WO2022176755A1 - 樹脂組成物並びにそれを用いた印刷用インキ及び導電性ペースト - Google Patents
樹脂組成物並びにそれを用いた印刷用インキ及び導電性ペースト Download PDFInfo
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- WO2022176755A1 WO2022176755A1 PCT/JP2022/005260 JP2022005260W WO2022176755A1 WO 2022176755 A1 WO2022176755 A1 WO 2022176755A1 JP 2022005260 W JP2022005260 W JP 2022005260W WO 2022176755 A1 WO2022176755 A1 WO 2022176755A1
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- carbon atoms
- group
- resin composition
- alkyl group
- composition according
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- 238000007639 printing Methods 0.000 title claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 171
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 82
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 82
- 239000002904 solvent Substances 0.000 claims abstract description 58
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 49
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 23
- 239000004417 polycarbonate Substances 0.000 claims abstract description 23
- 125000001424 substituent group Chemical group 0.000 claims abstract description 20
- 229920001519 homopolymer Polymers 0.000 claims abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 42
- 239000001257 hydrogen Substances 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 29
- 125000003118 aryl group Chemical group 0.000 claims description 29
- 125000003342 alkenyl group Chemical group 0.000 claims description 27
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 150000002440 hydroxy compounds Chemical class 0.000 claims description 25
- 150000002431 hydrogen Chemical class 0.000 claims description 21
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 18
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 17
- 125000002252 acyl group Chemical group 0.000 claims description 16
- 125000003545 alkoxy group Chemical group 0.000 claims description 16
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- 229910052736 halogen Inorganic materials 0.000 claims description 11
- 150000002367 halogens Chemical class 0.000 claims description 11
- 125000002837 carbocyclic group Chemical group 0.000 claims description 10
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 claims description 10
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 10
- 125000000623 heterocyclic group Chemical group 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 6
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910052801 chlorine Inorganic materials 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 5
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052794 bromium Inorganic materials 0.000 claims description 5
- 239000000460 chlorine Substances 0.000 claims description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 4
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- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims description 3
- CSZZMFWKAQEMPB-UHFFFAOYSA-N 1-methoxybutan-2-ol Chemical compound CCC(O)COC CSZZMFWKAQEMPB-UHFFFAOYSA-N 0.000 claims description 3
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 3
- 239000000470 constituent Substances 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 45
- 230000015572 biosynthetic process Effects 0.000 description 33
- 238000003786 synthesis reaction Methods 0.000 description 28
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 19
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 18
- 229920000642 polymer Polymers 0.000 description 17
- 238000006116 polymerization reaction Methods 0.000 description 17
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 13
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
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- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 231100000053 low toxicity Toxicity 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
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- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
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- 150000002009 diols Chemical class 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
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- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 3
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- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
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- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
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- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 3
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/04—Aromatic polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/04—Aromatic polycarbonates
- C08G64/06—Aromatic polycarbonates not containing aliphatic unsaturation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D169/00—Coating compositions based on polycarbonates; Coating compositions based on derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2369/00—Characterised by the use of polycarbonates; Derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
Definitions
- the present invention provides a resin composition having low toxicity and excellent stability (no erosion) and uniformity to a substrate when applied, a polycarbonate resin solution with a higher concentration, and a printing ink using them. , resin solutions for 3D printers, conductive pastes, coating solutions and films.
- Patent Document 1 halogen-based organic solvents, toluene, 1,4-dioxane, and other solvents that pose safety concerns for humans have been replaced with safer solvents.
- Patent Document 1 halogen-based organic solvents, toluene, 1,4-dioxane, and other solvents that pose safety concerns for humans have been replaced with safer solvents.
- Patent Document 1 halogen-based organic solvents, toluene, 1,4-dioxane, and other solvents that pose safety concerns for humans have been replaced with safer solvents.
- Patent Document 1 halogen-based organic solvents, toluene, 1,4-dioxane, and other solvents that pose safety concerns for humans have been replaced with safer solvents.
- the present inventors have found that by dissolving a polycarbonate resin containing a specific structural unit in a specific organic solvent, the toxicity is low and the base when applied.
- the inventors have found that it is possible to obtain a resin composition that is excellent in stability (no corrosion) and uniformity with respect to materials, and have completed the present invention.
- the present inventors have found that a high-concentration polycarbonate resin solution can be obtained by combining a specific polycarbonate resin containing fluorine atoms and a specific hydroxy compound, and have completed the present invention.
- the present invention is as follows. ⁇ 1> Polycarbonate resin containing a solvent represented by the following general formula (1) and a structural unit (a) represented by the following general formula (A) (only the structural unit represented by the following formula (i) (Excluding polycarbonate homopolymer consisting of).
- R a is hydrogen, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, each optionally having a substituent, and 7 carbon atoms.
- R b each optionally has a substituent, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or carbon representing an acyl group of numbers 2-20;
- R c to R f each independently represent hydrogen or an alkyl group having 1 to 3 carbon atoms;
- n represents an integer of 1-10.
- R 1 to R 8 are each independently hydrogen, fluorine, chlorine, bromine, iodine, an alkyl group having 1 to 7 carbon atoms each optionally having a substituent, represents an aryl group, an alkenyl group having 2 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms or an aralkyl group having 7 to 17 carbon atoms, and X represents -O-, -S-, -SO-, -SO 2 -, -CO-, or a divalent group represented by any of the following formulas (2) to (4).)
- R 9 and R 10 are each independently hydrogen, halogen, an alkyl group having 1 to 20 carbon atoms, each optionally having a substituent, an alkyl group having 1 to 5 carbon atoms, an alkoxy group, an aryl group having 6 to 12 carbon atoms, an aralkyl group having 7 to 17 carbon atoms, or an alken
- n represents an integer of 1 to 4, the above ⁇ 1>
- ⁇ 6> The resin composition according to ⁇ 5> above, wherein n in the general formula (1) is 2 or 3.
- ⁇ 7> The above ⁇ 1> to ⁇ , wherein the solvent represented by the general formula (1) contains one or more selected from the group consisting of glycol ether solvents, glycol ester solvents, and glyme solvents. 4>.
- the hydroxy compound is the resin composition represented by the following general formula (1a) or the following general formula (1b).
- R a is an optionally substituted alkyl group having 1 to 20 carbon atoms, aryl group having 6 to 20 carbon atoms, alkenyl group having 2 to 20 carbon atoms, 7 carbon atoms, represents an aralkyl group of ⁇ 20 or an acyl group of 2 to 20 carbon atoms
- R b to R e each independently represent hydrogen or an alkyl group having 1 to 10 carbon atoms
- n represents an integer of 1-10.
- R k represents an optionally branched C 3-20 alkyl group having a hydroxyl group.
- the polycarbonate resin further contains a structural unit (a) represented by the following general formula (A) (excluding the structural unit (b) represented by the general formula (A-1)). and the resin composition according to ⁇ 8> above.
- R 1 to R 8 are each independently hydrogen, fluorine, chlorine, bromine, iodine, an alkyl group having 1 to 7 carbon atoms each optionally having a substituent, an alkyl group having 1 to 7 carbon atoms, represents an aryl group of up to 12, an alkenyl group of 2 to 7 carbon atoms, an alkoxy group of 1 to 7 carbon atoms or an aralkyl group of 7 to 17 carbon atoms, X represents -O-, -S-, -SO-, —SO 2 —, —CO—, or a divalent group represented by any of the following formulas (2) to (4).)
- R 9 and R 10 are each independently hydrogen, halogen, an alkyl group having 1 to 20 carbon atoms, each optionally having a substituent, an alkyl group having 1 to 5 carbon atoms, an alkoxy group, an aryl group having 6 to 12 carbon atoms, an
- ⁇ 11> The above ⁇ 9>, wherein the content ratio [(b)/(a)] of the structural unit (b) and the structural unit (a) is 50/50 to 100/0 in terms of molar ratio.
- ⁇ 12> The resin composition according to any one of ⁇ 8> to ⁇ 11> above, wherein the mass ratio of the polycarbonate resin to the hydroxy compound (polycarbonate resin/hydroxy compound) is 1/99 to 50/50. is.
- ⁇ 13> The resin composition according to any one of ⁇ 8> to ⁇ 12> above, wherein the hydroxy compound has a boiling point of 50° C. or higher.
- the hydroxy compound is butyl carbitol, ethyl carbitol, butyl cellosolve, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, 1-butoxy-2-propanol, 1-methoxy-2-butanol,
- the resin composition according to any one of ⁇ 8> to ⁇ 13> above which is at least one selected from the group consisting of 2-hydroxyethyl methacrylate and diacetone alcohol.
- a printing ink comprising the resin composition according to any one of ⁇ 1> to ⁇ 15> above.
- a resin solution for a 3D printer comprising the resin composition according to any one of ⁇ 1> to ⁇ 15> above.
- ⁇ 18> A conductive paste containing the resin composition according to any one of ⁇ 1> to ⁇ 15> above.
- a coating solution comprising the resin composition according to any one of ⁇ 1> to ⁇ 15> above.
- ⁇ 20> A film formed from the resin composition according to any one of ⁇ 1> to ⁇ 15> above.
- the resin composition of the preferred embodiment of the present invention since a glycol-based solvent, which is a weak solvent, is used, substrates such as polycarbonate (hereinafter sometimes referred to as "PC") sheets are hardly damaged during application. , it is possible to form a precise and strong coating film surface with little bleeding.
- glycol-based solvents generally have low toxicity and odor, they are effective for screen printing paints and optical member applications from the viewpoint of the working environment, and can be used as various inks, paints, conductive pastes, and resin compositions for 3D printers. preferred.
- the resin composition of another preferred embodiment of the present invention it is possible to provide a polycarbonate resin solution with a higher concentration, so that it can be suitably used in technical fields that require a high concentration.
- the resin composition of the first embodiment of the present invention is a polycarbonate resin containing a solvent represented by the above general formula (1) and a structural unit (a) represented by the following general formula (A) (wherein the following formula (i) excluding a polycarbonate homopolymer consisting only of structural units represented by (i)).
- a polycarbonate homo obtained using only 2,2-bis(4-hydroxyphenyl)propane hereinafter sometimes referred to as "BPA" as a raw material diol component.
- BPA 2,2-bis(4-hydroxyphenyl)propane
- R 1 to R 8 are each independently hydrogen, fluorine, chlorine, bromine, iodine, an alkyl group having 1 to 7 carbon atoms, an aryl group having 6 to 12 carbon atoms, each optionally having a substituent, and carbon It represents an alkenyl group having 2 to 7 carbon atoms, an alkoxy group having 1 to 7 carbon atoms or an aralkyl group having 7 to 17 carbon atoms.
- the "substituent” in the case of “may have a substituent” includes "a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, an alkyl group having 1 to 7 carbon atoms, a carbon an aryl group having 6 to 12 carbon atoms, an alkenyl group having 2 to 7 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an aralkyl group having 7 to 17 carbon atoms,” and the like (hereinafter the same).
- X represents —O—, —S—, —SO—, —SO 2 —, —CO—, or a divalent group represented by any one of the following formulas (2) to (4).
- R 9 and R 10 each independently represents hydrogen, halogen, an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an aryl group having 6 to 12 carbon atoms, each of which may have a substituent. , an aralkyl group having 7 to 17 carbon atoms, or an alkenyl group having 2 to 15 carbon atoms, or R 9 and R 10 are bonded to each other to form a carbocyclic ring having 3 to 20 carbon atoms or 1 carbon atom.
- c represents an integer from 0 to 20;
- R 11 and R 12 are each independently hydrogen, halogen, optionally substituted alkyl group having 1 to 20 carbon atoms, alkoxy group having 1 to 5 carbon atoms, aryl group having 6 to 12 carbon atoms. , an aralkyl group having 7 to 17 carbon atoms, or an alkenyl group having 2 to 15 carbon atoms, or R 11 and R 12 are bonded to each other to form a carbocyclic ring having 3 to 20 carbon atoms or 1 to Forms 20 heterocycles.
- R 13 to R 22 each independently represent hydrogen or an alkyl group having 1 to 3 carbon atoms.
- the structural unit (a) represented by the general formula (A) is one or more selected from the group consisting of structural units represented by the following formulas (B) to (G). is preferably included.
- the polycarbonate resin used in the resin composition of the first embodiment of the present invention is produced by reacting a bisphenol deriving the structural unit (a) represented by the general formula (A) with a carbonate-forming compound. It is something that can be done. Therefore, known methods used to produce polycarbonate resins derived from bisphenol A, such as direct reaction of bisphenols and phosgene (phosgene method), or transesterification reactions of bisphenols and bisaryl carbonates ( It can be produced using a method such as transesterification method).
- phosgene method direct reaction of bisphenols and phosgene
- transesterification reactions of bisphenols and bisaryl carbonates It can be produced using a method such as transesterification method.
- the bisphenols which are raw material monomers for the polycarbonate resin used in the resin composition of the first embodiment of the present invention, are represented by the following general formula (A').
- R 1 to R 4 , R 5 to R 8 and X are the same as those of general formula (A).
- Specific examples of the monomer represented by the general formula (A′) include 4,4′-biphenyldiol, bis(4-hydroxyphenyl)methane, bis(2-hydroxyphenyl)methane, 2,4′- Dihydroxydiphenylmethane, bis(4-hydroxyphenyl)ether, bis(4-hydroxyphenyl)sulfone, 2,4'-dihydroxydiphenylsulfone, bis(2-hydroxyphenyl)sulfone, bis(4-hydroxy-3-methylphenyl) Sulfone, bis(4-hydroxyphenyl)sulfoxide, bis(4-hydroxyphenyl)sulfide, bis(4-hydroxyphenyl)ketone, 1,1-bis(4-hydroxyphenyl)ethane, 1,1-bis(4- hydroxyphenyl)-1-phenylethane, bis(4-hydroxypheny
- BPC 2,2-bis(4-hydroxyphenyl)propane
- BPZ 1,1-bis(4-hydroxyphenyl)cyclohexane
- BPAP 1,1-bis(4-hydroxyphenyl)-1-phenylethane
- TMC 3,3,5-trimethyl-1,1-bis(4-hydroxyphenyl)cyclohexane
- MIBK 2-bis(4-hydroxyphenyl)-4-methylpentane
- the monomer represented by the general formula (A') and phosgene are usually reacted in the presence of an acid binder and a solvent.
- the acid binder include pyridine and hydroxides of alkali metals such as sodium hydroxide and potassium hydroxide.
- the solvent include methylene chloride and chloroform.
- a catalyst such as a tertiary amine such as triethylamine or a quaternary ammonium salt such as benzyltriethylammonium chloride to promote the polycondensation reaction.
- Monofunctional compounds such as benzotriazole and long-chain alkyl-substituted phenols are preferably added as molecular weight modifiers.
- a small amount of an antioxidant such as sodium sulfite or hydrosulfite or a branching agent such as phloroglucin or isatin bisphenol may be added.
- the reaction temperature is generally 0 to 150°C, preferably 5 to 40°C. Although the reaction time depends on the reaction temperature, it is usually 0.5 minutes to 10 hours, preferably 1 minute to 2 hours. Moreover, it is desirable to keep the pH of the reaction system at 10 or higher during the reaction.
- the monomer represented by the general formula (A') and bisaryl carbonate are mixed and reacted at a high temperature under reduced pressure.
- bisaryl carbonates include bisaryl carbonates such as diphenyl carbonate, di-p-tolyl carbonate, phenyl-p-tolyl carbonate, di-p-chlorophenyl carbonate, dinaphthyl carbonate, and the like. Two or more of these compounds can be used in combination.
- the reaction is usually carried out at a temperature in the range of 150 to 350° C., preferably 200 to 300° C., and the degree of pressure reduction is preferably 1 mmHg or less at the end, and the bisaryl carbonate produced by the transesterification reaction is obtained. Phenols are distilled out of the system.
- the reaction time depends on the reaction temperature, degree of pressure reduction, etc., but is usually about 1 to 24 hours.
- the reaction is preferably carried out under an inert gas atmosphere such as nitrogen or argon.
- a molecular weight modifier, an antioxidant, or a branching agent may be added to carry out the reaction.
- the polycarbonate resin used in the resin composition of the first embodiment of the present invention can maintain well-balanced solvent solubility, coatability, peelability, scratch resistance, impact resistance, etc. necessary as a coating film-forming resin. preferable.
- the intrinsic viscosity ( ⁇ ) of the polycarbonate resin is preferably in the range of 0.3 to 2.0 dl/g, more preferably in the range of 0.35 to 1.5 dl/g.
- the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably in the range of 10,000 to 80,000, more preferably in the range of 15,000 to 50,000.
- the intrinsic viscosity ( ⁇ ) and viscosity-average molecular weight (Mv) of the polycarbonate resin can be measured by the methods described in Examples below.
- the mass ratio (solvent/polycarbonate resin) between the solvent and the polycarbonate resin in the resin composition of the first embodiment of the present invention is preferably 99.99/0.01 to 50/50, and 99/ It is more preferably 1 to 60/40, particularly preferably 95/5 to 70/30.
- the blending amount of the solvent and the polycarbonate resin used in the present invention is within such a range, the solvent solubility and coatability are well-balanced, and workability and appearance are improved.
- the resin composition of the first embodiment of the present invention is a solution obtained by dissolving the polycarbonate resin in a solvent (glycol-based organic solvent) represented by the following general formula (1), and in that state, the paint is generally called a clear color. becomes.
- the resin composition of the first embodiment of the present invention may be made into a colored coating composition by further dissolving or dispersing a desired dye and/or pigment.
- R a is hydrogen, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, and an aralkyl group having 7 to 20 carbon atoms, each of which may have a substituent; group or an acyl group having 2 to 20 carbon atoms.
- R a represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or an acyl group having 2 to 6 carbon atoms.
- R b each optionally has a substituent, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or carbon Represents an acyl group of numbers 2-20.
- R b represents an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 2 to 6 carbon atoms.
- R c to R f each independently represent hydrogen or an alkyl group having 1 to 3 carbon atoms.
- R c -R f represent hydrogen or a methyl group.
- n represents an integer of 1-10, preferably an integer of 1-4, more preferably 2 or 3;
- the solvent represented by the general formula (1) used in the present invention is ethylene glycol (all of R c to R f are hydrogen) or propylene glycol (any one of R c to R f is a methyl group). ) are preferred. Further, in the present invention, the solvent represented by the general formula (1) preferably contains one or more selected from the group consisting of glycol ether solvents, glycol ester solvents, and glyme solvents.
- glycol ether solvent examples include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol n-propyl ether, ethylene glycol mono-n-butyl ether, ethylene glycol mono-tert-butyl ether, and ethylene glycol monohexyl ether.
- ethylene glycol monophenyl ether diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol n-propyl ether, diethylene glycol mono-n-butyl ether, diethylene glycol tert-butyl ether, diethylene glycol monohexyl ether, diethylene glycol monophenyl ether, triethylene glycol monomethyl ether, tri Ethylene glycol monoethyl ether, triethylene glycol n-propyl ether, triethylene glycol mono n-butyl ether (butyl triglycol), triethylene glycol mono tert-butyl ether, triethylene glycol monohexyl ether, triethylene glycol monophenyl ether, etc. It is preferably mentioned. Among these, triethylene glycol mono-n-butyl ether (butyltriglycol) is more preferred. Two or more of these may be used in combination.
- glycol ester solvent examples include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate (butyl cellosolve acetate), diethylene glycol monoethyl ether acetate (ethyl carbitol acetate), diethylene glycol mono Butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate and the like are preferred.
- ethylene glycol monobutyl ether acetate butyl cellosolve acetate
- diethylene glycol monoethyl ether acetate ethyl carbitol acetate
- the glyme-based solvent preferably include monoglyme, diglyme, triglyme, tetraglyme, ethylglyme, methylethyldiglyme, butyldiglyme, and dipropylene glycol dimethyl ether.
- tetraglyme is more preferred. Two or more of these may be used in combination.
- Glyme is a type of solvent classified as a glycol ether, and is characterized in that an alkyl group is ether-bonded to a diol (having two OH's).
- triglyme has a structure obtained by methylating two hydroxy groups of triethylene glycol, and is represented by the following structural formula.
- the solvent represented by the general formula (1) used in the present invention preferably has a boiling point of 140°C or higher, more preferably 140 to 300°C.
- a resin composition of a second embodiment of the present invention is a resin composition containing a polycarbonate resin containing a structural unit (b) represented by the following general formula (A-1) and a hydroxy compound, wherein the hydroxy
- the compound is the resin composition represented by the general formula (1a) or the general formula (1b).
- the present inventors have found that in order to obtain a highly concentrated polycarbonate resin solution by dissolving a polymer in a solvent, the polymer to be used must have a small interaction between polymer chains and a site that interacts with the solvent. I thought the structure was good. Then, as shown below, the presence of F (fluorine) atoms in the polymer chain increases the distance between the polymer chains due to electron repulsion.
- the polycarbonate resin used in the resin composition of the second embodiment of the present invention further includes a structural unit (a) represented by the following general formula (A) (provided that the above general formula (A-1) excluding the structural unit (b)).
- the structural unit (a) represented by the general formula (A) has the same meaning as described in the resin composition of the first embodiment of the present invention.
- the structural unit (a) represented by the general formula (A) is one or more selected from the group consisting of structural units represented by the following formulas (B) to (H). is preferably included.
- the content ratio [(b)/(a)] of the structural unit (b) and the structural unit (a) is 50/50 to 50/50 in terms of molar ratio. It is preferably 100/0, more preferably 60/40 to 100/0.
- the polycarbonate resin used in the resin composition of the second embodiment of the present invention can maintain well-balanced solvent solubility, coatability, peelability, scratch resistance, impact resistance, etc. necessary as a coating film-forming resin. preferable.
- the intrinsic viscosity ( ⁇ ) of the polycarbonate resin is preferably in the range of 0.3 to 2.0 dl/g, more preferably in the range of 0.35 to 1.5 dl/g.
- the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably in the range of 10,000 to 80,000, more preferably in the range of 15,000 to 50,000.
- the intrinsic viscosity ( ⁇ ) and viscosity-average molecular weight (Mv) of the polycarbonate resin can be measured by the methods described in Examples below.
- the mass ratio of the polycarbonate resin and the hydroxy compound is preferably 1/99 to 50/50, and preferably 5/95 to 5/95. It is more preferably 50/50, still more preferably 5/95 to 30/70, and particularly preferably 7/93 to 13/87. If the mass ratio of the polycarbonate resin exceeds 50% by mass, the viscosity may become too high.
- the resin composition of the second embodiment of the present invention is a solution obtained by dissolving the polycarbonate resin in a hydroxy compound (organic solvent) represented by the following general formula (1a) or (1b).
- the paint is generally called a clear color.
- the resin composition of the second embodiment of the present invention may be made into a colored coating composition by further dissolving or dispersing a desired dye and/or pigment.
- R a is an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, which may have a substituent. It represents 2 to 20 acyl groups.
- R a represents an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 2 to 6 carbon atoms.
- R b to R e each independently represent hydrogen or an alkyl group having 1 to 10 carbon atoms.
- R b to R e represent hydrogen or an alkyl group having 1 to 3 carbon atoms, more preferably hydrogen or a methyl group.
- n represents an integer of 1-10, preferably an integer of 1-4, more preferably 2 or 3;
- R k represents an optionally branched C 3-20 alkyl group having a hydroxyl group, preferably an optionally branched C 3-10 alkyl group having a hydroxyl group represents a group.
- hydroxy compounds used in the second embodiment of the present invention include, for example, butyl carbitol, ethyl carbitol, butyl cellosolve, 1-methoxy-2-propanol (also known as propylene glycol monomethyl ether), 1-ethoxy -2-propanol, 1-butoxy-2-propanol, 1-methoxy-2-butanol, 2-hydroxyethyl methacrylate (also known as methacrylic acid (2-hydroxyethyl)), diacetone alcohol and the like are preferred, and these is not limited to These compounds may be used individually by 1 type, and may be used in combination of 2 or more type.
- more preferred hydroxy compounds include ethyl carbitol, butyl cellosolve, 1-methoxy-2-propanol (alias: propylene glycol monomethyl ether), 2-hydroxyethyl methacrylate (alias: methacrylic acid (2-hydroxyethyl)). , and diacetone alcohol, and more preferred hydroxy compounds include ethyl carbitol, 1-methoxy-2-propanol (a.k.a. propylene glycol monomethyl ether), 2-hydroxyethyl methacrylate (a.k.a. methacrylic acid (2-hydroxy ethyl)), and diacetone alcohol.
- the hydroxy compound used in the second embodiment of the present invention preferably has a boiling point of 50°C or higher, more preferably 50 to 250°C.
- pigments, dyes, colored particles, and particles having optical interference can be added in order to enhance the color effect.
- pigments and dyes include organic pigments such as azo pigments and phthalocyanine pigments. Specific examples include Red No. 104, Red No. 106, Red No. 201, Red No. 202, Red No. 204, and Red No. 215. , Red No. 220, Orange No. 203, Orange No. 204, Blue No. 1, Blue No. 404, Yellow No. 205, Yellow No. 401, Yellow No. 405, and the like.
- mica titanium, titanium oxide, iron oxide, tin oxide, zirconium oxide, chromium oxide, bismuth oxychloride, silica, chromium, titanium nitride, titanium, and magnesium fluoride are used to create white, pearl, metallic, and lame effects.
- gold, silver, nickel, etc. can also be used.
- Particles having optical coherence are particles that enhance color effects by reflecting or scattering light, and examples thereof include glass beads, minute seashells, mica, and the like. These are preferably added in the range of 0.0001 to 10.0% by mass to the resin composition as desired.
- a rust inhibitor, an antioxidant, a dispersant, an ultraviolet absorber, an antifoaming agent, a leveling agent, or the like may be added.
- the viscosity of the resin composition of the first embodiment of the present invention can be arbitrarily set depending on the desired application, but it is preferably in the range of 20 to 200,000 mPa s, more preferably in the range of 50 to 20,000 mPa s. preferable.
- the viscosity of the resin composition of the second embodiment of the present invention can be arbitrarily set depending on the desired application, but it is preferably in the range of 5 to 200,000 mPa s, more preferably in the range of 10 to 20,000 mPa s. It is preferably in the range of 10 to 5,000 mPa ⁇ s, more preferably in the range of 10 to 1,000 mPa ⁇ s, and particularly preferably in the range of 10 to 100 mPa ⁇ s.
- a method for measuring the viscosity for example, it can be measured at a measurement temperature of 25° C. using a vibrating viscometer (CJV5000) manufactured by A&D Co., Ltd.
- the coating film thickness after the resin composition of the first embodiment or the second embodiment of the present invention is applied and dried is preferably in the range of 1 to 200 ⁇ m thick, more preferably in the range of 5 to 120 ⁇ m thick. is more preferable, and a thickness in the range of 10 to 60 ⁇ m is particularly preferable.
- a coating thickness of 1 ⁇ m or more can ensure surface protection strength as a coating film, and a coating thickness of 200 ⁇ m or less is preferable because peeling due to contraction of the coating film can be suppressed.
- Another embodiment of the present invention is a printing ink, a resin solution for 3D printers, a conductive paste, and a coating solution, which contain the resin composition of the first or second embodiment of the present invention.
- Yet another embodiment of the present invention is a film formed from the resin composition of the first or second embodiment of the present invention.
- the resin composition of the first embodiment of the present invention has low toxicity and is excellent in stability (no erosion) and uniformity with respect to the substrate when applied, and thus is particularly excellent in the above-mentioned uses.
- PTBP pt-butylphenol
- the resulting polymer solution was added dropwise to warm water maintained at 45° C., and the solvent was removed by evaporation to obtain a white powdery precipitate.
- the resulting precipitate was filtered and dried at 105° C. for 24 hours to obtain polymer powder.
- a 0.5 g/dl solution of this polymer in methylene chloride as a solvent had an intrinsic viscosity of 0.65 dl/g at 20°C.
- PC-1 polycarbonate resin having a carbonate bond
- Examples 1 to 13, Comparative Examples 1 to 3 5 g of each of the polycarbonate (PC) resins and 45 g of solvent obtained in Synthesis Examples 1 to 9 described above were added to a mayonnaise bottle in the combinations shown in Table 1 below, and stirred with a shaker to produce resin compositions.
- the resin compositions of Examples 1 to 13 and Comparative Examples 1 to 3 thus obtained were subjected to the following tests and measurements of physical properties. The results are shown in Table 1 below.
- ⁇ Viscosity of resin composition > The viscosity of the resin composition was measured at 25° C. using a vibrating viscometer (CJV5000, manufactured by A&D Co., Ltd.).
- ⁇ PC coating film evaluation> (Preparation of coating film) A PC sheet (NF-2000, manufactured by Mitsubishi Engineering-Plastics Co., Ltd.) was prepared, and the resin composition prepared above was applied onto this PC sheet using a gap coater having a thickness of 60 ⁇ m. After coating, drying was performed at 120° C. for 1 minute in a box-type hot air dryer to form a coating film. (Slip during coating film formation) It was evaluated as follows.
- ECA Ethyl carbitol acetate
- BCsA butyl cellosolve acetate
- TGM Tetraglyme
- BTG butyl triglycol
- PGMEA Propylene glycol monomethyl ether acetate
- DMAc N,N-dimethylacetamide (non-glycol solvent)
- the N,N-dimethylacetamide (non-glycol solvent) used in Comparative Example 2 showed good solubility in polycarbonate resin, but its solution viscosity was remarkably low, and the slippage during coating film formation was poor. Bleeding after film formation was also common. Moreover, the resin composition of Comparative Example 2 corroded the PC substrate. The isophorone (non-glycol solvent) used in Comparative Example 3 took a long time to dissolve the polycarbonate resin, and the resin composition corroded the PC substrate.
- PTBP pt-butylphenol
- a solution of this polymer with a concentration of 0.5 g/dl in methylene chloride as a solvent had an intrinsic viscosity at 20° C. of 0.33 dl/g and a viscosity-average molecular weight (Mv) of 15,300.
- PC-10 polycarbonate resin having a carbonate bond
- Synthesis Example 12 Polymerization was carried out in the same manner as in Synthesis Example 10, except that 54.0 g of BPAF and 28.7 g of 1,1-bis(4-hydroxyphenyl)cyclohexane (hereinafter abbreviated as "BPZ”: manufactured by Taoka Chemical Co., Ltd.) were used at the same time. was performed to obtain a polycarbonate resin (Mv: 17600, hereinafter abbreviated as “PC-12”).
- BPZ 1,1-bis(4-hydroxyphenyl)cyclohexane
- Table 2 shows the weights of the raw material monomers and terminal terminator, the copolymerization ratio (mol%), and the viscosity-average molecular weight (Mv) of the obtained polycarbonate resin.
- Example 14-1 to 20-4, Comparative Examples 4-1 to 11-5 4.0 g of PC-10 obtained in Synthesis Example 10 as a polycarbonate resin and 36.0 g of ethyl carbitol as a hydroxy compound were added to a mayonnaise bottle and stirred with a shaker for 24 hours to obtain a resin solution. Resin solutions of other Examples and Comparative Examples were obtained in the same manner as in Example 14-1 using the polycarbonate resins and hydroxy compounds shown in Table 3. The solubility test shown below was performed on the resin solutions of Examples 4-1 to 20-4 and Comparative Examples 4-1 to 11-5 thus obtained. Table 3 shows the results.
- Table 3 shows the viscosity and transmittance of the resin solutions obtained in Examples 14-2, 15-2, 16-2, 17-2, 18-2, 19-2, and 20-2, which were measured by the following methods. shown in Similarly, the viscosity and transmittance of the resin solution obtained in Comparative Example 11-2 were measured, but undissolved resin was present and the resin solution could not be evaluated.
- ⁇ Glass transition temperature> The glass transition temperature of the obtained polycarbonate resin was measured using a differential scanning calorimeter (DSC). Measuring instrument: Shimadzu Corporation differential scanning calorimeter (DSC) DSC-50 Heating rate: 10°C/min Gas flow environment: Nitrogen 20ml/min Sample pretreatment: Heating and melting at 300°C
- ⁇ Transmittance of resin solution> The transmittance of the resulting resin solution was measured using a spectrophotometer. Measuring instrument: UV-1280 ultraviolet-visible spectrophotometer manufactured by Shimadzu Corporation Cell: 1 cm quartz cell Measurement wavelength: 800 nm Measurement procedure: In photometric mode, the transmittance of the resin solution was measured after zero point correction at 800 nm with propylene glycol monomethyl ether (PGM).
- PGM propylene glycol monomethyl ether
- the resin composition of the first embodiment of the present invention is a resin composition obtained by dissolving a specific polycarbonate resin that is highly soluble in a specific glycol-based solvent, and has low toxicity and an appropriate viscosity.
- it is suitable for paints, inks, and conductive pastes because it does not corrode substrates to a small extent.
- the resin composition of the second embodiment of the present invention can provide a polycarbonate resin solution with a higher concentration, it is suitable for applications that require a high concentration, such as paints, inks, and conductive pastes. .
Abstract
Description
さらに塗膜の生産性や、基材に対する安定性(浸食がないこと)や均一性といった塗膜の品質向上も求められている。また、高強度であるポリカーボネート樹脂の特性を活かすために、より高濃度のポリカーボネート樹脂溶液が求められている。
<1> 下記一般式(1)で表される溶剤と、下記一般式(A)で表される構成単位(a)を含むポリカーボネート樹脂(但し、下記式(i)で表される構成単位のみからなるポリカーボネートホモポリマーを除く)と、を含む樹脂組成物である。
Rbは、それぞれ置換基を有してもよい、炭素数1~20のアルキル基、炭素数6~20のアリール基、炭素数2~20のアルケニル基、炭素数7~20アラルキル基又は炭素数2~20のアシル基を表し;
Rc~Rfは、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表し;
nは1~10の整数を表す。)
R9及びR10は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
cは0~20の整数を表し;
R11及びR12は、それぞれ独立に、水素、ハロゲン、置換基を有してもよい、炭素数1~20のアルキル基、炭素数1~5のアルコキシ基、炭素数6~12のアリール基、炭素数7~17のアラルキル基、又は炭素数2~15のアルケニル基を表すか、または、
R11及びR12は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
R13~R22は、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表す。)
<2> 前記溶剤と前記ポリカーボネート樹脂との質量比(溶剤/ポリカーボネート樹脂)が、99.99/0.01~50/50である、上記<1>に記載の樹脂組成物である。
<3> 前記一般式(A)が、下記式(B)~(G)からなる群より選ばれる1種以上を含む、上記<1>または<2>に記載の樹脂組成物である。
<5> 前記一般式(1)中、Raは、水素、炭素数1~6のアルキル基、又は炭素数2~6のアシル基を表し、Rbは、炭素数1~6のアルキル基、炭素数6~10のアリール基、又は炭素数2~6のアシル基を表し、Rc~Rfは、水素又はメチル基を表し、nは1~4の整数を表す、上記<1>~<4>のいずれかに記載の樹脂組成物である。
<6> 前記一般式(1)中のnが、2又は3である、上記<5>に記載の樹脂組成物である。
<7> 前記一般式(1)で表される溶剤が、グリコールエーテル系溶媒、グリコールエステル系溶媒、及びグライム系溶媒からなる群より選択される1種以上を含有する、上記<1>~<4>のいずれかに記載の樹脂組成物である。
<8> 下記一般式(A-1)で表される構成単位(b)を含むポリカーボネート樹脂と、ヒドロキシ化合物とを含む樹脂組成物であって、
前記ヒドロキシ化合物が、下記一般式(1a)又は下記一般式(1b)で表される、前記樹脂組成物である。
Rb~Reは、それぞれ独立に、水素、又は炭素数1~10のアルキル基を表し;
nは1~10の整数を表す。)
<9> 前記ポリカーボネート樹脂が、さらに下記一般式(A)で表される構成単位(a)(ただし、前記一般式(A-1)で表される構成単位(b)を除く。)を含む、上記<8>に記載の樹脂組成物である。
R9及びR10は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
cは0~20の整数を表し;
R11及びR12は、それぞれ独立に、水素、ハロゲン、置換基を有してもよい、炭素数1~20のアルキル基、炭素数1~5のアルコキシ基、炭素数6~12のアリール基、炭素数7~17のアラルキル基、又は炭素数2~15のアルケニル基を表すか、または、
R11及びR12は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
R13~R22は、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表す。)
<10> 前記一般式(A)が、下記式(B)~(H)からなる群より選ばれる1種以上を含む、上記<8>または<9>に記載の樹脂組成物である。
<12> 前記ポリカーボネート樹脂と前記ヒドロキシ化合物との質量比(ポリカーボネート樹脂/ヒドロキシ化合物)が、1/99~50/50である、上記<8>~<11>のいずれかに記載の樹脂組成物である。
<13> 前記ヒドロキシ化合物の沸点が、50℃以上である、上記<8>~<12>のいずれかに記載の樹脂組成物である。
<14> 前記ヒドロキシ化合物が、ブチルカルビトール、エチルカルビトール、ブチルセロソルブ、1-メトキシ-2-プロパノール、1-エトキシ-2-プロパノール、1-ブトキシ-2-プロパノール、1-メトキシ-2-ブタノール、2-ヒドロキシエチルメタクリレート、及びジアセトンアルコールからなる群より選ばれる1種以上である、上記<8>~<13>のいずれかに記載の樹脂組成物である。
<15> 前記樹脂組成物が樹脂溶液である、上記<8>~<14>のいずれかに記載の樹脂組成物である。
<16> 上記<1>~<15>のいずれかに記載の樹脂組成物を含む、印刷用インキである。
<17> 上記<1>~<15>のいずれかに記載の樹脂組成物を含む、3Dプリンター用樹脂溶液である。
<18> 上記<1>~<15>のいずれかに記載の樹脂組成物を含む、導電性ペーストである。
<19> 上記<1>~<15>のいずれかに記載の樹脂組成物を含む、コーティング溶液である。
<20> 上記<1>~<15>のいずれかに記載の樹脂組成物から成形される、フィルムである。
本発明の第1実施形態の樹脂組成物は、上記一般式(1)で表される溶剤と、下記一般式(A)で表される構成単位(a)を含むポリカーボネート樹脂(但し、下記式(i)で表される構成単位のみからなるポリカーボネートホモポリマーを除く)と、を含む樹脂組成物である。
R1~R8は、それぞれ独立に、水素、フッ素、塩素、臭素、ヨウ素、それぞれ置換基を有してもよい、炭素数1~7のアルキル基、炭素数6~12のアリール基、炭素数2~7のアルケニル基、炭素数1~7のアルコキシ基又は炭素数7~17のアラルキル基を表す。
なお、本明細書において、「置換基を有してもよい」という場合の「置換基」としては、「フッ素原子、塩素原子、臭素原子、ヨウ素原子、炭素数1~7のアルキル基、炭素数6~12のアリール基、炭素数2~7のアルケニル基、炭素数1~5のアルコキシ基、炭素数7~17のアラルキル基」などが挙げられる(以下同様)。
Xは、-O-、-S-、-SO-、-SO2-、-CO-、又は下記式(2)~(4)のいずれかで示される二価の基を表す。
R9及びR10は、それぞれ独立に、水素、ハロゲン、それぞれ置換基を有してもよい、炭素数1~20のアルキル基、炭素数1~5のアルコキシ基、炭素数6~12のアリール基、炭素数7~17のアラルキル基、又は炭素数2~15のアルケニル基を表すか、または、R9及びR10は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し、
cは0~20の整数を表す。
R11及びR12は、それぞれ独立に、水素、ハロゲン、置換基を有してもよい、炭素数1~20のアルキル基、炭素数1~5のアルコキシ基、炭素数6~12のアリール基、炭素数7~17のアラルキル基、又は炭素数2~15のアルケニル基を表すか、または、R11及びR12は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成する。
R13~R22は、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表す。
本発明の第1実施形態の樹脂組成物に用いるポリカーボネート樹脂は、前記一般式(A)で表される構成単位(a)を誘導するビスフェノール類と炭酸エステル形成化合物とを反応させることによって、製造することができるものである。従って、ビスフェノールAから誘導されるポリカーボネート樹脂を製造する際に用いられている公知の方法、例えばビスフェノール類とホスゲンとの直接反応(ホスゲン法)、あるいはビスフェノール類とビスアリールカーボネートとのエステル交換反応(エステル交換法)などの方法を用いて製造することができる。
上記一般式(A’)で示されるモノマーとしては、具体的には、4,4’-ビフェニルジオール、ビス(4-ヒドロキシフェニル)メタン、ビス(2-ヒドロキシフェニル)メタン、2,4’-ジヒドロキシジフェニルメタン、ビス(4-ヒドロキシフェニル)エーテル、ビス(4-ヒドロキシフェニル)スルホン、2,4’-ジヒドロキシジフェニルスルホン、ビス(2-ヒドロキシフェニル)スルホン、ビス(4-ヒドロキシ-3-メチルフェニル)スルホン、ビス(4-ヒドロキシフェニル)スルホキシド、ビス(4-ヒドロキシフェニル)スルファイド、ビス(4-ヒドロキシフェニル)ケトン、1,1-ビス(4-ヒドロキシフェニル)エタン、1,1-ビス(4-ヒドロキシフェニル)-1-フェニルエタン、ビス(4-ヒドロキシフェニル)ジフェニルメタン、2,2-ビス(4-ヒドロキシフェニル)プロパン、2,2-ビス(4-ヒドロキシ-3-メチルフェニル)プロパン、1,1-ビス(4-ヒドロキシ-3-メチルフェニル)エタン、ビス(4-ヒドロキシ-3-メチルフェニル)メタン、2,2-ビス(4-ヒドロキシ-3-t-ブチルフェニル)プロパン、2,2-ビス(4-ヒドロキシフェニル)ブタン、2,2-ビス(4-ヒドロキシフェニル)ヘキサフルオロプロパン、1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン、1,1-ビス(4-ヒドロキシ-3-メチルフェニル)シクロヘキサン、1,1-ビス(4-ヒドロキシフェニル)シクロウンデカン、1,1-ビス(4-ヒドロキシフェニル)シクロドデカン、2,2-ビス(4-ヒドロキシ-3-アリルフェニル)プロパン、3,3,5-トリメチル-1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン、9,9-ビス(4-ヒドロキシ-3-エチルフェニル)フルオレン、9,9-ビス(4-ヒドロキシ-3-メチルフェニル)フルオレン、9,9-ビス(4-ヒドロキシフェニル)フルオレン、α,ω-ビス[3-(o-ヒドロキシフェニル)プロピル]ポリジメチルジフェニルランダム共重合シロキサン、α,ω-ビス[3-(o-ヒドロキシフェニル)プロピル]ポリジメチルシロキサン、4,4’-[1,4-フェニレンビス(1-メチルエチリデン)]ビスフェノール、4,4’-[1,3-フェニレンビス(1-メチルエチリデン)]ビスフェノール、2,2-ビス(4-ヒドロキシフェニル)ブタン、1,1-ビス(4-ヒドロキシフェニル)-2-エチルヘキサン、1,1-ビス(4-ヒドロキシフェニル)-2-メチルプロパン、2,2-ビス(4-ヒドロキシフェニル)-4-メチルペンタン、1,1-ビス(4-ヒドロキシフェニル)デカン、1,3-ビス(4-ヒドロキシフェニル)-5,7-ジメチルアダマンタンなどが例示される。これらは、2種類以上併用することも可能である。
本発明の第1実施形態の樹脂組成物は、上記ポリカーボネート樹脂を下記一般式(1)で表される溶剤(グリコール系有機溶剤)に溶解した溶液であり、その状態では一般にクリアー色と呼ばれる塗料となる。本発明の第1実施形態の樹脂組成物は、さらに所望の染料および/または顔料を溶解または分散させることで、着色した塗料組成物としてもよい。
Raは、水素、それぞれ置換基を有してもよい、炭素数1~20のアルキル基、炭素数6~20のアリール基、炭素数2~20のアルケニル基、炭素数7~20のアラルキル基又は炭素数2~20のアシル基を表す。好ましくは、Raは、水素、炭素数1~6のアルキル基、又は炭素数2~6のアシル基を表す。
Rbは、それぞれ置換基を有してもよい、炭素数1~20のアルキル基、炭素数6~20のアリール基、炭素数2~20のアルケニル基、炭素数7~20アラルキル基又は炭素数2~20のアシル基を表す。好ましくは、Rbは、炭素数1~6のアルキル基、炭素数6~10のアリール基、又は炭素数2~6のアシル基を表す。
Rc~Rfは、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表す。好ましくは、Rc~Rfは、水素又はメチル基を表す。
nは、1~10の整数を表し、好ましくは1~4の整数を表し、より好ましくは2又は3を表す。
また、本発明において、前記一般式(1)で表される溶剤は、グリコールエーテル系溶媒、グリコールエステル系溶媒、及びグライム系溶媒からなる群より選択される1種以上を含有することが好ましい。
なお、グライムとは、グリコールエーテル類に分類される溶剤の一種であり、ジオール(OHが2つついたもの)にアルキル基がエーテル結合しているのが特徴である。例えば、トリグライムは、トリエチレングリコールの2つのヒドロキシ基をメチル化した構造を持っており、以下の構造式で表される。
本発明の第2実施形態の樹脂組成物は、下記一般式(A-1)で表される構成単位(b)を含むポリカーボネート樹脂と、ヒドロキシ化合物とを含む樹脂組成物であって、前記ヒドロキシ化合物が、上記一般式(1a)又は上記一般式(1b)で表される、前記樹脂組成物である。
本発明の第2実施形態の樹脂組成物は、上記ポリカーボネート樹脂を下記一般式(1a)又は下記一般式(1b)で表されるヒドロキシ化合物(有機溶剤)に溶解した溶液であり、その状態では一般にクリアー色と呼ばれる塗料となる。本発明の第2実施形態の樹脂組成物は、さらに所望の染料および/または顔料を溶解または分散させることで、着色した塗料組成物としてもよい。
Raは、置換基を有してもよい、炭素数1~20のアルキル基、炭素数6~20のアリール基、炭素数2~20のアルケニル基、炭素数7~20アラルキル基又は炭素数2~20のアシル基を表す。好ましくは、Raは、炭素数1~6のアルキル基、炭素数6~10のアリール基、又は炭素数2~6のアシル基を表す。
Rb~Reは、それぞれ独立に、水素、又は炭素数1~10のアルキル基を表す。好ましくは、Rb~Reは、水素、又は炭素数1~3のアルキル基を表し、より好ましくは、水素又はメチル基を表す。
nは、1~10の整数を表し、好ましくは1~4の整数を表し、より好ましくは2又は3を表す。
これらのうち、より好ましいヒドロキシ化合物としては、エチルカルビトール、ブチルセロソルブ、1-メトキシ-2-プロパノール(別名;プロピレングリコールモノメチルエーテル)、2-ヒドロキシエチルメタクリレート(別名;メタクリル酸(2-ヒドロキシエチル))、及びジアセトンアルコールが挙げられ、更に好ましいヒドロキシ化合物としては、エチルカルビトール、1-メトキシ-2-プロパノール(別名;プロピレングリコールモノメチルエーテル)、2-ヒドロキシエチルメタクリレート(別名;メタクリル酸(2-ヒドロキシエチル))、及びジアセトンアルコールが挙げられる。
本発明の第1実施形態または第2実施形態の樹脂組成物を塗布して使用する場合、色彩効果を高めるために顔料や染料、着色粒子、光干渉性を有する粒子を添加することができる。顔料や染料としては、有機顔料として、アゾ顔料、フタロシアニン顔料等が挙げられ、具体的には、例えば、赤色104号、赤色106号、赤色201号、赤色202号、赤色204号、赤色215号、赤色220号、橙色203号、橙色204号、青色1号、青色404号、黄色205号、黄色401号、黄色405号等が挙げられる。また、白色、パール色、メタリック色、ラメ感を出すため、雲母チタン、酸化チタン、酸化鉄、酸化スズ、酸化ジルコニウム、酸化クロム、オキシ塩化ビスマス、シリカ、クロム、窒化チタン、チタン、フッ化マグネシウム、金、銀、ニッケル等を使用することも可能である。光干渉性を有する粒子とは、光の反射や散乱によって色彩効果を高める粒子であり、例としてガラスビーズや微小な貝殻、雲母などが挙げられる。これらは、所望に応じ、樹脂組成物中に0.0001~10.0質量%の範囲で添加することが好ましい。
さらに必要に応じて、防錆剤、酸化防止剤、分散剤、紫外線吸収剤、消泡剤、またはレベリング剤等を添加してもよい。
5w/w%の水酸化ナトリウム水溶液1100mlに2,2-ビス(4-ヒドロキシ-3-メチルフェニル-)プロパン(以下、「BPC」と略称:本州化学工業株式会社製)102.4g(0.4mol)とハイドロサルファイト0.1gを溶解した。
これにメチレンクロライド500mlを加えて撹拌しつつ、0.5gのベンジルトリエチルアンモニウムクロライド(以下、「TEBAC」と略称)を加え、さらに15℃に保ちながら、ついでホスゲン60gを60分で吹き込んだ。
ホスゲン吹き込み終了後、分子量調節剤としてp-t-ブチルフェノール(以下、「PTBP」と略称:大日本インキ化学工業株式会社製)1.5gを加え激しく撹拌して、反応液を乳化させ、乳化後、0.4mlのトリエチルアミンを加え、20~25℃にて約1時間撹拌し、重合させた。
重合終了後、反応液を水相と有機相に分離し、有機相をリン酸で中和し、先液(水相)の導電率が10μS/cm以下になるまで水洗を繰り返した。得られた重合体溶液を、45℃に保った温水に滴下し、溶媒を蒸発除去して白色粉末状沈殿物を得た。得られた沈殿物を濾過し、105℃、24時間乾燥して、重合体粉末を得た。
この重合体の塩化メチレンを溶媒とする濃度0.5g/dlの溶液の20℃における極限粘度は0.65dl/gであった。得られた重合体を赤外線吸収スペクトルにより分析した結果、1770cm-1付近の位置にカルボニル基による吸収、1240cm-1付近の位置にエーテル結合による吸収が認められ、カーボネート結合を有するポリカーボネート樹脂(以下、「PC-1」と略称)であることが確認された。
BPCの代わりに、2,2-ビス(4-ヒドロキシフェニル)-4-メチルペンタン(以下、「MIBK」と略称:本州化学工業株式会社製)54g、1,1-ビス(4-ヒドロキシフェニル)-1-フェニルエタン(以下、「BPAP」と略称:本州化学工業株式会社製)58gを用い、PTBPを2.0gに変更し、TEBACを用いなかった以外は実施例1と同様に重合を行い、0.49dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-2」と略称)を得た。
BPCを60.4g、PTBPを1.8gに変更し、同時に2,2-ビス(4-ヒドロキシフェニル)プロパン(以下、「BPA」と略称:三菱化学株式会社製)40.1gを用い、TEBACを用いなかった以外は実施例1と同様に重合を行い、0.58dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-3」と略称)を得た。
BPCの代わりに、MIBKを108g用い、PTBPの代わりに2-[2-ヒドロキシ-5-[2-(メタクリロイルオキシ)エチル]フェニル]-2H-ベンゾトリアゾール(以下、「BTAZ」と略称:大塚化学株式会社製)4.3gを用い、TEBACを用いなかった以外は実施例1と同様に重合を行い、0.54dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-4」と略称)を得た。
BPCを60.4gに変更し、同時にBPA 40.1gとp-ヒドロキシフェネチルアルコール(以下、「PHEP」と略称:大塚化学株式会社製)1.92gを用い、PTBPを用いなかった以外は実施例1と同様に重合を行い、0.72dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-5」と略称)を得た。
BPCの代わりにBPZ 107.2gを用い、PTBPを2.0gに変更し、TEBACを用いなかった以外は実施例1と同様に重合を行い、0.44dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-6」と略称)を得た。
BPCの代わりにBPAP 116.0gを用い、PTBPを2.0gに変更し、TEBACを用いなかった以外は実施例1と同様に重合を行い、0.43dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-7」と略称)を得た。
BPCの代わりに3,3,5-トリメチル-1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン(以下、「TMC」と略称:三光株式会社製)124.0gを用い、PTBPを1.62gに変更し、TEBACを用いなかった以外は実施例1と同様に重合を行い、0.48dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-8」と略称)を得た。
BPCの代わりにBPA 91.2gを用い、PTBPを2.0gに変更し、TEBACを用いなかった以外は実施例1と同様に重合を行い、0.49dl/gの極限粘度を有するポリカーボネート樹脂(以下、「PC-9」と略称)を得た。
上述した合成例1~9で得られた各ポリカーボネート(PC)樹脂5gおよび溶剤45gを下記表1に示す組み合わせでマヨネーズ瓶に加え、シェーカーで攪拌して樹脂組成物を製造した。
こうして得られた実施例1~13および比較例1~3の樹脂組成物について、以下に示す試験や物性値の測定を行った。結果を下記表1に示す。
樹脂組成物を調製する際、即ち、ポリカーボネート樹脂5g及び下記表1に示される溶剤45gをマヨネーズ瓶に加え、シェーカーで攪拌する際、攪拌開始から樹脂が目視にて完全に溶解するまでの時間(溶解時間)を計測した。
溶解時間が3時間未満:「A」
溶解時間が3時間以上48時間未満:「B」
溶解時間が48時間以上:「C」
溶解しない:「D」
樹脂組成物の粘度は、25℃で、株式会社エー・アンド・デイ製振動式粘度計(CJV5000))を用いて測定した。
(塗膜作製)
PCシート(三菱エンジニアリングプラスチックス社製 NF-2000)を用意し、上記で調製した樹脂組成物をこのPCシート上に60μm厚の隙間コーターを用いて塗布した。塗布後、箱型温風乾燥機で120℃、1分間乾燥を行って塗膜を形成した。
(塗膜形成時の滑り)
以下の通り評価した。
塗膜形成時にコーターとPCシートの間で引っ掛かりがなく、均一に塗膜形成できる:「〇」
塗膜形成時にコーターとPCシートの間で引っ掛かりがあり、塗膜が不均一になる:「×」
(基材への滲み)
樹脂組成物を塗布後、箱型温風乾燥機で120℃、1分間乾燥後、得られた塗膜を目視で評価した。
PCシートと塗膜との界面に滲みがない:「〇」
僅かに滲みが見られる:「△」
滲みが大きく界面が乱れている:「×」
PCシート(三菱エンジニアリングプラスチックス社製 NF-2000)を1cm×1cm角にカットし、9ccバイアル瓶に加え、更に上記で調製した樹脂組成物を加えてPC片を完全に浸した。そのまま静置し、24時間後のPC片の状態を目視確認した。
もとの形状を保つ:「A」
PC片の膨潤が見られる:「B」
PC片の形状が崩れ、一部溶液に溶解する:「C」
合成例1~9で得られたポリカーボネート樹脂の極限粘度[η]デシリットル/グラムは、0.5グラム/デシリットルのポリカーボネート樹脂の塩化メチレン溶液を、ウベローデ毛管粘度計によって20℃の温度で測定し、ハギンズ定数0.45を用いて、下記数式(I)により算出した。
η=1.23×10-4×Mv0.83 (I)
BCsA:ブチルセロソルブアセテート
TGM:テトラグライム
BTG:ブチルトリグリコール
PGMEA:プロピレングリコールモノメチルエーテルアセテート
DMAc:N,N-ジメチルアセトアミド(非グリコール系溶媒)
6.3w/w%の水酸化ナトリウム水溶液750mlに2,2-ビス(4-ヒドロキシフェニル)-1,1,1,3,3,3-ヘキサフルオロプロパン(以下、「BPAF」と略称:セントラル硝子株式会社製)90.0g(0.34mol)とハイドロサルファイト0.5gを溶解した。
これにメチレンクロライド300mlを加えて撹拌しつつ、0.1gのベンジルトリエチルアンモニウムクロライド(以下、「TEBAC」と略称)を加え、さらに15~25℃に保ちながら、ついでホスゲン42.4gを30分で吹き込んだ。
ホスゲン吹き込み終了後、分子量調節剤としてp-t-ブチルフェノール(以下、「PTBP」と略称:大日本インキ化学工業株式会社製)1.34gを加え激しく撹拌して、反応液を乳化させ、乳化後、0.5mlのトリエチルアミンを加え、20~30℃にて約1時間撹拌し、重合させた。
重合終了後、反応液を水相と有機相に分離し、有機相をリン酸で中和し、先液(水相)の導電率が10μS/cm以下になるまで水洗を繰り返した。得られた重合体溶液をアルミ皿の上に移してホットプレート上で溶媒を蒸発させて除去し、得られた固形物を更に120℃、24時間乾燥して重合体固形物を得た。
この重合体の塩化メチレンを溶媒とする濃度0.5g/dlの溶液の20℃における極限粘度は0.33dl/gであり、粘度平均分子量(Mv)は15300であった。得られた重合体を赤外線吸収スペクトルにより分析した結果、1770cm-1付近の位置にカルボニル基による吸収、1240cm-1付近の位置にエーテル結合による吸収が認められ、カーボネート結合を有するポリカーボネート樹脂(以下、「PC-10」と略称)であることが確認された。
BPAFを63.0g、同時に1,1-ビス(4-ヒドロキシフェニル)プロパン(以下、「BPA」と略称:三菱ケミカル株式会社製)18.0gを用い、PTBPをp-ヒドロキシフェネチルアルコール(以下、「PHEP」と略称:大塚化学株式会社製)0.92gに変更した以外は合成例10と同様に重合を行い、ポリカーボネート樹脂(Mv:27000、以下「PC-11」と略称)を得た。
BPAFを54.0g、同時に1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン(以下、「BPZ」と略称:田岡化学工業株式会社製)28.7gを用いた以外は合成例10と同様に重合を行い、ポリカーボネート樹脂(Mv:17600、以下「PC-12」と略称)を得た。
BPAFを54.0g、同時に1,1-ビス(4-ヒドロキシフェニル)-1-フェニルエタン(以下、「BPAP」と略称:本州化学工業株式会社製)31.1gを用いた以外は合成例10と同様に重合を行い、ポリカーボネート樹脂(Mv:19400、以下「PC-13」と略称)を得た。
BPAFを54.0g、同時に1,1-ビス(4-ヒドロキシフェニル)-3,3,5-トリメチルシクロヘキサン(以下、「TMC」と略称:本州化学工業株式会社製)40.1gを用いた以外は合成例10と同様に重合を行い、ポリカーボネート樹脂(Mv:17300、以下「PC-14」と略称)を得た。
BPAFを45.0g、同時に2,2-ビス(4-ヒドロキシ-3-メチルフェニル)プロパン(以下、「BPC」と略称:本州化学工業株式会社製)34.3gを用いた以外は合成例10と同様に重合を行い、ポリカーボネート樹脂(Mv:17300、以下「PC-15」と略称)を得た。
BPAFを63.0g、同時に9,9-ビス(-4-ヒドロキシ-3-メチルフェニル)フルオレン(以下、「BCFL」と略称:本州化学工業株式会社製)30.4gを用いた以外は合成例10と同様に重合を行い、ポリカーボネート樹脂(Mv:15800、以下「PC-16」と略称)を得た。
BPA91.2gを用い、PTBPを2.00gに変更し、TEBACを用いなかった以外は合成例10と同様に重合を行い、ポリカーボネート樹脂(Mv:21000、以下「PC-17」と略称)を得た。
ポリカーボネート樹脂として合成例10で得られたPC-10を4.0g、及びヒドロキシ化合物としてエチルカルビトール36.0gを、マヨネーズ瓶に加え、シェーカーで24時間攪拌して、樹脂溶液を得た。
表3に示すポリカーボネート樹脂、及びヒドロキシ化合物を用い、実施例14-1と同様にしてその他の実施例及び比較例の樹脂溶液を得た。
こうして得られた実施例4-1~20-4および比較例4-1~11-5の樹脂溶液について、以下に示す溶解性試験を行った。その結果を表3に示す。実施例14-2、15-2、16-2、17-2、18-2、19-2、20-2で得られた樹脂溶液について、以下の方法で測定した粘度及び透過率を表3に示す。同様に比較例11-2で得られた樹脂溶液について粘度及び透過率の測定を試みたが、未溶解の樹脂が存在し、樹脂溶液としての評価はできなかった。
得られたポリカーボネート樹脂の極限粘度[η]デシリットル/グラムは、0.5グラム/デシリットルのポリカーボネート樹脂の塩化メチレン溶液を、ウベローデ毛管粘度計によって20℃の温度で測定し、ハギンズ定数0.45を用いて、下記数式(I)により算出した。
η=1.23×10-4×Mv0.83 (I)
得られたポリカーボネート樹脂のガラス転移温度を、示差走査熱量測定機(DSC)を用いて測定した。
測定機器:株式会社島津製作所製示差走査熱量測定機(DSC)DSC-50
加温速度:10℃/分
ガスフロー環境:窒素20ml/分
試料前処理:300℃加熱融解
得られた樹脂溶液の外観を目視で確認し、以下の指標により判定した。
樹脂の溶け残りがなく透明なもの:「〇」
未溶解の樹脂が少し存在するもの:「△」
樹脂が全く溶解しないもの:「×」
得られた樹脂溶液の粘度を、振動式粘度計を用いて測定した。
測定装置:株式会社エー・アンド・デイ製振動式粘度計 CJV5000
測定温度:25℃
得られた樹脂溶液の透過率を、分光光度計を用いて測定した。
測定機器:株式会社島津製作所製紫外可視分光光度計UV-1280
セル:1cm石英セル
測定波長:800nm
測定手順:フォトメトリックモードにて、800nmにおけるゼロ点補正をプロピレングリコールモノメチルエーテル(PGM)で実施後、樹脂溶液の透過率を測定した。
Claims (20)
- 下記一般式(1)で表される溶剤と、下記一般式(A)で表される構成単位(a)を含むポリカーボネート樹脂(但し、下記式(i)で表される構成単位のみからなるポリカーボネートホモポリマーを除く)と、を含む樹脂組成物。
Rbは、それぞれ置換基を有してもよい、炭素数1~20のアルキル基、炭素数6~20のアリール基、炭素数2~20のアルケニル基、炭素数7~20アラルキル基又は炭素数2~20のアシル基を表し;
Rc~Rfは、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表し;
nは1~10の整数を表す。)
R9及びR10は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
cは0~20の整数を表し;
R11及びR12は、それぞれ独立に、水素、ハロゲン、置換基を有してもよい、炭素数1~20のアルキル基、炭素数1~5のアルコキシ基、炭素数6~12のアリール基、炭素数7~17のアラルキル基、又は炭素数2~15のアルケニル基を表すか、または、
R11及びR12は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
R13~R22は、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表す。) - 前記溶剤と前記ポリカーボネート樹脂との質量比(溶剤/ポリカーボネート樹脂)が、99.99/0.01~50/50である、請求項1に記載の樹脂組成物。
- 前記溶剤の沸点が、140℃以上である、請求項1~3のいずれかに記載の樹脂組成物。
- 前記一般式(1)中、Raは、水素、炭素数1~6のアルキル基、又は炭素数2~6のアシル基を表し、Rbは、炭素数1~6のアルキル基、炭素数6~10のアリール基、又は炭素数2~6のアシル基を表し、Rc~Rfは、水素又はメチル基を表し、nは1~4の整数を表す、請求項1~4のいずれかに記載の樹脂組成物。
- 前記一般式(1)中のnが、2又は3である、請求項5に記載の樹脂組成物。
- 前記一般式(1)で表される溶剤が、グリコールエーテル系溶媒、グリコールエステル系溶媒、及びグライム系溶媒からなる群より選択される1種以上を含有する、請求項1~4のいずれかに記載の樹脂組成物。
- 下記一般式(A-1)で表される構成単位(b)を含むポリカーボネート樹脂と、ヒドロキシ化合物とを含む樹脂組成物であって、
前記ヒドロキシ化合物が、下記一般式(1a)又は下記一般式(1b)で表される、前記樹脂組成物。
Rb~Reは、それぞれ独立に、水素、又は炭素数1~10のアルキル基を表し;
nは1~10の整数を表す。)
- 前記ポリカーボネート樹脂が、さらに下記一般式(A)で表される構成単位(a)(ただし、前記一般式(A-1)で表される構成単位(b)を除く。)を含む、請求項8に記載の樹脂組成物。
R9及びR10は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
cは0~20の整数を表し;
R11及びR12は、それぞれ独立に、水素、ハロゲン、置換基を有してもよい、炭素数1~20のアルキル基、炭素数1~5のアルコキシ基、炭素数6~12のアリール基、炭素数7~17のアラルキル基、又は炭素数2~15のアルケニル基を表すか、または、
R11及びR12は、互いに結合して、炭素数3~20の炭素環又は炭素数1~20の複素環を形成し;
R13~R22は、それぞれ独立に、水素、又は炭素数1~3のアルキル基を表す。) - 前記構成単位(b)と前記構成単位(a)との含有量比〔(b)/(a)〕が、モル比で、50/50~100/0である、請求項9又は10に記載の樹脂組成物。
- 前記ポリカーボネート樹脂と前記ヒドロキシ化合物との質量比(ポリカーボネート樹脂/ヒドロキシ化合物)が、1/99~50/50である、請求項8~11のいずれかに記載の樹脂組成物。
- 前記ヒドロキシ化合物の沸点が、50℃以上である、請求項8~12のいずれかに記載の樹脂組成物。
- 前記ヒドロキシ化合物が、ブチルカルビトール、エチルカルビトール、ブチルセロソルブ、1-メトキシ-2-プロパノール、1-エトキシ-2-プロパノール、1-ブトキシ-2-プロパノール、1-メトキシ-2-ブタノール、2-ヒドロキシエチルメタクリレート、及びジアセトンアルコールからなる群より選ばれる1種以上である、請求項8~13のいずれかに記載の樹脂組成物。
- 前記樹脂組成物が樹脂溶液である、請求項8~14のいずれかに記載の樹脂組成物。
- 請求項1~15のいずれかに記載の樹脂組成物を含む、印刷用インキ。
- 請求項1~15のいずれかに記載の樹脂組成物を含む、3Dプリンター用樹脂溶液。
- 請求項1~15のいずれかに記載の樹脂組成物を含む、導電性ペースト。
- 請求項1~15のいずれかに記載の樹脂組成物を含む、コーティング溶液。
- 請求項1~15のいずれかに記載の樹脂組成物から成形される、フィルム。
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