JP3981080B2 - 基体および回路基板にスルーコンタクトを形成する方法および装置 - Google Patents
基体および回路基板にスルーコンタクトを形成する方法および装置 Download PDFInfo
- Publication number
- JP3981080B2 JP3981080B2 JP2003545087A JP2003545087A JP3981080B2 JP 3981080 B2 JP3981080 B2 JP 3981080B2 JP 2003545087 A JP2003545087 A JP 2003545087A JP 2003545087 A JP2003545087 A JP 2003545087A JP 3981080 B2 JP3981080 B2 JP 3981080B2
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- Prior art keywords
- substrate
- contact
- cut
- cutting tool
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/27—Means for performing other operations combined with cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/18—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/18—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
- B26F1/22—Perforating by slitting, i.e. forming cuts closed at their ends without removal of material to form non-rectilinear cuts, e.g. for tabs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09836—Oblique hole, via or bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
- Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0207—Other than completely through work thickness or through work presented
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Forests & Forestry (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Monitoring And Testing Of Exchanges (AREA)
- Combinations Of Printed Boards (AREA)
- Container Filling Or Packaging Operations (AREA)
- Nonmetal Cutting Devices (AREA)
Description
2、3 コイル
4、5、6 接触区域
9 刃具
10 ベース
11 傾斜切込み
12 ラム
13 圧搾空気
14 真空ポンプ
15 駆動フック
20、30 スルーコンタクト・タブ
Claims (12)
- 刃具(9)により、対向する2つの表面(1a、1b)に導電接触区域(4、41;6、61)を有する塑性基体(1)の該導電接触区域(4、41)に、該基体(1)を貫通し該2つの面(1a、1b)に達する傾斜切込み(11)を入れ、スルーコンタクトを形成する方法であって、前記切込み形成操作によって、同時に前記傾斜切込み(11)に隣接する2つの基体領域(20、30)が互いの背後において固定されるまで重ね合わされることを特徴とする方法。
- 前記隣接する2つの基体領域(20、30)が、独立したラム(12)および/または前記刃具に取り付けられている駆動装置(15)によって、重ね合わされることを特徴とする請求項1記載の方法。
- 前記隣接する2つの基体領域(20、30)が、圧搾空気(13)または減圧(14)によって、重ね合わされることを特徴とする請求項1または2記載の方法。
- 前記基体の位置を固定したまま、前記切込みを形成するステップと前記隣接する2つの基体領域を重ね合わせるステップとが実施されることを特徴とする請求項1〜3いずれか1項記載の方法。
- 前記傾斜切込み(11)が、前記対向する2つの基体表面(1a、1b)に対し45°の角度で形成されることを特徴とする請求項1〜4いずれか1項記載の方法。
- 基体(1)の対向する2つの表面(1a、1b)に達する傾斜切込み(11)を形成するための刃具(9)、および該切込み(11)に隣接する2つの基体領域(20、30)を重ね合わせ互いの背後で固定するための手段(12;13;14;15)を備えている、請求項1〜5いずれか1項記載の方法を実施するための装置であって、前記刃具(9)および前記固定するための手段(12;13;14;15)が同一作業台に配されていることを特徴とする装置。
- 前記固定するための手段が、ラム(12)を備えていることを特徴とする請求項6記載の装置。
- 前記固定するための手段が、圧搾空気(13)によって、前記切込みに隣接する2つの基体領域を重ね合わせることを特徴とする請求項6または7記載の装置。
- 前記固定するための手段が、減圧(14)によって、前記切込みに隣接する2つの基体領域を重ね合わせることを特徴とする請求項6〜8いずれか1項記載の装置。
- 前記固定するための手段が、前記刃具(9)に取り付けられている駆動フック(15)を備えていることを特徴とする請求項6記載の装置。
- 前記刃具(9)が、少なくとも1つの歯(9b)を有する刃先を備えていることを特徴とする請求項6〜10いずれか1項記載の装置。
- 前記刃具(9)が、刃面に直角な方向に弾性を有する刀身を備えていることを特徴とする請求項6〜11いずれか1項記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10156395A DE10156395A1 (de) | 2001-11-16 | 2001-11-16 | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
PCT/EP2002/012774 WO2003043394A1 (de) | 2001-11-16 | 2002-11-14 | Verfahren und vorrichtung zum durchkontaktieren von substraten und leiterplatten |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005510068A JP2005510068A (ja) | 2005-04-14 |
JP2005510068A5 JP2005510068A5 (ja) | 2006-01-12 |
JP3981080B2 true JP3981080B2 (ja) | 2007-09-26 |
Family
ID=7706026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003545087A Expired - Fee Related JP3981080B2 (ja) | 2001-11-16 | 2002-11-14 | 基体および回路基板にスルーコンタクトを形成する方法および装置 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7207107B2 (ja) |
EP (1) | EP1449415B1 (ja) |
JP (1) | JP3981080B2 (ja) |
CN (1) | CN100407882C (ja) |
AT (1) | ATE291343T1 (ja) |
DE (2) | DE10156395A1 (ja) |
ES (1) | ES2235102T3 (ja) |
PT (1) | PT1449415E (ja) |
RU (1) | RU2292680C2 (ja) |
WO (1) | WO2003043394A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10156395A1 (de) | 2001-11-16 | 2003-05-28 | Giesecke & Devrient Gmbh | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
NL1030664C2 (nl) | 2005-12-13 | 2007-06-14 | Meco Equip Eng | Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager. |
DE102011014820A1 (de) | 2011-03-23 | 2012-09-27 | Giesecke & Devrient Gmbh | Substrat mit durchkontaktierten leitfähigen Strukturen und Verfahren zu dessen Herstellung |
DE102011016512A1 (de) | 2011-04-08 | 2012-10-11 | Giesecke & Devrient Gmbh | Verfahren zur Durchkontaktierung elektrisch leitfähiger Strukturen an entgegengesetzten Oberflächen eines Substrats |
RU2544709C1 (ru) * | 2013-11-26 | 2015-03-20 | Государственное бюджетное образовательное учреждение высшего профессионального образования "Кировская государственная медицинская академия" Министерства здравоохранения Российской Федерации (ГБОУ ВПО Кировская ГМА Минздрава России) | Способ в.г. вохмянина получения в детали длинномерных отверстий |
US10817768B1 (en) | 2019-12-20 | 2020-10-27 | Capital One Services, Llc | Systems and methods for preventing chip fraud by inserts in chip pocket |
US10888940B1 (en) | 2019-12-20 | 2021-01-12 | Capital One Services, Llc | Systems and methods for saw tooth milling to prevent chip fraud |
US11049822B1 (en) | 2019-12-20 | 2021-06-29 | Capital One Services, Llc | Systems and methods for the use of fraud prevention fluid to prevent chip fraud |
US10977539B1 (en) | 2019-12-20 | 2021-04-13 | Capital One Services, Llc | Systems and methods for use of capacitive member to prevent chip fraud |
US10810475B1 (en) | 2019-12-20 | 2020-10-20 | Capital One Services, Llc | Systems and methods for overmolding a card to prevent chip fraud |
US11715103B2 (en) | 2020-08-12 | 2023-08-01 | Capital One Services, Llc | Systems and methods for chip-based identity verification and transaction authentication |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2426670A (en) * | 1945-12-19 | 1947-09-02 | David N Cooley | Apparatus for connecting metallic strips |
DE2107591A1 (de) * | 1971-02-17 | 1972-08-31 | Siemens Ag | Verfahren zur Durchkontaktierung von beidseitig mit Leiterbahnen beschichteten Folien |
US3977074A (en) * | 1975-02-06 | 1976-08-31 | General Motors Corporation | Double sided printed circuit board and method for making same |
DE2524581A1 (de) | 1975-06-03 | 1976-12-23 | Siemens Ag | Flexible gedruckte schaltung |
DE3017320C2 (de) | 1980-05-06 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung einer Durchkontaktierung zwischen Metallschichten |
JPH01125892A (ja) | 1987-11-10 | 1989-05-18 | Mari Yamazaki | 両面形プリント配線板の導通方法 |
JPH0871981A (ja) | 1994-08-30 | 1996-03-19 | Bridgestone Corp | 帯状部材の切断方法および装置 |
US5718142A (en) * | 1995-07-20 | 1998-02-17 | Ferraro; Ronald M. | Metal stitcher |
DE10122414A1 (de) | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Durchkontaktierung von flexiblen Leiterplatten |
WO2003000466A2 (en) * | 2001-06-21 | 2003-01-03 | Black & Decker Inc. | Method and apparatus for fastening steel framing by crimping |
DE10156395A1 (de) | 2001-11-16 | 2003-05-28 | Giesecke & Devrient Gmbh | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
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2001
- 2001-11-16 DE DE10156395A patent/DE10156395A1/de not_active Withdrawn
-
2002
- 2002-11-14 ES ES02791679T patent/ES2235102T3/es not_active Expired - Lifetime
- 2002-11-14 PT PT02791679T patent/PT1449415E/pt unknown
- 2002-11-14 DE DE50202510T patent/DE50202510D1/de not_active Expired - Lifetime
- 2002-11-14 RU RU2004118246A patent/RU2292680C2/ru not_active IP Right Cessation
- 2002-11-14 JP JP2003545087A patent/JP3981080B2/ja not_active Expired - Fee Related
- 2002-11-14 CN CN028259181A patent/CN100407882C/zh not_active Expired - Fee Related
- 2002-11-14 WO PCT/EP2002/012774 patent/WO2003043394A1/de active IP Right Grant
- 2002-11-14 EP EP20020791679 patent/EP1449415B1/de not_active Expired - Lifetime
- 2002-11-14 US US10/495,564 patent/US7207107B2/en not_active Expired - Lifetime
- 2002-11-14 AT AT02791679T patent/ATE291343T1/de active
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US7207107B2 (en) | 2007-04-24 |
RU2292680C2 (ru) | 2007-01-27 |
US20050125997A1 (en) | 2005-06-16 |
DE10156395A1 (de) | 2003-05-28 |
ATE291343T1 (de) | 2005-04-15 |
RU2004118246A (ru) | 2006-01-10 |
ES2235102T3 (es) | 2005-07-01 |
CN1608398A (zh) | 2005-04-20 |
WO2003043394A1 (de) | 2003-05-22 |
EP1449415B1 (de) | 2005-03-16 |
CN100407882C (zh) | 2008-07-30 |
EP1449415A1 (de) | 2004-08-25 |
PT1449415E (pt) | 2005-07-29 |
DE50202510D1 (de) | 2005-04-21 |
JP2005510068A (ja) | 2005-04-14 |
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