JPWO2022196501A1 - - Google Patents

Info

Publication number
JPWO2022196501A1
JPWO2022196501A1 JP2023507034A JP2023507034A JPWO2022196501A1 JP WO2022196501 A1 JPWO2022196501 A1 JP WO2022196501A1 JP 2023507034 A JP2023507034 A JP 2023507034A JP 2023507034 A JP2023507034 A JP 2023507034A JP WO2022196501 A1 JPWO2022196501 A1 JP WO2022196501A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023507034A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022196501A1 publication Critical patent/JPWO2022196501A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores
    • H01C7/108—Metal oxide
    • H01C7/112—ZnO type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Thermistors And Varistors (AREA)
JP2023507034A 2021-03-16 2022-03-09 Pending JPWO2022196501A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021041966 2021-03-16
PCT/JP2022/010365 WO2022196501A1 (ja) 2021-03-16 2022-03-09 積層セラミック部品

Publications (1)

Publication Number Publication Date
JPWO2022196501A1 true JPWO2022196501A1 (https=) 2022-09-22

Family

ID=83320562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023507034A Pending JPWO2022196501A1 (https=) 2021-03-16 2022-03-09

Country Status (4)

Country Link
US (1) US20240161950A1 (https=)
JP (1) JPWO2022196501A1 (https=)
CN (1) CN116888692A (https=)
WO (1) WO2022196501A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025198014A1 (ja) * 2024-03-21 2025-09-25 パナソニックＩｐマネジメント株式会社 積層セラミック部品
WO2025225164A1 (ja) * 2024-04-25 2025-10-30 株式会社村田製作所 電子部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233908A (ja) * 1988-07-23 1990-02-05 Tdk Corp 複数端子電極付き部品の製造方法
JPH09275046A (ja) * 1996-04-04 1997-10-21 Hitachi Metals Ltd 電子部品の端子電極形成方法及び転写方法
JP2007115931A (ja) * 2005-10-21 2007-05-10 Taiyo Yuden Co Ltd バリスタ
JP2010109238A (ja) * 2008-10-31 2010-05-13 Murata Mfg Co Ltd セラミック電子部品
JPWO2017002495A1 (ja) * 2015-06-29 2018-03-08 京セラ株式会社 チップ型セラミック電子部品
JP2020096075A (ja) * 2018-12-12 2020-06-18 Tdk株式会社 チップバリスタ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005223280A (ja) * 2004-02-09 2005-08-18 Murata Mfg Co Ltd チップ型電子部品及びその製造方法
KR101760877B1 (ko) * 2016-07-27 2017-07-24 주식회사 모다이노칩 복합 소자 및 이를 구비하는 전자기기
KR102703772B1 (ko) * 2018-08-06 2024-09-04 삼성전기주식회사 적층 세라믹 전자부품의 제조방법
JP7534987B2 (ja) * 2021-03-08 2024-08-15 Tdk株式会社 セラミック電子部品
CN117916832A (zh) * 2021-08-31 2024-04-19 株式会社村田制作所 电子部件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233908A (ja) * 1988-07-23 1990-02-05 Tdk Corp 複数端子電極付き部品の製造方法
JPH09275046A (ja) * 1996-04-04 1997-10-21 Hitachi Metals Ltd 電子部品の端子電極形成方法及び転写方法
JP2007115931A (ja) * 2005-10-21 2007-05-10 Taiyo Yuden Co Ltd バリスタ
JP2010109238A (ja) * 2008-10-31 2010-05-13 Murata Mfg Co Ltd セラミック電子部品
JPWO2017002495A1 (ja) * 2015-06-29 2018-03-08 京セラ株式会社 チップ型セラミック電子部品
JP2020096075A (ja) * 2018-12-12 2020-06-18 Tdk株式会社 チップバリスタ

Also Published As

Publication number Publication date
US20240161950A1 (en) 2024-05-16
CN116888692A (zh) 2023-10-13
WO2022196501A1 (ja) 2022-09-22

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