TWI836456B - 電子零件包裝用覆蓋帶及包裝體 - Google Patents

電子零件包裝用覆蓋帶及包裝體 Download PDF

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Publication number
TWI836456B
TWI836456B TW111120221A TW111120221A TWI836456B TW I836456 B TWI836456 B TW I836456B TW 111120221 A TW111120221 A TW 111120221A TW 111120221 A TW111120221 A TW 111120221A TW I836456 B TWI836456 B TW I836456B
Authority
TW
Taiwan
Prior art keywords
layer
tape
heat
cover tape
sealing layer
Prior art date
Application number
TW111120221A
Other languages
English (en)
Chinese (zh)
Other versions
TW202304270A (zh
Inventor
長塚保則
太田友里恵
鈴木菜穂
小谷純子
萩尾宏徳
長尾将弘
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202304270A publication Critical patent/TW202304270A/zh
Application granted granted Critical
Publication of TWI836456B publication Critical patent/TWI836456B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
TW111120221A 2021-05-31 2022-05-31 電子零件包裝用覆蓋帶及包裝體 TWI836456B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021091196 2021-05-31
JP2021-091196 2021-05-31

Publications (2)

Publication Number Publication Date
TW202304270A TW202304270A (zh) 2023-01-16
TWI836456B true TWI836456B (zh) 2024-03-21

Family

ID=84323295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111120221A TWI836456B (zh) 2021-05-31 2022-05-31 電子零件包裝用覆蓋帶及包裝體

Country Status (3)

Country Link
JP (2) JP7737406B2 (https=)
TW (1) TWI836456B (https=)
WO (1) WO2022255338A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7753701B2 (ja) * 2021-07-16 2025-10-15 住友ベークライト株式会社 カバーテープ、電子部品包装体およびカバーテープの製造方法
JP7673867B1 (ja) 2024-09-09 2025-05-09 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004094258A1 (ja) * 2003-04-24 2004-11-04 Dai Nippon Printing Co., Ltd. 電子部品のテーピング包装用カバーテープ
CN101426697A (zh) * 2006-04-25 2009-05-06 电气化学工业株式会社 覆盖膜
CN106604878A (zh) * 2014-11-12 2017-04-26 住友电木株式会社 电子部件包装用盖带、电子部件包装用包材和电子部件包装体
TW201924936A (zh) * 2017-10-31 2019-07-01 日商電化股份有限公司 覆蓋膜
TW202006094A (zh) * 2018-07-06 2020-02-01 美商3M新設資產公司 多層覆蓋帶構造

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4425661B2 (ja) 2004-02-16 2010-03-03 電気化学工業株式会社 カバーテープ
JP4710072B2 (ja) * 2004-06-23 2011-06-29 電気化学工業株式会社 カバーテープ
JP4706274B2 (ja) * 2005-02-08 2011-06-22 住友ベークライト株式会社 電子部品包装用カバーテープ
JP6806753B2 (ja) * 2018-09-28 2021-01-06 住友ベークライト株式会社 カバーテープおよび電子部品用包装体
JP7524598B2 (ja) * 2020-05-14 2024-07-30 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004094258A1 (ja) * 2003-04-24 2004-11-04 Dai Nippon Printing Co., Ltd. 電子部品のテーピング包装用カバーテープ
CN101426697A (zh) * 2006-04-25 2009-05-06 电气化学工业株式会社 覆盖膜
CN106604878A (zh) * 2014-11-12 2017-04-26 住友电木株式会社 电子部件包装用盖带、电子部件包装用包材和电子部件包装体
TW201924936A (zh) * 2017-10-31 2019-07-01 日商電化股份有限公司 覆蓋膜
TW202006094A (zh) * 2018-07-06 2020-02-01 美商3M新設資產公司 多層覆蓋帶構造

Also Published As

Publication number Publication date
TW202304270A (zh) 2023-01-16
JP2023123545A (ja) 2023-09-05
JPWO2022255338A1 (https=) 2022-12-08
JP7737406B2 (ja) 2025-09-10
WO2022255338A1 (ja) 2022-12-08

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