JP6688267B2 - フラックスの製造方法 - Google Patents
フラックスの製造方法 Download PDFInfo
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- JP6688267B2 JP6688267B2 JP2017171274A JP2017171274A JP6688267B2 JP 6688267 B2 JP6688267 B2 JP 6688267B2 JP 2017171274 A JP2017171274 A JP 2017171274A JP 2017171274 A JP2017171274 A JP 2017171274A JP 6688267 B2 JP6688267 B2 JP 6688267B2
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- 239000002253 acid Substances 0.000 claims description 31
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 30
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 18
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- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 9
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- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 claims description 4
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- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
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- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- YFDSDPIBEUFTMI-UHFFFAOYSA-N tribromoethanol Chemical compound OCC(Br)(Br)Br YFDSDPIBEUFTMI-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
(1)水を40質量%以上90質量%以下、有機酸(アスコルビン酸を除く)を2質量%以上15質量%以下(2質量%以上3.2質量%以下は除く)、ヒドロキシ基を有する溶剤を0質量%超48質量%以下、を混合し、有機酸が、グルタル酸、フェニルコハク酸、コハク酸、マロン酸、アジピン酸、アゼライン酸、グリコール酸、ジグリコール酸、チオグリコール酸、チオジグリコール酸、プロピオン酸、2,2−ビスヒドロキシメチルプロピオン酸、2,2−ビスヒドロキシメチルブタン酸、リンゴ酸、酒石酸、ダイマー酸、水添ダイマー酸、トリマー酸のうち、少なくとも1種を含有するものであり、溶剤に含まれるヒドロキシ基と有機酸との反応で有機酸エステルが形成されるエステル化と、有機酸エステルと水との反応による加水分解の両方が起こることにより、平衡状態になるものであって、上記混合の時に、有機酸が有する有機酸カルボキシル基ユニットのモル質量%を100ユニットモル%としたときに、上記平衡状態では、溶剤に含まれるヒドロキシ基と有機酸とによってエステル化したカルボン酸エステルユニットの含有割合が0ユニットモル%以上50ユニットモル%以下となることを特徴とするフラックスの製造方法。
[R1COOR2]:有機酸エステルの濃度
[H2O]:水の濃度
[R1COOH]:有機酸の濃度
[R2OH]:アルコールの濃度
ここで、アルコールは溶剤中に過剰量存在するため、変動はないとみなしてよい。そのため、平衡定数式(5)は、平衡定数式(6)と近似できる。
(A)評価方法
各実施例および比較例の各フラックスの酸価を、水酸化カリウムを用いてJIS K0070に準じて計測した。フラックスを40℃で4週間保管した後、各フラックスの酸価を計測した。各フラックスの酸価の低下率を算出した。
○:酸価の低下率が50%以内だった
×:酸価の低下率が50%を超えた
ボールミッシング抑制検証では、各実施例および比較例のフラックスについて、下記の条件1と条件2の2つの条件で検証を行った。
Sn−3Ag−0.5Cuの組成で、直径600μmのはんだボールを用意した。用意したはんだボールに、各実施例および比較例のフラックスをそれぞれ塗布した後、フラックスが塗布された各はんだボールを基板の電極に搭載した。そして、ハイスピードヒータを用いて基板を100℃設定で1分加熱した後、250℃で5秒加熱した。その後、室温で冷却した。室温まで冷却した後の電極の様子を目視で確認した。
Sn−3Ag−0.5Cuの組成で、直径600μmのはんだボールを用意した。用意したはんだボールに、各実施例および比較例のフラックスをそれぞれ塗布した後、フラックスが塗布された各はんだボールを基板の電極に搭載した。そして、ハイスピードヒータを用いて基板を110℃設定で1分加熱した後、250℃で5秒加熱した。その後、室温で冷却した。室温まで冷却した後の電極の様子を目視で確認した。
○○:条件1および条件2による検証で、はんだが、電極から外れずに残った。
○:条件1による検証で、はんだが、電極から外れずに残った。
×:条件1および条件2による検証で、はんだが電極から外れてボールミッシングが発生した。
Claims (4)
- 水を40質量%以上90質量%以下、有機酸(アスコルビン酸を除く)を2質量%以上15質量%以下(2質量%以上3.2質量%以下は除く)、ヒドロキシ基を有する溶剤を0質量%超48質量%以下、を混合し、
前記有機酸が、グルタル酸、フェニルコハク酸、コハク酸、マロン酸、アジピン酸、アゼライン酸、グリコール酸、ジグリコール酸、チオグリコール酸、チオジグリコール酸、プロピオン酸、2,2−ビスヒドロキシメチルプロピオン酸、2,2−ビスヒドロキシメチルブタン酸、リンゴ酸、酒石酸、ダイマー酸、水添ダイマー酸、トリマー酸のうち、少なくとも1種を含有するものであり、
前記溶剤に含まれるヒドロキシ基と前記有機酸との反応で有機酸エステルが形成されるエステル化と、有機酸エステルと水との反応による加水分解の両方が起こることにより、平衡状態になるものであって、
上記混合の時に、前記有機酸が有する有機酸カルボキシル基ユニットのモル質量%を100ユニットモル%としたときに、上記平衡状態では、溶剤に含まれるヒドロキシ基と有機酸とによってエステル化したカルボン酸エステルユニットの含有割合が0ユニットモル%以上50ユニットモル%以下となることを特徴とするフラックスの製造方法。 - 上記混合の時に、前記水の含有割合が40質量%以上80質量%以下であることを特徴とする
請求項1に記載のフラックスの製造方法。 - 上記混合の時に、前記溶剤の含有割合が8質量%以上48質量%以下であることを特徴とする
請求項1または請求項2に記載のフラックスの製造方法。 - 上記混合の時に、活性補助成分としてアミンを0質量%超10質量%以下含有し、
前記アミンは、イミダゾール類、脂肪族アミン、芳香族アミン、アミノアルコール、ポリオキシアルキレン型アルキルアミン、末端アミンポリオキシアルキレン、アミンハロゲン化水素酸塩のうち、少なくとも1種を含有することを特徴とする
請求項1から請求項3のいずれか1項に記載のフラックスの製造方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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JP2017171274A JP6688267B2 (ja) | 2017-09-06 | 2017-09-06 | フラックスの製造方法 |
CN201880057163.XA CN111107961A (zh) | 2017-09-06 | 2018-09-06 | 助焊剂 |
US16/644,362 US20210060713A1 (en) | 2017-09-06 | 2018-09-06 | Flux |
PCT/JP2018/032958 WO2019049917A1 (ja) | 2017-09-06 | 2018-09-06 | フラックス |
KR1020207007820A KR20200051649A (ko) | 2017-09-06 | 2018-09-06 | 플럭스 |
TW107131287A TW201917113A (zh) | 2017-09-06 | 2018-09-06 | 助焊劑 |
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JP2017171274A JP6688267B2 (ja) | 2017-09-06 | 2017-09-06 | フラックスの製造方法 |
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JP2018191606A Division JP2019042811A (ja) | 2018-10-10 | 2018-10-10 | フラックス |
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US (1) | US20210060713A1 (ja) |
JP (1) | JP6688267B2 (ja) |
KR (1) | KR20200051649A (ja) |
CN (1) | CN111107961A (ja) |
TW (1) | TW201917113A (ja) |
WO (1) | WO2019049917A1 (ja) |
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JP6849934B1 (ja) * | 2020-03-18 | 2021-03-31 | 千住金属工業株式会社 | フラックス及びソルダペースト |
CN113798720A (zh) * | 2021-09-23 | 2021-12-17 | 沭阳县壹陆捌助剂有限公司 | 一种c9型中性助焊剂的生产工艺 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4151015A (en) * | 1977-12-02 | 1979-04-24 | Lake Chemical Company | Flux for use in soldering |
US4428780A (en) * | 1983-02-07 | 1984-01-31 | Lake Chemical Co. | Solutions for use in bonding plates of storage batteries to connecting systems |
JPH0773795B2 (ja) * | 1985-07-02 | 1995-08-09 | 太陽インキ製造株式会社 | はんだ付用水洗性フラツクス組成物 |
JPH0638992B2 (ja) * | 1986-05-16 | 1994-05-25 | 内橋エステック株式会社 | やに入りはんだ |
US5571340A (en) * | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
JP2719311B2 (ja) * | 1994-12-07 | 1998-02-25 | 双葉電子工業株式会社 | はんだ付け用無洗浄フラックス |
JP4079026B2 (ja) * | 2002-04-16 | 2008-04-23 | 唯知 須賀 | 無残渣ソルダペースト |
US6887319B2 (en) * | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
JP2005074449A (ja) | 2003-08-29 | 2005-03-24 | Harima Chem Inc | はんだ付け用フラックスおよびはんだペースト組成物 |
JP2005074484A (ja) * | 2003-09-01 | 2005-03-24 | Matsushita Electric Works Ltd | はんだ付け用水性フラックス |
JP4352866B2 (ja) * | 2003-11-18 | 2009-10-28 | パナソニック株式会社 | はんだ付け用フラックス |
WO2007086433A1 (ja) * | 2006-01-26 | 2007-08-02 | Toeikasei Co., Ltd. | 水分散型フラックス組成物、電子部品付き電子回路基板、およびそれらの製造方法 |
CN102357748A (zh) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | 一种无铅焊料用无卤素无松香抗菌型免清洗助焊剂 |
CN103286477B (zh) * | 2013-05-22 | 2015-09-30 | 中南大学 | 一种无铅焊料用助焊剂及其制备方法 |
WO2017122341A1 (ja) * | 2016-01-15 | 2017-07-20 | 千住金属工業株式会社 | フラックス |
CN106493487B (zh) * | 2016-12-08 | 2018-04-17 | 深圳市合明科技有限公司 | 水基助焊剂及其制备方法与应用 |
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- 2018-09-06 WO PCT/JP2018/032958 patent/WO2019049917A1/ja active Application Filing
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WO2019049917A1 (ja) | 2019-03-14 |
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KR20200051649A (ko) | 2020-05-13 |
CN111107961A (zh) | 2020-05-05 |
US20210060713A1 (en) | 2021-03-04 |
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