WO2023093541A1 - 一种舟结构 - Google Patents
一种舟结构 Download PDFInfo
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- WO2023093541A1 WO2023093541A1 PCT/CN2022/131269 CN2022131269W WO2023093541A1 WO 2023093541 A1 WO2023093541 A1 WO 2023093541A1 CN 2022131269 W CN2022131269 W CN 2022131269W WO 2023093541 A1 WO2023093541 A1 WO 2023093541A1
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- plate
- bottom plate
- carrying
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- 235000012431 wafers Nutrition 0.000 claims abstract description 36
- 239000010453 quartz Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 210000000567 greater sac Anatomy 0.000 claims description 8
- 230000000087 stabilizing effect Effects 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Definitions
- the present application belongs to the field of photovoltaic or semiconductor industry, for example, relates to a boat structure.
- Semiconductor or photovoltaic materials are widely used in electronics, new energy and other industries. Semiconductor and photovoltaic materials usually require chemical treatment before they can be applied to products.
- the processing of semiconductor or photovoltaic materials usually involves feeding sheet materials into a furnace for a certain period of time. It is realized by reacting under the conditions of temperature and pressure.
- some devices are usually used to load or move the materials to be processed, processed or processed. In the industry, this loading is usually referred to as Or the mobile device is called a boat, a graphite boat, a small boat or a flower basket.
- the equipment in the related art can only store single-row wafers usually, and when storing rectangular wafers, there is a waste of space and the problem of not compact structure.
- the present application provides a boat structure, which can improve the space utilization rate of the boat structure.
- the present application provides a boat structure, including a cover plate, a bottom plate, a support device and at least one set of carrying devices, the cover plate and the bottom plate are connected through the support device, and the carrying device is installed on the cover plate and the A placement cavity is formed between the bottom plates, the cover plate, the bottom plate, the support device and the carrying device, and the placement cavity is used for placing wafers.
- FIG. 1 is a schematic diagram of the device provided in Embodiment 1 of the present application.
- FIG. 2 is a schematic diagram of the device provided in Embodiment 2 of the present application.
- All directional indications (such as up, down, left, right, front, back, horizontal, vertical, etc.) in the embodiments of the present application are only used to explain the relative positional relationship and movement of the various components in a certain posture etc., if the specific posture changes, the directional indication also changes accordingly.
- this embodiment provides a boat structure, including a cover plate 1, a bottom plate 2, a support device and at least one set of carrying devices, the cover plate 1 and the bottom plate 2 are connected by a support device, and the carrying device is installed on the cover plate 1 Between the base plate 2 and the cover plate 1 , the base plate 2 , the supporting device and the carrying device are at least two sets of placement cavities 8 for placing the wafer 7 .
- the front and rear directions of the cover plate 1 and the base plate 2 are parallel to the placement direction of the wafer 7, that is, parallel to the diffusion air flow direction
- the left and right directions of the cover plate 1 and the bottom plate 2 are perpendicular to the placement direction of the wafer 7, that is, to the diffusion air flow direction.
- the direction is vertical, wherein, the direction of the diffusion airflow is the front-to-back direction, and the diffused airflow is the airflow formed by the carrier gas and the reaction gas.
- the cover plate 1 and the bottom plate 2 adopt a flat plate structure, the cover plate 1 is located above the bottom plate 2, and the bottom plate 2 supports the quartz boat structure.
- the cover plate 1 and the bottom plate 2 can be arranged in parallel to achieve the maximum possible supply.
- the space for placing the wafer 7 because when the cover plate 1 and the base plate 2 are not arranged in parallel, part of the space cannot be used to place the wafer 7 horizontally, thus wasting unnecessary space.
- the support device includes at least two sets of support structures, the two sets of support structures are located in the left and right directions of the cover plate 1 and the bottom plate 2, the two sets of support structures connect and support the cover plate 1 and the bottom plate 2, and the support structures are arranged to be placed along the wafer 7 In the vertical direction, a total cavity is formed between the support structure, the cover plate 1 and the bottom plate 2, and the front and rear directions of the cover plate 1 and the bottom plate 2 are the placement and removal directions of the wafer 7; the support structure includes at least one set of slot plates 3, and the slot plates 3 are located Between the cover plate 1 and the bottom plate 2, the upper end of the slot plate 3 is connected to the cover plate 1, and the lower end of the slot plate 3 is connected to the bottom plate 2.
- the slot plate 3 is provided with a notch 31, and the notch 31 is located on the opposite side of each supporting structure. On the surface, the opening direction of the notch 31 faces the placement cavity 8 .
- the support device includes two sets of support structures, each set of support structures includes two sets of slot plates 3, and four sets of slot plates 3 are distributed on the four corners of the cover plate 1 and the bottom plate 2, ensuring that the cover plate 1 and the bottom plate 2 The stability of the connection.
- the quartz boat structure also includes a stabilizing bar 4, and the stabilizing bar 4 is arranged to connect multiple sets of groove plates 3 in each group of supporting structures, thereby stabilizing the quartz boat structure and improving the strength , the stabilizer bar 4 is fixedly provided with a handle 5, the center of gravity of the handle 5 and the quartz boat structure is on the same horizontal plane, preventing the quartz boat structure from shifting during transportation, causing the collision and falling off of the wafer 7, and ensuring the stability of the quartz boat structure.
- the carrying device includes at least one set of carrying plates 6, the carrying plates 6 are located in the total cavity, the carrying plates 6 are connected with at least one of the cover plate 1 and the bottom plate 2, the carrying plates 6 are the same length as the slot plate 3, and the total cavity is placed in the At least one of the left, right and front and back in the horizontal direction is divided into multiple sets of placement cavities 8.
- the widths of multiple sets of placement cavities 8 can be the same or different, and wafers 7 of different sizes can be placed as required to meet the needs of wafers 7 of different sizes.
- the loading plate 6 is provided with a loading opening 61, the loading opening 61 is opposite to the placement cavity 8, the opening direction of the loading opening 61 faces the placement cavity 8, and the number of loading openings 61 and notches 31 in a group of placement cavities 8 The same, and the corresponding bearing opening 61 and notch 31 are on the same horizontal plane or approximately horizontal plane.
- the loading plate 6 is provided with multiple sets of loading openings 61, and each set of loading openings 61 includes a plurality of loading openings 61, and the number of two sets of loading openings 61 in one set of placement cavities 8 is the same, and the two sets of loading openings 61
- the corresponding bearing openings 61 are on the same horizontal plane, that is, for two groups of bearing openings 61 opposite to the same placement cavity 8, the number of bearing openings 61 in one group of bearing openings 61 is the same as that in the other group of bearing openings 61, and one group of bearing openings 61
- Each load port 61 of the ports 61 is at the same level or approximately a horizontal plane with the corresponding load port 61 of another group of load ports 61 .
- a set of carrying devices divides the total cavity into two groups of placement cavities 8 in the left and right directions, the number of carrying openings 61 and notches 31 is the same, and the corresponding carrying openings 61 and notches 31 are on the same horizontal plane, or, two groups
- the carrying device divides the total cavity into three groups of placement cavities 8 in the left and right directions.
- the number of carrying openings 61 and notches 31 in the placing cavities 8 on both sides is the same, and the corresponding carrying openings 61 and notches 31 are on the same horizontal plane, located in the middle In the placement chamber 8, the two groups of carrying ports 61 have the same number, and the corresponding two groups of carrying ports 61 are on the same horizontal plane; the wafer 7 can be placed in the carrying ports 61 and the notch 31, and the wafer 7 can also be placed in the two groups of carrying ports 61, the chips 7 are placed in parallel, and the parallel placed chips 7 are parallel to the heat radiation direction, which can effectively obtain a uniform temperature field and effectively avoid the phenomenon of wrapping.
- the overall cavity is divided into multiple groups of placement cavities 8 in the horizontal direction by the carrying device, forming the boat structure shown in Figure 1, which can carry more wafers 7, and the space utilization rate of the boat structure is higher.
- a group of carrying devices constitutes a double-row boat structure, two groups of carrying devices constitute a three-row boat structure; multiple groups of carrying devices constitute a multi-row boat structure.
- the supporting device and the bearing device can also adopt the rod-shaped structure shown in the figure.
- the difference between the present embodiment and the first embodiment is that the carrying plate 6 in the first embodiment divides at least one of the left, right and front and rear of the total cavity into multiple sets of placement cavities 8, while this embodiment In the embodiment, the carrying plate 6 divides the general cavity into multiple groups of placement cavities 8 in at least one of the left, right, front and rear in the horizontal direction and the vertical direction.
- the boat structure also includes at least one group of partitions 9, which are located between the cover plate 1 and the bottom plate 2, and divide the total cavity into a plurality of sub-cavities in the vertical direction, and the carrying device is installed on at least In one group of cavities, the sub-cavities are divided into multiple groups of placement cavities 8 in the horizontal direction, and the sub-cavities without carrying devices are used to carry wafers 7 to meet the requirements of carrying wafers 7 of different sizes.
- the boat structure can include a group of partitions 9, the partition 9 divides the total cavity into two component cavities in the vertical direction, and the carrying device is installed on the sub-cavity located above , divide the sub-cavity into two groups of placement cavities 8 in the horizontal direction.
- the support device may also include three sets of support structures, wherein two sets of support structures are located in the left and right directions of the cover plate 1 and the bottom plate 2 to connect and support the cover plate 1 and the bottom plate 2, and the other set of support structures are located on the cover plate 1 and the front or rear direction of the bottom plate 2 connect and support the cover plate 1 and the bottom plate 2, that is, support the wafer 7 in three directions.
- the left-right direction of the cover plate 1 and the bottom plate 2 is perpendicular to the placement direction of the wafer 7
- the front-back direction of the cover plate 1 and the bottom plate 2 is the placement and removal direction of the wafer 7 .
- the carrying plate 6 can be detachably connected to at least one of the cover plate 1 and the bottom plate 2. After the carrying plate 6 is disassembled, the wafer 7 can be placed directly in the general cavity. After the carrying plate 6 is installed, it can be placed in the general cavity. The body moves backward, that is, the carrying plate 6 is movably connected in the general cavity, and then controls the width of the placement cavity 8 so as to meet the requirements of wafers 7 of different sizes.
- the general cavity is divided into multiple groups of placement cavities by the carrying device to form a multi-row boat structure, which can carry more wafers, and the space utilization rate of the boat structure is higher.
- the cover plate and the bottom plate of the application can be arranged in parallel. Realize as much as possible to provide a space for placing wafers, which improves the space utilization rate; the application divides the total cavity into multiple sets of placement cavities in at least one of the left, right and front and rear directions through the carrying device, and the width of multiple sets of placement cavities It can be different to place wafers of different sizes to meet the needs of different wafers.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
本申请公开了一种舟结构,包括盖板、底板、支撑装置以及至少一组承载装置，盖板和底板通过支撑装置连接，承载装置安装在盖板和底板之间，盖板、底板、支撑装置以及承载装置形成放置腔，放置腔用于放置晶片。
Description
本申请要求在2021年11月25日提交中国专利局、申请号为202122907620.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
本申请属于光伏或半导体行业领域领域，例如涉及一种舟结构。
半导体或光伏材料广泛应用于电子、新能源等行业，半导体和光伏材料通常都需要经过化学处理才能够应用到产品上，半导体或光伏材料的加工，通常是将片状材料送入炉中在一定温度和压力的条件下进行反应来实现，在对半导体或者光伏材料加工的过程中，通常采用一些装置来装载或移动待加工的、加工中的或者加工后的材料，行业内通常把这种装载或者移动的装置称为舟、石墨舟、小舟或者花篮，相关技术中的设备通常只能存放单列晶片，并且在存放矩形晶片时，存在浪费空间，结构不紧凑的问题。
发明内容
本申请提供一种舟结构，能够提高舟结构的空间利用率。
本申请提供一种舟结构,包括盖板、底板、支撑装置以及至少一组承载装置，所述盖板和所述底板通过所述支撑装置连接，所述承载装置安装在所述盖板和所述底板之间，所述盖板、所述底板、所述支撑装置以及所述承载装置之间形成有放置腔，所述放置腔用于放置晶片。
图1为本申请实施例一提供的装置示意图。
图2为本申请实施例二提供的装置示意图。
图中标识：1、盖板；2、底板；3、槽板；31、槽口；4、稳定杆；5、把手；6、承载板；61、承载口；7、晶片；8、放置腔；9、隔板。
以下通过具体实例说明本申请的实施方式，本领域技术人员可由本说明书 所揭露的内容轻易地了解本申请的其他优点与功效。本申请还可以通过另外不同的具体实施方式加以实施或应用，本说明书中的细节也可以基于不同观点与应用，在没有背离本申请的精神下进行各种修饰或改变。需说明的是，在不冲突的情况下，以下实施例及实施例中的特征可以相互组合。
需要说明的是，本申请图式中仅显示与本申请中有关的组件而非按照实际实施时的组件数目、形状及尺寸绘制，其实际实施时各组件的型态、数量及比例可为一种随意的改变，且其组件布局型态也可能更为复杂。
本申请实施例中所有方向性指示(诸如上、下、左、右、前、后、横向、纵向……)仅用于解释在某一特定姿态下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
实施例一：
如图1所示，本实施例提供一种舟结构，包括盖板1、底板2、支撑装置以及至少一组承载装置，盖板1和底板2通过支撑装置连接，承载装置安装在盖板1和底板2之间，盖板1、底板2、支撑装置以及承载装置之间形成有至少两组放置腔8，放置腔8用于放置晶片7。
本实施例中，盖板1以及底板2的前后方向与晶片7的放置方向平行，即与扩散气流方向平行，盖板1以及底板2的左右方向与晶片7的放置方向垂直，即与扩散气流方向垂直，其中，扩散气流方向为前后方向，扩散的气流为载气和反应气体形成的气流。
本实施例中，盖板1以及底板2采用平板结构，盖板1位于底板2的上方，底板2对石英舟结构进行支撑，盖板1与底板2可以平行设置，实现尽可能的最大化提供放置晶片7的空间，因为盖板1与底板2非平行设置时，会使得部分空间无法用来水平放置晶片7，从而浪费了不必要的空间。
支撑装置包括至少两组支撑结构，两组支撑结构位于盖板1以及底板2的左右方向，两组支撑结构对盖板1以及底板2进行连接以及支撑，支撑结构被设置为沿晶片7放置的垂直方向，支撑结构、盖板1以及底板2之间形成总腔体，盖板1以及底板2的前后方向是晶片7放置以及取出方向；支撑结构至少包括一组槽板3，槽板3位于盖板1和底板2之间，槽板3的上端与盖板1连接，槽板3的下端与底板2连接，槽板3上设有槽口31，槽口31位于每组支撑结构的相对面上，槽口31开口方向朝向放置腔8。本实施例中，支撑装置包括两组支撑结构，每组支撑结构包括两组槽板3，四组槽板3分布在盖板1和底板2的四个角上，保证盖板1和底板2连接的稳定性。
为保证石英舟结构的稳定性，本实施例中，石英舟结构还包括稳定杆4，稳 定杆4被设置为连接每组支撑结构中的多组槽板3，从而稳固石英舟结构，提高强度，稳定杆4固设有把手5，把手5与石英舟结构的重心处于同一水平面，防止石英舟结构在运输中发生偏移，造成晶片7的碰撞以及脱落，保证了石英舟结构的稳定性。
承载装置包括至少一组承载板6，承载板6位于总腔体内，承载板6与盖板1和底板2中的至少之一连接，承载板6与槽板3长度相同，将总腔体在水平方向的左右和前后中的至少之一分隔成多组放置腔8，多组放置腔8的宽度可相同也可不同，可根据需要放置不同尺寸的晶片7，满足不同尺寸晶片7的需求。
在一实施例中，承载板6设有承载口61，承载口61与放置腔8相对，承载口61的开口方向朝向放置腔8，一组放置腔8内的承载口61和槽口31数量相同，且对应的承载口61和槽口31处于同一水平面或近似水平面。在另一实施例中，承载板6设有多组承载口61，每组承载口61包括多个承载口61，一组放置腔8内两组承载口61数量相同，且两组承载口61中对应的承载口61处于同一水平面，即，对于与同一放置腔8相对的两组承载口61，一组承载口61与另一组承载口61中承载口61的数量相同，且一组承载口61中的每个承载口61与另一组承载口61中对应的承载口61处于同一水平面或近似水平面。示例性地，一组承载装置将总腔体在左右方向分隔成两组放置腔8，承载口61和槽口31数量相同，对应的承载口61和槽口31处于同一水平面，或，两组承载装置将总腔体在左右方向分隔成三组放置腔8，位于两侧的放置腔8中承载口61和槽口31数量相同，对应的承载口61和槽口31处于同一水平面，位于中部的放置腔8中，两组承载口61数量相同，且对应的两组承载口61处于同一水平面；晶片7可以放置在承载口61和槽口31内，晶片7也可以放置在两组承载口61内，使晶片7平行放置，平行放置的晶片7与热量辐射方向平行，能有效获得均匀一致的温度场，有效避免出现绕镀现象。
本实施例中，通过承载装置将总腔体在水平方向分隔成多组放置腔8，形成图1所示的舟结构，可承载更多晶片7，舟结构的空间利用率更高，具体来说，一组承载装置构成双列式舟结构，两组承载装置构成三列式舟结构；多组承载装置构成多列式舟结构。
为降低石英舟结构自身重量，支撑装置和承载装置也可采用图中所示的棒状结构。
实施例二：
如图2所示，本实施例与实施例一的区别在于，实施例一中承载板6将总腔体在水平方向的左右和前后中的至少之一分隔成多组放置腔8，而本实施例中，承载板6将总腔体在水平方向的左右和前后中的至少之一以及竖直方向分 隔成多组放置腔8。
本实施例中，舟结构还包括至少一组隔板9，隔板9位于盖板1和底板2之间，将总腔体在竖直方向分隔成多个分腔体，承载装置安装在至少一组分腔体内，将分腔体在水平方向分隔成多组放置腔8，未安装承载装置的分腔体用于承载晶片7，满足承载不同尺寸晶片7的需求。
如图2所示，本实施例中，舟结构可以包括一组隔板9，隔板9将总腔体在竖直方向分隔成两组分腔体，承载装置安装在位于上方的分腔体，将分腔体在水平方向分隔成两组放置腔8。
其他实施例中，支撑装置也可包括三组支撑结构，其中两组支撑结构位于盖板1以及底板2的左右方向对盖板1以及底板2进行连接以及支撑，另一组支撑结构位于盖板1以及底板2的前或后方向对盖板1以及底板2进行连接以及支撑，即对晶片7的三个方向进行支撑。盖板1以及底板2的左右方向与晶片7的放置方向垂直，盖板1以及底板2的前后方向是晶片7放置以及取出方向。
其他实施例中，承载板6可与盖板1和底板2中的至少之一可拆卸连接，拆卸承载板6后，晶片7可以直接放置在总腔体内，承载板6安装后可在总腔体后移动，即，承载板6在总腔体内活动连接，进而控制放置腔8的宽度，以便满足不同尺寸的晶片7要求。
本申请通过承载装置将总腔体分隔成多组放置腔，形成多列式的舟结构，可承载更多晶片，舟结构的空间利用率更高，本申请的盖板与底板可以平行设置，实现尽可能的最大化提供放置晶片的空间，提高了空间利用率；本申请通过承载装置将总腔体在左右和前后中至少之一的方向分隔成多组放置腔，多组放置腔的宽度可不同，以放置不同尺寸的晶片，满足不同晶片的需求。
Claims (11)
- 一种舟结构,包括盖板、底板、支撑装置以及至少一组承载装置，所述盖板和所述底板通过所述支撑装置连接，所述承载装置安装在所述盖板和所述底板之间，所述盖板、所述底板、所述支撑装置以及所述承载装置之间形成有放置腔，所述放置腔被用于放置晶片。
- 根据权利要求1所述的舟结构，其中，所述支撑装置包括至少两组支撑结构，所述至少两组支撑结构被设置在所述盖板以及所述底板的两侧，对所述盖板以及所述底板进行连接以及支撑，所述至少两组支撑结构被设置为沿晶片放置的垂直方向，所述支撑结构、所述盖板以及所述底板构成总腔体。
- 根据权利要求2所述的舟结构，其中，所述支撑结构至少包括一组槽板，所述槽板位于所述盖板和所述底板之间，所述槽板的上端与所述盖板连接，所述槽板的下端与所述底板连接，所述槽板上设有槽口，所述槽口位于每组支撑结构的相对面上，所述槽口的开口方向朝向所述放置腔。
- 根据权利要求1所述的舟结构，其中，所述支撑装置包括两组支撑结构，每组支撑结构包括两组槽板，四组槽板分布在所述盖板和所述底板的四个角。
- 根据权利要求3所述的舟结构，还包括稳定杆，所述稳定杆被设置为连接每组支撑结构的多组槽板，所述稳定杆上固设有把手，所述把手与石英舟结构的重心处于同一水平面。
- 根据权利要求3所述的舟结构，其中，所述承载装置包括承载板，所述承载板位于所述总腔体内，所述承载板与盖板和底板中的至少之一连接，将所述总腔体在水平方向的左右和前后中的至少之一分隔成多组放置腔。
- 根据权利要求6所述的舟结构，其中，所述承载板设有承载口，所述承载口与所述放置腔相对，所述承载口的开口方向朝向所述放置腔，一组所述放置腔内的承载口和槽口数量相同，且对应的承载口和槽口处于同一水平面，晶片放置在承载口和槽口内，使晶片平行放置。
- 根据权利要求6所述的舟结构，其中，所述承载板设有多组承载口，每组承载口包括多个承载口，对于与同一放置腔相对的两组所述承载口，一组所述承载口与另一组所述承载口中所述承载口的数量相同，且一组所述承载口中的每个承载口与另一组所述承载口中对应的所述承载口处于同一水平面，晶片放置在两组承载口内，使晶片平行放置。
- 根据权利要求1所述的舟结构，还包括至少一组隔板，所述隔板位于所述盖板和所述底板之间，将总腔体在竖直方向分隔成多组分腔体，所述承载装置被设置在至少一组分腔体内，将分腔体在水平方向分隔成多组放置腔，未安装承载装置的分腔体被设置为承载晶片。
- 根据权利要求1所述的舟结构，其中，所述支撑装置包括三组支撑结构，被设置为对所述盖板以及所述底板进行连接以及支撑，其中两组支撑结构被设置为沿晶片放置的垂直方向，另一组支撑结构被设置为沿晶片放置的平行方向。
- 根据权利要求2所述的舟结构，其中，所述盖板以及所述底板采用平板结构，所述盖板位于所述底板的上方，所述底板对石英舟结构进行支撑，所述盖板与所述底板平行设置，所述承载板与所述盖板和所述底板中的至少之一可拆卸连接，所述承载板在所述总腔体内活动连接，能够控制放置腔的宽度。
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| CN101303993A (zh) * | 2007-05-10 | 2008-11-12 | 南亚科技股份有限公司 | 晶片承载装置 |
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