WO2022255338A1 - 電子部品包装用カバーテープおよび包装体 - Google Patents

電子部品包装用カバーテープおよび包装体 Download PDF

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Publication number
WO2022255338A1
WO2022255338A1 PCT/JP2022/022064 JP2022022064W WO2022255338A1 WO 2022255338 A1 WO2022255338 A1 WO 2022255338A1 JP 2022022064 W JP2022022064 W JP 2022022064W WO 2022255338 A1 WO2022255338 A1 WO 2022255338A1
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WIPO (PCT)
Prior art keywords
layer
cover tape
heat seal
intermediate layer
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/022064
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English (en)
French (fr)
Japanese (ja)
Inventor
保則 長塚
友里恵 太田
菜穂 鈴木
純子 小谷
宏徳 萩尾
将弘 長尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2022575288A priority Critical patent/JP7737406B2/ja
Publication of WO2022255338A1 publication Critical patent/WO2022255338A1/ja
Priority to JP2023094578A priority patent/JP2023123545A/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Definitions

  • the present disclosure relates to a cover tape for packaging electronic components and a package using the same.
  • cover tapes are required to have excellent visibility, and various types of cover tapes for electronic component packaging have been proposed that focus on haze value and total light transmittance as indexes of visibility (for example, Patent Document 1, and 2).
  • the present disclosure has been made in view of the above circumstances, and aims to provide a cover tape for packaging electronic components with excellent visibility of electronic components.
  • One embodiment of the present disclosure includes a base layer, a heat-sealing layer disposed on one side of the base layer, and an intermediate layer disposed between the base layer and the heat-sealing layer. , wherein the void area ratio calculated from the image observed from the heat seal layer side of the electronic component packaging cover tape is 10% or less. It's tape.
  • An embodiment of the present disclosure includes a carrier tape having a plurality of storage units for storing electronic components, the electronic components stored in the storage units, and the electronic component packaging described above arranged to cover the storage units. and a cover tape for.
  • the present disclosure has the effect of being able to provide a cover tape for packaging electronic components with excellent visibility of electronic components.
  • FIG. 1 is a schematic cross-sectional view illustrating an electronic component packaging cover tape of the present disclosure
  • FIG. 1A and 1B are schematic plan and cross-sectional views illustrating a package of the present disclosure
  • FIG. 1 is a schematic cross-sectional view illustrating an electronic component packaging cover tape of the present disclosure
  • FIG. 2 shows stereoscopic microscope images and binarized images of the cover tapes of Example 2 and Comparative Example 1 observed from the heat seal layer side.
  • FIG. 4 is a partially enlarged view of the interface between the intermediate layer and the heat seal layer of the cover tape for electronic component packaging of the present disclosure
  • FIG. 4 is a partially enlarged view of an interface between an intermediate layer and a heat seal layer of a conventional electronic component packaging cover tape. It is the edge part of the photograph which photographed the storage part of the package body using the conventional cover tape through the cover tape.
  • 2 when expressing a mode of arranging another member on top of a certain member, when simply describing “above” or “below”, unless otherwise specified, 2 includes both cases in which another member is arranged directly above or directly below, and cases in which another member is arranged above or below a certain member via another member.
  • 2 when expressing a mode in which another member is arranged on the surface of a certain member, when simply describing “on the surface side” or “on the surface”, unless otherwise specified, It includes both the case of arranging another member directly above or directly below so as to be in contact with it, and the case of arranging another member above or below a certain member via another member.
  • cover tape for electronic component packaging may be simply referred to as “cover tape”.
  • the electronic component packaging cover tape of the present embodiment comprises a base layer, a heat seal layer disposed on one side of the base layer, the base layer and the heat seal layer. and an intermediate layer disposed between the electronic component packaging cover tape, wherein the void area ratio calculated from the image observed from the heat seal layer side of the electronic component packaging cover tape is 10 % or less.
  • FIG. 1 is a schematic cross-sectional view showing an example of the cover tape of the present disclosure.
  • the cover tape 1 of the present disclosure includes a base layer 2, a heat seal layer 3 disposed on one side of the base layer 2, and a base layer 2 and the heat seal layer 3. and an intermediate layer 4 disposed between.
  • an antistatic layer 5 may be arranged on the side of the substrate layer 2 opposite to the side of the heat seal layer 3 .
  • the cover tape 1 of the present disclosure has a void area ratio of 10% or less obtained from an image observed from the heat seal layer 3 side.
  • D indicates the observation direction when acquiring an image.
  • the package 10 includes a carrier tape 11 having a plurality of storage units 12 for storing electronic components 13, electronic components 13 stored in the storage units 12, and storage and a cover tape 1 arranged to cover the portion 12 .
  • the cover tape 1 is heat-sealed to the carrier tape 11, and heat-sealed portions 3h are provided in a line shape with a predetermined width at both ends of the heat-seal layer 3 of the cover tape 1.
  • the carrier tape 11 has feed holes 14 .
  • FIG. 6 shows a partially enlarged view of the interface between the intermediate layer 24 and the heat seal layer 23 of the conventional cover tape for packaging electronic parts.
  • FIG. 6 shows an end portion of a photograph taken through the cover tape of the storage portion of the package using the conventional cover tape.
  • Reference numeral 40 denotes a carrier tape
  • 41 denotes a storage portion
  • 42 denotes an electronic component
  • the present inventors focused on the void area ratio calculated from the image observed from the heat seal layer side of the cover tape, and found that if the void area ratio is a specific value or less, the visibility of the electronic component is good. I found out that it will be.
  • FIG. 5 shows a partially enlarged view of the interface between the intermediate layer and the heat seal layer of the electronic component packaging cover tape of the present disclosure.
  • the cover tape in the present disclosure has a void area ratio of 10% or less calculated from an image observed from the heat seal layer side.
  • the "void area ratio" is obtained as follows. Observation images are obtained from the heat seal layer side of the cover tape with an optical microscope (Nikon ECLIPSE ME600). Next, the image is binarized using image analysis software (Win ROOF ver 7.4.5 (Mitani Shoji), the void is selected, and the ratio (%) of the total area of the void in the analysis area is calculated. Since resin has a higher refractive index than air (voids), it has a high reflectance and is treated as a non-void portion.As image acquisition conditions and image analysis conditions, the conditions in Examples described later can be adopted. can.
  • the void area ratio calculated from the image observed from the heat seal layer side is preferably 8.0% or less, more preferably 7.5% or less, and 5.0% or less. is particularly preferred. On the other hand, for example, it is 1.0% or more, and may be 2.0% or more.
  • the size of the void is, for example, 100 ⁇ m or less, preferably 30 ⁇ m or less. This is because, if the size of the space is larger than the above range, the characters printed on the chip and part of the electrode part of the chip are overlapped, and the visibility of the print and the electrodes is deteriorated.
  • the size of the void refers to the average of three measurements of the longest length obtained by connecting two arbitrary points on the periphery of the void. That is, if the value is equal to or less than the above value, the visibility of the cover tape becomes even better.
  • the density of the voids is, for example, 0.1/100 ⁇ m square or less, preferably 0.01/100 ⁇ m square or less. If the value is less than the above value, the visibility of the cover tape becomes even better.
  • a cover tape having a void area ratio within the above range can be obtained by adjusting the roughness of the surface of the intermediate layer on the heat seal layer side, as described later.
  • a cooling roll having a small surface arithmetic average roughness Ra or maximum height roughness Rz is used, and the arithmetic average roughness Ra or maximum height roughness Rz of the surface of the intermediate layer on the heat seal layer side is By reducing the height roughness Rz, the void area ratio can be reduced.
  • a cover tape having a void area ratio within the above range can also be obtained by selecting the material for the heat seal layer or the material for the intermediate layer.
  • a method of adjusting the roughness of the surface of the intermediate layer on the heat seal layer side is particularly preferred. This is because the void area ratio can be relatively easily reduced by changing the design of the cooling roll.
  • the heat-sealing layer in the present disclosure is a layer arranged on one side of the substrate layer.
  • the heat seal layer is heat-sealed to the carrier tape to bond the cover tape and the carrier tape.
  • the heat seal layer contains a thermoplastic resin, and examples of the thermoplastic resin include ethylene-vinyl acetate copolymer, acrylic resin, ethylene-acrylic acid copolymer, acrylic-styrene copolymer, Polyester-based resins, polyurethane resins, vinyl chloride-vinyl acetate copolymers, or resins containing these as main components can be used.
  • thermoplastic resin include ethylene-vinyl acetate copolymer, acrylic resin, ethylene-acrylic acid copolymer, acrylic-styrene copolymer, Polyester-based resins, polyurethane resins, vinyl chloride-vinyl acetate copolymers, or resins containing these as main components can be used.
  • the thermoplastic resin preferably has a softening point of 80°C or lower, particularly preferably 70°C or lower. If the softening point is less than the above value, the flowability of the resin increases when the heat seal layer is laminated on the intermediate layer by extrusion lamination, so the heat seal layer is laminated so as to follow the unevenness of the surface of the intermediate layer. can do. Therefore, the generation of voids can be suppressed.
  • the softening point of the thermoplastic resin may be 30°C or higher, or 40°C or higher.
  • the softening point of the heat-sealing material used for the heat-sealing layer is preferably 80°C or lower, particularly preferably 70°C or lower.
  • the softening point of the heat seal material may be 30°C or higher, or 40°C or higher.
  • the thermoplastic resin preferably has a melt mass flow rate (MFR) of 5 g/10 minutes or more, more preferably 20 g/10 minutes or more. If the thermoplastic resin has an MFR within the above range, it will easily flow into the irregularities on the surface of the intermediate layer. be able to. On the other hand, the melt mass flow rate (MFR) may be 120 g/10 minutes or less, or 80 g/10 minutes or less. In addition, MFR in this specification means the value in 190 degreeC and 2.16 kg of loads measured by JISK7210:2014.
  • melt mass flow rate (MFR) of the heat-sealing material forming the heat-sealing layer is preferably 5 g/10 minutes or more, more preferably 20 g/10 minutes or more.
  • melt mass flow rate (MFR) of the heat seal material may be 120 g/10 minutes or less, or 80 g/10 minutes or less.
  • the thermoplastic resin preferably contains an ethylene-vinyl acetate copolymer.
  • the heat-sealing property to the carrier tape is improved. Therefore, it is possible to suppress the occurrence of unintended peeling during transportation, storage, or the like.
  • an ethylene-vinyl acetate copolymer is a copolymer containing at least ethylene monomer units and vinyl acetate monomer units.
  • An ethylene monomer unit refers to a structural unit derived from an ethylene monomer
  • a vinyl acetate monomer unit refers to a structural unit derived from a vinyl acetate monomer.
  • the content of ethylene in the ethylene-vinyl acetate copolymer is not particularly limited, but is preferably 65% by mass or more and 98% by mass or less. This is because the softening point can be adjusted within the above range.
  • the content of vinyl acetate in the ethylene-vinyl acetate copolymer is not particularly limited, but is preferably 2% by mass or more and 35% by mass or less. This is because the softening point can be adjusted within the above range.
  • the ethylene-vinyl acetate copolymer may contain a third monomer unit in addition to the ethylene monomer unit and the vinyl acetate monomer unit.
  • the third monomer unit may contain functional groups with antistatic properties.
  • the number average molecular weight of the ethylene-vinyl acetate copolymer is not particularly limited, it is preferably 50,000 or more and 500,000 or less. This is because the melt mass flow rate (MFR) can be adjusted within the above range.
  • the content of the ethylene-vinyl acetate copolymer in the heat seal layer is not particularly limited, but can be 50% by mass or more and 90% by mass or less, and can be 60% by mass or more and 80% by mass or less. Increasing the content of the ethylene-vinyl acetate copolymer improves the heat-sealing performance, but tends to increase the surface tack.
  • the heat seal layer in the present disclosure contains an ethylene-vinyl acetate copolymer, it preferably further contains a polyethylene resin.
  • a polyethylene resin By blending the polyethylene resin, it is possible to reduce the surface tackiness while maintaining good heat-sealing properties, and to suppress deterioration after being placed in a high-humidity and heat environment.
  • Polyethylene includes various types of polyethylene such as low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. 0.910 to less than 0.930) and linear low density polyethylene (LLDPE, density 0.910 to 0.925) are preferably used.
  • LLDPE linear low density polyethylene
  • classification of various polyethylenes refers to those defined in the old JIS K6748:1995 and JIS K6899-1:2000.
  • the content of polyethylene in the heat seal layer is preferably 10% by mass or more and 50% by mass or less, more preferably 20% by mass or more and 40% by mass or less.
  • the heat-sealing performance is lowered, but the surface tack tends to be lowered.
  • the heat seal layer may contain additives such as tackifiers, antistatic agents, antiblocking agents, dispersants, fillers, plasticizers, and colorants as necessary.
  • the thickness of the heat seal layer is not particularly limited, and can be, for example, 1 ⁇ m or more and 30 ⁇ m or less, preferably 10 ⁇ m or more and 20 ⁇ m or less. If it is within the above range, it is preferable because it is easy to adjust the void area ratio within the above range. On the other hand, if the thickness of the heat-sealing layer is too thin, the sealing performance may be poor, and a uniform film may not be obtained. If the thickness of the heat seal layer is too thick, the transparency of the cover tape may decrease, and the stress increase in the single layer of the heat seal layer will deteriorate the tack regardless of the surface roughness shape of the intermediate layer. (Increase).
  • a cover tape having a void area ratio of 10% or less can be obtained by reducing the roughness of the surface of the intermediate layer on the heat seal layer side.
  • the surface roughness of the cover tape on the heat-seal layer side may also be reduced.
  • the arithmetic mean roughness Ra of the surface of the cover tape on the heat seal layer side is too small, the electronic components stored in the storage portion of the carrier tape adhere to the surface of the cover tape on the heat seal layer side, resulting in poor mounting.
  • the arithmetic mean roughness Ra of the surface of the cover tape on the heat seal layer side is preferably 0.3 ⁇ m or more, more preferably 0.4 ⁇ m or more.
  • the surface of the intermediate layer on the heat-seal layer side is the surface A of the intermediate layer 4 in contact with the heat-seal layer 3 in FIG. 1 shows the surface B of the heat seal layer 3 opposite to the intermediate layer 4 in FIG.
  • the arithmetic mean roughness Ra of the surface of the cover tape on the heat seal layer side is preferably 0.7 ⁇ m or less, more preferably 0.6 ⁇ m or less. This is because the haze value can be reduced.
  • the arithmetic mean roughness Ra is a value measured based on JIS B 0601-2001 using a small surface roughness measuring machine Surftest SJ-210 (manufactured by Mitutoyo Corporation). As the test conditions and test procedures, the conditions described in Examples described later can be adopted.
  • a cover tape having a void area ratio of 10% or less and an arithmetic mean roughness Ra of the surface of the cover tape on the heat seal layer side of 0.3 ⁇ m or more and 0.7 ⁇ m or less is good. It becomes a cover tape capable of suppressing defective mounting while maintaining visibility.
  • the maximum height roughness Rz of the surface of the cover tape on the heat seal layer side in the present disclosure is, for example, 2 ⁇ m or more, preferably 3 ⁇ m or more.
  • the maximum height roughness Rz is, for example, 10 ⁇ m or less, preferably 7 ⁇ m or less.
  • the method for forming the heat seal layer is not particularly limited, and known methods can be used. For example, there is a method (extrusion lamination method) in which a heat-melted film raw material is extruded onto the intermediate layer using a T-die or the like, rapidly cooled and solidified by cooling rolls, and pressed against the intermediate layer. A method of laminating a pre-manufactured film to the intermediate layer with an adhesive may also be used.
  • the adhesive for example, a polyester-based adhesive, a polyurethane-based adhesive, an acrylic-based adhesive, or the like can be used.
  • the surface roughness of the cooling roll used for forming the heat seal layer is not particularly limited, and the arithmetic mean roughness Ra is, for example, 1.5 ⁇ m or less, preferably 1.0 ⁇ m or less, and more preferably 0.7 ⁇ m or less. . Also, the arithmetic mean roughness Ra is, for example, 0.2 ⁇ m or more, may be 0.3 ⁇ m or more, or may be 0.4 ⁇ m or more. Also, the maximum height roughness Rz is, for example, 13 ⁇ m or less, preferably 10 ⁇ m or less, and more preferably 7 ⁇ m or less. Also, the maximum height roughness Rz is, for example, 1.5 ⁇ m or more, and may be 2.5 ⁇ m or more.
  • a heat seal layer composition in which a thermoplastic resin, an antistatic agent, and other additives are dispersed or dissolved in a solvent is used, and the base of the intermediate layer described later is used.
  • a method of applying the composition for the heat seal layer to the surface opposite to the material layer and drying the composition may be used.
  • the method of applying the heat seal layer composition include roll coating, reverse roll coating, gravure coating, gravure reverse coating, comma coating, bar coating, wire bar coating, rod coating, kiss coating, knife coating, die coating, Known coating methods such as flow coating, dip coating, and spray coating can be used.
  • the intermediate layer in the present disclosure is positioned between the substrate layer and the heat seal layer.
  • the intermediate layer can improve the adhesion between the substrate layer and the heat seal layer.
  • the intermediate layer can improve cushioning properties when the cover tape of the present disclosure is heat-sealed to the carrier tape, so that heat can be applied more uniformly to the heat-seal layer.
  • the void area ratio can be adjusted within the above range by adjusting the roughness of the surface of the intermediate layer on the heat seal layer side.
  • the arithmetic average roughness Ra of the surface of the intermediate layer on the heat seal layer side is, for example, 2.0 ⁇ m or less, preferably 1.5 ⁇ m or less, and more preferably 0.5 ⁇ m or less. If it is less than the above value, the void area ratio can be adjusted within the above range.
  • the arithmetic average roughness Ra of the surface of the intermediate layer on the heat seal layer side is, for example, 0.2 ⁇ m or more, preferably 0.25 ⁇ m or more. This is because the adhesiveness to the substrate is sufficient.
  • the maximum height roughness Rz of the surface of the intermediate layer on the heat seal layer side is, for example, 14.0 ⁇ m or less, preferably 10.0 ⁇ m or less, and more preferably 5.0 ⁇ m or less. If it is less than the above value, the void area ratio can be adjusted within the above range.
  • the maximum height roughness Rz of the surface of the intermediate layer on the heat seal layer side is, for example, 1.5 ⁇ m or more, preferably 3.0 ⁇ m or more. This is because the adhesiveness to the substrate is sufficient.
  • the roughness of the intermediate layer depends on the surface roughness of the chill rolls used for extrusion lamination when forming the intermediate layer. Therefore, by adjusting the surface roughness of the cooling roll when forming the intermediate layer, it is possible to obtain a cover tape having the above void area ratio.
  • the arithmetic mean roughness Ra is, for example, 2.0 ⁇ m or less, preferably 1.5 ⁇ m or less, and more preferably 0.5 ⁇ m or less.
  • the arithmetic mean roughness Ra is, for example, 0.2 ⁇ m or more, and may be 0.25 ⁇ m or more.
  • the maximum height roughness Rz is, for example, 14.0 ⁇ m or less, preferably 10.0 ⁇ m or less, and more preferably 5.0 ⁇ m or less.
  • the maximum height roughness Rz is, for example, 1.0 ⁇ m or more, and may be 3.0 ⁇ m or more.
  • the resin material used for the intermediate layer can be appropriately selected according to the materials of the base material layer and the heat seal layer, and examples thereof include polyolefins such as polyethylene and polypropylene, polyurethane, and polyester.
  • the resin material used for the intermediate layer preferably has a softening point of 70°C or higher, particularly preferably 90°C or higher. This is because, if the softening point is above the above range, the resin hardens before being formed into the unevenness of the chill roll, so that the unevenness is reduced and the gap between the heat-seal layer and the intermediate layer can be reduced.
  • the thickness of the intermediate layer can be, for example, 5 ⁇ m or more and 50 ⁇ m or less.
  • a film can be used as the intermediate layer.
  • the method for laminating the substrate layer and the intermediate layer is not particularly limited, and known methods can be used. For example, there is a method (extrusion lamination method) in which a heat-melted raw material for a film is extruded onto the substrate layer using a T-die or the like, rapidly cooled and solidified by the cooling rolls, and pressed against the substrate layer (extrusion lamination method). As a result, an intermediate layer is formed on one side of the base material layer.
  • An anchor coat layer is preferably formed in advance on the surface of the substrate layer on which the intermediate layer is arranged.
  • the method of bonding the film manufactured previously to a base material layer with an adhesive agent is also mentioned.
  • the former method is preferred. This is because adjusting the surface roughness of the cooling roll facilitates adjusting the roughness of the surface of the intermediate layer on the heat seal layer side.
  • the base layer in the present disclosure is a layer that supports an intermediate layer, a heat seal layer, or an antistatic layer described later.
  • Various materials can be used for the base layer as long as they have mechanical strength to withstand external forces during storage and transportation, and heat resistance to withstand manufacturing and taping packaging.
  • Examples include polyesters, polyamides and polyolefins.
  • polyesters include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, and terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer.
  • Polyamides include, for example, nylon 6, nylon 66, nylon 610, and the like.
  • Polyolefins include, for example, polyethylene, polypropylene, polymethylpentene, and the like. Among them, polyesters such as polyethylene terephthalate and polyethylene naphthalate are preferably used because of their cost and mechanical strength.
  • the base material layer may contain additives such as fillers, plasticizers, colorants, and antistatic agents as necessary.
  • the substrate layer may be a single layer, or may be a laminate of multiple layers of the same or different types. Also, the substrate layer may be a stretched film or an unstretched film. Among others, the substrate layer may be a film uniaxially or biaxially stretched for the purpose of improving strength.
  • the thickness of the base material layer can be, for example, 2.5 ⁇ m or more and 300 ⁇ m or less, may be 6 ⁇ m or more and 100 ⁇ m or less, or can be 12 ⁇ m or more and 50 ⁇ m or less. If the thickness of the base material layer is too thick, the rigidity at the time of tape packaging is increased, which is disadvantageous in terms of handleability and cost. Moreover, when the thickness of the base material layer is too thin, the mechanical strength may be insufficient.
  • the haze value of the cover tape formed by laminating each of the layers described above is preferably 70% or less, and particularly preferably 60% or less.
  • the cover tape in the present disclosure preferably has a total light transmittance of 80% or more, particularly preferably 85% or more, in the cover tape formed by laminating the above layers.
  • the total light transmittance and haze value are values measured with a haze meter NDH 7000 (manufactured by Nippon Denshoku Industries) in accordance with JIS-K-7361 and JIS-K-7136:2000, respectively. .
  • the cover tape will have better visibility.
  • the correlation with the amount of white spots caused by the voids existing between the intermediate layer and the heat seal layer is not so large. Therefore, it is not possible to suppress the occurrence of deterioration in visibility due to white spots, and it is not possible to obtain a cover tape with excellent visibility.
  • the width and length of the cover tape of the present disclosure can be appropriately set according to the width and length of the carrier tape.
  • the width of the cover tape is about 1 mm or more and 100 mm or less, and may be 5.25 mm or more and 5.5 mm or less.
  • the length is about 100 m or more and 10000 m or less.
  • the cover tapes of the present disclosure are typically stored in a rolled state prior to use (before heat sealing to the carrier tape).
  • an antistatic layer is disposed on the side of the substrate layer opposite to the side of the intermediate layer.
  • the antistatic layer is disposed on the side of the base material layer opposite to the side of the intermediate layer, and is a layer for preventing the cover tape from being charged.
  • the antistatic layer can be formed by coating the base layer with an antistatic agent.
  • antistatic agents include conductive polymers such as polythiophene, polyaniline, polypyrrole, polyacetylene, polyparaphenylene, polyphenylenevinylene, and polyvinylcarbazole.
  • the conductive polymer is preferably one or more selected from the group consisting of polythiophene, polyaniline and polypyrrole. This is because sufficient antistatic properties and transparency independent of humidity can be obtained.
  • polythiophene for example, PEDOT/PSS (poly(3,4-ethylenedioxythiophene/polystyrene sulfonic acid)) is preferably used.
  • polyaniline for example, sulfonated polyaniline is preferably used.
  • the antistatic layer containing antistatic layer is preferable because low surface resistivity can be obtained even if the thickness is thin.
  • the thin thickness of the antistatic layer can improve the light transmittance of the cover tape. Since the thickness of the antistatic layer is thin, the light absorptivity of the cover tape can be lowered, and the visibility of the cover tape can be improved.
  • the antistatic layer in the present disclosure may exhibit antistatic properties by containing an antistatic agent other than the conductive polymer.
  • Antistatic agents other than conductive polymers include, for example, high-molecular-weight surfactants and low-molecular-weight surfactants. There are nonionic, cationic, and anionic surfactants, respectively. Cationic polymer surfactants are preferable from the viewpoint of antistatic performance and coating properties, and nonionic surfactants are preferred from the viewpoints of cost, optical properties, and inkability. Low-molecular-weight surfactants are preferred. As the cationic polymeric surfactant, polymeric quaternary ammonium salts are preferred.
  • the counter anion of the quaternary ammonium salt is not particularly limited, and for example, halogen ions, sulfide ions, etc. are used. From the viewpoint, the number of carbon atoms is preferably 6 or less.
  • An acryl main chain is preferable for the main chain of the polymeric quaternary ammonium salt from the viewpoint of transparency and substrate adhesion.
  • the antistatic layer may contain a resin.
  • the nonionic low-molecular-weight surfactant is not particularly limited, but fatty acid ester type having 10 to 20 lipophilic groups, ether type such as polyoxyethylene alkyl ether, ester ether type, alkanolamide type, alkyl glycoside type, alkylamine. A mold is preferred.
  • an acrylic resin binder or its crosslinked binder may be included.
  • an antistatic layer composition in which an antistatic agent or the like is dispersed or dissolved in a solvent is used, and the antistatic layer for the antistatic layer on the side opposite to the intermediate layer side of the base layer A method of applying the composition and drying it may be mentioned.
  • the coating method of the antistatic layer composition include known coating methods such as air doctor, blade coating, knife coating, rod coating, bar coating, direct roll coating, reverse roll coating, gravure coating, and slide coating. mentioned.
  • the thickness of the antistatic layer can be, for example, 0.02 ⁇ m or more and 3 ⁇ m or less. By forming the antistatic layer with such a thickness, antistatic properties can be imparted to the cover tape.
  • an adhesive layer may be provided between the substrate layer and the intermediate layer or between the intermediate layer and the heat seal layer.
  • the adhesive layer can be formed between the base layer and the intermediate layer, or between the intermediate layer and the heat-sealing layer. can improve the adhesion of
  • the adhesive layer may be appropriately selected depending on the materials used for the substrate layer, the intermediate layer, and the heat seal layer, and is not particularly limited.
  • the adhesive layer can be formed of a resin having good adhesiveness, such as an olefin-based, acrylic, isocyanate-based, urethane-based, or ester-based adhesive.
  • the application of the adhesive is not particularly limited, it can be performed by gravure coating, roll coating, or the like.
  • the thickness of the adhesive layer can be adjusted as appropriate. 5 g/m 2 or less. If it is 1 g/m 2 or more, the adhesive strength can be made uniform.
  • the method for manufacturing the cover tape for packaging electronic components of the present disclosure is not particularly limited, but the intermediate layer is placed on one surface side of the base layer, and the arithmetic mean roughness Ra of the surface is 2.0 ⁇ m or less. It is preferable to have an intermediate layer forming step in which the intermediate layer is formed by an extrusion lamination method using a cooling roll of preferably 1.5 ⁇ m or less.
  • the method of manufacturing the cover tape for electronic component packaging of the present disclosure usually includes a heat seal layer forming step.
  • the heat seal layer forming step can be performed by an extrusion lamination method in which the heat-melted raw material for the heat seal layer film is extruded onto the intermediate layer using a T-die or the like, rapidly solidified by cooling rolls, and press-bonded to the intermediate layer.
  • the heat seal layer in this step is described in the section "A. Cover tape for packaging electronic components, I. Heat seal layer" above, so the description is omitted here.
  • the package of the present disclosure includes a carrier tape having a plurality of storage units for storing electronic components, the electronic components stored in the storage units, and the above-described cover tape arranged to cover the storage units. And prepare.
  • a package using the cover tape of the present disclosure improves the visibility of electronic components when the electronic components are visually or mechanically confirmed through the cover tape.
  • FIGS. 2(a) and 2(b) are a schematic plan view and a cross-sectional view showing an example of the package of the present disclosure. 2(a) and 2(b) have been described in the above section "A. Electronic component packaging cover tape", so description thereof will be omitted here.
  • Cover tape The cover tape in the present disclosure has been described in the above section "A. Cover tape for electronic component packaging", so the description is omitted here.
  • the heat-sealed layer of the cover tape and the carrier tape are adhered at the heat-sealed portion.
  • the heat-sealed portion can be arranged, for example, in part of the portion where the heat-sealed layer of the cover tape contacts the carrier tape. That is, the heat-seal layer may have a heat-sealed portion and a non-heat-sealed portion. This makes it possible to improve the releasability of the cover tape from the carrier tape.
  • a carrier tape in the present disclosure is a member having a plurality of storage units for storing electronic components.
  • Any carrier tape may be used as long as it has a plurality of storage units. Also called a tape.) can be used. Among them, an embossed carrier tape is preferably used from the viewpoint of cost, moldability, dimensional accuracy, and the like.
  • Examples of materials for the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, and paper.
  • plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin
  • paper refers to a material containing cellulose as a main component, and may further contain a resin component.
  • the thickness of the carrier tape is appropriately selected according to the material of the carrier tape, the thickness of the electronic component, etc.
  • the thickness of the carrier tape can be 30 ⁇ m or more and 1500 ⁇ m or less. If the thickness of the carrier tape is too thick, the moldability will deteriorate, and if the thickness of the carrier tape is too thin, the strength may be insufficient.
  • the carrier tape has multiple storage compartments.
  • the storage units are usually arranged at predetermined intervals in the longitudinal direction of the carrier tape.
  • the size, depth, pitch, etc. of the storage portions are appropriately adjusted according to the size, thickness, etc. of the electronic components.
  • a general carrier tape molding method can be applied as a method for forming the carrier tape having the storage portion, and the method is appropriately selected according to the type and material of the carrier tape. Examples thereof include press molding, vacuum molding, air pressure molding, punching, and compression.
  • the electronic components used in the package of the present disclosure are not particularly limited, and examples include ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light emitting diodes), liquid crystals, piezoelectric element resistors, filters, and crystal oscillators. child, crystal oscillator, connector, switch, volume, relay, and the like.
  • the format of the IC is also not particularly limited.
  • the package of the present disclosure is used for storing and transporting electronic components. Electronic components are stored and transported in a package for mounting. At the time of mounting, the cover tape is peeled off, and the electronic component stored in the storage portion of the carrier tape is taken out and mounted on a board or the like.
  • Example 1 As a substrate layer, a biaxially stretched polyethylene terephthalate film (FE2002 manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) having a thickness of 23 ⁇ m was prepared.
  • a polyethylene resin (Novatec LC600A, manufactured by Japan Polyethylene Co., Ltd.) is melted and extruded onto the PET film surface on which the adhesive layer is formed to form a surface with an arithmetic mean roughness Ra of 0.25 ⁇ m and a maximum height roughness Rz of 3.87 ⁇ m.
  • An intermediate layer having a thickness of 15 ⁇ m was formed by an extrusion lamination method using a cooling roll.
  • Table 1 shows the arithmetic mean roughness Ra and the maximum height roughness Rz of the surface of the formed intermediate layer opposite to the PET layer side.
  • a heat seal material softening point 48° C., MFR 28 g/ 10 minutes
  • a heat seal layer with a thickness of 15 ⁇ m is formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 0.41 ⁇ m and a maximum height roughness Rz of 2.9 ⁇ m.
  • HS layer was formed.
  • Table 1 shows the arithmetic mean roughness Ra and the maximum height roughness Rz of the surface of the formed heat seal layer opposite to the intermediate layer side.
  • the arithmetic mean roughness Ra and the maximum height roughness Rz were measured based on JIS B 0601-2001 using a small surface roughness measuring machine Surftest SJ-210 (manufactured by Mitutoyo Co., Ltd.) under the following test conditions and tests. It is the value measured in the procedure.
  • a sample is obtained by cutting the cover tape obtained above into a size of 50 mm ⁇ 20 mm. With the heat seal layer side of the sample facing up, use 3MTM heat resistant polyimide tape 7414 so that it is flat on a slide glass (76 ⁇ 26 mm, 0.8 to 1.0 mmt), 4 corners or 4 sides of the sample A polyimide tape was attached to the slide glass so as not to protrude from the slide glass. A small surface roughness tester and its scanning probe were placed horizontally on the sample surface. Under the above test conditions, the scanning probe was scanned over the film surface to obtain each value of the arithmetic mean roughness Ra and the maximum height roughness Rz of the roughness curve.
  • Example 2 The intermediate layer was formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 1.2 ⁇ m and a maximum height roughness Rz of 9.7 ⁇ m, and the heat seal layer was formed by CMPS V8021 (Mitsui Dow Polychemical Co., Ltd.
  • a cover tape having a structure consisting of antistatic layer/base layer/adhesive layer/intermediate layer/heat sealing layer was produced by the method of .
  • the intermediate layer is formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 1.2 ⁇ m and a maximum height roughness Rz of 9.7 ⁇ m
  • the heat seal layer is made of Mersen MX65D (manufactured by Tosoh Corporation).
  • a heat seal material (softening point 69 ° C., MFR 65 g / 10 minutes) was used, except that it was formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 0.41 ⁇ m and a maximum height roughness Rz of 2.9 ⁇ m.
  • a cover tape composed of antistatic layer/base layer/adhesive layer/intermediate layer/heat seal layer was prepared in the same manner as in Example 1.
  • Example 4 The intermediate layer was formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 0.2 ⁇ m and a maximum height roughness Rz of 1.22 ⁇ m, and the heat seal layer was formed by CMPS V8021 (Mitsui Dow Polychemical Co., Ltd.
  • the intermediate layer is formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 1.2 ⁇ m and a maximum height roughness Rz of 9.7 ⁇ m
  • the heat seal layer is formed from an ethylene-vinyl acetate copolymer (product Name: Ultrasen 537, manufactured by Tosoh Corporation), low-density polyethylene resin (product name: Sumikasen L705, manufactured by Sumitomo Chemical Co., Ltd.) and terpene resin (product name: YS Resin PX1250, manufactured by Yasuhara Chemical Co., Ltd.) are mixed at a ratio of 73:20:7.
  • a cover tape having a structure consisting of antistatic layer/base layer/adhesive layer/intermediate layer/heat seal layer was produced in the same manner as in Example 1 except that the above was carried out.
  • the intermediate layer was formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 2.1 ⁇ m and a maximum height roughness Rz of 14.4 ⁇ m, and a heat seal layer was formed with an arithmetic mean roughness Ra of 0.41 ⁇ m and a maximum height roughness Rz of 14.4 ⁇ m.
  • Antistatic layer/base layer/adhesive layer/intermediate layer/heat A cover tape composed of a sealing layer was produced.
  • the intermediate layer is formed by an extrusion lamination method using a cooling roll having a surface with an arithmetic mean roughness Ra of 2.1 ⁇ m and a maximum height roughness Rz of 14.4 ⁇ m, and the heat seal layer is formed of the same heat seal material as in Example 3. was used, and the antistatic layer/ A cover tape having a structure of substrate layer/adhesive layer/intermediate layer/heat seal layer was produced.
  • Fig. 4 shows a stereoscopic microscope image and a binarized image of the cover tapes of Example 2 and Comparative Example 1 observed from the heat seal layer side.
  • Package samples were produced under the following taping conditions. While 500 electronic parts (0402 size_chip capacitors) are continuously placed in the cavity of the paper carrier tape, the paper carrier tape and cover tape are heated under the following conditions using a taping machine NST-35 (Nitto Kogyo). A roll-shaped package sample was obtained by winding while sealing.
  • Paper carrier tape Hokuetsu Corporation 0.31mmt 8mm width (virgin paper) Paper carrier tape sprocket hole pitch: 2mm Cover tape width: 5.25 mm width
  • Taping temperature 150°C for Example 1 and Comparative Example 1, 170° C. in Example 2 and Comparative Example 2
  • Example 3 is 170°C
  • Example 4 is 170°C
  • Example 5 is 180°C
  • Taping speed 3500 tact Taping iron Size: 0.6 ⁇ 0.05 mm x 2-wire taping iron Length (seal length at 1 tact) 8 ⁇ 1 mm
  • Electronic parts 0402 size chip capacitor
  • the cover tapes of Examples 1 to 5 having a void area ratio of 10% or less had better visibility than the cover tapes of Comparative Examples 1 and 2.
  • the cover tape of Comparative Example 2 had substantially the same arithmetic mean roughness (Ra) and haze value as those of the cover tape of Example 5, white spots were observed when observed through the cover tape.
  • the same cooling roll as in Example 2 was used to form the intermediate layer and the heat seal layer. It was confirmed that the visibility became better.
  • the occurrence of abnormal chip behavior during mounting was suppressed as compared with Example 4. This is presumed to be due to the small arithmetic mean roughness Ra of the surface of the cover tape of Example 4 on the heat seal layer side.
  • An electronic component having a base layer, a heat-sealing layer arranged on one side of the base layer, and an intermediate layer arranged between the base layer and the heat-sealing layer
  • a cover tape for packaging electronic parts wherein the void area ratio calculated from an image observed from the heat seal layer side of the cover tape for packaging electronic parts is 10% or less.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
PCT/JP2022/022064 2021-05-31 2022-05-31 電子部品包装用カバーテープおよび包装体 Ceased WO2022255338A1 (ja)

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JP2006219137A (ja) * 2005-02-08 2006-08-24 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
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