WO2023139735A1 - Dispositif de montage de composant - Google Patents

Dispositif de montage de composant Download PDF

Info

Publication number
WO2023139735A1
WO2023139735A1 PCT/JP2022/002070 JP2022002070W WO2023139735A1 WO 2023139735 A1 WO2023139735 A1 WO 2023139735A1 JP 2022002070 W JP2022002070 W JP 2022002070W WO 2023139735 A1 WO2023139735 A1 WO 2023139735A1
Authority
WO
WIPO (PCT)
Prior art keywords
imaging
thermal expansion
component
push
unit
Prior art date
Application number
PCT/JP2022/002070
Other languages
English (en)
Japanese (ja)
Inventor
大介 春日
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2022/002070 priority Critical patent/WO2023139735A1/fr
Publication of WO2023139735A1 publication Critical patent/WO2023139735A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus that picks up components from a diced wafer and mounts them on a board.
  • the above Japanese Patent Application Laid-Open No. 2005-277273 discloses an electronic component mounting apparatus (component mounting apparatus) that picks up semiconductor chips from a diced wafer and mounts them on a substrate.
  • This electronic component mounting apparatus includes a supply section imaging camera that captures an image of a semiconductor chip on a wafer from above, a supply section imaging camera moving mechanism that moves the supply section imaging camera, an ejector that pushes up the semiconductor chip on the wafer from below, and an ejector XY table that moves the ejector.
  • the movement of the supply section imaging camera increases the temperature of the supply section imaging camera moving mechanism, and thermal expansion occurs in the supply section imaging camera movement mechanism.
  • this electronic component mounting apparatus is provided with a recognition mark that is used for correcting the thermal expansion of the feeding section imaging camera moving mechanism.
  • the thermal expansion of the supply section imaging camera moving mechanism is corrected by imaging the recognition mark with the supply section imaging camera.
  • the present invention was made to solve the above-mentioned problems, and one object of the present invention is to provide a component mounting apparatus capable of ensuring stable component push-up accuracy.
  • a component mounting apparatus is a component mounting apparatus that picks up components from a diced wafer and mounts them on a substrate, comprising: a first imaging unit that captures an image of the components on the wafer from above; a push-up unit that pushes up the components on the wafer from below; a first movement mechanism that moves the first imaging unit; a second movement mechanism that moves the push-up unit; , a control unit that acquires a first thermal expansion correction amount including the thermal expansion of the second moving mechanism, and performs thermal expansion correction based on the acquired first thermal expansion correction amount.
  • the first imaging unit images the pushing-up portion, based on the imaging result of the pushing-up portion by the first imaging unit, the first thermal expansion correction amount including the thermal elongation of the first moving mechanism that moves the first imaging unit and the thermal elongation of the second moving mechanism that moves the pushing-up portion is acquired, and a control unit is provided that performs thermal expansion correction based on the acquired first thermal expansion correction amount.
  • the pushing-up portion can be moved to an appropriate pushing-up position by the second moving mechanism, so that the component can be properly pushed up by the pushing-up portion.
  • the second moving mechanism so that the component can be properly pushed up by the pushing-up portion.
  • the component mounting apparatus in order to correct the thermal elongation of the first moving mechanism and the thermal elongation of the second moving mechanism, it is conceivable to configure the component mounting apparatus as follows. That is, it is conceivable to provide a component mounting apparatus with a recognition mark used for thermal expansion correction, to correct the thermal expansion of the first moving mechanism by imaging the recognition mark with the first imaging unit, and to correct the thermal expansion of the second moving mechanism by imaging the push-up portion with the first imaging unit in a state in which the thermal expansion of the first moving mechanism is corrected.
  • the thrust-up portion is imaged by the first imaging unit, based on the imaging result of the thrust-up portion by the first imaging unit, the first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism is acquired, and thermal expansion correction is performed based on the acquired first thermal expansion correction amount.
  • the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism can be corrected at the same time only by imaging the push-up portion, so that an increase in the time required for correcting the thermal expansion can be suppressed.
  • the control unit acquires the image pickup position of the component by the first image pickup unit based on the first thermal expansion correction amount, picks up an image of the component while the component is moved to the acquired image pickup position by the first image pickup unit, acquires the amount of deviation from the position of the push-up unit including the thermal expansion of the second moving mechanism to the position of the component based on the image pickup result of the component by the first image pickup unit, and acquires the push-up position of the component by the push-up unit based on the amount of deviation.
  • the component mounting apparatus preferably further includes a head unit that takes out components on the wafer from above, a second imaging section provided in the head unit, and a third moving mechanism that moves the head unit. 2, thermal expansion correction is performed based on the amount of thermal expansion correction.
  • thermal expansion correction is performed based on the amount of thermal expansion correction.
  • the control unit acquires the imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, images the component in a state of being moved to the acquired imaging position by the first imaging unit, acquires the deviation amount from the position of the push-up unit including the thermal expansion of the second moving mechanism to the position of the component based on the imaging result of the component by the first imaging unit, acquires the push-up position of the component by the push-up unit based on the deviation amount, and corrects the deviation amount and the second thermal expansion. and the position of picking up the part by the head.
  • this configuration it is possible to accurately correct the position where the part is pushed up by the pushing part and the position where the part is picked up by the head based on the first correction amount of thermal expansion and the second correction amount of thermal expansion.
  • the first moving mechanism is configured to move the first imaging section in a first direction and a second direction that are substantially orthogonal to each other in a horizontal plane
  • the second moving mechanism is configured to move the push-up section in the first direction and the second direction
  • the third moving mechanism is configured to move the head unit in the first direction and the second direction.
  • the thermal elongation of the first moving mechanism, the second moving mechanism, and the third moving mechanism can be corrected.
  • the control section is preferably configured so that the first imaging section images the push-up section with the first imaging section and the thrust-up section moved to the same first target position, and the second imaging section images the thrust-up section with the second imaging section and the thrust-up section moved to the same second target position as the first target position.
  • the control unit is configured to update the thermal expansion correction at predetermined time intervals, and the control unit is configured to acquire an area for picking up the component from the wafer within the predetermined time interval, capture an image of the push-up section with the first imaging unit at a position corresponding to the acquired area, and update the thermal expansion correction.
  • the control unit is configured to acquire an area for picking up the component from the wafer within the predetermined time interval, capture an image of the push-up section with the first imaging unit at a position corresponding to the acquired area, and update the thermal expansion correction.
  • thermal elongation is not linear in many cases, it is preferable from the viewpoint of improving the accuracy of thermal elongation correction to perform thermal elongation correction by imaging the push-up portion with the first imaging unit at a plurality of positions.
  • the time required for thermal expansion correction increases.
  • the accuracy of thermal expansion correction can be effectively improved, so even if the number of positions where the thrust-up portion is imaged by the first imaging unit is reduced, thermal expansion can be corrected with high accuracy. As a result, it is possible to accurately perform the thermal elongation correction while suppressing an increase in the time required for the thermal elongation correction.
  • control unit is configured to obtain the number of components to be taken out from the wafer within a predetermined time interval based on the substrate cycle time, and to obtain the area based on the obtained number of components. According to this configuration, it is possible to easily acquire the area from which the components are to be removed from the wafer within the predetermined time interval based on the number of components to be removed from the wafer within the predetermined time interval.
  • the push-up section is configured not to have an imaging section.
  • the push-up section does not have an imaging section, so an increase in the number of parts and complication of the structure can be suppressed compared to the case where the push-up section has an imaging section.
  • FIG. 1 is a schematic plan view showing a component mounting apparatus according to a first embodiment
  • FIG. FIG. 2 is a schematic perspective view showing a wafer imaging section, a push-up section, and a head according to the first embodiment
  • It is a figure for demonstrating the pushing-up of components by the pushing-up part by 1st Embodiment.
  • FIG. 12 is a flowchart continued from FIG. 11; FIG.
  • the component mounting apparatus 100 is a device that takes out components C as semiconductor chips from a diced wafer W and mounts them on a substrate B.
  • the component mounting apparatus 100 includes a base 1, a conveyor 2, a head unit 3, a head unit moving mechanism 4, a component supply section 5, a wafer imaging section 6, a wafer imaging section moving mechanism 7, a push-up section 8, a push-up section movement mechanism 9, and a control section 10.
  • the head unit moving mechanism 4 is an example of the "third moving mechanism” in the claims.
  • the wafer imaging section 6 is an example of the "first imaging section” in the claims.
  • the wafer imaging unit moving mechanism 7 is an example of the "first moving mechanism” in the claims.
  • the push-up portion moving mechanism 9 is an example of the "second moving mechanism” in the claims.
  • the conveyor 2 is configured to carry in the board B to the mounting work position and carry out the board B from the mounting work position.
  • the conveyor 2 also includes a pair of conveyor rails extending in the X direction and a positioning mechanism (not shown) that positions the board B at the mounting position. As a result, the conveyor 2 conveys the board B in the X direction and positions and fixes the board B at the mounting work position.
  • the head unit 3 is a head unit for component mounting.
  • the head unit 3 is supported by a head unit moving mechanism 4 so as to be movable in horizontal directions (XY directions) above the wafer W and the conveyor 2 (substrate B).
  • the head unit 3 includes a plurality of heads 31 arranged along the X direction.
  • the head 31 is a mounting head that picks up the component C from the wafer W from above and mounts the picked component C on the substrate B.
  • the head 31 has a suction nozzle 31a for sucking the component C at its tip.
  • the head 31 is configured to pick up the component C from the wafer W by suction with a suction nozzle 31a.
  • the head 31 is configured to mount the component C on the board B, which is picked up by the suction nozzle 31a.
  • the head unit moving mechanism 4 is configured to move the head unit 3. Specifically, the head unit moving mechanism 4 is configured to move the head unit 3 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane.
  • the head unit moving mechanism 4 includes an X-axis head unit moving mechanism 41 for moving the head unit 3 in the X direction and a Y-axis head unit moving mechanism 42 for moving the X-axis head unit moving mechanism 41 in the Y direction.
  • the X direction and the Y direction are examples of the "first direction" and the "second direction” in the claims, respectively.
  • the X-axis head unit moving mechanism 41 is a linear motion mechanism having a ball screw shaft 41a and a drive motor 41b that drives the ball screw shaft 41a.
  • the X-axis head unit moving mechanism 41 rotates the ball screw shaft 41a by the drive motor 41b, thereby moving the head unit 3 attached to the ball screw shaft 41a via the ball nut in the X direction.
  • the Y-axis head unit moving mechanism 42 is a linear motion mechanism having a ball screw shaft 42a and a drive motor 42b that drives the ball screw shaft 42a.
  • the Y-axis head unit moving mechanism 42 rotates the ball screw shaft 42a by the drive motor 42b, thereby moving the X-axis head unit moving mechanism 41 attached to the ball screw shaft 42a via the ball nut in the Y direction.
  • the X-axis head unit moving mechanism 41 and the Y-axis head unit moving mechanism 42 move the head unit 3 horizontally (XY directions) above the wafer W and the conveyor 2 (substrate B).
  • the head unit 3 is provided with a board imaging section 32 and a component imaging section 33 .
  • the board imaging unit 32 is a board camera that takes an image of a position recognition mark (fiducial mark) provided on the board B from above before the component C is mounted on the board B by the head 31 .
  • the control unit 10 is configured to correct the mounting position of the component C by the head 31 based on the imaging result of the position recognition mark by the board imaging unit 32 .
  • substrate imaging part 32 is an example of the "2nd imaging part" of a claim.
  • the component imaging unit 33 is a component camera that takes an image of the component C sucked by the suction nozzle 31a of the head 31 from the side before the component C is mounted on the board B by the head 31.
  • the control unit 10 is configured to recognize the state of the component C sucked by the suction nozzle 31 a of the head 31 based on the imaging result of the component C by the component imaging unit 33 .
  • illustration of the component imaging part 33 is abbreviate
  • the board imaging section 32 and the component imaging section 33 are provided in a common frame with the head unit 3 . Therefore, the board imaging section 32 and the component imaging section 33 can be moved horizontally (XY directions) above the wafer W and the conveyor 2 (board B) by the head unit moving mechanism 4 together with the head unit 3 .
  • the component supply unit 5 is configured to move the wafer W stored in the wafer storage unit 11 to the supply position PF and supply the components C of the wafer W.
  • a plurality of diced wafers W are stored in the wafer storage unit 11 .
  • a plurality of diced wafers W are stored while being adhered to an adhesive wafer sheet WS (see FIG. 3) attached to a ring frame.
  • the component supply unit 5 includes a wafer holding table 51 movable in the Y direction between the wafer storage unit 11 and the supply position PF.
  • the wafer holding table 51 is movable in the Y direction between the wafer housing portion 11 and the supply position PF while holding the wafer W via the ring frame.
  • the wafer image capturing unit 6 is a wafer camera that captures an image of the component C on the wafer W held by the wafer holding table 51 at the supply position PF from above before the component C is taken out from the wafer W by the head 31 .
  • the control unit 10 is configured to correct the pick-up position (suction position) of the component C by the head 31 based on the imaging result of the component C by the wafer imaging unit 6 .
  • the wafer imaging section 6 is supported by a wafer imaging section moving mechanism 7 so as to be movable above the wafer W in horizontal directions (XY directions).
  • the wafer imaging section moving mechanism 7 is configured to move the wafer imaging section 6 . Specifically, the wafer imaging section moving mechanism 7 is configured to move the wafer imaging section 6 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane.
  • the wafer imaging section moving mechanism 7 includes an X-axis wafer imaging section moving mechanism 71 for moving the wafer imaging section 6 in the X direction, and a Y-axis wafer imaging section moving mechanism 72 for moving the X-axis wafer imaging section moving mechanism 71 in the Y direction.
  • the X-axis wafer imaging unit moving mechanism 71 is a linear motion mechanism having a ball screw shaft 71a and a drive motor 71b that drives the ball screw shaft 71a.
  • the X-axis wafer imaging section moving mechanism 71 rotates the ball screw shaft 71a by the drive motor 71b, thereby moving the wafer imaging section 6 attached to the ball screw shaft 71a via the ball nut in the X direction.
  • the Y-axis wafer imaging unit moving mechanism 72 is a linear motion mechanism having a ball screw shaft 72a and a drive motor 72b that drives the ball screw shaft 72a.
  • the Y-axis wafer imaging section moving mechanism 72 rotates the ball screw shaft 72a by the drive motor 72b, thereby moving the X-axis wafer imaging section moving mechanism 71 attached to the ball screw shaft 72a via the ball nut in the Y direction.
  • the wafer imaging section 6 is moved above the wafer W in the horizontal direction (XY directions) by the X-axis wafer imaging section moving mechanism 71 and the Y-axis wafer imaging section moving mechanism 72 .
  • the push-up unit 8 is a push-up head that pushes up the component C of the wafer W held on the wafer holding table 51 at the supply position PF from below when the component C is taken out from the wafer W.
  • the head 31 is held by the wafer holding table 51 at the supply position PF, and is configured to pick up the component C from the wafer W while it is pushed up by the push-up portion 8 .
  • the push-up portion 8 includes a push-up pin 81 that is raised and lowered by a lifting mechanism (not shown).
  • the push-up pins 81 are configured to push up the component C from below and separate the component C from the wafer sheet WS by being lifted by an elevating mechanism. It should be noted that the push-up section 8 does not have an imaging section.
  • the push-up portion moving mechanism 9 is configured to move the push-up portion 8 .
  • the push-up portion moving mechanism 9 is configured to move the push-up portion 8 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane.
  • the pushing-up portion moving mechanism 9 includes an X-axis pushing-up portion moving mechanism 91 for moving the head unit 3 in the X direction, and a Y-axis pushing-up portion moving mechanism 92 for moving the X-axis pushing-up portion moving mechanism 91 in the Y direction.
  • the X-axis push-up portion moving mechanism 91 is a linear motion mechanism having a ball screw shaft 91a and a drive motor 91b that drives the ball screw shaft 91a.
  • the X-axis push-up portion moving mechanism 91 rotates the ball screw shaft 91a with a drive motor 91b, thereby moving the push-up portion 8 attached to the ball screw shaft 91a via a ball nut in the X direction.
  • the Y-axis push-up portion moving mechanism 92 is a linear motion mechanism having a ball screw shaft 92a and a drive motor 92b that drives the ball screw shaft 92a.
  • the Y-axis push-up portion moving mechanism 92 rotates the ball screw shaft 92a by the drive motor 92b, thereby moving the X-axis push-up portion moving mechanism 91 attached to the ball screw shaft 92a via the ball nut in the Y direction.
  • the push-up portion 8 is moved below the wafer W in the horizontal direction (XY direction) by the X-axis push-up portion movement mechanism 91 and the Y-axis push-up portion movement mechanism 92 .
  • control section 10 is configured to control the operation of each section of the component mounting apparatus 100 .
  • the control unit 10 is configured to control the operations of the conveyor 2, the head unit 3, the head unit moving mechanism 4, the board imaging unit 32, the component imaging unit 33, the component supply unit 5, the wafer imaging unit 6, the wafer imaging unit moving mechanism 7, the pushing unit 8, and the pushing unit moving mechanism 9.
  • the control unit 10 controls the operation of each unit based on output signals from position detection means such as encoders built in the drive motors of the above units.
  • the control unit 10 has a function of performing imaging control and image recognition of various imaging units (the substrate imaging unit 32, the component imaging unit 33, and the wafer imaging unit 6).
  • the control unit 10 includes a processor such as a CPU (Central Processing Unit) and a memory.
  • CPU Central Processing Unit
  • thermo elongation correction thermo elongation correction
  • the temperature rise occurs with the movement of each movement target of the head unit 3 (head 31), the wafer imaging section 6, and the push-up section 8.
  • thermal elongation thermal expansion
  • a shift occurs between the theoretical moving position and the actual moving position, so the positioning accuracy of each moving object is lowered. Therefore, the component mounting apparatus 100 performs thermal expansion correction.
  • the control unit 10 is an imaging portion 8 by the wafer imaging section 6, and based on the image result of the thrust part 8 by the wafer imaging section 6, the thermal growth of the Waeha imaging unit movement mechanism 7 and the thermal growth of the push -up part of the tracking part 9.
  • the first thermal growth correction amount D1 (see FIG. 4) is obtained, and it is configured to perform a thermal growth correction based on the obtained first thermal growth amount D1.
  • the head 31, the substrate imaging section 32, the wafer imaging section 6, and the push-up section 8 are schematically illustrated as marks representing each configuration.
  • control unit 10 captures an image of the push-up portion 8 by the substrate imaging unit 32, acquires the second thermal expansion correction amount D2 (see FIG. 5) including the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the push-up portion moving mechanism 9 based on the imaging result of the push-up portion 8 by the substrate imaging unit 32, and performs thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2.
  • the control unit 10 acquires the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, images the component C with the wafer imaging unit 6 while being moved to the acquired imaging position, acquires the deviation amount D3 (see FIG. 6) from the position of the thrusting unit 8 including the thermal elongation of the thrusting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and based on the deviation amount D3, determines the thrusting unit. 8 is configured to acquire the position of the component C pushed up. Further, the control unit 10 is configured to acquire the pickup position of the component C by the head 31 based on the deviation amount D3 and the second thermal expansion correction amount D2.
  • control unit 10 is configured such that the wafer imaging unit 6 images the push-up unit 8 while the wafer imaging unit 6 and the thrust-up unit 8 are moved to the same first target position (theoretical position P1), and the substrate imaging unit 32 images the push-up unit 8 while the substrate imaging unit 32 and the thrust-up unit 8 are moved to the same second target position (theoretical position P1) as the first target position.
  • the wafer imaging section 6 and the substrate imaging section 32 pick up an image of the push-up section 8
  • the wafer W is moved by the wafer holding table 51 so as to retreat from the supply position PF. Therefore, the push-up portion 8 is exposed upward at the supply position PF, and the wafer imaging portion 6 and the board imaging portion 32 can image the push-up portion 8 from above at the supply position PF.
  • the wafer imaging section moving mechanism 7 moves the wafer imaging section 6 with the theoretical position P1 as the target position
  • the thrusting section moving mechanism 9 moves the thrusting section 8 with the theoretical position P1 as the target position.
  • the wafer imaging section 6 is located at a position displaced from the theoretical position P1 by the amount of thermal expansion deviation D11.
  • the push-up portion moving mechanism 9 is positioned at a position displaced from the theoretical position P1 by a thermal expansion displacement amount D12.
  • the wafer imaging section 6 images the thrusting-up section 8 from above in a state where the wafer imaging section 6 and the pushing-up section 8 are positioned at a position displaced from the theoretical position P1 by the thermal expansion deviation amount.
  • This imaging result includes information on the amount of thermal expansion deviation D11 of the wafer imaging unit 6 and the amount of thermal expansion deviation D12 of the push-up unit 8 .
  • a first thermal expansion correction amount D1 including the thermal expansion displacement amount D11 of the wafer imaging unit 6 and the thermal expansion displacement amount D12 of the pushing-up unit 8 is obtained based on the imaging result of the pushing-up unit 8 by the wafer imaging unit 6.
  • the first thermal expansion correction amount D1 represents the displacement amount of the pushing-up portion 8 with respect to the wafer imaging portion 6 in a state of thermal expansion. That is, the first thermal expansion correction amount D1 represents the relative amount of thermal expansion deviation of the wafer imaging section 6 including the thermal expansion deviation amount D12 of the push-up section 8 .
  • the wafer imaging unit 6 by correcting the target position of the wafer imaging unit 6 so as to add the first thermal expansion correction amount D1 to the target position of the wafer imaging unit 6, it is possible to move the wafer imaging unit 6 so that the center of the wafer imaging unit 6 and the center of the push-up unit 8 substantially coincide. That is, it is possible to move the wafer imaging section 6 to the position of the pushing-up section 8 including the thermal expansion of the pushing-up section moving mechanism 9 .
  • the head unit moving mechanism 4 moves the substrate imaging section 32 with the theoretical position P1 as the target position
  • the thrusting section moving mechanism 9 moves the thrusting section 8 with the theoretical position P1 as the target position. Note that if the wafer imaging unit 6 has already imaged the push-up unit 8, the push-up unit 8 has already been moved.
  • the board imaging section 32 is positioned at a position shifted from the theoretical position P1 by the amount of thermal expansion deviation D21.
  • the push-up portion 8 is positioned at a position displaced from the theoretical position P1 by a thermal expansion displacement amount D12.
  • the board imaging section 32 captures an image of the thrusting section 8 from above in a state where the board imaging section 32 and the thrusting section 8 are positioned at positions displaced from the theoretical position P1 by the amount of thermal expansion deviation.
  • This imaging result includes information on the amount of thermal expansion deviation D21 of the board imaging portion 32 and the amount of thermal expansion deviation D12 of the push-up portion 8 .
  • a second thermal expansion correction amount D2 including the thermal expansion displacement amount D21 of the substrate imaging unit 32 and the thermal expansion displacement amount D12 of the pushing-up portion 8 is acquired based on the imaging result of the thrust-up portion 8 by the substrate imaging unit 32.
  • the second thermal expansion correction amount D2 includes the thermal expansion deviation amount D21 of the head 31 and the thermal expansion deviation amount D12 of the push-up portion 8 .
  • the second thermal expansion correction amount D2 represents the displacement amount of the push-up portion 8 with respect to the head 31 (board imaging portion 32) in a thermally expanded state. That is, the second thermal expansion correction amount D2 represents a relative amount of thermal expansion deviation of the head 31 (board imaging section 32) including the thermal expansion deviation amount D12 of the push-up portion 8.
  • the imaging position of the component C by the wafer imaging unit 6 is acquired as the target position after correction. Since the imaging position is acquired including the thermal elongation of the push-up part moving mechanism 9, when the wafer imaging part moving mechanism 7 moves the wafer imaging part 6 to the imaging position, the wafer imaging part 6 is moved to the position of the push-up part 8 including the thermal elongation of the push-up part moving mechanism 9. That is, the wafer imaging unit 6 is moved to a position shifted from the theoretical position P2 by the amount of thermal expansion deviation D12.
  • the component C is imaged from above by the wafer imaging unit 6 in a state of being shifted from the theoretical position P2 by the amount of thermal expansion deviation D12.
  • This imaging result includes information on the amount of deviation D3 from the position of the push-up portion 8 including the thermal elongation of the push-up portion moving mechanism 9 to the center position of the component C.
  • FIG. based on the imaging result of the component C by the wafer imaging unit 6, the shift amount D3 from the position of the push-up portion 8 including the thermal expansion of the push-up portion moving mechanism 9 to the center position of the component C is obtained.
  • the position of the part C pushed up by the push-up part 8 is obtained as the corrected target position. Then, by moving the push-up part 8 to the acquired push-up position by the push-up part moving mechanism 9, the push-up part 8 can be moved so that the center of the part C and the center of the push-up part 8 substantially coincide.
  • the pickup position of the component C by the head 31 is obtained as the corrected target position.
  • the head unit moving mechanism 4 moves the head 31 to the acquired take-out position, thereby moving the head 31 so that the center of the component C and the center of the head 31 substantially coincide.
  • the imaging of the push-up portion 8 by each of the wafer imaging portion 6 and the substrate imaging portion 32 may be performed at only one point, or may be performed at a plurality of points such as two points and four points.
  • each imaging section captures an image of the push-up portion 8 at a point P11 at the center position of the wafer adsorption area WA. Then, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 at the point P11 are acquired based on the imaging result at the point P11 of the push-up portion 8 .
  • the acquired first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used as they are when correcting the push-up position and the take-out position, as described with reference to FIGS. That is, the same first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used when picking up the component C at any position on the wafer W.
  • each imaging section image the push-up section 8 at a plurality of points, such as arbitrary two points and arbitrary four points within the wafer adsorption area WA.
  • the pushing-up portion 8 is imaged at two arbitrary points
  • the pushing-up portion 8 is imaged by each imaging portion at predetermined points P21 and P22 in the wafer adsorption area WA.
  • the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C on the wafer W are obtained using a coordinate transformation method such as affine transformation.
  • the obtained first thermal expansion correction amount D1 and second thermal expansion correction amount D2 for each position of the component C on the wafer W are used when correcting the push-up position and the pick-up position. That is, depending on the position of the component C on the wafer W, different first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used.
  • the push-up portion 8 when the push-up portion 8 is imaged at four arbitrary points, the push-up portion 8 is imaged by each imaging portion at predetermined points P31 to P34 within the wafer adsorption area WA. Then, based on the imaging results of the push-up portion 8 at each of the points P31 to P34, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for each position of the component C on the wafer W are obtained using a coordinate transformation method such as projective transformation. Then, the obtained first thermal expansion correction amount D1 and second thermal expansion correction amount D2 for each position of the component C on the wafer W are used when correcting the push-up position and the pick-up position. That is, depending on the position of the component C on the wafer W, different first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used.
  • Control processing related to thermal elongation correction 8 and 9 control processing for thermal expansion correction by the component mounting apparatus 100 of the first embodiment will be described based on a flowchart. Note that each process in the flowchart is executed by the control unit 10 .
  • step S101 it is determined whether or not the wafer W is present at the supply position PF. If it is determined that the wafer W does not exist at the supply position PF, the process proceeds to step S103. Further, when it is determined that the wafer W is present at the supply position PF, the process proceeds to step S102.
  • step S102 the wafer W is returned to the wafer storage unit 11 by the wafer holding table 51.
  • step S103 the wafer imaging section moving mechanism 7 moves to the imaging position (theoretical position P1), and the thrusting section moving mechanism 9 moves the thrusting section 8 to the imaging position (theoretical position P1).
  • step S104 the thrust-up portion 8 is imaged by the wafer imaging portion 6.
  • step S105 it is determined whether or not imaging of the push-up portion 8 by the wafer imaging unit 6 at all imaging points has been completed. If it is determined that the wafer imaging unit 6 has not completed imaging the thrust-up portion 8 at all imaging points, the process proceeds to step S103, and the wafer imaging unit 6 images the thrust-up portion 8 at the next imaging point. If it is determined that the imaging of the push-up portion 8 by the wafer imaging section 6 at all imaging points has been completed, the process proceeds to step S106. Note that when there is only one imaging point, the process of step S105 is not performed.
  • step S106 the first thermal expansion correction amount D1 is obtained based on the imaging result of the pushing-up portion 8 by the wafer imaging portion 6.
  • step S107 the board imaging section 32 is moved to the imaging position (theoretical position P1) by the head unit moving mechanism 4, and the thrusting section 8 is moved to the imaging position (theoretical position P1) by the thrusting section moving mechanism 9. It should be noted that the push-up portion 8 maintains the position moved in the process of step S103.
  • step S108 the board imaging section 32 captures an image of the push-up section 8.
  • step S109 it is determined whether or not imaging of the push-up portion 8 by the substrate imaging section 32 at all imaging points has been completed. If it is determined that the substrate imaging unit 32 has not completed imaging the push-up portion 8 at all imaging points, the process proceeds to step S107, and the substrate imaging unit 32 images the push-up portion 8 at the next imaging point. If it is determined that imaging of the push-up portion 8 by the substrate imaging section 32 at all imaging points has been completed, the process proceeds to step S110. Note that when there is only one imaging point, the process of step S109 is not performed.
  • step S ⁇ b>110 the second thermal expansion correction amount D ⁇ b>2 is acquired based on the imaging result of the push-up portion 8 by the substrate imaging section 32 .
  • the control process is then terminated. Note that the amount of thermal expansion of each moving mechanism changes with time, so the control process shown in FIG. 8 is performed at predetermined time intervals (such as 3-minute intervals). Therefore, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are updated at predetermined time intervals, and the latest thermal expansion state is reflected in the thermal expansion correction.
  • step S111 the imaging position of the component C by the wafer imaging unit 6 is obtained based on the first thermal expansion correction amount D1.
  • step S112 the wafer imaging section moving mechanism 7 moves the wafer imaging section 6 to the imaging position.
  • step S113 the image of the component C is captured by the wafer imaging unit 6.
  • step S114 the amount of deviation D3 is acquired based on the imaging result of the component C by the wafer imaging unit 6.
  • step S115 the push-up position of the part C by the push-up unit 8 is acquired based on the deviation amount D3.
  • step S116 the push-up portion moving mechanism 9 moves the push-up portion 8 to the push-up position.
  • step S117 the pickup position of the component C by the head 31 is acquired based on the deviation amount D3 and the second thermal expansion correction amount D2.
  • step S118 the head unit moving mechanism 4 moves the head 31 to the removal position.
  • step S119 the pushing-up portion 8 pushes up the component C and the head 31 picks up the component C.
  • the control process is then terminated. Further, the control processing shown in FIG. 9 is repeatedly performed until the production of the substrate B is completed.
  • the wafer imaging unit 6 captures an image of the push-up unit 8, acquires the first thermal expansion correction amount D1 including the thermal elongation of the wafer imaging unit moving mechanism 7 that moves the wafer imaging unit 6 and the thermal elongation of the push-up unit moving mechanism 9 that moves the push-up unit 8, based on the imaging result of the push-up unit 8 by the wafer imaging unit 6, and provides the control unit 10 that performs thermal elongation correction based on the acquired first thermal expansion correction amount D1.
  • the pushing-up portion moving mechanism 9 can move the pushing-up portion 8 to an appropriate pushing-up position, so that the pushing-up portion 8 can push up the component C appropriately.
  • the pushing-up portion moving mechanism 9 can move the pushing-up portion 8 to an appropriate pushing-up position, so that the pushing-up portion 8 can push up the component C appropriately.
  • the component mounting apparatus 100 In order to correct the thermal expansion of the wafer imaging section moving mechanism 7 and the thermal expansion of the push-up section moving mechanism 9, it is possible to configure the component mounting apparatus 100 as follows. That is, it is conceivable to provide the component mounting apparatus 100 with a recognition mark used for thermal expansion correction, to correct the thermal expansion of the wafer imaging section moving mechanism 7 by imaging the recognition mark with the wafer imaging section 6, and to correct the thermal expansion of the thrusting section moving mechanism 9 by imaging the push-up section 8 with the wafer imaging section 6 in a state in which the thermal expansion of the wafer imaging section movement mechanism 7 has been corrected.
  • the wafer imaging unit 6 captures an image of the push-up unit 8, and based on the imaging result of the push-up unit 8 by the wafer imaging unit 6, the first thermal expansion correction amount D1 including the thermal expansion of the wafer imaging unit moving mechanism 7 and the thermal expansion of the push-up unit moving mechanism 9 is acquired, and thermal expansion correction is performed based on the acquired first thermal expansion correction amount D1.
  • the thermal expansion of the wafer imaging part moving mechanism 7 and the thermal expansion of the pushing part moving mechanism 9 can be corrected simultaneously only by imaging the push-up part 8, so that it is possible to suppress an increase in the time required for correcting the thermal expansion.
  • the control unit 10 acquires the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, images the component C with the wafer imaging unit 6 while being moved to the acquired imaging position, acquires the deviation amount D3 from the position of the thrusting unit 8 including the thermal expansion of the thrusting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and acquires the deviation amount D3 based on the deviation amount D3. , to obtain the position of the component C pushed up by the pushing-up portion 8 .
  • the component mounting apparatus 100 includes the head unit 3 that picks up the component C on the wafer from above, the board imaging section 32 provided in the head unit 3, and the head unit moving mechanism 4 that moves the head unit 3.
  • the control unit 10 is configured to capture an image of the push-up portion 8 by the substrate imaging unit 32, acquire a second thermal expansion correction amount D2 including the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the push-up portion moving mechanism 9 based on the imaging result of the push-up portion 8 by the substrate imaging unit 32, and perform thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2.
  • the thermal expansion of the head unit moving mechanism 4 can be corrected so as to correspond to the correction of the thermal expansion of the wafer imaging unit moving mechanism 7 and the push-up portion moving mechanism 9, so that the head unit moving mechanism 4 can move the head 31 to an appropriate take-out position.
  • the component C can be properly picked up by the head 31, so that a more stable picking accuracy of the component C can be ensured.
  • the control unit 10 acquires the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, images the component C with the wafer imaging unit 6 while being moved to the acquired imaging position, acquires the deviation amount D3 from the position of the thrusting unit 8 including the thermal expansion of the thrusting unit moving mechanism 9 to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and acquires the deviation amount D3 based on the deviation amount D3. , the position of the component C pushed up by the pushing-up portion 8 is obtained, and the pickup position of the component C by the head 31 is obtained based on the deviation amount D3 and the second thermal expansion correction amount D2.
  • the pushing-up position of the component C by the pushing-up part 8 and the picking-up position of the component C by the head 31 can be corrected with high accuracy, so that it is possible to easily secure more stable pushing-up accuracy of the component C and more stable picking-up accuracy of the component C.
  • the wafer imaging section moving mechanism 7 is configured to move the wafer imaging section 6 in the X direction and the Y direction, which are substantially perpendicular to each other in the horizontal plane.
  • the push-up portion moving mechanism 9 is configured to move the push-up portion 8 in the X direction and the Y direction.
  • the head unit moving mechanism 4 is configured to move the head unit 3 in the X direction and the Y direction.
  • the thermal expansion of the wafer imaging section moving mechanism 7, the pushing section moving mechanism 9, and the head unit moving mechanism 4 can be corrected.
  • control unit 10 is configured such that the wafer imaging unit 6 images the push-up unit 8 while the wafer imaging unit 6 and the push-up unit 8 are moved to the same first target position, and the substrate imaging unit 32 images the push-up unit 8 while the substrate imaging unit 32 and the push-up unit 8 are moved to the same second target position as the first target position.
  • the thermal elongation of the push-up portion moving mechanism 9 included in the first thermal elongation correction amount D1 and the thermal elongation of the push-up portion moving mechanism 9 included in the second thermal elongation correction amount D2 can be matched, so the thermal elongation correction based on the first thermal elongation correction amount D1 and the second thermal elongation correction amount D2 can be accurately performed.
  • the push-up section 8 is configured so as not to have an imaging section. Accordingly, since the push-up section 8 does not have an imaging section, it is possible to suppress an increase in the number of parts and complication of the structure as compared with the case where the push-up section 8 has an imaging section. Further, even if the push-up unit 8 does not have an imaging unit, the wafer imaging unit 6 can be effectively used to correct thermal expansion of the push-up unit moving mechanism 9 . As a result, it is possible to correct the thermal elongation of the push-up portion moving mechanism 9 while suppressing an increase in the number of parts and complication of the structure.
  • FIG. 10 to 12 a second embodiment will be described with reference to FIGS. 10 to 12.
  • FIG. 10 to 12 an example will be described in which an area for picking up a component from a wafer is acquired within a predetermined time interval, and the thrust-up portion is imaged by the wafer imaging unit at a position corresponding to the acquired area.
  • the same components as in the first embodiment are indicated by the same reference numerals, and descriptions thereof are omitted.
  • a component mounting apparatus 200 according to the second embodiment of the present invention differs from the component mounting apparatus 100 according to the first embodiment in that it includes a control unit 110 as shown in FIG.
  • the control unit 110 is configured to update the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for thermal expansion correction at predetermined time intervals (such as 3-minute intervals).
  • the control unit 110 acquires the area 111 from which the component C is to be taken out from the wafer W within a predetermined time interval, and at the position P101 corresponding to the acquired area 111, the wafer imaging unit 6 images the push-up unit 8, and updates the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2.
  • the control unit 110 is configured to obtain the number of components C to be taken out from the wafer W within a predetermined time interval based on the cycle time of the substrate B, and to obtain the area 111 based on the obtained number of components C.
  • FIG. 10 shows an example in which there are two imaging points, but the number of imaging points may be one, or a plurality of points other than two.
  • step S201 the cycle time is initialized.
  • step S201 the previous cycle time is set from the previous production history.
  • step S202 the substrate B is replaced by the conveyor 2.
  • the conveyor 2 unloads the board B on which the component C has been mounted, and carries in the board B on which the component C is to be mounted.
  • step S203 it is determined whether or not the timing is the update timing of the thermal expansion correction. If it is determined that the timing is not the update timing of the thermal expansion correction, the process proceeds to step S207. Moreover, when it is determined that the timing is the update timing of the thermal expansion correction, the process proceeds to step S204.
  • step S204 based on the cycle time of the substrate B, the number of components C to be removed from the wafer W is obtained by the next thermal expansion correction update timing, and based on the obtained number of components C, the area 111 for removing the components C from the wafer W by the next thermal expansion correction update timing is obtained.
  • step S205 the pushing-up portion 8 is imaged by the wafer imaging portion 6 and the board imaging portion 32.
  • step S206 the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are obtained based on the imaging result of the push-up portion 8. Note that in steps S205 and S206, in detail, the processes of steps S103 to S110 shown in FIG. 8 are performed.
  • step S207 the image of the component C is captured by the wafer imaging unit 6.
  • step S208 the pushing-up portion 8 pushes up the component C and the head 31 picks up the component C. Note that in steps S207 and S208, in detail, the processes of steps S111 to S119 shown in FIG. 8 are performed.
  • step S ⁇ b>209 an image of the component C sucked by the suction nozzle 31 a of the head 31 is captured by the component imaging unit 33 .
  • step S ⁇ b>210 the component C is mounted on the board B by the head 31 based on the imaging result of the component C by the component imaging unit 33 .
  • the cycle time is updated in step S211.
  • the cycle time may be updated for each suction group of the head 31 or may be updated for each production of one substrate B.
  • step S212 it is determined whether or not the component C has been mounted at all mounting positions on the board B. If it is determined that component C is not mounted on all mounting positions on board B, the process proceeds to step S203, and component C is mounted on the remaining mounting positions. If it is determined that component C has been mounted at all mounting positions on board B, the process proceeds to step S213.
  • step S213 it is determined whether or not the production of the board B is finished. If it is determined that the production of the board B will not be finished, the process proceeds to step S202, and the component C is mounted on the next board B. On the other hand, if it is determined that the production of the board B is finished, the process proceeds to step S214.
  • step S214 the substrate B is carried out by the conveyor 2.
  • step S215 the cycle time is saved. After that, the control process is terminated.
  • the control unit 110 is configured to update the thermal expansion correction at predetermined time intervals.
  • the control unit 110 acquires the area 111 from which the component C is to be removed from the wafer W within a predetermined time interval, captures an image of the push-up unit 8 with the wafer imaging unit 6 at a position P101 corresponding to the acquired area 111, and updates the thermal expansion correction. Accordingly, by updating the thermal elongation correction at predetermined time intervals, the thermal elongation that changes with time can be properly reflected in the thermal elongation correction.
  • the area 111 from which the component C is to be taken out from the wafer W is acquired within a predetermined time interval, and the thrust-up portion 8 is imaged by the wafer imaging section 6 at the position P101 corresponding to the acquired area 111 to update the thermal expansion correction.
  • the thrust-up portion 8 can be imaged by the wafer imaging portion 6 at an effective position near the component C and the thermal expansion correction can be updated, so that the accuracy of the thermal expansion correction can be effectively improved.
  • thermal elongation is not linear in many cases, it is preferable from the viewpoint of improving the accuracy of thermal elongation correction to perform thermal elongation correction by imaging the push-up portion 8 with the wafer imaging unit 6 at a plurality of positions.
  • the wafer imaging unit 6 images the push-up portion 8 at a plurality of positions, the time required for thermal expansion correction increases.
  • the accuracy of thermal expansion correction can be effectively improved, so even if the number of positions where the thrust-up portion 8 is imaged by the wafer imaging unit 6 is reduced, the thermal expansion can be corrected with high accuracy. As a result, it is possible to accurately perform the thermal elongation correction while suppressing an increase in the time required for the thermal elongation correction.
  • control unit 110 is configured to acquire the number of components C to be taken out from the wafer W within a predetermined time interval based on the cycle time of the substrate B, and to acquire the area 111 based on the acquired number of components C. Accordingly, based on the number of components C to be removed from the wafer W within a predetermined time interval, it is possible to easily obtain the area 111 from which the components C are to be removed from the wafer W within the predetermined time interval.
  • the head is a mounting head, but the present invention is not limited to this.
  • the head may be a take-out head that picks up components from a wafer and transfers the picked-up components to a mounting head.
  • the board imaging section is provided as the second imaging section
  • the present invention is not limited to this.
  • an imaging section other than the substrate imaging section may be provided as the second imaging section.
  • the push-up portion moving mechanism (second moving mechanism) moves the push-up portion in the X direction (first direction) and the Y direction (second direction) is shown, but the present invention is not limited to this.
  • the second moving mechanism may move the push-up portion in only one of the first direction and the second direction.
  • control unit acquires the first thermal expansion correction amount and the second thermal expansion correction amount is shown, but the present invention is not limited to this. In the present invention, the control unit may acquire only the first thermal expansion correction amount.
  • control processing may be performed by event-driven processing in which processing is executed on an event-by-event basis. In this case, it may be completely event-driven, or a combination of event-driven and flow-driven.
  • head unit moving mechanism third moving mechanism
  • head unit moving mechanism third moving mechanism
  • Wafer imaging unit first imaging unit
  • Wafer imaging unit moving mechanism first moving mechanism
  • push-up portion push-up portion moving mechanism
  • control section 31 head 32 board imaging section (second imaging section)
  • Component mounting apparatus 111 Area B Board C
  • Component D1 First thermal expansion correction amount D2
  • Second thermal expansion correction amount D3 Deviation amount P101 Position corresponding to area X direction (first direction) Y direction (second direction) W Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un dispositif de montage de composant (100) comprenant une première unité d'imagerie (6), une unité d'élévation (8), un premier mécanisme de déplacement (7), un second mécanisme de déplacement (9) et une unité de commande (10). L'unité de commande utilise la première unité d'imagerie pour effectuer une imagerie de l'unité d'élévation, acquiert une première quantité de correction d'allongement thermique (D1) qui incorpore l'allongement thermique du premier mécanisme de mouvement et l'allongement thermique du second mécanisme de mouvement sur la base des résultats de l'imagerie de l'unité d'élévation par la première unité d'imagerie, et effectue une correction d'allongement thermique sur la base de la première quantité de correction d'allongement thermique acquise.
PCT/JP2022/002070 2022-01-20 2022-01-20 Dispositif de montage de composant WO2023139735A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/002070 WO2023139735A1 (fr) 2022-01-20 2022-01-20 Dispositif de montage de composant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/002070 WO2023139735A1 (fr) 2022-01-20 2022-01-20 Dispositif de montage de composant

Publications (1)

Publication Number Publication Date
WO2023139735A1 true WO2023139735A1 (fr) 2023-07-27

Family

ID=87348367

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/002070 WO2023139735A1 (fr) 2022-01-20 2022-01-20 Dispositif de montage de composant

Country Status (1)

Country Link
WO (1) WO2023139735A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009001627A1 (fr) * 2007-06-28 2008-12-31 Yamaha Motor Co., Ltd. Appareil de placement de composants
JP2017017350A (ja) * 2016-10-11 2017-01-19 ヤマハ発動機株式会社 部品実装装置
JP2020174136A (ja) * 2019-04-11 2020-10-22 ヤマハ発動機株式会社 基板作業装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009001627A1 (fr) * 2007-06-28 2008-12-31 Yamaha Motor Co., Ltd. Appareil de placement de composants
JP2017017350A (ja) * 2016-10-11 2017-01-19 ヤマハ発動機株式会社 部品実装装置
JP2020174136A (ja) * 2019-04-11 2020-10-22 ヤマハ発動機株式会社 基板作業装置

Similar Documents

Publication Publication Date Title
JP5059518B2 (ja) 電子部品実装方法及び装置
KR20190013670A (ko) 전자 부품의 실장 장치와 실장 방법 및 패키지 부품의 제조 방법
JP2007305775A (ja) 部品実装方法、部品実装装置および部品実装システム
JP3744251B2 (ja) 電子部品実装方法
JP2016219474A (ja) 部品取出し装置および部品取出し方法ならびに部品実装装置
JP4824641B2 (ja) 部品移載装置
JP4855347B2 (ja) 部品移載装置
EP2059112B1 (fr) Appareil de retrait de composant electronique, appareil de montage de surface et procede permettant de retirer un composant electronique
JP2017183378A (ja) 電子部品の実装装置
KR101960693B1 (ko) 부품 탑재 방법 및 부품 실장 장치
JP2016219472A (ja) 部品取出し装置および部品取出し方法ならびに部品実装装置
JP2009016673A5 (fr)
JP5892735B2 (ja) 突き上げピンの位置補正方法
WO2023139735A1 (fr) Dispositif de montage de composant
JP2018041802A (ja) 電子部品の実装方法及び実装装置
JP3709800B2 (ja) 実装機およびその部品装着方法
JP2009212251A (ja) 部品移載装置
JP4810586B2 (ja) 実装機
JP5254875B2 (ja) 実装機
JP2003318599A (ja) 部品実装方法及び部品実装装置
JP3531588B2 (ja) 電子部品の実装装置および実装方法
CN118266278A (en) Component mounting apparatus
JP2007287838A (ja) 部品移載装置、実装機および部品検査機用部品移載装置
JP2016219473A (ja) 部品取出し装置および部品取出し方法ならびに部品実装装置
JP6086671B2 (ja) ダイ部品供給装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22921002

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2023574985

Country of ref document: JP

Kind code of ref document: A