CN114516125A

CN114516125A - Silicon rod cutting device and silicon rod cutting method

Info

Publication number: CN114516125A
Application number: CN202011467695.6A
Authority: CN
Inventors: 卢建伟; 金晔天; 潘雪明; 朱勤超
Original assignee: Tiantong Rijin Precision Technology Co ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2020-11-20
Filing date: 2020-12-14
Publication date: 2022-05-20
Also published as: WO2022105162A1; CN214687337U; CN214687336U

Abstract

The application discloses silicon rod cuts equipment and silicon rod and cuts method, this silicon rod cuts equipment includes frame, material transport platform and two at least linear cutting device, and these two at least linear cutting device are independent each other, so accessible each independent linear cutting device carries the silicon rod execution to treating that the bench bears the weight of to the material and cuts the operation, has improved the operational freedom degree and the efficiency of cutting in the silicon rod cuts the operation. The closed loop line of cut that the linear cutting unit among this wire cutting device adopted, so can keep the line of cut high-speed operation, improve cutting efficiency, and simultaneously, the closed loop line of cut can be the operation of same running direction in cutting the operation, so, the linear cutting unit of this application can realize the operation of cutting of high accuracy, the cutting face that has avoided line of cut operation switching-over or functioning speed to lead to among the current cutting means has ripple scheduling problem, and simultaneously, this closed loop line of cut can effectively reduce the required line of cut overall length of linear cutting unit and avoid parts such as a receipts line section of thick bamboo and a wire reel, and the production cost is reduced.

Description

Silicon rod cutting device and silicon rod cutting method

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to silicon rod cutting equipment and a silicon rod cutting method.

Background

The wire cutting technology is an advanced silicon material processing technology in the world at present, and the principle of the wire cutting technology is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of wire cutting is achieved. During the cutting process, the steel wire or diamond wire is guided by the wire guide wheel, a cutting wire saw or a wire net is formed on the cutting wheel, and the workpiece to be processed is fed by the ascending and descending of the workbench or the ascending and descending of the cutting wire saw or the wire net. Under the action of a pressure pump, a cooling water automatic spraying device assembled on the equipment sprays cold water to cutting parts of the steel wire or the diamond wire and the workpiece, and the steel wire or the diamond wire reciprocates to cut the material to be processed into a plurality of pieces at one time. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the linear cutting technology has the advantages of high efficiency, high productivity, high precision and the like.

Current silicon rod clipper, including frame, frame and wire-electrode cutting unit, wherein, the wire-electrode cutting unit is a plurality of, and the line of cut twines cutting wheel and form a plurality of cutting coping saws in each wire-electrode cutting unit, and these a plurality of wire-electrode cutting units set up in the frame in unison, and when the execution was cuted the operation, a plurality of wire-electrode cutting units moved in step lift under elevating system's drive, had the inconvenience in a great deal of operations. For example, all the wire cutting units still have to be moved up and down, which causes a certain waste even in the case of a short silicon rod size; when one linear cutting unit fails, the whole machine is influenced; the cutting line is required to be wound on the plurality of linear cutting units in sequence, the whole cutting line is long, more transition wheels are required to be configured, parts such as a take-up drum and a pay-off drum are required to be arranged on two sides of the cutting line, the problem that the cutting line is uneven in tension is solved, the cutting line runs in a reciprocating mode during operation, and the cutting line usually undergoes the processes of running acceleration and deceleration when the running direction of the cutting line is switched, so that certain waviness can be formed on the cutting surface or the flatness of the cutting surface is not high.

Disclosure of Invention

In view of the above-mentioned disadvantages of the related art, the present application aims to disclose a silicon rod slicing apparatus and a silicon rod slicing method for solving the problems of complicated apparatus structure, inflexible operation, low cutting precision, and the like in the related art.

To achieve the above and other related objects, a first aspect of the present application discloses a silicon rod grinder including: a machine base; the material conveying table is arranged on the base and used for bearing the silicon rod to be cut and driving the silicon rod to be cut to be conveyed along a first direction, wherein the axis of the silicon rod to be cut is parallel to the first direction; at least two linear cutting devices which are mutually independent and arranged at intervals along a first direction; the wire cutting device is provided with at least one wire cutting unit, the wire cutting unit comprises a cutting wheel and a closed loop cutting wire which is connected end to end, and the closed loop cutting wire winds behind the cutting wheel to form a cutting wire saw.

In certain embodiments of the first aspect of the present application, the material delivery table includes a roller assembly and a motor assembly for controlling the roller assembly.

In certain embodiments of the first aspect of the present application, the roller assembly comprises: the roller pairs are arranged at intervals along the first direction, and each roller pair comprises two rollers connected through a rotating shaft.

In certain embodiments of the first aspect of the present application, the roller assembly is divided into a plurality of roller assembly sections.

In certain embodiments of the first aspect of the present application, the silicon rod chopping apparatus comprises at least two single-wire cutting devices having a single-wire cutting unit comprising: cutting the stent; a closed loop cutting line; the first single-wire cutting wheel and the second single-wire cutting wheel are arranged on two opposite sides of the cutting support along the second direction, and the wheel surfaces of the first single-wire cutting wheel and the second single-wire cutting wheel are parallel or coplanar; at least one single line transition wheel; wherein the closed loop cutting wire is wound around the first single wire cutting wheel, the second single wire cutting wheel and the at least one transition wheel to form a single wire cutting wire saw; the first direction is perpendicular to the wheel surfaces of the first single-wire cutting wheel and the second single-wire cutting wheel, and the second direction is perpendicular to the first direction.

In certain embodiments of the first aspect of the present application, the single-wire cutting unit comprises a first single-wire transition wheel forming a triangle with the first single-wire cutting wheel and a second single-wire cutting wheel.

In certain embodiments of the first aspect of the present application, the single-wire cutting unit includes a first single-wire transition wheel adjacent to the first single-wire cutting wheel and a second single-wire transition wheel adjacent to the second single-wire cutting wheel, the first single-wire transition wheel, the second single-wire transition wheel, and the second single-wire cutting wheel and the first single-wire cutting wheel forming a quadrilateral.

In certain embodiments of the first aspect of the present application, the single-wire cutting unit includes a first single-wire transition wheel adjacent the first single-wire cutting wheel, a second single-wire transition wheel adjacent the second single-wire cutting wheel, and a third single-wire transition wheel between the first single-wire transition wheel and the second single-wire transition wheel.

In certain embodiments of the first aspect of the present application, the single-wire cutting unit further comprises a single-wire tension adjustment mechanism associated with the at least one single-wire transition wheel.

In certain embodiments of the first aspect of the present application, the single-wire tension adjustment mechanism comprises: a single-wire drive unit; a single wire link assembly associated with the single wire transition wheel and the single wire drive unit; the single-wire connecting rod assembly is controlled by the single-wire driving unit to adjust the position of the single-wire transition wheel so as to adjust the tension of the closed-loop cutting wire.

In certain embodiments of the first aspect of the present application, the single-wire link assembly comprises: the pivot is arranged on the cutting bracket; a first link, a first end of the first link associated with the pivot, a second end of the first link connected with the single-line transition wheel; a second link, a first end of the second link associated with the pivot, a second end of the second link connected with the single wire drive unit.

In certain embodiments of the first aspect of the present application, the single wire drive unit comprises a counterweight or a drag cylinder.

In certain embodiments of the first aspect of the present application, the single-wire tension adjustment mechanism further comprises a single-wire tension balancing component.

In certain embodiments of the first aspect of the present application, the silicon rod chopping apparatus further comprises at least one multi-wire cutting device having a multi-wire cutting unit comprising: cutting the stent; a first closed loop cut line and a second closed loop cut line; the first multi-wire cutting wheel and the second multi-wire cutting wheel are arranged on two opposite sides of the cutting support along a second direction, wheel surfaces of the first multi-wire cutting wheel and the second multi-wire cutting wheel are parallel or coplanar, the first multi-wire cutting wheel is provided with at least two wire grooves, and the second multi-wire cutting wheel is provided with at least two wire grooves; at least one first multi-line transition wheel and at least one second multi-line transition wheel; wherein the first closed loop cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and the at least one first multi-wire transition wheel to form a first multi-wire cutting wire saw, the second closed loop cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and the at least one second multi-wire transition wheel to form a second multi-wire cutting wire saw, the first multi-wire cutting wire saw is parallel to the second multi-wire cutting wire saw, and a wire spacing is formed between the first multi-wire cutting wire saw and the second multi-wire cutting wire saw; the first direction is perpendicular to the tread of the first and second multi-wire sawing wheels and the second direction is perpendicular to the first direction.

In certain embodiments of the first aspect of the present application, the multi-wire cutting unit comprises a first multi-wire transition wheel and a second multi-wire transition wheel, the first multi-wire transition wheel and the first and second multi-wire cutting wheels forming a triangle, and the second multi-wire transition wheel and the first and second multi-wire cutting wheels forming a triangle.

In certain embodiments of the first aspect of the present application, the multi-wire cutting unit comprises two first multi-wire transition wheels and two second multi-wire transition wheels, the two first multi-wire transition wheels and the first multi-wire cutting wheel and the second multi-wire cutting wheel forming a quadrilateral, and the two second multi-wire transition wheels and the first multi-wire cutting wheel and the second multi-wire cutting wheel forming a quadrilateral.

In certain embodiments of the first aspect of the present application, the multi-wire cutting unit further comprises at least one multi-wire tension adjustment mechanism associated with at least one of the at least one first multi-wire transition wheel and at least one second multi-wire transition wheel.

In certain embodiments of the first aspect of the present application, the multi-wire tension adjustment mechanism comprises: a multi-line driving unit; a multi-wire linkage assembly associated with the multi-wire drive unit and the corresponding first or second multi-wire transition wheel; the multi-wire linkage assembly is controlled by the multi-wire drive unit to adjust the position of the first or second multi-wire transition wheel to adjust the tension of the closed loop cutting wire.

In certain embodiments of the first aspect of the present application, the multi-wire link assembly comprises: the pivot is arranged on the cutting bracket; a first link having a first end associated with the pivot and a second end connected to the first or second multi-line transition wheel; a second link, a first end of the second link being associated with the pivot, a second end of the second link being connected with the multi-wire drive unit.

In certain embodiments of the first aspect of the present application, the multi-wire drive unit comprises a counterweight or a tension cylinder.

In certain embodiments of the first aspect of the present application, the multi-wire tension adjustment mechanism further comprises a multi-wire tension balancing component.

In certain embodiments of the first aspect of the present application, the wire cutting device further comprises a cutting wire driving mechanism for driving the closed loop cutting wire to operate to cut the silicon rod to be cut.

In certain embodiments of the first aspect of the present application, the cutting device further comprises a silicon rod stabilizing device corresponding to the wire cutting device, and the silicon rod stabilizing device is configured to stabilize the silicon rod to be cut when the wire cutting device cuts the silicon rod to be cut.

In certain embodiments of the first aspect of the present application, the silicon rod stabilizing device comprises a first stabilizing component and a second stabilizing component spaced apart in a first direction, and an indwelling space is provided between the first stabilizing component and the second stabilizing component for receiving a cutting wire saw in the wire cutting device.

In certain embodiments of the first aspect of the present application, each of the first and second stabilizing assemblies comprises first and second side stabilizing members disposed along the second direction for respectively abutting opposite sides of the silicon rod to be cut.

In certain embodiments of the first aspect of the present application, any one of the first side stabilizing member and the second side stabilizing member comprises: a workpiece support block; and the workpiece auxiliary supporting block is controlled by the supporting block driving unit to move along the second direction so as to stretch and retract relative to the workpiece supporting block.

In certain embodiments of the first aspect of the present application, the silicon rod chopping apparatus further comprises a position adjusting device for adjusting the position of the at least one wire cutting device.

In certain embodiments of the first aspect of the present application, the position adjustment device comprises: the movable guide rail is arranged on the base along a first direction; the slide block is arranged on the at least one linear cutting device; and the moving driving unit is used for driving the at least one wire cutting device to move along the moving guide rail.

In certain embodiments of the first aspect of the present application, the silicon rod cutting apparatus further comprises a detection device for detecting an axial levelness of a silicon rod to be cut placed on the material conveying table.

In certain embodiments of the first aspect of the present application, the silicon rod cutting apparatus further includes a leveling device for leveling an axis of the silicon rod to be cut placed on the material conveying table according to a detection result of the detection device.

The invention discloses a silicon rod cutting method, which is applied to silicon rod cutting equipment, wherein the silicon rod cutting equipment comprises a base, a material conveying table and at least two mutually independent linear cutting devices, linear cutting units in the linear cutting devices comprise cutting wheels, transition wheels and closed loop cutting lines connected end to end, the closed loop cutting lines are wound around the cutting wheels and the transition wheels to form a cutting wire saw, and the silicon rod cutting method comprises the following steps: placing a silicon rod to be cut on a material conveying table, wherein the axis of the silicon rod is parallel to the first direction; the material conveying table is used for driving the silicon rod to be cut to be conveyed to a cutting position along a first direction; and independently driving part or all of the at least two wire cutting devices, so that the cutting wire saws in the part or all of the wire cutting devices perform cutting operation on the silicon rod to form the silicon rod sections.

In certain embodiments of the second aspect of the present application, the silicon rod truncation apparatus further includes a silicon rod stabilizing device corresponding to the wire cutting device, and the silicon rod truncation method further includes the steps of: before independently driving part or all of the wire cutting devices in the at least two wire cutting devices, driving a silicon rod stabilizing device corresponding to the wire cutting devices to stabilize the silicon rod to be cut.

The application discloses silicon rod cuts equipment and silicon rod and cuts method, silicon rod cuts equipment includes frame, material transport platform and two at least wire-electrode cutting device, wherein, two at least wire-electrode cutting device are mutually independent, so accessible each independent wire-electrode cutting device carries the silicon rod execution of treating that the bench bore to the material and cuts the operation, has improved the silicon rod and has cut the degree of freedom of operation and cut efficiency in the operation. And, the closed loop line of cut that the line cutting unit among the wire cutting device adopted, so can keep the line of cut high-speed operation, improve cutting efficiency, simultaneously, the closed loop line of cut can be in same direction of operation of cutting, so, the line cutting unit of this application can realize the high accuracy and cut the operation, has avoided cutting face that line of cut operation switching-over or functioning speed lead to in the current cutting mode to have the ripple scheduling problem, simultaneously, the closed loop line of cut can effectively reduce the required line of cut overall length of line of cut unit and avoid parts such as take-up cylinder and pay off cylinder, reduction in production cost.

Drawings

The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which this application relates will be better understood by reference to the exemplary embodiments described in detail below and the accompanying drawings. The brief description of the drawings is as follows:

fig. 1 is a schematic structural view of a silicon rod truncation apparatus according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a single-line cutting device according to an embodiment of the present invention at a first viewing angle.

Fig. 3 is a schematic structural diagram of a single-line cutting device according to an embodiment of the present invention at a second viewing angle.

Fig. 4 and 5 are views showing the state of the silicon rod stabilizing device in the single-wire cutting device of the present application.

Fig. 6 is a schematic view showing the configuration of the silicon rod truncating apparatus of the present application in another embodiment.

Fig. 7 is a schematic view of a multi-wire saw device according to another embodiment of the present invention from a first view angle.

Fig. 8 is a schematic view of the multi-wire saw device of the present application from a second perspective in another embodiment.

Fig. 9 is a schematic structural view of a silicon rod truncation apparatus according to another embodiment of the present application.

Fig. 10 is a schematic view of a single-line cutting device according to the present application at a first viewing angle in a further embodiment.

Fig. 11 is a schematic view of a single-line cutting device according to the present application at a second viewing angle in a further embodiment.

Fig. 12 is a schematic structural diagram of a single-line cutting device according to the present application at a first viewing angle in a further embodiment.

Fig. 13 is a schematic structural diagram of a single-line cutting device according to the present application at a second viewing angle in a further embodiment.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It is to be understood that other embodiments may be utilized and mechanical composition, structure, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first single-wire cutting wheel may be referred to as a second single-wire cutting wheel, and similarly, the second single-wire cutting wheel may be referred to as a first single-wire cutting wheel, without departing from the scope of the various described embodiments. The first single-line cutting wheel and the second single-line cutting wheel are both described in the context of a single-line cutting wheel, but they are not the same single-line cutting wheel unless the context clearly dictates otherwise. Similar considerations also apply to the first and second closed loop cutting lines, the first and second multi-wire cutting wheels, the first and second multi-wire transition wheels, the first and second connecting rods, the first and second stabilizing assemblies, etc.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In the existing silicon material processing, based on the inherent hard and brittle characteristics of silicon rods, wire cutting technology is generally used for processing. The procedure of the silicon rod operation starts with the execution of the cutting operation on the original long silicon rod to form a multi-stage short silicon rod (i.e., a silicon rod cut section which meets the specification of a workpiece after cutting the silicon rod), and the cutting operation uses equipment, i.e., silicon rod cutting equipment. Generally, a worktable is arranged on a silicon rod cutting device, for example, cutting wires of steel wires or diamond wires are guided by cutting wheels to form cutting wire saws on the cutting wheels to cut the silicon rod to be processed, and for the silicon rod cutting device, the implementation manner can refer to the scheme described in chinese patent CN 105196433B. When the silicon rod is placed on the material conveying table and cut-off operation is carried out, the plurality of linear cutting units are driven to descend synchronously by controlling the lifting mechanism, and the cutting fretsaws in the linear cutting units are used for contacting and entering the silicon rod so as to cut the silicon rod until the silicon rod penetrates through the silicon rod, so that the silicon rod cut-off operation is completed. Besides, other implementation manners of the silicon rod cutting equipment can refer to technical schemes described in Chinese invention patent documents such as patent publication No. CN 105856445B.

However, there are still some disadvantages in the related art. For example, all the wire cutting units can be moved up and down at the same time, which causes a certain waste even in the case of a short silicon rod size; when one linear cutting unit fails, the whole machine is influenced; the cutting line is required to be wound on the plurality of linear cutting units in sequence, the whole cutting line is long, more transition wheels are required to be configured, parts such as a take-up drum and a pay-off drum are required to be arranged on two sides of the cutting line, the problem that the cutting line is uneven in tension is solved, the cutting line runs in a reciprocating mode during operation, and the cutting line usually undergoes the processes of running acceleration and deceleration when the running direction of the cutting line is switched, so that certain waviness can be formed on the cutting surface or the flatness of the cutting surface is not high.

In view of the above, the present application discloses a silicon rod cutting apparatus and a silicon rod cutting method, which are originally created by using related components to solve the problems of complicated apparatus structure, inflexible operation, low cutting precision and the like in the related art.

In the embodiments provided herein, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, and the first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other two by two. For example, a length extending direction of the silicon rod sectioning apparatus, that is, a length direction when the silicon rod is placed thereon, is defined as a first direction (that is, a front-back direction or a conveying direction), a width extending direction of the silicon rod sectioning apparatus, that is, a left-right direction, is defined as a second direction (that is, a left-right direction), and a direction perpendicular to a horizontal plane formed by the first direction and the second direction is defined as a third direction (that is, a vertical direction, an up-down direction, or a lifting direction).

The application discloses silicon rod cuts equipment, carry platform and two at least wire-electrode cutting device of mutually independent including frame, material, wherein, the material is carried the platform and is located on the frame for bear and wait to cut silicon rod and drive and wait to cut the silicon rod and carry along the first direction, two at least wire-electrode cutting device mutually independent and along the first direction interval setting, each wire-electrode cutting device includes the wire-electrode cutting frame and locates an at least wire-electrode cutting unit on the wire-electrode cutting frame with liftable, the closed loop line of cutting of wire cutting unit cutting wheel, cross the ferryboat and end to end, the closed loop line of cutting is around forming the cutting coping saw behind cutting wheel and the ferryboat.

The application further discloses a silicon rod truncation method based on the silicon rod truncation equipment, which comprises the following steps: placing a silicon rod to be cut on a material conveying table, wherein the axis of the silicon rod is parallel to the first direction; the material conveying table is used for driving the silicon rod to be cut to be conveyed to a cutting position along a first direction; and independently driving part or all of the at least two wire cutting devices, so that the cutting wire saws in the part or all of the wire cutting devices perform cutting operation on the silicon rod to form the silicon rod sections.

The silicon rod cutting equipment and the silicon rod cutting method are used for cutting silicon rods. In embodiments, the silicon rod includes a single crystal silicon rod, i.e., a rod-shaped single crystal silicon grown from a melt by using a czochralski method or a suspension float zone method, such as a single crystal silicon rod having a length of about 5000mm (e.g., 5360mm specification, etc.) or a single crystal silicon rod having a length of about 800mm, which is commonly used in silicon rod processing, and a polycrystalline silicon rod, i.e., a silicon rod in which silicon is deposited on the surface of a silicon core wire by using a deposition technique such as a chemical vapor deposition technique, but is not limited thereto, and in other possible embodiments of the present application, the silicon rod cutting apparatus and the silicon rod cutting method may also be used for cutting a silicon ingot of polycrystalline silicon, or other hard materials having a long shape and requiring a cutting process.

In any embodiment provided by the present application, the end surfaces of the silicon rod refer to two surfaces that are opposite to each other along a first direction and point at a length direction of the silicon rod, for example, the two end surfaces of the silicon rod to be cut are circular or quasi-circular, and the side surface of the silicon rod is an arc surface; the cut silicon rod has a rectangular or quasi-rectangular shape at its two ends, i.e. four sides of the silicon rod in the longitudinal direction, which are generally rectangular.

The silicon rod truncation apparatus disclosed herein is used to perform truncation operations on a silicon rod to cut a long raw silicon rod into a plurality of short silicon rod segments. The silicon rod truncation apparatus of the present application may include at least: the machine comprises a machine base, a material conveying platform and at least two linear cutting devices.

The base serves as a main body part of the silicon rod cutting equipment and is used for providing a silicon rod processing platform, and in one example, the size and the weight of the base are large so as to provide a larger mounting surface and firmer overall stability. It should be understood that the machine base can serve as a base for different structures or components of the silicon rod slicing apparatus for performing machining operations, and the specific structure of the machine base can be changed based on different functional requirements or structural requirements. In some examples, the machine base comprises a fixing structure or a limiting structure, such as a base, a rod body, a column body, a frame body and the like, for receiving different parts in the silicon rod truncation equipment.

Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

The machine base of the silicon rod cutting equipment is provided with a silicon rod processing platform, a linear cutting device for processing, such as cutting, the silicon rod to be cut can be arranged on the silicon rod processing platform, and the linear cutting device is used for cutting the silicon rod to be cut. The shape of the silicon rod processing platform can be determined according to the base, or can be determined according to the processing requirements of the base and the linear cutting device together.

The material conveying platform is arranged on the base and used for bearing and driving the silicon rod to be cut and conveying the silicon rod to be cut along the first direction. Taking a single crystal silicon rod as an example, the silicon rod is long and cylindrical, and therefore, in the present application, the silicon rod to be cut is cut in a horizontal manner. The silicon rod processing platform of the base of the silicon rod cutting equipment is a narrow and long rectangle in response to the length of a silicon rod to be cut, the material conveying platform is integrally of a strip-shaped structure and is arranged on the silicon rod processing platform of the base, so that the silicon rod to be cut (including the cut silicon rod after cutting operation, hereinafter referred to as the silicon rod cutting section) can be placed on the silicon rod to be cut in a horizontal mode and can drive the borne silicon rod to be cut (or the silicon rod cutting section) to move. The material conveying table is arranged along a first direction, so that when the silicon rod to be cut is placed on the material conveying table in a horizontal mode, the axis of the silicon rod to be cut is approximately parallel to the first direction.

At least two wire cutting devices are independent of each other and arranged at intervals along a first direction. In the application, the at least two linear cutting devices are independent devices and independently operate according to the silicon rod cutting operation requirement, so that the cutting operation can be executed on the silicon rod to be born on the material conveying table by independently controlling each linear cutting device, and the operation freedom degree and the cutting efficiency in the silicon rod cutting operation are improved. For example, in certain embodiments, all of the silicon rod cutting devices are controlled to perform a cutting operation on the silicon rod to be cut. In some embodiments, a controlled number of silicon rod cutting devices perform the cutting operation on the silicon rod to be cut, and the remaining silicon rod cutting devices may remain stationary or otherwise operated.

Each wire cutting device comprises a wire cutting machine base and at least one wire cutting unit arranged on the wire cutting machine base in a lifting mode.

The wire cutting unit comprises a cutting wheel, a transition wheel and a closed-loop cutting wire connected end to end, and the closed-loop cutting wire is wound around the cutting wheel and the transition wheel to form a cutting wire saw for executing cutting operation on the silicon rod to be cut.

The utility model provides a silicon rod cuts equipment, including frame, material transport platform and two at least wire-electrode cutting device, wherein, two at least wire-electrode cutting device mutual independence, so accessible each independent wire-electrode cutting device carries the silicon rod execution of treating that the bench bore to the material and cuts the operation, has improved the silicon rod and has cut the operation degree of freedom in the operation and cut efficiency. And, the closed loop line of cut that the line cutting unit among the wire cutting device adopted, so can keep the line of cut high-speed operation, improve cutting efficiency, simultaneously, the closed loop line of cut can be in same direction of operation of cutting, so, the line cutting unit of this application can realize the high accuracy and cut the operation, has avoided cutting face that line of cut operation switching-over or functioning speed lead to in the current cutting mode to have the ripple scheduling problem, simultaneously, the closed loop line of cut can effectively reduce the required line of cut overall length of line of cut unit and avoid parts such as take-up cylinder and pay off cylinder, reduction in production cost.

Referring to fig. 1, a schematic structural view of a silicon rod truncation apparatus according to an embodiment of the present application is shown.

In the embodiment provided by the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, where the first direction, the second direction, and the third direction are all linear directions and are mutually perpendicular to each other two by two, in the embodiment shown in fig. 1, the X axis of the graphic coordinate axis is the first direction, the Y axis of the graphic coordinate axis is the second direction, and the Z axis of the graphic coordinate axis is the third direction.

In this embodiment, the silicon rod severing device is used to perform a severing operation on a silicon rod to cut a long raw silicon rod into a plurality of short silicon rod sections.

As shown in fig. 1, the silicon rod truncating apparatus in the present embodiment may include at least: a machine base 11, a material conveying table 12, and at least two wire cutting devices, wherein the at least two wire cutting devices comprise a single wire cutting device 15.

The machine base is used as a main body part of the silicon rod cutting equipment and is provided with a silicon rod processing platform, a linear cutting device for processing, such as cutting, the silicon rod to be cut can be arranged on the silicon rod processing platform, and the linear cutting device is used for cutting the silicon rod to be cut. The shape of the silicon rod processing platform can be determined according to the base, or can be determined according to the processing requirements of the base and the linear cutting device together. As shown in fig. 1, the base 1 is rectangular as a whole, and a silicon rod processing platform is disposed at the top thereof.

The material conveying table is arranged on the base and used for bearing the silicon rod to be cut and driving the silicon rod to be cut to be conveyed along a first direction. Taking the single crystal silicon rod as an example, in this embodiment, the silicon rod to be cut is cut in a horizontal manner. As shown in fig. 1, the silicon rod processing platform of the base 11 is a rectangular shape with a narrow length corresponding to the length of the silicon rod to be cut, and the material conveying platform 12 is integrally a strip-shaped structure and is disposed on the silicon rod processing platform of the base 11, so that the silicon rod to be cut is horizontally placed thereon and can drive the supported silicon rod to be cut to move along a first direction. The material conveying table is arranged along a first direction, so that when the silicon rod to be cut is placed on the material conveying table in a horizontal mode, the axis of the silicon rod to be cut is approximately parallel to the first direction.

In certain embodiments, the material delivery table includes a roller assembly and a motor assembly for controlling the roller assembly. As shown in fig. 1, a roller assembly arranged along a first direction and a motor assembly (not shown in the drawings) for controlling the roller assembly are arranged on the material conveying table, and when a silicon rod to be cut is horizontally placed on the roller assembly, the axis of the silicon rod to be cut is substantially parallel to the first direction.

In some embodiments, the roller assembly includes a plurality of roller pairs spaced back and forth along a first direction, wherein each roller pair includes two rollers connected through a rotation shaft, the motor assembly includes a motor, each roller pair corresponds to a motor, a plurality of roller pairs are spaced apart from each other and correspond to a motor, or a motor is shared by a plurality of roller pairs, the motor is used to drive the rollers in the corresponding roller pair to rotate, friction force between the rollers and the silicon rod to be cut placed thereon can be used to drive the silicon rod to be cut to be conveyed along the first direction, and feeding of the silicon rod to be cut and discharging of each cut section of the silicon rod after the silicon rod is cut are completed.

In some embodiments, the roller assembly includes a plurality of roller pairs spaced back and forth along a first direction, wherein the roller assembly is divided into a plurality of roller assembly sections according to the cut silicon rod, each roller assembly section includes a plurality of roller pairs, each roller pair includes two rollers connected by a rotating shaft, the motor assembly includes a plurality of motors, and each roller pair corresponds to one motor or shares one motor with a plurality of roller pairs belonging to one roller assembly section. When the silicon rod to be cut is cut into a plurality of sections of silicon rod sections, each roller pair in each roller assembly section rolls under the driving of the corresponding motor so as to drive the silicon rod sections in the roller assembly sections to be conveyed along a first direction, and therefore the sequential unloading of the plurality of sections of silicon rod sections is realized.

The linear cutting device is used for cutting off the silicon rod to be cut. As shown in fig. 1, the wire cutting device includes a single-wire cutting device 15, the multiple single-wire cutting devices 15 are independent of each other and are arranged at intervals along a first direction, and the silicon rod to be cut can be cut by the multiple single-wire cutting devices 15, so that the silicon rod to be cut is cut by the single-wire cutting devices 15 to form a multi-segment silicon rod cut segment.

In the application, the plurality of single-wire cutting devices 15 are independent devices and independently operate according to the silicon rod cutting operation requirement, so that the single-wire cutting devices 15 can be independently controlled to perform cutting operation on the silicon rod to be born on the material conveying table, and the operation freedom and the cutting efficiency in the silicon rod cutting operation are improved. For example, in some embodiments, all of the single-wire cutting devices 15 are controlled to perform the cutting operation on the silicon rods to be cut. In some embodiments, a controlled number of single-wire cutting devices 15 perform the cutting operation on the silicon rod to be cut, and the remaining single-wire cutting devices 15 may remain inactive or otherwise operate.

Regarding the single-wire cutting device, the single-wire cutting device has at least one single-wire cutting unit, the single-wire cutting unit includes single-wire cutting wheel, transition wheel and end to end's closed loop line of cut, the closed loop line of cut wind form the single-wire cutting coping saw behind single-wire cutting wheel and the transition wheel.

Please refer to fig. 2, which is a schematic structural diagram of a single-line cutting device according to an embodiment of the present disclosure at a first viewing angle. As shown in fig. 1 and 2, the single-wire cutting device 15 includes a wire cutting base 160 and a single-wire cutting unit 16.

As shown in fig. 1 and 2, the wire cutting machine base 160 is disposed on the machine base 11, and the single wire cutting unit 16 is disposed on the wire cutting machine base 160 in a liftable manner by a lifting mechanism. Here, the wire cutting machine base 160 is a carrier on which the single-wire cutting unit 16 is disposed on the base 11, and a concrete form thereof may be a beam, a column, a plate frame, a bracket, or the like.

The single-wire cutting unit 16 is arranged on the wire cutting machine base 160 in a lifting manner through a lifting mechanism. In some implementations, the lifting mechanism may include a lifting rail, a slider, and a lifting driving unit, wherein the lifting rail is disposed on the wire cutting machine base 160 along a third direction, the slider is disposed on the single-wire cutting unit 16 and adapted to the corresponding lifting rail, and the lifting driving unit is configured to move the single-wire cutting unit 16 up and down along the lifting rail. In practical applications, in order to stably lift the single-wire cutting unit 16 on the linear cutting machine base 160, a dual-rail design may be adopted, that is, two lifting rails are adopted and arranged in parallel. In addition, the lifting driving unit may further include a lifting screw connected to the single-wire cutting unit 16 in the third direction, and a lifting motor (the lifting motor may be, for example, a servo motor) connected to the lifting screw. In this way, the lifting motor drives the lifting screw rod to rotate, so that the single-wire cutting unit 16 can move up and down along the lifting guide rail. The lifting driving unit is not limited to this, and other components for driving the single-wire cutting unit 16 to move up and down along the lifting guide rail may be used, for example, the lifting driving unit may include a lifting rack, a driving gear engaged with the lifting rack, and a driving motor for driving the driving gear to rotate.

The single-wire cutting unit includes: the cutting wire saw comprises a cutting support, a closed loop cutting wire, a first single wire cutting wheel, a second single wire cutting wheel and at least one single wire transition wheel, wherein the closed loop cutting wire is wound on the first single wire cutting wheel, the second single wire cutting wheel and the at least one transition wheel to form a single wire cutting wire saw.

As shown in fig. 2, the single-wire cutting unit 16 includes: a cutting carriage 161, a first single-wire cutting wheel 162, a second single-wire cutting wheel 163, and a closed-loop cutting line 164.

The cutting support 161 is a carrier on which the first single-wire cutting wheel 162, the second single-wire cutting wheel 163, and other components are disposed on the wire cutting base 160, and may be a beam, a plate frame, a support, or the like. In addition, the cutting support 161 can be disposed on the wire cutting machine base 160 in a liftable manner through a lifting mechanism, and for the lifting mechanism, reference can be made to the foregoing description, which is not repeated herein. With the lifting mechanism, the cutting support 161 is relatively moved up and down along the third direction by the wire cutting machine base 160, so as to drive the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 and the single-wire cutting wire saw wound on the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 to move up and down, so as to cut the silicon rod to be cut. Furthermore, in some embodiments, the distal end of the cutting frame 161, which is relatively far away from the wire cutting base 160, may be further defined and guided by a guide rod structure to move the cutting frame 161 up and down under the driving of the lifting mechanism.

The first single-wire cutting wheel and the second single-wire cutting wheel are arranged on two opposite sides of the cutting support along the second direction. In the embodiment shown in fig. 2, the first wire cutting wheel 162 and the second wire cutting wheel 163 are oppositely disposed on both sides of the bottom of the cutting support 161 along the second direction, and the closed-loop cutting line 164 is wound around the first wire cutting wheel 162 and the second wire cutting wheel 163 to form a single-wire cutting wire saw disposed along the second direction.

The first single-wire cutting wheel 162 comprises at least one first cutting wire slot, and the plane of any first cutting wire slot is parallel to the wheel surface of the first single-wire cutting wheel, that is, the cutting wire slots on the first single-wire cutting wheel can be referred to as first cutting wire slots.

The second single-wire cutting wheel 163 comprises at least one second cutting wire slot, and the plane where any second cutting wire slot is located is parallel to the wheel surface of the second single-wire cutting wheel, that is, the cutting wire slots on the second single-wire cutting wheel can be referred to as second cutting wire slots.

The wheel surface of the first single-wire cutting wheel 162 is parallel to or coplanar with the wheel surface of the second single-wire cutting wheel 163, so that when the closed-loop cutting line 164 is wound around the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163, the first cutting line groove and the second cutting line groove, which are respectively and correspondingly used for winding the closed-loop cutting line 164, are located in the same plane, and thus, the direction of the single-wire cutting wire saw can be located in the plane where the first cutting line groove and the second cutting line groove, which are used for winding the closed-loop cutting line 164, are located at the same time. It should be appreciated that the closed loop cutting wire 164 is in operation during the cutting action and thus the single wire cut wire saw is defined by the spatial location of the closed loop cutting wire 164, which in the present embodiment is a single wire cut wire saw wound between the first single wire cutting wheel 162 and the second single wire cutting wheel 163.

It will be appreciated that when the closed loop cutting line 164 is wound around either of the single-wire cutting wheels (either the first single-wire cutting wheel 162 or the second single-wire cutting wheel 163), it is desirable to have both of the closed loop cutting lines 164 on either side of the single-wire cutting wheel lying in the plane of the cutting line slot in the single-wire cutting wheel for winding the closed loop cutting line 164.

The cutting support 161 has a recess at the bottom thereof so that the cutting support 161, the first single-wire cutting wheel 162, the second single-wire cutting wheel 163, and the single-wire cutting wire saw formed around the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 form a cutting accommodating space corresponding to the silicon rod to be cut.

The single-wire cutting unit further comprises at least one single-wire transition wheel, and the at least one single-wire transition wheel is used for drawing a closed loop cutting wire wound on the first single-wire cutting wheel and the second single-wire cutting wheel.

In some embodiments, the single-wire cutting unit includes a single-wire transition wheel. In the embodiment shown in fig. 2, the single-wire cutting unit 16 further comprises a first single-wire transition wheel 165, the first single-wire transition wheel 165 being disposed on the cutting support 161.

The first single-line transition wheel 165 is used to divert or guide the closed-loop cutting line 164. In the embodiment shown in fig. 2, the one first single-wire transition wheel 165 is disposed on top of the cutting support 161, and the first single-wire transition wheel 165 may form a triangle with the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163. The shape of the triangle formed by the first single-wire transition wheel 165 and the first and second single-

wire cutting wheels

162 and 163 is not limited. For example, in one embodiment, the first single-line transition wheel 165 is disposed at the top central region of the cutting support 161, and the first single-line transition wheel 165 may form an isosceles triangle or an equilateral triangle with the first single-line cutting wheel 162 and the second single-line cutting wheel 163. In one embodiment, the first single-wire transition wheel 165 is disposed on top of the cutting support 161 and is flush with the first single-wire cutting wheel 162 or the second single-wire cutting wheel 163 in a third direction, and the first single-wire transition wheel 165 may form a right triangle with the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163. In one embodiment, the first single line transition wheel 165 is disposed on top of the cutting support 161, and the first single line transition wheel 165 may form a generally triangular shape with the first single line cutting wheel 162 and the second single line cutting wheel 163.

The first single-line transition wheel 165 includes at least one transition line slot, and a plane where any transition line slot is located is parallel to the first single-line transition wheel surface.

The wheel surface of the first single-wire transition wheel 165 is parallel to or coplanar with the wheel surface of the first single-wire cutting wheel 162 and the wheel surface of the second single-wire cutting wheel 163, so that the closed-loop cutting line 164 is correspondingly wound on the first cutting line slot, the second cutting line slot and the transition line slot of the closed-loop cutting line 164 when being wound on the first single-wire transition wheel 165, the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163, and the first cutting line slot, the second cutting line slot and the transition line slot are located on the same plane, so that the single-wire cutting wire saw can be simultaneously located on the plane where the first cutting line slot, the second cutting line slot and the transition line slot for winding the closed-loop cutting line 164 are located.

In this way, in this embodiment, the first single-wire cutting wheel 162, the second single-wire cutting wheel 163 and the first single-wire transition wheel 165 of the single-wire cutting unit are wound by the closed-loop cutting line 164, in this example, the single-wire cutting device can omit components such as a take-up drum and a pay-off drum, and the closed-loop cutting line can be driven to operate at a high speed to cut.

In the existing silicon rod cutting equipment, a cutting line is wound between a cutting wheel and a transition wheel in a line cutting unit from a pay-off drum and wound to a take-up drum from the line cutting unit, the cutting line is driven to run in the cutting operation, and the running process of the cutting line is an acceleration process and a deceleration process which are alternately carried out. In the silicon rod truncation equipment, the closed-loop cutting line in the line cutting unit can be kept to continuously run at a high speed, and meanwhile, the closed-loop cutting line can run in the same running direction in the cutting process. Therefore, the linear cutting unit can realize high-precision cutting operation, and the problems that the cutting surface is corrugated and the like due to the operation reversing or the operation speed of the cutting line in the conventional cutting mode are solved; meanwhile, the closed loop cutting line can effectively reduce the total length of the cutting line required by the line cutting unit, avoid parts such as a take-up cylinder, a pay-off cylinder and the like, and reduce the production cost.

In the single-wire cutting unit of the present application, a cutting wire driving mechanism is further included for driving the closed-loop cutting wire 164 wound around the first single-wire cutting wheel 162, the second single-wire cutting wheel 163, and the first single-wire transition wheel 165 to run at a high speed.

In some embodiments, at least one of the first single-wire cutting wheel 162, the second single-wire cutting wheel 163, and the first single-wire transition wheel 165 is used as a driving wheel, and the other is used as a driven wheel, wherein the driving wheel is associated with the cutting wire driving mechanism, the driving wheel is driven by the cutting wire driving mechanism to rotate and drive the closed loop cutting wire 164 to run at a high speed in cooperation with the other driven wheels.

In some implementations, the first single-wire cutting wheel 162 or the second single-wire cutting wheel 163 may be used as the drive wheel. Taking the first single wire cutting wheel 162 as an example of a drive wheel, the first single wire cutting wheel 162 is associated with a cutting wire drive mechanism operable to drive the first single wire cutting wheel 162 in rotation. In some examples, the cutting wire driving mechanism includes a driving motor, a motor shaft of the driving motor is directly connected to a wheel shaft of the first single-wire cutting wheel 162, and when the driving motor rotates, the first single-wire cutting wheel 162 is driven to rotate by the motor shaft of the driving motor, the closed loop cutting wire 164 is carried to run, and the second single-wire cutting wheel 163 and the first single-wire transition wheel 165 are rotated, so that the closed loop cutting wire 164 runs at a high speed. In some examples, the cutting line driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on a motor shaft of the driving motor and a wheel shaft of the first single-wire cutting wheel, under the rotation of the driving motor, the transmission belt is driven by the motor shaft of the driving motor to operate and then drives the first single-wire cutting wheel 162 to rotate, the closed loop cutting line 164 is driven to operate and enables the second single-wire cutting wheel 163 and the first single-wire transition wheel 165 to rotate, and the high-speed operation of the closed loop cutting line 164 is realized.

In some implementations, the first single-wire transition wheel 165 may be used as a drive wheel. The first single-wire transition 165 is associated with a cutting wire drive mechanism that may be used to drive the first single-wire transition 165 in rotation. In some examples, the cutting wire driving mechanism includes a driving motor having a motor shaft directly connected to a wheel shaft of the first single-wire transition wheel 165, and the first single-wire transition wheel 165 is rotated by the motor shaft of the driving motor under rotation of the driving motor, and the closed-loop cutting wire 164 is carried to run and rotate the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163, so that the closed-loop cutting wire 164 runs at a high speed. In some examples, the cutting line driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on a motor shaft of the driving motor and a wheel shaft of the first single-wire transition wheel, when the driving motor rotates, the transmission belt is driven by the motor shaft of the driving motor to operate and then drives the first single-wire transition wheel 165 to rotate, the closed-loop cutting line 164 is driven to operate and enables the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 to rotate, and high-speed operation of the closed-loop cutting line 164 is achieved.

In addition, the single-wire transition wheel may also be used to adjust the tension of the closed loop cutting wire. Accordingly, the single-wire cutting unit further includes a single-wire tension adjustment mechanism associated with the at least one single-wire transition wheel.

Please refer to fig. 3, which is a schematic structural diagram of a single line cutting device according to an embodiment of the present disclosure at a second viewing angle. With reference to fig. 2 and 3, the single-wire cutting unit 16 includes a single-wire tension adjustment mechanism associated with the first single-wire transition wheel 165.

The single wire tension adjusting mechanism includes: the single-wire driving unit 171 and the single-wire connecting rod assembly are associated with the first single-wire transition wheel 165 and the single-wire driving unit 171, and the single-wire connecting rod assembly is controlled by the single-wire driving unit, that is, the single-wire driving unit 171 drives the single-wire connecting rod assembly to actuate so as to drive the first single-wire transition wheel 165 to generate position change to adjust the tension of the closed-loop cutting wire 164.

In the embodiment shown in fig. 2 and 3, the single-wire link assembly includes: a pivot 172, a first link 174, and a second link 176.

The pivot 172 is provided on the cutting support 161.

A first end of the first link 174 is associated with the pivot 172 and a second end of the first link 174 is connected to the first single-line transition wheel 165.

A first end of the second link 176 is associated with the pivot 172 and a second end of the second link 176 is connected to the single wire drive unit.

Through the single-wire link assembly, a lever effect may be achieved, adjusting the position of the first single-wire transition wheel 165.

With respect to the single wire drive unit, in certain implementations, the single wire drive unit 171 includes a weight (in the following description, the weight is labeled 171), and the weight 171 may be suspended from the second end of the second link 176. For example, when the tension of the closed loop cutting line 164 is to be increased, the weight portion 171 is released, the weight portion 171 descends, the second end of the second link 176 rotates the pivot 172 in a forward direction (clockwise in fig. 3) under the action of the gravity of the weight portion 171, the pivot 172 rotating in the forward direction drives the first link 174 and the associated first single-wire transition wheel 165 to move in a direction away from the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 (e.g., upward), the circumference of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is enlarged, and the tension of the closed loop cutting line 164 is increased. When the tension of the closed loop of cutting wire 164 is to be reduced, the counterweight 171 is lifted, the second end of the second link 176 is controlled to lift and drive the pivot 172 to rotate in a reverse direction (e.g., counterclockwise in fig. 3), the reverse rotation of the pivot 172 drives the first link 174 and the associated first single-wire transition wheel 165 to move in a direction (e.g., downward) close to the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163, the perimeter of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is reduced, and the tension of the closed loop of cutting wire 164 is reduced.

The counterweight part may include a counterweight frame and counterweights disposed in the configuration frame, wherein the number of the counterweights may be changed according to the requirement of the tension adjustment of the closed-loop cutting line 164, for example, when the tension of the closed-loop cutting line 164 is increased, the number of the counterweights may be increased, and when the tension of the closed-loop cutting line 164 is decreased, the number of the counterweights may be decreased.

The placement frame is movable up and down relative to the cutting frame 161 by means of an elevation guide.

In some embodiments, the weight may include a locking mechanism for locking the weight such that the weight is stationary relative to the cutting support 161 to allow the weight to be switched from an active state to a locked state with the cutting support 161. In some examples, the locking mechanism may be a latch, for example.

In some embodiments, the single wire tension adjustment mechanism may further include a single wire tension balancing member for ensuring that the tensions of the weight 171 and the closed loop cutting wire 164 are in a balanced state. In the embodiment shown in fig. 3, the single-wire tension adjusting mechanism further includes a single-wire tension balancing unit 173, the single-wire tension balancing unit 173 is a tension balancing cylinder (in the following description, the tension balancing cylinder is denoted by reference numeral 173), and the tension balancing cylinder 173 acts on the second link 176.

For example, when the tension of the closed loop cutting line 164 is to be increased, the weight 171 is released, the weight 171 descends, the second end of the second link 176 is driven by the weight of the weight 171 to rotate the pivot 172 in a forward direction (clockwise in fig. 3), the pivot 172 in the forward direction drives the first link 174 and the associated first single-wire transition wheel 165 to move in a direction away from the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 (e.g., upward), the circumference of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is enlarged, the tension of the closed loop cutting line 164 is increased, and when the tension of the closed loop cutting line 164 is adjusted to a desired value, the cylinder 173 extends out of the shaft and makes the cylinder shaft contact the second link 176, such that the weight 171 and the second linkage 176 no longer move, i.e., remain stationary relative to the cutting support 161. When the tension of the closed loop cutting line 164 is to be reduced, the second link 176 is lifted up by the cylinder shaft of the tension balancing cylinder 173, the weight 171 and the second link 176 are lifted up, and the pivot 172 is driven to rotate in a reverse direction (counterclockwise in fig. 3), the pivot 172 which rotates in the reverse direction drives the first link 174 and the associated first single-wire transition wheel 165 to move in a direction close to the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 (e.g., downward), the circumference of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is reduced, the tension of the closed loop cutting line 164 is reduced, until the tension of the closed loop cutting line 164 is adjusted to a desired value, the tension balancing cylinder 173 stops the cylinder shaft at the current position, so that the weight 171 and the second link 176 do not move any more, i.e., remain stationary relative to the cutting support 161.

Still other variations of the single wire drive unit are possible, for example, in some implementations, the single wire drive unit may include a pull cylinder positioned below the second link and having a cylinder shaft connected to the second end of the second link. For example, when the tension of the closed loop cutting line 164 is to be increased, the cylinder shaft is contracted by the pulling cylinder, the second link 176 is pulled and the pivot 172 is driven to rotate in a forward direction (clockwise in fig. 3), the forward rotation pivot 172 drives the first link 174 and the associated first single-wire transition wheel 165 to move in a direction away from the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 (e.g., upward), the circumference of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is enlarged, and the tension of the closed loop cutting line 164 is increased. When the tension of the closed loop cutting line 164 is to be reduced, the pulling cylinder extends out of the cylinder shaft, the second end of the second link 176 is controlled to lift and drive the pivot 172 to rotate in a reverse direction (e.g., counterclockwise in fig. 3), the pivot 172 rotating in the reverse direction drives the first link 174 and the associated first single-wire transition wheel 165 to move in a direction close to the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 (e.g., downward), the circumference of the triangle formed by the first single-wire transition wheel 165 and the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 is reduced, and the tension of the closed loop cutting line 164 is reduced.

The silicon rod truncation equipment further comprises a position adjusting device, and the position adjusting device is used for adjusting the position of the at least one linear cutting device. By utilizing the position adjusting device, the position of at least one linear cutting device arranged on the silicon rod cutting equipment can be adjusted, so that the silicon rod sections with corresponding lengths can be cut according to the cutting requirements.

In the embodiment shown in fig. 1, the position adjusting means may include: a moving guide, a slider, and a moving drive unit.

The movable guide rail can be arranged on the machine base along a first direction, and the sliding block is arranged on the at least one linear cutting device. In some embodiments, for the wire cutting device, taking the single-wire cutting device 15 as an example, the single-wire cutting device includes a wire cutting base 160 and a single-wire cutting unit 16, and therefore, a moving guide rail is provided at a position of the base 11 corresponding to the wire cutting base 160, and a sliding block is provided at the bottom of the wire cutting base 160, wherein the number of the moving guide rails is not limited, and may be one, or may be two or more in parallel.

The mobile driving unit is used for driving the at least one wire cutting device to move along the mobile guide rail. In some embodiments, the movement driving unit may include: the movable screw rod is arranged along a first direction and is associated with a wire cutting machine base in the at least one wire cutting device, and the driving source is used for driving the movable screw rod to rotate so as to enable the associated at least one wire cutting device to move along the transfer guide rail.

In some embodiments, the movement driving unit may include: the wire cutting machine comprises a movable rack, a driving gear and a driving source, wherein the movable rack is arranged along a first direction, the driving gear is associated with a wire cutting machine base in the at least one wire cutting device and is meshed with the movable rack, and the driving source is used for driving the driving gear to rotate so as to enable the associated at least one wire cutting device to move along the transfer guide rail.

The silicon rod cutting equipment further comprises a horizontal detection device (not shown in the figure), and the horizontal detection device is used for detecting the axis levelness of the silicon rod to be cut, which is placed on the material conveying table.

In some embodiments, the level detection device comprises a first contact-type measuring instrument and a second contact-type measuring instrument, wherein the first contact-type measuring instrument is used for measuring the level data of the silicon rod to be cut at the measuring position corresponding to the first contact-type measuring instrument, and the second contact-type measuring instrument is used for measuring the level data of the silicon rod to be cut at the measuring position corresponding to the second contact-type measuring instrument.

The silicon rod of this application cuts equipment still includes levelling device (not shown in the figure), is used for the basis level detection device's testing result is to placing the material is carried the bench and is waited to cut the axial lead of silicon rod and carry out the leveling, promptly, levelling device detects at level detection device wait to cut the silicon rod axial lead and be in when non-horizontality, utilize and rotate actuating mechanism drive material and carry the platform rotation with the axle center levelness of adjustment work piece.

In one embodiment of the present application, a leveling device includes: the device comprises a rotating fulcrum structure, a rotating driving mechanism and an offset limiting mechanism. The rotating fulcrum structure can be positioned below the material conveying platform and used as a rotating fulcrum for the material conveying platform to rotate. The rotation driving mechanism is positioned below the material conveying table and used for driving the material conveying table to rotate around the rotation fulcrum structure so as to adjust the axis levelness of the silicon rod to be cut. The offset limiting mechanism is arranged adjacent to the rotation driving mechanism and used for limiting the horizontal offset of the material conveying platform when the material conveying platform rotates (moves up and down) around the rotation fulcrum structure.

In one embodiment of the leveling device of the silicon rod truncation equipment, the first contact type measuring instrument corresponds to the rotating fulcrum structure and is used for measuring first height data (which can be absolute height or relative height relative to the material conveying table) of the top point of the silicon rod to be cut at the rotating fulcrum structure. The second contact measuring instrument corresponds to the rotary driving mechanism and is used for measuring second height data (which can be absolute height or relative height relative to the material conveying platform) of the top point of the silicon rod to be cut at the rotary driving mechanism. Subsequently, the adjustment amount of the material conveying table at the position of the rotation driving mechanism can be calculated by integrating the first height data measured by the first contact type measuring instrument and the second height data measured by the first contact type measuring instrument, and the rotation driving mechanism is used for driving the material conveying table to rotate around the rotation fulcrum structure according to the adjustment amount, so that horizontal centering is completed, and the axis of the silicon rod to be cut is adjusted to be in a horizontal state.

In another embodiment of the present application, a leveling device (not shown) of the silicon rod cutting apparatus of the present application may be further configured as a horizontal aligning mechanism for adjusting the levelness of the silicon rod to be cut by adjusting the cushion block. The leveling device is arranged on the material conveying table of the working area and used for adjusting the axial lead of the silicon rod to be cut into a horizontal state. Horizontal aligning mechanism includes: two adjusting cushion blocks, a horizontal detection unit and a driving motor.

The two adjusting cushion blocks are respectively arranged at the head end and the tail end of the material conveying table in the corresponding working area and used for bearing the silicon rod to be cut.

The horizontal detection unit is used for detecting the levelness of the silicon rod to be cut supported by the two adjusting cushion blocks.

The driving motor is associated with at least one of the two adjusting cushion blocks and is used for controlling the associated at least one adjusting cushion block to perform lifting motion so as to ensure that the axis line of the silicon rod to be cut is adjusted to be in a horizontal state.

Therefore, the horizontal aligning mechanism of the workpiece can adjust the axis levelness of the workpiece to be cut borne by the material conveying platform to be in a horizontal state, and the single-section workpiece section meeting the specification of the workpiece is obtained by cutting. In addition, due to the adoption of the workpiece horizontal aligning mechanism, the shaft axis of the workpiece to be cut is ensured to be in a horizontal state, the cutting section of each section of the cut workpiece is vertical to the shaft axis, the processing requirement of the workpiece is met, and the cutting quality and the yield of the workpiece are improved.

The silicon rod of this application cuts equipment still include with the silicon rod stabilising arrangement that wire-electrode cutting device corresponds for avoid waiting to cut the silicon rod by wire-electrode cutting device produces surface damage, surface waviness, collapses limit etc. when cutting. In the embodiment shown in fig. 1, the silicon rod cutting apparatus further includes silicon rod stabilizing devices corresponding to the single-wire cutting devices, and the silicon rod stabilizing devices are used for preventing the silicon rod to be cut from surface damage, surface waviness, edge breakage and the like when the silicon rod to be cut is cut by the single-wire cutting devices.

As shown in fig. 2, the single-wire cutting unit of the single-wire cutting device includes a first single-wire cutting wheel 162, a second single-wire cutting wheel 163, and a closed-loop cutting line 164, wherein the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 are disposed opposite to each other in a second direction, and the closed-loop cutting line 164 is wound around the first single-wire cutting wheel 162 and the second single-wire cutting wheel 163 to form a single-wire cutting wire saw, through which a silicon rod to be cut is cut to perform a silicon rod cutting operation. Wherein, when treating that the cutting silicon rod is cuted the moment (promptly, the single wire cutting coping saw will follow and treat when cutting the inside line of silicon rod), the silicon rod cutting face leads to "ripple face", "collapse limit" phenomenon because of producing slight displacement, seriously influences and cuts the quality.

In view of this, in the present application, the silicon rod truncating apparatus of the present application further comprises a silicon rod stabilizing device corresponding to the wire cutting device. In the embodiment shown in fig. 2 and 3, the silicon rod truncating apparatus of the present application includes silicon rod stabilizing devices corresponding to the respective single-wire cutting devices, the respective silicon rod stabilizing devices being disposed at intervals in the first direction.

In some embodiments, as shown in fig. 2 and 3, the silicon rod stabilizing device further comprises a first stabilizing component 181 and a second stabilizing component 182 which are arranged at intervals along the first direction, and an indwelling space for receiving a cutting wire saw in the wire cutting device is arranged between the first stabilizing component 181 and the second stabilizing component 182. Wherein either of the first and second stabilizing

assemblies

181, 182 includes first and second side stabilizing members disposed along the second direction. When waiting to cut the silicon rod and putting in the material conveying platform, first side stabilizing mean and second side stabilizing mean among first stabilizing mean 181 and the second stabilizing mean 182 can be used for respectively contradicting in wait to cut the relative both sides of silicon rod in order to wait to cut the silicon rod and carry on spacingly, ensure to wait to cut the stability of silicon rod in the silicon rod cuts the operation.

In some embodiments, the first side stabilizing member or the second side stabilizing member further comprises: the silicon rod cutting device comprises a workpiece supporting block and a workpiece auxiliary supporting block, wherein the workpiece auxiliary supporting block is designed to be movable, namely, the workpiece auxiliary supporting block can move relative to the workpiece supporting block so as to be matched with a silicon rod to be cut to be stable.

As shown in fig. 2 and 3, the first side stabilizing member or the second side stabilizing member includes: the workpiece supporting block and the workpiece auxiliary supporting block. The workpiece support block and the workpiece auxiliary support block belonging to the first stabilizing assembly 181 may be respectively designated as 183 and 185, and the workpiece support block and the workpiece auxiliary support block belonging to the second stabilizing assembly 182 may be respectively designated as 184 and 186.

The first and second stabilizing assemblies are associated with the wire cutting device. In the embodiment shown in fig. 1, a first stabilizing assembly 181 and a second stabilizing assembly 182 are associated with the single-wire cutting device 15.

The workpiece supporting block is fixed on a mounting structure. As shown in fig. 2 and 3, the silicon rod stabilizing device may include a first mounting structure 167 and a second mounting structure 168 oppositely disposed along a second direction, wherein the first mounting structure 167 is connected to the base 160 of the wire cutting machine, the second mounting structure 168 is associated with the cutting support 161 of the single-wire cutting unit, the first side stabilizing member of the first stabilizing assembly 181 and the first side stabilizing member of the second stabilizing assembly 182 are disposed on the first mounting structure 167, and the second side stabilizing member of the first stabilizing assembly 181 and the second side stabilizing member of the second stabilizing assembly 182 are disposed on the second mounting structure 168. Thus, the workpiece support blocks 183(184) in the first side stabilizing member are fixed to the first mounting structure 167, and the workpiece support blocks 183(184) in the second side stabilizing member are fixed to the second mounting structure 168.

In this embodiment, the first mounting structure 167 is connected to the wire cutting machine base 160, and the second mounting structure 168 is connected to the cutting holder 161 in the single wire cutting unit, so that the silicon rod stabilizing device is paired with the wire cutting device, i.e., the first stabilizing assembly 181 and the second stabilizing assembly 182 in the silicon rod stabilizing device are synchronized with the wire cutting device. In certain embodiments, the silicon rod stabilizing device moves synchronously with the wire cutting device when the wire cutting device is repositioned by the position adjusting device (e.g., the wire cutting device moves in the first direction).

The front end of the workpiece supporting block, which is used for abutting against the silicon rod to be cut, is provided with a first abutting part. As shown in fig. 2 and 3, the front end of the workpiece supporting block 183(184) is provided with a first interference portion, which may be, for example, a slope or an arc portion adapted to the silicon rod to be cut, and the arc portion is not limited, and may be, for example, a concave arc portion, a convex arc portion, or the like.

The workpiece auxiliary supporting block is matched with the workpiece supporting block. As shown in fig. 2 and 3, the workpiece auxiliary supporting block 185(186) is located below the workpiece supporting block 183(184), and the workpiece auxiliary supporting block 185(186) is moved in the second direction by the supporting block driving unit 187(188) to extend and retract relative to the workpiece supporting block 183 (184).

In some embodiments, the support block drive unit 187(188) may be, for example, a cylinder having a cylinder shaft connected to the work-piece auxiliary support block 185 (186).

When the workpiece auxiliary supporting block 185(186) needs to be driven to extend, the air cylinder is driven to extend from the cylinder shaft of the air cylinder and push the workpiece auxiliary supporting block 185(186) to extend relative to the workpiece supporting block. Fig. 4 shows the extended state of the workpiece auxiliary supporting block 185(186) after being driven, and as shown in fig. 4, the workpiece auxiliary supporting block 185(186) is driven to extend and abut against the bottom of the silicon rod 100 to be cut. When the workpiece auxiliary supporting block 185(186) needs to be driven to contract, the air cylinder is driven, the cylinder shaft of the air cylinder contracts and pulls the workpiece auxiliary supporting block 185(186) to contract relative to the workpiece supporting block. Fig. 5 shows a contracted state diagram of the workpiece auxiliary supporting block 185(186) after being driven, and the workpiece auxiliary supporting block 185(186) is contracted after being driven, as shown in fig. 5.

The front end of the auxiliary supporting block for the workpiece, which is used for abutting against the silicon rod to be cut, is provided with a first abutting part. As shown in fig. 4, the front end of the auxiliary workpiece supporting block 185(186) is provided with a second interference portion, which may be, for example, a slope or an arc portion adapted to the silicon rod to be cut, and the arc portion is not limited, and may be, for example, a concave arc portion, a convex arc portion, or the like.

As shown in fig. 4, with respect to the workpiece support blocks 183(184) and the workpiece auxiliary support blocks 185(186), the workpiece support blocks 183(184) and the workpiece auxiliary support blocks 185(186) belonging to one stabilizing member, the workpiece auxiliary support blocks 185(186) are arranged lower than the workpiece support blocks 183(184), and when the workpiece auxiliary support blocks 185(186) are extended under control, the holding distance between the workpiece auxiliary support blocks 185(186) of the first side stabilizing member and the workpiece auxiliary support blocks 185(186) of the second side stabilizing member, which are oppositely arranged, is smaller than the holding distance between the workpiece support blocks 183(184) of the first side stabilizing member and the workpiece support blocks 183(184) of the second side stabilizing member.

In this way, for each single-wire cutting device, four stabilizing members in the silicon rod stabilizing device corresponding to the single-wire cutting device are arranged at four positions, namely, front, rear, left and right positions. When the silicon rod to be cut is placed on the material conveying table in a horizontal manner, generally, the workpiece supporting blocks in the four stabilizing members can abut against the silicon rod to be cut. However, under some circumstances, because factors such as silicon rod size or silicon rod regularity, there is one or some in four work piece supporting shoe and fails to contradict in waiting to cut the silicon rod, perhaps, four work piece supporting shoes all contradict in waiting to cut the silicon rod but still fail spacing stability etc. at this moment, can further stretch out and contradict in waiting to cut the silicon rod in the lower position through driving four work piece auxiliary supporting shoe, cooperate with original four work piece supporting shoes, reliably prescribe a limit to the position of waiting to cut the silicon rod.

When the silicon rod cutting equipment shown in fig. 1 is used for cutting a silicon rod to be cut, the silicon rod to be cut is firstly placed on a material conveying table in a horizontal mode, and the axis of the silicon rod to be cut is parallel to a first direction; the material conveying table is used for driving the silicon rod to be cut to be conveyed to a cutting position along a first direction; driving a silicon rod stabilizing device to stabilize the silicon rod to be cut, for example, driving a workpiece auxiliary supporting block in the silicon rod stabilizing device in fig. 1 to extend out, so that the workpiece supporting block and the workpiece auxiliary supporting block in the silicon rod stabilizing device are in fit contact with the silicon rod to be cut to limit; the single-wire cutting units in the single-wire cutting devices (which can be partial single-wire cutting devices or all single-wire cutting devices) are independently driven to descend, and are contacted by the single-wire cutting wire saws in the single-wire cutting devices and enter the silicon rod to be cut so as to cut the silicon rod to be cut, and the single-wire cutting devices are continuously descended until the single-wire cutting wire saws penetrate out of the silicon rod to be cut so as to be cut to form silicon rod sections.

By last, silicon rod stabilising arrangement includes first stabilizing mean with the second stabilizing mean, wherein, first stabilizing mean with the confession is accomodate to having between the second stabilizing mean the space of reserving of cutting coping saw in the wire-electrode cutting device utilizes first stabilizing mean with the silicon rod of treating cutting can be stably waited to cut by the second stabilizing mean, can make the silicon rod remain stable when the cutting, avoids the silicon rod to produce surface damage, surface waviness, collapse limit scheduling problem when being cut by the wire-electrode cutting device, improves silicon rod cutting quality and production efficiency.

Furthermore, in the operation of cutting the silicon rod to be cut, the head and tail impurity layers of the silicon rod to be cut, which do not meet the production requirements in the processing technology, need to be cut first, and then the silicon rod to be cut is sliced and sampled to check the material characteristics of the silicon rod to be cut. Therefore, the silicon rod cutting equipment further comprises at least one multi-line cutting device, and silicon rod slices, namely required silicon wafer sample wafers, can be obtained by cutting the silicon rod to be cut.

In certain embodiments, a multi-wire cutting device is provided at the front end of the silicon rod cutting apparatus for cutting the head of the silicon rod to be cut so as to cut the silicon rod slice from which the head of the silicon rod to be cut is obtained. In some embodiments, a multi-wire cutting device is arranged at the rear end of the silicon rod cutting device and used for cutting the tail part of the silicon rod to be cut so as to cut the silicon rod slice with the tail part of the silicon rod to be cut. In some embodiments, the multi-wire cutting device is disposed at both the front end and the rear end of the silicon rod cutting apparatus, and is used for cutting the head and the tail of the silicon rod to be cut so as to obtain the silicon rod slices at the head of the silicon rod to be cut and the silicon rod slices at the tail of the silicon rod to be cut.

The silicon rod cuts equipment still includes an at least multi-wire cutting device, multi-wire cutting device has multi-wire cutting unit, multi-wire cutting unit includes multi-wire cutting wheel, multi-wire transition wheel and end to end's closed loop cutting line, the closed loop cutting line around form the multi-wire cutting coping saw behind multi-wire cutting wheel and the multi-wire transition wheel.

Fig. 6 is a schematic structural view of a silicon rod truncation apparatus according to another embodiment of the present disclosure. As shown in fig. 6, the silicon rod-cutting apparatus in the present embodiment includes at least: the cutting machine comprises a machine base 11, a material conveying table 12 and at least two wire cutting devices, wherein the at least two wire cutting devices comprise a single wire cutting device 15 and a multi-wire cutting device 13.

The machine base is used as a main body part of the silicon rod cutting equipment and is provided with a silicon rod processing platform, a linear cutting device for processing, such as cutting, the silicon rod to be cut can be arranged on the silicon rod processing platform, and the linear cutting device is used for cutting the silicon rod to be cut.

The material conveying table is arranged on the base and used for bearing a silicon rod to be cut and driving the silicon rod to be cut to be conveyed along a first direction. Taking a single crystal silicon rod as an example, in the present embodiment, the silicon rod is cut in a horizontal manner. As shown in fig. 6, the silicon rod processing platform of the machine base 11 is a narrow and long rectangle corresponding to the length of the silicon rod to be cut, and the material conveying platform 12 is integrally of a strip structure and is disposed on the silicon rod processing platform of the machine base 11, so that the silicon rod to be cut is horizontally placed thereon and can drive the borne silicon rod to be cut to move along a first direction. The material conveying table is arranged along a first direction, so that when the silicon rod to be cut is placed on the material conveying table in a horizontal mode, the axis of the silicon rod to be cut is approximately parallel to the first direction.

In certain embodiments, the material delivery table includes a roller assembly and a motor assembly for controlling the roller assembly. Wherein, the roller subassembly includes: the roller pairs are arranged at intervals along the first direction, and each roller pair comprises two rollers connected through a rotating shaft. The roller assembly is divided into a plurality of roller assembly sections according to the number of silicon rod sections to be cut.

The linear cutting device is used for cutting off the silicon rod. As shown in fig. 6, the silicon rod-chopping apparatus includes a plurality of single-wire cutting devices 15 and one multi-wire cutting device 13. The plurality of single-wire cutting devices 15 are mutually independent and arranged at intervals along the first direction, and the silicon rod to be cut can be cut by the plurality of single-wire cutting devices 15, so that the silicon rod to be cut can be cut by the single-wire cutting devices 15 to form a multi-section silicon rod cutting section. The multi-wire cutting device 13 is arranged at the front end of the silicon rod cutting equipment and used for cutting the head of the silicon rod to be cut so as to obtain a silicon rod slice at the head of the silicon rod.

The at least two wire cutting devices may be a combination of single wire cutting devices and multi-wire cutting devices.

In the application, the at least two wire cutting devices are a combination of a single-wire cutting device and a multi-wire cutting device, are independent devices and independently operate according to the silicon rod cutting operation requirement, so that the cutting operation of the silicon rod to be carried on the material conveying table can be performed by independently controlling each wire cutting device (comprising the single-wire cutting device 15 and the multi-wire cutting device 13), and the operation freedom degree and the cutting efficiency in the silicon rod cutting operation are improved. For example, in some embodiments, all the wire cutting devices (including the single-wire cutting device 15 and the multi-wire cutting device 13) are controlled to perform the cutting operation on the silicon rod to be cut. In some embodiments, a partial number of wire cutting devices (e.g., a portion of the single-wire cutting device 15, the multi-wire cutting device 15, or a portion of the single-wire cutting device 15 and the multi-wire cutting device 15) perform the chopping operation on the silicon rod to be cut, and the remaining wire cutting devices may remain stationary or otherwise operate.

The number and arrangement of the single-wire cutting devices 15 and the multi-wire cutting devices 13 in the silicon rod cutting equipment can be changed. For example, in some embodiments, the silicon rod chopping apparatus may comprise a plurality of single-wire cutting devices 15 and one multi-wire cutting device 13, wherein the multi-wire cutting device 13 may be disposed at a rear end of the silicon rod chopping apparatus, and is used for cutting a tail portion of a silicon rod to be cut to chop a silicon rod slice from which the tail portion of the silicon rod is obtained. In some embodiments, the silicon rod cutting apparatus comprises a plurality of single-wire cutting devices 15 and two multi-wire cutting devices 13, wherein the two multi-wire cutting devices 13 may be respectively disposed at the front end and the rear end of the silicon rod cutting apparatus, and are configured to respectively cut the head of the silicon rod to be cut to obtain silicon rod slices at the head of the silicon rod and cut the tail of the silicon rod to be cut to obtain silicon rod slices at the tail of the silicon rod.

For the single-wire cutting device, reference may be made to the related description in fig. 1, and the description thereof is omitted here.

Regarding the multi-wire cutting device, the multi-wire cutting device is provided with at least one multi-wire cutting unit, the multi-wire cutting unit comprises a multi-wire cutting wheel, a multi-wire transition wheel and a closed loop cutting wire which is connected end to end, and the closed loop cutting wire is wound around the multi-wire cutting wheel and the multi-wire transition wheel to form at least two multi-wire cutting wire saws.

Please refer to fig. 7, which is a schematic structural diagram of a multi-wire sawing device according to another embodiment of the present application at a first viewing angle. As shown in fig. 7, the multiple wire cutting device 13 comprises a wire cutting base 140 and a multiple wire cutting unit 14.

In the embodiment shown in fig. 7, the wire cutting machine base 140 is disposed on the machine base, and the multi-wire cutting unit 14 is disposed on the wire cutting machine base 140 in a lifting manner by a lifting mechanism. Here, the wire saw base 140 is a carrier on which the multi-wire saw unit 14 is disposed on the base 11, and may be a beam, a column, a plate frame, a bracket, or the like.

The multi-wire cutting unit 14 is arranged on the wire cutting machine base 140 in a lifting manner through a lifting mechanism. In some implementations, the lifting mechanism may include a lifting rail disposed on the base 140 of the wire cutting machine along a third direction, a slider disposed on the multi-wire cutting unit 14 and adapted to the corresponding lifting rail, and a lifting driving unit for lifting and lowering the multi-wire cutting unit 14 along the lifting rail. In practical applications, in order to realize stable lifting of the multi-wire cutting unit 14 on the wire cutting machine base 140, a dual-guide design may be adopted, that is, two lifting guide rails are adopted and arranged in parallel. In addition, the elevation driving unit may further include an elevation screw connected to the multi-wire cutting unit 14 in the third direction, and an elevation motor (the elevation motor may be, for example, a servo motor) connected to the elevation screw. In this way, the lifting motor drives the lifting screw rod to rotate, so that the multi-wire cutting unit 14 can move up and down along the lifting guide rail. The lifting driving unit is not limited to this, and other components for driving the multi-wire cutting unit 14 to move up and down along the lifting rail may be also suitable, for example, the lifting driving unit may include a lifting rack, a driving gear engaged with the lifting rack, and a driving motor for driving the driving gear to rotate.

The multi-wire cutting unit includes: the cutting device comprises a cutting support, a first closed-loop cutting line, a second closed-loop cutting line, a first multi-wire cutting wheel and a second multi-wire cutting wheel, wherein the first closed-loop cutting line is wound on the first multi-wire cutting wheel and the second multi-wire cutting wheel to form a first multi-wire cutting wire saw, and the second closed-loop cutting line is wound on the first multi-wire cutting wheel and the second multi-wire cutting wheel to form a second multi-wire cutting wire saw. As shown in fig. 7, the multi-wire cutting unit 14 comprises: a cutting carriage 141, a first multi-wire cutting wheel 142, a second multi-wire cutting wheel 143, a first closed loop cutting line 144, and a second closed loop cutting line 145.

The cutting support 141 is a carrier on which the first and second

multi-wire cutting wheels

142 and 143 and other components are disposed on the wire cutting base 140, and may be a beam, a plate frame, a support, or the like. In addition, the cutting support 141 can be disposed on the wire cutting machine base 140 in a lifting manner through a lifting mechanism, and for the lifting mechanism, reference may be made to the foregoing description, which is not repeated herein. By using the lifting mechanism, the cutting support 141 moves up and down along a third direction relative to the wire cutting machine base 140, so as to drive the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 and the multi-wire cutting wire saw wound on the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 to move up and down, thereby cutting the silicon rod to be cut. Furthermore, in some embodiments, the distal end of the cutting support 141, which is relatively far away from the wire cutting base 140, may be further defined by a guide rod structure and guide the cutting support 141 to move up and down by the lifting mechanism.

The first multi-wire saw wheel and the second multi-wire saw wheel are arranged on two opposite sides of the cutting support along the second direction. In the embodiment shown in fig. 7, the first and second

multi-wire cutting wheels

142 and 143 are oppositely disposed at both sides of the bottom of the cutting support 141 along the second direction, the first closed loop cutting wire 144 is wound around the first and second

multi-wire cutting wheels

142 and 143 to form a first multi-wire cutting wire saw, and the second closed loop cutting wire 145 is wound around the first and second

multi-wire cutting wheels

142 and 143 to form a second multi-wire cutting wire saw, the first multi-wire cutting wire saw is parallel to the second multi-wire cutting wire saw and both are disposed along the second direction, and the first multi-wire cutting wire saw and the second multi-wire cutting wire saw have a predetermined wire spacing therebetween.

The first multi-wire cutting wheel 142 comprises at least two first cutting wire grooves, and the plane of any first cutting wire groove is parallel to the wheel surface of the first multi-wire cutting wheel, that is, the cutting wire grooves on the first multi-wire cutting wheel can be referred to as first cutting wire grooves.

The second multi-wire cutting wheel 143 includes at least two second wire cutting grooves, and a plane of any one of the second wire cutting grooves is parallel to a wheel surface of the second multi-wire cutting wheel, that is, the wire cutting grooves on the second multi-wire cutting wheel may be referred to as second wire cutting grooves.

The wheel surface of the first multi-wire cutting wheel 142 is parallel or coplanar with the wheel surface of the second multi-wire cutting wheel 143, so that when the first closed-loop cutting line 144 and the second closed-loop cutting line 145 are wound around the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143, the first cutting wire slot and the second cutting wire slot for winding the first closed-loop cutting line 144 are located in the same plane, and the first cutting wire slot and the second cutting wire slot for winding the second closed-loop cutting line 145 are located in the same plane, respectively, so that the direction of the first multi-wire cutting wire saw is located in the plane where the first cutting wire slot and the second cutting wire slot for winding the first closed-loop cutting line 144 are located, and the direction of the second multi-wire cutting wire saw is located in the plane where the first cutting wire slot and the second cutting wire slot for winding the second closed-loop cutting line 145 are located. It will be understood that the first closed loop cut line 144 and the second closed loop cut line 145 are in operation during the cutting action and therefore are defined by the spatial position in which they are located, in the present embodiment the first closed loop cut line 144 and the second closed loop cut line, i.e. the first multi-wire cutting wire saw and the second multi-wire cutting wire saw, respectively, wound between the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143.

The bottom of the cutting support 141 has a depression such that the cutting support 141, the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and at least two multi-wire cutting saws (i.e., the first multi-wire cutting saw and the second multi-wire cutting saw) formed around the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 can form a cutting receipt space corresponding to the silicon rod to be cut.

The multi-wire cutting unit further comprises at least one first multi-wire transition wheel and at least one second multi-wire transition wheel for drawing a closed loop cutting wire wound around the first multi-wire cutting wheel and the second multi-wire cutting wheel.

In some embodiments, the multi-wire cutting unit comprises a first multi-wire transition wheel forming a triangle with the first and second multi-wire cutting wheels and a second multi-wire transition wheel forming a triangle with the first and second multi-wire cutting wheels.

In some embodiments, the multi-wire cutting unit comprises two first multi-wire transition wheels constituting a quadrilateral with the first and second multi-wire cutting wheels and two second multi-wire transition wheels constituting a quadrilateral with the first and second multi-wire cutting wheels.

In certain embodiments, the multi-wire cutting unit comprises three or more first multi-wire transition wheels and three or more second multi-wire transition wheels.

In the embodiment shown in fig. 7, the multi-wire cutting unit 14 further comprises a first multi-wire transition wheel 145 and a second multi-wire transition wheel 146, the first multi-wire transition wheel 145 and the second multi-wire transition wheel 146 being disposed on the cutting carriage 141.

The first multi-line transition wheel 145 is used to divert or guide the first closed loop cut line 144 and the second multi-line transition wheel 146 is used to divert or guide the second closed loop cut line 145. In the embodiment shown in fig. 7, the first multi-wire transition wheel 145 and the second multi-wire transition wheel are disposed on the top of the cutting support 141, the first multi-wire transition wheel 145 is disposed adjacent to the first multi-wire cutting wheel 142, and the second multi-wire transition wheel 146 is disposed adjacent to the second multi-wire cutting wheel 143, wherein the first multi-wire transition wheel 145 may form a first triangle with the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146 may form a second triangle with the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143. The first multi-wire transition wheel 145 may be non-limiting with respect to the shape of the first triangle formed by the first multi-wire saw wheel 142 and the second multi-wire saw wheel 143, and the second multi-wire transition wheel 146 may be non-limiting with respect to the shape of the second triangle formed by the first multi-wire saw wheel 142 and the second multi-wire saw wheel 143.

The first multi-line transition wheel 145 comprises at least one first transition line groove, and the plane of any first transition line groove is parallel to the plane of the first multi-line transition wheel.

The second multi-line transition wheel 146 includes at least one second transition line slot, and a plane of any second transition line slot is parallel to a second multi-line transition wheel surface.

The wheel surface of the first multi-wire transition wheel 145 is parallel to or coplanar with the wheel surface of the first multi-wire cutting wheel 142 and the wheel surface of the second multi-wire cutting wheel 143, so that the first closed-loop cutting wire 144 is correspondingly wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145, and the first cutting wire groove, the second cutting wire groove, and the first transition wire groove of the first closed-loop cutting wire 144 are located in the same plane, so that the first multi-wire cutting wire saw is simultaneously located in the plane where the first cutting wire groove, the second cutting wire groove, and the first transition wire groove of the first closed-loop cutting wire 144 are located.

Similarly, the wheel surface of the second multi-wire transition wheel 146 is parallel to or coplanar with the wheel surface of the first multi-wire cutting wheel 142 and the wheel surface of the second multi-wire cutting wheel 143, so that when the second closed-loop cutting wire 145 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146, the first cutting wire slot, the second cutting wire slot, and the second transition wire slot, which are used for winding the second closed-loop cutting wire 145, are respectively located in the same plane, and thus the direction of the second multi-wire cutting wire saw can be located in the plane where the first cutting wire slot, the second cutting wire slot, and the second transition wire slot, which are used for winding the second closed-loop cutting wire 145, are located at the same time.

In this way, in this embodiment, the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145 of the multi-wire cutting unit are wound by the first closed-loop cutting line 144, and the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146 of the multi-wire cutting unit are wound by the second closed-loop cutting line 145, in this case, the multi-wire cutting device can omit components such as a take-up drum and a pay-off drum, and the first closed-loop cutting line and the second closed-loop cutting line can be cut by driving and then operating at high speed.

In the existing silicon rod cutting equipment, a cutting line is wound between a cutting wheel and a transition wheel in a line cutting unit from a pay-off drum and wound to a take-up drum from the line cutting unit, the cutting line is driven to run in the cutting process, and the running process of the cutting line is an acceleration process and a deceleration process which are alternately carried out. In the silicon rod truncation equipment, the closed-loop cutting line in the line cutting unit can be kept to continuously run at a high speed, and meanwhile, the closed-loop cutting line can run in the same running direction in the cutting process. Therefore, the linear cutting unit can realize high-precision cutting operation, and the problems that the cutting surface is corrugated and the like due to the operation reversing or the operation speed of the cutting line in the conventional cutting mode are solved; meanwhile, the closed loop cutting line can effectively reduce the total length of the cutting line required by the line cutting unit, avoid parts such as a take-up cylinder, a pay-off cylinder and the like, and reduce the production cost.

In the multi-wire cutting unit of the present application, a cutting line driving mechanism is further included for driving the first closed loop cutting line 144 wound on the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143 and the first multi-wire transition wheel 145 and the second closed loop cutting line 145 wound on the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143 and the second multi-wire transition wheel 146 to run at high speed.

In some embodiments, at least one of the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, the first multi-wire transition wheel 145 and the second multi-wire transition wheel 146 is used as a driving wheel, and the others are used as driven wheels, wherein the driving wheel is associated with the cutting wire driving mechanism, the driving wheel is driven to rotate by the cutting wire driving mechanism and drives the closed loop cutting wire to run at a high speed in cooperation with the other driven wheels.

Since the first closed loop of cutting line 144 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145, and the second closed loop of cutting line 145 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146, in some implementations, the first multi-wire cutting wheel 142 or the second multi-wire cutting wheel 143 can be used as a drive wheel. Taking the first multi-wire cutting wheel 142 as an example of a driving wheel, the first multi-wire cutting wheel 142 is associated with a wire driving mechanism which can be used to drive the first multi-wire cutting wheel 142 in rotation. In some examples, the cutting wire drive mechanism comprises a drive motor, the motor shaft of which is directly connected to the axle of the first multi-wire cutting wheel 142, under the rotation of which the first multi-wire cutting wheel 142 is rotated by the motor shaft of the drive motor, the first closed loop cutting wire 144 is entrained and rotates the second multi-wire cutting wheel 143 and the first multi-wire transition wheel 145, achieving a high speed of travel of the first closed loop cutting wire 144, the second closed loop cutting wire 145 is entrained and rotates the second multi-wire cutting wheel 143 and the second multi-wire transition wheel 146, achieving a high speed of travel of the second closed loop cutting wire 145. In some examples, the cutting line driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on a motor shaft of the driving motor and an axle of the first multi-wire cutting wheel, under the rotation of the driving motor, the transmission belt is driven by the motor shaft of the driving motor to operate and then drive the first multi-wire cutting wheel 142 to rotate, the first closed loop cutting line 144 is driven to operate and rotate the second multi-wire cutting wheel 143 and the first multi-wire transition wheel 145, the high-speed operation of the first closed loop cutting line 144 is realized, and the second closed loop cutting line 145 is driven to operate and rotate the second multi-wire cutting wheel 143 and the second multi-wire transition wheel 146, the high-speed operation of the second closed loop cutting line 145 is realized.

In some implementations, the first multi-line transition wheel or the second multi-line transition wheel can be used as the drive wheel. In some examples, the cutting wire drive mechanism comprises a drive motor having a motor shaft directly connected to the axle of the first or second multi-wire transition wheel. In some examples, the severance line drive mechanism includes a drive motor and a drive belt that is journaled to a motor shaft of the drive motor and an axle of the first or second multi-wire transition wheel.

In addition, the multi-line transition wheel can also be used to adjust the tension of the closed loop cutting wire, i.e. the first multi-line transition wheel can also be used to adjust the tension of the first closed loop cutting wire and the second multi-line transition wheel can also be used to adjust the tension of the second closed loop cutting wire. Accordingly, the multi-wire cutting unit further comprises at least one multi-wire tension adjustment mechanism associated with at least one of the first and second multi-wire transition wheels.

Please refer to fig. 8, which is a schematic structural diagram of a multi-wire sawing device according to another embodiment of the present application at a second viewing angle. With reference to fig. 7 and 8, the multi-wire cutting unit 14 comprises a first multi-wire tension adjustment mechanism associated with the first multi-wire transition wheel 145 and a second multi-wire tension adjustment mechanism associated with the second multi-wire transition wheel 146.

Taking as an example the first multi-wire tension adjustment mechanism associated with the first multi-wire transition wheel, reference may be made to the first multi-wire tension adjustment mechanism for the second multi-wire tension adjustment mechanism associated with the first multi-wire transition wheel.

The first multi-wire tension adjustment mechanism includes: a multi-wire drive unit 191 and a multi-wire linkage assembly, wherein the multi-wire linkage assembly is associated with the first multi-wire transition wheel 145 and the multi-wire drive unit 191, and is controlled by the multi-wire drive unit, that is, the multi-wire drive unit 191 drives the multi-wire linkage assembly to actuate so as to drive the first multi-wire transition wheel 145 to generate position change to adjust the tension of the first closed-loop cutting wire 144.

In the embodiment shown in figures 7 and 8, the multi-wire connecting rod assembly comprises: a pivot 192, a first link 194, and a second link 196.

The pivot 192 is provided on the cutting support 141.

A first end of the first link 194 is associated with the pivot 192 and a second end of the first link 194 is connected to the first multi-wire transition wheel 145.

A first end of the second link 196 is associated with the pivot 192 and a second end of the second link 196 is connected to the multi-wire drive unit.

By means of the multi-wire linkage assembly, a lever effect can be achieved, adjusting the position of the first multi-wire transition wheel 145.

With respect to the multi-wire drive unit, in certain implementations, the multi-wire drive unit 191 includes a counterweight (in the following description, the counterweight is designated 191), and the counterweight 191 may be suspended from the second end of the second link 196. For example, when the tension of the first closed loop of cutting wire 144 is to be increased, the counterweight 191 is released, the counterweight 191 descends, the second end of the second link 196 carries the pivot 192 to rotate in a forward direction (counterclockwise in fig. 8) under the action of the weight of the counterweight 191, the pivot 192 that rotates in a forward direction carries the first link 194 and the associated first multi-wire transfer wheel 145 to move in a direction away from the first and second multi-wire cutting wheels 142 and 143 (e.g., upward), the perimeter of the triangle formed by the first and second

multi-wire transfer wheels

145 and 142 and 143 is enlarged, and the tension of the first closed loop of cutting wire 144 is increased. When the tension of the first closed loop of wire 144 is to be reduced, the counterweight 191 is lifted, the second end of the second link 196 is controlled to lift and bring the pivot 192 in a reverse rotation (clockwise in fig. 8), the pivot 192 in the reverse rotation in turn brings the first link 194 and the associated first multi-wire transition wheel 145 in a direction towards the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 (e.g. downwards), reducing the perimeter of the triangle formed by the first multi-wire transition wheel 145 and the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143, and reducing the tension of the first closed loop of wire 144.

The weight portion may include a weight frame and a weight block disposed in the configuration frame, wherein the number of the weight block may be changed according to the requirement of tension adjustment of the first closed-loop cutting line 144, for example, when the tension of the first closed-loop cutting line 144 is increased, the number of the weight block may be increased, and when the tension of the second closed-loop cutting line 145 is decreased, the number of the weight block may be decreased.

The disposition frame is movable up and down with respect to the cutting support 141 by an elevating guide.

In some embodiments, the weight may include a locking mechanism for locking the weight such that the weight is stationary relative to the cutting carriage 141 to allow the weight to be switched from an active state to a locked state with the cutting carriage 141. In some examples, the locking mechanism may be a latch, for example.

In certain embodiments, the multi-wire tension adjustment mechanism can further include a multi-wire tension balancing component for ensuring that the tension of the weight 191 and the first closed loop cut line 144 are in equilibrium. In the embodiment shown in fig. 8, the multi-wire tension adjusting mechanism further includes a multi-wire tension balancing member 193, the multi-wire tension balancing member 193 is a tension balancing cylinder (in the following description, the tension balancing cylinder is denoted as 193), and the tension balancing cylinder 193 acts on the second link 196, for example, an extended end of the second link 196.

For example, when the tension of the first closed loop of cutting wire 144 is to be increased, the counterweight 191 is released, the counterweight 191 descends, the second end of the second link 196 carries the pivot 192 to rotate in a forward direction (counterclockwise in fig. 8) under the action of the weight 191, the pivot 192 that rotates in a forward direction carries the first link 194 and the associated first multi-wire transfer wheel 145 to move in a direction away from the first and second multi-wire cutting wheels 142 and 143 (e.g. upward), the circumference of the triangle formed by the first multi-wire transfer wheel 145 and the first and second

multi-wire cutting wheels

142 and 143 is enlarged, the tension of the first closed loop of cutting wire 144 is increased until, when the tension of the first closed loop of cutting wire 144 is adjusted to a desired value, the second link 196 is pulled by the cylinder shaft of the tension balancing cylinder 193 so that the weight 191 and the second link 196 no longer move, i.e. remain stationary relative to the cutting support 141. When the tension of the first closed loop of cutting wire 144 is to be reduced, the second link 196 is pulled by the cylinder shaft of the tension balancing cylinder 193, lifting the counterweight and second link 196 and bringing the pivot 192 to rotate in reverse (clockwise as viewed in fig. 8), the reversely rotating pivot 192 in turn brings the first link 194 and the associated first multi-wire transition wheel 145 to move in a direction closer to the first and second multi-wire cutter wheels 142, 143 (e.g., downward), reducing the circumference of the triangle formed by the first multi-wire transition wheel 145 and the first and second

multi-wire cutter wheels

142, 143, reducing the tension of the first closed loop of cutting wire 144 until the tension of the first closed loop of cutting wire 144 is adjusted to a desired value, the tension balancing cylinder 193 stops the cylinder shaft at a current position such that the counterweight 191 and second link 196 no longer move, i.e. remain stationary relative to the cutting support 141.

Still other variations of the multi-wire drive unit are possible, for example, in certain implementations, the multi-wire drive unit can include a pull cylinder positioned below the second link and having a cylinder shaft connected to the second end of the second link. For example, when the tension of the first closed loop of cutting wire 144 is to be increased, the cylinder shaft is retracted by the pulling cylinder, pulling the second link 196 and causing the pivot 192 to rotate in a forward direction (e.g., counterclockwise in fig. 8), the forward rotating pivot 192 in turn causes the first link 194 and its associated first multi-wire transition wheel 145 to move in a direction away from the first and second multi-wire cutting wheels 142, 143 (e.g., upward), expanding the perimeter of the triangle formed by the first multi-wire transition wheel 145 and the first and second

multi-wire cutting wheels

142, 143, and increasing the tension of the first closed loop of cutting wire 144. When the tension of the first closed loop of cutting wire 144 is to be reduced, extending from the pull cylinder to the cylinder axis, the second end of the second link 196 is controlled to lift and rotate the pivot 192 in a reverse direction (clockwise in fig. 8), the pivot 192 in the reverse direction in turn moves the first link 194 and the associated first multi-wire transfer wheel 145 in a direction closer to the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 (e.g., in a downward direction), reducing the circumference of the triangle formed by the first multi-wire transfer wheel 145 and the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143, and reducing the tension of the first closed loop of cutting wire 144.

The silicon rod truncation equipment of the application further comprises a silicon rod stabilizing device corresponding to the wire cutting device, and the silicon rod stabilizing device is used for avoiding the silicon rod from being damaged, ripped on the surface, broken edges and the like when the wire cutting device cuts the silicon rod. In the embodiment shown in fig. 7, the silicon rod chopping apparatus further comprises a silicon rod stabilizing device corresponding to the multi-wire cutting device, for preventing the silicon rod from surface damage, surface waviness, edge breakage, and the like when being cut by the multi-wire cutting device.

As shown in fig. 7, the multi-wire cutting unit of the multi-wire cutting device includes a first multi-wire cutting wheel 142, a second multi-wire cutting wheel 143, a first multi-wire transition wheel 145, a second multi-wire transition wheel 146, a first closed loop cutting line 144, and a second closed loop cutting line 145, wherein the first multi-wire cutting wheel 142 and the second multi-wire cutting wheel 143 are oppositely disposed along a second direction, the first closed loop cutting line 144 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the first multi-wire transition wheel 145 to form a first multi-wire cutting wire saw, and the second closed loop cutting line 145 is wound around the first multi-wire cutting wheel 142, the second multi-wire cutting wheel 143, and the second multi-wire transition wheel 146 to form a second multi-wire cutting wire saw, through which a silicon rod to be cut is cut to perform a silicon rod cutting operation and a silicon rod sampling operation. Wherein, when waiting to cut the silicon rod by the truncation moment (promptly, when the inside wire outgoing of silicon rod is waited to cut from the multi-wire cutting coping saw, the silicon rod cutting face leads to "ripple face", "limit collapse" phenomenon because of producing slight displacement, seriously influences and cuts the quality.

In view of this, in the present application, the silicon rod truncating apparatus of the present application further comprises a silicon rod stabilizing device corresponding to the wire cutting device. As shown in fig. 7 and 8, the silicon rod sectioning apparatus of the present application includes silicon rod stabilizing devices corresponding to the respective single-wire cutting devices and multi-wire cutting devices, the respective silicon rod stabilizing devices being disposed at intervals in the first direction.

In this embodiment, the silicon rod stabilizing device comprises a first stabilizing component and a second stabilizing component which are arranged at intervals along a first direction, and an indwelling space for accommodating a cutting wire saw in the wire cutting device is arranged between the first stabilizing component and the second stabilizing component. Wherein, any one of the first stabilizing component and the second stabilizing component comprises a first side stabilizing part and a second side stabilizing part which are arranged along the second direction and are respectively used for abutting against two opposite sides of the silicon rod to be cut. Any one of the first and second side stabilizing members includes: a workpiece support block; and the workpiece auxiliary supporting block is controlled by the supporting block driving unit to move along the second direction so as to stretch and retract relative to the workpiece supporting block.

In the embodiments shown in fig. 7 and 8, the silicon rod truncation apparatus of the present application includes a silicon rod stabilizing device corresponding to the multi-wire cutting device.

In some embodiments, referring to fig. 7 and 8, the silicon rod stabilizing device further comprises a first stabilizing component 181 and a second stabilizing component 182 spaced apart in the first direction, and an indwelling space for receiving a cutting wire saw in the wire cutting device is provided between the first stabilizing component 181 and the second stabilizing component 182. Wherein either of the first and second stabilizing

assemblies

As shown in fig. 7 and 8, the first side stabilizing member or the second side stabilizing member includes: the workpiece supporting block and the workpiece auxiliary supporting block. Among them, the workpiece support block and the workpiece auxiliary support block belonging to the first stabilizing assembly 181 may be respectively designated as 183 and 185, and the workpiece support block and the workpiece auxiliary support block belonging to the second stabilizing assembly 182 may be respectively designated as 184 and 186.

The first and second stabilizing assemblies are associated with the wire cutting device. In the embodiment shown in fig. 6, the first and second stabilizing

assemblies

181, 182 are associated with the single wire cutting device 15 and the first and second stabilizing

assemblies

181, 182 are associated with the multi-wire cutting device 13.

The workpiece supporting block is fixed on a mounting structure. As shown in fig. 7 and 8, the silicon rod stabilizing apparatus may include a first mounting structure 147 and a second mounting structure 148 oppositely disposed in a second direction, wherein the first mounting structure 147 is connected to the wire cutter base 140, the second mounting structure 148 is associated with the cutting support 141 in the single-wire cutting unit, the first side stabilizing member of the first stabilizing assembly 181 and the first side stabilizing member of the second stabilizing assembly 182 are disposed on the first mounting structure 147, and the second side stabilizing member of the first stabilizing assembly 181 and the second side stabilizing member of the second stabilizing assembly 182 are disposed on the second mounting structure 148. Thus, the workpiece support blocks 183(184) in the first side stabilizing member are fixed to the first mounting structure 147, and the workpiece support blocks 183(184) in the second side stabilizing member are fixed to the second mounting structure 148.

In this embodiment, the first mounting structure 147 is connected to the wire cutting machine base 140, and the second mounting structure 148 is connected to the cutting support 141 in the single wire cutting unit, so that the silicon rod stabilizing device is paired with the wire cutting device, i.e., the first stabilizing assembly 181 and the second stabilizing assembly 182 in the silicon rod stabilizing device are synchronized with the wire cutting device. In certain embodiments, the silicon rod stabilizing device moves synchronously with the wire cutting device when the wire cutting device is repositioned by the position adjusting device (e.g., the wire cutting device moves in the first direction).

The front end of the workpiece supporting block, which is used for abutting against the silicon rod to be cut, is provided with a first abutting part. As shown in fig. 7 and 8, the front end of the workpiece supporting block 183(184) is provided with a first interference portion, which may be, for example, a slope or an arc portion adapted to the silicon rod to be cut, and the arc portion is not limited, and may be, for example, a concave arc portion, a convex arc portion, or the like.

The workpiece auxiliary supporting block is matched with the workpiece supporting block. As shown in fig. 7 and 8, the workpiece auxiliary supporting block 185(186) is located below the workpiece supporting block 183(184), and the workpiece auxiliary supporting block 185(186) is moved in the second direction by the supporting block driving unit 187(188) to extend and retract relative to the workpiece supporting block 183 (184).

When the workpiece auxiliary supporting block 185(186) needs to be driven to extend, the air cylinder is driven to extend from the cylinder shaft of the air cylinder and push the workpiece auxiliary supporting block 185(186) to extend relative to the workpiece supporting block. Fig. 4 shows the extended state of the workpiece auxiliary supporting block 185(186) after being driven, and as shown in fig. 4, the workpiece auxiliary supporting block 185(186) is driven to extend and abut against the bottom of the silicon rod 100 to be cut. When the workpiece auxiliary supporting block 185(186) needs to be driven to contract, the air cylinder is driven to contract from the air cylinder shaft of the air cylinder and pull the workpiece auxiliary supporting block 185(186) to contract relative to the workpiece supporting block. Fig. 5 shows a contracted state diagram of the workpiece auxiliary supporting block 185(186) after being driven, and the workpiece auxiliary supporting block 185(186) is contracted after being driven, as shown in fig. 5.

In this way, for each single-wire cutting device, four stabilizing members in the silicon rod stabilizing device corresponding to the single-wire cutting device are arranged at four positions, namely, front, rear, left and right positions. When the silicon rod to be cut is placed on the material conveying table in a horizontal manner, generally, the workpiece supporting blocks in the four stabilizing members can abut against the silicon rod to be cut. However, in some cases, due to factors such as the size of the silicon rod or the regularity of the silicon rod, one or some of the four workpiece support blocks may not be abutted to the silicon rod to be cut, or the four workpiece support blocks may be abutted to the silicon rod to be cut but may not be limited and stable.

When the silicon rod cutting equipment shown in fig. 6 is used for cutting silicon rods, the silicon rods to be cut are firstly placed on the material conveying table in a horizontal mode, and the axis of each silicon rod is parallel to the first direction; the material conveying table is used for driving the silicon rod to be cut to be conveyed to a cutting position along a first direction; driving the silicon rod stabilizing device to stabilize the silicon rod to be cut, for example, driving the auxiliary workpiece supporting block in the silicon rod stabilizing device in fig. 6 to extend out, so that the auxiliary workpiece supporting block and the auxiliary workpiece supporting block in the silicon rod stabilizing device are matched and abutted against the silicon rod to limit; independently driving the single-wire cutting units in the plurality of single-wire cutting devices (which may be part of the single-wire cutting devices or all of the single-wire cutting devices) and the multi-wire cutting units in the multi-wire cutting devices to descend, and the single-wire cutting wire saws in the single-wire cutting devices and the multi-wire cutting wire saws in the multi-wire cutting devices contact and enter the silicon rod to cut the silicon rod, and continuing to descend the multi-wire cutting devices until the multi-wire cutting wire saws penetrate out of the silicon rod to be cut into silicon rod sections (independently driving the single-wire cutting units in the plurality of single-wire cutting devices and the multi-wire cutting units in the multi-wire cutting devices to drive the single-wire cutting units in the plurality of single-wire cutting devices after driving the multi-wire cutting units in the multi-wire cutting devices to comprise a precursor driving unit in the multi-wire cutting device, or simultaneously driving the single-wire cutting units in the plurality of single-wire cutting devices and the multi-wire cutting units in the multi-wire cutting devices), and a first multi-wire cutting wire saw and a second multi-wire cutting wire saw in the multi-wire cutting unit are matched to cut off a silicon rod sample wafer, and the thickness of the silicon rod sample wafer corresponds to the wire distance between the first multi-wire cutting wire saw and the second multi-wire cutting wire.

Referring to fig. 9, a schematic structural view of a silicon rod truncation apparatus according to another embodiment of the present application is shown. As shown in fig. 9, the silicon rod truncating apparatus in the present embodiment may include at least: a machine base 21, a material conveying table 22, and at least two wire cutting devices, wherein the at least two wire cutting devices comprise a single wire cutting device 25.

The linear cutting device is used for cutting off the silicon rod to be cut. As shown in fig. 9, the silicon rod cutting apparatus includes a plurality of single-wire cutting devices 25, the plurality of single-wire cutting devices 25 are independent of each other and are spaced apart from each other along a first direction, and a cutting operation can be performed on a silicon rod to be cut by the plurality of single-wire cutting devices 25, so that the silicon rod to be cut is cut by the single-wire cutting device 15 to form a multi-stage silicon rod cut.

Referring to fig. 10 and 11, fig. 10 is a schematic structural diagram of a single-wire cutting device according to a further embodiment of the present application at a first viewing angle, and fig. 11 is a schematic structural diagram of a single-wire cutting device according to a further embodiment of the present application at a second viewing angle. In the embodiment shown in fig. 10 and 11, the single-wire cutting device 25 comprises a wire cutting stand 260 and a single-wire cutting unit 26.

The wire cutting machine base 260 is arranged on the machine base, and the single wire cutting unit 26 is arranged on the wire cutting machine base 260 in a lifting mode through the lifting mechanism. Here, the wire cutting machine base 260 is a carrier on which the single-wire cutting unit 26 is disposed on the base 21, and may be a beam, a column, a plate frame, a bracket, or the like.

The single-wire cutting unit 26 is arranged on the wire cutting machine base 260 in a lifting manner through a lifting mechanism. In certain implementations, the lift mechanism can include a lift rail, a slider, and a lift drive unit. The lifting guide rail is arranged on the wire cutting machine base 260 along the third direction, the sliding block is arranged on the single-wire cutting unit 26 and is matched with the corresponding lifting guide rail, and the lifting driving unit is used for enabling the single-wire cutting unit 26 to move up and down along the lifting guide rail. The lifting driving unit may further include a lifting screw rod connected with the single-wire cutting unit 26 along a third direction, and a lifting motor (the lifting motor may be a servo motor, for example) connected with the lifting screw rod. In some implementations, the lift driving unit may include a lift rack, a driving gear engaged with the lift rack, and a driving motor driving the driving gear to rotate.

The single-wire cutting unit includes: the cutting wire saw comprises a cutting support, a closed loop cutting wire, a first single wire cutting wheel, a second single wire cutting wheel and at least one single wire transition wheel, wherein the closed loop cutting wire is wound on the first single wire cutting wheel, the second single wire cutting wheel and the at least one single wire transition wheel to form a single wire cutting wire saw. In certain embodiments, the single-wire cutting unit comprises two single-wire transition wheels. As shown in fig. 10, the single-wire cutting unit 26 includes: a cutting stent 261, a first single-wire cutting wheel 262, a second single-wire cutting wheel 263, a closed loop cut line 264, a first single-wire transition wheel 265, and a second single-wire transition wheel 266.

The cutting support 261 is a carrier provided with a first single-wire cutting wheel 262, a second single-wire cutting wheel 263, a first single-wire transition wheel 265, and a second single-wire transition wheel arranged on the wire cutting machine base 260, and the specific form of the cutting support may be a beam body, a plate frame, a support, etc. In addition, the cutting support 261 can be disposed on the wire cutting machine base 260 in a lifting manner through a lifting mechanism, and for the lifting mechanism, reference may be made to the foregoing description, which is not described herein again. By using the lifting mechanism, the cutting support 261 moves up and down along a third direction relative to the wire cutting machine base 260, so as to drive the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the first single-wire transition wheel 265, the second single-wire transition wheel 266, and the single-wire cutting wire saw wound on the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the first single-wire transition wheel 265, and the second single-wire transition wheel 266 to move up and down, so as to cut the silicon rod to be cut. Furthermore, in some embodiments, the distal end of the cutting support 261, which is relatively far away from the wire cutting base 260, may further define and guide the cutting support 261 to move up and down under the driving of the lifting mechanism by providing a guide rod structure.

The first single-wire cutting wheel and the second single-wire cutting wheel are arranged on two opposite sides of the cutting support along the second direction. In the embodiment shown in fig. 10 and 11, the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 are oppositely disposed on both sides of the bottom of the cutting support 261 along the second direction, and the closed-loop cutting line 264 is wound around the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 to form a single-wire cutting wire saw, which is disposed along the second direction.

The first single-wire cutting wheel 262 comprises at least one first cutting wire slot, and the plane of any first cutting wire slot is parallel to the wheel surface of the first single-wire cutting wheel, that is, the cutting wire slots on the first single-wire cutting wheel can be referred to as first cutting wire slots.

The second single-wire cutting wheel 263 comprises at least one second cutting wire slot, and the plane of any second cutting wire slot is parallel to the wheel surface of the second single-wire cutting wheel, that is, the cutting wire slots on the second single-wire cutting wheel can be called as second cutting wire slots.

The wheel surface of the first single-wire cutting wheel 262 is parallel to or coplanar with the wheel surface of the second single-wire cutting wheel 263, so that when the closed-loop cutting wire 264 is wound around the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263, the first cutting wire slot and the second cutting wire slot which are correspondingly wound around the closed-loop cutting wire 264 are located in the same plane, and thus, the direction of the single-wire cutting wire saw can be located in the plane where the first cutting wire slot and the second cutting wire slot which are used for winding around the closed-loop cutting wire 264 are located at the same time. It will be appreciated that the closed loop cutting wire 264 is in operation during the cutting action and therefore the single wire cutting saw is defined by the spatial location of the closed loop cutting wire 264, which in the present embodiment is a single wire cutting saw, wound between the first single wire cutting wheel 262 and the second single wire cutting wheel 263.

It will be appreciated that when the closed loop cut line 264 is wound around either single wire cutting wheel (first single wire cutting wheel 262 or second single wire cutting wheel 263), the closed loop cut line 264 on both sides of the single wire cutting wheel should be located in the plane of the cut line slot in the single wire cutting wheel for winding the closed loop cut line 264.

The bottom of the cutting support 261 has a recess so that the cutting support 261, the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the single-wire cutting wire saw formed around the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 form a cutting accommodating space corresponding to the silicon rod to be cut.

The first single-wire transition wheel and the second single-wire transition wheel are used for reversing or guiding the closed-loop cutting line. In the embodiment shown in fig. 11, the first single-wire transition wheel 265 and the second single-wire transition wheel 266 are disposed on the top of the cutting stent 261, wherein the first single-wire transition wheel 265 is adjacent to the first single-wire cutting wheel 262, the second single-wire transition wheel 266 is adjacent to the second single-wire cutting wheel 263, and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the first single-wire transition wheel 265, and the second single-wire transition wheel 266 form a quadrilateral. The shape of the quadrangle formed by the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the first single-wire transition wheel 265, and the second single-wire transition wheel 266 is not limited. In some examples, the first single-wire cut wheel 262, the second single-wire cut wheel 263, the first single-wire transition wheel 265, and the second single-wire transition wheel 266 form a regular quadrilateral, such as: isosceles trapezoids, rectangles, and the like. In some examples, the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the first single-wire transition wheel 265, and the second single-wire transition wheel 266 may also form an arbitrary quadrilateral.

The first single-line transition wheel 265 comprises at least one first transition line groove, and the plane where any one first transition line groove is located is parallel to the wheel surface of the first single-line transition wheel. The second single-line transition wheel 266 comprises at least a second transition line groove, and the plane of any second transition line groove is parallel to the second single-line transition wheel surface.

The wheel surface of the first single-wire transition wheel 265 and the wheel surface of the second single-wire transition wheel 266 are parallel to or coplanar with the wheel surface of the first single-wire cutting wheel 262 and the wheel surface of the second single-wire cutting wheel 263, so that when the closed-loop cutting wire 264 is wound on the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the first single-wire transition wheel 265 and the second single-wire transition wheel 266, the first cutting wire groove, the second cutting wire groove, the first transition wire groove and the second transition wire groove which are correspondingly wound on the closed-loop cutting wire 264 are located in the same plane, and thus, the direction of the single-wire saw can be located in the plane where the first cutting wire groove, the second cutting wire groove, the first transition wire groove and the second transition wire groove which are used for winding on the closed-loop cutting wire 264 are located at the same time.

In this way, in this embodiment, the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the second single-wire transition wheel 266, and the first single-wire transition wheel 265 of the single-wire cutting unit are wound by the closed-loop cutting line 264, in this example, the single-wire cutting device can omit components such as a take-up drum and a pay-off drum, and the closed-loop cutting line can realize cutting by being driven to run at high speed.

In the single-wire cutting unit of the present application, a cutting wire driving mechanism is further included for driving the closed-loop cutting wire 264 wound around the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, the first single-wire transition wheel 265, and the second single-wire transition wheel 266 to run at a high speed.

In some embodiments, at least one of the first single-wire cutter wheel 262, the second single-wire cutter wheel 263, the first single-wire transition wheel 265, and the second single-wire transition wheel 266 is used as a driving wheel, and the others are used as driven wheels, wherein the driving wheel is associated with the cutting wire driving mechanism, the driving wheel is driven by the cutting wire driving mechanism to rotate, and the closed loop cutting wire 264 is driven to run at a high speed by the cooperation of the other driven wheels.

In some implementations, the first single-wire cutter wheel 262 or the second single-wire cutter wheel 263 can be used as a drive wheel. Taking the first single-wire cutting wheel 262 as an example of a drive wheel, the first single-wire cutting wheel 262 is associated with a cutting-wire drive mechanism that may be used to drive the first single-wire cutting wheel 262 in rotation. In some examples, the cutting wire driving mechanism includes a driving motor, a motor shaft of the driving motor is directly connected to a wheel shaft of the first single-wire cutting wheel 262, the first single-wire cutting wheel 262 is driven to rotate by the motor shaft of the driving motor under the rotation of the driving motor, the closed loop cutting wire 264 is carried to run, and the second single-wire cutting wheel 263, the second single-wire transition wheel 266 and the first single-wire transition wheel 265 are rotated, so that the closed loop cutting wire 264 runs at a high speed. In some examples, the cutting line driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on a motor shaft of the driving motor and an axle of the first single-wire cutting wheel, under the rotation of the driving motor, the motor shaft of the driving motor drives the transmission belt to run and then drives the first single-wire cutting wheel 262 to rotate, the closed loop cutting line 264 is driven to run and enables the second single-wire cutting wheel 263, the second single-wire transition wheel 266 and the first single-wire transition wheel 265 to rotate, and the high-speed running of the closed loop cutting line 264 is realized.

In some implementations, the first single-line transition 265 or the second single-line transition 266 may be used as the drive wheel. Taking the first single-wire transition 265 as an example of a drive wheel, the first single-wire transition 265 is associated with a cutting-wire drive mechanism that may be used to drive the first single-wire transition 265 in rotation. In some examples, the cutting wire drive mechanism includes a drive motor having a motor shaft directly coupled to the axle of the first single-wire transition wheel 265, whereby upon rotation of the drive motor, the first single-wire transition wheel 265 is rotated by the motor shaft of the drive motor, the closed loop cutting wire 264 is entrained and caused to rotate the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the second single-wire transition wheel 266 to enable high speed operation of the closed loop cutting wire 264. In some examples, the cutting line driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on a motor shaft of the driving motor and an axle of the first single-wire transition wheel, when the driving motor rotates, the transmission belt is driven by the motor shaft of the driving motor to operate and then drives the first single-wire transition wheel 265 to rotate, the closed loop cutting line 264 is driven to operate and enables the first single-wire cutting wheel 262, the second single-wire cutting wheel 263 and the second single-wire transition wheel 266 to rotate, and high-speed operation of the closed loop cutting line 264 is achieved.

In addition, the single-wire transition wheel can also be used for adjusting the tension of the closed-loop cutting wire. Accordingly, the single-wire cutting unit further includes a single-wire tension adjustment mechanism associated with the at least one single-wire transition wheel.

In certain embodiments, the single-wire cutting unit further comprises a single-wire tension adjustment mechanism associated with at least one of the first single-wire transition wheel and the second single-wire transition wheel.

In the following description, a single-wire tension adjusting mechanism associated with the first single-wire transition wheel is explained as an example.

With reference to fig. 10 and 11, the single-wire cutting unit 26 includes a single-wire tension adjustment mechanism associated with the first single-wire transition wheel 265.

The single wire tension adjusting mechanism includes: the single-wire driving unit 271 is connected with the first single-wire transition wheel 265 and the single-wire driving unit 271, and the single-wire connecting rod assembly is controlled by the single-wire driving unit, that is, the single-wire driving unit 271 drives the single-wire connecting rod assembly to move so as to drive the first single-wire transition wheel to generate position change to adjust the tension of the closed-loop cutting wire 264.

In the embodiment shown in fig. 10 and 11, the single-wire link assembly includes: a pivot 272, a first link 274, and a second link 276.

The pivot 272 is provided on the cutting support 261.

A first end of the first link 274 is associated with the pivot 272 and a second end of the first link 274 is connected to the first single-line transition wheel 265.

A first end of the second link 276 is associated with the pivot 272 and a second end of the second link 276 is connected to the single wire drive unit.

Through the single-line connecting rod assembly, a lever effect can be realized, and the position of the first single-line transition wheel 265 is adjusted.

With respect to the single wire drive unit, in certain implementations, the single wire drive unit 271 includes a weight, designated 271 in the following description), that may be suspended from the second end of the second link 276. For example, when the tension of the closed loop cutting line 264 is to be increased, the weight portion 271 is released, the weight portion 271 descends, the second end of the second link 276 drives the pivot 272 to rotate in the forward direction (counterclockwise in fig. 11) under the action of the gravity of the weight portion 271, the pivot 272 in the forward direction drives the first link 274 and the associated first single-wire transition wheel 265 to move in a direction away from the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (e.g., upward), the circumference of the quadrangle formed by the first single-wire transition wheel 265 and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the second single-wire transition wheel 266 is enlarged, and the tension of the closed loop cutting line 264 is increased. When the tension of the closed loop cutting line 264 is to be reduced, the weight 271 is lifted, the second end of the second link 276 is controlled to lift and drive the pivot 272 to rotate in a reverse direction (clockwise in fig. 11), the pivot 272 in the reverse direction drives the first link 274 and the first single-wire transition wheel 265 associated therewith to move in a direction close to the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (e.g., downward), the circumference of the quadrangle formed by the first single-wire transition wheel 265 and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263 and the second single-wire transition wheel 266 is reduced, and the tension of the closed loop cutting line 264 is reduced.

The counterweight part may include a counterweight frame and counterweights disposed in the configuration frame, wherein the number of the counterweights may be changed according to the requirement of the tension adjustment of the closed-loop cutting line 264, for example, when the tension of the closed-loop cutting line 264 is increased, the number of the counterweights may be increased, and when the tension of the closed-loop cutting line 264 is decreased, the number of the counterweights may be decreased.

The configuration frame is movable up and down with respect to the cutting support 261 by means of an elevating guide.

In some embodiments, the weight may include a locking mechanism for locking the weight such that the weight is stationary relative to the cutting support 261 to allow the weight to be switched from an active state to a locked state with the cutting support 261. In some examples, the locking mechanism may be a latch, for example.

In some embodiments, the weight may include a single line tension balancing component for ensuring that the tension of the weight and the closed loop cutting line 264 is in equilibrium. In the embodiment shown in fig. 11, the single-wire tension adjusting mechanism further includes a single-wire tension balancing member 273, and the single-wire tension balancing member 273 is a tension balancing cylinder (in the following description, the tension balancing cylinder is denoted as 273), and the tension balancing cylinder 173 acts on the second link 176, for example, an extension end of the second link 176.

For example, when the tension of the closed loop cutting line 264 is to be increased, the weight portion 271 is released, the weight portion 271 is lowered, the second end of the second link 276, under the action of the weight portion 271, drives the pivot 272 to rotate in a forward direction (counterclockwise in fig. 11), the pivot 272 in the forward direction drives the first link 274 and the associated first single-wire transition wheel 265 to move in a direction away from the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (e.g., upward), the circumference of the quadrangle formed by the first single-wire transition wheel 265 and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263 and the second single-wire transition wheel 266 is enlarged, the tension of the closed loop cutting line 264 is increased, until the tension of the closed loop cutting line 264 is adjusted to a desired value, the shaft is extended by the tension balancing cylinder 273 and the cylinder shaft is pressed against the second link 276, so that the weight 271 and the second link 276 no longer move, i.e., remain stationary relative to the cutting support 261. When the tension of the closed loop cutting line 264 is to be reduced, the second link 276 is lifted up by the cylinder shaft of the tension balancing cylinder 273, the weight and the second link 276 are lifted up, and the pivot 272 is driven to rotate in a reverse direction (clockwise in fig. 11), the pivot 272 which rotates in the reverse direction drives the first link 274 and the associated first single-wire transition wheel 265 to move in a direction close to the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (e.g., downward), the circumference of the quadrangle formed by the first single-wire transition wheel 265 and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263 and the second single-wire transition wheel 266 is reduced, the tension of the closed loop cutting line 264 is reduced, and until the tension of the closed loop cutting line 264 is adjusted to a desired value, the tension balancing cylinder 273 stops the cylinder shaft 276 at the current position, so that the weight 271 and the second link do not move any more, i.e., remain stationary relative to the cutting support 261.

Still other variations of the single wire drive unit are possible, for example, in some implementations, the single wire drive unit may include a pull cylinder positioned below the second link and having a cylinder shaft connected to the second end of the second link. For example, when the tension of the closed loop cutting line 264 is to be increased, the pulling cylinder contracts the cylinder shaft, pulls the second link 276 and drives the pivot 272 to rotate in a forward direction (counterclockwise in fig. 11), the pivot 272 rotating in the forward direction drives the first link 274 and the associated first single-wire transition wheel 265 to move in a direction away from the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (e.g., upward), the circumference of the quadrangle formed by the first single-wire transition wheel 265 and the first single-wire cutting wheel 262, the second single-wire cutting wheel 263, and the second single-wire transition wheel 266 is enlarged, and the tension of the closed loop cutting line 264 is increased. When the tension of the closed loop cutting line 264 is to be reduced, the pulling cylinder extends out of the cylinder shaft, the second end of the second link 276 is controlled to lift and drive the pivot 272 to rotate in a reverse direction (clockwise in fig. 11), the pivot 272 in the reverse direction drives the first link 274 and the first single-wire transition wheel 265 associated therewith to move in a direction close to the first single-wire cutting wheel 262 and the second single-wire cutting wheel 263 (e.g., downward), the perimeter of the quadrangle formed by the first single-wire transition wheel 265, the first single-wire cutting wheel 262, the second single-wire cutting wheel 263 and the second single-wire transition wheel 266 is reduced, and the tension of the closed loop cutting line 264 is reduced.

In the embodiment shown in fig. 9, the position adjusting means may include: a moving guide, a slider, and a moving drive unit.

The movable guide rail can be arranged on the machine base along a first direction, and the sliding block is arranged on the at least one linear cutting device. In some embodiments, as for the wire cutting device, taking the single-wire cutting device 25 as an example, the single-wire cutting device includes a wire cutting base 260 and a single-wire cutting unit 26, so that a moving guide rail is provided at a position of the base 21 corresponding to the wire cutting base 260, and a sliding block is provided at the bottom of the wire cutting base 260, wherein the number of the moving guide rails is not limited, and may be one, or may be two or more in parallel arrangement.

The mobile driving unit is used for driving the at least one wire cutting device to move along the mobile guide rail. In some embodiments, the movement driving unit may include: the wire cutting machine comprises a movable screw rod and a driving source, wherein the movable screw rod is arranged along a first direction and is associated with a wire cutting machine base in the at least one wire cutting device, and the driving source is used for driving the movable screw rod to rotate so as to enable the associated at least one wire cutting device to move along the transfer guide rail.

Furthermore, during the operation of cutting the silicon rod to be cut, the head and tail impurity layers of the silicon rod to be cut, which do not meet the production requirements in the processing technology, need to be cut first, and then the silicon rod to be cut is sliced and sampled to check the material characteristics of the silicon rod to be cut. Therefore, the silicon rod cutting equipment further comprises at least one multi-line cutting device, and silicon rod slices, namely required silicon wafer sample wafers, can be obtained by cutting the silicon rod to be cut.

In certain embodiments, a multi-wire cutting device is provided at the front end of the silicon rod truncation apparatus for cutting the head of the silicon rod to truncate a silicon rod slice from which the head of the silicon rod is obtained. In certain embodiments, a multi-wire cutting device is provided at the rear end of the silicon rod chopping apparatus for cutting the tail of the silicon rod to intercept the silicon rod slices from which the tail of the silicon rod is obtained. In certain embodiments, a multi-wire cutting device is provided at both the front end and the rear end of the silicon rod truncation apparatus for cutting the head and the tail of the silicon rod to intercept silicon rod slices obtained at the head and tail of the silicon rod.

As shown in fig. 9, the silicon rod slicing apparatus in this embodiment further includes a multi-wire cutting device 23, and the multi-wire cutting device 23 is disposed at the front end of the silicon rod slicing apparatus.

As such, the at least two wire cutting devices may be a combination of single wire cutting devices and multiple wire cutting devices.

In the application, the at least two wire cutting devices are a combination of a single-wire cutting device and a multi-wire cutting device, are independent devices and independently operate according to the silicon rod cutting operation requirement, so that the cutting operation of the silicon rod to be carried on the material conveying table can be performed by independently controlling each wire cutting device (comprising the single-wire cutting device 25 and the multi-wire cutting device 23), and the operation freedom degree and the cutting efficiency in the silicon rod cutting operation are improved. For example, in some embodiments, all of the wire cutting devices (including the single wire cutting device 25 and the multi-wire cutting device 23) are controlled to perform the cutting operation on the silicon rod to be cut. In some embodiments, a partial number of wire cutting devices (e.g., a portion of the single-wire cutting device 25, the multi-wire cutting device 25, or a portion of the single-wire cutting device 25 and the multi-wire cutting device 25) perform a chopping operation on the silicon rod to be cut, and the remaining wire cutting devices may remain stationary or otherwise operate.

The multi-wire cutting device 23 is arranged at the front end of the silicon rod cutting device and used for cutting the head of the silicon rod to be cut so as to obtain a silicon rod slice at the head of the silicon rod.

The number and arrangement of the single-wire cutting devices 25 and the multi-wire cutting devices 23 in the silicon rod cutting equipment can be changed. For example, in some embodiments, the silicon rod chopping apparatus may comprise a plurality of single-wire cutting devices 25 and one multi-wire cutting device 23, wherein the multi-wire cutting device 23 may be disposed at the rear end of the silicon rod chopping apparatus, and is used for cutting the tail of the silicon rod to be cut to cut the silicon rod slice from which the tail of the silicon rod is obtained. In some embodiments, the silicon rod cutting apparatus may include a plurality of single-wire cutting devices 25 and two multi-wire cutting devices 23, wherein the two multi-wire cutting devices 23 may be respectively disposed at a front end and a rear end of the silicon rod cutting apparatus, and are configured to respectively cut a head portion of the silicon rod to be cut to obtain silicon rod slices at the head portion of the silicon rod and cut a tail portion of the silicon rod to be cut to obtain silicon rod slices at the tail portion of the silicon rod.

The multi-wire cutting device is provided with at least one multi-wire cutting unit, the multi-wire cutting unit comprises a multi-wire cutting wheel, a multi-wire transition wheel and closed-loop cutting wires connected end to end, and the closed-loop cutting wires are wound on the multi-wire cutting wheel and the multi-wire transition wheel to form at least two multi-wire cutting wire saws.

The multi-wire cutting device 23 comprises a wire cutting machine base and a multi-wire cutting unit.

The wire cutting machine base is arranged on the machine base, and the multi-wire cutting unit is arranged on the wire cutting machine base in a lifting mode through the lifting mechanism. The wire cutting machine base is used as a carrier for arranging the multi-wire cutting unit on the machine base, and the specific form of the wire cutting machine base can adopt a beam body, a column body, a plate frame, a bracket and the like.

The multi-wire cutting unit is arranged on the wire cutting machine base in a lifting manner through the lifting mechanism. In certain implementations, the lift mechanism can include a lift rail, a slider, and a lift drive unit.

The multi-wire cutting unit includes: cutting support, first closed loop cutting line, second closed loop cutting line, first multi-wire saw wheel and the multi-wire saw wheel of second, wherein, first closed loop cutting line around first multi-wire saw wheel and the multi-wire saw wheel of second are in order to form first multi-wire saw, second closed loop cutting line around first multi-wire saw wheel and the multi-wire saw wheel of second is in order to form the multi-wire saw of second.

In the embodiment shown in fig. 9, the multi-wire cutting unit further comprises a first multi-wire transition wheel and a second multi-wire transition wheel, which are disposed on the cutting support.

The first multi-line transition wheel is used for reversing or guiding the first closed-loop cutting line, and the second multi-line transition wheel is used for reversing or guiding the second closed-loop cutting line.

Furthermore, the multi-line transition wheel can also be used to adjust the tension of the closed loop cutting wire, i.e. the first multi-line transition wheel can also be used to adjust the tension of the first closed loop cutting wire and the second multi-line transition wheel can also be used to adjust the tension of the second closed loop cutting wire. Accordingly, the multi-wire cutting unit further comprises at least one multi-wire tension adjustment mechanism associated with at least one of the first and second multi-wire transition wheels.

For the specific structure and operation principle of the multi-wire cutting device 23, reference may be made to the description of the multi-wire cutting device in fig. 7 and 8, and further description is omitted here.

Similarly, the silicon rod cutting equipment of this application still include with the silicon rod stabilising arrangement that the wire-electrode cutting device corresponds for avoid waiting to cut the silicon rod by surface damage, surface ripple, collapse limit etc. are produced when the wire-electrode cutting device cuts. In the embodiment shown in fig. 9, the silicon rod cutting apparatus further comprises a silicon rod stabilizing device corresponding to the single-wire cutting device 25 and the multi-wire cutting device 23, and is used for preventing the silicon rod to be cut from surface damage, surface waviness, edge breakage and the like when the silicon rod to be cut is cut by the multi-wire cutting device.

The silicon rod stabilizing device further comprises a first stabilizing component and a second stabilizing component which are arranged at intervals along a first direction, and an indwelling space for accommodating a cutting wire saw in the wire cutting device is arranged between the first stabilizing component and the second stabilizing component. Wherein either of the first and second stabilizing assemblies includes first and second side stabilizing members disposed along a second direction. When waiting to cut the silicon rod and putting in material conveying platform, first side stabilizing means and second side stabilizing means among first stabilizing means and the second stabilizing means can be used for respectively contradicting in wait to cut the relative both sides of silicon rod in order to wait to cut the silicon rod and carry on spacingly, ensure to wait to cut the stability of silicon rod in the silicon rod cuts the operation.

With regard to the specific structure and operation principle of the silicon rod stabilizing device, reference may be made to the foregoing description of the silicon rod stabilizing device in fig. 2 and 3, and further description thereof is omitted here.

As can be seen from the above fig. 1, 6, and 9, the silicon rod chopping apparatus of the present application comprises at least two wire cutting devices, wherein in certain embodiments, the at least two wire cutting devices may each be a single wire cutting device, and in certain embodiments, the at least two wire cutting devices may be a combination of a single wire cutting device and a multi-wire cutting device.

Regarding the single wire cutting device, the single wire cutting device includes a wire cutting base and a single wire cutting unit, wherein the single wire cutting unit includes: the cutting device comprises a cutting bracket, a closed loop cutting line, a first single-line cutting wheel, a second single-line cutting wheel and at least one single-line transition wheel. In the embodiment shown in fig. 1 and 6, the single-wire cutting unit comprises a single-wire transition wheel, i.e. a first single-wire transition wheel, which forms a triangle with the first single-wire cutting wheel and the second single-wire cutting wheel. In the embodiment shown in fig. 9, the single-wire cutting unit includes two single-wire transition wheels, i.e., a first single-wire transition wheel and a second single-wire transition wheel, which form a quadrangle, e.g., a rectangle or a trapezoid, with the first single-wire cutting wheel and the second single-wire cutting wheel. The foregoing is merely exemplary and other variations of the single wire cutting unit are possible.

Referring to fig. 12 and 13, fig. 12 is a schematic structural diagram of a single-wire cutting device according to the present application at a first viewing angle in a further embodiment, and fig. 13 is a schematic structural diagram of a single-wire cutting device according to the present application at a second viewing angle in a further embodiment. In the embodiment shown in fig. 12 and 13, the single wire cutting device includes a wire cutting stand 360 and a single wire cutting unit 36.

The wire cutting machine base is arranged on the machine base, and the single-wire cutting unit 36 is arranged on the wire cutting machine base 360 through the lifting mechanism in a lifting mode. Here, the wire cutting machine base 360 is a carrier on which the single-wire cutting unit 36 is disposed, and the specific form thereof may be a beam, a column, a plate frame, a bracket, or the like.

The single-wire cutting unit 36 is arranged on the wire cutting machine base 360 in a lifting manner through a lifting mechanism. In certain implementations, the lift mechanism can include a lift rail, a slider, and a lift drive unit. The lifting guide rail is arranged on the linear cutting machine base along a third direction, the sliding block is arranged on the single-wire cutting unit 36 and is matched with the corresponding lifting guide rail, and the lifting driving unit is used for enabling the single-wire cutting unit 36 to move up and down along the lifting guide rail. The lifting driving unit may further include a lifting screw rod connected to the single-wire cutting unit 36 along a third direction, and a lifting motor (the lifting motor may be a servo motor, for example) connected to the lifting screw rod. In some implementations, the lift driving unit may include a lift rack, a driving gear engaged with the lift rack, and a driving motor driving the driving gear to rotate.

The single-wire cutting unit includes: the cutting wire saw comprises a cutting support, a closed-loop cutting wire, a first single-wire cutting wheel, a second single-wire cutting wheel and a single-wire transition wheel, wherein the closed-loop cutting wire winds the first single-wire cutting wheel, the second single-wire cutting wheel and the single-wire transition wheel to form a single-wire cutting wire saw. In certain embodiments, the single-wire cutting unit comprises three single-wire transition wheels. As shown in fig. 12, the single-wire cutting unit 36 includes: a cutting carriage 361, a first single-line cutting wheel 362, a second single-line cutting wheel 363, a closed loop cut line 364, a first single-line transition wheel 365, a second single-line transition wheel 366, and a third single-line transition wheel 367.

The cutting support 361 is a carrier provided with a first single-wire cutting wheel 362, a second single-wire cutting wheel 363, a first single-wire transition wheel 365, a second single-wire transition wheel and a third single-wire transition wheel 367, and is configured on the wire cutting machine base 360, and the specific form of the cutting support can adopt a beam body, a plate frame, a support and the like. In addition, the cutting support 361 can be disposed on the wire cutting machine base 360 in a liftable manner through a lifting mechanism, and for the lifting mechanism, reference can be made to the foregoing description, which is not repeated herein. By using the lifting mechanism, the cutting support 361 moves up and down relative to the wire cutting machine base 360 along a third direction, so as to drive the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, the second single-wire transition wheel 366, the third single-wire transition wheel 367 and the single-wire cutting wire saw wound thereon to move up and down, so as to cut the silicon rod to be cut. Furthermore, in some embodiments, the distal end of the cutting support 361, which is relatively far away from the wire cutting machine base, may be further defined by a guide rod structure and guide the cutting support 361 to move up and down under the driving of the lifting mechanism.

The first single-wire cutting wheel and the second single-wire cutting wheel are arranged on two opposite sides of the cutting support along the second direction. In the embodiment shown in fig. 13, the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363 are oppositely disposed at two sides of the bottom of the cutting support 361 along the second direction, and the closed-loop cutting line 364 is wound around the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363 to form a single-wire cutting wire saw, which is disposed along the second direction.

The first single-wire cutting wheel 362 comprises at least one first cutting wire groove, and the plane of any first cutting wire groove is parallel to the wheel surface of the first single-wire cutting wheel, that is, the cutting wire grooves on the first single-wire cutting wheel can be called as first cutting wire grooves.

The second single-wire cutting wheel 363 comprises at least one second cutting wire slot, and the plane of any second cutting wire slot is parallel to the wheel surface of the second single-wire cutting wheel, that is, the cutting wire slots on the second single-wire cutting wheel can be called as second cutting wire slots.

The wheel surface of the first single-wire cutting wheel 362 is parallel to or coplanar with the wheel surface of the second single-wire cutting wheel 363, so that when the closed-loop cutting wire 364 is wound around the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363, the first cutting wire slot and the second cutting wire slot, which are respectively and correspondingly used for winding the closed-loop cutting wire 364, are located in the same plane, and thus, the direction of the single-wire cutting wire saw can be simultaneously located in the plane where the first cutting wire slot and the second cutting wire slot are used for winding the closed-loop cutting wire 364. It should be appreciated that the closed loop cutting wire 364 is in operation during the cutting action and thus the single wire cut wire saw is defined by the spatial location of the closed loop cutting wire saw, which in the present embodiment is a single wire cut wire saw wound between the first single wire cutting wheel 362 and the second single wire cutting wheel 363.

It should be understood that when the closed loop cut line 364 is wound around either single-wire cutting wheel (either the first single-wire cutting wheel 362 or the second single-wire cutting wheel 363), the closed loop cut line 364 on both sides of the single-wire cutting wheel should be located in the plane of the cut line slot in the single-wire cutting wheel for winding the closed loop cut line 364.

The cutting support 361 has a recess at the bottom thereof so that the cutting support 361, the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, and the single-wire cutting wire saw formed around the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363 form a cutting accommodating space corresponding to the silicon rod to be cut.

The first single-wire transition wheel, the second single-wire transition wheel and the third single-wire transition wheel are used for reversing or guiding the closed-loop cutting line. In the embodiment shown in FIG. 13, the first single-line transition wheel 365, the second single-line transition wheel 366, and the third single-line transition wheel 367 are disposed at the top of the cutting carriage 361, wherein the first single-line transition wheel 365 is adjacent to the first single-line cutting wheel 362, the second single-line transition wheel 366 is adjacent to the second single-line cutting wheel 363, and the third single-line transition wheel 367 is adjacent to the first single-line transition wheel 365 and the second single-line transition wheel 366.

Various implementations may be employed with respect to the combination of the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, the second single-wire transition wheel 366, and the third single-wire transition wheel 367. In some embodiments, the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, and the second single-wire transition wheel 366 form a quadrilateral, and the third single-wire transition wheel 367 is located between the first single-wire transition wheel 365 and the second single-wire transition wheel 366. In some examples, the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, and the second single-wire transition wheel 366 form a regular quadrilateral, such as: isosceles trapezoids, rectangles, etc. In some examples, the first single-wire cut wheel 362, the second single-wire cut wheel 363, the first single-wire transition wheel 365, and the second single-wire transition wheel 366 can also form an arbitrary quadrilateral. In some embodiments, the first single line cutting wheel 362, the second single line cutting wheel 363, the first single line transition wheel 365, the second single line transition wheel 366, and the third single line transition wheel 367 form a pentagon that is a regular pentagon, a common pentagon, or any pentagon.

The first single-line transition wheel 365 comprises at least one first transition line groove, and the plane of any first transition line groove is parallel to the surface of the first single-line transition wheel. The second single-line transition wheel 366 includes at least a second transition line slot, and a plane where any one of the second transition line slots is located is parallel to a second single-line transition wheel surface. The third single-wire transition wheel 367 comprises at least one third transition wire slot, and the plane where any third transition wire slot is located is parallel to the wheel surface of the third single-wire transition wheel.

The tread of the first single-wire transition wheel 365, the tread of the second single-wire transition wheel 366, and the tread of the third single-wire transition wheel 367 are parallel to or coplanar with the tread of the first single-wire cutting wheel 362 and the tread of the second single-wire cutting wheel 363, such that when the closed loop cut line 364 is wound around the first single line cut wheel 362, the second single line cut wheel 363, the first single line transition wheel 365, the second single line transition wheel 366, and the third single line transition wheel 367, the first cutting wire slot, the second cutting wire slot, the first transition wire slot, the second transition wire slot, and the third transition wire slot, which are respectively and correspondingly used for winding the closed-loop cutting wire 364, are located in the same plane, thus, the direction of the single-wire cutting wire saw can be simultaneously positioned in the plane of the first cutting wire groove, the second cutting wire groove, the first transition wire groove, the second transition wire groove and the third transition wire groove for winding the closed-loop cutting wire 364. As shown in fig. 12, when the closed-loop cut line 364 is wound around the first single-wire transition wheel 365, the second single-wire transition wheel 366, and the third single-wire transition wheel 367, the closed-loop cut line 364 is led out from the first transition wire slot of the first single-wire transition wheel 365, is folded down into the third transition wire slot of the third single-wire transition wheel 367, and is then folded up into the second transition wire slot of the second single-wire transition wheel 366.

In this way, in this embodiment, the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the second single-wire transition wheel 366, the third single-wire transition wheel 367, and the first single-wire transition wheel 365 of the single-wire cutting unit are wound by the closed-loop cutting line 364, in this example, the single-wire cutting device can omit components such as a take-up drum and a pay-off drum, and the closed-loop cutting line can realize cutting by being driven to run at high speed.

In the existing silicon rod cutting equipment, a cutting line is wound between a cutting wheel and a transition wheel in a line cutting unit from a pay-off drum and wound to a take-up drum from the line cutting unit, the cutting line is driven to run in the cutting process, and the running process of the cutting line is an acceleration process and a deceleration process which are alternately carried out. In the silicon rod cutting equipment, the closed-loop cutting line in the line cutting unit can keep running continuously at a high speed, and meanwhile, the closed-loop cutting line can run in the same running direction in the cutting process. Therefore, the linear cutting unit can realize high-precision cutting operation, and the problems that the cutting surface is corrugated and the like due to the operation reversing or the operation speed of the cutting line in the conventional cutting mode are solved; meanwhile, the closed loop cutting line can effectively reduce the total length of the cutting line required by the line cutting unit, avoid parts such as a take-up cylinder, a pay-off cylinder and the like, and reduce the production cost.

In the single-wire cutting unit of the present application, a cutting wire driving mechanism is further included for driving the closed-loop cutting wire 364 wound around the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the second single-wire transition wheel 366, the third single-wire transition wheel 367, and the first single-wire transition wheel 365 to run at a high speed.

In some embodiments, at least one of the first single-wire cutter wheel 362, the second single-wire cutter wheel 363, the first single-wire transition wheel 365, the second single-wire transition wheel 366, and the third single-wire transition wheel 367 is used as a driving wheel, and the other is used as a driven wheel, wherein the driving wheel is associated with the cutting-wire driving mechanism, and the driving wheel is driven by the cutting-wire driving mechanism to rotate and drive the closed-loop cutting wire 364 to run at a high speed in cooperation with the other driven wheels.

In certain implementations, the first single-wire cutting wheel 362 or the second single-wire cutting wheel 363 can be used as a drive wheel. Taking the first single-wire cutting wheel 362 as an example of a drive wheel, the first single-wire cutting wheel 362 is associated with a cutting-wire drive mechanism operable to drive the first single-wire cutting wheel 362 in rotation. In some examples, the cutting wire driving mechanism includes a driving motor having a motor shaft directly connected to a wheel shaft of the first single-wire cutting wheel 362, and the first single-wire cutting wheel 362 is rotated by the motor shaft of the driving motor, and the closed loop cutting wire 364 is carried to run and rotate the second single-wire cutting wheel 363, the second single-wire transition wheel 366, the third single-wire transition wheel 367, and the first single-wire transition wheel 365, so that the closed loop cutting wire 364 runs at a high speed. In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on a motor shaft of the driving motor and a wheel shaft of the first single-wire cutting wheel, under the rotation of the driving motor, the motor shaft of the driving motor drives the transmission belt to run and then drives the first single-wire cutting wheel 362 to rotate, the closed loop cutting wire 364 is driven to run and enables the second single-wire cutting wheel 363, the second single-wire transition wheel 366, the third single-wire transition wheel 367 and the first single-wire transition wheel 365 to rotate, and the high-speed running of the closed loop cutting wire 364 is realized.

In some implementations, the first single-wire transition wheel 365, the second single-wire transition wheel 366, or the third single-wire transition wheel 367 may be used as the drive wheel. Taking the first single-wire transition wheel 365 as an example of a drive wheel, the first single-wire transition wheel 365 is associated with a cut-wire drive mechanism that may be used to drive the first single-wire transition wheel 365 in rotation. In some examples, the cutting wire drive mechanism includes a drive motor having a motor shaft directly coupled to the axle of the first single-wire transition wheel 365, whereby rotation of the drive motor causes the first single-wire transition wheel 365 to rotate, causing the closed loop cutting wire 364 to be entrained and rotate the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the second single-wire transition wheel 366, and the third single-wire transition wheel 367 to effect high speed travel of the closed loop cutting wire 364. In some examples, the cutting wire driving mechanism includes a driving motor and a transmission belt, the transmission belt is sleeved on a motor shaft of the driving motor and a wheel shaft of the first single-wire transition wheel, the transmission belt is driven by the motor shaft of the driving motor to operate and then drives the first single-wire transition wheel 365 to rotate under the rotation of the driving motor, the closed loop cutting wire 364 is driven to operate and enables the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the second single-wire transition wheel 366 and the third single-wire transition wheel 367 to rotate, and the high-speed operation of the closed loop cutting wire 364 is realized.

In addition, the single-wire transition wheel can also be used for adjusting the tension of the closed-loop cutting line. Accordingly, the single-wire cutting unit further includes a single-wire tension adjustment mechanism associated with the at least one single-wire transition wheel.

In certain embodiments, the single-wire cutting unit 36 further includes a single-wire tension adjustment mechanism associated with at least one of the first single-wire transition wheel, the second single-wire transition wheel, and the third single-wire transition wheel.

Please refer to fig. 13, which is a schematic structural diagram of a single-line cutting device according to an embodiment of the present application at a second viewing angle. Referring to fig. 12 and 13, the single-wire cutting unit 36 includes a single-wire tension adjustment mechanism associated with the third single-wire transition wheel 367.

The single wire tension adjusting mechanism includes: the single-wire driving unit 371 and the single-wire connecting rod assembly are associated with the third single-wire transition wheel 367 and the single-wire driving unit 371, and the single-wire connecting rod assembly is controlled by the single-wire driving unit, namely, the single-wire driving unit 371 drives the single-wire connecting rod assembly to actuate so as to drive the third single-wire transition wheel to generate position change to adjust the tension of the closed-loop cutting wire 364.

In the embodiment shown in fig. 12 and 13, the single-wire link assembly includes: a pivot 372, a first link 374, and a second link 376.

The pivot 372 is disposed on the cutting carriage 361.

A first end of the first link 374 is associated with the pivot 372 and a second end of the first link 374 is connected to the third single-wire transition wheel 367.

A first end of the second link 376 is associated with the pivot 372 and a second end of the second link 376 is connected to the single wire drive unit.

Through the single-wire link assembly, a lever effect can be achieved, and the position of the third single-wire transition wheel 367 can be adjusted.

With respect to the single wire drive unit, in certain implementations, the single wire drive unit 371 includes a weight (referenced as 371 in the following description), which 371 may be suspended from the second end of the second link 376. For example, when the tension of the closed loop cut line 364 is to be increased, the counterweight 371 is lifted, the second end of the second link 376 is controlled to lift and drive the pivot 372 to rotate in a forward direction (e.g., counterclockwise in fig. 13), the pivot 372 rotating in the forward direction drives the first link 374 and the third single-wire transition wheel 367 associated therewith to move in a direction close to the first single-wire cutting wheel 362 and the second single-wire cutting wheel 363 (e.g., downward), the circumference formed by the third single-wire transition wheel 367 and the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, and the second single-wire transition wheel 366 is enlarged, and the tension of the closed loop cut line 364 is increased; when the tension of the closed loop cutting line 364 is to be reduced, the counterweight 371 is released, the counterweight 371 descends, the second end of the second link 376 drives the pivot 372 to rotate in the opposite direction (clockwise in fig. 13) under the action of the gravity of the counterweight 371, the pivot 372 in the opposite direction drives the first link 374 and the third wire transition wheel 367 associated therewith to move in a direction away from the first wire transition wheel 365 and the second wire transition wheel 366 (e.g., upward), the circumference formed by the first wire transition wheel 365 and the first wire cutting wheel 362, the second wire cutting wheel 363 and the second wire transition wheel 366 is reduced, and the tension of the closed loop cutting line 364 is reduced.

The counterweight part may include a counterweight frame and counterweights disposed in the configuration frame, wherein the number of the counterweights may be changed according to the requirement of the tension adjustment of the closed-loop cutting line 364, for example, when the tension of the closed-loop cutting line 364 is increased, the number of the counterweights may be increased, and when the tension of the closed-loop cutting line 364 is decreased, the number of the counterweights may be decreased.

The deployment frame is movable up and down relative to the cutting carriage 361 by means of a lifting rail.

In some embodiments, the weight may include a locking mechanism for locking the weight such that the weight is stationary relative to the cutting carriage 361, such that the weight and cutting carriage 361 are switched from an active state to a locked state. In some examples, the locking mechanism may be a latch, for example.

In certain embodiments, the weight may include a single wire tension balancing member for ensuring that the tension of the weight and the closed loop cut line 364 are in equilibrium. In the embodiment shown in fig. 13, the single-wire tension adjusting mechanism further includes a single-wire tension balancing member 373, the single-wire tension balancing member 373 is a tension balancing cylinder (in the following description, the tension balancing cylinder is denoted as 373), and the tension balancing cylinder 373 acts on the second link 376.

For example, when the tension of the closed loop cutting line 364 is to be increased, the second link 376 is lifted up by the cylinder shaft of the tension balancing cylinder 373, the counterweight and the second link 376 are lifted up, and the pivot 372 is driven to rotate in a forward direction (counterclockwise in fig. 13), the pivot 372 in the forward direction drives the first link 374 and the third single-wire transition wheel 367 associated therewith to move in a direction close to the first single-wire transition wheel 365 and the second single-wire transition wheel 366 (e.g., downward), the circumference formed by the third single-wire transition wheel 367 and the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, and the second single-wire transition wheel 366 is enlarged, the tension of the closed loop cutting line is increased, and the cylinder shaft is stopped at the current position by the tension balancing cylinder 373 until the tension of the closed loop cutting line 364 is adjusted to a desired value, such that the counterweight 371 and the second link 376 no longer move, i.e., remain stationary relative to the cutting carriage 361. When the tension of the closed loop cutting line 364 is to be reduced, the counterweight portion 371 is released, the counterweight portion 371 descends, the second end of the second link 376 drives the pivot 372 to rotate in the opposite direction (clockwise in fig. 13) under the action of the gravity of the counterweight portion 371, the pivot 372 rotates in the opposite direction and then drives the first link 374 and the third wire transition wheel 367 associated therewith to move in a direction away from the first wire transition wheel 365 and the second wire transition wheel 366 (e.g., upward), the circumference formed by the first wire transition wheel 365 and the first wire cutting wheel 362, the second wire cutting wheel 363 and the second wire transition wheel 366 is reduced, the tension of the closed loop cutting line 364 is reduced, and when the tension of the closed loop cutting line 364 is adjusted to a desired value, the cylinder shaft is extended by the tension balancing cylinder 373 and is pressed against the second link 376, such that the counterweight 371 and the second link 376 no longer move, i.e., remain stationary relative to the cutting carriage 361.

Still other variations of the single wire drive unit are possible, for example, in some implementations, the single wire drive unit may include a pull cylinder positioned below the second link and having a cylinder shaft connected to the second end of the second link. For example, when the tension of the closed loop cut line 364 is to be increased, the pulling cylinder extends out of the cylinder axis, the second end of the second link 376 is controlled to lift and drive the pivot 372 to rotate in a forward direction (e.g., counterclockwise in fig. 13), the pivot 372 rotating in the forward direction drives the first link 374 and the associated third single-wire transition wheel 367 to move in a direction (e.g., downward) close to the first single-wire transition wheel 365 and the second single-wire transition wheel 366, thereby expanding the circumference formed by the third single-wire transition wheel 367 and the first single-wire cutting wheel 362, the second single-wire cutting wheel 363, the first single-wire transition wheel 365, and the second single-wire transition wheel 366 and increasing the tension of the closed loop cut line 364. When the tension of the closed loop cutting line 364 is to be reduced, the pulling cylinder retracts the cylinder shaft, pulling the second link 376 and causing the pivot 372 to rotate in a reverse direction (clockwise in fig. 13), the pivot 372 rotating in the reverse direction causes the first link 374 and the associated first strand transition wheel 365 to move in a direction away from the first strand cutting wheel 362 and the second strand cutting wheel 363 (e.g., upward), reducing the circumference formed by the first strand transition wheel 365 and the first strand cutting wheel 362, the second strand cutting wheel 363, and the second strand transition wheel 366, and reducing the tension of the closed loop cutting line 364.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. A silicon rod chopping apparatus, comprising:

a machine base;

the material conveying table is arranged on the base and used for bearing the silicon rod to be cut and driving the silicon rod to be cut to be conveyed along a first direction, wherein the axis of the silicon rod to be cut is parallel to the first direction; and

at least two linear cutting devices which are mutually independent and arranged at intervals along a first direction; the wire cutting device includes: the wire cutting machine base is arranged on the machine base; the wire cutting unit is arranged on the wire cutting machine base in a lifting way through a lifting mechanism; the wire cutting unit comprises a cutting wheel, a transition wheel and a closed-loop cutting wire connected end to end, and the closed-loop cutting wire winds the cutting wheel and the transition wheel to form a cutting wire saw.

2. The silicon rod chopping apparatus as set forth in claim 1, wherein the material conveying table comprises a roller assembly and a motor assembly for controlling the roller assembly.

3. The silicon rod truncating apparatus of claim 2, wherein the roller assembly comprises: the roller pairs are arranged at intervals along the first direction, and each roller pair comprises two rollers connected through a rotating shaft.

4. The silicon rod chopping apparatus as recited in claim 3, wherein the roller assembly is divided into a plurality of roller assembly sections.

5. The silicon rod chopping apparatus as claimed in claim 1, wherein the silicon rod chopping apparatus comprises at least two single-wire cutting devices having a single-wire cutting unit comprising:

cutting the stent;

a closed loop cutting line;

the first single-wire cutting wheel and the second single-wire cutting wheel are arranged on two opposite sides of the cutting support along the second direction, and the wheel surfaces of the first single-wire cutting wheel and the second single-wire cutting wheel are parallel or coplanar; and

at least one single line transition wheel;

wherein the closed loop cutting wire is wound around the first single wire cutting wheel, the second single wire cutting wheel and the at least one transition wheel to form a single wire cutting wire saw; the first direction is perpendicular to the wheel surfaces of the first single-wire cutting wheel and the second single-wire cutting wheel, and the second direction is perpendicular to the first direction.

6. The silicon rod chopping apparatus as recited in claim 5, wherein the single-wire cutting unit comprises a first single-wire transition wheel that forms a triangle with the first single-wire cutting wheel and a second single-wire cutting wheel.

7. The silicon rod chopping apparatus as recited in claim 5, wherein the single-wire cutting unit comprises a first single-wire transition wheel adjacent to the first single-wire cutting wheel and a second single-wire transition wheel adjacent to the second single-wire cutting wheel, the first single-wire transition wheel, the second single-wire transition wheel, and the second single-wire cutting wheel and the first single-wire cutting wheel forming a quadrilateral.

8. The silicon rod chopping apparatus as recited in claim 5, wherein the single-wire cutting unit comprises a first single-wire transition wheel adjacent to the first single-wire cutting wheel, a second single-wire transition wheel adjacent to the second single-wire cutting wheel, and a third single-wire transition wheel between the first single-wire transition wheel and the second single-wire transition wheel.

9. The silicon rod chopping apparatus as recited in claim 5, wherein the single-wire cutting unit further comprises a single-wire tension adjustment mechanism associated with the at least one single-wire transition wheel.

10. The silicon rod truncating apparatus of claim 9, wherein the single line tension adjusting mechanism comprises:

a single-wire drive unit; and

a single wire link assembly associated with the single wire transition wheel and the single wire drive unit; the single-wire connecting rod assembly is controlled by the single-wire driving unit to adjust the position of the single-wire transition wheel so as to adjust the tension of the closed-loop cutting wire.

11. The silicon rod truncating apparatus of claim 10, wherein the single-wire link assembly comprises:

the pivot is arranged on the cutting bracket;

a first link, a first end of the first link associated with the pivot, a second end of the first link connected with the single-line transition wheel; and

a second link, a first end of the second link associated with the pivot, a second end of the second link connected with the single wire drive unit.

12. The silicon rod truncating apparatus of claim 10, wherein the single line drive unit comprises a weight or a pulling cylinder.

13. The silicon rod truncating apparatus of claim 10, wherein the single line tension adjusting mechanism further comprises a single line tension balancing member.

14. The silicon rod truncating apparatus of claim 5, further comprising at least one multi-wire cutting device having a multi-wire cutting unit comprising:

cutting the stent;

a first closed loop cut line and a second closed loop cut line;

the first multi-wire cutting wheel and the second multi-wire cutting wheel are arranged on two opposite sides of the cutting support along a second direction, wheel surfaces of the first multi-wire cutting wheel and the second multi-wire cutting wheel are parallel or coplanar, the first multi-wire cutting wheel is provided with at least two wire grooves, and the second multi-wire cutting wheel is provided with at least two wire grooves; and

at least one first multi-line transition wheel and at least one second multi-line transition wheel;

wherein the first closed loop cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and the at least one first multi-wire transition wheel to form a first multi-wire cutting wire saw, the second closed loop cutting wire is wound around the first multi-wire cutting wheel, the second multi-wire cutting wheel and the at least one second multi-wire transition wheel to form a second multi-wire cutting wire saw, the first multi-wire cutting wire saw is parallel to the second multi-wire cutting wire saw, and a wire spacing is formed between the first multi-wire cutting wire saw and the second multi-wire cutting wire saw; the first direction is perpendicular to the tread of the first and second multi-wire sawing wheels and the second direction is perpendicular to the first direction.

15. The silicon rod chopping apparatus as set forth in claim 14, wherein the multi-wire cutting unit comprises a first multi-wire transition wheel and a second multi-wire transition wheel, the first multi-wire transition wheel and the first and second multi-wire cutting wheels forming a triangle, and the second multi-wire transition wheel and the first and second multi-wire cutting wheels forming a triangle.

16. The silicon rod chopping apparatus as recited in claim 14, wherein the multi-wire cutting unit comprises two first multi-wire transition wheels and two second multi-wire transition wheels, the two first multi-wire transition wheels and the first multi-wire cutting wheel form a quadrilateral, and the two second multi-wire transition wheels and the first multi-wire cutting wheel and the second multi-wire cutting wheel form a quadrilateral.

17. The silicon rod truncation apparatus of claim 14 wherein the multi-wire cutting unit further comprises at least one multi-wire tension adjustment mechanism associated with at least one of the at least one first multi-wire transition wheel and at least one second multi-wire transition wheel.

18. The silicon rod truncating apparatus of claim 17, wherein the multi-line tension adjusting mechanism comprises:

a multi-line driving unit; and

a multi-wire linkage assembly associated with the multi-wire drive unit and the corresponding first or second multi-wire transition wheel; the multi-wire linkage assembly is controlled by the multi-wire drive unit to adjust the position of the first or second multi-wire transition wheel to adjust the tension of the closed loop cutting wire.

19. The silicon rod truncating apparatus of claim 18, wherein the multi-wire link assembly comprises:

the pivot is arranged on the cutting bracket;

a first link, a first end of the first link being associated with the pivot, a second end of the first link being connected to the first or second multi-line transition wheel; and

a second link, a first end of the second link being associated with the pivot, a second end of the second link being connected with the multi-wire drive unit.

20. The silicon rod truncating apparatus of claim 18, wherein the multi-wire drive unit comprises a counterweight or a pulling cylinder.

21. The silicon rod truncating apparatus of claim 18, wherein the multi-line tension adjusting mechanism further comprises a multi-line tension balancing member.

22. The silicon rod truncation apparatus of claim 1 wherein the wire cutting device further comprises a cutting wire drive mechanism for driving the closed loop cutting wire to operate to cut the silicon rod to be cut.

23. The silicon rod truncation apparatus according to claim 1, further comprising a silicon rod stabilizing device corresponding to the wire cutting device, for stabilizing the silicon rod to be cut when the wire cutting device cuts the silicon rod to be cut.

24. The silicon rod truncating apparatus of claim 23, wherein the silicon rod stabilizing device comprises a first stabilizing member and a second stabilizing member spaced apart in a first direction, and an indwelling space for receiving a cutting wire saw in the wire cutting device is provided between the first stabilizing member and the second stabilizing member.

25. The silicon rod truncating apparatus of claim 24, wherein any one of the first stabilizing assembly and the second stabilizing assembly comprises a first side stabilizing member and a second side stabilizing member arranged along the second direction for respectively abutting against opposite sides of the silicon rod to be cut.

26. The silicon rod truncating apparatus of claim 25, wherein any one of the first side stabilizing member and the second side stabilizing member comprises:

a workpiece support block; and

and the workpiece auxiliary supporting block is controlled by the supporting block driving unit to move along the second direction so as to stretch and retract relative to the workpiece supporting block.

27. The silicon rod truncating apparatus of claim 1, further comprising a position adjusting device for adjusting a position of the at least one linear cutting device.

28. The silicon rod truncating apparatus of claim 27, wherein the position adjusting device comprises:

the movable guide rail is arranged on the base along a first direction;

the slide block is arranged on the at least one linear cutting device; and

and the moving driving unit is used for driving the at least one linear cutting device to move along the moving guide rail.

29. The silicon rod truncation apparatus according to claim 1, further comprising a detection device for detecting the axial center levelness of the silicon rod to be cut placed on the material transport table.

30. The silicon rod truncation apparatus of claim 29, further comprising a leveling device for leveling an axis of the silicon rod to be cut placed on the material transport table according to a detection result of the detection device.

31. The silicon rod cutting method is applied to silicon rod cutting equipment, the silicon rod cutting equipment comprises a machine base, a material conveying table and at least two mutually independent wire cutting devices, wire cutting units in the wire cutting devices comprise cutting wheels, transition wheels and end-to-end closed loop cutting lines, the closed loop cutting lines form a cutting wire saw after the cutting wheels and the transition wheels, and the silicon rod cutting method comprises the following steps:

placing a silicon rod to be cut on a material conveying table, wherein the axis of the silicon rod is parallel to the first direction;

the material conveying table is used for driving the silicon rod to be cut to be conveyed to a cutting position along a first direction; and

and independently driving part or all of the at least two wire cutting devices, so that the cutting wire saws in the part or all of the wire cutting devices perform cutting operation on the silicon rod to form the silicon rod sections.

32. The silicon rod truncation method according to claim 31, wherein the silicon rod truncation apparatus further includes a silicon rod stabilizing device corresponding to the wire cutting device, and the silicon rod truncation method further includes the steps of:

before independently driving some or all of the at least two wire cutting devices, driving a silicon rod stabilizing device corresponding to the wire cutting device to stabilize the silicon rod to be cut.