WO2023090312A1 - 積層シートの製造方法、積層電子部品の製造方法、及び積層シート - Google Patents
積層シートの製造方法、積層電子部品の製造方法、及び積層シート Download PDFInfo
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- WO2023090312A1 WO2023090312A1 PCT/JP2022/042357 JP2022042357W WO2023090312A1 WO 2023090312 A1 WO2023090312 A1 WO 2023090312A1 JP 2022042357 W JP2022042357 W JP 2022042357W WO 2023090312 A1 WO2023090312 A1 WO 2023090312A1
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- laminated
- ceramic green
- insulating paste
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- internal electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Definitions
- the present invention relates to a laminated sheet manufacturing method, a laminated electronic component manufacturing method, and a laminated sheet.
- a multilayer electronic component such as a multilayer ceramic capacitor has a structure in which external electrodes are arranged at both ends of a laminate in which ceramic green sheets with internal electrodes printed are laminated.
- the ceramic green sheet on which the internal electrodes are printed has a step between a portion where the internal electrodes are printed and a portion where the internal electrodes are not printed.
- An object of the present invention is to provide a method for manufacturing a laminated sheet, a method for manufacturing a laminated electronic component, and a laminated sheet that can more easily reduce non-uniformity in thickness.
- the present invention provides a ceramic green sheet manufacturing process for manufacturing a ceramic green sheet by forming a slurry containing a ceramic powder into a sheet, and internal electrode printing for printing internal electrodes on the ceramic green sheet. and a storage elastic modulus E' of 1.0 MPa or more and 100 MPa or less at 80 ° C. and a frequency of 1 Hz in the same surface of the ceramic green sheet as the surface on which the internal electrodes are printed, where the internal electrodes are not formed.
- an insulating paste placement step of placing a certain insulating paste; a stacking step of stacking the ceramic green sheets on which the internal electrodes are printed and the insulating paste is placed; and pressing the stacked ceramic green sheets. and a pressing step for producing the laminated sheet.
- the present invention provides a cutting step of cutting the laminated sheet manufactured by the method of manufacturing a laminated sheet to prepare a laminated chip, and a baking step of baking the laminated chip. and an external electrode forming step of forming external electrodes on both end surfaces of the fired laminate chip.
- the present invention is a ceramic green in which an insulating paste having a storage elastic modulus E' of 1.0 MPa or more and 100 MPa or less at 80 ° C. and a frequency of 1 Hz is arranged in an internal electrode and a region where the internal electrode is not printed.
- an insulating paste having a storage elastic modulus E' of 1.0 MPa or more and 100 MPa or less at 80 ° C. and a frequency of 1 Hz is arranged in an internal electrode and a region where the internal electrode is not printed.
- the present invention it is possible to provide a method for manufacturing a laminated sheet, a method for manufacturing a laminated electronic component, and a laminated sheet that can easily reduce non-uniformity in thickness.
- FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor 1;
- FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 shown in FIG. 1 taken along line II-II.
- FIG. 2 is a cross-sectional view along line III-III of the multilayer ceramic capacitor 1 shown in FIG. 1;
- FIG. 3 is a flow chart illustrating a method for manufacturing a laminated ceramic capacitor 1 including a method for manufacturing a laminated sheet 20.
- FIG. FIG. 3 is a perspective view illustrating the state of arrangement of insulating paste 14b on a base sheet 23, where (a) is Example 1, (b) is Example 2, (c) is Example 3, and (d) is Example 4. , (e) is Example 5.
- FIG. 1 is a schematic perspective view of a multilayer ceramic capacitor 1
- FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 shown in FIG. 1 taken along line II-II.
- FIG. 2 is a cross-sectional view along line III-III
- FIG. 4 is a cross-sectional view for explaining an arrangement state of an insulating paste 14b on a base sheet 23, (a) being Example 1, (b) being Example 2, and (c) being Example 3; It is the figure which showed the state after press process S5 of the lamination sheet 20.
- FIG. 4 is a cross-sectional view for explaining an arrangement state of an insulating paste 14b on a base sheet 23, (a) being Example 1, (b) being Example 2, and (c) being Example 3; It is the figure which showed the state after press process S5 of the lamination sheet 20.
- FIG. 1 is a schematic perspective view of a laminated ceramic capacitor 1 using a laminated sheet 20.
- FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 1 shown in FIG. 1 along line II-II.
- FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 1 shown in FIG. 1 taken along line III-III.
- a multilayer ceramic capacitor 1 has a substantially rectangular parallelepiped shape and includes a laminate 2 and a pair of external electrodes 3 provided at both ends of the laminate 2 .
- the laminate 2 includes an inner layer section 10 in which a plurality of dielectric layers 11 and a plurality of internal electrodes 12 are laminated.
- the direction in which the pair of external electrodes 3 are provided in the multilayer ceramic capacitor 1 is defined as the length direction L as a term that indicates the orientation of the multilayer ceramic capacitor 1 .
- a stacking direction T is a direction in which the dielectric layers 11 and the internal electrodes 12 are stacked.
- a direction crossing both the length direction L and the stacking direction T is defined as a width direction W.
- the width direction W is orthogonal to both the length direction L and the stacking direction T.
- a pair of outer peripheral surfaces facing the stacking direction T is referred to as a main surface A
- a pair of outer peripheral surfaces facing the width direction W is referred to as a side surface B
- a long A pair of outer surfaces facing each other in the longitudinal direction L are referred to as a first end surface Ca and a second end surface Cb, and when the first end surface Ca and the second end surface Cb do not need to be specifically distinguished and described, they will be collectively described as an end surface C. .
- the laminate 2 includes an inner layer portion 10 and an outer layer portion 7 arranged on both main surface A sides of the inner layer portion 10 .
- the inner layer portion 10 includes a plurality of dielectric layers 11, internal electrodes 12 arranged between the plurality of dielectric layers 11, and portions between the plurality of dielectric layers 11 where the internal electrodes 12 are not arranged. and an insulator 14a.
- the dielectric layer 11 is formed by, for example, adding a binder, a plasticizer, a dispersant, etc. to a mixture obtained by adding and mixing a ceramic powder such as BaTiO 3 , a glass component, and a sintering aid as necessary.
- a ceramic green sheet 21 obtained by molding a slurry containing an agent and an organic solvent into a sheet is sintered.
- the storage elastic modulus E′ at 80° C. and 1 Hz of the ceramic green sheet 21 before sintering is generally in the range of 0.5 GPa or more and 1.0 GPa or less. Note that the storage elastic modulus E' is the component of the energy generated by the external force and strain in the object that is stored inside the object.
- the internal electrode 12 is formed by sintering an internal electrode paste containing, for example, Ni metal powder, a binder, additives such as a plasticizer and a dispersant, and an organic solvent.
- the internal electrodes 12 include a plurality of first internal electrodes 12A and a plurality of second internal electrodes 12B. The first internal electrodes 12A and the second internal electrodes 12B are alternately arranged.
- the first internal electrode 12A includes, in the length direction L, a first counter electrode 12Aa facing the second internal electrode 12B, and a first counter electrode 12Aa drawn out from the first counter electrode 12Aa toward the first end surface Ca. and an extraction electrode 12Ab. An end portion of the first extraction electrode 12Ab is exposed on the first end surface Ca and electrically connected to a first external electrode 3A, which will be described later.
- the second internal electrode 12B includes, in the length direction L, a second counter electrode 12Ba facing the first internal electrode 12A, and a second counter electrode 12Ba extending from the second counter electrode 12Ba toward the second end surface Cb. and an extraction electrode 12Bb. An end portion of the second extraction electrode 12Bb is exposed on the second end face Cb and electrically connected to a second external electrode 3B, which will be described later.
- first internal electrode 12A and the second internal electrode 12B will be collectively described as the internal electrode 12 unless it is necessary to distinguish them.
- first counter electrode 12Aa and the second counter electrode 12Ba need not be distinguished and explained, they will be collectively explained as the counter electrode 12a.
- extraction electrode 12b When it is not necessary to distinguish between the first extraction electrode 12Ab and the second extraction electrode 12Bb, they will be collectively described as the extraction electrode 12b.
- the insulator 14a is composed of, for example, ceramic powder made of BaTiO 3 , a sintering aid if necessary, a binder, additives such as a plasticizer and a dispersant, and an organic solvent.
- An insulating paste containing is sintered.
- the storage elastic modulus E′ at 80° C. and 1 Hz of the dry coating film 14b of the insulating paste before sintering is 1.0 MPa or more and 100 MPa or less. As shown in FIG.
- the end portion of the first counter electrode 12Aa on the side of the second end face Cb where the first lead-out electrode 12Ab is not drawn is spaced apart from the second end face Cb and is separated from the first counter electrode 12Aa.
- An insulator 14a is filled between the second end face Cb.
- the end portion of the second counter electrode 12Ba on the side of the first end surface Ca where the second extraction electrode 12Bb is not drawn is separated from the side of the first end surface Ca, and the second counter electrode 12Ba and the first end surface Ca Insulator 14a is filled between and.
- both sides of the first internal electrode 12A in the width direction W are separated from the side surface B, and the space between the first internal electrode 12A and the side surface B is filled with an insulator 14a.
- Both sides of the second internal electrode 12B in the width direction W are separated from the side surface B, and the space between the second internal electrode 12B and the side surface B is filled with an insulator 14a.
- FIG. 4 is a flow chart illustrating a method for manufacturing the laminated ceramic capacitor 1, including a method for manufacturing the laminated sheet 20. As shown in FIG.
- a slurry is obtained by adding additives such as a binder, a plasticizer and a dispersant, and an organic solvent to a mixture obtained by adding and mixing ceramic powder, a glass component, and optionally a sintering aid. is prepared.
- the slurry is placed on a carrier film, squeezed into a sheet by a doctor blade, and dried to produce a ceramic green sheet 21 .
- the storage elastic modulus E′ of the ceramic green sheet 21 at 80° C. and 1 Hz is generally in the range of 0.5 GPa or more and 1.0 GPa or less.
- Internal electrode printing step S2 an internal electrode paste containing a metal powder, a binder, additives such as a plasticizer and a dispersant, an organic solvent, etc. is applied to the ceramic green sheets 21 so as to have a band-like pattern by screen printing, inkjet printing, It is printed in a desired shape and thickness by gravure printing or the like and dried to form the patterned internal electrodes 12 .
- a base sheet 23 is produced by disposing an insulating paste 14b on a region where the internal electrodes 12 are not printed on the ceramic green sheet 21 on which the internal electrodes 12 are formed.
- the insulating paste 14b contains, for example, ceramic powder made of BaTiO 3 , optionally a sintering aid, a binder, additives such as a plasticizer and a dispersant, and an organic solvent.
- the storage elastic modulus E' at a frequency of 1 Hz is different.
- the storage elastic modulus E′ of the ceramic green sheet 21 at 80° C.
- the storage elastic modulus E' at 80°C and a frequency of 1 Hz is 1.0 MPa or more and 100 MPa or less.
- the storage elastic modulus E' of the insulating paste 14b can be adjusted to 1.0 MPa or more and 100 MPa or less by adjusting a flexible binder such as PVB and a plasticizer.
- the insulating paste 14b may be placed on the ceramic green sheet 21 by printing, or the insulating paste 14b in a semi-solid state may be placed on the ceramic green sheet 21.
- FIG. 5 is a perspective view for explaining the state of arrangement of the insulating paste 14b on the base sheet 23.
- (a) is Example 1
- (b) is Example 2
- (c) is Example 3
- (d). is Example 4
- (e) is Example 5.
- 6A and 6B are cross-sectional views for explaining the arrangement state of the insulating paste 14b on the base sheet 23, where (a) is Example 1, (b) is Example 2, and (c) is Example 3.
- FIG. 1 is Example 1
- (b) is Example 2
- Example 3 Example 3
- FIG. 5(a) shows Example 1 in which the insulating paste 14b is arranged on the ceramic green sheet 21 on the entire circumference of the internal electrode 12 with no space between it and the internal electrode 12.
- FIG. 6 is a cross-sectional view taken along line XX of FIG. 5(a); FIG.
- Example 1 the insulating paste 14b fills the gaps extending in the length direction L and the width direction W between the internal electrodes 12 as shown in FIG. , so that the height in the stacking direction T is substantially the same as that of the internal electrodes 12 . That is, the volume of the gaps between the internal electrodes 12 in the base sheet 23 and the volume of the insulating paste 14b are substantially equal.
- the dimensions in the length direction L and width direction W of the insulating paste 14 b do not have to strictly match the dimensions in the length direction L and width direction W of the gap between the internal electrodes 12 .
- the dimension of the insulating paste 14b in the stacking direction T may not strictly match the dimension of the internal electrode 12 in the stacking direction T.
- FIG. 5(b) shows Example 2 in which the insulating paste 14b is arranged all around the internal electrode 12 on the ceramic green sheet 21, but there is a gap between the internal electrode 12 and FIG. (b) is a cross-sectional view along line YY in FIG. 5(b).
- Example 2 the insulating paste 14b is spaced apart from the internal electrodes 12 in the gaps extending in the length direction L and the width direction W between the internal electrodes 12, as shown in FIG. As shown in a), they are arranged so that the height in the stacking direction T is higher than that of the internal electrodes 12 .
- the dimensions of the insulating paste 14b in the length direction L, width direction W, and stacking direction T are such that the total volume of the gaps between the internal electrodes 12 in the base sheet 23 is substantially equal to the total volume of the insulating paste 14b. Although it is preferable that the values are set so that the
- FIG. 5(c) shows Example 3 in which the insulating paste 14b is arranged all around the internal electrode 12 on the ceramic green sheet 21, overlaps with the internal electrode 12, and covers the upper surface of the outer peripheral portion of the internal electrode 12.
- FIG. 6(c) is a sectional view taken along line ZZ in FIG. 5(c).
- the total volume of the insulating paste 14b disposed between the internal electrodes 12 and the insulating paste 14b covering the upper surfaces of the outer peripheral portions of the internal electrodes 12 is the total volume of the base sheet 23.
- the volume is preferable to set the volume to be approximately equal to the volume of the gap between the internal electrodes 12 in , it does not have to be exactly the same.
- Example 4 In FIG. 5(d), the insulating paste 14b is arranged partly around the internal electrodes 12, there is a gap between the internal electrodes 12, and there is a gap between the internal electrodes 12 adjacent to each other in the width direction W. , are arranged along the length direction L of the internal electrode 12 in the fourth embodiment. Also in Example 4, the dimensions of the insulating paste 14b in the length direction L, the width direction W, and the lamination direction T are such that the volume of the entire insulating paste 14b is equal to the volume of the entire gap between the internal electrodes 12 in the base sheet 23. is preferably set to be approximately equal to , but does not have to be exactly the same.
- Example 5 (Example 5) 5(e), the insulating paste 14b is arranged partly around the internal electrodes 12, there is a gap between the internal electrodes 12, and unlike FIG. 5(d), the width between the internal electrodes 12 is
- the gaps in the direction W or the length direction L are randomly arranged.
- the dimensions of the insulating paste 14b in the length direction L, width direction W, and stacking direction T are such that the volume of the entire insulating paste 14b is equal to the volume of the entire gap between the internal electrodes 12 in the base sheet 23. is preferably set to be approximately equal to , but does not have to be exactly the same.
- the insulating paste 14b arranged in the regions where the internal electrodes 12 are not printed on the ceramic green sheets 21 on which the internal electrodes 12 are formed is dried at a temperature of 30° C. or more and 70° C. or less. is preferred.
- the insulating paste 14b maintains a certain shape on the ceramic green sheet 21 without flowing down, although it has certain fluidity.
- the insulating paste 14b is dried at temperatures between 40.degree. C. and 60.degree.
- (Lamination step S4) Next, using a laminating machine, a plurality of layers of the base sheet 23 are laminated to form a portion to be the inner layer portion 10, and ceramic green sheets for the outer layer portion are placed above and below the portion to be the inner layer portion 10 in the lamination direction T.
- the lamination sheet 20 is produced by lamination.
- the ceramic green sheets for the outer layer are made of the same material as the ceramic green sheets 21 forming the dielectric layer 11 .
- FIG. 7 is a diagram showing the state of the laminated sheet 20 produced in the laminating step S4 after the pressing step S5 that can be extended next.
- the plurality of base sheets 23 have the internal electrodes 12 facing the same direction of the stacking direction T, and the internal electrodes 12 are shifted by half a pitch in the length direction L between the adjacent base sheets 23. They are arranged so as to overlap in the width direction W. As shown in FIG.
- the portion of the internal electrode 12 that becomes the counter electrode 12a is continuously laminated in the lamination direction T.
- the portion of the internal electrode 12 that becomes the extraction electrode 12b the portion of the base sheet 23 where the internal electrode 12 exists and the portion of the base sheet 23 where the internal electrode 12 does not exist are alternately laminated. Therefore, in the laminated sheet 20, the number of stacked internal electrodes 12 in the stacking direction T in the portion to be the lead electrode 12b is half the number of stacked internal electrodes 12 in the stacking direction T in the portion to be the counter electrode 12a.
- the internal electrodes 12 of the base sheet 23 do not exist on both sides of the portion where the internal electrodes 12 exist.
- the insulating paste 14b is arranged in the regions of the base sheets 23 where the internal electrodes 12 are not present.
- the pressure of the press is from 30 MPa to 150 MPa.
- the actually implemented pressures are 50 MPa and 98 MPa.
- the laminate sheet 20 is placed in a mold, vacuum laminated, and immersed in a hot water bath at 80° C. for 10 minutes. After that, the pressure is increased, held at about 50 MPa for 750 s, and pressurized by a hydrostatic press.
- the insulating paste 14b has a storage elastic modulus E′ of 1.0 MPa or more and 100 MPa or less at 80° C. and a frequency of 1 Hz, and is a considerably flexible member compared to the ceramic green sheet 21 . Therefore, when pressed in the pressing step S5, the insulating paste 14b in the second, third, fourth, and fifth embodiments deforms and flows to fill the gaps between the internal electrodes 12. FIG. At this time, in Examples 4 and 5, etc., there are also gaps between the internal electrodes 12 where the insulating paste 14b is not arranged. However, due to the high fluidity of the insulating paste 14b, the insulating paste 14b also flows into these gaps, and all the gaps between the internal electrodes 12 can be filled.
- E′ storage elastic modulus
- Example 1 the gaps between the internal electrodes 12 are already arranged so as to fill the gaps, but since the insulating paste 14b is pressed, it is necessary to fill the slight gaps that have occurred during the arrangement. can be done. As described above, according to the embodiment, the laminated sheet 20 with few steps can be manufactured.
- the flow of the insulating paste 14b may occur not only in the pressing step S5 but also in the lamination step S4.
- the laminated sheet 20 is divided into cutting lines P extending in the width direction W at regular intervals in the length direction L shown in FIG. 7 and cutting lines extending in the length direction L at regular intervals in the width direction W. cut along. In FIG. 7, only cutting lines P extending in the width direction W at regular intervals in the length direction L are shown. Thereby, a plurality of laminates 2 are manufactured.
- each laminate 2 is degreased with a desired temperature profile (about 240° C.) to remove the binder, and then sintered with a predetermined temperature profile (about 1200° C.). At this time, the insulating paste 14b is sintered to become the insulator 14a.
- Example electrode forming step S8 an external electrode paste containing, for example, Cu as a main component, which is composed of metal powder, binder, additives (plasticizer, dispersant, etc.), organic solvent, etc., is dip-coated on the end face C of the sintered laminate 2. After drying, the external electrode paste is sintered using a belt furnace to form the external electrodes 3 . Further, a first plated film of Ni and a second plated film of Sn are formed on the outside of the external electrodes 3 by using a wet electrolytic barrel method or the like, whereby the multilayer ceramic capacitor 1 is manufactured.
- the laminate sheet 20 in which a plurality of base sheets 23 are laminated has a portion where the total thickness of the internal electrodes 12 and the dielectric layers 11 in the lamination direction T differs due to the number of the internal electrodes 12 being different.
- the insulating paste 14 is arranged in the portion where the internal electrode 12 does not exist or the portion where the number of internal electrodes 12 is small. Therefore, the thickness of the laminated sheet 20 in the lamination direction T can be made uniform.
- the insulating paste 14 Since the insulating paste 14 has a storage elastic modulus E′ of 1.0 MPa or more and 100 MPa or less at 80° C. and a frequency of 1 Hz, it easily flows. Therefore, when the insulating paste 14 is placed on the portion of the ceramic green sheet 21 where the internal electrode 12 does not exist, the length direction L and width direction W of the portion where the internal electrode 12 does not exist and the internal electrode 12 It is not necessary to strictly match the dimension in the stacking direction T. Even if the insulating paste 14 does not strictly match the dimensions of the internal electrodes 12 in the stacking direction T, the insulating paste 14 flows when pressed in the pressing step S5 or the like, and fills the portions where the internal electrodes 12 do not exist. can be done. Therefore, there is no need for highly accurate thickness control and positioning when the insulating paste 14 is arranged on the ceramic green sheet 21, and the laminated sheet 20 having a uniform thickness can be easily manufactured.
- E′ storage elastic modulus
- the thickness in the lamination direction T is uniform, so the possibility of cracks occurring in the sintering process is reduced.
- the insulating paste 14b has a storage elastic modulus E' of 1.0 MPa or more and 100 MPa or less at 80°C and 1 Hz of the embodiment, voids are not generated at the ends in the width direction W after sintering. Furthermore, good performance can be obtained in terms of electrical properties as well.
- the present invention is not limited thereto.
- a ceramic green sheet for the outer layer portion manufactured with the same material as the ceramic green sheet 21 forming the dielectric layer 11 was used, but the present invention is not limited to this.
- Part 7 may be made of the same material as insulating paste 14b.
- the surfaces of both main surfaces A of the laminated sheet 21 can be made smoother. That is, when the laminated sheet 21 is cut to form the laminated body 2, it is possible to prevent the laminated body 2 from becoming drum-shaped due to a decrease in the dimension of the outer peripheral side in the lamination direction T. Since the laminate 2 does not have a drum shape, folds are easily formed when the external electrodes 3 are applied.
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
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| KR1020247011033A KR20240046832A (ko) | 2021-11-19 | 2022-11-15 | 적층 시트의 제조 방법, 적층 전자부품의 제조 방법, 및 적층 시트 |
| JP2023561595A JP7775891B2 (ja) | 2021-11-19 | 2022-11-15 | 積層シートの製造方法、積層電子部品の製造方法、及び積層シート |
| CN202280063370.2A CN117981023A (zh) | 2021-11-19 | 2022-11-15 | 层叠片制造方法、层叠电子部件制造方法及层叠片 |
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| JP2021-188969 | 2021-11-19 | ||
| JP2021188969 | 2021-11-19 |
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| WO2023090312A1 true WO2023090312A1 (ja) | 2023-05-25 |
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| PCT/JP2022/042357 Ceased WO2023090312A1 (ja) | 2021-11-19 | 2022-11-15 | 積層シートの製造方法、積層電子部品の製造方法、及び積層シート |
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| WO (1) | WO2023090312A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004165375A (ja) * | 2002-11-12 | 2004-06-10 | Kyocera Corp | セラミック積層体の製法 |
| JP2008244313A (ja) * | 2007-03-28 | 2008-10-09 | Tdk Corp | 積層電子部品の製造方法 |
| JP2010067719A (ja) * | 2008-09-09 | 2010-03-25 | Tdk Corp | 積層セラミック電子部品の製造方法 |
| WO2010035461A1 (ja) * | 2008-09-29 | 2010-04-01 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
| JP2010087370A (ja) * | 2008-10-01 | 2010-04-15 | Tdk Corp | 積層セラミック電子部品の製造方法 |
| JP2020057772A (ja) * | 2018-09-27 | 2020-04-09 | 積水化学工業株式会社 | 段差吸収ペースト、段差吸収ペースト用樹脂微粒子及び積層セラミックコンデンサの製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5694719A (en) | 1979-12-28 | 1981-07-31 | Murata Manufacturing Co | Method of manufacturing laminated electronic component |
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- 2022-11-15 KR KR1020247011033A patent/KR20240046832A/ko active Pending
- 2022-11-15 CN CN202280063370.2A patent/CN117981023A/zh active Pending
- 2022-11-15 JP JP2023561595A patent/JP7775891B2/ja active Active
- 2022-11-15 WO PCT/JP2022/042357 patent/WO2023090312A1/ja not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004165375A (ja) * | 2002-11-12 | 2004-06-10 | Kyocera Corp | セラミック積層体の製法 |
| JP2008244313A (ja) * | 2007-03-28 | 2008-10-09 | Tdk Corp | 積層電子部品の製造方法 |
| JP2010067719A (ja) * | 2008-09-09 | 2010-03-25 | Tdk Corp | 積層セラミック電子部品の製造方法 |
| WO2010035461A1 (ja) * | 2008-09-29 | 2010-04-01 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
| JP2010087370A (ja) * | 2008-10-01 | 2010-04-15 | Tdk Corp | 積層セラミック電子部品の製造方法 |
| JP2020057772A (ja) * | 2018-09-27 | 2020-04-09 | 積水化学工業株式会社 | 段差吸収ペースト、段差吸収ペースト用樹脂微粒子及び積層セラミックコンデンサの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7775891B2 (ja) | 2025-11-26 |
| JPWO2023090312A1 (https=) | 2023-05-25 |
| KR20240046832A (ko) | 2024-04-09 |
| CN117981023A (zh) | 2024-05-03 |
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