JPWO2022190174A5 - - Google Patents

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Publication number
JPWO2022190174A5
JPWO2022190174A5 JP2023504891A JP2023504891A JPWO2022190174A5 JP WO2022190174 A5 JPWO2022190174 A5 JP WO2022190174A5 JP 2023504891 A JP2023504891 A JP 2023504891A JP 2023504891 A JP2023504891 A JP 2023504891A JP WO2022190174 A5 JPWO2022190174 A5 JP WO2022190174A5
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JP
Japan
Prior art keywords
ultrasonic transducers
workpiece
ultrasonic
chuck
contact
Prior art date
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Granted
Application number
JP2023504891A
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English (en)
Japanese (ja)
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JPWO2022190174A1 (https=
JP7366479B2 (ja
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Priority claimed from PCT/JP2021/009036 external-priority patent/WO2022190174A1/ja
Publication of JPWO2022190174A1 publication Critical patent/JPWO2022190174A1/ja
Publication of JPWO2022190174A5 publication Critical patent/JPWO2022190174A5/ja
Application granted granted Critical
Publication of JP7366479B2 publication Critical patent/JP7366479B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023504891A 2021-03-08 2021-03-08 搬送装置 Active JP7366479B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/009036 WO2022190174A1 (ja) 2021-03-08 2021-03-08 搬送装置

Publications (3)

Publication Number Publication Date
JPWO2022190174A1 JPWO2022190174A1 (https=) 2022-09-15
JPWO2022190174A5 true JPWO2022190174A5 (https=) 2023-04-19
JP7366479B2 JP7366479B2 (ja) 2023-10-23

Family

ID=83227503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023504891A Active JP7366479B2 (ja) 2021-03-08 2021-03-08 搬送装置

Country Status (7)

Country Link
US (1) US12519003B2 (https=)
EP (1) EP4306461A4 (https=)
JP (1) JP7366479B2 (https=)
KR (1) KR102633298B1 (https=)
CN (1) CN115315796A (https=)
TW (1) TWI832169B (https=)
WO (1) WO2022190174A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112023005089T5 (de) * 2022-12-06 2025-10-23 Panasonic Intellectual Property Management Co., Ltd. Aufnahmesystem und Aufnahmeverfahren
KR20250153244A (ko) * 2023-03-17 2025-10-24 야마하 로보틱스 가부시키가이샤 칩 유지 도구, 칩 유지 장치, 및 반도체 장치의 제조 장치
JP2025064294A (ja) * 2023-10-05 2025-04-17 ヤマハロボティクスホールディングス株式会社 ハンドリング装置
TW202520412A (zh) * 2023-10-12 2025-05-16 日商松下知識產權經營股份有限公司 拾取系統、接合裝置、分類裝置及控制方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890580A (en) * 1993-07-12 1999-04-06 Kaijo Corporation Object levitating apparatus, object transporting apparatus, and object levitating bearing along with an object levitating process and object transporting process
US5979475A (en) * 1994-04-28 1999-11-09 Hitachi, Ltd. Specimen holding method and fluid treatment method of specimen surface and systems therefor
DE10121742A1 (de) 2001-05-04 2003-01-23 Bosch Gmbh Robert Vorrichtung zum berührungslosen Greifen und Halten eines Gegenstandes
JP4376737B2 (ja) * 2004-08-31 2009-12-02 学校法人東京理科大学 非接触チャック
US20070141114A1 (en) 2005-12-15 2007-06-21 Essilor International Compagnie Generale D'optique Article coated with an ultra high hydrophobic film and process for obtaining same
JP4877658B2 (ja) 2007-02-14 2012-02-15 独立行政法人国立高等専門学校機構 非接触保持装置および非接触搬送装置
JP5099435B2 (ja) * 2008-03-05 2012-12-19 独立行政法人国立高等専門学校機構 非接触搬送装置
JP5752119B2 (ja) * 2009-07-22 2015-07-22 ツィンマーマン ウント シルプ ハンドハーブングステヒニーク ゲゼルシャフト ミット ベシュレンクテル ハフツングZimmermann & Schilp Handhabungstechnik GmbH 真空グリッパー
JP5402542B2 (ja) * 2009-11-06 2014-01-29 村田機械株式会社 非接触保持装置及び移載装置
US9360772B2 (en) * 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
JP5830440B2 (ja) 2012-06-20 2015-12-09 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP5553254B2 (ja) * 2013-08-20 2014-07-16 村田機械株式会社 非接触保持装置及び移載装置
KR101600382B1 (ko) 2014-05-12 2016-03-08 제트에스-핸들링 게엠베하 비접촉식 기판 그립핑 장치
TWI747225B (zh) * 2019-04-15 2021-11-21 日商新川股份有限公司 搬送裝置
KR102284457B1 (ko) * 2019-08-27 2021-07-30 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
KR102365660B1 (ko) * 2019-08-27 2022-02-18 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치

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