WO2022195937A1 - 半田プリコートに電子部品を仮止めするための粘着剤および電子部品実装基板の製造方法 - Google Patents

半田プリコートに電子部品を仮止めするための粘着剤および電子部品実装基板の製造方法 Download PDF

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Publication number
WO2022195937A1
WO2022195937A1 PCT/JP2021/037174 JP2021037174W WO2022195937A1 WO 2022195937 A1 WO2022195937 A1 WO 2022195937A1 JP 2021037174 W JP2021037174 W JP 2021037174W WO 2022195937 A1 WO2022195937 A1 WO 2022195937A1
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WIPO (PCT)
Prior art keywords
electronic component
adhesive
solder
solder precoat
organic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/037174
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English (en)
French (fr)
Japanese (ja)
Inventor
祐樹 吉岡
忠彦 境
憲 前田
進吾 岡村
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication date
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Priority to JP2023506725A priority Critical patent/JPWO2022195937A1/ja
Priority to US18/550,317 priority patent/US12484157B2/en
Priority to CN202180095726.6A priority patent/CN117043298A/zh
Publication of WO2022195937A1 publication Critical patent/WO2022195937A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2493/00—Presence of natural resin

Definitions

  • the present invention relates to an adhesive for temporarily attaching electronic components to a solder precoat and a method for manufacturing an electronic component mounting board.
  • Patent Document 1 discloses a printed circuit board (1) having a fine pitch pad section (5) with a pad arrangement pitch of less than 0.5 mm and a rough pitch pad section (4) with a pad arrangement pitch of 0.5 mm or more, Solder paste (8) is printed on the pad (3) of the rough pitch pad section (4), and then the solder deposition composition containing organic acid lead salt and tin powder as main components is printed on the fine pitch pad section (5). After that, the printed circuit board (1) is heated to melt the solder paste (8) to form a solder layer (13) on the pad (3) of the rough pitch pad section (4).
  • solder is deposited from the solder deposition composition (12) on the pad (3) of the fine pitch pad portion (5) to form a solder layer (13), and then the printed circuit board (1)
  • a flux (15) is applied to the top, an electronic component (16) is mounted thereon, and the leads (17) are temporarily fixed to the solder layer (13) on the pad (3) by the adhesive force of the flux (15).
  • the printed circuit board (1) on which the electronic component (16) is mounted is heated to melt the solder layer (13), and the lead (17) of the electronic component (16) is soldered to the pad (3).
  • a method for mounting electronic components on a printed circuit board is proposed.
  • solder pre-coating is also becoming smaller.
  • a fine solder precoat has a large surface area relative to the volume of solder, and is therefore affected by an oxide film formed on the surface, which is likely to cause poor connection between the electrode and the electronic component.
  • an organic substance such as an antioxidant
  • One aspect of the present invention is an adhesive for temporarily attaching an electronic component to a solder precoat at least partially covered with an organic film, the adhesive comprising a base resin and a solvent that dissolves the base resin. and wherein the content of the solvent is 25% by mass or more and 40% by mass or less, and the organic film dissolves in the solvent when the solder precoat is melted.
  • Another aspect of the present invention includes the steps of providing a circuit component having a solder precoat at least partially covered with an organic film; mounting the electronic component on the solder precoat via the adhesive; and reflowing the solder precoat to mount the electronic component on the circuit member.
  • the pressure-sensitive adhesive contains a main resin and a solvent that dissolves the main resin, the content of the solvent is 25% by mass or more and 40% by mass or less, and the organic The film is dissolved in the solvent when the solder precoat is reflowed.
  • the present invention it is possible to suppress the formation of an oxide film on the surface of the solder precoat, and to suppress poor connection between the electrode having the solder precoat and the electronic component.
  • FIG. 10 is a diagram schematically showing the remainder of the process of mounting an electronic component on a circuit member having a solder precoat
  • FIG. 10 is a diagram schematically showing part of the process of mounting an electronic component on a circuit member having another solder precoat
  • FIG. 11 schematically illustrates the remainder of the process of mounting electronic components to circuit members having another solder precoat
  • the adhesive according to this embodiment is an adhesive for temporarily attaching an electronic component to a solder precoat at least partially covered with an organic film. Solder precoats do not have the tackiness of cream solders or solder pastes. Therefore, an adhesive is applied to the solder precoat to make it tacky. An electronic component is mounted on the solder precoat via an adhesive.
  • the method for manufacturing an electronic component mounting board includes the steps of preparing a circuit member having a solder precoat at least partially covered with an organic film, and a step of applying the adhesive for temporarily fixing the electronic component on the solder precoat, a step of mounting the electronic component on the solder precoat via the adhesive, and a step of reflowing the solder precoat to attach the electronic component. and mounting on a circuit member.
  • a circuit member may be, for example, a laminated substrate, a resin substrate, a ceramic substrate, a substrate such as a silicon substrate, a semiconductor element, a semiconductor package, or the like.
  • it may be a structure in which a semiconductor package is mounted on various substrates.
  • Such structures include chip-on-board, chip-on-film, chip-on-glass, chip-on-chip, chip-on-package, package-on-package, and the like.
  • the organic film covering at least part of the solder precoat may be a film containing an organic substance.
  • the "film" of an organic film is not necessarily limited to a homogeneous and dense film, but is a broad concept that includes coatings, layers, deposits, etc. that cover at least part of the surface of the solder precoat in various states.
  • the organic film can be rephrased as an organic substance adhering to the surface of the solder precoat, an organic substance covering at least part of the surface of the solder precoat, or the like.
  • the organic film may be substantially (for example, 99% by mass or more) composed only of organic substances.
  • the organic substance has the function of inhibiting contact between the solder precoat and oxygen. Oxygen is shielded by the organic matter, which suppresses the formation of an oxide film on the surface of the solder precoat.
  • the organic film may be the residue generated when forming the solder precoat.
  • the solder precoat is formed by supplying solder paste containing solder particles and flux to electrodes (pads, lands, etc.) provided on the circuit member, and then heating the solder paste. The heating melts the solder particles in the solder paste, forming a film and adhering to the surface of the electrode. When the solder solidifies, a solder precoat is formed, and the surface of the solder precoat is covered with flux residue. That is, the residue generated when forming the solder precoat is flux residue.
  • the residue contains organic matter derived from the flux and has the function of inhibiting contact between the solder precoat and oxygen.
  • the residue may contain, as a main component, for example, a resin described below as the main resin of the pressure-sensitive adhesive or its thermally denatured product.
  • a main component means a component that can account for 30% by mass or more, further 50% by mass or more of the residue.
  • the residue generated when forming the solder precoat is usually removed by cleaning. However, if the residue is not removed and is used as an organic film covering at least a portion of the solder precoat, the cleaning process can be omitted.
  • the adhesive contains a base resin and a solvent that dissolves the base resin.
  • the content of the solvent in the adhesive is 25% by mass or more and 40% by mass or less.
  • the organic film dissolves in the solvent when the solder precoat is melted. In other words, the solvent is chosen to dissolve the organic film when melting the solder precoat.
  • the adhesive contains 25% by weight or more of solvent, sufficient solvent is present in the adhesive to dissolve the softened or melted organic film even when the solder precoat reflows.
  • the base resin dissolved in the solvent and the organic film are compatible with each other. Since the organic film and the base resin are compatible with each other before most of the solvent evaporates, the organic matter forming the organic film and the base resin can be easily separated from the molten solder generated by reflow. That is, it becomes difficult for the organic film to remain on the surface of the solder precoat. On the other hand, the molten solder wets and spreads over the electrodes covered with the solder precoat and the electrodes of the electronic component to form joints. As a result, poor connection caused by the organic film is suppressed.
  • the adhesive contains a solvent of 40% by mass or less, sufficient adhesiveness or tackiness is ensured to temporarily fix the electronic component on the solder precoat.
  • it is necessary to suppress the solvent content in the adhesive to 40% by mass or less.
  • the electronic component is JIS standard (Japanese Industrial Standards) 0402 size or smaller (0402, 0201, 03015, 01005, etc.)
  • the adhesive or tackiness is insufficient, static electricity may cause
  • the electronic component may not be separated from the moving means (such as a mounting head) that picks up the electronic component and carries it onto the solder precoat of the circuit member, resulting in mounting defects.
  • the adhesiveness or tackiness of the adhesive is insufficient, no matter how minute the electronic component is, the circuit member on which the electronic component is mounted may vibrate until it is transported to a reflow device for reflowing the solder precoat. , misalignment of electronic components may occur.
  • the pressure-sensitive adhesive according to the present embodiment is particularly suitable for temporarily attaching an electronic component having a size of 0402 or smaller defined by the JIS standard to a solder precoat.
  • the tackiness of the adhesive can be evaluated by the adhesive strength of the adhesive measured by the solder paste adhesiveness test method described in JIS Z 3284-3.
  • the adhesive strength can be measured using a commercially available tack force tester.
  • the adhesive strength is desirably 0.5 N or more, and more desirably 1.0 N or more.
  • the higher the solvent content in the adhesive the lower the adhesive strength of the adhesive.
  • the size of the electronic component is 0402 or less, the adhesion achieved by the solvent content of 25% by mass or more and 40% by mass or less is sufficient.
  • a rosin-based resin that itself has reducing properties is preferably used, but resins other than rosin-based resins are also used.
  • the main resin may be used alone, or two or more may be mixed or used in combination.
  • rosin-based resins, acrylic-based resins, and polyethylene glycol are desirable, but are not particularly limited.
  • rosin-based resins include natural rosins such as gum rosin and wood rosin, and derivatives thereof (polymerized rosin, hydrogenated rosin, disproportionated rosin, acid-modified rosin, rosin ester, etc.).
  • organic fatty acid esters for example, organic fatty acid esters, polyalkylene oxide-based resins, propylene glycol fatty acid esters, and acetylene glycols can be used.
  • Terpene resins As resins other than rosin resins, terpene resins, terpene phenol resins, styrene resins, xylene resins, acrylic resins, polyester resins, polyolefin resins, polyamides, polyamines, phenol resins, phenoxy resins, epoxy resins, etc. are used.
  • Terpene resins include aromatic modified terpene resins, hydrogenated terpene resins, and hydrogenated aromatic modified terpene resins. Hydrogenated terpene phenol resin etc. are mentioned as a terpene phenol resin.
  • Styrene resins include styrene-acrylic acid copolymers, styrene-maleic acid copolymers, and the like.
  • xylene resins examples include phenol-modified xylene resins, alkylphenol-modified xylene resins, phenol-modified resol-type xylene resins, polyol-modified xylene resins, and polyoxyethylene-added xylene resins.
  • Acrylic resins include acrylic acid, methacrylic acid, various esters of acrylic acid, various esters of methacrylic acid, crotonic acid, itaconic acid, maleic acid, maleic anhydride, maleic acid esters, maleic anhydride esters, acrylonitrile, Examples include acrylic resins obtained by copolymerizing at least one monomer selected from methacrylonitrile, acrylamide, methacrylamide, vinyl chloride and vinyl acetate. Examples of polyolefin resins include polyethylene and polypropylene. Examples of epoxy resins include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, and the like.
  • solvents examples include water, alcohol solvents, glycol solvents, ketone solvents, hydrocarbon solvents, ester solvents, glycol ether solvents, and terpineols.
  • a solvent may be used individually by 1 type, and may be used in combination of 2 or more type.
  • alcohol solvents include isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3-dimethyl-2,3-butanediol, 1,1,1-tris ( hydroxymethyl)ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2′-oxybis(methylene)bis(2-ethyl-1,3-propanediol), 2,2-bis( hydroxymethyl)-1,3-propanediol, 1,2,6-trihydroxyhexane, bis[2,2,2-tris(hydroxymethyl)ethyl]ether, 1-ethynyl-1-
  • Glycol-based solvents include, for example, ethylene glycol monomethyl ether, triethylene glycol monomethyl ether, polyethylene glycol monomethyl ether (295°C), triethylene glycol monobutyl ether, diethylene glycol monohexyl ether (hexyl carbitol), diethylene glycol mono-2-ethylhexyl ether.
  • ethylene glycol monophenyl ether diethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, diethylene glycol monobenzyl ether, diethylene glycol dibutyl ether, tripropylene glycol monoethyl ether, tripropylene glycol monobutyl ether, propylene glycol monophenyl ether, diethylene glycol dibutyl ether, tetraethylene glycol dimethyl ether, 2-methylpentane-2,4-diol, triethylene glycol monobutyl ether and the like.
  • ketone solvents include methyl ethyl ketone, methyl-n-propyl ketone, diethyl ketone, cyclohexanone and the like.
  • hydrocarbon solvents include normal hexane, isohexane, cyclohexane, methylcyclohexane, ethylcyclohexane, normal heptane, isoheptane, normal octane, isooctane, limonene, 2-methyl-2-butene, 2-methyl-1-pentene, 2-methyl-2-pentene, 3-ethyl-2-butene, 2,3-dimethyl-2-butene, 2,4,4-trimethyl-1-pentene, 2,4,4-trimethyl-2-pentene, etc. is mentioned.
  • ester-based solvents examples include butyl stearate, 2-ethylhexyl stearate, isotridecyl stearate, methyl oleate, isobutyl oleate, methyl cocoate, methyl laurate, isopropyl myristate, isopropyl palmitate, and 2-palmitate. Ethylhexyl, octyldodecyl myristate and the like.
  • the adhesive may contain, in addition to the base resin and solvent, an activator that reduces the oxide film covering the surface of the solder precoat. At least part or all of the surface of the solder precoat is covered with an organic film, but it is impossible to completely prevent the formation of an oxide film. An oxide film inevitably exists on the surface of the solder precoat.
  • the activator reduces the oxide layer and aids in forming a good joint. Examples of activators having a reducing action include organic acids, amines, halides and the like.
  • the active agents may be used singly or in combination of two or more.
  • organic acids examples include succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dimer acid, propionic acid, 2,2-bishydroxymethylpropionic acid, tartaric acid, malic acid, glycol. acid, diglycolic acid, thioglycolic acid, dithioglycolic acid, stearic acid, 12-hydroxystearic acid, palmitic acid, oleic acid and the like.
  • amines include ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2 -phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2 ,
  • halides include amine hydrohalides and organic halogen compounds.
  • amines constituting amine hydrohalides include ethylamine, ethylenediamine, triethylamine, diphenylguanidine, ditolylguanidine, methylimidazole, 2-ethyl-4-methylimidazole, etc.
  • Hydrogen halides include: Examples thereof include hydrogen chloride, hydrogen bromide, hydrogen iodide and the like.
  • organic halogen compounds include trans-2,3-dibromo-2-butene-1,4-diol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3 -bromo-1-propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2, 3-dibromo-1,4-butanediol, 2,3-dibromo-2-butene-1,4-diol and the like.
  • the adhesive may contain a thixotropic agent (agent for imparting thixotropy).
  • the thixotropic agents include wax-based thixotropic agents, amide-based thixotropic agents, sorbitol-based thixotropic agents, and the like. Examples of wax-based thixotropic agents include hardened castor oil.
  • Amide thixotropic agents include lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-toluenemethanamide.
  • aromatic amide methylenebisstearate amide, ethylenebislaurate amide, ethylenebishydroxystearate amide, saturated fatty acid bisamide, methylenebisoleate amide, unsaturated fatty acid bisamide, m-xylylene bisstearate amide, aromatic Bisamides, saturated fatty acid polyamides, unsaturated fatty acid polyamides, aromatic polyamides, substituted amides, methylolstearic acid amides, methylolamides, fatty acid ester amides and the like can be mentioned.
  • sorbitol thixotropic agents examples include dibenzylidene-D-sorbitol, bis(4-methylbenzylidene)-D-sorbitol and the like.
  • the thixotropic agents may be used singly or in combination of two or more.
  • the adhesive may further contain, for example, surfactants, silane coupling agents, antioxidants (eg, antioxidants that may be contained in organic films), colorants, and the like.
  • organic film When the organic film contains, as an organic matter, a residue generated when the solder precoat is formed (that is, a flux residue), such a residue is mainly composed of, for example, the base resin that can be included in the adhesive or its thermally modified product. may be included as an ingredient.
  • the solvent is at least selected from the group consisting of alcohol solvents, ester solvents, glycol solvents, ketone solvents and hydrocarbon solvents. It is preferable to use one type from the viewpoint of compatibility between the organic film and the main resin.
  • the organic substance may be, for example, an antioxidant, an organic acid, or an organic fatty acid ester.
  • the antioxidant may be a phenol-based antioxidant, an amine-based antioxidant, a phosphorus-based antioxidant, a sulfur-based antioxidant, or the like. These organic substances may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the solvent can be at least one selected from the group consisting of alcohol-based solvents, glycol-based solvents, and ketone-based solvents. It is desirable from the viewpoint of compatibility between the organic film and the base resin.
  • the solvent should be at least one selected from the group consisting of alcohol-based solvents, glycol-based solvents, and hydrocarbon-based solvents. is desirable from the viewpoint of compatibility between the organic film and the base resin.
  • the organic film contains an organic fatty acid as an organic substance
  • at least one solvent selected from the group consisting of alcohol-based solvents, glycol-based solvents, ketone-based solvents, and hydrocarbon-based solvents is used to combine the organic film and the base resin. is desirable from the viewpoint of compatibility of
  • Phenolic antioxidants include, for example, hindered phenol compounds having bulky substituents (eg, branched or cyclic alkyl groups such as t-butyl groups) at least one of the ortho positions of phenol.
  • hindered phenol compounds having bulky substituents eg, branched or cyclic alkyl groups such as t-butyl groups
  • Phenolic antioxidants include, for example, hindered phenol compounds having bulky substituents (eg, branched or cyclic alkyl groups such as t-butyl groups) at least one of the ortho positions of phenol.
  • hindered phenol compounds having bulky substituents eg, branched or cyclic alkyl groups such as t-butyl groups
  • amine antioxidants include alkylated diphenylamine, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, and N,N-di-sec-butyl-p-phenylenediamine. , p-phenylenediamine derivatives, 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethyl)isocyanurate and the like.
  • phosphorus-based antioxidants examples include tris-nonylphenyl phosphite, triphenyl phosphite, tris(2,4-di-t-butylphenyl) phosphite, tris(isodecyl) phosphite and the like.
  • sulfur-based antioxidants examples include 2,4-bis[(octylthio)methyl]-o-cresol, dilauryl-3,3-thiodipropionate, dimyristyl-3,3-thiodipropionate, distearyl -3,3-thiodipropionate, pentaerythrityl tetrakis(3-laurylthiopropionate), ditridecyl-3,3-thiodipropionate, 2-mercaptobenzimidazole, bis[2-methyl-4-( 3-n-alkylthiopropionyloxy)-5-t-butylphenyl]sulfide and the like.
  • organic acids examples include organic acids exemplified as activators having a reducing action that can be contained in adhesives.
  • Organic fatty acid esters include, for example, organic fatty acid esters that the adhesive can contain as the main resin.
  • FIG. 1 is a diagram schematically showing a process of forming an organic film together with a solder precoat on a circuit member.
  • FIG. 1(a) shows the main part of the circuit member 10 in cross section.
  • the circuit member 10 is a circuit board having minute electrodes 11 (lands or pads).
  • FIGS. 1(b) to 1(d) show the solder paste application process.
  • the solder paste 20 is applied to predetermined portions of the circuit member 10 by, for example, a printing method.
  • FIG. 1(b) shows a state in which a mask 12 having openings 12a corresponding to the electrodes 11 is superimposed on the circuit member 10.
  • FIG. A screen mask for example, can be used for the mask 12 .
  • solder paste 20 is applied to the circuit member 10 through the mask 12, as shown in FIG. 1(c).
  • Solder paste 20 includes solder particles 21 and flux 22 .
  • the particle size of the solder particles is not particularly limited as long as it is smaller than the openings 12a of the mask 12, but may be, for example, 20 ⁇ m or less.
  • the circuit member 10 with the solder paste 20 applied on the electrodes 11 is obtained.
  • the solder paste 20 may bridge between the closest electrodes 11 .
  • the circuit member 10 is heated to the melting temperature of the solder particles 21 .
  • solder particles 21 When the solder particles 21 are melted, the melted solder forms a film and adheres to the electrode surface so as to wet and spread. At this time, the solder existing between the electrodes 11 is attracted to the surface of the electrodes 11 by the surface tension of the molten solder.
  • a circuit member 10X having a solder precoat 23 is obtained as shown in FIG. 1(e).
  • the surface of the solder precoat 23 is covered with an organic film 24 containing flux residue. Due to the surface tension of the molten solder, the solder precoat 23 has a curved surface that is convex toward the organic film 24 (that is, convex upward on the paper surface). The curvature of the curved surface of the solder precoat 23 increases as the area per electrode 11 decreases.
  • FIG. 2 is a diagram schematically showing a process of applying an adhesive 25 onto the solder precoat 23 and then mounting the electronic component 30 on the circuit member 10X.
  • FIG. 2A shows a process of pressing the solder precoat 23 having an upwardly convex curved surface and covered with the organic film 24 against the circuit member 10X with a jig 40 having a flat pressing surface. ing. Since the upwardly convex curved surface is crushed and flattened by pressing, the solder precoat 23 has a shape suitable for stably mounting the electronic component 30 . At the same time, although not shown, the organic film 24 is cracked, or the organic film 24 is partially peeled off from the solder precoat 23, and the surface of the solder precoat 23 is partially exposed. As a result, the contact between the adhesive 25 and the solder precoat 23 is promoted, and when the adhesive has reducing properties, the reducing action is likely to occur.
  • FIG. 2(b) shows a state in which an adhesive 25 is applied on the solder precoat 23 that has been flattened and covered with an organic film 24.
  • the adhesive 25 is applied onto the solder precoat 23 of the circuit member 10X via the organic film 24 by, for example, a printing method. That is, although not shown, a mask having openings corresponding to the solder precoat 23 is superimposed on the circuit member 10X, the adhesive 25 is applied to the circuit member 10X through the mask, and then the mask is retracted from the circuit member 10X. A circuit member 10X is obtained in which the adhesive 25 is applied onto the solder precoat 23 with the organic film 24 interposed therebetween. The adhesive 25 may bridge between the closest electrodes 11 as shown in FIG. 2(b).
  • FIG. 2(c) shows the circuit member 10X in which the electronic component 30 is mounted on the solder precoat 23 via the organic film 24 and the adhesive 25.
  • the adhesive 25 serves to temporarily fix the electronic component 30 onto the solder precoat 23 until the electronic component 30 is mounted on the circuit member 10X by reflow.
  • the electronic component 30 is a chip component having a pair of lead terminals 30L on the left and right sides of the paper. A pair of lead terminals 30L are aligned so as to be joined to a pair of adjacent electrodes 11, respectively.
  • FIG. 3 schematically shows state changes of the solder precoat 23, the organic film 24, and the adhesive 25 during reflow.
  • a circuit member 10X having an electronic component 30 mounted on a solder precoat 23 via an organic film 24 and an adhesive 25 is introduced into a reflow device, heated, and then the organic film 24 and the adhesive 25 are heated. 25 are liquefied and mutually dissolved to form one liquid phase 245 .
  • the organic film 24 and the adhesive 25 are softened and liquefied by heating.
  • Adhesive 25 contains a sufficient amount of solvent. Until compatibility between the softened or liquefied adhesive 25 and the organic film 24 progresses sufficiently, at least part of the solvent remains in the liquid phase 245 without volatilizing.
  • FIG. 3(b) shows a state in which the solder precoat 23 is melted to form molten solder 23m, and the molten solder 23m spreads over the lead terminals 30L of the electronic component 30.
  • the electronic component has a size of 0402 or smaller defined by the JIS standard and has a plurality of terminals (for example, lead terminals 30L) to be connected to the solder precoating, the weight of the electronic component per terminal is, for example, 0.5. 05 mg or less.
  • FIG. 3(c) shows the circuit member 10Y that has been cooled and the solder has solidified to form the solder joints 23s.
  • the surface of the solder joint 23 s is covered with the residue 27 of the organic film 24 and the adhesive 25 . Residue 27 is washed if necessary.
  • FIG. 4(a) shows a circuit member 10X having another solder precoat 23.
  • the solder precoat 23 is also formed between the pair of electrodes 11 to form a bridge 231 between the pair of electrodes 11 . Since the electrodes 11 of the circuit member 10 are minute, such bridges 231 may occur when the solder precoat 23 is formed.
  • the bridge 231 is attracted to the electrode 11 and the lead terminal by the surface force of the molten solder 23m, so that the bridge 231 can be eliminated.
  • the electrode 11 is a microelectrode for bonding the electronic component 30 having a size of 0402 or smaller (0402, 0201, 03015, 01005, etc.)
  • the bridge 231 is difficult to eliminate due to the influence of the organic film 24.
  • the adhesive 25 used in this embodiment contains a sufficient amount of solvent, the organic film 24 is converted to the liquid phase 245 relatively easily, but it is beneficial to establish a process that can more reliably eliminate the bridge 231. be.
  • a circuit member 10 was prepared by forming a solder precoat 23 on a substrate having electrodes 11 for mounting an electronic component (0402 size chip capacitor).
  • the solder paste which is the raw material of the solder precoat 23, is a mixture of solder particles (average particle diameter: 20 ⁇ m, melting point: 217° C.) and flux, and the solder particle content is 90% by mass.
  • the main component of flux is rosin resin.
  • the surface of the solder precoat 23 is covered with flux residue (organic film 24).
  • the present disclosure is useful in the field of manufacturing an electronic component mounting board by mounting an electronic component on a circuit member having a solder precoat.
  • the present disclosure is particularly useful in the manufacture of electronic component mounting substrates that use microcomponents of 0402 size or less and electronic components with a self weight (weight) of 0.05 mg or less per terminal.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2021/037174 2021-03-18 2021-10-07 半田プリコートに電子部品を仮止めするための粘着剤および電子部品実装基板の製造方法 Ceased WO2022195937A1 (ja)

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US18/550,317 US12484157B2 (en) 2021-03-18 2021-10-07 Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate
CN202180095726.6A CN117043298A (zh) 2021-03-18 2021-10-07 用于在焊料预涂层暂时固定电子部件的粘合剂及电子部件安装基板的制造方法

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