WO2022110610A1 - 超薄玻璃基板制程方法以及显示面板制程方法 - Google Patents

超薄玻璃基板制程方法以及显示面板制程方法 Download PDF

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WO2022110610A1
WO2022110610A1 PCT/CN2021/086425 CN2021086425W WO2022110610A1 WO 2022110610 A1 WO2022110610 A1 WO 2022110610A1 CN 2021086425 W CN2021086425 W CN 2021086425W WO 2022110610 A1 WO2022110610 A1 WO 2022110610A1
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Prior art keywords
substrate
base material
region
layer
manufacturing
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PCT/CN2021/086425
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English (en)
French (fr)
Inventor
周晧煜
蒋承忠
吴天鸣
黄俊杰
陈风
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恩利克(浙江)显示科技有限公司
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Priority to US18/036,710 priority Critical patent/US20230406757A1/en
Priority to KR1020237015568A priority patent/KR20230079229A/ko
Publication of WO2022110610A1 publication Critical patent/WO2022110610A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • C03C17/324—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
    • C03C17/326—Epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to the technical field of panel manufacturing, in particular, to a manufacturing method of an ultra-thin glass substrate and a manufacturing method of a display panel.
  • the ultra-thin glass substrate (UTG substrate) is an important part of the foldable cover.
  • the quality of the ultra-thin substrate itself is the key.
  • the special treatment of its edge that is, it is necessary to remove defects such as chipping and micro-cracks caused by cutting, so as to avoid glass damage caused by micro-cracks when the substrate is bent. broken.
  • two issues need to be solved: 1) what cutting method to adopt to obtain relatively straight edge quality; 2) to use polishing and other methods to remove edge defects.
  • wheel knife cutting is limited to straight line cutting, and it is still difficult to cut products with special shapes (leading R angles).
  • UTG substrate of about 100um without chemical strengthening treatment is very fragile, and it is difficult to withstand wheel knife cutting.
  • a high proportion of debris occurs under the mechanical pressure at the same time, or defects such as obvious chipping and missing corners at the edge of the substrate are produced. These defects are very fatal defects for the subsequent edge polishing, which may directly lead to the scrapping of the substrate. Therefore, finding a suitable cutting method to obtain a substrate with a straight edge is an important work component.
  • laser non-mechanical cutting can achieve better edge cutting effect and may become the mainstream method of ultra-thin substrate cutting in the future.
  • Laser cutting refers to the energy released when the laser beam is irradiated on the surface of the workpiece. The workpiece is melted and evaporated for the purpose of cutting and slicing. Laser cutting does not exert pressure on the glass surface, so it will not cause the glass substrate to be broken, and various special-shaped cuttings can be made at the same time.
  • UTG substrates are prone to quality defects such as scratches on the glass surface or mutual crushing during the processing and transportation process.
  • a functional film is coated on the chemically strengthened UTG substrate to form a foldable cover.
  • the usual implementation is: after the UTG ultra-thin substrate is sprayed with protective ink, laser cutting or subsequent processing of the desired size is performed.
  • the problem of laser scattering in this area will eventually lead to incomplete laser cutting of glass, difficulty in slicing or serious edge collapse, etc. The above defects seriously affect the subsequent edges. Part of the polishing process.
  • the purpose of the present invention is to provide an ultra-thin glass substrate manufacturing method and a display panel manufacturing method, which overcome the difficulties of the prior art, and can obtain the glass substrate from the glass base material while simultaneously obtaining the glass base material on the glass base material.
  • the bending stress dissipation groove is provided to improve the bending performance of the panel on the preset bending path in the subsequent process of manufacturing the panel, thereby greatly saving the time of the functional layer process and improving the product quality of the ultra-thin glass substrate.
  • Embodiments of the present invention provide a method for manufacturing an ultra-thin glass substrate, including the following steps:
  • etching protection layer respectively on at least the upper and lower surfaces of the substrate region of the glass base material, the etching protection layer including a main body region and at least one thinned region extending along a preset bending path;
  • the substrate regions are arranged in a matrix on the glass base material, and the framework regions are separated between adjacent substrate regions.
  • the thinned area is a strip-shaped area extending along a predetermined bending path.
  • At least one slit parallel to the predetermined bending path is provided in the thinned region, and part of the substrate region is exposed from the slit.
  • the thickness of the thinned region of the etch protection layer is less than the thickness of the bulk region of the etch protection layer.
  • the etch protection layer includes an etch buffer layer for reducing etch and an etch stop layer for blocking etching, the etch buffer layer forming the thinned region, and the etch buffer layer provided in the same layer.
  • the etch protection layer forms a body region of the etch protection layer.
  • all skeleton regions in the glass base material are eliminated by one etching, at least one bending stress dissipation groove is formed in the substrate region along a predetermined bending path, and at least one bending stress dissipation groove is formed in the substrate region.
  • the edges form stress-dissipating edges.
  • the step S520 includes the following steps:
  • a polymer reinforcement layer on at least one side of the upper and lower surfaces of the substrate region of the glass base material, the polymer reinforcement layer having a slit, and the components of the polymer reinforcement layer Including acrylic, silicon-containing organic polymer materials, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate and polyethylene terephthalate-1,4 - cyclohexane dimethyl ester;
  • the step S520 includes the following steps:
  • a panel functional layer on at least one side of the upper and lower surfaces of the substrate region of the glass base material, the panel functional layer having a slit, and the panel functional layer comprising a TFT backplane, an organic light-emitting layer, One or a combination of touch detection layer, fingerprint identification layer and cover plate;
  • the stress dissipating edge is a circular arc edge, a knife edge or a polygonal edge, and the knife edge or polygonal edge includes at least one hypotenuse or arc hypotenuse, the hypotenuse and the glass
  • the angle range of the base material is (15°, 90°), and the thickness of the glass base material is 10um to 150um;
  • the stress-dissipating edge surrounds the edge of the substrate region, and the stress-dissipating edge has a width of 5um to 300um.
  • a step S550 is further included, forming a polymer reinforcement layer on at least one side of the upper and lower surfaces of the glass substrate, and the components of the polymer reinforcement layer include acrylic, silicon-containing Organic polymer materials, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate, and polyethylene 1,4-cyclohexyl terephthalate .
  • all skeleton regions in the glass base material are eliminated, leaving the substrate region protected by the etching protection layer;
  • At least one bending stress dissipating groove is formed in the substrate region along a predetermined bending path, and a stress dissipating edge is formed on the edge of the substrate region.
  • Embodiments of the present invention also provide a method for manufacturing a display panel, including the above-mentioned method for manufacturing an ultra-thin glass substrate, wherein the bending stress dissipation groove is disposed on a bending path of the display panel.
  • the purpose of the present invention is to provide an ultra-thin glass substrate manufacturing method, which can obtain a glass substrate from a glass base material and set a bending stress dissipation groove on the glass base material, so as to improve the panel in the subsequent process of manufacturing the panel.
  • the bending performance on the bending path greatly saves the time of the functional layer process and improves the product quality of the ultra-thin glass substrate.
  • FIG. 1 is a flow chart of the method for manufacturing an ultra-thin glass substrate of the present invention.
  • FIGS. 2 to 9 are schematic diagrams of the first manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present invention.
  • FIG. 10 is a schematic diagram of the intermediate process of the second process of the ultra-thin glass substrate manufacturing method of the present invention.
  • FIG. 11 is a schematic diagram of the intermediate process of the third process of the ultra-thin glass substrate manufacturing method of the present invention.
  • FIG. 1 is a flow chart of the method for manufacturing an ultra-thin glass substrate of the present invention.
  • the ultra-thin glass substrate manufacturing method of the present invention comprises the following steps:
  • etching protection layer at least on the upper and lower surfaces of the substrate region 11 of the glass base material, respectively, where the etching protection layer includes a main body region and at least one thinned region extending along a preset bending path;
  • S530 Etch at least the skeleton region 12 of the glass base material 1 to separate the substrate region 11 from the glass base material 1, form at least one bending stress dissipation groove in the substrate region 11 along a preset bending path through the thinning region, and The edge of the substrate region 11 forms a stress-dissipating edge 13;
  • a bending stress dissipation groove can be provided on the glass base material, so as to improve the panel during the subsequent panel manufacturing process.
  • the bending performance on the preset bending path greatly saves the time of the functional layer process and improves the product quality of the ultra-thin glass substrate.
  • the substrate regions 11 are arranged in a matrix on the glass base material 1 , and adjacent substrate regions 11 are separated by skeleton regions 12 , but not limited thereto.
  • the thinned area is a strip-shaped area extending along a predetermined bending path, but not limited thereto.
  • At least one slit parallel to the predetermined bending path is provided in the thinned area, and the partial substrate area 11 is exposed from the slit, but not limited thereto.
  • the thickness of the thinned region of the etching protection layer is smaller than the thickness of the main region of the etching protection layer, but not limited thereto.
  • the etching protection layer includes an etching buffer layer for reducing etching and an etching barrier layer for blocking etching, which are provided in the same layer.
  • the materials of the etching buffer layer and the etching barrier layer can be different, so as to achieve The effect of different blocking etch by region.
  • the buffer layer is etched to form a thinned region, and the protective layer is etched to form a main region of the etch protective layer, but not limited thereto.
  • all skeleton regions 12 in the glass base material 1 are eliminated by one etching, at least one bending stress dissipation groove is formed in the substrate region 11 along a predetermined bending path, and at the edge of the substrate region 11
  • the stress dissipating edge 13 is formed, but not limited thereto.
  • the stress dissipation edge is a circular arc edge, a blade edge or a polygonal edge, the blade edge or the polygonal edge includes at least one hypotenuse or arc hypotenuse, and the angle between the hypotenuse and the glass base material ranges from ( 15°, 90°), the thickness of the glass base material is 10um to 150um; the stress dissipation edge surrounds the edge of the substrate area, and the width of the stress dissipation edge is 5um to 300um, but not limited thereto.
  • step S550 is further included after step S540, forming a polymer reinforcement layer 24 on at least one side of the upper and lower surfaces of the glass substrate.
  • the components of the polymer reinforcement layer 24 include: acrylic, silicon-containing Organic polymer materials (silane, silicone resin, silicone rubber), epoxy resin, fluororesin, polyamide, polyimide, polycarbonate (PC), polyethylene terephthalate (PET), Poly-1,4-cyclohexane dimethyl terephthalate (PCT).
  • the substrate area is along a preset bend in the substrate area.
  • the bending path forms at least one bending stress dissipating groove, and the edge of the substrate region forms a stress dissipating edge, but not limited thereto.
  • FIGS. 2 to 9 are schematic diagrams of the first manufacturing process of the method for manufacturing an ultra-thin glass substrate of the present invention. As shown in FIGS. 2 to 9 , the first manufacturing process of the ultra-thin glass substrate manufacturing method of the present invention is as follows:
  • a glass base material 1 is provided first.
  • the thickness of the glass base material 1 is 10um to 150um.
  • the substrate regions 11 are arranged in a matrix on the glass base material 1 , and adjacent substrate regions 11 are separated by skeleton regions 12 .
  • n substrate regions 11 and skeleton regions 12 surrounding the substrate regions 11 are preset on the glass base material 1 , and n is greater than or equal to 1.
  • the etching protection layer 20 is respectively formed on the upper and lower surfaces of the substrate region 11 of the glass base material.
  • the etching protection layer 20 only covers the upper and lower surfaces of the substrate region 11, and the upper and lower surfaces of the skeleton region 12 are both exposed outside the etching protection layer 20.
  • the upper and lower surfaces of the skeleton region 12 can be etched at the same time in the subsequent etching, and it is easy to form a stress-dissipating edge 13 with multiple stress-dissipating surfaces.
  • the etch protection layer 20 includes a main body region 22 and at least one thinned region 21 extending along a predetermined bending path.
  • the thinned area 21 is a strip-shaped area extending along a predetermined bending path.
  • At least one slit parallel to the predetermined bending path is provided in the thinned area 21 , and part of the substrate area 11 is exposed in the narrow area. slits, so that during the etching process, at least one bending stress dissipating groove 14 is formed in the substrate region 11 along a predetermined bending path.
  • the skeleton region 12 of the glass base material 1 is etched, so that the substrate region 11 is separated from the glass base material 1 , and at least one bend is formed in the substrate region 11 along the preset bending path through the thinned region.
  • a folded stress-dissipating groove 14 is formed, and a stress-dissipating edge 13 is formed at the edge of the substrate region 11 .
  • the etching buffer layer in the present invention cannot completely block the etching of the substrate area 11 below it during the etching process, but only weakens the etching of the substrate area 11 below it, so that in the substrate area 11 corresponding to the thinned area Shallow grooves extending along the predetermined bending path are left (by contrast, the substrate area 11 covered by the etch barrier layer is not etched at all), these shallow grooves can disperse the bending stress when the panel is bent, as the bending stress. Flexural stress relief grooves are used. In this embodiment, through the first etching process, all the skeleton regions 12 in the glass base material 1 are eliminated, leaving the substrate region 11 protected by the etching protection layer 20 .
  • the stress-dissipating edge 13 is a blade edge, the stress-dissipating edge 13 surrounds the edge of the substrate region 11 , and the width of the stress-dissipating edge 13 is 5 um to 300 um.
  • all the skeleton regions 12 in the glass base material 1 are eliminated by one etching, at least one bending stress dissipation groove is formed in the substrate region 11 along the preset bending path, and stress dissipation is formed at the edge of the substrate region 11
  • symmetrical bending stress dissipating grooves 14 are formed on both sides of the substrate region 11 so as to disperse the stress in the two bending directions respectively.
  • the bending stress dissipating groove 14 may be provided only on one side of the substrate region 11 to disperse the stress in only one bending direction.
  • the etching protection layer is removed to obtain an independent glass substrate with a bending stress dissipating groove.
  • FIG. 10 is a schematic diagram of the intermediate process of the second process of the ultra-thin glass substrate manufacturing method of the present invention. As shown in FIG. 10 , the main difference between the second process of the ultra-thin glass substrate manufacturing method of the present invention and the first process is that a polymer compound is formed on at least one side of the upper and lower surfaces of the substrate region 11 of the glass base material.
  • S522 forming an etching protection layer on the side of the polymer reinforcement layer 24 away from the substrate area 11 , the etching protection layer has at least one slit exposing the partial substrate area 11 , and the narrow slit and the narrow slit are on the substrate area 11 .
  • the projections overlap so that both the glass substrate can be covered by the polymer reinforcement layer 24 .
  • the slits of the etching protection layer 20 and the slits of the polymer reinforcement layer 24 form bending stress dissipation grooves 14 on the corresponding local substrate regions 11 .
  • the second process can enhance the overall flexibility of the glass substrate when the glass substrate is bent and recovered, thereby improving the anti-fragmentation property of the glass substrate.
  • the bending performance of the panel on the preset bending path is improved, thereby greatly saving the time of the functional layer manufacturing process and improving the product quality of the ultra-thin glass substrate.
  • FIG. 11 is a schematic diagram of the intermediate process of the third process of the ultra-thin glass substrate manufacturing method of the present invention.
  • the main difference between the third process of the ultra-thin glass substrate manufacturing method of the present invention and the first process is that a panel functional layer is formed on at least one of the upper and lower surfaces of the substrate region 11 of the glass base material. 23.
  • the panel functional layer 23 has a slit, and the panel functional layer 23 includes one or a combination of a TFT backplane, an organic light-emitting layer, a touch detection layer, a fingerprint identification layer, and a cover plate.
  • An etching protection layer is formed on the side of the panel functional layer 23 away from the substrate area 11 , and the etching protection layer has at least one narrow slit exposing the partial substrate area 11 , and the projection of the narrow slit and the narrow slit on the substrate area 11 coincides.
  • the narrow slits of the etching protection layer 20 and the narrow slits of the panel functional layer 23 will form bending stress dissipation grooves 14 on the corresponding local substrate regions 11.
  • the third process enables the realization of the glass substrate covered by the polymer reinforcing layer 24, so as to carry out simultaneous processing of functional layers in multiple areas on the glass base material 1 (half corresponding to the subsequent display panels), which greatly saves functions.
  • the use of the bending stress dissipation groove 14 formed on the glass substrate improves the bending performance of the panel on the preset bending path in the subsequent process of manufacturing the panel, thereby greatly saving the time of the functional layer process and improving the ultra-thin Product quality of glass substrates.
  • the purpose of the present invention is to provide a method for manufacturing an ultra-thin glass substrate, which can obtain a glass substrate from a glass base material and at the same time set a bending stress dissipation groove on the glass base material, so as to improve the panel during the subsequent panel manufacturing process.
  • the bending performance on the preset bending path greatly saves the time of the functional layer process and improves the product quality of the ultra-thin glass substrate.

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Abstract

超薄玻璃基板制程方法以及显示面板制程方法，超薄玻璃基板制程方法包括：提供一玻璃母材，玻璃母材上预设n个基板区域和围绕基板区域的骨架区域，n大于等于1；至少在玻璃母材的基板区域的上下表面分别形成刻蚀保护层，刻蚀保护层包括主体区域以及至少一沿预设弯折路径延展的薄化区域；至少刻蚀玻璃母材的骨架区域，令基板区域自玻璃母材脱离，通过薄化区域在基板区域沿预设弯折路径形成至少一弯折应力消散槽，并且在基板区域的边沿形成应力消散边缘；去除刻蚀保护层得到独立的具有弯折应力消散槽的玻璃基板。该方法能够自玻璃母材获得玻璃基板的同时，在玻璃母材上设置弯折应力消散槽，提高面板在预设弯折路径上的弯折性能。

Description

超薄玻璃基板制程方法以及显示面板制程方法 技术领域
本发明涉及面板制程技术领域，具体地说，涉及超薄玻璃基板制程方法以及显示面板制程方法。
背景技术
超薄玻璃基片(UTG基片)作为可折叠盖板的重要组成部分，为实现更小或甚至R＝2mm的弯折半径的效果，超薄基片自身质量是关键。尤其是UTG基片被切割成特定尺寸后，其边部的特殊处理，即需要去除因切割产生的崩边、微裂纹等缺陷，从而避免基片在弯折的时候由于微裂纹等造成玻璃的破碎。总体而言，需要解决两个方面的问题：1)采取何种切割方式以获得相对平直的边部质量；2)采取抛光等方式去除边部缺陷。
目前，轮刀式切割局限于直线切割，在进行产品异形(导R角)切割方面仍然面临困难，再者未经化学强化处理的100um左右的UTG基片非常易碎，它难以承受轮刀切割时的机械压力出现高比例碎片，或者产生非期望的基片边部的明显崩片、缺角等缺陷。这些缺陷对于后续的边部抛光是非常致命的缺陷，可能直接导致基片的报废。因此，寻找合适的切割方式获得边部平直的基片是重要的工作组成。
相比而言，激光非机械力作用的切割能够获得更好的边部切割效果而可能成为未来超薄基片切割的主流方式，激光切割是指将激光束照射在工件表面时释放的能量使工件融化并蒸发，以达到切割分片的目的。激光切割没有对玻璃表面施加压力，所以不会造成玻璃基材破片，同时可以做各种各样异形切割。
另一方面，UTG基片在加工和转运过程极易发生玻璃表面划伤或相互挤压撑伤等质量缺陷，目前，采取在玻璃双表面喷涂防护油墨方式降低或避免上述问题的发生，并形成了大片UTG母板玻璃切割—边部抛光—化学强化—喷涂防护油墨的加工过程。最终在经过化学强化处理的UTG基片上涂布功能膜涂形成可折叠的盖板。
为此，通常的实施方式为：在UTG超薄基片喷涂防护油墨后进行激光切割或 者期望的尺寸进行后续的加工。然而，UTG基片表面均匀喷涂油墨是一项非常艰巨的任务，尤其要消除相关的气泡、确保膜层厚薄均匀、颜色均匀、喷涂环境洁净等是非常困难的。同时，也由于激光切割道上常常遇见喷涂不均匀的情况而导致激光在该区域出现散射的问题，最终导致激光切割玻璃不彻底，分片困难或严重崩边等缺陷，上述缺陷严重影响后续的边部抛光制程。
发明内容
针对现有技术中的问题，本发明的目的在于提供超薄玻璃基板制程方法以及显示面板制程方法，克服了现有技术的困难，能够自玻璃母材获得玻璃基板的同时，在玻璃母材上设置弯折应力消散槽，以便在后续的制程面板的过程中提高面板在预设弯折路径上的弯折性能，从而大大节约功能层制程的时间，提高了超薄玻璃基板的产品质量。
本发明的实施例提供一种超薄玻璃基板制程方法，包括以下步骤：
S510、提供一玻璃母材，所述玻璃母材上预设n个基板区域和围绕所述基板区域的骨架区域，n大于等于1；
S520、至少在所述玻璃母材的所述基板区域的上下表面分别形成刻蚀保护层，所述刻蚀保护层包括主体区域以及至少一沿预设弯折路径延展的薄化区域；
S530、至少刻蚀所述玻璃母材的骨架区域，令所述基板区域自所述玻璃母材脱离，通过所述薄化区域在所述基板区域沿预设弯折路径形成至少一弯折应力消散槽，并且在所述基板区域的边沿形成应力消散边缘；
S540、去除所述刻蚀保护层得到独立的具有弯折应力消散槽的所述玻璃基板。
在一些实施例中，所述基板区域矩阵排列于所述玻璃母材，相邻的所述基板区域之间具有所述骨架区域分隔。
在一些实施例中，所述薄化区域为一沿预设弯折路径延展的条形区域。
在一些实施例中，所述薄化区域中设有至少一条平行于预设弯折路径的窄缝，局部所述基板区域露出于所述窄缝。
在一些实施例中，所述刻蚀保护层的所述薄化区域的厚度小于所述刻蚀保护层的主体区域的厚度。
在一些实施例中，所述刻蚀保护层包括同层设置的消减刻蚀的刻蚀缓冲层以及阻挡刻蚀的刻蚀阻挡层，所述刻蚀缓冲层形成所述薄化区域，所述刻蚀保护层形成所述刻蚀保护层的主体区域。
在一些实施例中，通过一次刻蚀，消除所述玻璃母材中全部的骨架区域，在所述基板区域沿预设弯折路径形成至少一弯折应力消散槽，并且在所述基板区域的边沿形成应力消散边缘。
在一些实施例中，所述步骤S520包括以下步骤：
S521、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成高分子补强层，所述高分子补强层具有一窄缝，所述高分子补强层的组分包括亚克力、含硅的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯以及聚对苯二甲酸-1，4-环己二甲酯；
S522、在所述高分子补强层背离所述基板区域的一侧形成刻蚀保护层，所述刻蚀保护层具有至少一露出局部所述基板区域的窄缝，所述窄缝与所述窄缝在基板区域的上的投影相重合。
在一些实施例中，所述步骤S520包括以下步骤：
S523、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成面板功能层，所述面板功能层具有一窄缝，所述面板功能层包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合；
S524、在所述面板功能层背离所述基板区域的一侧形成刻蚀保护层，所述刻蚀保护层具有至少一露出局部所述基板区域的窄缝，所述窄缝与所述窄缝在基板区域的上的投影相重合。
在一些实施例中，所述应力消散边缘为圆弧形边缘、刀锋边缘或者多边形边缘，所述刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，所述斜边与所述玻璃母材的角度范围为(15°，90°)，所述玻璃母材的厚度为10um至150um；
所述应力消散边缘环绕所述基板区域的边沿，所述应力消散边缘的宽度为5um至300um。
在一些实施例中，所述步骤S540之后还包括步骤S550，在玻璃基板的上下表面中的至少一侧形成高分子补强层，所述高分子补强层的组分包括亚克力、含硅的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对苯二甲 酸乙二醇酯以及聚对苯二甲酸-1，4-环己二甲酯。
在一些实施例中，通过第一刻蚀制程，消除所述玻璃母材中全部的骨架区域，留下被所述刻蚀保护层保护的所述基板区域；
通过第二刻蚀制程，在所述基板区域沿预设弯折路径形成至少一弯折应力消散槽，并且所述基板区域的边沿形成应力消散边缘。
本发明的实施例还提供一种显示面板制程方法，包括如上述的超薄玻璃基板制程方法，所述弯折应力消散槽被配置于所述显示面板的弯折路径。
本发明的目的在于提供超薄玻璃基板制程方法，能够自玻璃母材获得玻璃基板的同时，在玻璃母材上设置弯折应力消散槽，以便在后续的制程面板的过程中提高面板在预设弯折路径上的弯折性能，从而大大节约功能层制程的时间，提高了超薄玻璃基板的产品质量。
附图说明
通过阅读参照以下附图对非限制性实施例所作的详细描述，本发明的其它特征、目的和优点将会变得更明显。
图1是本发明的超薄玻璃基板制程方法的流程图。
图2至9是本发明的超薄玻璃基板制程方法的第一种制程过程的示意图。
图10是本发明的超薄玻璃基板制程方法的第二种制程的中间过程示意图。
图11是本发明的超薄玻璃基板制程方法的第三种制程的中间过程示意图。
具体实施方式
现在将参考附图更全面地描述示例实施方式。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式。相反，提供这些实施方式使得本发明将全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的结构，因而将省略对它们的重复描述。
图1是本发明的超薄玻璃基板制程方法的流程图。本发明的超薄玻璃基板制程 方法，包括以下步骤：
S510、提供一玻璃母材1，玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于1；
S520、至少在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层，刻蚀保护层包括主体区域以及至少一沿预设弯折路径延展的薄化区域；
S530、至少刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，通过薄化区域在基板区域11沿预设弯折路径形成至少一弯折应力消散槽，并且在基板区域11的边沿形成应力消散边缘13；
S540、去除刻蚀保护层得到独立的具有弯折应力消散槽的玻璃基板。
本发明的制程过程中，不再需要使用刀轮和激光，能够自玻璃母材获得玻璃基板的同时，在玻璃母材上设置弯折应力消散槽，以便在后续的制程面板的过程中提高面板在预设弯折路径上的弯折性能，从而大大节约功能层制程的时间，提高了超薄玻璃基板的产品质量。
在一个优选实施例中，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔，但不以此为限。
在一个优选实施例中，薄化区域为一沿预设弯折路径延展的条形区域，但不以此为限。
在一个优选实施例中，薄化区域中设有至少一条平行于预设弯折路径的窄缝，局部基板区域11露出于窄缝，但不以此为限。
在一个优选实施例中，刻蚀保护层的薄化区域的厚度小于刻蚀保护层的主体区域的厚度，但不以此为限。
在一个优选实施例中，刻蚀保护层包括同层设置的消减刻蚀的刻蚀缓冲层以及阻挡刻蚀的刻蚀阻挡层，刻蚀缓冲层和刻蚀阻挡层的材质可以不同，以便实现分区域不同的阻挡刻蚀的效果。刻蚀缓冲层形成薄化区域，刻蚀保护层形成刻蚀保护层的主体区域，但不以此为限。
在一个优选实施例中，通过一次刻蚀，消除玻璃母材1中全部的骨架区域12，在基板区域11沿预设弯折路径形成至少一弯折应力消散槽，并且在基板区域11的边沿形成应力消散边缘13，但不以此为限。
在一个优选实施例中，应力消散边缘为圆弧形边缘、刀锋边缘或者多边形边缘， 刀锋边缘或者多边形边缘中包括至少一斜边或弧形斜边，斜边与玻璃母材的角度范围为(15°，90°)，玻璃母材的厚度为10um至150um；应力消散边缘环绕基板区域的边沿，应力消散边缘的宽度为5um至300um，但不以此为限。
在一个优选实施例中，步骤S540之后还包括步骤S550，在玻璃基板的上下表面中的至少一侧形成高分子补强层24，高分子补强层24的组分包括：亚克力，含硅的有机高分子材料(硅烷，硅树脂，硅橡胶)，环氧树脂，氟树脂，聚醯胺，聚醯亚胺，聚碳酸酯(PC)，聚对苯二甲酸乙二醇酯(PET)，聚对苯二甲酸-1，4-环己二甲酯(PCT)。
在一个优选实施例中，通过第一刻蚀制程，消除玻璃母材中全部的骨架区域，留下被刻蚀保护层保护的基板区域；通过第二刻蚀制程，在基板区域沿预设弯折路径形成至少一弯折应力消散槽，并且基板区域的边沿形成应力消散边缘，但不以此为限。
图2至9是本发明的超薄玻璃基板制程方法的第一种制程过程的示意图。如图2至9所示，本发明的超薄玻璃基板制程方法的第一种制程过程如下：
参考图2，首先提供一玻璃母材1，玻璃母材1的厚度为10um至150um，基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔。
参考图3、4，在玻璃母材1上预设n个基板区域11和围绕基板区域11的骨架区域12，n大于等于1。在玻璃母材的基板区域11的上下表面分别形成刻蚀保护层20，刻蚀保护层20仅覆盖基板区域11的上下表面，骨架区域12的上下表面均露出于刻蚀保护层20之外，使得骨架区域12的上下表面在后续的刻蚀中可以同时受到刻蚀，易形成具有多个应力消散面的应力消散边缘13基板区域11矩阵排列于玻璃母材1，相邻的基板区域11之间具有骨架区域12分隔。刻蚀保护层20包括主体区域22以及至少一沿预设弯折路径延展的薄化区域21。本实施例中，薄化区域21为一沿预设弯折路径延展的条形区域在薄化区域21中设有至少一条平行于预设弯折路径的窄缝，局部基板区域11露出于窄缝，以便在刻蚀过程中，在基板区域11沿预设弯折路径形成至少一弯折应力消散槽14。
参考图5、6、7、8，刻蚀玻璃母材1的骨架区域12，令基板区域11自玻璃母材1脱离，通过薄化区域在基板区域11沿预设弯折路径形成至少一弯折应力消散 槽14，并且在基板区域11的边沿形成应力消散边缘13。本发明中的刻蚀缓冲层在刻蚀过程中不能完全阻挡对其下方基板区域11的刻蚀，仅仅是减弱对其下方基板区域11的刻蚀，使得在薄化区域对应的基板区域11中留下沿预设弯折路径延展的浅槽(作为对比，被刻蚀阻挡层覆盖的基板区域11完全不受刻蚀)，这些浅槽在面板弯折的时候能够分散弯折应力，作为弯折应力消散槽使用。本实施例中，通过第一刻蚀制程，消除玻璃母材1中全部的骨架区域12，留下被刻蚀保护层20保护的基板区域11。应力消散边缘13为刀锋边缘，应力消散边缘13环绕基板区域11的边沿，应力消散边缘13的宽度为5um至300um。本实施例中通过一次刻蚀，消除玻璃母材1中全部的骨架区域12，在基板区域11沿预设弯折路径形成至少一弯折应力消散槽，并且在基板区域11的边沿形成应力消散边缘13，即在一次刻蚀的过程中，同时实现三个刻蚀效果。本实施例中，在基板区域11的两面都形成了相互对称的弯折应力消散槽14，以便可以分别分散两个弯折方向的应力。在一个变化例中，也可以只在基板区域11的一面设置弯折应力消散槽14，仅仅分散一个弯折方向的应力。
最后，参见图9去除刻蚀保护层得到独立的具有弯折应力消散槽的玻璃基板。
图10是本发明的超薄玻璃基板制程方法的第二种制程的中间过程示意图。如图10所示，本发明的超薄玻璃基板制程方法的第二种制程与第一种制程的主要差异在于：在玻璃母材的基板区域11的上下表面中的至少一侧形成高分子补强层24，高分子补强层24具有一窄缝，高分子补强层24，高分子补强层24的组分包括：亚克力，含硅的有机高分子材料(硅烷，硅树脂，硅橡胶)，环氧树脂，氟树脂，聚醯胺，聚醯亚胺，聚碳酸酯(PC)，聚对苯二甲酸乙二醇酯(PET)，聚对苯二甲酸-1，4-环己二甲酯(PCT)。S522、在高分子补强层24背离基板区域11的一侧形成刻蚀保护层，刻蚀保护层具有至少一露出局部基板区域11的窄缝，窄缝与窄缝在基板区域11的上的投影相重合，以便既能通过高分子补强层24覆盖的玻璃基板。刻蚀保护层20的窄缝和高分子补强层24的窄缝在对应的局部基板区域11上形成弯折应力消散槽14，后续过程参见第一种制程过程，此处不再赘述。使得第二种制程能够实现在玻璃基板被弯折以及恢复时，增强玻璃基板整体的挠性，从而提高玻璃基板的防碎裂属性；同时，玻璃基板形成的利用弯折应力消散槽14在后续 的制程面板的过程中提高面板在预设弯折路径上的弯折性能，从而大大节约功能层制程的时间，提高了超薄玻璃基板的产品质量。
图11是本发明的超薄玻璃基板制程方法的第三种制程的中间过程示意图。如图11所示，本发明的超薄玻璃基板制程方法的第三种制程与第一种制程的主要差异在于：在玻璃母材的基板区域11的上下表面中的至少一侧形成面板功能层23，面板功能层23具有一窄缝，面板功能层23包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合。在面板功能层23背离基板区域11的一侧形成刻蚀保护层，刻蚀保护层具有至少一露出局部基板区域11的窄缝，窄缝与窄缝在基板区域11的上的投影相重合，后续刻蚀过程中会经过，刻蚀保护层20的窄缝和面板功能层23的窄缝在对应的局部基板区域11上形成弯折应力消散槽14，后续过程参见第一种制程过程，此处不再赘述。使得第三种制程能够实现既通过高分子补强层24覆盖的玻璃基板，以便在玻璃母材1上进行多个区域(对分对应后续的显示面板)进行功能层的同时加工，大大节约功能层制程的时间，并且由于后续在分割玻璃基板14时不再需要使用刀轮和激光，能够避免刀轮切割和激光切割对已经成型的功能层的伤害，同时提供了显示面板的制程速度的产品质量；同时，玻璃基板形成的利用弯折应力消散槽14在后续的制程面板的过程中提高面板在预设弯折路径上的弯折性能，从而大大节约功能层制程的时间，提高了超薄玻璃基板的产品质量。
综上，本发明的目的在于提供超薄玻璃基板制程方法，能够自玻璃母材获得玻璃基板的同时，在玻璃母材上设置弯折应力消散槽，以便在后续的制程面板的过程中提高面板在预设弯折路径上的弯折性能，从而大大节约功能层制程的时间，提高了超薄玻璃基板的产品质量。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。

Claims (10)

  1. 一种超薄玻璃基板制程方法，其特征在于，包括以下步骤：
    S510、提供一玻璃母材，所述玻璃母材上预设n个基板区域和围绕所述基板区域的骨架区域，n大于等于1；
    S520、至少在所述玻璃母材的所述基板区域的上下表面分别形成刻蚀保护层，所述刻蚀保护层包括主体区域以及至少一沿预设弯折路径延展的薄化区域；
    S530、至少刻蚀所述玻璃母材的骨架区域，令所述基板区域自所述玻璃母材脱离，通过所述薄化区域在所述基板区域沿预设弯折路径形成至少一弯折应力消散槽，并且在所述基板区域的边沿形成应力消散边缘；
    S540、去除所述刻蚀保护层得到独立的具有弯折应力消散槽的所述玻璃基板。
  2. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述基板区域矩阵排列于所述玻璃母材，相邻的所述基板区域之间具有所述骨架区域分隔。
  3. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述薄化区域为一沿预设弯折路径延展的条形区域。
  4. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述薄化区域中设有至少一条平行于预设弯折路径的窄缝，局部所述基板区域露出于所述窄缝。
  5. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述刻蚀保护层的所述薄化区域的厚度小于所述刻蚀保护层的主体区域的厚度。
  6. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述刻蚀保护层包括同层设置的消减刻蚀的刻蚀缓冲层以及阻挡刻蚀的刻蚀阻挡层，所述刻蚀缓冲层形成所述薄化区域，所述刻蚀保护层形成所述刻蚀保护层的主体区域。
  7. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，通过一次刻蚀，消除所述玻璃母材中全部的骨架区域，在所述基板区域沿预设弯折路径形成至少一弯折应力消散槽，并且在所述基板区域的边沿形成应力消散边缘。
  8. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述步骤S520包括以下步骤：
    S521、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成高分子补强层，所述高分子补强层具有一窄缝，所述高分子补强层的组分包括亚克力、含硅 的有机高分子材料、环氧树脂、氟树脂、聚醯胺、聚醯亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯以及聚对苯二甲酸-1，4-环己二甲酯；
    S522、在所述高分子补强层背离所述基板区域的一侧形成刻蚀保护层，所述刻蚀保护层具有至少一露出局部所述基板区域的窄缝，所述窄缝与所述窄缝在基板区域的上的投影相重合。
  9. 根据权利要求1所述的超薄玻璃基板制程方法，其特征在于，所述步骤S520包括以下步骤：
    S523、在所述玻璃母材的所述基板区域的上下表面中的至少一侧形成面板功能层，所述面板功能层具有一窄缝，所述面板功能层包括TFT背板、有机发光层、触控检测层、指纹识别层、盖板中的一种或组合；
    S524、在所述面板功能层(23)背离所述基板区域的一侧形成刻蚀保护层，所述刻蚀保护层具有至少一露出局部所述基板区域的窄缝，所述窄缝与所述窄缝在基板区域的上的投影相重合。
  10. 一种显示面板制程方法，其特征在于，包括如权利要求1至9中任意一项所述的超薄玻璃基板制程方法，所述弯折应力消散槽被配置于所述显示面板的弯折路径。
PCT/CN2021/086425 2020-11-26 2021-04-12 超薄玻璃基板制程方法以及显示面板制程方法 WO2022110610A1 (zh)

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