WO2022088294A1 - 超薄玻璃基板制程方法以及显示面板制程方法 - Google Patents

超薄玻璃基板制程方法以及显示面板制程方法 Download PDF

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Publication number
WO2022088294A1
WO2022088294A1 PCT/CN2020/129699 CN2020129699W WO2022088294A1 WO 2022088294 A1 WO2022088294 A1 WO 2022088294A1 CN 2020129699 W CN2020129699 W CN 2020129699W WO 2022088294 A1 WO2022088294 A1 WO 2022088294A1
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WIPO (PCT)
Prior art keywords
substrate
base material
glass base
edge
ultra
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PCT/CN2020/129699
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English (en)
French (fr)
Inventor
周晧煜
蒋承忠
吴天鸣
黄俊杰
陈风
Original Assignee
恩利克(浙江)显示科技有限公司
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Priority to KR1020237015567A priority Critical patent/KR102686812B1/ko
Priority to US18/032,025 priority patent/US20230391661A1/en
Publication of WO2022088294A1 publication Critical patent/WO2022088294A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present disclosure relates to the technical field of panel manufacturing, and in particular, to a manufacturing method of an ultra-thin glass substrate and a manufacturing method of a display panel.
  • the ultra-thin glass substrate (UTG substrate) is an important part of the foldable cover.
  • the quality of the ultra-thin substrate itself is the key.
  • the special treatment of its edge that is, it is necessary to remove defects such as chipping and micro-cracks caused by cutting, so as to avoid glass damage caused by micro-cracks when the substrate is bent. broken.
  • two issues need to be solved: 1) what cutting method to adopt to obtain relatively straight edge quality; 2) to use polishing and other methods to remove edge defects.
  • wheel knife cutting is limited to straight line cutting, and it is still difficult to cut products with special shapes (leading R angles).
  • UTG substrate of about 100um without chemical strengthening treatment is very fragile, and it is difficult to withstand wheel knife cutting.
  • a high proportion of debris occurs under the mechanical pressure at the same time, or defects such as obvious chipping and missing corners at the edge of the substrate are produced. These defects are very fatal defects for the subsequent edge polishing, which may directly lead to the scrapping of the substrate. Therefore, finding a suitable cutting method to obtain a substrate with a straight edge is an important work component.
  • laser non-mechanical cutting can achieve better edge cutting effect and may become the mainstream method of ultra-thin substrate cutting in the future.
  • Laser cutting refers to the energy released when the laser beam is irradiated on the surface of the workpiece. The workpiece is melted and evaporated for the purpose of cutting and slicing. Laser cutting does not exert pressure on the glass surface, so it will not cause the glass substrate to be broken, and various special-shaped cuttings can be made at the same time.
  • UTG substrates are prone to quality defects such as scratches on the glass surface or mutual crushing during the processing and transportation process.
  • a functional film is coated on the chemically strengthened UTG substrate to form a foldable cover.
  • the usual implementation is: after the UTG ultra-thin substrate is sprayed with protective ink, laser cutting or subsequent processing of the desired size is performed.
  • the problem of laser scattering in this area will eventually lead to incomplete laser cutting of glass, difficulty in slicing or serious edge collapse, etc. The above defects seriously affect the subsequent edges. Part of the polishing process.
  • the purpose of the present disclosure is to provide a method for manufacturing an ultra-thin glass substrate and a method for manufacturing a display panel, which overcomes the difficulties of the prior art and can avoid the damage to the quality of the ultra-thin glass substrate caused by cutter wheel cutting and laser cutting. , simplifies the steps of obtaining the glass substrate, speeds up the process speed of the ultra-thin glass substrate, at the same time enhances the stress dissipation effect of the edge of the ultra-thin glass substrate, and improves the product quality of the ultra-thin glass substrate.
  • Embodiments of the present disclosure provide a method for manufacturing an ultra-thin glass substrate, including the following steps:
  • n substrate regions and skeleton regions surrounding the substrate regions are preset on the glass base material, and n is greater than or equal to 2;
  • the reaction chamber further includes a plurality of supports for supporting the glass base material, and a plurality of supports located along the direction of gravity a basket under the support member, the support member supports the skeleton region of the glass base material, and the etching medium at least etches the skeleton region of the glass base material;
  • the substrate region falls under gravity, and falls into the basket through the channels between the support members respectively ;
  • the support member only supports the frame area of the glass base material
  • the basket has a through hole through which the support member passes
  • the gap between the support members is based on the No.
  • a projected area is greater than or equal to a second projected area of the substrate area based on the basket.
  • the etching protection layer only covers the upper and lower surfaces of the substrate region, and the upper and lower surfaces of the skeleton region are both exposed outside the etching protection layer.
  • the step S420 includes the following steps:
  • polymer reinforcement layer on at least one side of the upper and lower surfaces of the substrate region of the glass base material, where the components of the polymer reinforcement layer include acrylic, silicon-containing organic polymer material, cyclic polymer Oxygen resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate and polyethylene terephthalate;
  • the step S420 includes the following steps:
  • the panel functional layer includes a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, a cover one or a combination of plates;
  • the edge of the substrate region forms a stress dissipation edge
  • the entire skeleton region in the glass base material is eliminated and a stress-dissipating edge is formed at the edge of the substrate region.
  • the substrate regions are arranged in a matrix on the glass base material, and the framework regions are separated between adjacent substrate regions.
  • the stress dissipating edge is a circular arc edge, a knife edge or a polygonal edge, and the knife edge or polygonal edge includes at least one hypotenuse or arc hypotenuse, the hypotenuse and the glass
  • the angle range of the base metal is (15°, 90°);
  • the thickness of the glass base material is 10um to 150um; the stress dissipation edge surrounds the edge of the substrate region, and the width of the stress dissipation edge is 5um to 300um.
  • step S440 the following steps are included before the step S460
  • step S450 Detect whether all the substrate regions are detached from the glass base material and fall into the basket, if yes, go to step S460, if not, go back to step S450.
  • a step S480 is further included, forming a polymer reinforcement layer on at least one side of the upper and lower surfaces of the glass substrate (14), and the components of the polymer reinforcement layer include acrylic, Silicon-containing organic polymer materials, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate and polyethylene terephthalate-1,4-cyclohexyl Dimethyl ester.
  • Embodiments of the present disclosure also provide a method for manufacturing a display panel, including the method for manufacturing an ultra-thin glass substrate as described above.
  • the purpose of the present disclosure is to provide an ultra-thin glass substrate manufacturing method, which can avoid the damage to the quality of the ultra-thin glass substrate caused by cutter wheel cutting and laser cutting, simplifies the steps of obtaining the glass substrate, accelerates the process speed of the ultra-thin glass substrate, and enhances the The stress dissipation effect on the edge of the ultra-thin glass substrate improves the product quality of the ultra-thin glass substrate.
  • FIG. 1 is a first flow chart of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • FIGS. 2 to 11 are schematic diagrams of a first manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • 12 to 14 are schematic diagrams of a second manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • 15 to 17 are schematic diagrams of a third manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • FIG. 18 is a second flow chart of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • 19 to 22 are schematic diagrams of a fourth manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • FIG. 23 is a third flowchart of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • 24 to 29 are schematic diagrams of a fifth manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • FIG. 30 is a fourth flowchart of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • 31 to 35 are schematic diagrams of a sixth manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • FIG. 1 is a first flow chart of the method for manufacturing an ultra-thin glass substrate of the present disclosure. As shown in FIG. 1 , the method for manufacturing an ultra-thin glass substrate of the present disclosure includes the following steps:
  • n substrate regions 11 and skeleton regions 12 surrounding the substrate regions 11 are preset, where n is greater than or equal to 2, and the thickness of the glass base material 1 is 10um to 150um.
  • S130 at least etch the skeleton region 12 of the glass base material 1 , so that the substrate region 11 is separated from the glass base material 1 , and a stress dissipation edge 13 is formed on the edge of the substrate region 11 .
  • dry etching or wet etching in chemical etching is used.
  • step S120 includes the following steps:
  • polymer reinforcement layer 24 on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material, and the components of the polymer reinforcement layer 24 include: acrylic, silicon-containing organic polymer materials (silane, silicon resin, silicone rubber), epoxy resin, fluororesin, polyamide, polyimide, polycarbonate (PC), polyethylene terephthalate (PET), polyethylene terephthalate (PET), 4-Cyclohexanedimethylester (PCT).
  • silicon-containing organic polymer materials silane, silicon resin, silicone rubber
  • epoxy resin fluororesin
  • PC polyamide
  • PC polycarbonate
  • PET polyethylene terephthalate
  • PET polyethylene terephthalate
  • PCT 4-Cyclohexanedimethylester
  • step S120 includes the following steps:
  • a panel functional layer 23 on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material, and the panel functional layer 23 includes a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate. one or a combination.
  • all the framework regions 12 in the glass base material 1 are eliminated, leaving the substrate region 11 protected by the etching protection layer.
  • the stress dissipation edge 13 is formed on the edge of the substrate region 11 .
  • all the skeleton regions 12 in the glass base material 1 are eliminated by one etching and the stress dissipation edge 13 is formed on the edge of the substrate region 11 , but not limited thereto.
  • the etching protection layer only covers the upper and lower surfaces of the substrate region 11, and the upper and lower surfaces of the skeleton region 12 are both exposed outside the etching protection layer, but not limited thereto.
  • one side of the glass base material 1 is completely covered by the etching protection layer, on the other side of the substrate area 11 only the substrate area 11 is covered by the etching protection layer, and the skeleton area 12 is exposed between the etching protection layer In addition, but not limited to this.
  • acid liquid is used for etching: using HF as the main body to prepare (1) HF+H2SO4+CH3COOH, (2) HF+HNO3+H2O, (3) HF+H2O+NH4F, ammonium fluoride or Sodium fluoride is the main body, 10-15% of HCL is added, and acetic acid is etched.
  • an alkaline liquid of phosphate + alkaline solution is used for etching.
  • the substrate regions 11 are arranged in a matrix on the glass base material 1 , and adjacent substrate regions 11 are separated by skeleton regions 12 , but not limited thereto.
  • the stress dissipating edge 13 is a circular arc edge, a blade edge or a polygonal edge, and the blade edge or polygonal edge includes at least one hypotenuse or arc hypotenuse, and the plane where the hypotenuse is located is the same as where the glass base material 1 is located.
  • An included angle is formed between the planes, and the angle range of the included angle is (15°, 90°), but not limited thereto.
  • the thickness of the glass base material 1 is 10um to 150um, but not limited thereto.
  • the stress-dissipating edge 13 surrounds the edge of the substrate region 11 , and the width of the stress-dissipating edge 13 is 5 um to 300 um, but not limited thereto.
  • the present disclosure also provides a method for manufacturing a display panel, which includes the above-mentioned method for manufacturing an ultra-thin glass substrate.
  • FIGS. 2 to 11 are schematic diagrams of a first manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • the first manufacturing process of the ultra-thin glass substrate manufacturing method of the present disclosure is as follows:
  • a glass base material 1 is provided first.
  • the thickness of the glass base material 1 is 10um to 150um.
  • the substrate regions 11 are arranged in a matrix on the glass base material 1 , and adjacent substrate regions 11 are separated by skeleton regions 12 .
  • n substrate regions 11 and skeleton regions 12 surrounding the substrate region 11 are preset on the glass base material 1, and n is greater than or equal to 2 to form an etching protection layer on the upper and lower surfaces of the substrate region 11 of the glass base material respectively. 20.
  • the etching protection layer 20 only covers the upper and lower surfaces of the substrate region 11, and the upper and lower surfaces of the skeleton region 12 are exposed outside the etching protection layer 20, so that the upper and lower surfaces of the skeleton region 12 can be simultaneously etched in the subsequent etching. Etching can easily form stress-dissipating edges 13 with multiple stress-dissipating surfaces.
  • the skeleton region 12 of the glass base material 1 is etched to separate the substrate region 11 from the glass base material 1 , and a stress dissipating edge 13 is formed on the edge of the substrate region 11 .
  • the stress-dissipating edge 13 is a blade edge, the stress-dissipating edge 13 surrounds the edge of the substrate region 11 , and the width of the stress-dissipating edge 13 is 5 um to 300 um.
  • the etching protection layer 20 is removed to obtain an independent glass substrate 14 .
  • the stress dissipating edge 131 may also be a circular arc edge, so as to dissipate stress in multiple different directions and improve the ability of the glass substrate 14 to prevent shattering.
  • the stress dissipating edge 131 may also be a triangular edge, so as to dissipate stress in multiple different directions and improve the anti-fragmentation capability of the glass substrate 14 .
  • FIGS. 12 to 14 are schematic diagrams of a second manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • one side of the glass base material 1 is fully covered by the etching protection layer 22 .
  • the etching protection layer 22 covers the other side of the substrate area 11, only the substrate area 11 is covered by the etching protection layer 20, and the skeleton area 12 is exposed outside the etching protection layer, so that during the etching process, the glass base material 1 is etched by the etching protection layer 22.
  • One side of the full coverage is not etched, and only the other side is etched, so that a sloped stress-dissipating edge 133 is finally formed on the edge of the glass substrate 14 .
  • FIGS. 15 to 17 are schematic diagrams of a third manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure.
  • FIGS. 15 to 17 in a modified example, based on the above-mentioned manufacturing process, in the process of forming the etching protection layer on the upper and lower surfaces of the substrate region 11 , in the upper and lower surfaces of the substrate region 11 of the glass base material At least one side of the polymer reinforcement layer 24 is formed.
  • An etching protection layer is formed on the side of the polymer reinforcement layer 24 away from the substrate area 11, and finally the glass substrate 14 with the upper and lower surfaces covered by the polymer reinforcement layer 24 can be obtained, so that when the glass substrate 14 is bent and restored, The overall flexibility of the glass substrate 14 is enhanced, thereby improving the anti-shatter property of the glass substrate 14 .
  • a panel function may also be formed on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material Layer 23, the panel function layer 23 includes one or a combination of a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate.
  • an etching protection layer is formed on the side of the panel functional layer 23 away from the substrate region 11 .
  • FIG. 18 is a second flow chart of the method for manufacturing an ultra-thin glass substrate of the present disclosure. As shown in FIG. 18 , the method for manufacturing an ultra-thin glass substrate of the present disclosure includes the following steps:
  • a panel functional layer 23 on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material 1 , and the panel functional layer 23 includes a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate.
  • an etching protection layer is formed on the side of the panel functional layer 23 away from the substrate region 11 .
  • the process of the present disclosure it is no longer necessary to use a cutter wheel and a laser, which can avoid the damage to the quality of the ultra-thin glass substrate caused by cutter wheel cutting and laser cutting, and can directly process the multiple substrate regions 11 on the glass base material 1
  • the panel functional layer 23 also avoids the damage to the panel functional layer 23 caused by cutter wheel cutting and laser cutting, which greatly saves the time of the subsequent process, simplifies the steps of obtaining a glass substrate with a panel functional layer, and speeds up the production of ultra-thin glass.
  • the process speed of the display substrate is enhanced, the stress dissipation effect of the edge of the ultra-thin glass substrate is enhanced, and the product quality of the ultra-thin glass substrate is improved.
  • step S220 includes the following steps:
  • a panel functional layer 23 is formed on the side of the polymer reinforcing layer 24 away from the substrate area 11, and the panel functional layer 23 at least includes a TFT backplane, an organic light-emitting layer, and a touch detection layer sequentially stacked on the substrate area 11.
  • An etching protection layer is formed on the side of the functional layer 23 away from the substrate region 11 .
  • the etching protection layer covers the surface and four sides of the panel functional layer 23 facing away from the substrate region 11 , but not limited thereto.
  • the stress dissipation edge 13 is formed on the edge of the substrate region 11, but not limited thereto.
  • all the skeleton regions 12 in the glass base material 1 are eliminated by one etching and the stress dissipation edge 13 is formed on the edge of the substrate region 11 , but not limited thereto.
  • the etching protection layer only covers the upper and lower surfaces of the substrate region 11, and the upper and lower surfaces of the skeleton region 12 are both exposed outside the etching protection layer, but not limited thereto.
  • one side of the glass base material 1 is completely covered by the etching protection layer, the other side of the substrate region 11 is only the substrate region 11 covered by the etching protection layer, and the skeleton region 12 is exposed outside the etching protection layer, but not This is limited.
  • the substrate regions 11 are arranged in a matrix on the glass base material 1 , and adjacent substrate regions 11 are separated by skeleton regions 12 , but not limited thereto.
  • the stress dissipating edge 13 is a circular arc edge, a knife edge or a polygonal edge, the knife edge or polygonal edge includes at least one hypotenuse or arc hypotenuse, and the angle range between the hypotenuse and the glass base material 1 is (15°, 90°), but not limited thereto.
  • the thickness of the glass base material 1 is 10um to 150um, but not limited thereto.
  • the stress-dissipating edge 13 surrounds the edge of the substrate region 11 , and the width of the stress-dissipating edge 13 is 5 um to 300 um, but not limited thereto.
  • the present disclosure also provides a method for manufacturing a display panel, which includes the above-mentioned method for manufacturing an ultra-thin glass substrate.
  • FIGS. 19 to 22 are schematic diagrams of a fourth manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure. As shown in FIGS. 19 to 22 , the fourth manufacturing process of the ultra-thin glass substrate manufacturing method of the present disclosure is as follows:
  • a glass base material 1 is provided first, and n substrate regions 11 and skeleton regions 12 surrounding the substrate regions 11 are preset on the glass base material 1 , and n is greater than or equal to 2.
  • the thickness of the glass base material 1 is 10 um to 150 um, the substrate regions 11 are arranged in a matrix on the glass base material 1 , and the adjacent substrate regions 11 are separated by a skeleton region 12 .
  • a panel functional layer 23 is formed on the upper surface of the substrate region 11 of the glass base material.
  • the panel functional layer 23 includes one or a combination of a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate.
  • the etching protection layer 20 is formed on the side of the base material 1 on which the panel functional layer 23 is not provided and on the side of the panel functional layer 23 away from the substrate region 11 , respectively.
  • At least the skeleton region 12 of the glass base material 1 is etched to separate the substrate region 11 from the glass base material 1 , and a stress dissipation edge 13 is formed on the edge of the substrate region 11 .
  • an independent glass substrate 14 is obtained by removing the etching protection layer, and a glass substrate 14 with a panel functional layer 23 is obtained.
  • the present disclosure can simultaneously obtain the glass substrate 14 from the glass base material 1, and simultaneously process the functional layers in multiple areas on the glass base material 1 (half corresponding to the subsequent display panels), which greatly saves the time of the functional layer process, and Since it is no longer necessary to use a cutter wheel and a laser when subsequently dividing the glass substrate 14 , damage to the formed functional layer by cutter wheel cutting and laser cutting can be avoided, and at the same time, the product quality of the process speed of the display panel is improved.
  • FIG. 23 is a third flowchart of the method for manufacturing an ultra-thin glass substrate of the present disclosure. As shown in FIG. 23 , the method for manufacturing an ultra-thin glass substrate of the present disclosure includes the following steps:
  • the process of the present disclosure it is no longer necessary to use a cutter wheel and a laser, which can avoid the damage to the quality of the ultra-thin glass substrate caused by cutter wheel cutting and laser cutting, and can directly process the multiple substrate regions 11 on the glass base material 1
  • the through holes and/or thinned areas also avoid the damage to the glass substrate 14 caused by laser drilling, which greatly saves the time of the subsequent process, simplifies the steps of obtaining a glass substrate with a panel functional layer, and speeds up the display of ultra-thin glass.
  • the process speed of the substrate is enhanced, the stress dissipation effect of the edge of the ultra-thin glass substrate is enhanced, and the product quality of the ultra-thin glass substrate is improved.
  • all the skeleton regions 12 in the glass base material 1 are eliminated, leaving the substrate region 11 protected by the etching protection layer, but not limited thereto.
  • At least one through hole and/or thinned region is formed in the substrate region 11 , and a stress dissipation edge 13 is formed on the edge of the substrate region 11 , but not limited thereto.
  • all skeleton regions 12 in the glass base material 1 are eliminated by one etching, at least one through hole and/or thinned region is formed in the substrate region 11 , and a stress dissipation edge is formed on the edge of the substrate region 11 13, but not limited thereto.
  • step S320 includes the following steps:
  • step S320 includes the following steps:
  • a panel functional layer 23 on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material, and the panel functional layer 23 includes a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate. one or a combination.
  • the substrate regions 11 are arranged in a matrix on the glass base material 1 , and adjacent substrate regions 11 are separated by skeleton regions 12 , but not limited thereto.
  • the opening area is any one of a round hole, an oval hole, a teardrop-shaped hole, and a special-shaped hole, but it is not limited thereto.
  • the stress dissipating edge 13 is a circular arc edge, a knife edge or a polygonal edge, the knife edge or polygonal edge includes at least one hypotenuse or arc hypotenuse, and the angle range between the hypotenuse and the glass base material 1 is (15°, 90°), but not limited thereto.
  • the thickness of the glass base material 1 is 10 um to 150 um, but not limited thereto.
  • the stress-dissipating edge 13 surrounds the edge of the substrate region 11 , and the width of the stress-dissipating edge 13 is 5 um to 300 um, but not limited thereto.
  • the through hole is the camera mounting hole 15 .
  • the thinned area corresponds to a fingerprint sensor.
  • the present disclosure also provides a display panel manufacturing method, the manufacturing process includes the above-mentioned ultra-thin glass substrate manufacturing method, the through holes are used to install acoustic or optical sensors, and the lower surface of the thinned area is provided with a fingerprint sensor.
  • FIGS. 24 to 29 are schematic diagrams of a fifth manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure. As shown in FIGS. 24 to 29 , the fifth manufacturing process of the ultra-thin glass substrate manufacturing method of the present disclosure is as follows:
  • a glass base material 1 is provided, and n substrate regions 11 and skeleton regions 12 surrounding the substrate regions 11 are preset on the glass base material 1 , and n is greater than or equal to 2.
  • the thickness of the glass base material 1 is 10um to 150um, the substrate regions 11 are arranged in a matrix on the glass base material 1, and adjacent substrate regions 11 are separated by skeleton regions 12.
  • An etching protection layer is respectively formed on at least the upper and lower surfaces of the substrate region 11 of the glass base material, and the etching protection layer has at least one opening region exposing a partial substrate region 11 .
  • the opening area is a circular hole.
  • the skeleton area 12 of the glass base material 1 is etched to separate the substrate area 11 from the glass base material 1 , a camera mounting hole 15 is formed in the substrate area 11 through the opening area, and the edge of the substrate area 11 is formed. A stress-dissipating edge 13 is formed.
  • the etching protection layer 20 is removed to obtain an independent glass substrate 14 having a camera mounting hole 15 .
  • the glass substrate 14 can be obtained from the glass base material 1 and at the same time, the glass base material 1 can be punched, so that the acoustic or optical sensor can be installed in the subsequent process, thereby greatly saving the time of the functional layer process and avoiding the
  • the damage to the glass substrate 14 caused by laser drilling greatly saves the time of the subsequent process, simplifies the steps of obtaining a glass substrate with a panel functional layer, accelerates the process speed of the ultra-thin glass display substrate, and at the same time enhances the ultra-thin glass substrate.
  • the stress-dissipating effect of the edge improves the product quality of ultra-thin glass substrates.
  • FIG. 30 is a fourth flowchart of the method for manufacturing an ultra-thin glass substrate of the present disclosure. As shown in FIG. 30 , the method for manufacturing an ultra-thin glass substrate of the present disclosure includes the following steps:
  • the reaction chamber further includes a plurality of support members 4 for supporting the glass base material and a plurality of support members 4 located below the support member 4 in the direction of gravity
  • the support member 4 supports the skeleton region 12 of the glass base material 1
  • the etching medium at least etches the skeleton region 12 of the glass base material 1 .
  • step S450 Detect whether all the substrate regions 11 are detached from the glass base material 1 and fall into the carrying basket, if yes, go to step S460, if not, go back to step S450.
  • the frame area 12 of the glass base material 1 is supported by the support 4, so that the substrate area 11 is detached from the glass base material 1 after being etched, and falls into the basket under the influence of gravity, and the basket can take out all the glass substrates 14 at one time.
  • the whole process does not need to use cutter wheel and laser, which can avoid the damage of cutter wheel cutting and laser cutting to the quality of ultra-thin glass substrate, simplify the steps of obtaining glass substrate, speed up the process speed of ultra-thin glass substrate, and enhance the ultra-thin glass substrate.
  • the stress dissipation effect on the edge of the thin glass substrate improves the product quality of the ultra-thin glass substrate.
  • the support 4 only supports the frame area 12 of the glass base material 1, the basket has a through hole through which the support 4 passes, and the gap between the supports 4 is greater than or equal to the substrate based on the first projected area of the basket Area 11 is based on the second projected area of the basket.
  • the etching protection layer only covers the upper and lower surfaces of the substrate region 11 , and the upper and lower surfaces of the skeleton region 12 are both exposed outside the etching protection layer.
  • step S420 includes the following steps: S421 , forming a polymer reinforcement layer 24 on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material.
  • step S420 includes the following steps:
  • a panel functional layer 23 on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material, and the panel functional layer 23 includes a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate. one or a combination.
  • all the skeleton regions 12 in the glass base material 1 are eliminated and the stress dissipation edge 13 is formed on the edge of the substrate region 11 by only one etching, but not limited thereto.
  • the substrate regions 11 are arranged in a matrix on the glass base material 1 , and adjacent substrate regions 11 are separated by skeleton regions 12 , but not limited thereto.
  • the stress dissipation edge 13 is a circular arc edge, a blade edge or a polygonal edge, the blade edge or polygonal edge includes at least one hypotenuse or arc hypotenuse, and the angle range between the hypotenuse and the glass base material 1 is is (15°, 90°), but not limited thereto.
  • the thickness of the glass base material 1 is 10um to 150um, but not limited thereto.
  • the stress-dissipating edge 13 surrounds the edge of the substrate region 11 , and the width of the stress-dissipating edge 13 is 5 um to 300 um, but not limited thereto.
  • step S480 is further included, forming a polymer reinforcement layer on at least one side of the upper and lower surfaces of the glass substrate 14, and the components of the polymer reinforcement layer include acrylic, Silicone organic polymer materials, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate and polyethylene terephthalate-1,4-cyclohexanedi methyl ester.
  • the present disclosure also provides a method for manufacturing a display panel, which includes the above-mentioned method for manufacturing an ultra-thin glass substrate.
  • FIGS. 31 to 35 are schematic diagrams of a sixth manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present disclosure. As shown in FIGS. 31 to 35 , the sixth manufacturing process of the ultra-thin glass substrate manufacturing method of the present disclosure is as follows:
  • a glass base material 1 is provided, and n substrate regions 11 and skeleton regions 12 surrounding the substrate regions 11 are preset on the glass base material 1 , and n is greater than or equal to 2.
  • the thickness of the glass base material 1 is 10 um to 150 um
  • the substrate regions 11 are arranged in a matrix on the glass base material 1
  • the adjacent substrate regions 11 are separated by a skeleton region 12 .
  • An etching protection layer is formed on the upper and lower surfaces of the substrate region 11 of the glass base material, respectively, and is immersed in a reaction chamber having an etching solution 3 .
  • the glass base material with the etching protection layer is immersed in a reaction chamber with an etching medium, and the reaction chamber further includes a plurality of supports 4 for supporting the glass base material and a plurality of supports 4 along the direction of gravity.
  • the support member 4 supports the skeleton region 12 of the glass base material 1
  • the etching medium at least etches the skeleton region 12 of the glass base material 1 .
  • the support 4 only supports the skeleton area 12 of the glass base material 1, the basket has a through hole for the support 4 to pass through, and the gap between the supports 4 based on the first projected area of the basket is greater than or equal to the substrate area 11 based on the second projected area of the basket. projection area.
  • the etching protection layer only covers the upper and lower surfaces of the substrate region 11 , and the upper and lower surfaces of the skeleton region 12 are both exposed outside the etching protection layer.
  • the substrate region 11 falls under gravity and falls into the basket through the channels between the support members 4 respectively. It is detected whether all the substrate regions 11 are detached from the glass base material 1 and fall into the basket, and if so, the subsequent step of lifting the basket is performed.
  • the basket is pulled out from the reaction chamber, and the substrate area 11 after being detached from the glass base material 1 is taken out, and finally the etching protection layer is removed to obtain an independent glass substrate 14 .
  • the purpose of the present disclosure is to provide a method for manufacturing an ultra-thin glass substrate, which can avoid the damage to the quality of the ultra-thin glass substrate caused by cutter wheel cutting and laser cutting, simplify the steps for obtaining the glass substrate, and speed up the process speed of the ultra-thin glass substrate. At the same time, the stress dissipation effect of the edge of the ultra-thin glass substrate is enhanced, and the product quality of the ultra-thin glass substrate is improved.

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Abstract

超薄玻璃基板（14）制程方法以及显示面板制程方法,超薄玻璃基板（14）制程方法包括：（S410）提供一玻璃母材（1），玻璃母材（1）上预设n个基板区域（11）和围绕基板区域（11）的骨架区域（12），n大于等于2；（S420）至少在玻璃母材（1）的基板区域（11）的上下表面分别形成刻蚀保护层（20）；（S430）将玻璃母材（1）浸没于具有刻蚀介质的反应腔体中，刻蚀介质至少刻蚀玻璃母材（1）的骨架区域（12）；（S440）当基板区域（11）的边沿被刻蚀形成应力消散边缘（13）并且自玻璃母材（1）脱离后，落入提篮；（S460）自反应腔体中拉出提篮，带出自玻璃母材（1）脱离后的基板区域（11）；（S470）去除刻蚀保护层（20）得到独立的玻璃基板（14）。避免刀轮切割和激光切割对超薄玻璃基板（14）质量的伤害，简化获得大批量玻璃基板（14）的步骤，提高了超薄玻璃基板（14）的生产速度和产品质量。

Description

超薄玻璃基板制程方法以及显示面板制程方法 技术领域
本揭露涉及面板制程技术领域，具体地说，涉及超薄玻璃基板制程方法以及显示面板制程方法。
背景技术
超薄玻璃基片(UTG基片)作为可折叠盖板的重要组成部分，为实现更小或甚至R＝2mm的弯折半径的效果，超薄基片自身质量是关键。尤其是UTG基片被切割成特定尺寸后，其边部的特殊处理，即需要去除因切割产生的崩边、微裂纹等缺陷，从而避免基片在弯折的时候由于微裂纹等造成玻璃的破碎。总体而言，需要解决两个方面的问题：1)采取何种切割方式以获得相对平直的边部质量；2)采取抛光等方式去除边部缺陷。
目前，轮刀式切割局限于直线切割，在进行产品异形(导R角)切割方面仍然面临困难，再者未经化学强化处理的100um左右的UTG基片非常易碎，它难以承受轮刀切割时的机械压力出现高比例碎片，或者产生非期望的基片边部的明显崩片、缺角等缺陷。这些缺陷对于后续的边部抛光是非常致命的缺陷，可能直接导致基片的报废。因此，寻找合适的切割方式获得边部平直的基片是重要的工作组成。
相比而言，激光非机械力作用的切割能够获得更好的边部切割效果而可能成为未来超薄基片切割的主流方式，激光切割是指将激光束照射在工件表面时释放的能量使工件融化并蒸发，以达到切割分片的目的。激光切割没有对玻璃表面施加压力，所以不会造成玻璃基材破片，同时可以做各种各样异形切割。
另一方面，UTG基片在加工和转运过程极易发生玻璃表面划伤或相互挤压撑伤等质量缺陷，目前，采取在玻璃双表面喷涂防护油墨方式降低或避免上述问题的发生，并形成了大片UTG母板玻璃切割—边部抛光—化学强化—喷涂防护油墨的加工过程。最终在经过化学强化处理的UTG基片上涂布功能膜涂形成可折叠的盖板。
为此，通常的实施方式为：在UTG超薄基片喷涂防护油墨后进行激光切割或 者期望的尺寸进行后续的加工。然而，UTG基片表面均匀喷涂油墨是一项非常艰巨的任务，尤其要消除相关的气泡、确保膜层厚薄均匀、颜色均匀、喷涂环境洁净等是非常困难的。同时，也由于激光切割道上常常遇见喷涂不均匀的情况而导致激光在该区域出现散射的问题，最终导致激光切割玻璃不彻底，分片困难或严重崩边等缺陷，上述缺陷严重影响后续的边部抛光制程。
发明内容
针对现有技术中的问题，本揭露的目的在于提供超薄玻璃基板制程方法以及显示面板制程方法，克服了现有技术的困难，能够避免刀轮切割和激光切割对超薄玻璃基板质量的伤害，简化获得玻璃基板的步骤，加快了超薄玻璃基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
本揭露的实施例提供一种超薄玻璃基板制程方法，包括以下步骤：
S410、提供一玻璃母材，所述玻璃母材上预设n个基板区域和围绕所述基板区域的骨架区域，n大于等于2；
S420、至少在所述玻璃母材的所述基板区域的上下表面分别形成刻蚀保护层；
S430、将带有刻蚀保护层的所述玻璃母材浸没于具有刻蚀介质的反应腔体中，所述反应腔体还包括支撑所述玻璃母材的多个支撑件以及沿重力方向位于所述支撑件下方的提篮，所述支撑件支撑所述玻璃母材的骨架区域，所述刻蚀介质至少刻蚀所述玻璃母材的骨架区域；
S440、当所述基板区域的边沿被刻蚀形成应力消散边缘并且自所述玻璃母材脱离后，所述基板区域受重力下落，分别穿过所述支撑件之间的通道落入所述提篮；
S460、自所述反应腔体中拉出所述提篮，带出自所述玻璃母材脱离后的基板区域；
S470、去除所述刻蚀保护层得到独立的所述玻璃基板。
在一些实施例中，所述支撑件仅支撑所述玻璃母材的骨架区域，所述提篮具有供所述支撑件穿过的通孔，所述支撑件之间的间隙基于所述提篮的第一投影区域大于等于所述基板区域基于所述提篮的第二投影区域。
在一些实施例中，所述刻蚀保护层仅覆盖所述基板区域的上下表面，所述骨架区域的上下表面均露出于所述刻蚀保护层之外。
在一些实施例中，所述步骤S420包括以下步骤：
S421、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成高分子补强层，所述高分子补强层的组分包括亚克力、含硅的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯以及聚对苯二甲酸-1,4-环己二甲酯；
S422、在所述高分子补强层背离所述基板区域的一侧形成刻蚀保护层。
在一些实施例中，所述步骤S420包括以下步骤：
S423、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成面板功能层，所述面板功能层包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合；
S424、在所述面板功能层背离所述基板区域的一侧形成刻蚀保护层。
在一些实施例中，通过第一刻蚀制程，消除所述玻璃母材中全部的骨架区域，留下被所述刻蚀保护层保护的所述基板区域，通过第二刻蚀制程，在所述基板区域的边沿形成应力消散边缘；
或者，仅通过一次刻蚀，消除所述玻璃母材中全部的骨架区域并且在所述基板区域的边沿形成应力消散边缘。
在一些实施例中，所述基板区域矩阵排列于所述玻璃母材，相邻的所述基板区域之间具有所述骨架区域分隔。
在一些实施例中，所述应力消散边缘为圆弧形边缘、刀锋边缘或者多边形边缘，所述刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，所述斜边与所述玻璃母材的角度范围为(15°，90°)；
所述玻璃母材的厚度为10um至150um；所述应力消散边缘环绕所述基板区域的边沿，所述应力消散边缘的宽度为5um至300um。
在一些实施例中，所述步骤S440之后，步骤S460之前还包括以下步骤
S450、检测所有的所述基板区域是否自所述玻璃母材脱离落入提篮中，若是，则执行步骤S460，若否，则返回步骤S450。
在一些实施例中，所述步骤S470之后还包括步骤S480，在玻璃基板(14)的上下表面中的至少一侧形成高分子补强层，所述高分子补强层的组分包括亚克力、含硅的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对 苯二甲酸乙二醇酯以及聚对苯二甲酸-1,4-环己二甲酯。
本揭露的实施例还提供一种显示面板制程方法，包括如上述的超薄玻璃基板制程方法。
本揭露的目的在于提供超薄玻璃基板制程方法，能够避免刀轮切割和激光切割对超薄玻璃基板质量的伤害，简化获得玻璃基板的步骤，加快了超薄玻璃基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
附图说明
通过阅读参照以下附图对非限制性实施例所作的详细描述，本揭露的其它特征、目的和优点将会变得更明显。
图1是本揭露的超薄玻璃基板制程方法的第一种流程图。
图2至11是本揭露的超薄玻璃基板制程方法的第一种制程过程的示意图。
图12至14是本揭露的超薄玻璃基板制程方法的第二种制程过程的示意图。
图15至17是本揭露的超薄玻璃基板制程方法的第三种制程过程的示意图。
图18是本揭露的超薄玻璃基板制程方法的第二种流程图。
图19至22是本揭露的超薄玻璃基板制程方法的第四种制程过程的示意图。
图23是本揭露的超薄玻璃基板制程方法的第三种流程图。
图24至29是本揭露的超薄玻璃基板制程方法的第五种制程过程的示意图。
图30是本揭露的超薄玻璃基板制程方法的第四种流程图。
图31至35是本揭露的超薄玻璃基板制程方法的第六种制程过程的示意图。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式。相反，提供这些实施方式使得本揭露将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的结构，因而将省略对它们的重复描述。
图1是本揭露的超薄玻璃基板制程方法的第一种流程图。如图1所示，本揭露的超薄玻璃基板制程方法，包括以下步骤：
S110、提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2，玻璃母材1的厚度为10um至150um。
S120、至少在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层。
S130、至少刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，并且在基板区域11的边沿形成应力消散边缘13。本实施例中采用化学蚀刻中的干法蚀刻或者湿法蚀刻。
S140、去除刻蚀保护层得到独立的玻璃基板14。
本揭露的制程过程中，不再需要使用刀轮和激光，能够避免刀轮切割和激光切割对超薄玻璃基板质量的伤害，简化获得玻璃基板的步骤，加快了超薄玻璃基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
在一个优选实施例中，步骤S120包括以下步骤：
S121、在玻璃母材的基板区域11的上下表面中的至少一侧形成高分子补强层24，高分子补强层24的组分包括：亚克力，含硅的有机高分子材料(硅烷，硅树脂，硅橡胶)，环氧树脂，氟树脂，聚醯胺，聚醯亚胺，聚碳酸酯(PC)，聚对苯二甲酸乙二醇酯(PET)，聚对苯二甲酸-1,4-环己二甲酯(PCT)。
S122、在高分子补强层24背离基板区域11的一侧形成刻蚀保护层，以便在玻璃基板14被弯折以及恢复时，增强玻璃基板14整体的挠性，从而提高玻璃基板14的防碎裂属性。
在一个优选实施例中，步骤S120包括以下步骤：
S123、在玻璃母材的基板区域11的上下表面中的至少一侧形成面板功能层23，面板功能层23包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合。
S124、在面板功能层23背离基板区域11的一侧形成刻蚀保护层。
在一个优选实施例中，通过第一刻蚀制程，消除玻璃母材1中全部的骨架区域12，留下被刻蚀保护层保护的基板区域11。
通过第二刻蚀制程，在基板区域11的边沿形成应力消散边缘13。
在一个优选实施例中，通过一次刻蚀，消除玻璃母材1中全部的骨架区域12并且在基板区域11的边沿形成应力消散边缘13，但不以此为限。
在一个优选实施例中，刻蚀保护层仅覆盖基板区域11的上下表面，骨架区域12的上下表面均露出于刻蚀保护层之外，但不以此为限。
在一个优选实施例中，玻璃母材1的一侧被刻蚀保护层全覆盖，基板区域11的另一侧仅基板区域11被刻蚀保护层覆盖，骨架区域12露出于刻蚀保护层之外，但不以此为限。
本实施例中，使用酸性液体进行刻蚀：以HF为主体调配出(1)HF+H2SO4+CH3COOH、(2)HF+HNO3+H2O、(3)HF+H2O+NH4F、以氟化氨或氟化钠为主体10～15％加入HCL，醋酸进行刻蚀。或者，磷酸盐+碱性溶液的碱性液体进行刻蚀。或者采用等离子体蚀刻，喷砂。
在一个优选实施例中，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔，但不以此为限。
在一个优选实施例中，应力消散边缘13为圆弧形边缘、刀锋边缘或者多边形边缘，刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，斜边所在平面与玻璃母材1所在平面之间形成夹角，夹角的角度范围为(15°，90°)，但不以此为限。
在一个优选实施例中，玻璃母材1的厚度为10um至150um，但不以此为限。在一个优选实施例中，应力消散边缘13环绕基板区域11的边沿，应力消散边缘13的宽度为5um至300um，但不以此为限。
本揭露还提供一种显示面板制程方法，其制程过程中包括上述超薄玻璃基板制程方法。
图2至11是本揭露的超薄玻璃基板制程方法的第一种制程过程的示意图。如图2至11所示，本揭露的超薄玻璃基板制程方法的第一种制程过程如下：
参考图2，首先提供一玻璃母材1，玻璃母材1的厚度为10um至150um，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔。
参考图3、4，在玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层20，刻蚀保护层20仅覆盖基板区域11的上下表面，骨架区域12的上下表面均露出于刻蚀保护层20之外，使得骨架区域12的上下表面在后续的刻蚀中可以同时受到刻蚀，易形成具有多个应力消散面的应力消散边缘13基板区域11矩阵排列于 玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔。
参考图5、6、7、8，刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，并且在基板区域11的边沿形成应力消散边缘13。本实施例中，通过第一刻蚀制程，消除玻璃母材1中全部的骨架区域12，留下被刻蚀保护层20保护的基板区域11。应力消散边缘13为刀锋边缘，应力消散边缘13环绕基板区域11的边沿，应力消散边缘13的宽度为5um至300um。
最后，参见图9去除刻蚀保护层20得到独立的玻璃基板14。
参见图10，在一个变形例中，应力消散边缘131也可以是圆弧形边缘，以便对多个不同方向的应力进行消散，提升玻璃基板14防碎裂的能力。
参见图11，在一个变形例中，应力消散边缘131也可以是三边形边缘，以便对多个不同方向的应力进行消散，提升玻璃基板14防碎裂的能力。
图12至14是本揭露的超薄玻璃基板制程方法的第二种制程过程的示意图。参考图12至14，在一个变形例中，以上述制程过程为基础，在基板区域11的上下表面形成刻蚀保护层的过程中，玻璃母材1的一侧被刻蚀保护层22全覆盖，基板区域11的另一侧仅基板区域11被刻蚀保护层20覆盖，骨架区域12露出于刻蚀保护层之外，使得在刻蚀的过程中，玻璃母材1被刻蚀保护层22全覆盖的一侧不受到刻蚀，仅另一侧收到刻蚀，从而最终在玻璃基板14的边沿形成斜坡式的应力消散边缘133。
图15至17是本揭露的超薄玻璃基板制程方法的第三种制程过程的示意图。参考图15至17，在一个变形例中，以上述制程过程为基础，在基板区域11的上下表面形成刻蚀保护层的过程中，可以通过在在玻璃母材的基板区域11的上下表面中的至少一侧形成高分子补强层24。在高分子补强层24背离基板区域11的一侧形成刻蚀保护层，最后可以获得上下表面被高分子补强层24覆盖的玻璃基板14，以便在玻璃基板14被弯折以及恢复时，增强玻璃基板14整体的挠性，从而提高玻璃基板14的防碎裂属性。
在一个变形例中，以上述制程过程为基础，在基板区域11的上下表面形成刻蚀保护层的过程中，也可以在玻璃母材的基板区域11的上下表面中的至少一侧形成面板功能层23，面板功能层23包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合。并且，在面板功能层23背离基板区域11的一侧形 成刻蚀保护层。
图18是本揭露的超薄玻璃基板制程方法的第二种流程图。如图18所示，本揭露的超薄玻璃基板制程方法，包括以下步骤：
S210、提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2。
S220、在玻璃母材1的基板区域11的上下表面中的至少一侧形成面板功能层23，面板功能层23包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合，在面板功能层23背离基板区域11的一侧形成刻蚀保护层。
S230、至少刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，并且在基板区域11的边沿形成应力消散边缘13。
S240、去除刻蚀保护层得到独立的玻璃基板14。
本揭露的制程过程中，不再需要使用刀轮和激光，能够避免刀轮切割和激光切割对超薄玻璃基板质量的伤害，并且能够在玻璃母材1上的多个基板区域11中直接加工面板功能层23，也避免了刀轮切割和激光切割对工面板功能层23的损伤，大大节约了后续制程的时间，简化获得带有面板功能层的玻璃基板的步骤，加快了超薄玻璃的显示基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
在一个优选实施例中，步骤S220包括以下步骤：
S221、在玻璃母材的基板区域11的上下表面中的至少一侧形成高分子补强层24。
S222、在高分子补强层24背离基板区域11的一侧形成面板功能层23，面板功能层23至少包括依次层叠于基板区域11的TFT背板、有机发光层、触控检测层，在面板功能层23背离基板区域11的一侧形成刻蚀保护层。以便在玻璃基板14被弯折以及恢复时，增强玻璃基板14整体的挠性，从而提高玻璃基板14的防碎裂属性。
在一个优选实施例中，刻蚀保护层覆盖面板功能层23背离基板区域11的表面和四个侧面，但不以此为限。
在一个优选实施例中，通过第一刻蚀制程，消除玻璃母材1中全部的骨架区域12，留下被刻蚀保护层保护的基板区域11。通过第二刻蚀制程，在基板区域11的 边沿形成应力消散边缘13，但不以此为限。
在一个优选实施例中，通过一次刻蚀，消除玻璃母材1中全部的骨架区域12并且在基板区域11的边沿形成应力消散边缘13，但不以此为限。
在一个优选实施例中，刻蚀保护层仅覆盖基板区域11的上下表面，骨架区域12的上下表面均露出于刻蚀保护层之外，但不以此为限。
或者，玻璃母材1的一侧被刻蚀保护层全覆盖，基板区域11的另一侧仅基板区域11被刻蚀保护层覆盖，骨架区域12露出于刻蚀保护层之外，但不以此为限。
在一个优选实施例中，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔，但不以此为限。
在一个优选实施例中，应力消散边缘13为圆弧形边缘、刀锋边缘或者多边形边缘，刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，斜边与玻璃母材1的角度范围为(15°，90°)，但不以此为限。在一个优选实施例中，玻璃母材1的厚度为10um至150um，但不以此为限。应力消散边缘13环绕基板区域11的边沿，应力消散边缘13的宽度为5um至300um，但不以此为限。
本揭露还提供一种显示面板制程方法，其制程过程中包括上述超薄玻璃基板制程方法。
图19至22是本揭露的超薄玻璃基板制程方法的第四种制程过程的示意图。如图19至22所示，本揭露的超薄玻璃基板制程方法的第四种制程过程如下：
参考图19、20，首先提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2。玻璃母材1的厚度为10um至150um，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔。在玻璃母材的基板区域11的上表面形成面板功能层23，面板功能层23包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合，在玻璃母材1没有设置面板功能层23的一侧以及在面板功能层23背离基板区域11的一侧分别形成刻蚀保护层20。
参考图21，至少刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，并且在基板区域11的边沿形成应力消散边缘13。
参考图22，去除刻蚀保护层得到独立的玻璃基板14，获得带有面板功能层23的玻璃基板14。
本揭露能够自玻璃母材1获得玻璃基板14的同时，在玻璃母材1上进行多个区域(对分对应后续的显示面板)进行功能层的同时加工，大大节约功能层制程的时间，并且由于后续在分割玻璃基板14时不再需要使用刀轮和激光，能够避免刀轮切割和激光切割对已经成型的功能层的伤害，同时提供了显示面板的制程速度的产品质量。
图23是本揭露的超薄玻璃基板制程方法的第三种流程图。如图23所示，本揭露的超薄玻璃基板制程方法，包括以下步骤：
S310、提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2。
S320、至少在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层，刻蚀保护层具有至少一露出局部基板区域11的开孔区域。
S330、至少刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，通过开孔区域在基板区域11形成至少一通孔和/或打薄区域，并且在基板区域11的边沿形成应力消散边缘13。
S340、去除刻蚀保护层得到独立的具有通孔和/或打薄区域的玻璃基板14。
本揭露的制程过程中，不再需要使用刀轮和激光，能够避免刀轮切割和激光切割对超薄玻璃基板质量的伤害，并且能够在玻璃母材1上的多个基板区域11中直接加工通孔和/或打薄区域，也避免了激光打孔对玻璃基板14的损伤，大大节约了后续制程的时间，简化获得带有面板功能层的玻璃基板的步骤，加快了超薄玻璃的显示基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
在一个优选实施例中，通过第一刻蚀制程，消除玻璃母材1中全部的骨架区域12，留下被刻蚀保护层保护的基板区域11，但不以此为限。
通过第二刻蚀制程，在基板区域11形成至少一通孔和/或打薄区域，并且基板区域11的边沿形成应力消散边缘13，但不以此为限。
在一个优选实施例中，通过一次刻蚀，消除玻璃母材1中全部的骨架区域12，在基板区域11形成至少一通孔和/或打薄区域，并且在基板区域11的边沿形成应力消散边缘13，但不以此为限。
在一个优选实施例中，步骤S320包括以下步骤：
S321、在玻璃母材的基板区域11的上下表面中的至少一侧形成高分子补强层24。
S322、在高分子补强层24背离基板区域11的一侧形成刻蚀保护层，刻蚀保护层具有至少一露出局部基板区域11的开孔区域。以便在玻璃基板14被弯折以及恢复时，增强玻璃基板14整体的挠性，从而提高玻璃基板14的防碎裂属性。
在一个优选实施例中，步骤S320包括以下步骤：
S323、在玻璃母材的基板区域11的上下表面中的至少一侧形成面板功能层23，面板功能层23包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合。
S324、在面板功能层23背离基板区域11的一侧形成刻蚀保护层，刻蚀保护层具有至少一露出局部基板区域11的开孔区域。
在一个优选实施例中，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔，但不以此为限。
在一个优选实施例中，开孔区域为圆孔、椭圆型孔、水滴型孔、异形孔中的任意一种，但不以此为限。
在一个优选实施例中，应力消散边缘13为圆弧形边缘、刀锋边缘或者多边形边缘，刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，斜边与玻璃母材1的角度范围为(15°，90°)，但不以此为限。
在一个优选实施例中，玻璃母材1的厚度为10um至150um，但不以此为限。应力消散边缘13环绕基板区域11的边沿，应力消散边缘13的宽度为5um至300um，但不以此为限。在一个优选实施例中，通孔为相机安装孔15。在一个优选实施例中，打薄区域对应配合指纹传感器。
本揭露还提供一种显示面板制程方法，其制程过程中包括上述超薄玻璃基板制程方法，通孔被用于安装声学或光学传感器，打薄区域的下表面设置指纹传感器。
图24至29是本揭露的超薄玻璃基板制程方法的第五种制程过程的示意图。如图24至29所示，本揭露的超薄玻璃基板制程方法的第五种制程过程如下：
参考图24、25，首先，提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2。玻璃母材1的厚度为10um至150um，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区 域12分隔。至少在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层，刻蚀保护层具有至少一露出局部基板区域11的开孔区域。本实施例中，开孔区域为圆孔。
参考图26、27，刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，通过开孔区域在基板区域11形成一相机安装孔15，并且在基板区域11的边沿形成应力消散边缘13。
参考图28、29，去除刻蚀保护层20得到独立的具有相机安装孔15的玻璃基板14。
本揭露能够自玻璃母材1获得玻璃基板14的同时，在玻璃母材1上进行打孔加工，以便在后续的制程过程中安装声学或光学传感器，从而大大节约功能层制程的时间，避免了激光打孔对玻璃基板14的损伤，大大节约了后续制程的时间，简化获得带有面板功能层的玻璃基板的步骤，加快了超薄玻璃的显示基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
图30是本揭露的超薄玻璃基板制程方法的第四种流程图。如图30所示，本揭露的超薄玻璃基板制程方法，包括以下步骤：
S410、提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2。
S420、至少在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层。
S430、将带有刻蚀保护层的玻璃母材浸没于具有刻蚀介质的反应腔体中，反应腔体还包括支撑玻璃母材的多个支撑件4以及沿重力方向位于支撑件4下方的提篮，支撑件4支撑玻璃母材1的骨架区域12，刻蚀介质至少刻蚀玻璃母材1的骨架区域12。
S440、当基板区域11的边沿被刻蚀形成应力消散边缘13并且自玻璃母材1脱离后，基板区域11受重力下落，分别穿过支撑件4之间的通道落入提篮。
S450、检测所有的基板区域11是否自玻璃母材1脱离落入提篮中，若是，则执行步骤S460，若否，则返回步骤S450。
S460、自反应腔体中拉出提篮，带出自玻璃母材1脱离后的基板区域11。
S470、去除刻蚀保护层得到独立的玻璃基板14。
本揭露通过支撑件4支撑玻璃母材1的骨架区域12，令基板区域11在被刻蚀后自玻璃母材1脱离，受重力影响落入提篮中，提篮可以一次性带出所有玻璃基板14，整个过程中不需要使用刀轮和激光，能够避免刀轮切割和激光切割对超薄玻璃基板质量的伤害，简化获得玻璃基板的步骤，加快了超薄玻璃基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
在一个优选实施例中，支撑件4仅支撑玻璃母材1的骨架区域12，提篮具有供支撑件4穿过的通孔，支撑件4之间的间隙基于提篮的第一投影区域大于等于基板区域11基于提篮的第二投影区域。
在一个优选实施例中，刻蚀保护层仅覆盖基板区域11的上下表面，骨架区域12的上下表面均露出于刻蚀保护层之外。
在一个优选实施例中，步骤S420包括以下步骤：S421、在玻璃母材的基板区域11的上下表面中的至少一侧形成高分子补强层24。
S422、在高分子补强层24背离基板区域11的一侧形成刻蚀保护层，但不以此为限。
在一个优选实施例中，步骤S420包括以下步骤：
S423、在玻璃母材的基板区域11的上下表面中的至少一侧形成面板功能层23，面板功能层23包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合。
S424、在面板功能层23背离基板区域11的一侧形成刻蚀保护层，但不以此为限。
在一个优选实施例中，通过第一刻蚀制程，消除玻璃母材1中全部的骨架区域12，留下被刻蚀保护层保护的基板区域11，通过第二刻蚀制程，在基板区域11的边沿形成应力消散边缘13。
或者，仅通过一次刻蚀，消除玻璃母材1中全部的骨架区域12并且在基板区域11的边沿形成应力消散边缘13，但不以此为限。
在一个优选实施例中，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔，但不以此为限。
在一个优选实施例中，应力消散边缘13为圆弧形边缘、刀锋边缘或者多边形边缘，刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，斜边与玻璃母材1 的角度范围为(15°，90°)，但不以此为限。
在一个优选实施例中，玻璃母材1的厚度为10um至150um，但不以此为限。应力消散边缘13环绕基板区域11的边沿，应力消散边缘13的宽度为5um至300um，但不以此为限。
在一个优选实施例中，所述步骤S470之后还包括步骤S480，在玻璃基板14的上下表面中的至少一侧形成高分子补强层，所述高分子补强层的组分包括亚克力、含硅的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯以及聚对苯二甲酸-1,4-环己二甲酯。
本揭露还提供一种显示面板制程方法，其制程过程中包括上述超薄玻璃基板制程方法。
图31至35是本揭露的超薄玻璃基板制程方法的第六种制程过程的示意图。如图31至35所示，本揭露的超薄玻璃基板制程方法的第六种制程过程如下：
参考图31，首先，提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于2。玻璃母材1的厚度为10um至150um，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔。在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层，并浸没在具有刻蚀溶液3的反应腔体中。
参考图32，将带有刻蚀保护层的玻璃母材浸没于具有刻蚀介质的反应腔体中，反应腔体还包括支撑玻璃母材的多个支撑件4以及沿重力方向位于支撑件4下方的提篮，支撑件4支撑玻璃母材1的骨架区域12，刻蚀介质至少刻蚀玻璃母材1的骨架区域12。支撑件4仅支撑玻璃母材1的骨架区域12，提篮具有供支撑件4穿过的通孔，支撑件4之间的间隙基于提篮的第一投影区域大于等于基板区域11基于提篮的第二投影区域。刻蚀保护层仅覆盖基板区域11的上下表面，骨架区域12的上下表面均露出于刻蚀保护层之外。
参考图33、34，当基板区域11的边沿被刻蚀形成应力消散边缘13并且自玻璃母材1脱离后，基板区域11受重力下落，分别穿过支撑件4之间的通道落入提篮。检测所有的基板区域11是否自玻璃母材1脱离落入提篮中，若是，则执行后续提出提篮的步骤。
参考图35，自反应腔体中拉出提篮，带出自玻璃母材1脱离后的基板区域11， 最后去除刻蚀保护层得到独立的玻璃基板14。
综上，本揭露的目的在于提供超薄玻璃基板制程方法，能够避免刀轮切割和激光切割对超薄玻璃基板质量的伤害，简化获得玻璃基板的步骤，加快了超薄玻璃基板的制程速度，同时增强了超薄玻璃基板边缘的应力消散效果，提高了超薄玻璃基板的产品质量。
以上内容是结合具体的优选实施方式对本揭露所作的进一步详细说明，不能认定本揭露的具体实施只局限于这些说明。对于本揭露所属技术领域的普通技术人员来说，在不脱离本揭露构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本揭露的保护范围。

Claims (10)

  1. 一种超薄玻璃基板制程方法，其特征在于，包括以下步骤：
    S410、提供一玻璃母材，所述玻璃母材上预设n个基板区域和围绕所述基板区域的骨架区域，n大于等于2；
    S420、至少在所述玻璃母材的所述基板区域的上下表面分别形成刻蚀保护层；
    S430、将带有刻蚀保护层的所述玻璃母材浸没于具有刻蚀介质的反应腔体中，所述反应腔体还包括支撑所述玻璃母材的多个支撑件以及沿重力方向位于所述支撑件下方的提篮，所述支撑件支撑所述玻璃母材的骨架区域，所述刻蚀介质至少刻蚀所述玻璃母材的骨架区域；
    S440、当所述基板区域的边沿被刻蚀形成应力消散边缘并且自所述玻璃母材脱离后，所述基板区域受重力下落，分别穿过所述支撑件之间的通道落入所述提篮；
    S460、自所述反应腔体中拉出所述提篮，带出自所述玻璃母材脱离后的基板区域；
    S470、去除所述刻蚀保护层得到独立的所述玻璃基板。
  2. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述支撑件仅支撑所述玻璃母材的骨架区域，所述提篮具有供所述支撑件穿过的通孔，所述支撑件之间的间隙基于所述提篮的第一投影区域大于等于所述基板区域基于所述提篮的第二投影区域。
  3. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述刻蚀保护层仅覆盖所述基板区域的上下表面，所述骨架区域的上下表面均露出于所述刻蚀保护层之外。
  4. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述步骤S420包括以下步骤：
    S421、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成高分子补强层，所述高分子补强层的组分包括亚克力、含硅的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯以及聚对苯二甲酸-1,4-环己二甲酯；
    S422、在所述高分子补强层背离所述基板区域的一侧形成刻蚀保护层。
  5. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述步骤S420 包括以下步骤：
    S423、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成面板功能层，所述面板功能层包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合；
    S424、在所述面板功能层背离所述基板区域的一侧形成刻蚀保护层。
  6. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，通过第一刻蚀制程，消除所述玻璃母材中全部的骨架区域，留下被所述刻蚀保护层保护的所述基板区域，通过第二刻蚀制程，在所述基板区域的边沿形成应力消散边缘；
    或者，仅通过一次刻蚀，消除所述玻璃母材中全部的骨架区域并且在所述基板区域的边沿形成应力消散边缘。
  7. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述基板区域矩阵排列于所述玻璃母材，相邻的所述基板区域之间具有所述骨架区域分隔；
    所述应力消散边缘为圆弧形边缘、刀锋边缘或者多边形边缘，所述刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，所述斜边与所述玻璃母材的角度范围为(15°，90°)；
    所述玻璃母材的厚度为10um至150um；所述应力消散边缘环绕所述基板区域的边沿，所述应力消散边缘的宽度为5um至300um。
  8. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于所述步骤S440之后，步骤S460之前还包括以下步骤：
    S450、检测所有的所述基板区域是否自所述玻璃母材脱离落入提篮中，若是，则执行步骤S460，若否，则返回步骤S450。
  9. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于：所述步骤S470之后还包括步骤S480，在玻璃基板的上下表面中的至少一侧形成高分子补强层，所述高分子补强层的组分包括亚克力、含硅的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯以及聚对苯二甲酸-1,4-环己二甲酯。
  10. 一种显示面板制程方法，其特征在于，包括如权利要求1至9中任意一项所述的超薄玻璃基板制程方法。
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