CN118266278A

CN118266278A - Component mounting apparatus

Info

Publication number: CN118266278A
Application number: CN202280076293.4A
Authority: CN
Inventors: 春日大介
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2022-01-20
Filing date: 2022-01-20
Publication date: 2024-06-28
Also published as: WO2023139735A1

Abstract

The invention provides a component mounting device capable of ensuring the jacking precision of stable components. The component mounting device (100) is provided with: a first imaging unit (6); a jack-up unit (8); a first movement mechanism (7); a second movement mechanism (9); and a control unit (10) that uses the first imaging unit to image the jack-up unit, obtains a first thermal expansion correction amount (D1) that includes the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism based on the imaging result of the jack-up unit by the first imaging unit, and performs thermal expansion correction based on the obtained first thermal expansion correction amount.

Description

Component mounting apparatus

Technical Field

The present invention relates to a component mounting apparatus, and more particularly, to a component mounting apparatus that takes out a component from a wafer in a diced state and mounts the component onto a substrate.

Background

Conventionally, there is known a component mounting apparatus that takes out a component from a wafer in a diced state and mounts the component on a substrate. Such a device is disclosed in, for example, japanese patent application laid-open No. 2005-277273.

In the above-mentioned japanese patent application laid-open No. 2005-277273, an electronic component mounting apparatus (component mounting apparatus) is disclosed in which semiconductor chips are taken out from a wafer in a diced state and mounted on a substrate. The electronic component mounting device is provided with: a supply unit imaging camera for imaging the semiconductor chip of the wafer from above; a supply unit imaging camera moving mechanism that moves the supply unit imaging camera; an ejector (ejector) for ejecting the semiconductor chip of the wafer from below; and an ejector XY table for moving the ejector. In this electronic component mounting apparatus, the supply unit captures a movement of the camera, and the temperature of the supply unit capturing the camera movement mechanism increases, so that thermal expansion occurs in the supply unit capturing the camera movement mechanism. Therefore, the electronic component mounting device is provided with an identification mark used for correction of thermal expansion of the camera moving mechanism by the supply unit. In this electronic component mounting apparatus, the thermal expansion of the supply unit imaging camera moving mechanism is corrected by imaging the identification mark with the supply unit imaging camera.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication No. 2005-277273

Disclosure of Invention

Problems to be solved by the invention

However, in the electronic component mounting apparatus described in japanese patent application laid-open No. 2005-277273, the thermal expansion of the supply unit imaging camera moving mechanism is corrected, while the thermal expansion of the ejector XY table is not corrected. Since thermal expansion occurs also in the ejector XY table, if correction of thermal expansion of the ejector XY table is not performed, the ejector cannot be moved to an appropriate ejection position due to thermal expansion of the ejector XY table. Therefore, there is a problem that the accuracy of the lifting of the stable semiconductor chip (component) cannot be ensured.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a component mounting apparatus capable of ensuring the precision of the lifting of a stable component.

Means for solving the problems

A component mounting apparatus according to an aspect of the present invention is a component mounting apparatus for taking out a component from a wafer in a diced state and mounting the component on a substrate, the component mounting apparatus including: a first imaging unit for imaging a part of the wafer from above; a jack-up section for jack-up a member of the wafer from below; a first moving mechanism that moves the first imaging unit; a second moving mechanism that moves the jack-up section; and a control unit that captures an image of the jack-up unit by the first imaging unit, acquires a first thermal expansion correction amount including thermal expansion of the first moving mechanism and thermal expansion of the second moving mechanism based on an image capturing result of the jack-up unit by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount.

In the component mounting apparatus according to one aspect of the present invention, as described above, the control section is provided that photographs the jack-up section with the first photographing section, obtains a first thermal expansion correction amount including thermal expansion of the first moving mechanism that moves the first photographing section and thermal expansion of the second moving mechanism that moves the jack-up section based on the result of photographing the jack-up section by the first photographing section, and performs thermal expansion correction based on the obtained first thermal expansion correction amount. Accordingly, since the thermal expansion of the second moving mechanism that moves the jack-up portion can be corrected, it is possible to suppress the jack-up portion from being able to move to an appropriate jack-up position due to the thermal expansion of the second moving mechanism. In other words, the second moving mechanism can move the jack-up portion to an appropriate jack-up position, and thus the jack-up portion can appropriately jack up the member. This ensures stable precision in lifting up the component. In addition, since the precision of the lifting of the stable member can be ensured, the precision of the removal of the stable member can be ensured.

In order to correct the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism, it is conceivable to construct the component mounting device as follows. That is, it is conceivable that the component mounting device is provided with an identification mark for thermal expansion correction, the identification mark is photographed by the first photographing section, the thermal expansion of the first moving mechanism is corrected, and the jacking section is photographed by the first photographing section in a state where the thermal expansion of the first moving mechanism is corrected, thereby the thermal expansion of the second moving mechanism is corrected. However, in this case, it is necessary to separately perform the photographing of the identification mark and the photographing of the jack-up portion, and thus the time required for the thermal expansion correction increases. In contrast, as described above, the jack-up unit is imaged by the first imaging unit, a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism is acquired based on the imaging result of the jack-up unit by the first imaging unit, and the thermal expansion correction is performed based on the acquired first thermal expansion correction amount. Thus, only by photographing the jack-up portion, the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism can be corrected at the same time, and therefore, an increase in time required for thermal expansion correction can be suppressed.

In the component mounting apparatus according to the above aspect, the control unit is preferably configured to acquire the imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, to image the component by the first imaging unit in a state of being moved to the acquired imaging position, to acquire an offset amount from a position of the thermally expanded jack-up unit including the second moving mechanism to a position of the component based on an imaging result of the component by the first imaging unit, and to acquire the jack-up position of the jack-up unit to the component based on the offset amount. With this configuration, the position of the jacking portion for jacking up the component can be accurately corrected based on the first thermal expansion correction amount, and thus the accuracy of jacking up the stable component can be easily ensured.

In the component mounting apparatus according to the above aspect, it is preferable that the component mounting apparatus further includes: a head unit for taking out a part of the wafer from above; a second photographing part provided to the head unit; and a third moving mechanism for moving the head unit, wherein the control unit is configured to take an image of the jack-up unit by the second image taking unit, obtain a second thermal expansion correction amount including thermal expansion of the third moving mechanism and thermal expansion of the second moving mechanism based on an image taking result of the jack-up unit by the second image taking unit, and perform thermal expansion correction based on the first thermal expansion correction amount and the second thermal expansion correction amount. With this configuration, the thermal expansion of the third moving mechanism can be corrected in accordance with the correction of the thermal expansion of the first moving mechanism and the second moving mechanism, and therefore the head can be moved to an appropriate removal position by the third moving mechanism. As a result, the head-to-component extraction can be performed appropriately, and therefore, more stable component extraction accuracy can be ensured.

In this case, the control unit is preferably configured to acquire the imaging position of the first imaging unit with respect to the component based on the first thermal expansion correction amount, to take the component with the first imaging unit in a state of being moved to the acquired imaging position, to acquire the offset amount from the position of the thermally expanded jack-up unit including the second moving mechanism to the position of the component based on the imaging result of the first imaging unit with respect to the component, to acquire the jack-up position of the jack-up unit with respect to the component based on the offset amount, and to acquire the take-out position of the head with respect to the component based on the offset amount and the second thermal expansion correction amount. With this configuration, the ejection position of the ejection portion with respect to the component and the removal position of the head with respect to the component can be corrected with high accuracy based on the first thermal expansion correction amount and the second thermal expansion correction amount, and therefore, it is possible to easily ensure the accuracy of the ejection of the more stable component and the removal accuracy of the more stable component.

In the above-described component mounting apparatus, it is preferable that the first moving mechanism is configured to move the first imaging unit in a first direction and a second direction substantially orthogonal to each other in a horizontal plane, the second moving mechanism is configured to move the jack-up unit in the first direction and the second direction, and the third moving mechanism is configured to move the head unit in the first direction and the second direction. With this configuration, the first imaging unit, the jack-up unit, and the head unit can be easily moved in the first direction and the second direction by the first moving mechanism, the second moving mechanism, and the third moving mechanism, respectively. In addition, when the influence of thermal expansion that moves the first imaging unit, the jack-up unit, and the head unit in the first direction and the second direction is complex, correction of thermal expansion of the first moving mechanism, the second moving mechanism, and the third moving mechanism can be performed.

In the above-described component mounting apparatus having the second imaging unit, the control unit is preferably configured to take an image of the jack-up unit by the first imaging unit in a state in which the first imaging unit and the jack-up unit are moved to the same first target position, and take an image of the jack-up unit by the second imaging unit in a state in which the second imaging unit and the jack-up unit are moved to the same second target position as the first target position. With this configuration, the thermal expansion of the second moving mechanism included in the first thermal expansion correction amount can be made to correspond to the thermal expansion of the second moving mechanism included in the second thermal expansion correction amount, and therefore thermal expansion correction based on the first thermal expansion correction amount and the second thermal expansion correction amount can be performed with high accuracy.

In the component mounting apparatus according to the above aspect, the control unit is preferably configured to update the thermal expansion correction at predetermined time intervals, and the control unit is preferably configured to acquire a region in which the component is taken out of the wafer at predetermined time intervals, and to take an image of the jack-up unit at a position corresponding to the acquired region, thereby updating the thermal expansion correction. With this configuration, the thermal expansion correction is updated at predetermined time intervals, so that the thermal expansion with time can be appropriately reflected on the thermal expansion correction. Further, a region in which the member is taken out of the wafer at predetermined time intervals is acquired, and the jack-up section is photographed by the first photographing section at a position corresponding to the acquired region, and thermal expansion correction is updated. Accordingly, the jack-up portion can be photographed by the first photographing portion at an effective position close to the component, and the thermal expansion correction can be updated, so that the accuracy of the thermal expansion correction can be effectively improved.

In addition, since the thermal expansion is not generally linear, it is preferable to perform thermal expansion correction by photographing the jack-up section with the first photographing section at a plurality of positions from the viewpoint of improving the accuracy of thermal expansion correction. However, when the jack-up portion is photographed with the first photographing portion at a plurality of positions, the time required for the thermal expansion correction increases. In contrast, in the above configuration, the accuracy of the thermal expansion correction can be effectively improved, and therefore, the thermal expansion correction can be performed with high accuracy even if the number of positions of the jack-up section is reduced by the first imaging section. This suppresses an increase in the time required for thermal expansion correction, and enables thermal expansion correction to be performed with high accuracy.

In this case, the control unit is preferably configured to acquire the number of components taken out from the wafer at predetermined time intervals based on the cycle time of the substrate, and to acquire the region based on the acquired number of components. With this configuration, the region in which the components are taken out of the wafer in the predetermined time interval can be easily obtained based on the number of components taken out of the wafer in the predetermined time interval.

In the component mounting apparatus according to the above aspect, the jack-up portion is preferably configured not to have the imaging portion. With this configuration, since the jack-up section does not have the imaging section, an increase in the number of components and a complication in the structure can be suppressed as compared with the case where the jack-up section has the imaging section. In addition, even if the jack-up section does not have an imaging section, the first imaging section can be effectively used to correct thermal expansion of the second moving mechanism. As a result, the thermal expansion of the second movement mechanism can be corrected while suppressing an increase in the number of components and complication of the structure.

Effects of the invention

According to the present invention, as described above, it is possible to provide a component mounting apparatus capable of ensuring the precision of the lifting of a stable component.

Drawings

Fig. 1 is a schematic plan view showing a component mounting apparatus of a first embodiment.

Fig. 2 is a schematic perspective view showing a wafer pickup unit, a jack-up unit, and a head portion according to the first embodiment.

Fig. 3 is a diagram for explaining the jacking of the member by the jacking portion according to the first embodiment.

Fig. 4 is a diagram (1) for explaining thermal elongation correction according to the first embodiment.

Fig. 5 is a diagram (2) for explaining thermal elongation correction according to the first embodiment.

Fig. 6 is a diagram (3) for explaining thermal elongation correction according to the first embodiment.

Fig. 7 is a diagram for explaining the photographing position of the thermal expansion correction of the first embodiment.

Fig. 8 is a flowchart (1) for explaining the control processing relating to the thermal expansion correction of the first embodiment.

Fig. 9 is a flowchart (2) for explaining the control processing relating to the thermal expansion correction of the first embodiment.

Fig. 10 is a diagram for explaining the photographing position of the thermal expansion correction of the second embodiment.

Fig. 11 is a flowchart for explaining the control processing relating to the thermal expansion correction of the second embodiment.

Fig. 12 is a flowchart following fig. 11.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings.

First embodiment

(Structure of component mounting device)

The structure of a component mounting apparatus 100 according to an embodiment of the present invention will be described with reference to fig. 1.

The component mounting apparatus 100 is an apparatus that takes out a component C as a semiconductor chip from a wafer W in a diced state and mounts the component C on a substrate B.

As shown in fig. 1 and 2, the component mounting apparatus 100 includes a base 1, a conveyor 2, a head unit 3, a head unit moving mechanism 4, a component supply unit 5, a wafer imaging unit 6, a wafer imaging unit moving mechanism 7, a jack 8, a jack moving mechanism 9, and a control unit 10. The head unit moving mechanism 4 is an example of a "third moving mechanism" in the claims. The wafer pickup unit 6 is an example of the "first pickup unit" in the claims. The wafer pickup unit moving mechanism 7 is an example of a "first moving mechanism" in the claims. The jack-up section moving mechanism 9 is an example of the "second moving mechanism" in the claims.

The conveyor 2 is configured to carry the substrate B into and out of the mounting operation position. The conveyor 2 includes a pair of conveyor rails extending in the X direction and a positioning mechanism (not shown) for positioning the substrate B at the mounting work position. Thereby, the conveyor 2 conveys the substrate B in the X direction, and positions and fixes the substrate B at the mounting operation position.

The head unit 3 is a head unit for component mounting. The head unit 3 is supported by a head unit moving mechanism 4 so as to be movable in the horizontal direction (XY direction) above the wafer W and the conveyor 2 (substrate B). The head unit 3 includes a plurality of heads 31 arranged along the X direction. The head 31 is a mounting head that takes out the component C of the wafer W from above and mounts the taken-out component C on the substrate B. The head 31 has a suction nozzle 31a at the tip for sucking the component C. The head 31 is configured to pick up and take out the component C from the wafer W by the suction nozzle 31a. The head 31 is configured to mount the component C suctioned by the suction nozzle 31a on the substrate B.

The head unit moving mechanism 4 is configured to move the head unit 3. Specifically, the head unit moving mechanism 4 is configured to move the head unit 3 in the X direction and the Y direction substantially orthogonal to each other in the horizontal plane. The head unit moving mechanism 4 includes an X-axis head unit moving mechanism 41 for moving the head unit 3 in the X direction and a Y-axis head unit moving mechanism 42 for moving the X-axis head unit moving mechanism 41 in the Y direction. The X-direction and the Y-direction are examples of the "first direction" and the "second direction" in the claims, respectively.

The X-axis head unit moving mechanism 41 is a direct-acting mechanism having a ball screw shaft 41a and a driving motor 41b that drives the ball screw shaft 41 a. The X-axis head unit moving mechanism 41 rotates the ball screw shaft 41a by the driving motor 41b, and thereby moves the head unit 3 attached to the ball screw shaft 41a via the ball nut in the X direction.

The Y-axis head unit moving mechanism 42 is a direct-acting mechanism having a ball screw shaft 42a and a drive motor 42b that drives the ball screw shaft 42 a. The Y-axis head unit moving mechanism 42 rotates the ball screw shaft 42a by the driving motor 42b, and thereby moves the X-axis head unit moving mechanism 41 attached to the ball screw shaft 42a via a ball nut in the Y direction. The head unit 3 is moved in the horizontal direction (XY direction) above the wafer W and the conveyor 2 (substrate B) by the X-axis head unit moving mechanism 41 and the Y-axis head unit moving mechanism 42.

The head unit 3 is provided with a board imaging unit 32 and a component imaging unit 33. The substrate imaging unit 32 is a substrate camera that images a position identification mark (reference mark) provided on the substrate B from above before the component C is mounted on the substrate B by the head 31. The control unit 10 is configured to correct the mounting position of the head 31 on the component C based on the imaging result of the position identification mark by the substrate imaging unit 32. The substrate imaging unit 32 is an example of the "second imaging unit" in the claims.

The component photographing section 33 is a component camera that photographs the component C sucked by the suction nozzle 31a of the head 31 from the side before the component C is mounted on the substrate B by the head 31. The control unit 10 is configured to recognize the state of the component C sucked by the suction nozzle 31a of the head 31 based on the result of the shooting of the component C by the component shooting unit 33. In fig. 2, the component imaging unit 33 is not shown.

The substrate imaging unit 32 and the component imaging unit 33 are provided on a frame common to the head unit 3. Therefore, the substrate photographing section 32 and the component photographing section 33 can be moved in the horizontal direction (XY direction) above the wafer W and the conveyor 2 (substrate B) by the head unit moving mechanism 4 together with the head unit 3.

The component supply unit 5 is configured to move the wafer W stored in the wafer storage unit 11 to the supply position PF and supply the component C of the wafer W. The wafer housing portion 11 houses a plurality of wafers W in a diced state. Specifically, the wafer W in a state of being bonded to the wafer WS (see fig. 3) attached to the ring frame and being cut is accommodated in the wafer accommodating portion 11. The component supply unit 5 includes a wafer holding table 51 movable in the Y direction between the wafer housing unit 11 and the supply position PF. The wafer holding table 51 is movable in the Y direction between the wafer housing portion 11 and the supply position PF in a state where the wafer W is held via the annular frame.

The wafer pickup unit 6 is a wafer camera that picks up the component C of the wafer W held on the wafer holding table 51 at the supply position PF from above before the component C is taken out from the wafer W by the head 31. The control unit 10 is configured to correct the pickup position (suction position) of the component C by the head 31 based on the result of the imaging of the component C by the wafer imaging unit 6. The wafer pickup unit 6 is supported by a wafer pickup unit moving mechanism 7 so as to be movable in the horizontal direction (XY direction) above the wafer W.

The wafer pickup unit moving mechanism 7 is configured to move the wafer pickup unit 6. Specifically, the wafer imaging unit moving mechanism 7 is configured to move the wafer imaging unit 6 in the X direction and the Y direction substantially orthogonal to each other in the horizontal plane. The wafer pickup section moving mechanism 7 includes an X-axis wafer pickup section moving mechanism 71 for moving the wafer pickup section 6 in the X-direction and a Y-axis wafer pickup section moving mechanism 72 for moving the X-axis wafer pickup section moving mechanism 71 in the Y-direction.

The X-axis wafer imaging unit moving mechanism 71 is a linear motion mechanism having a ball screw shaft 71a and a drive motor 71b that drives the ball screw shaft 71 a. The X-axis wafer imaging unit moving mechanism 71 rotates the ball screw shaft 71a by the drive motor 71b, and thereby moves the wafer imaging unit 6 attached to the ball screw shaft 71a via the ball nut in the X-direction.

The Y-axis wafer pickup unit moving mechanism 72 is a linear motion mechanism having a ball screw shaft 72a and a drive motor 72b that drives the ball screw shaft 72 a. The Y-axis wafer pickup unit moving mechanism 72 rotates the ball screw shaft 72a by the drive motor 72b, and thereby moves the X-axis wafer pickup unit moving mechanism 71 attached to the ball screw shaft 72a via the ball nut in the Y direction. The wafer pickup unit 6 is moved in the horizontal direction (XY direction) above the wafer W by the X-axis wafer pickup unit moving mechanism 71 and the Y-axis wafer pickup unit moving mechanism 72.

As shown in fig. 2 and 3, the lifting section 8 is a lifting head that lifts the component C of the wafer W held on the wafer holding table 51 at the supply position PF from below when the component C is taken out of the wafer W. The head 31 is configured to take out the component C held by the wafer holding table 51 at the supply position PF and lifted up by the lifting-up portion 8 from the wafer W. The jack-up section 8 includes a jack-up pin 81 that is lifted up and down by a lifting mechanism (not shown). The lifting pins 81 are lifted by the lifting mechanism, thereby lifting the component C from below and peeling the component C from the wafer WS. The jack-up unit 8 does not have an imaging unit.

The jack-up portion moving mechanism 9 is configured to move the jack-up portion 8. Specifically, the jack-up section moving mechanism 9 is configured to move the jack-up section 8 in the X direction and the Y direction substantially orthogonal to each other in the horizontal plane. The jack-up section moving mechanism 9 includes an X-axis jack-up section moving mechanism 91 for moving the head unit 3 in the X-direction and a Y-axis jack-up section moving mechanism 92 for moving the X-axis jack-up section moving mechanism 91 in the Y-direction.

The X-axis jack moving mechanism 91 is a linear motion mechanism having a ball screw shaft 91a and a drive motor 91b that drives the ball screw shaft 91 a. The X-axis jack-up section moving mechanism 91 rotates the ball screw shaft 91a by the drive motor 91b, and thereby moves the jack-up section 8 attached to the ball screw shaft 91a via the ball nut in the X-direction.

The Y-axis jack moving mechanism 92 is a linear motion mechanism having a ball screw shaft 92a and a drive motor 92b that drives the ball screw shaft 92 a. The Y-axis jack-up section moving mechanism 92 rotates the ball screw shaft 92a by the driving motor 92b, and thereby moves the X-axis jack-up section moving mechanism 91 attached to the ball screw shaft 92a via the ball nut in the Y-direction. The jack 8 is moved in the horizontal direction (XY direction) below the wafer W by the X-axis jack moving mechanism 91 and the Y-axis jack moving mechanism 92.

As shown in fig. 1, the control unit 10 is configured to control operations of each part of the component mounting apparatus 100. Specifically, the control unit 10 is configured to control operations of the conveyor 2, the head unit 3, the head unit moving mechanism 4, the substrate imaging unit 32, the component imaging unit 33, the component supply unit 5, the wafer imaging unit 6, the wafer imaging unit moving mechanism 7, the jack 8, the jack moving mechanism 9, and the like. The control unit 10 controls the operation of each section based on an output signal from a position detection means such as an encoder incorporated in the drive motor of each section. The control unit 10 has a function of performing imaging control and image recognition of various imaging units (the substrate imaging unit 32, the component imaging unit 33, and the wafer imaging unit 6). The control section 10 includes a processor such as a CPU (central processing unit) and a memory.

(Thermal elongation correction)

Here, in the respective moving mechanisms of the head unit moving mechanism 4, the wafer imaging section moving mechanism 7, and the jack-up section moving mechanism 9, a temperature rise occurs with the movement of the respective moving objects of the head unit 3 (head 31), the wafer imaging section 6, and the jack-up section 8. In each moving mechanism, thermal expansion (thermal expansion) occurs due to a temperature rise. In this case, the thermal expansion of each moving mechanism causes a shift between the theoretical moving position and the actual moving position, and thus the positioning accuracy of each moving object is lowered. Accordingly, in the component mounting apparatus 100, thermal expansion correction is performed.

Here, in the first embodiment, as shown in fig. 4 to 6, the control unit 10 is configured to take an image of the jack-up unit 8 by the wafer taking unit 6, obtain a first thermal expansion correction amount D1 (see fig. 4) including the thermal expansion of the wafer taking unit moving mechanism 7 and the thermal expansion of the jack-up unit moving mechanism 9 based on the result of taking the image of the jack-up unit 8 by the wafer taking unit 6, and perform thermal expansion correction based on the obtained first thermal expansion correction amount D1. In fig. 4 to 6, the head 31, the substrate imaging unit 32, the wafer imaging unit 6, and the jack-up unit 8 are schematically illustrated as marks for indicating the respective configurations for convenience.

In the first embodiment, the control unit 10 is configured to take an image of the jack-up unit 8 by the substrate imaging unit 32, acquire a second thermal expansion correction amount D2 (see fig. 5) including the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the jack-up unit moving mechanism 9 based on the result of the image taking of the jack-up unit 8 by the substrate imaging unit 32, and perform thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2.

Specifically, the control unit 10 is configured to acquire the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, to image the component C by the wafer imaging unit 6 in a state of being moved to the acquired imaging position, to acquire the offset amount D3 (see fig. 6) from the position of the jack 8 including the thermal expansion of the jack moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and to acquire the jack position of the jack 8 to the component C based on the offset amount D3. The control unit 10 is configured to obtain the extraction position of the head 31 with respect to the component C based on the offset D3 and the second thermal expansion correction amount D2.

In the first embodiment, the control unit 10 is configured to take an image of the jack-up unit 8 by the wafer imaging unit 6 while the wafer imaging unit 6 and the jack-up unit 8 are moved to the same first target position (theoretical position P1), and take an image of the jack-up unit 8 by the substrate imaging unit 32 while the substrate imaging unit 32 and the jack-up unit 8 are moved to the same second target position (theoretical position P1) as the first target position. When the wafer imaging unit 6 and the substrate imaging unit 32 capture the lift-up unit 8, the wafer W is moved so as to retract from the supply position PF by the wafer holding table 51. Therefore, the jack-up portion 8 is exposed upward at the supply position PF, and the wafer imaging portion 6 and the substrate imaging portion 32 can image the jack-up portion 8 from above at the supply position PF.

An example of thermal expansion correction will be described with reference to fig. 4 to 6.

The acquisition of the first thermal expansion correction amount D1 will be described with reference to fig. 4. As shown in fig. 4, in a state where the wafer W is not placed at the supply position PF, the wafer imaging unit 6 is moved by the wafer imaging unit moving mechanism 7 to the theoretical position P1 as a target position, and the jack 8 is moved by the jack moving mechanism 9 to the theoretical position P1 as a target position. In the state where the movement is completed, the wafer pickup unit 6 is located at a position shifted from the theoretical position P1 by the thermal expansion shift amount D11 due to the thermal expansion of the wafer pickup unit moving mechanism 7. Further, the jack-up portion 8 is located at a position shifted from the theoretical position P1 by the thermal elongation shift amount D12 due to the thermal elongation of the jack-up portion moving mechanism 9.

Then, the wafer imaging unit 6 images the jack-up unit 8 from above in a state where the wafer imaging unit 6 and the jack-up unit 8 are located at positions offset from the theoretical position P1 by the thermal expansion offset amount. The imaging result includes information of the thermal expansion offset D11 of the wafer imaging unit 6 and the thermal expansion offset D12 of the jack-up unit 8. Then, based on the result of the imaging by the wafer imaging unit 6 on the jack-up unit 8, a first thermal expansion correction amount D1 including the thermal expansion offset D11 of the wafer imaging unit 6 and the thermal expansion offset D12 of the jack-up unit 8 is obtained. The first thermal expansion correction amount D1 indicates the amount of displacement of the jack-up section 8 with respect to the wafer pickup section 6 in the state of thermal expansion. That is, the first thermal expansion correction amount D1 represents the relative thermal expansion offset of the wafer pickup unit 6 including the thermal expansion offset D12 of the jack-up unit 8.

Then, by correcting the target position of the wafer pickup unit 6 so as to apply the first thermal expansion correction amount D1 to the target position of the wafer pickup unit 6, the wafer pickup unit 6 can be moved so that the center of the wafer pickup unit 6 substantially coincides with the center of the jack-up unit 8. That is, the wafer pickup unit 6 can be moved to the position of the thermally extended jack 8 including the jack moving mechanism 9.

The acquisition of the second thermal expansion correction amount D2 will be described with reference to fig. 5. As shown in fig. 5, in a state where the wafer W is not placed at the supply position PF, the head unit moving mechanism 4 moves the substrate imaging unit 32 with respect to the theoretical position P1 as a target position, and the jack-up unit 8 moves with respect to the theoretical position P1 as a target position by the jack-up unit moving mechanism 9. In addition, when the wafer photographing section 6 photographs the jack-up section 8 first, the jack-up section 8 has moved completely, and therefore the jack-up section 8 maintains the moved position without moving. In the moved state, the substrate imaging unit 32 is located at a position shifted from the theoretical position P1 by the thermal expansion shift amount D21 due to the thermal expansion of the head unit moving mechanism 4. Further, the jack-up portion 8 is located at a position shifted from the theoretical position P1 by the thermal elongation shift amount D12 due to the thermal elongation of the jack-up portion moving mechanism 9.

Then, the substrate imaging unit 32 images the jack-up unit 8 from above in a state where the substrate imaging unit 32 and the jack-up unit 8 are located at positions offset from the theoretical position P1 by the thermal expansion offset amount. The imaging result includes information of the thermal expansion offset D21 of the substrate imaging unit 32 and the thermal expansion offset D12 of the jack-up unit 8. Then, based on the imaging result of the jack-up section 8 by the substrate imaging section 32, a second thermal expansion correction amount D2 including the thermal expansion offset amount D21 of the substrate imaging section 32 and the thermal expansion offset amount D12 of the jack-up section 8 is obtained. The thermal expansion offset of the substrate imaging unit 32 is regarded as substantially the same as the thermal expansion offset of the head 31, and thus the thermal expansion offset D21 may be also referred to as the thermal expansion offset of the head 31. Therefore, the second thermal expansion correction amount D2 can also be said to include the thermal expansion offset amount D21 of the head 31 and the thermal expansion offset amount D12 of the jack 8. The second thermal expansion correction amount D2 represents the amount of displacement of the jack-up portion 8 with respect to the head 31 (substrate imaging portion 32) in the state of thermal expansion. That is, the second thermal expansion correction amount D2 represents the relative thermal expansion offset of the head 31 (substrate photographing section 32) including the thermal expansion offset D12 of the jack-up section 8.

Further, by correcting the target position of the head 31 so as to apply the second thermal expansion correction amount D2 to the target position of the head 31, the head 31 can be moved so that the center of the head 31 substantially coincides with the center of the jack-up portion 8. That is, the head 31 can be moved to the position of the thermally extended jack 8 including the jack moving mechanism 9.

With reference to fig. 6, the acquisition of the jack-up position and the acquisition of the take-out position based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. As shown in fig. 6, in a state where the wafer W is placed at the supply position PF, the component C of the wafer W is located at a position offset from the theoretical position P2 where it should be placed due to a positioning error of the wafer holding table 51 or the like. In fig. 6, the center of the member C is offset from the theoretical position P2 by an offset Dx in the X direction and by an offset Dy in the Y direction. Therefore, it is necessary to take an image of the component C by the wafer taking section 6 and correct the position of the component C by the jacking section 8 and the position of the component C taken out (suction position) by the head 31 by the amount of positional deviation from the theoretical position P2 of the component C. In addition, along with correction of the positional deviation from the theoretical position P2 of the member C, it is also necessary to correct the positional deviation caused by thermal expansion of each moving mechanism.

First, the target position (theoretical position P2) of the wafer pickup unit 6 is corrected so that the first thermal expansion correction amount D1 is applied to the target position (theoretical position P2) of the wafer pickup unit 6, and the pickup position of the component C by the wafer pickup unit 6 is obtained as the corrected target position. Since the imaging position is obtained by thermal expansion including the jack-up section moving mechanism 9, when the wafer imaging section 6 is moved to the imaging position by the wafer imaging section moving mechanism 7, the wafer imaging section 6 is moved to the position of the jack-up section 8 including thermal expansion of the jack-up section moving mechanism 9. That is, the wafer pickup unit 6 moves to a position shifted from the theoretical position P2 by the thermal expansion shift amount D12.

Then, the wafer imaging unit 6 images the component C from above while moving to a position shifted from the theoretical position P2 by the thermal expansion shift amount D12. The imaging result includes information of the offset D3 from the position of the thermally extended jack-up section 8 including the jack-up section moving mechanism 9 to the center position of the component C. Then, based on the result of the imaging of the component C by the wafer imaging unit 6, the offset D3 from the position of the thermally extended jack-up unit 8 including the jack-up unit moving mechanism 9 to the center position of the component C is obtained.

Then, the target position (theoretical position P2) of the jack-up portion 8 is corrected so as to apply the offset amount D3 to the target position (theoretical position P2) of the jack-up portion 8, whereby the jack-up position of the jack-up portion 8 with respect to the component C is obtained as the corrected target position. Then, by moving the jack-up section 8 to the acquired jack-up position by the jack-up section moving mechanism 9, the jack-up section 8 can be moved so that the center of the component C substantially coincides with the center of the jack-up section 8.

Further, the target position (theoretical position P2) of the head 31 is corrected so that the offset amount D3 and the second thermal expansion correction amount D2 are applied to the target position (theoretical position P2) of the head 31, whereby the extraction position of the head 31 with respect to the component C is obtained as the corrected target position. Then, by moving the head 31 to the acquired removal position by the head unit moving mechanism 4, the head 31 can be moved so that the center of the component C substantially coincides with the center of the head 31.

As shown in fig. 7, the imaging of the jack-up unit 8 by each of the wafer imaging unit 6 and the substrate imaging unit 32 may be performed at only 1 point, or may be performed at a plurality of points such as 2 points and 4 points.

For example, in the wafer suction area WA in which the wafer W is placed and the component C is sucked in the area of the supply position PF, when the thermal expansion amount of each moving object of each moving mechanism is regarded as substantially constant regardless of the position of the component C, the imaging of the jack-up unit 8 by each imaging unit can be performed only at 1 point in the wafer suction area WA. In this case, the jack-up unit 8 is imaged by each imaging unit at a point P11 at the center of the wafer suction area WA. Then, based on the result of photographing at the point P11 of the jack-up section 8, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 at the point P11 are acquired. The first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 thus obtained are used as they are in correction of the jack-up position and the take-out position, as described with reference to fig. 4 to 6. That is, when the component C at any position of the wafer W is taken out, the same first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used.

For example, in the wafer suction area WA, when the thermal expansion amounts of the moving objects of the moving mechanisms are different depending on the position of the member C, the imaging of the jack-up unit 8 by the imaging units can be performed at a plurality of points such as any 2 points and any 4 points in the wafer suction area WA.

For example, when the jack-up section 8 is imaged at any 2 points, the jack-up section 8 is imaged by each imaging section at predetermined points P21 and P22 in the wafer suction area WA. Then, based on the imaging results of the jack-up sections 8 at the points P21 and P22, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C of the wafer W are obtained by using a coordinate transformation method such as affine transformation. The first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C of the wafer W are obtained and used for correction of the jack-up position and the take-out position. That is, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are different depending on the position of the component C of the wafer W.

For example, when the jack-up unit 8 is imaged at any 4 points, the jack-up unit 8 is imaged by each imaging unit at predetermined points P31 to P34 in the wafer suction area WA. Then, based on the imaging results of the jack-up sections 8 at the points P31 to P34, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C of the wafer W are obtained by a coordinate conversion method such as projective transformation. The first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C of the wafer W are obtained and used for correction of the jack-up position and the take-out position. That is, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are different depending on the position of the component C of the wafer W.

(Control processing relating to thermal elongation correction)

With reference to fig. 8 and 9, a control process related to thermal expansion correction of the component mounting apparatus 100 of the first embodiment will be described based on a flowchart. The respective processes of the flowchart are executed by the control unit 10.

With reference to fig. 8, a control process related to acquisition of the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. As shown in fig. 8, first, in step S101, it is determined whether or not the wafer W is present at the supply position PF. If it is determined that the wafer W is not present at the supply position PF, the process advances to step S103. If it is determined that the wafer W is present at the supply position PF, the process advances to step S102.

Then, in step S102, the wafer W is returned to the wafer housing section 11 by the wafer holding stage 51.

Then, in step S103, the wafer imaging unit moving mechanism 7 moves to the imaging position (theoretical position P1), and the jack-up unit 8 moves to the imaging position (theoretical position P1) by the jack-up unit moving mechanism 9.

Then, in step S104, the jack-up section 8 is photographed by the wafer photographing section 6.

Then, in step S105, it is determined whether or not the imaging of the jack-up section 8 by the wafer imaging section 6 at all the imaging points is completed. If it is determined that the imaging of the jack-up unit 8 by the wafer imaging unit 6 at all the imaging points is not completed, the flow proceeds to step S103, where the imaging of the jack-up unit 8 by the wafer imaging unit 6 at the next imaging point is performed. When it is determined that the imaging of the jack-up unit 8 by the wafer imaging unit 6 at all the imaging points is completed, the flow advances to step S106. In addition, when the imaging point is only 1 point, the processing of step S105 is not performed.

Then, in step S106, a first thermal expansion correction amount D1 is obtained based on the imaging result of the jack-up section 8 by the wafer imaging section 6.

Then, in step S107, the substrate imaging unit 32 is moved to the imaging position (theoretical position P1) by the head unit moving mechanism 4, and the jack 8 is moved to the imaging position (theoretical position P1) by the jack moving mechanism 9. The jack-up unit 8 is maintained at the position moved in the process of step S103.

Then, in step S108, the jack-up section 8 is photographed by the substrate photographing section 32.

Then, in step S109, it is determined whether or not the photographing of the jack-up section 8 by the substrate photographing section 32 at all photographing points is completed. If it is determined that the imaging of the jack-up section 8 by the substrate imaging section 32 at all the imaging points is not completed, the flow advances to step S107, where the imaging of the jack-up section 8 by the substrate imaging section 32 at the next imaging point is performed. When it is determined that the imaging of the jack-up section 8 by the substrate imaging section 32 at all the imaging points is completed, the flow advances to step S110. In addition, when the imaging point is only 1 point, the process of step S109 is not performed.

Then, in step S110, the second thermal expansion correction amount D2 is acquired based on the imaging result of the jack-up section 8 by the substrate imaging section 32. Then, the control process ends. Further, since the thermal expansion amounts of the respective moving mechanisms change with time, the control process shown in fig. 8 is performed at predetermined time intervals (3 minute intervals, etc.). Therefore, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are updated at predetermined time intervals, and the latest thermal expansion state is reflected in the thermal expansion correction.

With reference to fig. 9, a control process related to acquisition of the jack-up position and the take-out position based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. The wafer W is placed at the supply position PF. As shown in fig. 9, first, in step S111, the imaging position of the component C by the wafer imaging unit 6 is acquired based on the first thermal expansion correction amount D1.

Then, in step S112, the wafer imaging unit 6 is moved to the imaging position by the wafer imaging unit moving mechanism 7.

Then, in step S113, the component C is imaged by the wafer imaging unit 6.

Then, in step S114, the offset D3 is acquired based on the result of imaging the component C by the wafer imaging unit 6.

Then, in step S115, the jacking position of the jacking portion 8 with respect to the component C is obtained based on the offset amount D3.

Then, in step S116, the jack-up portion 8 is moved to the jack-up position by the jack-up portion moving mechanism 9.

In step S117, the extraction position of the head 31 with respect to the component C is obtained based on the offset amount D3 and the second thermal expansion correction amount D2.

Then, in step S118, the head 31 is moved to the take-out position by the head unit moving mechanism 4.

Then, in step S119, the jacking portion 8 jacks up the component C and the head 31 takes out the component C. Then, the control process ends. Further, the control process shown in fig. 9 is repeated until the production of the substrate B is completed.

(Effects of the first embodiment)

In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, the control unit 10 is provided, and the control unit 10 captures the image of the jack-up unit 8 by the wafer imaging unit 6, obtains the first thermal expansion correction amount D1 including the thermal expansion of the wafer imaging unit moving mechanism 7 for moving the wafer imaging unit 6 and the thermal expansion of the jack-up unit moving mechanism 9 for moving the jack-up unit 8 based on the captured image of the jack-up unit 8 by the wafer imaging unit 6, and performs the thermal expansion correction based on the obtained first thermal expansion correction amount D1. This makes it possible to correct the thermal expansion of the jack-up section moving mechanism 9 that moves the jack-up section 8, and therefore it is possible to suppress the jack-up section 8 from being unable to move to an appropriate jack-up position due to the thermal expansion of the jack-up section moving mechanism 9. In other words, since the jacking portion 8 can be moved to an appropriate jacking position by the jacking portion moving mechanism 9, the jacking portion 8 can be appropriately jacked up the component C. This ensures stable precision in lifting up the component C. In addition, since the precision of the lifting of the stable component C can be ensured, the precision of the removal of the stable component C can be ensured.

In order to correct the thermal expansion of the wafer pickup unit moving mechanism 7 and the thermal expansion of the jack-up unit moving mechanism 9, the following component mounting apparatus 100 is also considered. That is, it is conceivable that the thermal expansion of the wafer pickup unit moving mechanism 7 is corrected by providing the component mounting apparatus 100 with an identification mark for thermal expansion correction and capturing the identification mark with the wafer pickup unit 6, and that the thermal expansion of the jack-up unit moving mechanism 9 is corrected by capturing the image of the jack-up unit 8 with the wafer pickup unit 6 in a state where the thermal expansion of the wafer pickup unit moving mechanism 7 is corrected. However, in this case, it is necessary to separately perform the photographing of the identification mark and the photographing of the jack-up section 8, and thus the time required for the thermal expansion correction increases. In contrast, as described above, the jack-up unit 8 is imaged by the wafer imaging unit 6, the first thermal expansion correction amount D1 including the thermal expansion of the wafer imaging unit moving mechanism 7 and the thermal expansion of the jack-up unit moving mechanism 9 is acquired based on the imaging result of the jack-up unit 8 by the wafer imaging unit 6, and the thermal expansion correction is performed based on the acquired first thermal expansion correction amount D1. Accordingly, only by photographing the jack-up section 8, the thermal expansion of the wafer photographing section moving mechanism 7 and the thermal expansion of the jack-up section moving mechanism 9 can be corrected at the same time, and therefore, an increase in the time required for thermal expansion correction can be suppressed.

In the first embodiment, as described above, the control unit 10 is configured to acquire the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, to image the component C by the wafer imaging unit 6 in a state of being moved to the acquired imaging position, to acquire the offset D3 from the position of the thermal expansion lifting unit 8 including the lifting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and to acquire the lifting position of the component C by the lifting unit 8 based on the offset D3. Accordingly, the jacking position of the jacking portion 8 with respect to the component C can be accurately corrected based on the first thermal expansion correction amount D1, and thus the accuracy of jacking the stable component C can be easily ensured.

In the first embodiment, as described above, the component mounting apparatus 100 includes: a head unit 3 for taking out a component C of the wafer from above; a substrate imaging unit 32 provided in the head unit 3; and a head unit moving mechanism 4 that moves the head unit 3. The control unit 10 is configured to take an image of the jack-up unit 8 by the substrate imaging unit 32, acquire a second thermal expansion correction amount D2 including the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the jack-up unit moving mechanism 9 based on the result of the image of the jack-up unit 8 by the substrate imaging unit 32, and perform thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2. Accordingly, the thermal expansion of the head unit moving mechanism 4 can be corrected in accordance with the correction of the thermal expansion of the wafer pickup unit moving mechanism 7 and the jack-up unit moving mechanism 9, and therefore the head 31 can be moved to an appropriate take-out position by the head unit moving mechanism 4. As a result, the head 31 can properly take out the component C, and therefore, more stable accuracy of taking out the component C can be ensured.

In the first embodiment, as described above, the control unit 10 is configured to acquire the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, to image the component C by the wafer imaging unit 6 in a state of being moved to the acquired imaging position, to acquire the offset D3 from the position of the thermal expansion lifting unit 8 including the lifting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, to acquire the lifting position of the component C by the lifting unit 8 based on the offset D3, and to acquire the removal position of the component C by the head 31 based on the offset D3 and the second thermal expansion correction amount D2. Accordingly, the position of the ejection part 8 for ejecting the component C and the position of the head 31 for taking out the component C can be corrected with high accuracy based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2, and therefore, it is possible to easily achieve the assurance of the accuracy of the ejection of the more stable component C and the assurance of the accuracy of the taking out of the more stable component C.

In the first embodiment, as described above, the wafer imaging unit moving mechanism 7 is configured to move the wafer imaging unit 6 in the X direction and the Y direction substantially orthogonal to each other in the horizontal plane. The jack-up section moving mechanism 9 is configured to move the jack-up section 8 in the X-direction and the Y-direction. The head unit moving mechanism 4 is configured to move the head unit 3 in the X direction and the Y direction. Thus, the wafer imaging unit 6, the jack-up unit 8, and the head unit 3 can be easily moved in the X-direction and the Y-direction by the wafer imaging unit moving mechanism 7, the jack-up unit moving mechanism 9, and the head unit moving mechanism 4, respectively. In addition, when the influence of thermal expansion that moves the wafer pickup unit 6, the jack-up unit 8, and the head unit 3 in the X-direction and the Y-direction is complicated, correction of thermal expansion of the wafer pickup unit moving mechanism 7, the jack-up unit moving mechanism 9, and the head unit moving mechanism 4 can be performed.

In the first embodiment, as described above, the control unit 10 is configured to take the image of the jack-up unit 8 by the wafer imaging unit 6 in a state in which the wafer imaging unit 6 and the jack-up unit 8 are moved to the same first target position, and to take the image of the jack-up unit 8 by the substrate imaging unit 32 in a state in which the substrate imaging unit 32 and the jack-up unit 8 are moved to the same second target position as the first target position. Accordingly, the thermal expansion of the jack-up section moving mechanism 9 included in the first thermal expansion correction amount D1 can be made to correspond to the thermal expansion of the jack-up section moving mechanism 9 included in the second thermal expansion correction amount D2, and therefore thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 can be performed with high accuracy.

In the first embodiment, the jack-up unit 8 is configured without the imaging unit as described above. As a result, since the jack-up unit 8 does not have an imaging unit, an increase in the number of components and a complication in the structure can be suppressed as compared with a case where the jack-up unit 8 has an imaging unit. In addition, even if the jack-up unit 8 does not have an imaging unit, the thermal expansion of the jack-up unit moving mechanism 9 can be corrected by effectively using the wafer imaging unit 6. As a result, the thermal expansion of the jack-up section moving mechanism 9 can be corrected while suppressing an increase in the number of components and complication of the structure.

Second embodiment

Next, a second embodiment will be described with reference to fig. 10 to 12. In the second embodiment, unlike the first embodiment, an example will be described in which a region in which a component is taken out from a wafer in a predetermined time interval is acquired, and a wafer imaging unit is used to image a jack-up unit at a position corresponding to the acquired region. Note that, the same components as those of the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof is omitted.

(Structure of component mounting device)

As shown in fig. 10, a component mounting apparatus 200 according to a second embodiment of the present invention is different from the component mounting apparatus 100 according to the first embodiment in that the component mounting apparatus includes a control unit 110. The control unit 110 is configured to update the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 of the thermal expansion correction at predetermined time intervals (3 minute intervals, etc.).

In the second embodiment, the control unit 110 is configured to acquire the region 111 in which the component C is taken out of the wafer W at predetermined time intervals, and to take the image of the jack-up unit 8 by the wafer imaging unit 6 at the position P101 corresponding to the acquired region 111, and update the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 of the thermal expansion correction. In the second embodiment, the control unit 110 is configured to acquire the number of components C taken out of the wafer W at predetermined time intervals based on the cycle time of the substrate B, and to acquire the region 111 based on the acquired number of components C. In fig. 10, an example in which the imaging point is 2 points is shown, but the imaging point may be 1 point or a plurality of points other than 2 points.

(Control processing relating to thermal elongation correction)

With reference to fig. 11 and 12, a control process related to thermal expansion correction of the component mounting apparatus 200 of the second embodiment will be described based on a flowchart. The respective processes of the flowchart are executed by the control unit 110.

As shown in fig. 11, first, in step S201, a cycle time is initialized. In step S201, the last cycle time is set based on the last production history.

Then, in step S202, the substrate B is replaced by the conveyor 2. In step S202, the substrate B on which the components C have been mounted is carried out by the conveyor 2, and the substrate B on which the components C have been mounted is carried in.

Then, in step S203, it is determined whether or not the timing is an update timing of the thermal expansion correction. If it is determined that the timing is not the update timing of the thermal expansion correction, the flow advances to step S207. If it is determined that the timing is the update timing of the thermal expansion correction, the flow advances to step S204.

Then, in step S204, the number of components C taken out of the wafer W before the next thermal expansion correction update timing is obtained based on the cycle time of the substrate B, and the region 111 in which the components C were taken out of the wafer W before the next thermal expansion correction update timing is obtained based on the obtained number of components C.

Then, in step S205, the jack-up section 8 is photographed by the wafer photographing section 6 and the substrate photographing section 32.

Then, in step S206, based on the imaging result of the jack-up section 8, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are acquired. In steps S205 and S206, the processing of steps S103 to S110 shown in fig. 8 is performed in detail.

Then, in step S207, the component C is imaged by the wafer imaging unit 6.

Then, in step S208, the ejection of the component C by the ejection section 8 and the removal of the component C by the head 31 are performed. In steps S207 and S208, the processing of steps S111 to S119 shown in fig. 8 is performed in detail.

Then, in step S209, the component C sucked by the suction nozzle 31a of the head 31 is photographed by the component photographing section 33.

Then, in step S210, the component C is mounted on the substrate B by the head 31 based on the result of the imaging of the component C by the component imaging section 33.

Then, as shown in fig. 12, in step S211, the cycle time is updated. The cycle time may be updated for each adsorption group of the head 31, or may be updated for each production of 1 substrate B.

Then, in step S212, it is determined whether or not the component C is mounted at all mounting positions within the substrate B. If it is determined that the component C is not mounted at all the mounting positions in the board B, the process advances to step S203, where the component C is mounted at the remaining mounting positions. If it is determined that the component C is mounted at all the mounting positions in the board B, the process advances to step S213.

Then, in step S213, it is determined whether or not the production of the substrate B is ended. If it is determined that the production of the board B is not completed, the process advances to step S202, where the component C is mounted on the next board B. If it is determined that the production of the substrate B is completed, the process advances to step S214.

Then, in step S214, the substrate B is carried out by the conveyor 2.

Then, in step S215, the cycle time is saved. After that, the control process ends.

The other structures of the second embodiment are the same as those of the first embodiment.

(Effects of the second embodiment)

In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the control unit 110 is configured to update the thermal expansion correction at predetermined time intervals. The control unit 110 is configured to acquire the region 111 in which the component C is taken out of the wafer W at predetermined time intervals, and to take an image of the jack-up unit 8 by the wafer imaging unit 6 at a position P101 corresponding to the acquired region 111, thereby updating the thermal expansion correction. Thus, by updating the thermal expansion correction at predetermined time intervals, the thermal expansion that changes with time can be appropriately reflected in the thermal expansion correction. The region 111 in which the component C is taken out of the wafer W at predetermined time intervals is acquired, and the jack-up unit 8 is imaged by the wafer imaging unit 6 at a position P101 corresponding to the acquired region 111, and thermal expansion correction is updated. Accordingly, the jack-up portion 8 can be imaged by the wafer imaging portion 6 at an effective position near the component C, and the thermal expansion correction can be updated, so that the accuracy of the thermal expansion correction can be effectively improved.

In addition, since the thermal expansion is not generally linear, it is preferable to perform thermal expansion correction by photographing the jack-up section 8 with the wafer photographing section 6 at a plurality of positions from the viewpoint of improving the accuracy of thermal expansion correction. However, when the jack-up section 8 is photographed with the wafer photographing section 6 at a plurality of positions, the time required for the thermal expansion correction increases. In contrast, in the above configuration, the accuracy of the thermal expansion correction can be effectively improved, and therefore, the thermal expansion correction can be performed with high accuracy even if the number of positions of the jack-up section 8 is reduced by the wafer imaging section 6. This makes it possible to perform thermal expansion correction with high accuracy while suppressing an increase in time required for thermal expansion correction.

In the second embodiment, as described above, the control unit 110 is configured to acquire the number of components C taken out from the wafer W at predetermined time intervals based on the cycle time of the substrate B, and to acquire the region 111 based on the acquired number of components C. Thus, the region 111 in which the components C are taken out of the wafer W at predetermined time intervals can be easily obtained based on the number of the components C taken out of the wafer W at predetermined time intervals.

Further, other effects of the second embodiment are the same as those of the first embodiment described above.

(Modification)

The embodiments disclosed herein are illustrative in all respects and should not be considered as restrictive. The scope of the present invention is shown by the claims, not by the description of the above embodiments, but by all modifications (variations) within the meaning and scope equivalent to the claims.

For example, in the first and second embodiments described above, an example in which the head is a mounting head is shown, but the present invention is not limited to this. In the present invention, the head may be a pick-up head that picks up a component of a wafer and transfers the picked-up component to a mounting head.

In the first and second embodiments, the substrate imaging unit is provided as the second imaging unit, but the present invention is not limited to this. In the present invention, an imaging unit other than the substrate imaging unit may be provided as the second imaging unit.

In the first and second embodiments, the example in which the jack-up portion moving mechanism (second moving mechanism) moves the jack-up portion in the X direction (first direction) and the Y direction (second direction) has been described, but the present invention is not limited to this. In the present invention, the second moving mechanism may move the jack-up portion in only one of the first direction and the second direction.

In the first and second embodiments, the control unit obtains the first thermal expansion correction amount and the second thermal expansion correction amount, but the present invention is not limited to this. In the present invention, the control unit may acquire only the first thermal expansion correction amount.

In the above-described embodiment, the control process has been described using a flow-driven flow in which processes are sequentially performed according to the process flow for convenience of explanation, but the present invention is not limited thereto. In the present invention, the control process may be performed by an event-driven (event-driven) process in which the process is executed in units of events. In this case, the operation may be performed in a complete event-driven type, or may be performed by combining event-driven and flow-driven types.

Description of the reference numerals

3-Head unit

4 Head unit moving mechanism (third moving mechanism)

6 Wafer shooting part (first shooting part)

7 Wafer shooting part moving mechanism (first moving mechanism)

8 Jack-up portion

9 Jack-up portion moving mechanism (second moving mechanism)

10. 110 Control part

31 Heads

32 Substrate shooting part (second shooting part)

100. 200 Parts mounting device

111. Region(s)

B substrate

C component

D1 First thermal elongation correction amount

D2 Second thermal elongation correction amount

D3 Offset amount

P101 corresponds to the position of the region

X direction (first direction)

Y direction (second direction)

W wafer.

Claims

1. A component mounting apparatus for taking out a component from a wafer in a diced state and mounting the component onto a substrate, the apparatus comprising:

a first imaging unit that images the component of the wafer from above;

A jack-up section for jack-up the member of the wafer from below;

a first moving mechanism that moves the first imaging unit;

A second moving mechanism that moves the jack-up portion; and

And a control unit that captures an image of the jack-up unit by the first imaging unit, obtains a first thermal expansion correction amount including thermal expansion of the first moving mechanism and thermal expansion of the second moving mechanism based on an image capturing result of the jack-up unit by the first imaging unit, and performs thermal expansion correction based on the obtained first thermal expansion correction amount.

2. The component mounting apparatus according to claim 1,

The control unit is configured to acquire an imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, to image the component by the first imaging unit in a state of being moved to the acquired imaging position, to acquire an offset amount from a position of the jack-up unit including thermal expansion of the second moving mechanism to a position of the component based on an imaging result of the component by the first imaging unit, and to acquire a jack-up position of the jack-up unit to the component based on the offset amount.

3. The component mounting apparatus according to claim 1 or 2,

The device further comprises:

a head unit including a head that takes out the parts of the wafer from above;

A second photographing part provided to the head unit; and

A third moving mechanism for moving the head unit,

The control unit is configured to take an image of the jack-up unit by the second imaging unit, acquire a second thermal expansion correction amount including thermal expansion of the third moving mechanism and thermal expansion of the second moving mechanism based on an image of the jack-up unit by the second imaging unit, and perform thermal expansion correction based on the first thermal expansion correction amount and the second thermal expansion correction amount.

4. The component mounting apparatus as claimed in claim 3,

The control unit is configured to acquire an imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, to image the component by the first imaging unit in a state of being moved to the acquired imaging position, to acquire an offset amount from a position of the jack-up unit including thermal expansion of the second moving mechanism to a position of the component based on an imaging result of the component by the first imaging unit, to acquire a jack-up position of the jack-up unit to the component based on the offset amount, and to acquire a take-out position of the head to the component based on the offset amount and the second thermal expansion correction amount.

5. The component mounting apparatus according to claim 3 or 4,

The first moving mechanism is configured to move the first imaging section in a first direction and a second direction substantially orthogonal to each other in a horizontal plane,

The second moving mechanism is configured to move the jack-up portion in the first direction and the second direction,

The third moving mechanism is configured to move the head unit in the first direction and the second direction.

6. The component mounting apparatus according to any one of claims 3 to 5,

The control unit is configured to take an image of the jack-up unit by the first imaging unit while the first imaging unit and the jack-up unit are moved to the same first target position, and take an image of the jack-up unit by the second imaging unit while the second imaging unit and the jack-up unit are moved to a second target position that is the same as the first target position.

7. The component mounting apparatus according to any one of claims 1 to 6,

The control unit is configured to update the thermal expansion correction at predetermined time intervals,

The control unit is configured to acquire a region in which the component is taken out of the wafer at the predetermined time interval, and to update the thermal expansion correction by imaging the jack-up unit with the first imaging unit at a position corresponding to the acquired region.

8. The component mounting apparatus according to claim 7,

The control unit is configured to acquire the number of components taken out of the wafer in the predetermined time interval based on a cycle time of the substrate, and to acquire the region based on the acquired number of components.

9. The component mounting apparatus according to any one of claims 1 to 8,

The jack-up section is configured without an imaging section.