is reflected no.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a technique capable of highly suppressing displacement of a component mounting position due to thermal influence of a drive mechanism of a head unit such as thermal deformation (thermal expansion) .

The present invention has a head unit including a head for mounting a component and first and second imaging units and movably supported by the apparatus main body, and the head unit mounts the component on a substrate disposed at a working position of the apparatus main body Wherein a first mark of a first mark and a second mark provided on the apparatus body at the same pitch as the first and second image sensing units are provided by the first image sensing unit, A first data acquisition step of recognizing a position of each of the marks before the mounting operation is started by imaging the marks at the same time by the second imaging section; A second data acquisition step of recognizing the position of each of the marks again by imaging the second marks at the same time by the second imaging section; Calculating a parameter relating to a change in a coordinate system due to a thermal influence of a drive mechanism for driving the head unit based on the position of the recognized first and second marks; And a target position correcting step of converting the target position into coordinates based on a coordinate system after the change by coordinate transformation using the parameter. The head unit is moved based on the target coordinates after the conversion in the target position correcting step.

1 is a plan view showing a component mounting apparatus according to the present invention.
2 is a front view of the component mounting apparatus.
3 is a block diagram showing a control system of the component mounting apparatus.
4 is a schematic diagram for explaining the position of the reference mark pair and the order of imaging of the reference mark pair by the first and second head cameras.
5 is a flowchart showing the control of the position correction data acquisition process.
6 is a flowchart showing the control of the component mounting operation.
7 is a view for explaining a method of correcting the target coordinates when the head unit is moved.
8 is a plan view showing a modified example of the component mounting apparatus.
Fig. 9 is a schematic diagram for explaining the positions of reference mark pairs in the component mounting apparatus of Fig. 8 and the order of imaging of reference mark pairs by the first and second head cameras;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Configuration of component mounting apparatus]

1 and 2 show a component mounting apparatus 1 (a component mounting apparatus to which the component mounting method according to the present invention is applied) according to the present invention. Fig. 1 is a plan view, and Fig. 2 is a front view showing the component mounting apparatus 1, respectively.

The component mounting apparatus 1 includes an apparatus main body 2 having a base, a substrate carrying section 3 for carrying a substrate PB such as a printed wiring board on the apparatus main body 2, A head unit 6 movably supported by the apparatus main body 2, and parts cameras 7, 7.

The substrate conveying section 3 includes a pair of conveyors 4 for conveying the substrate PB in the X-axis direction. The conveyor 4 is a so-called belt conveyor. The conveyor 4 receives the substrate PB from the right side (X1 direction side) in FIGS. 1 and 2 and conveys it to a predetermined working position (position shown in the drawing) (PB) to the left side (X2 direction side) of the drawing. In the following description, only the upstream side and the downstream side refer to the transport direction of the substrate PB.

The component supply part 5 is disposed on both the front and back sides (both sides in the Y-axis direction) of the substrate conveying part 3. A plurality of tape feeders 5a are arranged along the conveyor 4 in each of the component feeding parts 5. Each of the tape feeders 5a serves as a carrier to supply surface mounted components (chip parts) on small pieces such as ICs, transistors, capacitors, and the like.

The head unit 6 draws a component from each component supply unit 5 and mounts (mounts) the component on the substrate PB. The head unit 6 drives the X- Direction and a Y-axis direction. More specifically, the head unit driving mechanism includes a pair of fixed rails 10 fixed on the high-priced frame and extending in the Y-axis direction, and a pair of stationary rails 10 movably supported by the stationary rails 10, A unit support member 11 and a ball screw shaft 12 screwed into the unit support member 11 and driven by a Y axis servomotor 13. [ The head unit driving mechanism includes a fixed rail 14 fixed to the unit supporting member 11 and supporting the head unit 6 movably in the X axis direction, And a ball screw shaft 15 driven by the servo motor 16 as a drive source. That is, the head unit driving mechanism moves the head unit 6 in the X-axis direction by the X-axis servomotor 16 through the ball screw shaft 15 and moves the Y- The unit supporting member 11 is moved in the Y-axis direction by the arm 13. As a result, the head unit 6 is moved in the X-axis direction and the Y-axis direction within a certain area.

The head unit 6 is provided with a plurality of shaft-shaped heads 20 and a head driving mechanism for driving these heads 20. In this case, the head units 6 are arranged in a line in the X-axis direction and have five heads 20 in total. The head driving mechanism has a lift driving mechanism that has a Z-axis servo motor 24 (see Fig. 3) corresponding to each head 20 and lifts (moves in the Z direction) the heads 20 individually, A rotary drive mechanism that has an R-axis servo motor 25 (see Fig. 3), which is one elevation drive mechanism common to the head 20, and rotates the heads 20 simultaneously around the head central axis (R direction) . The servo motors 13, 16, 24 and 25 are provided with encoders 13a, 16a, 24a and 25a (see Fig. 3) A signal indicating the position information is output from the controller 30 to be described later.

At the front end of each head 20, a nozzle for component suction is provided. Each of the nozzles is in communication with the negative pressure generating device through a motor-operated switching valve. Negative pressure is supplied from the negative pressure generating source device to each nozzle, so that the nozzles can adsorb the component.

The head unit 6 further includes first and second head cameras 22a and 22b (corresponding to the first imaging section and the second imaging section of the present invention) at the front portion (the lower section in Fig. 1) . These head cameras 22a and 22b pick up an out-of-plane reference mark provided on the substrate PB and image the first to third reference mark pairs M1 to M3 provided on the apparatus main body 2 . The reference mark provided on the substrate PB is a mark for recognizing the position of the substrate PB disposed at the working position. The pair of reference marks M1 to M3 provided in the apparatus main body 2 is subjected to thermal effects such as thermal deformation (thermal expansion) of the ball screw shafts 12 and 15 and / or the unit supporting member 11 This is for correcting the target coordinates at the time of moving the head unit 6 in order to suppress the movement error of the head unit 6 caused.

Both head cameras 22a and 22b are provided with a lighting unit for illuminating a mark, and a camera body including a CCD area sensor or the like. These head cameras 22a and 22b are arranged in a line in the X-axis direction with a predetermined pitch P1 therebetween, and are fixed downward to the head unit 6 for capturing the respective marks. The pitch P1 is a pitch between the optical axes (camera centers) of the head cameras 22a and 22b.

The reference mark pairs M1 to M3 are fixedly installed in a place where thermal deformation (thermal expansion) does not occur during mounting operation of the apparatus main body 2. [ In this case, the conveyor 4 of the substrate conveying section 3 is provided. More specifically, the conveyor 4 is provided on the upper surface of a conveyor frame 4a having a mechanism section such as a conveyor belt 4b.

The first reference mark pair M1 includes two marks M1 and M1 arranged in the X-axis direction. The second reference mark pair M2 also includes two marks M2 and M2 arranged in the X axis direction and the third reference mark pair M3 also includes two marks M3, M3).

Each reference mark pair M1 to M3 is provided around the working position. More specifically, as shown in Figs. 1 and 4, the conveyor 4 on the front side of the apparatus (the Y2 direction side of the apparatus main body 2) is provided with the first reference mark pair The first reference mark M1 and the second reference mark pair M2 are arranged in a line at a predetermined interval and the second reference mark M1 in the X axis direction of the conveyor 4 on the rear side (Y1 direction side of the apparatus main body 2) And a third reference mark pair M3 is disposed at the same position as the pair M2.

The pitch between the marks of the first reference mark pair M1 is equal to the pitch P1 of the head cameras 22a and 22b as shown in FIG. Thus, the head cameras 22a and 22b capture the first reference mark pair M1 at the same time. Concretely, the mark M1 located on the upstream side (X1 direction side) with respect to the first head camera 22a of the two marks M1 and M2 is moved to the downstream side (X2 direction) with the second head camera 22b And the marks M1 located on the left side (the right side). The same applies to the second and third reference mark pairs M2 and M3.

In the following description, the marks M1 to M3 (X1 (X1) to X3 (X1 to X3) picked up by the first head camera 22a among the two marks included respectively in the first to third reference mark pairs M1 to M3 Marks on the direction side are referred to as first marks and marks M1 to M3 (marks on the side in the X2 direction) captured by the second head camera 22b are referred to as second marks.

The parts cameras 7 and 7 pick up images of the parts to recognize the suction state of the parts drawn out from the parts supplying part 5 by the respective heads 20. [ Each of the parts cameras 7 and 7 is provided with an illuminating part for illuminating the parts and a camera body including a CCD line sensor and the like. As shown in Fig. 1, And the substrate transfer section 3, respectively.

[Explanation of the control system of the component mounting apparatus]

Fig. 3 shows a control device 30 of the component mounting apparatus 1. Fig. The control device 30 includes an arithmetic processing unit 32 for controlling the operations of the component mounting apparatus 1 in a general manner, a storage unit 34 for storing various programs and the like, A motor control section 36 for controlling the driving of the servomotors 13, 16, 24 and 25 and a control section for controlling the driving of the first and second head cameras 22a and 22b and the parts cameras 7 and 7 An image processing unit 38 for performing predetermined processing, and an external input / output unit outside the scope. The calculation processing unit 32 is a computer composed of a CPU and a memory and is connected to the storage unit 34, the motor control unit 36 and the input / output unit via the bus 31. [

The arithmetic processing unit 32 executes a mounting program necessary for mounting the component on the board PB and executes various arithmetic processing at that time. Particularly, during the series of mounting operations from the start to the end of the mounting operation, the head cameras 22a and 22b pick up the first to third reference mark pairs M1 to M3 at a predetermined timing as described later (Position correction data acquisition processing) for calculating and storing various parameters for correcting the target coordinates of the head unit 6 based on these image data.

The storage section 34 includes an operation program storage section 35a for storing a mounting program executed by the arithmetic processing section 32 and various data necessary for executing the mounting program, And a correction data storage unit 35b for storing various parameters calculated based on the data.

Based on the position information output from the encoders 13a, 16a, 24a, and 25a built in the motors 13, 16, 24, and 25 and the information provided from the arithmetic processing unit 32, (13, 17, 24, 25).

The image processing section 38 is connected to the head cameras 22a and 22b and the component cameras 7 and 7 and introduces the image signals from the head cameras 22a and 22b and the component cameras 7 and 7 Performs predetermined image processing, and transfers the image data to the arithmetic processing unit 32.

Although not shown, various kinds of sensors provided in the component mounting apparatus 1 are connected to the external input / output unit.

The control unit 30 also serves as the control unit, the arithmetic unit, and the storage unit of the present invention. More specifically, the arithmetic processing unit 32 corresponds to the control unit and the arithmetic unit of the present invention, And the portion 35b corresponds to the storage device of the present invention.

[Position Correction Data Acquisition Process]

The component mounting apparatus 1 controls the drive of each servomotor 13 and the like based on the information given from the arithmetic processing unit 32 so that the head unit 6 is driven by the component supply unit Picks up a component from the tape feeder 5a while reciprocating between the substrates P and P positioned at the work position and the substrate PB positioned at the work position and carries the component on the substrate PB and mounts it in a predetermined position.

Thermal expansion (thermal expansion) is generated in the ball screw shafts 12 and 15 and / or the unit supporting member 11, and the movement error of the head unit 6 due to the thermal deformation And the mounting position of the component may deviate from the intended mounting position. Therefore, in the component mounting apparatus 1, the head cameras 22a and 22b pick up the reference mark pairs M1 to M3, and based on these image data, the target coordinates of the head unit 6 in the mounting operation The position correction data acquisition processing for calculating and storing various parameters for correcting the position correction data is executed.

5 is a flowchart showing an example of the control of the position correction data acquisition process executed by the control device 30. [

This position correction data acquisition processing starts with the startup of the component mounting apparatus 1. When this processing is started, the arithmetic processing unit 32 executes the imaging operation of the first to third reference mark pairs M1 to M3. More specifically, the counter value n of the mark counter is reset to 0 (counter initialization), and the head unit 6 is moved above the conveyor 4 on the front side of the apparatus as shown by the solid line in Fig. 4, The first reference mark pair M1 is imaged by the head cameras 22a and 22b and the position of the first reference mark pair M1 is recognized (steps S1 and S3). That is, the coordinates of the first reference mark pair M1 are acquired. At this time, the first mark of the first reference mark pair M1 is imaged by the first head camera 22a and the second mark is imaged by the second head camera 22b, respectively. Thereafter, the counter value n is incremented by one (step S5), and it is determined whether or not to capture all the reference mark pairs M1 to M3 (whether n = 3) (step S7). If it is determined to be No, the process returns to step S3. Thus, until the determination in Step S7 is YES, the arithmetic processing unit 32 sequentially moves the head unit 6 as indicated by the arrows in Fig. 4 and determines whether the first to third reference mark pairs M1 to M3 The coordinates are obtained.

When it is determined Yes in step S7, the arithmetic processing unit 32 determines whether or not the coordinates of each of the obtained reference mark pairs M1 to M3 are initial data, that is, whether or not the reference mark pairs M1- M3) (step S9). If it is determined as Yes, the coordinate data of each of the obtained reference mark pairs M1 to M3 is used as the initial data E, 35b (step S11).

On the other hand, when it is determined to be No in step S9, that is, when it is determined that the recognition result is the second or later recognition of each reference mark pair (M1 to M3) after startup of the component mounting apparatus 1, The coordinate data of each reference mark pair M1 to M3 acquired in S3 to S7 is stored as update data D in the correction data storage unit 35b separately from the initial data E in step S19 ). Various parameters for correcting the target coordinates of the head unit 6 are calculated based on the initial data E and the elapsed data D stored in the correction data storage unit 35b, In the correction data storage unit 35b (step S21). The various parameters and their operation will be described later.

Next, the arithmetic processing unit 32 determines whether the elapsed data D is stored in the correction data storage unit 35b (step S13). If the elapsed time data D is No, the process proceeds to step S1. Thus, the imaging operation of the reference mark pair M1 to M3 described above is executed, and the coordinate data of the reference mark pair M1 to M3 is acquired. Since the imaging operation in steps S1 to S7 after the step S13 has elapsed is the second imaging operation after the startup of the component mounting apparatus 1, the coordinate data of the reference mark pair (M1 to M3) And becomes data (D).

If it is determined in step S13 that the elapsed data D has already been stored in the correction data storage unit 35b, the arithmetic processing unit 32 determines whether the elapsed time D T) has elapsed (step S15). Here, if the answer is Yes, the arithmetic processing unit 32 carries out the process in step S1, thereby executing the imaging operation of the reference mark pair M1 to M3 and setting the coordinates of the reference mark pair M1 to M3 to .

On the other hand, when the result of the determination in the step S15 is No, the arithmetic processing unit 32 determines whether or not the production of all of the boards PB that have been scheduled (component mounting processing) has been completed, Is turned off (step S17). If the result is No, the arithmetic processing unit 32 proceeds to step S13 to continue the mounting operation, and if it is determined to be Yes, ends the main flowchart.

A series of operations of the position correction data acquisition processing as described above will be schematically described as follows. First, when the component mounting apparatus 1 is started, the head unit 6 moves, and the imaging operation of the first to third reference mark pairs M1 to M3 by the head cameras 22a, 22b is executed twice do. As a result, the initial data E and the elapsed data D are acquired. Various parameters for correcting the target coordinates of the head unit 6 are calculated based on the data E and D, Is stored in the correction data storage unit 35b.

When the predetermined time T elapses, the imaging operation of the first to third reference mark pairs M1 to M3 by the head cameras 22a and 22b is performed, and the imaging operations of the reference mark pairs M1 to M3 The coordinate data, that is, the elapsed data D is updated, the various parameters are computed based on the latest elapsed data D and the initial data E, and the result is updated in the correction data memory And is stored in the storage unit 35b.

Thereafter, the imaging operation of the first to third reference mark pairs M1 to M3 by the head cameras 22a, 22b is performed every predetermined time (T) until the production of all the substrates PB is completed , The elapsed time data D, and the latest elapsed time data D are updated in the correction data storage unit 35b.

In this example, the process of acquiring the initial data E, that is, the process of the first step S3 to the step S7 after the startup of the component mounting apparatus 1 is the "first data acquisition step" Operation ", and the process of acquiring the elapsed data D, that is, the process of the second and subsequent steps S3 to S7 corresponds to the" second data acquisition step "and the" second data acquisition operation "of the present invention, The processing in step S21 corresponds to the " operation step " of the present invention.

Next, the details of the correction of the target coordinates when moving the head unit 6 and the calculation processing thereof (the processing of step S21 in Fig. 5) will be described with reference to Fig.

Fig. 7 is a graph showing the relationship between the target position (theoretical coordinates) at the reference temperature, that is, immediately after the start of the component mounting apparatus 1, the head unit driving mechanism such as the ball screw shafts 12 and 15, The model (white circle) of the head unit 6 when the head unit 6 is disposed and the mounting operation (substrate PB production) after warming, that is, after the startup of the component mounting apparatus 1, The model of the head unit 6 when the head unit 6 is disposed at the specific target coordinates in a state in which the head unit driving mechanism such as thermal deformation (thermal expansion) of the screw shafts 12 and 15 is thermally affected ). Specifically, the white circles in Fig. 7 show the coordinates of the respective head cameras 22a and 22b and the specific one head 20 at the reference temperature, and the black circles in Fig. 7 indicate the positions of the head cameras 22a, 22b) and the coordinates of the specific one head (20).

Here, the reference temperature is a time when the initial data (E) is obtained, and the warm time is when the elapsed data (D) is acquired. In this case, since the initial data E and the elapsed data D are continuously acquired after the component mounting apparatus 1 is started, both the data E and D acquired immediately after startup of the component mounting apparatus 1 ), And the warm-time model shown in Fig. 7 exaggerates the model at the stage where the mounting operation proceeds to some extent.

It is assumed that the head cameras 22a and 22b and the specific head 20 are in the theoretical coordinates of the reference coordinate system since the head unit driving mechanism is not thermally affected at the reference temperature, center position, the second head (x _f1, y _f1 each center position of the center position, and the head 20 of the camera (22b)) of 22a), (x _f2, y _f2), (x _st, y _st) . On the other hand, the center position of the first head camera 22a, the center position of the second head camera 22b, and the center position of the head 20 at warm time are ( _Xf1 , _Yf1 ), ( _Xf2 , Y is represented by _{f2), (x L, y} L).

7, in order to move the head unit 6 to the target coordinates when the production of the substrate PB proceeds and thermal deformation occurs in the ball screw shafts 12 and 15 or the like, the servo motors 13 and 16 The actual head unit 6 is subjected to thermal deformation such as thermal deformation of the ball screw shafts 12 and 15 and a change in attitude of the head unit 6 accompanying the thermal deformation, And is shifted from the target coordinate. Therefore, in order to precisely control the position of the head unit 6, the target coordinates (the theoretical target coordinates) based on the reference coordinate system, i.e., the coordinate system before being subjected to the thermal influence, are changed based on the coordinate system after being subjected to the thermal influence It needs to be converted into coordinates, i.e., corrected. In this case, in the component mounting apparatus 1, since the two reference cameras M1 to M3 are simultaneously picked up by the two head cameras 22a and 22b as described above, the first head camera (Referred to as a first correction coordinate system) based on the imaging result of the second head camera 22a and a coordinate system (referred to as a second correction coordinate system) based on the imaging result of the second head camera 22b can be defined, (Referred to as a second conversion formula) of a coordinate from a reference coordinate system to a first correction coordinate system (referred to as a first conversion formula) and a coordinate from a reference coordinate system to a second correction coordinate system (referred to as a second conversion formula) Can be set. For convenience of explanation, it is assumed that the coordinates of the head 20 are used as the target coordinates of the head unit 6.

_{Here, (x L (f1),} y L (f1)) is the target coordinates after conversion based on the first correction coordinate _{system, (x L (f2),} y L (f2)) is based on the second correction coordinate system Is the target coordinate after conversion. In _{addition, (dx (f1), dy} (f1)), (dx (f2), dy (f2)) is in the first and second correction coordinates respectively of the parallel movement amount, that is, the first, second correction coordinate system (warm during (Coordinate system) moves from the reference coordinate system (the coordinate system at the reference temperature). In addition, K _f1 and K _f2 are conversion matrices, respectively, and a rotation matrix indicating how much the first and second correction coordinate systems change from the reference coordinate system as shown in the following Equations 3 and 4 and a rotation matrix indicating the first and second correction coordinate systems Is expressed by the product of the scale matrix indicating how much the specific inter-distance in the reference coordinate system changes relative to the specified inter-distance.

Here, α _f1, α _f2 is seukeyi ringgap in the X-axis direction, β _f1, β _f2 is seukeyi ringgap the Y-axis direction. Further,? _F1 and? _F2 are angular variation amounts (rotation amounts) of vectors in the X-axis direction, and? _F1 and? _F2 are angular variation amounts of vectors in the Y-axis direction. As described above, the reference temperature time is when the initial data E is obtained, and when the warming time elapsing data D is obtained. Therefore, the values of the above-mentioned α _f1 , α _f2 , β _f1 , β _f2 , θ _f1 , θ _f2 , φ _f1 , and φ _f2 are obtained based on the initial data (E) and the elapsed data (D).

In other words, during the initial data (E), the first head camera (22a) are the coordinates of the image pick-up a pair of reference marks (M1~M3) (first _{mark) (X 11, Y 11)} , (X 21, Y 21 ) And (X ₃₁ , Y ₃₁ ), and the coordinates of the reference mark pair (M1 to M3) (second mark) captured by the second head camera 22b in the initial data E are (X ₁₁ ' Y ₁ '), (X ₂₁ ', Y ₂₁ ') and (X ₃₁ ', Y ₃₁ '), the inter-mark vector a ₁ (a _1x , a _{1y ), b 1 (b 1x,} b 1y) and a second vector between the connection of the second mark marks _{a 2 (a 2x, a 2y} ), b 2 (b 2x, b 2y) is represented as follows.

The vector a ₁ (a _1x , a _1y ) = (X ₂₁ -X ₁₁ , Y ₂₁ -Y ₁₁ )

Vector _{b 1 (b 1x, b 1y} ) = (X 31 -X 11, Y 31 -Y 11)

The vector a ₂ (a _2x , a _2y ) = (X ₂₁ '-X ₁₁ ', Y ₂₁ '-Y ₁₁ ')

The vector b ₂ (b _2x , b _2y ) = (X ₃₁ '-X ₁₁ ', Y ₃₁ '-Y ₁₁ ')

The coordinates (X ₁₂ , Y ₁₂ ), (X ₂₂ , Y ₂₂ ) of the reference mark pair M1 to M3 (first mark) captured by the first head camera 22a in the elapsed data D are (X _32, Y ₃₂₎ is called, and the lapse data (D) of the second camera head (22a) is a reference mark image pick-up pair (M1~M3), the coordinate of the (second mark) ₍₁₂ X ', Y _{12 '), (X 22'} , Y 22 '), (X 32', Y 32 '), a first vector _{a 1 (a 1x, a 1y} ) between mark connecting the two marks in the calibration coordinate system Speaking , B _1, respectively as follows: (B _1x, B _1y) and the vector a ₂ between marks connecting the two marks in the second correction coordinate system _{(a 2x, a 2y),} B 2 (B 2x, B 2y) is .

The vector A ₁ (A _1x , A _1y ) = (X ₂₂ -X ₁₂ , Y ₂₂ -Y ₁₂ )

The vector B ₁ (B _1x , B _1y ) = (X ₃₂ -X ₁₂ , Y ₃₂ -Y ₁₂ )

The vector A ₂ (A _2x , A _2y ) = (X ₂₂ '-X ₁₂ ', Y ₂₂ '-Y ₁₂ ')

The vector B ₂ (B _2x , B _2y ) = (X ₃₂ '-X ₁₂ ', Y ₃₂ '-Y ₁₂ ')

Thus, the first conversion equation (the expression from the vector _{A 1 (a 1x, a 1y} ), b 1 (b 1x, b 1y), a 2 (a 2x, a 2y), b 2 (b 2x, b 2y) 1) seukeyi parameter _{(α f1, β f1, θ} f1, φ f1 , such ringgap) of is obtained as shown in equation 5 to equation 8 below.

Second transformation parameters, such as (the formula 2) seukeyi about ringgap (α _f2, β _f2, θ _f2, φ _f2) similarly the vector _{A 1 (A 1x, A 1y} ), B 1 (B 1x, B 1y ), A ₂ (A _2x , A _2y ), and B ₂ (B _2x , B _2y ).

The parameters dx _(f1) , dy _(f1 ), dx _(f2) , and dy _(f2) relating to the parallel movement amounts of the first and second conversion types are the movement amounts (displacement amounts) of one mark before and after the change of the coordinate system, . Therefore, the corresponding parameters are obtained as shown in the following equations (13) and (14).

Further, dangye In the first conversion equation (the formula 1) seukeyi parameter (α _f1, β _f1, θ _f1, φ _f1) such as ringgap of and parallel to the movement amount parameter (dx _(f1), dy _(f1)) of the present corresponds to the "first parameter" of the invention, and the second transformation parameters (dx _(f2 according to (the formula 2) seukeyi parameter (α _f2, β _f2, θ _f2, φ _f2) such ringgap of and parallel movement _amount), dy _(f2) correspond to the " second parameter " of the present invention, and the step of calculating them corresponds to the " first computation step "

The displacement amounts of the target coordinates from the coordinates based on the reference coordinate system to the coordinates based on the first correction coordinate system, i.e., the correction values dx _{st (f1)} and dy _{st (f1)} The following equation (15) is obtained. The displacement amounts of the target coordinates from the coordinates based on the reference coordinate system to the coordinates based on the second correction coordinate system, that is, the correction values dx _{st (f2)} and dy _{st (f2)} ) Is obtained by the following Expression (16).

Next, as shown in Fig. 7, the first head camera 22a when the head unit 6 is disposed at the target coordinates based on the coordinates of the first head camera 22a at the reference temperature, that is, the reference coordinate system, (X _f1 , y _f1 ), and the coordinates of the second head camera 22a are (x _f2 , y _f2 ), the coordinates of the first head camera 22a at the time of warm- (X _f1 , y _f1 ) of the first head camera 22a and the coordinates (X _f2 , Y _f2 ) of the second head camera 22a when the head unit 6 is disposed at the target coordinate, is represented as the correction value _{(dx st (f1), dy} st (f1)), (dx st (f2), dy st (f2)) the following formula 17, formula 18, using each.

The correction values dxst _(f1) and dyst _(f1) correspond to the first displacement amount of the present invention, and the correction values dxst _(f2) and dyst _(f2) The process of calculating the coordinates (X _f1 , Y _f1 ), (X _f2 , Y _f2 ) of the first and second head cameras 22a and 22b, which corresponds to the "second displacement amount"Quot; second calculation process ".

By the way, based on the first conversion equation converts the coordinates after by the (formula 1), (X _{L (f1),} Y _{L (f1))} are the coordinates based on the first correction coordinate system, while the second conversion equation (formula 2) the coordinate after conversion as determined by _{(X L (f2), Y} L (f2)) are the coordinates based on the second corrected coordinates. Therefore, it is necessary to define a unified transformation formula for transforming the target coordinates based on the reference coordinate system into coordinates based on a single unified correction coordinate system. These conversion equations are obtained by the first and second head cameras 22a and 22b based on the coordinates of the first and second head cameras 22a and 22b at the warm time obtained in Eqs. 17 and 18, that is, based on the first and second correction coordinate systems ) coordinates (X _f1, Y _f1), (X _f2, Y _f2) and the first and second based on the first, the coordinate, that is, the reference coordinate system of the second head camera (22a, 22b) at the time of the reference temperature of the Can be defined as a two-point mapping transformation expression as shown in the following expression (19) using the coordinates (x _f1 , y _f1 ) and (x _f2 , y _f2 ) of the head cameras (22a, 22b)

Here, (dx, dy) is the parallel movement amount from the coordinate system (reference coordinate system) at the reference temperature to the coordinate system at the warming time. L is a transformation matrix, and a rotation matrix indicating how much the coordinate system at the time of warming changes from the coordinate system at the reference temperature as shown in the following Equation 20 and the rotation matrix indicating the specific inter- And a scale matrix indicating how much the change is in comparison with the scale matrix.

Here,? Is a scoring value in the X and Y-axis directions. Further,? Is an angle change amount (rotation amount). As described above, the coordinates of the first and second head cameras 22a and 22b based on the coordinate system (reference coordinate system) at the reference temperature are (x _f1 , y _f1 ) and (x _f2 , y _f2 ) Since the coordinates of the first and second head cameras 22a and 22b are (X _f1 , Y _f1 ) and (X _f2 and Y _f2 ) 22a, 22b) coordinates) to connect the vector a (a _x, a _y) and coordinates of two points (the first and second head camera (22a, 22b) at the time of ongam) a vector a connection (a _x, of A _y ) is as follows.

The vector a (a _x , a _y ) = (x _f2 -x _f1 , y _f2 -y _f1 )

The vector A (A _x , A _y ) = (X _f2 -X _f1 , Y _f2 -Y _f1 )

Accordingly, the vector a (a _x, a _y), A (A _x, A _y) by using the parameter such as seukeyi ringgap on the conversion equation (equation 19) (α _1, θ) is the following formula 21, formula 22 < / RTI >

Since the parameters dx and dy relating to the parallel movement amount of the conversion formula (Expression 19) can be defined as the movement amounts (displacement amounts) of one coordinate, the following Expression 23 .

Thus, a unified transformation equation (expression 19) for transforming the coordinates at the reference temperature into the coordinates at the warm time is defined.

In the process of step S21 in Fig. 5, based on the initial data (E) and the elapsed data (D) stored in the correction data storage unit 35b, various parameters for obtaining the conversion formula defined by the above- (Dx, dy) relating to the parallel movement amount, and the result is stored in the correction data storage unit 35b in a renewal manner.

In the present embodiment, the parameters (?,?) And the parameters (dx, dy) concerning the translation amount correspond to the "third parameter" of the present invention, Corresponds to the " third calculation process " of the present invention.

[Production process of substrate PB (component packaging process)]

Fig. 6 is a flowchart showing an example of control of the production process (component mounting process) of one substrate PB executed by the control device 30. Fig.

As shown in the figure, when the production process of the substrate PB is started, the operation processing section 32 loads the production program corresponding to the substrate PB to be the object from the operation program storage section 35a It is determined whether or not the initial data E and the elapsed data D have been acquired, that is, whether or not the data E and D are stored in the correction data storage unit 35b (step S33 ). If it is judged Yes, the arithmetic processing unit 32 drives the substrate conveying unit 3 to drive the substrate conveying unit 3 from the upstream apparatus such as the printing apparatus adjacent to the upstream side of the component mounting apparatus 1, And the substrate PB is placed at the working position (step S35). That is, in the component mounting apparatus 1, the production of the substantial substrate PB is started after the reference mark pairs M1 to M3 are recognized at least twice.

Next, the arithmetic processing unit 32 moves the head cameras 22a and 22b together with the head unit 6 to the upper side of the substrate PB, and the first head camera 22a (or the second head camera 22b) (Step S37). The position of the substrate PB positioned at the working position is recognized by taking a non-specified reference mark provided on the upper surface of the substrate PB by the first head camera 22a. At this time, the calculation processing unit 32 compares the target coordinates of the head unit 6 with the various parameters (?,?, Dx, dy) stored in the correction data storage unit 35b and the conversion formula 19). That is, the calculation processing unit 32 corrects the target coordinates of the head unit 6 and controls the servo motors 13 and 16 via the motor control unit 36 based on the corrected target coordinates. This makes it possible to accurately move the head unit 6 to the target coordinates without being influenced by the thermal influence of the head unit driving mechanism, and as a result, it becomes possible to recognize the accurate position of the substrate PB.

When the recognition of the position of the substrate PB is completed, the arithmetic processing unit 32 moves the head unit 6 to the component supply unit 5 and picks up the component from the tape feeder 5a by each head 20 And the head unit 6 is moved upwardly of the substrate PB via the upper part of the camera 7 for parts so as to perform image recognition of the attracted parts of the respective heads 20. Thereafter, Is mounted at a predetermined position on the substrate PB (step S39).

The computation processing unit 32 stores the target coordinates of the head unit 6 determined from the position of the programmed tape feeder 5a and the placement position of the parts in the correction parameter storage unit 35b ?,?, dx, dy) and the above-mentioned conversion formula (Equation 19) using the corresponding parameter. That is, the calculation processing unit 32 corrects the target coordinates of the head unit 6 and controls the servo motors 13 and 16 via the motor control unit 36 based on the corrected target coordinates. This makes it possible to accurately move the head unit 6 to the target coordinates without being influenced by the thermal influence of the head unit drive mechanism and to prevent the pickup of the components in the tape feeder 5a It is possible to accurately mount the parts. When it is judged from the recognition result of the reference mark on the board PB that there is a deviation of the board PB with respect to the working position and also from the recognition result of the suction component by the component camera 7, The arithmetic processing unit 32 corrects the target coordinates of the head unit 6 based on the positional deviation of the substrate PB and the deviation of the adsorption of the components, Is further corrected.

Next, the arithmetic processing unit 32 determines whether or not all the components of the board PB have been mounted (step S41), and if the result is NO, the arithmetic processing unit 32 shifts the process to step S39 , The component sucking in the tape feeder 5a and the mounting of the component on the board PB are repeatedly executed. If it is determined in step S41 that the mounting of all the components of the substrate PB is completed, the arithmetic processing unit 32 drives the substrate transfer section 3 to transfer the substrate PB And is carried out from the component mounting apparatus 1. This completes the control of a series of production processes for one substrate PB.

In this case, the process of correcting the target coordinates of the head unit 6 in the substrate position recognition in step S37 and the component mounting process in step S39 corresponds to the "target position correcting process" of the present invention.

As described above, in this component mounting apparatus 1, the recognition results of the first to third reference mark pairs M1 to M3 by the head cameras 22a, 22b at the reference temperature and the recognition results of the head camera 22a ,?, Dx, dy concerning the change of the coordinate system due to the thermal influence of the head unit drive mechanism are calculated based on the recognition results of the reference mark pairs M1 to M3 by the head mark drive units 22a, 22b. In the production process of the substrate PB, the target coordinates at the time of moving the head unit 6 are converted into the coordinates based on the coordinate system after the thermal influence by the conversion formula (Expression 19) using the above parameters. That is, after the target coordinates are corrected, the head unit 6 is moved based on the corrected target coordinates. Therefore, it is possible to satisfactorily eliminate the misalignment of the mounting position of the component due to the thermal influence (thermal deformation of the drive shaft, etc.) of the head unit drive mechanism.

Particularly, when the head unit 6 is changed or deformed due to thermal deformation (thermal expansion) of the ball screw shafts 12, 15 and / or the unit supporting member 11, The positional deviation of the first mark 6 appears as a difference between the change of the position of the first mark and the change of the position of the second mark. Therefore, as described above, the first and second marks of each of the reference mark pairs M1 to M3 are simultaneously imaged by the two head cameras 22a and 22b moving together with the head unit 6, (19) is obtained on the basis of the above formula (19), a reference mark is picked up by a single camera mounted on the head unit as in the prior art, a conversion formula is obtained on the basis of the image pickup result, It is possible to correct the target coordinates of the head unit 6 more accurately than when the coordinates are converted (corrected). Therefore, according to the component mounting apparatus 1, it is possible to more highly suppress the displacement of the mounting position of the component due to the thermal influence of the head unit driving mechanism.

Further, in this component mounting apparatus 1, the imaging operation of the first to third reference mark pairs M1 to M3 by the head cameras 22a, 22b is performed every predetermined time T elapses, The parameters?,?, Dx, and dy are calculated based on the latest elapsed data D and the initial data E acquired by the renewal data storage unit 35b. Therefore, it is necessary to continuously and precisely correct the target coordinates of the head unit 6 in accordance with the state of the thermal influence of the head unit drive mechanism that changes over time, and furthermore, There is an advantage that it can be maintained satisfactorily in the long term.

The above-described component mounting apparatus 1 is an example of a preferred embodiment of the component mounting apparatus 1 according to the present invention. The component mounting apparatus 1 includes a specific configuration of the component mounting apparatus 1, Can be suitably changed within a range that does not deviate from the gist of the present invention.

For example, although three reference mark pairs M1 to M3 are provided in the apparatus main body 2 in the above embodiment, the number of reference mark pairs is not limited to three, but may be four or more. For example, FIG. 8 shows an example in which six reference mark pairs M1 to M6 are installed. More specifically, the first to third reference mark pairs M1 to M3 are provided in order from the upstream side to the conveyor 4 (conveyor frame 4a) on the front side of the apparatus, and the conveyor 4 The fourth to sixth reference mark pairs M4 to M6 are provided in order from the downstream side in the conveyor frame 4a). In the case of the component mounting apparatus 1 shown in this figure, the head cameras 6a, 6b, and 6c are sequentially moved by the head cameras 22a, 22b while moving the head unit 6, The sixth reference mark pair M1 to M6 may be picked up. Even when the six reference mark pairs M1 to M6 are provided as described above, the first to sixth reference mark pairs M1 to M6 are formed in the same manner as in the case of recognizing the three reference mark pairs M1 to M3 as described above. M6 on the basis of the recognition result of the head unit driving mechanism and calculates the parameters related to the change of the coordinate system due to the thermal influence of the head unit driving mechanism and corrects the target coordinates when the head unit 6 is moved by the coordinate conversion using the above- .

In the position correction data acquisition process (Fig. 5) of the above embodiment, the imaging operation of the reference mark pair M1 to M3 is performed by the head cameras 22a and 22b every predetermined time T elapses , That is, the elapsed data D is acquired (step S15 in Fig. 5), the interval for acquiring the elapsed data D may be in accordance with conditions other than the time. For example, the elapsed time data D may be acquired at the time when the number of production of the substrate PB or the production lot number reaches a predetermined value.

Although the initial data E and the elapsed data D after the startup of the component mounting apparatus 1 are acquired almost continuously in the position correction data acquisition processing of the above embodiment, The acquisition of the elapsed data D may be started at a timing at which a change is expected to occur in the coordinate system. For example, a temperature sensor for detecting the temperature of the ball screw shafts 12 and 13 may be provided, and the acquisition of the elapsed data D may be started when the detected temperature of the temperature sensor reaches a predetermined temperature or more . In the above embodiment, to acquire the initial data E and the elapsed data D after starting the component mounting apparatus 1 almost continuously, the initial elapsed data D after acquiring the initial data E is acquired This is to avoid such a delay because the actual start of the mounting operation is delayed so much as the time until the time till the time t1 becomes longer.

Although the reference mark pairs M1 to M3 are provided on the conveyor 4 (conveyor frame 4a) in the component mounting apparatus 1, the reference mark pairs M1 to M3 are provided on the head cameras 22a and 22b Or may be provided at another position of the conveyor 4 as long as the position is capable of image pickup by the conveyor 4. Further, it may be provided at a position other than the conveyor 4.

The present invention described above can be summarized as follows.

The present invention has a head unit including a head for mounting a component and first and second imaging units and movably supported by the apparatus main body, and the head unit mounts the component on a substrate disposed at a working position of the apparatus main body Wherein a first mark of a first mark and a second mark provided on the apparatus body at the same pitch as the first and second image sensing units are provided by the first image sensing unit, A first data acquisition step of recognizing a position of each of the marks before the mounting operation is started by imaging the marks at the same time by the second imaging section; A second data acquisition step of recognizing the position of each of the marks again by imaging the second marks at the same time by the second imaging section; Calculating a parameter relating to a change in a coordinate system due to a thermal influence of a drive mechanism for driving the head unit based on the position of the recognized first and second marks; And a target position correcting step of converting the target position into coordinates based on a coordinate system after the change by the coordinate conversion using the parameter. The head unit is moved based on the target coordinates after the conversion in the target position correcting step.

That is, when the first mark is captured by the first imaging unit and the second mark by the second imaging unit at the same time and at different times, the head unit The positional deviation of the head unit resulting from a change or a change in the posture of the first mark is shown as a difference between the change of the position of the first mark and the change of the position of the second mark. Therefore, the first and second marks provided on the apparatus main body are picked up by the first and second pick-up units mounted on the head unit at the same time and at different times as described above, And the target coordinates at the time of moving the head unit are converted into coordinates based on the changed coordinate system by the coordinate conversion using the parameter to obtain the thermal influence of the driving mechanism It is possible to move the head unit to the target coordinates. In other words, it is possible to more highly suppress the displacement of the mounting position of the component due to the thermal influence of the drive mechanism (thermal deformation of the drive shaft).

In this case, in order to increase the accuracy of correction (conversion) of the target coordinates when the head unit is moved, a pair of reference marks consisting of the first and second marks is provided at a plurality of positions around the working position, In the second data acquisition step, the first mark is captured by the first imaging unit and the second mark by the second imaging unit, respectively, for each reference mark pair, and the first and second It is preferable to calculate the parameter based on the positions of the first and second marks of each reference mark pair recognized in the first and second data acquisition steps.

In particular, if at least three reference mark pairs are provided, it is possible to arrange each of the two axes (X-axis direction and Y-axis direction) (Rotation) in each of two orthogonal directions (X-axis direction and Y-axis direction) can be detected, and the accuracy of correction (conversion) of the target coordinates when moving the head unit can be increased Lt; / RTI >

In the component mounting method, the second data acquiring step is executed a plurality of times based on predetermined conditions between the start and the end of the mounting operation, and each time the second data acquiring step is executed, Based on the positions of the first and second marks recognized in the first data obtaining step and the positions of the first and second marks recognized in the latest second data obtaining step, In the target position correcting step, it is preferable to convert the target coordinates into coordinates based on the changed coordinate system by coordinate transformation using the latest parameters.

According to this method, since the parameters are updated on the basis of predetermined conditions, the target coordinates of the head unit can be corrected continuously and precisely.

Further, in the component mounting method, more specifically, the calculating step may calculate the first parameter based on the position of the first mark recognized in the first and second data acquiring steps, A first calculation step of calculating a second parameter based on a position of a second mark recognized in the second data acquisition step, and a second calculation step of calculating a second displacement, which is a displacement amount of the target coordinate before and after the conversion by the coordinate transformation using the first parameter And a second displacement amount that is a displacement amount of the target coordinate before and after the conversion by the coordinate transformation using the second parameter and calculates the position of the first and second imaging units based on the coordinate system before the change, A second calculation step of calculating positions of the first and second image pickup units based on the coordinate system after the change by the amount of displacement and a second calculation step of calculating the position of the first and second image pickup units based on the coordinate system before the change And a third parameter for converting the target coordinates of the head unit based on the coordinate system before the change to the coordinates based on the coordinate system after the change based on the positions of the first and second image pickup units based on the coordinate system after the change And in the target position correcting step, the target coordinates of the head unit are converted into coordinates based on the changed coordinate system by the coordinate conversion using the third parameter.

According to the component mounting method, it is possible to effectively suppress the displacement of the mounting position of the component due to the thermal influence of the drive mechanism.

On the other hand, the component mounting apparatus of the present invention has a head for mounting a component, a first and a second image pickup unit, and a head unit movably supported by the apparatus main body. A first and a second mark provided on the apparatus body at the same pitch as the first and second image pickup units and a first mark of the first and second marks, A first data acquisition operation for recognizing the position of each of the marks before the start of the mounting operation by imaging the second mark by the second imaging section at the same time by the first imaging section, In order to execute a second data acquisition operation of recognizing the position of each of the marks again by imaging the mark by the first imaging section and the second mark by the second imaging section at the same time, A change in a coordinate system due to a thermal effect of a drive mechanism for driving the head unit based on the positions of the first and second marks recognized by the first and second data acquisition operations; And a calculation device for calculating a target parameter of the head unit and converting the target coordinates when the head unit is moved into coordinates based on the changed coordinate system by coordinate conversion using the parameter, And controls the operation of the head unit based on the target coordinates after being converted by the apparatus.

More specifically, it further includes a storage device for storing the parameters in a renewal manner, and the control device executes the second data acquisition operation a plurality of times based on a predetermined condition between the start and the end of the mounting operation And the arithmetic and logic unit calculates the positions of the first and second marks recognized by the first data acquiring operation and the positions of the first and second marks recognized by the first and second data acquiring operations, The parameter is calculated based on the position of the second mark, the parameter is updated in the storage device, and the target coordinate is stored in the coordinate system after the change by the coordinate conversion using the parameter stored in the storage device As shown in FIG.

With these component mounting apparatuses, the mounting operation of the components based on the component mounting method described above can be automated and executed.

Claims (9)

1. A component mounting apparatus for mounting a component on a substrate placed at a working position of the apparatus main body by a head unit having a component mounting head and first and second image pickup units and movably supported by the apparatus main body, A component mounting method in an apparatus,
Wherein the first and second marks of the first and second marks provided on the apparatus body at the same pitch as the first and second imaging units are imaged by the first imaging unit and the second imaging unit by the second imaging unit, A first data acquiring step of recognizing the positions of the marks before the mounting operation is started,
A second data acquisition step of recognizing the positions of the respective marks again by imaging the first mark by the first imaging section and the second mark by the second imaging section at the same time after the first data acquisition step, and,
An arithmetic operation step of calculating a parameter related to a change in a coordinate system due to a thermal influence of a drive mechanism for driving the head unit based on the positions of the first and second marks recognized in the first and second data acquisition steps,
A target position correcting step of converting target coordinates when the head unit is moved into coordinates based on a coordinate system after change by coordinate transformation using the parameters;
And moving the head unit based on the target coordinates after the conversion in the target position correction step,
The reference mark pair consisting of the first and second marks may be provided at a plurality of positions around the working position,
Wherein in the first and second data acquisition steps, the first mark is captured by the first image pickup unit and the second mark by the second image pickup unit for each reference mark pair, 1, recognizes the position of the second mark,
Wherein the calculation step calculates the parameter based on the positions of the first and second marks of each reference mark pair recognized in the first and second data acquisition steps. delete The method according to claim 1,
Wherein at least three reference mark pairs are provided. The method according to claim 1 or 3,
The second data acquiring step is executed a plurality of times based on predetermined conditions between the start and the end of the mounting operation and the arithmetic operation is executed every time the second data acquiring step is executed,
The calculation step may update the parameters based on the positions of the first and second marks recognized in the first data acquisition step and the positions of the first and second marks recognized in the latest second data acquisition step Respectively,
Wherein the target position correction step converts the target coordinates into coordinates based on a coordinate system after the change by coordinate transformation using the latest parameters. The method according to claim 1 or 3,
In the calculating step,
Based on the position of the first mark recognized in the first and second data acquiring steps, and calculates the second parameter based on the position of the second mark recognized in the first and second data acquiring steps, A first calculation step of calculating two parameters,
A first amount of displacement which is the amount of displacement of the target coordinate before and after the conversion by the coordinate transformation using the first parameter and a second amount of displacement that is the amount of displacement of the target coordinate before and after the conversion by the coordinate transformation using the second parameter are calculated A second calculation step of calculating positions of the first and second image pickup units based on the positions of the first and second image pickup units based on the coordinate system before the change and the coordinate system after the change with the first and second displacement amounts;
Based on the position of the first and second imaging units based on the position of the first and second imaging units based on the coordinate system before the change and the position of the first and second imaging units based on the coordinate system after the change based on the coordinate system after the change And a third calculation step for calculating a third parameter for converting the coordinates into coordinates,
Wherein the target position correction step converts the target coordinates of the head unit into coordinates based on the changed coordinate system by coordinate transformation using the third parameter. 1. A component mounting apparatus for mounting a component on a substrate placed at a working position of the apparatus main body by a head unit having a component mounting head and first and second image pickup units and movably supported by the apparatus main body, As an apparatus,
A plurality of reference mark pairs which are formed at first and second marks provided at the same pitch as the first and second image sensing units and which are provided at a plurality of positions around the respective working positions,
The first and second marks of the first and second marks are captured by the first imaging section and the second imaging section by the second imaging section for each reference mark pair, A first data acquisition operation for recognizing the position of each mark and a second data acquisition operation for acquiring a first mark for the reference mark pair by the first imaging section and a second mark for the reference mark pair by the second imaging section A control device for controlling the operation of the head unit to perform a second data acquisition operation of recognizing the position of each of the marks again for each reference mark pair,
A parameter relating to a change in the coordinate system due to the thermal influence of the drive mechanism driving the head unit is calculated based on the positions of the first and second marks of the reference mark pairs recognized in the first and second data acquisition operations And an arithmetic unit for converting the target coordinates at the time of moving the head unit into coordinates based on the coordinate system after the change by the coordinate conversion using the parameter,
And the control device controls the operation of the head unit based on the target coordinates after being converted by the computing device. The method according to claim 6,
Further comprising a storage device for storing the parameter in a renewal manner,
The control device executes the second data acquisition operation a plurality of times based on predetermined conditions between the start and the end of the mounting operation,
Wherein each time the second data acquisition operation is performed, the arithmetic unit calculates the position of the first and second marks recognized in the first data acquisition operation and the positions of the first and second marks recognized in the latest second data acquisition operation And stores the parameter in the storage device in a renewal manner. Further, the target coordinate is stored in the coordinate system based on the coordinate system after the change by the coordinate transformation using the parameter stored in the storage device To the component mounting apparatus. 1. A component mounting apparatus for mounting a component on a substrate placed at a working position of the apparatus main body by a head unit having a component mounting head and first and second image pickup units and movably supported by the apparatus main body, A component mounting method in an apparatus,
Wherein the first and second marks of the first and second marks provided on the apparatus body at the same pitch as the first and second imaging units are imaged by the first imaging unit and the second imaging unit by the second imaging unit, A first data acquiring step of recognizing the positions of the marks before the mounting operation is started,
A second data acquisition step of recognizing the positions of the respective marks again by imaging the first mark by the first imaging section and the second mark by the second imaging section at the same time after the first data acquisition step, and,
An arithmetic operation step of calculating a parameter related to a change in a coordinate system due to a thermal influence of a drive mechanism for driving the head unit based on the positions of the first and second marks recognized in the first and second data acquisition steps,
A target position correcting step of converting target coordinates when the head unit is moved into coordinates based on a coordinate system after change by coordinate transformation using the parameters;
And moving the head unit based on the target coordinates after the conversion in the target position correction step,
In the calculating step,
Based on the position of the first mark recognized in the first and second data acquiring steps, and calculates the second parameter based on the position of the second mark recognized in the first and second data acquiring steps, A first calculation step of calculating two parameters,
A first amount of displacement which is the amount of displacement of the target coordinate before and after the conversion by the coordinate transformation using the first parameter and a second amount of displacement that is the amount of displacement of the target coordinate before and after the conversion by the coordinate transformation using the second parameter are calculated A second calculation step of calculating positions of the first and second image pickup units based on the positions of the first and second image pickup units based on the coordinate system before the change and the coordinate system after the change with the first and second displacement amounts;
Based on the position of the first and second imaging units based on the position of the first and second imaging units based on the coordinate system before the change and the position of the first and second imaging units based on the coordinate system after the change based on the coordinate system after the change And a third calculation step for calculating a third parameter for converting the coordinates into coordinates,
Wherein the target position correction step converts the target coordinates of the head unit into coordinates based on the changed coordinate system by coordinate transformation using the third parameter. 1. A component mounting apparatus for mounting a component on a substrate placed at a working position of the apparatus main body by a head unit having a component mounting head and first and second image pickup units and movably supported by the apparatus main body, As an apparatus,
First and second marks provided on the apparatus body at the same pitch as the first and second image pickup units,
The first and second marks are simultaneously imaged by the first imaging section and the second imaging section respectively by the first imaging section and the second imaging section, A data acquiring operation for acquiring the position of each of the marks by capturing the first mark by the first imaging unit and the second mark by the second imaging unit at the same time, 2 control device for controlling the operation of the head unit to execute the data acquisition operation,
Calculating a parameter related to a change in a coordinate system due to thermal influence of a drive mechanism that drives the head unit based on the positions of the first and second marks recognized in the first and second data acquisition operations, And a computing device for converting the target coordinates when the unit is moved into coordinates based on the changed coordinate system by coordinate transformation using the parameter,
The control device controls the operation of the head unit based on the target coordinates after being converted by the computing device,
The arithmetic unit calculates a first parameter based on the position of the first mark recognized in the first and second data acquisition operations as the parameter and also calculates a first parameter that is recognized in the first and second data acquisition operations A first calculation process for calculating a second parameter based on the position of the second mark,
A first amount of displacement which is the amount of displacement of the target coordinate before and after the conversion by the coordinate transformation using the first parameter and a second amount of displacement that is the amount of displacement of the target coordinate before and after the conversion by the coordinate transformation using the second parameter are calculated Second calculation processing for calculating positions of the first and second image pickup units based on the positions of the first and second image pickup units based on the coordinate system before the change and the coordinate system after the change by the first and second displacement amounts;
Based on the position of the first and second imaging units based on the position of the first and second imaging units based on the coordinate system before the change and the position of the first and second imaging units based on the coordinate system after the change based on the coordinate system after the change A third calculation process for calculating a third parameter for transforming the coordinates into coordinates,
And the processing unit converts the target coordinates of the head unit into coordinates based on the changed coordinate system by coordinate conversion using the third parameter.

Images