WO2023123907A1 - Procédé de fabrication de carte rigide-flexible et carte de circuit imprimé - Google Patents

Procédé de fabrication de carte rigide-flexible et carte de circuit imprimé Download PDF

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Publication number
WO2023123907A1
WO2023123907A1 PCT/CN2022/100046 CN2022100046W WO2023123907A1 WO 2023123907 A1 WO2023123907 A1 WO 2023123907A1 CN 2022100046 W CN2022100046 W CN 2022100046W WO 2023123907 A1 WO2023123907 A1 WO 2023123907A1
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WO
WIPO (PCT)
Prior art keywords
area
layer
board
rigid
manufacturing
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Application number
PCT/CN2022/100046
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English (en)
Chinese (zh)
Inventor
肖璐
林宇超
钟美娟
朱光远
张志远
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生益电子股份有限公司
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Publication of WO2023123907A1 publication Critical patent/WO2023123907A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Definitions

  • This application relates to the technical field of PCB (Printed Circuit Boards, printed circuit boards), for example, it relates to a manufacturing method of a soft-rigid combination board and a circuit board.
  • PCB Printed Circuit Boards, printed circuit boards
  • Rigid-flex board is a combination of flexible circuit board and rigid circuit board through pressing and other processes to form a flexible circuit board (Flexible Printed Circuit Board, FPC) and a printed circuit board (Printed Circuit Boards, PCB)
  • FPC Flexible Printed Circuit Board
  • PCB printed circuit Boards
  • the flying-tail type rigid-flex board is more commonly used in the rigid-flex board.
  • the gold finger can only be made on the edge of the board, which limits the use of the gold finger. Location.
  • the present application provides a method for manufacturing a rigid-flex board and a circuit board, which can flexibly design the position of a gold finger in the board.
  • an embodiment of the present application provides a method for manufacturing a rigid-flex board, including:
  • a soft board layer, a prepreg and a hard board layer the soft board layer is provided with a bending area, and the bending area is provided with golden fingers, and the hard board layer is provided with a first area, and the first area is the In the area of the hard board layer that is not covered by the prepreg; paste the first covering film on the surface of the bending area; make the shape corresponding to the bending area, and the shape is smaller than the first covering film; A protective tape is pasted on the surface of the bending area, and the designated bending area is the bending area facing the copper foil layer with the outermost soft board layer; the second cover film is pasted on the first area; the boards are laminated and pressed in sequence, The soft board layer and the hard board layer are stacked in sequence to obtain a mother board; and the first designated area of the mother board is opened, and the protective tape is removed, and the first designated area is the Substrate and copper foil outside the flex area of the flex layer.
  • the manufacturing method further includes: attaching reinforcement to a second designated area of the bending area, and the second designated area corresponds to the other side of the soft board layer corresponding to the golden finger.
  • the protective tape is a single-sided tape
  • the manufacturing method includes: attaching the adhesive side of the single-sided tape to the surface of the soft board layer in advance; and removing the single-sided tape
  • the effective area of the single-sided adhesive tape is reserved, and the position of the effective area covers the shape groove corresponding to the bending area.
  • the protective tape is a double-sided tape
  • the manufacturing method includes: attaching the first adhesive surface of the double-sided tape to the soft board layer of the adhesive sheet in advance
  • the second adhesive surface of the double-sided tape is attached to the surface of the soft board layer facing the bonding sheet in advance; the viscosity of the first adhesive surface is greater than that of the first adhesive surface.
  • the viscosity of the second adhesive surface and removing the invalid area of the double-sided tape, retaining the effective area of the double-sided tape, the position of the effective area covers the shape groove corresponding to the bending area.
  • the rigid-flex board includes a plurality of soft board layers
  • the prepreg includes a first prepreg stacked between two soft board layers and a first prepreg stacked on the soft board layer.
  • the manufacturing method further includes: opening a window on the first prepreg and the second prepreg, and the size of the window opening area is larger than the size of the first covering film .
  • the manufacturing method further includes: performing surface treatment on the golden finger.
  • the first cover film on the surface of the bending area before pasting the first cover film on the surface of the bending area, it also includes: making the inner layer pattern of each layer of core boards; browning each layer of core boards; and following the preset stacking sequence After the flexible board layers are stacked, a pressing process is performed to obtain the rigid-flex board.
  • the protective tape after attaching the protective tape to the surface of the bending area, it further includes: providing copper foil; and sequentially laminating and pressing the plates, so that the prepreg and copper foil are sequentially stacked on the surface of the protective tape. Directly above.
  • the sequential stacking and pressing so that the soft board layer and the hard board layer are sequentially stacked to obtain the motherboard, it also includes: making the outer layer pattern of the motherboard; and Carry out green oil treatment, surface treatment and shape treatment on the motherboard.
  • An embodiment of the present application provides a circuit board, which is manufactured according to the method for manufacturing a rigid-flex board as described above.
  • Fig. 1 is a schematic flow chart of a manufacturing method of a rigid-flex board provided by an embodiment of the present application
  • Fig. 2 is a schematic structural diagram of a soft board layer provided by an embodiment of the present application.
  • Fig. 3 is a schematic structural diagram of a rigid-flex board with only one golden finger provided by an embodiment of the present application
  • Fig. 4 is a structural schematic diagram of a stacking method provided by an embodiment of the present application.
  • Fig. 5 is a structural schematic diagram of another stacking method provided by an embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of a window opening method provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of an outline figure of a bending area provided by an embodiment of the present application.
  • multiple means more than two. Greater than, less than, exceeding, etc. are understood as not including the original number, above, below, within, etc. are understood as including the original number, and "at least one” means one or more "at least one of the following” and similar expressions refer to any combination of these items, including any combination of single or plural items. If there is a description of "first”, “second”, etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the indicated The sequence relationship of the technical characteristics.
  • connection may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediary.
  • a method of manufacturing a rigid-flex board including but not limited to S1, S2, S3, S4, S5, S6 and S7:
  • a soft board layer 1, a prepreg 3 and a hard board layer 2 are provided; the soft board layer is provided with a bending area, the bending area is provided with gold fingers, and the hard board layer is provided with a first area, so The first area is an area in the hard ply that is not covered by the prepreg.
  • the soft board layer 1 and the hard board layer 2 need to be laminated with prepreg 3, and then pressed together.
  • the second prepreg between the soft board layer 1 and the hard board layer 2 needs to be windowed, and the windowed area needs to be larger than the area of the first covering film. Therefore, in the windowed area, there is no prepreg coverage, and this area is first area.
  • the flexible board layer 1 includes a bending area 110 on which the gold finger is disposed, and the gold finger can move within a certain range through the bending area 110 .
  • step S2 it is necessary to stick the first cover film 15 on the surface of the bending area 110, so as to protect the bending area 110, so as to effectively improve the quality of the rigid-flex board.
  • pasting the first covering film 15 can act as a glue barrier, protecting the bending area 110 from being corroded by glue or other chemicals in the subsequent pressing and wet process.
  • the size of the outline pattern 120 is smaller than the size of the first covering film.
  • a protective tape is pasted on the surface of the designated bending area, and the designated bending area is the bending area where the outermost flexible board layer faces the copper foil layer.
  • the protective tape 14 of this embodiment has high temperature resistance and has double-sided adhesiveness, that is, the first side of the protective tape 14 has low viscosity and is attached to the surface of the soft board layer 1; while the second side of the protective tape 14 has high viscosity. , in contact with the outer copper foil 12 or the prepreg 3 .
  • the protective tape 14 can provide a physical bonding force with the outer copper foil 12 of the circuit board and the outer layer copper of the soft board layer 1, so that the outer layer copper foil 12 of the circuit board is indirectly pressed on the soft board layer 1 through the protective tape 14 superior.
  • the protective tape 14 and the outer layer copper of the soft board layer 1 have only physical bonding force, the protective tape 14 and the outer layer copper foil 12 of the circuit board are easier to remove from the surface of the soft board layer 1, that is, it is easier to perform the opening operation, and at the same time Contoured grooves that block resin flow into the bend area.
  • the prepreg 3 is not subjected to window opening or is only grooved along the shape of the bending area in the subsequent process, the prepreg 3 is in contact with the protective tape 14 instead of the copper foil 12 .
  • the protective tape 14 can provide a physical bonding force with the outer layer copper of the prepreg 3 and the soft board layer 1, so that the prepreg 3 is indirectly pressed on the soft board layer 1 through the protective tape 14, so that the protective tape 14 and the prepreg 3. It is easier to remove from the surface of the soft board layer 1, that is, it is easier to perform the opening operation.
  • the tape in order to further increase the physical bonding force between the aforementioned protective tape 14 and the copper foil 12 on the outer layer of the circuit board, the tape can also be roughened so that the surface of the tape has a certain roughness, thereby increasing the physical bond between the protective tape 14 and the copper foil 12. Binding force.
  • the protective tape 14 is a single-sided tape
  • the manufacturing method further includes:
  • the invalid area of the single-sided tape is removed, and the effective area of the single-sided tape is retained.
  • the position of the effective area is consistent with the position of the bending area 110 .
  • the size of the effective area only needs to ensure that it can cover the shape groove of the bending area 110 , and the size of the effective area can be the same as the first covering film 15 or slightly smaller than the first covering film 15 .
  • laser cutting may be used to cut the single-sided tape along the boundary line between the effective area and the invalid area, and then tear off the invalid area of the single-sided tape.
  • the protective tape 14 is a double-sided tape
  • the manufacturing method also includes:
  • the invalid area of the double-sided tape is removed, and the effective area of the double-sided tape is reserved, and the position of the effective area is consistent with the position of the bending area 110 .
  • the size of the effective area only needs to ensure that it can cover the shape groove of the bending area 110 , and the size of the effective area can be the same as the first covering film 15 or slightly smaller than the first covering film 15 .
  • the second prepreg 3 disposed between the soft board layer 1 and the hard board layer 2 needs to be windowed, and after the windowing treatment, a first region 210 not covered by the prepreg 3 will be formed. Because the prepreg in this area has been window-opened, it is necessary to paste a second cover film 22 to fill the gap in this area to reduce pressure loss and prevent the glue from flowing between the soft board layer 1 and the hard board layer 2 to cause the hard board Layer 1 adjacent to layer 2 cannot be bent.
  • the rigid-flex board includes a plurality of soft board layers
  • the manufacturing method further includes:
  • a window is opened on the first prepreg and the second prepreg stacked between the two soft board layers, and the size of the window area is larger than the size of the first covering film.
  • the first prepreg is stacked between two adjacent soft board layers 1
  • the second prepreg is stacked between the soft board layer 1 and the hard board layer 2.
  • the prepreg and the second prepreg are subjected to window opening treatment, so as to prevent the prepreg from flowing into the bending area 110 in subsequent processes, causing damage to the bending area 110 .
  • the window opening method includes laser cutting, milling window, etc., and can also be stamped into a prepreg with a suitable shape by mold stamping.
  • the window area of the prepreg 3 bonded to the outer layer copper foil 12 of the circuit board can also be grooved along the shape of the bending area 110 . Because the glass fiber at the grooved position of the prepreg is broken, the resin fills the groove again during the subsequent lamination process, so there is only resin in the groove without glass fiber, which is convenient for subsequent uncapping operations.
  • the boards are stacked and pressed sequentially, so that the soft board layer and the hard board layer are stacked in sequence to obtain a mother board.
  • a prepreg 3 needs to be stacked between the two sub-boards, so as to achieve press-fitting and fixing between the two sub-boards after the pressing process, so that the prepared mother board has a stable press-fit structure.
  • the sub-board includes a soft board layer 1 and a hard board layer 2, that is, between two adjacent soft board layers 1, between a soft board layer 1 and a hard board layer 2, and between two adjacent hard board layers 2 need to be laminated.
  • Prepreg 3 is placed.
  • one or more gold fingers can be designed on the PCB according to actual needs. When there is only one gold finger on the PCB, the board stacking method is shown in Figure 4, and a soft board layer 1 and a hard board layer 2 need to be pressed together.
  • the board stacking method is shown in Figure 5.
  • Multiple soft board layers 1 are stacked together in sequence, and then multiple hard board layers 2 corresponding to the number of soft board layers 1 are stacked in sequence. board together, and then press a plurality of soft board layers 1 and a plurality of hard board layers 2 .
  • the copper foil 12 is indirectly pressed on the surface of the soft board layer 1 through the prepreg 3 and the protective tape 14 , and the prepreg 3 is indirectly bonded to the soft board layer 1 through the protective tape 14
  • the surface of the soft board layer 1 does not need to be etched on the outer layer of copper except the crimping hole area 20, which effectively reduces the difficulty of PCB production, and makes the soft board layer 1 not increase the thickness of the finished PCB due to the remaining prepreg 3, so as not to High and low steps will be formed due to the prepreg 3 remaining in the soft board layer 1, which can effectively improve the levelness of the PCB surface, reduce the difficulty of subsequent component insertion and installation on the PCB, and effectively improve user experience.
  • the first designated area of the motherboard is opened, and the protective tape is removed, the first designated area is the base material and the copper foil outside the bending area of the soft board layer.
  • the prepreg 3 in the first designated area is not subjected to groove or window opening, it can also be opened by laser cutting or other methods. Specifically, as shown in FIG.
  • the copper foil 12 on the outside of the mother board and the periphery of the substrate 3 corresponding to the bending area are laser cut to form deep grooves, and then the cover outside the bending area is lifted along the deep grooves. After the cover is opened, the protective tape exposed after the cover needs to be removed.
  • step S1 before the step S1, it also includes: making inner-layer graphics of each layer of core boards, and performing browning treatment on each layer of core boards.
  • the core board includes the first core board 11 in the soft board layer 1 and the second core board 21 in the hard board layer 2.
  • the purpose of this step is to make the core boards of each layer in the daughter board and the The browning chemical solution reacts to form a dense organic browning film on the copper surface of the core board to enhance the bonding force between the core boards of each layer and the corresponding prepreg 3 and improve the pressing stability of the core boards of each layer.
  • prepregs 3 need to be stacked between adjacent core boards, and the prepregs 3 are respectively combined with adjacent core boards under pressure, thereby realizing press-fitting and fixing between adjacent core boards.
  • the manufacturing method further includes: performing surface treatment on the golden finger.
  • the communication signal current is relatively weak, and the contact resistance during wiring is usually a relatively large value, and gold is the metal with the highest conductivity in nature. If other metals are used as fingers, then during this contact process will be There is a relatively large power loss, and even the use of metals with ferromagnetic effects will cause electromagnetic interference, which will deteriorate and distort the original signal.
  • the manufacturing method further includes: attaching reinforcement to a second designated area of the bending area, and the second designated area is the area on the other side of the soft board layer corresponding to the golden finger.
  • the second designated area is on the surface of the bending area 110, after the first covering film is pasted on the surface of the bending area, it can be continued on the first
  • the surface of the covering film is pasted with reinforcement 16 to avoid severe deformation of the bending area 110, thereby increasing the service life of the PCB.
  • after affixing the protective tape on the surface of the bending area further includes: making the outer layer pattern of the motherboard; and performing green oil treatment, surface treatment and shape treatment on the motherboard.
  • the PCB by performing green oil treatment, surface treatment and shape treatment on the mother board, the PCB can be better protected, thereby effectively improving the quality of the PCB and improving user experience.
  • the first cover film is pasted on the surface of the bending area of the flexible board, and the shape corresponding to the bending area is smaller than the first cover film, and then a protective tape is attached on the surface of the bending area to protect the bending area.
  • Folding area, and a second cover film on the first area of the hard board layer and then sequentially laminate and press, so that the soft board layer and the hard board layer are stacked in sequence to obtain a mother board, and then the The first designated area on the outermost side of the bending area of the flex ply of the mother board is opened and the protective tape is removed to obtain a rigid-flex board.
  • the corresponding circuit board can also be manufactured through the manufacturing method described in the previous embodiments.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une carte rigide-flexible, et une carte de circuit imprimé. Dans le présent mode de réalisation, le procédé consiste à : appliquer un premier film de recouvrement sur une surface d'une région de courbure d'une couche de carte flexible ; réaliser un motif de contour, qui est plus petit que le premier film de recouvrement et correspond à la région de courbure ; ensuite, appliquer une bande adhésive de protection sur une surface d'une région de courbure spécifiée pour protéger la région de courbure ; appliquer un second film de recouvrement sur une première région d'une couche de carte rigide ; puis effectuer un empilement et une stratification de carte séquentielle, de telle sorte que la couche de carte flexible et la couche de carte rigide sont empilées en séquence pour obtenir une carte mère ; et découvrir une première région spécifiée d'une feuille de liaison de la couche de carte flexible et de la couche de carte rigide de la carte mère, la première région spécifiée étant située sur un côté extérieur de la région de courbure, puis retirer la bande adhésive de protection pour obtenir une carte rigide-flexible.
PCT/CN2022/100046 2021-12-27 2022-06-21 Procédé de fabrication de carte rigide-flexible et carte de circuit imprimé WO2023123907A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111613639.3A CN114401594A (zh) 2021-12-27 2021-12-27 一种软硬结合板的制作方法及电路板
CN202111613639.3 2021-12-27

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Publication number Priority date Publication date Assignee Title
CN114401594A (zh) * 2021-12-27 2022-04-26 生益电子股份有限公司 一种软硬结合板的制作方法及电路板

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CN109152242A (zh) * 2018-11-23 2019-01-04 鹤山市中富兴业电路有限公司 一种厚铜电源软硬结合板的制作工艺
CN208490038U (zh) * 2018-07-24 2019-02-12 华显光电技术（惠州）有限公司 背光fpc、背光模组及显示装置
CN112672510A (zh) * 2020-12-07 2021-04-16 高德（无锡）电子有限公司 一种超薄印刷线路软硬结合板树脂塞孔的加工方法
US20210251071A1 (en) * 2020-02-11 2021-08-12 Samsung Electronics Co., Ltd. Rigid-flexible printed circuit board and electronic device including same
CN114401594A (zh) * 2021-12-27 2022-04-26 生益电子股份有限公司 一种软硬结合板的制作方法及电路板

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CN205830152U (zh) * 2016-07-11 2016-12-21 上海埃富匹西电子有限公司 一种软硬结合多层线路板
CN108770185A (zh) * 2018-05-31 2018-11-06 高德（无锡）电子有限公司 防止软硬结合板软板弯折断裂的加工工艺
CN208490038U (zh) * 2018-07-24 2019-02-12 华显光电技术（惠州）有限公司 背光fpc、背光模组及显示装置
CN109152242A (zh) * 2018-11-23 2019-01-04 鹤山市中富兴业电路有限公司 一种厚铜电源软硬结合板的制作工艺
US20210251071A1 (en) * 2020-02-11 2021-08-12 Samsung Electronics Co., Ltd. Rigid-flexible printed circuit board and electronic device including same
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CN114401594A (zh) * 2021-12-27 2022-04-26 生益电子股份有限公司 一种软硬结合板的制作方法及电路板

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