CN210256791U - Multi-section type semiconductor crystal bar cutting device - Google Patents
Multi-section type semiconductor crystal bar cutting device Download PDFInfo
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- CN210256791U CN210256791U CN201920401859.1U CN201920401859U CN210256791U CN 210256791 U CN210256791 U CN 210256791U CN 201920401859 U CN201920401859 U CN 201920401859U CN 210256791 U CN210256791 U CN 210256791U
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Abstract
The utility model discloses a multistage formula semiconductor crystal bar cutting device, its characterized in that: the method comprises the following steps: the single-section type cutting device is used for cutting the semiconductor crystal bar by a single knife and cutting a sample wafer at the cut part of the semiconductor crystal bar; the multi-section type cutting device is used for synchronously cutting the semiconductor crystal bar by multiple knives and cutting a semiconductor crystal bar sample wafer; the wiring system is arranged on the base and forms a cutting section for cutting the semiconductor crystal bar in the single-section type cutting device and the multi-section type cutting device; the single-stage cutting device and the multi-stage cutting device can realize independent or synchronous semiconductor crystal bar cutting operation. The utility model discloses a single-section formula that has independent elevating gear respectively cuts device, multistage formula and cuts the device and the cooperation of walking the line system has reached the diversified cutting requirement of semiconductor crystal bar, walks many wire casings of line system well tangent line roller simultaneously and sets up the feasible the utility model discloses possessed the ability that cutting and sample go on in step, promoted machining efficiency.
Description
Technical Field
The utility model relates to a semiconductor crystal bar cutting device, especially a multistage formula semiconductor crystal bar cutting device.
Background
The wire cutting technology is a semiconductor crystal bar cutting machine which is advanced in the world at present, and the principle of the wire cutting machine is that a diamond wire which runs at a high speed is used for reciprocating friction on a processing surface of a workpiece to be processed (such as a monocrystalline silicon rod, sapphire or other semiconductor brittle and hard materials) to rub, and a semiconductor crystal bar with a long length is cut into a crystal bar with a short length, so that the next step of crystal bar rounding is facilitated. In the cutting process of a semiconductor crystal bar, a diamond wire is guided by a wire guide wheel to form a wire net on a main wire roller, a workpiece to be processed is fed by the ascending and descending of a workbench, under the action of a pressure pump, a cooling water automatic spraying device assembled on equipment sprays cooling water to cutting parts of the diamond wire and the workpiece, and the diamond wire reciprocates to cut hard and brittle materials such as semiconductors into a plurality of pieces at one time. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the linear cutting technology has the advantages of high efficiency, high productivity, high precision and the like.
However, the existing semiconductor crystal bar cutting machine still has defects, for example, the existing semiconductor crystal bar cutting machine is often single in cutting function and cannot adapt to the cutting processing of crystal bars with various requirements; in addition, the conventional semiconductor crystal bar cutting machine often lacks a leveling function for the workpiece before the workpiece is processed, so that after the semiconductor crystal bar is cut, the cutting surfaces at two ends of the semiconductor crystal bar are not vertical to the longitudinal central axis of the semiconductor crystal bar because the semiconductor crystal bar is even. And the error is transmitted to subsequent crystal bar rounding, so that the effective utilization rate of the semiconductor crystal bar is greatly reduced. Meanwhile, in the process of cutting off the crystal bar and sampling by the conventional semiconductor crystal bar cutting machine, when a plurality of detection sample wafers are required to be cut at the cut-off position of the semiconductor crystal bar, the sample wafers are required to be cut off by multiple times, and the mode process of cutting off the detection sample wafers is long and low in efficiency. Finally, the existing semiconductor crystal bar cutting device often has the defect that the cutting surfaces of the crystal bar segments are in unfilled corners due to mutual collision between the adjacent crystal bar segments in the conveying process of the crystal bar segments, so that the utilization rate of the crystal bar segments is reduced. Finally, the existing semiconductor crystal bar cutting device often has the defect that the cutting surfaces of the crystal bar segments are in unfilled corners due to mutual collision between the adjacent crystal bar segments in the conveying process of the crystal bar segments, so that the utilization rate of the crystal bar segments is reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a multistage formula semiconductor crystal bar cutting device that can adapt to multiple semiconductor crystal bar cutting requirement.
In order to achieve the above purpose, the detailed technical solution of the present invention is:
a multistage semiconductor crystal bar cutting device is characterized in that: the method comprises the following steps:
the single-section type cutting device is used for cutting the semiconductor crystal bar by a single knife and cutting a sample wafer at the cut part of the semiconductor crystal bar;
the multi-section type cutting device is used for synchronously cutting the semiconductor crystal bar by multiple knives and cutting a semiconductor crystal bar sample wafer;
the wiring system is arranged on the base and forms a cutting section for cutting the semiconductor crystal bar in the single-section type cutting device and the multi-section type cutting device;
the single-stage cutting device and the multi-stage cutting device can realize independent or synchronous semiconductor crystal bar cutting operation.
The utility model discloses a multistage formula crystal bar cuts device can cut the device through the single-section formula and realize the single-knife cutting to the semiconductor crystal bar, and accessible multistage formula cuts device and the collaborative work that the device was cut to the single-section formula again realizes the synchronous multistage cutting to the semiconductor crystal bar, thereby makes the utility model discloses can adapt to the cutting requirement of multiple semiconductor crystal bar.
The utility model discloses multistage formula semiconductor crystal bar cutting device's further improvement lies in, the multistage formula cuts the device and includes:
the frame is arranged on the base;
the first lifting mechanism is arranged on the base and drives the rack fixedly connected with the base to lift longitudinally; and
the first cutting units can horizontally move and are arranged on the rack, and the first cutting units are driven by the first lifting mechanism to synchronously lift at random.
The utility model discloses multistage formula semiconductor crystal bar cutting device's further improvement lies in, fore-and-aft is provided with an at least first vertical slide rail on the base, be provided with in the frame with the first vertical spout of slide rail looks adaptation, the two is mutually supported and is used for the lift orbit of restriction and guide frame.
The utility model discloses multistage formula semiconductor crystal bar cutting device's further improvement lies in, first cutting unit includes:
the first cutting frame is horizontally and slidably connected with the rack, and is of a concave structure with a downward opening;
the first horizontal driving device is arranged on one side, close to the rack, of the first cutting frame and is in transmission with the rack of the rack.
The utility model discloses multistage formula semiconductor crystal bar cutting device's further improvement lies in, the single-section formula cuts the device and includes:
the second lifting mechanism is arranged on the base;
and the second cutting unit is in sliding fit with the base, and is driven by a second lifting mechanism connected with the second cutting unit to vertically lift and cut the semiconductor crystal bar.
The utility model discloses multistage formula semiconductor crystal bar cutting device's further improvement lies in, walk the line system and include:
cutting a line;
the plurality of tangent roller sets are arranged on the single-section type cutting device of the multi-section type cutting device corresponding to the tangent roller sets one by one;
and the cutting line winding device is arranged on the base and used for winding and unwinding the cutting lines on the plurality of cutting line roller sets.
The utility model discloses a further improvement of the multi-section semiconductor crystal bar cutting device lies in that the cutting roller group comprises a plurality of wire cutting rollers, and a plurality of wire grooves are axially arranged on the wheel rim of each wire cutting roller at intervals; the cutting lines are wound between adjacent cutting lines in the wire grooves to form sampling intervals.
The utility model discloses multistage formula semiconductor crystal bar clipper's further improvement lies in, adjacent wire casing axial interval equals in many wire casings.
The utility model discloses but the further improvement of multistage formula semiconductor crystal bar cutting device lies in, but a plurality of tangent line rollers quick replacement install corresponding multistage formula cut the device, single section formula cut on the device.
The utility model discloses multistage formula semiconductor crystal bar cutting device's further improvement lies in, still include a plurality of hanging wire rollers that are used for the restriction and guide the line of cut to walk in the line system.
Drawings
FIG. 1 is a three-dimensional structure diagram of the multi-stage semiconductor ingot cutting machine of the present invention;
FIG. 2 is a schematic structural view of the multi-stage semiconductor ingot cutting machine of the present invention after the protective cover is removed;
FIG. 3 is a schematic structural view of the multi-segment semiconductor ingot cutting machine of the present invention at another viewing angle after the protective cover is removed;
FIG. 4 is a schematic view illustrating a state in which a transfer roller set of the material transfer apparatus transfers a semiconductor ingot;
FIG. 5 is a schematic view illustrating a state in which a susceptor in the material transfer apparatus is loaded with a semiconductor ingot;
FIG. 6 is a schematic structural view of the material conveying device;
FIG. 7 is a front view of the material delivery device;
FIG. 8 is a left side view of the material transport device;
FIG. 9 is a schematic cross-sectional view of a tangent roller;
fig. 10 is a schematic structural view of the transport mechanism.
Reference numerals: 100. the multi-section type cutting machine comprises a base 110, a first longitudinal slide rail 120, a second longitudinal slide rail 200, a material conveying device 210, a loading platform 220, a cutting platform 221, a bearing table 230, a discharging platform 240, a conveying mechanism 241, a conveying bracket 242, a conveying wheel set 242a, a conveying wheel 242b, a component force chamfering 243, a third lifting device 244, a conveying wheel driving device 300, a multi-section type cutting device 310, a frame 311, a first longitudinal slide groove 312, a horizontal rack 320, a first lifting device 330, a first cutting unit 331, a first cutting frame 332, a horizontal driving device 332a, a horizontal driving motor 332b, a first transmission gear 400, a single-section type cutting device 410, a second lifting device 411, a longitudinal driving motor 412, a second transmission gear 420, a second cutting unit 421, a second cutting frame 422, a second longitudinal slide groove 423, a longitudinal rack 500, a routing system 510, a cutting line 520, a cutting line roller group 521, a cutting roller group and a cutting roller group 521a, a wire groove 530, a cutting wire winding device 531, a wire storage barrel 540, a wire hanging roller 600, a tension device 610, a rotating device 620, an adjusting arm 621, an adjusting hole 630, a tension wheel 700, an aligning device 710, a measuring device 711, a contact type sensing device 712, a rotating cylinder 713, a connecting arm 720, an aligning mechanism 721, an aligning support 722, an aligning unit 722a, an aligning block 722b, an aligning motor 722c, a wear-resistant slide block 730, a guiding device 731, a guiding column 732, a guiding block 900, a semiconductor crystal bar 910 and a crystal bar segment.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1, 2 and 3, fig. 1 is a perspective view of a multi-section semiconductor ingot cutting machine according to the present invention; FIG. 2 is a perspective view of FIG. 1 with the protective cover removed; fig. 3 is a perspective view of the multi-section semiconductor ingot cutting machine of the present invention with the protective cover removed and another viewing angle removed.
The utility model discloses a multistage formula semiconductor crystal bar clipper, include:
a base 100.
The material conveying device 200 is disposed on the base 100, and is configured to bear the semiconductor ingot 900 to be cut and drive the semiconductor ingot to move axially along its own axis.
The single-section type cutting device 400 is arranged above the material conveying device 200 and close to the feeding side, and is used for cutting the semiconductor crystal bar 900 and cutting a semiconductor crystal bar sample wafer by a single knife.
The multi-section type cutting device 300 is arranged above the material conveying device and in the longitudinal interval from the unloading side to the single-section type cutting device 400, and is used for synchronously cutting the semiconductor crystal bar 900 and cutting a semiconductor crystal bar sample wafer by multiple knives.
And a routing system 500 disposed on the base 100 and forming a cutting section for cutting the semiconductor crystal bar 900 in the single-section type cutting device 400 and the multi-section type cutting device.
In the actual production process, the single-section type cutting device 400 and the multi-section type cutting device 400 can independently act on the semiconductor crystal bar to perform cutting operation, so that the diversified cutting requirements of the utility model on the semiconductor crystal bar are realized; also multistage formula segmenting device 400 and single-stage formula segmenting device 400 work in coordination, and synchronous cutting is located semiconductor crystal bar 900 on material conveyor 200, so that the utility model discloses cutting efficiency maximize to the semiconductor crystal bar. The single-stage cutting device 400 is mainly used for single-blade cutting and sample wafer cutting of semiconductor crystal bars.
Referring to fig. 2 and 3, the multi-segment type truncating device 300 includes: a frame 310 fixedly connected to a first lifting device 320 disposed on the base 100 and driven by the first lifting device to vertically lift; the rack 310 is provided with a plurality of first cutting units 330 which are horizontally movable on the rack, the plurality of first cutting units 330 are positioned above the material conveying device 200 and synchronously lifted and lowered together with the rack 310 by the first lifting device 320, so that the semiconductor crystal bar 900 positioned on the material conveying device can be synchronously cut into a plurality of crystal bar segments 910. In this embodiment, the transmission mode in the first lifting device 320 may be hydraulic transmission, or may be other transmission modes with higher accuracy, such as screw transmission, gear transmission, and the like. The multi-section type cutting device can meet the requirement of synchronous multi-section type cutting operation of the semiconductor crystal bar, the cutting surfaces at two ends of the crystal bar section 910 generated by cutting are parallel, and the whole utilization rate of the crystal bar section during the crystal bar rounding in the next processing procedure is improved
Further, as shown in fig. 2 and 3, at least one first longitudinal sliding rail 110 is disposed on a side surface of the base 100 facing the rack 310, and a first longitudinal sliding slot 311 slidably engaged with the first longitudinal sliding rail is disposed on the rack 310. When the frame 310 moves up and down under the driving of the first lifting device 320, it is bound by the first longitudinal sliding slot 311 and the first longitudinal sliding rail 110, so as to ensure that the frame does not deflect during the moving process to affect the verticality between the end surfaces of the two ends of the ingot section 910 and the axis of the ingot section after the semiconductor ingot 900 is cut off.
In the present embodiment, as shown in fig. 2, 3, 4 and 5, the first cutting unit 330 includes: the first cutting frame 331 is horizontally and movably connected with the frame, and the first cutting frame is of a concave structure with a downward opening. A horizontal driving device 332 is arranged on one side of the first cutting frame close to the frame 310, and comprises a horizontal driving motor 332a fixedly arranged on the first cutting frame 331 and a first transmission gear 332b arranged on the shaft end of the output shaft of the servo motor, and the transmission gear is meshed with the horizontal rack 312 arranged on the frame 310. When the horizontal position of the first cutting unit 330 on the rack needs to be adjusted, the horizontal driving motor 332a receives the start model of the PLC control device electrically connected therewith, and the horizontal driving motor rotates and drives the first transmission gear to roll on the horizontal rack 332b to drive the whole displacement of the first cutting unit 330 on the rack 310. In this embodiment, the horizontal driving motor may be a precise transmission device such as a servo motor or a stepping motor.
Meanwhile, at least one horizontal sliding groove 331a is formed on a side of the first cutting frame 331 adjacent to the frame 310, and the horizontal sliding groove is adapted to a horizontal sliding rail 311 formed on the frame 310 in a length direction, and the horizontal sliding groove and the horizontal sliding rail are engaged with each other to allow the first cutting unit 320 to be horizontally slidably mounted on the frame 310.
As shown in fig. 2, in the present embodiment, the single-stage cutoff device 400 includes: a second lifting device 410 provided on the base 100; and a second cutting unit 420 slidably coupled to the base 100 and vertically moved by the second lifting device 410. In detail, the second elevating device includes: a longitudinal driving motor 411 fixedly installed on the base 100, and a second driving gear 412 (not shown) fixedly installed on an output shaft end of the longitudinal servo motor and engaged with a longitudinal rack 423 installed in the second cutting unit 420. Meanwhile, the second cutting unit further includes a second cutting frame 421, which is located above the material conveying device 200 and is also a concave structure with a downward opening. A second longitudinal sliding groove 422 matched with the second longitudinal sliding rail 120 on the base is arranged on one side, facing the base, of the second cutting frame. When the vertical cutting machine works, the vertical driving motor receives a driving signal from the PLC control device, and the vertical driving motor rotates and drives the second transmission gear to rotate on the vertical rack so as to drive the second cutting unit to integrally lift. In this embodiment, the longitudinal driving motor may be a precise transmission device such as a servo motor or a stepping motor. The single-section type cut-off device can efficiently meet the single-knife cutting requirement of the semiconductor crystal bar, and the processing efficiency is improved.
As shown in fig. 2 to 5, in the present invention, the routing system 500 includes: a cut line 510; a plurality of cutter roller sets 520 respectively installed on the first cutting unit 330 and the second cutting unit 420 corresponding to each other one by one; and the cutting line winding device 530 is arranged on the base and used for repeatedly winding and unwinding the cutting lines on the plurality of cutting roller sets.
The cutting wire winding device 530 includes two wire storage drums 531 disposed at opposite sides of the base, and both ends of the cutting wire are wound around the wire storage drums, and the wire storage drums are driven by a rotary motor (not shown) disposed on the base and capable of rotating forward and backward. The rotating motor is electrically connected with the PLC control device and realizes preset forward and reverse rotation under the control of the PLC control device. When the semiconductor crystal bar needs to be cut, the rotating motor receives the starting signal to repeatedly rotate forwards and backwards and drives the wire storage cylinder and the cutting wire wound on the wire storage cylinder to be repeatedly wound on the wire storage cylinder, and the cutting wire is subjected to reciprocating friction with the surface of the semiconductor crystal bar to achieve the purpose of cutting.
And in order to satisfy the utility model discloses accomplish the intercepting operation that detects the sample wafer to semiconductor crystal bar truncation department when cutting semiconductor crystal bar. In the present embodiment, 3 tangent rollers 521 are provided in the tangent roller group 520, and are rotatably installed in the corresponding first cutting unit or second cutting unit in a "pint". Meanwhile, as shown in fig. 9, 4 parallel wire grooves 521a are axially arranged on the rim of the wire-cutting roller, and the cutting wires are wound in the wire grooves 521a of the wire-cutting roller, so that 3 sampling intervals capable of cutting off the semiconductor crystal bar and simultaneously cutting off the sample wafer of the semiconductor crystal bar can be formed between the cutting wires wound in the adjacent wire grooves. Meanwhile, the number of the wire slots 521a on the tangent roller is not limited to 4 as exemplified in the embodiment, and the specific number may be determined according to the number of the samples to be cut (for example, if the number of the samples is n, the number of the wire slots is n +1, and n ≧ 1).
Further, in this embodiment, in order to ensure the processing efficiency, the thread cutting roller 521 can be made into a plurality of specifications, and during processing, a worker can rapidly replace the thread cutting roller 521 with the corresponding specification at any time according to the number of the samples to be cut. In this embodiment, the wire cutting roller 521 is detachably connected to the first cutting unit 330 and the second cutting unit 420 (the connection manner may be pin connection, snap spring connection, etc.) for facilitating the assembly and disassembly of the wire cutting roller by a worker.
Further, as shown in fig. 2 and 3, a plurality of suspension wire rollers 540 are further provided in the wire routing system 500, and the wire routing path of the present invention is limited and guided by the suspension wire rollers to enable the straight entry of the cutting wire to each tangent roller set 520, thereby reducing the wear of the cutting wire to the tangent roller set. Preferably, the suspension wire roller is also provided with a device for limiting the influence of the drop of the cutting wire from the suspension wire roller
Further, as shown in fig. 2 and 3, at least one tension device 600 is disposed on a side wall of the base 100 in a length direction thereof for adjusting tension of the cutting line. In detail, the tension device includes a rotating device 610 fixedly disposed on the base, and an encoder (not shown) is disposed at a rotating shaft end of the rotating device for reading information of a rotating angle of the rotating shaft. The shaft end of the rotating shaft of the rotating device is also fixedly connected with an adjusting arm 620, a tension pulley 630 is rotatably arranged on the adjusting arm, and the cutting wire is wound on the rim of the tension pulley. When the device works, the PLC control device drives the rotating device to rotate to adjust the distance of the stretched cutting line, and then the effect of adjusting the tension of the cutting line is achieved.
The utility model discloses in, for realizing the automatically regulated of line of cut 500 tension, the tension size of line of cut 500 is detected by setting up a tension detection device (not shown in the figure) in tension device 500, and PLC controlling means is given to with the tension value that detects to this tension detection device, then rotates and makes appropriate regulation through PLC controlling means drive rotary device 610. Preferably, the tension detection device may be an electric proportional valve, that is, the magnitude of the tension is converted according to the magnitude of the pressure acting on the electric proportional valve.
Further, as shown in fig. 2 and 3, the adjusting arm 620 is provided with a plurality of adjusting holes 621 along the length direction, and a worker can adjust the extension length of the adjusting arm through the connection between different adjusting holes 621 and the shaft end of the rotating shaft of the rotating device. Meanwhile, a V-shaped wire groove used for limiting the cutting wire 500 is also arranged on the tension pulley.
Further, as shown in fig. 2 and 3, in order to effectively balance the tension at the two ends of the cutting line 500, two tension devices 600 are symmetrically disposed on the sidewall of the base 100 in the length direction, and the two tension devices can effectively adjust and balance the tension at the two ends of the cutting line.
Further, referring to fig. 2 and 4, the tension device 600 further includes a limiting device 640 for limiting the rotation angle of the adjusting arm 620, and the limiting device includes two limiting rods disposed on the base 100. In detail, the two limit rods are an upper stop rod 641 located above one end of the adjusting arm 620 far from the rotation axis and used for limiting the rotation limit of the adjusting arm when the adjusting arm rotates upward, and a lower stop rod 642 located below one end of the adjusting arm 620 far from the rotation axis and used for limiting the rotation limit of the adjusting arm when the adjusting arm rotates downward. When the adjusting arm rotates to the position of the upper blocking rod 641 or the lower blocking rod 642, the upper blocking rod 641 or the lower blocking rod 642 will prevent the adjusting arm 620 from continuing to rotate, thereby reducing the probability of the rotating device 610 triggering the rotation threshold. In this embodiment, an encoder (not shown in the figure) capable of detecting the rotation angle of the rotation shaft of the rotation device 610 is further disposed at the rotation shaft end of the rotation device 610, the encoder is electrically connected with the PLC device to transmit the detected rotation angle to the PLC control device, and a rotation angle threshold of the rotation device 610 is disposed in the PLC control device (the rotation angle threshold can be adjusted according to the actual production situation), when the rotation angle of the rotation device touches the preset rotation threshold, it indicates that the tension of the cutting line is too large and exceeds the adjustment range of the tension device 600, and at this time, the PLC control device triggers an alarm and is right.
Referring to fig. 6 and 7, the material transfer apparatus 200 includes a loading platform 210 for guiding an outer semiconductor ingot and driving the outer semiconductor ingot to move axially; a cutting platform 220 for carrying the semiconductor ingot and driving the semiconductor ingot to move axially; and the discharging platform 230 is used for sequentially guiding out the cut crystal bar segments.
Wherein, all be equipped with at least one transport mechanism 240 in above-mentioned material loading platform, cutting platform, the platform of unloading for realize the axial transmission of semiconductor crystal bar between the three. Meanwhile, the cutting platform 220 further comprises a carrying platform 221 for carrying the semiconductor crystal bar 900 during processing; during operation, the conveying structure in the cutting platform can be lifted relative to the bearing platform, and preferably, the bearing platform is of a V-shaped groove structure.
Further, the bearing platform is detachably arranged in the cutting platform. The utility model discloses the in-process of cutting semiconductor crystal bar, inevitable can produce the cutting to the plummer, for the continuous intensity of guaranteeing the plummer and whole platform precision, the plummer sets up to removable form. When the work life of the bearing table 221 is reached, workers remove the old bearing table and then replace the old bearing table with a new bearing table to ensure the cutting precision of the subsequent semiconductor crystal bar. Preferably, in order to ensure the bearing strength of the bearing table, the material of the bearing table can be ceramic.
As shown in fig. 6, 7, and 10, the transfer mechanism 240 includes: a transfer support 241 disposed parallel to an axis of the semiconductor ingot; a plurality of transfer wheel sets 242 rotatably fixed to the transfer frame 241 and arranged along the axial direction of the semiconductor ingot; a third lifting device 243 fixedly connected with the conveying bracket for lifting the whole conveying bracket and the conveying wheel set arranged on the conveying bracket; the transmission wheel driving device 244 is disposed on the transmission bracket and is used for driving the transmission wheel set to rotate so as to drive the semiconductor ingot to move along the axial direction. In this embodiment, the power source of the transmission wheel driving device 244 is a motor capable of realizing forward and reverse rotation, and the power transmission between the motor and the transmission wheel set is realized through a transmission belt, meanwhile, the power transmission mode of the transmission wheel driving device is not limited to a servo motor and a transmission belt, and can also be realized through other devices such as a motor and a transmission chain; the motor and the gear are realized.
Preferably, the conveying wheel set includes two opposite conveying wheels 242a, and a component force chamfer 242b is provided on a rim of the opposite side of the conveying wheels. When the semiconductor crystal bar is located on the conveying wheel set, the gravity of the semiconductor crystal bar 900 received by the rotating shaft of the conveying wheel 242a is decomposed into an axial component and a radial component through the component force chamfer 242b, so that the load of the semiconductor crystal bar received by the rotating shaft of the conveying wheel 242a is reduced, and the whole practical service life of the conveying mechanism 240 is prolonged. Preferably the component chamfer is a 45 ° chamfer to equalize the axial and radial components experienced by the transfer wheel.
Preferably, the motor that is the power supply among a plurality of transport mechanism 240 can realize the differential rotation under the control of the PLC controlling means who is connected with it electricity, and is concrete, and transport structure's transfer rate is reduced according to the preface by unloading platform 230 to feeding platform 210 to make the crystal bar section 910 on the material conveyor can pull open certain safe distance through the conveying speed difference between adjacent transport mechanism 240, and then orderly the leaving the utility model discloses, prevent to produce the collision between the adjacent crystal bar section 910, influence the quality of the crystal bar section 910 that cuts.
In the present embodiment, when the semiconductor ingot is transferred, the transfer frame is lifted by the third lifting device 243 until the semiconductor ingot falling on the transfer wheel set 242 does not contact the susceptor 221, and the transfer wheel set is driven by the transfer wheel driving device 244 to rotate and drive the semiconductor ingot 900 located on the transfer wheel set 242 to move axially. When the semiconductor crystal bar reaches the cutting position, the transmission wheel driving device stops working, so that the semiconductor crystal bar does not continue to advance. The transfer frame 241 is driven by the third lifting device 243 to descend, and the semiconductor on the transfer wheel set descends synchronously with the transfer frame until the semiconductor crystal bar is located on the susceptor 221 and completely separated from the transfer wheel set, and the semiconductor crystal bar is located completely. After the cutting is completed, the third lifting device rises and drives the transport support 241 to rise to push the cut ingot segment on the susceptor off the susceptor 221, and after the third lifting device 243 lifts the transport support to the proper position, the transport wheel driving device 244 drives the transport wheel set to rotate and drives the semiconductor ingot on the transport wheel set to continue to move axially to the unloading platform 230.
As shown in fig. 2, 3, 6 and 7, the present invention further includes a centering device 700, which includes: two measuring devices 710, one of which is disposed on the second cutting frame 421, for measuring the head data of the semiconductor ingot on the carrier 221; the second one is disposed on one of the first cutting frames 331, and is used for measuring tail data of the semiconductor ingot after the first cutting frame adjusts the horizontal position. Meanwhile, the two are electrically connected with the PLC control device, and the measured data are sent to the PLC control device to calculate the levelness of the semiconductor crystal bar.
And the aligning mechanisms 720 are arranged at two ends of the cutting platform and used for supporting the cutting platform and adjusting the levelness of the semiconductor crystal bar above the cutting platform in a matching way.
As shown in fig. 6 and 7, the aligning mechanism 720 includes: the aligning support 721 is hinged to one end of the cutting platform, so that the cutting platform 220 rotates up and down around the aligning support; in detail, the aligning support comprises a support seat fixed on the base and a rotating shaft which is rotatably arranged in the support seat and is fixedly connected with the bottom surface of the cutting platform;
the aligning unit 722 is disposed at the other end of the cutting platform, and includes: the aligning block 722a is arranged below the cutting platform and used for supporting and adjusting the levelness of the cutting platform; the center adjusting motor 722b is provided on the base 100, and drives the center adjusting block 722a eccentrically connected to the output shaft of the center adjusting motor to rotate. Preferably, the aligning motor can be a high-precision driving device such as a servo motor or a stepping motor.
During operation, when two measuring devices measure that the axis of the semiconductor crystal bar 900 deviates from a horizontal line, the PLC control device drives the aligning motor and drives the aligning block connected with the aligning motor to rotate, and then the cutting platform 220 at the joint of the jacking or the lowering and the aligning block top is lifted up or lowered, so that the cutting platform rotates around the aligning support 721, and then the levelness adjustment of the semiconductor crystal bar on the cutting platform is completed.
In addition to this embodiment, it is preferable that, as shown in fig. 6 and 7, a wear-resistant slider 722c is further included in the aligning unit, and an outer edge portion of the aligning block 722a is in smooth contact with the wear-resistant slider. In this embodiment, the wear-resistant slider may be made of a wear-resistant material such as a ceramic material or a metal material; the contact surface between the buffering chute 722c and the aligning block 722a is a smooth surface to reduce the resistance and wear of the aligning block during rotation, and preferably, the wear-resistant sliding block is of a U-shaped structure with a downward opening to achieve a certain effect of limiting the axial movement of the aligning block.
Further, the center adjusting device 700 is further provided with a guiding device 730, including: the guiding column 731 is fixed on the base 100, and a vertical sliding groove longitudinal rack 423 is also arranged on one side of the guiding column facing the aligning unit 722. And the upper end of the guide block 732 is fixedly connected with the bottom surface of the cutting platform 220 and can move up and down along with the rotation of the cutting platform, and meanwhile, the guide block and the vertical sliding chute are in sliding fit with each other and are sleeved in the guide columns. The cooperation of the two is led to two lateral walls of vertical spout to necessarily support and press on the lateral wall of the guide block that is located inside it to make the horizontal displacement of guide block and the cutting platform fixedly connected with the guide block necessarily receive the restriction of two lateral walls of vertical spout. In this embodiment, the guide post is composed of a support plate facing the aligning unit 722 and upper guide cylinders symmetrically installed on the support plate. Wherein the guide cylinder is used for realizing the purpose of clamping the guide block and further limiting the horizontal displacement of the cutting platform fixedly connected with the guide block.
Referring to fig. 6 and 7, the detailed structure of the measuring device 710 includes: the contact type sensing device 711 is positioned above the material conveying device 200 and can contact with the top of the semiconductor crystal bar in a rotating mode or the top of the semiconductor crystal bar, and in the implementation, the contact type sensing device is electrically connected with the PLC control device and can transmit the measured data to the PLC control device; and the rotating cylinder is arranged on the first cutting frame/the second cutting frame and is fixedly connected with the contact type sensing device through a connecting arm 713. Wherein, the rotary cylinder 712 is electrically connected with the PLC control device and is controlled and driven by the PLC control device.
The method for cutting the semiconductor crystal bar by using the multi-section semiconductor crystal bar cutting machine comprises the following steps:
s1: the semiconductor crystal bar to be cut is transferred to a feeding platform in the material conveying device by the feeding device, and the semiconductor crystal bar is fed into the cutting platform and falls on the cutting platform by the feeding platform.
S2: the aligning device adjusts the horizontal state of the central axis of the semiconductor crystal bar on the cutting platform;
s3: the cutting and the cutting-off sampling operation of the semiconductor crystal bar are realized through various cutting modes;
s4: and the cut crystal bar segments are sequentially conveyed to the unloading platform by the cutting platform and are finally unloaded from the unloading platform to the transfer device.
In step S3, the plurality of cutting methods are:
s31: the single-section type cutting device independently descends to realize single-knife cutting and cutting-off sampling operation on the semiconductor crystal bar;
s32: the multi-section type cutting device independently descends to realize synchronous cutting and cutting sampling operation on the semiconductor crystal bar;
s33: the single-section type cutting device and the multi-section type cutting device synchronously lower the frame to realize the synchronous cutting of the maximum efficiency of the semiconductor crystal bar and the sampling operation of the cutting part;
in detail, in step S1, the method for transferring the semiconductor ingot to be cut to a loading platform of a material conveying device, wherein the loading platform feeds the semiconductor ingot to a cutting platform and the semiconductor ingot is located on the cutting platform, includes:
s11: the material conveying device lifts the semiconductor crystal bar to the same horizontal height with the feeding platform;
s12: pushing the semiconductor crystal bar to the bottom part of the semiconductor crystal bar to be contacted with a conveying wheel set in a feeding platform;
s13: the conveying wheel driving device drives the conveying wheel set to rotate and drives the semiconductor crystal bar to enter the feeding platform, and then the conveying mechanism in the feeding platform conveys the semiconductor crystal bar part into the cutting platform through the rotating conveying wheel set;
s14: the rotating wheel set on the cutting platform rotates and drives the semiconductor crystal bar to axially move until the whole semiconductor crystal bar enters the cutting platform;
s15: the single-section type truncation device descends to position the head of the semiconductor crystal bar on the cutting platform, and the semiconductor crystal bar on the cutting platform is finely adjusted through the forward and reverse rotating transmission wheel driving device;
s16: and driving a third lifting device to synchronously descend a plurality of conveying and conveying mechanisms in the cutting platform to enable the semiconductor crystal bars to be positioned on the bearing platform.
In detail, in step S2, the aligning apparatus adjusts the horizontal state of the central axis of the semiconductor ingot on the cutting table, and includes:
s21: adjusting the horizontal position of one cutting unit provided with a measuring device in the multi-section type cut-off device to be above the tail part of the semiconductor crystal bar;
s22: descending the multi-section type cutting device to the upper part of the semiconductor crystal bar;
s23: rotating two measuring devices respectively arranged on the multi-section type cut-off device and the single-section type cut-off device, so that a detection end of a contact upper contact type sensing device in the measuring devices is contacted with the semiconductor crystal bar, further measuring data at two ends of the semiconductor, and converting the levelness of a central axis of the semiconductor crystal bar on the cutting platform according to the data at two ends of the semiconductor crystal bar measured by the measuring devices;
s24: the two measuring devices rotate to the initial positions, and the single-section type cut-off device and the multi-section type cut-off device ascend to return to the initial positions;
s25: according to the levelness of the central axis of the semiconductor crystal bar obtained by conversion, the aligning unit drives the cutting platform to rotate around aligning manufacture so as to drive the semiconductor crystal bar which falls on the bearing platform to make horizontal adjustment and reach a horizontal state.
In detail, in step S31, the single-stage slicing apparatus independently lowers the single-stage slicing apparatus to perform the single-blade slicing and the slicing sampling operation for the semiconductor ingot in multiple stages, including:
s311: the single-section type cut-off device is driven by the second lifting device to independently descend, and the wiring system is started simultaneously to make the cutting line releasing action required by adapting to the lower frame of the single-section type cut-off device;
s312: when the single-section type cutting device descends to the position to be cut, the action of the routing system for releasing the cutting line is finished, the tension device is started, and the tension force applied to the cutting line is finely adjusted by adjusting the position of the tension wheel;
s313: after the tension of the cutting line is finely adjusted, the wiring system is started again, and the cutting line is driven to rub back and forth on the surface of the semiconductor crystal bar to form cutting;
s314: the single-section type cut-off device continuously descends until the semiconductor crystal bar is cut through, the cutting and cut-off sampling operation is completed, and the single-section type cut-off device is driven by the second lifting device to return to the initial position.
In the step S32, the multi-stage cutting device independently descends to cut the semiconductor ingot and sample the cut portion, including:
s321: the horizontal driving device in the multi-section type cutting device acts to adjust the horizontal positions of the plurality of second cutting units;
s322: the first lifting device is started and drives the rack and the plurality of second cutting units on the rack to synchronously descend, and the wiring system is started simultaneously to make the cutting line releasing action required by adapting to the lower rack of the single-section type cutting device;
s323: when the multi-section type cutting device descends to the position to be cut, the action of the routing system for releasing the cutting line is finished, the tension device is started, and the tension force applied to the cutting line is finely adjusted by adjusting the position of the tension wheel;
s324: after the tension of the cutting line is finely adjusted, the wiring system is started again, and the cutting line is driven to rub back and forth on the surface of the semiconductor crystal bar to form cutting;
s325: the multi-section type cutting device continuously descends until the semiconductor crystal bar is cut through, the cutting and the cutting part sampling operation are completed, the multi-section type cutting device is driven by the first lifting device to return to the initial position, and the plurality of first cutting units are driven by the horizontal driving device to return to the initial position.
In the step S33, the multi-stage cutting device independently descends to cut the semiconductor ingot and sample the cut portion, including:
s331: the horizontal driving device in the multi-section type cutting device acts to adjust the horizontal positions of the plurality of second cutting units;
s332: the single-section type cut-off device and the multi-section type cut-off device synchronously descend under the action of the second lifting device and the first lifting device, and meanwhile, the wiring system is started to make the cutting line releasing action required by adapting to the lower frame of the single-section type cut-off device;
s333: when the single-section type cutting device and the multi-section type cutting device are descended to the position to be cut, the action of the routing system for releasing the cutting line is finished, the tension device is started, and the tension force applied to the cutting line is finely adjusted by adjusting the position of the tension wheel;
s334: after the tension of the cutting line is finely adjusted, the wiring system is started again, and the cutting line is driven to rub back and forth on the surface of the semiconductor crystal bar to form cutting;
s335: the single-section type cutting device and the multi-section type cutting device continuously descend until the semiconductor crystal bar is cut through, the cutting and the cutting part sampling operation are completed, the single-section type cutting device returns to the initial position under the driving of the second lifting device, meanwhile, the multi-section type cutting device returns to the initial position under the driving of the first lifting device, and the plurality of first cutting units return to the initial position under the action of the horizontal driving device.
In detail, in step S4, the method for sequentially feeding the cut ingot segments from the cutting platform to the unloading platform and finally unloading the cut ingot segments from the unloading platform to the transferring device includes:
s41: after the semiconductor crystal bar is cut, a plurality of conveying mechanisms in the cutting platform synchronously ascend to the same horizontal height under the action of a third lifting device so as to lift the cut crystal bar section off the bearing platform;
s42: when transport mechanism rises to initial position (can lift the semiconductor crystal bar promptly from the plummer), a plurality of transport mechanism among the material transfer device start according to the preface according to the start-up order of platform to cutting platform to material conveyor's last crystal bar section is according to the preface seeing off the utility model discloses can be used for the semiconductor crystal bar to carry the material to the start-up order of platform according to the preface.
Further, in step S42, the plurality of conveying structures in the material conveying device are arranged in the sequence from the unloading platform to the cutting platform to the loading platform, wherein the rotating speed of the conveying wheel set driven by the conveying wheel driving device is sequentially reduced, so that the adjacent crystal rod segments can generate a sufficient safety distance on the material conveying device when being unloaded.
The utility model discloses a semiconductor crystal bar cuts method realizes the diversified cutting operation to the semiconductor crystal bar through multiple cutting mode. And simultaneously, the utility model discloses in realized the function of cutting off department sample wafer in the synchronous intercepting of cutting apart semiconductor crystal bar section through the improvement to current tangent line roller structure, the effectual machining efficiency who promotes the semiconductor crystal bar. Additionally, the utility model provides a aligning device makes the utility model discloses can realize leveling function before cutting semiconductor crystal bar to promoted and cut the straightness that hangs down between terminal surface and the crystal bar section the central axis, guaranteed the high utilization ratio to the crystal bar section in the later stage rounding processing. Meanwhile, the material conveying device unloads materials at different time and different speed of the crystal bar sections, so that the safety interval between the crystal bar sections is ensured, and the collision probability of the crystal bar sections during unloading is reduced.
Claims (10)
1. A multistage semiconductor crystal bar cutting device is characterized in that: the method comprises the following steps:
the single-section type cutting device is used for cutting the semiconductor crystal bar by a single knife and cutting a sample wafer at the cut part of the semiconductor crystal bar;
the multi-section type cutting device is used for synchronously cutting the semiconductor crystal bar by multiple knives and cutting a semiconductor crystal bar sample wafer;
the wiring system is arranged on the base and forms a cutting section for cutting the semiconductor crystal bar in the single-section type cutting device and the multi-section type cutting device;
the single-stage cutting device and the multi-stage cutting device can realize independent or synchronous semiconductor crystal bar cutting operation.
2. The apparatus of claim 1, wherein the multi-stage slicing apparatus comprises:
the frame is arranged on the base;
the first lifting mechanism is arranged on the base and drives the rack fixedly connected with the base to lift longitudinally; and
the first cutting units can horizontally move and are arranged on the rack, and the first cutting units are driven by the first lifting mechanism to synchronously lift at random.
3. The multi-stage semiconductor ingot slicing apparatus of claim 2, wherein: the base is longitudinally provided with at least one first longitudinal sliding rail, the rack is provided with a first longitudinal sliding groove matched with the sliding rail, and the first longitudinal sliding groove are matched with each other to limit and guide the lifting track of the rack.
4. The multi-stage semiconductor ingot slicing apparatus of claim 3, wherein the first slicing unit comprises:
the first cutting frame is horizontally and slidably connected with the rack, and is of a concave structure with a downward opening;
the first horizontal driving device is arranged on one side, close to the rack, of the first cutting frame and is in transmission with the rack of the rack.
5. The apparatus of claim 1, wherein the single-stage slicing apparatus comprises:
the second lifting mechanism is arranged on the base;
and the second cutting unit is in sliding fit with the base, and is driven by a second lifting mechanism connected with the second cutting unit to vertically lift and cut the semiconductor crystal bar.
6. The multi-segment semiconductor ingot cutting apparatus according to claim 1, wherein the routing system comprises:
cutting a line;
the plurality of tangent roller sets are arranged on the single-section type cutting device of the multi-section type cutting device corresponding to the tangent roller sets one by one;
and the cutting line winding device is arranged on the base and used for winding and unwinding the cutting lines on the plurality of cutting line roller sets.
7. The multi-stage semiconductor ingot cutting device according to claim 6, wherein the tangent roller set comprises a plurality of tangent rollers, and a plurality of wire grooves are axially arranged on the rim of each tangent roller at intervals; the cutting lines are wound between adjacent cutting lines in the wire grooves to form sampling intervals.
8. The apparatus of claim 7, wherein adjacent ones of the plurality of wire slots are equally axially spaced.
9. The apparatus of claim 8, wherein the plurality of wire cutting rolls are mounted on the corresponding multi-stage cutting apparatus and single-stage cutting apparatus in a quick-replaceable manner.
10. The multi-sectional semiconductor ingot cutting device according to claim 9, wherein the routing system further comprises a plurality of wire hanging rollers for limiting and guiding routing of the cutting wires.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920401859.1U CN210256791U (en) | 2019-03-27 | 2019-03-27 | Multi-section type semiconductor crystal bar cutting device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920401859.1U CN210256791U (en) | 2019-03-27 | 2019-03-27 | Multi-section type semiconductor crystal bar cutting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114516125A (en) * | 2020-11-20 | 2022-05-20 | 天通日进精密技术有限公司 | Silicon rod cutting device and silicon rod cutting method |
| WO2024094187A1 (en) * | 2022-11-03 | 2024-05-10 | 青岛高测科技股份有限公司 | Cutting machine |
-
2019
- 2019-03-27 CN CN201920401859.1U patent/CN210256791U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114516125A (en) * | 2020-11-20 | 2022-05-20 | 天通日进精密技术有限公司 | Silicon rod cutting device and silicon rod cutting method |
| WO2022105162A1 (en) * | 2020-11-20 | 2022-05-27 | 天通日进精密技术有限公司 | Silicon rod cutting device and silicon rod cutting method |
| WO2024094187A1 (en) * | 2022-11-03 | 2024-05-10 | 青岛高测科技股份有限公司 | Cutting machine |
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Denomination of utility model: Multi segment semiconductor crystal rod cutting device Effective date of registration: 20211126 Granted publication date: 20200407 Pledgee: Hangzhou United Rural Commercial Bank Co.,Ltd. Haining sub branch Pledgor: TIANTONG RIJIN PRECISION TECHNOLOGY Co.,Ltd. Registration number: Y2021330002258 |