WO2022215575A1 - 結晶化ガラスからなる化学強化ガラス及びその製造方法 - Google Patents
結晶化ガラスからなる化学強化ガラス及びその製造方法 Download PDFInfo
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- WO2022215575A1 WO2022215575A1 PCT/JP2022/014980 JP2022014980W WO2022215575A1 WO 2022215575 A1 WO2022215575 A1 WO 2022215575A1 JP 2022014980 W JP2022014980 W JP 2022014980W WO 2022215575 A1 WO2022215575 A1 WO 2022215575A1
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- Prior art keywords
- glass
- main surface
- chemically strengthened
- less
- strengthened glass
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- 239000011521 glass Substances 0.000 title claims abstract description 191
- 239000005345 chemically strengthened glass Substances 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000013078 crystal Substances 0.000 claims abstract description 64
- 238000001878 scanning electron micrograph Methods 0.000 claims abstract description 27
- 238000003426 chemical strengthening reaction Methods 0.000 claims description 37
- 238000005530 etching Methods 0.000 claims description 27
- 238000002834 transmittance Methods 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 claims description 22
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 20
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 18
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 13
- 238000002425 crystallisation Methods 0.000 claims description 10
- 230000008025 crystallization Effects 0.000 claims description 10
- 238000005728 strengthening Methods 0.000 claims description 7
- 239000005341 toughened glass Substances 0.000 claims 1
- 230000000007 visual effect Effects 0.000 abstract description 3
- 150000003839 salts Chemical class 0.000 description 14
- 238000005342 ion exchange Methods 0.000 description 13
- 239000011734 sodium Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 229910001415 sodium ion Inorganic materials 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- 239000006059 cover glass Substances 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 238000004031 devitrification Methods 0.000 description 7
- 238000000634 powder X-ray diffraction Methods 0.000 description 7
- 229910052708 sodium Inorganic materials 0.000 description 7
- 229910018119 Li 3 PO 4 Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229910001416 lithium ion Inorganic materials 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 6
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 description 6
- 229910006404 SnO 2 Inorganic materials 0.000 description 5
- 229910052681 coesite Inorganic materials 0.000 description 5
- 229910052906 cristobalite Inorganic materials 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 150000007522 mineralic acids Chemical class 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- 229910052682 stishovite Inorganic materials 0.000 description 5
- 229910052905 tridymite Inorganic materials 0.000 description 5
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- IIPYXGDZVMZOAP-UHFFFAOYSA-N lithium nitrate Chemical compound [Li+].[O-][N+]([O-])=O IIPYXGDZVMZOAP-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 229910001413 alkali metal ion Inorganic materials 0.000 description 3
- 150000001805 chlorine compounds Chemical class 0.000 description 3
- 239000006103 coloring component Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 239000006060 molten glass Substances 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 238000005191 phase separation Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 235000010333 potassium nitrate Nutrition 0.000 description 3
- 239000004323 potassium nitrate Substances 0.000 description 3
- 235000010344 sodium nitrate Nutrition 0.000 description 3
- 239000004317 sodium nitrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- NLSCHDZTHVNDCP-UHFFFAOYSA-N caesium nitrate Chemical compound [Cs+].[O-][N+]([O-])=O NLSCHDZTHVNDCP-UHFFFAOYSA-N 0.000 description 2
- FLJPGEWQYJVDPF-UHFFFAOYSA-L caesium sulfate Chemical compound [Cs+].[Cs+].[O-]S([O-])(=O)=O FLJPGEWQYJVDPF-UHFFFAOYSA-L 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 2
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002823 nitrates Chemical class 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910010100 LiAlSi Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000003991 Rietveld refinement Methods 0.000 description 1
- 229910018162 SeO2 Inorganic materials 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- 206010040925 Skin striae Diseases 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910000288 alkali metal carbonate Inorganic materials 0.000 description 1
- 150000008041 alkali metal carbonates Chemical class 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- AIYUHDOJVYHVIT-UHFFFAOYSA-M caesium chloride Chemical compound [Cl-].[Cs+] AIYUHDOJVYHVIT-UHFFFAOYSA-M 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- UBEWDCMIDFGDOO-UHFFFAOYSA-N cobalt(II,III) oxide Inorganic materials [O-2].[O-2].[O-2].[O-2].[Co+2].[Co+3].[Co+3] UBEWDCMIDFGDOO-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- VQCBHWLJZDBHOS-UHFFFAOYSA-N erbium(III) oxide Inorganic materials O=[Er]O[Er]=O VQCBHWLJZDBHOS-UHFFFAOYSA-N 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- YXJYBPXSEKMEEJ-UHFFFAOYSA-N phosphoric acid;sulfuric acid Chemical compound OP(O)(O)=O.OS(O)(=O)=O YXJYBPXSEKMEEJ-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- JPJALAQPGMAKDF-UHFFFAOYSA-N selenium dioxide Chemical compound O=[Se]=O JPJALAQPGMAKDF-UHFFFAOYSA-N 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical compound Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0009—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing silica as main constituent
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0018—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents
- C03C10/0027—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents containing SiO2, Al2O3, Li2O as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
Definitions
- the present invention relates to chemically strengthened crystallized glass and a method for producing the same.
- Chemically strengthened glass is used for the cover glass of mobile devices.
- the glass is brought into contact with a molten salt containing alkali metal ions, ion exchange occurs between the alkali metal ions in the glass and the alkali metal ions in the molten salt, and compressive stress is applied to the glass surface.
- a layer is formed.
- Amorphous glass containing Li 2 O or crystallized glass containing Li 2 O is particularly excellent as a base material for such chemically strengthened glass.
- the reason for this is that ion exchange between lithium ions contained in the base material and sodium ions contained in the strengthening salt tends to generate compressive stress deep within the chemically strengthened glass. Since lithium ions and sodium ions have relatively small ionic radii, their diffusion coefficients due to ion exchange are large.
- Amorphous glass and crystallized glass containing Li 2 O have a relatively high fracture toughness value and tend to be difficult to break.
- Crystallized glass is made by depositing crystals in glass, and is harder and more scratch-resistant than amorphous glass that does not contain crystals.
- chemically strengthenable crystallized glass can be made stronger than amorphous glass while preventing breakage.
- crystallized glasses often have insufficient transparency compared to amorphous glasses.
- Patent Documents 1 and 2 describe examples of chemically strengthening crystallized glass by ion exchange treatment.
- an object of the present invention is to provide chemically strengthened glass made of crystallized glass, which is excellent in transparency and chemical strengthening properties.
- the present invention is a chemically strengthened glass having a first main surface and a second main surface facing each other, which is made of crystallized glass containing crystals and residual glass, and has a surface compressive stress value (CS 0 ) of 450 MPa. and a compressive stress value (CS 50 ) at a depth of 50 ⁇ m from the surface is 150 MPa or more, and a plurality of non-through holes having an average diameter of 5 to 50 nm are formed in the first main surface and the second main surface.
- CS 0 surface compressive stress value
- CS 50 compressive stress value
- an average depth of the non-through holes measured by cross-sectional SEM images of the first main surface and the second main surface is 5 to 50 nm, and the first main surface and the second main surface 2, wherein the total area ratio of the non-through holes to the total viewing area of the surface SEM image on the main surface of 2 is 1 to 40%.
- Eg/Ec is preferably 0.1 to 0.0001, where Eg is the etching rate of the residual glass and Ec is the etching rate of the crystal.
- the chemically strengthened glass preferably contains 40 to 70% SiO 2 , 5 to 35% Li 2 O, and 1 to 20% Al 2 O 3 in terms of mol % based on oxides.
- the present chemically strengthened glass preferably has a crystallization rate of 10 to 90% by mass.
- the present chemically strengthened glass preferably has a reflectance of 10% or less on the first principal surface and the second principal surface.
- the chemically strengthened glass preferably has a light transmittance of 90% or more in terms of thickness of 700 ⁇ m before chemical strengthening.
- the chemically strengthened glass preferably has a plate thickness of 300 to 3000 ⁇ m.
- the present invention also provides a method for producing chemically strengthened glass, which comprises chemically strengthening the crystallized glass containing crystals and residual glass, and after the chemical strengthening, using a washing liquid having a pH of 2 to 12 to remove the crystallized glass. cleaning the surface, wherein the chemically strengthened glass has a first main surface and a second main surface facing each other, a surface compressive stress value (CS 0 ) of 450 MPa or more, and a depth from the surface Compressive stress value (CS 50 ) at 50 ⁇ m is 150 MPa or more, the first main surface and the second main surface have a plurality of non-through holes with an average diameter of 5 to 50 nm, and the first main surface The average depth of the non-through holes measured by cross-sectional SEM images of the surface and the second main surface is 5 to 50 nm, and the surface SEM images of the first main surface and the second main surface.
- the method for producing chemically strengthened glass, wherein the total area ratio of the non-through holes to the total viewing area is 1 to
- Eg/Ec is preferably 0.1 to 0.0001, where Eg is the etching rate of the residual glass and Ec is the etching rate of the crystal.
- the crystallized glass has a base composition of 40 to 70% SiO 2 , 5 to 35% Li 2 O, and Al 2 O 3 in terms of mol% based on oxides. It is preferable to contain 1 to 20%.
- the chemically strengthened glass of the present invention is crystallized glass having a plurality of non-through holes on both main surfaces, and the average diameter value, average depth value and total area ratio of the non-through holes are within specific ranges.
- the modulus is suppressed, showing excellent transparency, and high chemical strengthening properties can be realized.
- FIG. 1 are diagrams showing examples of surface SEM images.
- BRIEF DESCRIPTION OF THE DRAWINGS (a) is a figure which shows an example of the chemically strengthened glass of this invention, (b) is a figure which shows an example of the conventional chemically strengthened glass.
- (c) is an enlarged view of a portion surrounded by a dotted line in (a).
- FIG. 2 is a partial cross-sectional view conceptually showing the surface layer of one main surface in one embodiment of the present invention.
- (a) and (b) of FIG. 3 are diagrams showing examples of cross-sectional SEM images of the chemically strengthened glass of the present invention.
- amorphous glass refers to glass in which no diffraction peak indicating crystals is observed by the powder X-ray diffraction method described below.
- Crystalized glass is obtained by heat-treating "amorphous glass” to precipitate crystals, and contains crystals.
- amorphous glass and crystalstallized glass are sometimes collectively referred to as “glass”.
- Amorphous glass that becomes crystallized glass by heat treatment is sometimes referred to as "mother glass of crystallized glass”.
- the powder X-ray diffraction measurement for example, CuK ⁇ rays are used to measure the range of 2 ⁇ from 10° to 80°, and when a diffraction peak appears, the precipitated crystal is identified by the Hanawalt method.
- the crystal identified from the peak group including the peak with the highest integrated intensity is taken as the main crystal.
- SmartLab manufactured by Rigaku Corporation can be used as the measuring device.
- Residual glass refers to an amorphous portion that is not crystallized in crystallized glass.
- the diameter of non-through holes in chemically strengthened glass is determined by the following method.
- Non-through holes on the surface of the chemically strengthened glass are observed with a SEM (scanning electron microscope) from directly above each of the first main surface and the second main surface in plan view to obtain a 100,000-fold surface SEM image.
- SEM scanning electron microscope
- non-through holes and matrix portions are distinguished, the length of each non-through hole is determined as the diameter, and the average diameter value is calculated. do.
- the gray portion is the matrix portion without non-through holes
- the black portion is the non-through holes.
- (c) of FIG. 1 is an enlarged view of the portion surrounded by the dotted line in (a), and the length of the portion indicated by the white double-headed arrow is an example of the diameter of the non-through hole.
- the total area ratio of non-through holes in chemically strengthened glass is obtained by the following method.
- the chemically strengthened glass surface is observed by SEM in plan view to obtain a 100,000-fold surface SEM image. From the obtained surface SEM image, the non-through holes and the matrix portion are distinguished, and the ratio of the total area of the non-through holes to the total visual field area of the surface SEM image is obtained, which is defined as the total area ratio of the non-through holes.
- the depth of non-through holes is obtained by the following method.
- a 300,000-fold cross-sectional SEM image is obtained on the fractured surface of the chemically strengthened glass.
- non-through holes and matrix portions are discriminated, the depth of each non-through hole is obtained, and the average value of the depths is calculated.
- the length of the portion indicated by the black double-headed arrow is an example of the depth of the non-through hole.
- the "etching rate" (unit: nm/min) is obtained by measuring the amount of weight loss (nm) per time (1 minute) due to the etching process.
- the conditions for measuring the etching rate ratio are not particularly limited as long as the desired etching rate ratio is obtained.
- the etching solution used in the etching process is not particularly limited, but specific examples thereof include NaOH and HCl.
- chemically strengthened glass refers to glass after chemical strengthening treatment
- chemically strengthened glass refers to glass before chemical strengthening treatment
- the glass composition is represented by mol% based on oxides, and mol% is simply expressed as "%".
- substantially does not contain means that it is below the level of impurities contained in raw materials, etc., that is, it is not added intentionally. Specifically, it is less than 0.1%, for example.
- stress profile refers to the compressive stress value expressed with the depth from the glass surface as a variable.
- tensile stress is represented as negative compressive stress.
- the "compressive stress value (CS)" can be measured by slicing the cross section of the glass and analyzing the sliced sample with a birefringence imaging system.
- a birefringence imaging system birefringence stress meter is a device that measures the magnitude of retardation caused by stress using a polarizing microscope and a liquid crystal compensator. .
- CS can be measured by irradiating light from the glass surface and analyzing the polarization of the scattered light.
- a stress measuring instrument using scattered light photoelasticity for example, there is a scattered light photoelastic stress meter SLP-2000 manufactured by Orihara Seisakusho Co., Ltd.
- the “compressive stress layer depth (DOL)” is the depth at which the compressive stress value is zero.
- the surface compressive stress value is sometimes referred to as CS 0
- the compressive stress value at a depth of 50 ⁇ m as CS 50 .
- CT internal tensile stress
- Light transmittance refers to the average transmittance of light with a wavelength of 380 nm to 780 nm. Also, the "haze value” is measured according to JIS K7136:2000 using a halogen lamp C light source.
- Reflectance as used herein is defined based on JIS Z8701 (1999). A D65 light source is used as the light source.
- Frracture toughness value is a value obtained by the IF method specified in JIS R1607:2015.
- drop strength is measured by the following method.
- a 120 x 60 x 0.6 mmt glass sample is fitted into a structure whose mass and rigidity are adjusted to the size of a general smart phone, and after preparing a pseudo smart phone, it is allowed to fall freely on #180 SiC sandpaper.
- the drop height if it is dropped from a height of 5 cm and does not crack, the work of raising the height by 5 cm and dropping it again is repeated until it cracks, and the average value of 10 pieces of height when it cracks for the first time is measured.
- the chemically strengthened glass of the present invention (hereinafter also abbreviated as the present chemically strengthened glass) is typically a plate-like glass article, and may be flat or curved. Also, there may be portions with different thicknesses.
- the thickness (t) of the present chemically strengthened glass in the form of a plate is preferably 3000 ⁇ m or less, more preferably 2000 ⁇ m or less, 1600 ⁇ m or less, 1100 ⁇ m or less, 900 ⁇ m or less, 800 ⁇ m or less, and 700 ⁇ m or less in stages. .
- the thickness (t) is preferably 300 ⁇ m or more, more preferably 400 ⁇ m or more, and still more preferably 500 ⁇ m or more so that sufficient strength can be obtained by the chemical strengthening treatment.
- This chemically strengthened glass preferably has a surface compressive stress value (CS 0 ) of 450 MPa or more because it is less likely to break due to deformation such as bending.
- CS 0 is more preferably 500 MPa or more, and even more preferably 600 MPa or more.
- the higher the CS 0 the higher the strength, but if it is too large, there is a risk of severe crushing when it breaks, so it is preferably 1100 MPa or less, more preferably 900 MPa or less.
- the chemically strengthened glass has a compressive stress value (CS 50 ) of 150 MPa or more at a depth of 50 ⁇ m from the surface, the chemically strengthened glass when a mobile terminal or the like having the chemically strengthened glass as a cover glass is dropped. It is preferable because it is easy to suppress the cracking of.
- CS50 is more preferably 180 MPa or higher, more preferably 200 MPa or higher. The higher the CS50 , the higher the strength. However, if the CS50 is too large, severe crushing may occur when cracked, so 300 MPa or less is preferable, and 270 MPa or less is more preferable.
- the chemically strengthened glass has a DOL of 90 ⁇ m or more because it is less likely to break even if the surface is scratched.
- DOL is more preferably 95 ⁇ m or more, still more preferably 100 ⁇ m or more, and particularly preferably 110 ⁇ m or more. The larger the DOL, the less likely it is to break even if it is scratched, but in chemically strengthened glass, tensile stress is generated inside according to the compressive stress formed near the surface, so it cannot be made extremely large.
- the DOL is preferably t/4 or less, more preferably t/5 or less.
- DOL is preferably 200 ⁇ m or less, more preferably 180 ⁇ m or less, in order to shorten the time required for chemical strengthening.
- the present chemically strengthened glass preferably has a compressive stress value CS t / 2 at a depth t / 2 from the surface of ⁇ 120 MPa or more, more preferably ⁇ 115 MPa or more, further preferably ⁇ 110 MPa or more.
- CS t/2 is ⁇ 120 MPa or more, explosive cracking can be prevented when the glass is scratched.
- the upper limit of CS t/2 is not particularly limited, it is preferably -80 MPa or less, for example, in order to maintain sufficient compressive stress.
- FIG. 2 shows a partial cross-sectional view conceptually showing an example of one main surface.
- the chemically strengthened glass 24 has non-through holes 22, so that unevenness is formed on the surface of the chemically strengthened glass made of crystallized glass. Reflection on the surface of the chemically strengthened glass is suppressed by increasing the refractive index and decreasing the refractive index, so that the transmittance is improved.
- the average diameter of non-through holes is preferably 5 to 50 nm, more preferably 8 to 40 nm, still more preferably 10 to 30 nm. That is, the average diameter of non-through holes is preferably 5 nm or more, more preferably 8 nm or more, and even more preferably 10 nm or more.
- the average diameter of non-through holes is preferably 50 nm or less, more preferably 40 nm or less, and even more preferably 30 nm or less.
- the average diameter of the non-through holes is 5 nm or more, the reflectance on the main surface can be reduced and the transparency can be improved. Further, when the average diameter of the non-through holes exceeds 50 nm, the depth of the holes approaches the wavelength of light, scattering increases and the transmittance decreases.
- the present chemically strengthened glass has an average depth of non-through holes of 5 to 50 nm, preferably 8 to 40 nm, more preferably 8 to 40 nm, as measured by cross-sectional SEM images on the first and second main surfaces. is between 10 and 30 nm. That is, the average depth of non-through holes is preferably 5 nm or more, more preferably 8 nm or more, and even more preferably 10 nm or more. The average depth of non-through holes is preferably 50 nm or less, more preferably 40 nm or less, and even more preferably 30 nm or less.
- the refractive index in the vicinity of the glass surface is effectively lowered, thereby lowering the reflectance and improving the transparency.
- the average depth value exceeds 50 nm, the average depth value of the non-through holes approaches the wavelength of light, scattering increases and the transmittance decreases.
- the shape of the non-through hole observed in the cross-sectional SEM image is not particularly limited, and examples thereof include a circular shape, a semicircular shape, and a rectangular shape.
- the total area ratio of non-through holes to the total viewing area of the surface SEM image is 1 to 40%, preferably 1 to 30%, more preferably 2 to 20%. That is, the total area ratio of non-through holes is preferably 1% or more, more preferably 2% or more. Also, the total area ratio of non-through holes is preferably 40% or less, more preferably 30% or less, and even more preferably 20% or less. When the total area ratio of the non-through holes is 1% or more, the area ratio of the glass on the main surface of the glass can be increased, the reflectance can be lowered, and the transparency can be improved. If the total area ratio of non-through holes exceeds 40%, scattering on the surface increases and the transmittance decreases.
- the distribution of the non-through holes on the first main surface and the second main surface of the present chemically strengthened glass is not particularly limited, it is preferably uniform from the viewpoint of improving transparency.
- the present chemically strengthened glass preferably has a reflectance of 10% or less on the first principal surface and the second principal surface, more preferably 9% or less, and even more preferably 8% or less. Excellent transparency is exhibited by having a reflectance of 10% or less on the first principal surface and the second principal surface. Although the lower limit of the reflectance is not particularly limited, it is typically 5% or more.
- the haze value of the present chemically strengthened glass is preferably 1.0% or less, more preferably 0.8% or less, further preferably 0.6% or less, and 0.4% or less when the thickness is 700 ⁇ m. is particularly preferred, and 0.2% or less is most preferred. Although the haze value is preferably as small as possible, it is usually 0.01% or more.
- the chemically strengthened glass preferably has a drop strength of 160 cm or more, more preferably 170 cm or more, and even more preferably 180 cm or more, as measured by the method described above.
- the drop strength of 160 cm or more makes it easy to suppress breakage of the chemically strengthened glass when a mobile terminal or the like having the chemically strengthened glass as a cover glass is dropped.
- the upper limit of the drop strength is not particularly limited, it is typically 300 cm or less.
- the mother composition of the present chemically strengthened glass preferably contains SiO 2 , Li 2 O and Al 2 O 3 .
- This chemically strengthened glass is expressed in mol% based on oxides in the mother composition, 40-70% SiO2 , Li 2 O from 5 to 35%, It is more preferable to contain 1 to 20% of Al 2 O 3 .
- SiO2 10-30% Li 2 O, 1-15% Al 2 O 3 ; 0-5 % of P2O5 ; 0-8 % ZrO2, 0-10% MgO, 0-5 % of Y2O3 0-10% of B2O3 , 0-5% Na 2 O; 0-5% K2O , More preferably, 0-2% SnO 2 is contained.
- the base composition of chemically strengthened glass refers to the composition of crystallized glass before chemical strengthening. This composition will be described later.
- the composition of this chemically strengthened glass has a composition similar to that of crystallized glass before tempering as a whole, except when extreme ion exchange treatment is performed.
- the composition of the deepest part from the glass surface is the same as the composition of the crystallized glass before tempering, except for the case of extreme ion exchange treatment.
- This chemically strengthened glass is also useful as a cover glass for use in electronic devices such as mobile devices such as mobile phones and smart phones. Furthermore, it is also useful for cover glass of electronic devices such as televisions, personal computers, and touch panels that are not intended for portability, walls of elevators, walls of buildings such as houses and buildings (full-surface displays). It is also useful as building materials such as window glass, table tops, interiors of automobiles, airplanes, etc., cover glasses thereof, and housings having curved surfaces.
- the present chemically strengthened glass is crystallized glass containing crystals and residual glass (hereinafter also referred to as the present crystallized glass). Since the glass is crystallized glass containing crystals and residual glass, the crystals in the surface layer of the glass are eluted by the cleaning treatment described later, and non-through holes are formed.
- Eg/Ec is preferably 0.1 to 0.0001, more preferably 0.05, where Eg is the etching rate of the residual glass and Ec is the etching rate of the crystal. 0.0005, more preferably 0.01 to 0.001. That is, Eg/Ec is preferably 0.0001 or more, more preferably 0.0005 or more, and even more preferably 0.001 or more. Eg/Ec is preferably 0.1 or less, more preferably 0.05 or less, and even more preferably 0.01 or less. When Eg/Ec is 0.1 to 0.0001, the crystals existing on the surface of the crystallized glass are eluted, and non-through holes are likely to occur, thereby improving the transparency.
- the present crystallized glass preferably contains at least one selected from Li 3 PO 4 crystals, LiAlSi 4 O 10 crystals, Li 2 Si 2 O 5 crystals, and Li 4 SiO 4 crystals. It is more preferable to contain at least one selected from 4 O 10 crystals and Li 2 Si 2 O 5 crystals.
- the present crystallized glass may contain these solid solution crystals. Since these crystals have a relatively high etching rate, the crystals existing on the surface of the crystallized glass are easily eluted by the cleaning treatment described later, and non-through holes are likely to be formed, thereby improving the transparency.
- the strongest diffraction peak preferably appears at 22.3° ⁇ 0.2 or 23.1° ⁇ 0.2. .
- the crystallization rate of the present crystallized glass is preferably 10% by mass or more, more preferably 15% by mass or more, and even more preferably 20% by mass or more, in order to increase the mechanical strength.
- the crystallization rate is preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less.
- a low crystallinity is excellent in that it is easy to heat and bend.
- the average grain size of precipitated crystals of the present crystallized glass is preferably 5 nm or more, particularly preferably 10 nm or more, in order to increase the strength. In order to improve transparency, it is preferably 80 nm or less, more preferably 60 nm or less, even more preferably 50 nm or less, particularly preferably 40 nm or less, and most preferably 30 nm or less.
- the average grain size of precipitated crystals is obtained from a transmission electron microscope (TEM) image.
- the thickness (t) is preferably 3000 ⁇ m or less, more preferably 2000 ⁇ m or less, 1600 ⁇ m or less, 1100 ⁇ m or less, 900 ⁇ m or less, 800 ⁇ m or less, and 700 ⁇ m or less in stages. .
- the thickness (t) is preferably 300 ⁇ m or more, more preferably 400 ⁇ m or more, and still more preferably 500 ⁇ m or more so that sufficient strength can be obtained by the chemical strengthening treatment.
- the light transmittance of this crystallized glass before chemical strengthening is 85% or more when the thickness is 700 ⁇ m, which is preferable because the display screen is easy to see when used as a cover glass for a portable display.
- the light transmittance is more preferably 88% or higher, still more preferably 90% or higher, and particularly preferably 92% or higher. The higher the light transmittance, the better, but it is usually 95% or less.
- the thickness is 700 ⁇ m, the light transmittance of 90% is comparable to ordinary amorphous glass.
- the light transmittance of this crystallized glass after chemical strengthening is 88% or more when the thickness is 700 ⁇ m, which is preferable because the display screen is easy to see when used as a cover glass for a portable display.
- the light transmittance is more preferably 90% or higher, still more preferably 91% or higher, and particularly preferably 92% or higher. The higher the light transmittance, the better, but it is usually 95% or less.
- the thickness is 700 ⁇ m, the light transmittance of 90% is comparable to ordinary amorphous glass.
- the light transmittance at 700 ⁇ m can be calculated from the Lambert-Beer law based on the measured values.
- the total visible light transmittance of the present glass with a plate thickness t [ ⁇ m] is 100 ⁇ T [%] and the surface reflectance on one side is 100 ⁇ R [%]
- X ⁇ Y represents XY.
- the surface reflectance may be obtained by calculation from the refractive index, or may be actually measured. If the plate thickness t is greater than 700 ⁇ m, the visible light transmittance may be measured after adjusting the plate thickness to 700 ⁇ m by polishing, etching, or the like.
- the haze value of the present crystallized glass before chemical strengthening is preferably 0.5% or less, more preferably 0.4% or less, and even more preferably 0.3% or less when the thickness is 700 ⁇ m. , 0.2% or less is particularly preferred, and 0.15% or less is most preferred.
- the haze value is preferably as small as possible, it is usually 0.01% or more. At a thickness of 700 ⁇ m, a haze value of 0.02% is comparable to ordinary amorphous glass.
- H 0.7 100 ⁇ [1 ⁇ (1 ⁇ H) ⁇ ((1 ⁇ R) 2 ⁇ T 0.7 )/((1 ⁇ R) 2 ⁇ T) ⁇ ][%] If the plate thickness t is greater than 700 ⁇ m, the haze value may be measured after adjusting the plate thickness to 700 ⁇ m by polishing, etching, or the like.
- the present crystallized glass has a high fracture toughness value, and even if a large compressive stress is formed by chemical strengthening, severe fracture is unlikely to occur.
- the fracture toughness value of the present crystallized glass is preferably 0.81 MPa ⁇ m 1/2 or more, more preferably 0.84 MPa ⁇ m 1/2 or more, still more preferably 0.87 MPa ⁇ m 1/2 or more. , a glass with high impact resistance is obtained.
- the upper limit of the fracture toughness value of the present crystallized glass is not particularly limited, it is typically 1.5 MPa ⁇ m 1/2 or less.
- the Young's modulus of the present crystallized glass is preferably 80 GPa or higher, more preferably 85 GPa or higher, still more preferably 90 GPa or higher, and particularly preferably 95 GPa or higher, so that warping can be suppressed during chemical strengthening treatment.
- This crystallized glass may be polished before use.
- the Young's modulus is preferably 130 GPa or less, more preferably 120 GPa or less, and even more preferably 110 GPa or less.
- This crystallized glass is obtained by heating and crystallizing amorphous glass, which will be described later.
- the present crystallized glass preferably contains SiO 2 , Li 2 O and Al 2 O 3 .
- This crystallized glass is expressed in mol % based on oxides, 40-70% SiO2 , Li 2 O from 5 to 35%, It is more preferable to contain 1 to 20% of Al 2 O 3 .
- This crystallized glass is expressed in mol % based on oxides, 50-70% SiO2 , 10-30% Li 2 O, 1-15% Al 2 O 3 ; 0-5 % of P2O5 ; 0-8 % ZrO2, 0-10% MgO, 0-5 % of Y2O3 0-10% of B2O3 , 0-5% Na 2 O; 0-5% K2O , More preferably, 0-2% SnO 2 is contained.
- the total amount of SiO 2 , Al 2 O 3 , P 2 O 5 and B 2 O 3 is preferably 60 to 80% in terms of mol % based on oxides.
- SiO 2 , Al 2 O 3 , P 2 O 5 and B 2 O 3 are glass network formers (hereinafter also abbreviated as NWF).
- NWF glass network formers
- a large total amount of these NWFs increases the strength of the glass.
- the total amount of NWFs is preferably 60% or more, more preferably 63% or more, and particularly preferably 65% or more, because it increases the fracture toughness value of the crystallized glass.
- glass with too much NWF has a high melting temperature and is difficult to manufacture.
- NWF Li 2 O, Na 2 O and K 2 O are network modifiers, and lowering the ratio to NWF increases the voids in the network and thus improves the impact resistance. Therefore, NWF is preferably 0.60 or less, more preferably 0.55 or less, and particularly preferably 0.50 or less. On the other hand, since these are components necessary for chemical strengthening, NWF is preferably 0.20 or more, more preferably 0.25 or more, and particularly preferably 0.30 or more, in order to improve chemical strengthening properties.
- the composition of the present crystallized glass is described below.
- SiO2 is a component that forms the network structure of the glass. Also, it is a component that lowers the etching rate of the residual glass.
- the content of SiO 2 is preferably 40% or more.
- the content of SiO 2 is more preferably 48% or more, even more preferably 50% or more, particularly preferably 52% or more, very preferably 54% or more.
- the content of SiO 2 is preferably 70% or less, more preferably 68% or less, even more preferably 66% or less, and particularly preferably 64% or less in order to improve meltability.
- Li 2 O is a component that forms surface compressive stress by ion exchange, and is essential because it is a constituent component of the main crystal.
- the content of Li 2 O is preferably 5% or more, more preferably 10% or more, more preferably 15% or more, still more preferably 18% or more, particularly preferably 20% or more, and most preferably 22% or more.
- the content of Li 2 O is preferably 35% or less, more preferably 32% or less, still more preferably 30% or less, particularly preferably 28% or less, and most preferably 26% or less. is.
- Al 2 O 3 is a component that increases the surface compressive stress due to chemical strengthening and lowers the etching rate of residual glass, and is essential.
- the content of Al 2 O 3 is preferably 1% or more, more preferably 2% or more, still more preferably 3% or more, 5% or more, 5.5% or more, 6% or more, particularly preferably 6% or more. .5% or more, most preferably 7% or more.
- the content of Al 2 O 3 is preferably 20% or less, more preferably 15% or less, still more preferably 12% or less, and particularly preferably 10% or less, in order to prevent the devitrification temperature of the glass from becoming too high. 9% or less is most preferred.
- P 2 O 5 is not essential, it is essential when obtaining crystallized glass containing Li 3 PO 4 crystals because it is a constituent component of Li 3 PO 4 crystals.
- the content of P 2 O 5 is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, particularly preferably 2% or more, and extremely preferably, in order to promote crystallization. is 2.5% or more.
- the P 2 O 5 content is too high , the phase separation tends to occur during melting and the acid resistance is significantly lowered. It is 8% or less, more preferably 4.5% or less, and particularly preferably 4.2% or less.
- ZrO 2 is a component that increases the mechanical strength and lowers the etching rate of residual glass, and is preferably contained because it significantly improves CS.
- the content of ZrO2 is preferably 0.5% or more, more preferably 1% or more, even more preferably 1.5% or more, particularly preferably 2% or more, most preferably 2.5% or more. is.
- ZrO2 is preferably 8 % or less, more preferably 5% or less, even more preferably 4% or less, even more preferably 3.5% or less, and 3% or less. Especially preferred. If the content of ZrO 2 is too high, the devitrification temperature increases and the viscosity decreases.
- the ZrO 2 content is preferably 5% or less, more preferably 4.5% or less, and 3.5% or less. More preferred.
- MgO is a component that stabilizes the glass and also a component that enhances mechanical strength and chemical resistance. Therefore, it is preferable to contain MgO when the Al 2 O 3 content is relatively small.
- the content of MgO is preferably 1% or more, more preferably 2% or more, still more preferably 3% or more, and particularly preferably 4% or more.
- MgO is 7% or less.
- Y 2 O 3 is a component that has the effect of making it difficult for fragments to scatter when the chemically strengthened glass is broken, and may be contained.
- the content of Y 2 O 3 is preferably 1% or more, more preferably 1.5% or more, still more preferably 2% or more, particularly preferably 2.5% or more, and extremely preferably 3% or more.
- the content of Y 2 O 3 is preferably 5% or less, more preferably 4% or less.
- B 2 O 3 is a component that improves the chipping resistance of chemically strengthened glass or chemically strengthened glass and improves the meltability, and may be contained.
- the content is preferably 0.5% or more, more preferably 1% or more, and still more preferably 2% or more, in order to improve meltability.
- the content of B 2 O 3 is more preferably 8% or less, still more preferably 6% or less, and particularly preferably 4% or less.
- Na 2 O is a component that improves the meltability of glass.
- Na 2 O is not essential, but when it is included, it is preferably 0.5% or more, more preferably 1% or more, and particularly preferably 2% or more. Too much Na 2 O makes it difficult for crystals such as Li 3 PO 4 , which is the main crystal, to precipitate, or deteriorates the chemical strengthening properties .
- the following is more preferable, 4% or less is still more preferable, and 3.5% or less is particularly preferable.
- K 2 O is a component that lowers the melting temperature of the glass and may be contained.
- the content is preferably 0.5% or more, more preferably 1% or more, still more preferably 1.5% or more, and particularly preferably 2% or more. If the amount of K 2 O is too large, the chemical strengthening properties are lowered, or an increase in the etching rate of residual glass is suppressed. It is preferably 3% or less, most preferably 2.5% or less.
- the total content of Na 2 O and K 2 O, Na 2 O+K 2 O is preferably 1% or more, more preferably 2% or more, in order to improve the meltability of the glass raw material.
- K 2 O/R 2 O of the K 2 O content to the total content of Li 2 O, Na 2 O and K 2 O (hereinafter referred to as R 2 O) is 0.2 or less. It is preferable because it can enhance the strengthening property and reduce the etching rate of the residual glass. K 2 O/R 2 O is more preferably 0.15 or less, even more preferably 0.10 or less.
- the R 2 O content is preferably 10% or more, more preferably 15% or more, and even more preferably 20% or more. Also, R 2 O is preferably 29% or less, more preferably 26% or less.
- ZrO 2 /R 2 O is preferably 0.02 or more, more preferably 0.03 or more, still more preferably 0.04 or more, and 0.1 or more. It is particularly preferred, and 0.15 or more is most preferred.
- ZrO 2 /R 2 O is preferably 0.6 or less, more preferably 0.5 or less, still more preferably 0.4 or less, and particularly 0.3 or less. preferable.
- TiO 2 is a component that can promote crystallization and may be contained. TiO 2 is not essential, but if it is included, it is preferably 0.2% or more, more preferably 0.5% or more. On the other hand, in order to suppress devitrification during melting, the content of TiO 2 is preferably 4% or less, more preferably 2% or less, and even more preferably 1% or less.
- BaO, SrO, MgO, CaO and ZnO are all components that improve the meltability of the glass and may be contained.
- the total content of BaO, SrO, MgO, CaO and ZnO (hereinafter, BaO + SrO + MgO + CaO + ZnO) is preferably 0.5% or more, more preferably 1% or more, and still more preferably 1.5% 2% or more, particularly preferably 2% or more.
- the content of BaO+SrO+MgO+CaO+ZnO is preferably 8% or less, more preferably 6% or less, still more preferably 5% or less, and particularly preferably 4% or less, because the ion exchange rate decreases.
- BaO, SrO, and ZnO may be contained in order to improve the light transmittance of the crystallized glass by improving the refractive index of the residual glass and bring it closer to the precipitated crystal phase, thereby lowering the haze value.
- the total content of BaO, SrO and ZnO (hereinafter, BaO + SrO + ZnO) is preferably 0.3% or more, more preferably 0.5% or more, still more preferably 0.7% or more, and particularly 1% or more. preferable.
- these components may reduce the ion exchange rate.
- BaO+SrO+ZnO is preferably 2.5% or less, more preferably 2% or less, even more preferably 1.7% or less, and particularly preferably 1.5% or less.
- La 2 O 3 , Nb 2 O 5 and Ta 2 O 5 are all components that make it difficult for fragments to scatter when the chemically strengthened glass is broken, and may be contained in order to increase the refractive index.
- the total content of La 2 O 3 , Nb 2 O 5 and Ta 2 O 5 (hereinafter referred to as La 2 O 3 +Nb 2 O 5 +Ta 2 O 5 ) is preferably 0.5% or more. more preferably 1% or more, still more preferably 1.5% or more, and particularly preferably 2% or more.
- La 2 O 3 +Nb 2 O 5 +Ta 2 O 5 is preferably 4% or less, more preferably 3% or less, still more preferably 2% or less, so that the glass is less likely to devitrify during melting. It is preferably 1% or less.
- CeO 2 may suppress coloration by oxidizing the glass.
- the content is preferably 0.03% or more, more preferably 0.05% or more, and even more preferably 0.07% or more.
- the content of CeO 2 is preferably 1.5% or less, more preferably 1.0% or less, in order to increase transparency.
- coloring component When the present chemically strengthened glass is colored and used, a coloring component may be added within a range that does not hinder the achievement of desired chemical strengthening properties.
- coloring components include Co3O4 , MnO2 , Fe2O3 , NiO , CuO , Cr2O3 , V2O5 , Bi2O3 , SeO2 , Er2O3 , Nd2O . 3 is mentioned.
- the total content of coloring components is preferably in the range of 1% or less. If it is desired to increase the visible light transmittance of the glass, it is preferred that these components are not substantially contained.
- SO 3 , chlorides, and fluorides may be appropriately contained as clarifiers and the like when melting the glass.
- 2 O 3 is preferably not contained.
- Sb 2 O 3 is contained, it is preferably 0.3% or less, more preferably 0.1% or less, and most preferably not contained.
- the method for producing chemically strengthened glass of the present invention includes chemically strengthening the crystallized glass containing crystals and residual glass, and washing the crystallized glass.
- Such a manufacturing method preferably comprises chemically strengthening a crystallized glass containing crystals and residual glass, and washing the surface of the crystallized glass with a washing liquid having a pH of 2 to 12 after the chemical strengthening.
- the crystallized glass is produced by heat-treating an amorphous glass having the same composition to crystallize it.
- Amorphous glass can be produced, for example, by the following method.
- the manufacturing method described below is an example in the case of manufacturing plate-shaped chemically strengthened glass.
- the glass raw materials are mixed so that a glass with the desired composition can be obtained, and then heated and melted in a glass melting kiln. Thereafter, the molten glass is homogenized by bubbling, stirring, addition of a clarifier, etc., formed into a glass plate having a predetermined thickness by a known forming method, and slowly cooled. Alternatively, the molten glass may be formed into a block, cooled slowly, and then cut into a plate.
- Crystallized glass is obtained by heat-treating the amorphous glass obtained by the above procedure.
- the heat treatment may be a two-stage heat treatment in which the temperature is raised from room temperature to the first treatment temperature and held for a certain period of time, and then held at a second treatment temperature higher than the first treatment temperature for a certain period of time.
- a one-step heat treatment of cooling to room temperature after holding at a specific treatment temperature may be used.
- the first treatment temperature is preferably a temperature range in which the crystal nucleation rate increases in the glass composition
- the second treatment temperature is a temperature range in which the crystal growth rate increases in the glass composition. is preferred.
- the crystallized glass obtained by the above procedure is ground and polished as necessary to form a crystallized glass plate.
- a crystallized glass plate is cut into a predetermined shape and size or chamfered, if the cutting or chamfering is performed before the chemical strengthening treatment, the compressive stress will also be applied to the end face due to the subsequent chemical strengthening treatment. It is preferred because layers are formed.
- the glass is brought into contact with a metal salt by a method such as immersion in a melt of a metal salt (eg, potassium nitrate) containing metal ions with a large ionic radius (typically, Na ions or K ions). Therefore, metal ions with a small ionic radius (typically Na ions or Li ions) in the glass are metal ions with a large ionic radius (typically Na ions or K ions for Li ions). , and K ions for Na ions).
- Li-Na exchange which exchanges Li ions in the glass with Na ions.
- Na--K exchange in which Na ions in the glass are exchanged for K ions.
- molten salts for chemical strengthening include nitrates, sulfates, carbonates, and chlorides.
- nitrates include lithium nitrate, sodium nitrate, potassium nitrate, cesium nitrate, and silver nitrate.
- Sulfates include, for example, lithium sulfate, sodium sulfate, potassium sulfate, cesium sulfate, and silver sulfate.
- Carbonates include, for example, lithium carbonate, sodium carbonate, potassium carbonate and the like.
- Chlorides include, for example, lithium chloride, sodium chloride, potassium chloride, cesium chloride, and silver chloride. These molten salts may be used alone, or may be used in combination.
- the time and temperature can be selected in consideration of the glass composition and the type of molten salt.
- the present crystallized glass may be chemically strengthened at 450° C. or less for preferably 1 hour or less.
- a molten salt containing 0.3% by mass of Li and 99.7% by mass of Na at 450° C. (for example, a mixed salt of lithium nitrate and sodium nitrate) is preferably heated for 0.5 hours.
- a treatment that is immersed to a certain extent can be mentioned.
- a metal salt containing K ions eg, potassium nitrate
- K ions eg, potassium nitrate
- a large compressive stress is generated in the compressive stress layer formed by the previous process, for example, within a depth of about 10 ⁇ m.
- a stress profile with a large surface compressive stress value is likely to be obtained.
- a plurality of non-through holes are formed in both main surfaces of the chemically strengthened glass by washing the chemically strengthened glass obtained by the chemical strengthening treatment.
- the cleaning treatment is performed by immersing the chemically strengthened glass in a cleaning liquid.
- the pH of the washing solution is preferably 2-12, more preferably 2.5-11, still more preferably 3-10.
- the cleaning treatment time is appropriately determined in consideration of the pH and composition of the cleaning solution, the etching rate of the crystallized glass, etc. so that the average diameter value, average depth value and total area ratio of the non-through holes to be formed are within the desired ranges. Although it can be adjusted, it is generally preferably 5 minutes to 48 hours, more preferably 10 minutes to 36 hours, still more preferably 30 minutes to 24 hours.
- the temperature of the cleaning liquid is not particularly limited, and is used at room temperature (15°C) to 100°C. If the temperature exceeds 100° C., the water in the cleaning liquid may boil, which is inconvenient for the cleaning operation and is not preferred.
- drying may be performed. Examples of the drying method include a method of blowing hot air and a method of blowing compressed air.
- cleaning solutions include acidic or alkaline cleaning solutions.
- the acidic cleaning liquid preferably contains an organic acid and an inorganic acid.
- the organic acid contained in the acidic cleaning solution include organic carboxylic acids such as citric acid and ascorbic acid, and organic phosphonic acids, with citric acid being preferred.
- the inorganic acid contained in the acidic cleaning solution include hydrochloric acid, phosphoric acid sulfate, nitric acid, and hydrofluoric acid, with hydrochloric acid being preferred.
- salts of these acids may be added together with the inorganic acids in order to suppress fluctuations in pH.
- Preferred combinations of organic and inorganic acids include, for example, citric acid and hydrochloric acid.
- the alkaline cleaning solution contains a base, and may contain a surfactant and a chelating agent in addition to the base.
- Examples of the base contained in the alkaline cleaning solution include alkali metal compounds such as alkali metal hydroxides and alkali metal carbonates, amines, and quaternary ammonium hydroxide.
- alkali metal hydroxides such as potassium hydroxide and sodium hydroxide are preferred.
- a nonionic surfactant is preferable as the surfactant.
- the resulting molten glass was poured into a mold, held at the temperature of the glass transition point for 1 hour, and then cooled to room temperature at a rate of 0.5°C/min to obtain a glass block.
- Some of the obtained blocks were used to evaluate the glass transition point, specific gravity, Young's modulus and fracture toughness of the amorphous glass, and Table 1 shows the results.
- R 2 O in the table represents the total content of Li 2 O, Na 2 O and K 2 O
- NWF represents the total content of SiO 2 , Al 2 O 3 , P 2 O 5 and B 2 O 3 . .
- Glass transition point Tg Glass was pulverized using an agate mortar, and about 80 mg of powder was placed in a platinum cell and heated from room temperature to 1100°C at a rate of 10/min while a differential scanning calorimeter (manufactured by Bruker; DSC3300SA) was measured. A DSC curve was measured using the glass transition point Tg.
- a thermal expansion meter manufactured by Bruker AXS; TD5000SA
- a thermal expansion curve is obtained at a temperature increase rate of 10 ° C./min, and from the obtained thermal expansion curve
- a glass transition point Tg [unit: °C] was determined.
- haze value Using a haze meter (manufactured by Suga Test Instruments Co., Ltd.; HZ-V3), a haze value [unit: %] was measured with a halogen lamp C light source.
- the obtained glass block was processed into a size of 50 mm ⁇ 50 mm ⁇ 1.5 mm, and heat-treated under the conditions shown in Table 2 to obtain crystallized glass.
- the upper row is the nucleation treatment condition
- the lower row is the crystal growth treatment condition. , means that it was held at 750° C. for 2 hours.
- the obtained crystallized glass was processed and mirror-polished to obtain a crystallized glass plate with a thickness t of 700 ⁇ m.
- a rod-shaped sample was also prepared for measuring the coefficient of thermal expansion.
- a portion of the remaining crystallized glass was pulverized and used for analysis of precipitated crystals. Table 2 shows the evaluation results of the crystallized glass.
- the main crystals detected are shown in the column of crystals in Table 2. Since it is difficult to distinguish between Li 3 PO 4 and Li 4 SiO 4 by powder X-ray diffraction, both are shown together.
- haze value Using a haze meter (manufactured by Suga Test Instruments Co., Ltd.; HZ-V3), a haze value [unit: %] was measured with a halogen lamp C light source.
- Crystallized glasses CG1 and CG2 were chemically strengthened under the conditions shown in Table 3 and subjected to ion exchange treatment, and the obtained chemically strengthened glasses were designated as glass A, glass B, and glass X, respectively.
- the resulting chemically strengthened glass was immersed in a cleaning solution having a pH of 8.9 at room temperature for 24 hours to perform a cleaning treatment to obtain the chemically strengthened glasses of Examples 1 to 4, which were analyzed.
- Table 4 shows the evaluation results of the chemically strengthened glass.
- Examples 1 and 2 are examples, and Examples 3 and 4 are comparative examples.
- stress profile The stress profile was measured using a scattered light photoelastic stress meter SLP-2000 manufactured by Orihara Seisakusho Co., Ltd.
- Crystallinity, crystal average grain size Powder X-ray diffraction was measured under the following conditions, and the degree of crystallinity [unit: %] and crystal average grain size (crystal size) [unit: nm] were calculated using the Rietveld method.
- Measuring device: Smart Lab manufactured by Rigaku Corporation X-ray used: CuK ⁇ ray Measurement range: 2 ⁇ 10° to 80° Speed: 10°/min Step: 0.02°
- the average diameter of non-through holes and the total area ratio of non-through holes were obtained as follows.
- the chemically strengthened glass was observed from directly above by SEM, and a 100,000-fold surface SEM image was obtained. From the obtained surface SEM image, the non-through holes and the matrix portion were discriminated, the long diameter of each non-through hole was determined as the diameter, and the average diameter value was calculated. Also, the total area ratio of non-through holes was obtained by calculating the ratio of the total area of non-through holes to the total visual field area of the surface SEM image.
- the depth of the non-through holes was determined as follows. A 300,000-fold cross-sectional SEM image was obtained on the fractured surface of the chemically strengthened glass. In the obtained cross-sectional SEM image, non-through holes and matrix portions were distinguished, the depth of each non-through hole was obtained, and the average value of the depths was calculated.
- Transmittance As the transmittance, the average transmittance for light with a wavelength of 380 nm to 780 nm was measured.
- Examples 1 and 2 which are chemically strengthened glasses of the present invention, are superior in transparency and strength compared to Examples 3 and 4, which are comparative examples.
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Abstract
Description
120×60×0.6mmtのガラスサンプルを一般的なスマートフォンのサイズに質量と剛性を調節した構造体にはめ込み、疑似スマートフォンを用意した上で、#180SiCサンドペーパーの上に自由落下させる。落下高さは、5cmの高さから落下させて割れなかった場合は5cm高さを上げて再度落下させる作業を割れるまで繰り返し、初めて割れたときの高さの10枚の平均値を測定する。
本発明の化学強化ガラス(以下、本化学強化ガラスとも略す。)は、典型的には板状のガラス物品であり、平板状でもよく曲面状でもよい。また、厚さの異なる部分があってもよい。
本化学強化ガラスの母組成は、SiO2、Li2O、Al2O3を含有することが好ましい。本化学強化ガラスは、母組成が酸化物基準のモル%表示で、
SiO2を40~70%、
Li2Oを5~35%、
Al2O3を1~20%、含有することがより好ましい。
Li2Oを10~30%、
Al2O3を1~15%、
P2O5を0~5%、
ZrO2を0~8%、
MgOを0~10%、
Y2O3を0~5%
B2O3を0~10%、
Na2Oを0~5%、
K2Oを0~5%、
SnO2を0~2%、含有することがさらに好ましい。
本化学強化ガラスは、携帯電話、スマートフォン等のモバイル機器等の電子機器に用いられるカバーガラスとしても有用である。さらに、携帯を目的としない、テレビ、パーソナルコンピュータ、タッチパネル等の電子機器のカバーガラス、エレベータ壁面、家屋やビル等の建築物の壁面(全面ディスプレイ)にも有用である。また、窓ガラス等の建築用資材、テーブルトップ、自動車や飛行機等の内装等やそれらのカバーガラスとして、また曲面形状を有する筺体等にも有用である。
本化学強化ガラスは、結晶と残留ガラスとを含有する結晶化ガラス(以下、本結晶化ガラスともいう。)である。結晶と残留ガラスとを含有する結晶化ガラスであることにより、後述する洗浄処理によりガラス表層部における結晶が溶出されて非貫通穴となる。
板厚t[μm]の本ガラスの、全光線可視光透過率が100×T[%]、片面の表面反射率が100×R[%]であった場合、ランベルト・ベールの法則(Lambert-Beer law)を援用することにより、定数αを用いて、T=(1-R)2×exp(-αt)の関係がある。
ここからαをR、T、tで表し、t=700μmとすれば、Rは板厚によって変化しないので、700μm換算の全光線可視光透過率T0.7はT0.7=100×T0.7/t/(1-R)^(1.4/t-2)[%]と計算できる。ただしX^YはXYを表す。
表面反射率は、屈折率からの計算で求めてもよいし、実際に測定してもよい。また、板厚tが700μmよりも大きい場合は、研磨やエッチングなどで板厚を700μmに調整して、可視光透過率を測定してもよい。
すなわち、ヘーズ値は、板厚が増すごとに内部直線透過率に比例した分が増えると考え得るので、700μmの場合のヘーズ値H0.7は、以下の式で求められる。ただし、「X^Y」は「XY」を表す。
H0.7=100×[1-(1-H)^{((1-R)2-T0.7)/((1-R)2-T)}][%]
また、板厚tが700μmよりも大きい場合は、研磨やエッチングなどで板厚を700μmに調整してヘーズ値を測定してもよい。
本結晶化ガラスは、SiO2、Li2O、Al2O3を含有することが好ましい。本結晶化ガラスは、酸化物基準のモル%表示で、
SiO2を40~70%、
Li2Oを5~35%、
Al2O3を1~20%、含有することがより好ましい。
SiO2を50~70%、
Li2Oを10~30%、
Al2O3を1~15%、
P2O5を0~5%、
ZrO2を0~8%、
MgOを0~10%、
Y2O3を0~5%
B2O3を0~10%、
Na2Oを0~5%、
K2Oを0~5%、
SnO2を0~2%、含有することがさらに好ましい。
以下、本結晶化ガラスの組成を説明する。
本発明の化学強化ガラスの製造方法は、結晶と残留ガラスとを含有する結晶化ガラスを化学強化処理すること、および結晶化ガラスを洗浄処理することを含む。かかる製造方法は、好ましくは、結晶と残留ガラスとを含有する結晶化ガラスを化学強化すること、前記化学強化後に、pH2~12の洗浄液を用いて前記結晶化ガラスの表面を洗浄すること、を含む。該結晶化ガラスは、同じ組成の非晶質ガラスを加熱処理して結晶化する方法で製造する。
非晶質ガラスは、例えば、以下の方法で製造できる。なお、以下に記す製造方法は、板状の化学強化ガラスを製造する場合の例である。
上記の手順で得られた非晶質ガラスを加熱処理することで結晶化ガラスが得られる。
化学強化処理は、大きなイオン半径の金属イオン(典型的には、NaイオンまたはKイオン)を含む金属塩(例えば、硝酸カリウム)の融液に浸漬する等の方法で、ガラスを金属塩に接触させることにより、ガラス中の小さなイオン半径の金属イオン(典型的には、NaイオンまたはLiイオン)が大きなイオン半径の金属イオン(典型的には、Liイオンに対してはNaイオンまたはKイオンであり、Naイオンに対してはKイオン)と置換させる処理である。
化学強化処理により得られた化学強化ガラスに洗浄処理を施すことにより、化学強化ガラスの両主面に複数の非貫通穴が形成される。洗浄処理は洗浄液に化学強化ガラスを浸漬することにより行う。洗浄液のpHは例えば2~12であることが好ましく、より好ましくは2.5~11、さらに好ましくは3~10である。洗浄処理時間は、洗浄液のpH及び組成、結晶化ガラスのエッチングレート等を考慮し、形成される非貫通穴の直径平均値、深さ平均値および総面積率が所望の範囲となるように適宜調整し得るが、通常5分~48時間であることが好ましく、より好ましくは10分~36時間、さらに好ましくは30分~24時間である。
表1に酸化物基準のモル%表示で示したガラス組成となるようにガラス原料を調合し、800gのガラスが得られるように秤量した。ついで、混合したガラス原料を白金るつぼに入れ、1600℃の電気炉に投入して5時間程度溶融し、脱泡し、均質化した。
アルキメデス法で測定した。
メノウ乳鉢を用いてガラスを粉砕し、約80mgの粉末を白金セルに入れて昇温速度を10/分として室温から1100℃まで昇温しながら、示差走査熱量計(ブルカー社製;DSC3300SA)を用いてDSC曲線を測定し、ガラス転移点Tgを求めた。
または、JIS R1618:2002に基づき、熱膨張計(ブルカー・エイエックスエス社製;TD5000SA)を用いて、昇温速度を10℃/分として熱膨張曲線を得て、得られた熱膨張曲線からガラス転移点Tg[単位:℃]を求めた。
ヘーズメーター(スガ試験機株式会社製;HZ-V3)を用いて、ハロゲンランプC光源でのヘーズ値[単位:%]測定した。
超音波法で測定した。
JIS R1607:2015に準拠してIF法で測定した。
得られたガラスブロックを50mm×50mm×1.5mmに加工してから、表2に記載した条件で熱処理して結晶化ガラスを得た。表の結晶化条件欄は、上段が核生成処理条件、下段が結晶成長処理条件であり、たとえば上段に550℃2h、下段に750℃2hと記載した場合は、550℃で2時間保持した後、750℃で2時間保持したことを意味する。
以下の条件で粉末X線回折を測定し、析出結晶を同定した。
測定装置:株式会社リガク製 Smart Lab
使用X線:CuKα線
測定範囲:2θ=10°~80°
スピード:1°/分
ステップ:0.01°
ヘーズメーター(スガ試験機株式会社製;HZ-V3)を用いて、ハロゲンランプC光源でのヘーズ値[単位:%]測定した。
結晶化ガラスCG1及びCG2について表3に示す条件で化学強化してイオン交換処理を行い、得られた化学強化ガラスをそれぞれガラスA、ガラスB、ガラスXとした。得られた化学強化ガラスをpH8.9の洗浄液に室温にて24時間浸漬して洗浄処理を行い、例1~4の化学強化ガラスを得て、分析を行った。化学強化ガラスの評価結果を表4に示す。表4において、例1及び2は実施例、例3及び4は比較例である。
応力プロファイルは有限会社折原製作所製散乱光光弾性応力計SLP-2000を用いて測定した。
NaOH処理(95℃、pH10)による時間あたりの重量減少を測定して求めた。
以下の条件で粉末X線回折を測定し、リートベルト法を用いて、結晶化度[単位:%]と結晶平均粒径(結晶サイズ)[単位:nm]を計算した。
測定装置:株式会社リガク製、Smart Lab
使用X線:CuKα線
測定範囲:2θ=10°~80°
スピード:10°/分
ステップ:0.02°
非貫通穴の直径平均値および非貫通穴の総面積率は、次のように求めた。SEMにより化学強化ガラスを直上から観察し、10万倍の表面SEM画像を得た。得られた表面SEM画像から、非貫通穴とマトリックス部分とを判別し、各非貫通穴の長径を直径として求め、その平均値である直径平均値を算出した。また、非貫通穴の総面積率は、表面SEM画像の総視野面積に対する非貫通穴の総面積の割合を求めた。
本明細書において、非貫通穴の深さは、次のように求めた。化学強化ガラスの割断面において30万倍の断面SEM画像を得た。得られた断面SEM画像において、非貫通穴とマトリックス部分とを判別し、各非貫通穴の深さを求め、その平均値である深さ平均値を算出した。
落下試験は、得られた120×60×0.6mmtのガラスサンプルを現在使用されている一般的なスマートフォンのサイズに質量と剛性を調節した構造体にはめ込み、疑似スマートフォンを用意した上で、#180SiCサンドペーパーの上に自由落下させた。落下高さは、5cmの高さから落下させて割れなかった場合は5cm高さを上げて再度落下させる作業を割れるまで繰り返し、初めて割れたときの高さの10枚の平均値を算出した。
透過率として、波長380nm~780nmの光における平均透過率を測定した。
22 非貫通穴
Claims (10)
- 対向する第1の主面及び第2の主面を有する化学強化ガラスであって、
結晶と残留ガラスとを含有する結晶化ガラスからなり、
表面圧縮応力値(CS0)が450MPa以上、及び表面からの深さ50μmにおける圧縮応力値(CS50)が150MPa以上であり、
前記第1の主面及び前記第2の主面に複数の直径平均値5~50nmの非貫通穴を有し、
前記第1の主面及び前記第2の主面の断面SEM画像により測定される前記非貫通穴の深さ平均値が5~50nmであり、且つ
前記第1の主面及び前記第2の主面における表面SEM画像の総視野面積に対する前記非貫通穴の総面積率が1~40%である、化学強化ガラス。 - 前記結晶化ガラスは、前記残留ガラスのエッチングレートをEgとし、前記結晶のエッチングレートをEcとしたとき、Eg/Ecが0.1~0.0001である、請求項1に記載の化学強化ガラス。
- 母組成が酸化物基準のモル%表示で、SiO2を40~70%、Li2Oを5~35%、Al2O3を1~20%含有する、請求項1または2に記載の化学強化ガラス。
- 結晶化率が10~90質量%である、請求項1~3のいずれか1項に記載の化学強化ガラス。
- 前記第1の主面及び前記第2の主面における反射率が10%以下である、請求項1~4のいずれか1項に記載の化学強化ガラス。
- 化学強化前における厚さ700μm換算の光透過率が90%以上である、請求項1~5のいずれか1項に記載の化学強化ガラス。
- 板厚が300~3000μmである、請求項1~6のいずれか1項に記載の化学強化ガラス。
- 化学強化ガラスの製造方法であって、
結晶と残留ガラスとを含有する結晶化ガラスを化学強化すること、
前記化学強化後に、pH2~12の洗浄液を用いて前記結晶化ガラスの表面を洗浄すること、を含み、
前記化学強化ガラスは、対向する第1の主面及び第2の主面を有し、表面圧縮応力値(CS0)が450MPa以上、及び表面からの深さ50μmにおける圧縮応力値(CS50)が150MPa以上であり、
前記第1の主面及び前記第2の主面に複数の直径平均値5~50nmの非貫通穴を有し、
前記第1の主面及び前記第2の主面の断面SEM画像により測定される前記非貫通穴の深さ平均値が5~50nmであり、且つ
前記第1の主面及び前記第2の主面における表面SEM画像の総視野面積に対する前記非貫通穴の総面積率が1~40%である、化学強化ガラスの製造方法。 - 前記残留ガラスのエッチングレートをEgとし、前記結晶のエッチングレートをEcとしたとき、Eg/Ecが0.1~0.0001である、請求項8に記載の化学強化ガラスの製造方法。
- 前記結晶化ガラスは、母組成が酸化物基準のモル%表示で、SiO2を40~70%、Li2Oを5~35%、Al2O3を1~20%含有する、請求項8または9に記載の化学強化ガラスの製造方法。
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