CN1608398A - 用于基板和印刷电路板的贯通接触的方法和设备 - Google Patents
用于基板和印刷电路板的贯通接触的方法和设备 Download PDFInfo
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Abstract
用于柔性基板(1)、尤其是印刷电路板的贯通接触的方法和装置,其借助于该基板的相对设置的表面(1a、1b)上的两个导电接触区(4、41)。切口(11)在接触区的区域内在相对于基板表面的倾斜位置形成,该倾斜切口附近的两个基板区(20、30)移位,直至它们彼此互锁。借助于挺杆(12)通过对压缩区(13)的冲击和低压力(14)的施加,或者借助于固定在切削工具上的驱动钩(15),进行所述的移位。包括切口形成和切口附近两个基板区的移位的两个步骤在一道工序中实施。
Description
技术领域
本发明涉及一种用于贯通接触柔性基板、尤其是电路板的方法和设备,该基板具有设置在该基板两相对表面上的导电接触区,藉此,借助切削工具在接触区的区域内倾斜于基板表面穿过该基板形成切口,且该倾斜切口附近的两个基板区被移动成彼此交错,直至它们卡在彼此之后。其结果是,它们接触设置在该基板的相对表面上的接触区,即,基板上侧的接触区触及基板下侧的接触区。
背景技术
这样的方法在未公开专利申请DE 101 22 414.1中述及。与传统贯通接触方法相比,此方法简单得多,借助该传统贯通接触方法,贯通接触通过冲制或钻一通孔并插入导电接触套管或灌入导电糊来实现(EP-A-0 884 973)。该基板的表面可以被后续层叠再次变平,这同时稳定了两个接触区之间的电连接。由于接触区因柔性基板的内部应力而彼此牢固压靠,所以不需要额外的导电材料来形成接触。
这样的基板或这样的电路板通常作为卡镶嵌物集成到IC卡或芯片卡(身份证、信用卡、现金卡等)内,且常形成卡体的一单独的层。在电路板的一面上例如可以是通过导电层形成的且具有其它电子器件的集成电路,同时电路板的相对面上的导电层例如被形成为天线线圈以用于与外部器件进行非接触式数据交换和能量传输,该天线线圈通过电路板与该集成电路电连接。通过电路板的此电连接通常被称为“贯通接触(durchkontaktieren)”。
在本发明中,该基板也可取代IC卡用于具有天线线圈技术和/或电子镶嵌物的标签、不干胶标签和类似的防伪物。
已经证明此方法存在的问题是,接连实施的两个工作步骤,即倾斜切割和切口附近两个基板区域(以下也称作“接触片”或“贯通接触片”)的贯通推进是不精确的,且导致不合格率高。因此,该方法的内部测试需要高成本的手工劳动。
发明内容
本发明要解决的问题在于提供一种用于贯通接触电路板等的具体且可靠、简化的方法、以及用于实施该方法的设备。
此问题通过具有独立权利要求的特征的方法和设备来解决。本发明的有利实施例和其改进在其从属权利要求中叙述。
因此,通过倾斜切口形成的贯通接触片不被推成彼此交错;这借助单独的撞锤(ram)或借助压缩空气或借助施加真空来机械地完成,或在倾斜切口的制造过程中借助固定在切削工具上的驱动钩自动地完成。这些方式中的一个或多个也可以彼此结合。所述机械辅助装置的使用允许该方法自动进行,且不合格率降低。
可看出的一特殊的优点在于,用于贯通推动该贯通接触片的机械辅助装置可与共同加工位置中用于形成倾斜切口的切削工具结合。这使得尤其可能在基板位置不变的情况下实施两个工艺步骤,使得用于贯穿推动该贯通接触片的机械辅助设备总是相对于先前制备的切口在精确的预定位置作用在基板上。
如果贯通接触所需的该两个步骤在一共同的操作中实现,则这是非常有利的。例如通过具有固定在其上的驱动钩的切削工具,通过以下步骤可实现此目的,该步骤为:该切削工具首先相对于该基板平面倾斜地推进穿过该基板;以及两个如此制成的贯通接触片中的一个随着该切削工具的进一步前进而被例如固定在该切削工具上的驱动钩推到另一个贯通接触片之后。
当采用压缩空气和/或真空时,形成切口和贯穿推进该片的两个步骤也可以集成到一个操作中。
甚至用于贯穿推进一个接触片至另一接触片之后的单独撞锤的使用可集成到形成倾斜切口的工艺步骤中。此时,在切削工具从该倾斜切口退出之前,所述接触片被该撞锤推进为彼此交错。该切削工具优选地用作刀刃(knifeblade),其在垂直于该刀刃平面的方向上是弹性的。
根据本发明的特定实施例,切削工具的切割边缘是锯齿状的,且具有至少一个齿。这防止了刀刃在放置在该柔性基板上后打滑,且因此提高了贯通接触的精度。
附图说明
以下将参照附图借助实施例来说明本发明,其中:
图1A和1B示出了柔性基板的前面和背面;
图2以侧视图示出了用于贯通接触该基板的本发明装置的两个实施例;
图3A和3B以剖视图和俯视图示出了一基板,其借助图2的装置贯通接触;
图4示出了根据图2的本发明装置的一实施例;
图5A和5B以剖视图和俯视图示出了一基板,其借助图4的装置来贯通接触;
图6以侧视图示出了用于贯通接触该基板的本发明装置的两个其它实施例;以及
图7示出了具有锯齿状切削边的切削工具。
具体实施方式
图1A示出基板1的前面,该基板适于结合到卡体内。在基板的此面上,导电层2为线圈形式,用于与外部装置的非接触式数据和能量交换。设置在基板1的此面上的线圈2具有接触区4和5,接触区5设置成与IC模块接触。线圈与IC模块的进一步接触通过接触区6实现,接触区6通过位置8处的贯通接触与基板1背面上的呈第二线圈形式的第二导电层3(图1B)相连。在位置7,同样类型的另一贯通接触将接触区4与线圈3相连。图1B中,基底背面上线圈3的相关接触区标记为61和41。
图2一起示出了用于进行贯通接触的本发明装置的两个实施例。这两个实施例的共同点在于:在加工位置,基板1位于柔性基底10(例如橡胶垫)上,且基板的位置不变;所有切口11倾斜于基板1的表面1a、1b形成;以及通过切口形成的贯通接触片20、30被推成彼此交错,直到片30互锁在另一片20之后,如图3A所示。
基板1中的切口11优选地相对于基板表面1a、1b以45°角形成。
根据图2所示的第一实施例,将两个贯通接触片20、30移动成彼此交错的步骤借助刀具9上的驱动钩15实现。为此,可卸载地安装在刀具夹具20中的刀具9首先在轴向上前推,以形成切口11。进一步推进刀具9导致驱动钩15与图2中位于切口11右方的接触片30接触,并将其向后推至位于图2中切口11左方的接触片20之后,使得两个接触片在彼此之后卡住(图3A)。
根据图2所示的第二实施例,取代驱动钩15,可在箭头方向上下移动的撞锤12用于将所述的两个贯通接触片20、30移动成彼此交错。此时,切口11首先通过在刀具9轴向上前进的刀具9制成,然后在刀具9移动回到其初始位置之前或之后,使用撞锤12再次推动位于切口11右方的接触片30至位于切口11左方的接触片20之后。此时,撞锤12具有较小的横截面,且以此横截面推动仅右侧接触片30的中心区域至左侧接触片20下方。
在平面图中,两个实施例均得到了贯通接触结构,如图3B所示。因此,接触片20、30仅在切口11的中心区域以其表面1a、1b交叠(图3A)。图3B中,如此获得的线圈2的接触区4和线圈3的接触区41之间的接触区域显示为阴影。
当贯通接触在加工位置上完成之后,基板1可以从加工位置上取下,且例如在叠层工序中被完成以与其它塑料层和可选的其它的电子器件一起形成塑料卡。
取代图2所示的具有较小横截面的撞锤,还可以使用沿切口11的总长度延伸的撞锤。根据图2实施例中的优选较小且位于刀具9中心的驱动钩15可选地也可以在刀具9的整个宽度上延伸。此时,将右侧接触片30整个推到左侧接触片20后面导致至少该整个推动的贯通接触片30在切口的两端撕破。为了避免此情形出现,如图4所示的图2装置的替换实施例提供了具有横向切割元件9a的刀具9或具有横向切割元件12a的撞锤12,这确保了在通过切割元件9a形成切口11时或在通过切割元件12a将接触片推动为彼此交错时,整齐的切口11a垂直于横向延伸的切口11形成。于是,贯通接触片30具有严格意义上的一般的片的形式,如图5A所示,右侧接触片30被向下推而超出基板平面。所述接触片30通过切口11和11a在三侧上与基板1分离,并仅在一侧与基板1相连。图5B再次示出了由图4的装置形成的贯通接触的区域的平面图。接触区4和41之间的具体接触表面仍用阴影表示。
图6再次同时在一个图中示出了用于实施该方法的本发明装置的另两个实施例。此时,通过朝向接触片30前面1a的压缩空气13和/或通过由真空泵14施加到接触片背面1b上的真空,将右侧接触片30移动成与左侧接触片20交错。此时,基座10可以是固定基座,因为切口11被引导至真空泵14的吸入口内,且位于切口11右方的贯通接触片30在移动而经过位于切口11左方的接触片20时也移动至所述吸入口内。
图7示出具有锯齿状切割边的刀具9的具体实施例。在此特别显示的实施例中,刀具9的切割边具有一单齿9b,其用于防止刀具9在被放置到基板1的表面1a上后滑动。
Claims (12)
1.一种用于贯通接触柔性基底(1)的方法,该基底具有设置在基底(1)的两个相对表面(1a、1b)上的导电接触区(4、41;6、61),借助于切削工具(9)在接触区(4、41)的区域内倾斜于基板(1)的表面(1a、1b)贯通该基板而形成切口(11),其特征在于,邻接该倾斜切口(11)的两个基板区域(20、30)被移动成彼此交错直到它们卡在彼此之后,将它们移动成彼此交错的步骤与该切口的形成在一道工序中一起进行。
2.根据权利要求1的方法,其特征在于,所述邻接的基板区域(20、30)借助于单独的撞锤(12)和/或设置在该切削工具上的驱动装置(15)而被移动成彼此交错。
3.根据权利要求1或2的方法,其特征在于,所述邻接的基板区域(20、30)借助于压缩空气(13)或真空(14)的形成而被移动成彼此交错。
4.根据权利要求1至3中的任一项的方法,其特征在于,形成该切口和将所述两个基板区域移动成彼此交错的两个步骤以不变的基板位置实施。
5.根据权利要求1至4中的任一项的方法,其特征在于,该倾斜切口(11)相对于基板表面(1a、1b)以45°角形成。
6.一种用于实施根据权利要求1至5中的任一项的方法的设备,包括:切削工具(9),用于倾斜于基板(1)的两个相对表面(1a、1b)穿过该基板形成切口(11);以及装置(12;13;14;15),用于将邻接该切口(11)的两个基板区域(20、30 移动成彼此交错并将它们卡在彼此之后,其特征在于,该切削工具(9)和该卡锁装置(12;13;14;15)设置在一共同的工作位置。
7.根据权利要求6的设备,其特征在于,该卡锁装置包括撞锤(12)。
8.根据权利要求6或7的设备,其特征在于,该卡锁装置采用压缩空气(13)来将邻接该切口的所述两个基板区域移动成彼此交错。
9.根据权利要求6至8中的任一项的设备,其特征在于,该卡锁装置采用真空(14)来将邻接该切口的所述两个基板区域移动成彼此交错。
10.根据权利要求6的设备,其特征在于,该卡锁装置包括固定在该切削工具(9)上的驱动钩(15)。
11.根据权利要求6至10中的任一项的设备,其特征在于,该切削工具(9)具有带至少一个齿(9a)的切割边。
12.根据权利要求6至11中的任一项的设备,其特征在于,该切削工具(9)包括垂直于刀刃平面的弹性的刀刃。
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DE10156395A DE10156395A1 (de) | 2001-11-16 | 2001-11-16 | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
DE10156395.7 | 2001-11-16 |
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EP (1) | EP1449415B1 (zh) |
JP (1) | JP3981080B2 (zh) |
CN (1) | CN100407882C (zh) |
AT (1) | ATE291343T1 (zh) |
DE (2) | DE10156395A1 (zh) |
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CN101331502B (zh) * | 2005-12-13 | 2012-05-30 | Meco设备工程有限公司 | 互连存在于衬底相对侧的迹线的方法 |
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DE10156395A1 (de) | 2001-11-16 | 2003-05-28 | Giesecke & Devrient Gmbh | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
DE102011014820A1 (de) | 2011-03-23 | 2012-09-27 | Giesecke & Devrient Gmbh | Substrat mit durchkontaktierten leitfähigen Strukturen und Verfahren zu dessen Herstellung |
DE102011016512A1 (de) | 2011-04-08 | 2012-10-11 | Giesecke & Devrient Gmbh | Verfahren zur Durchkontaktierung elektrisch leitfähiger Strukturen an entgegengesetzten Oberflächen eines Substrats |
RU2544709C1 (ru) * | 2013-11-26 | 2015-03-20 | Государственное бюджетное образовательное учреждение высшего профессионального образования "Кировская государственная медицинская академия" Министерства здравоохранения Российской Федерации (ГБОУ ВПО Кировская ГМА Минздрава России) | Способ в.г. вохмянина получения в детали длинномерных отверстий |
US11049822B1 (en) | 2019-12-20 | 2021-06-29 | Capital One Services, Llc | Systems and methods for the use of fraud prevention fluid to prevent chip fraud |
US10810475B1 (en) | 2019-12-20 | 2020-10-20 | Capital One Services, Llc | Systems and methods for overmolding a card to prevent chip fraud |
US10977539B1 (en) | 2019-12-20 | 2021-04-13 | Capital One Services, Llc | Systems and methods for use of capacitive member to prevent chip fraud |
US10888940B1 (en) | 2019-12-20 | 2021-01-12 | Capital One Services, Llc | Systems and methods for saw tooth milling to prevent chip fraud |
US10817768B1 (en) | 2019-12-20 | 2020-10-27 | Capital One Services, Llc | Systems and methods for preventing chip fraud by inserts in chip pocket |
US11715103B2 (en) | 2020-08-12 | 2023-08-01 | Capital One Services, Llc | Systems and methods for chip-based identity verification and transaction authentication |
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US2426670A (en) * | 1945-12-19 | 1947-09-02 | David N Cooley | Apparatus for connecting metallic strips |
DE2107591A1 (de) * | 1971-02-17 | 1972-08-31 | Siemens Ag | Verfahren zur Durchkontaktierung von beidseitig mit Leiterbahnen beschichteten Folien |
US3977074A (en) * | 1975-02-06 | 1976-08-31 | General Motors Corporation | Double sided printed circuit board and method for making same |
DE2524581A1 (de) * | 1975-06-03 | 1976-12-23 | Siemens Ag | Flexible gedruckte schaltung |
DE3017320C2 (de) * | 1980-05-06 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung einer Durchkontaktierung zwischen Metallschichten |
JPH01125892A (ja) * | 1987-11-10 | 1989-05-18 | Mari Yamazaki | 両面形プリント配線板の導通方法 |
JPH0871981A (ja) * | 1994-08-30 | 1996-03-19 | Bridgestone Corp | 帯状部材の切断方法および装置 |
US5718142A (en) * | 1995-07-20 | 1998-02-17 | Ferraro; Ronald M. | Metal stitcher |
DE10122414A1 (de) * | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Durchkontaktierung von flexiblen Leiterplatten |
WO2003000466A2 (en) * | 2001-06-21 | 2003-01-03 | Black & Decker Inc. | Method and apparatus for fastening steel framing by crimping |
DE10156395A1 (de) | 2001-11-16 | 2003-05-28 | Giesecke & Devrient Gmbh | Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten |
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US7207107B2 (en) | 2007-04-24 |
DE10156395A1 (de) | 2003-05-28 |
ATE291343T1 (de) | 2005-04-15 |
RU2292680C2 (ru) | 2007-01-27 |
EP1449415B1 (de) | 2005-03-16 |
PT1449415E (pt) | 2005-07-29 |
CN100407882C (zh) | 2008-07-30 |
EP1449415A1 (de) | 2004-08-25 |
US20050125997A1 (en) | 2005-06-16 |
RU2004118246A (ru) | 2006-01-10 |
JP3981080B2 (ja) | 2007-09-26 |
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ES2235102T3 (es) | 2005-07-01 |
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