JP7482715B2 - 封止構造体の製造方法 - Google Patents
封止構造体の製造方法 Download PDFInfo
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- JP7482715B2 JP7482715B2 JP2020137441A JP2020137441A JP7482715B2 JP 7482715 B2 JP7482715 B2 JP 7482715B2 JP 2020137441 A JP2020137441 A JP 2020137441A JP 2020137441 A JP2020137441 A JP 2020137441A JP 7482715 B2 JP7482715 B2 JP 7482715B2
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- coating
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- resin composition
- curable resin
- printing
- Prior art date
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Classifications
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- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
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Description
第1工程では、電子部品等を備える基板を準備するとともに、液状の硬化性樹脂組成物を準備する。
硬化性樹脂組成物としては、液状のものが用いられる。液状の硬化性樹脂組成物は、室温(20~35℃)で流動性を有する。硬化性樹脂組成物には、通常、固形成分が含まれる。固形成分が硬化性樹脂組成物に含まれる場合、固形成分の分布のばらつきが生じやすく、フローマークが発生し易い。
図1、2を参照しながら、第2工程について説明する。第2工程は、基板を硬化性樹脂組成物の第1被膜で覆う印刷工程と、第1被膜を基板とともに圧縮成形して、第1被膜から第2被膜を形成する成形工程とを備える。
印刷工程では、硬化性樹脂組成物20が、複数の半導体素子11を具備する基板10に印刷される。例えば、図1(a)に示すように、孔版30とスキージ40を用いる孔版印刷(スクリーン印刷など)により第1被膜21を形成することができる。第1被膜21は、図1(b)に示すように、半導体素子11とともに基板10の表面の大半を覆うことが望ましく、基板10の表面の全体を覆ってもよい。また、図1(c)に示されるように、基板の外周部に第1被膜21を有さない非塗布領域10aを設けてもよい。第1被膜21が形成された基板10は、図1(c)に示すように、孔版30から外されて、次の成形工程へ送られる。
図2(d)に示すように、成形工程では、第1被膜21を有する基板10が圧縮成形機50にセットされる。圧縮成形機50は、上金型51と、下金型52と、上金型51にバネなどの弾性部材を介して固定されたフランジ部53とを有し、上金型51は、第1被膜21を押圧する平坦な押圧面51aを有する。図2(e)に示すように、第1被膜21を押圧面51aで覆い、第1被膜21を基板10とともに圧縮することで、第1被膜21が圧縮され、第2被膜22(図2(f))が形成される。このとき、第1被膜21を有さない基板10の非塗布領域10aにフランジ部53を押し当ててもよい。この場合、第1被膜21を形成する硬化性樹脂組成物20は、フランジ部53に達するまで濡れ広げられる。その際、押圧面51aが平坦であるため、第1被膜21の厚みのばらつきは改善される。すなわち、厚みのばらつきの小さい第2被膜22が得られる。なお、ここでは図示しないが、上金型51およびフランジ部53を剥離フィルムで覆った状態で成形工程を行ってもよい。
以下、本発明を実施例および比較例に基づいて具体的に説明するが、本発明は以下の実施例に限定されるものではない。
熱硬化性樹脂(主材)であるナフタレン型エポキシ樹脂100質量部と、硬化剤である酸無水物120質量部と、硬化促進剤であるイミダゾール変性物25質量部と、フィラーである球状溶融シリカ(平均粒径21μm)2060質量部と、シランカップリング剤2質量部とを混合することにより熱硬化性樹脂組成物を調製した。
直径300mm、厚み775μmのシリコンウエハ基板に、厚みT=0.1~0.4mmの第2被膜が得られるように計量した上記熱硬化性樹脂組成物を印刷し、表1に示す投影面積S1を有する第1被膜を形成した。
次に、圧縮成形機の圧力を制御しながら第1被膜を圧縮し、表1に示す投影面積S2を有し、かつ表1に示すL/T比を有する第2被膜を成形した。圧縮成形の際、金型を125℃に加熱し、10分かけて熱硬化性樹脂組成物を硬化させた。
第2被膜のフローマークの有無を観察し、フローマークによる外観不良の無い良好な部位の最大長(流動長)Mを求めた。フローマークが観測されない場合には、最大長M=最大長L=294mmとした。結果を表1に示す。なお、S1/S2比が0.7または0.8の例は比較例である。
次に、S1/S2比を0.95に固定したこと以外、実施例1と同様に、印刷により第1被膜を形成し、続いて、圧縮成形により、表2に示す厚みTとL/T比を有する第2被膜を成形した。ただし、ここでは、第2被膜の厚みTを10箇所で厳密に測定し、厚みTの標準偏差σを求めた。結果を表2に示す。
印刷を行わず、ポッティングにより、熱硬化性樹脂組成物を基板に塗布し、その後、圧縮成形を行ったこと以外、実施例2と同様に、第2被膜を成形し、同様に評価した。結果を表2に示す。
圧縮成形を行わず、印刷により形成した第1被膜をそのまま加熱し、硬化させたこと以外、実施例2と同様に、第2被膜(第1被膜の硬化物)を成形し、同様に評価した。結果を表2に示す。
Claims (6)
- 基板と、液状の硬化性樹脂組成物と、を準備する第1工程と、
前記硬化性樹脂組成物で前記基板を封止して前記基板と前記硬化性樹脂組成物の硬化物とを含む封止体を形成する第2工程と、を含み、
前記第2工程は、
前記硬化性樹脂組成物を前記基板に印刷して前記基板を前記硬化性樹脂組成物の第1被膜で覆う印刷工程と、
前記硬化性樹脂組成物の第1被膜を金型の押圧面で覆って、前記第1被膜を前記基板とともに圧縮成形して前記第1被膜から第2被膜を形成する成形工程と、を備え、
前記第1被膜の前記基板に対する投影面積S1と、前記第2被膜の前記基板に対する投影面積S2との比:S1/S2が、0.9≦S1/S2<1を満たす、封止構造体の製造方法。 - 基板と、液状の硬化性樹脂組成物と、を準備する第1工程と、
前記硬化性樹脂組成物で前記基板を封止して前記基板と前記硬化性樹脂組成物の硬化物とを含む封止体を形成する第2工程と、を含み、
前記第2工程は、
前記硬化性樹脂組成物を前記基板に印刷して前記基板を前記硬化性樹脂組成物の第1被膜で覆う印刷工程と、
前記硬化性樹脂組成物の第1被膜を、前記第1被膜に突入する凸形状を有さない金型の押圧面で覆って、側面が解放された状態の前記第1被膜を前記基板とともに圧縮成形して前記第1被膜から第2被膜を形成する成形工程と、を備え、
前記第1被膜の前記基板に対する投影面積S1と、前記第2被膜の前記基板に対する投影面積S2との比:S1/S2が0.9以上である、封止構造体の製造方法。 - 前記第2被膜の最大長L(mm)の前記第2被膜の最大厚みT(mm)に対する比:L/Tが、653より大きい、請求項1または2に記載の封止構造体の製造方法。
- 前記比L/Tは、720以上である、請求項3に記載の封止構造体の製造方法。
- 前記第2被膜の最大厚みTは、0.4mm以下である、請求項1~4のいずれか1項に記載の封止構造体の製造方法。
- 前記印刷工程を、減圧下で行う、請求項1~5のいずれか1項に記載の封止構造体の製造方法。
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