WO2022105162A1 - Silicon rod cutting device and silicon rod cutting method - Google Patents

Abstract

A silicon rod cutting device and a silicon rod cutting method, the silicon rod cutting device comprising a machine base (11), a material conveying platform (12) and at least two wire cutting apparatuses, the at least two wire cutting apparatuses are independent from one another, and thus silicon rods carried on the material conveying platform (12) may be cut by means of the independent wire cutting apparatus, which improves the freedom of operation and cutting efficiency in a silicon rod cutting operation. A wire cutting unit in the wire cutting apparatus is provided with a closed-loop cutting wire (164), and therefore a cutting wire operating at high speed may be maintained, improving cutting efficiency. Meanwhile, the closed-loop cutting wire (164) can operate in the same operating direction during a cutting operation, as such, the wire cutting unit may achieve a high-precision cutting operation, thus avoiding problems in existing cutting methods such as ripples being present on a cutting surface caused by a change in direction or operation speed of the operating of the cutting wire. Meanwhile, the closed-loop cutting wire (164) may effectively reduce the total length of cutting wire required by the wire cutting unit and eliminate components such as take-up and pay-off reels, reducing production costs.

Description

Silicon rod cutting equipment and silicon rod cutting method technical field

The present application relates to the technical field of silicon workpiece processing, in particular to a silicon rod cutting device and a silicon rod cutting method.

Background technique

Wire cutting technology is the most advanced silicon material processing technology in the world. Its principle is that the high-speed running steel wire drives the cutting blade material attached to the steel wire or directly uses the diamond wire to rub the workpiece to be processed, so as to achieve wire cutting. the goal of. In the cutting process, the steel wire or diamond wire is guided by the wire wheel to form a cutting wire saw or a wire mesh on the cutting wheel, and the workpiece to be processed passes through the rise and fall of the worktable or the rise of the cutting wire saw or wire mesh The lowering realizes the feeding of the workpiece. Under the action of the pressure pump, the cooling water automatic spraying device installed on the equipment sprays cold water on the steel wire or diamond wire and the cutting part of the workpiece, and the reciprocating operation of the steel wire or diamond wire generates cutting to remove the material to be processed once. Cut into multiple pieces at the same time. Compared with traditional saw blade, grinding wheel and inner circle cutting, wire cutting technology has the advantages of high efficiency, high productivity and high precision.

The current silicon rod cutting machine includes a machine base, a frame and a wire cutting unit, wherein there are multiple wire cutting units, and the cutting wire is wound around the cutting wheel in each wire cutting unit to form a plurality of cutting wire saws. The cutting units are uniformly arranged on the frame. When performing the cutting operation, a plurality of wire cutting units move up and down synchronously under the drive of the lifting mechanism, and there are many inconveniences in operation. For example, all the wire cutting units still have to move up and down, even if the size of the silicon rod is short, causing a certain amount of waste; the failure of one of the wire cutting units will affect the whole machine; the cutting wire should be wound in sequence on the Multiple wire cutting units, the overall cutting line is relatively long, and it is necessary to configure more transition wheels and set up components such as take-up reels and pay-off reels on both sides, which not only causes the problem of uneven tension of the cutting line, but also causes problems during operation. The cutting line runs reciprocatingly. When the cutting line running direction is switched, it usually experiences the process of running acceleration and deceleration, which may form a certain waviness on the cutting surface or make the cutting surface flat.

SUMMARY OF THE INVENTION

In view of the above-mentioned shortcomings of the related art, the purpose of the present application is to disclose a silicon rod cutting device and a silicon rod cutting method, which are used to solve the problems of complex structure, inflexible operation and low cutting precision in the related art.

In order to achieve the above purpose and other related purposes, the first aspect of the present application discloses a silicon rod grinding machine, comprising: a machine base; The silicon rods to be cut are conveyed along a first direction, wherein the axis of the silicon rods to be cut is parallel to the first direction; at least two wire cutting devices are independent of each other and are arranged at intervals along the first direction; the wire cutting The device has at least a wire cutting unit, the wire cutting unit includes a cutting wheel and a closed-loop cutting wire connected end to end, the closed-loop cutting wire is wound around the cutting wheel to form a cutting wire saw.

In certain embodiments of the first aspect of the present application, the material conveying table includes a roller assembly and a motor assembly for controlling the roller assembly.

In some implementations of the first aspect of the present application, the roller assembly includes: a plurality of roller pairs arranged at intervals along the first direction, and each roller pair includes two rollers connected by a rotating shaft.

In certain embodiments of the first aspect of the present application, the roller assembly is divided into a plurality of roller assembly segments.

In some embodiments of the first aspect of the present application, the silicon rod cutting device comprises at least two single-wire cutting devices, the single-wire cutting devices having a single-wire cutting unit, the single-wire cutting units comprising: a cutting support; a closed-loop cutting wire ; The first single wire cutting wheel and the second single wire cutting wheel are arranged on opposite sides along the second direction in the cutting support, and the wheel surfaces of the first single wire cutting wheel and the second single wire cutting wheel are parallel or coplanar; at least one single wire transition wheel; wherein, the closed-loop cutting wire is wound around the first single wire cutting wheel, the second single wire cutting wheel and at least one transition wheel to form a single wire cutting wire saw; the first direction is perpendicular to the first single wire cutting wheel The surfaces of a single-wire cutting wheel and a second single-wire cutting wheel, the second direction being perpendicular to the first direction.

In some implementations of the first aspect of the present application, the single-wire cutting unit includes a first single-wire transition wheel, the first single-wire transition wheel forming a triangle with the first and second single-wire cutting wheels.

In some embodiments of the first aspect of the present application, the single-wire cutting unit includes a first single-wire transition wheel and a second single-wire transition wheel, the first single-wire transition wheel is adjacent to the first single-wire cutting wheel, and the first single-wire transition wheel is adjacent to the first single-wire cutting wheel. Two single wire transition wheels are adjacent to the second single wire cutting wheel, and the first single wire transition wheel, the second single wire transition wheel, the second single wire cutting wheel and the first single wire cutting wheel form a quadrilateral.

In certain embodiments of the first aspect of the present application, the single wire cutting unit includes a first single wire transition wheel, a second single wire transition wheel, and a third single wire transition wheel, the first single wire transition wheel being adjacent to the first single wire transition wheel A single wire cutting wheel, the second single wire transition wheel is adjacent to the second single wire cutting wheel, and the third single wire transition wheel is located between the first single wire transition wheel and the second single wire transition wheel.

In certain embodiments of the first aspect of the present application, the single wire cutting unit further includes a single wire tension adjustment mechanism associated with the at least one single wire transition wheel.

In certain embodiments of the first aspect of the present application, the single-wire tension adjustment mechanism includes: a single-wire drive unit; a single-wire link assembly associated with the single-wire transition wheel and the single-wire drive unit; the single-wire link assembly Controlled by the single-wire driving unit to adjust the position of the single-wire transition wheel to adjust the tension of the closed-loop cutting wire.

In certain implementations of the first aspect of the present application, the single-wire link assembly includes: a pivot shaft disposed on the cutting support; a first link, the first end of the first link is connected to the A pivot shaft is associated, and the second end of the first link is connected with the single-line transition wheel; a second link, the first end of the second link is associated with the pivot, and the second link The second end is connected with the single-line drive unit.

In certain embodiments of the first aspect of the present application, the single-wire drive unit includes a counterweight or a tension cylinder.

In certain embodiments of the first aspect of the present application, the single-thread tension adjustment mechanism further includes a single-thread tension balance member.

In some embodiments of the first aspect of the present application, the silicon rod cutting device further includes at least one multi-wire cutting device, the multi-wire cutting device has a multi-wire cutting unit, and the multi-wire cutting unit includes: a cutting support ; the first closed-loop cutting line and the second closed-loop cutting line; the first multi-line cutting wheel and the second multi-line cutting wheel are arranged on opposite sides of the cutting support along the second direction, and the first multi-line cutting wheel The wheel surfaces of the wheel and the second multi-wire cutting wheel are parallel or coplanar, the first multi-wire cutting wheel has at least two wire grooves, the second multi-wire cutting wheel has at least two wire grooves; at least one first multi-wire transition wheel and at least one second multi-wire transition wheel; wherein, the first closed-loop cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and at least one first multi-wire transition wheel to form a first multi-wire transition wheel a wire cutting wire saw, the second closed-loop cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and at least one second multi-wire transition wheel to form a second multi-wire cutting wire saw, the The first multi-wire cutting wire saw is parallel to the second multi-wire cutting wire saw, and there is a line spacing between the first multi-wire cutting wire saw and the second multi-wire cutting wire saw; the first direction is vertical On the wheel surfaces of the first multi-wire cutting wheel and the second multi-wire cutting wheel, the second direction is perpendicular to the first direction.

In some implementations of the first aspect of the present application, the multi-wire cutting unit includes a first multi-wire transition wheel and a second multi-wire transition wheel, the first multi-wire transition wheel and the first multi-wire transition wheel The wire cutting wheel and the second multi-wire cutting wheel form a triangle, and the second multi-wire transition wheel and the first multi-wire cutting wheel and the second multi-wire cutting wheel form a triangle.

In some embodiments of the first aspect of the present application, the multi-wire cutting unit includes two first multi-wire transition wheels and two second multi-wire transition wheels, the two first multi-wire transition wheels are connected with the first multi-wire transition wheel. A multi-wire cutting wheel and a second multi-wire cutting wheel form a quadrangle, and the two second multi-wire transition wheels and the first multi-wire cutting wheel and the second multi-wire cutting wheel form a quadrilateral.

In certain embodiments of the first aspect of the present application, the multi-wire cutting unit further includes at least one associated with at least one of the at least one first multi-wire transition wheel and at least one second multi-wire transition wheel Multi-thread tension adjustment mechanism.

In some implementations of the first aspect of the present application, the multi-wire tension adjustment mechanism includes: a multi-wire driving unit; A second multi-wire transition wheel is associated; the multi-wire link assembly is controlled by the multi-wire drive unit to adjust the position of the first multi-wire transition wheel or the second multi-wire transition wheel to adjust the position of the closed-loop cutting wire tension.

In some implementations of the first aspect of the present application, the multi-wire link assembly includes: a pivot shaft disposed on the cutting support; a first link, the first end of the first link is connected to the The pivot is associated, and the second end of the first link is connected with the first multi-wire transition wheel or the second multi-wire transition wheel; the second link, the first end of the second link is connected with the The pivot is associated with the second link, and the second end of the second link is connected with the multi-wire drive unit.

In certain embodiments of the first aspect of the present application, the multi-wire drive unit includes a counterweight or a tension cylinder.

In certain embodiments of the first aspect of the present application, the multi-thread tension adjusting mechanism further includes a multi-thread tension balancing component.

In some embodiments of the first aspect of the present application, the wire cutting device further comprises a cutting wire driving mechanism for driving the closed-loop cutting wire to run to cut the silicon rod to be cut.

In some embodiments of the first aspect of the present application, a silicon rod stabilizing device corresponding to the wire cutting device is further included, for stabilizing the silicon rod to be cut when the wire cutting device cuts the silicon rod to be cut .

In certain embodiments of the first aspect of the present application, the silicon rod stabilization device includes a first stabilization component and a second stabilization component spaced along a first direction, the first stabilization component and the second stabilization component There is a reserved space for accommodating the cutting wire saw in the wire cutting device therebetween.

In certain embodiments of the first aspect of the present application, either of the first stabilization assembly and the second stabilization assembly includes a first lateral stabilization member and a second lateral stabilization member disposed along the second direction, respectively It is used to interfere with the opposite sides of the silicon rod to be cut.

In certain embodiments of the first aspect of the present application, any one of the first and second side stabilization members includes: a workpiece support block; a workpiece auxiliary support block, the workpiece auxiliary support block being It is controlled by the support block driving unit to move along the second direction so as to extend and retract relative to the workpiece support block.

In some embodiments of the first aspect of the present application, the silicon rod cutting device further includes a position adjusting device for adjusting the position of at least the wire cutting device.

In some embodiments of the first aspect of the present application, the position adjustment device includes: a moving guide rail, arranged on the machine base along a first direction; a sliding block, arranged on the at least one wire cutting device; a moving drive unit, used for for driving the at least one line cutting device to move along the moving guide rail.

In certain embodiments of the first aspect of the present application, the silicon rod cutting device further includes a detection device for detecting the levelness of the axis of the silicon rod to be cut placed on the material conveying table.

In some embodiments of the first aspect of the present application, the silicon rod cutting device further includes a leveling device, used for adjusting the leveling device of the silicon rod to be cut placed on the material conveying table according to the detection result of the detection device. Level the shaft.

The second aspect of the present invention discloses a silicon rod cutting method, which is applied to a silicon rod cutting device. The silicon rod cutting equipment includes a machine base, a material conveying table, and at least two wire cutting devices independent of each other. The wire cutting unit in the device includes a cutting wheel, a transition wheel, and a closed-loop cutting wire connected end to end, the closed-loop cutting wire is wound around the cutting wheel and the transition wheel to form a cutting wire saw, and the silicon rod cutting method includes the following steps: Place the silicon rod to be cut on the material conveying table, and the axis of the silicon rod is parallel to the first direction; use the material conveying table to drive the silicon rod to be cut to the cutting position along the first direction; independently Some or all of the wire cutting devices in the at least two wire cutting devices are driven, so that the cutting wire saws in the part or all of the wire cutting devices perform a cutting operation on the silicon rod to form a silicon rod segment.

In some embodiments of the second aspect of the present application, the silicon rod cutting device further includes a silicon rod stabilizing device corresponding to the wire cutting device, and the silicon rod cutting method further comprises the following steps: driving at least two Before part or all of the wire cutting devices in each wire cutting device, the silicon rod stabilizing device corresponding to the wire cutting device is driven to stabilize the silicon rod to be cut.

The silicon rod cutting device and the silicon rod cutting method disclosed in the present application, the silicon rod cutting equipment includes a machine base, a material conveying table, and at least two wire cutting devices, wherein the at least two wire cutting devices are independent of each other, so The cutting operation of the silicon rods to be carried on the material conveying table can be performed by each independent wire cutting device, which improves the operational freedom and cutting efficiency in the cutting operation of the silicon rods. Moreover, the wire cutting unit in the wire cutting device adopts the closed-loop cutting wire, so the high-speed operation of the cutting wire can be maintained, and the cutting efficiency can be improved. At the same time, the closed-loop cutting wire can run in the same running direction during the cutting operation. The wire cutting unit can realize high-precision cutting operations, avoiding the problems of the cutting surface having ripples caused by the running reversal or running speed of the cutting wire in the existing cutting method. At the same time, the closed-loop cutting line can effectively reduce the wire cutting unit The total length of the cutting line required and the elimination of components such as take-up and pay-off spools reduce production costs.

Description of drawings

The invention to which this application relates is set forth with particularity characteristic of the appended claims. The features and advantages of the inventions involved in this application can be better understood by reference to the exemplary embodiments described in detail hereinafter and the accompanying drawings. A brief description of the drawings is as follows:

FIG. 1 is a schematic structural diagram of an embodiment of the silicon rod cutting device of the present application.

FIG. 2 is a schematic structural diagram of the single wire cutting device of the present application from a first viewing angle in an embodiment.

FIG. 3 is a schematic structural diagram of the single wire cutting device of the present application from a second viewing angle in an embodiment.

4 and 5 show the state diagrams of the silicon rod stabilizing device in the single wire cutting device of the present application.

FIG. 6 shows a schematic structural diagram of the silicon rod cutting device of the present application in another embodiment.

FIG. 7 is a schematic structural diagram of the multi-wire cutting device of the present application in another embodiment from a first viewing angle.

FIG. 8 is a schematic structural diagram of the multi-wire cutting device of the present application in another embodiment from a second viewing angle.

FIG. 9 shows a schematic structural diagram of the silicon rod cutting device of the present application in yet another embodiment.

FIG. 10 is a schematic structural diagram of the single-wire cutting device of the present application in yet another embodiment from a first viewing angle.

FIG. 11 is a schematic structural diagram of the single wire cutting device of the present application in another embodiment from a second viewing angle.

FIG. 12 is a schematic structural diagram of the single-wire cutting device of the present application from a first viewing angle in yet another embodiment.

FIG. 13 is a schematic structural diagram of the single-wire cutting device of the present application from a second viewing angle in yet another embodiment.

Detailed ways

The embodiments of the present application are described below by specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It is to be understood that other embodiments may be utilized and mechanical, structural, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered limiting, and the scope of embodiments of the present application is limited only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. Spatially related terms, such as "upper," "lower," "left," "right," "below," "below," "lower," "above," "upper," etc., may be used in the text for ease of description The relationship of one element or feature shown in the figures to another element or feature.

Although in some instances the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first single wire cutting wheel may be referred to as a second single wire cutting wheel, and similarly, a second single wire cutting wheel may be referred to as a first single wire cutting wheel without departing from the scope of the various described embodiments. Both the first single-wire cutting wheel and the second single-wire cutting wheel are describing a single-wire cutting wheel, but unless the context clearly indicates otherwise, they are not the same single-wire cutting wheel. A similar situation also includes first and second closed-loop cutting lines, first and second multi-wire cutting wheels, first and second multi-wire transition wheels, first connecting rods and The second link, the first stabilization assembly, the second stabilization assembly, and the like.

Also, as used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context dictates otherwise. It should be further understood that the terms "comprising", "comprising" indicate the presence of stated features, steps, operations, elements, components, items, kinds, and/or groups, but do not exclude one or more other features, steps, operations, The existence, appearance or addition of elements, assemblies, items, categories, and/or groups. The terms "or" and "and/or" as used herein are to be construed to be inclusive or to mean any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C" . Exceptions to this definition arise only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

In the existing silicon material processing, based on the inherent hard and brittle characteristics of silicon rods, it is usually completed by wire cutting technology. The process of the silicon rod operation starts from cutting the original long silicon rod to form a multi-section short silicon rod (that is, the silicon rod section that meets the workpiece specifications after cutting the silicon rod and cutting it). The equipment used for the cutting operation is the silicon rod cutting equipment. . In general, a workbench is provided on the silicon rod cutting equipment. For example, a cutting wire such as a steel wire or a diamond wire is guided by a cutting wheel to form a cutting wire on the cutting wheel. The saw cuts the silicon rod to be processed, and cuts the silicon rod. The implementation method can refer to the solution described in Chinese invention patent CN105196433B. The disclosed single crystal silicon rod cutting machine includes a machine base, a material conveying table, and a multi-wire cutting device, wherein the multi-wire cutting device further includes a machine. A frame and a plurality of wire cutting units arranged on the frame and can be lifted and lowered above the material conveying table through a lifting mechanism, and the cutting wires are sequentially wound around the cutting wheels in each wire cutting unit to form intervals Arranged multiple cutting wire saws. When the silicon rod is placed on the material conveying table and the cutting operation is performed, a plurality of wire cutting units are driven to descend synchronously by controlling the lifting mechanism, and the cutting wire saw in each wire cutting unit is used to contact and enter the silicon rod to cut the silicon rod. Until the silicon rod is penetrated, the silicon rod cutting operation is completed. In addition, other implementations of the silicon rod cutting device can also refer to the technical solutions described in Chinese invention patent documents such as Patent Publication No. CN105856445B.

However, there are still some deficiencies in the related art. For example, all the wire cutting units have to move up and down at the same time, even if the size of the silicon rod is short, causing a certain amount of waste; the failure of one of the wire cutting units will affect the whole machine; the cutting wire should be wound in sequence on the Multiple wire cutting units, the overall cutting line is relatively long, and it is necessary to configure more transition wheels and set up components such as take-up reels and pay-off reels on both sides, which not only causes the problem of uneven tension of the cutting line, but also causes problems during operation. The cutting line runs reciprocatingly. When the cutting line running direction is switched, it usually experiences the process of running acceleration and deceleration, which may form a certain waviness on the cutting surface or make the cutting surface flat.

In view of this, the present application discloses a silicon rod cutting device and a silicon rod cutting method, which carry out original technical transformation through related components, in order to solve the problems of complex equipment structure, inflexible operation and low cutting accuracy in the related art.

In the embodiments provided in this application, in order to clarify the definition of the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined. The direction and the third direction are both straight and perpendicular to each other. For example, the length extending direction of the silicon rod cutting device, that is, the length direction when the silicon rod is placed thereon is defined as the first direction (ie, the front-rear direction or the conveying direction), and the width extending direction of the silicon rod cutting device is also The left-right direction is defined as the second direction (that is, the left-right direction), and the direction perpendicular to the horizontal plane formed by the first direction and the second direction is defined as the third direction (that is, the vertical direction, the vertical direction, the up-down direction or the vertical direction). lift direction).

The present application discloses a device for cutting silicon rods, comprising a machine base, a material conveying table, and at least two wire cutting devices independent of each other, wherein the material conveying table is arranged on the machine base and is used to carry silicon to be cut. The rods are driven to convey the silicon rods to be cut along the first direction. The at least two wire cutting devices are independent of each other and are arranged at intervals along the first direction. At least one wire cutting unit on the machine base, the wire cutting unit cutting wheel, transition wheel, and a closed-loop cutting wire connected end to end, the closed-loop cutting wire is wound around the cutting wheel and the transition wheel to form a cutting wire saw.

The present application further discloses a silicon rod cutting method based on the aforementioned silicon rod cutting device, which comprises the following steps: placing the silicon rod to be cut on a material conveying table, and the axis of the silicon rod is parallel to the first direction; The material conveying table is used to drive the silicon rods to be cut to be conveyed to the cutting position along the first direction; some or all of the wire cutting devices in the at least two wire cutting devices are driven independently, so that the part or all of the wire cutting devices are driven independently. The cutting wire saw in the cutting wire saw to cut the silicon rod to form the silicon rod section.

The silicon rod cutting device and the silicon rod cutting method disclosed in the present application are used for cutting the silicon rod. In an embodiment, the silicon rods include single crystal silicon rods and polycrystalline silicon rods, the single crystal silicon rods are rod-shaped single crystal silicon rods grown from the melt by the Czochralski method or the floating zone melting method, such as in the processing of silicon rods Commonly used single crystal silicon rods with a length of about 5000mm (for example, a specification of 5360mm, etc.) or single crystal silicon rods with a length of about 800mm, etc., polysilicon uses precipitation technology such as chemical vapor deposition technology to precipitate silicon on the surface of the silicon core wire. Silicon rods, but not limited to this, in other possible embodiments of the present application, the silicon rod cutting device and the silicon rod cutting method can also be used to cut polysilicon ingots, or other long strips that require Truncation-treated hard materials.

In any of the embodiments provided in this application, the end faces of the silicon rod refer to two faces in the length direction of the silicon rod, that is, two faces opposite to each other along the first direction. For example, the two end faces of the silicon rod to be cut are circular or Circular, the sides of the silicon rod are arc surfaces; for the cut silicon rod, its two end faces are rectangular or quasi-rectangular, and the sides of the silicon rod are the four sides that are usually rectangular in the length direction of the silicon rod. .

The silicon rod cutting device disclosed in the present application is used to perform a cutting operation on a silicon rod to cut a long original silicon rod into a plurality of short silicon rod segments. The silicon rod cutting equipment of the present application may at least include: a machine base, a material conveying table, and at least two wire cutting devices.

The machine base is used as the main part of the silicon rod cutting equipment to provide a silicon rod processing platform. Machine stability. It should be understood that the machine base can be used as a base for different structures or components that perform processing operations in the silicon rod cutting equipment, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base includes a fixing structure or a limiting structure for receiving different components in the silicon rod cutting device, such as a base, a rod body, a column body, a frame body, etc., which are all machine bases described in this application.

Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

The base of the silicon rod cutting equipment has a silicon rod processing platform, and a wire cutting device for processing the silicon rod to be cut, such as cutting, may be provided on the silicon rod processing platform, and the wire cutting device performs the cutting operation of the silicon rod to be cut. . The shape of the silicon rod processing platform can be determined according to the machine base, or can be jointly determined according to the machining needs of the machine base and the wire cutting device.

The material conveying table is arranged on the machine base and is used to carry the silicon rods to be cut and drive the silicon rods to be cut to be conveyed along the first direction. Taking monocrystalline silicon rods as an example, the silicon rods are long and cylindrical. Therefore, in the present application, the cutting operation of the silicon rods to be cut is performed in a horizontal manner. The silicon rod processing platform of the machine base of the silicon rod cutting equipment is in the shape of a narrow and long rectangle according to the length of the silicon rod to be cut. The silicon rod to be cut (also including the cut silicon rod after the cutting operation, hereinafter referred to as "silicon rod segment") can be placed on it in a horizontal manner and can drive the supported silicon rod to be cut (or silicon rod segments) move. The material conveying table is arranged along the first direction. In this way, when the silicon rod to be cut is placed on the material conveying table in a horizontal manner, the axis of the silicon rod to be cut is substantially parallel to the first direction.

At least two wire cutting devices are independent of each other and are spaced apart along the first direction. In the present application, the at least two wire cutting devices are independent devices, which operate independently according to the requirements of the silicon rod cutting operation. Therefore, each wire cutting device can be independently controlled to perform cutting of the silicon rods to be carried on the material conveying table. It improves the operation freedom and the cutting efficiency in the cutting operation of the silicon rod. For example, in some embodiments, all of the ingot cutting devices are controlled to perform a slicing operation on the ingot to be cut. In some embodiments, a portion of the silicon rod cutting devices to be cut is controlled to perform a cutting operation, and the remaining silicon rod cutting devices can remain stationary or perform other operations.

Each of the wire cutting devices includes a wire cutting machine base and at least a wire cutting unit that can be lifted and lowered on the wire cutting machine base.

The wire cutting unit includes a cutting wheel, a transition wheel, and a closed-loop cutting wire connected end to end, and the closed-loop cutting wire is wound around the cutting wheel and the transition wheel to form a cutting wire saw that can perform the cutting operation of the silicon rod to be cut.

The silicon rod cutting device of the present application includes a machine base, a material conveying table, and at least two wire cutting devices, wherein the at least two wire cutting devices are independent of each other, so the material conveying table can be connected to the material conveying table through each independent wire cutting device. The truncation operation is performed on the silicon rod to be carried on the upper side, which improves the degree of freedom of operation and the truncation efficiency in the truncation operation of the silicon rod. Moreover, the wire cutting unit in the wire cutting device adopts the closed-loop cutting wire, so the high-speed operation of the cutting wire can be maintained, and the cutting efficiency can be improved. At the same time, the closed-loop cutting wire can run in the same running direction during the cutting operation. The wire cutting unit can realize high-precision cutting operations, avoiding the problems of the cutting surface having ripples caused by the running reversal or running speed of the cutting wire in the existing cutting method. At the same time, the closed-loop cutting line can effectively reduce the wire cutting unit The total length of the cutting line required and the elimination of components such as take-up and pay-off spools reduce production costs.

Please refer to FIG. 1 , which is a schematic structural diagram of an embodiment of the silicon rod cutting device of the present application.

In the embodiments provided in this application, in order to clarify the definition of the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined. The direction and the third direction are both straight and perpendicular to each other. In the embodiment shown in FIG. 1 , the X axis of the coordinate axis is the first direction, and the Y axis of the coordinate axis is the second direction. direction, the Z axis of the coordinate axis shown in the figure is the third direction.

In this embodiment, the silicon rod cutting device is used to perform a cutting operation on the silicon rod to cut the long original silicon rod into a plurality of short silicon rod segments.

As shown in FIG. 1 , the silicon rod cutting device in this embodiment may at least include: a machine base 11 , a material conveying table 12 , and at least two wire cutting devices, wherein the at least two wire cutting devices include a single wire cutting device 15.

As the main part of the silicon rod cutting equipment, the machine base has a silicon rod processing platform. The silicon rod processing platform can be provided with a wire cutting device for processing, for example, cutting, the silicon rod to be cut. The stick performs the truncation job. The shape of the silicon rod processing platform can be determined according to the machine base, or can be jointly determined according to the machining needs of the machine base and the wire cutting device. As shown in FIG. 1 , the machine base 1 is in the shape of a rectangle as a whole, and a silicon rod processing platform is provided on the top of the machine base 1 .

The material conveying table is arranged on the machine base and is used to carry the silicon rods to be cut and drive the silicon rods to be cut to be conveyed along the first direction. Taking a single crystal silicon rod as an example, in this embodiment, the cutting operation is performed in a horizontal manner for the silicon rod to be cut. As shown in FIG. 1 , the silicon rod processing platform of the machine base 11 is in the shape of a narrow and long rectangle according to the length of the silicon rod to be cut. On the processing platform, the silicon rod to be cut can be placed on it in a horizontal manner, and the supported silicon rod to be cut can be driven to move in a first direction. The material conveying table is arranged along the first direction. In this way, when the silicon rod to be cut is placed on the material conveying table in a horizontal manner, the axis of the silicon rod to be cut is substantially parallel to the first direction.

In certain embodiments, the material delivery station includes a roller assembly and a motor assembly for controlling the roller assembly. As shown in FIG. 1 , a roller assembly arranged along the first direction and a motor assembly (not shown in the drawings) for controlling the roller assembly are arranged on the material conveying table. When the silicon rod to be cut is horizontal When placed on the roller assembly in the same way, the axis of the silicon rod to be cut is substantially parallel to the first direction.

In some embodiments, the roller assembly includes a plurality of roller pairs spaced back and forth along the first direction, wherein each roller pair includes two rollers connected by a rotating shaft, the motor assembly includes a motor, each The roller pair corresponds to one motor, several roller pairs correspond to one motor, or a plurality of roller pairs share one motor. The motor is used to drive the roller in the corresponding roller pair to rotate. The frictional force of the silicon rods to be cut drives the silicon rods to be cut to be transported along the first direction, and the loading of the silicon rods to be cut and the unloading of the cut silicon rods are completed.

In some embodiments, the roller assembly includes a plurality of roller pairs spaced back and forth along the first direction, wherein the roller assembly is divided into a plurality of roller assembly sections according to the silicon rod section to be cut, each of which is The roller assembly section includes a plurality of roller pairs, each roller pair includes two rollers connected by a rotating shaft, the motor assembly includes a plurality of motors, each of the roller pairs corresponds to one of the motors or belongs to the same motor. A plurality of roller pairs in a roller assembly section share one of the motors. After the silicon rod to be cut is cut into multiple silicon rod segments, each pair of rollers in each roller assembly section is driven by a corresponding motor to roll, so as to drive the silicon rod segments in the roller assembly section. The segments are conveyed along the first direction, so as to realize the sequential unloading of the multi-segment silicon rod segments.

The wire cutting device is used for cutting the silicon rod to be cut. As shown in FIG. 1 , the wire cutting device includes a single wire cutting device 15 , a plurality of single wire cutting devices 15 are independent of each other and are arranged at intervals along the first direction, and the cutting operation of the silicon rod to be cut can be performed by the plurality of single wire cutting devices 15 , After the silicon rod to be cut is cut by the single-wire cutting device 15, a multi-segment silicon rod section is formed.

In the present application, the plurality of single-wire cutting devices 15 are independent devices that operate independently according to the requirements of the silicon rod cutting operation. Therefore, each single-wire cutting device 15 can be independently controlled to perform the cutting process on the silicon rods to be carried on the material conveying table. The cutting operation improves the degree of freedom of operation and cutting efficiency in the cutting operation of the silicon rod. For example, in some embodiments, all single wire dicing devices 15 are controlled to perform a severing operation on the silicon rod to be cut. In some embodiments, a controlled portion of the single wire cutting devices 15 performs the cutting operation of the silicon rod to be cut, and the remaining single wire cutting devices 15 may remain stationary or perform other operations.

Regarding the single-wire cutting device, the single-wire cutting device has at least one single-wire cutting unit, and the single-wire cutting unit includes a single-wire cutting wheel, a transition wheel, and an end-to-end closed-loop cutting wire, the closed-loop cutting wire wound around the single-wire cutting A single wire cutting wire saw is formed after the wheel and transition wheel.

Please refer to FIG. 2 , which is a schematic structural diagram of the single wire cutting device of the present application from a first viewing angle in an embodiment. As shown in FIGS. 1 and 2 , the single wire cutting device 15 includes a wire cutting machine base 160 and a single wire cutting unit 16 .

In the embodiment shown in FIG. 1 and FIG. 2 , the wire cutting machine base 160 is provided on the machine base 11 , and the single wire cutting unit 16 is movably installed on the wire cutting machine base 160 through a lifting mechanism. Here, the wire cutting machine base 160 is used as a carrier for disposing the single wire cutting unit 16 on the machine base 11 , and its specific form can be a beam body, a column body, a plate frame, a bracket, or the like.

The single wire cutting unit 16 can be lifted and lowered on the wire cutting machine base 160 through a lifting mechanism. In some implementations, the lifting mechanism may include a lifting guide rail, a sliding block, and a lifting driving unit, wherein the lifting guide rail is disposed on the wire cutting machine base 160 along a third direction, and the sliding block is provided on the wire cutting machine base 160. The single-wire cutting unit 16 is mounted on the single-wire cutting unit 16 and is adapted to the corresponding lifting guide rail, and the lifting driving unit is used for the single-wire cutting unit 16 to move up and down along the lifting guide rail. In practical applications, in order to enable the single wire cutting unit 16 to stably ascend and descend on the wire cutting machine base 160, a double guide rail design may be adopted, that is, two lifting guide rails are used, and the two lifting guide rails are arranged in parallel. In addition, the lift drive unit may further include a lift screw and a lift motor, wherein the lift screw is connected to the single wire cutting unit 16 in a third direction, the lift motor (the lift motor may be, for example, a servo motor) ) is connected with the lift screw. In this way, the lift screw is driven to rotate by the lift motor, so that the single-wire cutting unit 16 can be moved up and down along the lift guide rail. The implementation of the lift drive unit is not limited to this, and other components that can drive the single-wire cutting unit 16 to move up and down along the lift guide are still applicable. For example, the lift drive unit may include a lift rack, a A drive gear meshed with the lift rack and a drive motor that drives the drive gear to rotate.

The single-wire cutting unit includes: a cutting bracket, a closed-loop cutting wire, a first single-wire cutting wheel, a second single-wire cutting wheel, and at least one single-wire transition wheel, wherein the closed-loop cutting wire is wound around the first single-wire cutting wheel, The second single wire cutting wheel and at least one transition wheel form a single wire cutting wire saw.

As shown in FIG. 2 , the single-wire cutting unit 16 includes a cutting bracket 161 , a first single-wire cutting wheel 162 , a second single-wire cutting wheel 163 , and a closed-loop cutting wire 164 .

The cutting bracket 161 is used as a carrier for disposing the first single wire cutting wheel 162, the second single wire cutting wheel 163 and other components on the wire cutting machine base 160, and its specific form can be a beam, a plate frame, a bracket or the like. In addition, the cutting support 161 can be lifted and lowered on the wire cutting machine base 160 through a lifting mechanism. For the lifting mechanism, reference can be made to the foregoing description, which will not be repeated here. Using the lifting mechanism, the cutting support 161 moves up and down relative to the wire cutting machine base 160 in the third direction, thereby driving the first single wire cutting wheel 162 and the second single wire cutting wheel 163 and wrapping around the first single wire cutting wheel 162 and the single-wire cutting wire saw on the second single-wire cutting wheel 163 move up and down to cut the silicon rod to be cut. Furthermore, in some embodiments, the distal end of the cutting bracket 161 that is relatively far away from the wire cutting machine base 160 can also be defined by a guide rod structure and guide the cutting bracket 161 to operate under the driving of the lifting mechanism. Lift and move.

The first single-wire cutting wheel and the second single-wire cutting wheel are disposed on opposite sides of the cutting bracket along the second direction. In the embodiment shown in FIG. 2 , the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 are oppositely disposed on both sides of the bottom of the cutting bracket 161 along the second direction, and the closed-loop cutting line 164 is wound around the first A single wire cutting wheel 162 and a second single wire cutting wheel 163 to form a single wire cutting wire saw, the single wire cutting wire saw being disposed in the second direction.

The first single wire cutting wheel 162 includes at least one first cutting wire groove, and the plane where any of the first cutting wire grooves is located is parallel to the wheel surface of the first single wire cutting wheel, that is, the grooves on the first single wire cutting wheel. The cutting wire slot may be referred to as the first cutting wire slot.

The second single wire cutting wheel 163 includes at least one second cutting wire groove, and the plane where any of the second cutting wire grooves is located is parallel to the surface of the second single wire cutting wheel, that is, the Each of the cutting wire grooves may be referred to as the second cutting wire groove.

The wheel surface of the first single wire cutting wheel 162 is parallel or coplanar with the wheel surface of the second single wire cutting wheel 163, so that the closed-loop cutting wire 164 is wound around the first single wire cutting wheel 162 and the second single wire cutting wheel 162. When the wheel 163 is used, the first cutting wire groove and the second cutting wire groove for winding the closed-loop cutting wire 164 are correspondingly located in the same plane, so that the direction of the single-wire cutting wire saw can be located at the same time for winding the closed-loop cutting wire. 164 of the first cutting wire groove and the second cutting wire groove are located in the plane. It should be understood that the closed-loop cutting wire 164 is in a running state during the cutting action, so the single-wire cutting wire saw is defined by its spatial position. In the embodiment of the present application, it is wound around the first single-wire cutting wheel 162 and the second The closed-loop cutting wire 164 between the single-wire cutting wheels 163 is a single-wire cutting wire saw.

It should be understood that when the closed-loop cutting wire 164 is wound around any single-wire cutting wheel (the first single-wire cutting wheel 162 or the second single-wire cutting wheel 163 ), the closed-loop cutting wires 164 on both sides of the single-wire cutting wheel should be located at all In the single-wire cutting wheel, the cutting wire groove for winding the closed-loop cutting wire 164 is located in the plane.

The bottom of the cutting bracket 161 has a concave portion, so that the cutting bracket 161 , the first single wire cutting wheel 162 , the second single wire cutting wheel 163 , and the first single wire cutting wheel 162 and the second single wire cutting wheel 163 are wound around the first single wire cutting wheel 162 and the second single wire cutting wheel 163 . The single wire cutting wire saw formed therebetween can form a cutting accommodating space corresponding to the silicon rod to be cut.

The single-wire cutting unit further includes at least one single-wire transition wheel, which is used for pulling the closed-loop cutting wire wound around the first single-wire cutting wheel and the second single-wire cutting wheel.

In certain embodiments, the single wire cutting unit includes a single wire transition wheel. In the embodiment shown in FIG. 2 , the single wire cutting unit 16 further includes a first single wire transition wheel 165 , and the first single wire transition wheel 165 is disposed on the cutting support 161 .

The first single-wire transition wheel 165 is used for reversing or guiding the closed-loop cutting wire 164 . In the embodiment shown in FIG. 2 , the first single-wire transition wheel 165 is provided on the top of the cutting bracket 161 , and the first single-wire transition wheel 165 can be combined with the first single-wire cutting wheel 162 and The second single wire cutting wheel 163 forms a triangle. The shape of the triangle formed by the first single wire transition wheel 165 and the first single wire cutting wheel 162 and the second single wire cutting wheel 163 is not limited. For example, in one embodiment, the first single-wire transition wheel 165 is provided in the top center area of the cutting bracket 161 , and the first single-wire transition wheel 165 can be connected with the first single-wire cutting wheel 162 and the second single-wire transition wheel 162 . The single wire cutting wheel 163 forms an isosceles triangle or an equilateral triangle. In one embodiment, the first single wire transition wheel 165 is disposed on the top of the cutting bracket 161 and is flush with the first single wire cutting wheel 162 or the second single wire cutting wheel 163 in the third direction, then the first single wire cutting wheel 165 A single wire transition wheel 165 can form a right triangle with the first single wire cutting wheel 162 and the second single wire cutting wheel 163 . In one embodiment, the first single wire transition wheel 165 is provided on the top of the cutting bracket 161 , then the first single wire transition wheel 165 can be connected with the first single wire cutting wheel 162 and the second single wire cutting wheel 163 form an ordinary triangle.

The first single wire transition wheel 165 includes at least one transition wire slot, and the plane where any of the transition wire slots is located is parallel to the wheel surface of the first single wire transition wheel.

The wheel surface of the first single wire transition wheel 165 is parallel or coplanar with the wheel surface of the first single wire cutting wheel 162 and the wheel surface of the second single wire cutting wheel 163, so that the closed loop cutting wire 164 is wound around the first single wire. When the transition wheel 165 , the first single wire cutting wheel 162 and the second single wire cutting wheel 163 are respectively corresponding to the first cutting wire groove, the second cutting wire groove and the transition wire groove for winding the closed-loop cutting wire 164, they are located in the same plane, In this way, the direction of the single wire cutting wire saw can be located in the plane of the first cutting wire groove, the second cutting wire groove and the transition wire groove for winding the closed loop cutting wire 164 at the same time.

Thus, in this embodiment, the first single-wire cutting wheel 162, the second single-wire cutting wheel 163, and the first single-wire transition wheel 165 of the single-wire cutting unit are wound by the closed-loop cutting wire 164. In this example, the The single-wire cutting device can omit components such as wire take-up reels and pay-off reels, and the closed-loop cutting wire can be cut by running at high speed after being driven.

In the existing silicon rod cutting equipment, the cutting wire is wound from the pay-off drum to the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum. During the cutting operation, the The cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process. In the silicon rod cutting device of the present application, the closed-loop cutting line in the wire cutting unit can maintain continuous high-speed operation, and at the same time, the closed-loop cutting line can run in the same running direction during the cutting process. In this way, the wire cutting unit of the present application can achieve high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the closed-loop cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit and eliminate components such as wire take-up and pay-off spools, reducing production costs.

The single wire cutting unit of the present application further includes a cutting wire driving mechanism for driving the closed-loop cutting wire 164 wound around the first single wire cutting wheel 162 , the second single wire cutting wheel 163 , and the first single wire transition wheel 165 Run at high speed.

In some embodiments, at least one of the first single wire cutting wheel 162, the second single wire cutting wheel 163, and the first single wire transition wheel 165 is used as a driving wheel, and the others are used as driven wheels, wherein all The driving wheel is associated with the cutting wire driving mechanism, and the driving wheel is driven to rotate by the cutting wire driving mechanism, and the closed-loop cutting wire 164 is driven to run at high speed with the cooperation of other driven wheels.

In some implementations, the first single wire cutting wheel 162 or the second single wire cutting wheel 163 may be used as the drive wheel. Taking the first single wire cutting wheel 162 as a driving wheel as an example, the first single wire cutting wheel 162 is associated with a cutting wire driving mechanism, and the cutting wire driving mechanism can be used to drive the first single wire cutting wheel 162 to rotate. In some examples, the cutting wire driving mechanism includes a driving motor, and the motor shaft of the driving motor is directly connected to the wheel shaft of the first single wire cutting wheel 162. When the driving motor rotates, the motor of the driving motor is driven by the motor of the driving motor. The shaft drives the first single-wire cutting wheel 162 to rotate, and the closed-loop cutting line 164 is carried along to make the second single-wire cutting wheel 163 and the first single-wire transition wheel 165 rotate to realize the high-speed operation of the closed-loop cutting line 164 . In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on the motor shaft of the driving motor and the wheel shaft of the first single wire cutting wheel, and when the driving motor rotates, The drive belt is driven by the motor shaft of the drive motor, and then the first single-wire cutting wheel 162 is driven to rotate, and the closed-loop cutting wire 164 is carried to run and make the second single-wire cutting wheel 163 and the first single-wire transition wheel 165 rotate to achieve a closed loop. The cutting line 164 runs at high speed.

In some implementations, the first single wire transition wheel 165 may be used as the drive wheel. The first single wire transition wheel 165 is associated with a cutting wire drive mechanism that can be used to drive the first single wire transition wheel 165 in rotation. In some examples, the cutting wire driving mechanism includes a driving motor, and the motor shaft of the driving motor is directly connected to the wheel shaft of the first single-wire transition wheel 165, and when the driving motor rotates, the motor of the driving motor is driven by the driving motor The shaft drives the first single-wire transition wheel 165 to rotate, and the closed-loop cutting line 164 is carried along and makes the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 rotate, so as to realize the high-speed operation of the closed-loop cutting line 164 . In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on the motor shaft of the driving motor and the wheel shaft of the first single-wire transition wheel, and when the driving motor rotates, The drive belt is driven by the motor shaft of the drive motor, and then the first single-wire transition wheel 165 is driven to rotate, and the closed-loop cutting wire 164 is carried to run and make the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 rotate to realize a closed loop. The cutting line 164 runs at high speed.

In addition, the single-wire transition wheel can also be used to adjust the tension of the closed-loop cutting wire. Accordingly, the single wire cutting unit further includes a single wire tension adjustment mechanism associated with the at least one single wire transition wheel.

Please refer to FIG. 3 , which is a schematic structural diagram of the single-wire cutting device of the present application from a second viewing angle according to an embodiment. 2 and 3 , the single wire cutting unit 16 includes a single wire tension adjustment mechanism associated with the first single wire transition wheel 165 .

The single-wire tension adjustment mechanism includes: a single-wire drive unit 171 and a single-wire link assembly, the single-wire link assembly is associated with the first single-wire transition wheel 165 and the single-wire drive unit 171, and the single-wire link assembly is controlled. In the single-wire driving unit, that is, the single-wire connecting rod assembly is driven by the single-wire driving unit 171 to drive the first single-wire transition wheel 165 to change the position to adjust the tension of the closed-loop cutting wire 164 .

In the embodiment shown in FIGS. 2 and 3 , the single-wire link assembly includes: a pivot shaft 172 , a first link 174 , and a second link 176 .

The pivot shaft 172 is disposed on the cutting bracket 161 .

The first end of the first link 174 is associated with the pivot shaft 172 , and the second end of the first link 174 is connected with the first single-wire transition wheel 165 .

The first end of the second link 176 is associated with the pivot shaft 172 and the second end of the second link 176 is connected with the single wire drive unit.

Through the single-wire link assembly, a lever effect can be achieved to adjust the position of the first single-wire transition wheel 165 .

Regarding the single-wire drive unit, in some implementations, the single-wire drive unit 171 includes a counterweight (in the following description, the counterweight is marked as 171 ), and the counterweight 171 can be suspended from the second The second end of the connecting rod 176 . For example, when the tension of the closed-loop cutting line 164 is to be increased, the counterweight portion 171 is released, the counterweight portion 171 descends, and the second end of the second link 176 is under the gravity of the counterweight portion 171 . Under the action, the pivot shaft 172 is driven to rotate forward (clockwise as shown in FIG. 3 ), and the forwardly rotated pivot shaft 172 drives the first link 174 and its associated first single-line transition wheel 165 to move away from the first connecting rod 174 . The direction of the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is moved (for example, toward the top), and the circumference of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is enlarged. long, increasing the tension of the closed loop cutting line 164. When the tension of the closed-loop cutting line 164 is to be reduced, the counterweight portion 171 is lifted, and the second end of the second link 176 is controlled to lift and drive the pivot shaft 172 to rotate in the opposite direction (counterclockwise as shown in FIG. 3 ). ), the pivot shaft 172 rotated in the opposite direction drives the first link 174 and its associated first single-wire transition wheel 165 toward the direction close to the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 (for example, toward the downward) movement to reduce the perimeter of the triangle formed by the first single wire transition wheel 165 , the first single wire cutting wheel 162 and the second single wire cutting wheel 163 , and reduce the tension of the closed loop cutting wire 164 .

The counterweight portion may include a counterweight frame and counterweight blocks placed in the configuration frame, wherein the number of counterweight blocks may be varied according to the requirements of tension adjustment of the closed-loop cutting line 164, for example, When the tension of the closed-loop cutting line 164 is increased, the number of counterweights can be increased, and when the tension of the closed-loop cutting line 164 is decreased, the number of counterweights can be decreased.

The configuration frame can be moved up and down relative to the cutting support 161 through the up and down guide rails.

In some embodiments, the counterweight portion may include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting bracket 161 , so that the counterweight portion is connected to the cutting bracket 161 . switch from active to locked state. In some examples, the locking mechanism may be a latch, for example.

In some embodiments, the single-wire tension adjustment mechanism may further include a single-wire tension balance component, which is used to ensure that the tensions of the counterweight portion 171 and the closed-loop cutting wire 164 are in a balanced state. In the embodiment shown in FIG. 3 , the single-thread tension adjusting mechanism further includes a single-thread tension balancing part 173, which is a tension-balancing cylinder (in the following description, the tension-balancing cylinder is marked as 173), The tension balance cylinder 173 acts on the second connecting rod 176 .

For example, when the tension of the closed-loop cutting line 164 is to be increased, the counterweight portion 171 is released, the counterweight portion 171 descends, and the second end of the second link 176 is under the gravity of the counterweight portion 171 . Under the action, the pivot shaft 172 is driven to rotate forward (clockwise as shown in FIG. 3 ), and the forwardly rotated pivot shaft 172 drives the first link 174 and its associated first single-line transition wheel 165 to move away from the first connecting rod 174 . The direction of the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is moved (for example, toward the top), and the circumference of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is enlarged. long, increase the tension of the closed-loop cutting line 164 until the tension of the closed-loop cutting line 164 is adjusted to the expected value, the tension balance cylinder 173 extends the cylinder shaft and makes the cylinder shaft abut against the second The connecting rod 176 makes the counterweight portion 171 and the second connecting rod 176 no longer move, that is, remain stationary relative to the cutting bracket 161 . When the tension of the closed-loop cutting line 164 is to be reduced, the cylinder shaft of the tension balance cylinder 173 lifts the second connecting rod 176, lifts the counterweight portion 171 and the second connecting rod 176, and drives the pivot shaft 172 rotates in the reverse direction (counterclockwise as shown in FIG. 3 ), and the reversely rotated pivot 172 drives the first link 174 and its associated first single-wire transition wheel 165 to approach the first single-wire cutting wheel 162 and the direction of the second single-wire cutting wheel 163 (for example, downward), reducing the perimeter of the triangle formed by the first single-wire transition wheel 165, the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163, reducing the The tension of the closed-loop cutting line 164 is adjusted until the tension of the closed-loop cutting line 164 is adjusted to the expected value, the tension balance cylinder 173 stops the cylinder shaft at the current position, so that the counterweight 171 and the second connecting rod 176 do not To move again, that is, to remain stationary relative to the cutting support 161 .

The single-line drive unit can still make other changes, for example, in some implementations, the single-line drive unit can include a tension cylinder, the tension cylinder is located below the second connecting rod and the cylinder shaft of the tension cylinder is connected at the second end of the second link. For example, when the tension of the closed-loop cutting line 164 is to be increased, the tension cylinder contracts the cylinder shaft, pulls the second connecting rod 176 and drives the pivot shaft 172 to rotate in the forward direction (clockwise as shown in FIG. 3 ). The rotating pivot 172 then drives the first link 174 and its associated first single wire transition wheel 165 to move in a direction away from the first single wire cutting wheel 162 and the second single wire cutting wheel 163 (for example, upward), The perimeter of the triangle formed by the first single wire transition wheel 165 , the first single wire cutting wheel 162 and the second single wire cutting wheel 163 is enlarged to increase the tension of the closed loop cutting wire 164 . When the tension of the closed-loop cutting line 164 is to be reduced, the cylinder shaft is extended from the tension cylinder, and the second end of the second connecting rod 176 is controlled to lift and drive the pivot shaft 172 to rotate in the opposite direction (as shown in FIG. 3 ). counterclockwise), the reversely rotated pivot 172 drives the first link 174 and its associated first single-wire transition wheel 165 toward the direction close to the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 ( For example, by moving downward, the perimeter of the triangle formed by the first single wire transition wheel 165 , the first single wire cutting wheel 162 and the second single wire cutting wheel 163 is reduced, and the tension of the closed loop cutting wire 164 is reduced.

The silicon rod cutting device of the present application further includes a position adjusting device for adjusting the position of the at least one wire cutting device. Using the position adjusting device, the position of the at least one line cutting device configured on the silicon rod cutting device can be adjusted so as to be able to cut silicon rod segments of corresponding lengths according to cutting requirements.

In the embodiment shown in FIG. 1 , the position adjustment device may include: a moving guide rail, a sliding block, and a moving driving unit.

The moving guide rail may be arranged on the machine base along the first direction, and the sliding block may be arranged on the at least one wire cutting device. In some embodiments, for the wire cutting device, taking the single wire cutting device 15 as an example, the single wire cutting device includes a wire cutting machine base 160 and a single wire cutting unit 16. Therefore, the machine base 11 corresponds to the wire cutting machine The position of the machine base 160 is provided with a moving guide rail, and a sliding block is arranged at the bottom of the wire cutting machine base 160, wherein the number of the moving guide rails is not limited, it can be one, or two parallel arranged or more.

The moving driving unit is used for driving the at least one wire cutting device to move along the moving guide rail. In some embodiments, the mobile drive unit may comprise: a moving screw and a drive source, wherein the moving screw is disposed along a first direction and is associated with a wire cutting machine base in the at least wire cutting device, The driving source is used for driving the moving screw to rotate so as to move the associated at least one wire cutting device along the transfer guide rail.

In some embodiments, the moving driving unit may include: a moving rack, a driving gear and a driving source, wherein the moving rack is arranged along a first direction, and the driving gear is connected with the at least one wire cutting device in the The wire cutting machine base is associated with and meshed with the moving rack, and the driving source is used to drive the driving gear to rotate so that the associated at least wire cutting device moves along the transfer guide rail.

The silicon rod cutting device of the present application further includes a level detection device (not shown), and the level detection device is used for detecting the levelness of the axis of the silicon rod to be cut placed on the material conveying table.

In some embodiments, the level detection device includes a first contact measuring instrument and a second contact measuring instrument, wherein the first contact measuring instrument is used to measure the silicon rod to be cut corresponding to the first contact measuring instrument The level data at the measurement position of the second contact type measuring instrument is used to measure the level data of the silicon rod to be cut at the measurement position corresponding to the second contact type measuring instrument.

The silicon rod cutting device of the present application further includes a leveling device (not shown), which is used to adjust the axis line of the silicon rod to be cut placed on the material conveying table according to the detection result of the level detection device. Leveling, that is, when the level detection device detects that the axis of the silicon rod to be cut is in a non-level state, the leveling device uses a rotating drive mechanism to drive the material conveying table to rotate to adjust the level of the axis of the workpiece.

In an embodiment of the present application, the leveling device includes: a rotation fulcrum structure, a rotation drive mechanism, and an offset limit mechanism. The rotating fulcrum structure can be located below the material conveying platform as a rotating fulcrum for the rotating of the material conveying platform. The rotation driving mechanism is located below the material conveying table, and is used for driving the material conveying table to rotate around the rotating fulcrum structure to adjust the level of the axis of the silicon rod to be cut. The offset limit mechanism is adjacent to the rotation drive mechanism, and is used to limit the deviation of the material conveying platform in the horizontal direction when it rotates (up and down deflection) around the rotation fulcrum structure.

In an embodiment of the leveling device of the silicon rod cutting device of the present application for leveling, the first contact measuring instrument corresponds to the rotation fulcrum structure, and is used to measure the apex of the silicon rod to be cut at the rotation fulcrum structure. The first height data (can be absolute height or relative height relative to the material conveying platform). The second contact measuring instrument corresponds to the rotating drive mechanism and is used to measure the second height data (which may be absolute height or relative height relative to the material conveying table) of the vertex of the silicon rod to be cut at the rotating drive mechanism. Subsequently, the first height data measured by the first contact measuring instrument and the second height data measured by the first contact measuring instrument can be combined to calculate the adjustment amount of the material conveying platform at the rotating drive mechanism, And use the rotary drive mechanism to act according to the adjustment amount to drive the material conveying table to rotate around the pivot structure to complete the horizontal alignment, so that the axis line of the silicon rod to be cut is adjusted to a horizontal state.

In another embodiment of the present application, the leveling device (not shown) of the silicon rod cutting device of the present application can also be set as a horizontal centering mechanism for adjusting the levelness of the silicon rod to be cut by adjusting the spacer block . The leveling device is arranged on the material conveying platform in the working area, and is used to adjust the axis line of the silicon rod to be cut into a horizontal state. The horizontal centering mechanism includes: two adjustment pads, a level detection unit, and a drive motor.

The two adjusting pads are respectively arranged at the front and rear ends of the material conveying table in the corresponding working area, and are used to support the silicon rods to be cut.

The level detection unit is used for detecting the levelness of the silicon rods to be cut supported by the two adjusting spacers.

The drive motor is associated with at least one of the two adjustment pads, and is used to control at least one of the associated adjustment pads to move up and down to ensure that the axis line of the silicon rod to be cut is adjusted to a horizontal state .

In this way, the level of the axis of the workpiece to be cut carried by the material conveying table can be adjusted to a horizontal state by using the workpiece horizontal centering mechanism, and a single-section workpiece section that meets the workpiece specification can be obtained by cutting. In addition, due to the use of the workpiece horizontal centering mechanism, it can ensure that the axis line of the workpiece to be cut is in a horizontal state, and the cutting section of each workpiece section after cutting is perpendicular to the axis line, which meets the workpiece processing requirements and improves the The cutting quality and yield of the workpiece are improved.

The silicon rod cutting device of the present application further includes a silicon rod stabilizing device corresponding to the wire cutting device, which is used to avoid surface damage, surface ripples, edge chipping, etc. of the silicon rod to be cut when it is cut by the wire cutting device. In the embodiment shown in FIG. 1 , the silicon rod cutting device further includes a silicon rod stabilizing device corresponding to each single wire cutting device, so as to prevent the silicon rod to be cut from generating surface when being cut by the single wire cutting device Damage, surface ripples, chipping, etc.

As shown in FIG. 2, the single wire cutting unit of the single wire cutting device includes a first single wire cutting wheel 162, a second single wire cutting wheel 163, and a closed-loop cutting wire 164, wherein the first single wire cutting wheel 162 and the first single wire cutting wheel 162 The two single-wire cutting wheels 163 are disposed opposite to each other along the second direction, and the closed-loop cutting wire 164 is wound around the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 to form a single-wire cutting wire saw, through which the silicon to be cut is cut by the single-wire cutting wire saw Rods to implement silicon rod cutting operations. Among them, when the silicon rod to be cut is cut off (that is, when the single-wire cutting wire saw is going to exit the wire from the inside of the silicon rod to be cut), the cutting surface of the silicon rod will cause "corrugated surface" and "chipping" due to slight displacement. phenomenon, which seriously affects the quality of truncation.

In view of this, in the present application, the silicon rod cutting device of the present application further includes a silicon rod stabilizing device corresponding to the wire cutting device. In the embodiments shown in FIG. 2 and FIG. 3 , the silicon rod cutting device of the present application includes silicon rod stabilizing devices corresponding to each single wire cutting device, and each silicon rod stabilizing device is arranged at intervals along the first direction.

In certain embodiments, as shown in FIG. 2 and FIG. 3 , the silicon rod stabilization device further includes a first stabilization component 181 and a second stabilization component 182 spaced along the first direction. The first stabilization component 181 There is a reserved space for accommodating the cutting wire saw in the wire cutting device between the second stabilizing assembly 182 and the second stabilizing assembly 182 . Wherein, any one of the first stabilizing component 181 and the second stabilizing component 182 includes a first side stabilizing member and a second side stabilizing member arranged along the second direction. When the silicon rod to be cut is placed on the material conveying table, the first and second side stabilizing members in the first stabilizing assembly 181 and the second stabilizing assembly 182 can be respectively used to interfere with the silicon to be cut. The opposite sides of the rod are used to limit the silicon rod to be cut to ensure the stability of the silicon rod to be cut during the cutting operation of the silicon rod.

In some embodiments, the first side stabilization member or the second side stabilization member further comprises: a workpiece support block and a workpiece auxiliary support block, wherein the workpiece auxiliary support block is a movable design, that is, the workpiece The auxiliary support block can move relative to the workpiece support block to fit the silicon rod to be cut to be stabilized.

As shown in FIG. 2 and FIG. 3 , the first side stabilization member or the second side stabilization member includes: a workpiece support block and a workpiece auxiliary support block. The workpiece support blocks and auxiliary workpiece support blocks belonging to the first stabilization assembly 181 may be marked as 183 and 185, respectively, and the workpiece support blocks and auxiliary workpiece support blocks of the second stabilization assembly 182 may be marked as 184 and 186, respectively.

The first stabilization assembly and the second stabilization assembly are associated with the wire cutting device. In the embodiment shown in FIG. 1 , the first stabilization assembly 181 and the second stabilization assembly 182 are associated with the single wire cutting device 15 .

The workpiece support block is fixed on a mounting structure. As shown in FIG. 2 and FIG. 3 , the silicon rod stabilizing device may include a first mounting structure 167 and a second mounting structure 168 oppositely disposed along the second direction, wherein the first mounting structure 167 is connected to the wire cutting machine base 160 , the second mounting structure 168 is associated with the cutting bracket 161 in the single-wire cutting unit, and the first side stabilizing member in the first stabilizing assembly 181 and the first side stabilizing member in the second stabilizing assembly 182 are arranged on the first side. On an installation structure 167 , the second side stabilization member in the first stabilization assembly 181 and the second side stabilization member in the second stabilization assembly 182 are disposed on the second installation structure 168 . In this way, the workpiece support block 183 ( 184 ) in the first side stabilizing member is fixed on the first installation structure 167 , and the workpiece support block 183 ( 184 ) in the second side stabilizing member is fixed on the second installation structure 168 .

In this embodiment, the first installation structure 167 is connected to the wire cutting machine base 160, and the second installation structure 168 is connected to the cutting bracket 161 in the single wire cutting unit. Therefore, the silicon rod stabilization device is matched with the wire cutting device, That is, the first stabilizing component 181 and the second stabilizing component 182 in the silicon rod stabilizing device are synchronized with the wire cutting device. In some embodiments, when the wire cutting device changes position by the position adjustment device (eg, the wire cutting device moves along the first direction), the silicon rod stabilizing device moves synchronously with the wire cutting device .

The front end of the workpiece support block for abutting against the silicon rod to be cut is provided with a first abutting portion. As shown in FIGS. 2 and 3 , the front end of the workpiece support block 183 ( 184 ) is provided with a first interference portion, and the first interference portion can be, for example, a slope or an arc portion adapted to the silicon rod to be cut, so The arc portion is not limited, for example, it is a concave arc portion or a convex arc portion.

The workpiece auxiliary support block cooperates with the workpiece support block. As shown in FIGS. 2 and 3 , the workpiece auxiliary support block 185 ( 186 ) is located under the workpiece support block 183 ( 184 ), and the workpiece auxiliary support block 185 ( 186 ) is controlled by the support block driving unit 187 ( 188 ) to move along the The second direction moves to expand and contract relative to the workpiece support block 183 (184).

In some embodiments, the support block driving unit 187 ( 188 ) may be, for example, an air cylinder whose cylinder shaft is connected to the workpiece auxiliary support block 185 ( 186 ).

When it is necessary to drive the auxiliary workpiece support block 185 (186) to extend, the cylinder is driven, and the cylinder shaft of the air cylinder extends and pushes the auxiliary workpiece support block 185 (186) to protrude relative to the workpiece support block. action. FIG. 4 is a diagram showing the protruding state of the workpiece auxiliary support block 185 ( 186 ) after being driven. As shown in FIG. 4 , the workpiece auxiliary support block 185 ( 186 ) is driven to extend and abut against the bottom of the silicon rod 100 to be cut. . When the auxiliary workpiece support block 185 (186) needs to be driven to shrink, the air cylinder is driven, and the cylinder shaft of the air cylinder shrinks and pulls the auxiliary workpiece support block 185 (186) to make it shrink relative to the workpiece support block. FIG. 5 is a diagram showing the retracted state of the auxiliary workpiece support block 185 ( 186 ) after being driven. As shown in FIG. 5 , the auxiliary workpiece support block 185 ( 186 ) is retracted after being driven.

The front end of the workpiece auxiliary support block for abutting against the silicon rod to be cut is provided with a first abutting portion. As shown in FIG. 4 , the front end of the auxiliary workpiece support block 185 ( 186 ) is provided with a second interference portion, and the second interference portion may be, for example, a slope or an arc portion adapted to the silicon rod to be cut. The portion is not limited, for example, it is a concave arc portion, or a convex arc portion, and the like.

As shown in FIG. 4, regarding the workpiece support block 183 (184) and the workpiece auxiliary support block 185 (186), the workpiece support block 183 (184) and the workpiece auxiliary support block 185 (186) belong to the same stable part. The support block 185 (186) is arranged lower than the workpiece support block 183 (184), and when the workpiece auxiliary support block 185 (186) is controlled to extend, the workpiece auxiliary support in the oppositely arranged first side stabilization member The bearing distance between the block 185 (186) and the workpiece auxiliary support block 185 (186) in the second side stabilization part is smaller than that between the workpiece support block 183 (184) in the first side stabilization part and the second side stabilization part. The bearing spacing between the workpiece support blocks 183 (184).

In this way, for each single wire cutting device, there are four stabilizing components in the silicon rod stabilizing device corresponding to the single wire cutting device, which are located in four positions, front, rear, left, right, and right. When the silicon rod to be cut is placed on the material conveying table in a horizontal manner, generally, the workpiece support blocks in the four stabilizing components can abut against the silicon rod to be cut. However, in some cases, due to factors such as the size of the silicon rod or the regularity of the silicon rod, there is one or some of the four workpiece support blocks that fail to interfere with the silicon rod to be cut, or all four workpiece support blocks are It is in contact with the silicon rod to be cut but still cannot be limited and stabilized. At this time, the four workpiece auxiliary support blocks can be further extended by driving the four workpiece auxiliary support blocks to reach the silicon rod to be cut at a lower position, which is different from the original four workpiece support blocks. In cooperation, the position of the silicon rod to be cut can be reliably defined.

When using the silicon rod cutting device shown in FIG. 1 to cut the silicon rod to be cut, first place the silicon rod to be cut on the material conveying table in a horizontal manner. One direction is parallel; use the material conveying table to drive the silicon rod to be cut to the cutting position along the first direction; drive the silicon rod stabilizing device to stabilize the silicon rod to be cut, for example, drive the silicon rod stabilizing device in FIG. 1 . The workpiece auxiliary support block is extended, so that the workpiece support block and the workpiece auxiliary support block in the silicon rod stabilization device cooperate with the silicon rod to be cut to limit the position; independently drive each single wire cutting device (can be part of the single wire cutting device or all of the The single wire cutting unit in the single wire cutting device) descends and is contacted by the single wire cutting wire saw therein and enters the silicon rod to be cut to cut the silicon rod to be cut, and continues to descend the single wire cutting device until the single wire cutting wire saw passes through the silicon rod to be cut to cut Truncated to form silicon rod segments.

As can be seen from the above, the silicon rod stabilizing device includes a first stabilizing component and the second stabilizing component, wherein there is a space between the first stabilizing component and the second stabilizing component for accommodating the cutting device in the wire cutting device. In the indwelling space of the wire saw, the first stabilizing component and the second stabilizing component can stabilize the silicon rod to be cut, which can keep the silicon rod stable during cutting, and avoid the surface damage of the silicon rod when it is cut by the wire cutting device. Surface corrugation, edge chipping and other problems, improve the cutting quality and production efficiency of silicon rods.

In addition, in the cutting operation of the silicon rod to be cut, it is necessary to cut off the impurity layer at the head and tail of the silicon rod to be cut that does not meet the production requirements in the processing process, and then slice the sample piece to check the material of the silicon rod to be cut to be cut. characteristic. Therefore, the silicon rod cutting device of the present application further includes at least one multi-wire cutting device, which can cut the silicon rod to be cut to obtain a silicon rod slice, that is, a desired silicon wafer sample.

In some embodiments, a multi-wire cutting device is provided at the front end of the silicon rod cutting device, which is used for cutting the head of the silicon rod to be cut to obtain slices of the silicon rod to obtain the head of the silicon rod to be cut. In some embodiments, a multi-wire cutting device is provided at the rear end of the silicon rod cutting device, which is used for cutting the tail of the silicon rod to be cut to obtain slices of the silicon rod to obtain the tail of the silicon rod to be cut. In some embodiments, a multi-wire cutting device is provided at both the front end and the rear end of the silicon rod cutting device, which is used to cut the head and tail of the silicon rod to be cut to intercept the silicon rod slice and the head of the silicon rod to be cut. Slice the silicon rod at the tail of the silicon rod to be cut.

The silicon rod cutting device further includes at least one multi-wire cutting device, the multi-wire cutting device has a multi-wire cutting unit, and the multi-wire cutting unit includes a multi-wire cutting wheel, a multi-wire transition wheel, and a closed loop connected end to end A cutting wire, the closed-loop cutting wire is wound around the multi-wire cutting wheel and the multi-wire transition wheel to form a multi-wire cutting wire saw.

Please refer to FIG. 6 , which shows a schematic structural diagram of the silicon rod cutting device of the present application in another embodiment. As shown in FIG. 6 , the silicon rod cutting device in this embodiment at least includes: a machine base 11 , a material conveying table 12 , and at least two wire cutting devices, wherein the at least two wire cutting devices include a single wire cutting device 15 and multiple wire cutting devices. Wire cutting device 13 .

As the main part of the silicon rod cutting equipment, the machine base has a silicon rod processing platform. The silicon rod processing platform can be provided with a wire cutting device for processing, for example, cutting, the silicon rod to be cut. The stick performs the truncation job.

The material conveying table is arranged on the machine base and is used to carry the silicon rods to be cut and drive the silicon rods to be cut to be conveyed along the first direction. Taking a single crystal silicon rod as an example, in this embodiment, the silicon rod is cut in a horizontal manner. As shown in FIG. 6 , the silicon rod processing platform of the machine base 11 is in the shape of a narrow and long rectangle according to the length of the silicon rod to be cut. The material conveying table 12 has a strip structure as a whole. On the processing platform, the silicon rod to be cut can be placed on it in a horizontal manner, and the supported silicon rod to be cut can be driven to move in a first direction. The material conveying table is arranged along the first direction. In this way, when the silicon rod to be cut is placed on the material conveying table in a horizontal manner, the axis of the silicon rod to be cut is substantially parallel to the first direction.

In certain embodiments, the material delivery station includes a roller assembly and a motor assembly for controlling the roller assembly. Wherein, the roller assembly includes: a plurality of roller pairs arranged at intervals along the first direction, and each roller pair includes two rollers connected by a rotating shaft. The roller assembly is divided into a plurality of roller assembly segments according to the number of silicon rod segments to be cut.

The wire cutting device is used for cutting the silicon rod. As shown in FIG. 6 , the silicon rod cutting device includes a plurality of single-wire cutting devices 15 and a multi-wire cutting device 13 . A plurality of single-wire cutting devices 15 are independent of each other and are arranged at intervals along the first direction. A plurality of single-wire cutting devices 15 can perform the cutting operation of the silicon rod to be cut, so that the silicon rod to be cut is cut by the single-wire cutting device 15 to form a multi-section silicon rod. part. The multi-wire cutting device 13 is provided at the front end of the silicon rod cutting device, and is used for cutting the head of the silicon rod to be cut to obtain slices of the silicon rod for obtaining the head of the silicon rod.

The at least two wire cutting devices may be a combination of single wire cutting devices and multiple wire cutting devices.

In this application, the at least two wire cutting devices are a combination of a single wire cutting device and a multi-wire cutting device. They are independent devices and operate independently according to the requirements of the silicon rod cutting operation. Therefore, each wire cutting device can be independently controlled by The device (including the single wire cutting device 15 and the multi-wire cutting device 13 ) is used to perform the cutting operation for the silicon rod to be carried on the material conveying table, which improves the operation freedom and cutting efficiency in the cutting operation of the silicon rod. For example, in some embodiments, all wire cutting devices (including the single wire cutting device 15 and the multi-wire cutting device 13) are controlled to perform the slicing operation of the silicon rod to be cut. In certain embodiments, a portion of the wire dicing device (eg, a portion of the single-wire dicing device 15, the multi-wire dicing device 15, or a portion of the single-wire dicing device 15 and the multi-wire dicing device 15) performs truncation of the silicon rod to be cut operation, the remaining wire cutting devices can remain stationary or do other operations.

Wherein, the number and arrangement of the single wire cutting device 15 and the multi-wire cutting device 13 in the silicon rod cutting device can still be changed in other ways. For example, in some embodiments, the silicon rod cutting device includes a plurality of single-wire cutting devices 15 and a multi-wire cutting device 13, wherein the multi-wire cutting device 13 can be provided at the rear end of the silicon rod cutting device , which is used to cut the tail of the silicon rod to be cut to intercept the silicon rod slice to obtain the tail of the silicon rod. In some embodiments, the silicon rod cutting equipment section includes a plurality of single-wire cutting devices 15 and two multi-wire cutting devices 13, wherein the two multi-wire cutting devices 13 can be respectively provided in the silicon rod cutting equipment. The front end and the rear end are respectively used for cutting the head of the silicon rod to be cut to obtain the silicon rod section of the head of the silicon rod and cutting the tail of the silicon rod to be cut to cut the silicon rod section to obtain the tail of the silicon rod.

Regarding the single-wire cutting device, reference may be made to the relevant description in the aforementioned FIG. 1 , which will not be repeated here.

Regarding the multi-wire cutting device, the multi-wire cutting device has at least one multi-wire cutting unit, the multi-wire cutting unit includes a multi-wire cutting wheel, a multi-wire transition wheel, and an end-to-end closed-loop cutting wire, the closed-loop cutting After the wire is wound around the multi-wire cutting wheel and the multi-wire transition wheel, at least two multi-wire cutting wire saws are formed.

Please refer to FIG. 7 , which is a schematic structural diagram of the multi-wire cutting device of the present application in another embodiment from a first viewing angle. As shown in FIG. 7 , the multi-wire cutting device 13 includes a wire-cutting stand 140 and a multi-wire cutting unit 14 .

In the embodiment shown in FIG. 7 , the wire cutting machine base 140 is disposed on the machine base, and the multi-wire cutting unit 14 is movably installed on the wire cutting machine base 140 through a lifting mechanism. Here, the wire cutting machine base 140 is used as a carrier for disposing the multi-wire cutting unit 14 on the machine base 11, and its specific form can be a beam body, a column body, a plate frame, a bracket, or the like.

The multi-wire cutting unit 14 can be lifted and lowered on the wire cutting machine base 140 through a lifting mechanism. In some implementations, the lifting mechanism may include a lifting guide rail, a sliding block, and a lifting driving unit, wherein the lifting guide rail is disposed on the wire cutting machine base 140 along a third direction, and the sliding block is provided on the wire cutting machine base 140. On the multi-wire cutting unit 14 and adapted to the corresponding lifting guide rail, the lifting driving unit is used for the multi-wire cutting unit 14 to move up and down along the lifting guide rail. In practical applications, in order to enable the multi-wire cutting unit 14 to stably ascend and descend on the wire cutting machine base 140, a double guide rail design may be adopted, that is, two lifting guide rails are used, and the two lifting guide rails are arranged in parallel. In addition, the lift drive unit may further include a lift screw and a lift motor, wherein the lift screw is connected to the multi-wire cutting unit 14 in a third direction, and the lift motor (the lift motor may be, for example, a servo motor) motor) is connected with the lift screw. In this way, the lift screw is driven to rotate by the lift motor, so that the multi-wire cutting unit 14 can be moved up and down along the lift guide rail. The implementation of the lift drive unit is not limited to this, and other components that can drive the multi-wire cutting unit 14 to move up and down along the lift guide are still applicable. For example, the lift drive unit may include a lift rack, and A drive gear meshed with the lift rack, and a drive motor that drives the drive gear to rotate.

The multi-wire cutting unit includes: a cutting bracket, a first closed-loop cutting wire, a second closed-loop cutting wire, a first multi-wire cutting wheel, and a second multi-wire cutting wheel, wherein the first closed-loop cutting wire is wound around the the first multi-wire cutting wheel and the second multi-wire cutting wheel to form a first multi-wire cutting wire saw, and the second closed-loop cutting wire is wound around the first multi-wire cutting wheel and the second multi-wire cutting wheel to form a Second multi-wire cutting wire saw. As shown in FIG. 7 , the multi-wire cutting unit 14 includes a cutting bracket 141 , a first multi-wire cutting wheel 142 , a second multi-wire cutting wheel 143 , a first closed-loop cutting line 144 , and a second closed-loop cutting line 145 .

The cutting bracket 141 is used as a carrier for disposing the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143 and other components on the wire cutting machine base 140, and its specific form can be a beam body, a plate frame, a bracket, etc. . In addition, the cutting support 141 can be lifted and lowered on the wire cutting machine base 140 through a lifting mechanism. For the lifting mechanism, reference can be made to the foregoing description, which will not be repeated here. Using the lifting mechanism, the cutting bracket 141 moves up and down relative to the wire cutting machine base 140 in the third direction, thereby driving the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 and wrapping around the first multi-wire cutting wheel 142 . The multi-wire cutting wire saws on the wire cutting wheel 142 and the second multi-wire cutting wheel 143 move up and down to cut the silicon rod to be cut. Furthermore, in some embodiments, the distal end of the cutting bracket 141 that is relatively far away from the wire cutting machine base 140 can also be defined by a guide rod structure and guide the cutting bracket 141 to operate under the driving of the lifting mechanism. Lift and move.

The first multi-wire cutting wheel and the second multi-wire cutting wheel are arranged on opposite sides of the cutting bracket along the second direction. In the embodiment shown in FIG. 7 , the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 are oppositely disposed on both sides of the bottom of the cutting bracket 141 along the second direction, and the first closed-loop cutting wire 144 is wound around the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 to form the first multi-wire cutting wire saw, and the second closed loop cutting wire 145 is wound around the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 to form a second multi-wire cutting wire saw, the first multi-wire cutting wire saw being parallel to the second multi-wire cutting wire saw and both disposed in the second direction, the first multi-wire cutting wire saw and the second multi-wire cutting wire saw with a predetermined wire spacing.

The first multi-wire cutting wheel 142 includes at least two first cutting wire grooves, and the plane where any of the first cutting wire grooves is located is parallel to the wheel surface of the first multi-wire cutting wheel, that is, the first multi-wire cutting wheel The cutting wire groove on the wheel can be referred to as the first cutting wire groove.

The second multi-wire cutting wheel 143 includes at least two second cutting wire grooves, and the plane where any of the second cutting wire grooves is located is parallel to the wheel surface of the second multi-wire cutting wheel, that is, the second multi-wire cutting wheel The cutting wire groove on the wheel can be referred to as the second cutting wire groove.

The wheel surface of the first multi-wire cutting wheel 142 and the wheel surface of the second multi-wire cutting wheel 143 are parallel or coplanar, so that the first closed-loop cutting wire 144 and the second closed-loop cutting wire 145 are wound around the When the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 are respectively correspondingly used for winding the first closed-loop cutting wire 144, the first cutting wire groove and the second cutting wire groove are located in the same plane and used for winding the The first cutting wire groove and the second cutting wire groove of the two closed-loop cutting wires 145 are located in the same plane, so that the direction of the first multi-wire cutting wire saw can be positioned at the first cutting wire used for winding the first closed-loop cutting wire 144 at the same time. The plane where the cutting wire slot and the second cutting wire slot are located and the direction of the second multi-wire cutting wire saw are both located in the plane where the first cutting wire slot and the second cutting wire slot for winding the second closed-loop cutting wire 145 are located. . It should be understood that the first closed-loop cutting wire 144 and the second closed-loop cutting wire 145 are in a running state during the cutting action, so the multi-wire cutting wire saw is defined by its spatial position. In the embodiment of the present application, the winding The first closed-loop cutting wire 144 and the second closed-loop cutting wire between the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 are the first multi-wire cutting wire saw and the second multi-wire cutting wire saw, respectively.

The bottom of the cutting support 141 has a concave portion, so that the cutting support 141, the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel At least two multi-wire cutting wire saws (ie, the first multi-wire cutting wire saw and the second multi-wire cutting wire saw) formed between the wire cutting wheels 143 may form a cutting accommodation space corresponding to the silicon rod to be cut.

The multi-wire cutting unit further includes at least one first multi-wire transition wheel and at least one second multi-wire transition wheel for pulling the closed-loop cutting wire wound around the first multi-wire cutting wheel and the second multi-wire cutting wheel.

In certain embodiments, the multi-wire cutting unit includes a first multi-wire transition wheel and a second multi-wire transition wheel, the first multi-wire transition wheel being associated with the first multi-wire cutting wheel and the second multi-wire transition wheel The multi-wire cutting wheel forms a triangle, and the second multi-wire transition wheel, the first multi-wire cutting wheel and the second multi-wire cutting wheel form a triangle.

In some embodiments, the multi-wire cutting unit includes two first multi-wire transition wheels and two second multi-wire transition wheels, the two first multi-wire transition wheels and the first multi-wire cutting wheel and The second multi-wire cutting wheel forms a quadrilateral, and the two second multi-wire transition wheels, the first multi-wire cutting wheel and the second multi-wire cutting wheel form a quadrilateral.

In certain embodiments, the multi-wire cutting unit includes three or more first multi-wire transition wheels and three or more second multi-wire transition wheels.

In the embodiment shown in FIG. 7 , the multi-wire cutting unit 14 further includes a first multi-wire transition wheel 145 and a second multi-wire transition wheel 146 , the first multi-wire transition wheel 145 and the second multi-wire transition wheel 145 The transition wheel 146 is disposed on the cutting bracket 141 .

The first multi-line transition wheel 145 is used for reversing or guiding the first closed-loop cutting line 144 , and the second multi-line transition wheel 146 is used for reversing or guiding the second closed-loop cutting line 145 . In the embodiment shown in FIG. 7 , the first multi-wire transition wheel 145 and the second multi-wire transition wheel 145 are arranged on the top of the cutting bracket 141 , and the first multi-wire transition wheel 145 is adjacent to the The first multi-wire cutting wheel 142 and the second multi-wire transition wheel 146 are adjacent to the second multi-wire cutting wheel 143, wherein the first multi-wire transition wheel 145 can be connected to the first multi-wire transition wheel 145. The cutting wheel 142 and the second multi-wire cutting wheel 143 form a first triangle, and the second multi-wire transition wheel 146 may form a second triangle with the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 . The shape of the first triangle formed by the first multi-wire transition wheel 145 and the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 is not limited, and the second multi-wire transition wheel 146 can be combined with any The shape of the second triangle formed by the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 is not limited.

The first multi-wire transition wheel 145 includes at least one first transition wire groove, and the plane where any of the first transition wire grooves is located is parallel to the wheel surface of the first multi-wire transition wheel.

The second multi-wire transition wheel 146 includes at least one second transition wire groove, and the plane where any of the second transition wire grooves is located is parallel to the surface of the second multi-wire transition wheel.

The wheel surface of the first multi-wire transition wheel 145 is parallel or coplanar with the wheel surface of the first multi-wire cutting wheel 142 and the wheel surface of the second multi-wire cutting wheel 143, so that the first closed-loop cutting line 144 is When wound on the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145, they are respectively used for winding the first cutting wire groove and the second cutting wire groove of the first closed-loop cutting wire 144. The wire groove and the first transition wire groove are located in the same plane, so that the direction of the first multi-wire cutting wire saw can be located at the first cutting wire groove and the second cutting wire groove for winding the first closed-loop cutting wire 144 at the same time. and the plane where the first transition slot is located.

Similarly, the wheel surface of the second multi-wire transition wheel 146 is parallel or coplanar with the wheel surface of the first multi-wire cutting wheel 142 and the wheel surface of the second multi-wire cutting wheel 143, so that the second closed-loop cutting When the wire 145 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146, it is respectively used to wind the first cutting wire groove, The second cutting wire groove and the second transition wire groove are located in the same plane, so that the direction of the second multi-wire cutting wire saw can be located at the first cutting wire groove, the second cutting wire groove for winding the second closed-loop cutting wire 145 at the same time The cutting wire groove and the second transition wire groove are in the plane.

Thus, in this embodiment, the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145 of the multi-wire cutting unit are wound by the first closed-loop cutting wire 144, so The first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146 of the multi-wire cutting unit are wound by the second closed-loop cutting wire 145. In this example, the multi-wire cutting The device can omit components such as wire take-up reels and pay-off reels, and the first closed-loop cutting line and the second closed-loop cutting line can be driven and run at high speed to realize cutting.

In the existing silicon rod cutting equipment, the cutting wire is wound from the pay-off drum to the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum. During the cutting process, the The cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process. In the silicon rod cutting device of the present application, the closed-loop cutting line in the wire cutting unit can maintain continuous high-speed operation, and at the same time, the closed-loop cutting line can run in the same running direction during the cutting process. In this way, the wire cutting unit of the present application can achieve high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the closed-loop cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit and eliminate components such as wire take-up and pay-off spools, reducing production costs.

In the multi-wire cutting unit of the present application, a cutting wire driving mechanism is further included, which is used to drive the cutting wire wound around the first multi-wire cutting wheel 142 , the second multi-wire cutting wheel 143 , and the first multi-wire transition wheel 145 . The first closed-loop cutting wire 144 and the second closed-loop cutting wire 145 wound around the first multi-wire cutting wheel 142 , the second multi-wire cutting wheel 143 , and the second multi-wire transition wheel 146 run at high speed.

In some embodiments, at least one of the first multi-wire cutting wheel 142 , the second multi-wire cutting wheel 143 , the first multi-wire transition wheel 145 , and the second multi-wire transition wheel 146 is used as a driving wheel , and others are driven wheels, wherein the driving wheel is associated with the cutting line driving mechanism, and the cutting line driving mechanism drives the driving wheel to rotate and drives the closed-loop cutting line to run at high speed with the cooperation of other driven wheels. .

Since the first closed-loop cutting wire 144 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145, the second closed-loop cutting wire 145 is wound around the first multi-wire cutting wheel 142, The second multi-wire cutting wheel 143 and the second multi-wire transition wheel 146, therefore, in some implementations, the first multi-wire cutting wheel 142 or the second multi-wire cutting wheel 143 may be used as the driving wheel. Taking the first multi-wire cutting wheel 142 as a driving wheel as an example, the first multi-wire cutting wheel 142 is associated with a cutting wire driving mechanism, and the cutting wire driving mechanism can be used to drive the first multi-wire cutting wheel 142 to rotate. In some examples, the cutting wire driving mechanism includes a driving motor, and the motor shaft of the driving motor is directly connected to the wheel shaft of the first multi-wire cutting wheel 142 . The motor shaft drives the first multi-wire cutting wheel 142 to rotate, and the first closed-loop cutting wire 144 is carried to run and make the second multi-wire cutting wheel 143 and the first multi-wire transition wheel 145 rotate, so as to realize the high-speed operation of the first closed-loop cutting wire 144 , the second closed-loop cutting line 145 is carried to run and make the second multi-wire cutting wheel 143 and the second multi-wire transition wheel 146 rotate, so that the second closed-loop cutting line 145 runs at high speed. In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on the motor shaft of the driving motor and the wheel shaft of the first multi-wire cutting wheel, and when the driving motor rotates , the drive belt is driven by the motor shaft of the drive motor, and then the first multi-wire cutting wheel 142 is driven to rotate, and the first closed-loop cutting wire 144 is carried to make the transition between the second multi-wire cutting wheel 143 and the first multi-wire cutting wheel 144 The wheel 145 rotates to realize the high-speed operation of the first closed-loop cutting line 144 , and the second closed-loop cutting line 145 is carried along to make the second multi-line cutting wheel 143 and the second multi-line transition wheel 146 rotate to realize the second closed-loop cutting line 145 Run at high speed.

In some implementations, the first multi-wire transition wheel or the second multi-wire transition wheel may be used as the drive wheel. In some examples, the cutting wire drive mechanism includes a drive motor whose motor shaft is directly connected to the axle of the first multi-wire transition wheel or the second multi-wire transition wheel. In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, and the transmission belt is sleeved on the motor shaft of the driving motor and the axle of the first multi-wire transition wheel or the second multi-wire transition wheel.

In addition, the multi-wire transition wheel can also be used to adjust the tension of the closed-loop cutting wire, that is, the first multi-wire transition wheel can also be used to adjust the tension of the first closed-loop cutting wire, and the second multi-wire transition wheel can also be used To adjust the tension of the second closed-loop cutting line. Accordingly, the multi-wire cutting unit further includes at least one multi-wire tension adjustment mechanism associated with at least one of the first multi-wire transition wheel and the second multi-wire transition wheel.

Please refer to FIG. 8 , which is a schematic structural diagram of the multi-wire cutting device of the present application in another embodiment from a second viewing angle. 7 and 8 , the multi-wire cutting unit 14 includes a first multi-wire tension adjusting mechanism associated with the first multi-wire transition wheel 145 and a second multi-wire transition wheel 146 associated with the second multi-wire transition wheel 146 . Thread tension adjustment mechanism.

Now, the first multi-wire tension adjustment mechanism associated with the first multi-wire transition wheel is used as an example for description, and the second multi-wire tension adjustment mechanism associated with the first multi-wire transition wheel can refer to the first multi-wire tension adjustment mechanism. Tension adjustment mechanism.

The first multi-wire tension adjustment mechanism includes: a multi-wire drive unit 191 and a multi-wire link assembly, the multi-wire link assembly is associated with the first multi-wire transition wheel 145 and the multi-wire drive unit 191, The multi-wire link assembly is controlled by the multi-wire drive unit, that is, the multi-wire link assembly is driven to act by the multi-wire drive unit 191 to drive the first multi-wire transition wheel 145 to generate a position change to generate a position change. The tension of the first closed loop cutting line 144 is adjusted.

In the embodiment shown in FIGS. 7 and 8 , the multi-wire link assembly includes: a pivot shaft 192 , a first link 194 , and a second link 196 .

The pivot shaft 192 is disposed on the cutting bracket 141 .

The first end of the first link 194 is associated with the pivot shaft 192 , and the second end of the first link 194 is connected with the first multi-wire transition wheel 145 .

The first end of the second link 196 is associated with the pivot 192 and the second end of the second link 196 is connected with the multi-wire drive unit.

Through the multi-wire connecting rod assembly, a lever effect can be achieved to adjust the position of the first multi-wire transition wheel 145 .

Regarding the multi-wire drive unit, in some implementations, the multi-wire drive unit 191 includes a counterweight (in the following description, the counterweight is marked as 191 ), and the counterweight 191 can be suspended from the The second end of the second link 196 . For example, when the tension of the first closed-loop cutting line 144 is to be increased, the counterweight portion 191 is released, the counterweight portion 191 descends, and the second end of the second link 196 receives the counterweight portion 191 Under the action of gravity, the pivot shaft 192 is driven to rotate forward (counterclockwise as shown in FIG. 8 ), and the forwardly rotated pivot shaft 192 drives the first link 194 and its associated first multi-line transition wheel 145 to move away from The direction of the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 is moved (for example, toward the top), and the first multi-wire transition wheel 145 and the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel are enlarged. The perimeter of the triangle formed by the wheel 143 increases the tension of the first closed-loop cutting line 144 . When the tension of the first closed-loop cutting line 144 is to be reduced, the counterweight portion 191 is lifted, and the second end of the second link 196 is controlled to lift and drive the pivot shaft 192 to rotate in the opposite direction (as shown in FIG. 8 ). clockwise), the reversely rotated pivot 192 drives the first connecting rod 194 and its associated first multi-wire transition wheel 145 to approach the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 moving in the direction (for example, downward), reducing the perimeter of the triangle formed by the first multi-wire transition wheel 145, the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143, reducing the first closed loop The tension of the cutting line 144 .

The counterweight portion may include a counterweight frame and a counterweight block placed in the configuration frame, wherein the number of the counterweight blocks may be changed according to the requirements of the tension adjustment of the first closed-loop cutting line 144 , For example, when the tension of the first closed-loop cutting line 144 is increased, the number of counterweight blocks can be increased, and when the tension of the second closed-loop cutting line 145 is decreased, the number of counterweight blocks can be decreased.

The configuration frame can be moved up and down relative to the cutting support 141 through the up and down guide rails.

In some embodiments, the counterweight portion may include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting bracket 141 , so that the counterweight portion is connected to the cutting bracket 141 . switch from active to locked state. In some examples, the locking mechanism may be a latch, for example.

In some embodiments, the multi-wire tension adjustment mechanism may further include a multi-wire tension balance component for ensuring that the tensions of the counterweight portion 191 and the first closed-loop cutting wire 144 are in a balanced state. In the embodiment shown in FIG. 8 , the multi-thread tension adjusting mechanism further includes a multi-thread tension balancing member 193, which is a tension balancing cylinder (in the following description, the tension balancing cylinder is marked as 193 ), the tension balance cylinder 193 acts on the second connecting rod 196 , for example, the extension end of the second connecting rod 196 .

For example, when the tension of the first closed-loop cutting line 144 is to be increased, the counterweight portion 191 is released, the counterweight portion 191 descends, and the second end of the second link 196 is under the gravity of the counterweight portion 191 . Under the action, the pivot shaft 192 is driven to rotate in the forward direction (counterclockwise as shown in FIG. 8 ), and the forwardly rotated pivot shaft 192 then drives the first link 194 and its associated first multi-line transition wheel 145 to move away from the The direction of the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 is moved (for example, toward the top), and the first multi-wire transition wheel 145 and the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 are enlarged. The perimeter of the formed triangle increases the tension of the first closed-loop cutting line 144 until the tension of the first closed-loop cutting line 144 is adjusted to the expected value, and the cylinder shaft of the tension balance cylinder 193 pulls the first closed-loop cutting line 144. The two connecting rods 196 make the counterweight portion 191 and the second connecting rod 196 no longer move, that is, remain stationary relative to the cutting bracket 141 . When the tension of the first closed-loop cutting line 144 is to be reduced, the second connecting rod 196 is pulled by the cylinder shaft of the tension balancing cylinder 193, the counterweight and the second connecting rod 196 are lifted, and the pivot shaft is driven 192 rotates in the reverse direction (clockwise as shown in FIG. 8 ), and the reversely rotated pivot shaft 192 drives the first connecting rod 194 and its associated first multi-wire transition wheel 145 to approach the first multi-wire cutting The direction of the wheel 142 and the second multi-wire cutting wheel 143 is moved (for example, toward the bottom), and the triangle formed by the first multi-wire transition wheel 145 and the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 is reduced. Circumference, reduce the tension of the first closed-loop cutting line 144, until the tension of the first closed-loop cutting line 144 is adjusted to the expected value, the tension balance cylinder 193 stops the cylinder shaft at the current position, so that the matching The weight portion 191 and the second link 196 no longer move, that is, remain stationary relative to the cutting bracket 141 .

Still other variations of the multi-wire drive unit may be made, for example, in some implementations, the multi-wire drive unit may include a tension cylinder located below the second connecting rod and the cylinder of the tension cylinder. A shaft is connected to the second end of the second link. For example, when the tension of the first closed-loop cutting line 144 is to be increased, the tension cylinder shrinks the cylinder shaft, pulls the second link 196 and drives the pivot shaft 192 to rotate forward (counterclockwise as shown in FIG. 8 ), The positively rotating pivot 192 then drives the first link 194 and its associated first multi-wire transition wheel 145 to move away from the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 (eg, moving upward) to expand the perimeter of the triangle formed by the first multi-wire transition wheel 145 , the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 to increase the tension of the first closed-loop cutting wire 144 . When the tension of the first closed-loop cutting line 144 is to be reduced, the cylinder shaft is extended from the tension cylinder, and the second end of the second connecting rod 196 is controlled to lift and drive the pivot shaft 192 to rotate in the opposite direction (see FIG. 8 ). clockwise in ), the pivot shaft 192 that rotates in the opposite direction drives the first link 194 and its associated first multi-wire transition wheel 145 to approach the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 145 The direction of the wheel 143 (for example, downward) moves, reducing the perimeter of the triangle formed by the first multi-wire transition wheel 145, the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143, reducing the first multi-wire transition wheel 145. Tension of a closed loop cutting line 144.

The silicon rod cutting device of the present application further includes a silicon rod stabilizing device corresponding to the wire cutting device, which is used to avoid surface damage, surface ripples, edge chipping, etc. of the silicon rod when it is cut by the wire cutting device. In the embodiment shown in FIG. 7 , the silicon rod cutting device further includes a silicon rod stabilizing device corresponding to the multi-wire cutting device, so as to avoid surface damage to the silicon rod when it is cut by the multi-wire cutting device , surface ripple, edge collapse, etc.

As shown in FIG. 7, the multi-wire cutting unit of the multi-wire cutting device includes a first multi-wire cutting wheel 142, a second multi-wire cutting wheel 143, a first multi-wire transition wheel 145, and a second multi-wire transition wheel The wheel 146, the first closed-loop cutting line 144, and the second closed-loop cutting line 145, wherein the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 are oppositely arranged along the second direction, and the first closed-loop cutting line 144 Winding around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145 to form a first multi-wire cutting wire saw, the second closed-loop cutting wire 145 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146 to form a second multi-wire cutting wire saw, by which the silicon rod to be cut is cut to perform the silicon rod cutting operation and the silicon rod Sample work. Among them, when the silicon rod to be cut is cut off (that is, when the multi-wire cutting wire saw is going to exit the wire from the inside of the silicon rod to be cut), the cutting surface of the silicon rod will cause a "corrugated surface" and "chipping" due to slight displacement. ” phenomenon, which seriously affects the quality of truncation.

In view of this, in the present application, the silicon rod cutting device of the present application further includes a silicon rod stabilizing device corresponding to the wire cutting device. As shown in FIG. 7 and FIG. 8 , the silicon rod cutting device of the present application includes silicon rod stabilizing devices corresponding to each single-wire cutting device and multi-wire cutting device, and each silicon rod stabilizing device is arranged at intervals along the first direction.

In this embodiment, the silicon rod stabilizing device includes a first stabilizing component and a second stabilizing component spaced along a first direction, and there is a space between the first stabilizing component and the second stabilizing component for accommodating the The reserved space for the cutting wire saw in the wire cutting device. Wherein, any one of the first stabilizing component and the second stabilizing component includes a first side stabilizing member and a second side stabilizing member arranged along the second direction, which are respectively used to interfere with the silicon rod to be cut. opposite sides. Any one of the first and second side stabilization members includes: a workpiece support block; a workpiece auxiliary support block, the workpiece auxiliary support block being controlled by the support block driving unit to move in the second direction to move in the second direction Extends and contracts relative to the workpiece support block.

In the embodiments shown in FIGS. 7 and 8 , the silicon rod cutting device of the present application includes a silicon rod stabilizing device corresponding to the multi-wire cutting device.

In some embodiments, as shown in FIG. 7 and FIG. 8 , the silicon rod stabilization device further includes a first stabilization component 181 and a second stabilization component 182 spaced along the first direction. The first stabilization component 181 There is a reserved space for accommodating the cutting wire saw in the wire cutting device between the second stabilizing assembly 182 and the second stabilizing assembly 182 . Wherein, any one of the first stabilizing component 181 and the second stabilizing component 182 includes a first side stabilizing member and a second side stabilizing member arranged along the second direction. When the silicon rod to be cut is placed on the material conveying table, the first and second side stabilizing members in the first stabilizing assembly 181 and the second stabilizing assembly 182 can be respectively used to interfere with the silicon to be cut. The opposite sides of the rod are used to limit the silicon rod to be cut to ensure the stability of the silicon rod to be cut during the cutting operation of the silicon rod.

In some embodiments, the first side stabilization member or the second side stabilization member further comprises: a workpiece support block and a workpiece auxiliary support block, wherein the workpiece auxiliary support block is a movable design, that is, the workpiece The auxiliary support block can move relative to the workpiece support block to fit the silicon rod to be cut to be stabilized.

As shown in FIG. 7 and FIG. 8 , the first side stabilization member or the second side stabilization member includes: a workpiece support block and a workpiece auxiliary support block. The workpiece support blocks and auxiliary workpiece support blocks belonging to the first stabilization assembly 181 may be marked as 183 and 185, respectively, and the workpiece support blocks and auxiliary workpiece support blocks of the second stabilization assembly 182 may be marked as 184 and 186, respectively.

The first stabilization assembly and the second stabilization assembly are associated with the wire cutting device. In the embodiment shown in FIG. 6 , the first stabilization assembly 181 and the second stabilization assembly 182 are associated with the single wire cutting device 15 , and the first stabilization assembly 181 and the second stabilization assembly 182 are associated with the multiwire cutting device 13 .

The workpiece support block is fixed on a mounting structure. As shown in FIG. 7 and FIG. 8 , the silicon rod stabilizing device may include a first mounting structure 147 and a second mounting structure 148 oppositely disposed along the second direction, wherein the first mounting structure 147 is connected to the wire cutting machine base 140 , the second mounting structure 148 is associated with the cutting support 141 in the single-wire cutting unit, and the first side stabilizing member in the first stabilizing assembly 181 and the first side stabilizing member in the second stabilizing assembly 182 are arranged on the first side. On an installation structure 147 , the second side stabilization member in the first stabilization assembly 181 and the second side stabilization member in the second stabilization assembly 182 are disposed on the second installation structure 148 . In this way, the workpiece support block 183 ( 184 ) in the first side stabilizing part is fixed on the first installation structure 147 , and the workpiece support block 183 ( 184 ) in the second side stabilizing part is fixed on the second installation structure 148 .

In this embodiment, the first installation structure 147 is connected to the wire cutting machine base 140, and the second installation structure 148 is connected to the cutting support 141 in the single wire cutting unit. Therefore, the silicon rod stabilizing device is matched with the wire cutting device. That is, the first stabilizing component 181 and the second stabilizing component 182 in the silicon rod stabilizing device are synchronized with the wire cutting device. In some embodiments, when the wire cutting device is changed in position by the position adjustment device (eg, the wire cutting device moves along the first direction), the silicon rod stabilizing device moves synchronously with the wire cutting device .

The front end of the workpiece support block for abutting against the silicon rod to be cut is provided with a first abutting portion. As shown in FIG. 7 and FIG. 8 , the front end of the workpiece support block 183 ( 184 ) is provided with a first interference portion, and the first interference portion may be, for example, a slope or arc adapted to the silicon rod to be cut. The arc portion is not limited, for example, it is a concave arc portion or a convex arc portion.

The workpiece auxiliary support block cooperates with the workpiece support block. As shown in FIGS. 7 and 8 , the workpiece auxiliary support block 185 ( 186 ) is located under the workpiece support block 183 ( 184 ), and the workpiece auxiliary support block 185 ( 186 ) is controlled by the support block driving unit 187 ( 188 ) to move along the The second direction moves to expand and contract relative to the workpiece support block 183 (184).

In some embodiments, the support block driving unit 187 ( 188 ) may be, for example, an air cylinder whose cylinder shaft is connected to the workpiece auxiliary support block 185 ( 186 ).

When it is necessary to drive the auxiliary workpiece support block 185 (186) to extend, the cylinder is driven, and the cylinder shaft of the air cylinder extends and pushes the auxiliary workpiece support block 185 (186) to protrude relative to the workpiece support block. action. FIG. 4 is a diagram showing the protruding state of the workpiece auxiliary support block 185 ( 186 ) after being driven. As shown in FIG. 4 , the workpiece auxiliary support block 185 ( 186 ) is driven to extend and abut against the bottom of the silicon rod 100 to be cut. . When the auxiliary workpiece support block 185 (186) needs to be driven to shrink, the air cylinder is driven, and the cylinder shaft of the air cylinder shrinks and pulls the auxiliary workpiece support block 185 (186) to make it shrink relative to the workpiece support block. FIG. 5 is a diagram showing the retracted state of the auxiliary workpiece support block 185 ( 186 ) after being driven. As shown in FIG. 5 , the auxiliary workpiece support block 185 ( 186 ) is retracted after being driven.

The front end of the workpiece auxiliary support block for abutting against the silicon rod to be cut is provided with a first abutting portion. As shown in FIG. 4 , the front end of the auxiliary workpiece support block 185 ( 186 ) is provided with a second interference portion, and the second interference portion may be, for example, a slope or an arc portion adapted to the silicon rod to be cut. The portion is not limited, for example, it is a concave arc portion, or a convex arc portion, and the like.

As shown in FIG. 4, regarding the workpiece support block 183 (184) and the workpiece auxiliary support block 185 (186), the workpiece support block 183 (184) and the workpiece auxiliary support block 185 (186) belong to the same stable part. The support block 185 (186) is arranged lower than the workpiece support block 183 (184), and when the workpiece auxiliary support block 185 (186) is controlled to extend, the workpiece auxiliary support in the oppositely arranged first side stabilization member The bearing distance between the block 185 (186) and the workpiece auxiliary support block 185 (186) in the second side stabilization part is smaller than that between the workpiece support block 183 (184) in the first side stabilization part and the second side stabilization part. The bearing spacing between the workpiece support blocks 183 (184).

In this way, for each single wire cutting device, there are four stabilizing components in the silicon rod stabilizing device corresponding to the single wire cutting device, which are located at four positions, front, rear, left, right, and right. When the silicon rod to be cut is placed on the material conveying table in a horizontal manner, generally, the workpiece support blocks in the four stabilizing components can abut against the silicon rod to be cut. However, in some cases, due to factors such as the size of the silicon rod or the regularity of the silicon rod, there is one or some of the four workpiece support blocks that fail to interfere with the silicon rod to be cut, or all four workpiece support blocks are It is in contact with the silicon rod to be cut but still cannot be limited and stabilized. At this time, the four workpiece auxiliary support blocks can be further extended by driving the four workpiece auxiliary support blocks to reach the silicon rod to be cut at a lower position, which is different from the original four workpiece support blocks. In cooperation, the position of the silicon rod to be cut can be reliably defined.

When the silicon rod cutting device shown in FIG. 6 is used to cut the silicon rod, first place the silicon rod to be cut on the material conveying table in a horizontal manner, and the axis of the silicon rod is parallel to the first direction. ; Use the material conveying table to drive the silicon rod to be cut to the cutting position along the first direction; drive the silicon rod stabilizing device to stabilize the silicon rod to be cut, for example, drive the workpiece auxiliary support in the silicon rod stabilizing device in FIG. 6 The block is extended, so that the workpiece support block and the workpiece auxiliary support block in the silicon rod stabilization device cooperate with the silicon rod to limit the position; independently drive multiple single wire cutting devices (can be part of the single wire cutting device or all single wire cutting devices) The single-wire cutting unit in the multi-wire cutting unit and the multi-wire cutting unit in the multi-wire cutting device descend and are contacted by the single-wire cutting wire saw in the single-wire cutting unit and the multi-wire cutting wire saw in the multi-wire cutting unit and enter the silicon rod to The rod is cut, and the multi-wire cutting device continues to descend until the multi-wire cutting wire saw goes out of the silicon rod to cut off to form a silicon rod segment (the single-wire cutting unit in the multiple single-wire cutting devices and the multi-wire cutting device in the multi-wire cutting device are driven independently. The unit includes driving the multi-wire cutting unit in the multi-wire cutting device first and then driving the single-wire cutting unit in multiple single-wire cutting devices, or simultaneously driving the single-wire cutting unit in multiple single-wire cutting devices and the multi-wire cutting device in the multi-wire cutting device. unit), wherein the first multi-wire cutting wire saw and the second multi-wire cutting wire saw in the multi-wire cutting unit cooperate to cut off a silicon rod sample, and the thickness of the silicon rod sample corresponds to the first multi-wire cutting wire The wire spacing between the saw and the second multi-wire cutting wire.

Please refer to FIG. 9 , which is a schematic structural diagram of a silicon rod cutting device according to another embodiment of the present application. As shown in FIG. 9 , the silicon rod cutting device in this embodiment may at least include: a machine base 21 , a material conveying table 22 , and at least two wire cutting devices, wherein the at least two wire cutting devices include a single wire cutting device 25.

The wire cutting device is used for cutting the silicon rod to be cut. As shown in FIG. 9 , the silicon rod cutting device includes a plurality of single-wire cutting devices 25 , which are independent of each other and are arranged at intervals along the first direction, and the silicon rods to be cut can be cut through the plurality of single-wire cutting devices 25 . The cutting operation is performed so that the silicon rod to be cut is cut by the single wire cutting device 15 to form a multi-section silicon rod section.

Please refer to FIG. 10 and FIG. 11 , wherein, FIG. 10 shows a schematic structural diagram of the single wire cutting device of the present application from a first viewing angle in another embodiment, and FIG. 11 shows the single wire cutting device of the present application in another embodiment. Schematic diagram of the structure from the second perspective. In the embodiment shown in FIGS. 10 and 11 , the single wire cutting device 25 includes a wire cutting machine base 260 and a single wire cutting unit 26 .

The wire cutting machine base 260 is installed on the machine base, and the single wire cutting unit 26 is movably installed on the wire cutting machine base 260 through a lifting mechanism. Here, the wire cutting machine base 260 is used as a carrier for disposing the single wire cutting unit 26 on the machine base 21, and its specific form can be a beam body, a column body, a plate frame, a bracket, or the like.

The single wire cutting unit 26 can be lifted and lowered on the wire cutting machine base 260 through a lifting mechanism. In some implementations, the lift mechanism may include lift rails, sliders, and lift drive units. Wherein, the lifting guide rail is arranged on the wire cutting machine base 260 along the third direction, the sliding block is arranged on the single wire cutting unit 26 and is adapted to the corresponding lifting guide rail, the lifting driving unit It is used for the single-wire cutting unit 26 to move up and down along the lift rail. The lift drive unit may further include a lift screw and a lift motor, wherein the lift screw is connected to the single wire cutting unit 26 along the third direction, and the lift motor (the lift motor may be, for example, a servo motor) is a connected with the lift screw. In some implementations, the lift driving unit may include a lift rack, a drive gear meshed with the lift rack, and a drive motor that drives the drive gear to rotate.

The single-wire cutting unit includes: a cutting bracket, a closed-loop cutting wire, a first single-wire cutting wheel, a second single-wire cutting wheel, and at least one single-wire transition wheel, wherein the closed-loop cutting wire is wound around the first single-wire cutting wheel, A second single-wire cutting wheel, and at least one single-wire transition wheel to form a single-wire cutting wire saw. In certain embodiments, the single-wire cutting unit includes two single-wire transition wheels. As shown in FIG. 10 , the single wire cutting unit 26 includes: a cutting bracket 261 , a first single wire cutting wheel 262 , a second single wire cutting wheel 263 , a closed-loop cutting wire 264 , a first single wire transition wheel 265 , and a second single wire transition wheel 266.

The cutting bracket 261 is used as a carrier for disposing the first single wire cutting wheel 262, the second single wire cutting wheel 263, the first single wire transition wheel 265, and the second single wire transition configuration on the wire cutting machine base 260, and its specific form can be adopted Beams, plates, brackets, etc. In addition, the cutting support 261 can be lifted and lowered on the wire cutting machine base 260 by a lifting mechanism. For the lifting mechanism, reference can be made to the above description, and details are not repeated here. Using the lifting mechanism, the cutting bracket 261 moves up and down relative to the wire cutting machine base 260 in the third direction, thereby driving the first single wire cutting wheel 262, the second single wire cutting wheel 263, the first single wire transition wheel 265, And the second single wire transition wheel 266 and the single wire cutting wire saw wound around the first single wire cutting wheel 262, the second single wire cutting wheel 263, the first single wire transition wheel 265, and the second single wire transition wheel 266 move up and down to move up and down. Cut the silicon rod for cutting. Furthermore, in some embodiments, the distal end of the cutting bracket 261 that is relatively far away from the wire cutting machine base 260 can also be defined by a guide rod structure and guide the cutting bracket 261 to operate under the driving of the lifting mechanism. Lift and move.

The first single-wire cutting wheel and the second single-wire cutting wheel are disposed on opposite sides of the cutting bracket along the second direction. In the embodiment shown in FIG. 10 and FIG. 11 , the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 are oppositely disposed on both sides of the bottom of the cutting bracket 261 along the second direction, and the closed-loop cutting line 264 Winding around the first single wire cutting wheel 262 and the second single wire cutting wheel 263 to form a single wire cutting wire saw, the single wire cutting wire saw is disposed along the second direction.

The first single wire cutting wheel 262 includes at least one first cutting wire groove, and the plane where any of the first cutting wire grooves is located is parallel to the wheel surface of the first single wire cutting wheel, that is, the grooves on the first single wire cutting wheel. The cutting wire slot may be referred to as the first cutting wire slot.

The second single wire cutting wheel 263 includes at least one second cutting wire groove, and the plane where any of the second cutting wire grooves is located is parallel to the surface of the second single wire cutting wheel, that is, the grooves on the second single wire cutting wheel. Each of the cutting wire grooves may be referred to as the second cutting wire groove.

The wheel surface of the first single wire cutting wheel 262 is parallel or coplanar with the wheel surface of the second single wire cutting wheel 263, so that the closed-loop cutting wire 264 is wound around the first single wire cutting wheel 262 and the second single wire cutting wheel 262. When the wheel 263 is used, the first cutting wire groove and the second cutting wire groove for winding the closed-loop cutting wire 264 are correspondingly located in the same plane, so that the direction of the single-wire cutting wire saw can be located at the same time for winding the closed-loop cutting wire. 264 in the plane where the first cutting line slot and the second cutting line slot are located. It should be understood that the closed-loop cutting wire 264 is in a running state during the cutting action, so the single-wire cutting wire saw is defined by its spatial position. In the embodiment of the present application, it is wound around the first single-wire cutting wheel 262 and the second The closed loop cutting wire 264 between the single wire cutting wheels 263 is the single wire cutting wire saw.

It should be understood that when the closed-loop cutting wire 264 is wound around any single-wire cutting wheel (the first single-wire cutting wheel 262 or the second single-wire cutting wheel 263 ), the closed-loop cutting wires 264 on both sides of the single-wire cutting wheel should be located at all In the single-wire cutting wheel, the cutting wire groove for winding the closed-loop cutting wire 264 is located in the plane.

The bottom of the cutting bracket 261 has a concave portion, so that the cutting bracket 261 , the first single wire cutting wheel 262 , the second single wire cutting wheel 263 , and the first single wire cutting wheel 262 and the second single wire cutting wheel 263 are wound around the first single wire cutting wheel 262 and the second single wire cutting wheel 263 The single wire cutting wire saw formed therebetween can form a cutting accommodating space corresponding to the silicon rod to be cut.

The first single-wire transition wheel and the second single-wire transition wheel are used for reversing or guiding the closed-loop cutting line. In the embodiment shown in FIG. 11 , the first single wire transition wheel 265 and the second single wire transition wheel 266 are provided on the top of the cutting bracket 261 , wherein the first single wire transition wheel 265 is adjacent to the first single wire transition wheel 265 A single wire cutting wheel 262, the second single wire transition wheel 266 adjacent to the second single wire cutting wheel 263, the first single wire cutting wheel 262, the second single wire cutting wheel 263, the first single wire transition wheel 265, and the second single wire cutting wheel 262 The single wire transition wheel 266 forms a quadrilateral. The shape of the quadrilateral formed by the first single wire cutting wheel 262 , the second single wire cutting wheel 263 , the first single wire transition wheel 265 , and the second single wire transition wheel 266 is not limited. In some examples, the first single wire cutting wheel 262 , the second single wire cutting wheel 263 , the first single wire transition wheel 265 , and the second single wire transition wheel 266 form a regular quadrilateral, such as an isosceles trapezoid, a rectangle, and the like. In some examples, the first single wire cutting wheel 262 , the second single wire cutting wheel 263 , the first single wire transition wheel 265 , and the second single wire transition wheel 266 may also form any quadrilateral.

The first single wire transition wheel 265 includes at least one first transition wire slot, and the plane where any of the first transition wire slots is located is parallel to the surface of the first single wire transition wheel. The second single-wire transition wheel 266 includes at least a second transition wire groove, and the plane where any of the second transition wire grooves is located is parallel to the wheel surface of the second single-wire transition wheel.

The wheel surface of the first single wire transition wheel 265 and the wheel surface of the second single wire transition wheel 266 are parallel or coplanar with the wheel surface of the first single wire cutting wheel 262 and the second single wire cutting wheel 263, so that the When the closed loop cutting wire 264 is wound around the first single wire cutting wheel 262 , the second single wire cutting wheel 263 , the first single wire transition wheel 265 , and the second single wire transition wheel 266 , the closed loop cutting wire 264 is respectively used for winding the first The cutting wire groove, the second cutting wire groove, the first transition wire groove, and the second transition wire groove are located in the same plane, so that the direction of the single wire cutting wire saw can be located at the same time as the first wire used for winding the closed loop cutting wire 264. The cutting wire groove, the second cutting wire groove, the first transition wire groove, and the second transition wire groove are in a plane.

In this way, in this embodiment, the first single wire cutting wheel 262, the second single wire cutting wheel 263, the second single wire transition wheel 266, and the first single wire transition wheel 265 of the single wire cutting unit are wound by the closed loop cutting wire 264, In this example, the single wire cutting device can omit components such as a wire take-up spool and a wire pay-off spool, and the closed-loop cutting wire can be driven and run at a high speed to achieve cutting.

In the existing silicon rod cutting equipment, the cutting wire is wound from the pay-off drum to the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum. During the cutting process, the The cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process. In the silicon rod cutting device of the present application, the closed-loop cutting line in the wire cutting unit can maintain continuous high-speed operation, and at the same time, the closed-loop cutting line can run in the same running direction during the cutting process. In this way, the wire cutting unit of the present application can achieve high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the closed-loop cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit and eliminate components such as wire take-up and pay-off spools, reducing production costs.

The single wire cutting unit of the present application further includes a cutting wire driving mechanism for driving the first single wire cutting wheel 262, the second single wire cutting wheel 263, the first single wire transition wheel 265, and the second single wire transition wheel The closed loop cutting line 264 on 266 runs at high speed.

In some embodiments, at least one of the first single wire cutting wheel 262, the second single wire cutting wheel 263, the first single wire transition wheel 265, and the second single wire transition wheel 266 is used as a driving wheel, and the other As a driven wheel, wherein the driving wheel is associated with the cutting wire driving mechanism, the driving wheel is driven to rotate by the cutting wire driving mechanism, and the closed-loop cutting wire 264 is driven to run at high speed with the cooperation of other driven wheels.

In some implementations, the first single wire cutting wheel 262 or the second single wire cutting wheel 263 may be used as the drive wheel. Taking the first single wire cutting wheel 262 as the driving wheel as an example, the first single wire cutting wheel 262 is associated with a cutting wire driving mechanism, and the cutting wire driving mechanism can be used to drive the first single wire cutting wheel 262 to rotate. In some examples, the cutting wire driving mechanism includes a driving motor, and the motor shaft of the driving motor is directly connected to the wheel shaft of the first single wire cutting wheel 262. When the driving motor rotates, the motor of the driving motor is rotated by the driving motor. The shaft drives the first single-wire cutting wheel 262 to rotate, and the closed-loop cutting line 264 is carried along and makes the second single-wire cutting wheel 263, the second single-wire transition wheel 266, and the first single-wire transition wheel 265 rotate, so as to realize the high-speed operation of the closed-loop cutting line 264 . In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on the motor shaft of the driving motor and the wheel shaft of the first single wire cutting wheel, and when the driving motor rotates, The drive belt is driven by the motor shaft of the drive motor, and then the first single-wire cutting wheel 262 is driven to rotate, and the closed-loop cutting wire 264 is carried along to make the second single-wire cutting wheel 263, the second single-wire transition wheel 266, and the first single-wire cutting wheel 263. The single-line transition wheel 265 rotates to realize the high-speed operation of the closed-loop cutting line 264 .

In some implementations, the first single wire transition wheel 265 or the second single wire transition wheel 266 may be used as the drive wheel. Taking the first single wire transition wheel 265 as a driving wheel as an example, the first single wire transition wheel 265 is associated with a cutting wire driving mechanism, and the cutting wire driving mechanism can be used to drive the first single wire transition wheel 265 to rotate. In some examples, the cutting wire driving mechanism includes a driving motor, and the motor shaft of the driving motor is directly connected to the wheel shaft of the first single-wire transition wheel 265, and when the driving motor rotates, the motor of the driving motor is driven by the driving motor The shaft drives the first single-wire transition wheel 265 to rotate, and the closed-loop cutting line 264 is carried along and makes the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the second single-wire transition wheel 266 rotate, so as to realize the high-speed of the closed-loop cutting line 264. run. In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on the motor shaft of the driving motor and the wheel shaft of the first single-wire transition wheel, and when the driving motor rotates, The drive belt is driven by the motor shaft of the drive motor, and then the first single-wire transition wheel 265 is driven to rotate, and the closed-loop cutting wire 264 is carried along to make the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the second single-wire cutting wheel 263. The single-line transition wheel 266 rotates to realize the high-speed operation of the closed-loop cutting line 264 .

In the existing silicon rod cutting equipment, the cutting wire is wound from the pay-off drum to the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum. During the cutting process, the The cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process. In the silicon rod cutting device of the present application, the closed-loop cutting line in the wire cutting unit can maintain continuous high-speed operation, and at the same time, the closed-loop cutting line can run in the same running direction during the cutting process. In this way, the wire cutting unit of the present application can achieve high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the closed-loop cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit and eliminate components such as wire take-up and pay-off spools, reducing production costs.

In addition, the single-wire transition wheel can also be used to adjust the tension of the closed-loop cutting wire. Accordingly, the single wire cutting unit further includes a single wire tension adjustment mechanism associated with the at least one single wire transition wheel.

In certain embodiments, the single wire cutting unit further includes a single wire tension adjustment mechanism associated with at least one of the first single wire transition wheel and the second single wire transition wheel.

In the following description, the single-thread tension adjustment mechanism associated with the first single-thread transition wheel is taken as an example.

10 and 11 , the single wire cutting unit 26 includes a single wire tension adjustment mechanism associated with the first single wire transition wheel 265 .

The single-wire tension adjustment mechanism includes: a single-wire drive unit 271 and a single-wire link assembly, the single-wire link assembly is associated with the first single-wire transition wheel 265 and the single-wire drive unit 271, and the single-wire link assembly is controlled In the single-wire driving unit, that is, the single-wire connecting rod assembly is driven by the single-wire driving unit 271 to drive the first single-wire transition wheel to change the position to adjust the tension of the closed-loop cutting wire 264 .

In the embodiment shown in FIGS. 10 and 11 , the single-wire link assembly includes: a pivot shaft 272 , a first link 274 , and a second link 276 .

The pivot shaft 272 is disposed on the cutting bracket 261 .

The first end of the first link 274 is associated with the pivot shaft 272 , and the second end of the first link 274 is connected with the first single wire transition wheel 265 .

The first end of the second link 276 is associated with the pivot shaft 272 and the second end of the second link 276 is connected with the single wire drive unit.

Through the single-wire link assembly, a lever effect can be achieved to adjust the position of the first single-wire transition wheel 265 .

Regarding the single-wire drive unit, in some implementations, the single-wire drive unit 271 includes a counterweight portion (in the following description, the counterweight portion is marked as 271 ), the counterweight portion can be suspended from the second link 276 second end. For example, when the tension of the closed-loop cutting line 264 is to be increased, the counterweight portion 271 is released, the counterweight portion 271 descends, and the second end of the second link 276 is under the gravity of the counterweight portion 271 . Under the action, the pivot shaft 272 is driven to rotate forward (counterclockwise as shown in FIG. 11 ), and the forwardly rotated pivot shaft 272 drives the first link 274 and its associated first single-line transition wheel 265 to move away from the first connecting rod 274 . A single-wire cutting wheel 262 and a second single-wire cutting wheel 263 move in the direction (for example, toward the top), and the first single-wire transition wheel 265 and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the second single-wire transition wheel are enlarged The perimeter of the quadrilateral formed by 266 increases the tension of the closed loop cutting line 264 . When the tension of the closed-loop cutting line 264 is to be reduced, the counterweight portion 271 is lifted, and the second end of the second link 276 is controlled to lift and drive the pivot shaft 272 to rotate in the opposite direction (clockwise as shown in FIG. 11 ). ), the pivot shaft 272 that rotates in the opposite direction drives the first link 274 and its associated first single-wire transition wheel 265 toward the direction close to the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (for example, toward the down) to reduce the perimeter of the quadrilateral formed by the first single wire transition wheel 265, the first single wire cutting wheel 262, the second single wire cutting wheel 263 and the second single wire transition wheel 266, and reduce the closed loop cutting line 264 tension.

The counterweight portion may include a counterweight frame and counterweight blocks placed in the configuration frame, wherein the number of the counterweight blocks may vary according to the requirements of tension adjustment of the closed-loop cutting line 264, for example, When the tension of the closed-loop cutting line 264 is increased, the number of counterweights can be increased, and when the tension of the closed-loop cutting line 264 is decreased, the number of counterweights can be decreased.

The configuration frame can be moved up and down relative to the cutting support 261 through the up and down guide rails.

In some embodiments, the counterweight portion may include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting bracket 261 , so that the counterweight portion is connected to the cutting bracket 261 . switch from active to locked state. In some examples, the locking mechanism may be a latch, for example.

In some embodiments, the weight portion may include a single wire tension balance member for ensuring that the tension of the weight portion and the closed loop cutting wire 264 is in a balanced state. In the embodiment shown in FIG. 11 , the single-thread tension adjusting mechanism further includes a single-thread tension balancing part 273, which is a tension-balancing cylinder (in the following description, the tension-balancing cylinder is marked as 273), The tension balance cylinder 173 acts on the second connecting rod 176 , for example, the extension end of the second connecting rod 176 .

For example, when the tension of the closed-loop cutting line 264 is to be increased, the counterweight portion 271 is released, the counterweight portion 271 descends, and the second end of the second link 276 is under the gravity of the counterweight portion 271 . Under the action, the pivot shaft 272 is driven to rotate forward (counterclockwise as shown in FIG. 11 ), and the forwardly rotated pivot shaft 272 drives the first link 274 and its associated first single-line transition wheel 265 to move away from the first connecting rod 274 . A single-wire cutting wheel 262 and a second single-wire cutting wheel 263 move in the direction (for example, toward the top), and the first single-wire transition wheel 265 and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the second single-wire transition wheel are enlarged The perimeter of the quadrilateral formed by 266 increases the tension of the closed-loop cutting line 264 until the tension of the closed-loop cutting line 264 is adjusted to a desired value, and the tension balance cylinder 273 extends the cylinder shaft and makes the The cylinder shaft abuts against the second connecting rod 276 , so that the counterweight portion 271 and the second connecting rod 276 no longer move, that is, remain stationary relative to the cutting bracket 261 . When the tension of the closed-loop cutting line 264 is to be reduced, the cylinder shaft of the tension balance cylinder 273 lifts the second connecting rod 276 , lifts the counterweight and the second connecting rod 276 , and drives the pivot shaft 272 Reverse rotation (clockwise as shown in FIG. 11 ), the reversely rotated pivot 272 drives the first link 274 and its associated first single wire transition wheel 265 toward the first single wire cutting wheel 262 and The direction of the second single-wire cutting wheel 263 is moved (eg, downward), reducing the size of the quadrilateral formed by the first single-wire transition wheel 265 , the first single-wire cutting wheel 262 , the second single-wire cutting wheel 263 and the second single-wire transition wheel 266 . Circumference, reduce the tension of the closed-loop cutting line 264, until the tension of the closed-loop cutting line 264 is adjusted to the expected value, the tension balance cylinder 273 stops the cylinder shaft at the current position, so that the weight portion 271 and the The second link 276 no longer moves, ie remains stationary relative to the cutting support 261 .

The single-line drive unit can still make other changes, for example, in some implementations, the single-line drive unit can include a tension cylinder, the tension cylinder is located below the second connecting rod and the cylinder shaft of the tension cylinder is connected at the second end of the second link. For example, when the tension of the closed-loop cutting line 264 is to be increased, the tension cylinder shrinks the cylinder shaft, pulls the second connecting rod 276 and drives the pivot shaft 272 to rotate in the forward direction (counterclockwise in FIG. 11 ). The rotating pivot shaft 272 then drives the first link 274 and its associated first single-wire transition wheel 265 to move in a direction away from the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (for example, upward), Enlarging the perimeter of the quadrilateral formed by the first single wire transition wheel 265 , the first single wire cutting wheel 262 , the second single wire cutting wheel 263 and the second single wire transition wheel 266 increases the tension of the closed loop cutting wire 264 . When the tension of the closed-loop cutting line 264 is to be reduced, the cylinder shaft is extended from the pulling force cylinder, and the second end of the second connecting rod 276 is controlled to lift and drive the pivot shaft 272 to rotate in the opposite direction (as shown in FIG. 11 ). clockwise), the reversely rotated pivot 272 drives the first link 274 and its associated first single-wire transition wheel 265 toward the direction close to the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 ( For example, moving downwards, reducing the perimeter of the quadrilateral formed by the first single wire transition wheel 265, the first single wire cutting wheel 262, the second single wire cutting wheel 263 and the second single wire transition wheel 266, reducing the closed-loop cutting Tension of wire 264.

The silicon rod cutting device of the present application further includes a position adjusting device for adjusting the position of the at least one wire cutting device. Using the position adjusting device, the position of the at least one line cutting device configured on the silicon rod cutting device can be adjusted so as to be able to cut silicon rod segments of corresponding lengths according to cutting requirements.

In the embodiment shown in FIG. 9 , the position adjustment device may include: a moving guide rail, a sliding block, and a moving driving unit.

The moving guide rail may be arranged on the machine base along the first direction, and the sliding block may be arranged on the at least one wire cutting device. In some embodiments, for the wire cutting device, taking the single wire cutting device 25 as an example, the single wire cutting device includes a wire cutting machine base 260 and a single wire cutting unit 26, therefore, the machine base 21 corresponds to the wire cutting machine The position of the machine base 260 is provided with a moving guide rail, and a sliding block is arranged at the bottom of the wire cutting machine base 260, wherein the number of the moving guide rails is not limited, it can be one, or it can also be two arranged in parallel or more.

The moving driving unit is used for driving the at least one wire cutting device to move along the moving guide rail. In some embodiments, the mobile drive unit may comprise: a moving screw and a drive source, wherein the moving screw is disposed along a first direction and is associated with a wire cutting machine base in the at least wire cutting device, The driving source is used for driving the moving screw to rotate so as to move the associated at least one wire cutting device along the transfer guide rail.

In some embodiments, the moving driving unit may include: a moving rack, a driving gear and a driving source, wherein the moving rack is arranged along a first direction, and the driving gear is connected with the at least one wire cutting device in the The wire cutting machine base is associated with and meshed with the moving rack, and the driving source is used to drive the driving gear to rotate so that the associated at least wire cutting device moves along the transfer guide rail.

In addition, in the cutting operation of the silicon rod to be cut, it is necessary to cut off the impurity layer at the head and tail of the silicon rod to be cut that does not meet the production requirements in the processing process, and then slice the sample piece to check the material of the silicon rod to be cut to be cut. characteristic. Therefore, the silicon rod cutting device of the present application further includes at least one multi-wire cutting device, which can cut the silicon rod to be cut to obtain a silicon rod slice, that is, a desired silicon wafer sample.

In some embodiments, a multi-wire cutting device is provided at the front end of the silicon rod cutting device, which is used for cutting the head of the silicon rod to cut a slice of the silicon rod to obtain the head of the silicon rod. In some embodiments, a multi-wire cutting device is provided at the rear end of the silicon rod cutting device, which is used for cutting the tail of the silicon rod to cut the silicon rod slice for obtaining the tail of the silicon rod. In some embodiments, a multi-wire cutting device is provided at both the front end and the rear end of the silicon rod cutting device, for cutting the head and tail of the silicon rod to intercept the silicon rod slices and the tail of the silicon rod for obtaining the head of the silicon rod. Silicon rod slices.

The silicon rod cutting device further includes at least one multi-wire cutting device, the multi-wire cutting device has a multi-wire cutting unit, and the multi-wire cutting unit includes a multi-wire cutting wheel, a multi-wire transition wheel, and a closed loop connected end to end A cutting wire, the closed-loop cutting wire is wound around the multi-wire cutting wheel and the multi-wire transition wheel to form a multi-wire cutting wire saw.

As shown in FIG. 9 , the silicon rod cutting device in this embodiment further includes a multi-wire cutting device 23 , and the multi-wire cutting device 23 is provided at the front end of the silicon rod cutting device.

As such, the at least two wire cutting devices may be a combination of single wire cutting devices and multiple wire cutting devices.

In this application, the at least two wire cutting devices are a combination of a single wire cutting device and a multi-wire cutting device. They are independent devices and operate independently according to the requirements of the silicon rod cutting operation. Therefore, each wire cutting device can be independently controlled by The device (including the single wire cutting device 25 and the multi-wire cutting device 23 ) is used to perform the cutting operation for the silicon rods to be carried on the material conveying table, which improves the operation freedom and cutting efficiency in the cutting operation of the silicon rods. For example, in some embodiments, all wire cutting devices (including the single wire cutting device 25 and the multi-wire cutting device 23) are controlled to perform the slicing operation of the silicon rod to be cut. In certain embodiments, a portion of the wire dicing device (eg, a partial single-wire dicing device 25 , a multi-wire dicing device 25 , or a portion of the single-wire dicing device 25 and the multi-wire dicing device 25 ) performs truncation of the silicon rod to be cut. operation, the remaining wire cutting devices can remain stationary or do other operations.

The multi-wire cutting device 23 is provided at the front end of the silicon rod cutting device, and is used for cutting the head of the silicon rod to be cut to obtain the silicon rod slices of the silicon rod head.

Wherein, the number and arrangement of the single wire cutting device 25 and the multi-wire cutting device 23 in the silicon rod cutting device can still be changed in other ways. For example, in some embodiments, the silicon rod cutting device includes a plurality of single-wire cutting devices 25 and a multi-wire cutting device 23, wherein the multi-wire cutting device 23 can be provided at the rear end of the silicon rod cutting device , which is used to cut the tail of the silicon rod to be cut to intercept the silicon rod slice to obtain the tail of the silicon rod. In some embodiments, the silicon rod cutting device includes a plurality of single-wire cutting devices 25 and two multi-wire cutting devices 23, wherein the two multi-wire cutting devices 23 can be respectively provided in the silicon rod cutting equipment. The front end and the rear end are respectively used for cutting the head of the silicon rod to be cut to obtain the silicon rod section of the head of the silicon rod and cutting the tail of the silicon rod to be cut to cut the silicon rod section to obtain the tail of the silicon rod.

The multi-wire cutting device has at least one multi-wire cutting unit, and the multi-wire cutting unit includes a multi-wire cutting wheel, a multi-wire transition wheel, and an end-to-end closed-loop cutting wire, and the closed-loop cutting wire is wound around the multi-wire cutting wire. At least two multi-wire cutting wire saws are formed after the wire cutting wheel and the multi-wire transition wheel.

The multi-wire cutting device 23 includes a wire-cutting stand and a multi-wire cutting unit.

The wire cutting machine base is arranged on the machine base, and the multi-wire cutting unit is movably arranged on the wire cutting machine base through a lifting mechanism. Here, the wire cutting machine base is used as a carrier for disposing multi-wire cutting units on the machine base, and its specific form can be a beam body, a column body, a plate frame, a bracket, or the like.

The multi-wire cutting unit can be lifted and lowered on the wire cutting machine base through a lifting mechanism. In some implementations, the lift mechanism may include lift rails, sliders, and lift drive units.

The multi-wire cutting unit includes: a cutting bracket, a first closed-loop cutting wire, a second closed-loop cutting wire, a first multi-wire cutting wheel, and a second multi-wire cutting wheel, wherein the first closed-loop cutting wire is wound around the the first multi-wire cutting wheel and the second multi-wire cutting wheel to form a first multi-wire cutting wire saw, and the second closed-loop cutting wire is wound around the first multi-wire cutting wheel and the second multi-wire cutting wheel to form a Second multi-wire cutting wire saw.

In the embodiment shown in FIG. 9 , the multi-wire cutting unit further includes a first multi-wire transition wheel and a second multi-wire transition wheel, and the first multi-wire transition wheel and the second multi-wire transition wheel are arranged at on the cutting bracket.

The first multi-wire transition wheel is used for reversing or guiding the first closed-loop cutting line, and the second multi-line transition wheel is used for reversing or guiding the second closed-loop cutting line.

Furthermore, the multi-wire transition wheel can also be used to adjust the tension of the closed-loop cutting wire, that is, the first multi-wire transition wheel can also be used to adjust the tension of the first closed-loop cutting wire, and the second multi-wire transition wheel can also be used to adjust the tension of the first closed-loop cutting wire. Can be used to adjust the tension of the second closed loop cutting line. Accordingly, the multi-wire cutting unit further includes at least one multi-wire tension adjustment mechanism associated with at least one of the first multi-wire transition wheel and the second multi-wire transition wheel.

For the specific structure and working principle of the multi-wire cutting device 23 , reference may be made to the foregoing description of the multi-wire cutting device in FIG. 7 and FIG. 8 , which will not be repeated here.

Similarly, the silicon rod cutting device of the present application further includes a silicon rod stabilizing device corresponding to the wire cutting device, so as to prevent the silicon rod to be cut from generating surface damage, surface waviness, chipping when being cut by the wire cutting device wait. In the embodiment shown in FIG. 9 , the silicon rod cutting device further includes a silicon rod stabilizing device corresponding to the single-wire cutting device 25 and the multi-wire cutting device 23 , which is used to prevent the silicon rod to be cut from being cut by the multi-wire cutting device. When the cutting device cuts, surface damage, surface ripples, edge chipping, etc. are generated.

The silicon rod stabilizing device further includes a first stabilizing component and a second stabilizing component spaced along the first direction, and there is a space between the first stabilizing component and the second stabilizing component for receiving the cutting device in the wire cutting device. Space for the wire saw. Wherein, any one of the first stabilization assembly and the second stabilization assembly includes a first side stabilization part and a second side stabilization part arranged along the second direction. When the silicon rod to be cut is placed on the material conveying table, the first side stabilizing member and the second side stabilizing member in the first stabilizing assembly and the second stabilizing assembly can be respectively used to interfere with the silicon rod to be cut. The opposite sides are used to limit the silicon rod to be cut to ensure the stability of the silicon rod to be cut during the cutting operation of the silicon rod.

In some embodiments, the first side stabilization member or the second side stabilization member further comprises: a workpiece support block and a workpiece auxiliary support block, wherein the workpiece auxiliary support block is a movable design, that is, the workpiece The auxiliary support block can move relative to the workpiece support block to fit the silicon rod to be cut to be stabilized.

For the specific structure and working principle of the silicon rod stabilizing device, reference may be made to the foregoing description of the silicon rod stabilizing device in FIG. 2 and FIG. 3 , which will not be repeated here.

As can be seen from the above Figures 1, 6, and 9, the silicon rod cutting device of the present application includes at least two wire cutting devices, wherein, in some embodiments, the at least two wire cutting devices may both be single wire cutting Device, in some embodiments, the at least two wire cutting devices may be a combination of single wire cutting devices and multiple wire cutting devices.

Regarding the single-wire cutting device, the single-wire cutting device includes a wire-cutting stand and a single-wire cutting unit, wherein the single-wire cutting unit includes: a cutting bracket, a closed-loop cutting wire, a first single-wire cutting wheel, a second single-wire cutting wheel, and at least A single-line transition wheel. In the embodiment shown in FIG. 1 and FIG. 6 , the single wire cutting unit includes a single wire transition wheel, that is, a first single wire transition wheel, the first single wire transition wheel is connected with the first single wire cutting wheel and the second single wire transition wheel The single-wire cutting wheel forms a triangle. In the embodiment shown in FIG. 9 , the single wire cutting unit includes two single wire transition wheels, namely, a first single wire transition wheel and a second single wire transition wheel, and the first single wire transition wheel and the second single wire transition wheel are the same as the The first single-wire cutting wheel and the second single-wire cutting wheel form a quadrilateral, for example, a rectangle or a trapezoid. However, the above is only an exemplary illustration, and other changes can be made to the single-wire cutting unit.

Please refer to FIG. 12 and FIG. 13 , wherein, FIG. 12 shows a schematic structural diagram of the single wire cutting device of the present application from a first viewing angle in another embodiment, and FIG. 13 shows the single wire cutting device of the present application in still another embodiment Schematic diagram of the structure from the second perspective. In the embodiment shown in FIGS. 12 and 13 , the single-wire cutting device includes a wire-cutting stand 360 and a single-wire cutting unit 36 .

The wire cutting machine base is installed on the machine base, and the single wire cutting unit 36 is movably installed on the wire cutting machine base 360 through a lifting mechanism. Here, the wire cutting machine base 360 is used as a carrier for disposing the single wire cutting unit 36 on the machine base, and its specific form can be a beam body, a column body, a plate frame, a bracket or the like.

The single wire cutting unit 36 can be lifted and lowered on the wire cutting machine base 360 through a lifting mechanism. In some implementations, the lift mechanism may include lift rails, sliders, and lift drive units. Wherein, the lifting guide rail is arranged on the wire cutting machine base along the third direction, the sliding block is arranged on the single wire cutting unit 36 and is adapted to the corresponding lifting guide rail, and the lifting driving unit is used for The single-wire cutting unit 36 moves up and down along the lift guide rail. The lift drive unit may further include a lift screw and a lift motor, wherein the lift screw is connected to the single wire cutting unit 36 in the third direction, and the lift motor (the lift motor may be, for example, a servo motor) is a connected with the lift screw. In some implementations, the lift driving unit may include a lift rack, a drive gear meshed with the lift rack, and a drive motor that drives the drive gear to rotate.

The single wire cutting unit includes: a cutting bracket, a closed loop cutting wire, a first single wire cutting wheel, a second single wire cutting wheel, and a single wire transition wheel, wherein the closed loop cutting wire is wound around the first single wire cutting wheel, the second single wire cutting wheel, and the second single wire cutting wheel. A single wire cutting wheel, and a single wire transition wheel to form a single wire cutting wire saw. In certain embodiments, the single wire cutting unit includes three single wire transition wheels. As shown in FIG. 12 , the single wire cutting unit 36 includes: a cutting bracket 361 , a first single wire cutting wheel 362 , a second single wire cutting wheel 363 , a closed-loop cutting line 364 , a first single wire transition wheel 365 , and a second single wire transition wheel 366 , and a third single-line transition wheel 367 .

The cutting bracket 361 serves as a carrier for disposing the first single wire cutting wheel 362, the second single wire cutting wheel 363, the first single wire transition wheel 365, the second single wire transition wheel and the third single wire transition wheel 367 on the wire cutting machine base 360 , and its specific form can be a beam body, a plate frame, a bracket, etc. In addition, the cutting support 361 can be lifted and lowered on the wire cutting machine base 360 through a lifting mechanism. For the lifting mechanism, reference can be made to the foregoing description, which will not be repeated here. Using the lifting mechanism, the cutting bracket 361 moves up and down relative to the wire cutting machine base 360 in the third direction, thereby driving the first single wire cutting wheel 362, the second single wire cutting wheel 363, the first single wire transition wheel 365, The second single wire transition wheel 366, the third single wire transition wheel 367 and the single wire cutting wire saw around them move up and down to cut the silicon rod to be cut. Furthermore, in some embodiments, the distal end of the cutting bracket 361 that is relatively far away from the wire cutting machine base can also be defined by a guide rod structure and guide the cutting bracket 361 to move up and down under the driving of the lifting mechanism. move.

The first single-wire cutting wheel and the second single-wire cutting wheel are disposed on opposite sides of the cutting bracket along the second direction. In the embodiment shown in FIG. 13 , the first single wire cutting wheel 362 and the second single wire cutting wheel 363 are oppositely disposed on both sides of the bottom of the cutting bracket 361 along the second direction, and the closed-loop cutting wire 364 is wound around the first A single-wire cutting wheel 362 and a second single-wire cutting wheel 363 form a single-wire cutting wire saw disposed along the second direction.

The first single wire cutting wheel 362 includes at least one first cutting wire groove, and the plane where any of the first cutting wire grooves is located is parallel to the surface of the first single wire cutting wheel, that is, the grooves on the first single wire cutting wheel. The cutting wire slot may be referred to as the first cutting wire slot.

The second single wire cutting wheel 363 includes at least one second cutting wire groove, and the plane where any of the second cutting wire grooves is located is parallel to the surface of the second single wire cutting wheel, that is, the grooves on the second single wire cutting wheel. Each of the cutting wire grooves may be referred to as the second cutting wire groove.

The wheel surface of the first single wire cutting wheel 362 is parallel or coplanar with the wheel surface of the second single wire cutting wheel 363, so that the closed loop cutting wire 364 is wound around the first single wire cutting wheel 362 and the second single wire cutting wheel 362. When the wheel 363 is used, the first cutting wire groove and the second cutting wire groove for winding the closed-loop cutting wire 364 are correspondingly located in the same plane, so that the direction of the single-wire cutting wire saw can be located at the same time for winding the closed-loop cutting wire. The first and second cutting wire grooves of 364 are located in the plane. It should be understood that the closed-loop cutting wire 364 is in a running state during the cutting action, so the single-wire cutting wire saw is defined by its spatial position. In the embodiment of the present application, it is wound around the first single-wire cutting wheel 362 and the second The closed loop cutting wire 364 between the single wire cutting wheels 363 is the single wire cutting wire saw.

It should be understood that when the closed-loop cutting wire 364 is wound around any single-wire cutting wheel (the first single-wire cutting wheel 362 or the second single-wire cutting wheel 363 ), the closed-loop cutting wires 364 on both sides of the single-wire cutting wheel should be located at all In the single-wire cutting wheel, the cutting wire groove for winding the closed-loop cutting wire 364 is located in the plane.

The bottom of the cutting bracket 361 has a concave portion, so that the cutting bracket 361 , the first single wire cutting wheel 362 , the second single wire cutting wheel 363 , and the first single wire cutting wheel 362 and the second single wire cutting wheel 363 are wound around the first single wire cutting wheel 362 and the second single wire cutting wheel 363 . The single wire cutting wire saw formed therebetween can form a cutting accommodating space corresponding to the silicon rod to be cut.

The first single-line transition wheel, the second single-line transition wheel, and the third single-line transition wheel are used for reversing or guiding the closed-loop cutting line. In the embodiment shown in FIG. 13 , the first single wire transition wheel 365 , the second single wire transition wheel 366 , and the third single wire transition wheel 367 are arranged on the top of the cutting bracket 361 , wherein the first single wire transition wheel 361 The transition wheel 365 is adjacent to the first single wire cutting wheel 362, the second single wire transition wheel 366 is adjacent to the second single wire cutting wheel 363, and the third single wire transition wheel 367 is adjacent to the first single wire transition wheel 365 and the second single wire transition wheel 366.

Regarding the combination of the first single wire cutting wheel 362 , the second single wire cutting wheel 363 , the first single wire transition wheel 365 , the second single wire transition wheel 366 , and the third single wire transition wheel 367 , various implementations may be adopted. In some embodiments, the first single wire cutting wheel 362, the second single wire cutting wheel 363, the first single wire transition wheel 365, and the second single wire transition wheel 366 form a quadrilateral, and the third single wire transition wheel 367 is located on the first single wire Between the transition wheel 365 and the second single wire transition wheel 366 . In some examples, the first single wire cutting wheel 362, the second single wire cutting wheel 363, the first single wire transition wheel 365, and the second single wire transition wheel 366 form a regular quadrilateral, such as an isosceles trapezoid, a rectangle, and the like. In some examples, the first single wire cutting wheel 362 , the second single wire cutting wheel 363 , the first single wire transition wheel 365 , and the second single wire transition wheel 366 may also form any quadrilateral. In some embodiments, the first single wire cutting wheel 362, the second single wire cutting wheel 363, the first single wire transition wheel 365, the second single wire transition wheel 366, and the third single wire transition wheel 367 form a pentagon, so The pentagon is a regular pentagon, an ordinary pentagon or an arbitrary pentagon.

The first single wire transition wheel 365 includes at least one first transition wire slot, and the plane where any of the first transition wire slots is located is parallel to the surface of the first single wire transition wheel. The second single-wire transition wheel 366 includes at least a second transition wire groove, and the plane where any of the second transition wire grooves is located is parallel to the wheel surface of the second single-wire transition wheel. The third single-wire transition wheel 367 includes at least one third transition wire groove, and the plane where any of the third transition wire grooves is located is parallel to the surface of the third single-wire transition wheel.

The wheel surface of the first single wire transition wheel 365, the wheel surface of the second single wire transition wheel 366, the wheel surface of the third single wire transition wheel 367, the wheel surface of the first single wire cutting wheel 362 and the wheel surface of the second single wire cutting wheel 363 The faces are parallel or coplanar, so that the closed loop cutting wire 364 is wound around the first single wire cutting wheel 362, the second single wire cutting wheel 363, the first single wire transition wheel 365, the second single wire transition wheel 366, and the third single wire transition. When the wheel 367 is used, the first cutting wire groove, the second cutting wire groove, the first transition wire groove, the second transition wire groove, and the third transition wire groove correspondingly used for winding the closed-loop cutting wire 364 are located in the same plane, This allows the single wire cutting wire saw to be oriented simultaneously in the first cutting wire slot, the second cutting wire slot, the first transition wire slot, the second transition wire slot, and the third transition wire for wrapping the closed loop cutting wire 364 The slot is in the plane. Wherein, as shown in FIG. 12 , when the closed-loop cutting wire 364 is wound around the first single-wire transition wheel 365 , the second single-wire transition wheel 366 , and the third single-wire transition wheel 367 , the closed-loop cutting wire 364 is cut from the first single-wire transition wheel 364 . The first transition wire slot of the single wire transition wheel 365 is drawn out and then folded down into the third transition wire slot of the third single wire transition wheel 367 , and then folded up into the second transition wire slot of the second single wire transition wheel 366 .

In this way, in this embodiment, the first single wire cutting wheel 362, the second single wire cutting wheel 363, the second single wire transition wheel 366, the third single wire transition wheel 367, and the first single wire transition wheel 365 of the single wire cutting unit pass through The closed-loop cutting wire 364 is wound. In this example, the single-wire cutting device can omit components such as a wire take-up reel and a pay-off reel, and the closed-loop cutting wire can be driven and run at a high speed to achieve cutting.

In the existing silicon rod cutting equipment, the cutting wire is wound from the pay-off drum to the cutting wheel and the transition wheel in the wire cutting unit, and is wound from the wire cutting unit to the wire take-up drum. During the cutting process, the The cutting line is driven to run, and the running process of the cutting line is an alternate acceleration and deceleration process. In the silicon rod cutting device of the present application, the closed-loop cutting line in the wire cutting unit can maintain continuous high-speed operation, and at the same time, the closed-loop cutting line can run in the same running direction during the cutting process. In this way, the wire cutting unit of the present application can achieve high-precision cutting operations, and avoid problems such as ripples on the cutting surface caused by the running reversal or running speed of the cutting wire in the existing cutting method; at the same time, the closed-loop cutting wire can effectively Reduce the overall length of the cutting wire required by the wire cutting unit and eliminate components such as wire take-up and pay-off spools, reducing production costs.

The single wire cutting unit of the present application further includes a cutting wire driving mechanism for driving the first single wire cutting wheel 362, the second single wire cutting wheel 363, the second single wire transition wheel 366, and the third single wire transition wheel 367. , and the closed-loop cutting line 364 on the first single-line transition wheel 365 runs at high speed.

In some embodiments, at least one of the first single wire cutting wheel 362 , the second single wire cutting wheel 363 , the first single wire transition wheel 365 , the second single wire transition wheel 366 , and the third single wire transition wheel 367 are As a driving wheel, others are driven wheels, wherein the driving wheel is associated with the cutting wire driving mechanism, the driving wheel is driven to rotate by the cutting wire driving mechanism, and the closed-loop cutting is driven with the cooperation of other driven wheels. Line 364 runs at high speed.

In some implementations, the first single wire cutting wheel 362 or the second single wire cutting wheel 363 may be used as the drive wheel. Taking the first single wire cutting wheel 362 as a driving wheel as an example, the first single wire cutting wheel 362 is associated with a cutting wire driving mechanism, and the cutting wire driving mechanism can be used to drive the first single wire cutting wheel 362 to rotate. In some examples, the cutting wire driving mechanism includes a driving motor, and the motor shaft of the driving motor is directly connected to the wheel shaft of the first single wire cutting wheel 362. When the driving motor rotates, the motor of the driving motor is driven by the motor of the driving motor. The shaft drives the first single-wire cutting wheel 362 to rotate, the closed-loop cutting wire 364 is carried along and makes the second single-wire cutting wheel 363, the second single-wire transition wheel 366, the third single-wire transition wheel 367, and the first single-wire transition wheel 365 rotate, Realize high-speed operation of closed-loop cutting line 364. In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on the motor shaft of the driving motor and the wheel shaft of the first single wire cutting wheel, and when the driving motor rotates, The drive belt is driven by the motor shaft of the drive motor, and then the first single-wire cutting wheel 362 is driven to rotate, and the closed-loop cutting wire 364 is carried along to make the second single-wire cutting wheel 363, the second single-wire transition wheel 366, and the third single-wire cutting wheel 363. The transition wheel 367 and the first single-wire transition wheel 365 rotate to realize the high-speed operation of the closed-loop cutting line 364 .

In some implementations, the first single wire transition wheel 365, the second single wire transition wheel 366, or the third single wire transition wheel 367 may be used as the drive wheels. Taking the first single wire transition wheel 365 as a driving wheel as an example, the first single wire transition wheel 365 is associated with a cutting wire driving mechanism, and the cutting wire driving mechanism can be used to drive the first single wire transition wheel 365 to rotate. In some examples, the cutting wire driving mechanism includes a driving motor, and the motor shaft of the driving motor is directly connected to the wheel shaft of the first single-wire transition wheel 365. When the driving motor rotates, the motor of the driving motor is driven by the motor of the driving motor. The shaft drives the first single-wire transition wheel 365 to rotate, and the closed-loop cutting line 364 is carried along to rotate the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the second single-wire transition wheel 366, and the third single-wire transition wheel 367, In order to realize the high-speed operation of the closed-loop cutting line 364. In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on the motor shaft of the driving motor and the wheel shaft of the first single-wire transition wheel, and when the driving motor rotates, The drive belt is driven by the motor shaft of the drive motor, and then the first single-wire transition wheel 365 is driven to rotate, and the closed-loop cutting wire 364 is carried along to make the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, and the second single-wire cutting wheel 363. The transition wheel 366 and the third single-wire transition wheel 367 rotate to realize the high-speed operation of the closed-loop cutting line 364 .

In addition, the single-wire transition wheel can also be used to adjust the tension of the closed-loop cutting wire. Accordingly, the single wire cutting unit further includes a single wire tension adjustment mechanism associated with the at least one single wire transition wheel.

In certain embodiments, the single wire cutting unit 36 further includes a single wire tension adjustment mechanism associated with at least one of the first single wire transition wheel, the second single wire transition wheel, and the third single wire transition wheel.

Please refer to FIG. 13 , which is a schematic structural diagram of the single-wire cutting device of the present application from a second viewing angle according to an embodiment. 12 and 13 , the single wire cutting unit 36 includes a single wire tension adjustment mechanism associated with the third single wire transition wheel 367 .

The single-wire tension adjustment mechanism includes: a single-wire drive unit 371 and a single-wire link assembly, the single-wire link assembly is associated with the third single-wire transition wheel 367 and the single-wire drive unit 371, and the single-wire link assembly is controlled In the single-wire driving unit, that is, the single-wire link assembly is driven by the single-wire driving unit 371 to drive the third single-wire transition wheel to change the position to adjust the tension of the closed-loop cutting wire 364 .

In the embodiment shown in FIGS. 12 and 13 , the single-wire link assembly includes: a pivot shaft 372 , a first link 374 , and a second link 376 .

The pivot shaft 372 is disposed on the cutting bracket 361 .

The first end of the first link 374 is associated with the pivot shaft 372 , and the second end of the first link 374 is connected with the third single-wire transition wheel 367 .

The first end of the second link 376 is associated with the pivot shaft 372 and the second end of the second link 376 is connected with the single wire drive unit.

Through the single-wire link assembly, a lever effect can be achieved to adjust the position of the third single-wire transition wheel 367 .

Regarding the single-wire drive unit, in some implementations, the single-wire drive unit 371 includes a counterweight (in the following description, the counterweight is marked as 371 ), and the counterweight 371 can be suspended from the second The second end of link 376 . For example, when the tension of the closed-loop cutting line 364 is to be increased, the counterweight portion 371 is lifted, and the second end of the second link 376 is controlled to lift and drive the pivot shaft 372 to rotate in the forward direction (reversely as shown in FIG. 13 ). clockwise), the forwardly rotating pivot 372 drives the first link 374 and its associated third single-wire transition wheel 367 toward the direction close to the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363 (for example, moving downward) to expand the perimeter formed by the third single wire transition wheel 367 and the first single wire cutting wheel 362, the second single wire cutting wheel 363, the first single wire transition wheel 365, and the second single wire transition wheel 366, increasing the When the tension of the closed-loop cutting line 364 is to be reduced, the counterweight portion 371 is released, the counterweight portion 371 descends, and the second end of the second link 376 is subjected to the Under the action of gravity of the counterweight portion 371, the pivot shaft 372 is driven to rotate in the reverse direction (clockwise as shown in FIG. 13 ), and the reversely rotated pivot shaft 372 drives the first link 374 and its associated third single-line transition. The wheel 367 moves in a direction away from the first single-wire transition wheel 365 and the second single-wire transition wheel 366 (for example, upward), reducing the size of the first single-wire transition wheel 365 and the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363 and the perimeter formed by the second single wire transition wheel 366 reduce the tension of the closed-loop cutting wire 364 .

The counterweight portion may include a counterweight frame and counterweight blocks placed in the configuration frame, wherein the number of the counterweight blocks may vary according to the requirements of tension adjustment of the closed-loop cutting line 364, for example, When the tension of the closed-loop cutting line 364 is increased, the number of counterweights can be increased, and when the tension of the closed-loop cutting line 364 is decreased, the number of counterweights can be decreased.

The configuration frame can be moved up and down relative to the cutting support 361 through the up and down guide rails.

In some embodiments, the counterweight portion may include a locking mechanism for locking the counterweight portion so that the counterweight portion is stationary relative to the cutting bracket 361 , so that the counterweight portion is connected to the cutting bracket 361 . switch from active to locked state. In some examples, the locking mechanism may be a latch, for example.

In certain embodiments, the weight portion may include a single wire tension balance member for ensuring that the tension of the weight portion and the closed loop cutting wire 364 is in a balanced state. In the embodiment shown in FIG. 13 , the single-thread tension adjusting mechanism further includes a single-thread tension balancing member 373, which is a tension-balancing cylinder (in the following description, the tension-balancing cylinder is marked as 373), The tension balance cylinder 373 acts on the second connecting rod 376 .

For example, when the tension of the closed-loop cutting line 364 is to be increased, the cylinder shaft of the tension balance cylinder 373 lifts the second connecting rod 376, lifts the counterweight and the second connecting rod 376, and drives the pivot shaft 372 rotates forward (counterclockwise in FIG. 13 ), and the pivot 372 that rotates forward drives the first link 374 and its associated third single-line transition wheel 367 to approach the first single-line transition wheel 365 and the direction of the second single-wire transition wheel 366 (for example, downward) to expand the third single-wire transition wheel 367 and the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, the second single-wire The circumference formed by the transition wheel 366 increases the tension of the closed-loop cutting line 364 until the tension of the closed-loop cutting line 364 is adjusted to a desired value, the tension balance cylinder 373 stops the cylinder shaft at the current position, so that The counterweight portion 371 and the second link 376 no longer move, that is, remain stationary relative to the cutting bracket 361 . When the tension of the closed-loop cutting line 364 is to be reduced, the counterweight portion 371 is released, the counterweight portion 371 descends, and the second end of the second link 376 is under the action of the gravity of the counterweight portion 371 . The pivot shaft 372 is driven down to rotate in the reverse direction (clockwise as shown in FIG. 13 ), and the pivot shaft 372 rotated in the reverse direction drives the first link 374 and its associated third single-line transition wheel 367 to move away from the first The direction of the single wire transition wheel 365 and the second single wire transition wheel 366 is moved (for example, upward), and the first single wire transition wheel 365 and the first single wire cutting wheel 362 , the second single wire cutting wheel 363 and the second single wire transition wheel 366 are reduced. The formed perimeter reduces the tension of the closed-loop cutting line 364 until the tension of the closed-loop cutting line 364 is adjusted to a desired value, and the tension balance cylinder 373 extends the cylinder shaft and makes the cylinder shaft Contacting the second link 376 , the counterweight portion 371 and the second link 376 no longer move, that is, remain stationary relative to the cutting bracket 361 .

The single-line drive unit can still make other changes, for example, in some implementations, the single-line drive unit can include a tension cylinder, the tension cylinder is located below the second connecting rod and the cylinder shaft of the tension cylinder is connected at the second end of the second link. For example, when the tension of the closed-loop cutting line 364 is to be increased, the cylinder shaft is extended from the tension cylinder, and the second end of the second connecting rod 376 is controlled to lift and drive the pivot shaft 372 to rotate in the forward direction (as shown in FIG. 13 ). counterclockwise), the positive rotating pivot 372 drives the first link 374 and its associated third single-line transition wheel 367 toward the direction close to the first single-line transition wheel 365 and the second single-line transition wheel 366 Move (for example, downward) to expand the perimeter formed by the third single-wire transition wheel 367, the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, and the second single-wire transition wheel 366, The tension of the closed loop cutting line 364 is increased. When the tension of the closed-loop cutting line 364 is to be reduced, the tension cylinder shrinks the cylinder shaft, pulls the second connecting rod 376 and drives the pivot shaft 372 to reversely rotate (clockwise as shown in FIG. 13 ), and reversely rotates The pivot shaft 372 drives the first link 374 and its associated first single-wire transition wheel 365 to move in a direction away from the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363 (for example, upward), reducing the The perimeter formed by the first single wire transition wheel 365 , the first single wire cutting wheel 362 , the second single wire cutting wheel 363 and the second single wire transition wheel 366 reduces the tension of the closed loop cutting wire 364 .

The silicon rod cutting device of the present application includes a machine base, a material conveying table, and at least two wire cutting devices, wherein the at least two wire cutting devices are independent of each other, so the material conveying table can be connected to the material conveying table through each independent wire cutting device. The truncation operation is performed on the silicon rod to be carried on the upper side, which improves the degree of freedom of operation and the truncation efficiency in the truncation operation of the silicon rod. Moreover, the wire cutting unit in the wire cutting device adopts the closed-loop cutting wire, so the high-speed operation of the cutting wire can be maintained, and the cutting efficiency can be improved. At the same time, the closed-loop cutting wire can run in the same running direction during the cutting operation. The wire cutting unit can realize high-precision cutting operations, avoiding the problems of the cutting surface having ripples caused by the running reversal or running speed of the cutting wire in the existing cutting method. At the same time, the closed-loop cutting line can effectively reduce the wire cutting unit The total length of the cutting line required and the elimination of components such as take-up and pay-off spools reduce production costs.

The above-mentioned embodiments merely illustrate the principles and effects of the present application, but are not intended to limit the present application. Anyone skilled in the art can make modifications or changes to the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed in this application should still be covered by the claims of this application.

Claims (32)

1. A silicon rod cutting device is characterized in that, comprising:

   Machine base;

   A material conveying table, which is arranged on the machine base, is used to carry the silicon rods to be cut and drive the silicon rods to be cut to be transported along a first direction, wherein the axis line of the silicon rods to be cut is related to the first direction. parallel; and

   At least two wire cutting devices are independent of each other and are arranged at intervals along the first direction; the wire cutting devices include: a wire cutting machine base, which is arranged on the machine base; at least a wire cutting unit, which can be lifted and lowered by a lifting mechanism On the wire cutting machine base; the wire cutting unit includes a cutting wheel, a transition wheel, and a closed-loop cutting wire connected end to end, and the closed-loop cutting wire is wound around the cutting wheel and the transition wheel to form a cutting wire saw.
2. The silicon rod cutting device according to claim 1, wherein the material conveying table comprises a roller assembly and a motor assembly for controlling the roller assembly.
3. The silicon rod cutting device according to claim 2, wherein the roller assembly comprises: a plurality of roller pairs arranged at intervals along the first direction, and each roller pair includes two rollers connected by a rotating shaft.
4. The silicon rod cutting device according to claim 3, wherein the roller assembly is divided into a plurality of roller assembly sections.
5. The silicon rod cutting device according to claim 1, wherein the silicon rod cutting device comprises at least two single wire cutting devices, the single wire cutting devices have a single wire cutting unit, and the single wire cutting unit comprises:

   cutting bracket;

   Closed loop cutting line;

   A first single-wire cutting wheel and a second single-wire cutting wheel are disposed on opposite sides of the cutting support along the second direction, and the wheel surfaces of the first single-wire cutting wheel and the second single-wire cutting wheel are parallel or coplanar; and

   at least one single-line transition wheel;

   Wherein, the closed-loop cutting wire is wound around the first single wire cutting wheel, the second single wire cutting wheel and at least one transition wheel to form a single wire cutting wire saw; the first direction is perpendicular to the first single wire cutting wheel and the first single wire cutting wheel The wheel surface of the two single-wire cutting wheels, the second direction is perpendicular to the first direction.
6. The silicon rod cutting device according to claim 5, wherein the single wire cutting unit comprises a first single wire transition wheel, and the first single wire transition wheel is formed with the first single wire cutting wheel and the second single wire cutting wheel triangle.
7. The silicon rod cutting device according to claim 5, wherein the single wire cutting unit comprises a first single wire transition wheel and a second single wire transition wheel, the first single wire transition wheel is adjacent to the first single wire cutting wheel, The second single wire transition wheel is adjacent to the second single wire cutting wheel, and the first single wire transition wheel, the second single wire transition wheel, the second single wire cutting wheel and the first single wire cutting wheel form a quadrilateral.
8. The silicon rod cutting device according to claim 5, wherein the single wire cutting unit comprises a first single wire transition wheel, a second single wire transition wheel, and a third single wire transition wheel, and the first single wire transition wheel is adjacent to the The first single wire cutting wheel, the second single wire transition wheel is adjacent to the second single wire cutting wheel, and the third single wire transition wheel is located between the first single wire transition wheel and the second single wire transition wheel.
9. The silicon rod cutting device according to claim 5, wherein the single wire cutting unit further comprises a single wire tension adjustment mechanism associated with the at least one single wire transition wheel.
10. The silicon rod cutting device according to claim 9, wherein the single wire tension adjustment mechanism comprises:

    single-wire drive units; and

    A single-wire link assembly, associated with the single-wire transition wheel and the single-wire drive unit; the single-wire link assembly is controlled by the single-wire drive unit to adjust the position of the single-wire transition wheel to adjust the tension of the closed-loop cutting wire .
11. The silicon rod cutting device according to claim 10, wherein the single-wire connecting rod assembly comprises:

    a pivot shaft, arranged on the cutting support;

    a first link, a first end of the first link is associated with the pivot, a second end of the first link is connected with the single wire transition wheel; and

    A second link, the first end of the second link is associated with the pivot, the second end of the second link is connected with the single-wire drive unit.
12. The silicon rod cutting device according to claim 10, wherein the single-wire driving unit comprises a counterweight or a tension cylinder.
13. The silicon rod cutting device according to claim 10, wherein the single wire tension adjustment mechanism further comprises a single wire tension balance component.
14. The silicon rod cutting device according to claim 5, wherein the silicon rod cutting device further comprises at least one multi-wire cutting device, the multi-wire cutting device has a multi-wire cutting unit, and the multi-wire cutting unit includes :

    cutting bracket;

    a first closed-loop cutting line and a second closed-loop cutting line;

    The first multi-wire cutting wheel and the second multi-wire cutting wheel are arranged on opposite sides of the cutting bracket along the second direction, and the wheel surfaces of the first multi-wire cutting wheel and the second multi-wire cutting wheel are parallel or coplanar, the first multi-wire cutting wheel has at least two wire slots, and the second multi-wire cutting wheel has at least two wire slots; and

    at least one first multi-line transition wheel and at least one second multi-line transition wheel;

    Wherein, the first closed-loop cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and at least one first multi-wire transition wheel to form a first multi-wire cutting wire saw, and the second closed-loop cutting wire is The cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and at least one second multi-wire transition wheel to form a second multi-wire cutting wire saw, the first multi-wire cutting wire saw being parallel to the the second multi-wire cutting wire saw, the first multi-wire cutting wire saw and the second multi-wire cutting wire saw have a wire spacing; the first direction is perpendicular to the first multi-wire cutting wheel and the The wheel surface of the second multi-wire cutting wheel, the second direction is perpendicular to the first direction.
15. The silicon rod cutting device according to claim 14, wherein the multi-wire cutting unit comprises a first multi-wire transition wheel and a second multi-wire transition wheel, the first multi-wire transition wheel and the The first multi-wire cutting wheel and the second multi-wire cutting wheel form a triangle, and the second multi-wire transition wheel and the first multi-wire cutting wheel and the second multi-wire cutting wheel form a triangle.
16. The silicon rod cutting device according to claim 14, wherein the multi-wire cutting unit comprises two first multi-wire transition wheels and two second multi-wire transition wheels, the two first multi-wire transition wheels The wheel forms a quadrilateral with the first multi-wire cutting wheel and the second multi-wire cutting wheel, and the two second multi-wire transition wheels form a quadrilateral with the first multi-wire cutting wheel and the second multi-wire cutting wheel.
17. 15. The silicon rod cutting apparatus of claim 14, wherein the multi-wire cutting unit further comprises a multi-wire transition wheel associated with at least one of the at least one first multi-wire transition wheel and at least one second multi-wire transition wheel at least one multi-thread tension adjustment mechanism.
18. The silicon rod cutting device according to claim 17, wherein the multi-wire tension adjustment mechanism comprises:

    multi-line drive units; and

    A multi-wire link assembly, associated with the multi-wire drive unit and the corresponding first multi-wire transition wheel or second multi-wire transition wheel; the multi-wire link assembly is controlled by the multi-wire drive unit to adjust the The position of the first multi-wire transition wheel or the second multi-wire transition wheel to adjust the tension of the closed loop cutting wire.
19. The silicon rod cutting device according to claim 18, wherein the multi-wire connecting rod assembly comprises:

    a pivot shaft, arranged on the cutting bracket;

    a first link, the first end of the first link is associated with the pivot, and the second end of the first link is connected with the first multi-wire transition wheel or the second multi-wire transition wheel; as well as

    A second link, the first end of the second link is associated with the pivot, the second end of the second link is connected with the multi-wire drive unit.
20. The silicon rod cutting device according to claim 18, wherein the multi-wire driving unit comprises a counterweight or a tension cylinder.
21. The silicon rod cutting device according to claim 18, wherein the multi-wire tension adjusting mechanism further comprises a multi-wire tension balancing component.
22. The silicon rod cutting device according to claim 1, wherein the wire cutting device further comprises a cutting wire driving mechanism for driving the closed-loop cutting wire to run to cut the silicon rod to be cut.
23. The silicon rod cutting device according to claim 1, further comprising a silicon rod stabilizing device corresponding to the wire cutting device, for stabilizing the silicon rod to be cut when the wire cutting device cuts the silicon rod to be cut Cut silicon rods.
24. The silicon rod cutting device according to claim 23, wherein the silicon rod stabilizing device comprises a first stabilizing component and a second stabilizing component spaced along the first direction, the first stabilizing component and the first stabilizing component There is a reserved space for accommodating the cutting wire saw in the wire cutting device between the two stabilizing components.
25. The silicon rod cutting device according to claim 24, wherein any one of the first stabilization assembly and the second stabilization assembly includes a first side stabilization member and a second side stabilization member disposed along the second direction The components are respectively used to abut on opposite sides of the silicon rod to be cut.
26. The silicon rod cutting device according to claim 25, wherein any one of the first side stabilization member and the second side stabilization member comprises:

    workpiece support blocks; and

    A workpiece auxiliary support block, the workpiece auxiliary support block is controlled by the support block driving unit to move in a second direction to expand and contract relative to the workpiece support block.
27. The silicon rod cutting device according to claim 1, further comprising a position adjusting device for adjusting the position of at least one wire cutting device.
28. The silicon rod cutting device according to claim 27, wherein the position adjusting device comprises:

    The moving guide rail is arranged on the base along the first direction;

    a slider, provided on the at least one wire cutting device; and

    A moving driving unit is used for driving the at least one wire cutting device to move along the moving guide rail.
29. The silicon rod cutting device according to claim 1, further comprising a detection device for detecting the levelness of the axis of the silicon rod to be cut placed on the material conveying table.
30. The silicon rod cutting device according to claim 29, characterized in that it further comprises a leveling device, which is used for adjusting the axis of the silicon rod to be cut placed on the material conveying table according to the detection result of the detection device. Leveling.
31. A silicon rod cutting method, characterized in that it is applied to a silicon rod cutting device, the silicon rod cutting equipment comprising a machine base, a material conveying table, and at least two wire cutting devices independent of each other, in the wire cutting device The wire cutting unit includes a cutting wheel, a transition wheel, and a closed-loop cutting wire connected end to end, the closed-loop cutting wire is wound around the cutting wheel and the transition wheel to form a cutting wire saw, and the silicon rod cutting method includes the following steps:

    Place the silicon rod to be cut on the material conveying table, and the axis line of the silicon rod is parallel to the first direction;

    Utilize the material conveying table to drive the silicon rod to be cut to be conveyed to the cutting position along a first direction; and

    Part or all of the wire cutting devices in the at least two wire cutting devices are independently driven, so that the cutting wire saws in the part or all of the wire cutting devices perform a cutting operation on the silicon rod to form a silicon rod segment.
32. The silicon rod cutting method according to claim 31, wherein the silicon rod cutting equipment further comprises a silicon rod stabilizing device corresponding to the wire cutting device, and the silicon rod cutting method further comprises the following steps:

    Before independently driving some or all of the at least two wire cutting devices, the silicon rod stabilizing device corresponding to the wire cutting devices is driven to stabilize the silicon rod to be cut.

Images