WO2022196355A1 - 硬化性パーフルオロポリエーテル粘着剤組成物、その硬化物を用いた粘着剤並びに粘着テープ - Google Patents
硬化性パーフルオロポリエーテル粘着剤組成物、その硬化物を用いた粘着剤並びに粘着テープ Download PDFInfo
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- WO2022196355A1 WO2022196355A1 PCT/JP2022/008724 JP2022008724W WO2022196355A1 WO 2022196355 A1 WO2022196355 A1 WO 2022196355A1 JP 2022008724 W JP2022008724 W JP 2022008724W WO 2022196355 A1 WO2022196355 A1 WO 2022196355A1
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- WIPO (PCT)
- Prior art keywords
- perfluoropolyether
- adhesive composition
- component
- mass
- parts
- Prior art date
Links
- 239000010702 perfluoropolyether Substances 0.000 title claims abstract description 158
- 239000000203 mixture Substances 0.000 title claims abstract description 131
- 239000000853 adhesive Substances 0.000 title claims abstract description 100
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 100
- 239000002390 adhesive tape Substances 0.000 title abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 41
- 239000003960 organic solvent Substances 0.000 claims abstract description 30
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 23
- 239000011737 fluorine Substances 0.000 claims abstract description 23
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 23
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 22
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 22
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 22
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 19
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 16
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 66
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 47
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 21
- 239000000377 silicon dioxide Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 20
- 230000002209 hydrophobic effect Effects 0.000 claims description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 13
- 238000007259 addition reaction Methods 0.000 claims description 12
- 230000003197 catalytic effect Effects 0.000 claims description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 239000002904 solvent Substances 0.000 abstract description 31
- 239000003921 oil Substances 0.000 abstract description 29
- 239000000126 substance Substances 0.000 abstract description 25
- 239000011248 coating agent Substances 0.000 abstract description 19
- 238000000576 coating method Methods 0.000 abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052710 silicon Inorganic materials 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000001723 curing Methods 0.000 description 31
- 229920001971 elastomer Polymers 0.000 description 29
- 239000005060 rubber Substances 0.000 description 29
- -1 dimethylphenylsilylene group Chemical group 0.000 description 23
- 229910052799 carbon Inorganic materials 0.000 description 16
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 229920001296 polysiloxane Polymers 0.000 description 14
- 150000001721 carbon Chemical group 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000007789 gas Substances 0.000 description 12
- 230000035699 permeability Effects 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 11
- 150000002430 hydrocarbons Chemical group 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 125000004430 oxygen atom Chemical group O* 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 150000003961 organosilicon compounds Chemical class 0.000 description 7
- 125000005010 perfluoroalkyl group Chemical group 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 125000002947 alkylene group Chemical group 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 125000000962 organic group Chemical group 0.000 description 6
- 125000005702 oxyalkylene group Chemical group 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 125000005647 linker group Chemical group 0.000 description 5
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 229910021485 fumed silica Inorganic materials 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 150000003058 platinum compounds Chemical class 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 125000006551 perfluoro alkylene group Chemical group 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 101100030361 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pph-3 gene Proteins 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000001367 organochlorosilanes Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000013464 silicone adhesive Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 2
- GRGVQLWQXHFRHO-AATRIKPKSA-N (e)-3-methylpent-3-en-1-yne Chemical compound C\C=C(/C)C#C GRGVQLWQXHFRHO-AATRIKPKSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 1
- HMVBQEAJQVQOTI-UHFFFAOYSA-N 3,5-dimethylhex-3-en-1-yne Chemical compound CC(C)C=C(C)C#C HMVBQEAJQVQOTI-UHFFFAOYSA-N 0.000 description 1
- HFYAEUXHCMTPOL-UHFFFAOYSA-N 3-Methyl-1-penten-3-ol Chemical compound CCC(C)(O)C=C HFYAEUXHCMTPOL-UHFFFAOYSA-N 0.000 description 1
- JYOZFNMFSVAZAW-UHFFFAOYSA-N 4-phenylbut-3-yn-2-ol Chemical compound CC(O)C#CC1=CC=CC=C1 JYOZFNMFSVAZAW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 150000002221 fluorine Chemical class 0.000 description 1
- 238000000806 fluorine-19 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 150000001282 organosilanes Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 230000001575 pathological effect Effects 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- FPLNVLLOPKZBQX-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-5-yl)ethyl]silane Chemical compound CCO[Si](OCC)(OCC)CCC1CCCC2OC12 FPLNVLLOPKZBQX-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- NTUUXNCVRZQBFX-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-5-yl)ethyl]silane Chemical compound CO[Si](OC)(OC)CCC1CCCC2OC12 NTUUXNCVRZQBFX-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Definitions
- the pressure-sensitive adhesive of the present invention is excellent in heat resistance, oil resistance, chemical resistance, solvent resistance, low-temperature properties, moisture resistance, low gas permeability, etc., and in particular, a pressure-sensitive adhesive that forms a smooth coating film without voids on the film surface after curing.
- a curable perfluoropolyether adhesive composition (hereinafter also referred to as a perfluoropolyether adhesive composition) that forms a (perfluoropolyether rubber cured product or perfluoropolyether gel cured product), and its The present invention relates to adhesives and adhesive tapes using cured products.
- a linear perfluoropolyether compound having at least two alkenyl groups in one molecule and a perfluoropolyether structure in the main chain, and two or more H-SiOSiO structures in one molecule.
- Properties such as heat resistance, chemical resistance, solvent resistance, water repellency, oil repellency, and weather resistance are well balanced from a composition comprising an organosilicon compound such as fluorine-containing organohydrogenpolysiloxane and a hydrosilylation reaction catalyst. It has been proposed that a cured product can be obtained (Patent Documents 1 and 2).
- adhesives are used in various situations, mainly for labels and adhesive tapes attached to products.
- the applications are expanding, such as adhesive films for protecting displays and protective films during the product manufacturing process.
- it is also used for optical members, taking advantage of the transparency of the material, and is also being used in products such as Optical Clear Adhesive Tape (OCA tape).
- OCA tape Optical Clear Adhesive Tape
- the main categories of adhesives are acrylic, rubber, silicone, etc., each of which has advantages and disadvantages. Silicone pressure-sensitive adhesives are less costly than acrylic or rubber-based pressure sensitive adhesives, but are superior to the other two types of pressure sensitive adhesives in terms of heat resistance, cold resistance, weather resistance, chemical resistance, electrical insulation, etc. .
- Patent Document 4 a curable perfluoropolyether adhesive composition has been proposed (Patent Document 4). It is shown that this composition is excellent in heat resistance, weather resistance, water repellency, oil repellency, etc., and gives a cured product excellent in chemical resistance and solvent resistance.
- the exemplified composition contains a trace amount of organic solvents such as ethanol and toluene. In some cases, gasification and voids were generated, and the flatness of the coating film surface was impaired.
- the present invention has been made in view of the above circumstances, and is a cured product having excellent heat resistance, weather resistance, water repellency, oil repellency, chemical resistance, solvent resistance, etc.
- An object of the present invention is to provide a curable perfluoropolyether pressure-sensitive adhesive composition that gives a cured product characterized by no voids, and a pressure-sensitive adhesive and pressure-sensitive adhesive tape containing the cured product.
- a first aspect of the present invention is a curable perfluoropolyether pressure-sensitive adhesive composition
- A a repeating unit having at least two alkenyl groups in one molecule and represented by -C a F 2a O- (wherein a represents an integer of 1 to 6) in the main chain;
- B A fluorine-containing organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule: Curing effective Amount
- C Hydrosilylation reaction catalyst:
- a curable perfluoropolyether pressure-sensitive adhesive composition is provided which contains a catalytic amount and does not contain an organic solvent in the composition.
- curable perfluoropolyether adhesive composition containing components (A) to (C) as in the first aspect of the present invention and does not contain an organic solvent in the composition, heat resistance and weather resistance , Excellent water repellency, oil repellency, oil resistance, low temperature properties, moisture resistance, low gas permeability, etc., and gives a cured product (adhesive) that has a smooth coating film without voids on the film surface after curing.
- a curable perfluoropolyether adhesive composition is obtained.
- the rubber cured product perfluoro Polyether rubber cured product
- the pressure-sensitive adhesive composition is Since it does not thicken or gel, workability is improved, and it is excellent in heat resistance, weather resistance, water repellency, oil repellency, oil resistance, low temperature properties, moisture resistance, low gas permeability, etc. Especially after curing film surface It becomes a curable perfluoropolyether adhesive composition that gives a cured product (adhesive) that is free of voids and forms a smooth coating film.
- the curable perfusate further contains 0.5 to 20 parts by mass of hydrophobic silica powder as component (F) with respect to 100 parts by mass of component (A).
- a fluoropolyether adhesive composition is provided.
- the hydrophobic silica powder of component (F) is essentially free of organic solvent.
- a curable perfluoropolyether adhesive composition with excellent scratch resistance can be obtained from an adhesive composition containing such a hydrophobic silica powder.
- a curable perfluoropolyether pressure-sensitive adhesive composition (A) a repeating unit having at least two alkenyl groups in one molecule and represented by -C a F 2a O- (wherein a represents an integer of 1 to 6) in the main chain; A linear perfluoropolyether compound having a perfluoropolyether structure containing: 100 to 40 parts by mass (D) having one alkenyl group in one molecule and a perfluoropolyether structure in the main chain Polyfluoromonoalkenyl compound having: 0 to 60 parts by mass (however, the total amount of the components (A) and (D) is 100 parts by mass.) (B) fluorine-containing organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule: curing effective amount (C) hydrosilylation reaction catalyst: containing a catalytic amount of an organic solvent in the composition Provided is a curable
- the total amount of components is 100 parts by mass.
- curable perfluoropolyether adhesive composition containing components (A) to (D) like the second aspect of the present invention and does not contain an organic solvent in the composition, heat resistance and weather resistance , Excellent water repellency, oil repellency, oil resistance, low temperature properties, moisture resistance, low gas permeability, etc., and gives a cured product (adhesive) that has a smooth coating film without voids on the film surface after curing.
- a curable perfluoropolyether adhesive composition is obtained.
- a curable perfluoropolyether pressure-sensitive adhesive composition containing the above components (A) to (D) of the present invention and does not contain an organic solvent in the composition, a cured rubber or cured gel (perfluoropolyether rubber cured product or gel cured product).
- the perfluoropolyether gel cured product (hereinafter sometimes referred to as perfluoropolyether gel) is a cured product containing perfluoropolyether as a main component and having a low cross-linking density.
- Penetration also referred to as cone penetration
- JIS K6249 according to the consistency test method (1/4 cone) is 10 to 100.
- This corresponds to a rubber hardness measurement value (rubber hardness value) of 0 according to JIS K6301, which is so low in hardness (i.e., soft) and low elasticity (low stress) that it does not show an effective rubber hardness value.
- rubber hardness value rubber hardness value
- JIS K6301 cured perfluoropolyether rubber
- the cured film of perfluoropolyether gel cured product having a softness of 10 to 100 in the penetration defined by JIS K6249 according to JIS K2220 (1/4 cone) is usually subjected to a pencil hardness test (JIS K5600-5-4 45° scratch resistance test with a pencil lead) corresponds to a soft film of "6B" or less, while perfluoropolyether rubber cured product (rubber elasticity The cured film of body) usually shows a scratch resistance of "5B" or higher in the same test.
- Rf 1 is a perfluoropolyether structure represented by the general formula F-[CF(CF 3 )CF 2 O] w -CF(CF 3 )- (wherein w represents an integer of 1 to 500); is. ] is preferably a polyfluoromonoalkenyl compound represented by
- a composition containing such a component (D) is a curable perfluoropolyether adhesive composition that gives a cured product (adhesive) with excellent chemical resistance and solvent resistance.
- an addition reaction controller not containing an organic solvent is added in an amount of 0.01 to 0.01 parts per 100 parts by mass of the components (A) and (D).
- a curable perfluoropolyether adhesive composition containing 5 parts by mass.
- the pressure-sensitive adhesive composition is Since it does not thicken or gel, workability is improved, and it is excellent in heat resistance, weather resistance, water repellency, oil repellency, oil resistance, low temperature properties, moisture resistance, low gas permeability, etc. Especially after curing film surface It becomes a curable perfluoropolyether adhesive composition that gives a cured product (adhesive) that is free of voids and forms a smooth coating film.
- a component (F) 0.5 to 20 parts by mass of hydrophobic silica powder with respect to a total of 100 parts by mass of the component (A) and the component (D)
- a curable perfluoropolyether pressure-sensitive adhesive composition is provided.
- the hydrophobic silica powder of component (F) is essentially free of organic solvents.
- a curable perfluoropolyether adhesive composition with excellent scratch resistance can be obtained from an adhesive composition containing such a hydrophobic silica powder.
- the component (C) does not contain an organic solvent.
- Such a (C) component is used so that the composition does not contain an organic solvent.
- the component (A) is represented by the following general formula (1) [In the formula, X is -CH 2 -, -CH 2 O-, -CH 2 OCH 2 -, or -Y-NR 1 -CO- (provided that Y is -CH 2 - or the following structural formula (Z) (i.e., a dimethylphenylsilylene group in the ortho, meta, or para positions), and R 1 is a hydrogen atom, a methyl group, a phenyl group, or an allyl group).
- X' is -CH 2 -, -OCH 2 -, -CH 2 OCH 2 -, or -CO-NR 2 -Y'- (provided that Y' is -CH 2 - or represented by the following structural formula (Z') (i.e., a dimethylphenylsilylene group at the ortho, meta, or para position), and R2 is a hydrogen atom, a methyl group, a phenyl group, or an allyl group).
- Z' i.e., a dimethylphenylsilylene group at the ortho, meta, or para position
- R2 is a hydrogen atom, a methyl group, a phenyl group, or an allyl group.
- p is independently 0 or 1
- r is an integer of 2-6
- m and n are each an integer of 0-600, and the sum of m and n is 50-600.
- It is preferably a linear perfluoropolyether compound represented
- a composition containing such a component (A) provides a cured product (adhesive) having excellent chemical resistance and solvent resistance and a curable perfluoropolyether adhesive composition having high adhesive strength. .
- the composition is cured to form an adhesive having an adhesive strength of 0.001 N/25 mm to 10.0 N/25 mm.
- a perfluoropolyether adhesive composition is desirable.
- a composition that gives a cured product having such adhesive strength is a curable perfluoropolyether adhesive composition with good adhesive strength to adherends.
- the cured product of the curable perfluoropolyether adhesive composition is a non-conductive adhesive having a volume resistivity of 1 ⁇ 10 9 ⁇ cm or more. is preferably
- the curable perfluoropolyether adhesive composition of the present invention can be suitably used as a material for such non-conductive adhesives.
- the present invention also provides a pressure-sensitive adhesive containing a cured product of the curable perfluoropolyether pressure-sensitive adhesive composition.
- the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention can be used as a pressure-sensitive adhesive that provides a perfluoropolyether rubber cured product or a perfluoropolyether gel cured product with excellent adhesiveness to various substrates. can be done.
- the present invention also provides a pressure-sensitive adhesive tape comprising a base material and a cured product layer of the curable perfluoropolyether pressure-sensitive adhesive composition laminated thereon.
- the cured product layer of the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention (the pressure-sensitive adhesive layer made of a cured perfluoropolyether rubber or perfluoropolyether gel cured product) is laminated on a substrate. By doing so, it can be used as an adhesive tape having a non-conductive adhesive layer.
- the perfluoropolyether pressure-sensitive adhesive composition of the present invention has heat resistance, weather resistance, oil resistance, low temperature properties, moisture resistance, low gas permeability, water repellency, oil repellency, chemical resistance, It is excellent in solvent resistance, etc., and can provide a rubber-like or gel-like cured product (adhesive) that forms a smooth coating film without voids on the film surface after curing.
- a curable perfluoro perfluoro-curable material that is excellent in heat resistance, weather resistance, water repellency, oil repellency, etc., and in particular, gives a cured product (adhesive) that becomes a smooth coating film without voids on the film surface after curing.
- Development of a pressure-sensitive adhesive and pressure-sensitive adhesive tape containing a polyether pressure-sensitive adhesive composition and its cured product has been desired.
- the present inventors have made intensive studies to achieve the above object, and as a result, according to the specific perfluoropolyether pressure-sensitive adhesive composition according to the present invention, the chemical resistance and solvent resistance are higher than those of conventional silicone pressure-sensitive adhesives. It gives a rubber-like or gel-like cured product (perfluoropolyether rubber cured product or perfluoropolyether gel cured product) with excellent adhesion, and in particular, the cured product that becomes a smooth coating film without voids on the film surface after curing (adhesive).
- a first aspect of the present invention is a curable perfluoropolyether adhesive composition that gives a rubber-like cured product (perfluoropolyether rubber cured product),
- A a repeating unit having at least two alkenyl groups in one molecule and represented by -C a F 2a O- (wherein a represents an integer of 1 to 6) in the main chain;
- C Hydrosilylation reaction catalyst: A curable perfluoropolyether adhesive composition containing a catalytic amount and containing no organic solvent in the composition.
- the component (A) contained in the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention is the main ingredient (base polymer) of the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention. It has at least two alkenyl groups in one molecule, and a perfluoropolyether structure (perfluorooxyalkylene structure) in the main chain, preferably a divalent perfluorooxyalkylene structure It is a linear perfluoropolyether compound having
- a repeating structure of a number of oxyalkylene units represented by -C a F 2a O- (wherein a in each unit is independently an integer of 1 to 6) is used.
- Examples include those represented by the following general formula (3).
- Examples of the individual repeating structures —C a F 2a O— (ie, oxyalkylene units) constituting the perfluorooxyalkylene structure represented by formula (3) include the following structures.
- the perfluoroalkyl ether structure may be composed of one of these repeating structures alone, or may be a combination of two or more.
- linear means that the individual repeating units —C a F 2a O— (oxyalkylene units) constituting the perfluoropolyether structure (perfluorooxyalkylene structure) of the main chain are straight to each other. It means that each repeating unit (oxyalkylene unit) itself is a linear oxyalkylene unit or a branched oxyalkylene unit (e.g., -CF (CF 3 )CF 2 O—, —C(CF 3 ) 2 O—, etc.).
- the alkenyl group in the linear perfluoropolyether compound of component (A) preferably has 2 to 8 carbon atoms, particularly 2 to 6 carbon atoms, and has a CH 2 ⁇ CH— structure at the end.
- a vinyl group, an allyl group, a propenyl group, an isopropenyl group, a butenyl group, a hexenyl group, and the like having a CH 2 ⁇ CH— structure at the end thereof, particularly a vinyl group and an allyl group.
- This alkenyl group may be directly bonded to both ends of a perfluoropolyether structure, particularly a divalent perfluorooxyalkylene structure, which constitutes the main chain of the linear perfluoropolyether compound, or a divalent such as -CH 2 -, -CH 2 O-, -CH 2 OCH 2 -, or -Y-NR-CO- [provided that Y is -CH 2 - or represented by the following structural formula (Z) group to be (Dimethylphenylsilylene group at ortho-, meta- or para-position) and R is a hydrogen atom, a methyl group, a phenyl group, or an allyl group. ] or the like.
- component (A) has at least two alkenyl groups in one molecule.
- Component (A) includes polyfluorodialkenyl compounds represented by the following general formula (4) or (5).
- X is independently -CH 2 -, -CH 2 O-, -CH 2 OCH 2 -, or -Y-NR 1 -CO- (provided that Y is -CH 2 - or the following structural formula (Z )
- R 1 is a hydrogen atom, a methyl group, a phenyl group, or an allyl group
- X′ is —CH 2 —, —OCH 2 —, —CH 2 OCH 2 —, or -CO-NR 2 -Y'- (where Y' is -CH 2 - or a group represented by the following structural formula (
- linear perfluoropolyether compound of component (A) those represented by the following general formula (1) are particularly suitable.
- X, X′ and p are the same as above, r is an integer of 2 to 6, m and n are integers of 0 to 600, respectively, and the sum of m and n is 50 to 600.
- r is an integer of 2 to 6
- m and n are integers of 0 to 600, respectively, and the sum of m and n is 50 to 600.
- the linear perfluoropolyether compound of the above general formula (1) has a polyethylene-equivalent weight-average molecular weight of 3,000 to 3,000 in molecular weight distribution measurement by gel permeation chromatography (GPC) analysis using a fluorine-based solvent as a developing solvent. 100,000, preferably 4,000 to 50,000.
- GPC gel permeation chromatography
- 100,000, preferably 4,000 to 50,000 When the weight-average molecular weight is 3,000 or more, swelling in gasoline and various solvents is reduced. In particular, the swelling with respect to gasoline is 6% or less, and the properties can be satisfied as a member required to be resistant to gasoline. Further, when the weight average molecular weight is 100,000 or less, the viscosity is not too high and the workability is excellent, which is practical.
- the value of the degree of polymerization (m+n) of the linear perfluoropolyether compound of the general formula (1) is similarly measured by gel permeation chromatography (GPC) analysis using a fluorine-based solvent as a developing solvent. It can be obtained as a number average degree of polymerization or a weight average degree of polymerization in terms of polyethylene.
- the number average degree of polymerization and number average molecular weight can also be calculated from the ratio of the terminal structure to the repeating unit structure obtained from the 19 F-NMR spectrum.
- linear perfluoropolyether compound represented by general formula (1) include those represented by the following formula.
- the linear perfluoropolyether compound as described above is added in advance as a molecular
- the component (A) a product obtained by subjecting an organosilicon compound containing two SiH groups in the interior to a hydrosilylation reaction under ordinary methods and conditions to extend the chain length.
- the straight-chain perfluoropolyether compound of component (A) may be used alone or in combination of two or more.
- component (B) acts as a cross-linking agent and/or chain extender for component (A).
- This component (B) is a fluorine-containing organohydrogenpolysiloxane having at least two, preferably three or more, silicon-bonded hydrogen atoms (hydrosilyl groups represented by SiH) per molecule.
- Examples of such component (B) include the known fluorine-containing organohydrogenpolysiloxanes described in Patent Document 1, Patent Document 2 and Patent Document 4, but are not particularly limited.
- the fluorine-containing organohydrogenpolysiloxane of component (B) contains an adhesive functional group having a heteroatom such as nitrogen, oxygen or sulfur in the molecule (for example, an alkoxy group, an epoxy group, a (meth)acryloxy group, mercapto group, etc.), it is clearly distinguished from the organosilicon compound (especially the organohydrogenpolysiloxane having the adhesive functional group) of component (G), which is an optional component described later. It is a thing.
- the fluorine-containing organohydrogenpolysiloxane of the component (B) is compatible with the component (A), or in the second embodiment of the present invention described later, the component (A) and the component (D) described later. From the viewpoint of dispersibility, uniformity of cured rubber or gel (adhesive) after curing, etc., one or more monovalent perfluoroalkyl groups, monovalent perfluorooxyalkyl groups, divalent Fluorine-containing organohydrogenpolysiloxane having a perfluoroalkylene group and/or a divalent perfluorooxyalkylene group can be preferably used.
- Examples of the monovalent or divalent fluorine-containing organic group include perfluoroalkyl groups, perfluorooxyalkyl groups, perfluoroalkylene groups and perfluorooxyalkylene groups represented by the following formulas.
- f is an integer of 1 to 200, preferably an integer of 1 to 100, and h is an integer of 1 to 3.
- i and j are each an integer of 1 or more, preferably an integer of 1 to 100, and the average of i+j is 2 to 200, preferably 2 to 100.
- d and e are each an integer of 1 to 50, preferably an integer of 1 to 40.
- the perfluoroalkyl group, perfluorooxyalkyl group, perfluoroalkylene group or perfluorooxyalkylene group and the silicon atom are preferably connected by a divalent linking group, and the divalent linking group is is an alkylene group, an arylene group, a combination thereof, or an ether-bonded oxygen atom, an amide bond, a carbonyl bond, an ester bond, a diorganosilylene group, or the like in these groups. but not limited thereto.
- monovalent substituents bonded to silicon atoms other than the above-mentioned monovalent or divalent fluorine-containing organic groups and silicon-bonded hydrogen atoms SiH groups
- groups include alkyl groups such as methyl group, ethyl group, propyl group, butyl group, hexyl group, cyclohexyl group, octyl group and decyl group; alkenyl groups such as vinyl group and allyl group; Aryl groups such as naphthyl group; aralkyl groups such as benzyl group and phenylethyl group, and some or all of the hydrogen atoms of these groups are substituted with chlorine atoms, cyano groups, etc., e.g., chloromethyl group, chloropropyl group , a cyanoethyl group, and other unsubstituted or substituted
- the siloxane skeleton in the molecule may be cyclic, linear, branched, three-dimensional network, or a combination thereof.
- the number of silicon atoms in this fluorine-containing organohydrogenpolysiloxane is not particularly limited, it is usually about 2-60, preferably about 3-30.
- Examples of (B) components having such monovalent or divalent fluorine-containing organic groups and silicon-bonded hydrogen atoms include the following compounds. These compounds may be used singly or in combination of two or more. In the formula below, Me represents a methyl group and Ph represents a phenyl group.
- the amount of component (B) is an effective amount for curing component (A) and component (D) described later, that is, an effective amount for curing.
- Hydrosilyl groups (Si—H) in component (B) per mol, or in the second embodiment of the present invention described later, per 1 mol total of alkenyl groups possessed by components (A) and (D) is preferably 0.2 to 4 mol, more preferably 0.5 to 3 mol. If the amount of hydrosilyl groups (Si—H) is 0.2 mol or more, the degree of cross-linking is sufficient and a cured product can be reliably obtained. Also, if the amount of hydrosilyl groups (Si—H) is 4 mol or less, there is no fear of foaming during curing.
- the component (B) can be used singly or in combination of two or more.
- the hydrosilylation reaction catalyst (addition reaction catalyst) of component (C) of the present invention is an alkenyl group in component (A), or in the second embodiment of the present invention described later, It is a catalyst that accelerates the addition reaction between alkenyl groups in component (A) and component (D) described later and hydrosilyl groups in component (B).
- This hydrosilylation reaction catalyst is generally a compound of a noble metal (platinum group metal) and is expensive, so relatively easily available platinum or a platinum compound is often used.
- platinum compounds include chloroplatinic acid, complexes of chloroplatinic acid and olefins such as ethylene, complexes with vinylsiloxane, and metal platinum supporting silica, alumina, carbon, or the like.
- platinum group metal catalysts other than platinum compounds rhodium, ruthenium, iridium, and palladium compounds are also known, such as RhCl(PPh3) 3 , RhCl(CO)( PPh3)2 , Ru3 ( CO) 12 , IrCl(CO)(PPh 3 ) 2 , Pd(PPh 3 ) 4 and the like can be exemplified.
- the amount of the hydrosilylation reaction catalyst can be a catalytic amount, but it is usually 0.1 to 500 ppm (in terms of mass of platinum group metal) with respect to the total mass of components (A), (B) and (D). and more preferably 0.1 to 100 ppm.
- the component (C) hydrosilylation reaction catalyst can be used alone or in combination of two or more.
- the hydrosilylation reaction catalyst (addition reaction catalyst) of the component (C) of the present invention does not contain an organic solvent (for example, the above platinum group metal catalyst is not diluted, dissolved or dispersed in an organic solvent). be.
- [(E) component] In the first aspect of the present invention (or in the second aspect described later), it is optional to add a hydrosilylation reaction catalyst controller (addition reaction controller) as component (E), if necessary.
- the addition reaction controller does not contain an organic solvent.
- Component (E) causes the adhesive composition to thicken or gel before heat curing, for example, when the curable perfluoropolyether adhesive composition is prepared or when the adhesive composition is applied to a substrate.
- can be added to prevent For example, 1-ethynyl-1-hydroxycyclohexane, 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-penten-3-ol, phenylbutyn-3-ol, acetylene alcohol such as nol, 3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexene-1-yne, polymethylvinylsiloxane cyclic compound, organic phosphorus compound and the like. , the addition of which can maintain appropriate curing reactivity and storage stability.
- (E) component may be used individually by 1 type, or may be used together by 2 or more types.
- the amount of component (E) to be blended is 100 parts by mass of component (A), or, in the second aspect of the present invention, which will be described later, to a total of 100 parts by mass of components (A) and (D) described later. On the other hand, it is in the range of 0 to 5 parts by mass, and when blended, it is preferably in the range of 0.01 to 5 parts by mass, more preferably in the range of 0.02 to 4 parts by mass. If the blending amount is 5 parts by mass or less, the curability of the resulting composition is not lowered.
- hydrophobic silica powder as component (F) as needed.
- the hydrophobic silica powder of component (F) is essentially free of organic solvent.
- Component (F), the hydrophobic silica powder imparts appropriate physical strength to the cured product obtained from the curable perfluoropolyether pressure-sensitive adhesive composition. It has the effect of uniformly dispersing it in a substance.
- hydrophobic silica powder of the component (F) finely divided silica having a BET specific surface area of 50 m 2 /g or more, particularly 50 to 400 m 2 /g, which is known as a filler for silicone rubber, is preferably hydrophobized. is.
- finely divided silica examples include fumed silica (fumed silica or dry silica), precipitated silica (wet silica), colloidal silica, etc. Among these, fumed silica is most preferred.
- the BET specific surface area is 50 m 2 /g or more, the physical strength of the resulting cured product is sufficient, and component (G) is uniformly dispersed. If it is 400 m 2 /g or less, the kneading operation becomes easy, and component (F) itself is uniformly dispersed.
- the BET specific surface area in the present invention can be measured according to DIN 66131.
- hydrophobizing agent for finely divided silica examples include organochlorosilane, organodisilazane, cyclic organopolysilazane, and linear organopolysiloxane.
- organochlorosilane, organodisilazane, cyclic organo Polysilazanes are preferred.
- component (F) When component (F) is blended in the composition of the present invention, the amount is per 100 parts by mass of component (A), or per 100 parts by mass of component (A) and component (D), which will be described later. 0.5 to 20 parts by mass is preferable, and 1 to 18 parts by mass is more preferable. If the blending amount is 0.5 parts by mass or more, the effect of blending it can be reliably obtained. On the other hand, when the content is 20 parts by mass or less, the fluidity of the composition does not deteriorate, and the coatability onto the substrate is improved.
- adhesion imparting agent adheresion aid or adhesion improver
- the (G) component adhesion-imparting agent is an optional component that is blended as necessary, and acts as an aid (adhesion aid or adhesion improver) for improving adhesion to substrates.
- a hydrolyzable organosilane compound So-called silane coupling agents or carbon functional silanes
- organohydrogensilanes having the adhesive functional group in the molecule and organohydrogensilanes having the adhesive functional group in the molecule organic silicon compounds such as hydrogen polysiloxane
- an organosilicon compound a hydrogen atom (SiH group) bonded to a silicon atom in one molecule, an epoxy group bonded to a silicon atom via a carbon atom or a carbon atom and an oxygen atom, and a carbon atom or a carbon
- Organosilicon compounds organo (hydrogen) silanes, organo (hydrogen) silanes, organo (hydrogen) gen) polysilox
- Organopolysiloxane having one or more monovalent perfluoroalkyl groups or monovalent perfluorooxyalkyl groups bonded to silicon atoms via siloxane).
- organosilicon compounds of component (G) fluorine-containing organohydrogenpolysiloxanes containing adhesive functional groups have adhesive functional groups ( For example, it has an alkoxy group, an epoxy group, a (meth)acryloxy group, a mercapto group, etc.), and is different from the fluorine-containing organohydrogenpolysiloxane of component (B) described above.
- the siloxane skeleton of such an organopolysiloxane may be cyclic, linear, branched, or a mixture thereof.
- component (G) examples include ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, ⁇ -(3,4-epoxycyclohexyl)ethyltrimethoxysilane, ⁇ -(3 ,4-epoxycyclohexyl)ethyltriethoxysilane, ⁇ -(2,3-epoxycyclohexyl)ethyltrimethoxysilane, ⁇ -(2,3-epoxycyclohexyl)ethyltriethoxysilane, and other organosilanes containing adhesive functional groups
- organopolysiloxane represented by the following general formula can be used.
- R 1 ' is independently an unsubstituted or halogen-substituted monovalent hydrocarbon group
- a and B are shown below, w is an integer of 0 ⁇ w ⁇ 100, x is 1 ⁇ x ⁇ 100 Integer, y is an integer of 1 ⁇ y ⁇ 100, and z is an integer of 0 ⁇ z ⁇ 100.
- halogen-substituted or unsubstituted monovalent hydrocarbon group for R 1 ' those having 1 to 10 carbon atoms, particularly preferably 1 to 8 carbon atoms, are specifically methyl, ethyl, propyl, butyl and hexyl.
- Aryl groups such as phenyl group and tolyl group;
- Aralkyl groups such as benzyl group and phenylethyl group; Examples include substituted monovalent hydrocarbon groups substituted with halogen atoms, and among these, a methyl group is particularly preferred.
- w is preferably an integer of 0 ⁇ w ⁇ 20
- x is preferably an integer of 1 ⁇ x ⁇ 20
- y is preferably an integer of 1 ⁇ y ⁇ 20
- z is preferably an integer of 1 ⁇ z ⁇ 20
- 3 ⁇ w+x+y+z ⁇ 50 is preferred.
- A represents an epoxy group bonded to a silicon atom via a carbon atom or a carbon atom and an oxygen atom and/or a trialkoxysilyl group bonded to a silicon atom via a carbon atom or a carbon atom and an oxygen atom, specifically , the following groups can be mentioned.
- R 2 ′ represents a divalent hydrocarbon group (alkylene group, cycloalkylene group, etc.) having 1 to 10 carbon atoms, particularly 1 to 5 carbon atoms, which may be interposed by an oxygen atom.
- R 3 represents a divalent hydrocarbon group having 1 to 10 carbon atoms, especially 1 to 4 (such as an alkylene group), and R 4 represents a monovalent hydrocarbon group having 1 to 8 carbon atoms, especially 1 to 4 (alkyl group, etc.).
- R 5 represents a monovalent hydrocarbon group (such as an alkyl group) having 1 to 8 carbon atoms, particularly 1 to 4 carbon atoms
- R 6 represents a hydrogen atom or a methyl group
- k represents an integer of 2 to 10.
- B represents a monovalent perfluoroalkyl group or perfluorooxyalkyl group bonded to a silicon atom via a carbon atom or a carbon atom and an oxygen atom.
- monovalent perfluoroalkyl groups or perfluorooxyalkyl groups include those represented by the following general formulas.
- the divalent linking group containing a carbon atom or a carbon atom and an oxygen atom includes an alkylene group, an arylene group, a combination thereof, or a group containing an ether-bonded oxygen atom, an amide bond, a carbonyl bond, or the like.
- organopolysiloxanes contain an organohydrogenpolysiloxane having three or more silicon-bonded hydrogen atoms (Si—H groups) per molecule, an aliphatic unsaturated group such as a vinyl group or an allyl group, and an epoxy group. and/or a trialkoxysilyl group, and optionally a compound containing an aliphatic unsaturated group and a perfluoroalkyl group or a perfluorooxyalkyl group, are subjected to a partial addition reaction according to a conventional method. be able to.
- the number of aliphatic unsaturated groups should be less than the number of Si—H groups.
- the target substance may be isolated after the completion of the reaction, but it is also possible to use a mixture from which unreacted substances and addition reaction catalysts have been removed.
- (G) component organopolysiloxane examples include those represented by the following structural formulas.
- Me is a methyl group and Ph is a phenyl group.
- the (G) component may be used alone or in combination of two or more.
- the blending amount of component (G) is based on 100 parts by mass of component (A), or in the second embodiment of the present invention described later, based on a total of 100 parts by mass of component (A) and component (D) described later. , 0.05 to 5.0 parts by mass, preferably 0.1 to 3.0 parts by mass, more preferably 0.2 to 1.0 parts by mass. If it is 0.05 parts by mass or more, the effect of blending it can be reliably obtained.
- a second aspect of the present invention is a curable perfluoropolyether adhesive composition that gives a rubber-like cured product (perfluoropolyether rubber cured product) or a gel-like cured product (perfluoropolyether gel cured product).
- Polyfluoromonoalkenyl compound 0 to 60 parts by mass (however, the total amount of components (A) and (D) is 100 parts by mass.)
- Component (D) in the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention is a specific second A polyfluoromono which is a component used in the embodiment of (i.e., a composition that gives a gel cured product), has one alkenyl group in one molecule, and has a perfluoropolyether structure in the main chain It is an alkenyl compound.
- a polyfluoromonoalkenyl compound represented by the following general formula (2) is particularly preferred.
- Rf1- (X') p -CH CH2 (2)
- X' and p are the same as described in the general formula (1) above, and Rf 1 is a perfluoropolyether structure (monovalent perfluoropolyether group ).
- polyfluoromonoalkenyl compound represented by the general formula (2) include the following.
- m is an integer of 1 to 200, particularly an integer of 2 to 100.
- the blending amount in the curable perfluoropolyether adhesive composition is the linear perfluoropolyether of component (A) in the present composition.
- the ratio of the dialkenyl compound and component (D) is 100 to 40 parts by mass of component (A) and 0 to 60 parts by mass of component (D), and the total of component (A) and component (D) is 100 parts by mass. selected to be
- the perfluoropolyether pressure-sensitive adhesive composition of the second aspect of the present invention contains 99.9 to 40 parts by mass of component (A), preferably 99 to 40 parts by mass, particularly 95 to 50 parts by mass of component (D). 0.1 to 60 parts by mass, preferably 1 to 60 parts by mass, particularly 5 to 50 parts by mass, and further 8 to 40 parts by mass with respect to 92 to 60 parts by mass , and the total amount of the components (A) and (D) is 100 parts by mass.
- the polyfluoromonoalkenyl compound (D) may be used singly or in combination of two or more.
- control agent (E) component, the hydrophobic silica powder (F) component, and the adhesive functional group-containing organosilicon compound (G) component of the hydrosilylation reaction catalyst can also be exemplified by the same ones as described above.
- the perfluoropolyether pressure-sensitive adhesive composition of the present invention is, for example, 0.001 to 10.0 N/25 mm, preferably 0.002 to 8.0 N/25 mm, more preferably 0 It forms a pressure-sensitive adhesive consisting of a cured perfluoropolyether rubber or gel having a surface adhesive strength of 0.003 to 6.0 N/25 mm, and has heat resistance, water repellency, oil repellency, weather resistance, and chemical resistance. In addition to being excellent in solvent resistance, etc., it can form a cured product (adhesive) that has good adhesion to resins and metal substrates, and can be used for various purposes.
- a cured product adheresive
- the perfluoropolyether pressure-sensitive adhesive composition contains the total moles of alkenyl groups having component (B) and component (A) per 100 parts by mass of component (A).
- the amount of hydrosilyl groups of component (B) is 0.2 to 3.0 mol with respect to formula 1, and the amount of component (C) is 0.1 in terms of platinum with respect to the total amount of components (A) and (B). It can be formed by curing ⁇ 100 ppm.
- the perfluoropolyether adhesive composition contains 40 to 80 parts by mass of component (A) and 20 to 60 parts by mass of component (D),
- the total amount of components A) and (D) is 100 parts by mass
- the hydrosilyl groups of component (B) per the total number of moles of the alkenyl groups of component (A) and component (D) are 1. is 0.2 to 3.0 mol
- component (C) is formed by curing 0.1 to 100 ppm in terms of platinum with respect to the total amount of components (A), (B), and (D).
- the formation of the cured perfluoropolyether pressure-sensitive adhesive composition described above is carried out by coating each composition of the present invention on a suitable substrate and then curing, or by a conventionally known method such as lamination. Curing can be easily carried out by heat treatment usually at a temperature of 60 to 150° C. for about 1 to 60 minutes.
- Adhesives using the cured product of the perfluoropolyether adhesive composition of the present invention can be used for automobiles, chemical plants, semiconductor production lines, analytical/physical and chemical equipment, medical equipment, aircraft, optical members, etc. can be used as
- a cured product of the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention is excellent in heat resistance, oil resistance, low temperature characteristics, moisture resistance, low gas permeability, etc. In particular, it is non-conductive with excellent chemical resistance and solvent resistance. It is useful as an adhesive tape having an adhesive layer.
- the pressure-sensitive adhesive composition of the present invention when coating the pressure-sensitive adhesive composition of the present invention, it is useful to use a known primer in combination in order to improve adhesion or adhesiveness to the substrate.
- the primer can prevent penetration of chemicals and solvents from the substrate interface, and can improve the acid resistance, chemical resistance and solvent resistance of the entire part.
- silane-based primers mainly composed of silane coupling agents primers mainly composed of organohydrogenpolysiloxane, primers mainly composed of synthetic rubber, primers mainly composed of acrylic resins, and urethane resins are mainly used.
- a primer containing an epoxy resin as a component, a primer containing an epoxy resin as a main component, and a composition obtained by adding a tackifier to the perfluoropolyether rubber composition of the present invention can also be used as a primer.
- the cured product (cured product of perfluoropolyether rubber or cured perfluoropolyether gel) of the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention has a volume resistivity of 1 ⁇ 10 9 ⁇ cm or more.
- a non-conductive adhesive is preferred.
- Such a curable perfluoropolyether pressure-sensitive adhesive composition of the present invention is suitable as a material for non-conductive pressure-sensitive adhesives.
- the upper limit of the volume resistivity of the cured product of the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention is not particularly limited, it can be, for example, 1 ⁇ 10 13 ⁇ cm.
- Such a perfluoropolyether adhesive composition of the present invention is excellent in heat resistance, weather resistance, oil resistance, low temperature properties, moisture resistance, low gas permeability, water repellency, oil repellency, etc. It becomes a curable perfluoropolyether pressure-sensitive adhesive composition that gives a cured product (adhesive) that forms a smooth coating film without voids derived from organic solvents on the surface of the film after coating.
- the third aspect of the present invention is the cured product (cured product of perfluoropolyether rubber or cured perfluoropolyether gel) of the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention described above. Adhesive containing.
- the perfluoropolyether pressure-sensitive adhesive composition of the present invention exhibits heat resistance, weather resistance, oil resistance, chemical resistance, solvent resistance (solvent resistance), low temperature properties, moisture resistance, low gas It gives a cured product (adhesive) with excellent permeability, water repellency, oil repellency, etc., and after curing, the film surface is free of voids and smooth. Therefore, the adhesive of the present invention is excellent in heat resistance, weather resistance, oil resistance, chemical resistance, solvent resistance (solvent resistance), low temperature properties, moisture resistance, low gas permeability, water repellency, oil repellency, etc. After curing, the surface of the film has no voids and becomes a smooth coating film.
- the fourth aspect of the present invention is a pressure-sensitive adhesive tape laminated with a cured product layer of the curable perfluoropolyether pressure-sensitive adhesive composition of the present invention described above.
- the perfluoropolyether pressure-sensitive adhesive composition of the present invention exhibits heat resistance, weather resistance, oil resistance, chemical resistance, solvent resistance (solvent resistance), low temperature properties, moisture resistance, low gas It gives a cured product (adhesive) with excellent permeability, water repellency, oil repellency, etc., and after curing, the film surface is free of voids and smooth. Therefore, the adhesive tape of the present invention is excellent in heat resistance, weather resistance, oil resistance, chemical resistance, solvent resistance (solvent resistance), low temperature properties, moisture resistance, low gas permeability, water repellency, oil repellency, etc. Furthermore, after curing, a smooth coating film is formed without voids on the film surface.
- the substrate surface can be subjected to degreasing treatment with an organic solvent or the like, pre-baking treatment, etc. before plasma irradiation.
- % shows the mass % in the following example.
- Example 1 A curable perfluoropolyether adhesive composition shown in Table 1 was prepared using the following raw materials. These pressure-sensitive adhesive compositions were cured under curing conditions of 130° C. for 5 minutes, and the surface adhesive strength of each cured product was measured. The coating film surface condition was observed. The results are also shown in Table 1.
- base compound F 100 parts of the polymer represented by the above formula (a-1) was charged into a planetary mixer, and while maintaining the internal temperature at 50 to 100 ° C., fumed silica surface-treated with dimethyldichlorosilane ( 10 parts of the BET specific surface area of 110 m 2 /g) were added in portions. After that, heating was stopped and the mixture was kneaded under reduced pressure (gauge pressure: -0.093 MPa) for 1 hour. Subsequently, the apparatus was heated while kneading, and after the internal temperature reached 130°C, heat treatment was performed under reduced pressure (gauge pressure: -0.093 MPa) for 1 hour while maintaining the temperature at 130 to 160°C. Next, after cooling the content to 40° C. or lower, the content was taken out and passed through a triple roll twice to obtain a base compound F (base F).
- base F base F
- Each composition of the adhesive strength measurement examples and comparative examples was applied to a PET (polyethylene terephthalate) film having a thickness of 50 ⁇ m and a width of 25 mm using an applicator so that the thickness was 30 ⁇ m, and then subjected to heating at 130 ° C. for 5 minutes. It was heated under the conditions and hardened into a rubber or gel state to prepare an adhesive tape in which a 30 ⁇ m-thick adhesive layer (rubber or gel cured material layer) was laminated on a 50 ⁇ m-thick PET film. This adhesive tape was adhered to a metal plate (polished stainless steel plate), and a roller covered with a rubber layer weighing 2 kg was reciprocated once over the tape substrate to press the adhesive tape.
- a PET polyethylene terephthalate
- each adhesive layer (rubber or gel cured material layer) was measured at 25°C using a tensile tester at a tensile speed of 300 mm/min at an angle of 180°.
- the force (N/25 mm) required to peel off from the stainless steel plate was measured.
- Solvent resistance test After filling 3 g of the compositions of Examples and Comparative Examples in a 32 ⁇ ⁇ 15 mm glass container, they were cured under the conditions of 130 ° C. for 5 minutes to prepare samples, xylene and FuelC (50/50 of toluene/isooctane ( wt %) mixed solution) at 25° C. for 7 days, and the weight change rate before and after the immersion was measured.
- Pencil Hardness (Scratch Resistance) Test According to JIS K5600-5-4, the hardness of the pencil lead was judged by scratching at 45° with a pencil lead.
- Adhesion Test Examples and Comparative Examples were applied to an adherend, epoxy glass, to a thickness of 100 ⁇ m, and then heated at 130° C. for 5 minutes to form a rubber or gel. It was cured to produce a substrate laminated with an adhesive layer.
- the pressure-sensitive adhesive layer on the substrate was rubbed 10 times with a finger, and ⁇ was given when the adhesive layer was not peeled off from the substrate, and X was given when the substrate was peeled off and the surface of the substrate was exposed.
- adhesives such as those of Examples 1 to 5 using the curable perfluoropolyether adhesive composition of the present invention only have good adhesion to substrates. There were no voids on the film surface after curing.
- Comparative Examples 1 and 2 which do not contain the (B) component or (C) component, which are the essential components of the present invention, did not lead to curing, and the organic components (C) and (E) Voids were observed on the surface of the film after curing in Comparative Examples 3 to 5, in which the organic solvent was contained in the composition due to the presence of the solvent.
- the present invention is excellent in heat resistance, weather resistance, water repellency, oil repellency, chemical resistance and solvent resistance, and has curability that does not cause voids on the coating surface, especially in the heating process. It turned out to be a perfluoropolyether adhesive composition.
- the present invention is not limited to the above embodiments.
- the above-described embodiment is an example, and any device having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect is the present invention. included in the technical scope of
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Abstract
Description
(A)1分子中に少なくとも2個のアルケニル基を有し、かつ主鎖中に-CaF2aO-(式中、aは1~6の整数を示す。)で表される繰り返し単位を含むパーフルオロポリエーテル構造を有する直鎖状パーフルオロポリエーテル化合物:100質量部
(B)1分子中にケイ素原子に結合した水素原子を少なくとも2個有する含フッ素オルガノハイドロジェンポリシロキサン:硬化有効量
(C)ヒドロシリル化反応触媒:触媒量
を含有し、組成物中に有機溶剤を含有しないものである硬化性パーフルオロポリエーテル粘着剤組成物を提供する。
(A)1分子中に少なくとも2個のアルケニル基を有し、かつ主鎖中に-CaF2aO-(式中、aは1~6の整数を示す。)で表される繰り返し単位を含むパーフルオロポリエーテル構造を有する直鎖状パーフルオロポリエーテル化合物:100~40質量部
(D)1分子中に1個のアルケニル基を有し、かつ主鎖中にパーフルオロポリエーテル構造を有するポリフルオロモノアルケニル化合物:0~60質量部(但し、前記(A)成分と(D)成分の合計量は100質量部である。)
(B)1分子中にケイ素原子に結合した水素原子を少なくとも2個有する含フッ素オルガノハイドロジェンポリシロキサン:硬化有効量
(C)ヒドロシリル化反応触媒: 触媒量
を含有し、組成物中に有機溶剤を含有しないものである硬化性パーフルオロポリエーテル粘着剤組成物を提供する。
Rf1-(X’)p-CH=CH2(2)
[式中、X’は-CH2-、-OCH2-、-CH2OCH2-、又は-CO-NR2-Y’-(但し、Y’は-CH2-又は下記構造式(Z’)で示される基(即ち、オルト、メタ、又はパラ位で示されるジメチルフェニルシリレン基)であり、
で表される直鎖状パーフルオロポリエーテル化合物であることが好ましい。
すなわち、本発明の第一の態様は、ゴム状硬化物(パーフルオロポリエーテルゴム硬化物)を与える硬化性パーフルオロポリエーテル粘着剤組成物であって、
(A)1分子中に少なくとも2個のアルケニル基を有し、かつ主鎖中に-CaF2aO-(式中、aは1~6の整数を示す。)で表される繰り返し単位を含むパーフルオロポリエーテル構造を有する直鎖状パーフルオロポリエーテル化合物:100質量部
(B)1分子中にケイ素原子に結合した水素原子を少なくとも2個有する含フッ素オルガノハイドロジェンポリシロキサン:硬化有効量
(C)ヒドロシリル化反応触媒:触媒量
を含有し、組成物中に有機溶剤を含有しないものである硬化性パーフルオロポリエーテル粘着剤組成物である。
本発明の第一の態様において、本発明の硬化性パーフルオロポリエーテル粘着剤組成物に含まれる(A)成分は、本発明の硬化性パーフルオロポリエーテル粘着剤組成物の主剤(ベースポリマー)として作用するものであり、1分子中に少なくとも2個のアルケニル基を有し、かつ主鎖中にパーフルオロポリエーテル構造(パーフルオロオキシアルキレン構造)、好ましくは二価のパーフルオロオキシアルキレン構造を有する直鎖状パーフルオロポリエーテル化合物である。
(CaF2aO)q (3)
(式中、qは50~600の整数、好ましくは50~400の整数、より好ましくは50~200の整数である。)
-CF2CF2O-
-CF2CF2CF2O-
-CF(CF3)CF2O-
-CF2CF2CF2CF2O-
-CF2CF2CF2CF2CF2CF2O-
-C(CF3)2O-
-CF2O-
-CF2CF2O-
-CF2CF2CF2O-
-CF(CF3)CF2O-
であり、Rは水素原子、メチル基、フェニル基、又はアリル基である。]等を介して結合していてもよい。また、(A)成分は、アルケニル基を1分子中に少なくとも2個有する。
CH2=CH-(X)p-Rf2-(X’)p-CH=CH2 (4)
CH2=CH-(X)p-Q-Rf2-Q-(X’)p-CH=CH2 (5)
[式中、Xは独立に-CH2-、-CH2O-、-CH2OCH2-、又は-Y-NR1-CO-(但し、Yは-CH2-又は下記構造式(Z)で示される基であり、R1は水素原子、メチル基、フェニル基、又はアリル基である。)であり、X’は-CH2-、-OCH2-、-CH2OCH2-、又は-CO-NR2-Y’-(但し、Y’は-CH2-又は下記構造式(Z’)で示される基であり、R2は水素原子、メチル基、フェニル基又はアリル基である。)である。
Rf2は二価のパーフルオロポリエーテル構造(パーフルオロオキシアルキレン構造)であり、上記式(3)、即ち(CaF2aO)qで示されるものが好ましい。Qは炭素数1~15の二価の炭化水素基であり、エーテル結合を含んでいてもよく、具体的にはアルキレン基、エーテル結合を含んでいてもよいアルキレン基である。pは独立に0又は1である。]
本発明の第一の態様において、(B)成分は、(A)成分の架橋剤及び/又は鎖長延長剤として作用するものである。この(B)成分は、1分子中にケイ素原子に結合した水素原子(SiHで示されるヒドロシリル基)を少なくとも2個、好ましくは3個以上有する含フッ素オルガノハイドロジェンポリシロキサンである。かかる(B)成分としては、上記特許文献1、特許文献2および特許文献4等に記載された公知の含フッ素オルガノハイドロジェンポリシロキサンが挙げられるが、特に限定されるものではない。
-CgF2g-
(式中、gは1~20の整数、好ましくは2~10の整数である。)
(式中、d及びeはそれぞれ1~50の整数、好ましくは1~40の整数である。)
-CH2CH2CH2-、
-CH2CH2CH2OCH2-、
-CH2CH2CH2-NH-CO-、
-CH2CH2CH2-N(Ph)-CO-、
-CH2CH2CH2-N(CH3)-CO-、
-CH2CH2CH2-N(CH2CH3)-CO-、
-CH2CH2-Si(CH3)2-Ph’-N(CH3)-CO-、
-CH2CH2CH2-Si(CH3)2-Ph’-N(CH3)-CO-、
-CH2CH2CH2-O-CO-
(式中、Phはフェニル基であり、Ph’はフェニレン基である。)
本発明の第一の態様において、本発明の(C)成分のヒドロシリル化反応触媒(付加反応触媒)は、(A)成分中のアルケニル基、あるいは後述する本発明の第二の実施態様においては(A)成分及び後述する(D)成分中のアルケニル基と、(B)成分中のヒドロシリル基との付加反応を促進する触媒である。このヒドロシリル化反応触媒は、一般に貴金属(白金族金属)の化合物であり、高価格であることから、比較的入手しやすい白金又は白金化合物がよく用いられる。
本発明の第一の態様において(又は後述する第二の態様において)、上記の(A)~(C)成分以外にも、各種配合剤を添加することは任意である。
本発明の第一の態様において(又は後述する第二の態様において)、(E)成分としてヒドロシリル化反応触媒の制御剤(付加反応制御剤)を必要に応じて配合することは任意である。ここで、付加反応制御剤は有機溶剤を含有しないものである。
本発明の第一の態様において(又は後述する第二の態様において)、(F)成分として疎水性シリカ粉末を必要に応じて配合することは任意である。(F)成分の疎水性シリカ粉末は、本質的に有機溶剤を含有しないものである。(F)成分の疎水性シリカ粉末は、硬化性パーフルオロポリエーテル粘着剤組成物から得られる硬化物に適切な物理的強度を付与すると同時に、後述する(G)成分のオルガノ水素シロキサンを該組成物中に均一に分散させる作用を有するものである。この(F)成分の疎水性シリカ粉末としては、シリコーンゴム用充填剤として公知のBET比表面積が50m2/g以上、特に50~400m2/gの微粉末シリカを疎水化処理したものが好適である。
また、接着性を付与するためにエポキシ基、アルコキシ基等を含有する、公知の接着性付与剤「(G)成分」を添加することもできる。
[式中、R3は炭素数1~10、特に1~4の2価炭化水素基(アルキレン基等)を示し、R4は炭素数1~8、特に1~4の1価炭化水素基(アルキル基等)を示す。]
(式中、g’は1~20の整数、好ましくは2~10の整数である。)
(式中、f’は2~200の整数、好ましくは2~100の整数であり、h’は1~3の整数である。)
-CH2CH2-、
-CH2CH2CH2-、
-CH2CH2CH2OCH2-、
-CH2CH2CH2-NH-CO-、
-CH2CH2CH2-N(CH3)-CO-、
-CH2CH2CH2-N(Ph)-CO-
(但し、Phはフェニル基である。)
等の炭素数2~12の2価の連結基が挙げられる。
本発明の第二の態様は、ゴム状硬化物(パーフルオロポリエーテルゴム硬化物)又はゲル状硬化物(パーフルオロポリエーテルゲル硬化物)を与える硬化性パーフルオロポリエーテル粘着剤組成物であって、
(A)1分子中に少なくとも2個のアルケニル基を有し、かつ主鎖中に-CaF2aO-(但し、aは1~6の整数を示す。)で表される繰り返し単位を含むパーフルオロポリエーテル構造を有する直鎖状パーフルオロポリエーテル化合物:100~40質量部
(D)1分子中に1個のアルケニル基を有し、かつ主鎖中にパーフルオロポリエーテル構造を有するポリフルオロモノアルケニル化合物:0~60質量部(但し、前記(A)成分と(D)成分の合計量は100質量部である。)
(B)1分子中にケイ素原子に結合した水素原子を少なくとも2個有する含フッ素オルガノハイドロジェンポリシロキサン:硬化有効量
(C)ヒドロシリル化反応触媒: 触媒量
を含有し、組成物中に有機溶剤を含有しないものである硬化性パーフルオロポリエーテル粘着剤組成物である。
(D)成分は、本発明の硬化性パーフルオロポリエーテル粘着剤組成物において、上述した本発明の第一の実施態様(即ち、ゴム硬化物を与える組成物)に対して、特定の第二の実施態様(即ち、ゲル硬化物を与える組成物)において用いられる成分であり、1分子中に1個のアルケニル基を有し、かつ主鎖中にパーフルオロポリエーテル構造を有する、ポリフルオロモノアルケニル化合物である。特に、下記一般式(2)で表されるポリフルオロモノアルケニル化合物が好ましい。
[式中、X’及びpは上記一般式(1)中で説明したのと同じであり、Rf1は、下記一般式で表されるパーフルオロポリエーテル構造(1価のパーフルオロポリエーテル基)である。
F-[CF(CF3)CF2O]w-CF(CF3)-
(式中、wは1~500の整数、好ましくは2~200の整数を示す。)]
本発明の第二の態様においては、上記の(A)~(D)成分以外にも、第一態様と同様に各種配合剤を添加することは任意である。ヒドロシリル化反応触媒の制御剤(E)成分、疎水性シリカ粉末(F)成分、接着性官能基含有有機ケイ素化合物(G)成分も、上述で説明したものと同様のものを例示できる。
本発明のパーフルオロポリエーテル粘着剤組成物は、上記した組成物を硬化させることにより、例えば0.001~10.0N/25mm、好ましくは0.002~8.0N/25mm、より好ましくは0.003~6.0N/25mmの表面粘着力を有するパーフルオロポリエーテルゴム又はゲルの硬化物からなる粘着剤を形成するものであり、耐熱性、撥水性、撥油性、耐候性、耐薬品性、耐溶剤性等に優れている上、樹脂や金属基材との密着力が良好な硬化物(粘着剤)を形成させることができ、各種の用途に使用することができる。
下記原料を使用し、表1に示す硬化性パーフルオロポリエーテル粘着剤組成物を調製した。これらの粘着剤組成物を130℃、5分の硬化条件にて硬化し、それぞれの硬化物の表面粘着力を測定すると共に、下記方法によって耐溶剤性試験、鉛筆硬度試験、密着性試験、及び塗膜表面状態観察を行った。結果を表1に併記する。
(A)直鎖状パーフルオロポリエーテル化合物
(a-1)2官能性パーフルオロポリエーテル(パーフルオロポリエーテル1)
CH2=CH―CH2―O―CH2―Rf―CH2―O-CH2―CH=CH2
(Rf:-CF2O(CF2CF2O)20.8(CF2O)22.1CF2-、
ただし繰り返し単位 CF2CF2O と CF2O の配列はランダムである
(c-1)CAT-PL-56(信越化学工業株式会社製商品名/有機溶剤非含有品)
(c-2)CAT-PL-50T(信越化学工業株式会社製商品名/トルエン含有品)
(e-1)エチニルシクロヘキサノール
(e-2)エチニルシクロヘキサノール/50%トルエン溶液
上記式(a-1)で示されるポリマー100部をプラネタリーミキサー内に仕込み、内温を50~100℃に保持しながら、ジメチルジクロロシランで表面処理された煙霧質シリカ(BET比表面積110m2/g)10部を分割添加した。その後、加熱を停止して1時間減圧下(ゲージ圧;-0.093MPa)で混練した。引き続き混練しながら装置を加熱し、内温が130℃に達してから130~160℃に保持しながら1時間減圧下(ゲージ圧;-0.093MPa)で熱処理した。次に、内容物を40℃以下に冷却後、内容物を取り出し、三本ロールを2回通してベースコンパウンドF(ベースF)を得た。
実施例及び比較例の各組成物を、厚み50μm、幅25mmのPET(ポリエチレンテレフタレート)フィルムに厚みが30μmとなるようにアプリケータを用いて塗工した後、130℃、5分間の条件で加熱してゴム又はゲル状に硬化させ、厚み50μmのPETフィルム上に厚み30μmの粘着剤層(ゴム又はゲル硬化物層)が積層された粘着テープを作製した。この粘着テープを金属板(研磨したステンレス板)に貼りつけ、重さ2kgのゴム層で被覆されたローラーを、該テープ基材上で1往復させることにより該粘着テープを圧着した。室温で20時間放置した後、25℃において、引っ張り試験機を用いて、各粘着剤層(ゴム又はゲル硬化物層)の粘着力として、300mm/分の引張り速度で180°の角度で粘着テープをステンレス板から引き剥がすのに要する力(N/25mm)を測定した。
32φ×15mmガラス容器内に実施例及び比較例の組成物を3g充填した後、130℃、5分間の条件にて硬化させてサンプルを作製し、キシレン及びFuelC(トルエン/イソオクタンの50/50(wt%)混合溶液)に25℃にて7日間浸漬し、浸漬前と後の重量変化率を測定した。
JIS K5600-5-4に準拠し鉛筆の芯による、45°引掻きで傷が生じるときの鉛筆の芯の硬さで判定した。
実施例及び比較例の各組成物を、被着体であるエポキシガラスに厚み100μmとなるように塗工した後、130℃、5分間の条件で加熱してゴム状又はゲル状に硬化させ、粘着層が積層された基材を作製した。その基材上の粘着層を指で10回こすり、基材から剥離しなかったものを○、剥離し基材表面が露出したものを×とした。
上記密着性試験と同様に基材を作製後、その基材上の粘着層を光学顕微鏡にて観察した。ボイドが認められないものを○、ボイドが認められたものを×とした。
Claims (14)
- 硬化性パーフルオロポリエーテル粘着剤組成物であって、
(A)1分子中に少なくとも2個のアルケニル基を有し、かつ主鎖中に-CaF2aO-(式中、aは1~6の整数を示す。)で表される繰り返し単位を含むパーフルオロポリエーテル構造を有する直鎖状パーフルオロポリエーテル化合物:100質量部
(B)1分子中にケイ素原子に結合した水素原子を少なくとも2個有する含フッ素オルガノハイドロジェンポリシロキサン:硬化有効量
(C)ヒドロシリル化反応触媒:触媒量
を含有し、組成物中に有機溶剤を含有しないものである硬化性パーフルオロポリエーテル粘着剤組成物。 - 更に、(E)有機溶剤を含有しない付加反応制御剤を前記(A)成分100質量部に対して、0.01~5質量部含有するものである請求項1に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 更に(F)成分として、疎水性シリカ粉末を前記(A)成分100質量部に対して、0.5~20質量部含有するものである請求項1又は2に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 硬化性パーフルオロポリエーテル粘着剤組成物であって、
(A)1分子中に少なくとも2個のアルケニル基を有し、かつ主鎖中に-CaF2aO-(式中、aは1~6の整数を示す。)で表される繰り返し単位を含むパーフルオロポリエーテル構造を有する直鎖状パーフルオロポリエーテル化合物:100~40質量部
(D)1分子中に1個のアルケニル基を有し、かつ主鎖中にパーフルオロポリエーテル構造を有するポリフルオロモノアルケニル化合物:0~60質量部(但し、前記(A)成分と(D)成分の合計量は100質量部である。)
(B)1分子中にケイ素原子に結合した水素原子を少なくとも2個有する含フッ素オルガノハイドロジェンポリシロキサン:硬化有効量
(C)ヒドロシリル化反応触媒: 触媒量
を含有し、組成物中に有機溶剤を含有しないものである硬化性パーフルオロポリエーテル粘着剤組成物。 - 前記(A)成分99.9~40質量部に対して前記(D)成分0.1~60質量部(但し、前記(A)成分と前記(D)成分の合計量は100質量部である。)を含有するものである請求項4に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 更に、(E)有機溶剤を含有しない付加反応制御剤を前記(A)成分と前記(D)成分の合計100質量部に対して、0.01~5質量部含有するものである請求項4~6のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 更に(F)成分として、疎水性シリカ粉末を前記(A)成分と前記(D)成分の合計100質量部に対して、0.5~20質量部含有するものである請求項4~7のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 前記(C)成分が有機溶剤を含有しないものである請求項1~8のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 前記(A)成分が、下記一般式(1)
で表される直鎖状パーフルオロポリエーテル化合物である請求項1~9のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物。 - 硬化して0.001N/25mmから10.0N/25mmの粘着力を有する粘着剤を形成するものである請求項1~10のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 前記硬化性パーフルオロポリエーテル粘着剤組成物の硬化物が、体積抵抗率が1×109Ω・cm以上の非導電性粘着剤である請求項1~11のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物。
- 請求項1~12のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物の硬化物を含むものである粘着剤。
- 基材上に、請求項1~12のいずれか1項に記載の硬化性パーフルオロポリエーテル粘着剤組成物の硬化物層が積層しているものである粘着テープ。
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