WO2022163763A1 - 電子部品実装基板の封止方法および熱硬化性シート - Google Patents

電子部品実装基板の封止方法および熱硬化性シート Download PDF

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Publication number
WO2022163763A1
WO2022163763A1 PCT/JP2022/003123 JP2022003123W WO2022163763A1 WO 2022163763 A1 WO2022163763 A1 WO 2022163763A1 JP 2022003123 W JP2022003123 W JP 2022003123W WO 2022163763 A1 WO2022163763 A1 WO 2022163763A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
substrate
component mounting
sealing
thermosetting sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/003123
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English (en)
French (fr)
Japanese (ja)
Inventor
陽介 大井
正宏 浅原
大輔 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagase Chemtex Corp
Original Assignee
Nagase Chemtex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase Chemtex Corp filed Critical Nagase Chemtex Corp
Priority to US18/263,552 priority Critical patent/US20240071781A1/en
Priority to KR1020237027977A priority patent/KR102687490B1/ko
Priority to JP2022542772A priority patent/JP7161084B1/ja
Priority to CN202280012541.9A priority patent/CN116888714A/zh
Priority to EP22745982.3A priority patent/EP4287250A4/en
Publication of WO2022163763A1 publication Critical patent/WO2022163763A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Definitions

  • thermosetting sheet used in step (b) is a sealing material and a mold underfill material molded into a sheet.
  • a thermosetting sheet has the property of being melted by heating and then cured.
  • the thermosetting sheet is composed of, for example, a thermosetting resin composition (hereinafter also simply referred to as “resin composition”), and the resin composition contains a thermosetting resin such as epoxy resin.
  • the distance Lq may be 0.91 Lp or more, 0.93 Lp or more, or 0.96 Lp or more.
  • Lp and Lq may satisfy the above relationship at 70% or more, further 90% or more of the length of the trajectory of the frame line F, and Lp and Lq may satisfy the above relationship at 98% to 100%. desirable.
  • epoxy resins include, but are not limited to, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, glycidylamine type epoxy resin, alicyclic epoxy resin, A dicyclopentadiene type epoxy resin, a polyether type epoxy resin, a silicone-modified epoxy resin, or the like can be used. These may be used alone or in combination of two or more.
  • biphenyl type epoxy resins, naphthalene type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AD type epoxy resins, etc. are preferable. It is more preferable in that it has excellent properties.
  • amine compounds include, but are not limited to, tetramethyldiaminodiphenylmethane, tetraethyldiaminodiphenylmethane, diethyldimethyldiaminodiphenylmethane, dimethyldiaminotoluene, diaminodibutyltoluene, diaminodipropyltoluene, diaminodiphenylsulfone, diaminoditolylsulfone, diethyldiamino Toluene, bis(4-amino-3-ethylphenyl)methane, polytetramethylene oxide-di-p-aminobenzoate and the like can be used.
  • a sample of an electronic component mounting substrate for evaluation was prepared by placing electronic components on a circular substrate similar to that of Example 1.
  • a circular thermosetting sheet with an Lq of 1.0 Lp was placed on the sample so that the center of the substrate and the center of the thermosetting sheet were aligned so as to contact the electronic component, and the A layer was in contact with the sample.
  • a thermosetting sheet was heat-molded in the same manner as in the above examples, and evaluated in the same manner. Table 4 shows the results. Note that the maximum value of tan ⁇ (loss tangent) of the A layer was 3 or more in any of the thermosetting sheets. Also, the ⁇ E′ value of the B layer satisfied 40000 ⁇ E′ ⁇ 250000 [Pa/K].

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
PCT/JP2022/003123 2021-02-01 2022-01-27 電子部品実装基板の封止方法および熱硬化性シート Ceased WO2022163763A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US18/263,552 US20240071781A1 (en) 2021-02-01 2022-01-27 Method for sealing electronic component mounting substrate, and heat-curable sheet
KR1020237027977A KR102687490B1 (ko) 2021-02-01 2022-01-27 전자 부품 실장 기판의 봉지 방법 및 열경화성 시트
JP2022542772A JP7161084B1 (ja) 2021-02-01 2022-01-27 電子部品実装基板の封止方法および熱硬化性シート
CN202280012541.9A CN116888714A (zh) 2021-02-01 2022-01-27 电子部件安装基板的密封方法及热固化性片材
EP22745982.3A EP4287250A4 (en) 2021-02-01 2022-01-27 METHOD FOR SEALING A SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND HEAT-CURING FILM

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021014655 2021-02-01
JP2021-014655 2021-02-01

Publications (1)

Publication Number Publication Date
WO2022163763A1 true WO2022163763A1 (ja) 2022-08-04

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Country Status (7)

Country Link
US (1) US20240071781A1 (https=)
EP (1) EP4287250A4 (https=)
JP (1) JP7161084B1 (https=)
KR (1) KR102687490B1 (https=)
CN (1) CN116888714A (https=)
TW (1) TWI877450B (https=)
WO (1) WO2022163763A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025067614A (ja) * 2023-10-13 2025-04-24 味の素株式会社 半導体チップパッケージの製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012059743A (ja) * 2010-09-06 2012-03-22 Nitto Denko Corp 電子部品装置の製法およびそれに用いる電子部品封止用樹脂組成物シート
JP2014131016A (ja) 2012-11-29 2014-07-10 Nitto Denko Corp 熱硬化性樹脂シート及び電子部品パッケージの製造方法
JP2014229769A (ja) 2013-05-23 2014-12-08 日東電工株式会社 電子部品装置の製造方法
JP2015071670A (ja) 2013-10-02 2015-04-16 住友ベークライト株式会社 圧縮成形用モールドアンダーフィル材料、半導体パッケージ、構造体および半導体パッケージの製造方法
JP2015178635A (ja) 2012-11-29 2015-10-08 日東電工株式会社 熱硬化性樹脂シート及び電子部品パッケージの製造方法
JP2015216229A (ja) * 2014-05-09 2015-12-03 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート
WO2021029259A1 (ja) * 2019-08-09 2021-02-18 ナガセケムテックス株式会社 モールドアンダーフィル封止用の多層シート、モールドアンダーフィル封止方法、電子部品実装基板及び電子部品実装基板の製造方法

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JP2015178635A (ja) 2012-11-29 2015-10-08 日東電工株式会社 熱硬化性樹脂シート及び電子部品パッケージの製造方法
JP2014229769A (ja) 2013-05-23 2014-12-08 日東電工株式会社 電子部品装置の製造方法
JP2015071670A (ja) 2013-10-02 2015-04-16 住友ベークライト株式会社 圧縮成形用モールドアンダーフィル材料、半導体パッケージ、構造体および半導体パッケージの製造方法
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Title
See also references of EP4287250A4

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025067614A (ja) * 2023-10-13 2025-04-24 味の素株式会社 半導体チップパッケージの製造方法
JP7764888B2 (ja) 2023-10-13 2025-11-06 味の素株式会社 半導体チップパッケージの製造方法

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Publication number Publication date
KR102687490B1 (ko) 2024-07-24
JP7161084B1 (ja) 2022-10-25
EP4287250A4 (en) 2025-03-05
EP4287250A1 (en) 2023-12-06
KR20230128565A (ko) 2023-09-05
CN116888714A (zh) 2023-10-13
US20240071781A1 (en) 2024-02-29
TW202243042A (zh) 2022-11-01
JPWO2022163763A1 (https=) 2022-08-04
TWI877450B (zh) 2025-03-21

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