JPWO2022190174A1 - - Google Patents
Info
- Publication number
- JPWO2022190174A1 JPWO2022190174A1 JP2023504891A JP2023504891A JPWO2022190174A1 JP WO2022190174 A1 JPWO2022190174 A1 JP WO2022190174A1 JP 2023504891 A JP2023504891 A JP 2023504891A JP 2023504891 A JP2023504891 A JP 2023504891A JP WO2022190174 A1 JPWO2022190174 A1 JP WO2022190174A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
- B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
- B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/009036 WO2022190174A1 (ja) | 2021-03-08 | 2021-03-08 | 搬送装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022190174A1 true JPWO2022190174A1 (https=) | 2022-09-15 |
| JPWO2022190174A5 JPWO2022190174A5 (https=) | 2023-04-19 |
| JP7366479B2 JP7366479B2 (ja) | 2023-10-23 |
Family
ID=83227503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023504891A Active JP7366479B2 (ja) | 2021-03-08 | 2021-03-08 | 搬送装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12519003B2 (https=) |
| EP (1) | EP4306461A4 (https=) |
| JP (1) | JP7366479B2 (https=) |
| KR (1) | KR102633298B1 (https=) |
| CN (1) | CN115315796A (https=) |
| TW (1) | TWI832169B (https=) |
| WO (1) | WO2022190174A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112023005089T5 (de) * | 2022-12-06 | 2025-10-23 | Panasonic Intellectual Property Management Co., Ltd. | Aufnahmesystem und Aufnahmeverfahren |
| KR20250153244A (ko) * | 2023-03-17 | 2025-10-24 | 야마하 로보틱스 가부시키가이샤 | 칩 유지 도구, 칩 유지 장치, 및 반도체 장치의 제조 장치 |
| JP2025064294A (ja) * | 2023-10-05 | 2025-04-17 | ヤマハロボティクスホールディングス株式会社 | ハンドリング装置 |
| TW202520412A (zh) * | 2023-10-12 | 2025-05-16 | 日商松下知識產權經營股份有限公司 | 拾取系統、接合裝置、分類裝置及控制方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227480A (ja) * | 2007-02-14 | 2008-09-25 | Institute Of National Colleges Of Technology Japan | 非接触保持装置および非接触搬送装置 |
| WO2009110552A1 (ja) * | 2008-03-05 | 2009-09-11 | 独立行政法人国立高等専門学校機構 | 非接触搬送装置 |
| JP2015216376A (ja) * | 2014-05-12 | 2015-12-03 | コーニング精密素材株式会社Corning Precision Materials Co., Ltd. | 非接触式の基板把持装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5890580A (en) * | 1993-07-12 | 1999-04-06 | Kaijo Corporation | Object levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting process |
| US5979475A (en) * | 1994-04-28 | 1999-11-09 | Hitachi, Ltd. | Specimen holding method and fluid treatment method of specimen surface and systems therefor |
| DE10121742A1 (de) | 2001-05-04 | 2003-01-23 | Bosch Gmbh Robert | Vorrichtung zum berührungslosen Greifen und Halten eines Gegenstandes |
| JP4376737B2 (ja) * | 2004-08-31 | 2009-12-02 | 学校法人東京理科大学 | 非接触チャック |
| US20070141114A1 (en) | 2005-12-15 | 2007-06-21 | Essilor International Compagnie Generale D'optique | Article coated with an ultra high hydrophobic film and process for obtaining same |
| JP5752119B2 (ja) * | 2009-07-22 | 2015-07-22 | ツィンマーマン ウント シルプ ハンドハーブングステヒニーク ゲゼルシャフト ミット ベシュレンクテル ハフツングＺｉｍｍｅｒｍａｎｎ ＆ Ｓｃｈｉｌｐ Ｈａｎｄｈａｂｕｎｇｓｔｅｃｈｎｉｋ ＧｍｂＨ | 真空グリッパー |
| JP5402542B2 (ja) * | 2009-11-06 | 2014-01-29 | 村田機械株式会社 | 非接触保持装置及び移載装置 |
| US9360772B2 (en) * | 2011-12-29 | 2016-06-07 | Nikon Corporation | Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method |
| JP5830440B2 (ja) | 2012-06-20 | 2015-12-09 | 東京エレクトロン株式会社 | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
| JP5553254B2 (ja) * | 2013-08-20 | 2014-07-16 | 村田機械株式会社 | 非接触保持装置及び移載装置 |
| TWI747225B (zh) * | 2019-04-15 | 2021-11-21 | 日商新川股份有限公司 | 搬送裝置 |
| KR102284457B1 (ko) * | 2019-08-27 | 2021-07-30 | 세메스 주식회사 | 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치 |
| KR102365660B1 (ko) * | 2019-08-27 | 2022-02-18 | 세메스 주식회사 | 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치 |
-
2021
- 2021-03-08 WO PCT/JP2021/009036 patent/WO2022190174A1/ja not_active Ceased
- 2021-03-08 JP JP2023504891A patent/JP7366479B2/ja active Active
- 2021-03-08 US US17/640,827 patent/US12519003B2/en active Active
- 2021-03-08 CN CN202180005176.4A patent/CN115315796A/zh active Pending
- 2021-03-08 EP EP21930033.2A patent/EP4306461A4/en not_active Withdrawn
- 2021-03-08 KR KR1020227001893A patent/KR102633298B1/ko active Active
-
2022
- 2022-03-03 TW TW111107800A patent/TWI832169B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227480A (ja) * | 2007-02-14 | 2008-09-25 | Institute Of National Colleges Of Technology Japan | 非接触保持装置および非接触搬送装置 |
| WO2009110552A1 (ja) * | 2008-03-05 | 2009-09-11 | 独立行政法人国立高等専門学校機構 | 非接触搬送装置 |
| JP2015216376A (ja) * | 2014-05-12 | 2015-12-03 | コーニング精密素材株式会社Corning Precision Materials Co., Ltd. | 非接触式の基板把持装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4306461A4 (en) | 2025-01-08 |
| KR102633298B1 (ko) | 2024-02-05 |
| US20230197497A1 (en) | 2023-06-22 |
| EP4306461A1 (en) | 2024-01-17 |
| US12519003B2 (en) | 2026-01-06 |
| TW202235349A (zh) | 2022-09-16 |
| WO2022190174A1 (ja) | 2022-09-15 |
| JP7366479B2 (ja) | 2023-10-23 |
| KR20220127224A (ko) | 2022-09-19 |
| CN115315796A (zh) | 2022-11-08 |
| TWI832169B (zh) | 2024-02-11 |
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