WO2023019590A1 - 涂覆显影设备 - Google Patents

涂覆显影设备 Download PDF

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Publication number
WO2023019590A1
WO2023019590A1 PCT/CN2021/113899 CN2021113899W WO2023019590A1 WO 2023019590 A1 WO2023019590 A1 WO 2023019590A1 CN 2021113899 W CN2021113899 W CN 2021113899W WO 2023019590 A1 WO2023019590 A1 WO 2023019590A1
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WO
WIPO (PCT)
Prior art keywords
coating
unit
substrate
developing
module
Prior art date
Application number
PCT/CN2021/113899
Other languages
English (en)
French (fr)
Inventor
李康植
吴均
王晖
程成
郑敦宇
孙永成
王文军
邵乾
王俊
王德云
金泳律
Original Assignee
盛美半导体设备(上海)股份有限公司
盛美半导体设备韩国有限公司
清芯科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 盛美半导体设备(上海)股份有限公司, 盛美半导体设备韩国有限公司, 清芯科技有限公司 filed Critical 盛美半导体设备(上海)股份有限公司
Priority to JP2024510522A priority Critical patent/JP2024529766A/ja
Priority to PCT/CN2021/113899 priority patent/WO2023019590A1/zh
Priority to KR1020247009092A priority patent/KR20240044511A/ko
Priority to EP21953831.1A priority patent/EP4391017A1/en
Publication of WO2023019590A1 publication Critical patent/WO2023019590A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Definitions

  • the invention relates to the field of semiconductor manufacturing equipment, in particular to coating and developing equipment.
  • the inline machine for realizing the photolithography process is composed of a rubber developing machine and an exposure machine.
  • the general process of the photolithography process is: after the substrate is processed by the glue-coating and developing machine, it is sent to the exposure machine for exposure treatment, and the exposed substrate is returned to the glue-coating and developing machine to complete the developing process.
  • the traditional gumming and developing machine includes a carrier block, a processing block and an interface block sequentially connected in series.
  • the processing block includes a four-layer coating unit block arranged in a stack, and a developing unit block stacked on the four-layer coating unit block.
  • a manipulator that moves horizontally in its central handling area is arranged in the unit block of each floor.
  • FFU fan filter unit
  • the manipulators in the unit blocks of each layer are busy transferring substrates between processing modules (such as coating modules, developing modules, or heat treatment modules) in the unit block, as well as transferring substrates between the carrier block and the interface block. , which will cause the process robot to be very busy, which will inhibit the operating efficiency of the equipment to a certain extent.
  • processing modules such as coating modules, developing modules, or heat treatment modules
  • the coating and developing equipment and substrate transmission method thereof proposed by the invention can reduce the risk of substrate particle contamination and improve the overall operating efficiency of the equipment.
  • the coating and developing equipment provided by the present invention includes sequentially connected equipment front-end modules, process stations and interface stations, wherein the process stations include:
  • a coating unit comprising at least one row of vertically stacked coating modules for coating the substrate
  • a developing unit comprising at least one row of vertically stacked developing modules, for developing the substrate
  • the substrate is carried into the mobile transmission part by the at least one side manipulator, and is transported to the interface station by the mobile transmission part; after the substrate is processed by the developing unit, the substrate is carried by the at least one side manipulator Carry the substrate into the mobile transmission part, and transfer it to the front-end module of the equipment by the mobile transmission part.
  • the coating modules in the coating unit adopt a vertical layout, which enables the multi-layer coating modules to share the same coating manipulator, which can reduce the number of FFUs installed in the coating unit and make the process environment control easier.
  • the developing unit can use a small number of FFUs to ensure the cleanliness of the internal environment of the entire unit.
  • the effective cooperation of the horizontally moving mobile transfer unit and the vertically moving side manipulator enables the substrates after the coating or developing unit to be processed to be quickly transferred to the interface station or the front-end module of the equipment, which can improve the operating efficiency of the equipment.
  • the coating unit further includes at least one column of vertically stacked heat treatment modules, located opposite to the coating module, for heating and cooling the substrate before and after the coating treatment;
  • the developing unit also includes at least one row of vertically stacked heat treatment modules, located opposite to the developing modules, for heating and cooling the substrate before and after the development treatment.
  • the at least one moving transport part is located on the top or bottom of the coating unit and the developing unit.
  • the coating unit further includes at least one coating robot for transferring the substrate between the coating module and the heat treatment module of the coating unit;
  • the developing unit further includes at least one developing robot for transferring the substrate between the developing module and the heat treatment module of the developing unit.
  • Multiple rows of vertically stacked coating modules in the coating unit can share the same coating manipulator, so only one fan filter unit (FFU) needs to be configured in the coating unit to ensure a clean process atmosphere and reduce the generation of particles from the environment on the substrate pollute.
  • the developing unit can also clean its internal environment and reduce particle pollution by configuring only one FFU. Therefore, the vertical layout of the coating module and the developing module can make the control of the coating or developing process environment easier.
  • the at least one moving transport part is located between the top and the bottom of the coating unit and the developing unit.
  • the coating unit includes at least one coating manipulator arranged on the upper and lower sides of the mobile transmission part between the top and bottom of the coating unit and the developing unit, for Transfer of substrates between the coating module and the thermal treatment module;
  • the developing unit includes at least one developing manipulator arranged on the upper and lower sides of the moving transfer part between the top and bottom of the coating unit and the developing unit, for transferring the substrate between the developing module and the heat treatment module of the developing unit.
  • the horizontally arranged mobile transmitting part divides the internal space of the coating unit and the developing unit into several relatively independent subspaces, for example, in the coating unit
  • the pair of moving transmission parts arranged horizontally will separate the coating unit and the developing unit into relatively independent upper space and lower space.
  • the upper space and the lower space Each space is equipped with a coating manipulator and a developing manipulator.
  • each of the upper space and the lower space is equipped with an FFU to realize the control of the internal environment of each unit.
  • At least one of the side manipulators is arranged between the coating unit and the developing unit, and is used to move the substrate after the coating unit has finished processing into the moving transport part, or to transfer the substrate after the processing in the developing unit The processed substrate is carried into the mobile transfer unit.
  • the process station includes at least two side manipulators, and at least one of the at least two side manipulators is arranged between the coating unit and the front-end module of the equipment for Carry the substrates after the coating unit has finished processing into the mobile transfer section, or move the substrates after the developing unit has completed the processing out of the mobile transfer section;
  • At least one side manipulator among the at least two side manipulators is arranged between the developing unit and the interface station, and is used to move the substrate after the developing unit has finished processing into the mobile transport part, or to finish the processing in the coating unit Subsequent substrates are unloaded from the moving transfer unit.
  • the side manipulators are arranged on both sides of the process station, and the side manipulators between the coating unit and the developing unit are eliminated.
  • the length of the equipment can be shortened, and the equipment occupies an area. Efficiency, thereby improving the operating efficiency of the entire equipment.
  • the process station includes at least three side manipulators, wherein at least one of the at least three side manipulators is arranged between the coating unit and the front-end module of the equipment, It is used to carry out the substrate after the development unit has finished processing from the mobile transfer part;
  • At least one side manipulator among the at least three side manipulators is arranged between the coating unit and the developing unit, and is used to move the substrate after the coating unit has finished processing into the moving transport part, or to finish the processing in the developing unit Subsequent substrates are moved into the mobile transmission department;
  • At least one side robot among the at least three side robots is disposed between the developing unit and the interface station, and is used to carry out the substrate after the coating unit finishes processing from the moving transfer unit.
  • the front-end module of the equipment includes a manipulator at the front-end of the equipment, and the manipulator at the front-end of the equipment moves the substrate processed by the developing unit out of the moving transmission part;
  • the interface station includes an interface manipulator, and the interface manipulator carries out the substrates processed in the coating unit from the mobile transfer unit.
  • the present invention also proposes a substrate transfer method for coating and developing equipment, using the above coating and developing equipment, wherein,
  • the front-end manipulator of the equipment is installed in the front-end module of the equipment, and the manipulator of the front-end of the equipment moves the substrate from the front-end module of the equipment to the process station;
  • the coating unit of the process station is equipped with a coating robot, which sends the substrate into the coating unit, and the substrate is coated and heat-treated in the coating unit;
  • the coating manipulator moves the substrate out of the coating unit after the coating unit has finished processing
  • the side manipulator moves the substrate out of the coating unit into the mobile transmission part
  • the mobile transfer unit transfers the substrates processed by the coating unit to the interface station;
  • the interface station is equipped with an interface manipulator.
  • the interface manipulator will move the substrate out of the mobile transmission part after the coating unit is processed and move it into the interface station.
  • the substrate is moved into the interface station by the interface manipulator;
  • the interface manipulator removes the exposed substrate from the interface station and transfers it to the process station;
  • a developing manipulator is installed in the developing unit of the process station, and the developing manipulator sends the substrate into the developing unit, and the substrate is developed and heat-treated in the developing unit;
  • the substrate is carried out of the development unit by the development robot;
  • the side manipulator moves the substrate out of the developing unit into the mobile transmission part
  • the mobile transfer unit transfers the substrate processed by the developing unit to the front-end module of the equipment;
  • the robot at the front end of the equipment will carry out the substrate from the mobile transmission part after the development unit has completed processing and move it into the front-end module of the equipment, or the robot on the other side will carry out the substrate from the mobile transmission part after the development unit has completed processing, and then the front-end robot will carry the substrate into the module.
  • Device front-end module
  • Fig. 1 shows the front perspective view of the coating development equipment of embodiment one
  • Fig. 2 shows the back perspective view of the coating development equipment of embodiment one
  • Fig. 3 shows a cross-sectional view of the coating development device of Embodiment 1;
  • Fig. 4 shows a longitudinal sectional view of the coating development equipment of embodiment one
  • Figure 5 shows another cross-sectional view of the coating and developing device of Embodiment 1;
  • Fig. 6 shows another longitudinal sectional view of the coating developing device of embodiment one
  • Fig. 7 shows another longitudinal sectional view of the coating development equipment of embodiment one
  • Fig. 8a shows the conveyance path of the substrate in the coating and developing equipment before the exposure treatment in the first embodiment
  • Fig. 8b shows the conveyance path of the substrate in the coating and developing equipment after the exposure treatment in the first embodiment
  • Figure 9 shows a cross-sectional view of the coating and developing device of Embodiment 2.
  • Fig. 10 shows a longitudinal sectional view of the coating development equipment of embodiment two
  • Fig. 11 shows another cross-sectional view of the coating and developing device of embodiment two;
  • Figure 12a shows the transport path of the substrate in the coating and developing equipment before the exposure treatment of the second embodiment
  • Fig. 12b shows the transport path of the substrate in the coating and developing equipment after the exposure treatment of the second embodiment
  • Fig. 13 shows a cross-sectional view of the coating and developing device of embodiment three
  • Fig. 14 shows a longitudinal sectional view of the coating development equipment of embodiment three
  • Fig. 15 shows another cross-sectional view of the coating and developing device of the third embodiment
  • Figure 16a shows the transport path of the substrate in the coating and developing equipment before the exposure treatment of the third embodiment
  • Figure 16b shows the transport path of the substrate in the coating and developing equipment after the exposure treatment of the third embodiment
  • Fig. 17 shows a cross-sectional view of the coating and developing device of embodiment four
  • Fig. 18 shows another cross-sectional view of the coating and developing device of embodiment four;
  • Fig. 19 shows the perspective view of the hidden coating and developing module of the process station in the coating and developing equipment of the fourth embodiment
  • Fig. 20a shows the transport path of the substrate in the coating and developing equipment before the exposure treatment of the fourth embodiment
  • Figure 20b shows the transport path of the substrate in the coating and developing equipment after the exposure treatment of the fourth embodiment
  • Figure 21 shows a cross-sectional view of the coating and developing device of Embodiment five
  • Fig. 22 shows another cross-sectional view of the coating and developing device of the fifth embodiment
  • Fig. 23a shows the conveyance path of the substrate in the coating and developing equipment before the exposure treatment in Embodiment 5;
  • Fig. 23b shows the transport path of the substrate in the coating and developing equipment after the exposure treatment of the fifth embodiment
  • Fig. 24 shows a longitudinal sectional view of the coating and developing device of embodiment six
  • Figure 25a to Figure 25c show the longitudinal layout diagrams of the coating module and the heating module in the coating unit.
  • 26a to 26c are schematic diagrams showing the longitudinal layout of the developing module and the heating module in the developing unit.
  • the coating and developing equipment proposed by the present invention includes an equipment front-end module (EFEM), a process station, and an interface station connected in sequence.
  • the equipment front-end module is provided with an equipment front-end manipulator (EFEM manipulator), and the interface station is provided with an interface manipulator.
  • EFEM manipulator equipment front-end manipulator
  • the process station comprises a coating unit, a developing unit, at least one laterally moving mobile transport and at least one vertically moving side robot. After the substrate is processed in the coating unit, the substrate is carried into the mobile transmission part by the side manipulator, and then transferred to the interface station; after the substrate is processed in the developing unit, the substrate is carried into the mobile transmission part by the side manipulator, and It is sent to the front-end module of the device by the mobile transmission unit.
  • the coating unit includes at least one column of vertically stacked coating modules, at least one column of vertically stacked heat treatment modules and at least one coating robot.
  • the coating module is used to coat the substrate
  • the heat treatment module is used to heat and cool the substrate before and after the coating treatment
  • the heat treatment module is located opposite the coating module
  • the coating manipulator is used for coating in the coating unit Transfer of substrates between modules and heat treatment modules.
  • the developing unit includes at least one row of vertically stacked developing modules, at least one row of vertically stacked heat treatment modules and at least one developing manipulator.
  • the developing module is used to develop the substrate, and the heat treatment module is used to heat and cool the substrate before and after the development treatment.
  • the heat treatment module is located on the opposite side of the development module, and the development manipulator is used to transfer between the development module and the heat treatment module of the development unit. substrate.
  • At least one laterally moving mobile transport is located on the top or bottom of the coating unit and the developing unit, or at least one laterally moving mobile transport is located between the top and the bottom of the coating unit and the developing unit.
  • the coating unit is arranged on both sides above and below the mobile transport part located between the top and bottom of the coating unit and the developing unit.
  • At least one coating manipulator is used to transfer the substrate between the coating module and the heat treatment module of the coating unit; the developing unit is arranged at least A development robot for transferring substrates between the development module and the heat treatment module of the development unit.
  • the side manipulator is set between the equipment front-end module and the coating unit, or between the coating unit and the developing unit, or between the developing unit and the interface station.
  • FIG. 1 to FIG. 7 show perspective views of the coating development apparatus proposed by the present invention.
  • the coating and developing equipment is mainly composed of an equipment front-end module (EFEM) 100 , a process station 200 and an interface station 300 arranged in a line.
  • Fig. 3 shows a cross-sectional view of the coating development apparatus in this embodiment.
  • the front-end module 100 has a plurality of load ports 110 for holding one or more wafer cassettes 120 containing multiple substrates.
  • An EFEM manipulator R10 is arranged in the equipment front-end module 100, which can transfer substrates between the EFEM 100 and the process station 200.
  • the interface station 300 is used to connect external equipment, such as an exposure machine, to perform exposure processing on the substrate after the coating unit 210 completes the processing.
  • An interface manipulator R30 is provided in the interface station 300 for transferring substrates between the process station 200 and the interface station 300 .
  • the process station 200 includes a coating unit 210 and a developing unit 220 arranged in a line, at least one laterally (for example, the horizontal direction in FIG. 4 ) moving transport unit 230 and at least one vertical (for example, the vertical direction in FIG. 4 ) moving side manipulator R0 .
  • the coating unit 210 is used to perform coating and heat treatment on the substrate, and includes at least one column of vertically stacked coating modules 211 , at least one column of vertically stacked heat treatment modules 212 and at least one coating robot R21 .
  • the coating module 211 and the heat treatment module 212 are arranged oppositely, and Fig. 25a to Fig. 25c show various layouts in which the coating module 211 and the heat treatment module 212 are arranged oppositely.
  • the coating module 211 is used to coat the substrate
  • the heat treatment module 212 is used to heat and cool the substrate
  • the coating manipulator R21 is used to transfer the substrate between the coating module 211 and the heat treatment module 212 of the coating unit 210 .
  • the developing unit 220 is used for developing and heat-treating the substrate, including at least one row of vertically stacked developing modules 221 , at least one row of vertically stacked heat treatment modules 222 and at least one developing robot R22 .
  • the developing module 221 and the heat treatment module 222 are arranged oppositely, and Fig. 26a to Fig. 26c show various layouts in which the developing module 221 and the heat treatment module 222 are arranged oppositely.
  • the developing module 221 is used for developing the substrate, and the heat treatment module 222 is used for heating and cooling the substrate.
  • the developing robot R22 is used to transfer the substrate between the developing module 221 and the heat treatment module 222 of the developing unit 220 .
  • the substrate is carried into the mobile transport unit 230 by the side manipulator R0, and transported to the interface station 300 by the mobile transport unit 230; in the transmission unit 230 , and transmitted to the device front-end module 100 by the mobile transmission unit 230 .
  • the mobile transfer part and the side manipulator are separately configured to be responsible for the transfer between the EFEM and the interface station. Transferring the coated or developed substrate can reduce the operating load of the manipulator inside the coating or developing unit, thereby reducing the impact of manipulator operation efficiency on the output rate of the coating and developing equipment, thereby increasing the output rate of the coating and developing equipment.
  • the coating unit 210 includes three columns of vertically stacked coating modules C1-C3, each column includes four coating modules 211, and the developing unit 220 includes three columns of vertically stacked developing modules. D1-D3, each column includes four developing modules 221 .
  • the number of columns and numbers of coating, developing and heat treatment modules in the coating and developing unit can be adjusted according to the specific process capacity and equipment size requirements.
  • the coating modules mentioned in the embodiments of the present invention include three types, which are respectively a coating module for forming a photoresist coating, a coating module for forming a top anti-reflection coating, and Coating module for forming bottom anti-reflective coating.
  • the coating unit is equipped with corresponding coating modules according to the specific process requirements.
  • the same type of coating modules configured by the coating unit can share liquid supply nozzles, or they can be equipped with liquid supply nozzles separately. Configure the liquid supply nozzle.
  • a mobile transfer part 230 of lateral movement is configured, and the mobile transfer part 230 can be connected to the linear transfer path of the EFEM 100 and the interface station 300. Move laterally.
  • the coating unit 210 is provided with two coating manipulators R21, one coating manipulator R21 is located on the upper side of the mobile transmission part 230, and is used to transfer the substrate between the coating module 211 and the heat treatment module 212 located on the upper side of the mobile transmission part 230, Another coating robot R21 is located at the lower side of the moving transfer part 230 for transferring substrates between the coating module 211 and the heat treatment module 212 located at the lower side of the moving transfer part 230 .
  • the developing unit 220 is provided with two developing manipulators R22, one developing manipulator R22 is located on the upper side of the mobile transmission part 230, and is used to transfer substrates between the developing module 221 and the heat treatment module 222 located on the upper side of the mobile transporting part 230, and the other developing manipulator R22 is located at the lower side of the moving transport part 230 and is used for transferring the substrate between the developing module 221 and the heat treatment module 222 located at the lower side of the moving transport part 230 .
  • a plurality of laterally moving mobile transmission parts can also be set between the top and bottom of the coating unit and the developing unit, and the coating unit moves between the top and the bottom of the coating unit and the developing unit.
  • At least one coating manipulator is arranged on the upper and lower sides of the transmission part, which is used to transfer the substrate between the coating module and the heat treatment module of the coating unit; the mobile transmission of the developing unit between the top and bottom of the coating unit and the developing unit At least one developing manipulator is arranged on the upper and lower sides of the part, and is used to transfer the substrate between the developing module and the heat treatment module of the developing unit.
  • the moving transmission part 230 may also be disposed on the top or bottom of the coating unit 210 and the developing unit 220, as shown in FIG. 6 and FIG. 7 respectively.
  • the coating unit 210 is configured with at least one coating manipulator, for example two, referring to Fig. 6 or Fig. 7, the interior of the coating unit 210 is divided into upper and lower Two spaces, wherein one coating manipulator R21 is used to transfer the substrate between the coating module 211 and the heat treatment module 212 located in the upper space of the coating unit 210; The substrate is transferred between the coating module 211 and the heat treatment module 212.
  • the upper space and the lower space of the coating unit 210 are respectively equipped with a fan filter unit (FFU) to ensure the process of the upper and lower spaces of the coating unit 210.
  • FFU fan filter unit
  • the coating unit 210 can also be equipped with only one coating robot arm R21, which is used to transfer substrates between all coating modules 211 and heat treatment modules 212 in the entire space of the coating unit 210.
  • the coating unit 210 only needs A fan filter unit (FFU) is configured to clean the process environment of the coating unit 210, which makes the control of the process environment of the equipment easier to operate.
  • the developing unit 220 may be configured with only one developing robot R22, or may be configured with multiple developing robots R22.
  • a side robot arm R0 is disposed between the coating unit 210 and the developing unit 220, and is used to carry the substrate after the coating unit 210 finishes processing or the developing unit 220 finishes processing the substrate into the mobile transport part 230.
  • a first buffer (241, 242) is arranged between the EFEM100 and the coating unit 210
  • a second buffer (251, 242) is arranged between the coating unit 210 and the developing unit 220.
  • a third buffer unit (261, 262) is arranged between the developing unit 220 and the interface station 300.
  • the buffer section can accommodate multiple substrates and make the substrates stay, and the side manipulator R0 can move vertically up and down along the height direction of the coating and developing equipment to access the buffer sections at different heights.
  • Fig. 8a shows the transport method of the substrate in the coating and developing equipment before the exposure treatment in the first embodiment.
  • the substrate to be processed is carried out from the equipment front-end module 100 by the EFEM manipulator R10 and carried into the first buffer unit 241, and then carried out from the first buffer unit 241 by the coating manipulator R21 and carried into the coating unit 210, and the substrate is coated in the coating unit 210.
  • coating manipulator R21 carries out coating unit 210 and carries into the second buffer section 251, and then is carried out from second buffer section 251 by side robot arm R0 and Loaded into the mobile transport unit 230, and then transported to the interface station 300 by the mobile transport unit 230, and then transported out of the mobile transport unit 230 by the interface manipulator R30 located in the interface station 300 and sent into the exposure machine for exposure processing.
  • Fig. 8b shows the transport method of the substrate in the coating and developing equipment after the exposure treatment of the first embodiment.
  • the substrate after the exposure process is received from the exposure machine by the interface robot R30 and carried into the third buffer section 262, and then carried out from the third buffer section 262 by the developing robot R22 and carried into the developing unit 220, and the substrate is developed in the developing unit 220 Processing and heat treatment, next, the processed substrate in the developing unit 220 is carried out of the developing unit 220 by the developing robot R22 and carried into the second buffer section 252, and then carried out from the second buffer section 252 by the side robot R0 and carried into the mobile transmission section In 230, it is transferred to the EFEM 100 by the mobile transfer unit 230, and then the EFEM manipulator R10 located in the EFEM 100 is carried out from the mobile transfer unit 230 and sent into the wafer cassette 120 located at the load port 110.
  • the difference between the second embodiment and the first embodiment is that: 1) two side manipulators are arranged between the coating unit 210 and the developing unit 220, namely the first side manipulator R1 and the second side manipulator R2 ; 2) a pair of mobile transmission parts are configured between the top and the bottom of the coating unit 210 and the developing unit 220, respectively the first mobile transmission part 231 and the second mobile transmission part 232, and the first side manipulator R1 is used to
  • the substrates processed in the coating unit 210 are carried into the first moving transmission part 231
  • the second side robot arm R2 is used to carry the substrates processed in the developing unit 220 into the second moving transmission part 232 .
  • Other structures of the coating and developing equipment proposed in the second embodiment are basically the same as those in the first embodiment, and will not be described below.
  • Fig. 12a shows the transport method of the substrate in the coating and developing equipment before the exposure treatment in the second embodiment.
  • the substrate to be processed is carried out from the EFEM 100 by the EFEM manipulator R10 and carried into the first buffer unit 241, and then carried out from the first buffer unit 241 by the coating manipulator R21 and carried into the coating unit 210, and the substrate is coated in the coating unit 210 and heat treatment, and then, after finishing the substrate processing in the coating unit 210, the coating manipulator R21 carries out the coating unit 210 and carries it into the second buffer section 251, and then the first side robot arm R1 carries it out from the second buffer section 251 and Loaded into the first mobile transmission part 231, then transported to the interface station 300 by the first mobile transmission part 231, and then carried out from the first mobile transmission part 231 by the interface manipulator R30 located in the interface station 300 and sent into the exposure machine Perform exposure processing.
  • Fig. 12b shows the transfer method of the substrate in the coating and developing equipment after the exposure treatment of the second embodiment.
  • the substrate after the exposure process is received from the exposure machine by the interface robot R30 and carried into the third buffer part 262, and then the substrate is carried out from the third buffer part 262 by the developing robot R22 and carried into the developing unit 220, and the substrate is processed in the developing unit 220.
  • the substrate after the processing in the developing unit 220 is carried out of the developing unit 220 by the developing manipulator R22 and carried into the second buffer part 252, and then carried out from the second buffer part 252 by the second side manipulator R2 and carried into it
  • the second mobile transfer part 232 transfers to the EFEM 100, and then the EFEM manipulator R10 located in the EFEM is carried out from the second mobile transfer part 232 and sent to the crystal at the loading port 110.
  • the round box 120 In the round box 120.
  • two side manipulators and a pair of moving transfer parts are set up so that the substrate transfer paths after the coating unit and the developing unit are processed do not overlap, and the sharing of side manipulators and moving transfer parts can be avoided
  • the cross-contamination caused by it can improve the transmission efficiency of the equipment to a certain extent.
  • the difference between the third embodiment and the first embodiment is that 1) the side manipulator R0 and the second buffer part (251, 252) are not set between the coating unit 210 and the developing unit 220, but between the EFEM 100 and the coating unit 210 and between the developing unit 220 and the interface station 300 are respectively provided with a side manipulator, respectively defined as the third side manipulator R3 and the fourth side manipulator R4; 2) between the coating unit 210 and the developing unit 220 A pair of mobile transmission parts are arranged between the top and bottom of the top and bottom, respectively, the first mobile transmission part 231 and the second mobile transmission part 232, and the third side manipulator R3 is used to carry the substrates processed by the coating unit 210 into the second side.
  • a mobile transmission part 231, or the substrate after the processing of the developing unit 220 is carried out from the second mobile transmission part 232, and the fourth side manipulator R4 is used to carry the substrate after the processing of the developing unit 220 into the second mobile transmission part 232 , or the substrate processed by the coating unit 210 is carried out from the first moving transport part 231 .
  • Other structures of the coating and developing equipment proposed in the third embodiment are basically the same as those in the first embodiment, and will not be described below.
  • the side manipulator between the coating unit 210 and the developing unit 220 is canceled, the length of the coating and developing equipment can be shortened, and the floor space of the equipment can be reduced. Transmission efficiency, thereby improving the operating efficiency of the entire device.
  • Fig. 16a shows the transport method of the substrate in the coating and developing equipment before the exposure treatment in the third embodiment.
  • the substrate to be processed is carried out from the equipment front-end module 100 by the EFEM manipulator R10 and carried into the first buffer unit 241, and then carried out from the first buffer unit 241 by the coating manipulator R21 and carried into the coating unit 210, and the substrate is coated in the coating unit 210.
  • the coating manipulator R21 carries out the coating unit 210 and carries it into the first buffer unit 241, and then the third side manipulator R3 removes it from the first buffer unit 241 Carried out and carried into the first mobile transmission part 231, and then transported to the interface station 300 by the first mobile transmission part 231, after that, the interface manipulator R30 located in the interface station 300 is directly carried out from the first mobile transmission part 231 and sent in The exposure process is carried out in the exposure machine, or the fourth side manipulator R4 is carried out from the first mobile transmission part 231 and carried into the third buffer part 261, and then the interface manipulator R30 is carried out from the third buffer part 261 and sent into the exposure machine Perform exposure processing.
  • Fig. 16b shows the transport method of the substrate in the coating and developing equipment after the exposure treatment of the third embodiment.
  • the substrate after the exposure process is received by the interface robot R30 from the exposure machine and carried into the third buffer part 262, and then carried out from the third buffer part 262 by the developing robot R22 and carried into the developing unit 220, and the substrate is developed in the developing unit 220 And heat treatment, next, after finishing the substrate processing in the developing unit 220, the developing robot 220 is carried out of the developing unit 220 and carried into the third buffer part 262, and then the fourth side robot R4 is carried out from the third buffer part 262 and carried into the second buffer part 262.
  • the second mobile transfer part 232 transfers to the EFEM 100, and then, the EFEM manipulator R10 located in the EFEM directly unloads the wafer from the second mobile transfer part 232 and sends it into the loading port 110.
  • the EFEM manipulator R10 is carried out from the first buffer part 242 and sent into the crystal at the load port 110. In the round box 120.
  • the difference between the fourth embodiment and the first embodiment is that 1) two side manipulators are arranged between the coating unit 210 and the developing unit 220, respectively the first side manipulator R1 and the second side manipulator R2; Two side manipulators are arranged between EFEM 100 and coating unit 210, which are respectively the third side manipulator R3 and the fifth side manipulator R5; one side manipulator is arranged between the developing unit 220 and the interface station 300, which is defined as the fourth side Manipulator R4, the operation process of multiple side manipulators will be described in detail below in conjunction with the transfer process of the substrate; 2) A pair of moving transfer parts is arranged between the top and bottom of the coating unit 210 and the developing unit 220, respectively for the first The mobile transmission part 231 and the second mobile transmission part 232, the first side manipulator R1 is used to carry the substrate after the coating unit 210 is processed into the first mobile transmission part 231, and the second side manipulator R2 is used to transfer the substrate in the developing unit 220 The substrate after the processing is carried into the second mobile transmission part
  • the functional modules include a thickening module 271 , a front cooling module 272 , an edge exposure module 273 , a pre-cleaning module 274 , a post-cooling module 275 and a post-cleaning module 276 .
  • a plurality of vertically stacked adhesion increasing modules 271 and a plurality of vertically stacked front cooling modules 272 are arranged between the EFEM 100 and the coating unit 210.
  • the adhesion-increasing module 271 is used to form an adhesion-increasing film on the surface of the substrate before the substrate is sent into the coating unit 210 for processing.
  • HMDS gas is used to blow the surface of the substrate to improve the hydrophobicity of the surface of the substrate, which is conducive to enhancing the adhesion between the photoresist and the substrate. Adhesiveness.
  • the temperature of the substrate after the tackification treatment is at a high temperature of 120°C to 130°C, and the substrate is transferred from the tackification module 271 to the front cooling module 272 by the fifth side manipulator R5, and the substrate is cooled from the high temperature to 22°C to 23°C.
  • a plurality of vertically stacked edge exposure modules 273 are arranged between the coating unit 210 and the developing unit 220 to perform edge exposure treatment on the coated substrate. If the interface station 300 is externally connected to an immersion exposure machine, in general, before the substrate is transferred to the exposure machine for immersion exposure, it is necessary to perform a pre-cleaning operation on the substrate to reduce defocusing during the exposure process. Therefore, in this embodiment, a plurality of vertically stacked pre-cleaning modules 274 are arranged between the coating unit 210 and the developing unit 220 to clean the substrate after edge exposure treatment.
  • a plurality of post-cooling modules 275 are disposed between the developing unit 220 and the interface station 300 to cool the pre-cleaned substrates.
  • the substrate needs to be cleaned to avoid damage to the photoresist when the immersion liquid remaining on the substrate surface after the immersion exposure treatment is heated. Therefore, in this embodiment, a plurality of vertically stacked post-cleaning modules 276 are arranged between the developing unit 220 and the interface station 300 to clean the substrate after the immersion exposure treatment.
  • Fig. 20a shows the transfer method of the substrate in the coating and developing equipment before the exposure treatment of the fourth embodiment.
  • the EFEM manipulator R10 sends the substrate to be processed into the first buffer section 241, and the fifth side robot arm R5 unloads the substrate from the first buffer section 241 and sends it into the tackifying module 271, and then transfers the substrate after the tackifying treatment to the front cooling module 272 , the coating manipulator R21 takes out the substrate from the front cooling module 272 and sends it to the coating unit 210, where the substrate is subjected to coating and heat treatment.
  • the substrate is sent into the second buffer section 251, and the first side manipulator R1 unloads the substrate from the second buffer section 251 and sends it into the edge exposure module 273, then transfers the substrate after the edge exposure treatment to the pre-cleaning module 274 for pre-cleaning, and then
  • the substrates after pre-cleaning are carried into the first mobile transfer unit 231, the first mobile transfer unit 231 transfers the substrates to the interface station 300, and the fourth side robot R4 carries the substrates out of the first mobile transfer unit 232 and into the third buffer Section 261 or post-cooling module 275, the interface robot R30 carries out the substrate from the third buffer section 261 or post-cooling module 275 and sends it into the exposure machine for exposure processing.
  • Fig. 20b shows the transfer method of the substrate in the coating and developing device after the exposure treatment in this embodiment.
  • the interface manipulator R30 receives the exposed substrate from the exposure machine and sends it to the third buffer unit 262, and the fourth side manipulator R4 takes out the substrate from the third buffer unit 262 and sends it to the post-cleaning module 276 for post-exposure cleaning.
  • the cleaned substrate is sent to the third buffer section 262, and the developing robot arm R22 unloads the substrate from the third buffer section 262 and sends it into the developing unit 220, where the substrate is subjected to developing treatment and heat treatment.
  • the developing robot arm R22 will The substrate processed by the developing unit is sent to the second buffer section 252, and the second side robot arm R2 unloads the substrate from the second buffer section 252 and carries it into the second mobile transmission section 232, and the second mobile transmission section 232 transmits the substrate to the EFEM 100 , the third side robot arm R3 unloads the substrate from the second moving transfer section 232 and sends it into the first buffer section 242, and then the EFEM robot arm R10 takes it out from the first buffer section 242 and sends it into the wafer cassette 120 located at the load port 110 middle.
  • Embodiment 4 compared with Embodiment 1, two temporary storage parts may also be included, namely the first temporary storage part 281 and the second temporary storage part 282, and the first temporary storage part 281 and the second temporary storage part 282 are stacked. Arranged and set between the developing unit 220 and the interface station 300 .
  • the first temporary storage unit 281 is used to temporarily store the substrate after the coating unit 210 finishes processing, so as to wait to enter the exposure machine for exposure processing.
  • the substrate is preferentially obtained from the first temporary storage unit 281 In this way, the substrate after the coating unit 210 finishes processing can be temporarily stored before the exposure machine, so that there are enough substrates waiting to enter the exposure machine for exposure processing, thereby reducing the waiting time of the exposure machine and improving Exposure machine efficiency.
  • the second temporary storage part 282 is used to temporarily store the substrate after the exposure process is completed, to wait to enter the developing unit for processing.
  • the substrate is preferentially obtained from the second temporary storage part 282 and sent to the developing unit.
  • the exposed substrate can be temporarily stored before the developing unit 220, so that the exposed substrate in the exposure machine can be sent out in time, thereby reducing the occupation or waiting time of the exposure machine and improving the use efficiency of the exposure machine. .
  • the difference between the fifth embodiment and the first embodiment is that 1) the side manipulator R0 and the second buffer part (251, 252) are not set between the coating unit 210 and the developing unit 220, but between the EFEM Two side manipulators are set between 100 and coating unit 210, defined as the third side manipulator R3 and fifth side manipulator R5, and two side manipulators are set between the developing unit 220 and the interface station 300, respectively defined as the fourth side manipulator Manipulator R4 and sixth side manipulator R6, the operation process of multiple side manipulators will be described in detail below in conjunction with the transfer process of the substrate; 2) A pair of mobile transport is arranged between the top and bottom of the coating unit 210 and the developing unit 220 The parts are respectively the first mobile transmission part 231 and the second mobile transmission part 232, the fifth side robot arm R5 is used to carry the substrates processed in the coating unit 210 into the first mobile transmission part 231, and the sixth side robot arm R6 is used After the substrate processed in the coating unit 210 is carried out
  • the functional modules include a thickening module 271 , a front cooling module 272 , an edge exposure module 273 , a pre-cleaning module 274 , a post-cooling module 275 and a post-cleaning module 276 , and the function of each functional module is the same as that of the fourth embodiment.
  • a plurality of vertically stacked adhesion increasing modules 271 and a plurality of vertically stacked front cooling modules 272 are arranged between the EFEM 100 and the coating unit 210; a plurality of vertically stacked edge exposure modules 273, a plurality of vertically stacked A stacked pre-cleaning module 274 , a plurality of vertically stacked post-cooling modules 275 , and a plurality of vertically stacked post-cleaning modules 276 are arranged between the developing unit 220 and the interface station 300 .
  • a plurality of vertically stacked edge exposure modules 273 and a plurality of vertically stacked pre-cleaning modules 274 may also be arranged between the EFEM 100 and the coating unit 210.
  • Fig. 23a shows the transport method of the substrate in the coating and developing equipment before the exposure treatment in the fifth embodiment.
  • the EFEM manipulator R10 sends the substrate to be processed into the first buffer section 241, and the fifth side robot arm R5 unloads the substrate from the first buffer section 241 and sends it into the tackifying module 271, and then transfers the substrate after the tackifying treatment to the front cooling module 272 , the coating manipulator R21 takes out the substrate from the front cooling module 272 and sends it to the coating unit 210, where the substrate is subjected to coating and heat treatment.
  • the substrate is sent into the first buffer unit 241, the fifth side robot arm R5 unloads the substrate from the first buffer unit 241 and sent to the first mobile transmission unit 231, the substrate is transported to the interface station 300 by the first mobile transmission unit 231, and the sixth side robot arm R5 R6 unloads the substrate from the first mobile transfer unit 231 and sends it into the edge exposure module 273, then transfers the substrate after the edge exposure treatment to the pre-cleaning module 274 for pre-cleaning, and then carries the pre-cleaned substrate into the third buffer unit 261 , or the post-cooling module 275 , the interface manipulator R30 unloads the substrate from the third buffer 261 or the post-cooling module 275 and sends it into the exposure machine for exposure processing.
  • Fig. 23b shows the transfer method of the substrate in the coating and developing equipment after the exposure treatment of the fifth embodiment.
  • the interface manipulator R30 receives the exposed substrate from the exposure machine and sends it to the third buffer unit 262, and the fourth side manipulator R4 takes out the substrate from the third buffer unit 262 and sends it to the post-cleaning module 276 for post-exposure cleaning.
  • the cleaned substrate is sent to the third buffer section 262, and the developing robot arm R22 unloads the substrate from the third buffer section 262 and sends it into the developing unit 220, where the substrate is subjected to developing treatment and heat treatment.
  • the developing robot arm R22 will The substrate processed by the developing unit 220 is sent to the third buffer section 262, and the fourth side robot arm R4 unloads the substrate from the third buffer section 262 and carries it into the second mobile transmission section 232, and the second mobile transmission section 232 transmits the substrate to the EFEM 100, the third side manipulator R3 unloads the substrate from the second mobile transfer unit 232 and sends it to the first buffer unit 242, and then the EFEM manipulator R10 takes it out from the first buffer unit 242 and sends it to the wafer cassette located at the load port 110 120.
  • first temporary storage unit 281 and the second temporary storage unit 282 can also be applied to the fifth embodiment.
  • Fig. 24 shows a schematic longitudinal section of the coating and developing device of the sixth embodiment.
  • the coating unit 210 has two vertically stacked coating modules 211, each column has five coating modules 211, and the developing unit 220 has two vertically stacked developing modules 221 , each column has five developing modules 221;
  • photoresist tank 280 and photoresist pump are also integrated in the coating and developing equipment, photoresist tank 280 stores photoresist, photoresist The tank 280 supplies photoresist to the coating module 211 through a photoresist pump.
  • the photoresist tank 280 is located on one side of the transport direction of the moving transport part (231, 232), and the photoresist pump is located between the EFEM 100 and the coating unit 210 (not shown).
  • the other structures of the coating and developing equipment proposed in the sixth embodiment and the numbers of the same parts are basically the same as those in the fifth embodiment, and will not be described below.
  • the functional modules in the sixth embodiment are not shown in FIG. 24 .
  • the photoresist tank and the photoresist pump can also be arranged outside the coating and developing equipment, such as stored in an external cabinet.
  • the coating and development equipment and its substrate transmission method proposed by the present invention adopt the vertical layout of the coating module and the development module, and the coating and development process atmospheres are completely independent, which can more easily control the cleanliness of the environmental atmosphere and reduce the risk of substrate particle pollution.
  • the laterally moving mobile transfer part and the vertically moving side manipulator it is specially used to transport the substrates processed by the coating or developing unit to the interface station or the front-end module of the equipment, so as to improve the coating or developing process.
  • the operating efficiency of the manipulator in the unit thereby improving the overall operating efficiency of the equipment.

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Abstract

一种涂覆显影设备，包括依次连接的设备前端模块（100）、工艺站（200）以及接口站（300），工艺站（200）包括涂覆单元（210）、显影单元（220）、至少一个横向移动的移动传输部（230）以及至少一个侧面机械手（R0），当基板在涂覆单元（210）完成处理后，由至少一个侧面机械手（R0）将基板搬入移动传输部（230）中，并由移动传输部（230）传送至接口站（300）；当基板在显影单元（220）完成处理后，由至少一个侧面机械手（R0）将基板搬入移动传输部（230）中，并由移动传输部（230）传送至设备前端模块（100）。通过配置移动传输部（230）和侧面机械手（R0），负责在设备前端模块（100）和接口站（300）之间传送在涂覆单元（210）或显影单元（220）完成处理之后的基板，能够降低涂覆单元（210）或显影单元（220）内部的机械手运行负荷，提高涂覆显影设备的产出率。

Description

涂覆显影设备 技术领域
本发明涉及半导体制造设备领域，特别是涉及一种涂覆显影设备。
背景技术
目前实现光刻工艺的内联机台是由涂胶显影机台和曝光机组成。光刻工艺的一般流程为：基板在涂胶显影机台完成涂胶工艺处理后，送入曝光机中进曝光处理，经曝光后的基板再次返回涂胶显影机台完成显影工艺处理。
传统的涂胶显影机台，例如专利文献1(CN104465460B)所记载，包括依次串联的载体块、处理块和接口块。其中，处理块具备叠层布置的四层涂覆用单位块，以及堆叠在四层涂覆用单位块之上的显影用单位块。各层单位块内配置一个在其中央搬运区域水平移动的机械手。受限于设备总高度的设计要求，可能没有足够的空间为每层单位块均配置风机过滤机组(FFU)，进而无法保证各层单位块内工艺环境的洁净度，最终会增加基板表面产生颗粒污染的风险。
此外，各层单位块内的机械手既要忙于在单位块内的各处理模块(例如涂覆模块、显影模块或热处理模块)之间传送基板，还要忙于在载体块和接口块之间传递基板，这将导致工艺机器人十分忙碌，一定程度上会抑制设备的运行效率。
发明内容
本发明提出的涂覆显影设备及其基板传输方法，可减少基板颗粒污染风险，并提高设备的整体运行效率。
本发明提供的涂覆显影设备，包括依次连接的设备前端模块、工艺站以及接口站，其中，工艺站包括：
涂覆单元，包含至少一列垂直堆叠的涂覆模块，用于对基板进行涂覆处理；
显影单元，包含至少一列垂直堆叠的显影模块，用于对基板进行显影处理；
至少一个横向运动的移动传输部；以及
至少一个垂直运动的侧面机械手；
其中基板在涂覆单元完成处理后，由所述至少一个侧面机械手将基板搬入移 动传输部中，并由移动传输部传送至接口站；基板在显影单元完成处理后，由所述至少一个侧面机械手将基板搬入移动传输部中，并由移动传输部传送至设备前端模块。
涂覆单元内的涂覆模块采用垂直布局，能够使多层涂覆模块共享同一个涂覆机械手，可以减少涂覆单元内FFU的安装数量，使得工艺环境控制更加容易。显影单元与涂覆单元一样，可以采用较少数量的FFU便可以确保整个单元内部环境的洁净度。
横向运动的移动传输部和垂直运动的侧面机械手有效配合，使得在涂覆或显影单元完成处理后的基板快速传送至接口站或设备前端模块，能够提高设备的运行效率。
作为本发明的一种可选方案，涂覆单元还包括至少一列垂直堆叠的热处理模块，位于涂覆模块的对面，用于对涂覆处理前后的基板进行加热和冷却处理；
显影单元还包括至少一列垂直堆叠的热处理模块，位于显影模块的对面，用于对显影处理前后的基板进行加热和冷却处理。
作为本发明的一种可选方案，所述至少一个移动传输部位于涂覆单元和显影单元的顶部或底部。
作为本发明的一种可选方案，涂覆单元还包括至少一个涂覆机械手，用于在涂覆单元的涂覆模块和热处理模块之间传送基板；
显影单元还包括至少一个显影机械手，用于在显影单元的显影模块和热处理模块之间传送基板。
涂覆单元内多列垂直堆叠的涂覆模块可以共享同一涂覆机械手，所以，涂覆单元内仅需配置一个风机过滤机组(FFU)，便能保证工艺氛围的洁净，减少环境对基板产生颗粒污染。同样地，显影单元也可以仅通过配置一个FFU，来实现其内部环境的洁净，减少颗粒污染。因此，采取涂覆模块和显影模块各自垂直布局，能够使得涂覆或显影工艺环境的控制更加容易。
作为本发明的一种可选方案，所述至少一个移动传输部位于涂覆单元和显影单元的顶部和底部之间。
作为本发明的一种可选方案，涂覆单元包括配置在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧的至少一个涂覆机械手，用于在涂覆单元 的涂覆模块和热处理模块之间传送基板；
显影单元包括配置在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧的至少一个显影机械手，用于在显影单元的显影模块和热处理模块之间传送基板。
当移动传输部位于涂覆单元和显影单元的顶部和底部之间时，横向布置的移动传输部将涂覆单元和显影单元的内部空间分隔成若干相对独立的子空间，例如，在涂覆单元和显影单元的顶部和底部之间设置一对移动传输部时，横向布置的一对移动传输部将涂覆单元和显影单元分隔成相对独立的上部空间和下部空间，此时，上部空间和下部空间各自配置一个涂覆机械手和显影机械手，同样地，为确保工艺环境的洁净，上部空间和下部空间各自配置一个FFU便能实现对各单元内部环境的控制。
作为本发明的一种可选方案，至少一个所述侧面机械手配置在涂覆单元和显影单元之间，用于将在涂覆单元完成处理之后的基板搬入移动传输部，或者将在显影单元完成处理之后的基板搬入移动传输部。
作为本发明的一种可选方案，工艺站包括至少两个所述侧面机械手，所述至少两个所述侧面机械手中的至少一个侧面机械手配置在涂覆单元和设备前端模块之间，用于将在涂覆单元完成处理之后的基板搬入移动传输部，或者将在显影单元完成处理之后的基板从移动传输部搬出；
以及所述至少两个所述侧面机械手中的至少一个侧面机械手配置在显影单元和接口站之间，用于将在显影单元完成处理之后的基板搬入移动传输部，或者将在涂覆单元完成处理之后的基板从移动传输部搬出。
侧面机械手设置在工艺站的两侧，取消涂覆单元和显影单元之间的侧面机械手，一方面能够缩短设备长度，减少设备占地面积，另一方面移动传输部的行程缩短有利于提高其传输效率，进而提高整个设备的运行效率。
作为本发明的一种可选方案，工艺站包括至少三个所述侧面机械手，其中，所述至少三个所述侧面机械手中的至少一个侧面机械手配置在涂覆单元和设备前端模块之间，用于将在显影单元完成处理之后的基板从移动传输部搬出；
所述至少三个所述侧面机械手中的至少一个侧面机械手配置在涂覆单元和显影单元之间，用于将在涂覆单元完成处理之后的基板搬入移动传输部，或者将在显 影单元完成处理之后的基板搬入移动传输部；
以及所述至少三个所述侧面机械手中的至少一个侧面机械手配置在显影单元和接口站之间，用于将在涂覆单元完成处理之后的基板从移动传输部搬出。
作为本发明的一种可选方案，设备前端模块包括设备前端机械手，设备前端机械手将在显影单元完成处理后的基板从移动传输部中搬出；
接口站包括接口机械手，接口机械手将在涂覆单元完成处理后的基板从移动传输部中搬出。
本发明还提出了涂覆显影设备的基板传输方法，采用上述涂覆显影设备，其中，
设备前端模块内设置有设备前端机械手，设备前端机械手将基板从设备前端模块搬出传送至工艺站；
工艺站的涂覆单元内设置有涂覆机械手，涂覆机械手将基板送入涂覆单元，基板在涂覆单元内进行涂覆处理和热处理；
涂覆机械手将在涂覆单元完成处理后的基板搬出涂覆单元；
侧面机械手将从涂覆单元搬出的基板搬入移动传输部；
移动传输部将在涂覆单元完成处理后的基板传送至接口站；
接口站内设置有接口机械手，接口机械手将在涂覆单元完成处理后基板从移动传输部搬出并搬入接口站，或者由另一侧面机械手将在涂覆单元完成处理后基板从移动传输部搬出，再由接口机械手将基板搬入接口站；
接口机械手将曝光处理后的基板从接口站搬出并传送至工艺站；
工艺站的显影单元内设置显影机械手，显影机械手将基板送入显影单元，基板在显影单元内进行显影和热处理；
在显影单元完成处理后的基板由显影机械手搬出显影单元；
侧面机械手将显影单元搬出的基板搬入移动传输部；
移动传输部将在显影单元完成处理后的基板传送至设备前端模块；
设备前端机械手将在显影单元完成处理后基板从移动传输部搬出并搬入设备前端模块，或者由另一侧面机械手将在显影单元完成处理后基板从移动传输部搬出，再由设备前端机械手将基板搬入设备前端模块。
附图概述
图1示出了实施例一的涂覆显影设备的前透视图；
图2示出了实施例一的涂覆显影设备的后透视图；
图3示出了实施例一的涂覆显影设备的一横截面图；
图4示出了实施例一的涂覆显影设备的一纵截面图；
图5示出了实施例一的涂覆显影设备的另一横截面图；
图6示出了实施例一的涂覆显影设备的另一纵截面图；
图7示出了实施例一的涂覆显影设备的另一纵截面图；
图8a示出了实施例一曝光处理之前基板在涂覆显影设备中的搬运路径；
图8b示出了实施例一曝光处理之后基板在涂覆显影设备中的搬运路径；
图9示出了实施例二的涂覆显影设备的一横截面图；
图10示出了实施例二的涂覆显影设备的一纵截面图；
图11示出了实施例二的涂覆显影设备的另一横截面图；
图12a示出了实施例二曝光处理之前基板在涂覆显影设备中的搬运路径；
图12b示出了实施例二曝光处理之后基板在涂覆显影设备中的搬运路径；
图13示出了实施例三的涂覆显影设备的一横截面图；
图14示出了实施例三的涂覆显影设备的一纵截面图；
图15示出了实施例三的涂覆显影设备的另一横截面图；
图16a示出了实施例三曝光处理之前基板在涂覆显影设备中的搬运路径；
图16b示出了实施例三曝光处理之后基板在涂覆显影设备中的搬运路径；
图17示出了实施例四涂覆显影设备的一横截面图；
图18示出了实施例四涂覆显影设备的另一横截面图；
图19示出了实施例四涂覆显影设备中工艺站隐藏涂覆和显影模块的透视图；
图20a示出了实施例四曝光处理之前基板在涂覆显影设备中的搬运路径；
图20b示出了实施例四曝光处理之后基板在涂覆显影设备中的搬运路径；
图21示出了实施例五涂覆显影设备的一横截面图；
图22示出了实施例五涂覆显影设备的另一横截面图；
图23a示出了实施例五曝光处理之前基板在涂覆显影设备中的搬运路径；
图23b示出了实施例五曝光处理之后基板在涂覆显影设备中的搬运路径；
图24示出了实施例六的涂覆显影设备的一纵截面图；
图25a至图25c示出了涂覆单元内涂覆模块和加热模块的纵向布局示意图；以及
图26a至图26c示出了显影单元内显影模块和加热模块的纵向布局示意图。
本发明的较佳实施方式
为详细说明本发明的技术内容、构造特征、所达成目的及效果，下面将结合实施例并配合图式予以详细说明。
本发明提出的涂覆显影设备，包括依次串接的设备前端模块(EFEM)、工艺站以及接口站，设备前端模块内设置有设备前端机械手(EFEM机械手)，接口站内设置有接口机械手。
工艺站包括涂覆单元、显影单元、至少一个横向运动的移动传输部以及至少一个垂直运动的侧面机械手。基板在涂覆单元完成处理后，由侧面机械手将基板搬入移动传输部中，并由移动传输部传送至接口站；基板在显影单元完成处理后，由侧面机械手将基板搬入移动传输部中，并由移动传输部传送至设备前端模块。
涂覆单元包含至少一列垂直堆叠的涂覆模块、至少一列垂直堆叠的热处理模块以及至少一个涂覆机械手。涂覆模块用于对基板进行涂覆处理，热处理模块用于对涂覆处理前后的基板进行加热和冷却处理，热处理模块位于涂覆模块的对面，涂覆机械手用于在涂覆单元的涂覆模块和热处理模块之间传递基板。
显影单元包含至少一列垂直堆叠的显影模块、至少一列垂直堆叠的热处理模块以及至少一个显影机械手。显影模块用于对基板进行显影处理，热处理模块用于对显影处理前后的基板进行加热和冷却处理，热处理模块位于显影模块的对面，显影机械手用于在显影单元的显影模块和热处理模块之间传递基板。
至少一个横向运动的移动传输部位于涂覆单元和显影单元的顶部或底部，或者至少一个横向运动的移动传输部位于涂覆单元和显影单元的顶部和底部之间。当至少一个横向运动的移动传输部位于涂覆单元和显影单元的顶部和底部之间时，涂覆单元在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧各配置至少一个涂覆机械手，用于在涂覆单元的涂覆模块和热处理 模块之间传送基板；显影单元在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧各配置至少一个显影机械手，用于在显影单元的显影模块和热处理模块之间传送基板。
侧面机械手设置在设备前端模块和涂覆单元之间，或者设置在涂覆单元和显影单元之间，或者设置在显影单元和接口站之间。
下面将结合具体实施例详细介绍侧面机械手设置的位置和数量，以及对应的基板传输方法。
实施例一
请参阅图1至图7示出的本发明实施例提出的涂覆显影设备。图1和图2示出了本发明提出的涂覆显影设备的透视图。涂覆显影设备主要由呈直线排列的设备前端模块(EFEM)100、工艺站200和接口站300构成。图3示出了本实施例中涂覆显影设备的横截面图。设备前端模块100具备多个装载端口110，用于保持一个或多个收纳有多片基板的晶圆盒120。设备前端模块100内设置有一个EFEM机械手R10，能够在EFEM 100和工艺站200之间传送基板。接口站300用于连接外部设备，例如曝光机，用以对在涂覆单元210完成处理之后的基板进行曝光处理。接口站300内设置有一个接口机械手R30，用于在工艺站200和接口站300之间传送基板。
工艺站200包含直线排列的涂覆单元210和显影单元220，至少一个横向(例如图4中水平方向)运动的移动传输部230以及至少一个垂直(例如图4中垂直方向)运动的侧面机械手R0。涂覆单元210用以对基板执行涂覆和热处理，且包含至少一列垂直堆叠的涂覆模块211、至少一列垂直堆叠的热处理模块212以及至少一个涂覆机械手R21。涂覆模块211和热处理模块212相对设置，图25a至图25c示出了涂覆模块211和热处理模块212相对设置的各种不同布局。涂覆模块211用于对基板进行涂覆处理，热处理模块212用于对基板进行加热和冷却处理，涂覆机械手R21用于在涂覆单元210的涂覆模块211和热处理模块212之间传送基板。显影单元220用以对基板执行显影和热处理，包含至少一列垂直堆叠的显影模块221、至少一列垂直堆叠的热处理模块222以及至少一个显影机械手R22。显影模块221和热处理模块222相对设置，图 26a至图26c示出了显影模块221和热处理模块222相对设置的各种不同布局。显影模块221用于对基板进行显影处理，热处理模块222用于对基板进行加热和冷却处理。显影机械手R22用于在显影单元220的显影模块221和热处理模块222之间传送基板。当基板在涂覆单元210完成处理后，由侧面机械手R0搬入移动传输部230中，并由移动传输部230传送至接口站300；当基板在显影单元220完成处理后，由侧面机械手R0搬入移动传输部230中，并由移动传输部230传送至设备前端模块100。
相较现有技术中由涂覆或显影单元内部的机械手在EFEM和接口站之间传送基板，在本发明的实施例中，单独配置移动传输部和侧面机械手，负责在EFEM和接口站之间传送涂覆或显影处理之后的基板，能够降低涂覆或显影单元内部的机械手运行负荷，从而降低机械手运行效率对涂覆显影设备产出率的影响，进而提高涂覆显影设备的产出率。
如图1所示，在本实施例中，涂覆单元210包含三列垂直堆叠的涂覆模块C1～C3，每列包含四个涂覆模块211，显影单元220包含三列垂直堆叠的显影模块D1～D3，每列包含四个显影模块221。涂覆和显影单元中的涂覆、显影以及热处理模块的列数以及数量可根据具体工艺产能以及设备尺寸要求进行调整。
需要指出的是，在本发明实施例中提及的涂覆模块包括三种，分别为用于形成光刻胶涂层的涂覆模块，用于形成顶部抗反射涂层的涂覆模块，以及用于形成底部抗反射涂层的涂覆模块。涂覆单元根据具体工艺要求配置相应的涂覆模块，其中，涂覆单元配置的同类型涂覆模块之间可以共用供液喷嘴，也可各自配置供液喷嘴，不同类型涂覆模块之间各自配置供液喷嘴。
参见图4和图5，在涂覆单元210和显影单元220的顶部和底部之间配置有一个横向运动的移动传输部230，移动传输部230能够在连接EFEM 100和接口站300的直线传送路径上横向移动。涂覆单元210设置两个涂覆机械手R21，一个涂覆机械手R21位于移动传输部230的上侧，用于在位于移动传输部230上侧的涂覆模块211和热处理模块212之间传送基板，另一个涂覆机械手R21位于移动传输部230的下侧，用于在位于移动传输部230下侧的涂覆模块211和热处理模块212之间传送基板。显影单元220设置两个显影机械手R22，一 个显影机械手R22位于移动传输部230的上侧，用于在位于移动传输部230上侧的显影模块221和热处理模块222之间传送基板，另一个显影机械手R22位于移动传输部230的下侧，用于在位于移动传输部230下侧的显影模块221和热处理模块222之间传送基板。在其他实施例中，在涂覆单元和显影单元的顶部和底部之间还可以设置多个横向运动的移动传输部，涂覆单元在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧各配置至少一个涂覆机械手，用于在涂覆单元的涂覆模块和热处理模块之间传送基板；显影单元在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧各配置至少一个显影机械手，用于在显影单元的显影模块和热处理模块之间传送基板。
在其他实施例中，移动传输部230还可以设置在涂覆单元210和显影单元220的顶部或底部，分别如图6和图7所示。当移动传输部230位于涂覆单元210和显影单元220的顶部或底部时，涂覆单元210配置至少一个涂覆机械手，例如两个，参见图6或图7，涂覆单元210内部分隔成上下两个空间，其中一个涂覆机械手R21用于在位于涂覆单元210上部空间的涂覆模块211和热处理模块212之间传送基板；另一个涂覆机械手R21用于在位于涂覆单元210下部空间的涂覆模块211和热处理模块212之间传送基板，此时，涂覆单元210的上部空间和下部空间分别配置一个风机过滤机组(FFU)，来确保涂覆单元210的上下两个空间的工艺环境的洁净。当然，涂覆单元210也可以仅配置一个涂覆机械手R21，用于在涂覆单元210整个空间内的所有涂覆模块211和热处理模块212之间传送基板，此时，涂覆单元210仅需要配置一个风机过滤机组(FFU)，实现涂覆单元210工艺环境的洁净，这使得设备工艺环境的控制更加容易操作。同样地，显影单元220可以仅配置一个显影机械手R22，也可以配置多个显影机械手R22。
在实施一中，在涂覆单元210和显影单元220之间配置有一个侧面机械手R0，用于将在涂覆单元210完成处理之后的基板或者在显影单元220完成处理之后的基板搬入移动传输部230。为方便不同机械手之间传送基板，在EFEM100和涂覆单元210之间配置有第一缓存部(241，242)，在涂覆单元210和显影单元220之间配置有第二缓存部(251，252)，在显影单元220和接口站300之间配置有第三缓存部(261，262)。缓存部能够收容多片基板，并使基 板停留，侧面机械手R0能够沿涂覆显影设备的高度方向垂直上下移动，以访问到不同高度处的缓存部。
图8a示出了实施例一曝光处理之前基板在涂覆显影设备中的传输方法。待加工基板由EFEM机械手R10从设备前端模块100搬出并搬入第一缓存部241，再由涂覆机械手R21从第一缓存部241搬出并搬入涂覆单元210，基板在涂覆单元210中进行涂覆处理和热处理，接下来，在涂覆单元210完成处理后的基板，由涂覆机械手R21搬出涂覆单元210并搬入第二缓存部251，再由侧面机械手R0从第二缓存部251搬出并搬入移动传输部230中，再由移动传输部230传输至接口站300，之后，由位于接口站300内的接口机械手R30从移动传输部230中搬出并送入曝光机中进行曝光处理。
图8b示出了实施例一曝光处理之后基板在涂覆显影设备中的传输方法。完成曝光处理后的基板，由接口机械手R30从曝光机接收后并搬入第三缓存部262，再由显影机械手R22从第三缓存部262搬出并搬入显影单元220，基板在显影单元220中进行显影处理和热处理，接下来，在显影单元220完成处理后的基板，由显影机械手R22搬出显影单元220并搬入第二缓存部252，再由侧面机械手R0从第二缓存部252搬出并搬入移动传输部230中，再由移动传输部230传输至EFEM 100，之后，再由位于EFEM 100内的EFEM机械手R10从移动传输部230中搬出并送入位于装载端口110的晶圆盒120中。
实施例二
参见图9至图11，实施例二与实施例一的区别在于，1)在涂覆单元210和显影单元220之间配置两个侧面机械手，分别为第一侧面机械手R1和第二侧面机械手R2；2)在涂覆单元210和显影单元220的顶部和底部之间配置了一对移动传输部，分别为第一移动传输部231和第二移动传输部232，第一侧面机械手R1用于将在涂覆单元210完成处理后的基板搬入第一移动传输部231，第二侧面机械手R2用于将在显影单元220完成处理后的基板搬入第二移动传输部232。实施例二提出的涂覆显影设备其他结构与实施例一基本相同，下文将不再描述。
图12a示出了实施例二曝光处理之前基板在涂覆显影设备中的传输方法。 待加工基板由EFEM机械手R10从EFEM 100搬出并搬入第一缓存部241，再由涂覆机械手R21从第一缓存部241搬出并搬入涂覆单元210，基板在涂覆单元210中进行涂覆处理和热处理，接下来，在涂覆单元210完成处理后的基板，由涂覆机械手R21搬出涂覆单元210并搬入第二缓存部251，再由第一侧面机械手R1从第二缓存部251搬出并搬入第一移动传输部231中，再由第一移动传输部231传输至接口站300，之后，由位于接口站300内的接口机械手R30从第一移动传输部231中搬出并送入曝光机中进行曝光处理。
图12b示出了实施例二曝光处理之后基板在涂覆显影设备中的传输方法。完成曝光处理后的基板，由接口机械手R30从曝光机接收后并搬入第三缓存部262，再由显影机械手R22从第三缓存部262搬出基板并搬入显影单元220，基板在显影单元220中进行显影处理和热处理，接下来，在显影单元220完成处理后的基板，由显影机械手R22搬出显影单元220并搬入第二缓存部252，再由第二侧面机械手R2从第二缓存部252搬出并搬入第二移动传输部232中，再由第二移动传输部232传输至EFEM 100，之后，再由位于EFEM内的EFEM机械手R10从第二移动传输部232中搬出并送入位于装载端口110的晶圆盒120中。
在不改变设备占地面积的同时，设置两个侧面机械手与一对移动传输部，以使在涂覆单元和显影单元完成处理后的基板搬运路径不重叠，能够避免共用侧面机械手和移动传输部引起的交叉污染，并能一定程度上提高设备的传输效率。
实施例三
参见图13至图15，实施三与实施例一的区别在于，1)在涂覆单元210和显影单元220之间未设置侧面机械手R0以及第二缓存部(251，252)，而是在EFEM 100和涂覆单元210之间以及显影单元220和接口站300之间各设置一个侧面机械手，分别定义为第三侧面机械手R3和第四侧面机械手R4；2)在涂覆单元210和显影单元220的顶部和底部之间配置了一对移动传输部，分别为第一移动传输部231和第二移动传输部232，第三侧面机械手R3用于将在涂覆单元210完成处理后的基板搬入第一移动传输部231，或者将在显影单元 220完成处理后的基板从第二移动传输部232搬出，第四侧面机械手R4用于将在显影单元220完成处理后的基板搬入第二移动传输部232，或者将在涂覆单元210完成处理后的基板从第一移动传输部231搬出。实施例三提出的涂覆显影设备其他结构与实施例一基本相同，下文将不再描述。
实施例三中，取消涂覆单元210和显影单元220之间的侧面机械手，能够缩短涂覆显影设备的长度，减少设备的占地面积，与此同时，能够缩短移动传输部的运动行程提高其传输效率，进而提高整个设备的运行效率。
图16a示出了实施例三曝光处理之前基板在涂覆显影设备中的传输方法。待加工基板由EFEM机械手R10从设备前端模块100搬出并搬入第一缓存部241，再由涂覆机械手R21从第一缓存部241搬出并搬入涂覆单元210，基板在涂覆单元210中进行涂覆处理和热处理，接下来，在涂覆单元210完成处理后的基板，由涂覆机械手R21搬出涂覆单元210并搬入第一缓存部241，再由第三侧面机械手R3从第一缓存部241搬出并搬入第一移动传输部231中，再由第一移动传输部231传输至接口站300，之后，由位于接口站300内的接口机械手R30直接从第一移动传输部231中搬出并送入曝光机中进行曝光处理，或由第四侧面机械手R4从第一移动传输部231中搬出并搬入第三缓存部261之后，再由接口机械手R30从第三缓存部261搬出并送入曝光机中进行曝光处理。
图16b示出了实施例三曝光处理之后基板在涂覆显影设备中的传输方法。完成曝光处理后的基板，由接口机械手R30从曝光机接收并搬入第三缓存部262，再由显影机械手R22从第三缓存部262搬出并搬入显影单元220，基板在显影单元220中进行显影处理和热处理，接下来，在显影单元220完成处理后的基板，由显影机械手220搬出显影单元220并搬入第三缓存部262，再由第四侧面机械手R4从第三缓存部262搬出并搬入第二移动传输部232中，再由第二移动传输部232传输至EFEM 100，之后，再由位于EFEM内的EFEM机械手R10直接从第二移动传输部232中搬出并送入位于装载端口110的晶圆盒120中，或者由第三侧面机械手R3从第二移动传输部232中搬出并搬入第一缓存部242之后，再由EFEM机械手R10从第一缓存部242搬出并送入位于装载端口110的晶圆盒120中。
实施例四
参见图17至图19，实施四与实施例一的区别在于，1)在涂覆单元210和显影单元220之间配置两个侧面机械手，分别为第一侧面机械手R1和第二侧面机械手R2；在EFEM 100和涂覆单元210之间配置两个侧面机械手，分别为第三侧面机械手R3和第五侧面机械手R5；在显影单元220和接口站300之间配置一个侧面机械手，定义为第四侧面机械手R4，多个侧面机械手的运作流程将配合基板的传输工艺在下文详细描述；2)在涂覆单元210和显影单元220的顶部和底部之间配置了一对移动传输部，分别为第一移动传输部231和第二移动传输部232，第一侧面机械手R1用于将在涂覆单元210完成处理之后的基板搬入第一移动传输部231，第二侧面机械手R2用于将在显影单元220完成处理之后的基板搬入第二移动传输部232，第三侧面机械手R3用于将在显影单元220完成处理之后的基板从第二移动传输部232搬出，第四侧面机械手R4用于将在涂覆单元210完成处理之后的基板从第一移动传输部231搬出；3)多个功能模块，功能模块的具体布局及作用将在下文进行详细阐述。实施例四提出的涂覆显影设备其他结构与实施例一基本相同，下文将不再描述。
功能模块包括增粘模块271、前冷却模块272、边缘曝光模块273、预清洗模块274、后冷却模块275以及后清洗模块276。
在本实施例中，多个垂直堆叠的增粘模块271和多个垂直堆叠的前冷却模块272布置在EFEM 100和涂覆单元210之间。增粘模块271用以在基板送入涂覆单元210内进行处理之前在基板表面形成增粘薄膜，例如采用HMDS气体吹拂基板表面，改善基板表面的疏水性，有利于增强光刻胶与基板的粘附性。经增粘处理后的基板温度处于120℃～130℃的高温，通过第五侧面机械手R5将基板由增粘模块271传送至前冷却模块272，将基板从高温冷却至22℃～23℃。
多个垂直堆叠的边缘曝光模块273布置在涂覆单元210和显影单元220之间，用以对涂覆工艺后的基板进行边缘曝光处理。若接口站300外接浸没式曝光机，一般情况在基板传送至曝光机执行浸没式曝光操作之前，需要对基板执行预清洗操作，以减少曝光处理时散焦现象的产生。因此，在本实施例中，多个垂直堆叠的预清洗模块274布置在涂覆单元210和显影单元220之间，用以 对边缘曝光处理后的基板进行清洗。
多个后冷却模块275布置在显影单元220和接口站300之间，对预清洗后的基板进行冷却。此外，对于浸没式曝光处理后的基板，在进入显影单元220进行处理之前，需要对基板进行清洗，以避免浸没式曝光处理后残留在基板表面的浸没液加热时对光刻胶的损坏。因此，在本实施例中，多个垂直堆叠的后清洗模块276布置在显影单元220和接口站300之间，用以对浸没式曝光处理后的基板进行清洗。
图20a示出了实施例四曝光处理之前基板在涂覆显影设备中的传输方法。EFEM机械手R10将待加工基板送入第一缓存部241，第五侧面机械手R5从第一缓存部241搬出基板并送入增粘模块271，再将增粘处理之后的基板传送至前冷却模块272，涂覆机械手R21从前冷却模块272取出基板并送入涂覆单元210，基板在涂覆单元210中进行涂覆处理和热处理，接下来，涂覆机械手R21将在涂覆单元210完成处理后的基板送入第二缓存部251，第一侧面机械手R1从第二缓存部251搬出基板并送入边缘曝光模块273，然后将边缘曝光处理之后的基板传送至预清洗模块274进行预清洗，再将预清洗之后的基板搬入第一移动传输部231中，第一移动传输部231将基板传送至接口站300，第四侧面机械手R4将基板从第一移动传输部232中搬出并送入第三缓存部261或后冷却模块275，接口机械手R30将基板从第三缓存部261或后冷却模块275中搬出并送入曝光机中进行曝光处理。
图20b示出了本实施例中曝光处理之后基板在涂覆显影设备中的传输方法。接口机械手R30从曝光机接收曝光处理之后的基板，并送入第三缓存部262，第四侧面机械手R4从第三缓存部262中取出基板并送入后清洗模块276进行曝光后清洗，再将清洗后的基板传送至第三缓存部262，显影机械手R22从第三缓存部262搬出基板并送入显影单元220，基板在显影单元220中进行显影处理和热处理，接下来，显影机械手R22将在显影单元完成处理后的基板送入第二缓存部252，第二侧面机械手R2从第二缓存部252搬出基板并搬入第二移动传输部232中，第二移动传输部232将基板传送至EFEM 100，第三侧面机械手R3从第二移动传输部232中将基板搬出并送入第一缓存部242，再由EFEM机械手R10从第一缓存部242取出并送入位于装载端口110的晶圆盒120 中。
在实施例四中，相对实施例一，还可以包括两个暂存部，分别为第一暂存部281和第二暂存部282，第一暂存部281和第二暂存部282堆叠布置并设置在显影单元220和接口站300之间。第一暂存部281用于暂存在涂覆单元210完成处理之后的基板，以等待进入曝光机进行曝光处理，当曝光机中有空闲工位时，优先从第一暂存部281中获取基板送入曝光机中进行曝光处理，这样可以使在涂覆单元210完成处理之后的基板在曝光机之前暂存，使得等待进入曝光机进行曝光处理的基板充足，从而减少曝光机的等待时间，提高曝光机的使用效率。
第二暂存部282用于暂存完成曝光处理后的基板，以等待进入显影单元进行处理，当显影单元中有空闲工位时，优先从第二暂存部282中获取基板送入显影单元中进行工艺处理，这样可以使曝光处理后的基板在显影单元220之前暂存，使得在曝光机中完成曝光处理的基板及时送出，从而减少曝光机的占用或等待时间，提高曝光机的使用效率。
实施例五
参见图21和图22，实施五与实施例一的区别在于，1)在涂覆单元210和显影单元220之间未设置侧面机械手R0以及第二缓存部(251，252)，而是在EFEM 100和涂覆单元210之间设置两个侧面机械手，定义为第三侧面机械手R3和第五侧面机械手R5，以及显影单元220和接口站300之间设置两个侧面机械手，分别定义为第四侧面机械手R4和第六侧面机械手R6，多个侧面机械手的运作流程将配合基板的传输工艺在下文详细描述；2)在涂覆单元210和显影单元220的顶部和底部之间配置了一对移动传输部，分别为第一移动传输部231和第二移动传输部232，第五侧面机械手R5用于将在涂覆单元210完成处理后的基板搬入第一移动传输部231，第六侧面机械手R6用于将在涂覆单元210完成处理后的基板从第一移动传输部231搬出，第四侧面机械手R4用于将在显影单元220完成处理后的基板搬入第二移动传输部232，第三侧面机械手R3用于将在显影单元220完成处理后的基板从第二移动传输部232搬出；3)多个功能模块，功能模块的具体布局及作用将在下文进行详细阐述。 实施例五提出的涂覆显影设备其他结构与实施例一基本相同，下文将不再描述。
功能模块包括增粘模块271、前冷却模块272、边缘曝光模块273、预清洗模块274、后冷却模块275以及后清洗模块276，各功能模块的作用与实施例四相同。在本实施例中，多个垂直堆叠的增粘模块271和多个垂直堆叠的前冷却模块272布置在EFEM 100和涂覆单元210之间；多个垂直堆叠的边缘曝光模块273、多个垂直堆叠的预清洗模块274、多个垂直堆叠的后冷却模块275以及多个垂直堆叠的后清洗模块276均布置在显影单元220和接口站300之间。在其他实施例中，多个垂直堆叠的边缘曝光模273和多个垂直堆叠的预清洗模块274还可以布置在EFEM 100和涂覆单元210之间。
图23a示出了实施例五曝光处理之前基板在涂覆显影设备中的传输方法。EFEM机械手R10将待加工基板送入第一缓存部241，第五侧面机械手R5从第一缓存部241搬出基板并送入增粘模块271，再将增粘处理之后的基板传送至前冷却模块272，涂覆机械手R21从前冷却模块272取出基板并送入涂覆单元210，基板在涂覆单元210中进行涂覆处理和热处理，接下来，涂覆机械手R21将在涂覆单元210完成处理后的基板送入第一缓存部241，第五侧面机械手R5从第一缓存部241搬出基板并送入第一移动传输部231，基板由第一移动传输部231传送至接口站300，第六侧面机械手R6将基板从第一移动传输部231中搬出并送入边缘曝光模块273，然后将边缘曝光处理之后的基板传送至预清洗模块274进行预清洗，再将预清洗之后的基板搬入第三缓存部261，或后冷却模块275，接口机械手R30将基板从第三缓存部261或后冷却模块275中搬出并送入曝光机中进行曝光处理。
图23b示出了实施例五曝光处理之后基板在涂覆显影设备中的传输方法。接口机械手R30从曝光机接收曝光处理之后的基板，并送入第三缓存部262，第四侧面机械手R4从第三缓存部262中取出基板并送入后清洗模块276进行曝光后清洗，再将清洗后的基板传送至第三缓存部262，显影机械手R22从第三缓存部262搬出基板并送入显影单元220，基板在显影单元220中进行显影处理和热处理，接下来，显影机械手R22将在显影单元220完成处理后的基板送入第三缓存部262，第四侧面机械手R4从第三缓存部262搬出基板并搬入第二移动传输部232中，第二移动传输部232将基板传送至EFEM 100，第三侧 面机械手R3从第二移动传输部232中将基板搬出并送入第一缓存部242，再由EFEM机械手R10从第一缓存部242取出并送入位于装载端口110的晶圆盒120。
同样地，第一暂存部281和第二暂存部282也可以应用到实施例五中。
实施例六
图24示出了实施例六涂覆显影设备的一纵截面示意图。实施例六与实施例五的区别在于，1)涂覆单元210具有两列垂直堆叠的涂覆模块211，每列具有五个涂覆模块211，显影单元220具有两列垂直堆叠的显影模块221，每列具有五个显影模块221；2)涂覆显影设备内还集成有光刻胶罐280以及光刻胶泵(图未示出)，光刻胶罐280存放光刻胶，光刻胶罐280通过光刻胶泵向涂覆模块211供给光刻胶。其中，光刻胶罐280位于移动传输部(231，232)传输方向的一侧，光刻胶泵位于EFEM 100和涂覆单元210之间(图未示出)。实施例六提出的涂覆显影设备其他结构以及相同部件的编号与实施例五基本相同，下文将不再描述。
实施例六中各功能模块在图24中未示出，实施例六各功能模块的具体布局及作用可参考实施例五。
在其他实施例中，光刻胶罐和光刻胶泵也可以布置在涂覆显影设备的外部，例如存放于外置柜内。
本发明提出的涂覆显影设备及其基板传输方法，采取涂覆模块和显影模块各自垂直布局，涂覆和显影工艺氛围完全独立，能够更容易控制环境氛围的洁净度，减少基板颗粒污染风险，与此同时，通过横向运动的移动传输部与垂直运动的侧面机械手的配合，专门用于向接口站或设备前端模块运送在涂覆或显影单元完成处理后的基板，以此提高涂覆或显影单元内机械手的运行效率，进而提高设备的整体运行效率。
上述实施例仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变，仍应由本发明的权利要求所涵盖。

Claims (18)

  1. 一种涂覆显影设备，包括依次连接的设备前端模块、工艺站以及接口站，其中，工艺站包括：
    涂覆单元，包含至少一列垂直堆叠的涂覆模块，用于对基板进行涂覆处理；
    显影单元，包含至少一列垂直堆叠的显影模块，用于对基板进行显影处理；
    至少一个横向运动的移动传输部；以及
    至少一个垂直运动的侧面机械手；
    其中基板在涂覆单元完成处理后，由所述至少一个侧面机械手将基板搬入移动传输部中，并由移动传输部传送至接口站；基板在显影单元完成处理后，由所述至少一个侧面机械手将基板搬入移动传输部中，并由移动传输部传送至设备前端模块。
  2. 根据权利要求1所述的涂覆显影设备，其特征在于，
    涂覆单元还包括至少一列垂直堆叠的热处理模块，位于涂覆模块的对面，用于对涂覆处理前后的基板进行加热和冷却处理；
    显影单元还包括至少一列垂直堆叠的热处理模块，位于显影模块的对面，用于对显影处理前后的基板进行加热和冷却处理。
  3. 根据权利要求2所述的涂覆显影设备，其特征在于，所述至少一个移动传输部位于涂覆单元和显影单元的顶部或底部。
  4. 根据权利要求3所述的涂覆显影设备，其特征在于，
    涂覆单元还包括至少一个涂覆机械手，用于在涂覆单元的涂覆模块和热处理模块之间传送基板；
    显影单元还包括至少一个显影机械手，用于在显影单元的显影模块和热处理模块之间传送基板。
  5. 根据权利要求2所述的涂覆显影设备，其特征在于，所述至少一个移动传输部位于涂覆单元和显影单元的顶部和底部之间。
  6. 根据权利要求5所述的涂覆显影设备，其特征在于，
    涂覆单元包括配置在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧的至少一个涂覆机械手，用于在涂覆单元的涂覆模块和热处理模块之间传送基板；
    显影单元包括配置在位于涂覆单元和显影单元的顶部和底部之间的移动传输部上下两侧的至少一个显影机械手，用于在显影单元的显影模块和热处理模块之间传送基板。
  7. 根据权利要求1所述的涂覆显影设备，其特征在于，至少一个所述侧面机械手配置在涂覆单元和显影单元之间，用于将在涂覆单元完成处理之后的基板搬入移动传输部，或者将在显影单元完成处理之后的基板搬入移动传输部。
  8. 根据权利要求1所述的涂覆显影设备，其特征在于，工艺站包括至少两个所述侧面机械手，所述至少两个所述侧面机械手中的至少一个侧面机械手配置在涂覆单元和设备前端模块之间，用于将在涂覆单元完成处理之后的基板搬入移动传输部，或者将在显影单元完成处理之后的基板从移动传输部搬出；
    以及所述至少两个所述侧面机械手中的至少一个侧面机械手配置在显影单元和接口站之间，用于将在显影单元完成处理之后的基板搬入移动传输部，或者将在涂覆单元完成处理之后的基板从移动传输部搬出。
  9. 根据权利要求1所述的涂覆显影设备，其特征在于，工艺站包括至少三个所述侧面机械手，所述至少三个所述侧面机械手中的至少一个侧面机械手配置在涂覆单元和设备前端模块之间，用于将在显影单元完成处理之后的基板从移动传输部搬出；
    所述至少三个所述侧面机械手中的至少一个侧面机械手配置在涂覆单元和显影单元之间，用于将在涂覆单元完成处理之后的基板搬入移动传输部，或者将在显影单元完成处理之后的基板搬入移动传输部；
    以及所述至少三个所述侧面机械手中的至少一个侧面机械手配置在显影单元和接口站之间，用于将在涂覆单元完成处理之后的基板从移动传输部搬出。
  10. 根据权利要求1所述的涂覆显影设备，其特征在于，
    设备前端模块包括设备前端机械手，设备前端机械手将在显影单元完成处理后的基板从移动传输部中搬出；
    接口站包括接口机械手，接口机械手将在涂覆单元完成处理后的基板从移动传输部中搬出。
  11. 根据权利要求1所述的涂覆显影设备，其特征在于，工艺站还包括：
    多个垂直堆叠的增粘模块，用以在基板表面形成增粘薄膜；
    以及多个垂直堆叠的前冷却模块，用以对增粘处理后的基板进行冷却；
    其中多个增粘模块和多个前冷却模块位于涂覆单元和设备前端模块之间；
    在基板被送入涂覆单元进行处理之前，至少一个侧面机械手将基板传送至增粘模块，之后，再将增粘处理后的基板传送至前冷却模块。
  12. 根据权利要求1所述的涂覆显影设备，其特征在于，工艺站还包括：
    多个垂直堆叠的边缘曝光模块，用以对在涂覆单元完成处理后的基板进行边缘曝光处理；
    多个边缘曝光模块位于涂覆单元和显影单元之间，或者位于涂覆单元和设备前端模块之间，或者位于显影单元和接口站之间；
    至少一个侧面机械手将在涂覆单元完成处理后的基板被送入接口站之前，将基板传送至边缘曝光模块进行边缘曝光处理。
  13. 根据权利要求12所述的涂覆显影设备，其特征在于，工艺站还包括：
    多个垂直堆叠的预清洗模块，用以对边缘曝光处理后的基板进行清洗；
    其中多个预清洗模块位于涂覆单元和显影单元之间，或者位于涂覆单元和设备前端模块之间，或者位于显影单元和接口站之间；
    至少一个侧面机械手在边缘曝光之后的基板被送入接口站之前，将基板传送至预清洗模块进行清洗。
  14. 根据权利要求13所述的涂覆显影设备，其特征在于，工艺站还包括：
    多个垂直堆叠的后冷却模块，用以对预清洗后的基板进行冷却；
    其中多个后冷却模块位于显影单元和接口站之间；
    至少一个侧面机械手在预清洗之后的基板被送入接口站之前，将基板传送至后冷却模块中进行冷却。
  15. 根据权利要求1所述的涂覆显影设备，其特征在于，工艺站还包括：
    多个垂直堆叠的后清洗模块，用以在浸没式曝光处理后且基板送入显影单元前，对基板进行后清洗；
    其中多个后清洗模块位于显影单元和接口站之间；
    至少一个侧面机械手将曝光处理之后的基板传送至后清洗模块中进行清洗，再将后清洗处理后的基板传送至显影单元进行处理。
  16. 根据权利要求1所述的涂覆显影设备，其特征在于，工艺站还包括：
    第一暂存部，用于暂存在涂覆单元完成处理之后的基板，以等待进入曝光机进行曝光处理；
    第二暂存部，用于暂存完成曝光处理后的基板，以等待进入显影单元进行处理；
    其中第一暂存部和第二暂存部位于显影单元和接口站之间。
  17. 根据权利要求1所述的涂覆显影设备，其特征在于，工艺站还包括：
    光刻胶泵，位于设备前端模块和涂覆单元之间；以及
    光刻胶罐，位于移动传输部的一侧，用于存储光刻胶，并通过光刻胶泵向涂覆模块供给光刻胶。
  18. 一种涂覆显影设备的基板传输方法，采用权利要求1所述的涂覆显影设备，其特征在于，
    设备前端模块内设置有设备前端机械手，设备前端机械手将基板从设备前端模块搬出传送至工艺站；
    工艺站的涂覆单元内设置有涂覆机械手，涂覆机械手将基板送入涂覆单元，基板在涂覆单元内进行涂覆处理和热处理；
    涂覆机械手将在涂覆单元完成处理后的基板搬出涂覆单元；
    侧面机械手将从涂覆单元搬出的基板搬入移动传输部；
    移动传输部将在涂覆单元完成处理后的基板传送至接口站；
    接口站内设置有接口机械手，接口机械手将在涂覆单元完成处理后的基板从移动传输部搬出并搬入接口站，或者由另一侧面机械手将在涂覆单元完成处理后的基板从移动传输部搬出，再由接口机械手将基板搬入接口站；
    接口机械手将曝光处理后的基板从接口站搬出并传送至工艺站；
    工艺站的显影单元内设置显影机械手，显影机械手将基板送入显影单元，基板在显影单元内进行显影和热处理；
    在显影单元完成处理后的基板由显影机械手搬出显影单元；
    侧面机械手将显影单元搬出的基板搬入移动传输部；
    移动传输部将在显影单元完成处理后的基板传送至设备前端模块；
    设备前端机械手将在显影单元完成处理后基板从移动传输部搬出并搬入设备前端模块，或者由另一侧面机械手将在显影单元完成处理后基板从移动传输部搬出， 再由设备前端机械手将基板搬入设备前端模块。
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CN101794710A (zh) * 2009-01-30 2010-08-04 细美事有限公司 用于处理基板的系统及方法
CN104465460A (zh) 2010-07-09 2015-03-25 东京毅力科创株式会社 涂覆显影装置和涂覆显影方法
CN104600003A (zh) * 2013-10-31 2015-05-06 细美事有限公司 基板处理设备
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