JP2005510068A5 - - Google Patents
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- Publication number
- JP2005510068A5 JP2005510068A5 JP2003545087A JP2003545087A JP2005510068A5 JP 2005510068 A5 JP2005510068 A5 JP 2005510068A5 JP 2003545087 A JP2003545087 A JP 2003545087A JP 2003545087 A JP2003545087 A JP 2003545087A JP 2005510068 A5 JP2005510068 A5 JP 2005510068A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- adjacent
- cutting tool
- substrate regions
- fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 7
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10156395A DE10156395A1 (de) | 2001-11-16 | 2001-11-16 | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
| PCT/EP2002/012774 WO2003043394A1 (de) | 2001-11-16 | 2002-11-14 | Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005510068A JP2005510068A (ja) | 2005-04-14 |
| JP2005510068A5 true JP2005510068A5 (https=) | 2006-01-12 |
| JP3981080B2 JP3981080B2 (ja) | 2007-09-26 |
Family
ID=7706026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003545087A Expired - Fee Related JP3981080B2 (ja) | 2001-11-16 | 2002-11-14 | 基体および回路基板にスルーコンタクトを形成する方法および装置 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7207107B2 (https=) |
| EP (1) | EP1449415B1 (https=) |
| JP (1) | JP3981080B2 (https=) |
| CN (1) | CN100407882C (https=) |
| AT (1) | ATE291343T1 (https=) |
| DE (2) | DE10156395A1 (https=) |
| ES (1) | ES2235102T3 (https=) |
| PT (1) | PT1449415E (https=) |
| RU (1) | RU2292680C2 (https=) |
| WO (1) | WO2003043394A1 (https=) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10156395A1 (de) | 2001-11-16 | 2003-05-28 | Giesecke & Devrient Gmbh | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
| NL1030664C2 (nl) * | 2005-12-13 | 2007-06-14 | Meco Equip Eng | Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager. |
| DE102011014820A1 (de) | 2011-03-23 | 2012-09-27 | Giesecke & Devrient Gmbh | Substrat mit durchkontaktierten leitfähigen Strukturen und Verfahren zu dessen Herstellung |
| DE102011016512A1 (de) | 2011-04-08 | 2012-10-11 | Giesecke & Devrient Gmbh | Verfahren zur Durchkontaktierung elektrisch leitfähiger Strukturen an entgegengesetzten Oberflächen eines Substrats |
| RU2544709C1 (ru) * | 2013-11-26 | 2015-03-20 | Государственное бюджетное образовательное учреждение высшего профессионального образования "Кировская государственная медицинская академия" Министерства здравоохранения Российской Федерации (ГБОУ ВПО Кировская ГМА Минздрава России) | Способ в.г. вохмянина получения в детали длинномерных отверстий |
| US11049822B1 (en) | 2019-12-20 | 2021-06-29 | Capital One Services, Llc | Systems and methods for the use of fraud prevention fluid to prevent chip fraud |
| US10977539B1 (en) | 2019-12-20 | 2021-04-13 | Capital One Services, Llc | Systems and methods for use of capacitive member to prevent chip fraud |
| US10810475B1 (en) | 2019-12-20 | 2020-10-20 | Capital One Services, Llc | Systems and methods for overmolding a card to prevent chip fraud |
| US10888940B1 (en) | 2019-12-20 | 2021-01-12 | Capital One Services, Llc | Systems and methods for saw tooth milling to prevent chip fraud |
| US10817768B1 (en) | 2019-12-20 | 2020-10-27 | Capital One Services, Llc | Systems and methods for preventing chip fraud by inserts in chip pocket |
| US11715103B2 (en) | 2020-08-12 | 2023-08-01 | Capital One Services, Llc | Systems and methods for chip-based identity verification and transaction authentication |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2426670A (en) * | 1945-12-19 | 1947-09-02 | David N Cooley | Apparatus for connecting metallic strips |
| DE2107591A1 (de) * | 1971-02-17 | 1972-08-31 | Siemens Ag | Verfahren zur Durchkontaktierung von beidseitig mit Leiterbahnen beschichteten Folien |
| US3977074A (en) * | 1975-02-06 | 1976-08-31 | General Motors Corporation | Double sided printed circuit board and method for making same |
| DE2524581A1 (de) * | 1975-06-03 | 1976-12-23 | Siemens Ag | Flexible gedruckte schaltung |
| DE3017320C2 (de) | 1980-05-06 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung einer Durchkontaktierung zwischen Metallschichten |
| JPH01125892A (ja) | 1987-11-10 | 1989-05-18 | Mari Yamazaki | 両面形プリント配線板の導通方法 |
| JPH0871981A (ja) | 1994-08-30 | 1996-03-19 | Bridgestone Corp | 帯状部材の切断方法および装置 |
| US5718142A (en) * | 1995-07-20 | 1998-02-17 | Ferraro; Ronald M. | Metal stitcher |
| DE10122414A1 (de) | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Durchkontaktierung von flexiblen Leiterplatten |
| AU2002315399A1 (en) * | 2001-06-21 | 2003-01-08 | Black And Decker Inc. | Method and apparatus for fastening steel framing by crimping |
| DE10156395A1 (de) | 2001-11-16 | 2003-05-28 | Giesecke & Devrient Gmbh | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
-
2001
- 2001-11-16 DE DE10156395A patent/DE10156395A1/de not_active Withdrawn
-
2002
- 2002-11-14 DE DE50202510T patent/DE50202510D1/de not_active Expired - Lifetime
- 2002-11-14 JP JP2003545087A patent/JP3981080B2/ja not_active Expired - Fee Related
- 2002-11-14 WO PCT/EP2002/012774 patent/WO2003043394A1/de not_active Ceased
- 2002-11-14 CN CN028259181A patent/CN100407882C/zh not_active Expired - Fee Related
- 2002-11-14 EP EP20020791679 patent/EP1449415B1/de not_active Expired - Lifetime
- 2002-11-14 PT PT02791679T patent/PT1449415E/pt unknown
- 2002-11-14 AT AT02791679T patent/ATE291343T1/de active
- 2002-11-14 RU RU2004118246A patent/RU2292680C2/ru not_active IP Right Cessation
- 2002-11-14 ES ES02791679T patent/ES2235102T3/es not_active Expired - Lifetime
- 2002-11-14 US US10/495,564 patent/US7207107B2/en not_active Expired - Lifetime
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