WO2022099545A1 - 一种天线组件和电子设备 - Google Patents

一种天线组件和电子设备 Download PDF

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Publication number
WO2022099545A1
WO2022099545A1 PCT/CN2020/128393 CN2020128393W WO2022099545A1 WO 2022099545 A1 WO2022099545 A1 WO 2022099545A1 CN 2020128393 W CN2020128393 W CN 2020128393W WO 2022099545 A1 WO2022099545 A1 WO 2022099545A1
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WO
WIPO (PCT)
Prior art keywords
antenna unit
branch
coplanar waveguide
radio frequency
frequency chip
Prior art date
Application number
PCT/CN2020/128393
Other languages
English (en)
French (fr)
Inventor
邓冰洁
洪国锋
Original Assignee
广州视源电子科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州视源电子科技股份有限公司 filed Critical 广州视源电子科技股份有限公司
Priority to EP20961102.9A priority Critical patent/EP4089836A4/en
Priority to KR1020227022110A priority patent/KR102687557B1/ko
Priority to PCT/CN2020/128393 priority patent/WO2022099545A1/zh
Priority to CN202080078438.5A priority patent/CN114766071B/zh
Priority to AU2020477004A priority patent/AU2020477004B2/en
Priority to JP2022540345A priority patent/JP7418586B2/ja
Publication of WO2022099545A1 publication Critical patent/WO2022099545A1/zh
Priority to US17/846,308 priority patent/US12074369B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H01Q1/46—Electric supply lines or communication lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/528—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the re-radiation of a support structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/357—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using a single feed point
    • H01Q5/364—Creating multiple current paths
    • H01Q5/371—Branching current paths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/378—Combination of fed elements with parasitic elements
    • H01Q5/385—Two or more parasitic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • the present invention relates to the technical field of antennas, and in particular, to an antenna assembly and an electronic device.
  • wireless communication technology has been applied to many electronic devices.
  • the wireless data transmission function in electronic devices requires the support of radio frequency devices.
  • the performance of radio frequency devices directly determines the communication modes that electronic devices can support and the strength of received signals. stability.
  • the antenna is interfered by the power supply, the display screen, the communication module on the main board and the cable in the whole electronic equipment, so that the antenna cannot radiate electromagnetic waves efficiently.
  • the radiated electromagnetic waves can also interfere with the performance of the display screen, cause screen flicker, or interfere with other electronic components in the electronic device.
  • the interference sources other than the antenna are mostly shielded, such as the power supply, the main board, the transmitting module and other devices.
  • the interference noise will also interfere with the coaxial transmission line between the antenna and the RF chip, or the interference noise will pass through the whole system.
  • the reflection and refraction of the metal back cover will eventually affect the antenna, which cannot fundamentally solve the problem of radiation interference of the antenna.
  • Adding metal shields to components other than the antenna will also increase the assembly cost.
  • the purpose of the embodiments of the present invention is to provide an antenna assembly and an electronic device, so as to solve the problems that the prior art cannot fundamentally solve the problems that the antenna is interfered by radiation and the assembly cost is high.
  • an antenna assembly including:
  • the antenna unit is arranged on the surface of the dielectric substrate
  • the radio frequency chip is disposed on the surface of the medium substrate, and the radio frequency chip is connected with the antenna unit;
  • a metal shield is disposed on the surface of the dielectric substrate facing away from the antenna unit, and covers the antenna unit.
  • an embodiment of the present invention provides an electronic device, the electronic device includes a display screen, a frame arranged around the display screen, and at least one antenna assembly according to the first aspect, where the antenna assembly is located in the The electronic device is connected to the frame, wherein the side of the dielectric substrate in the antenna assembly that is not provided with the metal shield faces the frame.
  • the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, and a metal shielding cover is arranged.
  • the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit and covers the antenna unit, The other electronic devices of the electronic equipment can be isolated by the metal shield to cause electromagnetic interference to the antenna unit;
  • the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, avoiding the use of coaxial cables to connect the antenna unit and the radio frequency chip, fundamentally It solves the problem that the antenna unit is subject to electromagnetic interference and ensures the radiation performance of the antenna unit;
  • the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit.
  • the antenna unit is shielded towards the metal
  • the electromagnetic waves radiated in the direction of the cover are shielded by the metal shielding cover, and the electromagnetic waves radiated by the antenna unit are radiated to the outside of the electronic device.
  • other electronic devices in the electronic device do not need to be provided with a shielding cover, which reduces the manufacturing cost of the electronic device.
  • FIG. 1 is a schematic diagram of the overall structure of an antenna assembly according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an exploded structure of an antenna assembly according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of the positions of an antenna unit and a metal shield in an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a connection between an antenna unit and a transmission line in an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a connection between an antenna unit and a transmission line in another embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a connection between an antenna unit and a transmission line in another embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the connection between the antenna unit and the transmission line in still another embodiment of the present invention.
  • FIG. 8 is a schematic view of the front structure of the electronic device in the present invention.
  • FIG. 9 is a schematic diagram of a rear structure of an electronic device in the present invention.
  • FIG. 10 is a partial exploded schematic diagram of the installation place of the antenna assembly in the embodiment of the present invention.
  • Fig. 11 is the enlarged schematic diagram of part A in Fig. 10;
  • Fig. 12 is the schematic diagram of the avoidance hole of the lower frame in part A in Fig. 10;
  • Dielectric substrate 2. Antenna unit; 21, First antenna unit; 211, First feed branch; 212, First short circuit branch; 213, First branch; 214, L-shaped branch; 215, First parasitic branch; 22, second antenna unit; 221, main body; 222, second short circuit branch; 223, second feed branch; 224, second branch; 225, third branch; 226, second parasitic branch; 227, fourth branch; 228, L-shaped feeder; 23, third antenna unit; 24, fourth antenna unit; 3, metal shield; 4, radio frequency chip; 41, first radio frequency chip; 42, second radio frequency chip; 5. Coplanar waveguide transmission line; 51.
  • connection should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements.
  • connection may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements.
  • specific meanings of the above terms in the present invention can be understood in specific situations.
  • a first feature "on” or “under” a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
  • an antenna assembly includes a dielectric substrate 1 , an antenna unit 2 , a radio frequency chip 4 , and a metal shield 3 .
  • the antenna unit 2 and the radio frequency chip 4 are disposed on the surface of the dielectric substrate 1 .
  • the antenna unit 2 and the radio frequency chip 4 are connected by a transmission line, and the metal shield 3 is arranged on the surface of the dielectric substrate 1 facing away from the antenna unit 2 .
  • the dielectric substrate 1 can be a PCB board of an antenna assembly
  • the antenna unit 2 can be a unit that radiates electromagnetic waves
  • the antenna unit 2 can be a metal sheet with a set shape printed on the surface of the dielectric substrate 1, for example, it can be printed on a medium Copper sheets of various shapes on the surface of the substrate 1, wherein the antenna unit 2 can be electrically connected to the radio frequency chip 4 through a transmission line, such as through a transmission line printed on the dielectric substrate 1 to achieve electrical connection between the antenna unit 2 and the radio frequency chip 4.
  • the metal shielding cover 3 can be a cover body stamped from a metal material such as stainless steel or galvanized steel sheet, the metal shielding cover 3 can cover the antenna unit 2 and is provided with an opening for the antenna unit 2 to radiate and receive electromagnetic waves.
  • the antenna unit 2 can radiate electromagnetic waves in all directions, and the entire antenna assembly ultimately requires electromagnetic waves to be radiated on the side (the F side in FIG. 3 ) of the dielectric substrate 1 where the antenna unit 2 is arranged, As shown in FIG. 3 , in the embodiment of the present invention, the antenna unit 2 can radiate electromagnetic waves in all directions, and the entire antenna assembly ultimately requires electromagnetic waves to be radiated on the side (the F side in FIG. 3 ) of the dielectric substrate 1 where the antenna unit 2 is arranged, As shown in FIG. 3 , in the embodiment of the present invention, the antenna unit 2 can radiate electromagnetic waves in all directions, and the entire antenna assembly ultimately requires electromagnetic waves to be radiated on the side (the F side in FIG. 3 ) of the dielectric substrate 1 where the antenna unit 2 is arranged, As shown in FIG.
  • the metal shield 3 can be disposed on the surface of the dielectric substrate 1 facing away from the antenna unit 2 and cover the antenna unit 2, so that the electromagnetic waves radiated by the antenna unit 2 are directed to the side of the dielectric substrate 1 where the antenna unit 2 is disposed ( The electromagnetic wave radiated from the antenna unit 2 to the metal shielding cover 3 is shielded by the metal shielding cover 3, and the metal shielding cover 3 will not affect the electromagnetic wave radiated by the antenna unit 2, and can avoid other electronic devices. Electromagnetic interference of the antenna unit 2, and avoiding electromagnetic interference to other electronic devices when the antenna unit 2 radiates electromagnetic waves.
  • the antenna unit 2 and the radio frequency chip 4 are arranged on the same dielectric substrate 1, and there is no need to use a coaxial cable to connect the antenna unit. 2 and RF chip 4, fundamentally solve the problem of electromagnetic interference caused by the use of coaxial cables in antenna unit 2. Furthermore, other electronic devices do not need to add shielding covers, which reduces the use and installation procedures of shielding covers, and reduces the need for electronic devices. The manufacturing cost of the device.
  • the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, and a metal shielding cover is arranged.
  • the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit and covers the antenna unit, The other electronic devices of the electronic equipment can be isolated by the metal shield to cause electromagnetic interference to the antenna unit;
  • the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, avoiding the use of coaxial cables to connect the antenna unit and the radio frequency chip, fundamentally It solves the problem that the antenna unit is subject to electromagnetic interference and ensures the radiation performance of the antenna unit;
  • the metal shielding cover is arranged on the surface of the dielectric substrate facing away from the antenna unit.
  • the antenna unit is shielded towards the metal
  • the electromagnetic waves radiated in the direction of the cover are shielded by the metal shielding cover, and the electromagnetic waves radiated by the antenna unit are radiated to the outside of the electronic device.
  • other electronic devices in the electronic device do not need to be provided with a shielding cover, which reduces the manufacturing cost of the electronic device.
  • the number of antenna units 2 may be one or more than one, and the antenna unit 2 and the radio frequency chip 4 may be connected by a microstrip transmission line or a coplanar waveguide transmission line, wherein the microstrip transmission line is suitable for microwave
  • the circuit with relatively narrow frequency band, and the circuit structure of the microstrip transmission line is simple, insensitive to the processing technology of the dielectric substrate, the thickness of the copper layer and the thickness difference, and the manufacturing cost is low.
  • the grounded coplanar waveguide transmission line has good anti-interference, and has relatively low radiation loss in the high frequency band and can achieve good high-order mode suppression, making the grounded coplanar waveguide transmission line suitable for high frequency transmission of 30GHz and above.
  • the microstrip transmission line or the coplanar waveguide transmission line may also be provided with an impedance matching circuit, for example, a ⁇ -shaped matching circuit may be provided.
  • an impedance matching circuit for example, a ⁇ -shaped matching circuit may be provided.
  • the antenna unit 2 and the radio frequency chip 4 can be arranged on different surfaces of the dielectric substrate 1 , and the radio frequency chip 4 can be connected to the transmission line through metal vias, which can make full use of the space on both sides of the dielectric substrate 1 for arrangement
  • the radio frequency chip 4 and the antenna unit 2 reduce the area of the dielectric substrate 1 , and can be applied to scenarios where the space of the electronic equipment is limited, so that the antenna unit 2 and the radio frequency chip 4 cannot be arranged on the same surface of the dielectric substrate 1 .
  • the antenna unit 2 and the radio frequency chip 4 can also be arranged on the same surface of the dielectric substrate 1 , and the pins of the radio frequency chip 4 can be directly connected to the transmission line, so there is no need to provide metal vias on the dielectric substrate 1 , which reduces the cost of the dielectric substrate 1 .
  • the manufacturing cost is also suitable for the scenario where the antenna unit 2 and the radio frequency chip 4 are arranged on the same surface of the dielectric substrate 1 due to space constraints on the entire electronic device. In practical applications, those skilled in the art can set the antenna unit 2 and the radio frequency chip 4 on the same surface or on different surfaces according to actual needs, which is not limited in this embodiment of the present invention.
  • the metal shielding cover 3 can be connected to the dielectric substrate 1 by welding, snapping, locking screws, etc.
  • the contact surface between the metal shielding cover 3 and the dielectric substrate 1 Electromagnetic shielding performance of shield 3.
  • ⁇ is the wavelength of the electromagnetic wave, so that the electromagnetic wave radiated by the antenna unit 2 is reflected when it reaches the bottom of the metal shielding cover 3 and changes the propagation direction, and the phase of the reflected electromagnetic wave is inverted by 180°
  • the phase change of the electromagnetic wave corresponding to the quarter-wavelength path is 90°, and the two quarter-wave paths change the phase twice for a total of 180°.
  • phase of the electromagnetic wave is also flipped by 180° after one reflection, realizing the electromagnetic wave 360°.
  • the phase of ° is reversed, and the phase of the electromagnetic wave reaching the antenna unit 2 after reflection is consistent with the phase radiated by the antenna unit 2 in the forward direction, thereby forming the effect of directional radiation.
  • the number of the antenna units 2 is two, and the transmission line adopts a coplanar waveguide transmission line as an example to describe the structure of the antenna unit 2 and the routing of the transmission line in the embodiment of the present invention.
  • the dielectric substrate 1 is provided with a coplanar waveguide transmission line 5 on the surface where the antenna unit 2 is provided, and the antenna unit 2 and the first radio frequency chip 41 are connected through the coplanar waveguide transmission line 5 , wherein the coplanar waveguide transmission line 5 includes coplanar waveguide feed lines (51, 53) and coplanar waveguide ground planes (52, 54) located on both sides of the coplanar waveguide feed lines (51, 53), and the antenna unit 2 passes through the coplanar waveguide feed lines (51, 53).
  • the planar waveguide feed lines (51, 53) are connected to the first radio frequency chip 41, and the coplanar waveguide ground planes (52, 54) may be metal layers disposed on the dielectric substrate 1, such as copper, and preferably, the coplanar waveguide
  • the ground planes (52, 54) are connected as a whole, and the coplanar waveguide ground planes (52, 54) are connected to the ground 7 on the other side of the dielectric substrate 1 through the metal vias 8 on the dielectric substrate 1, wherein the coplanar waveguide is connected to the ground plane 7 on the other side of the dielectric substrate 1.
  • the metal vias 8 connecting the ground (52, 54) to the ground 7 may be set according to actual conditions, which is not limited in the embodiment of the present invention.
  • the antenna unit 2 includes a first antenna unit 21 and a second antenna unit 22
  • the coplanar waveguide feed line includes a first coplanar waveguide feed line 51 and a second antenna unit 22 .
  • the coplanar waveguide feed line 53 , the coplanar waveguide ground plane includes a first coplanar waveguide ground plane 52 located on both sides of the first coplanar waveguide feed line 51 , and a second coplanar waveguide ground plane 52 located on both sides of the second coplanar waveguide feed line 53 .
  • the planar waveguide grounding plane 54 wherein the first coplanar waveguide feed line 51 and the second coplanar waveguide feed line 53 are both provided with impedance matching circuits.
  • the first antenna unit 21 and the second antenna unit 22 are located on the same side of the first radio frequency chip 41 , and the first antenna unit 21 is located between the second antenna unit 22 and the first radio frequency chip 41 ,
  • the first antenna unit 21 is connected to the first radio frequency chip 41 through the first coplanar waveguide feed line 51 , the first antenna unit 21 is grounded through the first coplanar waveguide ground plane 52 , and the second antenna unit 22 is fed through the second coplanar waveguide.
  • the wire 53 is connected to the first radio frequency chip 41 , and when the second antenna unit 22 needs to be grounded, the second antenna unit 22 can be grounded through the second coplanar waveguide ground plane 54 .
  • the pins of the first radio frequency chip 41 can be connected to the first coplanar waveguide feed line 51 and the second coplanar waveguide feeder.
  • the wires 53 are directly connected.
  • the pins of the first radio frequency chip 41 are connected to the first coplanar waveguide feeder 51 and the second coplanar waveguide feeder. 53 can be connected through metal vias.
  • the first coplanar waveguide feed line 51 is located on the side of the first antenna unit 21 close to the first radio frequency chip 41 and is perpendicular to the bottom edge of the dielectric substrate 1 .
  • the first antenna unit 21 includes a first feed stub 211 and a first short-circuit stub 212 that are perpendicular to the first coplanar waveguide feed line 51 .
  • a short-circuit branch 212 is connected to the first coplanar waveguide ground plane 52, the first feed branch 211 is connected to the first coplanar waveguide feed line 51, and the first short-circuit branch 212 and the first feed branch 211 are far away from the first coplanar waveguide
  • One end of the feed line 51 is connected through the first branch 213
  • an L-shaped branch 214 is also provided between the first short-circuit branch 212 and the first feed branch 211 , and one end of the L-shaped branch 214 is vertically connected to the first short-circuit branch 212 , the other end of the L-shaped branch 214 is vertically connected to the first branch 213,
  • the first short-circuit branch 212 is also provided with a first parasitic branch 215, and the first parasitic branch 215 is perpendicular to the first short-circuit branch 212 and is connected to the first branch
  • the nodes 213 are arranged in parallel and spaced apart, and the first parasitic branch 215 extends from one end of the first short-
  • first antenna unit 21 is illustrated in conjunction with FIG. 4 and FIG. 5 , in practical applications, those skilled in the art can also set the first antenna unit 21 of any structure.
  • the structure of the first antenna unit 21 is not limited, and the connection method between the first antenna unit 21 and the coplanar waveguide transmission line is also not limited.
  • the second coplanar waveguide feed line 53 is parallel to the bottom edge of the dielectric substrate 1 , wherein the bottom edge can be any edge of the square dielectric substrate 1 , as shown in FIG. 4 .
  • the dielectric substrate 1 is a rectangle, and the long side of the rectangle is the bottom side.
  • the second antenna unit 22 includes a square body 221 provided with a second short-circuit branch 222 extending to the second coplanar waveguide ground plane 54 , and a second short circuit stub 222 extending to the second coplanar waveguide feed line 53
  • the second feeder branch 223 , the second short-circuit branch 222 and the second feeder branch 223 are arranged in parallel and spaced apart, the second short-circuit branch 222 is arranged away from the first RF chip 41 , and the second feeder branch 223 is arranged close to the first RF chip 41
  • the main body 221 is further provided with a second branch 224 and a third branch 225 extending from the main body 221 to the first antenna unit 21.
  • the second branch 224 and the third branch 225 are arranged in parallel and spaced apart, and the second branch 224 is close to the second branch 224.
  • the coplanar waveguide feeder 53 is provided, the third stub 225 is arranged away from the second coplanar waveguide feeder 53, the third stub 225 is provided with a second parasitic stub 226, and the second parasitic stub 226 is located at the third stub 225 away from the third stub 225.
  • One side of the two coplanar waveguide feed lines 53 is spaced parallel to the third branch 225 , and the second parasitic branch 226 extends from the end of the third branch 225 away from the main body 221 toward the main body 221 .
  • the second coplanar waveguide feed line 53 is parallel to the bottom edge of the dielectric substrate 1
  • the second antenna unit 22 includes a square body 221
  • the body 221 is away from the second coplanar waveguide feeder
  • Two corners of one end of the wire 53 are respectively provided with a second branch 224 and a third branch 225
  • the second branch 224 is located on the side of the main body 221 away from the first radio frequency chip 41
  • the third branch 225 is located on the main body 221 close to the first radio frequency chip 41.
  • the second branch 224 is parallel to the second coplanar waveguide feeder 53 and extends away from the main body 221
  • the third branch 225 is perpendicular to the second coplanar waveguide feeder 53 And it extends in the direction of the second coplanar waveguide feed line 53 .
  • One end of the second branch 224 away from the main body 221 is provided with a fourth branch 227 extending toward the second coplanar waveguide feed line 53 .
  • the fourth stub 227 is further provided with an L-shaped feeder 228, the L-shaped feeder 228 is located between the fourth stub 227 and the main body 221, one end of the L-shaped feeder 228 is connected to the fourth stub 227, and the other end is connected to the second coplanar waveguide
  • the feeder 53 is connected.
  • One end of the third branch 225 close to the second coplanar waveguide feed line 53 is provided with a second parasitic branch 226 , and the second parasitic branch 226 extends away from the first One end of the radio frequency chip 41 extends, and the second parasitic branch 226 is parallel to the second branch 224 .
  • the structure of the second antenna unit 22 is illustrated in conjunction with FIG. 4 and FIG. 5 , in practical applications, those skilled in the art can also set the second antenna unit 22 of any structure, such as a second antenna
  • the structure of the unit 22 may be the same as that of the first antenna unit 21 , and the example of the present invention does not limit the structure of the second antenna unit 22 .
  • an isolation ground plane 6 is further provided between the first antenna element 21 and the second antenna element 22, and one end of the isolation ground plane 6 is connected to the coplanar waveguide ground plane (52 , 54) connection, the other end is connected to the ground 7 on the other side of the dielectric substrate 1 through the metal via 8 on the dielectric substrate 1, and the isolation of the first antenna unit 21 and the second antenna unit 22 can be improved by isolating the ground plane 6.
  • the antenna unit 2 includes two antenna units and the transmission line is a coplanar waveguide transmission line as an example to illustrate the structure of the antenna unit 2, the structure of the transmission line and the routing, in practical applications, those skilled in the art can set the antenna according to actual needs.
  • the number of units 2 antenna units with different structures, and transmission lines with different layouts, the embodiments of the present invention do not limit the number and structure of the antenna units, nor do the structures and routing methods of the transmission lines.
  • FIG. 6 is a schematic diagram of another antenna assembly according to an example of the present invention.
  • the antenna assembly of the embodiment of the present invention includes In addition to the chip 41, the antenna assembly further includes a third antenna unit 23 and a fourth antenna unit 24, the radio frequency chip 4 further includes a second radio frequency chip 42, and the coplanar waveguide feed line further includes a third coplanar waveguide feed line 55 and a fourth coplanar waveguide feed line 55.
  • the second radio frequency chip 42 is located on the side of the first radio frequency chip 41 away from the first antenna unit 21, and the third antenna unit 23 and the fourth antenna unit 24 are located in the second radio frequency chip 42 away from the first radio frequency
  • the third antenna unit 23 is located between the second radio frequency chip 42 and the fourth antenna unit 24, the third antenna unit 23 and the first antenna unit 21 are mirror images of each other, and the fourth antenna unit 24 and the second antenna
  • the units 22 are mirror images of each other
  • the third antenna unit 23 is connected to the second RF chip 42 through the third coplanar waveguide feeder 55
  • the fourth antenna unit 24 is connected to the second RF chip 42 through the fourth coplanar waveguide feeder 56
  • being a mirror image of each other may mean that the third antenna unit 23 and the first antenna unit 21 are mirror images of each other in structure, and the fourth antenna unit 24 and the second antenna unit 22 are mirror images of each other in structure.
  • the structures of the third antenna unit 23 and the fourth antenna unit 24 may also be other structures
  • the antenna assembly of the embodiment of the present invention includes a first antenna unit 21 , a second antenna unit 22 , a third antenna unit 23 , a fourth antenna unit 24 , a first radio frequency chip 41 and a second radio frequency chip 42 , and the second radio frequency chip 42 is located in
  • the first radio frequency chip 41 is located on the side away from the first antenna unit 21
  • the third antenna unit 23 and the fourth antenna unit 24 are located on the side of the second radio frequency chip 42 away from the first radio frequency chip 41
  • the third antenna unit 23 is located on the second radio frequency chip 42.
  • the antenna assembly includes a first group of antennas (the first antenna unit 21 and the second antenna unit 22) and a second group of antenna units (the third antenna unit 23 and the fourth antenna unit 22).
  • the antenna unit 24) can realize the wireless AP function (Access Point, wireless access point), and furthermore, the first group of antennas (the first antenna unit 21 and the second antenna unit 22) and the second group of antenna units (the third antenna unit).
  • There are two radio frequency chips (the first radio frequency chip 41 and the second radio frequency chip 42) between the unit 23 and the fourth antenna unit 24) the distance between the two groups of antennas is large, the isolation of the two groups of antennas is high, and the area of the entire antenna assembly Small.
  • FIG. 7 is a schematic diagram of another antenna assembly according to an embodiment of the present invention.
  • the antenna assembly includes the first antenna unit 21, the second antenna unit 22 and the first antenna unit shown in FIG. 4 or FIG. 5
  • the antenna assembly further includes a third antenna unit 23 and a fourth antenna unit 24, the radio frequency chip 4 further includes a second radio frequency chip 42, and the coplanar waveguide feeder line also includes a third coplanar waveguide feeder line 55 and a fourth The coplanar waveguide feed line 56, wherein the second radio frequency chip 42 is located on the side of the first radio frequency chip 41 away from the first antenna unit 21, and the third antenna unit 23 and the fourth antenna unit 24 are located on the second radio frequency chip 42 and the first antenna unit 21.
  • the third antenna unit 23 has the same structure as the first antenna unit 21
  • the fourth antenna unit 24 has the same structure as the second antenna unit 22
  • the third antenna unit 23 is located between the second radio frequency chip 42 and the fourth antenna unit 24
  • the third antenna unit 23 is connected to the second radio frequency chip 42 through the third coplanar waveguide feed line 55
  • the fourth antenna unit 24 is connected to the second radio frequency chip 42 through the fourth coplanar waveguide feed line 56 .
  • the structures of the third antenna unit 23 and the fourth antenna unit 24 may also be other structures, which are not limited in this embodiment of the present invention.
  • the antenna assembly of the embodiment of the present invention includes a first antenna unit 21 , a second antenna unit 22 , a third antenna unit 23 , a fourth antenna unit 24 , a first radio frequency chip 41 and a second radio frequency chip 42 , and the second radio frequency chip 42 is located in The first radio frequency chip 41 is away from the side of the first antenna unit 21, and the third antenna unit 23 and the fourth antenna unit 24 are located between the second radio frequency chip 42 and the first radio frequency chip 41.
  • the antenna assembly includes a first group of The antennas (the first antenna unit 21 and the second antenna unit 22) and the second group of antenna units (the third antenna unit 23 and the fourth antenna unit 24) can realize the wireless AP function (Access Point, wireless access point), and then Alternatively, the two groups of antennas can be increased by increasing the distance between the first group of antennas (the first antenna element 21 and the second antenna element 22) and the second group of antenna elements (the third antenna element 23 and the fourth antenna element 24).
  • the isolation degree increases, and the area of the dielectric substrate increases, which is suitable for scenarios where the installation space of antenna components is not limited.
  • an embodiment of the present invention provides an electronic device 100 .
  • the electronic device 100 includes a display screen 101 , a frame 102 disposed around the display screen 101 , and at least one antenna assembly 103 provided in an example of the present invention.
  • the antenna assembly 103 is located in the electronic device 100 and connected to the frame 102 , wherein the side of the dielectric substrate of the antenna assembly 103 that is not provided with a metal shield faces the frame 102 , that is, the antenna assembly 103 radiates electromagnetic waves to the outside of the electronic device 100 .
  • the display screen 101 may be one of LCD, LED, OLED and other display screens
  • the frame 102 may be a frame surrounding the display screen 101
  • the frame 102 has a certain thickness in the direction perpendicular to the display screen 101 .
  • the antenna assembly 103 can be installed on the frame 102.
  • the number of the antenna assembly 103 can be one or more than one.
  • the antenna unit and the radio frequency chip of the antenna assembly are arranged on the same dielectric substrate, and a metal shield is provided, the antenna assembly is located in the electronic device and connected to the frame, and the dielectric substrate in the antenna assembly is not provided The side with the metal shield faces the frame.
  • the metal shield is arranged on the surface of the dielectric substrate facing away from the antenna unit and covers the antenna unit.
  • the metal shield can be used to isolate other electronic devices of the electronic device and cause electromagnetic interference to the antenna unit; Secondly, the antenna unit and the radio frequency chip are arranged on the same dielectric substrate, avoiding the use of coaxial cables to connect the antenna unit and the radio frequency chip, fundamentally solving the problem of electromagnetic interference of the antenna unit, and ensuring the radiation performance of the antenna unit; again The metal shield is arranged on the surface of the dielectric substrate facing away from the antenna unit. After the antenna assembly is installed in the whole electronic equipment, the electromagnetic waves radiated by the antenna unit towards the metal shield are shielded by the metal shield, and the electromagnetic waves radiated by the antenna unit are directed to the electronic equipment. Radiated from the outside of the device, the electromagnetic waves radiated by the antenna unit will not interfere with the display screen, causing the display screen to flicker, nor will it interfere with other electronic devices inside the electronic device; manufacturing cost of electronic equipment.
  • the number of antenna units in the antenna assembly can be one or more, the antenna unit and the radio frequency chip can be arranged on the same surface or different surfaces of the dielectric substrate, and the electronic device can be installed according to the installation space of the antenna assembly, radiation performance and radiation direction. Select an antenna assembly.
  • the frame 102 of the electronic device 100 includes a lower frame 1021, the antenna assembly 103 is detachably connected to the lower frame 1021, and the dielectric substrate 1 in the antenna assembly 103 is not provided with One side of the metal shield 3 faces the bottom surface of the lower frame 1021 .
  • the material of the lower frame 1021 can be metal, and the bottom surface of the lower frame 1021 is provided with an avoidance hole 10211 facing the antenna assembly 103, so that after the antenna assembly 103 is installed on the lower frame 1021, the dielectric substrate 1 in the antenna assembly 103 is not
  • the side provided with the metal shield 3 faces the avoidance hole 10211 , and the antenna unit on the antenna assembly 103 can radiate electromagnetic waves to the outside of the electronic device 100 through the avoidance hole 10211 .
  • the antenna assembly 103 can also be installed on other frames of the electronic device 100, for example, it can be installed on the left frame or the right frame, and the side of the dielectric substrate 1 in the antenna assembly 103 that is not provided with the metal shield 3 can also be connected to the display
  • the front faces of the screen 101 are in the same direction, and the embodiment of the present invention does not limit the installation position and orientation of the antenna assembly 103 .
  • the antenna assembly in the embodiment of the present invention is located on the lower frame of the electronic device.
  • the side of the dielectric substrate 1 in the antenna assembly that is not provided with the metal shield faces the bottom surface of the lower frame.
  • the lower frame has sufficient installation space, which can facilitate the installation of the antenna assembly.
  • the lower frame of the electronic device is closer to the user, and the antenna assembly is located on the lower frame with a wide radiation area, which improves the wireless network performance of the electronic device.
  • the electronic device 100 further includes a decorative piece 104 covering the avoidance hole 10211 to prevent the avoidance hole 10211 from directly exposing the dielectric substrate 1 of the antenna assembly 103 , so that the electronic device 100 has a good appearance.

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Abstract

本发明实施例公开了一种天线组件和电子设备，天线组件包括介质基板；天线单元，天线单元设置在介质基板的表面上；射频芯片，射频芯片设置在介质基板的表面上，射频芯片与天线单元连接；以及金属屏蔽罩，金属屏蔽罩设置在介质基板背向天线单元的表面上，并且覆盖天线单元。一方面，可以通过金属屏蔽罩隔离电子设备的其他电子器件对天线单元造成电磁干扰，并且天线单元和射频芯片设置在同一块介质基板上避免了使用同轴电缆线连接天线单元和射频芯片，从根本上解决了天线单元受电磁干扰的问题，保证了天线单元的辐射性能，另一方面，电子设备中其他电子器件无需设置屏蔽罩，降低了电子设备的制造成本。

Description

一种天线组件和电子设备 技术领域
本发明涉及天线技术领域，尤其涉及一种天线组件和电子设备。
背景技术
随着科技的进步，无线通信技术被应用在众多电子设备中，电子设备中的无线数据传输功能需要射频器件的支持，射频器件的性能直接决定了电子设备可以支持的通信模式以及接收信号的强度稳定性。
天线作为射频器件中接收和发送电磁波的单元，在电子设备整机中却因为受到电源、显示屏、主板上通信模块和排线等器件的干扰，导致天线无法高效的辐射电磁波，同时，天线全向辐射的电磁波也会干扰到显示屏的性能导致闪屏，或者干扰电子设备内的其他电子器件。
传统技术中多是将天线以外的干扰源进行屏蔽，如将电源，主板，发射模块等器件进行屏蔽，然而干扰噪声还会干扰到天线和射频芯片之间的同轴传输线，或者干扰噪声通过整机金属后盖进行反射、折射最终影响到天线，无法从根本解决天线受辐射干扰问题，对天线以外的器件增加金属屏蔽罩还会增加装配成本。
发明内容
本发明实施例的目的在于：提供一种天线组件和电子设备，以解决现有技术无法从根本上解决天线受辐射干扰，以及装配成本高的问题。
为达此目的，本发明实施例采用以下技术方案：
第一方面，提供一种天线组件，包括：
介质基板；
天线单元，所述天线单元设置在所述介质基板的表面上；
射频芯片，所述射频芯片设置在所述介质基板的表面上，所述射频芯片与所述天线单元连接；以及
金属屏蔽罩，所述金属屏蔽罩设置在所述介质基板背向所述天线单元的表面上，并且覆盖所述天线单元。
第二方面，本发明实施例提供了一种电子设备，所述电子设备包括显示屏、设置在所述显示屏四周的边框以及至少一个第一方面所述的天线组件，所述天线组件位于所述电子设备内且与所述边框连接，其中，所述天线组件中介质基板未设置有金属屏蔽罩的一面朝向所述边框。
本发明实施例的天线组件，天线单元和射频芯片设置在同一块介质基板上，且设置有金属屏蔽罩，首先，该金属屏蔽罩设置在介质基板背向天线单元的表面上并且覆盖天线单元，可以通过金属屏蔽罩隔离电子设备的其他电子器件对天线单元造成电磁干扰；其次，天线单元和射频芯片设置在同一块介质基板上避免了使用同轴电缆线连接天线单元和射频芯片，从根本上解决了天线单元受电磁干扰的问题，保证了天线单元的辐射性能；再次，金属屏蔽罩设置在介质基板背向天线单元的表面上，天线组件安装于电子设备整机后，天线单元朝金属屏蔽罩方向辐射的电磁波被金属屏蔽罩所屏蔽，天线单元辐射的电磁波向电子设备外部辐射，天线单元辐射的电磁波不会干扰到显示屏导致显示屏闪屏，也不会干扰到电子设备整机内部的其他电子器件；最后，电子设备中其他电子器件无需设置屏蔽罩，降低了电子设备的制造成本。
附图说明
下面根据附图和实施例对本发明作进一步详细说明。
图1为本发明实施例的天线组件的整体结构示意图；
图2为本发明实施例天线组件的分解结构示意图；
图3为本发明实施例中天线单元与金属屏蔽罩的位置示意图；
图4为本发明实施例中天线单元与传输线的连接示意图；
图5为本发明另一实施例中天线单元与传输线的连接示意图；
图6为本发明又一实施例中天线单元与传输线的连接示意图；
图7为本发明再一实施例中天线单元与传输线的连接示意图；
图8为本发明中电子设备的正面结构示意图；
图9为本发明中电子设备的背面结构示意图；
图10为本发明实施例中天线组件安装处的局部分解示意图；
图11为图10中局部A的放大示意图；
图12为图10中局部A中下边框的避让孔的示意图；
图中：
1、介质基板；2、天线单元；21、第一天线单元；211、第一馈电枝节；212、第一短路枝节；213、第一枝节；214、L形枝节；215、第一寄生枝节；22、第二天线单元；221、主体；222、第二短路枝节；223、第二馈电枝节；224、第二枝节；225、第三枝节；226、第二寄生枝节；227、第四枝节；228、L形馈电线；23、第三天线单元；24、第四天线单元；3、金属屏蔽罩；4、射频芯片；41、第一射频芯片；42、第二射频芯片；5、共面波导传输线；51、第一共面波导馈电线；52、第一共面波导接地面；53、第二共面波导馈电线；54、第二共面波导接地面；55、第三共面波导馈电线；56、第四共面波导馈电线；6、隔离 接地面；7、地面；8、金属过孔；100、电子设备；101、显示屏；102、边框；1021、下边框；10211、避让孔；103、天线组件；104、装饰件。
具体实施方式
为使本发明解决的技术问题、采用的技术方案和达到的技术效果更加清楚，下面将结合附图对本发明实施例的技术方案作进一步的详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，除非另有明确的规定和限定，术语“相连”、“连接”、“固定”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
如图1和图2所示，本发明实施例的一种天线组件包括介质基板1、天线单元2、射频芯片4以及金属屏蔽罩3，天线单元2和射频芯片4设置在介质基板 1的表面，天线单元2和射频芯片4通过传输线连接，金属屏蔽罩3设置在介质基板1背向天线单元2的表面上。
其中，介质基板1可以是天线组件的PCB板，天线单元2可以是辐射电磁波的单元，天线单元2可以是印刷在介质基板1的表面上具有设定形状的金属片，例如可以是印刷在介质基板1的表面上各种形状的铜片，其中，天线单元2可以通过传输线与射频芯片4电连接，如通过印刷在介质基板1上的传输线实现天线单元2和射频芯片4的电连接。金属屏蔽罩3可以是不锈钢、镀锌钢板板等金属材质冲压而成的罩体，该金属屏蔽罩3可覆盖天线单元2并且设置有供天线单元2辐射和接收电磁波的开口。
如图3所示，在本发明实施例中，天线单元2可以全向辐射电磁波，整个天线组件最终要求在介质基板1设置有天线单元2的一侧(图3中的F侧)辐射电磁波，如图3所示，金属屏蔽罩3可以设置在介质基板1背向天线单元2的表面上并覆盖天线单元2，使得天线单元2辐射的电磁波向介质基板1设置有天线单元2的一侧(图3中F侧)的方向辐射出去，天线单元2向金属屏蔽罩3辐射的电磁波被金属屏蔽罩3屏蔽，金属屏蔽罩3既不会影响天线单元2辐射电磁波，又可以避免其他电子器件对天线单元2的电磁干扰，以及避免天线单元2辐射电磁波时对其他电子器件造成电磁干扰，另外，天线单元2和射频芯片4设置在同一块介质基板1上，无需使用同轴电缆线连接天线单元2和射频芯片4，从根本上解决了天线单元2使用同轴电缆线受电磁干扰的问题，再者，其他电子器件也无需增加屏蔽罩，减少了屏蔽罩的使用和安装工序，降低了电子设备的制造成本。
本发明实施例的天线组件，天线单元和射频芯片设置在同一块介质基板上，且设置有金属屏蔽罩，首先，该金属屏蔽罩设置在介质基板背向天线单元的表 面上并且覆盖天线单元，可以通过金属屏蔽罩隔离电子设备的其他电子器件对天线单元造成电磁干扰；其次，天线单元和射频芯片设置在同一块介质基板上避免了使用同轴电缆线连接天线单元和射频芯片，从根本上解决了天线单元受电磁干扰的问题，保证了天线单元的辐射性能；再次，金属屏蔽罩设置在介质基板背向天线单元的表面上，天线组件安装于电子设备整机后，天线单元朝金属屏蔽罩方向辐射的电磁波被金属屏蔽罩所屏蔽，天线单元辐射的电磁波向电子设备外部辐射，天线单元辐射的电磁波不会干扰到显示屏导致显示屏闪屏，也不会干扰到电子设备整机内部的其他电子器件；最后，电子设备中其他电子器件无需设置屏蔽罩，降低了电子设备的制造成本。
在本发明的可选实施例中，天线单元2的数量可以为一个或者一个以上，天线单元2与射频芯片4可以通过微带传输线或者共面波导传输线连接，其中，微带传输线可适用于微波频段带宽相对较窄的电路，并且微带传输线电路结构简单，对介质基板加工工艺、铜层厚度及厚度差异不敏感，制造成本低。接地共面波导传输线抗干扰性良好，且在高频波段具有相对较低辐射损耗以及能够实现良好的高阶模抑制，使得接地共面波导传输线适用于30GHz及以上高频段的传输。
优选地，微带传输线或者共面波导传输线上还可以设置有阻抗匹配电路，例如可以设置π形匹配电路。通过设置阻抗匹配电路，可以在天线组件频偏后调正频率，还可以使得天线组件与有源器件匹配，以提升天线组件的整体辐射性能。
在另一可选实施例中，天线单元2和射频芯片4可以设置在介质基板1的不同表面上，射频芯片4可以通过金属过孔与传输线连接，能够充分利用介质基板1两面的空间来布置射频芯片4和天线单元2，减小介质基板1的面积，并 且可以适用于电子设备整机空间受限，导致天线单元2和射频芯片4无法设置在介质基板1同一个表面上的场景。
当然，天线单元2和射频芯片4也可以设置在介质基板1的同一表面上，射频芯片4的引脚可以与传输线直接连接，无需在介质基板1上设置金属过孔，降低了介质基板1的制造成本，同时适用于电子设备整机上因空间受限导致天线单元2和射频芯片4设置在介质基板1同一表面上的场景。在实际应用中，本领域技术人员可以根据实际需要将天线单元2和射频芯片4设置在同一表面上或者不同表面上，本发明实施例对此不加以限制。
在实际应用中，金属屏蔽罩3可以通过焊接、卡扣、锁螺丝等方式与介质基板1连接，可选地，金属屏蔽罩3和介质基板1的接触面还可以设置有导电布以提高金属屏蔽罩3的电磁屏蔽性能。
在一个优选实施例中，金属屏蔽罩3的底部到天线单元2的距离等于天线单元2辐射的电磁波的四分之一波长，如图3所示，L＝λ/4，其中，L为金属屏蔽罩3的底部到天线单元2的距离，λ为电磁波的波长，这样使得天线单元2辐射的电磁波到达金属屏蔽罩3的底部时被反射而改变传播方向，反射一次电磁波的相位翻转180°，四分之一波长路径对应的电磁波的相位变化为90°，两个四分之一的路径变化两次相位合计180°，再加上反射一次后电磁波的相位也翻转180°，实现了电磁波360°的相位翻转，反射后到达天线单元2的电磁波相位与天线单元2正向辐射的相位达到一致，从而形成定向辐射的效果。
以下以天线单元2的数量为两个，传输线采用共面波导传输线为示例说明本发明实施例中天线单元2的结构以及传输线的走线。
如图4和图5所示，在一个示例中，介质基板1在设置有天线单元2的表面上设置有共面波导传输线5，天线单元2和第一射频芯片41通过共面波导传 输线5连接，其中，共面波导传输线5包括共面波导馈电线(51，53)和位于共面波导馈电线(51，53)两侧的共面波导接地面(52，54)，天线单元2通过共面波导馈电线(51，53)与第一射频芯片41连接，共面波导接地面(52，54)可以是设置在介质基板1上的金属层，例如可以是铜，优选地，共面波导接地面(52，54)连接为一个整体，并且共面波导接地面(52，54)通过介质基板1上的金属过孔8与介质基板1另一面的地面7连接，其中，共面波导接地面(52，54)与地面7连接的金属过孔8可以根据实际情况进行设置，本发明实施例对此不加以限制。
如图4和图5所示，在一个可选的示例中，天线单元2包括第一天线单元21和第二天线单元22，共面波导馈电线包括第一共面波导馈电线51和第二共面波导馈电线53，共面波导接地面包括位于第一共面波导馈电线51两侧的第一共面波导接地面52，以及位于第二共面波导馈电线53两侧的第二共面波导接地面54，其中，第一共面波导馈电线51和第二共面波导馈电线53上均设置有阻抗匹配电路。
如图4和图5所示，第一天线单元21和第二天线单元22位于第一射频芯片41的同侧，第一天线单元21位于第二天线单元22和第一射频芯片41之间，第一天线单元21通过第一共面波导馈电线51与第一射频芯片41连接，第一天线单元21通过第一共面波导接地面52接地，第二天线单元22通过第二共面波导馈电线53与第一射频芯片41连接，在第二天线单元22需要接地时，第二天线单元22可以通过第二共面波导接地面54接地。
需要说明的是，当第一射频芯片41和天线单元2设置在介质基板1的同一面时，第一射频芯片41的引脚可以与第一共面波导馈电线51、第二共面波导馈电线53直接连接，当第一射频芯片41和天线单元2设置在介质基板1的不同 面时，第一射频芯片41的引脚与第一共面波导馈电线51、第二共面波导馈电线53可以通过金属过孔连接。
如图4和图5所示，在本发明的一个示例中，第一共面波导馈电线51位于第一天线单元21靠近第一射频芯片41的一侧，且与介质基板1的底边垂直。第一天线单元21包括垂直于第一共面波导馈电线51的第一馈电枝节211和第一短路枝节212，第一短路枝节212和第一馈电枝节211等长且平行间隔设置，第一短路枝节212与第一共面波导接地面52连接，第一馈电枝节211与第一共面波导馈电线51连接，第一短路枝节212和第一馈电枝节211远离第一共面波导馈电线51的一端通过第一枝节213连接，第一短路枝节212和第一馈电枝节211之间还设置有L形枝节214，L形枝节214的一端垂直连接在第一短路枝节212上，L形枝节214的另一端垂直连接在第一枝节213上，第一短路枝节212还设置有第一寄生枝节215，第一寄生枝节215与第一短路枝节212垂直，且与第一枝节213平行间隔设置，第一寄生枝节215自第一短路枝节212远离第一共面波导馈电线51的一端向介质基板底边的方向延伸。
需要说明的是，虽然结合图4和图5对第一天线单元21的结构进行了示例说明，在实际应用中，本领域技术人员还可以设置任意结构的第一天线单元21，本发明示例对第一天线单元21的结构不加以限制，对第一天线单元21与共面波导传输线的连接方式亦不加以限制。
如图4所示，在一个可选示例中，第二共面波导馈电线53与介质基板1的底边平行，其中，该底边可以是方形介质基板1的任意一条边，如图4所示，介质基板1为矩形，矩形的长边即为底边。
在图4中，第二天线单元22包括一方形的主体221，主体221设置有延伸至第二共面波导接地面54的第二短路枝节222，以及延伸至第二共面波导馈电 线53的第二馈电枝节223，第二短路枝节222和第二馈电枝节223平行且间隔设置，第二短路枝节222远离第一射频芯片41设置，第二馈电枝节223靠近第一射频芯片41设置，主体221还设置有自主体221向第一天线单元21延伸的第二枝节224和第三枝节225，第二枝节224和第三枝节225平行且间隔设置，第二枝节224靠近第二共面波导馈电线53设置，第三枝节225远离第二共面波导馈电线53设置，第三枝节225设置有第二寄生枝节226，第二寄生枝节226位于第三枝节225远离第二共面波导馈电线53的一侧，且与第三枝节225平行间隔设置，第二寄生枝节226自第三枝节225远离主体221的一端向主体221的方向延伸。
如图5所示，在另一个示例中，第二共面波导馈电线53与介质基板1的底边平行，第二天线单元22包括一方形的主体221，主体221远离第二共面波导馈电线53的一端的两个角分别设置有第二枝节224和第三枝节225，第二枝节224位于主体221远离射第一射频芯片41的一侧，第三枝节225位于主体221靠近第一射频芯片41的一侧，第二枝节224与第二共面波导馈电线53平行，且自主体221向远离主体221的方向延伸，第三枝节225与第二共面波导馈电线53垂直且向第二共面波导馈电线53的方向延伸。第二枝节224远离主体221的一端设置有向第二共面波导馈电线53延伸的第四枝节227。第四枝节227还设置有L形馈电线228，L形馈电线228位于第四枝节227与主体221之间，L形馈电线228一端与第四枝节227连接，另一端与第二共面波导馈电线53连接。第三枝节225靠近第二共面波导馈电线53的一端设置有第二寄生枝节226，第二寄生枝节226自第三枝节225靠近第二共面波导馈电线53的一端向远离第一射频芯片41的一端延伸，且第二寄生枝节226与第二枝节224平行。
需要说明的是，虽然结合图4和图5对第二天线单元22的结构进行了示例 说明，在实际应用中，本领域技术人员还可以设置任意结构的第二天线单元22，如第二天线单元22可以与第一天线单元21的结构相同，本发明示例对第二天线单元22的结构不加以限制。
如图4和图5所示，在一个优选的实施例中，第一天线单元21和第二天线单元22之间还设置有隔离接地面6，隔离接地面6一端与共面波导接地面(52，54)连接，另一端通过介质基板1上的金属过孔8与介质基板1另一面的地面7连接，通过隔离接地面6可以提高第一天线单元21和第二天线单元22的隔离度。
虽然以上以天线单元2包含两个天线单元，传输线为共面波导传输线为示例说明了天线单元2的结构、传输线的结构和走线，在实际应用中，本领域技术人员可以根据实际需要设置天线单元2的数量、设计不同结构的天线单元以及布局不同的传输线，本发明实施例对天线单元的数量、结构不加以限制，对传输线的结构和走线方式亦不加以限制。
如图6所示为本发明示例的另一种天线组件的示意图，本发明实施例的天线组件除了包含图4或图5所示的第一天线单元21、第二天线单元22以及第一射频芯片41以外，天线组件还包括第三天线单元23和第四天线单元24，射频芯片4还包括第二射频芯片42，共面波导馈电线还包括第三共面波导馈电线55和第四共面波导馈电线56，其中，第二射频芯片42位于第一射频芯片41远离第一天线单元21的一侧，第三天线单元23和第四天线单元24位于第二射频芯片42远离第一射频芯片41的一侧，第三天线单元23位于第二射频芯片42和第四天线单元24之间，第三天线单元23与第一天线单元21互为镜像，第四天线单元24与第二天线单元22互为镜像，第三天线单元23通过第三共面波导馈电线55与第二射频芯片42连接，第四天线单元24通过第四共面波导馈电线56 与第二射频芯片42连接，其中，互为镜像可以是指第三天线单元23与第一天线单元21在结构上互为镜像，第四天线单元24与第二天线单元22在结构上互为镜像。当然，第三天线单元23与第四天线单元24的结构还可以是其他结构，本发明实施例对此不加以在限制。
本发明实施例的天线组件包括第一天线单元21、第二天线单元22、第三天线单元23、第四天线单元24、第一射频芯片41以及第二射频芯片42，第二射频芯片42位于第一射频芯片41远离第一天线单元21的一侧，第三天线单元23和第四天线单元24位于第二射频芯片42远离第一射频芯片41的一侧，第三天线单元23位于第二射频芯片42和第四天线单元24之间，一方面，天线组件包括第一组天线(第一天线单元21和第二天线单元22)和第二组天线单元(第三天线单元23和第四天线单元24)，可以实现无线AP功能(Access Point，无线接入点)，再者，第一组天线(第一天线单元21和第二天线单元22)和第二组天线单元(第三天线单元23和第四天线单元24)中间有两个射频芯片(第一射频芯片41和第二射频芯片42)，两组天线的距离较大，两组天线的隔离度高，整个天线组件的面积小。
如图7所示为本发明实施例的另一种天线组件的示意图，本发明实施例的天线组件除了包含图4或图5所示的第一天线单元21、第二天线单元22以及第一射频芯片41以外，天线组件还包括第三天线单元23和第四天线单元24，射频芯片4还包括第二射频芯片42，共面波导馈电线还包括第三共面波导馈电线55和第四共面波导馈电线56，其中，第二射频芯片42位于第一射频芯片41远离第一天线单元21的一侧，第三天线单元23和第四天线单元24位于第二射频芯片42和第一射频芯片41之间，第三天线单元23与第一天线单元21结构相同，第四天线单元24与第二天线单元22结构相同，第三天线单元23位于第二 射频芯片42和第四天线单元24之间，第三天线单元23通过第三共面波导馈电线55与第二射频芯片42连接，第四天线单元24通过第四共面波导馈电线56与第二射频芯片42连接。当然，第三天线单元23与第四天线单元24的结构还可以是其他结构，本发明实施例对此不加以在限制。
本发明实施例的天线组件包括第一天线单元21、第二天线单元22、第三天线单元23、第四天线单元24、第一射频芯片41以及第二射频芯片42，第二射频芯片42位于第一射频芯片41远离第一天线单元21的一侧，第三天线单元23和第四天线单元24位于第二射频芯片42和第一射频芯片41之间，一方面，天线组件包括第一组天线(第一天线单元21和第二天线单元22)和第二组天线单元(第三天线单元23和第四天线单元24)，可以实现无线AP功能(Access Point，无线接入点)，再者，可以通过增加第一组天线(第一天线单元21和第二天线单元22)和第二组天线单元(第三天线单元23和第四天线单元24)之间的距离来提高两组天线的隔离度，介质基板的面积增加，适用于天线组件安装空间不受限的场景。
如图8-图10所示，本发明实施例提供一种电子设备100，该电子设备100包括显示屏101、设置在显示屏101四周的边框102以及本发明示例所提供的至少一个天线组件103，天线组件103位于电子设备100内且与边框102连接，其中，天线组件103中介质基板未设置有金属屏蔽罩的一面朝向边框102，即天线组件103向电子设备100的外部辐射电磁波。
具体地，显示屏101可以是LCD、LED、OLED等显示屏中的一种，边框102可以是包围在显示屏101四周的框体，边框102在垂直于显示屏101的方向上具有一定的厚度，使得天线组件103可以安装在边框102上，在一个可选实施例中，天线组件103的数量可以为一个或者一个以上。
本发明实施例的电子设备中，天线组件的天线单元和射频芯片设置在同一块介质基板上，且设置有金属屏蔽罩，天线组件位于电子设备内且与边框连接，天线组件中介质基板未设置有金属屏蔽罩的一面朝向边框，首先，该金属屏蔽罩设置在介质基板背向天线单元的表面上并且覆盖天线单元，可以通过金属屏蔽罩隔离电子设备的其他电子器件对天线单元造成电磁干扰；其次，天线单元和射频芯片设置在同一块介质基板上避免了使用同轴电缆线连接天线单元和射频芯片，从根本上解决了天线单元受电磁干扰的问题，保证了天线单元的辐射性能；再次，金属屏蔽罩设置在介质基板背向天线单元的表面上，天线组件安装于电子设备整机后，天线单元朝金属屏蔽罩方向辐射的电磁波被金属屏蔽罩所屏蔽，天线单元辐射的电磁波向电子设备外部辐射，天线单元辐射的电磁波不会干扰到显示屏导致显示屏闪屏，也不会干扰到电子设备整机内部的其他电子器件；最后，电子设备中其他电子器件无需设置屏蔽罩，降低了电子设备的制造成本。
进一步地，天线组件中天线单元的数量可以为一个或者多个，天线单元和射频芯片可以设置在介质基板的同面或者异面，电子设备可以根据天线组件的安装空间、辐射性能以及辐射方向来选择天线组件。
如图9-图12所示，在一个可选实施例中，电子设备100的边框102包括下边框1021，天线组件103与下边框1021可拆卸式连接，天线组件103中介质基板1未设置有金属屏蔽罩3的一面朝向下边框1021的底面。具体地，下边框1021的材质可以是金属，该下边框1021的底面设置有与天线组件103正对的避让孔10211，使得天线组件103安装于下边框1021后，天线组件103中介质基板1未设置有金属屏蔽罩3的一面正对该避让孔10211，天线组件103上的天线单元可以通过该避让孔10211向电子设 备100外部辐射电磁波。当然，天线组件103还可以安装在电子设备100的其他边框上，示例性地，可以安装在左边框或者右边框，天线组件103中介质基板1未设置有金属屏蔽罩3的一面也可以与显示屏101的正面同向，本发明实施例对天线组件103的安装位置、朝向均不加以限制。
本发明实施例的天线组件位于电子设备的下边框，天线组件中介质基板1未设置有金属屏蔽罩的一面朝向下边框的底面，一方面，下边框安装空间足，可以方便安装天线组件，另一方面，电子设备的下边框更接近用户，天线组件位于下边框辐射面积广，提高了电子设备的无线网络性能。
优选地，电子设备100还包括装饰件104，该装饰件104覆盖避让孔10211，避免避让孔10211直接暴露出天线组件103的介质基板1，使得电子设备100具有良好的外观。
在本说明书的描述中，参考术语“一实施例”、“示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚器件，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以适当组合，形成本领域技术人员可以理解的其他实施方式。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。

Claims (20)

  1. 一种天线组件，其特征在于，包括：
    介质基板；
    天线单元，所述天线单元设置在所述介质基板的表面上；
    射频芯片，所述射频芯片设置在所述介质基板的表面上，所述射频芯片与所述天线单元连接；以及
    金属屏蔽罩，所述金属屏蔽罩设置在所述介质基板背向所述天线单元的表面上，并且覆盖所述天线单元。
  2. 根据权利要求1所述的天线组件，其特征在于，所述介质基板设置有共面波导传输线，所述射频芯片与所述天线单元通过所述共面波导传输线连接。
  3. 根据权利要求2所述的天线组件，其特征在于，所述共面波导传输线包括共面波导馈电线和位于所述共面波导馈电线两侧的共面波导接地面，所述天线单元通过所述共面波导馈电线与所述射频芯片连接，所述天线单元通过所述共面波导接地面接地。
  4. 根据权利要求3所述的天线组件，其特征在于，所述天线单元包括第一天线单元和第二天线单元，所述射频芯片包括第一射频芯片，所述共面波导馈电线包括第一共面波导馈电线和第二共面波导馈电线；
    所述第一天线单元和所述第二天线单元位于所述第一射频芯片的同侧，所述第一天线单元位于所述第二天线单元和所述第一射频芯片之间，所述第一天线单元通过所述第一共面波导馈电线与所述第一射频芯片连接，所述第二天线单元通过所述第二共面波导馈电线与所述第一射频芯片连接。
  5. 根据权利要求4所述的天线组件，其特征在于，所述第一共面波导馈电线和所述第二共面波导馈电线上均设置有阻抗匹配电路。
  6. 根据权利要求4所述的天线组件，其特征在于，所述第一天线单元与所 述第二天线单元之间设置有隔离接地面。
  7. 根据权利要求4所述的天线组件，其特征在于，所述第一共面波导馈电线位于所述第一天线单元靠近所述第一射频芯片的一侧，且与所述介质基板的底边垂直，所述共面波导接地面包括位于所述第一共面波导馈电线两侧的第一共面波导接地面；
    所述第一天线单元包括垂直于所述第一共面波导馈电线的第一馈电枝节和第一短路枝节，所述第一短路枝节和所述第一馈电枝节等长且平行间隔设置，所述第一短路枝节与所述第一共面波导接地面连接，所述第一馈电枝节与所述第一共面波导馈电线连接，所述第一短路枝节和所述第一馈电枝节远离所述第一共面波导馈电线的一端通过第一枝节连接，所述第一短路枝节和所述第一馈电枝节之间还设置有L形枝节，所述L形枝节的一端垂直连接在所述第一短路枝节上，所述L形枝节的另一端垂直连接在所述第一枝节上；
    所述第一短路枝节还设置有第一寄生枝节，所述第一寄生枝节与所述第一短路枝节垂直，且与所述第一枝节平行间隔设置，所述第一寄生枝节自所述第一短路枝节远离所述第一共面波导馈电线的一端向所述介质基板底边方向延伸。
  8. 根据权利要求7所述的天线组件，其特征在于，所述第二共面波导馈电线与所述介质基板的底边平行，所述共面波导接地面还包括位于所述第二共面波导馈电线两侧的第二共面波导接地面；
    所述第二天线单元包括一方形的主体，所述主体设置有延伸至所述第二共面波导接地面的第二短路枝节，以及延伸至所述第二共面波导馈电线的第二馈电枝节，所述第二短路枝节和所述第二馈电枝节平行且间隔设置，所述第二短路枝节远离所述第一射频芯片设置，所述第二馈电枝节靠近所述第一射频芯片 设置；
    所述主体还设置有自所述主体向所述第一天线单元方向延伸的第二枝节和第三枝节，所述第二枝节和所述第三枝节平行且间隔设置，所述第二枝节靠近所述第二共面波导馈电线设置，所述第三枝节远离所述第二共面波导馈电线设置；
    所述第三枝节设置有第二寄生枝节，所述第二寄生枝节位于所述第三枝节远离所述第二共面波导馈电线的一侧，且与所述第三枝节平行间隔设置，所述第二寄生枝节自所述第三枝节远离所述主体的一端向所述主体的方向延伸。
  9. 根据权利要求7所述的天线组件，其特征在于，所述第二共面波导馈电线与所述介质基板的底边平行；
    所述第二天线单元包括一方形的主体，所述主体远离所述第二共面波导馈电线的一端的两个角分别设置有第二枝节和第三枝节，所述第二枝节位于所述主体远离所述第一射频芯片的一侧，所述第三枝节位于所述主体靠近所述第一射频芯片的一侧，所述第二枝节与所述第二共面波导馈电线平行，且自所述主体向远离所述主体的方向延伸，所述第三枝节与所述第二共面波导馈电线垂直且向所述第二共面波导馈电线方向延伸；
    所述第二枝节远离所述主体的一端设置有向所述第二共面波导馈电线延伸的第四枝节，所述第四枝节还设置有L形馈电线，所述L馈电线位于所述第四枝节与所述主体之间，所述L形馈电线一端与所述第四枝节连接，另一端与所述第二共面波导馈电线连接；
    所述第三枝节靠近所述第二共面波导馈电线的一端设置有第二寄生枝节，所述第二寄生枝节自所述第三枝节靠近所述第二共面波导馈电线的一端向远离所述第一射频芯片的方向延伸，所述第二寄生枝节与所述第二枝节平行。
  10. 根据权利要求4-9任一项所述的天线组件，其特征在于，所述天线单元还包括第三天线单元和第四天线单元，所述射频芯片还包括第二射频芯片，所述共面波导馈电线还包括第三共面波导馈电线和第四共面波导馈电线；
    所述第二射频芯片位于所述第一射频芯片远离所述第一天线单元的一侧，所述第三天线单元和所述第四天线单元位于所述第二射频芯片远离所述第一射频芯片的一侧，所述第三天线单元位于所述第二射频芯片和所述第四天线单元之间，所述第三天线单元与所述第一天线单元互为镜像，所述第四天线单元与所述第二天线单元互为镜像，所述第三天线单元通过所述第三共面波导馈电线与所述第二射频芯片连接，所述第四天线单元通过所述第四共面波导馈电线与所述第二射频芯片连接。
  11. 根据权利要求4-9任一项所述的天线组件，其特征在于，所述天线单元还包括第三天线单元和第四天线单元，所述射频芯片还包括第二射频芯片，所述共面波导馈电线还包括第三共面波导馈电线和第四共面波导馈电线；
    所述第二射频芯片位于所述第一射频芯片远离所述第一天线单元的一侧，所述第三天线单元和所述第四天线单元位于所述第二射频芯片和所述第一射频芯片之间，所述第三天线单元与所述第一天线单元结构相同，所述第四天线单元与所述第二天线单元结构相同，所述第三天线单元位于所述第二射频芯片和所述第四天线单元之间，所述第三天线单元通过所述第三共面波导馈电线与所述第二射频芯片连接，所述第四天线单元通过所述第四共面波导馈电线与所述第二射频芯片连接。
  12. 根据权利要求1所述的天线组件，其特征在于，所述介质基板设置有微带传输线，所述天线单元和所述射频芯片通过微带传输线连接。
  13. 根据权利要求12所述的天线组件，其特征在于，所述微带传输线上设 置有阻抗匹配电路。
  14. 根据权利要求1-9任一项所述的天线组件，其特征在于，所述天线单元和所述射频芯片设置在所述介质基板同一侧的表面上。
  15. 根据权利要求1-9任一项所述的天线组件，其特征在于，所述天线单元和所述射频芯片设置在所述介质基板不同侧的表面上。
  16. 根据权利要求1-9任一项所述的天线组件，其特征在于，所述金属屏蔽罩的底部到所述天线单元的距离等于所述天线单元辐射的电磁波的波长的四分之一。
  17. 一种电子设备，其特征在于，所述电子设备包括显示屏、设置在所述显示屏四周的边框以及权利要求1-16任一项所述的天线组件，所述天线组件位于所述电子设备内且与所述边框连接，其中，所述天线组件中介质基板未设置有金属屏蔽罩的一面朝向所述边框。
  18. 根据权利要求18所述的电子设备，其特征在于，所述边框包括下边框，所述天线组件与所述下边框可拆卸式连接，所述天线组件中介质基板未设置有金属屏蔽罩的一面朝向所述下边框的底面。
  19. 根据权利要求18所述的电子设备，其特征在于，所述下边框的底面设置有与所述天线组件正对的避让孔。
  20. 根据权利要求19所述的电子设备，其特征在于，所述电子设备还包括装饰件，所述装饰件覆盖所述避让孔。
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