WO2022196501A1 - 積層セラミック部品 - Google Patents

積層セラミック部品 Download PDF

Info

Publication number
WO2022196501A1
WO2022196501A1 PCT/JP2022/010365 JP2022010365W WO2022196501A1 WO 2022196501 A1 WO2022196501 A1 WO 2022196501A1 JP 2022010365 W JP2022010365 W JP 2022010365W WO 2022196501 A1 WO2022196501 A1 WO 2022196501A1
Authority
WO
WIPO (PCT)
Prior art keywords
sintered body
pair
electrode
terminal portion
electrode layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/010365
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
優斗 秋山
沙也佳 渡邉
裕司 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to US18/550,067 priority Critical patent/US20240161950A1/en
Priority to JP2023507034A priority patent/JPWO2022196501A1/ja
Priority to CN202280016533.1A priority patent/CN116888692A/zh
Publication of WO2022196501A1 publication Critical patent/WO2022196501A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H01C7/108—Metal oxide
    • H01C7/112—ZnO type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Definitions

  • the present disclosure relates to laminated ceramic components used in various electronic devices.
  • Patent Document 1 is known as an example of prior art document information related to varistors.
  • the distance between the external electrodes becomes smaller as the size is reduced.
  • a metal containing silver as the main component is used as the base material for the external electrodes, if stress remains in the external electrodes, part of the external electrodes may peel off and silver may be exposed. As a result, there is a problem that migration tends to occur.
  • An object of the present disclosure is to provide a laminated ceramic component that is less susceptible to migration.
  • a laminated ceramic component includes a sintered body, a plurality of internal electrodes, and side electrodes.
  • the sintered body has a pair of end faces facing each other in the first direction, a pair of side faces facing each other in the second direction, and a pair of main faces facing each other in the third direction.
  • the shape of the sintered body is a rectangular parallelepiped whose long side is in the first direction.
  • the plurality of internal electrodes are provided inside the sintered body.
  • the side electrode is provided on at least one of the pair of side surfaces of the sintered body and electrically connected to at least one of the plurality of internal electrodes.
  • the side electrode has a primary electrode layer containing silver as a main component, and a plating layer provided to cover at least a portion of the primary electrode layer.
  • the primary electrode layer extends in the second direction from at least one of a first terminal portion provided on a side surface of the sintered body and a pair of end portions of the first terminal portion in the third direction. and a second terminal portion provided on at least one of the main surfaces of the.
  • the tip portion of the second terminal portion and the sintered body are separated.
  • the laminated ceramic component further includes an intervening portion formed by part of the plating layer entering a portion where the tip portion of the second terminal portion and the sintered body are separated.
  • FIG. 1 is a see-through perspective view of a laminated ceramic component in one embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional view of a side electrode portion of the same laminated ceramic component.
  • FIG. 3 is a see-through top view of the same laminated ceramic component.
  • FIG. 4 is an external perspective view of the same laminated ceramic component.
  • 5 is a see-through perspective view of a laminated ceramic component according to Modification 1.
  • FIG. 6 is an external perspective view of a laminated ceramic component according to Modification 1.
  • FIG. 1 A laminated ceramic component according to an embodiment of the present disclosure will be described below with reference to FIGS. 1 to 6.
  • FIG. In the following description, an example in which the multilayer ceramic component is a multilayer varistor will be described.
  • FIG. 1 is a see-through perspective view of a multilayer varistor 1 according to an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view of side electrode portions of the multilayer varistor 1.
  • the laminated varistor 1 includes a sintered body 11, a plurality of internal electrodes 13 provided inside the sintered body 11, and a plurality of internal electrodes 13 provided on the surface of the sintered body 11 and electrically connected to each of the internal electrodes 13. and a plurality of external electrodes (first to third external electrodes 12a to 12c).
  • the sintered body 11 of the laminated varistor 1 excluding the external electrodes is a rectangular parallelepiped having a length of 1.6 mm, a width of 0.8 mm and a height of 0.6 mm. 3 and other external perspective views, the outer shape of the sintered body 11 is illustrated as a rectangular parallelepiped. The corners may be rounded.
  • the X-axis direction parallel to the long side direction of the sintered body 11 is defined as the left-right direction
  • the Y-axis direction is defined as the front-back direction (depth direction)
  • the Z-axis direction is defined as the vertical direction.
  • the positive direction of the X-axis direction is defined as the right side
  • the positive direction of the Y-axis direction is defined as the front side
  • the positive direction of the Z-axis direction is defined as the upper side.
  • these directions are only examples, and are not meant to limit the directions when the multilayer varistor 1 is used.
  • the arrows indicating each direction in the drawings are only shown for explanation and are not substantial.
  • the sintered body 11 has a pair of end faces facing each other in the first direction, a pair of side faces facing each other in the second direction, and a pair of side faces facing each other in the third direction. and a pair of principal surfaces.
  • the right end face is called a first end face S11
  • the left end face is called a second end face S12.
  • the front side surface is referred to as a first side surface S21
  • the rear side surface is referred to as a second side surface S22.
  • the upper main surface is called a first main surface S31
  • the lower main surface is called a second main surface S32.
  • the sintered body 11 has a laminated structure in which a plurality of layers are laminated in the third direction, and is formed in a rectangular parallelepiped shape having long sides in the first direction.
  • the sintered body 11 is composed of a semiconductor ceramic component having nonlinear resistance characteristics.
  • the sintered body 11 contains, for example, ZnO as a main component, and Bi2O3 , Co2O3 , MnO2 , Sb2O3 , etc. as subcomponents , or Pr6O11 , Co2O3 , CaCO3 , Including Cr 2 O 3 and the like.
  • the sintered body 11 may contain, for example, ZnO as a main component and at least one of Bi 2 O 3 , Co 2 O 3 , MnO 2 and Sb 2 O 3 as subcomponents, and Pr 6 O 11 , Co 2 O 3 , CaCO 3 and Cr 2 O 3 .
  • the sintered body 11 is a laminate obtained by laminating a plurality of layers containing, for example, ZnO as a main component.
  • the sintered body 11 is formed by sintering ZnO and depositing other subcomponents at the grain boundaries, and internal electrodes 13 are formed between a plurality of layers.
  • Side electrodes 12 are respectively provided at the central portions of two side surfaces (first side surface S21 and second side surface S22) on the long sides of the sintered body 11, and these side electrodes 12 serve as first external electrodes 12a. .
  • the first external electrode 12 a is electrically connected to the first internal electrode 13 a provided in the inner layer of the sintered body 11 .
  • Two side surfaces (first side surface S21 and second side surface S22) on the long side of the sintered body 11 are provided with a second external electrode 12b and a third An external electrode 12c is provided.
  • a second internal electrode 13b electrically connected to the second external electrode 12b and a third internal electrode 13c electrically connected to the third external electrode 12c are further provided. ing.
  • the first internal electrode 13a has a first facing portion 21 and a first lead portion 22, as shown in FIGS.
  • the first facing portion 21 has a rectangular shape when viewed from above, and partially overlaps the second internal electrode 13b and the third internal electrode 13c in the third direction.
  • the first drawn portion 22 is narrower than the first facing portion 21 in the first direction.
  • the first drawer portion 22 protrudes from the first facing portion 21 along the second direction.
  • two first drawer portions 22 protrude from the first opposing portion 21 toward the front side and the rear side.
  • One of the two first lead portions 22 is electrically connected to the first external electrode 12a provided on the first side surface S21, and the other of the two first lead portions 22 is provided on the second side surface S22. It is electrically connected to the first external electrode 12a.
  • the second internal electrode 13b has a second facing portion 23 and a second lead portion 24, as shown in FIGS.
  • the second facing portion 23 faces the first facing portion 21 via a partial layer of the sintered body 11 in the third direction.
  • the top view shape of the second facing portion 23 is rectangular.
  • the width of the second opposing portion 23 is smaller than the width of the first opposing portion 21 in the first direction, and the width of the second opposing portion 23 is smaller than the width of the first opposing portion 21 in the second direction.
  • the second drawer portion 24 protrudes from the second facing portion 23 along the first direction.
  • the second lead-out portion 24 includes a first connecting portion 24b connecting between the two second external electrodes 12b and extending from the second facing portion 23 along the first direction.
  • first protruding portion 24a protrudes leftward from the second facing portion 23, for example.
  • the first connecting portion 24b protrudes forward and rearward from the left end of the first projecting portion 24a to connect the two second external electrodes 12b.
  • the third internal electrode 13c has a third facing portion 25 and a third lead portion 26, as shown in FIGS.
  • the third facing portion 25 faces the first facing portion 21 via a partial layer of the sintered body 11 in the third direction.
  • the top view shape of the third facing portion 25 is rectangular.
  • the width of the third opposing portion 25 is smaller than the width of the first opposing portion 21 in the first direction, and the width of the third opposing portion 25 is smaller than the width of the first opposing portion 21 in the second direction.
  • the third drawer portion 26 protrudes from the third facing portion 25 along the first direction. In this embodiment, the third drawer portion 26 protrudes in the opposite direction to the second drawer portion 24, for example, rightward. As shown in FIG.
  • the third lead-out portion 26 includes a second connecting portion 26b connecting between the two third external electrodes 12c and a second connecting portion 26b protruding from the third facing portion 25 along the first direction. and a second projecting portion 26a connected to the portion 26b.
  • the second protruding portion 26a protrudes, for example, rightward from the third facing portion 25.
  • the second connecting portion 26b protrudes forward and rearward from the right end of the second projecting portion 26a to connect the two third external electrodes 12c.
  • the first internal electrode 13a is provided so as to be sandwiched between the second internal electrode 13b and the third internal electrode 13c in the stacking direction of the sintered body 11.
  • the first facing portion 21 and the third facing portion 25 face each other to form a varistor region.
  • the laminated varistor 1 has two varistors (first varistor and second varistor).
  • the first varistor is configured between the first external electrode 12a and the second external electrode 12b, that is, between the first internal electrode 13a and the second internal electrode 13b.
  • the second varistor is configured between the first external electrode 12a and the third external electrode 12c, that is, between the first internal electrode 13a and the third internal electrode 13c.
  • the first external electrode 12a, the second external electrode 12b, and the third external electrode 12c have two long side surfaces (first side surface S21 and second side surface S22) when the sintered body 11 is viewed from the stacking direction. are provided one each.
  • first side surface S21 and second side surface S22 on each of the two side surfaces (the first side surface S21 and the second side surface S22) of the sintered body 11, as the side surface electrodes 12, the first external electrode 12a and the second external electrode 12b,
  • One third external electrode 12c is provided on each of the pair of side surfaces (the first side surface S21 and the second side surface S22) of the sintered body 11, and is electrically connected to at least one of the plurality of internal electrodes 13. It is good if it is.
  • the first external electrode 12a, the second external electrode 12b, and the third external electrode 12c which are the side electrodes 12, are formed by sintering a paste containing silver as a main component and further containing glass frit. It includes a primary electrode layer 14 baked onto the body 11 and a plated electrode 15 that is a plated layer formed on the surface of the primary electrode layer 14 .
  • the side electrode 12 includes a primary electrode layer 14 containing silver as a main component and a plating layer (specifically, a plating electrode 15 made of a plating layer) provided so as to cover at least a portion of the primary electrode layer 14.
  • the plated layer formed on the surface of the primary electrode layer 14 may be referred to as a plated electrode 15 below.
  • the plating electrode 15 includes a primary plating electrode 15a made of nickel or the like formed on the primary electrode layer 14, and a secondary plating electrode 15b made of tin or the like formed on the primary plating electrode 15a. That is, in this embodiment, the material of the plating layer (plating electrode 15) formed on the primary electrode layer 14 contains at least one of nickel and tin.
  • the primary electrode layer 14 has a first terminal portion 141 and a second terminal portion 142 .
  • the first terminal portion 141 is provided on the side surface of the sintered body 11 (first side surface S21 or second side surface S22).
  • the second terminal portion 142 includes a pair of terminals extending in the second direction from a pair of ends of the first terminal portion 141 in the third direction.
  • a pair of terminals are provided on both of a pair of main surfaces (first main surface S31 and second main surface S32), respectively, and the multilayer varistor 1 has, for example, the first main surface S31 and the second main surface S32. It can be mounted on the substrate with either surface facing the substrate.
  • the second terminal portion 142 includes a pair of terminals provided on both of the pair of main surfaces, but one terminal provided on either one of the pair of main surfaces is included. may contain. That is, the primary electrode layer 14 has the second terminal portion 142 extending in the second direction from at least one of the pair of end portions in the third direction of the first terminal portion 141 and provided on at least one of the pair of main surfaces. It's fine if you do.
  • the average thickness of the primary electrode layer 14 on each of the upper surface (first main surface S31) and the lower surface (second main surface S32) of the sintered body 11 is about 4 ⁇ m
  • the nickel layer (primary plating electrode 15a) is about 2 ⁇ m
  • the thickness of the tin layer (secondary plating electrode 15b) is about 3 ⁇ m.
  • the primary electrode layer 14 (see FIG. 2) constituting the side electrode 12 is formed on the side surface (first side surface S21 or second side surface S22) of the sintered body 11 by, for example, transferring electrode paste filled in grooves.
  • the primary electrode layer 14 is provided so as to partially protrude from the upper and lower surfaces of the sintered body 11 . That is, the primary electrode layer 14 constituting the side electrode 12 includes the first terminal portion 141 covering a part of the side surface (first side surface S21 or second side surface S22) of the sintered body 11, and the upper end of the first terminal portion 141. and two second terminal portions 142 extending in the second direction from the bottom portion and the bottom end portion, respectively.
  • the two second terminal portions 142 are provided so as to partially cover the upper surface (first main surface S31) and the lower surface (second main surface S32) of the sintered body 11, respectively.
  • the primary electrode layer 14 and the sintered body 11 is provided with a gap 20 .
  • the primary electrode layer 14 is formed by a groove transfer method in which the sintered body 11 is pushed into an intaglio whose grooves are filled with an electrode paste containing glass frit.
  • the average thickness of the primary electrode layer 14 is reduced compared to the transfer method in which the primary electrode layer 14 is formed by pressing the sintered body 11 against a relief plate coated with electrode paste. can.
  • the second terminal portion 142 formed on the main surface is formed by creeping up the electrode paste filled in the groove, the second terminal portion 142 is not connected to the first terminal portion 141 formed on the side surface.
  • the average thickness is formed to be thin as compared with the case.
  • the average thickness of the primary electrode layer 14 is thinner than in the case of forming by a transfer method using a letterpress, so the amount of glass frit in the electrode paste is reduced, thereby reducing the primary electrode layer 14.
  • the adhesive strength of 14 is reduced. Therefore, when the primary electrode layer 14 shrinks in the cooling process after sintering the sintered body 11 , the stress caused by the shrinkage causes the tip portion 143 of the second terminal portion 142 to peel off from the surface of the sintered body 11 .
  • a gap 20 is provided between the tip portion 143 of 142 and the sintered body 11 . In other words, at least the tip portion 143 and the sintered body 11 are separated at the second terminal portion 142 .
  • the tip portion 143 of the second terminal portion 142 is peeled off from the surface of the sintered body 11, the stress generated by shrinkage during baking is released. It is possible to reduce the possibility that the two-terminal portion 142 is further peeled off from the sintered body 11 .
  • the primary electrode layer 14 is covered with the plating electrode 15 and , the plating electrode 15 enters into the gap 20 between the primary electrode layer 14 and the sintered body 11 .
  • part of the plating layer (the electrode paste forming the plating electrode 15) enters the portion (the gap 20) where the tip portion 143 of the second terminal portion 142 and the sintered body 11 are separated, and the intervening portion 16 is formed. is formed.
  • the intervening portion 16 is provided in the portion (gap 20) where the tip portion 143 of each of the pair of terminals (second terminal portions 142) and the sintered body 11 are separated.
  • the intervening portion 16 is interposed between the tip portion 143 of the second terminal portion 142 and the sintered body 11 and covers the surface of the tip portion 143 of the second terminal portion 142 . Therefore, when the tip of the side electrode 12 is viewed from the right side of the sintered body 11, the plating electrode 15 (that is, part of the plating electrode 15 entering the gap 20) is between the primary electrode layer 14 and the sintered body 11.
  • An interposed portion 16) is interposed.
  • the tip portions 143 of the second terminal portions 142 provided on the upper and lower surfaces of the sintered body 11 in the primary electrode layer 14 are covered with the plated electrode 15 .
  • the plating electrode 15 can suppress the occurrence of migration.
  • the glass melts and solidifies to bond the primary electrode layer 14 and the sintered body 11, resulting in a shrinkage rate of A stress remains in the primary electrode layer 14 due to the difference in .
  • the plating electrode 15 is formed on the primary electrode layer 14, the residual stress is further increased. Therefore, when subjected to thermal stress such as a heat cycle, the tip portion of the primary electrode layer 14 (specifically, the tip portion 143 of the second terminal portion 142) separates from the sintered body 11, and the tip of the shortest distance with a different potential is removed. Silver in the portion (tip portion 143 of the second terminal portion 142) is exposed, and migration tends to occur.
  • the primary electrode layer 14 is separated from the sintered body 11 at the tip portion of the primary electrode layer 14 (the tip portion 143 of the second terminal portion 142), and the primary electrode layer 14 and the sintered body are separated from each other.
  • the gap 20 between the body 11 and the primary electrode layer 14 residual stress can be suppressed when the primary electrode layer 14 is baked.
  • the plating electrode 15 is formed on the primary electrode layer 14 , the plating electrode 15 (the intervening portion 16 that is part of the plating electrode 15 ) intervenes in the gap 20 so that the tip of the primary electrode layer 14 The silver in portion 143 can be covered.
  • the laminated varistor 1 is less likely to cause migration by suppressing further separation of the primary electrode layer 14 from the sintered body 11 against thermal stress such as a heat cycle. can be obtained.
  • the length L2 of the portion (the gap 20 described above) where the tip portion 143 of the second terminal portion 142 and the sintered body 11 are separated is the length L1 of the second terminal portion 142. of 3% or more and 20% or less (see FIG. 2).
  • the length of the gap 20 after baking the primary electrode layer 14 can be set to 5% or more and 10% or less of the distance from the side surface to the tip portion (the above length L1). Even more desirable. This is because if the length of the void 20 is less than 5%, the stress remaining during sintering cannot be sufficiently reduced, and if it is greater than 10%, the shape after plating becomes unstable.
  • the length L3 of the intervening portion 16 is preferably 2% or more and 8% or less of the length L1 of the second terminal portion 142 (see FIG. 2). Further, it is more desirable that the L3 be 4% or more and 6% or less of the L1. If the length L3 of the intervening portion 16 is less than 2% of the length L1 of the second terminal portion 142, the silver of the second terminal portion 142 exposed in the gap 20 may not be sufficiently covered. Further, when the length L3 of the intervening portion 16 is larger than 8% of the length L1 of the second terminal portion 142, the distance between the side electrodes 12 becomes small, and the effect of suppressing the occurrence of migration is reduced. is.
  • the average thickness of the primary electrode layer 14 is preferably 1 ⁇ m or more and 6 ⁇ m or less. Further, it is more desirable that the average thickness of the primary electrode layer 14 after baking is 2 ⁇ m or more and 4 ⁇ m or less. This is because if the average thickness of the primary electrode layer 14 after baking is less than 2 ⁇ m, the primary electrode layer 14 becomes discontinuous, and there is a possibility that electrical connection with the internal electrode 13 cannot be established. Further, when the average thickness of the primary electrode layer 14 after baking is thicker than 4 ⁇ m, the content of glass that contributes to the adhesion force between the sintered body 11 and the second terminal portion 142 of the primary electrode layer 14 increases. This is because the bonding between the primary electrode layer 14 and the sintered body 11 is strengthened and the gap 20 is not generated.
  • the multilayer varistor 1 configured as described above is mounted on a substrate provided with a balanced line to which a communication IC is connected, for example.
  • the laminated varistor 1 is mounted on a substrate, for example, using the first main surface S31 or the second main surface S32 as a mounting surface.
  • the first external electrode 12a is connected to the ground of the circuit
  • the second external electrode 12b and the third external electrode 12c are each connected to the signal line of the balanced line.
  • the electrical resistance of the multilayer varistor 1 rapidly decreases. Since current flows through the multilayer varistor 1, the circuit in which the multilayer varistor 1 is provided can be protected.
  • the multilayer varistor 1 of this embodiment includes a first varistor and a second varistor, and the capacitance of each of the first varistor and the second varistor is preferably 200 pF or less. Also, the difference between the capacitance of the first varistor and the capacitance of the second varistor is preferably -20% or more and +20% or less of the capacitance of the first varistor.
  • the multilayer varistor 1 in this embodiment contains ZnO as a main component, and Bi2O3 , Co2O3 , MnO2 , Sb2O3 , etc., or Pr6O11 , Co2O3 , CaCO3 , etc. as subcomponents. Including Cr 2 O 3 and the like.
  • ZnO is sintered and other subcomponents are precipitated at the grain boundaries, and the internal electrodes 13 are formed between the varistor layers.
  • ZnO is the main component
  • Bi2O3 , Co2O3 , MnO2 , Sb2O3 , etc., or Pr6O11 , Co2O3 , CaCO, etc. are used as subcomponents.
  • 3 , Cr 2 O 3 and the like are prepared, and a solvent, a plasticizer and the like are added to the powder to form a slurry.
  • Slurry ceramic is formed into a sheet. After that, an electrode having an arbitrary shape to be the internal electrode 13 is screen-printed on the ceramic sheet. Pd is desirable for the electrodes, but Ag is also possible.
  • the ceramic sheet on which the electrodes are printed and the ceramic sheet on which the electrodes are not printed are laminated to produce a ceramic laminate.
  • a ceramic laminate is cut into an arbitrary shape to obtain a green chip.
  • This green chip is fired to obtain a ceramic (sintered body 11) having varistor characteristics.
  • an external electrode that can be electrically connected to the internal electrode 13 is required.
  • the side electrodes 12 are applied and baked by pressing an electrode paste containing silver as a main component adhered to a letterpress against the ceramic body (sintered body 11). provides the primary electrode layer.
  • the sintered body 11 is pressed into an intaglio plate filled with an electrode paste containing 3 to 4 wt% glass, which is mainly composed of silver.
  • the primary electrode layer 14 is provided by applying it to the ceramic body (sintered body 11) and baking it.
  • a thin primary electrode layer 14 having a thickness of 1 ⁇ m or more and 6 ⁇ m or less can be formed, and shrinkage during baking stably generates a gap 20 at the tip portion 143 of the second terminal portion 142 of the primary electrode layer 14 .
  • plating can be reliably interposed in the gap 20 , and the intervening portion 16 can be provided between the tip portion 143 of the second terminal portion 142 and the sintered body 11 .
  • the first to third external electrodes 12a to 12c are provided on the long side surfaces of the sintered body 11, but the arrangement of the first to third external electrodes 12a to 12c is not limited to this. .
  • first external electrode 12a is provided on the long side surface of the sintered body 11 and the second and third external electrodes are provided on the short side end surface of the sintered body 11, migration can be similarly suppressed.
  • a laminated varistor 1 can be obtained.
  • FIG. 5 is a see-through top view of the laminated varistor 1 in Modification 1
  • FIG. 6 is an external perspective view of the laminated varistor 1 in Modification 1.
  • the second external electrode 12d is provided on the left end surface (second end surface S12) of the sintered body 11, and the third external electrode 12d is provided on the right end surface (first end surface S11) of the sintered body 11.
  • An external electrode 12e is provided. That is, the multilayer varistor 1 includes the second external electrode 12d and the third external electrode 12e as a pair of end face electrodes provided on each of the pair of end faces (the second end face S12 and the first end face S11).
  • the second external electrode 12d is provided on the entire second end surface S12, which is the left end surface, and extends from the second end surface S12 to the first side surface S21 and part of the second side surface S22 (left end portion), the first main surface S31 and the first main surface S31. It is provided over a part (left end) of the second main surface S32.
  • the third external electrode 12e is provided on the entire first end surface S11, which is the right end surface, and extends from the first end surface S11 to a part (right end) of the first side surface S21 and the second side surface S22 and the first main surface. It is provided over S31 and a part (right end) of the second main surface S32.
  • the multilayer varistor 1 includes, as the internal electrodes 13, a first internal electrode 13a electrically connected to the first external electrode 12a, a second internal electrode 13d electrically connected to the second external electrode 12d, and a third internal electrode 13e electrically connected to the third external electrode 12e. That is, in the multilayer varistor 1, the second internal electrode 13d and the third internal and an electrode 13e.
  • the first internal electrode 13a has the same configuration as the first internal electrode 13a provided in the multilayer varistor 1 shown in FIG. 1, so the description thereof will be omitted.
  • the second internal electrode 13d has a second facing portion 23 and a second lead portion 24c.
  • the second facing portion 23 faces the first facing portion 21 in the third direction.
  • the second lead-out portion 24c protrudes leftward, for example, along the first direction from the second facing portion 23 and is connected to the second external electrode 12d provided on the second end surface S12.
  • the third internal electrode 13e has a third facing portion 25 and a third lead portion 26c.
  • the third facing portion 25 faces the first facing portion 21 in the third direction.
  • the third lead-out portion 26c protrudes, for example, rightward along the first direction from the third facing portion 25 and is connected to the third external electrode 12e provided on the first end surface S11.
  • the second external electrode 12d and the third external electrode 12e are formed by a dip coating method in which the end face of the sintered body 11 is immersed in electrode paste. Therefore, the average thickness of the second external electrode 12d and the third external electrode 12e is thicker than the average thickness of the first external electrode 12a, and the primary electrode layer 14 is sintered in the second external electrode 12d and the third external electrode 12e. It is difficult to peel off from the body 11. - ⁇ Therefore, in the second external electrode 12d and the third external electrode 12e, no gap is formed between the tip portion of the second terminal portion 142 of the primary electrode layer 14 and the sintered body 11, and the intervening portion 16 is not provided. not
  • the first external electrodes 12a as the side electrodes 12 are formed by transferring the electrode paste filled in the grooves, for example, to the side surfaces (the first side surface S21 and the second side surface S22) of the sintered body 11, as in the above embodiment. ). Therefore, the thickness of the primary electrode layer 14 formed on the surface of the sintered body 11 is reduced compared to the case where the electrode paste applied to the letterpress is transferred to the side surface of the sintered body 11 to form the first external electrodes 12a. It can be made thin. Therefore, a gap 20 is provided between the tip portion 143 of the second terminal portion 142 and the sintered body 11 due to the thermal stress applied during sintering. Interposed portion 16 is provided between tip portion 143 and sintered body 11 . That is, in the multilayer varistor 1 of Modification 1, the intervening portion 16 is present at the portion where the tip portion 143 of the second terminal portion 142 of the first external electrode 12a as the side electrode 12 is separated from the sintered body 11. will do.
  • the thermal stress applied to the primary electrode layer 14 during the cooling process after sintering causes the tip portion 143 of the second terminal portion 142 to separate from the sintered body 11, and the thermal stress applied to the primary electrode layer 14 is removed. Since it is open, it is possible to prevent the primary electrode layer 14 from further peeling off from the sintered body 11 due to the heat cycle applied during use.
  • the intervening portion 16 is formed by the plating layer entering the gap 20 between the tip portion 143 of the second terminal portion 142 and the sintered body 11, the tip portion 143 of the second terminal portion 142 has a primary The silver of the electrode layer 14 can be covered with the intervening portion 16, and the occurrence of migration can be suppressed.
  • the laminated ceramic component is the laminated varistor 1 in the above-described embodiment and modified example 1, the laminated ceramic component is not limited to the laminated varistor 1 .
  • a laminated ceramic component may have a laminated structure in which a plurality of layers each containing a ceramic component are laminated, and may be a thermistor, a capacitor, or the like.
  • the number of the second internal electrodes 13b is one in the above-described embodiment and modification 1, the number of the second internal electrodes 13b may be plural.
  • the multilayer varistor 1 includes a plurality of second internal electrodes 13b, one or more first internal electrodes 13a are preferably arranged between adjacent second internal electrodes 13b.
  • the number of the third internal electrodes 13c is one in the above-described embodiment and modification 1, the number of the third internal electrodes 13c may be plural.
  • the multilayer varistor 1 includes a plurality of third internal electrodes 13c, one or more first internal electrodes 13a are preferably arranged between adjacent third internal electrodes 13c.
  • the first external electrode 12a, the second external electrode 12b, and the third external electrode 12c are provided on the first side surface S21 and the second side surface S22, respectively.
  • the first external electrode 12a, the second external electrode 12b, and the third external electrode 12c may be provided on at least one of the first side surface S21 and the second side surface S22. That is, the first external electrode 12a, the second external electrode 12b, and the third external electrode 12c may be provided on only one of the first side surface S21 and the second side surface S22.
  • the laminated ceramic component (1) of the first aspect includes a sintered body (11), a plurality of internal electrodes (13), and side electrodes (12).
  • the sintered body (11) has a pair of end faces (S11, S12) facing each other in the first direction, a pair of side faces (S21, S22) facing each other in the second direction, and a pair of side faces (S21, S22) facing each other in the third direction. It has main surfaces (S31, S32).
  • the shape of the sintered body (11) is a rectangular parallelepiped with the long side extending in the first direction.
  • a plurality of internal electrodes (13) are provided inside the sintered body (11).
  • a side electrode (12) is provided on at least one of the pair of side surfaces (S21, S22) of the sintered body (11) and electrically connected to at least one of the plurality of internal electrodes (13).
  • the side electrode (12) has a primary electrode layer (14) containing silver as a main component and a plated layer (15) provided to cover at least a portion of the primary electrode layer (14).
  • the primary electrode layer (14) has a first terminal (141) and a second terminal (142).
  • the first terminal portion (141) is provided on the side surfaces (S21, S22) of the sintered body (11).
  • the second terminal portion (142) extends in the second direction from at least one of the pair of ends of the first terminal portion (141) in the third direction and is provided on at least one of the pair of main surfaces (S31, S32). ing.
  • the tip portion (143) of the second terminal portion (142) and the sintered body (11) are separated.
  • the laminated ceramic component (1) is formed by part of the plated layer (15) entering the portion where the tip portion (143) of the second terminal portion (142) and the sintered body (11) are separated. It further comprises an intermediate portion (16).
  • the second terminal portions (142) extend in the second direction from a pair of ends of the first terminal portions (141) in the third direction. It includes a pair of terminals extending therefrom.
  • An intermediate portion (16) is provided at a portion where the tip portion (143) of each of the pair of terminals and the sintered body (11) are separated.
  • the laminated ceramic component (1) can be mounted on the substrate regardless of which side of the pair of main surfaces is used as the mounting surface.
  • the tip portion (143) of the second terminal portion (142) and the sintered body (11) are separated in the second direction.
  • the length (L2) of the portion where the contact is made is 3% or more and 20% or less of the length (L1) of the second terminal portion (142).
  • the stress remaining during sintering can be sufficiently reduced, and the possibility of silver at the tip portion (143) of the second terminal portion (142) being exposed can be reduced.
  • the length (L3) of the intervening portion (16) in the second direction is the length of the second terminal portion (142) 2% or more and 8% or less of the length (L1) of .
  • the average thickness of the primary electrode layer (14) is 1 ⁇ m or more and 6 ⁇ m or less.
  • the average thickness of the primary electrode layer (14) by setting the average thickness of the primary electrode layer (14) to 1 ⁇ m or more, the possibility that the primary electrode layer (14) is formed discontinuously is reduced, and the primary electrode layer (14) is and the internal electrode (13) is less likely to become unstable.
  • the average thickness of the primary electrode layer (14) by setting the average thickness of the primary electrode layer (14) to 6 ⁇ m or less, the bonding between the sintered body (11) and the second terminal portion (142) is suppressed from becoming too strong, and the second terminal portion A gap (20) can be easily generated between the tip portion (143) of 142 and the sintered body (11).
  • the material of the plating layer (15) contains at least one of nickel and tin.
  • a laminated ceramic component (1) of a seventh aspect is, in any one of the first to sixth aspects, a pair of end face electrodes (12d, 12e) provided on each of the pair of end faces (S11, S12), Prepare more.
  • the plurality of internal electrodes (13) include a pair of internal electrodes (13d, 13e) for end surface electrodes electrically connected to the pair of end surface electrodes (12d, 12e), respectively.
  • An intermediate portion (16) is present at a portion where the tip portion (143) of the second terminal portion (142) of the side electrode (12) is separated from the sintered body (11).
  • the configurations according to the second to seventh aspects are not essential configurations for the laminated ceramic component (1), and can be omitted as appropriate.
  • the multilayer varistor of the present disclosure is industrially useful because it is possible to obtain a multilayer varistor that does not readily cause migration even when the distance between the external electrodes is reduced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Thermistors And Varistors (AREA)
PCT/JP2022/010365 2021-03-16 2022-03-09 積層セラミック部品 Ceased WO2022196501A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US18/550,067 US20240161950A1 (en) 2021-03-16 2022-03-09 Multilayer ceramic component
JP2023507034A JPWO2022196501A1 (https=) 2021-03-16 2022-03-09
CN202280016533.1A CN116888692A (zh) 2021-03-16 2022-03-09 层压陶瓷部件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-041966 2021-03-16
JP2021041966 2021-03-16

Publications (1)

Publication Number Publication Date
WO2022196501A1 true WO2022196501A1 (ja) 2022-09-22

Family

ID=83320562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/010365 Ceased WO2022196501A1 (ja) 2021-03-16 2022-03-09 積層セラミック部品

Country Status (4)

Country Link
US (1) US20240161950A1 (https=)
JP (1) JPWO2022196501A1 (https=)
CN (1) CN116888692A (https=)
WO (1) WO2022196501A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025198014A1 (ja) * 2024-03-21 2025-09-25 パナソニックＩｐマネジメント株式会社 積層セラミック部品
WO2025225164A1 (ja) * 2024-04-25 2025-10-30 株式会社村田製作所 電子部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233908A (ja) * 1988-07-23 1990-02-05 Tdk Corp 複数端子電極付き部品の製造方法
JPH09275046A (ja) * 1996-04-04 1997-10-21 Hitachi Metals Ltd 電子部品の端子電極形成方法及び転写方法
JP2005223280A (ja) * 2004-02-09 2005-08-18 Murata Mfg Co Ltd チップ型電子部品及びその製造方法
JP2010109238A (ja) * 2008-10-31 2010-05-13 Murata Mfg Co Ltd セラミック電子部品
WO2017002495A1 (ja) * 2015-06-29 2017-01-05 京セラ株式会社 チップ型セラミック電子部品
JP2020096075A (ja) * 2018-12-12 2020-06-18 Tdk株式会社 チップバリスタ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115931A (ja) * 2005-10-21 2007-05-10 Taiyo Yuden Co Ltd バリスタ
KR101760877B1 (ko) * 2016-07-27 2017-07-24 주식회사 모다이노칩 복합 소자 및 이를 구비하는 전자기기
KR102703772B1 (ko) * 2018-08-06 2024-09-04 삼성전기주식회사 적층 세라믹 전자부품의 제조방법
JP7534987B2 (ja) * 2021-03-08 2024-08-15 Tdk株式会社 セラミック電子部品
CN117916832A (zh) * 2021-08-31 2024-04-19 株式会社村田制作所 电子部件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233908A (ja) * 1988-07-23 1990-02-05 Tdk Corp 複数端子電極付き部品の製造方法
JPH09275046A (ja) * 1996-04-04 1997-10-21 Hitachi Metals Ltd 電子部品の端子電極形成方法及び転写方法
JP2005223280A (ja) * 2004-02-09 2005-08-18 Murata Mfg Co Ltd チップ型電子部品及びその製造方法
JP2010109238A (ja) * 2008-10-31 2010-05-13 Murata Mfg Co Ltd セラミック電子部品
WO2017002495A1 (ja) * 2015-06-29 2017-01-05 京セラ株式会社 チップ型セラミック電子部品
JP2020096075A (ja) * 2018-12-12 2020-06-18 Tdk株式会社 チップバリスタ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025198014A1 (ja) * 2024-03-21 2025-09-25 パナソニックＩｐマネジメント株式会社 積層セラミック部品
WO2025225164A1 (ja) * 2024-04-25 2025-10-30 株式会社村田製作所 電子部品

Also Published As

Publication number Publication date
JPWO2022196501A1 (https=) 2022-09-22
US20240161950A1 (en) 2024-05-16
CN116888692A (zh) 2023-10-13

Similar Documents

Publication Publication Date Title
JP5777179B2 (ja) 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板
US11170937B2 (en) Multilayer ceramic electronic component
KR102076149B1 (ko) 적층 세라믹 전자부품 및 그 실장 기판
JP6104853B2 (ja) ガラス組成物、それを含有する外部電極用ペースト、及び積層セラミック電子部品
CN101228601A (zh) 多层电子组件
WO2022196501A1 (ja) 積層セラミック部品
WO2006030705A1 (ja) チップ形電子部品
JP3736602B2 (ja) チップ型サーミスタ
JP3460669B2 (ja) 積層セラミック電子部品
JP3436127B2 (ja) 電子部品用端子電極及び電子部品
JP3777856B2 (ja) 面実装用電子部品
KR101539888B1 (ko) 적층 세라믹 전자부품의 제조방법
JP2023095602A (ja) 積層バリスタ及び製造方法
US12176153B2 (en) Multilayer electronic component
JP5014856B2 (ja) 積層型フィルタ
JP2023056513A (ja) 積層型電子部品
JP2023099430A (ja) 積層型電子部品
JP2023099433A (ja) 積層型電子部品
JP3508574B2 (ja) チップ型サージアブソーバ
JP2004014437A (ja) チップ型サージアブソーバ及びその製造方法
JP3458701B2 (ja) 電子部品及びその製造方法
JP5760894B2 (ja) 静電気保護素子
JP2008270391A (ja) 積層型チップバリスタおよびその製造方法
JP3460667B2 (ja) 積層セラミック電子部品
JP2023101384A (ja) 積層型電子部品

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22771252

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202280016533.1

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2023507034

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 18550067

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22771252

Country of ref document: EP

Kind code of ref document: A1