WO2022118512A1 - 化学強化ガラスおよび電子機器筐体 - Google Patents
化学強化ガラスおよび電子機器筐体 Download PDFInfo
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- WO2022118512A1 WO2022118512A1 PCT/JP2021/032550 JP2021032550W WO2022118512A1 WO 2022118512 A1 WO2022118512 A1 WO 2022118512A1 JP 2021032550 W JP2021032550 W JP 2021032550W WO 2022118512 A1 WO2022118512 A1 WO 2022118512A1
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- Prior art keywords
- glass
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- chemically strengthened
- strengthened glass
- chemical strengthening
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- 239000005345 chemically strengthened glass Substances 0.000 title claims abstract description 96
- 239000011521 glass Substances 0.000 claims abstract description 179
- 150000002500 ions Chemical class 0.000 claims abstract description 30
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 58
- 239000000203 mixture Substances 0.000 claims description 32
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 12
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 12
- 239000006018 Li-aluminosilicate Substances 0.000 claims description 4
- 239000005341 toughened glass Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- 239000003513 alkali Substances 0.000 abstract description 10
- 230000035699 permeability Effects 0.000 abstract description 9
- 238000003426 chemical strengthening reaction Methods 0.000 description 115
- 239000011734 sodium Substances 0.000 description 48
- 230000005540 biological transmission Effects 0.000 description 40
- 239000013078 crystal Substances 0.000 description 23
- 229910001413 alkali metal ion Inorganic materials 0.000 description 19
- 238000000034 method Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 13
- 150000003839 salts Chemical class 0.000 description 13
- 230000008859 change Effects 0.000 description 12
- 239000006059 cover glass Substances 0.000 description 10
- 230000007423 decrease Effects 0.000 description 10
- 238000004031 devitrification Methods 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 10
- 238000002834 transmittance Methods 0.000 description 10
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000000523 sample Substances 0.000 description 9
- 239000002994 raw material Substances 0.000 description 8
- 238000005728 strengthening Methods 0.000 description 8
- 239000002344 surface layer Substances 0.000 description 8
- 238000005342 ion exchange Methods 0.000 description 7
- 238000011282 treatment Methods 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 6
- 229910001415 sodium ion Inorganic materials 0.000 description 6
- 229910001416 lithium ion Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000006124 Pilkington process Methods 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000006103 coloring component Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 4
- 229910052912 lithium silicate Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000009774 resonance method Methods 0.000 description 4
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000013001 point bending Methods 0.000 description 3
- 235000010333 potassium nitrate Nutrition 0.000 description 3
- 239000004323 potassium nitrate Substances 0.000 description 3
- TWQULNDIKKJZPH-UHFFFAOYSA-K trilithium;phosphate Chemical compound [Li+].[Li+].[Li+].[O-]P([O-])([O-])=O TWQULNDIKKJZPH-UHFFFAOYSA-K 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- 229910000502 Li-aluminosilicate Inorganic materials 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 238000003991 Rietveld refinement Methods 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 239000005354 aluminosilicate glass Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- NLSCHDZTHVNDCP-UHFFFAOYSA-N caesium nitrate Chemical compound [Cs+].[O-][N+]([O-])=O NLSCHDZTHVNDCP-UHFFFAOYSA-N 0.000 description 2
- FLJPGEWQYJVDPF-UHFFFAOYSA-L caesium sulfate Chemical compound [Cs+].[Cs+].[O-]S([O-])(=O)=O FLJPGEWQYJVDPF-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000003280 down draw process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910000174 eucryptite Inorganic materials 0.000 description 2
- 238000005816 glass manufacturing process Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 2
- 229910001386 lithium phosphate Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007500 overflow downdraw method Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 235000010344 sodium nitrate Nutrition 0.000 description 2
- 239000004317 sodium nitrate Substances 0.000 description 2
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 description 1
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- -1 SeO 2 Inorganic materials 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- HZVVJJIYJKGMFL-UHFFFAOYSA-N almasilate Chemical compound O.[Mg+2].[Al+3].[Al+3].O[Si](O)=O.O[Si](O)=O HZVVJJIYJKGMFL-UHFFFAOYSA-N 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- HEHRHMRHPUNLIR-UHFFFAOYSA-N aluminum;hydroxy-[hydroxy(oxo)silyl]oxy-oxosilane;lithium Chemical compound [Li].[Al].O[Si](=O)O[Si](O)=O.O[Si](=O)O[Si](O)=O HEHRHMRHPUNLIR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- AIYUHDOJVYHVIT-UHFFFAOYSA-M caesium chloride Chemical compound [Cl-].[Cs+] AIYUHDOJVYHVIT-UHFFFAOYSA-M 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000008395 clarifying agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- ZADYMNAVLSWLEQ-UHFFFAOYSA-N magnesium;oxygen(2-);silicon(4+) Chemical compound [O-2].[O-2].[O-2].[Mg+2].[Si+4] ZADYMNAVLSWLEQ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000004554 molding of glass Methods 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052670 petalite Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0018—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents
- C03C10/0027—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents containing SiO2, Al2O3, Li2O as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2204/00—Glasses, glazes or enamels with special properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
Definitions
- the present invention relates to chemically strengthened glass and an electronic device housing.
- Chemically tempered glass is widely used for the housing of electronic devices such as mobile terminals because it is required to have strength that does not easily break even if the mobile terminal is dropped.
- Chemically strengthened glass causes ion exchange between alkaline ions contained in glass and alkaline ions having a larger ion radius contained in the molten salt, such as by immersing the glass in a molten salt such as sodium nitrate. As a result, the glass has a compressive stress layer formed on the surface layer of the glass.
- Patent Document 1 discloses an aluminosilicate glass having a specific composition and capable of obtaining a high surface compressive stress by chemical strengthening.
- the cover glass may interfere with the transmission and reception of radio waves, and 5G-compatible mobile terminals are required to have a cover glass with excellent dielectric properties such as radio wave transmission.
- excellent dielectric properties for example, it is desirable that the relative permittivity and the dielectric loss are low. By lowering the relative permittivity, it is possible to suppress the reflection of radio waves and improve the radio wave transmission. Moreover, the loss of radio waves can be suppressed by reducing the dielectric loss.
- Non-alkali glasses have been developed so far as glass having high radio wave transmission in a high frequency band such as that used in 5G, that is, glass having a small relative permittivity and dielectric loss tangent (Patent Document 2).
- an object of the present invention is to provide a chemically strengthened glass having both excellent radio wave transmission and high strength in a high frequency band.
- the present inventors have found that in the high frequency band, there are both glass in which the radio wave permeability after the chemical strengthening decreases and glass in which the radio wave permeability increases as compared with the case before the chemical strengthening. Further, the present invention has been made by finding a correlation between the surface characteristics after chemical strengthening and the radio wave transmission for the glass whose radio wave permeability increases in the high frequency band after chemical strengthening.
- the present invention is a chemically strengthened glass having a thickness of t (unit: ⁇ m) and a relative permittivity of 7.0 or less at 20 ° C. and a frequency of 10 GHz.
- Entropy function S1 calculated from the amount of alkaline ions in the central part of the glass
- entropy function S2 calculated from the average amount of alkaline ions from the glass surface to a depth of 0.05t, and from the glass surface to a depth of 0.05t.
- It is a chemically strengthened glass in which Z obtained by the following formula from the average value X [unit: MPa] of the compressive stress in the region is 0.65 or more.
- the value of (S2-S1) which is the value obtained by subtracting the entropy function S1 from the entropy function S2, is preferably 0.04 or more. ..
- the dielectric loss tangent of this chemically strengthened glass at 20 ° C. and a frequency of 10 GHz is preferably 0.02 or less.
- This chemically strengthened glass has a mother composition of oxide-based molar percentage display. 40-80% of SiO 2 B 2 O 3 0 to 20%, Al 2 O 3 1-25%, It is preferable to contain Li 2 O and / or Na 2 O in a total amount of 5 to 30%.
- the chemically strengthened glass preferably has a surface compressive stress value CS 0 of 300 MPa or more.
- the chemically strengthened glass preferably has an internal chemically strengthened stress CS of 0.05 t or more and a thickness of t of 300 ⁇ m or more at a depth of 0.05 t from the glass surface.
- the chemically strengthened glass preferably has a compressive stress layer depth DOL of 70 ⁇ m or more and a thickness t of 350 ⁇ m or more.
- This chemically strengthened glass is lithium aluminosilicate glass,
- the population composition is expressed as an oxide-based molar percentage. 40-70% of SiO 2 Al 2 O 3 7.5-20%, It preferably contains 5 to 25% Li 2 O.
- the thickness t of the chemically strengthened glass is preferably 100 ⁇ m or more and 2000 ⁇ m or less.
- the chemically strengthened glass is preferably crystallized glass.
- the present invention also provides an electronic device housing containing the chemically strengthened glass.
- the chemically strengthened glass of the present invention has excellent strength and exhibits excellent radio wave transmission in the high frequency band.
- FIG. 1 is a graph showing the correlation between the amount of change in the relative permittivity and the total value in dielectric loss tangent before and after chemical strengthening, which are important for radio wave transmission at a frequency of 10 GHz, and the entropy function and compressive stress.
- the vertical axis is the total value of the relative permittivity changed before and after the chemical strengthening and the value obtained by multiplying the dielectric loss tangent by 100, and the horizontal axis is the parameter Z that can be calculated from the entropy function and the compressive stress before and after the chemical strengthening.
- Radio wave transmission is determined by both the relative permittivity and the dielectric loss tangent, but since the relative permittivity has a larger absolute value and is more effective than the dielectric loss tangent, the radio wave transmission is the sum of the relative permittivity and the dielectric loss tangent 100 times. It is represented by a value.
- chemically strengthened glass refers to glass after being chemically strengthened
- chemically strengthened glass refers to glass before being chemically strengthened
- the "matrix composition of chemically strengthened glass” is the glass composition of chemically strengthened glass.
- the glass composition at a depth of 1/2 of the thickness t is the matrix composition of chemically strengthened glass, except when an extreme ion exchange treatment is performed.
- the glass composition is expressed as an oxide-based molar percentage display unless otherwise specified, and molar% is simply expressed as "%".
- substantially not contained means that it is below the level of impurities contained in raw materials and the like, that is, it is not intentionally contained. Specifically, for example, it is less than 0.1 mol%.
- the "stress profile” refers to a compressive stress value expressed with the depth from the glass surface as a variable.
- the “compressive stress layer depth (DOL)” is a depth at which the compressive stress value (CS) becomes zero.
- “Internal tensile stress value (CT)” refers to a tensile stress value at a depth of 1/2 of the thickness t of glass. In the present specification, the tensile stress value is expressed as a negative compressive stress value.
- the stress profile in the present specification can be measured using a scattered light photoelastic stress meter (for example, SLP-1000 manufactured by Orihara Seisakusho).
- the scattered photoelastic stress meter may be affected by surface scattering, and the measurement accuracy near the sample surface may decrease.
- the compressive stress value expressed as a function of depth follows the complementary error function, so the internal stress value.
- the stress value on the surface can be known by measuring.
- the complementary error function is not followed, the surface portion is measured by another method, for example, a method of measuring with a surface stress meter.
- the chemically strengthened glass of the present invention is a chemically strengthened glass having a thickness of t (unit: ⁇ m) and a specific dielectric constant of 7.0 or less at a frequency of 10 GHz, and is calculated from the amount of alkali ions in the central portion of the glass.
- Entropy function S1, entropy function S2 calculated from the average amount of alkaline ions from the glass surface to a depth of 0.05t, and the average value of compressive stress X [MPa] in the region from the glass surface to a depth of 0.05t. Therefore, Z obtained by the following formula is 0.65 or more.
- Z (S2-S1) ⁇ 10 + X / 1000
- the entropy function S is the contents [Li 2 O], [Na 2 O] and [K 2 O] according to the molar percentage of Li 2 O, Na 2 O and K 2 O at the respective depths. ], It shall be calculated by the following formula. In the following formula, when [Li 2 O], [Na 2 O] and [K 2 O] are zero, it is 1 ⁇ 10 -4 .
- the present inventors focused on the relationship between the radio wave transmission in the high frequency band and the chemical strengthening, and found that the glass in which the radio wave transmission in the high frequency band increased after the chemical strengthening as compared with before the chemical strengthening, and the glass after the chemical strengthening. We have found that there is glass that reduces radio wave transmission in the high frequency band.
- the present inventors have characterized that the radio wave permeability in the high frequency band increases after the chemical strengthening as compared with the case before the chemical strengthening. 1)
- the mixing degree of alkaline ions changes significantly before and after the chemical strengthening. It was thought that it should be provided with both that and 2) that a high compressive stress was applied after the chemical strengthening.
- the features of 1) and 2) will be described.
- Relative permittivity and dielectric loss are mainly caused by the movement of alkali metal ions in glass. Therefore, by suppressing the movement of alkali metal ions in glass by chemical strengthening treatment, the relative permittivity and dielectric loss can be reduced. Conceivable.
- the degree of alkali ion mixing changes significantly before and after chemical strengthening, alkali metal ions exchange with each other due to the presence and mixing of different types of alkali metal ions in the glass. It is considered that it becomes difficult, the relative permittivity and the dielectric loss decrease, and the dielectric characteristics improve.
- the degree of mixing of alkali metal ions is expressed by the entropy function.
- high compressive stress after chemical strengthening it is considered that if the compressive stress is strong, the movement of alkali metal ions is suppressed, the relative permittivity and the dielectric loss are lowered, and the dielectric properties are improved.
- FIG. 1 shows the total of the relative permittivity and the dielectric tangent, which are important for the radio wave transmission at a frequency of 10 GHz, for the glass whose radio wave permeability increases after the chemical strengthening in Experimental Example 1 described later as compared with the case before the chemical strengthening.
- It is a graph which shows the correlation between the change amount of a value before and after chemical strengthening, an entropy function and a compressive stress.
- the vertical axis of FIG. 1 is the total value of the relative permittivity changed before and after the chemical strengthening and the value obtained by multiplying the dielectric loss tangent by 100, and the horizontal axis is the parameter Z that can be calculated from the entropy function and the compressive stress before and after the chemical strengthening.
- Radio wave transmission is determined by both the relative permittivity and the dielectric loss tangent, but since the relative permittivity has a larger absolute value and is more effective than the dielectric loss tangent, the radio wave transmission is determined by the amount of change in the relative permittivity and the dielectric loss tangent. It is represented by the total value obtained by multiplying the amount of change in. Details of Experimental Example 1 will be described later.
- the content of the alkali metal ion for calculating the entropy function is measured using EPMA (Electron Probe Micro Analyzer, manufactured by JEOL: JXA-8500F).
- the measurement conditions of EPMA are an acceleration voltage of 15 kV, a probe current of 30 nA, and an integration time of 1000 msec. The interval is 1 ⁇ m as / point.
- the chemical strengthening suppresses the movement of alkali metal ions after the chemical strengthening compared to before the chemical strengthening, and the improvement in radio wave transmission means that the amount of change in the relative permittivity due to the chemical strengthening and the dielectric loss due to the chemical strengthening It can be evaluated by the amount of change.
- the value obtained by subtracting the "relative permittivity at 20 ° C. and 10 GHz after chemical strengthening" from the "relative permittivity at 20 ° C. and 10 GHz before chemical strengthening” is preferably 0 or more, more preferably 0. It is more preferably 0.02 or more, 0.04 or more, further preferably 0.06 or more, particularly preferably 0.08 or more, further preferably 0.1 or more, and most preferably 0.12 or more. Since the relative permittivity of the glass after the chemical strengthening is reduced by 0 or more as compared with the case before the chemical strengthening, it can be evaluated that the relative permittivity is lowered by the chemical strengthening and the radio wave transmission property is improved.
- the value obtained by subtracting the "dielectric loss tangent at 20 ° C. and 10 GHz after chemical strengthening" from the "dielectric loss tangent at 20 ° C. and 10 GHz before chemical strengthening” is preferably 0 or more, more preferably 0.001 or more. 0.002 or more is further preferable, 0.003 or more is further preferable, and 0.004 or more is particularly preferable. Since the dielectric loss tangent of the glass after the chemical strengthening is reduced by 0 or more as compared with the case before the chemical strengthening, it can be evaluated that the dielectric loss is reduced by the chemical strengthening and the radio wave transmission property is improved.
- the dielectric property of the glass surface is particularly important among the dielectric properties of glass, such as when designing a circuit on a glass substrate.
- the chemically strengthened glass of the present invention can efficiently transmit radio waves in the high frequency band because the relative permittivity and dielectric tangent of the glass plate surface are smaller than the relative permittivity and dielectric tangent inside the glass, and the dielectric properties of the glass surface layer. Is excellent.
- Z 0.65 or more, the movement of alkali metal ions after chemical strengthening is suppressed, and excellent radio wave transmission is exhibited in the high frequency band.
- the value of Z can be adjusted by the composition of the chemically strengthened glass and the conditions of the chemically strengthened treatment (molten salt composition, time, temperature, etc.).
- S1 in the above formula is an entropy function calculated from the amount of alkaline ions in the central portion of the glass
- S2 is an entropy function calculated from the average amount of alkaline ions from the glass surface to a depth of 0.05 t.
- the value of S1 is not particularly limited, but the lower the value of S1, the better the chemical strengthening property can be obtained.
- the value is preferably 0.375 or less, more preferably 0.35 or less, and further preferably 0. It is 325 or less, more preferably 0.30 or less, particularly preferably 0.25 or less, further preferably 0.20 or less, and most preferably 0.15 or less.
- S1 is too low, the relative permittivity and the dielectric loss tangent cannot be lowered even if chemically strengthened, so 0.0 or more is preferable.
- the value of S2 is not particularly limited, but the higher the S2, the lower the relative permittivity and dielectric loss tangent of the glass after chemical strengthening, and the better radio wave transmission after chemical strengthening, for example, preferably 0.2 or more. Yes, more preferably 0.25 or more, still more preferably 0.3 or more, even more preferably 0.35 or more, particularly preferably 0.40 or more, still more preferably 0.45 or more.
- S2 is too high, the chemical strengthening stress is not sufficiently applied, and for example, it is preferably 0.5 or less, more preferably 0.49 or less, still more preferably 0.48 or less, and 0.47. The following is even more preferable, and 0.46 or less is particularly preferable.
- the value obtained by subtracting S1 from S2 is not particularly limited, but the higher the value, the lower the relative permittivity and the dielectric loss tangent after chemical strengthening, so that it is preferably 0.04 or more, more preferably 0. It is 0.05 or more, more preferably 0.1 or more, still more preferably 0.15 or more, particularly preferably 0.2 or more, further preferably 0.25 or more, and most preferably 0.3 or more.
- the value obtained by subtracting S1 from S2 is too high, sufficient chemical strengthening stress cannot be applied, so that it is preferably 0.5 or less, more preferably 0.48 or less, still more preferably 0.46 or less. It is more preferably 0.44 or less, particularly preferably 0.42 or less, further preferably 0.40 or less, and most preferably 0.38 or less.
- S1 and S2 By setting S1 and S2 in the above range, it is possible to increase the mixing degree of alkali metal ions by chemical strengthening, suppress the movement of alkali metal ions on the glass surface layer, and improve radio wave transmission in a high frequency band.
- S1 and S2 can be adjusted depending on the composition of the chemically strengthening glass and the chemical strengthening treatment conditions (molten salt composition, time, temperature, etc.).
- X in the above formula is the average value [unit: MPa] of the compressive stress in the region from the glass surface to the depth of 0.05 t.
- the value of X is not particularly limited, but for example, it is preferably 100 MPa or more, more preferably 150 MPa or more, further preferably 200 MPa or more, further preferably 250 MPa or more, particularly preferably 275 MPa or more, and 300 MPa or more. It is more preferably 320 MPa or more, and most preferably 320 MPa or more.
- the value of X is too high, it will explosively break as fine pieces when the glass is crushed, so that it is preferably 600 MPa or less, more preferably 500 MPa or less, and further preferably 475 MPa or less. It is more preferably 450 MPa or less, particularly preferably 425 MPa or less, further preferably 400 MPa or less, and most preferably 375 MPa or less.
- the value of X can be adjusted by the composition of the chemically strengthened glass and the conditions of the chemically strengthened treatment (molten salt composition, time, temperature, etc.).
- the chemically strengthened glass is preferably plate-shaped.
- the glass plate may have a edging shape or the like having a different outer peripheral thickness.
- the form of the glass plate is not limited to this, and for example, the two main surfaces may not be parallel to each other, and one or both of the two main surfaces may be a curved surface in whole or in part. More specifically, the glass plate may be, for example, a flat plate-shaped glass plate having no warp, or a curved glass plate having a curved surface.
- the thickness (t) is, for example, 2000 ⁇ m or less, preferably 1500 ⁇ m or less, more preferably 1000 ⁇ m or less, still more preferably 900 ⁇ m or less, and particularly preferably 900 ⁇ m or less, from the viewpoint of enhancing the effect of chemical strengthening. It is 800 ⁇ m or less, and most preferably 700 ⁇ m or less. Further, the thickness is, for example, 100 ⁇ m or more, preferably 200 ⁇ m or more, more preferably 300 ⁇ m or more, still more preferably 350 ⁇ m or more, from the viewpoint of obtaining the effect of sufficient strength improvement by the chemical strengthening treatment. Yes, more preferably 400 ⁇ m or more, and particularly preferably 500 ⁇ m or more.
- the shape of this chemically strengthened glass may be a shape other than a plate shape, depending on the product to which it is applied, the application, and the like.
- the relative permittivity of the chemically strengthened glass at 20 ° C. and a frequency of 10 GHz is 7.0 or less, preferably 6.9 or less, more preferably 6.8 or less, further preferably 6.7 or less, and 6.6 or less. Even more preferably, 6.5 or less is particularly preferable, 6.4 or less is even more preferable, and 6.3 or less is most preferable. Since the relative permittivity is small, the loss of radio waves due to reflection on the glass surface can be suppressed, so that the radio wave transmission tends to be good. On the other hand, if the relative permittivity is too low, the glass will not be sufficiently chemically strengthened, so 4.0 or more is preferable, 4.2 or more is more preferable, and 4.4 or more is further preferable.
- the relative permittivity can be measured by the slip-post dielectric resonance method (SPDR method) using a network analyzer for a value at 20 ° C. and a frequency of 10 GHz.
- the dielectric positive contact (tan ⁇ ) of the chemically strengthened glass at 20 ° C. and a frequency of 10 GHz is preferably 0.02 or less, more preferably 0.018 or less, still more preferably 0.016 or less, still more preferably 0.014 or less. , 0.012 or less is particularly preferable, 0.011 or less is more preferable, and 0.010 or less is most preferable. Since the dielectric loss tangent is small, the loss when the radio wave passes through the inside of the glass can be suppressed, so that the radio wave transmission tends to be good. On the other hand, if the dielectric loss tangent is too low, the glass will not be able to apply sufficient chemical strengthening stress.
- the dielectric loss tangent (tan ⁇ ) can be measured by a slip-post dielectric resonance method (SPDR method) using a network analyzer for a value at 20 ° C. and a frequency of 10 GHz.
- the relative permittivity and the dielectric tangential value at 20 ° C. and a frequency of 10 GHz are brought closer to each other, and the frequency dependence (dielectric dispersion) is reduced by reducing the frequency dependence (dielectric dispersion). It is preferable because the frequency characteristics of the above are not easily changed and the design change can be small even when the frequency at the time of use is different.
- the relative permittivity and the dielectric loss tangent can be adjusted by the composition of the glass and the chemical strengthening conditions.
- this chemically strengthened glass Since the alkali content of this chemically strengthened glass is appropriately adjusted in the glass composition, the relative permittivity and the dielectric loss tangent at a frequency of 10 GHz can be reduced. Generally, in the frequency range of about 10 GHz to 40 GHz, the relative permittivity of glass and the frequency dependence of dielectric loss tangent are small, so this chemically strengthened glass with excellent dielectric properties at a frequency of 10 GHz is 28 GHz, 35 GHz, etc. used at 5 G. Excellent radio wave transmission even in the band of.
- the relative permittivity and the dielectric loss tangent can be measured by the slip-post dielectric resonance method (SPDR method) using a network analyzer.
- This chemically strengthened glass is obtained by chemically strengthening the chemically strengthened glass or crystallized glass described later. That is, the mother composition of the present chemically strengthened glass is the same as the glass composition of the chemically strengthened glass described later, and the preferable composition range is also the same.
- the average composition of the chemically strengthened glass is the same as the composition of the chemically strengthened glass or the crystallized glass described later.
- the average composition refers to a composition obtained by analyzing a glass sample that has been heat-treated from a glass state and then finely crushed.
- the chemically strengthened glass preferably has an internal chemically strengthened stress CS of 0.05 t or more, more preferably 150 MPa or more, still more preferably 200 MPa or more, still more preferably 225 MPa or more, and particularly preferably 250 MPa or more.
- an internal chemically strengthened stress CS of 0.05 t or more, more preferably 150 MPa or more, still more preferably 200 MPa or more, still more preferably 225 MPa or more, and particularly preferably 250 MPa or more.
- the surface compressive stress value CS 0 is preferably 300 MPa or more, more preferably 400 MPa or more, and further preferably 500 MPa or more, excellent strength can be easily obtained, and the compressive stress value CS 50 at a depth of 50 ⁇ m from the surface is also available. It is preferable because it tends to grow.
- the compressive stress value CS 50 at a depth of 50 ⁇ m from the surface is preferably 75 MPa or more, more preferably 90 MPa or more, still more preferably 100 MPa or more, and particularly preferably 125 MPa or more.
- the large CS 50 makes it difficult to break when the chemically strengthened glass is damaged due to falling or the like.
- the internal tensile stress value CT of the chemically strengthened glass is preferably 80 MPa or less, more preferably 75 MPa or less. Since the CT is small, crushing is unlikely to occur.
- the internal tensile stress value CT is preferably 50 MPa or more, more preferably 60 MPa or more, still more preferably 65 MPa or more. When the CT is equal to or higher than the above value, the compressive stress near the surface becomes large and the strength becomes high.
- the compressive stress layer depth DOL of the chemically strengthened glass is preferably 0.25t or less, more preferably 0.2t or less, still more preferably 0.19t or less, because if it is too large with respect to the thickness t, it causes an increase in CT. , More preferably 0.18 tons or less. Further, from the viewpoint of improving the strength, the DOL is preferably 0.06 tons or more, more preferably 0.08 tons or more, still more preferably 0.10 tons or more, and particularly preferably 0.12 tons or more.
- the DOL is preferably 140 ⁇ m or less, more preferably 133 ⁇ m or less.
- the DOL is preferably 70 ⁇ m or more, more preferably 80 ⁇ m or more, and even more preferably 90 ⁇ m or more.
- the preferred thickness (t) and preferred shape of the chemically strengthened glass are the same as the preferred thickness (t) and shape of the present glass described above.
- the Young's modulus of the chemically strengthened glass is preferably 50 GPa or more, more preferably 80 GPa or more, still more preferably 85 GPa or more because it is difficult to crush.
- the upper limit of the Young's modulus is not particularly limited, but since a glass having a high Young's modulus may have a low acid resistance, it is, for example, 110 GPa or less, preferably 100 GPa or less, and more preferably 90 GPa or less. Young's modulus can be measured, for example, by the ultrasonic pulse method.
- the four-point bending strength of the chemically strengthened glass is preferably 350 MPa or more, more preferably 450 MPa or more, and further preferably 400 MPa or more.
- the upper limit of the 4-point bending strength is not particularly limited, but is typically 1000 MPa or less.
- the 4-point bending strength is measured by the method specified in JIS R1601: 2008.
- the Vickers hardness of the surface of the chemically strengthened glass is preferably 4.4 GPa or more, more preferably 4.8 GPa or more, and further preferably 5.2 GPa or more.
- the upper limit of Vickers hardness is not particularly limited, but is typically 9.0 GPa or less.
- the Vickers hardness is the Vickers hardness (HV0.1) specified in JIS R1610: 2003.
- the thermal conductivity of the chemically strengthened glass is preferably 2.0 W / m ° C or lower, more preferably 1.8 W / m ° C or lower, and even more preferably 1.5 W / m ° C or lower.
- the lower limit of the thermal conductivity is not particularly limited, but is typically 0.8 W / m ° C. or higher.
- This chemically strengthened glass is particularly useful as a cover glass used for mobile devices such as mobile phones, smartphones, personal digital assistants (PDAs), and tablet terminals.
- non-portable construction such as cover glass for display devices such as televisions (TVs), personal computers (PCs), and touch panels, wall surfaces of elevators, walls of buildings such as houses and buildings (full-scale display), and window glass. It is also useful as materials, table tops, interiors of automobiles and airplanes, cover glass for them, and applications such as housings having a curved shape that is not plate-shaped due to bending or molding.
- the chemically strengthened glass can be produced by chemically strengthening the chemically strengthened glass described below (hereinafter, also referred to as “this chemically strengthened glass”).
- Chemically strengthened glass any one of soda-lime glass, alkaline aluminosilicate glass, and alkaline aluminoborosilicate glass is preferable. These glasses are suitable for chemical strengthening treatments.
- the chemically strengthened glass is lithium aluminosilicate glass. Since lithium aluminum nosilicate glass contains lithium ion, which is an alkaline ion having the smallest ion radius, it has a favorable stress profile and excellent strength by chemical strengthening treatment in which ions are exchanged using various molten salts. It is easy to obtain chemically strengthened glass.
- SiO 2 B 2 O 3 0 to 20%, Al 2 O 3 1-25%, It is preferable to contain Li 2 O and / or Na 2 O in a total amount of 5 to 30%.
- lithium aluminosilicate glass 40-70% of SiO 2 Al 2 O 3 7.5-20%, Those containing 5 to 25% of Li 2 O are preferable.
- SiO 2 is a component constituting a glass network. Further, SiO 2 is a component that enhances chemical durability and is a component that reduces the occurrence of cracks when the glass surface is scratched.
- the content of SiO 2 is preferably 40% or more, more preferably 50% or more, further preferably 55% or more, further preferably 56% or more, still more preferably 63% or more, in order to improve chemical durability. It is particularly preferable, and 65% or more is most preferable. In order to improve the meltability during glass production, the content of SiO 2 is preferably 80% or less, more preferably 75% or less, further preferably 70% or less, particularly preferably 68% or less, and 65% or less. Most preferred.
- Al 2 O 3 is an effective component from the viewpoint of improving the ion exchange performance during chemical strengthening and increasing the surface compressive stress after strengthening.
- the content of Al 2 O 3 is preferably 1% or more, preferably 3% or more, more preferably 5% or more, and 7% or more in order to improve the chemical durability and the chemical strengthening property. Is even more preferable, 9.1% or more is even more preferable, 10% or more is even more preferable, 11% or more is particularly preferable, and 12% or more is most preferable. On the other hand, if the content of Al 2 O 3 is too large, crystals may easily grow during melting. In order to prevent a decrease in yield due to devitrification defects, the content of Al 2 O 3 is preferably 25% or less, more preferably 23% or less, further preferably 21% or less, particularly preferably 20% or less, and most preferably. Is 19% or less.
- Both SiO 2 and Al 2 O 3 are components that stabilize the structure of the glass, and the total content is preferably 57.5% or more, more preferably 65% or more in order to reduce the brittleness. It is more preferably 75% or more, still more preferably 77% or more, and particularly preferably 79% or more.
- the total content thereof is preferably 95% or less, more preferably 90% or less, still more preferably 87% or less, still more preferably 85% or less, and particularly preferably 82. % Or less.
- Li 2 O is a component that forms surface compressive stress by ion exchange, and is a component that improves the meltability of glass.
- chemically strengthened glass contains Li 2 O, Li ions on the glass surface are ion-exchanged with Na ions, and Na ions are further ion-exchanged with K ions. Both the surface compressive stress and the compressive stress layer have large stress. A profile is obtained.
- the Li 2 O content is preferably 5% or more, more preferably 6.5% or more, further preferably 7.1% or more, and 7.5% or more. It is particularly preferable, and 8% or more is most preferable.
- the Li 2O content is preferably 18% or less, more preferably 16% or less, still more preferably 15% or less, still more preferably 14% or less. Particularly preferably, it is 12% or less. Further, if the content of alkaline ions is too large, the radio wave permeability tends to decrease. Therefore, from the viewpoint of improving the radio wave permeability, the Li 2 O content is preferably 12% or less, more preferably 10% or less. 9% or less is more preferable.
- the total amount of Li 2 O and / or Na 2 O is preferably 5% or more, more preferably 7.5% or more, still more preferably 10% or more. Further, from the viewpoint of preventing the glass from dissolving in water or the like, the total amount of Li 2 O and / or Na 2 O is preferably 30% or less, more preferably 25% or less, still more preferably 20% or less. ..
- Both Na 2 O and K 2 O are not essential, but are components that improve the meltability of the glass and reduce the crystal growth rate of the glass, and are preferably contained in order to improve the ion exchange performance.
- Na 2 O is a component that forms a surface compressive stress layer in a chemical strengthening treatment using a potassium salt, and is a component that can improve the meltability of glass.
- the content of Na 2 O is preferably 1.5% or more, more preferably 2.5% or more, further preferably 3% or more, still more preferably 3.6% or more, particularly. It is preferably 4% or more.
- the content is preferably 10% or less, more preferably 7% or less, and 5%. The following is even more preferable, and 3% or less is even more preferable.
- K2 O may be contained for the purpose of suppressing devitrification in the glass manufacturing process.
- the content is preferably 0.1% or more, more preferably 0.15% or more, and particularly preferably 0.2% or more. In order to further prevent devitrification, 0.5% or more is preferable, and 1.2% or more is more preferable.
- the content of K2O is preferably 4% or less, more preferably 3% or less, and more preferably 2 %, because a large amount of K causes brittleness and a decrease in surface stress due to reverse exchange during strengthening. The following is even more preferable, 1% or less is even more preferable, and 0.5% or less is particularly preferable.
- the total content of Na 2 O and K 2 O ([Na 2 O] + [K 2 O]) is preferably 2% or more, more preferably 2.5% or more, in order to increase the meltability of the glass. It is more preferably 3% or more, and particularly preferably 3.5% or more. If ([Na 2 O] + [K 2 O]) is too large, the surface compressive stress value tends to decrease. Therefore, ([Na 2 O] + [K 2 O]) is preferably 10% or less, more preferably. Is 8% or less, more preferably 7% or less, and particularly preferably 6% or less. Further, the coexistence of Na 2 O and K 2 O suppresses the movement of the alkaline component, which is preferable from the viewpoint of radio wave transmission.
- this chemically strengthened glass has the ratio of the content of Li 2 O to the total content of Na 2 O and K 2 O ([Na 2 O] + [K 2 O]) [[ Li 2 O] / ([Na 2 O] + [K 2 O])] is preferably 1 or more, more preferably 2 or more, still more preferably 3 or more, and particularly preferably 5 or more.
- the upper limit of [[Li 2 O] / ([Na 2 O] + [K 2 O])] is not particularly limited, but is typically 20 or less.
- MgO, CaO, SrO, and BaO are not essential, but one or more of them may be contained from the viewpoint of improving the stability of the glass and improving the chemical strengthening characteristics.
- the total content of 1 or more selected from MgO, CaO, SrO, and BaO [MgO] + [CaO] + [SrO] + [BaO] is preferably 1% or more, preferably 2% or more. More preferably, 4% or more is further preferable.
- the total content of these is preferably 20% or less, more preferably 10% or less.
- MgO may be contained in order to reduce the viscosity at the time of dissolution.
- the content is preferably 1% or more, more preferably 2% or more, still more preferably 3% or more.
- the content of MgO is preferably 5% or less, more preferably 4% or less, still more preferably 3% or less, and particularly preferably 2% or less.
- CaO is a component that improves the meltability of glass and may be contained.
- the content is preferably 0.1% or more, more preferably 0.15% or more, and further preferably 0.5% or more.
- the CaO content is preferably 5% or less, more preferably 3% or less, still more preferably 1% or less, and typically 0.5% or less.
- ZnO is a component that improves the meltability of glass and may be contained.
- the content is preferably 0.2% or more, more preferably 0.5% or more.
- the ZnO content is preferably 8% or less, more preferably 5% or less, still more preferably 3% or less.
- [ZnO] + [SrO] + [BaO] is preferably less than 1%, preferably 0.5% or less, in order to facilitate chemical strengthening. Is more preferable. It is more preferable that these are substantially not contained.
- ZrO 2 may not be contained, but it is preferably contained from the viewpoint of increasing the surface compressive stress of the chemically strengthened glass.
- the content of ZrO 2 is preferably 0.1% or more, more preferably 0.15% or more, still more preferably 0.2% or more, particularly preferably 0.25% or more, typically 0.3%. That is all.
- the content of ZrO 2 is preferably 2% or less, more preferably 1.5% or less, still more preferably 1% or less, and particularly preferably 0.8% or less.
- the content of Y2O3 is preferably 0.1% or more , more preferably 0.2% or more, still more preferably 0.5% or more, and particularly preferably 1% or more. On the other hand, if the amount is too large, it becomes difficult to increase the compressive stress layer during the chemical strengthening treatment.
- the content of Y2O3 is preferably 10 % or less, more preferably 8% or less, still more preferably 5% or less, still more preferably 3% or less, particularly preferably 2% or less, still more preferably 1 It is less than 5.5%.
- La 2 O 3 is not essential, but can be contained for the same reason as Y 2 O 3 .
- La 2 O 3 is preferably 0.1% or more, more preferably 0.2% or more, still more preferably 0.5% or more, and particularly preferably 0.8% or more.
- it is preferably 5% or less, more preferably 3% or less, still more preferably 2% or less, and particularly preferably 1.5% or less.
- TiO 2 is a component that suppresses the solarization of glass and may be contained.
- the content is preferably 0.02% or more, more preferably 0.03% or more, still more preferably 0.04% or more, and particularly preferably 0.05% or more. Yes, typically 0.06% or higher.
- the content of TiO 2 is preferably 5% or less, more preferably 3% or less, further preferably 2% or less, still more preferably 1% or less, particularly preferably 0.5% or less, still more preferably 0.25. % Or less.
- B 2 O 3 is not essential, it may be contained for the purpose of reducing the brittleness of the glass and improving the crack resistance, and for the purpose of improving the radio wave transmission.
- the content is preferably 1.0% or more, preferably 3.0% or more, more preferably 4.0% or more, particularly preferably 5.0% or more, and 7 It is more preferably 9.0% or more, and most preferably 8.0% or more.
- the content of B 2 O 3 is preferably 25% or less.
- the content of B 2 O 3 is more preferably 16% or less, still more preferably 13% or less, and particularly preferably 12% or less. The following is particularly preferable, 11% or less is more preferable, and 10% or less is most preferable. It is more preferable that B 2 O 3 is substantially not contained in order to prevent the problem of pulse formation during melting.
- P 2 O 5 is not essential, it may be contained for the purpose of increasing the compressive stress layer at the time of chemical strengthening.
- the content is preferably 0.25% or more, preferably 0.5% or more, more preferably 0.75% or more, and particularly preferably 1.0% or more. It is more preferably .25% or more, and most preferably 1.5% or more.
- the content of P 2 O 5 is preferably 10% or less, more preferably 8% or less, still more preferably 6% or less, still more preferably 4% or less, and 3% or less. Is particularly preferable, 2.5% or less is more preferable, and 2.0% or less is most preferable. In order to prevent the occurrence of veins at the time of melting, it is more preferable that the substance is not substantially contained.
- the total content of B 2 O 3 and P 2 O 5 is preferably 0 to 35%, more preferably 5% or more, still more preferably 8% or more.
- the total content of B 2 O 3 and P 2 O 5 is preferably 20% or less, more preferably 17% or less, still more preferably 15% or less.
- Nb 2 O 5, Ta 2 O 5 , Gd 2 O 3 , and CeO 2 are components that suppress the solarization of glass, are components that improve meltability, and may be contained.
- the content of each is preferably 0.03% or more, more preferably 0.1% or more, still more preferably 0.5% or more, particularly preferably 0.8% or more, typically.
- the target is 1% or more.
- the compressive stress value is preferably 3% or less, more preferably 2% or less, still more preferably 1% or less. , Particularly preferably 0.5% or less.
- the coloring component may be added as long as it does not hinder the achievement of the desired chemical strengthening property.
- the coloring component include Fe 2 O 3 , Co 3 O 4 , MnO 2 , NiO, CuO, Cr 2 O 3 , V 2 O 5 , Bi 2 O 3 , SeO 2 , CeO 2 , Er 2 O 3 , and so on. Nd 2 O 3 and the like are preferable.
- the content of the coloring component is preferably 5% or less in total in terms of molar percentage display based on oxides. If it exceeds 5%, the glass may easily devitrify.
- the content of the coloring component is preferably 3% or less, more preferably 1% or less. If it is desired to increase the transmittance of the glass, it is preferable that these components are not substantially contained.
- SO 3 , chloride, fluoride and the like may be appropriately contained as a clarifying agent or the like when the glass is melted. It is preferable that As 2 O 3 is not contained. When Sb 2 O 3 is contained, it is preferably 0.3% or less, more preferably 0.1% or less, and most preferably not contained.
- the ⁇ -OH value is a value used as an index of the water content of glass, and the absorbance of light having a wavelength of 2.75 to 2.95 ⁇ m is measured, and the maximum value ⁇ max is the thickness (mm) of the glass. It is the value obtained by dividing by.
- the ⁇ -OH value is preferably 0.8 mm -1 or less because the radio wave permeability of the glass can be further improved, more preferably 0.6 mm -1 or less, further preferably 0.5 mm -1 or less, and 0. 4 mm -1 or less is even more preferable.
- the ⁇ -OH value is more preferably 0.1 mm -1 or more, and further preferably 0.2 mm -1 or more.
- the ⁇ -OH value can be adjusted by the composition of the glass, the heat source at the time of melting, the melting time, and the raw material.
- the temperature (T2) at which the viscosity is 102 dPa ⁇ s is preferably 1750 ° C. or lower, more preferably 1700 ° C. or lower, particularly preferably 1675 ° C. or lower, and typically 1650 ° C. or lower.
- the temperature (T2) is a temperature that serves as a guideline for the melting temperature of the glass, and the lower the T2, the easier it is to manufacture the glass.
- the lower limit of T2 is not particularly limited, but since a glass having a low T2 tends to have a glass transition point too low, T2 is usually 1400 ° C. or higher, preferably 1450 ° C. or higher.
- the temperature (T4) at which the viscosity is 104 dPa ⁇ s is preferably 1350 ° C. or lower, more preferably 1300 ° C. or lower, further preferably 1250 ° C. or lower, and particularly preferably 1150 ° C. or lower.
- the temperature (T4) is a temperature that serves as a guideline for the temperature at which the glass is formed into a plate shape, and the glass having a high T4 tends to have a high load on the forming equipment.
- the lower limit of T4 is not particularly limited, but since a glass having a low T4 tends to have a glass transition point too low, T4 is usually 900 ° C. or higher, preferably 950 ° C. or higher, more preferably 1000 ° C. That is all.
- the devitrification temperature of the chemically strengthened glass is 120 ° C. higher than the temperature (T4) at which the viscosity is 104 dPa ⁇ s, because devitrification is unlikely to occur during molding by the float method.
- the devitrification temperature is more preferably 100 ° C. higher than T4, still more preferably 50 ° C. higher than T4, and particularly preferably T4 or lower.
- the breaking toughness value of the chemically strengthened glass is preferably 0.70 MPa ⁇ m 1/2 or more, more preferably 0.75 MPa ⁇ m 1/2 or more, still more preferably 0.80 MPa ⁇ m 1/2 or more. Particularly preferably, it is 0.83 MPa ⁇ m 1/2 or more.
- the fracture toughness value is usually 2.0 MPa ⁇ m 1/2 or less, and typically 1.5 MPa ⁇ m 1/2 or less. Due to the large fracture toughness value, even if a large surface compressive stress is introduced into the glass by chemical strengthening, severe crushing is unlikely to occur.
- the fracture toughness value can be measured using, for example, the DCDC method (Acta metall. Mater. Vol. 43, pp. 3453-3458, 1995).
- the Young's modulus of the chemically strengthened glass is preferably 80 GPa or more, more preferably 82 GPa or more, still more preferably 84 GPa or more, and particularly preferably 85 GPa or more because the glass is not easily crushed.
- the upper limit of the Young's modulus is not particularly limited, but glass having a high Young's modulus may have a low acid resistance. Therefore, for example, 110 GPa or less is preferable, more preferably 100 GPa or less, and further preferably 90 GPa or less. Young's modulus can be measured, for example, by the ultrasonic pulse method.
- the average linear thermal expansion coefficient (thermal expansion coefficient) of the present chemical strengthening glass at 50 to 350 ° C. is preferably 95 ⁇ 10 -7 / ° C. or less, more preferably 90 ⁇ , from the viewpoint of reducing warpage after chemical strengthening. It is 10-7 / ° C. or lower, more preferably 88 ⁇ 10-7 / ° C. or lower, particularly preferably 86 ⁇ 10-7 / ° C. or lower, and most preferably 84 ⁇ 10-7 / ° C. or lower.
- the lower limit of the coefficient of thermal expansion is not particularly limited, but since glass having a small coefficient of thermal expansion may be difficult to melt, the average linear thermal expansion coefficient (thermal expansion) of this chemically strengthened glass at 50 to 350 ° C.
- the coefficient is, for example, preferably 60 ⁇ 10 -7 / ° C. or higher, more preferably 70 ⁇ 10 -7 / ° C. or higher, still more preferably 74 ⁇ 10 -7 / ° C. or higher, and particularly preferably 76 ⁇ 10 -7 / ° C. It is above °C.
- the glass transition point (Tg) is preferably 500 ° C. or higher, more preferably 520 ° C. or higher, still more preferably 540 ° C. or higher, from the viewpoint of reducing warpage after chemical strengthening. In terms of easy float molding, it is preferably 750 ° C. or lower, more preferably 700 ° C. or lower, still more preferably 650 ° C. or lower, particularly preferably 600 ° C. or lower, and most preferably 580 ° C. or lower.
- This chemically strengthened glass can be manufactured by a normal method. For example, the raw materials for each component of glass are mixed and melted by heating in a glass melting kiln. Then, the glass is homogenized by a known method, formed into a desired shape such as a glass plate, and slowly cooled.
- the glass plate forming method examples include a float method, a pressing method, a fusion method and a downdraw method.
- the float method suitable for mass production is preferable.
- continuous molding methods other than the float method, for example, the fusion method and the down draw method are also preferable.
- the molded glass is ground and polished as necessary to form a glass substrate.
- the subsequent chemical strengthening treatment is performed. This is preferable because a compressive stress layer is also formed on the end face.
- the chemically strengthened glass may be crystallized glass (hereinafter, also referred to as “this crystallized glass”).
- the present crystallized glass is a crystallized glass having the glass composition of the present chemically strengthening glass described above.
- the present crystallized glass preferably contains at least one of lithium silicate crystal, lithium aluminosilicate crystal or lithium phosphate crystal, magnesium aluminosilicate crystal, magnesium silicate crystal, and silicate crystal.
- lithium silicate crystal lithium metasilicate crystal is more preferable.
- lithium aluminosilicate crystal petalite crystal, ⁇ -spodium crystal, ⁇ -eucryptite, and ⁇ -eucryptite are preferable.
- As the lithium phosphate crystal a lithium orthophosphate crystal is preferable.
- Crystallized glass containing lithium metasilicate crystals is more preferable in order to increase the transparency.
- Crystallized glass is obtained by heat-treating amorphous glass having the same composition as the chemically strengthened glass to crystallize it.
- the glass composition of crystallized glass is the same as that of amorphous glass.
- the crystallized glass has a visible light transmittance (total light visible light transmittance including diffused transmitted light) of preferably 85% or more when converted to a thickness of 700 ⁇ m, so that it can be used as a cover glass for a portable display. When used, the screen of the display is easy to see.
- the visible light transmittance is more preferably 88% or more, further preferably 90% or more. The higher the visible light transmittance is, the more preferable it is, but it is usually 93% or less.
- the visible light transmittance of ordinary amorphous glass is about 90% or more.
- the transmittance at 700 ⁇ m can be calculated from the measured transmittance using Lambert-Beer-Lambert's law.
- the thickness may be adjusted to 0.7 mm by polishing or etching, and the actual measurement may be performed.
- the haze value is preferably 1.0% or less, more preferably 0.4% or less, further preferably 0.3% or less, and 0.2% or less when converted to a thickness of 700 ⁇ m. It is particularly preferable, and 0.15% or less is most preferable.
- the haze value when the thickness is 700 ⁇ m is preferably 0.02% or more, more preferably 0.03% or more.
- the haze value is a value measured according to JIS K7136 (2000).
- the haze value H 0.7 in the case of 700 ⁇ m is calculated by the following formula.
- the thickness may be adjusted to 700 ⁇ m by polishing or etching and actually measured.
- the refractive index of the present crystallized glass is preferably 1.52 or more, more preferably 1.55 or more, still more preferably 1.57 or more at a wavelength of 590 nm.
- the crystallization rate of the crystallized glass is preferably 5% or more, more preferably 10% or more, further preferably 15% or more, and particularly preferably 20% or more in order to increase the mechanical strength. In order to increase the transparency, 70% or less is preferable, 60% or less is more preferable, and 50% or less is particularly preferable.
- the low crystallization rate is also excellent in that it can be easily bent and molded by heating.
- the crystallization rate can be calculated by the Rietveld method from the X-ray diffraction intensity.
- the Rietveld method is described in the "Crystal Analysis Handbook” (Kyoritsu Shuppan, 1999, pp. 492-499), edited by the editorial board of the "Crystal Analysis Handbook” of the Crystallographic Society of Japan.
- the average particle size of the precipitated crystals of the crystallized glass is preferably 80 nm or less, more preferably 60 nm or less, further preferably 50 nm or less, particularly preferably 40 nm or less, and most preferably 30 nm or less.
- the average particle size of the precipitated crystals is determined from a transmission electron microscope (TEM) image.
- the average particle size of the precipitated crystals can be estimated from a scanning electron microscope (SEM) image.
- the present chemically strengthened glass can be produced by subjecting the obtained glass plate to a chemically strengthened treatment, and then washing and drying.
- the chemical strengthening treatment can be performed by a known method.
- the glass plate is brought into contact with a melt of a metal salt (for example, potassium nitrate) containing a metal ion (typically K ion) having a large ionic radius by immersion or the like.
- a metal salt for example, potassium nitrate
- the metal ion having a small ion radius typically Na ion or Li ion
- the metal ion having a small ion radius typically Na ion or Li ion
- the glass plate becomes a metal ion having a large ion radius (typically, K ion or Li ion for Na ion).
- K ion or Li ion for Na ion typically, K ion or Li ion for Na ion.
- it is replaced with Na ion).
- the chemical strengthening treatment can be performed, for example, by immersing the glass plate in a molten salt such as potassium nitrate heated to 360 to 600 ° C. for 0.1 to 500 hours.
- a molten salt such as potassium nitrate heated to 360 to 600 ° C. for 0.1 to 500 hours.
- the heating temperature of the molten salt is preferably 375 to 500 ° C.
- the immersion time of the glass plate in the molten salt is preferably 0.3 to 200 hours, for example.
- Examples of the molten salt for performing the chemical strengthening treatment include nitrates, sulfates, carbonates, chlorides and the like.
- examples of the nitrate include lithium nitrate, sodium nitrate, potassium nitrate, cesium nitrate, silver nitrate and the like.
- examples of the sulfate include lithium sulfate, sodium sulfate, potassium sulfate, cesium sulfate, silver sulfate and the like.
- Examples of the carbonate include lithium carbonate, sodium carbonate, potassium carbonate and the like.
- examples of the chloride include lithium chloride, sodium chloride, potassium chloride, cesium chloride, silver chloride and the like.
- the treatment conditions of the chemically strengthened glass are the characteristics and composition of the glass, the type of molten salt, the entropy function S desired for the finally obtained chemically strengthened glass, the surface compressive stress and the depth of the compressive stress layer.
- Appropriate conditions may be selected in consideration of chemical strengthening characteristics such as glass.
- the chemical strengthening treatment may be performed only once, or the chemical strengthening treatment (multi-stage strengthening) may be performed a plurality of times under two or more different conditions.
- the chemical strengthening treatment is performed under the condition that the DOL is large and the CS is relatively small.
- the second stage of the chemical strengthening treatment when the chemical strengthening treatment is performed under the condition that the DOL is small and the CS is relatively high, the internal tensile stress area (St) is increased while increasing the CS on the outermost surface of the chemically strengthened glass. And the internal tensile stress (CT) can be suppressed low.
- the electronic device housing of the present invention includes the chemically strengthened glass of the present invention.
- Examples of the electronic device housing include a cover glass for the display surface of a mobile terminal, a cover glass for the back surface, and a cover glass for a display device such as a television (TV), a personal computer (PC), or a touch panel that is not intended to be carried. Can be mentioned.
- Example 1 Various glass raw materials were mixed and weighed to 400 g as glass. Then, the mixed raw materials were put into a platinum crucible, put into an electric furnace at 1500 to 1700 ° C., melted for about 3 hours, defoamed, and homogenized.
- FIG. 1 shows a graph showing the correlation between the radio wave transmission at a frequency of 10 GHz and the entropy function and the compressive stress for the glass whose radio wave transmission has increased due to chemical strengthening.
- the vertical axis of FIG. 1 is the total value of the relative permittivity changed before and after the chemical strengthening and the value obtained by multiplying the dielectric loss tangent by 100, and the horizontal axis is the parameter Z that can be calculated from the entropy function and the compressive stress before and after the chemical strengthening.
- the content of the alkali metal ion for calculating the entropy function was measured using EPMA (Electron Probe Micro Analoger, manufactured by JEOL: JXA-8500F).
- the measurement conditions of EPMA are an acceleration voltage of 15 kV, a probe current of 30 nA, and an integration time of 1000 msec. The interval was set to 1 ⁇ m as / point.
- Example 2 The glass raw materials were prepared so as to have the composition shown in the molar percentage display based on the oxide in Table 1, and weighed to 400 g as glass. Then, the mixed raw materials were put into a platinum crucible, put into an electric furnace at 1500 to 1700 ° C., melted for about 3 hours, defoamed, and homogenized.
- the obtained molten glass was poured into a metal mold, kept at a temperature about 50 ° C. higher than the glass transition point for 1 hour, and then cooled to room temperature at a rate of 0.5 ° C./min to obtain glass blocks.
- the obtained glass block was cut and ground, and finally both sides were mirror-polished to obtain a glass plate having a thickness (t) of 700 ⁇ m.
- the compressive stress and compressive stress layer depth DOL of the surface layer after chemical strengthening were measured using an optical waveguide surface stress meter FSM-6000 and a scattered photoelastic stress meter SLP-1000 manufactured by Orihara Seisakusho, and from the surface layer to 0.05 t ⁇ m.
- the average value of the compressive stress in the region of is described as the internal average chemical strengthening stress.
- the obtained sample was obtained by using EPMA (Electron Probe Micro Analyzer, manufactured by JEOL: JXA-8500F), and the content of alkali metal ions after chemical strengthening at a depth of 0.05 t from the glass surface.
- EPMA Electro Probe Micro Analyzer, manufactured by JEOL: JXA-8500F
- the content of alkali metal ions in the center of the plate thickness (center of the glass) was measured.
- the average value is shown in Table 2 as the amount of ions after strengthening and the amount of ions at the center of the plate thickness.
- the entropy function S was obtained from the obtained ion amount of the alkali metal element according to the following definition formula.
- the relative permittivity and tan ⁇ were measured by the slip-post dielectric resonance method (SPDR method) using a network analyzer.
- the measurement conditions were a temperature of 20 ° C. and a frequency of 10 GHz.
- Examples 5 to 7 which are comparative examples, since the amount of change in the entropy function before and after the chemical strengthening is small, the alkali fixing parameter Z is less than 0.65, and as a result, the chemical strengthening treatment is performed to make the relative permittivity. It can be confirmed that both the rate and the dielectric loss increase and the dielectric characteristics decrease.
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Abstract
Description
ガラスの中心部分のアルカリイオン量から算出されるエントロピー関数S1、ガラス表面から0.05tの深さまでの平均のアルカリイオン量から算出されるエントロピー関数S2、およびガラス表面から深さ0.05tまでの領域における圧縮応力の平均値X[単位:MPa]から以下の式で求められるZが0.65以上である化学強化ガラスである。
Z=(S2-S1)×10+X/1000
ただしエントロピー関数Sは、それぞれの深さにおけるLi2O、Na2OおよびK2Oの酸化物基準のモル百分率による含有量[Li2O]、[Na2O]および[K2O]から以下の式で求めるものとする。下記式において、[Li2O]、[Na2O]および[K2O]がゼロである場合は、1×10-4とする。
S=-[Li2O]/([Li2O]+[Na2O]+[K2O])log([Li2O]/([Li2O]+[Na2O]+[K2O]))-[Na2O]/([Li2O]+[Na2O]+[K2O])log([Na2O]/([Li2O]+[Na2O]+[K2O]))-[K2O]/([Li2O]+[Na2O]+[K2O])log([K2O]/([Li2O]+[Na2O]+[K2O]))
SiO2を40~80%、
B2O3を0~20%、
Al2O3を1~25%、
Li2Oおよび/またはNa2Oを合計で5~30%、含有することが好ましい。
母組成が、酸化物基準のモル百分率表示で、
SiO2を40~70%、
Al2O3を7.5~20%、
Li2Oを5~25%含有することが好ましい。
本発明の化学強化ガラスは、厚さがt(単位:μm)であり、周波数10GHzにおける比誘電率が7.0以下の化学強化ガラスであって、ガラスの中心部分のアルカリイオン量から算出されるエントロピー関数S1、ガラス表面から0.05tの深さまでの平均のアルカリイオン量から算出されるエントロピー関数S2、およびガラス表面から深さ0.05tまでの領域における圧縮応力の平均値X[MPa]から以下の式で求められるZが0.65以上である。Z=(S2-S1)×10+X/1000
S=-[Li2O]/([Li2O]+[Na2O]+[K2O])log([Li2O]/([Li2O]+[Na2O]+[K2O]))-[Na2O]/([Li2O]+[Na2O]+[K2O])log([Na2O]/([Li2O]+[Na2O]+[K2O]))-[K2O]/([Li2O]+[Na2O]+[K2O])log([K2O]/([Li2O]+[Na2O]+[K2O]))
前記1)化学強化前後でアルカリイオンの混合度が大きく変化していることについて、互いに異なる種類のアルカリ金属イオンがガラス中に存在して混合されていることにより、アルカリ金属イオン同士の交換が起こりにくくなり、比誘電率や誘電損失が低下し、誘電特性が向上すると考えられる。アルカリ金属イオンの混合度合いはエントロピー関数で表される。
前記2)化学強化後に高い圧縮応力が入っていることについて、圧縮応力が強いとアルカリ金属イオンの動きが抑制され、比誘電率や誘電損失が下がり、誘電特性が向上すると考えられる。
本化学強化ガラスは、以下に説明する化学強化用ガラス(以下、「本化学強化用ガラス」ともいう)を化学強化処理することにより製造できる。
本化学強化用ガラスは、ソーダ石灰ガラス、アルカリアルミノシリケートガラス、及びアルカリアルミノホウケイ酸ガラスのいずれかが好ましい。これらのガラスは化学強化処理に適している。
SiO2を40~80%、
B2O3を0~20%、
Al2O3を1~25%、
Li2Oおよび/またはNa2Oを合計で5~30%、含有することが好ましい。
SiO2を40~70%、
Al2O3を7.5~20%、
Li2Oを5~25%含有するものが好ましい。
本化学強化用ガラスは、結晶化ガラス(以下、「本結晶化ガラス」ともいう。)であってもよい。本結晶化ガラスは、上述した本化学強化用ガラスのガラス組成を有する結晶化ガラスである。
dH/dt∝exp(-αt/1000)×(1-H)
と表せる。
本化学強化ガラスは、得られたガラス板に化学強化処理を施した後、洗浄および乾燥することにより、製造できる。
本発明の電子機器筐体は、本発明の化学強化ガラスを含む。電子機器筐体としては、例えば、携帯端末の表示面のカバーガラス及び背面等のカバーガラス、携帯を目的としないテレビ(TV)、パーソナルコンピュータ(PC)又はタッチパネル等のディスプレイ装置のカバーガラス等が挙げられる。
各種ガラス原料を調合し、ガラスとして400gになるように秤量した。ついで、混合した原料を白金るつぼに入れ、1500~1700℃の電気炉に投入して3時間程度溶融し、脱泡し、均質化した。
表1に酸化物基準のモル百分率表示で示した組成となるようにガラス原料を調合し、ガラスとして400gになるように秤量した。ついで、混合した原料を白金るつぼに入れ、1500~1700℃の電気炉に投入して3時間程度溶融し、脱泡し、均質化した。
Z=(S2-S1)×10+X/1000
Claims (11)
- 厚さがt(単位:μm)であり、20℃、周波数10GHzにおける比誘電率が7.0以下の化学強化ガラスであって、
ガラスの中心部分のアルカリイオン量から算出されるエントロピー関数S1、ガラス表面から0.05tの深さまでの平均のアルカリイオン量から算出されるエントロピー関数S2、およびガラス表面から深さ0.05tまでの領域における圧縮応力の平均値X[単位:MPa]から以下の式で求められるZが0.65以上である化学強化ガラス。
Z=(S2-S1)×10+X/1000
ただしエントロピー関数Sは、それぞれの深さにおけるLi2O、Na2OおよびK2Oの酸化物基準のモル百分率による含有量[Li2O]、[Na2O]および[K2O]から以下の式で求めるものとする。下記式において、[Li2O]、[Na2O]および[K2O]がゼロである場合は、1×10-4とする。
S=-[Li2O]/([Li2O]+[Na2O]+[K2O])log([Li2O]/([Li2O]+[Na2O]+[K2O]))-[Na2O]/([Li2O]+[Na2O]+[K2O])log([Na2O]/([Li2O]+[Na2O]+[K2O]))-[K2O]/([Li2O]+[Na2O]+[K2O])log([K2O]/([Li2O]+[Na2O]+[K2O])) - 前記エントロピー関数S2から前記エントロピー関数S1を減じた値である(S2-S1)の値が0.04以上である請求項1に記載の化学強化ガラス。
- 20℃、周波数10GHzにおける誘電正接が0.02以下である請求項1または2に記載の化学強化ガラス。
- 母組成が、酸化物基準のモル百分率表示で、
SiO2を40~80%、
B2O3を0~20%、
Al2O3を1~25%、
Li2Oおよび/またはNa2Oを合計で5~30%、含有する請求項1~3のいずれか1項に記載の化学強化ガラス。 - 表面圧縮応力値CS0が300MPa以上である請求項1~4のいずれか1項に記載の化学強化ガラス。
- ガラス表面から0.05tの深さにおける内部化学強化応力CS0.05tが75MPa以上、かつ前記厚さtが300μm以上である請求項1~5のいずれか1項に記載の化学強化ガラス。
- 圧縮応力層深さDOLが70μm以上、かつ前記厚さtが350μm以上である請求項1~6のいずれか1項に記載の化学強化ガラス。
- リチウムアルミノシリケートガラスであり、
母組成が、酸化物基準のモル百分率表示で、
SiO2を40~70%、
Al2O3を7.5~20%、
Li2Oを5~25%含有する請求項1~7のいずれか1項に記載の化学強化ガラス。 - 前記厚さtが100μm以上2000μm以下である、請求項1~5および8のいずれか1項に記載の化学強化ガラス。
- 結晶化ガラスである請求項1~9のいずれか1項に記載の化学強化ガラス。
- 請求項1~10のいずれか1項に記載の化学強化ガラスを含む電子機器筐体。
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JP2020033202A (ja) * | 2018-08-27 | 2020-03-05 | Agc株式会社 | 結晶化ガラス基体、化学強化ガラス板、及びこれらの製造方法 |
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