WO2023074804A1 - アルカリ可溶性の紫外線硬化性オルガノポリシロキサン、それを含む紫外線硬化性組成物およびその用途 - Google Patents
アルカリ可溶性の紫外線硬化性オルガノポリシロキサン、それを含む紫外線硬化性組成物およびその用途 Download PDFInfo
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- WO2023074804A1 WO2023074804A1 PCT/JP2022/040185 JP2022040185W WO2023074804A1 WO 2023074804 A1 WO2023074804 A1 WO 2023074804A1 JP 2022040185 W JP2022040185 W JP 2022040185W WO 2023074804 A1 WO2023074804 A1 WO 2023074804A1
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- organopolysiloxane
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- JUYQFRXNMVWASF-UHFFFAOYSA-M lithium;phenyl-(2,4,6-trimethylbenzoyl)phosphinate Chemical compound [Li+].CC1=CC(C)=CC(C)=C1C(=O)P([O-])(=O)C1=CC=CC=C1 JUYQFRXNMVWASF-UHFFFAOYSA-M 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical class [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- YSGBMDFJWFIEDF-UHFFFAOYSA-N methyl 2-hydroxy-3-methylbutanoate Chemical compound COC(=O)C(O)C(C)C YSGBMDFJWFIEDF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- PNXSDOXXIOPXPY-DPTVFECHSA-N n-hydroxy-5-norbornene-2,3-dicarboximide perfluoro-1-butanesulfonate Chemical compound C([C@H]1C=C2)[C@H]2C2C1C(=O)N(OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C2=O PNXSDOXXIOPXPY-DPTVFECHSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
- 125000001484 phenothiazinyl group Chemical class C1(=CC=CC=2SC3=CC=CC=C3NC12)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- ILPVOWZUBFRIAX-UHFFFAOYSA-N propyl 2-oxopropanoate Chemical compound CCCOC(=O)C(C)=O ILPVOWZUBFRIAX-UHFFFAOYSA-N 0.000 description 1
- HUAZGNHGCJGYNP-UHFFFAOYSA-N propyl butyrate Chemical compound CCCOC(=O)CCC HUAZGNHGCJGYNP-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical compound C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical class [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 1
- NRYWFNLVRORSCA-UHFFFAOYSA-N triethoxy(6-triethoxysilylhexyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCC[Si](OCC)(OCC)OCC NRYWFNLVRORSCA-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- ZZJNLOGMYQURDL-UHFFFAOYSA-M trifluoromethanesulfonate;tris(4-methylphenyl)sulfanium Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C)=CC=C1[S+](C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 ZZJNLOGMYQURDL-UHFFFAOYSA-M 0.000 description 1
- HHMQUQRJNPTPAJ-UHFFFAOYSA-M trifluoromethanesulfonate;tris(4-tert-butylphenyl)sulfanium Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[S+](C=1C=CC(=CC=1)C(C)(C)C)C1=CC=C(C(C)(C)C)C=C1 HHMQUQRJNPTPAJ-UHFFFAOYSA-M 0.000 description 1
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- VMJFYMAHEGJHFH-UHFFFAOYSA-M triphenylsulfanium;bromide Chemical compound [Br-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 VMJFYMAHEGJHFH-UHFFFAOYSA-M 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
Definitions
- the present invention relates to an alkali-soluble, ultraviolet-curable organopolysiloxane curable by actinic rays, such as ultraviolet rays or electron beams, and an ultraviolet-curable composition containing the same.
- the curable polysiloxane of the present invention has high solubility in alkaline aqueous solutions and good ultraviolet curing properties, so it exhibits excellent lithography performance and is used as an insulating material for electronic and electrical devices that require patterning, especially coatings. It is suitable as a material for use as an agent.
- silicone resins Due to its high heat resistance and excellent chemical stability, silicone resins have been used as coating agents, potting agents, insulating materials, etc. for electronic and electrical devices. Among silicone resins, UV-curable silicone compositions have also been reported so far.
- Touch panels are used in various display devices such as mobile devices, industrial equipment, and car navigation systems. In order to improve the detection sensitivity, it is necessary to suppress the electrical influence from the light emitting parts such as light emitting diodes (LED) and organic EL devices (OLED). placed. On the other hand, a thin display device such as an OLED has a structure in which many functional thin layers are laminated. In recent years, studies have been made to improve the visibility of a display device by laminating insulating layers formed from an acrylate-based polymer with a high refractive index and a polyfunctional polymerizable monomer above and below a touch screen layer. (For example, Patent Documents 1 and 2)
- Patent Document 3 discloses a lithographically curable composition
- a lithographically curable composition comprising a silsesquioxane having a carboxyl group and a methacryloxy group, a polyfunctional polymerizable monomer, an inorganic filler, a polymerization initiator, and an organic solvent.
- This composition contains a polyfunctional polymerizable monomer at a concentration of 33% or more of the total curable components in order to improve the sensitivity during curing and the adhesion of the cured product.
- Patent Document 4 discloses a silsesquioxane having a group selected from a carboxy group, a carboxylic acid anhydride group, a phenolic hydroxyl group and a polymerizable double bond, a photopolymerization initiator, and a lithography method comprising an organic solvent.
- Possible curable compositions are disclosed. However, in the present composition, there is still room for improvement in terms of mechanical strength (especially brittleness) and transparency of coatings with large thicknesses, and substantially, at a concentration of 64% or more of the total curable component A composition comprising a non-silicon-containing polyfunctional polymerizable monomer.
- an ultraviolet-curable composition containing an organopolysiloxane having an ultraviolet-curable group and a hydrophilic group has been disclosed, the organopolysiloxane itself has high solubility in an alkaline aqueous solution, and a polyfunctional polymerizable monomer is used.
- a polyfunctional polymerizable monomer is used.
- the present invention has been made to solve the above problems, and has one or more monovalent functional groups having both a hydrophilic group and an ultraviolet curable group in one molecule on a silicon atom, and , an ultraviolet-curable organopolysiloxane having solubility in an alkaline aqueous solution as a whole organopolysiloxane; It was completed by discovering that the cured product (cured film) has sufficient mechanical strength and good transparency without using it.
- the present invention relates to an ultraviolet-curable organopolysiloxane and an ultraviolet-curable composition containing the same.
- the composition is cured by forming bonds with ultraviolet-curable functional groups, and the curing method is UV irradiation. Any method that allows the UV-curable functional group to undergo a curing reaction can be used, for example electron beam irradiation may be used to cure the composition of the present invention.
- the UV-curable organopolysiloxane of the present invention has at least one monovalent functional group in one molecule that is bonded to a silicon atom and has both a hydrophilic group and an UV-curable group, and has an organopolysiloxane
- the siloxane as a whole is characterized by having solubility in an alkaline aqueous solution.
- the ultraviolet curable organopolysiloxane may have one or more siloxane units selected from repeating units (1) and (2) below in one molecule.
- R 1 RSiO 2/2 (1)
- R 1 is a monovalent functional group having both a hydrophilic group and a UV-curable group, and R is an unsubstituted or fluorine-substituted monovalent hydrocarbon group, an alkoxy group, and a hydroxyl group. is a group of choice, A is R 1 or R, and A includes at least one R 1 )
- the ultraviolet curable organopolysiloxane may have one or more siloxane units (1) per molecule (that is, it is essential).
- the UV-curable organopolysiloxane may further contain the following siloxane unit (3).
- (R 2 RSiO 2/2 ) (3) (Wherein, R 2 is a monovalent group having an ultraviolet curable group and no hydrophilic group, and R is the above group)
- the hydrophilic group in the monovalent functional group in the ultraviolet-curable organopolysiloxane is preferably a group selected from carboxyl groups, hydroxyl groups, phenolic hydroxyl groups, and polyether groups.
- the UV-curable group in the monovalent functional group in the UV-curable organopolysiloxane is preferably a group selected from an epoxy group, an oxetane group, a vinyl ether group, and a (meth)acryloxy group.
- the UV-curable organopolysiloxane has the average unit formula: (B 3 SiO 1/2 ) a (R 1 RSiO 2/2 ) b1 (R 2 RSiO 2/2 ) b2 (RSiO 3/2 ) c (SiO 4/2 ) d (4) (Wherein, R 1 , R 2 and R are each independently the same groups as above, each B is independently a group selected from R 1 , R 2 and R; a is 0 or a positive number, b1 is a number within the range of 1 to 100, b2 is a number within the range of 0 to 50, and (c + d) is a positive number)
- a branched organopolysiloxane represented by is preferred.
- the value of (b1+b2)/(a+b1+b2+c+d) in the average unit formula (4) of the ultraviolet-curable organopolysiloxane is preferably 0.1 or more and 0.5 or less.
- the UV-curable organopolysiloxane preferably contains one or more of the following siloxane units (5) in the molecule. (RSiO3 /2 ) (5) (Wherein, R is the same group as described above)
- the hydrophilic group in the monovalent functional group in the UV-curable organopolysiloxane is preferably a carboxyl group, and the UV-curable group is preferably a (meth)acryloxy group.
- the solubility of the UV-curable organopolysiloxane in an alkaline aqueous solution was evaluated by applying the organopolysiloxane to a glass plate so that the thickness after application was 4 ⁇ m, and then coating the coating film with tetramethylammonium hydroxide (TMAH).
- TMAH tetramethylammonium hydroxide
- the mass reduction rate of the coating film comprising the organopolysiloxane is preferably 90% by mass or more, 95% by mass or more, or 98% by mass or more.
- the present invention further provides an ultraviolet curable composition containing at least the following components.
- A the UV-curable organopolysiloxane described above;
- B Photopolymerization initiator
- A Amount of 0.5 to 10 parts by mass per 100 parts by mass of component
- C Organic solvent
- the present invention further provides a cured product of the above UV-curable composition. Also provided is a method of using the cured product as an insulating coating layer.
- the present invention further provides a display device, such as a liquid crystal display, an organic EL display, and an organic EL flexible display, including a layer comprising a cured product of the ultraviolet curable composition.
- a display device such as a liquid crystal display, an organic EL display, and an organic EL flexible display, including a layer comprising a cured product of the ultraviolet curable composition.
- the UV-curable organopolysiloxane of the present invention has good coatability on substrates, and is highly soluble in alkaline aqueous solutions that are commonly used in the development process for forming patterns of desired shapes.
- unreacted/uncured organopolysiloxane and the curable composition containing the same can be easily removed by washing with an alkaline aqueous solution. High-precision patterning is possible in the process.
- the cured product formed from the UV-curable composition containing the UV-curable organopolysiloxane of the present invention is optically transparent, can be designed with a wide range of hardness, etc., and has a low dielectric constant. There are advantages.
- the curable composition according to the present invention can be used as a material for forming a low dielectric constant layer, particularly a low dielectric constant material for electronic devices, particularly an insulating layer, in any field where a material having a low dielectric constant is required. materials, particularly patterning materials and coating materials.
- the UV-curable organopolysiloxane of the present invention has at least one monovalent functional group in one molecule that is bonded to a silicon atom and has both a hydrophilic group and an UV-curable group, and has an organopolysiloxane
- the siloxane as a whole is soluble in an alkaline aqueous solution (in the present invention, it may be expressed as "alkali-soluble").
- the ultraviolet-curable composition of the present invention contains (A) the organopolysiloxane, (B) a photopolymerization initiator, and (C) an organic solvent as essential components.
- alkali-soluble means that the formed coating film is soluble in an aqueous alkaline solution that is commonly used in the development process performed to form a pattern of a desired shape.
- Basic aqueous solutions of sodium hydroxide, potassium hydroxide, quaternary ammonium salts and the like are well known as alkaline aqueous solutions, but an aqueous solution of tetramethylammonium hydroxide is typically used, and in the present invention, this solution is used. It means that it is soluble in alkaline aqueous solution.
- the expression "soluble in an alkaline aqueous solution” means that the organopolysiloxane of the present invention is applied to a glass plate to a thickness of 4 ⁇ m, and then the coating film is treated with tetramethylammonium hydroxide (TMAH ) in a 2.38% aqueous solution of ) for 1 minute and then washed with water, the weight reduction rate of the coating film composed of the organopolysiloxane is 90% by mass or more, and in particular, it was evaluated by the above method.
- TMAH tetramethylammonium hydroxide
- a common method for applying organopolysiloxane onto a glass plate is spin coating or the like, and in the case of applying using an organic solvent, which will be described later, the organic solvent must be removed in advance by drying or the like.
- the above method can be used to evaluate the solubility of the UV-curable composition containing the organopolysiloxane according to the present invention in alkaline aqueous solution.
- the organopolysiloxane containing one or more siloxane units selected from the repeating units (1) and (2) described above is more soluble in alkaline aqueous solutions than the organopolysiloxane containing only silsesquioxane units.
- the solubility of a coating film made of the organopolysiloxane in alkaline aqueous solution is evaluated by the method described above, the weight reduction rate of the coating film is 98 mass. % or more, there is a tendency to obtain an organopolysiloxane having particularly excellent alkali solubility.
- the UV-curable organopolysiloxane of the present invention has, in one molecule, one or more monovalent functional groups bonded to silicon atoms and having both a hydrophilic group and an UV-curable group, and is an organopolysiloxane having an alkali solubility of
- the molecular structure is not limited as long as it can achieve this purpose, and may be linear, branched, cyclic, cage-like, or any other structure.
- the UV-curable organopolysiloxane of the present invention preferably has one or more siloxane units selected from repeating units (1) and (2) below in one molecule. . (R 1 RSiO 2/2 ) (1) ( A3SiO1 / 2) (2) (Wherein R 1 is a monovalent functional group having both a hydrophilic group and a UV-curable group, and R is an unsubstituted or fluorine-substituted monovalent hydrocarbon group, an alkoxy group, and a hydroxyl group. selected groups, A is R 1 or R, and A includes at least one R 1 )
- the organopolysiloxane preferably contains the siloxane unit (1).
- the toughness of a coating having a particularly large film thickness is high, and the transparency is also good, as compared with a cured product consisting only of a silsesquioxane unit.
- the organopolysiloxane can further contain the following siloxane unit (3).
- R 2 is a monovalent functional group having an ultraviolet-curing group and no hydrophilic group, and R is the group described above. (R 2 RSiO 2/2 ) (3)
- the UV-curable organopolysiloxane of the present invention has a monovalent functional group bonded to silicon atoms and having both a hydrophilic group and an UV-curable group, and the hydrophilic group in the monovalent functional group
- a group selected from a carboxyl group, a hydroxyl group, a phenolic hydroxyl group, and a polyether group can preferably be used as the functional group.
- a carboxyl group is most preferable because it has a large effect of increasing the alkali solubility.
- a group selected from an epoxy group, an oxetane group, a vinyl ether group, and a (meth)acryloxy group can be preferably used as the UV-curable group in the monovalent functional group.
- an epoxy group and a (meth)acryloxy group are more preferable, and a (meth)acryloxy group is most preferable, from the viewpoint of ease of production and raw material availability.
- the organopolysiloxane has the average unit formula (4): (B 3 SiO 1/2 ) a (R 1 RSiO 2/2 ) b1 (R 2 RSiO 2/2 ) b2 (RSiO 3/2 ) c (SiO 4/2 ) d (4) It is a branched organopolysiloxane represented by (Wherein, R 1 , R 2 and R are each independently the same groups as described above, B is each independently a group selected from R, R 1 and R 2 , a is 0 or is a positive number, b1 is a number in the range 1-100, b2 is a number in the range 0-50, and (c+d) is a positive number)
- the ratio of each structural unit is not limited, but the lower limit of the value of (b1+b2)/(a+b1+b2+c+d) is preferably 0.1 or more, and 0 0.15 or higher is more preferred. On the other hand, a preferable upper limit of the value is 0.5, and a value of 0.4 or less is more preferable.
- the branched organopolysiloxane may further have siloxane units selected from T units represented by (RSiO 3/2 ) and Q units represented by (SiO 4/2 ), in particular (RSiO 3 /2 ) may have a siloxane T unit.
- UV-curable organopolysiloxane preferably used in the present invention include polysiloxanes composed of combinations of the following siloxy units.
- M is a trimethylsiloxy unit
- M Vi is a dimethylvinylsiloxy unit
- M R1 is a siloxane unit having a monovalent group and two methyl groups having both a hydrophilic group and a UV-curable group
- D is a dimethylsiloxy unit
- D R1 is a siloxane unit having a monovalent group and a methyl group having both a hydrophilic group and an ultraviolet curable group
- D R2 is a monovalent group having an ultraviolet curable group
- T is a methylsiloxy unit
- TR is an alkylsiloxy or alkenylsiloxy unit (the alkyl group is an alkyl group that may be partially fluorine-substituted, vinyl, propyl, hex
- Examples of preferred combinations of siloxy units constituting UV-curable organopolysiloxane M R1 T Ph , MM R1 T Ph , M Vi M R1 T Ph , M R1 DT Ph , MM R1 DT Ph , M Vi M R1 DT Ph , M R1 Q, MM R1 Q , M Vi M R1 Q, M R1 DQ, MM R1 DQ, M Vi M R1 DQ, M R1 T, MM R1 T, M Vi M R1 T, M R1 TTR , MM R1 TTR , M Vi M R1 TTR , M R1 DT , MM R1 DT , M Vi M R1 DT, M R1 DTT R , MM R1 DTT R , M Vi M R1 DTT R , MD R1 T, MD R1 D R2 T, D R1 T, D R1 T R , D R1D R2 TR , MD R1 TTR
- the substituent R in the branched organopolysiloxane is a group selected from unsubstituted or fluorine-substituted monovalent hydrocarbon groups, alkoxy groups, and hydroxyl groups.
- An unsubstituted or fluorine-substituted monovalent hydrocarbon group is preferably a group selected from unsubstituted or fluorine-substituted alkyl, cycloalkyl, arylalkyl, and aryl groups having 1 to 20 carbon atoms. is.
- alkyl group examples include groups such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, sec-butyl, pentyl, hexyl and octyl, with methyl and hexyl being particularly preferred.
- cycloalkyl group examples include cyclopentyl and cyclohexyl.
- arylalkyl group examples include benzyl and phenylethyl groups. Examples of the aryl group include a phenyl group and a naphthyl group.
- fluorine-substituted monovalent hydrocarbon groups examples include 3,3,3-trifluoropropyl and 3,3,4,4,5,5,6,6,6-nonafluorohexyl groups. but the 3,3,3-trifluoropropyl group is preferred.
- Alkoxy groups include methoxy, ethoxy, propoxy and isopropoxy groups.
- the refractive index of the branched organopolysiloxane can be designed within a desired range (for example, 1.40 to 1.60) depending on the type of substituent R in the branched organopolysiloxane.
- the branched organopolysiloxane has a refractive index of 1.5. It can be lowered to 50 or less and 1.45 or less, and can be used as a raw material for a curable composition having a lower refractive index.
- the substituent R 1 described in formula (1) and the like is a monovalent functional group bonded to the silicon atom and having both a hydrophilic group and an ultraviolet-curing group.
- the linking group R4 is a chain divalent hydrocarbon group having 2 to 10 carbon atoms, and includes ethylene, propylene, butylene, hexylene and the like, with ethylene and propylene being preferred.
- the linking group X is an oxygen atom, a sulfur atom, or an NR7 group, preferably an oxygen atom.
- R7 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 3 carbon atoms.
- the linking group R5 is a trivalent hydrocarbon group having 3 to 10 carbon atoms, chain, cyclic, or a combination thereof, that is, an alkanetriyl group.
- An yl group can be used as a preferred linking group. (7) (Wherein, * represents a binding site)
- Y is a group containing a monovalent UV-curable group.
- Usable UV-curable groups include an epoxy group, an oxetane group, a vinyl ether group, a (meth)acryloxy group, etc., and a (meth)acryloxy group is a preferred UV-curable group.
- Preferred examples of Y are acryloxy and methacryloxy groups.
- Z is a hydrophilic group, preferably a hydroxyl group, a hydroxyl group-containing group, or a carboxyl group-containing group.
- a hydroxyl group-containing group an alcoholic hydroxyl group or a phenolic hydroxyl group bonded via a divalent linking group is used may Moreover, it may and preferably has a carboxyl group represented by —CO 2 H bonded via a divalent linking group.
- the linking group R 6 is a divalent hydrocarbon group which may optionally contain an oxygen atom or a sulfur atom as a heteroatom, specifically a linear, branched or cyclic divalent group having 2 to 12 carbon atoms. Hydrocarbon group; sulfur-containing straight-chain, branched, or cyclic divalent hydrocarbon group; oxygen-containing straight-chain, branched, or cyclic divalent hydrocarbon group. More specific examples include divalent groups exemplified by the following structural formula (8). Among them, 6a, 6b, 6c, 6d, 6e, 6i, 6k, 6m, 6p, 6q, 6q and 6s can be preferably used. (8) (Wherein, * represents a binding site)
- Substituent R2 is a monovalent group having a UV-curable group and no hydrophilic group.
- a group selected from an epoxy group, an oxetane group, a vinyl ether group, and a (meth)acryloxy group can be preferably used, and as described above, an epoxy group and a (meth)acryloxy group are more preferable.
- R 2 examples include glycidoxyethyl, glycidoxypropyl, 2-(3,4-epoxycyclohexyl)ethyl, 3-(3,4-epoxycyclohexyl)propyl, acryloxy A propyl group, a methacryloxypropyl group, an acryloxyoctyl group, and a methacryloxyoctyl group can be mentioned.
- the UV-curable organopolysiloxane of the present invention is preferably a branched organopolysiloxane having monovalent functional groups having both (meth)acryloxy groups and carboxyl groups bonded to silicon atoms.
- each molecule preferably has an average of 2.5 or more monovalent functional groups.
- the UV-curable organopolysiloxane may contain a monovalent group (substituent R 2 ) having an UV-curable group and no hydrophilic group. Therefore, the number of UV-curable groups and the number of hydrophilic groups in the molecule may be different.
- the average number of UV-curable groups in the molecule is preferably 2 or more, more preferably 3 or more, and more preferably 5 or more.
- the average number of hydrophilic groups in the molecule is preferably 2 or more, more preferably 3 or more.
- the molecular weight of the UV-curable organopolysiloxane of the present invention is not particularly limited.
- the average molecular weight is preferably from 1,000 to 100,000, more preferably from 1,000 to 50,000, and even more preferably from 2,000 to 30,000.
- the method for producing the ultraviolet-curable organopolysiloxane of the present invention is also not particularly limited.
- 1) UV-curable organopolysiloxane is produced and a functional group having a hydrophilic group is imparted, and 2) reactive organopolysiloxane having no hydrophilic group and UV-curable group is prepared.
- methods 1) and 2) are preferably applicable.
- a specific example is a method of producing an epoxy group-containing UV-curable organopolysiloxane, converting the functional groups of the epoxy groups in stages, and imparting functional groups having a (meth)acryloxy group and a carboxyl group.
- the ultraviolet curable composition of the present invention contains the following three components.
- Component (A) is the main component of the detailed invention.
- Component (B) is a component that catalyzes the curing reaction of component (A) by ultraviolet rays, and compounds known as photopolymerization initiators are usually applicable.
- a photocationic polymerization initiator is used as the photopolymerization initiator.
- photocationic polymerization initiators compounds capable of generating Bronsted acids or Lewis acids by irradiation with ultraviolet rays or electron beams, so-called photoacid generators, are known. Acids are known to cause reactions between cationically polymerizable functional groups.
- a radical photopolymerization initiator can be used as the photopolymerization initiator.
- the photo-radical polymerization initiator can cure the composition of the present invention by generating free radicals upon irradiation with ultraviolet rays, which induce radical polymerization reactions.
- photocationic polymerization initiator used in the ultraviolet-curable composition of the present invention can be arbitrarily selected from those known in the art and is not particularly limited. Strong acid-generating compounds such as diazonium salts, sulfonium salts, iodonium salts, and phosphonium salts are known as photocationic polymerization initiators, and these can be used.
- photocationic polymerization initiators include bis(4-tert-butylphenyl)iodonium hexafluorophosphate, cyclopropyldiphenylsulfonium tetrafluoroborate, dimethylphenacylsulfonium tetrafluoroborate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroarce diphenyliodonium tetrafluoromethanesulfonate, 2-(3,4-dimethoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-[2-(furan-2-yl) Vinyl]-4,6-bis(trichloromethyl)-1,3,5-triazine, 4-isopropyl-4'-methyldiphenyliodonium tetrakis(pentafluorophenyl)borate, 2-[2-(5-methyl)
- the amount of the photocationic polymerization initiator to be added to the UV-curable composition of the present invention is not particularly limited as long as the desired photo-curing reaction occurs.
- a photocationic polymerization initiator can be used in an amount of 0.1 to 10 parts by weight, preferably 0.2 to 5 parts by weight, particularly 0.5 to 5 parts by weight, based on 100 parts by weight of the alkali-soluble organopolysiloxane. preferable.
- a photosensitizer can also be used in combination with the photocationic polymerization initiator.
- the use of a sensitizer can increase the photon efficiency of the polymerization reaction, making longer wavelength light available for the polymerization reaction than when only the photoinitiator is used. is known to be particularly effective when the coating thickness of is relatively thick or when relatively long wavelength LED light sources are used.
- Sensitizers include anthracene compounds, phenothiazine compounds, perylene compounds, cyanine compounds, merocyanine compounds, coumarin compounds, benzylidene ketone compounds, (thio)xanthene or (thio)xanthone compounds such as isopropyl Thioxanthone, 2,4-diethylthioxanthone, alkyl-substituted anthracenes, squarium-based compounds, (thia)pyrylium-based compounds, porphyrin-based compounds, etc. are known, and any photosensitizer may be used in the curing of the present invention without being limited to these. can be used in sexual compositions.
- Radical photopolymerization initiators are roughly classified into photocleavage type and hydrogen abstraction type, but the photoradical polymerization initiator used in the composition of the present invention is arbitrarily selected from those known in the art. It can be selected and used, and is not particularly limited to a specific one.
- photoradical polymerization initiators include acetophenone, p-anisyl, benzyl, benzoin, benzophenone, 2-benzoylbenzoic acid, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(dimethylamino)benzophenone.
- benzoin methyl ether benzoin isopropyl ether, benzoin isobutyl ether, benzoin ethyl ether, 4-benzoylbenzoic acid, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1, 2'-biimidazole, methyl 2-benzoylbenzoate, 2-(1,3-benzodioxol-5-yl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-benzyl -2-(dimethylamino)-4'-morpholinobtyrophenone, ( ⁇ )-camphorquinone, 2-chlorothioxanthone, 4,4'-dichlorobenzophenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2- Phenylacetophenone, 2,4-diethylthioxanthene-9-one, diphenyl(
- Omnirad registered trademark
- 651, 184, 1173, 2959, 127, 907, 369, 369E, and 379EG alkylphenone-based photopolymerization initiators, manufactured by IGM Resins BV
- IGM Resins BV radical photopolymerization initiators
- Omnirad registered trademark
- TPO H acylphosphine oxide photoinitiators
- IGM RESINS BV Omnirad (registered trademark) MBF and 754 (intramolecular hydrogen abstraction type photoinitiator IGM Resins BV), Irgacure® OXE01 and OXE02 (oxime ester-based non-social polymerization initiators, BASF).
- the amount of the radical photopolymerization initiator to be added to the curable composition of the present invention is not particularly limited as long as the desired photopolymerization reaction or photocuring reaction occurs, but generally the component (A) of the present invention It is used in an amount of 0.1 to 10 parts by weight, preferably 0.5 to 5 parts by weight, per 100 parts by weight of the UV-curable alkali-soluble organopolysiloxane.
- a photosensitizer can also be used in combination with the photoradical polymerization initiator.
- the use of a sensitizer can be expected to have the effect of increasing the photon efficiency of the polymerization reaction, as in the case of using the photocationic polymerization initiator.
- the photosensitizer the above-described photosensitizers that can be used in combination with the photocationic polymerization initiator are exemplified and can be preferably used.
- the UV-curable composition of the present invention preferably contains (C) an organic solvent for the purpose of adjusting the coatability of the UV-curable organopolysiloxane, adjusting the film thickness of the coating film, and improving the dispersibility of the photopolymerization initiator.
- organic solvents conventionally blended in various UV-curable compositions can be used without particular limitation.
- organic solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n.
- ketones lactic acid alkyl esters such as methyl 2-hydroxypropionate and ethyl 2-hydroxypropionate; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 3 -methyl ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl -3-methoxybutyl propionate, ethyl acetate, n-propyl acetate, i-propyl acetate, n-butyl acetate, i-butyl acetate, n-pentyl formate, i-pentyl acetate, n-butyl propionate, ethyl buty
- the content of the organic solvent is not particularly limited, and is appropriately set according to (A) the miscibility with the UV-curable organopolysiloxane, the thickness of the coating film formed from the UV-curable composition, and the like. Typically, it is used in an amount of 50 to 10,000 parts by weight per 100 parts by weight of component (A). That is, the solute concentration of the UV-curable organopolysiloxane is preferably 1 to 50% by mass, more preferably 2 to 40% by mass.
- the cured product obtained from the UV-curable composition of the present invention depends on the molecular structure of component (A) and the number of hydrophilic groups and UV-curable groups per molecule. Depending on the amount added, the desired physical properties of the cured product and the curing speed of the curable composition can be obtained, and further according to the amount of component (C), the viscosity of the curable composition will be the desired value. can be designed to A cured product obtained by curing the ultraviolet curable composition of the present invention is also included in the scope of the present invention.
- the shape of the cured product obtained from the curable composition of the present invention is not particularly limited, and may be a thin coating layer, a molded product such as a sheet, or a laminate or a display device. It may be used as a sealing material or an intermediate layer.
- the cured product obtained from the composition of the present invention is preferably in the form of a thin-film coating layer, particularly preferably a thin-film insulating coating layer.
- the UV-curable composition of the present invention is suitable for use as a coating agent, particularly an insulating coating agent for electronic and electrical devices.
- additives In addition to the above ingredients, further additives may be added to the compositions of the present invention as desired. Examples of additives include, but are not limited to, the following.
- An adhesion promoter can be added to the ultraviolet curable composition of the present invention in order to improve adhesion and adhesion to substrates in contact with the composition.
- an adhesion-imparting agent may be added to the curable composition of the present invention. is preferred. Any known adhesion promoter can be used as the adhesion promoter as long as it does not inhibit the curing reaction of the composition of the present invention.
- adhesion promoters examples include trialkoxysiloxy groups (e.g., trimethoxysiloxy group, triethoxysiloxy group) or trialkoxysilylalkyl groups (e.g., trimethoxysilylethyl group, triethoxysilylethyl group) and a hydrosilyl group or an alkenyl group (e.g., vinyl group, allyl group), or an organosiloxane oligomer having a linear, branched or cyclic structure with about 4 to 20 silicon atoms; trialkoxy Organosilanes having a siloxy group or a trialkoxysilylalkyl group and a methacryloxyalkyl group (e.g., 3-methacryloxypropyl group), or organosilanes having a linear, branched or cyclic structure having about 4 to 20 silicon atoms Siloxane oligomer; trialkoxysiloxy group
- the amount of the adhesion promoter added to the ultraviolet curable composition of the present invention is not particularly limited, but since it does not promote the curing properties of the curable composition and the discoloration of the cured product, , 0.01 to 5 parts by mass, or preferably 0.01 to 2 parts by mass.
- additives may be added to the ultraviolet curable composition of the present invention in addition to or instead of the adhesion imparting agent described above.
- Additives that can be used include leveling agents, silane coupling agents that are not included in the adhesiveness imparting agents described above, ultraviolet absorbers, antioxidants, polymerization inhibitors, fillers (reinforcing fillers, insulating and functional fillers such as thermally conductive fillers).
- Suitable additives can be added to the composition of the present invention, if desired.
- a thixotropic agent may be added to the composition of the present invention as necessary, particularly when used as a sealing material.
- the method for producing the cured film is not particularly limited as long as it is a method capable of curing the film made of the ultraviolet-curable composition described above.
- a known lithographic process can be applied, preferably to produce a patterned cured film.
- the substrate is not particularly limited, and various substrates such as a glass substrate, a silicon substrate, and a glass substrate coated with a transparent conductive film can be used.
- a known method using a coating device such as a spin coater, a roll coater, a bar coater, a slit coater, or the like can be applied to apply the ultraviolet curable composition onto the substrate.
- the applied curable composition is optionally heated and dried to remove the solvent.
- a method of drying on a hot plate at a temperature of 80 to 120° C., preferably 90 to 100° C. for 1 to 2 minutes, a method of standing at room temperature for several hours, and a hot air heater or infrared heater.
- Examples include a method of heating for several tens of minutes to several hours.
- Position-selective exposure of the coating film is usually performed through a photomask or the like, using a known active energy ray light source including ultraviolet light sources such as high-pressure mercury lamps, metal halide lamps and LED lamps, and laser light sources such as excimer laser light. done.
- a negative photomask or a positive photomask can be used.
- the energy dose to be irradiated depends on the structure of the curable composition, but is typically about 100 to 1,000 mJ/cm2.
- a developer In order to form a pattern of the desired shape, it is developed with a developer.
- Alkaline aqueous solutions and organic solvents are known as developing solutions, but development with alkaline aqueous solutions is the mainstream.
- Both an aqueous solution of an inorganic base and an aqueous solution of an organic base can be used as the alkaline aqueous solution.
- Suitable developers include basic aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, quaternary ammonium salts and the like, with aqueous solutions of tetramethylammonium hydroxide being particularly preferred.
- a developing method is not particularly limited, and for example, a dipping method, a spray method, or the like can be applied.
- the UV-curable organopolysiloxane and the UV-curable composition containing it as a main component according to the present invention have excellent UV-curing properties, and at the same time, are remarkably excellent in alkali solubility.
- the development step it has the advantage that simple and highly accurate pattern formation can be performed, and the mechanical strength and transparency of the resulting cured film are excellent.
- Post-heating is generally preferred for the patterned cured film after development.
- the PEB temperature is not particularly limited as long as the patterned cured film is not thermally decomposed or deformed, but is preferably 150 to 250.degree.
- the UV-curable composition of the present invention is particularly useful as a material for forming insulating layers that constitute various articles, particularly electronic devices and electrical devices.
- the composition can be designed to have a low dielectric constant of less than 3.0 after curing.
- the curable composition of the present invention is particularly suitable as a material for forming an insulating layer of display devices such as touch panels and displays because the cured product obtained therefrom has good transparency.
- the insulating layer may form any desired pattern, as described above, if desired. Therefore, a display device such as a touch panel and a display including an insulating layer obtained by curing the ultraviolet curable composition of the present invention is also one aspect of the present invention.
- the curable composition of the present invention can be used to coat an article and then cured to form an insulating coating layer (insulating film). Therefore, the composition of the present invention can be used as an insulating coating agent. A cured product formed by curing the curable composition of the present invention can also be used as an insulating coating layer.
- the insulating film formed from the curable composition of the present invention can be used for various purposes other than the display device. In particular, it can be used as a component of electronic devices or as a material used in the process of manufacturing electronic devices. Electronic devices include electronic equipment such as semiconductor devices and magnetic recording heads.
- the curable composition of the present invention can be used for semiconductor devices such as LSI, system LSI, DRAM, SDRAM, RDRAM, D-RDRAM, insulating films for multi-chip module multilayer wiring boards, interlayer insulating films for semiconductors, and etching stopper films. , a surface protective film, a buffer coat film, a passivation film in LSI, a cover coat for flexible copper-clad plates, a solder resist film, and a surface protective film for optical devices.
- Refractive index of UV curable organopolysiloxane A digital refractometer (RX-7000 ⁇ manufactured by Atago Co., Ltd.) was used to measure the refractive index (n D ) of the synthesized organopolysiloxane in propylene glycol methyl ether acetate (PGMEA) solution at 25°C. Solutions with various polymer concentrations were prepared and measured, and the nD of the synthesized organopolysiloxane was calculated by extrapolation.
- RX-7000 ⁇ manufactured by Atago Co., Ltd. was used to measure the refractive index (n D ) of the synthesized organopolysiloxane in propylene glycol methyl ether acetate (PGMEA) solution at 25°C. Solutions with various polymer concentrations were prepared and measured, and the nD of the synthesized organopolysiloxane was calculated by extrapolation.
- TMAH dissolution test B Only the edge portion of the cured coating film (less than 5% of the total area of the cured film) dissolves in the TMAH dissolution test C: Half of the cured coating film (About 5-50% of the total area of the cured film) is dissolved in the TMAH dissolution test D: The cured coating is completely dissolved or almost dissolved in the TMAH dissolution test
- Examples and Comparative Examples Using the following functional polysiloxane solution and curing catalyst, mix in the composition shown in Table 1 (parts by mass; polysiloxane is converted to solid content), then dilute with PGMEA so that the total solid content concentration is 20% by mass. After that, it was filtered through a membrane filter with a pore size of 0.2 ⁇ m to prepare each ultraviolet curable composition.
- Ultraviolet curable polysiloxane (A-1) PGMEA solution of the functional polysiloxane solution obtained by solvent substitution of the functional polysiloxane solution obtained in the above synthesis example (C-1) obtained in the above synthesis example PGMEA solution of the functional polysiloxane obtained in the above synthesis example (C-2) PGMEA solution of the functional polysiloxane obtained in the above synthesis example (C-3) PGMEA solution of the functional polysiloxane obtained in the above synthesis example (C-4 ) PGMEA solution of the functional polysiloxane obtained in the above synthesis example (C-5) PGMEA solution of the functional polysiloxane obtained in the above synthesis example (C-6) Functional polysiloxane obtained in the above synthesis example PGMEA solution (C-7) PGMEA solution of the functional polysiloxane obtained in the above synthesis example (C-8) PGMEA solution of the functional polysiloxane obtained in the
- Example 1 [Dielectric constant of cured organopolysiloxane (cured film)]
- the curable composition of Example 1 was poured into a Teflon cup with a diameter of 50 mm and dried at room temperature for 16 hours, followed by drying at 50° C. for 5 hours and then at 90° C. for 12 hours to give a 100 ⁇ m thick film.
- a transparent organopolysiloxane film was formed.
- This film test piece was irradiated with ultraviolet light (LED light of 365 nm, 2000 mJ/cm 2 ) and further heated in an oven at 150° C. for 30 minutes to obtain a completely cured coating film.
- LED light ultraviolet light
- Example 6 On the other hand, the same operation was performed using the curable composition of Example 6, whose main component was an ultraviolet curable organopolysiloxane consisting only of silsesquioxane units, to form an organopolysiloxane film having a thickness of 100 ⁇ m. Attempts were made, but many cracks occurred on the surface and a transparent film could not be formed.
- main component was an ultraviolet curable organopolysiloxane consisting only of silsesquioxane units
- the coating films formed from the UV-curable organopolysiloxanes of the present invention exhibit high alkali solubility, particularly organopolysiloxanes having D structural units as well as silsesquioxane units.
- Polysiloxane and curable compositions containing it had particularly excellent alkali solubility.
- the present organopolysiloxane has good UV curability.
- the cured coating film formed by ultraviolet irradiation is transparent, and in particular, the cured coating film obtained from polysiloxane having both the UV-curable group and the hydrophilic group in the D structural unit has high transparency and sufficient coating film. Shows toughness.
- branched organopolysiloxane of the present invention by adjusting the types of structural units and functional groups that make up the branched organopolysiloxane of the present invention, it is possible to adjust the refractive index of the organopolysiloxane over a wide range. It is possible to design a cured product having a desired refractive index in the composition. In particular, since branched organopolysiloxanes having trifluoro-functional structural units have a refractive index of 1.45 or less, using such branched organopolysiloxanes makes it possible to form a cured product with a low refractive index. There is an advantage that a curable composition can be designed.
- the UV-curable organopolysiloxane of the present invention and the UV-curable composition containing it as a main component have excellent UV-curing properties, and at the same time, are remarkably excellent in alkali solubility.
- the organopolysiloxane or the like is particularly suitable as a material for forming an insulating layer of a display device such as a touch panel and a display, particularly a flexible display, particularly as a patterning material and a coating material.
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Abstract
Description
(R1RSiO2/2) (1)
(A3SiO1/2) (2)
(式中、R1は、親水性基および紫外線硬化性基の両者を有する一価の官能基であり、Rは非置換又はフッ素で置換された一価炭化水素基、アルコキシ基、および水酸基から選ばれる基である。AはR1またはRであり、Aは少なくとも1個のR1を含む)
(R2RSiO2/2) (3)
(式中、R2は、紫外線硬化性基を有し、親水性基を有さない一価の基であり、Rは前記の基である)
(B3SiO1/2)a(R1RSiO2/2)b1(R2RSiO2/2)b2(RSiO3/2)c(SiO4/2)d (4)
(式中、R1,R2,Rは、それぞれ独立に、前記同様の基であり、
Bはそれぞれ独立に、R1,R2、およびRから選ばれる基であり、
aは0又は正数であり、b1は1~100の範囲内の数であり、b2は0~50の範囲内の数であり、(c+d)は正数である)
で表される分岐状オルガノポリシロキサンであることが好ましい。
(RSiO3/2) (5)
(式中、Rは、前記同様の基である)
{式中、R4は炭素数2から10の鎖状二価炭化水素基であり、
R5は炭素数3から10の鎖状、環状、もしくはその組み合わせである三価炭化水素基であり、
Xは酸素原子、硫黄原子、または―NR7-(式中、R7は、水素原子または炭素原子数1から3の一価炭化水素基である)であり、
nは0または1であり、
Yは一価の紫外線硬化性基を含む基であり、
Zは水酸基、水酸基含有基または―O(C=O)-R6-CO2H(式中、R6は、任意で酸素原子または硫黄原子を含有してもよい、炭素原子数2から12の直鎖、分岐、または環状二価炭化水素基である)で表される一価の親水性基であり、
*はオルガノポリシロキサン上のケイ素原子への結合部位である}
(A)上記の紫外線硬化性オルガノポリシロキサン、
(B)光重合開始剤 (A)成分100質量部に対し0.5~10質量部となる量
(C)有機溶媒
本発明の紫外線硬化性オルガノポリシロキサンは、ケイ素原子上に結合し、親水性基および紫外線硬化性基の両者を有する一価の官能基を一分子中に1個以上有し、かつ、オルガノポリシロキサン全体としてアルカリ水溶液に対する可溶性(本発明において、「アルカリ可溶性」と表現することがある)を有する。また、本発明の紫外線硬化性組成物は、(A)当該オルガノポリシロキサン、(B)光重合開始剤、および(C)有機溶媒を必須成分として含む。
本発明の紫外線硬化性オルガノポリシロキサンは、ケイ素原子上に結合し、親水性基および紫外線硬化性基の両者を有する一価の官能基を、一分子中に1個以上有し、かつ、上記のアルカリ可溶性を有する、オルガノポリシロキサンである。この目的を達成できる限りその分子構造に制限はなく、直鎖状、分岐状、環状、かご状等、任意のものであることができる。
(R1RSiO2/2) (1)
(A3SiO1/2) (2)
(式中、R1は、親水性基および紫外線硬化性基の両者を有する一価の官能基であり、Rは非置換又はフッ素で置換された一価炭化水素基、アルコキシ基、および水酸基から選ばれる基であり、AはR1またはRであり、Aは少なくとも1個のR1を含む)
(R2RSiO2/2) (3)
(B3SiO1/2)a(R1RSiO2/2)b1(R2RSiO2/2)b2(RSiO3/2)c(SiO4/2)d (4)
で表される分岐状オルガノポリシロキサンである。
(式中、R1,R2,Rは、それぞれ独立に、前記同様の基であり、Bは、それぞれ独立に、R、R1、およびR2から選ばれる基であり、aは0又は正数であり、b1は1~100の範囲内の数であり、b2は0~50の範囲内の数であり、(c+d)は正数である)
MR1TPh、MMR1TPh、MViMR1TPh、MR1DTPh、MMR1DTPh、MViMR1DTPh、MR1Q、MMR1Q、MViMR1Q、MR1DQ、MMR1DQ、MViMR1DQ、MR1T、MMR1T、MViMR1T、MR1TTR、MMR1TTR、MViMR1TTR、MR1DT、MMR1DT、MViMR1DT、MR1DTTR、MMR1DTTR、MViMR1DTTR、MDR1T、MDR1DR2T、DR1T、DR1DR2T、DR1TR、DR1DR2TR、MDR1TTR、MDR1DR2TTR、MDR1TR、MDR1DR2TR、DR1TTR、DR1DR2TTR、MDR1TPh、MDR1DR2TPh、DR1TPh、DR1DR2TPh、DR1TPhQ、DR1DR2TPhQ、MDR1Q、MDR1DR2Q、MViDR1Q、MViDR1DR2Q、MDR1TQ、MDR1DR2TQ、MDR1TPhQ、MDR1DR2TPhQ、MDR1TRQ、MDR1DR2TRQ、MDR1TTRQ、MDR1DR2TTRQ、MDR1TRTPhQ、MDR1DR2TRTPhQ、MDRDR1TQ、DRDR1TQ、DRDR1DR2TQ
{式中、R4は炭素数2から10の鎖状二価炭化水素基であり、R5は炭素数3から10の鎖状、環状、もしくはその組み合わせである三価炭化水素基であり、Xは酸素原子、硫黄原子、または―NR7-(式中、R7は、水素原子または炭素原子数1から3の一価炭化水素基である)であり、nは0または1であり、Yは一価の紫外線硬化性基を含む基であり、Zは水酸基または―O(C=O)-R6-CO2H(式中、R6は、任意で酸素原子または硫黄原子を含有してもよい、炭素原子数2から12の直鎖、分岐、または環状二価炭化水素基である)で表される一価の親水性基であり、*はポリシロキサン上のケイ素原子への結合部位である。}
(式中、*は結合部位を表す)
(式中、*は結合部位を表す)
本発明の紫外線硬化性組成物は、以下の三成分を含有する。成分(A)は、詳述した本発明の主成分である。
(A)上記の紫外線硬化性オルガノポリシロキサン
(B)光重合開始剤、(A)成分100質量部に対し0.1~10質量部となる量
(C)有機溶媒
成分(B)は、紫外線による成分(A)の硬化反応を触媒せしめる成分であり、通常、光重合開始剤として知られている化合物群が適用できる。成分(A)が有する紫外線硬化性官能基が、エポキシ基含有基又はビニルエーテル基などを含むカチオン重合性官能基である場合には、光重合開始剤として、光カチオン重合開始剤を用いる。光カチオン重合開始剤としては、紫外線又は電子線の照射によってブレンステッド酸又はルイス酸を生成することができる化合物、いわゆる光酸発生剤が公知であり、紫外線などの照射によって酸が発生し、その酸がカチオン重合性官能基どうしの反応を引き起こすことが知られている。一方、成分(A)が有する紫外線硬化性官能基が、(メタ)アクリロキシ基等のラジカル重合性官能基である場合は、光重合開始剤として光ラジカル重合開始剤を用いることができる。光ラジカル重合開始剤は、紫外線の照射によってフリーラジカルが発生し、それがラジカル重合反応を引き起こして本発明の組成物を硬化させることができる。
本発明の紫外線硬化性組成物に用いる光カチオン重合開始剤は、当技術分野で公知のものから任意に選択して用いることができ、特に特定のものに限定されない。光カチオン重合開始剤には、ジアゾニウム塩、スルホニウム塩、ヨードニウム塩、ホスホニウム塩などの強酸発生化合物が知られており、これらを用いることができる。光カチオン重合開始剤の例として、ビス(4-tert-ブチルフェニル)ヨードニウム ヘキサフルオロホスフェート、シクロプロピルジフェニルスルホニウム テトラフルオロボレート、ジメチルフェナシルスルホニウム テトラフルオロボレート、ジフェニルヨードニウム ヘキサフルオロホスフェート、ジフェニルヨードニウム ヘキサフルオロアルセナート、ジフェニルヨードニウム テトラフルオロメタンスルホネート、2-(3,4-ジメトキシスチリル)-4,6-ビス(トリクロロメチル)-1,3,5-トリアジン、2-[2-(フラン-2-イル)ビニル]-4,6-ビス(トリクロロメチル)-1,3,5-トリアジン、4-イソプロピル-4’-メチルジフェニルヨードニウム テトラキス(ペンタフルオロフェニル)ボレート、2-[2-(5-メチルフラン-2-イル)ビニル]-4,6-ビス(トリクロロメチル)-1,3,5-トリアジン、2-(4-メトキシフェニル)-4,6-ビス(トリクロロメチル)-1,3,5-トリアジン、2-(4-メトキシスチリル)-4,6-ビス(トリクロロメチル)-1,3,5-トリアジン、4-ニトロベンゼンジアゾニウム テトラフルオロボレート、トリフェニルスルホニウム テトラフルオロボレート、トリフェニルスルホニウムブロマイド、トリ-p-トリルスルホニウム ヘキサフルオロホスフェート、トリ-p-トリルスルホニウム トリフルオロメタンスルホネート、ジフェニルヨードニウム トリフラート、トリフェニルスルホニウム トリフラート、ジフェニルヨードニウム ナイトレート、ビス(4-tert-ブチルフェニル)ヨードニウム パーフルオロ-1-ブタンスルホネート、ビス(4-tert-ブチルフェニル)ヨードニウム トリフラート、トリフェニルスルホニウムパーフルオロ-1-ブタンスルホナート、N-ヒドロキシナフタルイミド トリフラート、p-トルエンスルホネート、ジフェニルヨードニウム p-トルエンスルホネート、(4-tert-ブチルフェニル)ジフェニルスルホニウム トリフラート、トリス(4-tert-ブチルフェニル)スルホニウム トリフラート、N-ヒドロキシ-5-ノルボルネン-2,3-ジカルボキシミド ペルフルオロ-1-ブタンスルホナート、(4-フェニルチオフェニル)ジフェニルスルホニウム トリフラート、及び4-(フェニルチオ)フェニルジフェニルスルホニウム トリエチルトリフルオロホスフェートなどが挙げられるがこれらに限定されない。光カチオン重合開始剤として、上記化合物のほかにも、Omnicat 250、Omnicat 270(以上、IGM Resins B.V.社)、CPI-310B, IK-1(以上、サンアプロ株式会社)、DTS-200 (みどり化学株式会社)、及びIrgacure 290(BASF社)などの市販されている光開始剤を挙げることができる。
光ラジカル重合開始剤は、大きく分けて光開裂型と水素引き抜き型のものが知られているが、本発明の組成物に用いる光ラジカル重合開始剤は、当技術分野で公知のものから任意に選択して用いることができ、特定のものに特に限定されない。光ラジカル重合開始剤の例としては、アセトフェノン、p-アニシル、ベンジル、ベンゾイン、ベンゾフェノン、2-ベンゾイル安息香酸、4,4’-ビス(ジエチルアミノ)ベンゾフェノン、4,4’-ビス(ジメチルアミノ)ベンゾフェノン、ベンゾインメチルエーテル、ベンゾインイソプロピルエーテル、ベンゾインイソブチルエーテル、ベンゾインエチルエーテル、4-ベンゾイル安息香酸、2,2’-ビス(2-クロロフェニル)-4,4’,5,5’-テトラフェニル-1,2’-ビイミダゾール、メチル2-ベンゾイルベンゾエート、2-(1,3-ベンゾジオキソール-5-イル)-4,6-ビス(トリクロロメチル)-1,3,5-トリアジン、2-ベンジル-2-(ジメチルアミノ)-4’-モルホリノブチロフェノン、(±)-カンファーキノン、2-クロロチオキサントン、4,4’-ジクロロベンゾフェノン、2,2-ジエトキシアセトフェノン、2,2-ジメトキシ-2-フェニルアセトフェノン、2,4-ジエチルチオキサンテン-9-オン、ジフェニル(2,4,6-トリメチルベンゾイル)ホスフィンオキシド、エチル(2,4,6-トリメチルベンゾイル)フェニルホスフィネート、1,4-ジベンゾイルベンゼン、2-エチルアントラキノン、1-ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチルプロピオフェノン、2-ヒドロキシ-4’-(2-ヒドロキシエトキシ)-2-メチルプロピオフェノン、2-イソプロピルチオキサントン、リチウム フェニル(2,4,6-トリメチルベンゾイル)ホスフィナート、2-メチル-4’-(メチルチオ)-2-モルホリノプロピオフェノン、2-イソニトロソプロピオフェノン、2-フェニル-2-(p-トルエンスルホニルオキシ)アセトフェノン、及びフェニルビス(2,4,6-トリメチルベンゾイル)ホスフィンオキシドなどが挙げられるがこれらに限定されない。また、光ラジカル重合開始剤として上記化合物の他に、Omnirad(登録商標) 651, 184, 1173, 2959, 127, 907, 369, 369E, 及び379EG(アルキルフェノン系光重合開始剤、IGM Resins B.V.社)、Omnirad(登録商標)TPO H, TPO-L,及び819(アシルフォスフィンオキサイド系光重合開始剤、IGM RESINS B.V.社)、Omnirad(登録商標)MBF及び754(分子内水素引き抜き型光重合開始剤、IGM Resins B.V.社)、Irgacure(登録商標)OXE01及びOXE02(オキシムエステル系非会重合開始剤、BASF社)などの開始剤を挙げることができる。
本発明の紫外線硬化性組成物は、紫外線硬化性オルガノポリシロキサンの塗布性および塗膜の膜厚調整、光重合開始剤の分散性向上等の目的で、(C)有機溶媒を含むことが好ましい。かかる有機溶媒としては、従来から種々の紫外線硬化性組成物に配合されている有機溶媒を特に制限なく用いることができる。
上記成分に加えて、所望によりさらなる添加剤を本発明の組成物に添加してもよい。添加剤としては、以下に挙げるものを例示できるが、これらに限定されない。
本発明の紫外線硬化性組成物には、組成物に接触している基材に対する接着性や密着性を向上させるために接着促進剤を添加することができる。本発明の硬化性組成物をコーティング剤、シーリング材などの、基材に対する接着性又は密着性が必要な用途に用いる場合には、本発明の硬化性組成物に接着性付与剤を添加することが好ましい。この接着促進剤としては、本発明の組成物の硬化反応を阻害しない限り、任意の公知の接着促進剤を用いることができる。
本発明の紫外線硬化性組成物には、上述した接着性付与剤に加えて、あるいは接着性付与剤に代えて、所望によりその他の添加剤を添加してもよい。用いることができる添加剤としては、レベリング剤、上述した接着性付与剤として挙げたものに含まれないシランカップリング剤、紫外線吸収剤、酸化防止剤、重合禁止剤、フィラー(補強性フィラー、絶縁性フィラー、および熱伝導性フィラー等の機能性フィラー)などが挙げられる。必要に応じて、適切な添加剤を本発明の組成物に添加することができる。また、本発明の組成物には必要に応じて、特にシール材として用いる場合には、チキソ性付与剤を添加してもよい。
硬化膜の製造方法は、上述の紫外線硬化性組成物からなる膜を硬化させることができる方法であれば特に限定されない。公知のリソグラフィープロセスを適用することができ、パターン化された硬化膜を製造することが好ましい。典型的な製造方法としては、
1)基材上に上述の紫外線硬化性組成物の塗膜を形成する。
2)得られた塗膜を、100℃以下程度の温度で短時間加熱し、溶媒を除去する。
3)塗膜を位置選択的に露光する。
4)露光された塗膜を現像する。
5)パターン化された硬化膜を100℃を超える温度で加熱し、膜を完全硬化させる。
を含む方法が推奨される。
基材としては、特に限定されず、ガラス基板、シリコン基板、透明導電性膜がコーティングされたガラス基板等の種々の基板を使用することができる。
上述の紫外線硬化性組成物を基材上に塗布するには、スピンコーター、ロールコーター、バーコーター、スリットコーター等の塗布装置を用いる公知の方法が適用できる。
塗布された硬化性組成物は、必要に応じて加熱し、乾燥され、溶媒が除去される。典型的には、ホットプレート上にて80~120℃、好ましくは90~100℃の温度にて1~2分間乾燥させる方法、室温にて数時間放置する方法、温風ヒータや赤外線ヒータ中で数十分間~数時間加熱する方法等が挙げられる。
塗膜に対する位置選択的露光は、通常、フォトマスク等を介し、高圧水銀ランプ、メタルハライドランプ、LEDランプ等の紫外線光源、エキシマレーザー光等のレーザー光源を含む公知の活性エネルギー線光源を使用して行われる。硬化性組成物の特性に応じて、ネガ型、ポジ型のフォトマスクを使い分けることができる。照射するエネルギー線量は、硬化性組成物の構造に依存するが、典型的には、100~1,000mJ/cm2程度である。
以上の操作により、所望の形状にパターン化された紫外線硬化性組成物の硬化膜を形成することができる。
本発明の紫外線硬化性組成物は、様々な物品、特に電子デバイス及び電気デバイスを構成する絶縁層を形成するための材料として特に有用である。当該組成物は、硬化後に、3.0未満の低い比誘電率を有するように設計することができる。また、本発明の硬化性組成物は、それから得られる硬化物の透明性が良好であることから、タッチパネル、及びディスプレイなどの表示装置の絶縁層を形成するための材料として特に適している。この場合、絶縁層は、必要に応じて上述したように所望する任意のパターンを形成してもよい。したがって、本発明の紫外線硬化性組成物を硬化させて得られる絶縁層を含むタッチパネル及びディスプレイなどの表示装置も本発明の一つの態様である。
デジタル屈折計(株式会社アタゴ製、RX-7000α)を使用し、25℃における合成したオルガノポリシロキサンのプロピレングリコールメチルエーテルアセテート(PGMEA)溶液の屈折率(nD)を測定した。種々のポリマー濃度の溶液を作製し、測定を行い、外挿法により、合成したオルガノポリシロキサンのnDを算出した。
硬化性組成物および硬化物を目視で観察し、外観を判定した。
各硬化性分岐状オルガノポリシロキサンの20質量%PGMEA溶液を光学ガラス基板上に1.0μmの膜厚になるようにスピンコートし、ホットプレートを用いて90℃で2分間加熱(プリベーク)し、塗膜を形成した。その後、25℃において、テトラメチルアンモニウムヒドロキシド(TMAH)の2.38%水溶液を用いて1分間現像し、室温(25℃)の水浴で浸漬水洗した。水洗時間は15秒間である。水洗後、乾燥により水分を除去後、ガラス基板を目視で観察し、アルカリ溶液に対する溶解性(現像性)を以下の基準で判定した。
A:完全溶解:塗膜が完全に除去されている
B:ほぼ溶解:少量の塗膜残り(スカム)が観察される
C:部分的に溶解:多量(塗膜面積の20%以上)のスカムが観察される
D:不溶
各硬化性組成物のPGMEA溶液(硬化性分岐状オルガノポリシロキサン濃度:20質量%)を用い、上記と同様の手法により硬化性組成物の塗膜を形成した。この塗膜に対し、高エネルギー線を照射(365nmのLED光、光量:500mJ/cm2)を行い、その後150℃にて2分間加熱し硬化塗膜を得た。以下の基準で高エネルギー線硬化性を判定した。
A:硬化塗膜が、上記TMAH溶解試験にて不溶
B:硬化塗膜のエッジ部分のみ(硬化膜の全面積の5%未満)が、上記TMAH溶解試験にて溶解
C:硬化塗膜の半分程度まで(硬化膜の全面積の約5-50%)が、上記TMAH溶解試験にて溶解
D:硬化塗膜が、上記TMAH溶解試験にて完全溶解またはほぼ溶解
温度計及び窒素導入管を備えた200mLの三口フラスコに、3-グリシジルオキシプロピル(ジメトキシ)メチルシラン 25.0 g、フェニルトリメトキシシラン 67.5 g、トルエン100.0 g、水 50.0 gおよび水酸化セシウム50%水溶液 1.4 gを加えて80℃で2時間攪拌した。トルエンによる共沸脱水および脱メタノール化を行い、固形分78%まで濃縮し、115 ℃でさらに6時間攪拌した。その後、室温まで放置して、アルカリ吸着剤(キョーワード(登録商標)KW-700PL) 11.6 gを加えて、室温で30分攪拌後し、固形分をろ過し、固形分濃度78%のエポキシ官能性分岐状ポリシロキサン(A-1)の溶液を得た。29Si-NMRの測定結果から、得られたポリシロキサンにおけるエポキシ官能性D構造単位及びフェニル官能性T構造単位の比率は24:76であった。ゲルパーミエーションクロマトグラムの解析結果から、(A-1)の数平均分子量(Mn)、重量平均分子量(Mw)、および多分散性(PDI)は、それぞれ2400、5600及び2.33であった。これらの分析結果から、エポキシ官能性分岐状ポリシロキサン一分子あたり、平均4個のエポキシ基を有することが示唆された。
フェニルトリメトキシシラン 67.5 gの代わりにヘキシルトリメトキシシラン 70.2 gを用いた以外は合成例1と同様に反応を行い、固形分濃度92%のエポキシ官能性分岐状ポリシロキサン(A-2)の溶液を得た。29Si-NMRの測定結果から、得られたポリシロキサンにおけるエポキシ官能性D構造単位及びフェニル官能性T構造単位の比率は25:75であった。ゲルパーミエーションクロマトグラムの解析結果から、(A-2)のMn、Mw、およびPDIは、それぞれ1400、3600及び2.57であった。これらの分析結果から、エポキシ官能性分岐状ポリシロキサン一分子あたり、平均2.5個のエポキシ基を有することが示唆された。
3-グリシジルオキシプロピル(ジメトキシ)メチルシラン 25.0 gの代わりに3-グリシジルオキシプロピルトリメトキシシラン 30.0 gを用い、フェニルトリメトキシシランの量を75.0gとし、水の量を37.0gとし、水酸化セシウム50%水溶液の量を1.6 gとした以外は合成例1と同様に反応を行い、固形分濃度78%のエポキシ官能性分岐状ポリシロキサン(A-3)の溶液を得た。29Si-NMRの測定結果から、得られたポリシロキサンにおけるエポキシ官能性T構造単位及びフェニル官能性T構造単位の比率は25:75であった。ゲルパーミエーションクロマトグラムの解析結果から、(A-3)のMn、Mw、およびPDIは、それぞれ5000、12000及び2.40であった。これらの分析結果から、エポキシ官能性分岐状ポリシロキサン一分子あたり、平均9個のエポキシ基を有することが示唆された。
3-グリシジルオキシプロピル(ジメトキシ)メチルシランの量を24.0 gとし、トリメトキシ(メチル)シラン 13.0 g、シクロヘキシルトリメトキシシラン 46.8 g、トルエン 17.1 g、水 15.0 g、ジブチルヒドロキシトルエン 17 mg、水酸化カリウム43%水溶液 0.6gを用いた以外は合成例1と同様に反応を行い、固形分濃度39%のエポキシ官能性分岐状ポリシロキサン(A-4)の溶液を得た。29Si-NMRの測定結果から、得られたポリシロキサンにおけるエポキシ官能性D構造単位、メチル官能性T構造単位、及びシクロヘキシル官能性T構造単位の比率は24:21:55であった。
ヘキサメチルジシロキサン 20.0g、トリメトキシ(メチル)シラン 38.0 g、ポリメトキシシロキサン(三菱化学社製、MKCシリケート「MS51」) 59.0 g、トルエン 38.2 g、水 28.5 g、ジブチルヒドロキシトルエン 39 mg、トリフルオロ酢酸 0.164 gを加えて80℃で1時間攪拌した。その後、水酸化カリウム43%水溶液 0.610 g、3-グリシジルオキシプロピル(ジメトキシ)メチルシラン 76.0 g、トルエン 25.1 g、水 12.5 gを加え、合成例1と同様に反応を行い、固形分濃度39%のエポキシ官能性分岐状ポリシロキサン(A-5)の溶液を得た。29Si-NMRの測定結果から、得られたポリシロキサンにおけるM構造単位、エポキシ官能性D構造単位、メチル官能性T構造単位、及びQ構造単位の比率は16:26:20:38であった。
ヘキサメチルジシロキサン 11.0g、トリメトキシ(3,3,3-トリフルオロプロピル)シラン 33.0 g、ポリメトキシシロキサン(三菱化学社製、MKCシリケート「MS51」) 32.5 g、トルエン 20.5 g、水 15.5 g、ジブチルヒドロキシトルエン 26 mg、トリフルオロ酢酸 0.107 gを加えて80℃で1時間攪拌した。その後、水酸化カリウム43%水溶液 0.340 g、3-グリシジルオキシプロピル(ジメトキシ)メチルシラン 41.8 g、トルエン 6.77 g、水 5.11 gを加え、合成例1と同様に反応を行い、固形分濃度36%のエポキシ官能性分岐状ポリシロキサン(A-5)の溶液を得た。29Si-NMRの測定結果から、得られたポリシロキサンにおけるM構造単位、エポキシ官能性D構造単位、トリフルオロプロピル官能性T構造単位、及びQ構造単位の比率は16:29:19:36であった。
ヘキサメチルジシロキサン 10.0 g、トリメトキシ(メチル)シラン 11.0 g、トリメトキシ(3,3,3-トリフルオロプロピル)シラン 35.0 g、ポリメトキシシロキサン(三菱化学社製、MKCシリケート「MS51」) 28.0 g、トルエン 72.0 g、水 30.0 g、ジブチルヒドロキシトルエン 30 mg、トリフルオロ酢酸 0.118 gを加えて80℃で1時間攪拌した。その後、水酸化カリウム43%水溶液 0.370 g、3-グリシジルオキシプロピル(ジメトキシ)メチルシラン 44.0 g、トルエン 7.21 g、水 5.40 gを加え、合成例1と同様に反応を行い、固形分濃度44%のエポキシ官能性分岐状ポリシロキサン(A-5)の溶液を得た。29Si-NMRの測定結果から、得られたポリシロキサンにおけるM構造単位、エポキシ官能性D構造単位、メチル官能性T構造単位、トリフルオロプロピル官能性T構造単位、及びQ構造単位の比率は13:26:10:20:31であった。
温度計及び窒素導入管を備えた200mLの三口フラスコに、(A-1)溶液 31.8 g、アクリル酸 3.6 g、ジブチルヒドロキシトルエン 11.7 mg、および1,1,3,3-テトラメチルグアニジン 86.0 mgを加えた後、90℃で24時間攪拌した。その後、反応溶液を室温まで放置し、炭酸水素ナトリウム水溶液にて中和し、水で3回洗浄した。次にプロピレングリコールメチルエーテルアセテート(PGMEA)を加え、溶媒置換を行い、固形分濃度50%のアクリロキシ官能性分岐状ポリシロキサン(B-1)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよび水酸基官能性D構造単位及びフェニル官能性T構造単位の比率は24:76であることを確認した。
(A-1)溶液 31.8 gの代わりに(A-2)溶液 32.0 gを用い、アクリル酸の量を 2.0 gとし、ジブチルヒドロキシトルエンの量を 4.7 mgとし、および1,1,3,3-テトラメチルグアニジンの量を 48.0 mgとした以外は合成例4と同様に反応を行い、固形分濃度50%のアクリロキシ官能性分岐状ポリシロキサン(B-2)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよび水酸基官能性D構造単位、エポキシ官能性D構造単位、及びヘキシル官能性T構造単位の比率は23:2:75であることを確認した。
(A-1)溶液 31.8 gの代わりに(A-3)溶液 44.2 gを用い、アクリル酸の量を5.4 gとし、ジブチルヒドロキシトルエンの量を12.0 mgとし、および1,1,3,3-テトラメチルグアニジンの量を146 mgとした以外は合成例4と同様に反応を行い、固形分濃度50%のアクリロキシ官能性分岐状ポリシロキサン(B-3)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよび水酸基官能性T構造単位、エポキシ官能性T構造単位、及びフェニル官能性T構造単位の比率は24:1:75であることを確認した。
(A-1)溶液 31.8 gの代わりに(A-4)溶液 121 gを用い、アクリル酸の量を7.1 gとし、ジブチルヒドロキシトルエンの量を10.0 mgとし、1,1,3,3-テトラメチルグアニジンの量を1.72 gとして合成例8と同様に反応を行った。ただし、反応後に中和処理、及び溶媒置換は行わずに、固形分濃度39%のアクリロキシ官能性分岐状ポリシロキサン(B-4)のトルエン溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよび水酸基官能性D構造単位、エポキシ官能性D構造単位、メチル官能性T構造単位、及びシクロヘキシル官能性T構造単位の比率は22:2:21:55であることを確認した。
(A-1)溶液 31.8 gの代わりに(A-5)溶液 120 gを用い、アクリル酸の量を10.0 gとし、ジブチルヒドロキシトルエンの量を10.0 mgとし、1,1,3,3-テトラメチルグアニジン 1.72 gの代わりにテトラブチルアンモニウムブロミド 2.04 gを用いた以外は合成例11と同様に反応を行い、固形分濃度39%のアクリロキシ官能性分岐状ポリシロキサン(B-5)のトルエン溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるM構造単位、アクリロキシおよび水酸基官能性D構造単位、エポキシ官能性D構造単位、メチル官能性T構造単位、及びQ構造単位の比率は16:25:1:20:38であることを確認した。
(A-1)溶液 31.8 gの代わりに(A-6)溶液 209 gを用い、アクリル酸の量を13.6 gとし、ジブチルヒドロキシトルエンの量を15.0 mgとし、テトラブチルアンモニウムブロミドの量を3.05 gとした以外は合成例11と同様に反応を行い、固形分濃度36%のアクリロキシ官能性分岐状ポリシロキサン(B-6)のトルエン溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるM構造単位、アクリロキシおよび水酸基官能性D構造単位、トリフルオロプロピル官能性T構造単位、及びQ構造単位の比率は16:29:19:36であることを確認した。
(A-1)溶液 31.8 gの代わりに(A-7)溶液 192 gを用い、アクリル酸の量を14.6 gとし、ジブチルヒドロキシトルエンの量を17.0 mgとし、テトラブチルアンモニウムブロミドの量を3.16 gとした以外は合成例11と同様に反応を行い、固形分濃度44%のアクリロキシ官能性分岐状ポリシロキサン(B-7)のトルエン溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるM構造単位、アクリロキシおよび水酸基官能性D構造単位、メチル官能性T構造単位、トリフルオロプロピル官能性T構造単位、及びQ構造単位の比率は13:26:10:20:31であることを確認した。
攪拌機、温度計、窒素導入管及び還流管を備えた200mLのセパラブルフラスコに、アクリロキシ官能性分岐状ポリシロキサン(B-1)のPGMEA溶液37.55g、無水コハク酸1.9 g、および1,1,3,3-テトラメチルグアニジン 31.8 mgを加えた後、70℃で3時間攪拌した。その後、反応溶液を室温まで放置し、アルカリ吸着剤(キョーワード(登録商標)KW-700PL) 1.0 gを加えて30分攪拌した。得られた溶液をろ過し、固形分濃度を46%に調製し、アクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-1)の溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよびカルボキシル官能性D構造単位、アクリロキシおよび水酸基官能性D構造単位、及びフェニル官能性T構造単位の比率は22:2:76であることを確認した。また(C-1)の屈折率は1.536であった。
(B-1)のPGMEA溶液の量を34.79gとし、無水コハク酸1.9 gの代わりに無水フタル酸1.9 gを用い、攪拌時間を7時間とした以外は合成例7と同様に反応を行い、固形分濃度46%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-2)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよびカルボキシル官能性D構造単位、アクリロキシおよび水酸基官能性D構造単位、及びフェニル官能性T構造単位の比率は23:1:76であることを確認した。また(C-2)の屈折率は1.542であった。
(B-1)のPGMEA溶液の量を38.78gとし、無水コハク酸1.9 gの代わりに4-ニトロフタル酸無水物4.06 gを用い、攪拌時間を7時間とした以外は合成例7と同様に反応を行い、固形分濃度46%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-3)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよびカルボキシル官能性D構造単位、アクリロキシおよび水酸基官能性D構造単位、及びフェニル官能性T構造単位の比率は20:4:76であることを確認した。また(C-3)の屈折率は1.560であった。
(B-1)のPGMEA溶液の量を46.60gとし、無水コハク酸1.9 gの代わりにチオジグリコール酸無水物4.36 gを用い、1,1,3,3-テトラメチルグアニジンの量を57.0 mgとした以外は合成例7と同様に反応を行い、固形分濃度46%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-4)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよびカルボキシル官能性D構造単位及びフェニル官能性T構造単位の比率は24:76であることを確認した。また(C-4)の屈折率は1.554であった。
(B-1)のPGMEA溶液37.55gの代わりに、(B-2)のPGMEA溶液41.61gを用い、無水コハク酸の量を2.3 gとし、1,1,3,3-テトラメチルグアニジンの量を40.1 mgとした以外は合成例7と同様に反応を行い、固形分濃度46%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-5)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよびカルボキシル官能性D構造単位、エポキシ官能性D構造単位、及びヘキシル官能性T構造単位の比率は23:2:75であることを確認した。また(C-5)の屈折率は1.463であった。
(B-1)のPGMEA溶液37.55gの代わりに、(B-3)のPGMEA溶液40.8gを用い、無水コハク酸の量を2.7 gとし、1,1,3,3-テトラメチルグアニジンの量を46 mgとし、攪拌時間を21時間とした以外は合成例7と同様に反応を行い、固形分濃度46%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-6)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよびカルボキシル官能性T構造単位、エポキシ官能性T構造単位、及びフェニル官能性T構造単位の比率は24:1:75であることを確認した。また(C-6)の屈折率は1.531であった。
(B-1)のPGMEA溶液 37.55gの代わりに、(B-4)のトルエン溶液 121 gを用い、無水コハク酸の量を4.3 gとし、攪拌時間を7時間とした以外は合成例15と同様に反応を行った。反応終了後、PGMEAを加え、溶媒置換を行うことで、固形分濃度30%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-7)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるアクリロキシおよびカルボキシル官能性D構造単位、アクリロキシおよび水酸基官能性D構造単位、エポキシ官能性D構造単位、メチル官能性T構造単位、及びシクロヘキシル官能性T構造単位の比率は18:4:2:21:55であることを確認した。また(C-7)の屈折率は1.478であった。ゲルパーミエーションクロマトグラムの解析結果から、(C-7)のMn、Mw、およびPDIは、それぞれ1060、1540及び1.46あった。これらの分析結果から、アクリロキシおよびカルボキシル官能性分岐状ポリシロキサン一分子あたり、平均2個のアクリロキシ基および平均1個のカルボキシル基を有することが示唆された。
(B-1)のPGMEA溶液37.55gの代わりに、(B-5)のトルエン溶液 120 gを用い、無水コハク酸の量を4.6 gとし、攪拌時間を7時間とした以外は合成例15と同様に反応を行った。ただし反応終了後の中和処理は行わず、PGMEAを加えて溶媒置換のみを行うことにより、固形分濃度30%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-8)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるM単位、アクリロキシおよびカルボキシル官能性D構造単位、アクリロキシおよび水酸基官能性D構造単位、エポキシ官能性D構造単位、メチル官能性T構造単位、及びQ構造単位の比率は16:16:9:1:20:38であることを確認した。また(C-8)の屈折率は1.461であった。ゲルパーミエーションクロマトグラムの解析結果から、(C-8)のMn、Mw、およびPDIは、それぞれ7610、34700及び4.55であった。これらの分析結果から、アクリロキシおよびカルボキシル官能性分岐状ポリシロキサン一分子あたり、平均14個のアクリロキシ基および平均9個のカルボキシル基を有することが示唆された。
(B-1)のPGMEA溶液37.55gの代わりに、(B-6)のトルエン溶液 209gを用い、無水コハク酸の量を5.98 gとし、攪拌時間を5時間とした以外は合成例22と同様に反応を行った。ただし反応終了後の中和処理は行わず、PGMEAを加えて溶媒置換のみを行うことにより、固形分濃度30%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-9)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるM構造単位、アクリロキシおよびカルボキシル官能性D構造単位、アクリロキシおよび水酸基官能性D構造単位、トリフルオロプロピル官能性T構造単位、及びQ構造単位の比率は16:19:10:19:36であることを確認した。また(C-9)の屈折率は1.450であった。ゲルパーミエーションクロマトグラムの解析結果から、(C-9)のMn、Mw、およびPDIは、それぞれ4670、6410、及び1.37であった。これらの分析結果から、アクリロキシおよびカルボキシル官能性分岐状ポリシロキサン一分子あたり、平均9個のアクリロキシ基および平均6個のカルボキシル基を有することが示唆された。
(B-1)のPGMEA溶液37.55gの代わりに、(B-7)のトルエン溶液 192 gを用い、無水コハク酸の量を8.0 gとし、攪拌時間を5時間とした以外は合成例22と同様に反応を行った。ただし反応終了後の中和処理は行わず、PGMEAを加えて溶媒置換のみを行うことにより、固形分濃度27%のアクリロキシおよびカルボキシル官能性分岐状ポリシロキサン(C-10)のPGMEA溶液を得た。生成物の13C-NMR測定結果から、得られたポリシロキサンにおけるM構造単位、アクリロキシおよびカルボキシル官能性D構造単位、アクリロキシおよび水酸基官能性D構造単位、メチル官能性T構造単位、トリフルオロプロピル官能性T構造単位、及びQ構造単位の比率は13:21:5:10:20:31であることを確認した。また(C-10)の屈折率は1.450であった。ゲルパーミエーションクロマトグラムの解析結果から、(C-10)のMn、Mw、およびPDIは、それぞれ5040、7890及び1.57であった。これらの分析結果から、アクリロキシおよびカルボキシル官能性分岐状ポリシロキサン一分子あたり、平均9個のアクリロキシ基および平均7個のカルボキシル基を有することが示唆された。
下記の官能性ポリシロキサン溶液および硬化触媒を用い、表1に示す組成(質量部;ポリシロキサンは固形分換算)で混合し、次いで全体の固形分濃度が20質量%になるようにPGMEAで希釈した後、孔径0.2μmのメンブランフィルターで濾過し、各紫外線硬化性組成物を調製した。
紫外線硬化性ポリシロキサン
(A-1)上記合成例で得られた官能性ポリシロキサン溶液を溶媒置換することにより得られた官能性ポリシロキサン溶液のPGMEA溶液
(C-1)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-2)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-3)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-4)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-5)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-6)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-7)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-8)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-9)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
(C-10)上記合成例で得られた官能性ポリシロキサンのPGMEA溶液
硬化触媒
(D-1)IGM Resin社製 Omnirad (登録商標)819
(D-2)BASF社製 Irgacure(登録商標) OXE-02
(D-3)IGM Resin社製 Omnirad (登録商標) TPO-L
実施例1の硬化性組成物を直径50mmのテフロン(登録商標)カップ中に注ぎ、室温で16時間、続いて50℃で5時間、さらに90℃で12時間乾燥させることにより、厚さ100μmの透明なオルガノポリシロキサンフィルムを形成した。このフィルム試験片に紫外線照射(365nmのLED光、2000mJ/cm2)を行い、さらにオーブン中で150℃、30分間加熱して、完全に硬化した塗膜を得た。
硬化物両面に微量のシリコーンオイルを塗り、直径33mm、厚さ0.007mmの錫箔を圧着した。直径30mmの平行板電極を接続したキーサイトテクノロジー製E4990Aプレシジョンインピーダンス・アナライザにて室温、100KHzにおける静電容量を測定した。測定した静電容測定した硬化物の厚さ、及び電極面積の値を用いて、比誘電率を算出したところ、2.9であった。
Claims (17)
- ケイ素原子上に結合し、親水性基および紫外線硬化性基の両者を有する一価の官能基を一分子中に1個以上有し、かつ、オルガノポリシロキサン全体としてアルカリ水溶液に対する可溶性を有する、紫外線硬化性オルガノポリシロキサン。
- 下記繰り返し単位(1)および(2)から選ばれる一種以上のシロキサン単位を一分子中に1個以上有する請求項1に記載の紫外線硬化性オルガノポリシロキサン。
(R1RSiO2/2) (1)
(A3SiO1/2) (2)
(式中、R1は、親水性基および紫外線硬化性基の両者を有する一価の官能基であり、Rは非置換又はフッ素で置換された一価炭化水素基、アルコキシ基、および水酸基から選ばれる基であり、AはR1またはRであり、Aは少なくとも1個のR1を含む) - シロキサン単位(1)を一分子中に1個以上有する、請求項1または2に記載の紫外線硬化性オルガノポリシロキサン。
- 下記シロキサン単位(3)をさらに含む、請求項1~3のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。
(R2RSiO2/2) (3)
(式中、R2は、紫外線硬化性基を有し、親水性基を有さない一価の官能基であり、Rは前記の基である) - 前記の親水性基がカルボキシル基、水酸基、フェノール性水酸基、ポリエーテル基から選ばれる基である、請求項1~4のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。
- 前記の紫外線硬化性基がエポキシ基、オキセタン基、ビニルエーテル基、(メタ)アクリロキシ基から選ばれる基である、請求項1~5のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。
- 平均単位式:
(B3SiO1/2)a(R1RSiO2/2)b1(R2RSiO2/2)b2(RSiO3/2)c(SiO4/2)d (4)
(式中、R1,R2,Rは、それぞれ独立に、前記同様の基であり、
Bはそれぞれ独立に、R1,R2、およびRから選ばれる基であり、
aは0又は正数であり、b1は1~100の範囲内の数であり、b2は0~50の範囲内の数であり、(c+d)は正数である)
で表される分岐状オルガノポリシロキサンである、請求項1~6のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。 - 平均単位式(4)における(b1+b2)/(a+b1+b2+c+d)の値が0.1以上0.5以下である、請求項7に記載の紫外線硬化性オルガノポリシロキサン。
- 分子内に下記シロキサン単位(5)を1個以上含む、請求項1~8のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。
(RSiO3/2) (5)
(式中、Rは、前記同様の基である) - 前記R1が下記式(6)で表される基である、請求項2~9のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。
{式中、R4は炭素数2から10の鎖状二価炭化水素基であり、
R5は炭素数3から10の鎖状、環状、もしくはその組み合わせである三価炭化水素基であり、
Xは酸素原子、硫黄原子、または―NR7-(式中、R7は、水素原子または炭素原子数1から3の一価炭化水素基である)であり、
nは0または1であり、
Yは一価の紫外線硬化性基を含む基であり、
Zは水酸基、水酸基含有基または―O(C=O)-R6-CO2H(式中、R6は、任意で酸素原子または硫黄原子を含有してもよい、炭素原子数2から12の直鎖、分岐、または環状二価炭化水素基である)で表される一価の親水性基であり、
*はオルガノポリシロキサン上のケイ素原子への結合部位である} - 親水性基がカルボキシル基であり、紫外線硬化性基が(メタ)アクリロキシ基である、請求項1~10のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。
- オルガノポリシロキサンを塗布後の厚さが4μmとなるようにガラス板上に塗布した後、当該塗膜をテトラメチルアンモニウムヒドロキシド(TMAH)の2.38質量%水溶液に1分間浸漬後に水洗した場合、当該オルガノポリシロキサンからなる塗膜の質量減少率が90質量%以上となる、アルカリ水溶液に対する可溶性を有する、請求項1~11のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン。
- (A)請求項1~12のいずれか1項に記載の紫外線硬化性オルガノポリシロキサン、
(B)光重合開始剤 (A)成分100質量部に対し0.1~10質量部となる量、および
(C)有機溶媒
を含有してなる紫外線硬化性組成物。 - 請求項13に記載の紫外線硬化性組成物を含む絶縁性コーティング剤。
- 請求項13に記載の紫外線硬化性組成物の硬化物。
- 請求項13に記載の紫外線硬化性組成物の硬化物を絶縁性コーティング層として使用する方法。
- 請求項13に記載の紫外線硬化性組成物の硬化物からなる層を含む表示装置。
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63135426A (ja) * | 1986-11-27 | 1988-06-07 | Toray Silicone Co Ltd | アクリロキシ基含有オルガノポリシロキサン、その製造方法およびその用途 |
JPH07149905A (ja) * | 1993-11-26 | 1995-06-13 | Toray Dow Corning Silicone Co Ltd | オルガノポリシロキサンおよびその製造方法 |
US5824762A (en) * | 1994-11-28 | 1998-10-20 | Dow Corning Toray Silicone Co., Ltd. | Organopolysiloxane and method for the preparation of the same |
JP2007226115A (ja) * | 2006-02-27 | 2007-09-06 | Fujifilm Corp | 感光性組成物及び感光性フィルム、並びに永久パターン形成方法 |
JP2011209442A (ja) * | 2010-03-29 | 2011-10-20 | Nippon Steel Chem Co Ltd | 環状シリコーン樹脂を含んだ感光性アルカリ可溶性樹脂組成物及びこれを用いた硬化物 |
JP2013140229A (ja) | 2011-12-28 | 2013-07-18 | Jsr Corp | タッチパネル、タッチパネルの製造方法、感放射線性組成物およびタッチパネル用硬化膜 |
WO2014046210A1 (ja) * | 2012-09-24 | 2014-03-27 | 旭硝子株式会社 | 部分加水分解縮合物およびこれを用いた撥インク剤 |
JP2014237771A (ja) * | 2013-06-07 | 2014-12-18 | 旭化成イーマテリアルズ株式会社 | シリコーン重合体 |
JP2018123234A (ja) | 2017-01-31 | 2018-08-09 | 東京応化工業株式会社 | 重合性組成物、硬化膜の製造方法、及び硬化膜 |
JP2020184010A (ja) | 2019-05-07 | 2020-11-12 | Jsr株式会社 | 感放射線性組成物、表示装置用絶縁膜、表示装置、表示装置用絶縁膜の形成方法、及びシルセスキオキサン |
JP2021061056A (ja) | 2014-09-30 | 2021-04-15 | 日鉄ケミカル&マテリアル株式会社 | タッチパネル用感光性樹脂組成物およびその硬化膜、ならびに当該硬化膜を有するタッチパネル |
-
2022
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- 2022-10-27 CN CN202280076909.8A patent/CN118401589A/zh active Pending
- 2022-10-27 KR KR1020247016614A patent/KR20240093793A/ko unknown
- 2022-10-27 EP EP22887129.9A patent/EP4424750A1/en active Pending
- 2022-10-28 TW TW111141104A patent/TW202334317A/zh unknown
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63135426A (ja) * | 1986-11-27 | 1988-06-07 | Toray Silicone Co Ltd | アクリロキシ基含有オルガノポリシロキサン、その製造方法およびその用途 |
JPH07149905A (ja) * | 1993-11-26 | 1995-06-13 | Toray Dow Corning Silicone Co Ltd | オルガノポリシロキサンおよびその製造方法 |
US5824762A (en) * | 1994-11-28 | 1998-10-20 | Dow Corning Toray Silicone Co., Ltd. | Organopolysiloxane and method for the preparation of the same |
JP2007226115A (ja) * | 2006-02-27 | 2007-09-06 | Fujifilm Corp | 感光性組成物及び感光性フィルム、並びに永久パターン形成方法 |
JP2011209442A (ja) * | 2010-03-29 | 2011-10-20 | Nippon Steel Chem Co Ltd | 環状シリコーン樹脂を含んだ感光性アルカリ可溶性樹脂組成物及びこれを用いた硬化物 |
JP2013140229A (ja) | 2011-12-28 | 2013-07-18 | Jsr Corp | タッチパネル、タッチパネルの製造方法、感放射線性組成物およびタッチパネル用硬化膜 |
WO2014046210A1 (ja) * | 2012-09-24 | 2014-03-27 | 旭硝子株式会社 | 部分加水分解縮合物およびこれを用いた撥インク剤 |
JP2014237771A (ja) * | 2013-06-07 | 2014-12-18 | 旭化成イーマテリアルズ株式会社 | シリコーン重合体 |
JP2021061056A (ja) | 2014-09-30 | 2021-04-15 | 日鉄ケミカル&マテリアル株式会社 | タッチパネル用感光性樹脂組成物およびその硬化膜、ならびに当該硬化膜を有するタッチパネル |
JP2018123234A (ja) | 2017-01-31 | 2018-08-09 | 東京応化工業株式会社 | 重合性組成物、硬化膜の製造方法、及び硬化膜 |
JP2020184010A (ja) | 2019-05-07 | 2020-11-12 | Jsr株式会社 | 感放射線性組成物、表示装置用絶縁膜、表示装置、表示装置用絶縁膜の形成方法、及びシルセスキオキサン |
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WO2024101193A1 (ja) * | 2022-11-09 | 2024-05-16 | ダウ・東レ株式会社 | アルカリ可溶性の紫外線硬化性ケイ素含有直鎖状重合体、それを含む紫外線硬化性組成物およびその用途 |
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