JPWO2024122214A1 - - Google Patents

Info

Publication number
JPWO2024122214A1
JPWO2024122214A1 JP2024562621A JP2024562621A JPWO2024122214A1 JP WO2024122214 A1 JPWO2024122214 A1 JP WO2024122214A1 JP 2024562621 A JP2024562621 A JP 2024562621A JP 2024562621 A JP2024562621 A JP 2024562621A JP WO2024122214 A1 JPWO2024122214 A1 JP WO2024122214A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024562621A
Other languages
Japanese (ja)
Other versions
JPWO2024122214A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024122214A1 publication Critical patent/JPWO2024122214A1/ja
Publication of JPWO2024122214A5 publication Critical patent/JPWO2024122214A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2024562621A 2022-12-06 2023-10-25 Pending JPWO2024122214A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022195026 2022-12-06
PCT/JP2023/038512 WO2024122214A1 (ja) 2022-12-06 2023-10-25 半田フラックスおよび電子部品実装基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024122214A1 true JPWO2024122214A1 (https=) 2024-06-13
JPWO2024122214A5 JPWO2024122214A5 (https=) 2025-03-21

Family

ID=91378893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024562621A Pending JPWO2024122214A1 (https=) 2022-12-06 2023-10-25

Country Status (2)

Country Link
JP (1) JPWO2024122214A1 (https=)
WO (1) WO2024122214A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001105180A (ja) * 1999-10-05 2001-04-17 Showa Denko Kk はんだ付けフラックス
JP2001300766A (ja) * 2000-04-27 2001-10-30 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及び回路基板
JP2013035065A (ja) * 2010-02-09 2013-02-21 Nordson Corp フラックス及びハンダ材料、並びにその作製方法
JP2016159325A (ja) * 2015-02-27 2016-09-05 住友金属鉱山株式会社 はんだ用フラックスおよびはんだペースト
WO2022195937A1 (ja) * 2021-03-18 2022-09-22 パナソニックＩｐマネジメント株式会社 半田プリコートに電子部品を仮止めするための粘着剤および電子部品実装基板の製造方法
WO2022209001A1 (ja) * 2021-03-31 2022-10-06 千住金属工業株式会社 フラックスコートはんだプリフォーム用フラックス、フラックスコートはんだプリフォーム、及び電子基板に電子部品を実装する方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250848A (ja) * 1995-03-07 1996-09-27 Matsushita Electric Ind Co Ltd チップの半田付け方法
JPH09321425A (ja) * 1996-05-28 1997-12-12 Nippon Antomu Kogyo Kk チップ状電子部品の実装方法
JP2002314239A (ja) * 2001-04-10 2002-10-25 Seiko Epson Corp 電子部品の実装方法、マスキング部材及び電気光学装置の製造方法
JP2007207868A (ja) * 2006-01-31 2007-08-16 Toshiba Corp 配線基板
JP2009094251A (ja) * 2007-10-05 2009-04-30 Sharp Corp プリント基板用印刷マスクおよびその印刷マスクを使用したプリント基板の実装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001105180A (ja) * 1999-10-05 2001-04-17 Showa Denko Kk はんだ付けフラックス
JP2001300766A (ja) * 2000-04-27 2001-10-30 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及び回路基板
JP2013035065A (ja) * 2010-02-09 2013-02-21 Nordson Corp フラックス及びハンダ材料、並びにその作製方法
JP2016159325A (ja) * 2015-02-27 2016-09-05 住友金属鉱山株式会社 はんだ用フラックスおよびはんだペースト
WO2022195937A1 (ja) * 2021-03-18 2022-09-22 パナソニックＩｐマネジメント株式会社 半田プリコートに電子部品を仮止めするための粘着剤および電子部品実装基板の製造方法
WO2022209001A1 (ja) * 2021-03-31 2022-10-06 千住金属工業株式会社 フラックスコートはんだプリフォーム用フラックス、フラックスコートはんだプリフォーム、及び電子基板に電子部品を実装する方法

Also Published As

Publication number Publication date
WO2024122214A1 (ja) 2024-06-13

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