WO2022190174A1 - 搬送装置 - Google Patents

搬送装置 Download PDF

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Publication number
WO2022190174A1
WO2022190174A1 PCT/JP2021/009036 JP2021009036W WO2022190174A1 WO 2022190174 A1 WO2022190174 A1 WO 2022190174A1 JP 2021009036 W JP2021009036 W JP 2021009036W WO 2022190174 A1 WO2022190174 A1 WO 2022190174A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
ultrasonic transducers
workpiece
ultrasonic
standing wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/009036
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
マイケル カークビー
広志 宗像
卓也 足立
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Robotics Co Ltd
Original Assignee
Yamaha Robotics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Robotics Co Ltd filed Critical Yamaha Robotics Co Ltd
Priority to CN202180005176.4A priority Critical patent/CN115315796A/zh
Priority to PCT/JP2021/009036 priority patent/WO2022190174A1/ja
Priority to JP2023504891A priority patent/JP7366479B2/ja
Priority to KR1020227001893A priority patent/KR102633298B1/ko
Priority to US17/640,827 priority patent/US12519003B2/en
Priority to EP21930033.2A priority patent/EP4306461A4/en
Priority to TW111107800A priority patent/TWI832169B/zh
Publication of WO2022190174A1 publication Critical patent/WO2022190174A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Definitions

  • the present invention relates to a transport device equipped with a non-contact chuck that floats a work without contact.
  • Non-contact chucks are sometimes used in processes such as polishing semiconductor wafers and mounting semiconductor chips obtained by singulating semiconductor wafers (see, for example, Patent Document 1).
  • the non-contact chuck floats the workpiece and holds it without contact, but the force that holds the workpiece is weak. The position may shift.
  • One aspect of the present invention is a transport device equipped with a non-contact chuck that floats and holds a work in a non-contact manner.
  • the carrier device further comprises a plurality of ultrasonic transducers that emit ultrasonic waves.
  • a plurality of ultrasonic transducers emits ultrasonic waves to generate standing waves that attract the workpiece, and when viewed from the direction in which the non-contact chuck faces the workpiece, the forces that attract the workpiece outward are generated in multiple directions. It is configured to hold the workpiece in a balanced position.
  • the work can be levitated in the vertical direction using the non-contact chuck, and movement of the work in the horizontal direction can be suppressed using the plurality of ultrasonic transducers.
  • a plurality of ultrasonic transducers can interfere ultrasonic waves to generate a standing wave region at a predetermined position of the non-contact chuck.
  • the workpiece is attracted to the position of the node of the standing wave with low potential energy.
  • the work can be caught at a position where the pulling force is balanced, thereby suppressing sideslip.
  • the work following the area of the standing wave can be moved to a desired position. The relative position between the non-contact chuck and the work can be finely adjusted even after the work is levitated.
  • the non-contact chuck is preferably a Bernoulli chuck having injection holes for injecting gas and a suction surface formed around the injection holes.
  • a plurality of ultrasonic transducers are provided on the attraction surface.
  • multiple ultrasonic transducers can generate a standing wave region at a predetermined position. Since the flow speed of the airflow radially flowing from the injection hole of the Bernoulli chuck along the adsorption surface is substantially constant, it is suitable for generating a standing wave region with a plurality of ultrasonic transducers. According to this aspect, it is possible to stably suppress side slippage of the workpiece by combining the ultrasonic transducer with a non-contact chuck that is compatible with each other.
  • the plurality of ultrasonic transducers include at least three pairs of ultrasonic transducers that generate standing waves, and a pair of ultrasonic transducers are provided at each of the first to third positions surrounding the workpiece from three sides. It is preferable that the child is arranged.
  • a standing wave region can be generated at each of the first to third positions. If the work is pulled at two points, the work may slide sideways in a direction that intersects the direction passing through the two points. If the work is pulled at three or more points, side slippage of the work can be stably suppressed.
  • the plurality of ultrasonic transducers may be arranged in a grid.
  • an ultrasonic transducer at a suitable position in accordance with the outer shape of the workpiece from among the plurality of ultrasonic transducers arranged in a grid pattern, so that workpieces of various sizes and shapes can be driven.
  • a standing wave can be generated more powerfully than a pair of ultrasonic transducers.
  • FIG. 1 is a perspective view showing a conveying device according to one embodiment of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing a main part of the conveying device shown in FIG. 1.
  • FIG. 3 is a bottom view of the conveying device shown in FIG. 2 as seen from below in the vertical direction where the non-contact chuck faces the work.
  • FIG. 4 is a bottom view schematically showing an operation in which the work follows the region of the standing wave by gradually shifting the region of the standing wave surrounding the work.
  • FIG. 5 is a bottom view showing a first modification in which a pair of ultrasonic transducers are provided at each of the first to third positions surrounding the workpiece from three sides.
  • FIG. 6 is a bottom view showing a second modification in which a pair of ultrasonic transducers are provided at each of the first to fourth positions for suppressing movement in the left-right direction and front-rear direction.
  • FIG. 7 is a bottom view showing a third modification in which a plurality of ultrasonic transducers are arranged in two rows along the contour of the work.
  • the transport device 1 of one embodiment of the present invention moves the work W in the horizontal direction (X, Y).
  • a plurality of ultrasonic transducers 3 for suppressing the vibration are provided.
  • the plurality of ultrasonic transducers 3 emit ultrasonic waves to generate a standing wave region S in a region 200 outside the workpiece W (see FIG. 2).
  • a standing wave is generated, the workpiece W is attracted to the position of the node of the standing wave with low potential energy.
  • a standing wave region S is generated in a plurality of directions (for example, front, back, left, and right, preferably 360° omnidirectional) as viewed from the workpiece W (see FIGS. 3 and 5 to 7), the pulling The workpiece W can be caught at a position where the forces are balanced to suppress the sideslip.
  • the standing wave region S surrounding the work W is shifted little by little, the work W follows the standing wave region S (see FIG. 4).
  • FIG. 1 is a perspective view showing a conveying device 1 according to one embodiment of the present invention.
  • the transfer device 1 includes a non-contact chuck 2 that floats and holds a work W in a non-contact manner.
  • the carrier device 1 is used, for example, in a die bonding device or a pick-up device in a semiconductor manufacturing process.
  • the transport device 1 picks up a semiconductor chip, which is an example of the work W.
  • FIG. 1 is a perspective view showing a conveying device 1 according to one embodiment of the present invention.
  • the transfer device 1 includes a non-contact chuck 2 that floats and holds a work W in a non-contact manner.
  • the carrier device 1 is used, for example, in a die bonding device or a pick-up device in a semiconductor manufacturing process.
  • the transport device 1 picks up a semiconductor chip, which is an example of the work W.
  • FIG. 1 is a perspective view showing a conveying device 1 according to one embodiment of the present invention.
  • a semiconductor chip is made by dicing a semiconductor wafer into individual pieces, and is processed into LSI packages, etc. through the bonding process in the post-process.
  • the interval between adjacent semiconductor chips is about the same as the thickness of the dicing cutter, for example about 100 ⁇ m.
  • the transfer device 1 may be applied to a wire bonding method in which a semiconductor chip is picked up and placed on a substrate or the like with the active surface facing up. It may be applied to a flip-chip bonding method in which a semiconductor chip is picked up and placed on a substrate or the like with the active surface facing downward.
  • FIG. 2 is a cross-sectional view schematically showing the essential parts of the conveying device 1 shown in FIG.
  • the non-contact chuck 2 is a Bernoulli chuck, and includes an injection hole 21 for injecting gas and a suction surface 22 formed around the injection hole 21 .
  • the non-contact chuck 2 is not limited to the Bernoulli chuck, and may be other types of non-contact chucks.
  • the non-contact chuck 2 may be a combination of an electromagnet that attracts the work W with magnetic force and an air blower that separates the work with a force balanced with the magnetic force.
  • the injection hole 21 for injecting gas is formed, for example, in an annular shape.
  • the adsorption surface 22 surrounding the injection hole 21 is a flat surface extending in the horizontal direction (X, Y), and can form a uniform flow path facing the flat workpiece W. As shown in FIG.
  • the transport device 1 includes a non-contact chuck 2, a plurality of ultrasonic transducers 3, an oscillator 4 that supplies high-frequency power to the ultrasonic transducers 3, and a controller that controls the oscillator 4. a part 5;
  • the ultrasonic transducer 3 is an electromechanical transducer that converts the high-frequency power supplied from the oscillator 4 into ultrasonic vibration.
  • Each ultrasonic transducer 3 is, for example, an ultrasonic speaker, and is composed of a unimorph transducer or the like in which a piezoelectric ceramic is bonded to one side of a metal disc.
  • the configuration of the ultrasonic transducer 3 is not particularly limited, and a known configuration can be appropriately selected.
  • Each ultrasonic transducer 3 is embedded in the attraction surface 22 and radiates ultrasonic waves (compressional waves) downward in the vertical direction Z. As shown in FIG. When ultrasonic waves radiated from a plurality of ultrasonic transducers 3 interfere with each other, standing waves are generated, and nodes and antinodes of the standing waves appear in the vertical direction Z at intervals of 1/2 wavelength.
  • the oscillator 4 can arbitrarily vary the phase and frequency of the high-frequency power supplied to each ultrasonic transducer 3 according to instructions from the control unit 5 . Further, the oscillator 4 can arbitrarily switch between the ultrasonic transducers 3 to which high-frequency power is supplied and the ultrasonic transducers 3 to which high-frequency power is not supplied in accordance with instructions from the control unit 5 .
  • the control unit 5 can change the position of the amplitude of the standing waves generated by the plurality of ultrasonic transducers 3 by controlling the high-frequency power supplied from the oscillator 4 to each ultrasonic transducer 3 .
  • FIG. 3 is a bottom view of the conveying device 1 shown in FIG. 2 as seen from below in the vertical direction Z where the non-contact chuck 2 faces the workpiece W.
  • the plurality of ultrasonic transducers 3 are provided on the adsorption surface 22 of the non-contact chuck 2 .
  • a plurality of ultrasonic transducers 3 are arranged in a lattice pattern with equal intervals in the front, rear, left, and right directions.
  • the horizontal direction (X, Y) described above includes the left-right direction X and the front-rear direction Y.
  • the area overlapping the work W is defined as an area 100 inside the work W, and the area not overlapping the work W is outside the work W. Let it be region 200 .
  • the plurality of ultrasonic transducers 3 driven by the control unit 5 and the oscillator 4 are located in the space near the surface of the adsorption surface 22 of the non-contact chuck 2, and the adsorption surface 22 faces the workpiece W.
  • a standing wave region S is generated in a region 200 outside the workpiece W when viewed from the vertical direction Z. As shown in FIG.
  • a part of the region S of the standing wave may be superimposed on the region 100 inside the workpiece W.
  • the region S of the standing wave is not strictly limited to the case where it occurs in the region 200 outside the work W, and may be in the vicinity of the outer circumference of the work W.
  • FIG. When a standing wave is generated, the workpiece W is attracted to the position of the node of the standing wave with low potential energy.
  • the workpiece W By generating the standing wave regions S in a plurality of directions when viewed from the workpiece W, the workpiece W can be caught at a position where the attracting forces are balanced, thereby suppressing sideslip.
  • a plurality of ultrasonic transducers 3 arranged in a lattice may simultaneously drive a large number of ultrasonic transducers 3 to generate a standing wave region S, or an inner region 100 of the workpiece W and an outer region 100 of the workpiece W may be generated.
  • a standing wave region S may be generated by driving the ultrasonic transducers 3 positioned near the boundary with the region 200 of . Since the ultrasonic transducer 3 at a suitable position can be selected from among the plurality of ultrasonic transducers 3 according to the outer shape of the work W and driven, it is possible to cope with various sizes and shapes of the work W. When the number of ultrasonic transducers 3 to be driven increases, even if each ultrasonic transducer 3 is small, it can generate a standing wave with a large amplitude, so that the force of trapping the workpiece W becomes stronger.
  • FIG. 4 is a bottom view schematically showing an operation in which the work follows the standing wave region by gradually shifting the standing wave region S surrounding the work W.
  • the conveying device 1 of this embodiment can not only suppress the lateral slip of the work W, but also finely adjust the relative positions of the non-contact chuck 2 and the work W.
  • FIG. 4 by arranging a plurality of ultrasonic transducers 3 in a lattice and gradually switching the ultrasonic transducers 3 to be driven to slowly move the region S of the standing wave, the standing wave
  • the work W follows the movement of the region S of .
  • FIG. 5 is a bottom view showing a first modification in which a pair of ultrasonic transducers 3P and 3D are provided at each of first to third positions P1, P2 and P3 surrounding the workpiece W from three sides. is.
  • the plurality of ultrasonic transducers 3 should include at least three pairs of ultrasonic transducers 3P and 3D that interfere with each other to generate a standing wave region S.
  • Each of the pair of ultrasonic transducers 3P, 3D includes an ultrasonic transducer 3P proximal to the center of the work W and a transducer 3D distal to the center of the work W.
  • the first position P1 is located near the midpoint of one of the sides (hereinafter referred to as the first side), and the second position P2 is located near the first side.
  • the third position P3 is positioned diagonally from the vertex shared by the first side and the second side. located near the apex.
  • FIG. 6 shows a second ultrasonic transducer in which a pair of ultrasonic transducers 3P and 3D are provided at each of first to fourth positions Q1, Q2, Q3 and Q4 for suppressing movement in the left-right direction X and the front-rear direction Y.
  • 2 is a bottom view showing a modification of No. 2.
  • FIG. In the case of four-point restraint to suppress the movement in the left-right direction X and the front-back direction Y, for example, at least a pair of ultrasonic transducers 3P and 3D are arranged in the vicinity of the midpoint of each side of the rectangular workpiece W. good.
  • FIG. 7 is a bottom view showing a third modification in which a plurality of ultrasonic transducers 3 are arranged in two rows along the contour of the work W.
  • the ultrasonic transducers 3P proximal to the center of the work W are arranged in a line along the contour of the work W.
  • the ultrasonic transducers 3D distal to the center of the work W are arranged in a line so as to surround the ultrasonic transducers 3P proximal to the center of the work W.
  • the plurality of ultrasonic transducers 3 surround the workpiece W in a double frame shape.
  • a row of ultrasonic transducers 3P proximal to the center of the workpiece W (hereinafter referred to as the first row) and a row of ultrasonic transducers 3D distal to the center of the workpiece W (hereinafter referred to as the second row)
  • a frame-shaped standing wave region S surrounding the workpiece W is generated between .
  • the intervals between the ultrasonic transducers 3P proximal to the center of the work W may not be equal, and the intervals between the ultrasonic transducers 3D distal to the center of the work W may not be equal.
  • the ultrasonic transducers 3P and 3D may be arranged so as to surround only four corners of a rectangular workpiece W in an L shape.
  • the work W When the work W is levitated using a non-contact chuck such as a Bernoulli chuck, the work W tends to slide sideways.
  • the plurality of ultrasonic transducers 3 provided on the attraction surface 22 generate a standing wave that attracts the work W, and the work W is drawn toward the outside 200 in a plurality of directions. Since the work is held at a position where the forces are balanced, the side slip of the work W can be suppressed. It is particularly suitable for semiconductor manufacturing processes that require precise alignment of the semiconductor chip with respect to the substrate.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Iron Core Of Rotating Electric Machines (AREA)
  • Branching, Merging, And Special Transfer Between Conveyors (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Manipulator (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
PCT/JP2021/009036 2021-03-08 2021-03-08 搬送装置 Ceased WO2022190174A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN202180005176.4A CN115315796A (zh) 2021-03-08 2021-03-08 搬送装置
PCT/JP2021/009036 WO2022190174A1 (ja) 2021-03-08 2021-03-08 搬送装置
JP2023504891A JP7366479B2 (ja) 2021-03-08 2021-03-08 搬送装置
KR1020227001893A KR102633298B1 (ko) 2021-03-08 2021-03-08 반송 장치
US17/640,827 US12519003B2 (en) 2021-03-08 2021-03-08 Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuck
EP21930033.2A EP4306461A4 (en) 2021-03-08 2021-03-08 TRANSPORT DEVICE
TW111107800A TWI832169B (zh) 2021-03-08 2022-03-03 搬送裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/009036 WO2022190174A1 (ja) 2021-03-08 2021-03-08 搬送装置

Publications (1)

Publication Number Publication Date
WO2022190174A1 true WO2022190174A1 (ja) 2022-09-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/009036 Ceased WO2022190174A1 (ja) 2021-03-08 2021-03-08 搬送装置

Country Status (7)

Country Link
US (1) US12519003B2 (https=)
EP (1) EP4306461A4 (https=)
JP (1) JP7366479B2 (https=)
KR (1) KR102633298B1 (https=)
CN (1) CN115315796A (https=)
TW (1) TWI832169B (https=)
WO (1) WO2022190174A1 (https=)

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WO2024122220A1 (ja) * 2022-12-06 2024-06-13 パナソニックＩｐマネジメント株式会社 ピックアップシステムおよびピックアップ方法
WO2024194931A1 (ja) * 2023-03-17 2024-09-26 ヤマハロボティクスホールディングス株式会社 チップ保持具、チップ保持装置、および半導体装置の製造装置
WO2025074923A1 (ja) * 2023-10-05 2025-04-10 ヤマハロボティクスホールディングス株式会社 ハンドリング装置
WO2025079596A1 (ja) * 2023-10-12 2025-04-17 パナソニックＩｐマネジメント株式会社 ピックアップシステム、接合装置、ソート装置、および制御方法

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See also references of EP4306461A4

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Publication number Priority date Publication date Assignee Title
WO2024122220A1 (ja) * 2022-12-06 2024-06-13 パナソニックＩｐマネジメント株式会社 ピックアップシステムおよびピックアップ方法
JP7515078B1 (ja) * 2022-12-06 2024-07-12 パナソニックＩｐマネジメント株式会社 ピックアップシステムおよびピックアップ方法
WO2024194931A1 (ja) * 2023-03-17 2024-09-26 ヤマハロボティクスホールディングス株式会社 チップ保持具、チップ保持装置、および半導体装置の製造装置
WO2025074923A1 (ja) * 2023-10-05 2025-04-10 ヤマハロボティクスホールディングス株式会社 ハンドリング装置
WO2025079596A1 (ja) * 2023-10-12 2025-04-17 パナソニックＩｐマネジメント株式会社 ピックアップシステム、接合装置、ソート装置、および制御方法

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